LTC3611

10A, 32V Monolithic

Synchronous Step-Down
DC/DC Converter
Features Description
n 10A Output Current The LTC®3611 is a high efficiency, monolithic synchronous
n Wide VIN Range = 4.5V to 32V (36V Maximum) step-down DC/DC converter that can deliver up to 10A
n Internal N-Channel MOSFETs output current from a 4.5V to 32V (36V maximum) input
n True Current Mode Control supply. It uses a constant on-time valley current mode
n Optimized for High Step-Down Ratios control architecture to deliver very low duty cycle opera-
n t0N(MIN) ≤ 100ns tion at high frequency with excellent transient response.
n Extremely Fast Transient Response The operating frequency is selected by an external resistor
n Stable with Ceramic COUT and is compensated for variations in VIN and VOUT.
n ±1% 0.6V Voltage Reference
The LTC3611 can be configured for discontinuous or
n Power Good Output Voltage Monitor
forced continuous operation at light load. Forced continu-
n Adjustable On-Time/Switching Frequency (>1MHz)
ous operation reduces noise and RF interference while
n Adjustable Current Limit
discontinuous mode provides high efficiency by reducing
n Programmable Soft-Start
switching losses at light loads.
n Output Overvoltage Protection
n Optional Short-Circuit Shutdown Timer Fault protection is provided by internal foldback current
n Low Shutdown IQ: 15μA limiting, an output overvoltage comparator and an optional
n Available in a 9mm × 9mm 64-Pin QFN Package short-circuit shutdown timer. Soft-start capability for sup-
ply sequencing is accomplished using an external timing
Applications capacitor. The regulator current limit is user programmable.
A power good output voltage monitor indicates when
n Point of Load Regulation
n Distributed Power Systems the output is in regulation. The LTC3611 is available in a
compact 9mm × 9mm QFN package.
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
Patents including 5481178, 6100678, 6580258, 5847554, 6304066.

Typical Application
High Efficiency Step-Down Converter Efficiency and Power Loss
vs Load Current
182k
0.1µF VOUT VON ION 100 10000
VIN VOUT = 2.5V
RUN/SS VIN 90
4.5V TO 32V
10µF 80 VIN = 5V
100pF LTC3611 ×3 VIN = 25V 1000
1µH VOUT 70
POWER LOSS (mW)
EFFICIENCY (%)

SW 2.5V 60
680pF 0.22µF 10A
100µF 100
50
ITH BOOST ×2 POWER LOSS,
12.5k 40 VIN = 5V
SGND INTVCC 30
30.1k 10
FCB 20 POWER LOSS,
39.2k VIN = 25V
INTVCC VRNG 4.7µF 10
PGND 0 1
PGOOD
11k 0.01 0.1 1 10
EXTVCC VFB LOAD CURRENT (A)
3611 TA01a 9.5k 3611 TA01b

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LTC3611
Absolute Maximum Ratings Pin Configuration
(Note 1)
Input Supply Voltage (VIN, ION)................... 36V to –0.3V TOP VIEW

54 INTVCC
53 INTVCC
Boosted Topside Driver Supply Voltage

64 PGND
63 PGND
62 PGND
61 PGND
60 PGND
59 PGND
58 PGND
57 PGND
56 PGND

50 SGND
49 SGND
52 SVIN
51 SVIN
55 SW
(BOOST)................................................. 42V to –0.3V
SW Voltage............................................. 36V to –0.3V PGND 1 48 SGND
INTVCC, EXTVCC, (BOOST – SW), RUN/SS, PGND 2
65
PGND 47 SGND
PGOOD Voltages........................................... 7V to –0.3V PGND 3 46 SGND
SW 4 45 SGND
FCB, VON, VRNG Voltages............. INTVCC + 0.3V to –0.3V SW 5 44 EXTVCC
ITH, VFB Voltages........................................ 2.7V to –0.3V SW 6 43 VFB

Operating Junction Temperature Range SW 7

SW 8
66
SW
42 SGND
41 ION
(Notes 2, 4)............................................. –40°C to 125°C SW 9 40 SGND

Storage Temperature Range....................–55°C to 125°C SW 10

68
39 FCB
SW 11 38 ITH
SGND
PVIN 12 37 VRNG
PVIN 13 36 PGOOD
PVIN 14 67 35 VON
PVIN
PVIN 15 34 SGND
PVIN 16 33 SGND

PVIN 17
PVIN 18
PVIN 19
PVIN 20
PVIN 21
PVIN 22
PVIN 23
PVIN 24
PVIN 25
SW 26
NC 27
SGND 28
BOOST 29
RUN/SS 30
SGND 31
SGND 32
WP PACKAGE
64-LEAD (9mm × 9mm) QFN MULTIPAD
TJMAX = 125°C, θJA = 28°C/W

order information
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC3611EWP#PBF LTC3611EWP#TRPBF LTC3611WP 64-Lead (9mm × 9mm) Plastic QFN –40°C to 125°C
LTC3611IWP#PBF LTC3611IWP#TRPBF LTC3611WP 64-Lead (9mm × 9mm) Plastic QFN –40°C to 125°C
LEAD BASED FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC3611EWP LTC3611EWP#TR LTC3611WP 64-Lead (9mm × 9mm) Plastic QFN –40°C to 125°C
LTC3611IWP LTC3611IWP#TR LTC3611WP 64-Lead (9mm × 9mm) Plastic QFN –40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/

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 LTC3611
Electrical Characteristics The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 15V unless otherwise noted.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
Main Control Loop
VIN Operating Input Voltage Range 4.5 32 V
IQ Input DC Supply Current
Normal 900 2000 µA
Shutdown Supply Current 15 30 µA
VFB Feedback Reference Voltage ITH = 1.2V (Note 3)
–40°C to 85°C 0.594 0.600 0.606 V
–40°C to 125°C l 0.590 0.600 0.610 V
ΔVFB(LINEREG) Feedback Voltage Line Regulation VIN = 4V to 30V, ITH = 1.2V (Note 3) 0.002 %/V
ΔVFB(LOADREG) Feedback Voltage Load Regulation ITH = 0.5V to 1.9V (Note 3) –0.05 –0.3 %
IFB Feedback Input Current VFB = 0.6V –5 ±50 nA
gm(EA) Error Amplifier Transconductance ITH = 1.2V (Note 3) l 1.4 1.7 2 mS
VFCB Forced Continuous Threshold l 0.54 0.6 0.66 V
IFCB Forced Continuous Pin Current VFCB = 0.6V –1 –2 µA
tON On-Time ION = 60μA, VON = 1.5V 190 250 310 ns
ION = 60μA, VON = 0V 120 ns
tON(MIN) Minimum On-Time ION = 180μA, VON = 0V 60 100 ns
tOFF(MIN) Minimum Off-Time ION = 30μA, VON = 1.5V 290 500 ns
IVALLEY(MAX) Maximum Valley Current VRNG = 0V, VFB = 0.56V, FCB = 0V l 6 10 A
VRNG = 1V, VFB = 0.56V, FCB = 0V l 8 15 A
IVALLEY(MIN) Maximum Reverse Valley Current VRNG = 0V, VFB = 0.64V, FCB = 0V –6 A
VRNG = 1V, VFB = 0.64V, FCB = 0V –8 A
ΔVFB(OV) Output Overvoltage Fault Threshold 7 10 13 %
VRUN/SS(ON) RUN Pin Start Threshold l 0.8 1.5 2 V
VRUN/SS(LE) RUN Pin Latchoff Enable Threshold RUN/SS Pin Rising 4 4.5 V
VRUN/SS(LT) RUN Pin Latchoff Threshold RUN/SS Pin Falling 3.5 4.2 V
IRUN/SS(C) Soft-Start Charge Current VRUN/SS = 0V –0.5 –1.2 –3 µA
IRUN/SS(D) Soft-Start Discharge Current VRUN/SS = 4.5V, VFB = 0V 0.8 1.8 3 µA
VIN(UVLO) Undervoltage Lockout VIN Falling l 3.4 3.9 V
VIN(UVLOR) Undervoltage Lockout Release VIN Rising l 3.5 4 V
RDS(ON) Top Switch On-Resistance 15 22 mΩ
Bottom Switch On-Resistance 9 14 mΩ

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LTC3611
Electrical Characteristics The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 15V unless otherwise noted.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
Internal VCC Regulator
VINTVCC Internal VCC Voltage 6V < VIN < 30V, VEXTVCC = 4V l 4.7 5 5.6 V
ΔVLDO(LOADREG) Internal VCC Load Regulation ICC = 0mA to 20mA, VEXTVCC = 4V –0.1 ±2 %
VEXTVCC EXTVCC Switchover Voltage ICC = 20mA, VEXTVCC Rising l 4.5 4.7 V
ΔVEXTVCC EXTVCC Switch Drop Voltage ICC = 20mA, VEXTVCC = 5V 150 300 m/V
ΔVEXTVCC(HYS) EXTVCC Switchover Hysteresis 500 m/V
PGOOD Output
ΔVFBH PGOOD Upper Threshold VFB Rising 7 10 13 %
ΔVFBL PGOOD Lower Threshold VFB Falling –7 –10 –13 %
ΔVFB(HYS) PGOOD Hysteresis VFB Returning 1 2.5 %
VPGL PGOOD Low Voltage IPGOOD = 5mA 0.15 0.4 V

Note 1: Stresses beyond those listed under Absolute Maximum Ratings Note 4: The LTC3611 is tested under pulsed load conditions such that
may cause permanent damage to the device. Exposure to any Absolute TJ ≈ TA. The LTC3611E is guaranteed to meet specifications from
Maximum Rating condition for extended periods may affect device 0°C to 125°C junction temperature. Specifications over the –40°C to
reliability and lifetime. 125°C operating junction temperature range are assured by design,
Note 2: TJ is calculated from the ambient temperature TA and power characterization and correlation with statistical process controls. The
dissipation PD as follows: LTC3611I is guaranteed over the full –40°C to 125°C operating junction
TJ = TA + (PD • 28°C/W) (θJA is simulated per JESD51-7 high temperature range. Note that the maximum ambient temperature
effective thermal conductivity test board) consistent with these specifications is determined by specific operating
conditions in conjunction with board layout, the rated package thermal
θJC = 1°C/W (θJC is simulated when heatsink is applied at the
impedance and other environmental factors.
bottom of the package)
Note 3: The LTC3611 is tested in a feedback loop that adjusts VFB to
achieve a specified error amplifier output voltage (ITH). The specification at
85°C is not tested in production. This specification is assured by design,
characterization, and correlation to testing at 125°C.

Typical Performance Characteristics

Transient Response
Transient Response (Discontinuous Mode) Start-Up

VOUT VOUT
200mV/DIV 200mV/DIV

RUN/SS
2V/DIV

IL IL
5A/DIV 5A/DIV VOUT
1V/DIV
ILOAD ILOAD IL
5A/DIV 5A/DIV 5A/DIV
3611 G01 3611 G02 3611 G03
40µs/DIV 40µs/DIV 40ms/DIV
LOAD STEP 0A TO 8A LOAD = 1A TO 10A VIN = 25V
VIN = 25V VIN = 25V VOUT = 2.5V
VOUT = 2.5V VOUT = 2.5V RLOAD = 0.5Ω
FCB = 0 FCB = INTVCC FIGURE 6 CIRCUIT
FIGURE 6 CIRCUIT FIGURE 6 CIRCUIT

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 LTC3611
Typical Performance Characteristics
Efficiency vs Load Current Efficiency vs Input Voltage Frequency vs Input Voltage
100 100 640
FCB = 5V
DISCONTINUOUS ILOAD = 10A
FIGURE 6 CIRCUIT
90 600
95

FREQUENCY (kHz)
560
EFFICIENCY (%)

EFFICIENCY (%)
80
CONTINUOUS 90 520
70 ILOAD = 10A
480 ILOAD = 0A
VIN = 12V 85
60 VOUT = 2.5V ILOAD = 1A 440
EXTVCC = 5V
FCB = 0V
FIGURE 6 CIRCUIT
FIGURE 6 CIRCUIT
50 80 400
0.01 0.1 1 10 5 10 15 20 25 30 35 5 10 15 20 25 30 35
LOAD CURRENT (A) INPUT VOLTAGE (V) INPUT VOLTAGE (V)
3611 G06
3611 G04
3611 G05

Frequency vs Load Current Load Regulation ITH Voltage vs Load Current

650 0.80 2.5
FIGURE 6 CIRCUIT FIGURE 6 CIRCUIT
600
CONTINUOUS MODE 0.60
550
2.0
500 0.40
450
FREQUENCY (kHz)

ITH VOLTAGE (V)

400 DISCONTINUOUS MODE 0.20 1.5
∆VOUT (%)

CONTINUOUS
350 MODE
0
300
250 1.0
–0.20
200 DISCONTINUOUS
150 –0.40 MODE
0.5
100
–0.60
50
0 –0.80 0
0 2 4 6 8 10 0 2 4 6 8 10 0 5 10 15
LOAD CURRENT (A) LOAD CURRENT (A) LOAD CURRENT (A)
3611 G07 3611 G08 3611 G09

Load Current vs ITH Voltage

and VRNG On-Time vs ION Current On-Time vs VON Voltage
25 10000 1000
VVON = 0V ION = 30µA

20
800
VRNG = 1V
15
LOAD CURRENT (A)

0.7V 1000
ON-TIME (ns)
ON-TIME (ns)

600
10 0.5V

5 400
100
0
200
–5

–10 10 0
0 0.5 1 1.5 2 2.5 3 1 10 100 0 1 2 3
ITH VOLTAGE (V) ION CURRENT (µA) VON VOLTAGE (V)
3611 G11 3611 G12
3611 G10

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LTC3611
Typical Performance Characteristics
Maximum Valley Current Limit Maximum Valley Current Limit
On-Time vs Temperature vs VRNG Voltage vs RUN/SS Voltage
300 20 18
IION = 30µA FIGURE 6 CIRCUIT

MAXIMUM VALLEY CURRENT LIMIT (A)

MAXIMUM VALLEY CURRENT LIMIT (A)

VVON = 0V
250 15

200 15 12
ON-TIME (ns)

150 9

100 10 6

50 3

0 5 0
–50 –25 0 25 50 75 100 125 0.5 0.6 0.7 0.8 0.9 1 1.65 1.9 2.15 2.4 2.65 2.9 3.15 3.4
TEMPERATURE (°C) VRNG VOLTAGE (V) RUN/SS VOLTAGE (V)
3611 G13 3611 G15 3611 G16

Maximum Valley Current Limit Input Voltage vs Maximum Maximum Valley Current Limit
vs Temperature Valley Current in Foldback
20 18 20
VRNG = 1V VRNG = 1V
MAXIMUM VALLEY CURRENT LIMIT (A)

MAXIMUM VALLEY CURRENT LIMIT (A)

16
MAXIMUM VALLEY CURRENT (A)

15 15
14

12
10 10
10

8
5 5

0 4 0
–50 –25 0 25 50 75 100 125 4 8 12 16 20 24 28 32 36 0 0.1 0.2 0.3 0.4 0.5 0.6
TEMPERATURE (°C) INPUT VOLTAGE (V) VFB (V)
3611 G17 3611 G27 3611 G14

Feedback Reference Voltage

vs Temperature Error Amplifier gm vs Temperature
0.62 2.0
FEEDBACK REFERENCE VOLTAGE (V)

1.8
0.61

1.6
gm (mS)

0.60
1.4

0.59
1.2

0.58 1.0
–50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125
TEMPERATURE (°C) TEMPERATURE (°C)
3611 G18
3611 G19

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 LTC3611
Typical Performance Characteristics
Input and Shutdown Currents
vs Input Voltage INTVCC Load Regulation IEXTVCC vs Frequency
1400 40 0.30 30
VIN = 24V
EXTVCC OPEN 35 VOUT = 2.5V
1200 0.20 25

SHUTDOWN CURRENT (µA)

30
1000 0.10
INPUT CURRENT (µA)

20
25

IEXTVCC (mA)
∆INTVCC (%)
800 0
SHUTDOWN 20 15
600 –0.10
15
10
400 –0.20
10
EXTVCC = 5V
200 5
5 –0.30

0 0 –0.40 0
0 5 10 15 20 25 30 0 10 20 30 40 50 400 500 600 700 800 900 1000
INPUT VOLTAGE (V) INTVCC LOAD CURRENT (mA) FREQUENCY (KHz)
3611 G20
3611 G21
3611 G28

EXTVCC Switch Resistance RUN/SS Pin Current

vs Temperature FCB Pin Current vs Temperature vs Temperature
10 0 3
EXTVCC SWITCH RESISTANCE (Ω)

–0.25
8 2

RUN/SS PIN CURRENT (µA)

FCB PIN CURRENT (µA)

–0.50 PULL-DOWN CURRENT

6 1
–0.75
4 0
–1.00

2 –1
–1.25

PULL-UP CURRENT
0 –1.50 –2
–50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)
3611 G24
3611 G22 3611 G23

RUN/SS Pin Current Undervoltage Lockout Threshold

vs Temperature vs Temperature
5.0 4.0
UNDERVOLTAGE LOCKOUT THRESHOLD (V)
RUN/SS PIN CURRENT (μA)

4.5 3.5
LATCHOFF ENABLE

4.0 3.0

LATCHOFF THRESHOLD
3.5 2.5

3.0 2.0
–50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125
TEMPERATURE (°C) 3611 G25
TEMPERATURE (°C)
3611 G26

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LTC3611
Pin Functions
PGND (Pins 1, 2, 3, 56, 57, 58, 59, 60, 61, 62, 63, 64, VRNG (Pin 37): Current Limit Range Input. The voltage
65): Power Ground. Connect this pin closely to the (–) at this pin adjusts maximum valley current and can be
terminal of CVCC and the (–) terminal of CIN. set from 0.7V to 1V by a resistive divider from INTVCC.
It defaults to 0.7V if the VRNG pin is tied to ground which
SW (Pins 4, 5, 6, 7, 8, 9, 10, 11, 26, 55, 66): Switch
results in a typical 10A current limit.
Node Connection to the Inductor. The (–) terminal of the
bootstrap capacitor, CB, also connects here. This pin swings ITH (Pin 38): Current Control Threshold and Error Amplifier
from a diode voltage drop below ground up to VIN. Compensation Point. The current comparator threshold
PVIN (Pins 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, increases with this control voltage. The voltage ranges
23, 24, 25, 67): Main Input Supply. Decouple this pin to from 0V to 2.4V with 0.8V corresponding to zero sense
power PGND with the input capacitance, CIN. voltage (zero current).

NC (Pin 27): No Connection. FCB (Pin 39): Forced Continuous Input. Tie this pin to
ground to force continuous synchronous operation at low
SGND (Pins 28, 31, 32, 33, 34, 40, 42, 45, 46, 47, 48, load, to INTVCC to enable discontinuous mode operation at
49, 50, 68): Signal Ground. All small-signal components low load or to a resistive divider from a secondary output
and compensation components should connect to this when using a secondary winding.
ground, which in turn connects to PGND at one point.
ION (Pin 41): On-Time Current Input. Tie a resistor from VIN
BOOST (Pin 29): Boosted Floating Driver Supply. The (+) to this pin to set the one-shot timer current and thereby
terminal of the bootstrap capacitor, CB, connects here. set the switching frequency.
This pin swings from a diode voltage drop below INTVCC
up to VIN + INTVCC. VFB (Pin 43): Error Amplifier Feedback Input. This pin
connects the error amplifier input to an external resistive
RUN/SS (Pin 30): Run Control and Soft-Start Input. A divider from VOUT.
capacitor to ground at this pin sets the ramp time to full
EXTVCC (Pin 44): External VCC Input. When EXTVCC ex-
output current (approximately 3s/μF) and the time delay
ceeds 4.7V, an internal switch connects this pin to INTVCC
for overcurrent latchoff (see Applications Information).
and shuts down the internal regulator so that controller and
Forcing this pin below 0.8V shuts down the device.
gate drive power is drawn from EXTVCC. Do not exceed
VON (Pin 35): On-Time Voltage Input. Voltage trip point for 7V at this pin and ensure that EXTVCC < VIN.
the on-time comparator. Tying this pin to the output volt-
SV IN (Pins 51, 52): Supply Pin for Internal PWM
age or an external resistive divider from the output makes
Controller.
the on-time proportional to VOUT. The comparator input
defaults to 0.7V when the pin is grounded and defaults to INTVCC (Pins 53, 54): Internal 5V Regulator Output. The
2.4V when the pin is tied to INTVCC. Tie this pin to INTVCC driver and control circuits are powered from this voltage.
in high VOUT applications to use a lower RON value. Decouple this pin to power ground with a minimum of
PGOOD (Pin 36): Power Good Output. Open-drain logic 4.7μF low ESR tantalum or ceramic capacitor.
output that is pulled to ground when the output voltage
is not within ±10% of the regulation point.

3611fd


 LTC3611
FUNCTIONAL Diagram
RON

VON ION FCB EXTVCC SVIN

35 41 39 44
51, 52
4.7V
0.7V 2.4V PVIN
1µA + – 0.6V 12, 13, 14, 15,
REF 16, 17, 18, 19,
20, 21, 22, 23,
24, 25, 67
0.6V 5V CIN
REG

INTVCC
– +
53, 54
F
BOOST
29
VVON
tON = (10pF) R
IION
S Q FCNT CB
M1

ON
20k DB L1
SW
+ + VOUT
SWITCH 4, 5, 6, 7, 8, 9,
ICMP IREV LOGIC 10, 11, 26, 55,
66
– –
1.4V SHDN +
COUT
OV
M2 CVCC
VRNG
37
PGND
×
(0.5 TO 2) 1, 2, 3, 56, 57,
0.7V 58, 59, 60, 61,
62, 63, 64, 65
36 PGOOD

1 R2
240k
1V
+ 0.54V
Q2 Q4 UV

Q6 –
ITHB
43
VFB
Q3 Q1
+ R1

OV
+ 0.8V – 0.66V
SGND
– 28, 31, 32, 33, 34,
SS RUN 40, 42, 45, 46, 47,
– + SHDN 48, 49, 50, 68
1.2µA
×3.3 EA
NC
+

27
–

+ –
6V

0.6V 0.4V
38 30
3611 FD
ITH RUN/SS

CSS

3611fd


LTC3611
Operation
Main Control Loop Overvoltage and undervoltage comparators OV and UV
pull the PGOOD output low if the output feedback volt-
The LTC3611 is a high efficiency monolithic synchronous,
age exits a ±10% window around the regulation point.
step-down DC/DC converter utilizing a constant on-time,
Furthermore, in an overvoltage condition, M1 is turned
current mode architecture. It operates from an input voltage
off and M2 is turned on and held on until the overvoltage
range of 4.5V to 32V and provides a regulated output voltage
condition clears.
at up to 10A of output current. The internal synchronous
power switch increases efficiency and eliminates the need Foldback current limiting is provided if the output is
for an external Schottky diode. In normal operation, the shorted to ground. As VFB drops, the buffered current
top MOSFET is turned on for a fixed interval determined threshold voltage ITHB is pulled down by clamp Q3 to
by a one-shot timer OST. When the top MOSFET is turned a 1V level set by Q4 and Q6. This reduces the inductor
off, the bottom MOSFET is turned on until the current valley current level to one sixth of its maximum value as
comparator ICMP trips, restarting the one-shot timer and VFB approaches 0V.
initiating the next cycle. Inductor current is determined Pulling the RUN/SS pin low forces the controller into its
by sensing the voltage between the PGND and SW pins shutdown state, turning off both M1 and M2. Releasing
using the bottom MOSFET on-resistance. The voltage on the pin allows an internal 1.2μA current source to charge
the ITH pin sets the comparator threshold corresponding up an external soft-start capacitor, CSS. When this voltage
to inductor valley current. The error amplifier, EA, adjusts reaches 1.5V, the controller turns on and begins switching,
this voltage by comparing the feedback signal VFB from but with the ITH voltage clamped at approximately 0.6V
the output voltage with an internal 0.6V reference. If the below the RUN/SS voltage. As CSS continues to charge,
load current increases, it causes a drop in the feedback the soft-start current limit is removed.
voltage relative to the reference. The ITH voltage then
rises until the average inductor current again matches INTVCC/EXTVCC Power
the load current.
Power for the top and bottom MOSFET drivers and most of
At light load, the inductor current can drop to zero and the internal controller circuitry is derived from the INTVCC
become negative. This is detected by current reversal pin. The top MOSFET driver is powered from a floating
comparator IREV which then shuts off M2 (see Func- bootstrap capacitor, CB. This capacitor is recharged from
tional Diagram), resulting in discontinuous operation. Both INTVCC through an external Schottky diode, DB, when
switches will remain off with the output capacitor supplying the top MOSFET is turned off. When the EXTVCC pin is
the load current until the ITH voltage rises above the zero grounded, an internal 5V low dropout regulator supplies
current level (0.8V) to initiate another cycle. Discontinu- the INTVCC power from VIN. If EXTVCC rises above 4.7V,
ous mode operation is disabled by comparator F when the internal regulator is turned off, and an internal switch
the FCB pin is brought below 0.6V, forcing continuous connects EXTVCC to INTVCC. This allows a high efficiency
synchronous operation. source connected to EXTVCC, such as an external 5V sup-
The operating frequency is determined implicitly by the ply or a secondary output from the converter, to provide
top MOSFET on-time and the duty cycle required to main- the INTVCC power. Voltages up to 7V can be applied to
tain regulation. The one-shot timer generates an on-time EXTVCC for additional gate drive. If the input voltage is
that is proportional to the ideal duty cycle, thus holding low and INTVCC drops below 3.5V, undervoltage lockout
frequency approximately constant with changes in VIN. circuitry prevents the power switches from turning on.
The nominal frequency can be adjusted with an external
resistor, RON.

3611fd

10
 LTC3611
Applications Information
The basic LTC3611 application circuit is shown on the front Operating Frequency
page of this data sheet. External component selection is The choice of operating frequency is a trade-off between
primarily determined by the maximum load current. The efficiency and component size. Low frequency operation
LTC3611 uses the on-resistance of the synchronous power improves efficiency by reducing MOSFET switching losses
MOSFET for determining the inductor current. The desired but requires larger inductance and/or capacitance in order
amount of ripple current and operating frequency also to maintain low output ripple voltage.
determines the inductor value. Finally, CIN is selected for its
ability to handle the large RMS current into the converter The operating frequency of LTC3611 applications is de-
and COUT is chosen with low enough ESR to meet the termined implicitly by the one-shot timer that controls the
output voltage ripple and transient specification. on-time, tON, of the top MOSFET switch. The on-time is
set by the current into the ION pin and the voltage at the
VON and PGOOD VON pin according to:
The LTC3611 has an open-drain PGOOD output that VVON
indicates when the output voltage is within ±10% of the tON = (10pF)
IION
regulation point. The LTC3611 also has a VON pin that
allows the on-time to be adjusted. Tying the VON pin high Tying a resistor RON from VIN to the ION pin yields an
results in lower values for RON which is useful in high VOUT on-time inversely proportional to VIN. The current out of
applications. The VON pin also provides a means to adjust the ION pin is:
the on-time to maintain constant frequency operation in
applications where VOUT changes and to correct minor VIN
IION =
frequency shifts with changes in load current. RON

VRNG Pin and ILIMIT Adjust For a step-down converter, this results in approximately
The VRNG pin is used to adjust the maximum inductor constant frequency operation as the input supply varies:
valley current, which in turn determines the maximum VOUT
average output current that the LTC3611 can deliver. The f= [Hz]
VVON RON (10pF)
maximum output current is given by:
IOUT(MAX) = IVALLEY(MAX) + 1/2 ΔIL To hold frequency constant during output voltage changes,
The IVALLEY(MAX) is shown in the figure “Maximum Valley tie the VON pin to VOUT or to a resistive divider from VOUT
when VOUT > 2.4V. The VON pin has internal clamps that
Current Limit vs VRNG Voltage” in the Typical Performance
limit its input to the one-shot timer. If the pin is tied below
Characteristics.
0.7V, the input to the one-shot is clamped at 0.7V. Similarly,
An external resistor divider from INTVCC can be used to if the pin is tied above 2.4V, the input is clamped at 2.4V.
set the voltage on the VRNG pin from 1V to 1.4V, or it can In high VOUT applications, tying VON to INTVCC so that
be simply tied to ground force a default value equivalent the comparator input is 2.4V results in a lower value for
to 0.7V. Do not float the VRNG pin.

3611fd

11
LTC3611
Applications Information
RON. Figures 1a and 1b show how RON relates to switching switches and inductor reduce the effective voltage across
frequency for several common output voltages. the inductance, resulting in increased duty cycle as the
load current increases. By lengthening the on-time slightly
Because the voltage at the ION pin is about 0.7V, the cur-
rent into this pin is not exactly inversely proportional to as current increases, constant frequency operation can be
VIN, especially in applications with lower input voltages. maintained. This is accomplished with a resistive divider
To correct for this error, an additional resistor, RON2, from the ITH pin to the VON pin and VOUT. The values
required will depend on the parasitic resistances in the
connected from the ION pin to the 5V INTVCC supply will
further stabilize the frequency. specific application. A good starting point is to feed about
25% of the voltage change at the ITH pin to the VON pin
5V as shown in Figure 2a. Place capacitance on the VON pin
RON2 = R
0.7V ON to filter out the ITH variations at the switching frequency.
The resistor load on ITH reduces the DC gain of the error
Changes in the load current magnitude will also cause amp and degrades load regulation, which can be avoided
frequency shift. Parasitic resistance in the MOSFET by using the PNP emitter follower of Figure 2b.

1000
SWITCHING FREQUENCY (kHz)

VOUT = 3.3V

VOUT = 1.5V VOUT = 2.5V

100
100 1000 10000
RON (kΩ)
3611 F01a

Figure 1a. Switching Frequency vs RON (VON = 0V)

1000
SWITCHING FREQUENCY (kHz)

VOUT = 12V

VOUT = 5V

VOUT = 3.3V

100
100 1000 10000
RON (kΩ)
3611 F01b

Figure 1b. Switching Frequency vs RON (VON = INTVCC)

3611fd

12
 LTC3611
Applications Information
RVON1 2.0
30k
VOUT VON
CVON

SWITCHING FREQUENCY (MHz)

RVON2 0.01µF LTC3611 1.5
100k DROPOUT
RC
REGION
ITH
CC 1.0

(2a) 0.5
RVON1
3k
VOUT VON
CVON 0
RVON2 0 0.25 0.50 0.75 1.0
10k 10k 0.01µF
LTC3611 DUTY CYCLE (VOUT/VIN)
INTVCC 3611 F03
RC
Q1 ITH
2N5087 Figure 3. Maximum Switching Frequency vs Duty Cycle
CC
3611 F02

To improve the frequency response, a feedforward capaci-

(2b) tor C1 may also be used. Great care should be taken to
Figure 2. Correcting Frequency Shift with Load Current Changes route the VFB line away from noise sources, such as the
inductor or the SW line.
Minimum Off-time and Dropout Operation Inductor Selection
The minimum off-time, tOFF(MIN), is the smallest amount Given the desired input and output voltages, the induc-
of time that the LTC3611 is capable of turning on the bot- tor value and operating frequency determine the ripple
tom MOSFET, tripping the current comparator and turning current:
the MOSFET back off. This time is generally about 250ns. ⎛V ⎞⎛ V ⎞
The minimum off-time limit imposes a maximum duty ΔIL = ⎜ OUT ⎟ ⎜ 1− OUT ⎟
cycle of tON/(tON + tOFF(MIN)). If the maximum duty cycle ⎝ f L ⎠⎝ VIN ⎠
is reached, due to a dropping input voltage for example,
then the output will drop out of regulation. The minimum Lower ripple current reduces core losses in the inductor,
input voltage to avoid dropout is: ESR losses in the output capacitors and output voltage
ripple. Highest efficiency operation is obtained at low
tON + tOFF(MIN) frequency with small ripple current. However, achieving
VIN(MIN) = VOUT
tON this requires a large inductor. There is a trade-off between
component size, efficiency and operating frequency.
A plot of maximum duty cycle vs frequency is shown in
Figure 3. A reasonable starting point is to choose a ripple current
that is about 40% of IOUT(MAX). The largest ripple current
Setting the Output Voltage occurs at the highest VIN. To guarantee that ripple current
does not exceed a specified maximum, the inductance
The LTC3611 develops a 0.6V reference voltage between should be chosen according to:
the feedback pin, VFB, and the signal ground as shown in
Figure 6. The output voltage is set by a resistive divider ⎛ V ⎞⎛ VOUT ⎞
L=⎜ OUT
according to the following formula: ⎟ ⎜ 1− ⎟
⎝ f ΔIL(MAX) ⎠ ⎝ VIN(MAX) ⎠
⎛ R2 ⎞
VOUT = 0.6V ⎜ 1+ ⎟
⎝ R1⎠
3611fd

13
LTC3611
Applications Information
Once the value for L is known, the type of inductor must capacitors have the highest capacitance density but it is
be selected. High efficiency converters generally cannot important to only use types that have been surge tested
afford the core loss found in low cost powdered iron cores. for use in switching power supplies. Aluminum electrolytic
A variety of inductors designed for high current, low volt- capacitors have significantly higher ESR, but can be used
age applications are available from manufacturers such as in cost-sensitive applications providing that consideration
Sumida, Panasonic, Coiltronics, Coilcraft and Toko. is given to ripple current ratings and long-term reliability.
Ceramic capacitors have excellent low ESR characteris-
CIN and COUT Selection tics but can have a high voltage coefficient and audible
The input capacitance, CIN, is required to filter the square piezoelectric effects. The high Q of ceramic capacitors with
wave current at the drain of the top MOSFET. Use a low ESR trace inductance can also lead to significant ringing. When
capacitor sized to handle the maximum RMS current. used as input capacitors, care must be taken to ensure that
ringing from inrush currents and switching does not pose
VOUT VIN an overvoltage hazard to the power switches and control-
IRMS ≅IOUT(MAX) –1
VIN VOUT ler. To dampen input voltage transients, add a small 5μF
to 50μF aluminum electrolytic capacitor with an ESR in
This formula has a maximum at VIN = 2VOUT, where the range of 0.5Ω to 2Ω. High performance through-hole
IRMS = IOUT(MAX)/2. This simple worst-case condition is capacitors may also be used, but an additional ceramic
commonly used for design because even significant de- capacitor in parallel is recommended to reduce the effect
viations do not offer much relief. Note that ripple current of their lead inductance.
ratings from capacitor manufacturers are often based on
only 2000 hours of life which makes it advisable to derate Top MOSFET Driver Supply (CB, DB)
the capacitor. An external bootstrap capacitor, CB, connected to the
The selection of COUT is primarily determined by the ESR BOOST pin supplies the gate drive voltage for the topside
required to minimize voltage ripple and load step transients. MOSFET. This capacitor is charged through diode DB from
The output ripple ΔVOUT is approximately bounded by: INTVCC when the switch node is low. When the top MOSFET
turns on, the switch node rises to VIN and the BOOST pin
⎛ 1 ⎞ rises to approximately VIN + INTVCC. The boost capacitor
ΔVOUT ≤ ΔIL ⎜ ESR +
⎝ 8fCOUT ⎟⎠ needs to store about 100 times the gate charge required by
the top MOSFET. In most applications an 0.1μF to 0.47μF,
Since ΔIL increases with input voltage, the output ripple X5R or X7R dielectric capacitor is adequate.
is highest at maximum input voltage. Typically, once the
ESR requirement is satisfied, the capacitance is adequate Discontinuous Mode Operation and FCB Pin
for filtering and has the necessary RMS current rating. The FCB pin determines whether the bottom MOSFET
Multiple capacitors placed in parallel may be needed to remains on when current reverses in the inductor. Tying
meet the ESR and RMS current handling requirements. this pin above its 0.6V threshold enables discontinuous
Dry tantalum, special polymer, aluminum electrolytic and operation where the bottom MOSFET turns off when in-
ceramic capacitors are all available in surface mount pack- ductor current reverses. The load current at which current
ages. Special polymer capacitors offer very low ESR but reverses and discontinuous operation begins depends on
have lower capacitance density than other types. Tantalum the amplitude of the inductor ripple current and will vary

3611fd

14
 LTC3611
Applications Information
with changes in VIN. Tying the FCB pin below the 0.6V Fault Conditions: Current Limit and Foldback
threshold forces continuous synchronous operation, al- The LTC3611 has a current mode controller which inher-
lowing current to reverse at light loads and maintaining ently limits the cycle-by-cycle inductor current not only
high frequency operation. in steady state operation but also in transient. To further
In addition to providing a logic input to force continuous limit current in the event of a short circuit to ground, the
operation, the FCB pin provides a means to maintain a LTC3611 includes foldback current limiting. If the output
flyback winding output when the primary is operating falls by more than 25%, then the maximum sense voltage is
in discontinuous mode. The secondary output VOUT2 is progressively lowered to about one sixth of its full value.
normally set as shown in Figure 4 by the turns ratio N
of the transformer. However, if the controller goes into INTVCC Regulator and EXTVCC Connection
discontinuous mode and halts switching due to a light An internal P-channel low dropout regulator produces the
primary load current, then VOUT2 will droop. An external 5V supply that powers the drivers and internal circuitry
resistor divider from VOUT2 to the FCB pin sets a minimum within the LTC3611. The INTVCC pin can supply up to 50mA
voltage VOUT2(MIN) below which continuous operation is RMS and must be bypassed to ground with a minimum of
forced until VOUT2 has risen above its minimum: 4.7μF tantalum or ceramic capacitor. Good bypassing is
necessary to supply the high transient currents required
⎛ R4 ⎞ by the MOSFET gate drivers.
VOUT2(MIN) = 0.6V ⎜ 1+ ⎟
⎝ R3 ⎠

SW
PGND SGND

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
SW
INTVCC
INTVCC
SVIN
SVIN
SGND
SGND

IN4148
1 48
VOUT2 PGND SGND
2 47
CSEC + PGND SGND
1µF 3 46
PGND SGND
•

4 45
VOUT1 SW SGND
•

T1 5 44
+ 1:N SW EXTVCC
COUT 6 43
SW VFB
7 42
SW SGND
8 41 R4
SW ION
9 LTC3611 40
SW SGND
10 39 OPTIONAL EXTVCC
SW FCB CONNECTION
11 38 5V < VOUT2 < 7V
SW ITH
VIN 12 37
PVIN VRNG
+ 13 36 R3
CIN PVIN PGOOD
14 35
PVIN VON
15 34
PVIN SGND
16 33
PVIN SGND
RUN/SS
BOOST
SGND

SGND
SGND
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
SW
NC

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
3611 F04

SGND
SW

Figure 4. Secondary Output Loop and EXTVCC Connection

3611fd

15
LTC3611
Applications Information
The EXTVCC pin can be used to provide MOSFET gate drive additional 1.3s/μF, during which the load current is folded
and control power from the output or another external back until the output reaches 75% of its final value.
source during normal operation. Whenever the EXTVCC After the controller has been started and given adequate
pin is above 4.7V the internal 5V regulator is shut off and time to charge up the output capacitor, CSS is used as a
an internal 50mA P-channel switch connects the EXTVCC short-circuit timer. After the RUN/SS pin charges above 4V,
pin to INTVCC. INTVCC power is supplied from EXTVCC if the output voltage falls below 75% of its regulated value,
until this pin drops below 4.5V. Do not apply more than then a short-circuit fault is assumed. A 1.8μA current then
7V to the EXTVCC pin and ensure that EXTVCC ≤ VIN. The begins discharging CSS. If the fault condition persists until
following list summarizes the possible connections for the RUN/SS pin drops to 3.5V, then the controller turns
EXTVCC: off both power MOSFETs, shutting down the converter
1. EXTVCC grounded. INTVCC is always powered from the permanently. The RUN/SS pin must be actively pulled
internal 5V regulator. down to ground in order to restart operation.
2. EXTVCC connected to an external supply. A high efficiency The overcurrent protection timer requires that the soft-
supply compatible with the MOSFET gate drive require- start timing capacitor, CSS, be made large enough to
ments (typically 5V) can improve overall efficiency. guarantee that the output is in regulation by the time CSS
has reached the 4V threshold. In general, this will depend
3. EXTVCC connected to an output derived boost network.
upon the size of the output capacitance, output voltage
The low voltage output can be boosted using a charge
and load current characteristic. A minimum soft-start
pump or flyback winding to greater than 4.7V. The system
capacitor can be estimated from:
will start-up using the internal linear regulator until the
boosted output supply is available. CSS > COUT VOUT RSENSE (10 –4 [F/V s])
Generally 0.1μF is more than sufficient.
Soft-Start and Latchoff with the RUN/SS Pin
Overcurrent latchoff operation is not always needed or
The RUN/SS pin provides a means to shut down the LTC3611
desired. Load current is already limited during a short
as well as a timer for soft-start and overcurrent latchoff.
circuit by the current foldback circuitry and latchoff op-
Pulling the RUN/SS pin below 0.8V puts the LTC3611 into
eration can prove annoying during troubleshooting. The
a low quiescent current shutdown (IQ < 30μA). Releasing
feature can be overridden by adding a pull-up current
the pin allows an internal 1.2μA current source to charge
greater than 5μA to the RUN/SS pin. The additional cur-
up the external timing capacitor, CSS. If RUN/SS has
rent prevents the discharge of CSS during a fault and also
been pulled all the way to ground, there is a delay before
shortens the soft-start period. Using a resistor to VIN as
starting of about:
shown in Figure 5a is simple, but slightly increases shut-
1.5V down current. Connecting a resistor to INTVCC as shown
tDELAY = C = (1.3s/µF ) CSS
1.2µA SS in Figure 5b eliminates the additional shutdown current,
but requires a diode to isolate CSS. Any pull-up network
When the voltage on RUN/SS reaches 1.5V, the LTC3611 must be able to pull RUN/SS above the 4.2V maximum
begins operating with a clamp on ITH of approximately threshold of the latchoff circuit and overcome the 4μA
0.9V. As the RUN/SS voltage rises to 3V, the clamp on ITH maximum discharge current.
is raised until its full 2.4V range is available. This takes an

3611fd

16
 LTC3611
Applications Information
INTVCC 3. INTVCC current. This is the sum of the MOSFET driver
RSS* and control currents. This loss can be reduced by sup-
3.3V OR 5V
VIN
RUN/SS RUN/SS plying INTVCC current through the EXTVCC pin from a
D2*
RSS* high efficiency source, such as an output derived boost
D1
network or alternate supply if available.
2N7002 CSS
CSS
4. CIN loss. The input capacitor has the difficult job of filtering
*OPTIONAL TO OVERRIDE
3611 F05
the large RMS input current to the regulator. It must have
OVERCURRENT LATCHOFF a very low ESR to minimize the AC I2R loss and sufficient
(5a) (5b) capacitance to prevent the RMS current from causing ad-
Figure 5. RUN/SS Pin Interfacing with Latchoff Defeated ditional upstream losses in fuses or batteries.
Other losses, including COUT ESR loss, Schottky diode D1
Efficiency Considerations conduction loss during dead time and inductor core loss
generally account for less than 2% additional loss.
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%. When making adjustments to improve efficiency, the input
It is often useful to analyze individual losses to determine current is the best indicator of changes in efficiency. If
what is limiting the efficiency and which change would you make a change and the input current decreases, then
produce the most improvement. Although all dissipative the efficiency has increased. If there is no change in input
elements in the circuit produce losses, four main sources current, then there is no change in efficiency.
account for most of the losses in LTC3611 circuits:
Checking Transient Response
1. DC I2R losses. These arise from the resistance of the
The regulator loop response can be checked by looking
internal resistance of the MOSFETs, inductor and PC board
at the load transient response. Switching regulators take
traces and cause the efficiency to drop at high output
several cycles to respond to a step in load current. When
currents. In continuous mode the average output current
a load step occurs, VOUT immediately shifts by an amount
flows through L, but is chopped between the top and bot-
equal to ΔILOAD (ESR), where ESR is the effective series
tom MOSFETs. If the two MOSFETs have approximately
resistance of COUT. ΔILOAD also begins to charge or dis-
the same RDS(ON), then the DC I2R loss for one MOSFET
charge COUT generating a feedback error signal used by the
can simply be determined by [RDS(ON) + RL] • IO.
regulator to return VOUT to its steady-state value. During
2. Transition loss. This loss arises from the brief amount this recovery time, VOUT can be monitored for overshoot
of time the top MOSFET spends in the saturated region or ringing that would indicate a stability problem. The ITH
during switch node transitions. It depends upon the pin external components shown in Figure 6 will provide
input voltage, load current, driver strength and MOSFET adequate compensation for most applications. For a
capacitance, among other factors. The loss is significant detailed explanation of switching control loop theory see
at input voltages above 20V and can be estimated from: Application Note 76.
Transition Loss ≅ (1.7A–1) VIN2 IOUT CRSS f

3611fd

17
LTC3611
Applications Information
Design Example Next, set up VRNG voltage and check the ILIMIT. Tying
As a design example, take a supply with the following VRNG to 1V will set the typical current limit to 15A, and
specifications: VIN = 5V to 36V (12V nominal), VOUT = tying VRNG to GND will result in a typical current around
2.5V ±5%, IOUT(MAX) = 10A, f = 550kHz. First, calculate 10A. CIN is chosen for an RMS current rating of about 5A
the timing resistor with VON = VOUT: at 85°C. The output capacitors are chosen for a low ESR
of 0.013Ω to minimize output voltage changes due to
2.5V inductor ripple current and load steps. The ripple voltage
RON = =187k
(2.4) (550kHz ) (10pF ) will be only:
ΔVOUT(RIPPLE) = ΔIL(MAX) (ESR)
and choose the inductor for about 40% ripple current at
= (3.6A) (0.013Ω) = 47mV
the maximum VIN:
However, a 0A to 10A load step will cause an output
2.5V ⎛ 2.5V ⎞ change of up to:
L= 1− = 1µH
(550kHz )(0.4)(10A ) ⎜⎝ 36V ⎟⎠ ΔVOUT(STEP) = ΔILOAD (ESR) = (10A) (0.013Ω) =130mV
Selecting a standard value of 1μH results in a maximum An optional 22μF ceramic output capacitor is included
ripple current of: to minimize the effect of ESL in the output ripple. The
2.5V ⎛ 2.5V ⎞ complete circuit is shown in Figure 6.
ΔIL = 1– = 3.6A
(550kHz )(1µH) ⎜⎝ 12V ⎟⎠
INTVCC

VIN
CF
CVCC 0.1µF
4.7µF 50V
6.3V SW
PGND SGND

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
SW
INTVCC
INTVCC
SVIN
SVIN
SGND
SGND

1 48
PGND SGND EXTVCC
2 47 C4
PGND SGND
0.01µF
3 46 (OPTIONAL)
PGND SGND
VOUT R1 R2
4 45
2.5V AT SW SGND 9.5k C1 30.1k C2
10A L1 5 44 1% 1%
C5 COUT1 1µH SW EXTVCC (OPTIONAL) VOUT
22µF 100µF 6 43
SW VFB RON
6.3V ×2
7 42 182k
SW SGND
(OPTIONAL) 1%
8 41
GND SW ION VIN
9 LTC3611 40 CON
SW SGND (OPTIONAL) CC1
10 39 0.01µF
R5 680pF
SW FCB
11 38 12.5k
SW ITH
VIN VIN 12 37
PVIN VRNG
5V TO 32V GND 13 36 39.2k
PVIN PGOOD R3
CIN C6 + 14 35 11k
4.7µF 100µF PVIN VON CC2
50V 50V 15 34 RPG1
PVIN SGND 100k 100pF
×2 16 33
(OPTIONAL)
PVIN
RUN/SS
BOOST
SGND

SGND
SGND

RVON
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN

INTVCC
SW
NC

0Ω
VOUT
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
SGND
SW RSS1 0.01µF 3611 F06

2Ω 510k
CIN = MURATA GRM32ER71H475K VIN
COUT = MURATA GRM43SR60J107M INTVCC CSS
L1 = COOPER HCP0703-IRO (OPTIONAL)
CB1 0.1µF
C5: MURATA GRM31CR60J226KE19 DB 0.22µF
KEEP POWER AND SIGNAL GROUNDS SEPARATE. CMDSH-3
CONNECT TO ONE POINT. SW

Figure 6. Design Example: 5V to 32V Input to 2.5V/10A at 550kHz

3611fd

18
 LTC3611
Applications Information
How to Reduce SW Ringing • Use a compact plane for the switch node (SW) to improve
As with any switching regulator, there will be voltage ring- cooling of the MOSFETs and to keep EMI down.
ing on the SW node, especially for high input voltages. • Use planes for VIN and VOUT to maintain good voltage
The ringing amplitude and duration is dependent on the filtering and to keep power losses low.
switching speed (gate drive), layout (parasitic inductance)
• Flood all unused areas on all layers with copper. Flood-
and MOSFET output capacitance. This ringing contributes
ing with copper reduces the temperature rise of power
to the overall EMI, noise and high frequency ripple. One
components. Connect these copper areas to any DC
way to reduce ringing is to optimize layout. A good layout
net (VIN, VOUT, GND or to any other DC rail in your
minimizes parasitic inductance. Adding RC snubbers from
system).
SW to GND is also an effective way to reduce ringing.
Finally, adding a resistor in series with the BOOST pin When laying out a printed circuit board without a ground
will slow down the MOSFET turn-on slew rate to dampen plane, use the following checklist to ensure proper opera-
ringing, but at the cost of reduced efficiency. Note that tion of the controller. These items are also illustrated in
since the IC is buffered from the high frequency transients Figure 7.
by PCB and bondwire inductances, the ringing by itself is • Segregate the signal and power grounds. All small-
normally not a concern for controller reliability. signal components should return to the SGND pin at
one point, which is then tied to the PGND pin.
PC Board Layout Checklist
• Connect the input capacitor(s), CIN, close to the IC. This
When laying out a PC board follow one of the two sug-
capacitor carries the MOSFET AC current.
gested approaches. The simple PC board layout requires
a dedicated ground plane layer. Also, for higher currents, • Keep the high dV/dT SW, BOOST and TG nodes away
a multilayer board is recommended to help with heat from sensitive small-signal nodes.
sinking of power components. • Connect the INTVCC decoupling capacitor, CVCC, closely
• The ground plane layer should not have any traces and to the INTVCC and PGND pins.
it should be as close as possible to the layer with the • Connect the top driver boost capacitor, CB, closely to
LTC3611. the BOOST and SW pins.
• Place CIN and COUT all in one compact area, close to • Connect the VIN pin decoupling capacitor, CF , closely
the LTC3611. It may help to have some components to the VIN and PGND pins.
on the bottom side of the board.
• Keep small-signal components close to the LTC3611.
• Ground connections (including LTC3611 SGND and
PGND) should be made through immediate vias to
the ground plane. Use several larger vias for power
components.

3611fd

19
LTC3611
Applications Information

CVCC
SW

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49

PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
SW
INTVCC
INTVCC
SVIN
SVIN
SGND
SGND
1 48
PGND SGND
2 47
PGND SGND
3 46
PGND SGND
4 45 R1
SW SGND
5 44
COUT SW EXTVCC
6 43 R2
SW VFB
7 42
SW SGND RON
8 41
SW ION
VOUT 9 LTC3611 40
SW SGND
10 39 CC1
SW FCB RC
11 38
SW ITH
12 37
PVIN VRNG
13 36
PVIN PGOOD
14 35
CIN PVIN VON
15 34
PVIN SGND CC2
16 33
PVIN
RUN/SS
BOOST
SGND

SGND
SGND
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
SW
NC

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

DB
CB CSS
RF
3611 F07

Figure 7. LTC3611 Layout Diagram

3611fd

20
 LTC3611
TYPICAL ApplicationS
3.3V Input to 1.5V/10A at 750kHz
INTVCC

CF
CVCC 0.1µF
4.7µF 50V
6.3V SW
PGND SGND

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
SW
INTVCC
INTVCC
SVIN
SVIN
SGND
SGND
1 48
PGND SGND VIN2 = 5V
2 47 C4
PGND SGND
0.01µF
3 46 (OPTIONAL)
PGND SGND
VOUT R2
4 45 R1
1.5V AT SW SGND C1 30.1k C2
L1 20.43k
10A 5 44 1%
C5 COUT1 0.47µH SW EXTVCC 1%
(OPTIONAL) VOUT
22µF 100µF 6 43
SW VFB RON
6.3V ×2
7 42 113k
SW SGND
(OPTIONAL) 1%
8 41
GND SW ION VIN
9 LTC3611 40 CON
SW SGND
10 39 0.01µF (OPTIONAL) CC1
R5 1500pF
SW FCB
11 38 12.5k
SW ITH
VIN VIN 12 37
PVIN VRNG
3.3V GND 13 36 39.2k
PVIN PGOOD
CIN C6 + 14 35
11k
4.7µF 100µF PVIN VON CC2
50V 50V 15 34 RPG1
PVIN SGND 100k 100pF
×2 16 33
(OPTIONAL) INTVCC
PVIN
RUN/SS
BOOST
SGND

SGND
SGND
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
SW
NC

VOUT
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
SGND
RSS1 (OPTIONAL) CVON 3611 TA02

CB1 510k
C5: TAIYO YUDEN JMK316BJ226ML-T 2Ω VIN
0.22µF
CIN: MURATA GRM31CR71H475K CSS
COUT1: MURATA GRM435R60J107M INTVCC (OPTIONAL)
0.1µF
L1: TOKO FDV0630-R47M
KEEP POWER AND SIGNAL GROUNDS SEPARATE.
CONNECT TO ONE POINT.

3611fd

21
LTC3611
TYPICAL ApplicationS
5V to 24V Input to 1.2V/10A at 550kHz
INTVCC

VIN
CF
CVCC 0.1µF
4.7µF 50V
6.3V SW
PGND SGND

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
SW
INTVCC
INTVCC
SVIN
SVIN
SGND
SGND
1 48
PGND SGND EXTVCC
2 47 C4
PGND SGND
0.01µF
3 46 (OPTIONAL)
PGND SGND
VOUT R1 R2
4 45
1.2V AT SW SGND 30k C1 30.1k C2
10A L1 5 44 1% 1%
C5 COUT1 0.47µH SW EXTVCC VOUT
6 43 (OPTIONAL)
22µF 100µF
SW VFB RON
6.3V ×2
7 42 182k
SW SGND
(OPTIONAL) 1%
8 41
GND SW ION VIN
9 LTC3611 40 CON
SW SGND
10 39 0.01µF (OPTIONAL) CC1
R5 1500pF
SW FCB
11 38 4.75k
SW ITH
VIN VIN 12 37
PVIN VRNG
5V TO 24V GND 13 36 39.2k
PVIN PGOOD 11k
CIN C6 + 14 35
4.7µF 100µF PVIN VON CC2
50V 50V 15 34 RPG1
PVIN SGND 100k 100pF
×2 16 33
(OPTIONAL) INTVCC
PVIN
RUN/SS
BOOST
SGND

SGND
SGND
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
SW
NC

VOUT
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
SGND
SGND
CB1 RSS1 CVON
(OPTIONAL) 3611 TA03
0.22µF 510k
C5: TAIYO YUDEN JMK316BJ226ML-T INTVCC VIN
CIN: MURATA GRM32ER71H475K 2Ω CSS
COUT1: MURATA GRM435R60J167M DB (OPTIONAL)
0.1µF
L1: TOKO HCPO703-OR47 CMDSH-3
KEEP POWER AND SIGNAL GROUNDS SEPARATE.
CONNECT TO ONE POINT.

3611fd

22
 LTC3611
TYPICAL ApplicationS
5V to 28V Input to 1.8V/10A All Ceramic 1MHz
INTVCC

VIN
CF
CVCC 0.1µF
4.7µF 50V
6.3V SW
PGND SGND

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
SW
INTVCC
INTVCC
SVIN
SVIN
SGND
SGND
1 48
PGND SGND EXTVCC
2 47 C4
PGND SGND
0.01µF
3 46 (OPTIONAL)
PGND SGND
VOUT R1 R2
4 45 C1
1.8V AT SW SGND 10k 20k C2
47pF
10A L1 5 44 1% 1%
C5 COUT 0.68µH SW EXTVCC VOUT
22µF 100µF 6 43
SW VFB RON
6.3V ×2
7 42 102k
SW SGND
(OPTIONAL) 1%
8 41
GND SW ION VIN
9 LTC3611 40 CON
SW SGND
10 39 0.01µF (OPTIONAL) CC1
R5 680pF
SW FCB
11 38 12.7k
SW ITH
VIN VIN 12 37
PVIN VRNG
5V TO 28V
13 36
PVIN PGOOD 9.31k 39.2k
CIN 14 35
4.7µF PVIN VON CC2
50V 15 34 RPG1
PVIN SGND 100k 100pF
×2 16 33
PVIN INTVCC
RUN/SS
BOOST
SGND

SGND
SGND
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
SW
NC

VOUT
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
SGND
CB1 RSS1 CVON
(OPTIONAL) 3611 TA04
0.22µF 510k
COUT: MURATA GRM32ER60J107ME20L INTVCC VIN
CIN: MURATA GRM32ER71H475K 2Ω CSS
L1: VISHAY IHLP2525CZERR68M01 DB (OPTIONAL)
0.1µF
KEEP POWER AND SIGNAL GROUNDS SEPARATE. CMDSH-3
CONNECT TO ONE POINT.

3611fd

23
LTC3611
Package Description
WP Package
64-Lead QFN Multipad (9mm × 9mm)
(Reference LTC DWG # 05-08-1812 Rev A)
SEATING PLANE
1.39 3.30
9.00 A 0.00 – 0.05
1.19 0.50
BSC 49 50 51 52 53 54 64
0.20 REF
B 0.30 – 0.50
1.92 48 0.53 1
PAD 1 2.01 (2x) 3.50 0.87
CORNER 1.17
3.06

0.30
(2x)
2.98
0.95
5
4.53 3.60

bbb M C A B
9.00
BSC 1.30
1.81
4.10
3.30

NX b 3.99 2.04
aaa C 2x

33
16
WP64 QFN REV A 0707

32 17

aaa C 2x TOP VIEW 0.20 – 0.30 1.42 3.85

0.90 ± 0.10
NX
// ccc C 0.08 C BOTTOM VIEW
(BOTTOM METALLIZATION DETAILS)
6
3.30 1.39
0.50 1.19

0.30 – 0.50
PIN 1 0.53 1.92
0.87 3.50 (2x) 2.01 NOTE:
1.17 3.06 1. DIMENSIONING AND TOLERANCING CONFORM TO ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS, ANGLES ARE IN DEGREES (°)
3. N IS THE TOTAL NUMBER OF TERMINALS
0.30
(2x) 4. THE LOCATION OF THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING
2.98 CONVENTION CONFORMS TO JEDEC PUBLICATION 95 SPP-002
0.95
5 DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED
3.60 4.53 BETWEEN 0.15mm AND 0.30mm FROM THE TERMINAL TIP.
6 COPLANARITY APPLIES TO THE TERMINALS AND ALL OTHER SURFACE
METALLIZATION
1.30
1.81
2.30 4.10 SYMBOL TOLERANCE
3.30
aaa 0.15
bbb 0.10
2.04 3.99 ccc 0.10

3.85 1.42 0.20 – 0.30

RECOMMENDED SOLDER PAD LAYOUT

TOP VIEW

3611fd

24
 LTC3611
Revision History (Revision history begins at Rev D)

REV DATE DESCRIPTION PAGE NUMBER

D 06/10 Updated SW voltage range in Absolute Maximum Ratings. 2
Note 4 updated. 4

3611fd

25
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
LTC3611
Typical Application 14V to 32V Input to 12V/5A at 500kHz
CVCC
4.7µF INTVCC VIN
6.3V CF
0.1µF
50V
SW
PGND SGND

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49

PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
SW
INTVCC
INTVCC
SVIN
SVIN
SGND
SGND
1 48
PGND SGND EXTVCC
2 47 C4
PGND SGND
0.01µF
3 46 (OPTIONAL)
PGND SGND
VOUT R1 R2
4 45
12V AT SW SGND 1.58k C1 30.1k C2
5A L1 5 44 1% 1%
C5 COUT + 4.7µH SW EXTVCC (OPTIONAL) VOUT
22µF 180µF 6 43
SW VFB RON
25V 16V
7 42 1M
SW SGND
(OPTIONAL) 1%
8 41
GND SW ION VIN
9 LTC3611 40 CON
SW SGND
10 39 0.01µF (OPTIONAL) CC1
R5 560pF
SW FCB
11 38 20k
SW ITH
VIN VIN 12 37
PVIN VRNG
14V TO 32V GND 13 36
PVIN PGOOD
CIN C6 + 14 35
4.7µF 100µF PVIN VON CC2
50V 50V 15 34 RPG1
PVIN SGND 100k 100pF
×2 16 33
(OPTIONAL) INTVCC
PVIN
RUN/SS
BOOST
SGND

SGND
SGND
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
PVIN
SW
NC

INTVCC
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
SGND
CB1 RSS1 CVON
(OPTIONAL) 3611 TA05
0.22µF 510k
CIN: GRM31CR71H475K INTVCC VIN
COUT: SANYO 16SVP180MX CSS
DB (OPTIONAL)
L1: HCP0703-4R7-R 0.1µF
CMDSH-3 RUN/SS
KEEP POWER AND SIGNAL GROUNDS SEPARATE.
CONNECT TO ONE POINT.

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3611fd

26 Linear Technology Corporation

LT 0610 REV D • PRINTED IN USA

1630 McCarthy Blvd., Milpitas, CA 95035-7417

(408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com  LINEAR TECHNOLOGY CORPORATION 2008