SERVICE MANUAL ECHO CAMERA SSD-1400 W English Edition Document Number : MN2-0220 Document Revision 2 Copyright® ALOKA Co, Ltd. FILE 112-0220 Rev. 2 'SSD-1400 SERVICE MANUAL, Contents of SSD-1400 SERVICE MANUAL Section 1 How to use this service manual page 1-1~1-4 (4 pages) I-1. Service Manual 1-2. Contents of this Service Manual 1-3. Construction of This Service Manual 1-4 Contents of Each Section Section 2 PRECAUTIONS (read without fail) page 2+ (A pages) 2-1 Precautions Against Electrical Hazards to Serviceman zl 2-2 Precautions Against Mechanical Hazards to Serviceman = *-* zl 2.3. Precautions Against Germ Hazards to Serviceman 2d 2-4 Precautions for Keeping Electrical Safety : 22 2-5 Precautions for Keeping Mechanical Safety 22 2.6 Precautions for Keeping Chemicals Safety : 22 2-7 Preparation to be Made at Service Center 22 2-8 Care to be Taken inthe Field 23 2.9 Precaution for Monitor repairing 23 2-10 Handling of S.M.D. PCBs fees nes ed Section 3 BEFORE REPAIRING page 3+1~3-14 (14 pages) 3+1_ Repair work on the description of Service Manual Bl 3-2 Modification work on the description of Service Manual = *~ 36 33 Messages sete 32 Section 4 PRINCIPLE OF SYTSTEM OPERATION page 4-1~4-108 (114 pages) 4-1. System Specification 41 4-2 System Configuration + 4.3. System Block Diagram rs 4-4. Principle of System Operation eu va12-0220 Rev. 2 SSD-1400 SERVICE MANUAL 4-5. Principle of each PCB’s Operation 42 45:1 PROBE SELECTOR ~~~ seers de 22 45.2 TX/PRE AMP 4 26 453 RX FOCUS sod vo de 30 MAIN AMP vrs ve 434 GEUITF vere vee : 438 pu : 442 cpu : 452 CINE MANAGER & CINE MEMORY 4 36 45.9 MECHA SERVO *+++++++ viene 4 2 45:10 MECHA PROBE SELECTOR vv 0-> vo 6B 4511 DOP ASP +00 : om DOP DSP «+--+ vee soe 80 4513 CW CONNECTOR (CW TXRX) == eo) 45-14 PHYSIO AMP++++++++ vee cree de BB 45-15. PHI (PHYSIO MEMORY) : 44 4.5016 VER MEMORY 0050 cere seers ge 100 4517 DMS ITF/VOLISERVO de tod Section 5 SCHEMATICS page S-1~S-64 (84 paves) ‘Main Body CABLE CONNECTION PSC-128 - od CABLES CABLE3I4 53 CABLE 550 CABLE 600 CABLE 601 CABLE G04 ves 5. 6 CABLE GT) CABLE 67 CABLE 672 59 CABLE 750 CABLE 752 vores ce Sed CABLE 754 CABLE 758 CALBE 762 Sa CABLE S00 CABLE 801 CABLE 802 CALBE 803 CABLE 805 CABLE 807 CALBE 808 CONNECTOR PANEL EPAOLS OPERATION PANEL L-KEY-62 MOTHER BOARD EPID EP A398 OUTLET BOX (for 100- 120V) 1B-217 ve 5 dd 2/412-0220 Rev. 2 SSD-1400 SERVICE MANUAL AC OUTLET BOX (for 200-240) 3B.219 5. 45 POWER SUPPLY UNIT PSU-SIE00 renee 5 46 UN3 (Low voltages, HVA) EPSO7S UN4 (HVB) EPAI87 TV MONITOR 1P-1235(for NTSC) /1P-1235V(for PAL) 5- 53 Physio. signal display unit PHYSIO. UNIT EU-5042 PHYSIO PANEL 1 P4206 PHYSIO PANEL 2 P4207 see 5.59) Doppler unit AUDIO VO EPS020 : 5-60 CBL3I2,— CBLB06 CBL302 CO-DMU-200-A"* tae ee pooc0n0 Section 6 TROUBLE SHOOTING page 6-1 ~6.98 (1U4pages) 6-1 Introduction 6.2 Precautions 62 6-3. Tools and Measuring Instruments Required : G4 644 Information 65 6-5 Check List Map 7 . 6-39 6-6 Waveform for Troubleshooting a BS 6 88 Section 7 ADJUSTMENT PROCEDURE aye 71~7-4 (4 pages) 7-1 Introduction 7-2 Attention : 7 wed 7.3 Tools and Measuring Instruments m1 7-4 Adjustment Procedure 72 Section 8 PERFORMANCE CHECK, page 818-14 (14 pages) 8-1 Introduction eo 8-2. Precautions 8 1 8.3 Making Entries in Repair Report & 1 844 Performance check 3/4N2-0220 Rev. 2 SSD-1400 SERVICE MANUAL Section 9 DISASSEMBLING PROCEDURE page 9-1~9.98 (UL pages) SSD-1400 Disassembling Instruction : 91 ‘SSD-1400 Installation Procedure 9. 25 SCU-1400 Installation Procedure a ) UGR- 1404) Installation Procedure ve . 9. 35 PEU-1000 Installation Procedure 9. 43 EU.9055 (VCR memory uninstallation Procedure 947 EU.9056 (Cine memory unit) Installation Procedure 9 49 ‘SCU+1400B Installation Procedure es SCU-1400€ Installation Procedure aoe 5 9 37 DMS-14000 Installation Procedure S v8 65 CAS-1400 Installation Procedure 9B SSD-1 400 Installation Procedure (for USA system) =~ 9.79 EU-9075 Installation Procedure : 9. 83 MP-HA1700-2 Installation Procedure + 9. 92 MP-PH1700-1 Installation Procedure = see 0 96 Section 10 PARTS LIST page 10-1~10-44 10-1 Contents of Parts List . se 10 10-2 Appliance of Parts List 10. 10-3 Outline of Parts List ce 10-4 Explanation of Parts List : : 1 1045 Attention 10. 10-6 Parts List Sooo060 aod cece Oe Section 11 SERVICE INFORMATION page [1-1~ 11-4 4 pages) 11-1 Introduction see - : eal 11.2.Assignment of CTRL key and those usage . see ed Appendix SSD-1400 SERVICE MANUAL Appendix. page Apndx-I~Apndx-2 (2 pages) Appendis-1 Introduction Apndx = 1 ‘Appondix-2 Manual Change Information Apnds = 1 4/41 12 ‘20220 SECTION 1 How to use this service manual Service Manual 1) This service manual has been prepared for persons in charge of repair at the field 2) This service manual is compiled according to the following basic principle. “For service, pick ‘out a faulty PCB and replace it with anew PCB.” 3) Make the best use of this service manual, making also reference to available technical support information such as “Technical Bulletin” Contents of this Service Manual 1) The equipment is repaired by PCB replacement. Therefore this service manual does not include the circuit diagrams of the PCB unit. For the function of each PCBs whose circuit diagram isnot included, refer to “SECTION 4 PRINCIPLE OF SYSTEM OPERATION” In “SECTION 4”, Specification of System, Principle of System, System Block Diagram, PCB Block Diagram, the explanation of cach PCB Block Diagram, and signal lst are described However, “Cable Connection Diagram”, “Circuit Diagram of PCB equipped with the panel switches which are easily exchangeable atthe field” and “Circuit Diagram composed of ‘general circuit such as TV monitor and Power Supply unit” are described in “SECTION 5 SCHEMATICS” 2) For changes and modifications of as well as additions to specifications, if any, prompt information will be given to you by means of “APPENDIX Manual Change Information”. @IMPORTANT@ Always observe the manner specified for replacement, addition, or deletion of “Manual Change” to prevent missing of necessary information and keeping of erroneous information, Construction of This Service Manual The structure of Service Manual is as follows: 1) Service Instructions, soon SECTION 1~3,5~9, 11 2) Principle of Operation SECTION 4 3) Parts List SECTION 10 4) Manual Change Information, APPENDIXN2-0220 SECTION | How to use this service manual 14 Contents of Each Section SECTION 1 How to use this service manual Describes the purpose of the Service Manual. SECTION 2 PRECAUTIONS Describes general precautions and preparations for maintenance service, Be sure to follow working, procedures if mentioned SECTION 3 BEFORE REPAIRING Gives information peculiar to the equipment and care to be taken before starting repair work SECTION 4 PRINCIPLE OF SYSTEM OPERATION Describes Specification of System, Principle of System, System Block Diagram, PCB Block ygram, and Signal List, Gives the convenience of diagram, the explanation of each PCB Block ‘grasping flow of major signals and mutual communication between units in the whole system, SECTION 5 SCHEMATICS Gives the cable connection diagram including all cables used, the circuit diagram of PCB equipped with switches, and the circuit diagram of TV monitor and Power Supply unit, SECTION 6 TROUBLESHOOTING Describes precautions on actual repair work and shows the necessary tools and measuring instruments, Also, includes many hints on primary diagnosis and measures to be taken inthe field20220 SECTION 1 How to use this service manual SCT} 1 'T PROCEDURE Gives guides of adjustments of PCBs and units which some PCBs need when they are replaced SECTION § PERFORMANCE CHEC! Describes the procedure of checking for proper operation after repair and provides the forms of chock sheet. SECTION 9 DISASSEMBLING PROCEDURE Disassembling Procedure Hlustrates the disassembly and assembly of main components. Be sure to follow working procedures if specified, SECTION 10 PARTS LIST Lists the mechanical parts and electrical part which replacement possibility are considered SECTION _11_ SERVICE INFORMATION Provides available information about maintenance service. APPENDIX SERVICE MANUAL Appendix Manual change information, the revision list of this manual, is filed in this section.24 22 23 WN2-0220 SECTION 2 PRECAUTIONS Precautions Against Electrical Hazards to Serviceman ‘When disassembling the equipment after checking it for a trouble symptom, give care to the following: 1) Besa to unplug the equipment before disassembly. 2) Be sure totum of th main switch onthe equipment when removing electrical pars such as PCBs probe, and cable 3) Safety alert symbols ‘The indication AN, used on this equipment and in this service manual have the following ‘meaning, “Indicates a potentially hazardous situation which, i nt avoided, may reslt in minor or moderate injury.” “A caution message is inserted here.” Precautions Against Mechanical Hazards to Serviceman ‘When disassembling the equipment, give care to the follo 1g to protect serviceman from hazards : 1) Keep the working environment neat ‘Wear working gloves to protect your hands from getting injured by burrs on the unit and casing 2) Use only proper tools suited to work being made. 3) Be sure to observe the specified disassembly procedure shown in SECTION 9. 4) Take sufficient care not to damage component with undue load, Precautions Against Germ Hazards to Serviceman 1) When it is necessary to touch the equipment, options and/or other peripheral devices at a ‘customer who uses intracorporeal (transesophageal, transurethral, transvaginal, transrectal) probes that need sterilization, take special care to protect your hands against germs, inrespective of the usage of the equipment: whether itis used in the operation room or not, 2» Service tools are subject to germ pollution in hospitals and, therefore, need periodical sterilization. 3) Be careful not to directly touch anything assumable to have germ pollution, If necessary, ask the customer for effective protection against germs.wn2-0220 SECTION2 PRECAUTIONS 24 2-6 27 Precautions for Keeping Electrical Safety 1) Be sure to ground the equipment securely 2) Perfeciness in grounding, screw tightening, and cover installation is essential. Negligence of it could cause a possibilty of leakage current from outer fitting which may lead to serious, damage toa patient being diagnosed. Precautions for Keeping Mechanical Safety ‘Take care to the following to prevent the equipment from being damaged or broken during, disassembly and reassembly work. 1) Besure to observe the specified disassembly procedure, 2) Take care not to damage component parts by undue load. 3) When reassembling the equipment, carefully check every part for loosening, distortion and creak 4) Use only the specified screws and nuts, Using any other screws and/or nuts would affect not ‘only mechanical performance, but also clectrical performance of the equipment Precautions for Keeping Chemicals Safety Whenever grease, oil or other chemicals is used for maintenance service, options and/or peripheral devices, be sure to clean the equipment and/or devices after service work, Preparation to be Made at Service Center 1) When called by a customer on the telephone, note the followings: Name of equipment Sorial number of equipment Name of hospital Telephone number ‘Name of person in charge Detail of trouble symptom as far as possible State of connection to optional devices 2) Goover the “Technical Bulletin” to see whether the complained trouble can be mended by ‘means of regular repairing method,N2-0220 Rev. 1 SECTION 2 PRECAUTIONS Care to be Taken in the Field 1) Check for trouble symptoms. 2) Check for connection to optional devices and other peripheral devices. 3) Record the contents of the battery backup memory: 4) After work restore the equipment according to the above mentioned contents of momory if 3) After completion of work, put back the peripheral devices to the original condition. Precaution for Monitor repairing 1) Subjecting the unit to sirong shocks may result in damage to the CRT or malfunction, therefore care must be taken when transporting or installing the unit @ DANGER @ High voltages are present inside the display chassis. Only experienced Av technicians should touch internal parts. @ DANGER @ — Theclectric charge has remained in CRT after the power switeh is tumed off, Because the high voltage is usually used for CRT. So make the AN clectric charge escape with a grounding stick which is connected to the around ofthe chassis and through the resistance for high voltage (Approx. 1MQ) before removing the anode cap, Some electric charge remain in CRT after escaping with a grounding stick Do not touch the metallic part of the anode eap with bare hands ‘when detaching the anode cap directly 2) CRT with the deflecting yoke is already adjusted to the best condition. Do not touch the deflecting voke and the magnet of the neck part. 3) Be sure to detach the metallic goods such as a wrist watch from your body before doing the repair work. To prevent the secondary damage and the electrical shock, the matters above should be taken into careful considerationwv2-0220 Rev. 2 SECTION 2 PRECAUTIONS 2-10 Handling of S.M.D. PCBs Iis an Aloka's policy that neither repair nor upgrade (improvement) of PCBs used for $.M.D. is ‘made in the field as a rule because of the following reasons: [REMARKS] PCB does not need repairing or modifying in the field as a rule ‘When handling a PCB, do not ouch he JC unless is necessary. IC soled with worker's hands may cause corrosion, Additionally, foreign patles suchas fine solder dust could be the cause of short-circuited IC lead wires whose pitch is smaller dhan that of the traitional ones T@CAUTION® When handling # PCB, avoid touching the IC and connector i ' pins on the devices to prevent BSD Electro Static Discharge) 4 ' damage 1 1 A service person should preferably wear an ESD wrist strap | ' correctly grounded when handling a PCB. _ Donot give excessively lar ‘When replacing the ROM (Read Only Memory) on the PCB, attempting to force the ROM into its socket would cause the PCB to be subjected to an undue force, and the following faults may 1) Damage to PCB intermediate-layer patterns, 2) Peeling of chip devices (resistor, capacitor, diode, etc.) 3) Damage to a junction between electrode and internal element of chip devices, 4) Peeling of pattems (especially those for mounting the parts) together with chip devices since those patterns are rather fragile compared with PCBs used before no 3) Damage to parts on the reverse side in the case of PCBs of both-side mounting type. rand Also, a PCB mounted improperly or a warped PCB mounted as its may cause the chip devices to came off and the fine pattrns to be cut additionally, reuse of chip devices (including resistors, capacitors, diodes. cc. is strictly inhibited because of the following reason: Since the chip devices are lacking in lead wires, such as those found inthe traditional component parts, heat given to the PCB willbe directly conducted to the inside of chip devices. As a result, a thermal stress will ccur due toa difference in thermal ‘expansion coefficient between each chip device and PCB, giving rise ofthe possibility of cracks inside of or on the surface of chip devices or the possibilty of thermal breaking (internal burning). ‘Very thn wiring pattems require extreme-care in handing ofthe PCB Be sure to observe the precautions mentioned above also to prevent the secondary accidents.31 ww2-0220 SECTION 3 BEFORE REPAIRING Repait work on the description of Service Manual ‘The typical processes forthe repair work are shown as the Flow Chart on the next page. Do the repair work according to this procedure, In the case of upgrade (improvement) of the Technical Bulletin or Upgrade Kit, see the next item 3-2, Each procedures of flow chart are numbered to refer its detail shown from page 3-3. Furthermore, the low Chart and its explanation show the time when each section of service man are required on repair work. This is a guide forthe usage of service manual. ‘The service manual is very important for the repair work, especially readjustment and performance check after completion of repair work. This is to keep the safety and quality of equipment. If you make them, you have to describe thatthe treatment has been done according t0 the applied section of service manual, on the repair report or the like, ‘The circled numbers shown in the Flow Chart on next page, are corresponded to the procedure numer shown from pageww2-0220 SECTION3 BEFORE REPAIRING Demand of repai (START) Reception and Investigation Technical Bulletin Section 4~6, 11 @ [Selection and order of Section 6, 10 required part(s) History © [Preparation Section 3 at your site at customer side Confirmation © Repair and Section 2, 6, 9 adustment © [eepzation cneck Section 8 @® [check by customer Fill repair report Approve by customer Repair again? ® [Present repair report @ [show comments of the Demand 0 repair the prohibition to use onthe defective part(s) ‘equipment ——t Report to customerwve-0220, SECTION 3 BEFORE REPAIRING Procedure 1 Reception of repair and investigation ‘Accept the repair request from the customer or distributor. At thi time, the following points have to be confirmed and checked, Model name/nurber, and serial number ‘Name of customer, address, phone number, and name of person in charge Configuration of the connection of peripheral devices Software version or the like shown on the start up display(if possible) Detail of phenomenon appeated on the function of equipment ‘Make an examination what circuit may be defective as the function of equipment based on the above information, If you need to know about the basic operation and special information for the ‘maintenance, refer 10 the following sections, or ask to the Technical Support, © Section 4 PRINCIPLE OF SYSTEM OPERATION © Section 5 | SCHEMATICS © Section 6 TROUBLESHOOTING @ Section 11 SERVICE INFORMATION ‘The reported phenomenon may be the original problem on the equipment, Because, refer to the Technical Bulletin separately issued 10 check it whether defectiveness or not, IFit has been reported 4s the original problem, make a work according tothe Technical Bulletin. Procedure 2 Selection of required parts and order I you find the doubtful circuit, order the necessary parts. Then check the delivery date and decide the date fo visit on the consultation with the customer. For the selection and order of parts, refer tothe following sections, © Section 6 TROUBLESHOOTING Section 10 PARTS LIST For the electrical parts such as UNIT, check the history information on the HISTORY of this, equipment separately issued,20220 SECTION 3 BEFORE REPAIRING Procedure 3 Preparation of visiting the customer Check the required tools, measuring devices and parts to be replaced before the visiting the ‘customer. Then check the special information forthe equipment reference with the following section, © Section 3 BEFORE REPAIRING Procedure 4 Confirmation of phenomenon Confirm he appeared phenomenon and condition to happen i with he customer. Ifyou don’t now about the operation of equipment, refer tothe Operation Manual attached to the equipment Procedure 5 Repair and readjustment Repair the defective circuit with the brought parts. For the repair work, read the following section carefully, @ Section 2 PRECAUTIONS ‘And, examine the trouble reason depending on the situation with following section, Section 6 TROUBLESHOOTING ‘The electrical or mechanical read tment may be requested depending on the replaced parts, Because, refer to the following section after complection of repair, © Section 9 ADJUSTMENT Procedure 6 Operation check (Check the system behavior to keep its condition as same as before in trouble, reference with the following section. Be sure to do according to the description because check items are depending on the portion to be treated, Section 8 | PERFORMANCE CHECKwwa-0220 SECTION 3 BEFORE REPAIRING Procedure 7 Judgment of the operation quality I the result of “Procedure 6” is passed to the all standards, do the next “Procedure 8”. On the other side, if not, make a judgment of “Procedure 10”. Procedure 8 Confirm by customer, make repair report and approve Reconfirm the solution of trouble phenomenon with the customer. Then make a repair report and obtain approval of customer ‘The repair report shows not only the treatment but also the method of readjustment and operation check. If they have been done according 10 the service manual, the followings have to be shown, “Readjusted according to the Section 9 of service manual.” “Checked according to the Section 8 of service manual, and passe: Procedure 9 Presentation of report and order to repair parts Fill the repair report with necessary item, and present it according to the certain procedure. Ifthe defective parts that rouble cause included is available to use again by repair, make an order 10 do. Ifyou cannot judge whether the part can be used again or not, ask 10 the Technical Support. Procedure 10 Judgment of possibilty to repair again As the result of judgment on “Procedure 7”, ifthe trouble is not solved, judge the possibility 10 ‘make the repair work again, I available, return fo “Procedure S” and continue to work, If unavailable, go to “Procedure 11”. Procedure 11. Indication of the prohibition to use As the result of judgment on “Procedure 10” if you judge that itis impossible to continue the repair work at this time, indicate that the equipment is still out of order, and also show the prohibition to use, on the equipment. Procedure 12 Report to the customer Report the reason why the trouble cannot be solved to the customer. Then consult about the plan of next repair work. ‘And do the same way from “Procedure 2”, al:ww2-0220 SECTION3 BEFORE REPAIRING 32 Upgrade (Improvement) work on the description of Service Manual ‘Tho typical processes for the upgrade ( improvement) work are shown as the Flow Chart on the ext page. Do the upgrade ( improvement) work according to this procedure. Inthe case of repair work, see the previous item 3-1, Each procedures of flow chart are numbered to refer its detail shown from page 3-8, Furthermore, the Flow Chart and its explanation show the time when each section of service manual are required ‘on upgrade ( improvement) work. This is a guide for the usage of service manual. The service manual is very important for the upgrade ( improvement) work, especially readjustment and performance check afer completion of upgrade ( improvement) work, This is 10 kop the safety and quality of equipment, ‘The eircled numbers shown in the Flow Chart on next page, are corresponded to the procedure ‘number shown from page 3-8.ve-0220 SECTION BEFORE REPAIRING (Demand to upgrade (improvement) (START) @ © [Sekection and order of Cearce Consultation with requires parts/kits instllation Technical Support Procedure @ at your at customer side ® @ © Dothe repair wor Yes _aceording 9 item 3-1 | [Upgrade (improvement) Upgrade Upgrade (improvernent) Procedure Operation check © [Brow ammens tne Seacaee caer epee Return unnecessary parts, and report of upgrade (improvement)wN2-0220 SECTION 3 BEFORE REPAIRING Procedure 1 Selection of required parts / kits and order Accept the upgrade ( improvernent) request from the customer, distributor or person in charge of sales, AL this time, the following points have to be confirmed and checked to decide the parts and kits, ‘Document name that announced the upgrade ( improvement) or kit requested ‘Model name/number, and serial number ‘Name of customer, address, phone number, and name of person in charge CConfigoration of the connection of peripheral devices eocee Software version or the like shown on the start up display Make an examination what parts or kits are required based on the above information. For the selection, refer to the following document separately issued, or ask to the Technical Support, © Technical Bulletin To confirm the detail of upgrade ( improvement, see the Installation Procedure attached with applied Technical Bulletin, Depending on the upgrade ( improvement), hardware, or software, the other upgrade (improvement) may be required. Check it with the Technical Bulletin. “Then, confirm the delivery date of required paris or kits, and decide the date to visit on the consultation with the customer. . Procedure 2 Preparation of visiting the customer (Check the required tools, measuring devices and parts or kits to be used before the visiting the ‘customer. Then check the special information for the equipment reference with the following section and document, @ Section 3 BEFORE REPAIRING Technical Bulletin and/or Installatiion Procedure2-020 SECTION3 BEFORE REPAIRING Procedure 3 Operation check before upgrade (improvement) (On the basis of work, the upgrade (improvement) to the defective equipment is prohibited. Because, before upgrade (improvement) work, check the behavior of equipment whether normal or not according to following section and document, © Section 8 PERFORMANCE CHECK © Operation Manual Procedure 4 Judgment of the operation quality the result of “Procedure 3” is passed to the all standards, do the next “Procedure 5. On the other side, ifnot, go to “Procedure 10” Procedure 5 Upgrade (Improvement) work Do the upgrade (Improvement) work according to the following document, © Installatiion Procedure attached with kit or Technical Bulletin Procedure 6 Operation check after upgrade (improvement) (Check the system behavior to keep its condition as same as before the upgrade (improvement), reference with the following sect ». Be sure to do according to the descripti mn because check jems are depending on the portion to be treated. @ Section 8 PERFORMANCE CHECK © Installation Procedure Procedure 7 Judgment of the operation quality If the result of “Procedure 6” is passed to the all standards, do the next “Procedure 8". On the other side, if not, make a judgment of “Procedure 11”,‘wn2-0220 SECTION 3 BEFORE REPAIRING Procedure 8 Confirmation by customer Reconfirm any functions of equipment with the customer. Then, ifneed, introduce and explain bout the new functions and specification added by this upgrade (improvement). Furthermore, if need, make a report tobe approved by the customer. The report shows not only the treatment but also the method of operation chock, IC it has boon done according to the service ‘manual, the following has to be shown, “Checked according to the Section 8 of service manual, and passed.” Procedure 9 Return of unnecessary parts and report of completion According to the Technical Bulletin, return the unnecessary replaced or unused parts as soon as possible if suggested. ‘And, ithe report of upgrade (improvement) is suggested on the same document, report it with the information required, Procedure 10 Work for the abnormal behavior of equipment On the result of judgment in “Procedure 4”, ifthe equipment does not work normal, solve the problem according to item 3-1 “Repair work on the description of service manual” shown in this section, When the problem is solved, return to “Procedure $” of is item and continue to do the upgrade (improvement) work. Procedure 11 Judgment of possibility to recover ‘As the reslt of judgment on “Procedure 7, if the problem has been made by this upgrade (Gemprovement, judge the possibility to recover it I available, return to “Procedure 5” and continue to work. If unavailable, go to “Procedure 12” Procedure 12 Indication of the prohit tion to use A the result of judgment on “Procedure 11”, if you judge that i s impossible to recover a this time, indicate thatthe equipment is the out of order, and also show the prohibition to use, on the equipment, 3-10wa2-0220 SECTION 3 BEFORE REPAIRING Procedure 13. Report to the customer Report to the customer that tho upgrade (improvement) has not beon comploted because of the problem on the upgrade (improvement) work. Then make a schedule to fic and complete it, Procedure 14. Asking to the Technical Support Report tothe Technical Support about the happening of problem on the upgrade (improvement) ‘work, make an examination fo solve and order the additional parts. Before the asking, check the following points, [Name of kit, or the issue mumber of Technical Bulletin showing the upgrade (improvement) Model name/mumber, and serial number ‘Configuration ofthe connection of peripheral devices Software version or the like shown on the stat up display Indication of equipment such as Upgrade (improvement) or History Label Detail of phenomenon appeared on the function of equipment 3-11mi2-0220 Rev. 1 SECTION 3 BEFORE REPAIRING 33 Messages In this equipment, messages are displayed warning that the equipment is malfunctioning or advising the correct operation method. ‘Thore are two types of mossage, differing according to their content. 1) WARNING This appears atthe center of the screen and an alarm tone is also emitted (You can switch over the warning display postion atthe bottom of sercen by selecting WARNING DISPLAY in Common Preset of PRESET, then sclecing “BOTTOM” ) 2) Assistance Messages ‘Wihien you use the keyboard to operate a function in a menu, assistance messages appear in the message area atthe bottom of the screen | ‘Warning Area Message Area Fig. Mesage Areas 3-12MN2-0220 Rev.1 SECTION 3 BEFORE REPAIRING 1)_ WARNING Ne. Message Cause | Treatment 1 | invalid probe connected. [A probe was connected nol|Connect a suitable probe, intended for use with the eauipment 2 | Storememory clear [The NEW PATIENT switcjiit is prmissible to erase image Data in he memory will be was pressed or MEMORY |data, press the SET switch, I deleted [CLEAR was selected from thehot, press the MARK. REB} Press to proceed. foenu switch --Quit 3 MEMORY FULL [You attempted wo store a larger[Delete unwanted images trom Press key agin to amount of image data than the}he data already stored in the clear old images. remaining capacity ofthe store memory -Quit___|memory 2) Assistance Messages No, Message Cause ‘Treatment 1 | Enter data from keyboard. When the name of the hospital|Enter characters from the ‘Then press key. [and the data was input keyboard, then press the SET] key 2 INPUT ERROR |When incorrect values were Input the appropriate values. Invalid entry. Enter correct input during input of the data value. land time. 3. | theimage [When the PRINT, STORE, Freeze the image then press the| ‘Then try again, REVIEW © switches were|switch, lpressed during freeze or when| [HIST measurement was} carried out [You attempted to perform an|Press FREEZE. Then try again. lauto trace without freezing the| limage, To change frequency or angle, |Afier having changed to alse the ELEMENT SELECT| press key. elements 6 | System AUTO-FREBZE. Press |When panel operation was not|Press the FREEZE switch, key to resume, _|earried out for 20 minutes. 3-1312-0220 Rov. 1 SECTION3 BEFORE REPAIRING No. Message Cause ‘Treatment 7 | USE to swite, |coom operation. sctivato zoom. 8 RANGE LIMIT lWhen setting was made| Selection is not available, exceeding the change limit in} lease of changing a setting value} hvith the rotary encoder. 9 |USE to move |You attempt to shift a body [Shift the body mark with the the mark Then press mark. jrackball, key 10 | Press key to {To display the fetus body mark.|The fetal rotation function is rotate Fetus mark lactivated by the MARK REF| leitch, 11] DETECTION ERROR — {When it is not possible to| R-wave of ECG is not detected [detect the R wave of the ECG| lor S seconds or more. 12 | IMAGE stored in memory [When operations were finished| ramet lafter carrying out store, 13 | DATA/image deleted. When there was erasing of 1 o all images in the store memory. 14 | No images have been stored in [If you attempt to erase an| memory. limage when there are no] limages in the store memory. 15 | Press to display |If you attompt to crase anjPress the REVIEW switch] the image to be cleared from thefimage in the store memorylselect the image to be erased store memory. Then press when a review image is notfthen erase it key, ldisplayed. 16 PROCESSING When the histogram is being| lcaloulate. 17 | Measurement memory area is |You attempt to _perform| full. To proceed clear [measurement when the| measurement, press key to clear. lempty 3-14wwa2-0220 SECTION 3 BEFORE REPAIRING No. Message Cause Treatment 7 | USE to switch [zoom operaation. activate zoom, 8 RANGE LIMIT |When a setting was made| Sclection is not available. exceeding the change limit in ease of chan withthe rotary encoder. 9 | USE to move |You attempt to shift a body [Shift the body mark with the the mark. Thon press mark trackball key to. [To display the fetus body mark.|The fetal rotation function is rotate Fetus mark, lactivaid by the MARK REF| witch, 11] DETECTIONERROR — [When it is not possible to 1 of ECG is not detected [detect the R. wave of the ECG for § seconds oF mor 12] IMAGE stored in memory | When operations were finished} ramet lafter carrying out store. 13 | DATAVimage deleted. [When there was erasing of 1 or all images in the store memory. 14 | No images have been stored in [If you attempt to erase an memory image when there are no images in the store memory. 15 | Press to display |If you attempt to erase an)Press the REVIEW switch, the image to be cleared from the|image in the store memory|select the image 10 be erased store memory. Then press when a review image is notfthen erase it key to clear. lmeasurement when the Imeasurement display arca was lempty. 3-15WN2-0220 Rev. 2 SECTION 4 Principle of System Operation PCB reference table in section 4 No. TITLE MODEL (1) | MODEL (2) | MODEL (3) 4-5-1 | PROBE SELECTOR Ep4004** 4-5-2. | TX/PRE AMP Ep404g** 4-5-3. | RX FOCUS EP4045** 4-5-4 | MAIN AMP. EP4OO7#* 4-5-5 |GEUITF EP3956°* 4:56 | DIU EP3966** 4-5-7 [CPU EP3990%* | EP430S** CINE MANAGER EP3996"* 45-8 CINE MEMORY EP3997** 4-5-9 | MECHA. SERVO EP4008** 4-5-10 | MECH. PROBE SELECTOR | EP4010** 4-5-1 | DOP. ASP Ep3944"* DOP. DSP EP3045% 4-513 | CW CONNECTOR EP4O11** 4-5-14 | PHYSIO. AMP EP4012** 4-5-15 | PHYSIO. MEMORY (PHI) _ | EP3995** 4-5-16 | VCR MEMORY EP3068** 4-5-17 | DMS ITF/VOLISERVO EP4293%*4-1, System Specifications Scanning method ‘Simultaneously connectable probes: Display modes Line mode (M, D mode) Display method Sweep speed Echo erase Request function B refresh function Image display magnification Electronic linear probe Electronic convex probe ‘Mechanical scanner Screen display direction Zoom function Move position (B mode) Scan area Positive/negative reverse ww2-0220 Rev. 2 SECTION 4 Principle of System Operation Electronic linear scanning Electronic convex scanning Mechanical sector scanning (with SCU-1400* connected) Mechanical radial scanning (with SCU-1400* connected) Electronic scanning probes: 2 Mechanical scanner probes: 2 o (sith SCU-1400* connected) Independent probe: 1...... (with UGR-1400 connected) :B, 2B, BM, M, BIPW, PW.....(ovith UGR-1400 connected) BICW, CW un. (with UGR+1400 + SCU-1400* connected) Scroll + 1,15,2,3,4,6,8 seclscroen 2 Yes + Yes : No 4 levels from 3,4, 5,6,8, 10, 12, 15,17, 19, 21, 24 em + Blevels from 3,4, 5,6,8, 10, 12, 15, 17, 19,21, 24.em + Slevels from 3, 4, 5, 6, 8, 10, 12, 15, 17, 19.21, 24em, + Reversible vertically and horizontally (in B mode only) +B scrolling method + Yes + Variable (moveable) t InM, D mode image only 4-1-2wno-0220 SECTION 4 Principle of System Operation Ultrasound focusing method Electronic scanning probe : Transmit focusing. B mode... 4 steps max, BIM mode..... 1 of 4 steps M mode... 1 of 4 stops D mode........1 of 4 steps (with UGR-1400 connected) Acoustic lens + Receive focusing, max. 16 levels, continuously variable Acoustic lens ‘Mechanical scanning probe = ‘Concave focusing. Acoustic output control + Gt-level selective Image adjustment and processing functions Gain B mode... Continuously variable M mod... Operates as B-mode compensation value D mode... Continuously variable (vith UGR-1400 connected) stc + 8 sliding volumes Contrast + Bode... revel switching Mode... 8level switching D mode... 8level switching . (vith UGR-1400 connected) AGC 2 Brmode 0. 8-level switching M mode... level switching FIC + ON/OFF(M mode only) Reliet 2 Brno ad-level switching M mode... level switching ABC (Automatic B-Gain Control) + 64-level switching IPS (Image Process Solect) + 8-level switching VIEW gamma compensation 3 types PHOTO gamma compensation + 3 types Frame correlation + 4level switching(also, Autofunction for circulatory system) Line interpolation : ON/OFF Post-processing. 5 S typesLime density Image select Presets, Measurement functions Annotation function Characters and automatic display Graphic display N2-0220 Rev. 1 SECTION 4 Principle of System Operation 2 Blectronie probe on 2-level switching Mochanical sector. ....2level switching Mechanical radial 2Hevel switching =: Stypes 5 1S types + Basic measurement Obstetric measurement Cardiac function measurement Doppler measurement.....(with auto-trace function) (ith UGR-1400 connected) VCR playback measurement (with EU-9055 connected) : Yes 21D Mcharacters <1 line Age, 4 characters 1 ine Heart rate S charactors. * 1 ine Name. 23 characters X 1 line Sex Vcharacter x1 line Hospital name ......21 characters X 2 lines Comments... nn 57 characters X31 lines (NTSC) ST characters. 36 lines (PAL) Date and time Probe number Probe frequency Image select Line density Acoustic output BSA, GA B-mode plane number Frame rate Depth range: (vith SCU-1400* connected) Gain Contrast + Gray-scale bar (64 gradations)12-0220 Rev. 1 SECTION 4 Principle of System Operation Seale mark Index mark Fous mark ‘Scan area mark Cine & search mark Meursor M time marker Doppler cursor (with UGR-1400 connected) Doppler sample mark.....(with UGR-1400 connected) Doppler angle mark... (with UGR-1400 connected) Doppler base line... (vith UGR-1400 connected) Doppler flow-rate mark... (with UGR-1400 connected) Doppler time marker.....(with UGR-1400 connected) Puncture guide line Caliper mark Body mark... ons: ABDOM OBIGYN CARDIO Py SMALL PART Four limbs Animals* + (dependent on setting) Cine memory (optional) Search function + Yes (Max. 32 frames in B mode) Scroll function 2 Yes Store function + Yes Review function Yes Loop playback funetion + d-level switching of playback speed Doppler (optional) PRF (Velocity range) : PW. 1 to 25 KHz, cw. 2 t032 KHz Spectrum invert function 2 Yes Baseline shift function 2 Yes Angle compensation function = Yes Doppler pre-compression + 2levels Wall- motion filter + I2levelsRejection Steored beam Doppler smoothing Doppler resolution Physiological signals (optional) ECG display Sensitivity Position ECG synchronization R-DELAY PCG display Sensi Position Image display system External L/O signal connectors Power supply input voltage Power consumption External dimensions Unit weight Operating ambient conditions 2-020 Rev. 1 iple of System Operation 2 16levels + -20, 15, 10, -5,0,.5, 10, 15, 20 deg. 2 Blevels 2 Zlevels + Vchannel + Continuously variable + B mode, Fixed M, D mode. Yes (I channel) (Continuously variable 1 0102.55 sin 10 ms steps 1 channel (only with M, D mode display) Continuously variable + Continuously variable + Black and white composite video signal (NTSC, PAL) Black and white composi co signal input: 1 Tine Black and white composite video signal output 2 lines, + 100 10 120 VAC, 200 to 240 VAC, 50/60 Hz. +: 600 VA max. Overall width ...490mm Overall height...1280mm Depth. 705mm Approx. 90 kg. 1010.40 °C 30 10 85 % pressure700 to 1060 hPa 2 Temperature, Humidity BaromeWN2-0220 Rev. 2 SECTION + Principle of System Operation 4-2, System Configuration ‘The SSD-1400 ultrasound diagnostic device comprises the following units Main unit usi-i44 THIRX circuit DIU ciruit Doppler circuit (Option) ‘Operation panel nit L-KEY-62" Track ball L186 Observation TV monitor IP-1235*(NTSC) /IP-1235*V(PAL) Power supply unit PSU-S1400" Options Mechanical scanner unit SCU-1400¢ Doppler unit, UGR-1400 Physiological signal unit PEU-1000, Cine memory unit EU-9056 VCR memory EU-9085 Footswitch MP.2345 3eway footswitch MP-2614 Recording device (Black and white printer) eR Data Management Subsystem DMS-1400 (Ver 3.0 onward) ‘Computer Aided Subsystem ‘CAS-1400 (Ver3.0 onward, for USA) Volume mode unit EU.9075 (Ver 4.0 onward) 4-3. System Block Diagrams Lists of all PCBs mounted in the device (except power supply unit and external options) and system block diagrams are shown on the following pages. See Section 4-5 "Principle of PCB Operation” for the PCB block diagrams,‘SSD-1400 PCB List (1/2) [SSD-1400 JUnit PCB model [Name [Beseripon Iname [Main un ery IEP401300 — [CONNECTOR PANEL [Connectors for BIW printer, VOR TV signal, lroor-suvitch, printer control signals [Operation panel unt |[-KEY-02™ [Operation Pancl Image storage unit |USM-22 EPANIOO) — |MOTHER BOARD EPA39800 [EPIO0400 [PROBE SELECTOR — [Two 200-pin conncctors, PROBE 1/2 selection, HVS, AVS contra, probe code louxput JEPs04400 | TXIPRE AMP [Transmission iggor signal genoraton, transmission pulso gouscation, PRE |AMP circuit, PRE STC signal goncration, L ON/OFF circuit, ransmission ower supply voltage monitoring circuit [EPI04500 [RX FOCUS [Delay & addition, lecironic/mechanical scanner probe received signal Jswitching, Doppter RF signal output, V.B.P.F.cirewit, LOG AMP circuit, leceived signal output IEPa00700 | MAIN AMP JReveive dynamic focus selection, gain, AGC, contrast, rohetcireuit and control signal gencration, transmission vllage monitoring circuit, transmission trigger land transmission pulse generation for mochanical scannor(Rev.DD and after, [Tx circuit for mechanical scanner is moved to Mecha Servo board.) [EPSOSc0010T |GEULTF [ND conversion, frame rate and heart rate calculation, mode contro, ultrasound laddress generation, transmission voltage control, timing signal generation lEPsoco007 [DIU [D/A conversion, pre-processing, main memory, post-processing, GEU interface, parameter memory. display control, TV timing signal generation fEP309000 {CPU [Overall system control, character and graphic generation /EP430500 Cine memory wait IEU-9056 [EP399600 [CINE MANAGER [Cine memory readTvete conieal fEP300700 [CINE MEMORY — [BAW cine memory [Mechanical seanner unit |SCU-I400* _]EP400800 MECH. SERVO [Transducer position detection, motor dive signal generation, shaking [compensation circuit, transmission timing signal generation {(Rev.DD and ater, Tx circuit for mechanical scanner is added.) [EPa0T000 MECH, PROBE Two G0-pin connectors, PROBE 172 sclection, PRE AMP circuit, probe code ISELECTOR, loutput. CW transmission power supply voltage output to data bus [EPAOTION — [CW CONNECTOR [CW TwWRk circuit (ransmission reference signal generation, transmission (CW TXRX) voltage control a gd & 2 ? £ °N0y 02Z0-ZHH‘SSD-1400 PCB List (2/2) Issp-1400 Iv JPCB model [Name [Description name Boppler unit’ UGR-T400|EP394400 JDOPASP igh frequency tuning circuit, Quadrature detection, sample hold circu, wall- lmotion filter, anti-aliasing filter, A/D conversion jeP394500_—_ [DOP DSF IFFT frequoncy conversion, audio signal output IEPa02000 [AUDIO 110 [D/A conversion , external audio signal iput circuit Physiological signal unit [PEU-1000 EP401200|PHYSIO. AMP IECG AMP, PCG AMP, R-wave detection, PCG filter circuit, hum filter circuit (EU-5042) JeP399500 [PHI [A/D conversion, interpolation cireuil, physiological signal memory, memory |(PHYSIO. MEMORY) control, physiological signal synchronization mark generation [EP430700__[PHYSIO. PANEL 1 Adjustment trimmers for ECG and PCG sensitivity and display position [EP420600_[PHYSIO. PANEL 2 [ON/OFF switches for ECG. PCG, ECG SYNC and SOUND VCR MEMORY. lEU-9035 IEPS96800 [VCR MEMORY [VCR momory, momory control (address and timing) Power supply unit [PSU-S1400 HS1V, 5V. £15V, +15V_(TV monitor) +24V. HVA, HVB. [Observation TV monitor |IP-1235* [Black and White TV monitor (NTSC) IP=1235°V [Black and White TV monitor (PAL) [Volume mode unit leu-9075 IEP429300 [DMS ITF/VOLISERVO|DMS interface, Video signal inpuoutput circuit, Volume mode calculating, block, motor servo circuit Data Management [DMS-1400_ JDMU-200 [DATA (CPU, VCM board, SCSI card, Ethernet card, Floppy Disk Drive, Hard Disk [Subsystem MANAGEMENT UNIT|Drive [EPA20301 [DMS ITF IDMS interface, video signal input/output cieut [Computer Aided ICAS-1400__ |DMU-100_ DATA [CPU, VCM board (without memory), SCSI card, Ethernet card, Floppy Disk [Subsystem MANAGEMENT UNIT|Drive, Hard Disk Drive [EPa29301 _ JDMS ITF [CAS interface, video signal inpaVouiput circuit sidioug + NOLLOAS uoneiedo waisis Jo "Ney 02Z0-ZNARX FOCUS MAIN AMP ela og >| Beer vere] ARP Bled] Sot voor] of S88 q RX FOCUS. Signa Processor ee od 5} (Ganste. REE) lvarr [eeNrRo. 2 | re an : 3 Ccontast : Ter rite}S—] Generar a a= PRE sto] ESnerter : 5 032, Kam MEGHAR, _ Seite MECHA i : MECHA T we fs] é USM-22* > et |wh: Linear or ae | gover (| Bb |B: ; fe Brobe eu: i : JED: i Teena TL servo GEU Timing Hv con’ ms Do iMecna i BDe i i! SERVO i Lente mec LL || | i SU 400 opton! PRE a Q i 3 ic i Se8 if GEU BUS Windo} GEV Interface a5 ' ASP i = {I es Ui ucr.r400" option i ae = Mechanical |!MECHAPROBE | ij | ASP Sector Prove | | SELECTOR i Independent Probe ‘SSB°1400 S/N 8840001 ~ 8840050.” (Optional mechanical probe connection wnt : $CU-1400 S/N 8780001~8780020 )2-020, SECTION 4 Principle of System Operation DIU ‘ainch te, a Ee, a | ozs, pu oA ¥. —— Fer Sore [ttt “|CINE MEM p-1235M(PAL) iVCR j MEMORY 1 EU-9055"(Option} CINE MGR! i-—-=-= 2-28 EU-2086"(Opter) [asaress Senerator DIU Control DIU Timing br opto) cai) oo veR(opten 9 QeSNTREL :O VIDEO OUT ao iZg Ovocom 7, LI 1 2Z VIDEO OUT. [LSE Srocrow pation ae 4.0 ‘itt Sood OOO HV COND Boal i F 2 i !PHYSIO AMP pos a0 242° (Option)! __ _._ £U-S042"(Optoh| ESS nPTS In HUM Power Supply Unit et a SYSTEM BLOCK DIAGRAM 4002 5} detector Signal Process tanste ‘SecRiry EXCHANGEY 5 a vere} 498 RX FOCUS. | TX/PRE AMP. Trane. DT ‘ink Genet z = a |e . ale Linear or i BB . Bee #8 ea eg EU Tim Hy cont Sonia? | ceu aus windof CEU Intertace A A Mechanical Sector Probe ap fee fi CONNECT :1400:10BHen} ; : PSC-128* Oppel PANEL &2 USI-144 = ‘Apply for SSD“i400 S/N BSiO0ST~, (Optional mechanics probe connection unt: SCU-14008~ S/N #780021wv2-0220 SECTION 4 Principle of System Operation 7 Post Prosess | = TPs12a5INTSC} M, IPaiza5v(PAL) ss(opton) | i ‘CINE MGRI wl den EU-9066"(Optor) ai): “ > 5 aadress 5 Seite DIU Timing US interface g Printer(Opton) ° Aupio a 8 2 : ‘vcR(Opton) Serre CENTRO QO vwe0 our oo Oviveo in vt Quiveo ou: Oroor sw 0 0 O FYSIOAMP | PSU-S1400" > Eu-5042" Optioh) Power Supply Uni Te ODED SYSTEM BLOCK DIAGRAM SSD-1400 WA a 10-7T | t K — Tels[els T i Tle bess 3 = 3 Tee bebe Eh eral RXFOGUS ~ Eaots0o—~—*Y«|SCMAIN'AMP EB A007 Re ver|—of Be | _ a ——— a = EP404500 | “ep ioaa00 || Ae Mechanical Sesser Probe ae ED EGEEE PPE EL Ebr eb eb Eb ebb sh Prb rb errr esr rrr} Ipsependere Pree PSC-128* _ nn USI-144 ch | [ -beusto Poh z 7 REVISIONS1N2-0220 Rev. 1 SECTION 4 Principle of System Operation z ‘Ss T x e[sTeTs i 12 [stats sh [zfslsTs = : = : | PIU epsesso00(NTSCIPAL) OMS 1400 oF GAS-A000 Aion) “care <——S pe on bol vee, 1 : pezevem) [Sarees 1] PHI epgggsoq i i [ L_ Beeson} mm | i i NE | if IVGR erect | i| MEMORY 1] cen oak oe ee ° at ao8 |_ tm com sil a Verontin { 6 a GeuITe | i6 i oo EP395% Zi 89 > 8% veroour cwswicun = ES BE bros [500] liv cont ‘Sins 122 |eetomne—S] PSU.s1400° [evs omni] (neon abl owe py Une ne Tee 7 SYSTEM BLOCK DIAGRAM | SSD-1400 wes. | %4 wonsaneene | ON | SESNED | GUESS] AND | DRANG WO AE eeK Tis Gta 2 é @ Teles Tels tate Tete ls t a FAESESEREAESE ce ca one ry is MA “2 __ [cor , | [= le RXFOCUS Wy EPi04500 g be 2 8 ae [ence] §] ola| — 1 i lel ¥f g 3 el 6 i le epeator Q fs | Probe a : i ¥ : one ot [HI] S88 = = } Susann ols cnwica | | MECHA PROBE ase | SeobrSbe | | SELECTOR Le «I i. seoseareroy cron me 7 = | = STON RF =| z ae] ou sunt a ir : 38 few ee SONNECTOR ee ee =| pie see ey een 7 <=] ugnraal_PSC-128" ERevase |! °12-0220 Rev. 2 SECTION 4 Principle of System Operation 7 uv Ww Bx ¥ Zz Vz[a1 Vizlslalsteels[ateh [els [als lilels [el ists DME ITFVOUSERVO “# TV ous-14n,ca9-140 EU907 ob shes fas" Lf se HE] EL fet, oe i PE h ene F r ERSOSEOOTOTINTS!PAL) | =| | POTS) OU Wem —_eracored PemeVeAL) Lu os enn) \ WetiorY j SMENER | | Cosson | Bi RE] bE PrtenOxton) Daty | R.Deiy GATE! i ae a [5 eden, © oun al Conte! Signals 2 99 SRNes, 8 84 vocoour Er A Pe Deere 32 VIDEO OUTS 508 gw (option Foor sw PRIN = = 88d rcorsw [000] ope | Fv con inet} EUSOD ono FINE 122 | | yao me Psu-s1400" oreoxcaoend| | FC woracd [Eosm PEIN Power Stpply Unt ince SYSTEM BLOCK DIAGRAM ssD-1400 ver4 | ‘DRAWN | OESNED | CHECKED | APO DRAWNG NO. ‘SCALE units, 4-1 0-512-0220 Rev. 2 SECTION 4 principle of System Operation 4-4 Principles of System Operation 4-4-1, System Control Unit OPERATION NEL ae 1X RX MAIN pre Amp| | Focus | | AMP ae cPu . CEU fase, Ts GEU BUS WINDOW cotu cpvapns ATA ceuaons.cata [BOPPLER] [ecu] | MECH PROBE DSP SERVO SELECTOR. cortion)| |oPtion)| | (OPTION) t VoR MEMORY CPU PHI (OPTION) (OPTION) CPUADRS. ATA (Mic68340) CINEMANAGER ][ ny [DMS ITF/VOLISERVO “VS0(CPU) (OPTION) (PTON) 4 Dire ors! Pye cara “DATA CINE Data maigement MEMORY subsystem (OPTION) (orTioN) Fig, 4-4-1 The system control unit includes the HOST CPU (MC68340) to provide overall system control ‘The CPU controls all parts ofthe device based on the software stored in ROM, according to information from the operation panel ‘The local CPU (V50) is mounted inthe cine memory unit to provide cine memory contro. The DSP (Digital Signal Processor local processor is mounted inthe Doppler module to provide {intemal Doppler module control and FFT (Fast Fourier Transformation) frequency analysis.2-020 SECTION 4 Principle of System Operation 44-2 TXIRX Unit ‘The T>Rx unit provides functions to generate transmission pulses, conduct analog processing of received echoes, and transfer ultrasound image data to the DIU ‘The transmission pulses are converted to high-voltage in the driver circuit that drives the oscillator and are then supplied to the selected probe, The transmission voltage is detected by the transmission power supply voltage monitoring circuit on the TX/PRE AMP board and this data is sent to the system control unit. The system control unit immediately stops transmission if it receives abnormal transmission power supply data The electronic scanning probe has a maximum of 120 Tx/Rec lines, allowing it to simultancously drive upto 32 transducers. Up to 32 of the 120 T/Rx lines can be selected by the selector circuit, which comprises 16 HVSs (8-channct High Voltage Analog Switches) The received echoes are received by the transducers that transmitted and are amplified in the pre-amp circuit, The received echoes ae analog processed afler received dynamic focussing, then A/D converted and transferred to the DIU. With an electronic probe, phase compensation is conducted inthe matrix switch and delay line because the phases ofthe echoes received by the multiple transducers are displaced from cach other. 4-12el-b acc -Lp| CONT [ie | USBLK stiEcTOR perave] Ene bel 106 Somer Poeuer 7 7 ADDER losc VIDEO joe es coe GENE. 3 [ow Pe MECH PROBE [INDEPENDENT | fag CW >| | Joeveus ee oe (A. B, ©, Z, MECH. *] CONTROLLER | asc CONT. GAIN PANEL woroRe 1X irons MECH. [seuss MECH, | usaux GENE. i seueus Sy) Vinpow KE > SERVO: TX TRIG, . TX/RX PART BLOCK DIAGRAM | 1/1 tontiadg warsis yo adioung NOLLDAS 1 'n0y 02z0-ZNNNN2-0220 SECTION 4 Principle of System Operation 44-3 DIU Unit ‘The DIU uses a high-speed X-Y system, The ultrasound image data received from the T3/RX unit as digital signal is sent for pre-processing, Pre-processing involves input selection of the ultrasound image data sent from the Ts/Rx unit and optional Doppler unit, addition of M, D-mode physiological signals (the physiological signal unit is optional), frame correlation, and storing in frame memory Post-processing involves the interpolation and correlation of the B-mode image in the TV horizontal sean direction, addition of gray-scale bar, characters, eraphics and B-mode physiological signals, and output to the D/A conversion circuit. In addition, the DIU unit supplies the ultrasound image data for ABC (Auto B-Gain Control) ‘Affe D/A conversion, TV synchronization and blank signals are added and the signal is, ‘output as @ composite video signalsi-y cpuaus om Bus <=>] ous rr {> ToFROM ows veo sus NOL! cpupys eo SERVO SI Casa] INE CINE vcR MANAGER: MEMORY MEMORY sc video From TXIRX part on TAR pat ge FRAME, Post aa PRE |---| virco DOP VIDEO From DSP | process MEMORY PROCESS SELECTOR I~ F F Tor FRow ceuaus BPHYSIO SIS TO Tv MONITOR, MPHYSIO, PHYSIO. SIGNAL FromeHysi0. AME | py Ras| cas| we| CPU BUS oF | piu GEU MEMORY CONTROL, INTERFACE CONTROLLER tf tii ABC [asc cont, cru TIMING GENERATOR DSC PART BLOCK DIAGRAM [i] ROY O@ZO-ZNN uonmsdg weiss Jo ardoung + NOLLIASww2-0220 SECTION 4 Principle of System Operation 4-4-4 ABC (Auto B-Gain Control) Function ‘This function evaluates the brightness from the B-mode ultrasound image data stored in frame memory and automatically maintains the optimal B-mode gain for MAG ete. , regardless of the probe type, frequency, and individual differences between test subjects. ‘The ABC function can be turned ON or OFF and the ABC level can be set atthe operation panel. ‘The B-mode ultrasound image data stored in frame memory is sent tothe ABC control unit, which evaluates the brightness and outputs an ABC gain level analog signal according tothe [ABC setting on the operation panel. Also the gain volume setting is output by the ABC controller asthe ABC gain. The ABC gain is added to STC and output to the MAIN AMP. ow 1 | vo aoe MAIN Li ai 8 TVMONITOR man Li ap [teel ow re is cao | cevie ' mae | cougars : control ssconn ! fe CAIN + cont. | sre ' | OPERATION ]19-eu, ; PANEL : OPERATION manvawe. : pane Fig 42 4-4-5 Cine Memory Unit (Option) ‘The cine memory unit is made up of two PCBs: the controller unit (CINE MANAGER) and ‘memory unit (CINE MEMORY). Cine memory isa display memory that can store 32 pre~ frozen screens of ultrasound images (in 1B mode). The cine memory unit offers search, serol, store, review, and oop playback functions under the control of the V50 processor on the CINE MANAGER board, 4-1644-6 447 ww2-0220 SECTION 4 Principle of System Operation Mechanical Scanner Unit (Option) ‘The mechanical scanner unit comprises a controller unit (MECH. SERVO), selector ‘unit (MECH, PROBE SELECTOR) and CW CONNECTOR board. The transmission circuit is mounted on the MAIN AMP board.*! The transmission pulses goncrated by MAIN AMP are converted fo high-voltage inthe river circuit that drives the oscillator and are then supplied to the selected probe ‘The transmission voltage is detected by tho transmission power supply voltage monitoring circuit on the MAIN AMP board and this data is sont to tho system control unit. The system control unit immediately stops transmission if receives abnormal transmission voltage data The rectived echoes are amplified by the PRE AMP circuit on MECH. PROBE ‘SELECTOR and supplied to the RX FOCUS board wor] we omnia on { connector >] AvP. [>| rocus MoTOR® | MECHA, PROBE SELECTOR xe GEU SERVO [1_ceveus as —— CONT. Fig, 4-4-3 *'Main AMP board EP400700DD~, and MECHA SERVO board EP400800DD~, Tx circuit for mechanical probe (MECH. TX GENE.) was moved to MECHA SERVO board, Doppler Unit (Option) The Doppler unit comprises DOP ASP (Analog Signal Processor), DOP DSP (Digital Signal Processor), and AUDIO V/O units Transmission in PW mode is made by TX/PRE AMP when an electronic scanning probe is used or by MAIN AMP when a mechanical scanner probe is used. Transmission in CW mode is made by CW CONNCETOR board. The CW mode is available only when an independent or mechanical scanner probe is usod (restrictions apply according to the probe used), The transmission voltage monitoring cireuit forthe CW mode is mounted on the MECH. PROBE SELECTOR board, It detects the transmission voltage ‘The Doppler received signal from the electronic scanning probe passes through the PRE AMP circuit and is phase compensated and added in the DELAY & ADDER circuit before boing sent to DOP ASP. 4-17wi2-0220 SECTION 4 Principle of System Operation ‘When the PW mode is selected at the mechanical scanner, the Doppler received signal passes through the PRE AMP circuit on MECH PROBE SELECTOR and is output to RX FOCUS. The MECH PROBE SELECTOR board switches between the Doppler signal from the electronic scanning probe and the Doppler signal from the mechanical scanner probe and sends the signal to DOP ASP. ‘When the CW mode is selected at the mechanical scanner, the Doppler reccived signal passes through MECH PROBE SELECTOR and IND PROBE CONNECTOR, and is amplified by the PRE AMP circuit on CW CONNECTOR before being sent to DOP ASP. DOP ASP conducts Quairature detection on the received signal, then converts it to base= band frequency and filters it before A/D conversion, DOP DSP conducts frequency analysis on the signal using FFT (Fast Fourier Transformation) and sends it to DIU, LIrx Gene, prope SL \ \_ SELECTOR i DELAY& ‘VBPF/ Banaue Lec ane ne ae eee wECH pte g}—wee - pxrocus INoxnecTon oor ose cn pnost feltoron wo. | Lcondoront DO MEPORE ee Imeem oo CONNECTOR > [conscron 'y pf CW LOW sp pe FO woroee | 4p i fo i 4S domnesron | oauhus | Spase | ocvtue _=NIAIN AMP board Rev.DD and ater, MECH TX GENE eeu is moved to MECHA SERVO board Fig 4-4 4-1812-0220 Rev. 1 SECTION 4 Principle of System Operation 4-4-8, Physiological Signal Unit (Option) ‘The physiological signal unit is made up of the physiological amplifier unit (PHYSIO AMP), physio. panel, and physiological signal memory unit (PHI). ECG (clectrocardiogram) and PCG (phonocardiogram) are input to PHYSIO AMP, where they are amplified by amplifier circuits with isolated power supplies, and are output by the photocouplers as the isolated signals B_ECG, M_ECG, and M_PCG. For noise elimination, the ECG circuit contains the HUM FILTER (50 H2/60 Hz) and the PCG circuit has a threo-level PCG FILTER. In addition, the ECG R-wave detection circuit (R-DETECT) is mounted on PHYSIO AMP, ‘Tho PHI board A/D converts the physiological signals, ‘The B_ECG signal is interpolated and stored in the physiological signal memory. The stored signal is synchronized with the TV signal, read, added in the DIU post-processing unit, and displayed on the plane mode (B mode) image. The M_ECG and M_PCG signals are interpolated, writen to the physiological signal storage area of the DIU display memory, and displayed on the sweep mode (M/D mode) image. ros, [Pos PHOTO PCG Mees | 10 | ane [> |-coupcer| | ric ter| >] EMITER Meco ees [ECG HUM PHOTO To >| ane [> fritter| > |-coupcer| P>|LMITER a.tce 9 pe BR RCATE To UML eee PHYSIO DETECT. Seurre PANEL |eccet PHYSIO. AMP. PHYSIO PANEL, PHL Meco "Pos ae INTER. [MECC rrame |__| foe M.ECS POLATION MEMORY AD e.sce ECG INTER. [8.606 post —| [>| Memory || POLATION Process 4-19Wn2-0220 Rev. 2 SECTION 4 Principle of System Oj 4-4-9. Power Supply Unit ‘The power supply unit comprises a series power supply and switching power supply Itsupplies the power required by the main unit. It also has an isolated power supply for the optional recording device. The transmission voltage forthe electronic scanning probe (HVA), and mechanical scanner probe (HV) is controlled by the contol signals from the main unt. 4-410. Data Management Subsystem Unit (Ver. 3.0 and higher) ‘This unit is for handling DICOM communications and DICOM specification image filing. 4-4-1, Computer Ai jed Subsystem Unit (USA only, Ver.3.0 and higher) This unit for handling the [CAS] software of Obstetrical and Gynecological measurement report function 4-4-12, Volume mode unit (Ver, 4.0 and higher) ‘This unit is designed to display Volume mode image on a monitor‘MN2-0220 SECTION 4 Principle of System Operation 4-5 Principles of PCB Operation 4-5-1 PROBE SI CTOR Board ‘This board comprises probe connectors, probe select relays, HVS, and the relevant control cirouts Dy 2 3) 4) LIN/CONV CONNECTOR 1 260-pin connector for linear/convex probe. LIN/CONV CONNECTOR 2 260-pin connector for linear/convex probe, RELAY Comprises 64 relays to switch between PROBE 1 and PROBE 2. HYS Comprises 16 HVSs (8-channel High Voltage Analog Switches) to select and switch 32 of 128 channels CONTROL & PROBE CODE INTERFACE ‘Comprises ROM (Read-Only Memory), logic circuits, relays, and PLDs (Programmable Logic Devices). It controls the probe switching relays and HVSs and outputs probe codes to the data bus, 4-22e+ LINICONV, CONNECTOR 1 LINICONV CONNECTOR 2 GEU ADRS (03) ENt NZ ENS. READ HyoTCLK HVADRS(02) PROBE CODE! (09) qo11-128) PROBE CODE? (02) Jgtouiizy owi2e1) GEV OATAOT) SEU BUS PROBE CODED (OS) ARK (1-32) PROBEON: PROBEON2 MESEL RAMEN ra PROBE SELECTOR Mone Be, EP4004"*. 4 22un2-0220 SECTION 4+ Principle of System Operation © SIGNAL LIST ( PROBE SELECTOR ) moor | 3100-2 x = <——5 a a a az ee wee Heo —| aoe 25 [sexe 1 Ta re Watt [mois | ets} ee ros eaten | wate —[— weir 1 — ws 2 =a Tero [Cireisest | pastor a [as seats | —abast | — sonore | Tra 7 [50-5 usioisa | wees | upon [meee] Ca a Tat —[~satteat ns vts0 | —usioest | uous] unos eas Teast —|— sation? | aos wut or i Tat ais Te —setiens [oa [a i [ ar THR sation [ores BEE x00 ae oreo ie] aarti eating Pos ESE meet 10 crop Tari] Teint? | —sptiens | — not 2 et RE ex te [rand] — raat | satin eres BELA] | SLT | eases | | es Paris [sation [oo ev DATA | eed OwTAR | CEU ATAS we para] [2 | eri? [aris | eotient [os GEU_o4TAO— | Geu-paTA?—| CEU OATAL i] tants} ta] eottont_| es 7 Toei | aaa | sotient | —g ; Sar oar 3] tras—| trae —|eotiontt | — og : ores] res |“ stieats | [rar Tar 7] rere 1 anata —| “ation | — 0" : e[ranry [rerio —[eptients_ [ot _ - 7 _ Saas [ra settee] ors ro ir =a ir Z os + [ar =a Hur “sr : et eta Toxo x0 Tox i aes ac 1619 rr Ta ae ie) re 100-3 4-24wn2-0220 SECTION 4 Principle of System Operation 45-2 TX/PRE AMP This board comprises 32 TwRx circuits and transmission trigger signal generation circuits to cary out ultrasound Tx/Rx. ) 2 3) 4) ° ‘TX POWER SUPPLY VOLTAGE DETECTOR AID converts the transmission power supply voltage and outputs it to the data bus. ™ Carries out electronic probe transmission, (Max. simultaneously driven channels: 32, Max. transmission voltage: 90 V) ‘TX TRIGGER Generates the transmission triggers for electronic probes (max. 32 channels) TX FOCUS CONTROL Generates the control signals to control electronic transmission trigger generation for clectronic probes, and the PROBE SELECTOR control signals. PRE STC DRIVER Converts the STC CNT and GND CNT signals to pos them to the PRE AMP. negative signals and outputs PRE AMP ‘Conduct first-stage amplification of the received signals from the electronic probes, according to the STC_P and STC_N signals generated by the PRE STC DRIVER, LONIOFF ‘Tums the probe "L" (inductance) ON in the Doppler mode to increase Doppler sensitivity-e From oEU TF USBI || al TxV yoceuLtr [a Fenn DETECTOR EUDATA = wv TX TRIG aoa ™ THX To PROBE SELECTOR Cane eater 2 mx ena naz From GEU ITE. eur TACLK DOR Ps. PRE OUT ‘To RX FOCUS: To, ENt a PRE AMP Usabies Ene is Z GEUDATA READ + GEUADRS TXFADRS TXCLK I nue Usetk BSADRS {1x Focus }_ —boe LoNorF ont vet 8 cont. |— HvDTeuk a [seecarocveveneaseucnss huswcur q vars g L RESET ToPRonEsciecron, sTcr & From MAIN AMP >| PRESTC STCN Li ‘ston Ren & 9 Tie ah Woe Be z TX/PRE AMP. EP4044"". w| é 0zz0-2Nnwve-0220 SECTION 4 Principle of System Operation 4-28 © SIGNAL LIST (TX/PRE AMP ) Holt Nol-2 Ix a a. Tplexoak = t = Toe oT Tao Too ee Tae Ta TS 2] wordie —| meanest | wanes] anos] Pe Bo Lee, cH Gp at] — wre Hr Gros | rmase | eet Trpibast | —_wveue 1 Gres To] rnogo — | so] — sas HOFF tt cro [tuo] ust | ups) ws] Ta [ares Gro Ta ubaoes0—| asso? | abana Janos] Wart —[—sstent | rot He seer = oD ete Ty Tare tant | cro 5 17 Bro oo i] THis | —sotiet | ores Toes Bro" a if Tie tier’ | ore 3 is [aes Tie i) | aro i Taagi —[— satan] 0 Te] et on, ee] xe 1 THEE rea? [oxo Ta] aos | Ce S| te acs | ce wos] [os reagan tonto S Te] eu gata | ey oaras | ce oatas—| teu barat] [Cie] —reaeit—[—raanie | sotient [ond TI | GeUoatAd——|GEV-OATAE | ceW-oarai| cEU_earas—] [Cir] rears —(—vearza | ~aotvent0_[—o18-$ To oro 8 oo Gos aos Teo] —rreent —|_—_treret | “eptventt —[_o9s-s + | wee [oo a reer | —rrerta [sete] ort 7 t i 1) wrens [trea | ~sotieats | oo T Ta ar Tsar |r satan] 00 + [tarts tras —1“satieni os fatecatel 7 =] mar THT —[—eotienié | oot ree) [= £ GOs [er =isr ase z eros (ete: ro Aa z was eo Er a rr Tae, Tae ron No1-3 x 5 z o. Ta Ta Ta Tex Fesoutt | —Preduti [tourer oan Pradura | Prete Caos Peaouté | Prebvis Cros Pradetd—|—Prebut HOF Freoetig | —rredet CHET Fradetiz—[redetT CxO Peabetia—[ —Preoutt x07 rragetie | rredetis Gros Peadatit | —Predatit—T ROE Peaout20 | —Predatis | —weuret | ONO Praoutz® —[—rregatti | —sgereti | exo-8 Predut2a—[—Prebutts | —sgerett | _OHO_SE Peadutzt | —Predets 1 Taos Peeout20 | —Peebet? 1 1610-3 Freda] Peeout te Teer PreQutdt | _Predetsl | toureis [eves Bei T oes EERE OSE BOT BOE ae Ta 75 ra2-020 SECTION 4 Principle of System Operation 4-5-3 RX FOCUS ‘Two of these boards are used to altemately conduct reccive focussing and receive dynamic focussing, » 2» 3 4) 6 7 8) % Vil CONVERTER Convers the PRE AMP voltage output to a current CROSS POINT SWITCH ‘The CROSS POINT SWITCH connects the received signals (max. 32.channels) to the optimal delay tap, DELAY & ADDER Conducts delay and adding (receive focus) on the received signals (max. 32 channels) and outputs the received signals as one line. LIN/CONV HPF. (High pass Filter) Allows only the high-frequency component ofthe received signals to pass when an electronic high-frequency probe is used. MECH. HPF. (High pass Filter) Allows only the high-frequency component ofthe received signals to pass when a ‘mechanical scanner high-frequency probe is used, ANALOG SWITCH Selects the received signals from the electronic or mechanical scanner probe, turns ON/OFF the Doppler output and H.P.F. V.BPF. (Variable Band Pass Filter) Allows the optimum frequency signals for the probe frequency and received signal depth to pass. LOG. AMP Comprises two 430 dB amplifiers and LOG ICs to carry out logarithmic amplification of the received signals. CROSS POINT SWITCH CONTROL, Generates cross point switch control signals and analog switch contro signals 4-30ae From MECH, PROBE CONNECTOR Tee ToasP -—— RXDOPA ‘DOP OUT | 7 rxoors MECH. RX ToMANN Loco’ L__s} anatoc Loson switcH | TP ren TPISHe VBPF LOG AMP From TXPRE AMP PRE QUT Gane POINT SW 3 Fose_o LooFe HPF ON open CROSS POINT SW CEURUS ‘CONT From MAIN AMP Foon Tne ee MODEL BE. RX FOCUS EP4045"* 4 vuontiedg weIsig Jo ardioud + NOLLDAS 02z0-2NAwn2-0220 SECTION 4 Principle of System Operation © SIGNAL LIST (RX FOCUS 1 ) 02-1 1102-2 zu i a 3 aos | aa ToD os Be] toca | taco | oa fro Be [ toca af Fe cat | ea eat | or ter Paco | eso8se | aoe —| a BI] —uesoes | tena] usages Ta| —usameso—| —ussoas? | — veaoast | UO, ra] see * oo De ir] growed | aoe Te st] oe Te] ao 0 | oro io i070 1g] nese ta Te x00. Tet nf RE exe TE SE ASO |G S| EST | TE TE | aU OArAA | ce DaTas_—[ Ey OATAS_[ CEU ATAT eeu t)_] ao ss | ee TI @UOnFA|“ceu-oaTa2—[ “GE OATAT [CEU ATA eeu art | ao s8—|_eeba are ie] oo 0 ‘00 om ia [wee 0-8 Te ora Tae 0-2 7 e ater ay ci 7 [ar = =r = [ar ar Har =i, zee ato a ono, ti a cH 10) 11023 aT E a 3s aaa Tere Toa | —Predutt | Fretut EG Ei] —Predate | reetuts os FE] readers —[—prebvis | —raures | — aos Zi] Peedutt | —Predatr—[ —soarea [oor Za| predate | — Predera | —seures | — ono s7 | Peedutid | —preantt | —so8re | ONO Te Peeout aT seure? [ovo 3E aT] rebate woures | — ovo se Te| predate | —rreoutit | —roures | ovo 52 Tet prebere ets | —seeret [nse Ta] —reouta? | —rredetti | —saarett [oa TE _predui2a | —predetts | —soareit [xe Tz] Predars—) —preoeres—| —sparets | —ovo"3E Ti Predatzt—| —preoure? | —soarera | exo st Ta] —redetso— | —Predates | —seurens [oro S-[ pregura? 1 —prederst | —soureig | rose T HOF 7 CHO 5 ero 57 [as rs crs? —] | es0ek | arabes GHOSE T1180 [sar GHOSE Tp eoa | a0 BOs se aa aah@ SIGNAL LIST (RX FOCUS? ) 3103-1 I x a a D aoe EO tae Gio Ze] —oG0_F—| 10608 | oro 05 | ago" —[— Foca — oro txt [Cer HH | oss [east | aT TH] —Wesonse | —snoess | —opnoass 1] —vsanego—| —usnons2 —[ —vsnons| | s00857 a usec 7 or [3 ir ercmcey [aie | he eo i OD Gia Gr Gro" 1s [nese TE TE iO 1] en Ex exe To [EARS GEST _| GARETT [eeu DaTA4_—| eOaTAs [CEU DATAE__| CEU DATAT 1] G8u"oaTAG_| ceu_oaraz—[ceu_oATAL_”|ceu-O4TA ie ooo Gro. Gio. Ho 0 + [nee oo TH, 6x0» facie x00 r © [ar cl cn ww [sr <5 sr =i Tir =a Tar ais [a xo AGA no Paco roo ABAD noo 103-3 ay z t 7 ae Tex Too Taro HA | —Prebutt | —Predutt | —aoarel | — 0x0 fT 25 [Preutd | Prebutt—|—sparet—| eno at at | Preosté | rreouts | —soxres | ono at Bi | Peedatd | —PredutT | —t00" 7 aa] rast souce | or ia [Prevent ioired [tro ia} predate Spire? | —cxo_ sr aT} reat, Soacel | exo" 38 ie] reout soured | W037 TE] Predutz0—| —Predetit x0 FE ia] predate | —Predyit GHOST 1S | PreGutta | —Peedut th CxO Te | Preoatt5—| —Peeduis x08 Ti_|—Predetts—|—Prebutar HOS 1a |~peeout30—[—rreoutat | —soureis | 10-58 S[prebvist | rreourat [spares | — ono st i Goer T ORT Gro" 5 CHO t oxo i xo Tae A035 a Ta, ac 4-33 SECTION 4 wet ae HEC ETS HECCETL wn2-0220 Principle of System Operation 103-2 EAT EGAwai2-0220 SECTION 4 Principle of System Operation 4-5-4 MAIN AMP ‘This board switches the receive focus, conducts ultrasound analog processing, and generates the mechanical scanner transmission pulses. 1) RX EXCHANGE Receives the received signals from the two RX FOCUS boards while switching the depth in approximately I em increments. The received signal is switched by analog ICs on both the rising edge and falling edge of the EXCHANGV signal 2) DETECTOR Detects the received signal and adds the gain signal 3) AGC (Automatic Gain Control) Comprises delay circuits, Subtracts the delayed received signal from the original received signal, Eight levels can be selected by the AGC 0 to 2 control signals, 4) CONTRAST Comprises resistive potential divider circuits to oulput a potential-divided signal. Eight levels can be selected, 3) RELIEF Comprises differentiation circuits. Adds the differentiated received signal tothe ‘original signal. Bight levels can be selected ©) AF (Anti-Aliasing filter) Eliminates the aliasing that occurs when monochrome image data is sampled. 7) GAINCONTROLER Generates the gain, FO (6 types), and PRE STC (6 types) signals, 8) MECH, TX TRIGGER Generates the transmission trigger for the mechanical scanner. 9) MECH. TX 1 10) MECH. TX 2 11) MECH. TX POWER SUPPLY VOLTAGE DETECTOR AID converts the transmission power supply voltage and outputs it to the CPU board. ‘EP40OTOODD and after, the above 8)~11) are deleted and moved to MECHA SERVO board. 4-34From RX FOCUS 1, 14 15 1P3 Tes ToGEUITF, CONNECTOR tooor SELECTOR, aar our Lose2 3 ane can cont 18 Torx g FOCoNT, GAIN STC - SELECTOR DATA eaneoae gro toTx/PRE AMP * re src cont ; ue Fore stc| ee ee *|_GENE. Iria BAN OCF om SEU i ‘AD i xu | DATA 1X1 To | eon prose f went i can From o1U ussux aucux READ MeTxset stew~n eno From OPERATION i MEX ON an ane From GEU |.T.F. THTLE Se [MODEL Rs & ‘MAPIETRS, Rev.DD & 9 HMR(MECHA SERVO IR ~10)) MAIN AMP. EP4007"*. w ‘Thesis indo linear ot mowed in Rev-DD aod afer yeiodg Wass Jo adlouud + NOTLOAS sey 0220-28N2-0220 SECTION 4 Principle of System Operation © SIGANAL LIST ( MAIN AMP ) 1083 104-1 i Se 7 eae ae I oe 2 T a fear Aer) eet) crease [meter] neaoest cn Hp sseso | srisest | sswoest__| aa ae] waoesa | woes | isomers | eS 14 | —wuaoese | —eeapest | uaoest | asa aL 7 oo ee 1] brass | ens-9 | eros | eno Te] aos | eno o_o ‘0° 1s] aeser ace re 0-8 Tepe a ext cn SF LE a ST Te [eeu sata OATAE | eeu SATA] EL GAT Ti [eau aura cy oarar [eeu onvat |e oaTay eyo Eo eo ao + [nee ‘0-2 Ti a8 [ner aoe oi0-o r n <9 cd c= cm or = =r 1st] ar Tar =a Tae Tao ia Tax ase ae 70 ar 3410 1 +350V (HVB) 2 3 GND 4-36 wu VIDEO_OUT GND mewv2-0220 SECTION 4 Principle of system Operation 45-5 GEULTE. This board generates the control signals for the GEU unit, generates the memory write control signals for the DIU unit, and opens the bus between the CPU BUS and the GEU BUS and PANEL BUS, 1) CPUBUS WINDOW Controls opening between the CPU BUS and the GEU BUS and PANEL BUS. 2) PROBE CONNECTOR DETECTOR Detects whether a probe is connected and outputs this data to the CPU BUS. The 5-bit data has 2 bits for linear/convex probes, 2 bits for mechanical scanner probes, and 1 bit for the independent probe. The corresponding data bit becomes LOW when a probe is connected. 3) FRAME RATE CALCULATOR ‘The frame interval is counted from tho 100 1 sec clock signal by a 16-bit counter and the result is output to the CPU BUS. When the count is complete, the IRQY signal is output to apply an interrupt to the CPU. The CPU calculates the frame rate from the counted data. 4) HEART RATE CALUCULATOR Each time the optional physiological signal unit inputs the RY signal, the IROY signal is output to apply an interrupt to the CPU, ‘The CPU calculates the heart rate from the data, 5) MODE CONTROL Generates PROCOD and SCNMOD signals corresponding to the mode when mode data is sent from the CPU, PROCOD __SCNMOD BMODE 0 1 MMODE___|0 0 D MODE 1 0 PROCOD - Process code: (Not used) 1 1 ‘SCNMOD : Sean Code 4-989 D 8) %» 2-020 SECTION 4 Principle of System Operation BEAM ADDRESS Outputs addresses in the B mode by counting a clock signal synchronized with an ultrasound line using a 9-bit counter in which the CPU start and end values can be set. HV CONTROL Generates the HVS DATA 0 to 7 signals from the high-voltage (transmission) data sent from the CPU. This block also contains a CPU runaway detector circuit, which sets all the HVS DATA 0 to 7 signals to HIGH level to stop transmission if a CPU lock-up TIMING GENERATOR Generates all timing signals from tho 12 MHz, 1 MHz, and 0.5 MHz clock signals produced by dividing the 60 MHz/48 MHz clock frequency from the crystal oscillator, according tothe data set by the CPU. Operates at 48 MHz with a 2 MHz probe but ‘operates at 60 MHz with all other frequency probes, AND converter US video (VIDEO_OUT) signal, which is sent from MAIN AMP board, is converted into 6 bts of digital signal, and sent to DIU board. This circuit is also used for A/D convert of VCR playback signal 4-99ow -b cevaus CPU BUS WINDOW PNLeUS |, Procooy ‘scNMOD PROBE | CONNECTION ae PROBE GH DETECTOR ang — FRAME RATE BEAM FRMEND/ CALCULATOR ADDRESS —* ira! HEART RATE CALCULATOR we Ra us video (inEo_ouT)—a] ideo (MDEO_OUTY AG Line Buffer veR_IN converter (FIFO) seal veRN USADRS(O~7) DSCADRSO~7) Hv CONTROL ada Txeuw used TIMING OF AREA om GENERATOR oFcENTI sepnr \DDATO~S. oe TITLE 8 mR eee GEU_LT-F. EP3956"*. 4 uonersdg warsss jo 2jdioung NOLLAS ‘oz20-2Nw2-020 SECTION 4 Principle of System Operation © SIGNAL LIST ( GEUITF) snort nora 7 rE C m a oI 5 2] wee eta ta] a ro 3a ae] eset [ae] a} aes] at ia sens — ort — na aha et en 2 z t i eae aaa ae] GP t { a Ciev oie ca nev oes ceva] ae ara one eae ea we eer sii earoarae | eevee] Cat pooner sat ear Wage ane aes tame] Fit i i [ete — | ~ aie p —}—k eee] et { ar Teper —|— BF See] ae 7 [a6 [sist “| — aor Tea ee Te [encienst | SAL er tee i i t Taree beast] Pr ee Toran a or PET] { i Toa ejees [ewe] [ie _— teks} ae 7 a 7 tra — stat TE $ T{ onset —T ait [ie WE Te # [suas 1 a a a a + [csoase | “asonse mee or r a i {ase —| tne | a 3 7 = Tse Tis 3 a) ED aor, eo war z G65 —| “Bester |e 5 1] “1s |e — | fa iat i ewe | a9.8 | 683 B14 ely 1 VIDEO_OUT aI z —— 2 SND) 3a 3a Ser —| a5 a ae om aE | a Swe ana wae ora wre nT Se $m SC I TBs Br Birae— [BL BITS SOT 31 Ae oMEAIOMTEE BTAT OR ST 1 VCR_IN EC NZIS IOC CTO - TASES [AE ELAR SEST | BES 2 VCRINR it PACT 7 3 NC if tt 4 NC in it trae aT ean 1316 q 1 VCR_IN r oe 1 arEr TE UTE | ce 2 VCRIN.R Scere cer uDTT— |e Te aoe er reir dev inst e0 anF NC 1 [eevareae Ged EAT | fet oie [eat eae seat oe ek Hae a san |" sa 4-41Ww2-0220 Rev. 1 SECTION 4 Principle of System Operation 4-5-6, DIU ‘The DIU (Digital Imaging Unit) fetches ultrasound wave digital data coming from the GEU in synchronized with the DIU clock, writing ultrasound wave data to the display memory in XY writing method, then reading out the ultrasound wave data in synchronized with the TV signal. After this, gradation conversion of display data, addition of gray scale bar and other post processing are executed by this block. In the writing system, ultrasound wave scanning data are thought of as scanning line vectors, and from the starting point indicated by the vector (XO, YO) and the time it takes to pass the boundary (X), (Y), one scanning line can freely be written to main memory. Also, through the dynamic focus area signal (DFAREA), multi-level dynamic focused ultrasound wave data ean be written to memory. ‘The boundary passing signal (INCX, INCY) is detected by the XY Boundary Calculator from the boundary passing time (X), (Y) in I pixel units. If the boundary passing signal is detected, data are written to the line buffer the following system is used to determine if the signal is INCX or INCY by the scanning address and register setting. (a) XY Sampling Writing System (X and Y System) In this system, writing to the line buffer is done each time either INCX or INCY is generated. This system is used forall scanning lines. (b) X Sampling, Y Sampling Writing System (X or Y System) In this write system, the line buffer write area (X system) is set when INCX is ‘generated and the line buffer write area (Y system) is set when INCY is generated. Data are written to the area specified in the X system cach time INCX is generated, while writing is not performed when INCY is generated. INCY information is held until INCX js generated, thon writing of both is done simultancously. For this reason, the number of times INCY is generated must be fewer than the times INCX is generated. ‘Accordingly, the area which can be specified in the X system is limited to 45° or more left and right. In the same way, the area which can be specified in the Y system is limited to 45° or less left and right. Also, the area setting is stored in XO and YO (16-bit) in the parameter table. ‘The boundary pass signal (INCX, INCY) is written to the line buffer simultaneously withthe ultrasound wave data, and is used to increment the main memory write address. ABC (Auto B-gain Control) This block generates “B_GAIN’ signal, which controls the gain for B-mode, referring ultrasound brightness data in the image memory and the Gain Level setting by operation panel. Then B_GAIN signal is sent to MAIN AMP board, and controls the gain of reciving signal. In case ABC off, B_GAIN becomes the signal referring B GAIN knob setting. PRE PROCESS This block is a circuit that executes various types of processing of ultrasound image data sent and received at the GEU for writing to MEMORY. Line Correlation Applies line correlation for black and white B image data.1ne-0220 SECTION 4 Principle of System Operation Test Pattern Generation Generates the various types of test pattern. US Erase Erase a part of or all the ultrasound image data. Erased image data are written to image memory as "0" or "I" level ‘This function differs from echo erase, memory erase and erase in the point of synchronization with writing of ultrasound image data, M SMOOTH In order to reduce the scatter from interlacing, an arithmetic mean of 2 pixels in the depth direction of ultrasound M and D image data is taken, Furthermore, this function goes OFF automatically in the case of ultrasound B image data Echo Erase In order to make physiological signals easy to see, the bottom portion of ultrasound M image data is erased. The crased portion of ultrasound image data is written to image memory as "0" level. This differs from USERASE and ERASE in the point that itis executed when ultrasound image data are stored in image memory Memory Erase In order not to display unnecessary data when changing modes, etc, all of the image memory is erased. The erased portion of ultrasound image data is written to image memory as "0" level Except in the point that Erase is executed in screen units, which image memory is configured into this function is the same as Echo Erase, t a portion or Black and White Frame Correlation Correlation between two frames is executed in order to reduce noise. CPU Access: ‘When making a histogram, etc. of ultrasound image data, the CPU can access image memory. Access by the CPU is limited to times when the ultrasound image is frozen. 4-43wno-0220 SECTION 4 Principle of System Operation MEMORY This block is capable of storing cnough ultrasound image data for two screens after they have been processed by the pre process block. Scanning conversion in the DIU is executed during writing to or reading from this block. Main memory is used as M and D image display memory during real operation and as frame memory for frame correlation. During B image display and when the image is frozen, CINE memory is used as display memory. Memory Configuration 2 X 2 pixels is the smallest configuration element and 2 sereens of $12 x $12 pixel 8 bit ultrasound image data are stored, Black and White Main Memory bits 0-5: Black and White Image Data bit 6 Organism signal for M and D bit 7 Syne. Mark for M and D organisms, Write/Read Speed Writing to or reading from RAM is carried out by RMW at 320 nsee/l pixel. However, by shifting the access eycle one half period, apparently, RMW is done at 160 nsec/1 pixel. On the other hand, reading from the SAM block is by serial Read at 160 nsee/l pixel. By doing 2 pixels simultaneously, apparently, serial read can be done at 80 nsec! pixel Erase Using the Dual-port RAM flash vite function, the image memory can be erased. Erasing is executed by flash write at 160 nsec/l Row, but when 4 chips are working simultaneously, erasing can be done at high speed, with one 512 512 pixel screen erased in approx. 45 psec. Furthermore, since it is not dependent on ultrasound image data write operations, it differs from USERASE, ECHO ERASE and Memory Erase POST PROCESS This block carries out various types of processing of ultrasound image data read from image memory. H Interpolation Spaces between lines of ultrasound B image data are interpolated in the TV H direction. The area which can be intcrpolated is from 1~11 pixels, and selection of the numberof pixels to be interpolated is set by the rezister. Ordinarily, the lina interpolation method is used. For black and white and

You might also like

• Aloka Ssd-1400 Service Manual

  

  No ratings yet

  Aloka Ssd-1400 Service Manual

  544 pages
• Aloka SSD-1700 Ultrasound - Service Manual PDF

  

  No ratings yet

  Aloka SSD-1700 Ultrasound - Service Manual PDF

  638 pages
• Aloka SSD-680 - Service Manual PDF

  

  No ratings yet

  Aloka SSD-680 - Service Manual PDF

  462 pages
• Aloka SSD-680 - Service Manual PDF

  

  No ratings yet

  Aloka SSD-680 - Service Manual PDF

  462 pages
• Aloka SSD500 Service Manual PDF

  

  No ratings yet

  Aloka SSD500 Service Manual PDF

  249 pages
• Aloka SSD500 Service Manual

  

  100% (1)

  Aloka SSD500 Service Manual

  249 pages
• Aloka SSD500 Service Manual PDF

  

  No ratings yet

  Aloka SSD500 Service Manual PDF

  249 pages
• Aloka SSD-680 - Service Manual

  

  No ratings yet

  Aloka SSD-680 - Service Manual

  462 pages
• Aloka SSD-4000 Service Manual

  

  No ratings yet

  Aloka SSD-4000 Service Manual

  761 pages
• Aloka 4000

  

  67% (3)

  Aloka 4000

  761 pages
• Aloka SSD1000

  

  No ratings yet

  Aloka SSD1000

  352 pages
• Aloka Prosound 3500

  

  No ratings yet

  Aloka Prosound 3500

  438 pages
• Aloka SSD-4000 Service Manual

  

  No ratings yet

  Aloka SSD-4000 Service Manual

  723 pages
• TP - Ms3463s.pa511 Lc-22cff4011e

  

  No ratings yet

  TP - Ms3463s.pa511 Lc-22cff4011e

  57 pages
• AOC Le42h057d Le46h057d LCD TV Service Manual

  

  33% (3)

  AOC Le42h057d Le46h057d LCD TV Service Manual

  188 pages
• ssd-3500 Service Manual

  

  91% (11)

  ssd-3500 Service Manual

  428 pages
• Aoc Le46h158z

  

  No ratings yet

  Aoc Le46h158z

  109 pages
• Aoc Le26w154

  

  No ratings yet

  Aoc Le26w154

  73 pages
• Aoc Le40h137m LCD TV

  

  No ratings yet

  Aoc Le40h137m LCD TV

  95 pages
• LG C2 Overscan Service Manual

  

  No ratings yet

  LG C2 Overscan Service Manual

  56 pages
• Samsung TV Service Manual PDF

  

  100% (1)

  Samsung TV Service Manual PDF

  98 pages
• DP 32640

  

  No ratings yet

  DP 32640

  37 pages
• C4505 Deh-4250sd, Deh-4290sd, Deh-3200ub

  

  No ratings yet

  C4505 Deh-4250sd, Deh-4290sd, Deh-3200ub

  82 pages
• Sharp LC-49CFE4041E Chassis MS3463S.711X

  

  No ratings yet

  Sharp LC-49CFE4041E Chassis MS3463S.711X

  64 pages
• PF6200 manualPF6200 manualPF6200 manualPF6200 Manual

  

  No ratings yet

  PF6200 manualPF6200 manualPF6200 manualPF6200 Manual

  61 pages
• Manual de Servicio TV AOC

  

  No ratings yet

  Manual de Servicio TV AOC

  120 pages
• Aoc l32w931 l32w931p LCD TV PDF

  

  No ratings yet

  Aoc l32w931 l32w931p LCD TV PDF

  120 pages
• Aloka ProSound 6 Service Manual

  

  77% (22)

  Aloka ProSound 6 Service Manual

  209 pages
• Aloka Prosound 6 Service Manual

  

  No ratings yet

  Aloka Prosound 6 Service Manual

  209 pages
• Aloka Prosound 6 Service Manual

  

  100% (2)

  Aloka Prosound 6 Service Manual

  209 pages
• Ultrasound Probe Compatibility Guide

  

  No ratings yet

  Ultrasound Probe Compatibility Guide

  2 pages
• 7SmR9HcvqBGUVo-nvtOlPuK bnR9WiN85ejov9JT1rNbByKHTj1Yi5u0uEk982NNjDcdVCeVwU siMah-RTLJQvH-jQ4cLLD174YuA 2

  

  No ratings yet

  7SmR9HcvqBGUVo-nvtOlPuK bnR9WiN85ejov9JT1rNbByKHTj1Yi5u0uEk982NNjDcdVCeVwU siMah-RTLJQvH-jQ4cLLD174YuA 2

  36 pages
• VividS5 Bios Update

  

  No ratings yet

  VividS5 Bios Update

  3 pages
• Ultrasound LOGIQ Etransducer Guide

  

  No ratings yet

  Ultrasound LOGIQ Etransducer Guide

  2 pages
• Ge 730-Expert Download Catalog

  

  No ratings yet

  Ge 730-Expert Download Catalog

  5 pages
• User Manual 16884

  

  No ratings yet

  User Manual 16884

  374 pages