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ADS1246, ADS1247, ADS1248

SBAS426H – AUGUST 2008 – REVISED MARCH 2016

ADS124x 24-Bit, 2-kSPS, Analog-To-Digital Converters With

Programmable Gain Amplifier (PGA) For Sensor Measurement
1 Features 3 Description
•
1 Programmable Data Rates Up to 2 kSPS The ADS1246, ADS1247, and ADS1248 devices are
precision, 24-bit analog-to-digital converters (ADCs)
• Single-Cycle Settling for All Data Rates that include many integrated features to reduce
• Simultaneous 50-Hz and 60-Hz Rejection at 20 system cost and component count for sensor
SPS measurement applications. The devices feature a
• Analog Multiplexer With 8 (ADS1248) and 4 low-noise, programmable gain amplifier (PGA), a
(ADS1247) Independently Selectable Inputs precision delta-sigma (ΔΣ) ADC with a single-cycle
settling digital filter, and an internal oscillator. The
• Low-Noise PGA: 48 nVRMS at PGA = 128 ADS1247 and ADS1248 devices also provide a built-
• Dual-Matched Programmable Excitation Current in, low-drift voltage reference, and two matched
Sources programmable excitation current sources (IDACs).
• Low-Drift Internal 2.048-V Reference: An input multiplexer supports four differential inputs
10 ppm/°C (Maximum) for the ADS1248, two for the ADS1247, and one for
• Sensor Burn-Out Detection the ADS1246. In addition, the multiplexer integrates
• 4 or 8 General-Purpose I/Os (ADS1247, sensor burn-out detection, voltage bias for
thermocouples, system monitoring, and general
ADS1248)
purpose digital I/Os (ADS1247 and ADS1248). The
• Internal Temperature Sensor PGA provides selectable gains up to 128 V/V. These
• Power Supply and VREF Monitoring (ADS1247, features provide a complete front-end solution for
ADS1248) temperature sensor measurement applications
including thermocouples, thermistors, and resistance
• Self and System Calibration
temperature detectors (RTDs) and other small signal
• SPI™-Compatible Serial Interface measurements including resistive bridge sensors.
• Analog Supply: Unipolar (2.7 V to 5.25 V) and The digital filter settles in a single cycle to support
Bipolar (±2.5 V) Operation fast channel cycling when using the input multiplexer
• Digital Supply: 2.7 V to 5.25 V and provides data rates up to 2 kSPS. For data rates
of 20 SPS or less, both 50-Hz and 60-Hz interference
are rejected by the filter.
2 Applications
• Temperature Sensor Measurements: Device Information(1)
– RTDs, Thermocouples, and Thermistors PART NUMBER PACKAGE BODY SIZE (NOM)

• Pressure Measurements ADS1246 TSSOP (16) 5.00 mm × 4.40 mm

ADS1247 TSSOP (20) 6.50 mm × 4.40 mm
• Flow Meters
ADS1248 TSSOP (28) 9.70 mm × 4.40 mm
• Factory Automation and Process Controls
(1) For all available packages, see the orderable addendum at
the end of the datasheet.

Simplified Schematic
REFP0/ REFN0/ ADS1248 Only
AVDD REFP REFN DVDD AVDD GPIO0 GPIO1 REFP1 REFN1 VREFOUT VREFCOM DVDD

Burnout
Burnout ADS1247
Detect Voltage
Detect ADS1246 VREF Mux
Reference ADS1248
VBIAS
VBIAS

GPIO
SCLK AIN0/IEXC System SCLK
DIN AIN1/IEXC Monitor DIN
Serial Serial
DRDY AIN2/IEXC/GPIO2 DRDY
AINP 3rd Order Adjustable Interface 3rd Order Adjustable Interface
Input DOUT/DRDY AIN3/IEXC/GPIO3 Input DOUT/DRDY
PGA û Digital And PGA û Digital And
AINN Mux Mux
Modulator Filter Control CS AIN4/IEXC/GPIO4 Modulator Filter Control CS
START AIN5/IEXC/GPIO5 START
RESET AIN6/IEXC/GPIO6 Dual RESET
IDACs
Internal Oscillator AIN7/IEXC/GPIO7 Internal Oscillator
ADS1248 Only
Burnout Burnout
Detect Detect

AVSS CLK DGND AVSS IEXC1 IEXC2 CLK DGND

ADS1248 Only

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features .................................................................. 1 9.4 Device Functional Modes........................................ 36
2 Applications ........................................................... 1 9.5 Programming........................................................... 41
3 Description ............................................................. 1 9.6 Register Maps ......................................................... 50
4 Revision History..................................................... 2 10 Application and Implementation........................ 70
10.1 Application Information.......................................... 70
5 Device Comparison Table..................................... 4
10.2 Typical Applications .............................................. 76
6 Pin Configuration and Functions ......................... 5
10.3 Do's and Don'ts ..................................................... 86
7 Specifications......................................................... 7
11 Power-Supply Recommendations ..................... 88
7.1 Absolute Maximum Ratings ...................................... 7
11.1 Power-Supply Sequencing.................................... 88
7.2 ESD Ratings.............................................................. 7
11.2 Power-Supply Decoupling..................................... 88
7.3 Recommended Operating Conditions....................... 8
7.4 Thermal Information .................................................. 8 12 Layout................................................................... 89
12.1 Layout Guidelines ................................................. 89
7.5 Electrical Characteristics........................................... 9
12.2 Layout Example .................................................... 90
7.6 Timing Requirements .............................................. 11
7.7 Switching Characteristics ........................................ 11 13 Device and Documentation Support ................. 91
7.8 Typical Characteristics ............................................ 13 13.1 Documentation Support ........................................ 91
13.2 Related Links ........................................................ 91
8 Parameter Measurement Information ................ 21
13.3 Community Resources.......................................... 91
8.1 Noise Performance ................................................. 21
13.4 Trademarks ........................................................... 91
9 Detailed Description ............................................ 24
13.5 Electrostatic Discharge Caution ............................ 91
9.1 Overview ................................................................. 24
13.6 Glossary ................................................................ 91
9.2 Functional Block Diagram ....................................... 24
9.3 Feature Description................................................. 25 14 Mechanical, Packaging, and Orderable
Information ........................................................... 91

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (October 2011) to Revision H Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
• Updated Features and Description sections to include use in applications other than temperature measurement .............. 1
• Edited Device Comparison Table to include ADS1146, ADS1147, and ADS1148; changed title, deleted footnote ............. 4
• Merged all Pin Functions into one table, changed IOUT1 and IOUT2 to IEXC1 and IEXC2 to match figures ...................... 6
• Changed compliance voltage for excitation current sources in Electrical Characteristics, now refers to Figure 41 and
Figure 42; changed initial error and initial mismatch to absolute error and absolute mismatch ............................................ 9
• Re-ordered elements in Timing Requirements tables, changed timing references to tCLK ................................................... 11
• Changed order of Typical Characteristics curves to match order in Electrical Characteristics table ................................... 13
• Added cross-reference for Equation 1 in Noise Performance section ................................................................................. 21
• Corrected values in Table 2.................................................................................................................................................. 22
• Modified Low-Noise PGA section to add more detail; added Table 7; added PGA Common-Mode Voltage
Requirements and PGA Common-Mode Voltage Calculation Example sections ................................................................ 26
• Added fCLK/fMOD column to Table 9 ....................................................................................................................................... 30
• Added cross-reference for Equation 15 to Power-Supply Monitor section........................................................................... 35
• Added cross-reference for Equation 16 to External Voltage Reference Monitor section..................................................... 35
• Added Device Functional Modes section ............................................................................................................................. 36
• Corrected values in Table 15 to remove extra 0 in 800000h ............................................................................................... 40
• Added text to Chip Select section to say that SCLK will force DRDY high, even with CS high........................................... 41
• Added text to Data Output and Data Ready section to say that stop read data continuous mode is not compatible
with DRDY MODE set to 1 ................................................................................................................................................... 42
• Modified Figure 74 and Figure 75 to better show DIN transitions with respect to SCLK; replaced Figure 76 to better

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Revision History (continued)

show full command and DRDY/DOUT falling with NOP....................................................................................................... 43
• Added more infomation to Data Format section; added Figure 77 ...................................................................................... 44
• Added cross-reference for Figure 78 to Commands section................................................................................................ 45
• Modified Figure 78 to include CS status through SLEEP and WAKEUP command ............................................................ 46
• Updated Figure 79 and Figure 80 to show start of command execution ............................................................................. 46
• Added cross-reference for Figure 83 to Commands section................................................................................................ 47
• Removed figure for SDATAC (Stop Read Data Continuous) command .............................................................................. 47
• Updated Figure 85 to show MUX1 as the start of the data byte for the given command and register location................... 48
• Updated Figure 86 to show start of calibration timing .......................................................................................................... 49
• Updated Register Maps section to new format .................................................................................................................... 50
• Updated Application Information section. Included new typical applications for Ratiometric 3-Wire RTD
Measurement System and K-Type Thermocouple Measurement (–200°C to +1250°C) with Cold-Junction
Compensation....................................................................................................................................................................... 70
• Updated Figure 112 and Figure 113 to better show timing information ............................................................................... 74
• Removed Hardware-Compensated 3-Wire RTD Measurement application section ............................................................ 76

Changes from Revision F (June 2011) to Revision G Page

• Added Figure 35 .................................................................................................................................................................. 17

• Added Figure 41 and Figure 42............................................................................................................................................ 18

Changes from Revision E (December, 2010) to Revision F Page

• Added footnote to Full-scale input voltage specification in Electrical Characteristics table ................................................... 8
• Added test condition for INL parameter of Electrical Characteristics ..................................................................................... 9
• Added tCSPW to minimum specification in Timing Characteristics for Figure 1...................................................................... 11
• Updated Figure 1 to show tCSPW timing ................................................................................................................................ 12
• Corrected grid and axis values for Figure 29 ....................................................................................................................... 16
• Corrected grid and axis values for Figure 30 ....................................................................................................................... 16
• Updated Figure 51................................................................................................................................................................ 25
• Added details to Bias Voltage Generation section ............................................................................................................... 34
• Corrected Table 14............................................................................................................................................................... 39
• Added details to Calibration section ..................................................................................................................................... 39
• Added Equation 18 to Calibration section ............................................................................................................................ 39
• Added section to Calibration Commands ............................................................................................................................. 40
• Added details to Digital Interface section ............................................................................................................................. 43
• Added Restricted command space to Table 19 ................................................................................................................... 45

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5 Device Comparison Table

EXCITATION
NUMBER OF VOLTAGE
PRODUCT RESOLUTION (Bits) CURRENT PACKAGE
INPUTS REFERENCE
SOURCES
ADS1146 16 1 Differential External No TSSOP-16
ADS1147 16 4-Input Multiplexer Internal or External Yes TSSOP-20
TSSOP-28
ADS1148 16 8-Input Multiplexer Internal or External Yes
VQFN-32
ADS1246 24 1 Differential External No TSSOP-16
ADS1247 24 4-Input Multiplexer Internal or External Yes TSSOP-20
ADS1248 24 8-Input Multiplexer Internal or External Yes TSSOP-28

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6 Pin Configuration and Functions

PW Package
28-Pin TSSOP PW Package
Top View 20-Pin TSSOP
Top View

DVDD 1 28 SCLK
DVDD 1 20 SCLK
DGND 2 27 DIN
DGND 2 19 DIN
CLK 3 26 DOUT/DRDY
CLK 3 18 DOUT/DRDY
RESET 4 25 DRDY
RESET 4 17 DRDY
REFP0/GPIO0 5 24 CS
REFP0/GPIO0 5 16 CS
REFN0/GPIO1 6 23 START ADS1247
REFN0/GPIO1 6 15 START
REFP1 7 22 AVDD
ADS1248 VREFOUT 7 14 AVDD
REFN1 8 21 AVSS
VREFCOM 8 13 AVSS
VREFOUT 9 20 IEXC1
AIN0/IEXC 9 12 AIN3/IEXC/GPIO3
VREFCOM 10 19 IEXC2
AIN1/IEXC 10 11 AIN2/IEXC/GPIO2
AIN0/IEXC 11 18 AIN3/IEXC/GPIO3

AIN1/IEXC 12 17 AIN2/IEXC/GPIO2

AIN4/IEXC/GPIO4 13 16 AIN7/IEXC/GPIO7

AIN5/IEXC/GPIO5 14 15 AIN6/IEXC/GPIO6

PW Package
16-Pin TSSOP
Top View

DVDD 1 16 SCLK

DGND 2 15 DIN

CLK 3 14 DOUT/DRDY

RESET 4 13 DRDY
ADS1246
REFP 5 12 CS

REFN 6 11 START

AINP 7 10 AVDD

AINN 8 9 AVSS

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Pin Functions
PIN
ADS1248 ADS1247 ADS1246 TYPE (1) DESCRIPTION (2)
NAME
(TSSOP-28) (TSSOP-20) (TSSOP-16)
AIN0/IEXC 11 9 — I Analog input 0, optional excitation current output
AIN1/IEXC 12 10 — I Analog input 1, optional excitation current output
Analog input 2, optional excitation current output,
AIN2/IEXC/GPIO2 17 11 — I/O
or general-purpose digital input/output pin 2
Analog input 3, optional excitation current output,
AIN3/IEXC/GPIO3 18 12 — I/O
or general-purpose digital input/output pin 3
Analog input 4, optional excitation current output,
AIN4/IEXC/GPIO4 13 — — I/O
or general-purpose digital input/output pin 4
Analog input 5, optional excitation current output,
AIN5/IEXC/GPIO5 14 — — I/O
or general-purpose digital input/output pin 5
Analog input 6, optional excitation current output,
AIN6/IEXC/GPIO6 15 — — I/O
or general-purpose digital input/output pin 6
Analog input 7, optional excitation current output,
AIN7/IEXC/GPIO7 16 — — I/O
or general-purpose digital input/output pin 7
AINN — — 8 I Negative analog input
AINP — — 7 I Positive analog input
Positive analog power supply, connect a 0.1-μF capacitor to
AVDD 22 14 10 P
AVSS
AVSS 21 13 9 P Negative analog power supply
External clock input, tie to DGND to activate the internal
CLK 3 3 3 I
oscillator
CS 24 16 12 I Chip select (active low)
DGND 2 2 2 G Digital ground
DIN 27 19 15 I Serial data input
DOUT/DRDY 26 18 14 O Serial data output or data output combined with data ready
DRDY 25 17 13 O Data ready (active low)
DVDD 1 1 1 P Digital power supply, connect a 0.1-μF capacitor to DGND
IEXC1 20 — — O Excitation current output 1
IEXC2 19 — — O Excitation current output 2
REFN — — 6 I Negative external reference input
Negative external reference input 0, or
REFN0/GPIO1 6 6 — I/O
general-purpose digital input/output pin 1
REFN1 8 — — I Negative external reference input 1
REFP — — 5 I Positive external reference input
Positive external reference input 0, or
REFP0/GPIO0 5 5 — I/O
general-purpose digital input/output pin 0
REFP1 7 — — I Positive external reference input 1
RESET 4 4 4 I Reset (active low)
SCLK 28 20 16 I Serial clock input
START 23 15 11 I Conversion start
Negative internal reference voltage output, connect to AVSS
VREFCOM 10 8 — O when using a unipolar supply or to the mid-voltage of the
power supply when using a bipolar supply
Positive internal reference voltage output, connect a capacitor
VREFOUT 9 7 — O
in the range of 1-μF to 47-μF to VREFCOM

(1) G = Ground, I = Input, O = Output, P = Power

(2) See Unused Inputs and Outputs for unused pin connections.

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7 Specifications
7.1 Absolute Maximum Ratings (1)
MIN MAX UNIT
AVDD to AVSS –0.3 5.5
Power-supply voltage AVSS to DGND –2.8 0.3 V
DVDD to DGND –0.3 5.5
Analog input voltage AINx, REFPx, REFNx, VREFOUT, VREFCOM, IEXC1, IEXC2 AVSS – 0.3 AVDD + 0.3 V
Digital input voltage SCLK, DIN, DOUT/DRDY, DRDY, CS, START, RESET, CLK DGND – 0.3 DVDD + 0.3 V
Continuous, any pin except power supply pins –10 10
Input current mA
Momentary, any pin except power supply pins –100 100
Junction, TJ 150
Temperature °C
Storage, Tstg –60 150

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±2000
V(ESD) Electrostatic discharge Charged device model (CDM), per JEDEC specification JESD22-C101, V
±500
all pins (2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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7.3 Recommended Operating Conditions

Over operating ambient temperature range (unless otherwise noted)
MIN NOM MAX UNIT
POWER SUPPLY
AVDD to AVSS 2.7 5.25
Analog power supply AVSS to DGND –2.65 0.1 V
AVDD to DGND 2.25 5.25
Digital power supply DVDD to DGND 2.7 5.25 V
ANALOG INPUTS (1)
VIN Differential input voltage V(AINP) – V(AINN) (2) –VREF / Gain VREF / Gain V
VCM Common-mode input voltage (V(AINP) + V(AINN)) / 2 See Equation 3 V
VOLTAGE REFERENCE INPUTS (3)
VREF Differential reference input voltage V(REFPx) – V(REFNx) 0.5 (AVDD – AVSS) – 1 V
V(REFNx) Absolute negative reference voltage AVSS – 0.1 V(REFPx) – 0.5 V
V(REFPx) Absolute positive reference voltage V(REFNx) + 0.5 AVDD + 0.1 V
EXTERNAL CLOCK INPUT (4)
fCLK External clock frequency 1 4.5 MHz
External clock duty cycle 25% 75%
GENERAL-PURPOSE INPUTS/OUTPUTS (GPIO)
GPIO input voltage AVSS AVDD V
DIGITAL INPUTS
Digital input voltage DGND DVDD V
TEMPERATURE RANGE
TA Operating ambient temperature –40 125 °C
Specified ambient temperature –40 105 °C

(1) AINP and AINN denote the positive and negative inputs of the PGA.
(2) For VREF > 2.7 V, the differential input voltage must not exceed 2.7 V / Gain.
(3) REFPx and REFNx denote the differential reference input pair (ADS1246, ADS1247), or one of the two available differential reference
input pairs (ADS1248).
(4) External clock only required if the internal oscillator is not used.

7.4 Thermal Information

ADS1246 ADS1247 ADS1248
(1)
THERMAL METRIC PW (TSSOP) PW (TSSOP) PW (TSSOP) UNIT
16 PINS 20 PINS 28 PINS
RθJA Junction-to-ambient thermal resistance 95.2 87.6 54.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 28.8 21.2 11.3 °C/W
RθJB Junction-to-board thermal resistance 41.1 39.9 13 °C/W
ψJT Junction-to-top characterization parameter 1.5 0.8 0.5 °C/W
ψJB Junction-to-board characterization parameter 40.4 39.2 12.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.

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7.5 Electrical Characteristics

Minimum and maximum specifications apply from TA = –40°C to 105°C. Typical specifications are at TA = 25°C.
All specifications are at AVDD = 5 V, DVDD = 3.3 V, AVSS = 0 V, external VREF = 2.048 V, and fCLK = 4.096 MHz (unless
otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ANALOG INPUTS
Differential input current 100 pA
Absolute input current See Table 8
PGA
PGA gain settings 1, 2, 4, 8, 16, 32, 64, 128 V/V
SYSTEM PERFORMANCE
Resolution 24 Bits
DR Data rate 5, 10, 20, 40, 80, 160, 320, 640, 1000, 2000 SPS
ADC conversion time Single-cycle settling
Differential input, end point fit,
INL Integral nonlinearity 6 15 ppm
Gain = 1, VCM = 2.5 V
(1)
VIO Offset voltage (input referred) After calibration –15 15 μV
Offset drift See Figure 9 to Figure 12
TA = 25°C, all Gains,
Gain error –0.02% ±0.005% 0.02%
DR = 40 SPS, 80 SPS, or 160 SPS
Gain drift See Figure 17 to Figure 20
Noise See Table 1 to Table 4
NMRR Normal-mode rejection See Table 10
At DC, Gain = 1 80 90
CMRR Common-mode rejection dB
At DC, Gain = 32 90 125
AVDD / DVDD at DC,
PSRR Power-supply rejection 100 135 dB
Gain = 32, DR = 80 SPS
VOLTAGE REFERENCE INPUTS
Reference input current 30 nA
INTERNAL VOLTAGE REFERENCE
VREF Internal reference voltage 2.038 2.048 2.058 V

(2)
TA = 25°C to 105°C 2 10 ppm/°C
Reference drift
TA = –40°C to 105°C 6 15 ppm/°C
Output current (3) –10 10 mA
Load regulation 50 μV/mA
Start-up time See Table 11
INTERNAL OSCILLATOR
Internal oscillator frequency 3.89 4.096 4.3 MHz
EXCITATION CURRENT SOURCES (IDACs)
Output current settings 50, 100, 250, 500, 750, 1000, 1500 μA
Compliance voltage All currents See Figure 41 and Figure 42
Absolute error All currents, each IDAC –6% ±1% 6%
Absolute mismatch All currents, between IDACs ±0.15%
Temperature drift Each IDAC 100 ppm/°C
Temperature drift matching Between IDACs 10 ppm/°C
BURN-OUT CURRENT SOURCES
Burn-out current source settings 0.5, 2, 10 μA

(1) Offset calibration on the order of noise.

(2) Specified by the combination of design and final production test.
(3) Do not exceed this loading on the internal voltage reference.

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Electrical Characteristics (continued)

Minimum and maximum specifications apply from TA = –40°C to 105°C. Typical specifications are at TA = 25°C.
All specifications are at AVDD = 5 V, DVDD = 3.3 V, AVSS = 0 V, external VREF = 2.048 V, and fCLK = 4.096 MHz (unless
otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BIAS VOLTAGE
Bias voltage (AVDD + AVSS) / 2 V
Bias voltage output impedance 400 Ω
TEMPERATURE SENSOR
Output voltage TA = 25°C 118 mV
Temperature coefficient 405 μV/°C
GENERAL-PURPOSE INPUTS/OUTPUTS (GPIO)
VIL Low-level input voltage AVSS 0.3 × AVDD V
VIH High-level input voltage 0.7 × AVDD AVDD V
VOL Low-level output voltage IOL = 1 mA 0.2 × AVDD V
VOH High-level output voltage IOH = 1 mA 0.8 × AVDD V
DIGITAL INPUTS/OUTPUTS (other than GPIO)
VIL Low-level input voltage DGND 0.3 × DVDD V
VIH High-level input voltage 0.7 × DVDD DVDD V
VOL Low-level output voltage IOL = 1 mA DGND 0.2 × DVDD V
VOH High-level output voltage IOH = 1 mA 0.8 × DVDD V
Input leakage DGND < VIN < DVDD –10 10 μA
POWER SUPPLY
Power-down mode 0.1
Converting, AVDD = 3.3 V,
200
DR = 20 SPS, external reference
IAVDD Analog supply current Converting, AVDD = 5 V, µA
225
DR = 20 SPS, external reference
Additional current with internal reference
180
enabled
Power-down mode 0.2
Normal operation, DVDD = 3.3 V,
210
IDVDD Digital supply current DR = 20 SPS, internal oscillator μA
Normal operation, DVDD = 5 V,
230
DR = 20 SPS, internal oscillator
AVDD = DVDD = 5 V,
DR = 20 SPS, internal oscillator, external 2.3
reference
PD Power dissipation mW
AVDD = DVDD = 3.3 V,
DR = 20 SPS, internal oscillator, external 1.4
reference

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7.6 Timing Requirements

At TA = –40°C to 105°C and DVDD = 2.7 V to 5.5 V (unless otherwise noted)
PARAMETER MIN NOM MAX UNIT
SERIAL INTERFACE (SEE Figure 1 AND Figure 2)
tCSSC Delay time, First SCLK rising edge after CS falling edge 10 ns
tSCCS Delay time, CS rising edge after final SCLK falling edge 7 tCLK (1)
tCSPW Pulse duration, CS high 5 tCLK
488 ns
tSCLK SCLK period
64 Conversions
tSPWH Pulse duration, SCLK high 0.25 0.75 tSCLK
tSPWL Pulse duration, SCLK low 0.25 0.75 tSCLK
tDIST Setup time, DIN valid before SCLK falling edge 5 ns
tDIHD Hold time, DIN valid after SCLK falling edge 5 ns
tSTD Setup time, SCLK low before DRDY rising edge 5 tCLK
tDTS Delay time, SCLK rising edge after DRDY falling edge 1 tCLK
MINIMUM START TIME PULSE DURATION (SEE Figure 3)
tSTART Pulse duration, START high 3 tCLK
RESET PULSE DURATION, SERIAL INTERFACE COMMUNICATION AFTER RESET (SEE Figure 4)
tRESET Pulse duration, RESET low 4 tCLK
Delay time, SCLK rising edge (start of serial interface communication)
tRHSC 0.6 (2) ms
after RESET rising edge

(1) tCLK = 1 / fCLK. The default clock frequency fCLK = 4.096 MHz.
(2) Applicable only when fCLK = 4.096 MHz, scales proportionally with fCLK frequency.

7.7 Switching Characteristics

At TA = –40°C to 105°C and DVDD = 2.7 V to 5.5 V (unless otherwise noted; see Figure 1 and Figure 2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Propagation delay time, DVDD ≤ 3.6 V 50
tDOPD ns
SCLK rising edge to valid new DOUT DVDD > 3.6 V 180
tDOHD DOUT hold time 0 ns
Propagation delay time,
tCSDO 10 ns
CS rising edge to DOUT high impedance
tPWH Pulse duration, DRDY high 3 tCLK

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CS tCSPW
tSCLK tSPWH
tCSSC tSCCS
SCLK
tDIST tDIHD
tSPWL
DIN DIN[0] DIN[7] DIN[6] DIN[5] DIN[4] DIN[1] DIN[0]

tDOPD tDOHD
DOUT/DRDY DOUT[7] DOUT[6] DOUT[5] DOUT[4] DOUT[1] DOUT[0]
tCSDO

Figure 1. Serial Interface Timing, DRDY MODE Bit = 0

tDTS
tPWH

DRDY

tSTD(1)
1 2 3 4 5 6 7 8
SCLK(2)

(1) This timing diagram is applicable only when the CS pin is low. SCLK does not need to be low during tSTD when CS is
high.
(2) SCLK must only be sent in multiples of eight during partial retrieval of output data.

Figure 2. Serial Interface Timing to Allow Conversion Result Loading

START tSTART

Figure 3. Minimum Start Pulse Duration

tRESET
RESET

CS

SCLK

tRHSC

Figure 4. Reset Pulse Duration and Serial Interface Communication After Reset

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7.8 Typical Characteristics

At TA = 25°C, AVDD = 5 V, AVSS = 0 V, and external VREF = 2.5 V (unless otherwise noted)

8 8
PGA = 1 PGA = 32
6 Data Rate = 20SPS 6 Data Rate = 20SPS
4
4

INL (ppm of FSR)

-40°C 2
INL (ppm of FSR)

2 -10°C
-10°C 0
0 -40°C
-2
-2
-4
+25°C
-4 +25°C
-6
+105°C +105°C
-6 -8

-8 -10
-100 -50 0 50 100 -100 -50 0 50 100
VIN (% of FSR) VIN (% of FSR)

Figure 5. Integral Nonlinearity vs Input Signal Figure 6. Integral Nonlinearity vs Input Signal
8 8
PGA = 128 -40°C +105°C
6 Data Rate = 20SPS 6
-10°C
4 4
+25°C
INL (ppm of FSR)

INL (ppm of FSR)

-40°C -10°C
2 2

0 0

-2 -2
+25°C
-4 -4
+105°C
-6 -6 PGA = 1
Data Rate = 2kSPS
-8 -8
-100 -50 0 50 100 -100 -50 0 50 100
VIN (% of FSR) VIN (% of FSR)

Figure 7. Integral Nonlinearity vs Input Signal Figure 8. Integral Nonlinearity vs Input Signal
4 8
AVDD = 5V AVDD = 5V
3 Data Rate = 20SPS 6 Data Rate = 160SPS
Input-Referred Offset (mV)

Input-Referred Offset (mV)

4
2
2 PGA = 32
1
PGA = 128 0
0 PGA = 128
PGA = 32 -2
-1
-4
PGA = 1 PGA = 1
-2 -6

-3 -8
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Temperature (°C) Temperature (°C)

Figure 9. Offset vs Temperature Figure 10. Offset vs Temperature

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Typical Characteristics (continued)

At TA = 25°C, AVDD = 5 V, AVSS = 0 V, and external VREF = 2.5 V (unless otherwise noted)
8 15
AVDD = 5V AVDD = 5V
6
Data Rate = 640SPS Data Rate = 2kSPS
4 10
Input-Referred Offset (mV)

Input-Referred Offset (mV)

2
PGA = 32 5
0
-2
PGA = 128 0 PGA = 32
-4
-6
-5 PGA = 128
-8
PGA = 1
-10 -10
-12 PGA = 1
-14 -15
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Temperature (°C) Temperature (°C)

Figure 11. Offset vs Temperature Figure 12. Offset vs Temperature

4 5
AVDD = 3.3V AVDD = 3.3V
4
3 Data Rate = 20SPS PGA = 1 Data Rate = 160SPS
3
Input-Referred Offset (mV)

Input-Referred Offset (mV) 2

2
1 PGA = 32
1 0

0 -1 PGA = 128
-2
-1 -3
PGA = 1
-4
-2 PGA = 32
-5
PGA = 128
-3 -6
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Temperature (°C) Temperature (°C)

Figure 13. Offset vs Temperature Figure 14. Offset vs Temperature

10 8
AVDD = 3.3V AVDD = 3.3V
8 Data Rate = 640SPS 6 Data Rate = 2kSPS
Input-Referred Offset (mV)

Input-Referred Offset (mV)

6 PGA = 1
PGA = 1 4
4 PGA = 128
PGA = 32
2 2

0 0
-2 PGA = 32
PGA = 128 -2
-4
-4
-6

-8 -6
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Temperature (°C) Temperature (°C)

Figure 15. Offset vs Temperature Figure 16. Offset vs Temperature

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Typical Characteristics (continued)

At TA = 25°C, AVDD = 5 V, AVSS = 0 V, and external VREF = 2.5 V (unless otherwise noted)
0.05 0.03
AVDD = 5V
0.04
PGA = 1 0.02 Data Rate = 160SPS
0.03
PGA = 1
0.02 0.01
Gain Error (%)

Gain Error (%)

0.01
PGA = 32 0
0
-0.01
-0.01
-0.02 PGA = 32
-0.02
PGA = 128
-0.03 PGA = 128
AVDD = 5V -0.03
-0.04
Data Rate = 20SPS
-0.05 -0.04
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Temperature (°C) Temperature (°C)

Figure 17. Gain Error vs Temperature Figure 18. Gain Error vs Temperature
0.03 0.02
Data Rate = 640SPS AVDD = 5V
Data Rate = 2kSPS
0.02 0.01

0.01 PGA = 1
0
Gain Error (%)
Gain Error (%)

PGA = 1
0
-0.01
-0.01 PGA = 128
PGA = 128 -0.02
-0.02
PGA = 32
-0.03 -0.03
PGA = 32
-0.04 -0.04
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Temperature (°C) Temperature (°C)

Figure 19. Gain Error vs Temperature Figure 20. Gain Error vs Temperature
0.04 0.04
AVDD = 3.3V AVDD = 3.3V
0.03 Data Rate = 20SPS 0.03 Data Rate = 160SPS
PGA = 128
0.02 0.02
PGA = 32
Gain Error (%)

Gain Error (%)

0.01 0.01
PGA = 1
0 0
PGA = 1
-0.01 -0.01
PGA = 128 PGA = 32
-0.02 -0.02

-0.03 -0.03

-0.04 -0.04
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Temperature (°C) Temperature (°C)

Figure 21. Gain Error vs Temperature Figure 22. Gain Error vs Temperature

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Typical Characteristics (continued)

At TA = 25°C, AVDD = 5 V, AVSS = 0 V, and external VREF = 2.5 V (unless otherwise noted)
0.05 0.05
AVDD = 3.3V AVDD = 3.3V
0.04 Data Rate = 640SPS 0.04 Data Rate = 2kSPS
PGA = 128 PGA = 128
0.03 0.03
0.02 0.02
Gain Error (%)

Gain Error (%)

0.01 0.01
PGA = 32
0 0
PGA = 1
-0.01 -0.01
-0.02 -0.02
PGA = 1
-0.03 -0.03
PGA = 32
-0.04 -0.04
-0.05 -0.05
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Temperature (°C) Temperature (°C)

Figure 23. Gain Error vs Temperature Figure 24. Gain Error vs Temperature
1800 1800
AVDD = 5V AVDD = 5V
1600 PGA = 1 1600 PGA = 32
Data Rate = 20SPS Data Rate = 20SPS
1400 1400
12k Samples 12k Samples
1200 s = 13 1200 s = 19
Counts

Counts

1000 1000
800 800
600 600
400 400
200 200
0 0
-53
-49
-45
-41
-37
-33
-29
-26
-22
-18
-14
-10
-6
-3
0
4
8
12
16
19
23
27
31
35
39
43
47

-69
-63
-58
-52
-47
-41
-36
-30
-25
-20
-14
-9
-3
1
7
12
18
23
28
34
39
45
50
56
61
67
73
(LSB) (LSB)

Figure 25. Noise Histogram Plot Figure 26. Noise Histogram Plot
1600 1400
AVDD = 3.3V AVDD = 3.3V
1400 PGA = 1 1200 PGA = 32
Data Rate = 20SPS Data Rate = 20SPS
1200 12k Samples 12k Samples
1000
s = 18.5 s = 22
1000
800
Counts

Counts

800
600
600
400
400

200 200

0 0
-60
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
15
20
25
30
35
40
45
50
60
70
80
90
100
110

-80
-60
-45
-35
-25
-15
-5
5
15
25
35
45
60
80
100

(LSB) (LSB)

Figure 27. Noise Histogram Plot Figure 28. Noise Histogram Plot

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Typical Characteristics (continued)

At TA = 25°C, AVDD = 5 V, AVSS = 0 V, and external VREF = 2.5 V (unless otherwise noted)
0.30 0.30
AVDD = 5V AVDD = 3.3V
PGA = 32 PGA = 32
0.25 Data Rate = 5SPS 0.25
Data Rate = 5SPS
RMS Noise (mV)

RMS Noise (mV)

0.20 0.20

0.15 0.15

0.10 0.10

0.05 0.05

0 0
-100 -80 -60 -40 -20 0 20 40 60 80 100 -100 -80 -60 -40 -20 0 20 40 60 80 100
VIN (% of FSR) VIN (% of FSR)

Figure 29. RMS Noise vs Input Signal Figure 30. RMS Noise vs Input Signal
130 8
125
7

Power-Supply Rejection (mV/V)

120 2000SPS
PGA = 32 6
115
CMRR (dB)

110 5
PGA = 128 320/640/1000SPS
105 4
100
3
95 40/80/160SPS
PGA = 1 2
90 5/10/20SPS
85 1

80 0
-40 -20 0 20 40 60 80 100 120 1 2 4 8 16 32 64 128
Temperature (°C) Gain

Figure 31. CMRR vs Temperature Figure 32. Power-Supply Rejection vs Gain

700 2.050
2280 Units 14 Units
600

500 2.049
Output Voltage (V)

400
Counts

300 2.048

200
2.047
100

0
2.0475

2.0476

2.0477

2.0478

2.0479

2.0480

2.0481

2.0482

2.0483

2.0484

2.0485

2.046
-40 -20 0 20 40 60 80 100 120
Initial Accuracy (V) Temperature (°C)

Figure 33. Internal VREF Initial Accuracy Histogram Figure 34. Internal VREF vs Temperature

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Typical Characteristics (continued)

At TA = 25°C, AVDD = 5 V, AVSS = 0 V, and external VREF = 2.5 V (unless otherwise noted)
0 3.0
32 Units 2.5
−20 2.0
1.5
Reference Drift (ppm)

Data Rate Error (%)

−40 1.0 DVDD = 5V
0.5
−60 0
DVDD = 3.3V
-0.5
−80 -1.0
-1.5
−100 -2.0
-2.5
−120 -3.0
0 200 400 600 800 1000 -40 -20 0 20 40 60 80 100 120
Time (hours) G000
Temperature (°C)
Internal Oscillator

Figure 35. Internal Reference Long-Term Drift Figure 36. Data Rate Error vs Temperature
200 350
2280 Units 2280 Units
180
300
160
140 250
120
Counts

200
Counts

100
80 150
60
100
40
20 50
0
0
-1.25
-1.00
-0.75
-0.50
-0.25
0
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50

-0.6

-0.5

-0.4

-0.3

-0.2

-0.1

0.1

0.2

0.3

0.4

0.5

0.6
Initial Accuracy (%) Initial Accuracy (%)

Figure 37. IDAC Initial Accuracy Histogram Figure 38. IDAC Mismatch Histogram
1.002 0.004
1.5mA Setting, 10 Units
1.001
0.003
1.000
Normalized Output Current

0.002
IEXC1 - IEXC2 (mA)

0.999 50mA
0.998 100mA 0.001
0.997 500mA 0
0.996
250mA
0.995 750mA -0.001
0.994 -0.002
IDAC Current Settings
0.993 1mA
-0.003
0.992 1.5mA
0.991 -0.004
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 -40 -20 0 20 40 60 80 100 120
AVDD (V) Temperature (°C)

Figure 39. IDAC Line Regulation Figure 40. IDAC Drift

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Typical Characteristics (continued)

At TA = 25°C, AVDD = 5 V, AVSS = 0 V, and external VREF = 2.5 V (unless otherwise noted)
1.1 1.01
1
0.9 1.005
Normalized IDAC Current

Normalized IDAC Current

0.8
1
0.7
0.6
0.995
0.5 50µA
0.4 100µA
250µA 0.99
0.3 500µA
0.2 750µA 0.985
1mA
0.1
1.5mA
0 0.98
0 1 2 3 4 5 0 1 2 3 4 5
Voltage (V) Voltage (V)

Figure 41. IDAC Voltage Compliance Figure 42. IDAC Voltage Compliance
600 290
550
270
500
Analog Current (mA)

Digital Current (mA)

450
AVDD = 5V 250
400 DVDD = 5V
350 230
AVDD = 3.3V
300 DVDD = 3.3V
210
250
200
190
150
100 170
5 10 20 40 80 160 320 640 1000 2000 5 10 20 40 80 160 320 640 1000 2000
Data Rate (SPS) Data Rate (SPS)

Figure 43. Analog Supply Current vs Data Rate Figure 44. Digital Supply Current vs Data Rate
800 330
AVDD = 5V 2kSPS DVDD = 5V
700 310
2kSPS
600
Analog Current (mA)

290
Digital Current (mA)

320/640/1kSPS
500 320/640/1kSPS
40/80/160SPS 270
400
5/10/20SPS 250
300
230
200
40/80/160SPS
100 210
5/10/20SPS
0 190
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Temperature (°C) Temperature (°C)

Figure 45. Analog Supply Current vs Temperature Figure 46. Digital Supply Current vs Temperature

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Typical Characteristics (continued)

At TA = 25°C, AVDD = 5 V, AVSS = 0 V, and external VREF = 2.5 V (unless otherwise noted)
700 310
AVDD = 3.3V DVDD = 3.3V 2kSPS
600 290
2kSPS
Analog Current (mA)

Digital Current (mA)

500
270
320/640/1kSPS
400 320/640/1kSPS
250
40/80/160SPS
300
5/10/20SPS
230
200
40/80/160SPS
100 210
5/10/20SPS
0 190
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Temperature (°C) Temperature (°C)

Figure 47. Analog Supply Current vs Temperature Figure 48. Digital Supply Current vs Temperature

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8 Parameter Measurement Information

8.1 Noise Performance
The ADC noise performance is optimized by adjusting the data rate and PGA setting. Generally, the lowest input-
referred noise is achieved using the highest gain possible, consistent with the input signal range. Do not set the
gain too high or the result is ADC overrange. Noise also depends on the output data rate. As the data rate
reduces, the ADC bandwidth correspondingly reduces. This reduction in total bandwidth results in lower overall
noise. Table 1 to Table 6 summarize the noise performance of the device. The data are representative of typical
noise performance at TA = 25°C. The data shown are the result of averaging the readings from multiple devices
and were measured with the inputs shorted together. A minimum of 128 consecutive readings were used to
calculate the root mean square (RMS) and peak-to-peak (PP) noise for each reading.
Table 1, Table 3, and Table 5 list the input-referred noise in units of μVRMS and μVPP for the conditions shown.
Table 2, Table 4, and Table 6 list the corresponding data in units of ENOB (effective number of bits) where
ENOB for the RMS noise is defined as in Equation 1:
ENOB = ln((2 · VREF/Gain) / VNRMS) / ln(2)
where VNRMS = Input referred RMS noise voltage (1)
ENOB for the peak-to-peak noise is calculated with the same method.
Table 3 to Table 6 use the internal reference available on the ADS1247 and ADS1248. The data are also
representative of the ADS1246 noise performance when using a low-noise external reference such as the
REF5025 or the REF5020.

Table 1. Noise in μVRMS and (μVPP)

at AVDD = 5 V, AVSS = 0 V, and External Reference = 2.5 V
DATA PGA SETTING
RATE
(SPS) 1 2 4 8 16 32 64 128
5 1.1 (4.99) 0.68 (3.8) 0.37 (1.9) 0.19 (0.98) 0.1 (0.44) 0.07 (0.31) 0.05 (0.27) 0.05 (0.21)
10 1.53 (8.82) 0.82 (3.71) 0.5 (2.69) 0.27 (1.33) 0.15 (0.67) 0.08 (0.5) 0.06 (0.36) 0.07 (0.34)
20 2.32 (13.37) 1.23 (6.69) 0.71 (3.83) 0.34 (1.9) 0.18 (1.01) 0.12 (0.71) 0.10 (0.51) 0.09 (0.54)
40 2.72 (17.35) 1.33 (7.65) 0.68 (3.83) 0.38 (2.21) 0.22 (1.13) 0.14 (0.77) 0.15 (0.78) 0.14 (0.76)
80 3.56 (22.67) 1.87 (12.3) 0.81 (5.27) 0.5 (3.49) 0.3 (1.99) 0.19 (1.24) 0.19 (1.16) 0.18 (1.04)
160 5.26 (42.03) 2.52 (17.57) 1.32 (9.22) 0.67 (5.25) 0.41 (2.89) 0.26 (1.91) 0.27 (1.74) 0.26 (1.74)
320 9.39 (74.91) 4.68 (39.48) 2.69 (18.95) 1.24 (9.94) 0.68 (5.25) 0.45 (3.08) 0.38 (2.71) 0.36 (2.46)
640 13.21 (119.66) 6.93 (59.31) 3.59 (28.55) 1.53 (10.68) 0.95 (8.7) 0.63 (4.94) 0.53 (3.74) 0.5 (3.55)
1000 32.34 (443.91) 16.11 (185.67) 11.54 (92.23) 4.65 (37.55) 2.02 (23.14) 1.15 (12.29) 0.77 (7.42) 0.64 (4.98)
2000 32.29 (372.54) 15.99 (182.27) 8.02 (91.73) 4.08 (45.89) 2.19 (24.14) 1.36 (12.32) 1.08 (8.03) 1.0 (6.93)

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Table 2. Effective Number of Bits from RMS Noise and (Peak-to-Peak Noise)
at AVDD = 5 V, AVSS = 0 V, and External Reference = 2.5 V
DATA PGA SETTING
RATE
(SPS) 1 2 4 8 16 32 64 128
5 22.1 (19.9) 21.8 (19.3) 21.7 (19.3) 21.6 (19.3) 21.6 (19.4) 21.1 (18.9) 20.6 (18.1) 19.6 (17.5)
10 21.6 (19.1) 21.5 (19.4) 21.3 (18.8) 21.1 (18.8) 21 (18.8) 20.9 (18.3) 20.3 (17.7) 19.1 (16.8)
20 21 (18.5) 21 (18.5) 20.7 (18.3) 20.8 (18.3) 20.7 (18.2) 20.3 (17.7) 19.6 (17.2) 18.7 (16.1)
40 20.8 (18.1) 20.8 (18.3) 20.8 (18.3) 20.6 (18.1) 20.4 (18.1) 20.1 (17.6) 19 (16.6) 18.1 (15.6)
80 20.4 (17.8) 20.4 (17.6) 20.6 (17.9) 20.3 (17.5) 20 (17.3) 19.6 (16.9) 18.6 (16) 17.7 (15.2)
160 19.9 (16.9) 19.9 (17.1) 19.9 (17) 19.8 (16.9) 19.5 (16.7) 19.2 (16.3) 18.1 (15.5) 17.2 (14.5)
320 19 (16) 19 (16) 18.8 (16) 18.9 (15.9) 18.8 (15.9) 18.4 (15.6) 17.6 (14.8) 16.7 (14)
640 18.5 (15.4) 18.5 (15.4) 18.4 (15.4) 18.6 (15.8) 18.3 (15.1) 17.9 (14.9) 17.2 (14.4) 16.3 (13.4)
1000 17.2 (13.5) 17.2 (13.7) 16.7 (13.7) 17 (14) 17.2 (13.7) 17.1 (13.6) 16.6 (13.4) 15.9 (12.9)
2000 17.2 (13.7) 17.3 (13.7) 17.2 (13.7) 17.2 (13.7) 17.1 (13.7) 16.8 (13.6) 16.1 (13.2) 15.3 (12.5)

Table 3. Noise in μVRMS and (μVPP)

at AVDD = 5 V, AVSS = 0 V, and Internal Reference = 2.048 V
DATA PGA SETTING
RATE
(SPS) 1 2 4 8 16 32 64 128
5 1.35 (7.78) 0.7 (4.17) 0.35 (2.03) 0.17 (0.95) 0.1 (0.53) 0.06 (0.32) 0.05 (0.31) 0.05 (0.29)
10 1.8 (10.82) 0.88 (5.26) 0.5 (2.75) 0.24 (1.47) 0.13 (0.8) 0.09 (0.49) 0.07 (0.39) 0.07 (0.4)
20 2.62 (14.32) 1.22 (7.05) 0.66 (3.88) 0.35 (2.05) 0.19 (1.09) 0.12 (0.66) 0.1 (0.61) 0.1 (0.55)
40 2.64 (16.29) 1.34 (7.75) 0.69 (4.06) 0.35 (2.07) 0.21 (1.15) 0.15 (0.85) 0.14 (0.81) 0.13 (0.75)
80 3.69 (23.62) 1.82 (10.81) 0.89 (5.48) 0.51 (2.68) 0.3 (1.69) 0.21 (1.32) 0.2 (1.09) 0.18 (0.98)
160 5.7 (35.74) 2.63 (16.9) 1.34 (8.82) 0.68 (4.24) 0.4 (2.65) 0.3 (1.92) 0.28 (1.88) 0.26 (1.57)
320 9.67 (67.44) 4.95 (35.3) 2.59 (17.52) 1.29 (8.86) 0.72 (4.35) 0.49 (3.03) 0.4 (2.44) 0.37 (2.34)
640 13.66 (93.06) 7.04 (45.2) 3.63 (18.73) 1.84 (12.97) 1.02 (6.51) 0.68 (4.2) 0.58 (3.69) 0.53 (3.5)
1000 31.18 (284.59) 16 (129.77) 7.58 (61.3) 3.98 (33.04) 2.08 (16.82) 1.16 (9.08) 0.83 (5.42) 0.68 (4.65)
2000 31.42 (273.39) 15.45 (130.68) 8.07 (67.13) 4.06 (36.16) 2.29 (19.22) 1.38 (9.87) 1.06 (6.93) 1.0 (6.48)

Table 4. Effective Number of Bits from RMS Noise and (Peak-to-Peak Noise)
at AVDD = 5 V, AVSS = 0 V, and Internal Reference = 2.048 V
DATA PGA SETTING
RATE
(SPS) 1 2 4 8 16 32 64 128
5 21.5 (19) 21.5 (18.9) 21.5 (18.9) 21.5 (19) 21.3 (18.9) 21 (18.6) 20.2 (17.7) 19.2 (16.8)
10 21.1 (18.5) 21.1 (18.6) 21 (18.4) 21 (18.4) 20.9 (18.3) 20.5 (18) 19.8 (17.3) 18.7 (16.3)
20 20.6 (18.1) 20.7 (18.1) 20.6 (18) 20.5 (17.9) 20.4 (17.8) 20.1 (17.6) 19.2 (16.7) 18.3 (15.8)
40 20.6 (17.9) 20.5 (18) 20.5 (17.9) 20.5 (17.9) 20.2 (17.8) 19.7 (17.2) 18.8 (16.3) 17.9 (15.4)
80 20.1 (17.4) 20.1 (17.5) 20.1 (17.5) 20 (17.5) 19.7 (17.2) 19.2 (16.6) 18.3 (15.8) 17.5 (15)
160 19.5 (16.8) 19.6 (16.9) 19.5 (16.8) 19.5 (16.9) 19.3 (16.6) 18.7 (16) 17.8 (15.1) 16.9 (14.3)
320 18.7 (15.9) 18.7 (15.8) 18.6 (15.8) 18.6 (15.8) 18.4 (15.8) 18 (15.4) 17.3 (14.7) 16.4 (13.7)
640 18.2 (15.4) 18.1 (15.5) 18.1 (15.7) 18.1 (15.3) 17.9 (15.3) 17.5 (14.9) 16.8 (14.1) 15.9 (13.2)
1000 17 (13.8) 17 (13.9) 17 (14) 17 (13.9) 16.9 (13.9) 16.8 (13.8) 16.2 (13.5) 15.5 (12.7)
2000 17 (13.9) 17 (13.9) 17 (13.9) 16.9 (13.8) 16.8 (13.7) 16.5 (13.7) 15.9 (13.2) 15 (12.3)

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Table 5. Noise in μVRMS and (μVPP)

at AVDD = 3 V, AVSS = 0 V, and Internal Reference = 2.048 V
DATA PGA SETTING
RATE
(SPS) 1 2 4 8 16 32 64 128
5 2.5 (14.24) 1.32 (6.92) 0.67 (3.48) 0.32 (1.68) 0.17 (0.9) 0.09 (0.51) 0.08 (0.42) 0.07 (0.39)
10 3.09 (16.85) 1.69 (9.32) 0.82 (4.68) 0.42 (2.41) 0.23 (1.18) 0.11 (0.63) 0.11 (0.66) 0.1 (0.55)
20 4.55 (24.74) 2.19 (12.82) 1.07 (5.94) 0.55 (3.38) 0.28 (1.66) 0.16 (1.0) 0.15 (0.92) 0.14 (0.87)
40 5.06 (34.59) 2.39 (14.49) 1.27 (7.75) 0.66 (4.01) 0.36 (2.18) 0.21 (1.16) 0.21 (1.27) 0.15 (0.84)
80 6.63 (43.46) 3.28 (20.22) 1.79 (10.64) 0.89 (5.48) 0.47 (2.95) 0.29 (1.63) 0.28 (1.64) 0.21 (1.24)
160 9.75 (68.28) 4.89 (32.19) 2.36 (17.74) 1.26 (9.87) 0.65 (4.77) 0.4 (2.6) 0.4 (2.7) 0.3 (2.12)
320 19.22 (140.06) 9.8 (82.24) 4.81 (32.74) 2.47 (18.59) 1.27 (9.45) 0.71 (5.83) 0.5 (3.36) 0.43 (2.86)
640 27.07 (192.96) 13.54 (100.26) 6.88 (49.07) 3.4 (25.93) 1.76 (12.49) 1.02 (7.49) 0.71 (4.81) 0.6 (4.06)
1000 40.83 (388.28) 20.39 (185.96) 10.39 (89.38) 5.09 (43.28) 2.66 (22.78) 1.45 (11.01) 0.93 (6.74) 0.74 (4.86)
2000 42.06 (322.85) 21.15 (166.75) 10.66 (92.68) 5.61 (44.08) 2.92 (23.06) 1.68 (11.71) 1.19 (8.23) 1.05 (6.97)

Table 6. Effective Number of Bits from RMS and (Peak-to-Peak Noise)

at AVDD = 3 V, AVSS = 0 V, and Internal Reference = 2.048 V
DATA PGA SETTING
RATE
(SPS) 1 2 4 8 16 32 64 128
5 20.6 (18.1) 20.6 (18.2) 20.5 (18.2) 20.6 (18.2) 20.5 (18.1) 20.4 (17.9) 19.6 (17.2) 18.8 (16.3)
10 20.3 (17.9) 20.2 (17.7) 20.3 (17.7) 20.2 (17.7) 20.1 (17.7) 20.1 (17.6) 19.1 (16.6) 18.3 (15.8)
20 19.8 (17.3) 19.8 (17.3) 19.9 (17.4) 19.8 (17.2) 19.8 (17.2) 19.6 (17) 18.7 (16.1) 17.8 (15.2)
40 19.6 (16.9) 19.7 (17.1) 19.6 (17.0) 19.6 (17) 19.5 (16.8) 19.2 (16.8) 18.2 (15.6) 17.7 (15.2)
80 19.2 (16.5) 19.3 (16.6) 19.1 (16.6) 19.1 (16.5) 19 (16.4) 18.7 (16.3) 17.8 (15.3) 17.2 (14.7)
160 18.7 (15.9) 18.7 (16) 18.7 (15.8) 18.6 (15.7) 18.6 (15.7) 18.3 (15.6) 17.3 (14.5) 16.7 (13.9)
320 17.7 (14.8) 17.7 (14.6) 17.7 (14.9) 17.7 (14.7) 17.6 (14.7) 17.5 (14.4) 17 (14.2) 16.2 (13.4)
640 17.2 (14.4) 17.2 (14.3) 17.2 (14.3) 17.2 (14.3) 17.1 (14.3) 16.9 (14.1) 16.5 (13.7) 15.7 (12.9)
1000 16.6 (13.4) 16.6 (13.4) 16.6 (13.5) 16.6 (13.5) 16.6 (13.5) 16.4 (13.5) 16.1 (13.2) 15.4 (12.7)
2000 16.6 (13.6) 16.6 (13.6) 16.6 (13.4) 16.5 (13.5) 16.4 (13.4) 16.2 (13.4) 15.7 (12.9) 14.9 (12.2)

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9 Detailed Description

9.1 Overview
The ADS1246, ADS1247 and ADS1248 devices are highly integrated 24-bit data converters. The devices include
a low-noise, high-input impedance programmable gain amplifier (PGA), a delta-sigma (ΔΣ) ADC with an
adjustable single-cycle settling digital filter, internal oscillator, and an SPI-compatible serial interface.
The ADS1247 and ADS1248 also include a flexible input multiplexer with system monitoring capability and
general-purpose I/O settings, a very low-drift voltage reference, and two matched current sources for sensor
excitation. Figure 49 and Figure 50 show the various functions incorporated in each device.

9.2 Functional Block Diagram

AVDD REFP REFN DVDD

Burnout
Detect ADS1246
VBIAS

SCLK
DIN
Serial
DRDY
AINP 3rd Order Adjustable Interface
Input DOUT/DRDY
PGA û Digital And
AINN Mux
Modulator Filter Control CS
START
RESET
Internal Oscillator

Burnout
Detect

AVSS CLK DGND

Figure 49. ADS1246 Block Diagram

REFP0/ REFN0/ ADS1248 Only

AVDD GPIO0 GPIO1 REFP1 REFN1 VREFOUT VREFCOM DVDD

Burnout
Detect VREF Mux
Voltage ADS1247
Reference ADS1248
VBIAS

GPIO
AIN0/IEXC System SCLK
AIN1/IEXC Monitor DIN
Serial
AIN2/IEXC/GPIO2 DRDY
3rd Order Adjustable Interface
AIN3/IEXC/GPIO3 Input DOUT/DRDY
PGA û Digital And
Mux
AIN4/IEXC/GPIO4 Modulator Filter Control CS
AIN5/IEXC/GPIO5 START
AIN6/IEXC/GPIO6 Dual RESET
IDACs
AIN7/IEXC/GPIO7 Internal Oscillator
ADS1248 Only
Burnout
Detect

AVSS IEXC1 IEXC2 CLK DGND

ADS1248 Only

Figure 50. ADS1247, ADS1248 Block Diagram

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9.3 Feature Description

9.3.1 ADC Input and Multiplexer
The ADC measures the input signal through the onboard PGA. All analog inputs are connected to the internal
AINP or AINN analog inputs through the analog multiplexer. Figure 51 shows a block diagram of the analog input
multiplexer.
The input multiplexer connects to eight (ADS1248) or four (ADS1247) analog inputs. Any analog input pin can be
selected as the positive input or negative input through the MUX0 register, while the ADS1246 has AINP and
AINN connections for a single differential channel. The multiplexer also allows the on-chip excitation current and
bias voltage to be selected to a specific channel.
Through the input multiplexer, the ambient temperature (internal temperature sensor), AVDD, DVDD, and
external reference are all selectable for measurement. See System Monitor for details.
On the ADS1247 and ADS1248, the analog inputs can also be configured as general-purpose inputs and outputs
(GPIOs). See General-Purpose Digital I/O for more details.

AVDD AVDD

IDAC2 IDAC1

System Monitors
AVSS AVDD VBIAS
AVDD AVDD
AIN0
AVSS AVDD VBIAS Temperature
VREFP Diode
VREFN
AIN1

ADS1247/48 Only VREFP1/4

AVSS AVDD VBIAS
VREFN1/4

AIN2 VREFP0/4
VREFN0/4
AVSS AVDD VBIAS
AVDD/4
AIN3 AVSS/4

DVDD/4
ADS1248 Only DGND/4
AVSS AVDD VBIAS

AIN4 AVDD

AVSS AVDD VBIAS Burnout Current Source

(0.5mA, 2mA, 10mA)

AIN5
AINP
To
VBIAS PGA
AVSS AVDD AINN ADC

AIN6
Burnout Current Source
AVSS AVDD VBIAS (0.5mA, 2mA, 10mA)

AIN7 AVSS

Figure 51. Analog Input Multiplexer Circuit

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ESD diodes protect the ADC inputs. To prevent these diodes from turning on, make sure the voltages on the
analog input pins do not drop below AVSS by more than 100 mV, and do not exceed AVDD by more than 100
mV, as shown in Equation 2. The same caution is true if the inputs are configured to be GPIOs.
AVSS – 100 mV < V(AINX) < AVDD + 100 mV (2)

9.3.2 Low-Noise PGA

The ADS1246, ADS1247, and ADS1248 feature a low-drift, low-noise, high input impedance programmable gain
amplifier (PGA). The PGA can be set to gains of 1, 2, 4, 8, 16, 32, 64, or 128 by register SYS0. Figure 52 shows
a simplified diagram of the PGA.
The PGA consists of two chopper-stabilized amplifiers (A1 and A2) and a resistor feedback network that sets the
gain of the PGA. The PGA input is equipped with an electromagnetic interference (EMI) filter, as shown in
Figure 52. Note that as with any PGA, ensure that the input voltage stays within the specified common-mode
input range. The common-mode input voltage (VCM) must be within the range shown in Equation 3.
§ VIN MAX ˜ Gain · § VIN MAX ˜ Gain ·
¨¨ AVSS 0.1 V ¸¸ d VCM d ¨¨ AVDD 0.1 V ¸¸
© 2 ¹ © 2 ¹ (3)
454
AINP +
A1
7.5 pF

RF R

7.5 pF
RG C ADC
R

RF

7.5 pF
454 A2
AINN +

7.5 pF

Figure 52. Simplified Diagram of the PGA

Gain is changed inside the device using a variable resistor, RG. The differential full-scale input voltage range
(FSR) of the PGA is defined by the gain setting and the reference voltage used, as shown in Equation 4.
FSR = ±VREF / Gain (4)
Table 7 shows the corresponding full-scale input ranges when using the internal 2.048-V reference.

Table 7. PGA Full-Scale Range

PGA GAIN SETTING FSR
1 ±2.048 V
2 ±1.024 V
4 ±0.512 V
8 ±0.256 V
16 ±0.128 V
32 ±0.064 V
64 ±0.032 V
128 ±0.016 V

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9.3.2.1 PGA Common-Mode Voltage Requirements

To stay within the linear operating range of the PGA, the input signals must meet certain requirements that are
discussed in this section.
The outputs of both amplifiers (A1 and A2) in Figure 52 can not swing closer to the supplies (AVSS and AVDD)
than 100 mV. If the outputs OUTP and OUTN are driven to within 100 mV of the supply rails, the amplifiers
saturate and consequently become nonlinear. To prevent this nonlinear operating condition, the output voltages
must meet Equation 5.
AVSS + 0.1 V ≤ V(OUTN), V(OUTP) ≤ AVDD – 0.1 V (5)
Translating the requirements of Equation 5 into requirements referred to the PGA inputs (AINP and AINN) is
beneficial because there is no direct access to the outputs of the PGA. The PGA employs a symmetrical design;
therefore, the common-mode voltage at the output of the PGA can be assumed to be the same as the common-
mode voltage of the input signal, as shown in Figure 53.

AINP +

A1
-
½ V IN RF OUTP

½ Gain·V IN
VCM = ½ (V (AINP) + V(AINN)) RG
½ Gain·V IN
RF

½ V IN OUTN
-
A2
AINN +

Figure 53. PGA Common-Mode Voltage

The common-mode voltage is calculated using Equation 6.

VCM = ½ (V(AINP) + V(AINN)) = ½ (V(OUTP) + V(OUTN)) (6)
The voltages at the PGA inputs (AINP and AINN) can be expressed as Equation 7 and Equation 8.
V(AINP) = VCM + ½ VIN (7)
V(AINN) = VCM – ½ VIN (8)
The output voltages (V(OUTP) and V(OUTN)) can then be calculated as Equation 9 and Equation 10.
V(OUTP) = VCM + ½ Gain · VIN (9)
V(OUTN) = VCM – ½ Gain · VIN (10)
The requirements for the output voltages of amplifiers A1 and A2 (Equation 5) can now be translated into
requirements for the input common-mode voltage range using Equation 9 and Equation 10, which are given in
Equation 11 and Equation 12.
VCM (MIN) ≥ AVSS + 0.1 V + ½ Gain · VIN (MAX) (11)
VCM (MAX) ≤ AVDD – 0.1 V – ½ Gain · VIN (MAX) (12)
To calculate the minimum and maximum common-mode voltage limits, the maximum differential input voltage
(VIN (MAX)) that occurs in the application must be used. VIN (MAX) can be less than the maximum possible full-scale
value.

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9.3.2.2 PGA Common-Mode Voltage Calculation Example

The following paragraphs explain how to apply Equation 11 and Equation 12 to a hypothetical application. The
setup for this example is AVDD = 3.3 V, AVSS = 0 V, and gain = 16, using an external reference, VREF = 2.5 V.
The maximum possible differential input voltage VIN = (V(AINP) – V(AINN)) that can be applied is then limited to the
full-scale range of FSR = ±2.5 V / 16 = ±0.156 V. Consequently, Equation 11 and Equation 12 yield an allowed
VCM range of 1.35 V ≤ VCM ≤ 1.95 V.
If the sensor signal connected to the inputs in this hypothetical application does not make use of the entire full-
scale range but is limited to VIN (MAX) = ±0.1 V, for example, then this reduced input signal amplitude relaxes the
VCM restriction to 0.9 V ≤ VCM ≤ 2.4 V.
In the case of a fully-differential sensor signal, each input (AINP, AINN) can swing up to ±50 mV around the
common-mode voltage (V(AINP) + V(AINN)) / 2, which must remain between the limits of 0.9 V and 2.4 V. The
output of a symmetrical wheatstone bridge is an example of a fully-differential signal. Figure 54 shows a situation
where the common-mode voltage of the input signal is at the lowest limit. V(OUTN) is exactly at 0.1 V in this case.
Any further decrease in common-mode voltage (VCM) or increase in differential input voltage (VIN) drives V(OUTN)
below 0.1 V and saturates amplifier A2.

V(AINP) = 0.95 V +

A1
-
50 mV RF V(OUTP) = 1.7 V

800 mV
VCM = 0.9 V RF / 7.5
800 mV
RF

50 mV V(OUTN) = 0.1 V
-
A2
V(AINN) = 0.85 V +

Figure 54. Example where VCM is at Lowest Limit

In contrast, the signal of an RTD is of a pseudo-differential nature (if implemented as shown in one of the
application example sections, 3-Wire RTD Measurement), where the negative input is held at a constant voltage
other than 0 V and only the voltage on the positive input changes. When a pseudo-differential signal must be
measured, the negative input in this example must be biased at a voltage from 0.85 V to 2.35 V. The positive
input can then swing up to VIN (MAX) = 100 mV above the negative input. In this case, the common-mode voltage
changes at the same time the voltage on the positive input changes. That is, while the input signal swings
between 0 V ≤ VIN ≤ VIN (MAX), the common-mode voltage swings between V(AINN) ≤ VCM ≤ V(AINN) + ½ VIN (MAX).
Satisfying the common-mode voltage requirements for the maximum input voltage VIN (MAX) ensures the
requirements are met throughout the entire signal range.
Figure 55 and Figure 56 show examples of both fully-differential and pseudo-differential signals, respectively.

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AINP

AINP VCM
100 mV
VCM
1.0 V 100 mV 1.0 V
AINN

AINN

0V 0V
Figure 55. Fully-Differential Input Signal Figure 56. Pseudo-Differential Input Signal

NOTE
With a unipolar power supply, the input range does not extend to the ground. Equation 11
and Equation 12 show the common-mode voltage requirements.
• VCM (MIN) ≥ AVSS + 0.1 V + ½ Gain · VIN (MAX)
• VCM (MAX) ≤ AVDD – 0.1 V – ½ Gain · VIN (MAX)

9.3.2.3 Analog Input Impedance

The device inputs are buffered through a high-input impedance PGA before they reach the ΔΣ modulator. For the
majority of applications, the input current is minimal and can be neglected. However, because the PGA is
chopper-stabilized for noise and offset performance, the input impedance is best described as a small absolute
input current. The absolute input current for selected channels is approximately proportional to the selected
modulator clock. Table 8 shows the typical values for these currents with a differential voltage coefficient and the
corresponding input impedances over data rate.

Table 8. Typical Values for Analog Input Current over Data Rate (1)
CONDITION ABSOLUTE INPUT CURRENT EFFECTIVE INPUT IMPEDANCE
DR = 5 SPS, 10 SPS, 20 SPS ± (0.5 nA + 0.1 nA/V) 5000 MΩ
DR = 40 SPS, 80 SPS, 160 SPS ± (2 nA + 0.5 nA/V) 1200 MΩ
DR = 320 SPS, 640 SPS, 1 kSPS ± (4 nA + 1 nA/V) 600 MΩ
DR = 2 kSPS ± (8 nA + 2 nA/V) 300 MΩ

(1) Input current with VCM = 2.5 V. TA = 25°C, AVDD = 5 V, and AVSS = 0 V.

9.3.3 Clock Source

The device can use either the internal oscillator or an external clock. Connect the CLK pin to DGND before
power up or reset to activate the internal oscillator. Connecting an external clock to the CLK pin at any time
deactivates the internal oscillator, with the device then operating on the external clock. After the device switches
to the external clock, it cannot be switched back to the internal oscillator without cycling the power supplies or
resetting the device.

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9.3.4 Modulator
A third-order delta-sigma modulator is used in the ADS1246, ADS1247, and ADS1248 devices. The modulator
converts the analog input voltage into a pulse code modulated (PCM) data stream. To save power, the modulator
clock runs from 32 kHz up to 512 kHz for different data rates, as shown in Table 9.

Table 9. Modulator Clock Frequency for Different Data Rates

DATA RATE MODULATOR RATE (fMOD) (1)
fCLK/fMOD
(SPS) (kHz)
5, 10, 20 32 128
40, 80, 160 128 32
320, 640, 1000 256 16
2000 512 8

(1) Using the internal oscillator or an external 4.096-MHz clock.

9.3.5 Digital Filter

The ADC uses linear-phase finite impulse response (FIR) digital filters that can be adjusted for different output
data rates. The digital filter always settles in a single cycle.
Table 10 shows the exact data rates when an external clock equal to 4.096 MHz is used. Also shown is the
signal –3-dB bandwidth, and the 50-Hz and 60-Hz attenuation. For good 50-Hz or 60-Hz rejection, use a data
rate of 20 SPS or slower.
The frequency responses of the digital filter are shown in Figure 57 to Figure 67. Figure 60 illustrates a detailed
view of the filter frequency response from 48 Hz to 62 Hz for a 20-SPS data rate. All filter plots are generated
with a 4.096-MHz external clock.
Data rates and digital filter frequency responses scale proportionally with changes in the system clock frequency.
The internal oscillator frequency has a variation, as specified in Electrical Characteristics that will also affect data
rates and the digital filter frequency response.

Table 10. Digital Filter Specifications (1)

NOMINAL ACTUAL –3-dB ATTENUATION
DATA RATE DATA RATE BANDWIDTH fIN = 50 Hz ±0.3 Hz fIN = 60 Hz ±0.3 Hz fIN = 50 Hz ±1 Hz fIN = 60 Hz ±1 Hz
5 SPS 5.018 SPS 2.26 Hz –106 dB –74 dB –81 dB –69 dB
10 SPS 10.037 SPS 4.76 Hz –106 dB –74 dB –80 dB –69 dB
20 SPS 20.075 SPS 14.8 Hz –71 dB –74 dB –66 dB –68 dB
40 SPS 40.15 SPS 9.03 Hz — — — —
80 SPS 80.301 SPS 19.8 Hz — — — —
160 SPS 160.6 SPS 118 Hz — — — —
320 SPS 321.608 SPS 154 Hz — — — —
640 SPS 643.21 SPS 495 Hz — — — —
1000 SPS 1000 SPS 732 Hz — — — —
2000 SPS 2000 SPS 1465 Hz — — — —

(1) Values shown for fCLK = 4.096 MHz.

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space

0 0

-20 -20
Magnitude (dB)

Magnitude (dB)
-40 -40

-60 -60

-80 -80

-100 -100

-120 -120
0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200
Frequency (Hz) Frequency (Hz)
Figure 57. Filter Profile with Data Rate = 5 SPS Figure 58. Filter Profile with Data Rate = 10 SPS

0 -60

-20 -70

Magnitude (dB)
Magnitude (dB)

-40 -80

-60 -90

-80 -100

-100 -110

-120 -120
0 20 40 60 80 100 120 140 160 180 200 48 50 52 54 56 58 60 62
Frequency (Hz) Frequency (Hz)
Figure 59. Filter Profile with Data Rate = 20 SPS Figure 60. Detailed View of Filter Profile with Data Rate =
20 SPS Between 48 Hz and 62 Hz

0 0

-20 -20
Magnitude (dB)

-40 -40
Gain (dB)

-60 -60

-80 -80

-100 -100

-120 -120
0 200 400 600 800 1000 1200 1400 1600 1800 2000 0 200 400 600 800 1000 1200 1400 1600 1800 2000
Frequency (Hz) Frequency (Hz)
Figure 61. Filter Profile with Data Rate = 40 SPS Figure 62. Filter Profile with Data Rate = 80 SPS

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0 0

-20 -20
Magnitude (dB)

Magnitude (dB)
-40 -40

-60 -60

-80 -80

-100 -100

-120 -120
0 200 400 600 800 1000 1200 1400 1600 1800 2000 0 500 1000 1500 2000 2500 3000 3500 4000 4500 5000
Frequency (Hz) Frequency (Hz)
Figure 63. Filter Profile with Data Rate = 160 SPS Figure 64. Filter Profile with Data Rate = 320 SPS

0 0

-20 -20

Magnitude (dB)
Magnitude (dB)

-40 -40

-60 -60

-80 -80

-100 -100

-120 -120
0 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 0 1 2 3 4 5 6 7 8 9 10
Frequency (Hz) Frequency (kHz)
Figure 65. Filter Profile with Data Rate = 640 SPS Figure 66. Filter Profile with Data Rate = 1 kSPS

-20
Magnitude (dB)

-40

-60

-80

-100

-120
0 2 4 6 8 10 12 14 16 18 20
Frequency (kHz)
Figure 67. Filter Profile with Data Rate = 2 kSPS

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9.3.6 Voltage Reference Input

The voltage reference for the device is the differential voltage between REFP and REFN, given by Equation 13:
VREF = V(REFP) – V(REFN) (13)
In the case of the ADS1246, these pins are dedicated inputs. For the ADS1247 and ADS1248, there is a
multiplexer that selects the reference inputs, as shown in Figure 68. The reference input uses a buffer to
increase the input impedance.
As with the analog inputs, REFP0 and REFN0 can be configured as digital I/Os on the ADS1247 and ADS1248.

ADS1248 Only
REFP1 REFN1 REFP0 REFN0 VREFOUT VREFCOM

Internal
Reference Multiplexer Voltage
Reference

REFP REFN

ADC

Figure 68. Reference Input Multiplexer

The reference input circuit has ESD diodes to protect the inputs. To prevent the diodes from turning on, make
sure the voltage on the reference input pin is not less than AVSS – 100 mV, and does not exceed AVDD + 100
mV, as shown in Equation 14.
AVSS – 100 mV < (V(REFP) or V(REFN)) < AVDD + 100 mV (14)

9.3.7 Internal Voltage Reference

The ADS1247 and ADS1248 have an internal voltage reference with a low temperature coefficient. The output of
the voltage reference is 2.048 V (nominal) with the capability of both sourcing and sinking up to 10 mA of current.
The voltage reference must have a capacitor connected between VREFOUT and VREFCOM. The value of the
capacitance must be in the range of 1 μF to 47 μF. Large values provide more noise filtering of the reference;
however, the turnon time increases with capacitance, as shown in Table 11. For stability reasons, VREFCOM
must have a path with an impedance less than 10 Ω to AC ground nodes, such as GND (for a 0-V to 5-V analog
power supply), or AVSS (for a ±2.5-V analog power supply). In case this impedance is higher than 10 Ω, connect
a capacitor of at least 0.1 μF between VREFCOM and an AC ground node (for example, GND).

NOTE
Because time is required for the voltage reference to settle to the final voltage, take care
when the device is turned off between conversions. Allow adequate time for the internal
reference to fully settle before starting a new conversion.

Table 11. Internal Reference Settling Time

VREFOUT CAPACITOR SETTLING ERROR TIME TO REACH THE SETTLING ERROR
±0.5% 70 μs
1 μF
±0.1% 110 μs
±0.5% 290 μs
4.7 μF
±0.1% 375 μs
±0.5% 2.2 ms
47 μF
±0.1% 2.4 ms

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The internal reference is controlled by the MUX1 register; by default, the internal reference is off after power up
(see ADS1247 and ADS1248 Detailed Register Definitions for more details). Therefore, the internal reference
must first be turned on and then connected through the internal reference multiplexer. Because the internal
reference is used to generate the current reference for the excitation current sources, it must be turned on before
the excitation currents become available.

9.3.8 Excitation Current Sources

The ADS1247 and ADS1248 provide two matched excitation current sources (IDACs) for RTD applications. For
three-wire RTD applications, the matched current sources can be used to cancel the errors caused by sensor
lead resistance. The output current of the IDACs can be programmed to 50 μA, 100 μA, 250 μA,
500 μA, 750 μA, 1000 μA, or 1500 μA.
The two matched current sources can be connected to dedicated current output pins IEXC1 and IEXC2
(ADS1248 only), or to any analog input pin (ADS1247 and ADS1248); see ADS1247 and ADS1248 Detailed
Register Definitions for more information. Both current sources can be connected to the same pin. The internal
reference must be turned on and the proper amount of capacitance applied to VREFOUT when using the
excitation current sources.

9.3.9 Sensor Detection

To help detect a possible sensor malfunction, the device provides selectable current sources (0.5 μA, 2 μA, or
10 μA) to act as burn-out current sources. When enabled, one current source sources current to the selected
positive analog input (AINP) while the other current source sinks current from the selected negative analog input
(AINN).
In case of an open circuit in the sensor, these burn-out current sources pull the positive input towards AVDD and
the negative input towards AVSS, resulting in a full-scale reading. A full-scale reading may also indicate that the
sensor is overloaded or that the reference voltage is absent. A near-zero reading may indicate a shorted sensor.
The absolute value of the burn-out current sources typically varies by ±10% and the internal multiplexer adds a
small series resistance. Therefore, distinguishing a shorted sensor condition from a normal reading can be
difficult, especially if an RC filter is used at the inputs. In other words, even if the sensor is shorted, the voltage
drop across the external filter resistance and the residual resistance of the multiplexer causes the output to read
a value higher than zero.
The ADC readings of a functional sensor may be corrupted when the burn-out current sources are enabled. TI
recommends disabling the burn-out current sources when performing the precision measurement, and only
enabling them to test for sensor fault conditions.

9.3.10 Bias Voltage Generation

A selectable bias voltage is provided for use with unbiased thermocouples. The bias voltage is (AVDD + AVSS) /
2 and can be applied to any analog input channel through the internal input multiplexer. The bias voltage turnon
times for different sensor capacitances are listed in Table 12.
The internal bias voltage generator, when selected on multiple channels, causes them to be internally shorted.
Because of this, take care to limit the amount of current that may flow through the device. TI recommends that
under no circumstances should more than 5 mA be allowed to flow through this path. This applies when the
device is in operation and when it is powered down.

Table 12. Bias Voltage Settling Time

SENSOR CAPACITANCE SETTLING TIME
0.1 μF 220 μs
1 μF 2.2 ms
10 μF 22 ms
200 μF 450 ms

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9.3.11 General-Purpose Digital I/O

The ADS1248 has eight pins and the ADS1247 has four pins that serve a dual purpose as either analog inputs
or general-purpose digital inputs and outputs (GPIOs).
Three registers control the function of the GPIO pins. Use the GPIO configuration register (IOCFG) to enable a
pin as a GPIO pin. The GPIO direction register (IODIR) configures the GPIO pin as either an input or an output.
Finally, the GPIO data register (IODAT) contains the GPIO data. If a GPIO pin is configured as an input, the
respective IODAT[x] bit reads the status of the pin; if a GPIO pin is configured as an output, write the output
status to the respective IODAT[x] bit. For more information about the use of GPIO pins, please see the ADS1247
and ADS1248 Detailed Register Definitions section.
Figure 69 shows a diagram of how these functions are combined onto a single pin. Note that when the pin is
configured as a GPIO, the corresponding logic is powered from AVDD and AVSS. When the ADS1247 and
ADS1248 are operated with bipolar analog supplies, the GPIO outputs bipolar voltages. Care must be taken
loading the GPIO pins when used as outputs because large currents can cause droop or noise on the analog
supplies.
IOCFG
IODIR

DIO WRITE
REFx0/GPIOx
AINx/GPIOx
To Analog Mux

DIO READ

Figure 69. Analog and Data Interface Pin

9.3.12 System Monitor

The ADS1247 and ADS1248 provide a system monitor function. This function can measure the analog power
supply, digital power supply, external voltage reference, or ambient temperature. Note that the system monitor
function provides a coarse result. When the system monitor is enabled, the analog inputs are disconnected.

9.3.12.1 Power-Supply Monitor

The system monitor can measure the analog or digital power supply. When measuring the power supply (VSP),
the resulting conversion is approximately 1/4 of the actual power supply voltage, as shown in Equation 15.
Conversion Result = (VSP / 4) / VREF (15)

9.3.12.2 External Voltage Reference Monitor

The ADC can measure the external voltage reference. In this configuration, the monitored external voltage
reference (VREX) is connected to the analog input. The result (conversion code) is approximately 1/4 of the actual
reference voltage, as shown in Equation 16.
Conversion Result = (VREX / 4) / VREF (16)

NOTE
The internal reference voltage must be enabled when measuring an external voltage
reference using the system monitor.

9.3.12.3 Ambient Temperature Monitor

On-chip diodes provide temperature-sensing capability. When selecting the temperature monitor function, the
anodes of two diodes are connected to the ADC. Typically, the difference in diode voltage is 118 mV at
TA = 25°C with a temperature coefficient of 405 μV/°C.

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9.4 Device Functional Modes

9.4.1 Power Up
When DVDD is powered up, the internal power-on reset module generates a pulse that resets all digital circuitry.
All the digital circuits are held in a reset state for 216 system clocks to allow the analog circuits and the internal
digital power supply to settle. SPI communication cannot occur until the internal reset is released.

9.4.2 Reset
When the RESET pin goes low, the device is immediately reset. All registers are restored to default values. The
device stays in reset mode as long as the RESET pin stays low. When the RESET pin goes high, the ADC
comes out of reset mode and is able to convert data. After the RESET pin goes high, and when the system clock
frequency is 4.096 MHz, the digital filter and the registers are held in a reset state for 0.6 ms when
fCLK = 4.096 MHz. Therefore, valid SPI communication can only be resumed 0.6 ms after the RESET pin goes
high; see Figure 4. When the RESET pin goes low, the clock selection is reset to the internal oscillator.
A reset can also be performed by the RESET command through the serial interface and is functionally the same
as using the RESET pin. For information about using the RESET command, see RESET (0000 011X).

9.4.3 Power-Down Mode

Power consumption is reduced to a minimum by placing the device into power-down mode. There are two ways
to put the device into power-down mode: using the SLEEP command and taking the START pin low.
During power-down mode, the internal reference status depends on the setting of the VREFCON bits in the
MUX1 register; see Register Maps for details.

9.4.4 Conversion Control

The START pin provides precise control of conversions. Pulse the START pin high to begin a conversion, as
shown in Figure 70 and Table 13. The conversion completion is indicated by the DRDY pin going low and with
the DOUT/DRDY pin when the DRDY MODE bit is 1 in the IDAC0 register. When the conversion completes, the
device automatically powers down. During power down, the conversion result can be retrieved; however, START
must be taken high before communicating with the configuration registers. The device stays powered down until
the START pin is returned high to begin a new conversion. When the START pin is returned high, the decimation
filter is held in a reset state for 32 modulator clock cycles internally to allow the analog circuits to settle.
Holding the START pin high will configure the device to continuously convert as shown in Figure 71.

tSTART

START

tCONV

DOUT/DRDY

1 2 3 24

SCLK

DRDY

ADS1246/47/48 Power Down

Converting
Status

Figure 70. Timing for Single Conversion Using the Start Pin

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Table 13. Start Pin Conversion Times for Figure 70 (1)

SYMBOL DESCRIPTION DATA RATE (SPS) VALUE UNIT
5 200.295 ms
10 100.644 ms
20 50.825 ms
40 25.169 ms

Time from the START rising edge to DRDY and 80 12.716 ms

tCONV
DOUT/DRDY going low 160 6.489 ms
320 3.247 ms
640 1.692 ms
1000 1.138 ms
2000 0.575 ms

(1) For fCLK = 4.096MHz

START
Data Ready Data Ready Data Ready

DOUT/DRDY

ADS1246/47/48
Converting Converting Converting Converting
Status

NOTE: SCLK held low in this example.

Figure 71. Timing for Conversion With Start Pin High

With the START pin held high, the ADC converts the selected input channels continuously. This configuration
continues until the START pin is taken low. The START pin can also be used to perform synchronized
measurements for multi-channel applications by pulsing the START pin. With multiple devices, if each device
receives the START pin pulse at the same time, all devices start a conversion on the rise of the start pin. If all
devices are operating with the same data rate, all of the devices complete the conversion at the same time.
Conversions can also be initiated through SPI commands as well. Similar to using the START pin, the device can
be put into a power-down mode using the SLEEP command. Functionally, this is similar to taking the START pin
low. To initiate a conversion, the WAKEUP command powers up the ADC and starts a conversion, similar to
returning the START pin high. Note that the START pin must be held high to use commands to control
conversions. Do not combine using the START pin and using commands to control conversions.
Also, sending a SYNC command immediately starts a new ADC conversion. For the SYNC command, the digital
filter is reset, starting a new conversion without completing the previous conversion. This is useful in
synchronizing conversions from multiple devices or maintaining periodic timing from multiple channels.
Similarly, writing to any of the first four registers (MUX0, VBIAS, MUX1, or SYS0; addresses 00h to 04h)
automatically resets the digital filter. A change in any of these registers makes the appropriate setup change in
the device, but also restarts the conversion similar to a SYNC command.

9.4.4.1 Settling Time for Channel Multiplexing

The device is a true single-cycle settling ΔΣ converter. The first data available after the start of a conversion are
fully settled and valid for use, provided that the input signal has settled to its final result. The time required to
settle is roughly equal to the inverse of the data rate. The exact time depends on the specific data rate and the
operation that resulted in the start of a conversion; see Table 14 for specific values.

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9.4.4.2 Channel Cycling and Overload Recovery

When cycling through channels, take care when configuring the device to ensure that settling occurs within one
cycle. For setups that cycle through MUX channels, but do not change PGA and data rate settings, changing the
MUX0 register is sufficient. However, when changing PGA and data rate settings, ensure that an overloaded
condition cannot occur during the transmission. When configuration register data are transferred to the device,
new settings become active at the end of each register byte sent. Therefore, a brief overload condition can occur
during the transmission of configuration data after the completion of the MUX0 byte and before completion of the
SYS0 byte. This temporary overload can result in intermittent incorrect readings. To ensure that an overload
does not occur, it may be necessary to split the communication into two separate communications allowing the
change of the SYS0 register before the change of the MUX0 register.
In the event of an overloaded state, take care to ensure single-cycle settling into the next cycle. Because the
device implements a chopper-stabilized PGA, changing data rates during an overload state can cause the
chopper to become unstable. This instability results in slow settling time. To prevent this slow settling, always
change the PGA setting or MUX setting to a non-overloaded state before changing the data rate.

9.4.4.3 Single-Cycle Settling

The ADS1246, ADS1247, and ADS1248 are capable of single-cycle settling across all gains and data rates.
However, to achieve single-cycle settling at 2 kSPS, special care must be taken with respect to the interface
using WREG to change a configuration register. When operating at 2 kSPS, the SCLK period must not exceed
520 ns, and the time between the beginning of writing a register byte data and the beginning of a subsequent
register byte data must not exceed 4.2 µs. Additionally, when performing multiple individual write commands to
the first four registers, wait at least 64 system clocks before initiating another write command.

9.4.4.4 Digital Filter Reset Operation

Apart from the RESET command and the RESET pin, the digital filter is reset automatically when either a write
operation to the MUX0, VBIAS, MUX1, or SYS0 registers is performed, when a SYNC command is issued, or the
START pin is taken high.
The filter is reset four system clocks (tCLK) after the falling edge of the seventh SCLK of the SYNC command.
Similarly, if any write operation takes place in the MUX0 register, regardless of whether the register value
changed or not, the filter is reset after the completion of the MUX0 write.
If any write activity takes place in the VBIAS, MUX1, or SYS0 registers, regardless of whether the register value
changed or not, the filter is reset. The reset pulse lasts for 32 modulator clocks after the completion of the write
operation. If there are multiple write operations, the resulting reset pulse may be viewed as the ANDed result of
the different active low pulses created individually by each action.
Table 14 shows the conversion time after a filter reset. Note that this time depends on the operation initiating the
reset. Also, the first conversion after a filter reset has a slightly different time than the second and subsequent
conversions.

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Table 14. Data Conversion Time

FIRST DATA CONVERSION TIME AFTER FILTER RESET
HARDWARE RESET, RESET SECOND AND SUBSEQUENT
COMMAND, START PIN HIGH, CONVERSION TIME AFTER
SYNC COMMAND, MUX0
WAKEUP COMMAND, VBIAS, FILTER RESET
NOMINAL EXACT DATA REGISTER WRITE
MUX1, or SYS0 REGISTER
DATA RATE RATE
WRITE
(SPS) (SPS)
NO. OF NO. OF NO. OF
SYSTEM SYSTEM SYSTEM
(ms) (1) (ms) (1) (ms) (1)
CLOCK CLOCK CLOCK
CYCLES CYCLES CYCLES
5 5.019 199.258 816160 200.26 820265 199.250 816128
10 10.038 99.633 408096 100.635 412201 99.625 408064
20 20.075 49.820 204064 50.822 208169 49.812 204032
40 40.151 24.92 102072 25.172 103106 24.906 102016
80 80.301 12.467 51064 12.719 52098 12.453 51008
160 160.602 6.240 25560 6.492 26594 6.226 25504
320 321.608 3.124 12796 3.25 13314 3.109 12736
640 643.216 1.569 6428 1.695 6946 1.554 6368
1000 1000 1.014 4156 1.141 4674 1 4096
2000 2000 0.514 2108 0.578 2370 0.5 2048

(1) For fCLK = 4.096 MHz.

9.4.5 Calibration
The conversion data are scaled by offset and gain registers before yielding the final output code. As shown in
Figure 72, the output of the digital filter is first subtracted by the offset register (OFC) and then multiplied by the
full-scale register (FSC) to digitally scale the gain. A digital clipping circuit ensures that the output code does not
exceed 24 bits. Equation 17 shows the scaling.

+
Output Data Final
ADC S ´
Clipped to 24 Bits Output
-

OFC FSC Register

Register 400000h

Figure 72. Calibration Block Diagram

FSC[2:0]
Final Output Data = (Input - OFC[2:0]) ´
400000h (17)
The values of the offset and full-scale registers are set by writing to them directly, or they are set automatically
by calibration commands.
The offset and gain calibration features are intended for correction of minor system level offset and gain errors.
When entering manual values into the calibration registers, care must be taken to avoid scaling down the gain
register to values far below a scaling factor of 1.0. Under extreme situations it is possible to over-range the ADC.
Avoid encountering situations where analog inputs are connected to voltages greater than VREF / gain.
Take care when increasing digital gain with the FSC. When implementing custom digital gains less than 20%
higher than nominal and offsets less than 40% of full scale, no special care is required. When operating at digital
gains greater than 20% higher than nominal and offsets greater than 40% of full scale, make sure that the offset
and gain registers follow the conditions of Equation 18.
2V
1.251 V ! Offset Scaling
Gain Scaling (18)

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9.4.5.1 Offset Calibration Register: OFC[2:0]

The offset calibration register is a 24-bit word, composed of three 8-bit registers. The offset is in twos
complement format with a maximum positive value of 7FFFFFh and a maximum negative value of 800000h. This
value is subtracted from the conversion data. A register value of 000000h provides no offset correction. Note that
while the offset calibration register value can correct offsets ranging from –FS to +FS (as shown in Table 15),
avoid overloading the analog inputs.

Table 15. Final Output Code versus Offset Calibration Register Setting
OFFSET REGISTER FINAL OUTPUT CODE WITH VIN = 0 (1)
7FFFFFh 800000h
000001h FFFFFFh
000000h 000000h
FFFFFFh 000001h
800000h 7FFFFFh

(1) Excludes effects of noise and inherent offset errors.

9.4.5.2 Full-Scale Calibration Register: FSC[2:0]
The full-scale or gain calibration register is a 24-bit word composed of three 8-bit registers. The full-scale
calibration value is 24-bit, straight binary, normalized to 1.0 at code 400000h. Table 16 summarizes the scaling
of the full-scale register. Note that while the full-scale calibration register can correct gain errors > 1 (with gain
scaling < 1), make sure to avoid overloading the analog inputs. The default or reset value of FSC depends on the
PGA gain setting. A different factory-trimmed FSC reset value is stored for each PGA gain setting which provides
gain accuracy over all the device input ranges.

NOTE
The factory-trimmed FSC reset value loads automatically whenever the PGA gain setting
changes.

Table 16. Gain Correction Factor versus Full-Scale Calibration Register Setting
FULL-SCALE REGISTER GAIN SCALING
800000h 2.0
400000h 1.0
200000h 0.5
000000h 0

9.4.5.3 Calibration Commands

The device provides commands for three types of calibration: system gain calibration, system offset calibration
and self offset calibration. Where absolute accuracy is needed, TI recommends performing a calibration after
power up, a change in temperature, a change of gain, and in some cases a change in channel. At the completion
of calibration, the DRDY signal goes low indicating the calibration has completed. The first data after calibration
are always valid. If the START pin is taken low or a SLEEP command is issued after any calibration command,
the device powers down after completing calibration.
After a calibration has started, allow the calibration to complete before issuing any other commands (other than
the SLEEP command). Issuing commands during a calibration can result in corrupted data. If this occurs, either
resend the calibration command that was aborted or issue a device reset.

9.4.5.3.1 System Offset and Self Offset Calibration

System offset calibration corrects both internal and external offset errors. The system offset calibration is initiated
by sending the SYSOCAL command while applying a zero differential input (VIN = 0) to the selected analog
inputs while the inputs are within the input common-mode range, ideally at mid-supply.

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The self offset calibration is initiated by sending the SELFOCAL command. During self offset calibration, the
selected inputs are disconnected from the internal circuitry and a zero differential signal is applied internally,
connecting the inputs to mid-supply. With both offset calibrations the offset calibration register (OFC) is updated
afterwards. When either offset calibration command is issued, the device stops the current conversion and starts
the calibration procedure immediately. An offset calibration should be performed before a gain calibration.

9.4.5.3.2 System Gain Calibration

System gain calibration corrects for gain error in the signal path. The system gain calibration is initiated by
sending the SYSGCAL command while applying a full-scale input to the selected analog inputs. Afterwards the
full-scale calibration register (FSC) is updated. When a system gain calibration command is issued, the device
stops the current conversion and starts the calibration procedure immediately.

9.4.5.4 Calibration Timing

When calibration is initiated, the device performs 16 consecutive data conversions and averages the results to
calculate the calibration value. This provides a more accurate calibration value. The time required for calibration
is shown in Table 17 and can be calculated using Equation 19:
50 32 16
Calibration Time t CAL
fCLK fMOD fDATA

where fDATA is the data rate. (19)

Table 17. Calibration Time Versus Data Rate

DATA RATE CALIBRATION TIME (tCAL)
(SPS) (ms) (1)
5 3201.01
10 1601.01
20 801.012
40 400.26
80 200.26
160 100.14
320 50.14
640 25.14
1000 16.14
2000 8.07

(1) For fCLK = 4.096 MHz.

9.5 Programming
9.5.1 Serial Interface
The device provides an SPI-compatible serial communication interface plus a data ready signal (DRDY).
Communication is full-duplex with the exception of a few limitations in regards to the RREG command and the
RDATA command. These limitations are explained in detail in Commands. For the basic serial interface timing
characteristics, see Figure 1 and Figure 2 of this document.

9.5.1.1 Chip Select (CS)

The CS pin activates SPI communication. CS must be low before data transactions and must stay low for the
entire SPI communication period. When CS is high, the DOUT/DRDY pin enters a high-impedance state.
Therefore, reading and writing to the serial interface are ignored and the serial interface is reset. DRDY pin
operation is independent of CS. DRDY will still indicate that a new conversion has completed and is forced high
as a response to SCLK, even if CS is high.
Taking CS high deactivates only the SPI communication with the device. Data conversion continues and the
DRDY signal can be monitored to check if a new conversion result is ready. A master device monitoring the
DRDY signal can select the appropriate slave device by pulling the CS pin low.

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Programming (continued)
9.5.1.2 Serial Clock (SCLK)
SCLK provides the clock for serial communication. SCLK is a Schmitt-trigger input, but TI recommends keeping
SCLK as free from noise as possible to prevent glitches from inadvertently shifting the data. Data are shifted into
DIN on the falling edge of SCLK and shifted out of DOUT on the rising edge of SCLK.

9.5.1.3 Data Input (DIN)

DIN is used along with SCLK to send data to the device. Data on DIN are shifted into the device on the falling
edge of SCLK.
The communication of this device is full-duplex in nature. The device monitors commands shifted in even when
data are being shifted out. Data that are present in the output shift register are shifted out when sending in a
command. Therefore, make sure that whatever is being sent on the DIN pin is valid when shifting out data. When
no command is to be sent to the device when reading out data, send the NOP command on DIN.

9.5.1.4 Data Ready (DRDY)

The DRDY pin goes low to indicate a new conversion is complete, and the conversion result is stored in the
conversion result buffer. SCLK must be held low for tDTS after the DRDY low transition (see Figure 2) so that the
conversion result is loaded into both the result buffer and the output shift register. Therefore, issue no commands
during this time frame if the conversion result is to be read out later. This constraint applies only when CS is
asserted and the device is in RDATAC mode. When CS is not asserted, SPI communication with other devices
on the SPI bus does not affect loading of the conversion result. After the DRDY pin goes low, it is forced high on
the first falling edge of SCLK (so that the DRDY pin can be polled for 0 instead of waiting for a falling edge). If
the DRDY pin is not taken high by clocking in SCLKs after it falls low, a short high pulse for a duration of tPWH
indicates new data are ready.

9.5.1.5 Data Output and Data Ready (DOUT/DRDY)

The DOUT/DRDY pin has two modes: data out (DOUT) only, or DOUT combined with data ready (DRDY). The
DRDY MODE bit determines the function of this pin and can be found in the ID register in the ADS1246 and the
IDAC0 register in the ADS1247 and ADS1248. In either mode, the DOUT/DRDY pin goes to a high-impedance
state when CS is taken high.
When the DRDY MODE bit is set to 0, this pin functions as DOUT only. Data are clocked out on the rising edge
of SCLK, MSB first (as shown in Figure 73).
When the DRDY MODE bit is set to 1, this pin functions as both DOUT and DRDY. Data are shifted out as with
DOUT, but the pin adds the DRDY function. Note that this mode will not be operational when the device is in
stop read data continuous mode when the SDATAC command is given.
The DRDY MODE bit modifies only the DOUT/DRDY pin functionality. The DRDY pin functionality remains
unaffected.

SCLK 1 2 3 22 23 24 1 2 8

DOUT/DRDY(1) D[23] D[22] D[21] D[2] D[1] D[0]

DRDY

(1) CS tied low.

Figure 73. Data Retrieval with the DRDY MODE Bit = 0 (Disabled)

When the DRDY MODE bit is enabled and a new conversion is complete, DOUT/DRDY goes low if it is high. If it
is already low, then DOUT/DRDY goes high and then goes low (as shown in Figure 74). Similar to the DRDY pin,
a falling edge on the DOUT/DRDY pin signals that a new conversion result is ready. After DOUT/DRDY goes
low, the data can be clocked out by providing 24 SCLKs if the device is in read data continuous mode. In order to
force DOUT/DRDY high (so that DOUT/DRDY can be polled for a 0 instead of waiting for a falling edge), a no

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Programming (continued)
operation command (NOP) or any other command that does not load the data output register can be sent after
reading out the data. Because SCLKs can only be sent in multiples of eight, a NOP can be sent to force
DOUT/DRDY high if no other command is pending. The DOUT/DRDY pin goes high after the first rising edge of
SCLK after reading the conversion result completely (as shown in Figure 75). The same condition also applies
after an RREG command. After all the register bits have been read out, the first rising edge of SCLK forces
DOUT/DRDY high. Figure 76 shows an example where sending an extra NOP command after reading out a
register with an RREG command forces the DOUT/DRDY pin high.

SCLK 1 2 3 22 23 24 1 2 24

DOUT/DRDY(1) D[23] D[22] D[21] D[2] D[1] D[0] D[23] D[22] D[0]

DIN NOP NOP NOP

DRDY

(1) CS tied low.

Figure 74. Data Retrieval with the DRDY MODE Bit = 1 (Enabled)

SCLK 1 2 3 22 23 24 1 2 8 1 2 24

DOUT/DRDY(1) D[23] D[22] D[21] D[2] D[1] D[0] D[23] D[22] D[0]

DIN NOP NOP NOP

DRDY

(1) DRDY MODE bit enabled, CS tied low.

Figure 75. DOUT/DRDY Forced High after Retrieving the Conversion Result

SCLK 1 2 8 1 2 8 1 2 8 1 2 8

DOUT/DRDY(1) XXh

DIN RREG 00h NOP NOP

(1) DRDY MODE bit enabled, CS tied low.

Figure 76. DOUT/DRDY Forced High after Reading Register Data

9.5.1.6 SPI Reset

SPI communication is reset in several ways. To reset the serial interface (without resetting the registers or the
digital filter), the CS pin can be pulled high. Taking the RESET pin low resets the serial interface along with all
the other digital functions. It will also return all registers to their default values and start a new conversion.
In systems where CS is tied low permanently, register writes must always be fully completed in 8-bit increments.
If a glitch on SCLK disrupts SPI communications, commands will not be recognized by the device. The device
implements a timeout function for all listed commands in the event that data are corrupted and the CS pin is
permanently tied low. The SPI timeout will reset the interface if idle for 64 conversion cycles.

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Programming (continued)
9.5.1.7 SPI Communication During Power-Down Mode
When the START pin is low or the device is in power-down mode, only the RDATA, RDATAC, SDATAC,
WAKEUP, and NOP commands can be issued. The RDATA command can be used to repeatedly read the last
conversion result during power-down mode. Other commands do not function because the internal clock is shut
down to save power during power-down mode.

9.5.2 Data Format

The device provides 24 bits of data in binary twos complement format. The size of one code (LSB) is calculated
using Equation 20.
1 LSB = (2 × VREF / Gain) / 224 = +FS / 223 (20)
A positive full-scale (FS) input [VIN ≥ (+FS – 1 LSB) = (VREF / Gain – 1 LSB)] produces an output code of
7FFFFFh and a negative full-scale input (VIN ≤ –FS = –VREF / Gain) produces an output code of 800000h. The
output clips at these codes for signals that exceed full-scale. Table 18 summarizes the ideal output codes for
different input signals.

Table 18. Ideal Output Code vs Input Signal

INPUT SIGNAL, VIN
IDEAL OUTPUT CODE (1)
(AINP – AINN)
≥ FS (223 – 1) / 223 7FFFFFh
23
FS / 2 000001h
0 000000h
–FS / 223 FFFFFFh
≤ –FS 800000h

(1) Excludes effects of noise, linearity, offset, and gain errors.

Mapping of the analog input signal to the output codes is shown in Figure 77.

7FFFFFh
7FFFFEh
¼
Output Code

000001h
000000h
FFFFFFh
¼

800001h
800000h

-FS ¼ 0 ¼ FS
Input Voltage VIN
23 23
2 -1 2 -1
-FS FS
23 23
2 2

Figure 77. Code Transition Diagram

9.5.3 Commands
The device offers 13 commands to control device operation as shown in Table 19. Some of the commands are
stand-alone commands (WAKEUP, SLEEP, SYNC, RESET, SYSOCAL, SYSGCAL, and SELFOCAL). There are
three additional commands used to control the read of data from the device (RDATA, RDATAC, and SDATAC).
The commands to read (RREG) and write (WREG) configuration register data from and to the device require
additional information as part of the instruction. A no-operation command (NOP) can be used to clock out data
from the device without clocking in a command.
Operands:
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• n = number of registers to be read or written (number of bytes – 1)

• r = register (0 to 15)
• x = don't care

Table 19. SPI Commands

(1)
COMMAND DESCRIPTION 1st COMMAND BYTE 2nd COMMAND BYTE
WAKEUP Exit power-down mode 0000 000x (00h, 01h)
SLEEP Enter power-down mode 0000 001x (02h, 03h)
SYNC Synchronize ADC conversions 0000 010x (04h, 05h) 0000 010x (04,05h)
RESET Reset to default values 0000 011x (06h, 07h)
NOP No operation 1111 1111 (FFh)
RDATA Read data once 0001 001x (12h, 13h)
RDATAC Read data continuous mode 0001 010x (14h, 15h)
SDATAC Stop read data continuous mode 0001 011x (16h, 17h)
RREG Read from register rrrr 0010 rrrr (2xh) 0000 nnnn
WREG Write to register rrrr 0100 rrrr (4xh) 0000 nnnn
SYSOCAL System offset calibration 0110 0000 (60h)
SYSGCAL System gain calibration 0110 0001 (61h)
SELFOCAL Self offset calibration 0110 0010 (62h)
Restricted command.
Restricted 1111 0001 (F1h)
Never send to the device.

(1) When the START pin is low or the device is in power-down mode, only the RDATA, RDATAC, SDATAC, WAKEUP, and NOP
commands can be issued.

9.5.3.1 WAKEUP (0000 000x)

Use the WAKEUP command to power up the device after a SLEEP command. After execution of the WAKEUP
command, the device powers up on the falling edge of the eighth SCLK.

9.5.3.2 SLEEP (0000 001x)

The SLEEP command places the device into power-down mode. When the SLEEP command is issued, the
device completes the current conversion and then goes into power-down mode. Note that this command does
not automatically power down the internal voltage reference; see the VREFCON bits in MUX1 for each device for
further details.
To exit power-down mode, issue the WAKEUP command. Single conversions can be performed by issuing a
WAKEUP command followed by a SLEEP command.
Both WAKEUP and SLEEP are the software command equivalents of using the START pin to control the device,
as shown in Figure 78.

NOTE
If the START pin is held low, a WAKEUP command will not power up the device. When
using the SLEEP command, CS must be held low for the duration of the power-down
mode.

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CS
SLEEP WAKEUP

DIN 0000 001X 0000 000X

1 8
SCLK

DRDY

Status Normal Mode Power-down Mode Normal Mode

Finish Current Conversion Start New Conversion

Figure 78. SLEEP and WAKEUP Commands Operation

9.5.3.3 SYNC (0000 010x)

The SYNC command resets the ADC digital filter and starts a new conversion. The DRDY pin from multiple
devices connected to the same SPI bus can be synchronized by issuing a SYNC command to all of devices
simultaneously.
SYNC

DIN 0000 010X 0000 010X

1 7 8 Synchronization
SCLK Occurs Here

4 tCLK

Figure 79. SYNC Command Operation

9.5.3.4 RESET (0000 011X)

The RESET command restores the registers to the respective default values. This command also resets the
digital filter. RESET is the command equivalent of using the RESET pin to reset the device. However, the
RESET command does not reset the serial interface. If the RESET command is issued when the serial interface
is out of synchonization due to a glitch on SCLK, the device does not reset. The CS pin can be used to reset the
serial interface first, and then a RESET command can be issued to reset the device. The RESET command
holds the registers and the decimation filter in a reset state for 0.6 ms when the system clock frequency is 4.096
MHz, similar to the hardware reset. Therefore, SPI communication can be only be started 0.6 ms after the
RESET command is issued, as shown in Figure 80.

DIN ANY SPI

RESET
COMMAND
1 7 8 1 8
SCLK

4 tCLK 0.6 ms

Figure 80. SPI Communication after an SPI Reset

9.5.3.5 RDATA (0001 001x)

The RDATA command loads the most recent conversion result into the output register. After issuing this
command, the conversion result is read out by sending 24 SCLKs, as shown in Figure 81. This command also
works in RDATAC mode.

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DRDY
RDATA
DIN 0001 001X NOP NOP NOP

DOUT MSB Mid-Byte LSB

SCLK
1 8 1 24

Figure 81. Read Data Once

When performing multiple reads of the conversion result, the RDATA command can be sent when the last eight
bits of the conversion result are being shifted out during the course of the first read operation by taking
advantage of the duplex communication nature of the serial interface, as shown in Figure 82.
1 2 7 8 9 10 23 24 1 2 23 24

SCLK

DOUT D[23] D[22] D[17] D[16] D[15] D[14] D[1] D[0] D[23] D[22] D[1] D[0]

DIN NOP NOP NOP RDATA NOP NOP

DRDY

Figure 82. Using RDATA in Full-Duplex Mode

9.5.3.6 RDATAC (0001 010x)

The RDATAC command enables read data continuous mode. This is the default mode after a power up or reset.
In read data continuous mode, new conversion results are automatically loaded onto DOUT. The conversion
result can be received from the device after the DRDY signal goes low by sending 24 SCLKs. It is not necessary
to read back all the bits, as long as the number of bits read out is a multiple of eight. The RDATAC command
must be issued after DRDY goes low, and the command takes effect on the next DRDY.
Be sure to complete data retrieval (conversion result or register read-back) before DRDY returns low, or the
resulting data will be corrupt. Successful register read operations in RDATAC mode require the knowledge of
when the next DRDY falling edge occurs.

DRDY
RDATAC
DIN 0001 010X NOP

DOUT 24 Bits

SCLK

1 8 1 24

Figure 83. Read Data Continuously

9.5.3.7 SDATAC (0001 011x)

The SDATAC command terminates read data continuous mode. In stop read data continuous mode, the
conversion result is not automatically loaded onto DOUT when DRDY goes low, and register read operations can
be performed without interruption from new conversion results being loaded into the output shift register. Use the
RDATA command to retrieve conversion data. The SDATAC command takes effect after the next DRDY.

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If DRDY is not actively monitored for data conversions, the stop read data continuous mode is the preferred
method of reading data. In this mode, a read of ADC data is not interrupted by the completion of a new ADC
conversion.

9.5.3.8 RREG (0010 rrrr, 0000 nnnn)

The RREG command outputs the data from up to 15 registers, starting with the register address specified as part
of the instruction. The number of registers read is one plus the value of the second byte. If the count exceeds the
remaining registers, the addresses wrap back to the beginning. The two byte command structure for RREG is
listed below.
• First Command Byte: 0010 rrrr, where rrrr is the address of the first register to read.
• Second Command Byte: 0000 nnnn, where nnnn is the number of bytes to read –1.
• Byte(s): data read from the registers are clocked out with NOPs.
It is not possible to use the full-duplex nature of the serial interface when reading out the register data. For
example, a SYNC command cannot be issued when reading out the VBIAS and MUX1 data, as shown in
Figure 84. Any command sent during the readout of the register data is ignored. Thus, TI recommends sending
NOPs through DIN when reading out the register data.
1st 2nd
Command Command
Byte Byte
DIN 0010 0001 0000 0001

DOUT VBIAS MUX1

Data Byte Data Byte

Figure 84. Read from Register

9.5.3.9 WREG (0100 rrrr, 0000 nnnn)

The WREG command writes to the registers, starting with the register specified as part of the instruction. The
number of registers that are written is one plus the value of the second byte. The command structure for WREG
is listed below.
• First Command Byte: 0100 rrrr, where rrrr is the address of the first register to be written.
• Second Command Byte: 0000 nnnn, where nnnn is the number of bytes to be written – 1.
• Byte(s): data to be written to the registers.

DIN 0100 0010 0000 0001 MUX1 SYS0

st nd
1 2 Data Data
Command Command Byte Byte

Figure 85. Write to Register

9.5.3.10 SYSOCAL (0110 0000)

The SYSOCAL command initiates a system offset calibration. For a system offset calibration, the inputs must be
externally shorted to a voltage within the input common mode range. The inputs should be near the mid-supply
voltage of (AVDD + AVSS) / 2. The OFC register is updated when the command completes. Timing for the
calibration commands can be found in Figure 86.

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Calibration Calibration
Starts Complete

DRDY tCAL

CALIBRATION
DIN
COMMAND
1 8
SCLK

4 tCLK

Figure 86. Calibration Command

9.5.3.11 SYSGCAL (0110 0001)

The SYSGCAL command initiates the system gain calibration. For a system gain calibration, the input should be
set to full-scale. The FSC register is updated after this operation. Timing for the calibration commands can be
found in Figure 86.

9.5.3.12 SELFOCAL (0110 0010)

The SELFOCAL command initiates a self offset calibration. The device internally shorts the inputs to mid-supply
and performs the calibration. The OFC register is updated after this operation. Timing for the calibration
commands can be found in Figure 86.

9.5.3.13 NOP (1111 1111)

This is a no-operation command. This is used to clock out data without clocking in a command.

9.5.3.14 Restricted Command (1111 0001)

This is a restricted command. This command should never be issued to the device.

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9.6 Register Maps

9.6.1 ADS1246 Register Map

Table 20. ADS1246 Register Map

ADDRESS REGISTER BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
00h BCS BCS[1:0] 0 0 0 0 0 1
01h VBIAS 0 0 0 0 0 0 VBIAS[1:0]
02h MUX1 CLKSTAT 0 0 0 0 MUXCAL[2:0]
03h SYS0 0 PGA[2:0] DR[3:0]
04h OFC0 OFC[7:0]
05h OFC1 OFC[15:8]
06h OFC2 OFC[23:16]
07h FSC0 FSC[7:0]
08h FSC1 FSC[15:8]
09h FSC2 FSC[23:16]
DRDY
0Ah ID ID[3:0] 0 0 0
MODE

9.6.2 ADS1246 Detailed Register Definitions

9.6.2.1 BCS—Burn-out Current Source Register (offset = 00h) [reset = 01h]

These bits control the sensor burn-out detect current source.
Figure 87. Burn-out Current Source Register
7 6 5 4 3 2 1 0
BCS[1:0] 0 0 0 0 0 1
R/W-0h R-0h R-0h R-0h R-0h R-0h R-1h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 21. Burn-out Current Source Register Field Descriptions

Bit Field Type Reset Description
7:6 BCS[1:0] R/W 0h Burn-out Detect Current Source
These bits control the setting of the sensor burn-out detect
current source
00: Burn-out current source off (default)
01: Burn-out current source on, 0.5 μA
10: Burn-out current source on, 2 μA
11: Burn-out current source on, 10 μA
5:0 RESERVED R 01h Reserved
Always write 000001

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9.6.2.2 VBIAS—Bias Voltage Register (offset = 01h) [reset = 00h]

This register enables a bias voltage on the analog inputs.
Figure 88. Bias Voltage Register
7 6 5 4 3 2 1 0
0 0 0 0 0 0 VBIAS[1:0]
R-0h R-0h R-0h R-0h R-0h R-0h R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 22. Bias Voltage Register Field Descriptions

Bit Field Type Reset Description
7:2 RESERVED R 00h Reserved
Always write 000000
1 VBIAS[1] R/W 0h VBIAS[1] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AINN
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AINN
0 VBIAS[0] R/W 0h VBIAS[0] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AINP
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AINP

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9.6.2.3 MUX—Multiplexer Control Register (offset = 02h) [reset = x0h]

Figure 89. Multiplexer Control Register

7 6 5 4 3 2 1 0
CLKSTAT 0 0 0 0 MUXCAL[2:0]
R-xh R-0h R-0h R-0h R-0h R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 23. Multiplexer Control Register Field Descriptions

Bit Field Type Reset Description
7 CLKSTAT R xh Clock status
This bit is read-only and indicates whether the internal oscillator
or external clock is being used.
0: Internal oscillator in use
1: External clock in use
6:3 RESERVED R 0h Reserved
Always write 0000
2:0 MUXCAL R/W 0h System Monitor Control
These bits are used to select a system monitor. The MUXCAL
selection supercedes the selections from the VBIAS register.
000: Normal operation (default)
001: Offset calibration. The analog inputs are disconnected and
AINP and AINN are internally connected to mid-supply (AVDD +
AVSS) / 2.
010: Gain calibration. The analog inputs are connected to the
voltage reference.
011: Temperature measurement. The inputs are connected to a
diode circuit that produces a voltage proportional to the ambient
temperature of the device.

Table 24 lists the ADC input connection and PGA settings for each MUXCAL setting. The PGA setting reverts to
the original SYS0 register setting when MUXCAL is taken back to normal operation or offset measurement.

Table 24. MUXCAL Settings

MUXCAL[2:0] PGA GAIN SETTING ADC INPUT
000 Set by SYS0 register Normal operation
001 Set by SYS0 register Offset calibration: inputs shorted to mid-supply (AVDD + AVSS) / 2
010 Forced to 1 Gain calibration: V(REFP) – V(REFN) (full-scale)
011 Forced to 1 Temperature measurement diode

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9.6.2.4 SYS0—System Control Register 0 (offset = 03h) [reset = 00h]

Figure 90. System Control Register 0

7 6 5 4 3 2 1 0
0 PGA[2:0] DR[3:0]
R-0h R/W-0h R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 25. System Control Register 0 Field Descriptions

Bit Field Type Reset Description
7 RESERVED R 0h Reserved
This bit must always be set to 0
6:4 PGA[2:0] R/W 0h Gain Setting for PGA
These bits determine the gain of the PGA
000: PGA = 1 (default)
001: PGA = 2
010: PGA = 4
011: PGA = 8
100: PGA = 16
101: PGA = 32
110: PGA = 64
111: PGA = 128
3:0 DR[3:0] R/W 0h Data Output Rate Setting
These bits determine the data output rate of the ADC
0000: DR = 5 SPS (default)
0001: DR = 10 SPS
0010: DR = 20 SPS
0011: DR = 40 SPS
0100: DR = 80 SPS
0101: DR = 160 SPS
0110: DR = 320 SPS
0111: DR = 640 SPS
1000: DR = 1000 SPS
1001 to 1111: DR = 2000 SPS

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9.6.2.5 OFC—Offset Calibration Coefficient Registers (offset = 04h, 05h, 06h) [reset = 00h, 00h, 00h]
These bits make up the offset calibration coefficient register of the ADS1246.
Figure 91. Offset Calibration Coefficient Registers
7 6 5 4 3 2 1 0
OFC[7:0]
R/W-00h
15 14 13 12 11 10 9 8
OFC[15:8]
R/W-00h
23 22 21 20 19 18 17 16
OFC[23:16]
R/W-00h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 26. Offset Calibration Coefficient Register Field Descriptions

Bit Field Type Reset Description
23:0 OFC[23:0] R/W 000000h Offset Calibration Register
Three registers compose the ADC 24-bit offset calibration word.
The 24-bit word is twos complement format and is internally left-
shifted to align with the ADC 24-bit conversion result. The ADC
subtracts the register value from the conversion result before full
scale operation.

9.6.2.6 FSC—Full-Scale Calibration Coefficient Registers (offset = 07h, 08h, 09h) [reset = PGA
dependent]
These bits make up the full-scale calibration coefficient register. The reset value for FSC is factory-trimmed for
each PGA setting. The factory-trimmed FSC reset value is automatically loaded whenever the PGA setting is
changed.
Figure 92. Full-Scale Calibration Coefficient Registers
7 6 5 4 3 2 4 0
FSC[7:0]
R/W-xxh
15 14 13 12 11 10 9 8
FSC[15:8]
R/W-xxh
23 22 21 20 19 18 17 16
FSC[23:16]
R/W-xxh
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 27. Full-Scale Calibration Coefficient Register Field Descriptions

Bit Field Type Reset Description
23:0 FSC[23:0] R/W xxxxxxh Full-Scale Calibration Register
Three registers compose the ADC 24-bit full-scale calibration
word. The 24-bit word is straight binary. The ADC divides the
register value by the FSC register by 400000h to derive the
scale factor for calibration. After the offset calibration, the ADC
multiplies the scale factor by the conversion result. The factory-
trimmed FSC reset value is automatically loaded whenever the
PGA setting is changed.

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9.6.2.7 ID—ID Register (offset = 0Ah) [reset = x0h]

Figure 93. ID Register

7 6 5 4 3 2 1 0
ID[3:0] DRDY MODE 0 0 0
R-xh R/W-0h R-0h R-0h R-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 28. ID Register Field Descriptions

Bit Field Type Reset Description
7:4 ID[3:0] R xh Revision Identification
Read-only, factory-programmed bits; used for revision
identification.
3 DRDY MODE R/W 0h Data Ready Mode Setting
This bit sets the DOUT/DRDY pin functionality. In either setting
of the DRDY MODE bit, the dedicated DRDY pin continues to
indicate data ready, active low.
0: DOUT/DRDY pin functions only as Data Out (default)
1: DOUT/DRDY pin functions both as Data Out and Data Ready,
active low (1)
2:0 RESERVED R 0h RESERVED
These bits must always be set to 000

(1) Cannot be used in SDATAC mode

9.6.3 ADS1247 and ADS1248 Register Map

Table 29. ADS1247 and ADS1248 Register Map

ADDRESS REGISTER BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
00h MUX0 BCS[1:0] MUX_SP[2:0] MUX_SN[2:0]
01h VBIAS VBIAS[7:0]
02h MUX1 CLKSTAT VREFCON[1:0] REFSELT[1:0] MUXCAL[2:0]
03h SYS0 0 PGA[2:0] DR[3:0]
04h OFC0 OFC[7:0]
05h OFC1 OFC[15:8]
06h OFC2 OFC[23:16]
07h FSC0 FSC[7:0]
08h FSC1 FSC[15:8]
09h FSC2 FSC[23:16]
DRDY
0Ah IDAC0 ID[3:0] IMAG[2:0]
MODE
0Bh IDAC1 I1DIR[3:0] I2DIR[3:0]
0Ch GPIOCFG IOCFG[7:0]
0Dh GPIODIR IODIR[7:0]
0Eh GPIODAT IODAT[7:0]

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9.6.4 ADS1247 and ADS1248 Detailed Register Definitions

9.6.4.1 MUX0—Multiplexer Control Register 0 (offset = 00h) [reset = 01h]

This register allows any combination of differential inputs to be selected on any of the input channels. Note that
this setting can be superceded by the MUXCAL and VBIAS bits.
Figure 94. Multiplexer Control Register 0
7 6 5 4 3 2 1 0
BCS[1:0] MUX_SP[2:0] MUX_SN[2:0]
R/W-0h R/W-0h R/W-1h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 30. Multiplexer Control Register 0 Register Field Descriptions

Bit Field Type Reset Description
7:6 BCS[1:0] R/W 0h Burn-out Detect Current Source Register
These bits control the setting of the sensor burnout detect
current source
00: Burn-out current source off (default)
01: Burn-out current source on, 0.5 μA
10: Burn-out current source on, 2 μA
11: Burn-out current source on, 10 μA
5:3 MUX_SP[2:0] R/W 0h Multiplexer Selection - ADC Positive Input
Positive input channel selection bits
000: AIN0 (default)
001: AIN1
010: AIN2
011: AIN3
100: AIN4 (ADS1248 only)
101: AIN5 (ADS1248 only)
110: AIN6 (ADS1248 only)
111: AIN7 (ADS1248 only)
2:0 MUX_SN[2:0] R/W 1h Multiplexer Selection - ADC Negative Input
Negative input channel selection bits
000: AIN0
001: AIN1 (default)
010: AIN2
011: AIN3
100: AIN4 (ADS1248 only)
101: AIN5 (ADS1248 only)
110: AIN6 (ADS1248 only)
111: AIN7 (ADS1248 only)

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9.6.4.2 VBIAS—Bias Voltage Register (offset = 01h) [reset = 00h]

Figure 95. Bias Voltage Register (ADS1247)
7 6 5 4 3 2 1 0
0 0 0 0 VBIAS[3:0]
R-0h R-0h R-0h R-0h R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 31. Bias Voltage Register Field Descriptions (ADS1247)

Bit Field Type Reset Description
7:4 RESERVED R 0h Reserved
Always write 0000
3 VBIAS[3] R/W 0h VBIAS[3] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AIN3
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AIN3
2 VBIAS[2] R/W 0h VBIAS[2] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AIN2
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AIN2
1 VBIAS[1] R/W 0h VBIAS[1] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AIN1
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AIN1
0 VBIAS[0] R/W 0h VBIAS[0] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AIN0
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AIN0

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Figure 96. Bias Voltage Register (ADS1248)

7 6 5 4 3 2 1 0
VBIAS[7:0]
R/W-00h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 32. Bias Voltage Register Field Descriptions (ADS1248)

Bit Field Type Reset Description
7 VBIAS[7] R/W 0h VBIAS[7] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AIN7
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AIN7
6 VBIAS[6] R/W 0h VBIAS[6] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AIN6
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AIN6
5 VBIAS[5] R/W 0h VBIAS[5] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AIN5
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AIN5
4 VBIAS[4] R/W 0h VBIAS[4] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AIN4
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AIN4
3 VBIAS[3] R/W 0h VBIAS[3] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AIN3
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AIN3
2 VBIAS[2] R/W 0h VBIAS[2] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AIN2
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AIN2
1 VBIAS[1] R/W 0h VBIAS[1] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AIN1
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AIN1
0 VBIAS[0] R/W 0h VBIAS[0] Voltage Enable
A bias voltage of mid-supply (AVDD + AVSS) / 2 is applied to
AIN0
0: Bias voltage is not enabled (default)
1: Bias voltage is applied to AIN0

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9.6.4.3 MUX1—Multiplexer Control Register 1 (offset = 02h) [reset = x0h]

Figure 97. Multiplexer Control Register 1
7 6 5 4 3 2 1 0
CLKSTAT VREFCON[1:0] REFSELT[1:0] MUXCAL[2:0]
R-xh R/W-0h R/W-0h R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 33. Multiplexer Control Register 0 Register Field Descriptions

Bit Field Type Reset Description
7 CLKSTAT R xh Clock Status
This bit is read-only and indicates whether the internal oscillator or
external clock is being used
0: Internal oscillator in use
1: External clock in use
6:5 VREFCON[1:0] R/W 0h Internal Reference Control
These bits control the internal voltage reference. These bits allow the
reference to be turned on or off completely, or allow the reference state
to follow the state of the device. Note that the internal reference is
required for operation of the IDAC functions.
00: Internal reference is always off (default)
01: Internal reference is always on
10 or 11: Internal reference is on when a conversion is in progress and
powers-down when the device receives a SLEEP command or the
START pin is taken low
4:3 REFSELT[1:0] R/W 0h Reference Select Control
These bits select the reference input for the ADC.
00: REFP0 and REFN0 reference inputs selected (default)
01: REFP1 and REFN1 reference inputs selected (ADS1248 only)
10: Internal reference selected
11: Internal reference selected and internally connected to REFP0 and
REFN0 input pins
2:0 MUXCAL[2:0] (1) R/W 0h System Monitor Control
These bits are used to select a system monitor. The MUXCAL selection
supercedes selections from the MUX0, MUX1, and VBIAS registers
(includes MUX_SP, MUX_SN, VBIAS, and reference input selections).
000: Normal operation (default)
001: Offset calibration. The analog inputs are disconnected and AINP
and AINN are internally connected to mid-supply (AVDD + AVSS) / 2.
010: Gain calibration. The analog inputs are connected to the voltage
reference.
011: Temperature measurement. The inputs are connected to a diode
circuit that produces a voltage proportional to the ambient temperature
of the device.
100: REF1 monitor. The analog inputs are disconnected and AINP and
AINN are internally connected to (V(REFP1) – V(REFN1)) / 4 (ADS1248
only)
101: REF0 monitor. The analog inputs are disconnected and AINP and
AINN are internally connected to (V(REFP0) – V(REFN0)) / 4
110: Analog supply monitor. The analog inputs are disconnected and
AINP and AINN are internally connected to (AVDD – AVSS) / 4
111: Digital supply monitor. The analog inputs are disconnected and
AINP and AINN are internally connected to (DVDD – DGND) / 4

(1) When using either reference monitor, the internal reference should be enabled.

Table 34 provides the ADC input connection and PGA settings for each MUXCAL setting. The PGA setting
reverts to the original SYS0 register setting when MUXCAL is taken back to normal operation or offset
measurement.

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Table 34. MUXCAL Settings

MUXCAL[2:0] PGA GAIN SETTING ADC INPUT
000 Set by SYS0 register Normal operation
001 Set by SYS0 register Inputs shorted to mid-supply (AVDD + AVSS) / 2
010 Forced to 1 V(REFP) – V(REFN) (full-scale)
011 Forced to 1 Temperature measurement diode
100 Forced to 1 (V(REFP1) – V(REFN1)) / 4
101 Forced to 1 (V(REFP0) – V(REFN0)) / 4
110 Forced to 1 (AVDD – AVSS) / 4
111 Forced to 1 (DVDD – DGND) / 4

9.6.4.4 SYS0—System Control Register 0 (offset = 03h) [reset = 00h]

Figure 98. System Control Register 0
7 6 5 4 3 2 1 0
0 PGA[2:0] DR[3:0]
R-0h R/W-0h R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 35. System Control Register 0 Field Descriptions

Bit Field Type Reset Description
7 RESERVED R 0h Reserved
This bit must always be set to 0
6:4 PGA[2:0] R/W 0h Gain Setting for PGA
These bits determine the gain of the PGA
000: PGA = 1 (default)
001: PGA = 2
010: PGA = 4
011: PGA = 8
100: PGA = 16
101: PGA = 32
110: PGA = 64
111: PGA = 128
3:0 DR[3:0] R/W 0h Data Output Rate Setting
These bits determine the data output rate of the ADC
0000: DR = 5 SPS (default)
0001: DR = 10 SPS
0010: DR = 20 SPS
0011: DR = 40 SPS
0100: DR = 80 SPS
0101: DR = 160 SPS
0110: DR = 320 SPS
0111: DR = 640 SPS
1000: DR = 1000 SPS
1001 to 1111: DR = 2000 SPS

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9.6.4.5 OFC—Offset Calibration Coefficient Register (offset = 04h, 05h, 06h) [reset = 00h, 00h, 00h]
These bits make up the offset calibration coefficient register of the ADS1247 and ADS1248.
Figure 99. Offset Calibration Coefficient Register
7 6 5 4 3 2 1 0
OFC[7:0]
R/W-00h
15 14 13 12 11 10 9 8
OFC[15:8]
R/W-00h
23 22 21 20 19 18 17 16
OFC[23:16]
R/W-00h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 36. Offset Calibration Coefficient Register Field Descriptions

Bit Field Type Reset Description
23:0 OFC[23:0] R/W 000000h Offset Calibration Register
Three registers compose the ADC 24-bit offset calibration word.
The 24-bit word is twos complement format and is internally left-
shifted to align with the ADC 24-bit conversion result. The ADC
subtracts the register value from the conversion result before full
scale operation.

9.6.4.6 FSC—Full-Scale Calibration Coefficient Register (offset = 07h, 08h, 09h) [reset = PGA dependent]
These bits make up the full-scale calibration coefficient register. The reset value for FSC is factory-trimmed for
each PGA setting. The factory-trimmed FSC reset value is automatically loaded whenever the PGA setting is
changed.
Figure 100. Full-Scale Calibration Coefficient Register
7 6 5 4 3 2 4 0
FSC[7:0]
R/W-xxh
15 14 13 12 11 10 9 8
FSC[15:8]
R/W-xxh
23 22 21 20 19 18 17 16
FSC[23:16]
R/W-xxh
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 37. Full-Scale Calibration Coefficient Register Field Descriptions

Bit Field Type Reset Description
23:0 FSC[23:0] R/W xxxxxxh Full-Scale Calibration Register
Three registers compose the ADC 24-bit full-scale calibration
word. The 24-bit word is straight binary. The ADC divides the
register value by the FSC register by 400000h to derive the
scale factor for calibration. After the offset calibration, the ADC
multiplies the scale factor by the conversion result. The factory-
trimmed FSC reset value is automatically loaded whenever the
PGA setting is changed.

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9.6.4.7 IDAC0—IDAC Control Register 0 (offset = 0Ah) [reset = x0h]

Figure 101. IDAC Control Register 0

7 6 5 4 3 2 1 0
ID[3:0] DRDY MODE IMAG[2:0]
R-xh R/W-0h R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 38. IDAC Control Register 0 Field Descriptions

Bit Field Type Reset Description
7:4 ID[3:0] R xh Revision Identification
Read-only, factory-programmed bits; used for revision
identification.
3 DRDY MODE R/W 0h Data Ready Mode Setting
This bit sets the DOUT/DRDY pin functionality. In either setting
of the DRDY MODE bit, the dedicated DRDY pin continues to
indicate data ready, active low.
0: DOUT/DRDY pin functions only as Data Out (default)
1: DOUT/DRDY pin functions both as Data Out and Data Ready,
active low (1)
2:0 IMAG[2:0] R/W 0h IDAC Excitation Current Magnitude
The ADS1247 and ADS1248 have two excitation current
sources (IDACs) that can be used for sensor excitation. The
IMAG bits control the magnitude of the excitation current. The
IDACs require the internal reference to be on.
000: off (default)
001: 50 μA
010: 100 μA
011: 250 μA
100: 500 μA
101: 750 μA
110: 1000 μA
111: 1500 μA

(1) Cannot be used in SDATAC mode

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9.6.4.8 IDAC1—IDAC Control Register 1 (offset = 0Bh) [reset = FFh]

Figure 102. IDAC Control Register 1 (ADS1247)
7 6 5 4 3 2 1 0
1 1 I1DIR[1:0] 1 1 I2DIR[1:0]
R-1h R-1h R/W-3h R-1h R-1h R/W-3h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Figure 103. IDAC Control Register 1 (ADS1248)

7 6 5 4 3 2 1 0
I1DIR[3:0] I2DIR[3:0]
R/W-Fh R/W-Fh
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

The two IDACs on the ADS1248 can be routed to either the IEXC1 and IEXC2 output pins or directly to the
analog inputs.

Table 39. IDAC Control Register Field Descriptions

Bit Field Type Reset Description
7:4 I1DIR[3:0] R/W Fh IDAC Excitation Current Output 1
These bits select the output pin for the first excitation current
source
0000: AIN0
0001: AIN1
0010: AIN2
0011: AIN3
0100: AIN4 (ADS1248 only)
0101: AIN5 (ADS1248 only)
0110: AIN6 (ADS1248 only)
0111: AIN7 (ADS1248 only)
10x0: IEXC1 (ADS1248 only)
10x1: IEXC2 (ADS1248 only)
11xx: Disconnected (default)
3:0 I2DIR[3:0] R/W Fh IDAC Excitation Current Output 2
These bits select the output pin for the second excitation current
source
0000: AIN0
0001: AIN1
0010: AIN2
0011: AIN3
0100: AIN4 (ADS1248 only)
0101: AIN5 (ADS1248 only)
0110: AIN6 (ADS1248 only)
0111: AIN7 (ADS1248 only)
10x0: IEXC1 (ADS1248 only)
10x1: IEXC2 (ADS1248 only)
11xx: Disconnected (default)

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9.6.4.9 GPIOCFG—GPIO Configuration Register (offset = 0Ch) [reset = 00h]

Figure 104. GPIO Configuration Register (ADS1247)
7 6 5 4 3 2 1 0
0 0 0 0 IOCFG[3:0]
R-0h R-0h R-0h R-0h R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 40. GPIO Configuration Register Field Descriptions (ADS1247)

Bit Field Type Reset Description
7:4 RESERVED R 0h Reserved
Always write 0000
3 IOCFG[3] R/W 0h GPIO[3] (AIN3) Pin Configuration
0: GPIO[3] is not enabled (default)
1: GPIO[3] is applied to AIN3
2 IOCFG[2] R/W 0h GPIO[2] (AIN2) Pin Configuration
0: GPIO[2] is not enabled (default)
1: GPIO[2] is applied to AIN2
1 IOCFG[1] R/W 0h GPIO[1] (REFN0) Pin Configuration
0: GPIO[1] is not enabled (default)
1: GPIO[1] is applied to REFN0
0 IOCFG[0] R/W 0h GPIO[0] (REFP0) Pin Configuration
0: GPIO[0] is not enabled (default)
1: GPIO[0] is applied to REFP0

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Figure 105. GPIO Configuration Register (ADS1248)

7 6 5 4 3 2 1 0
IOCFG[7:0]
R/W-00h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 41. GPIO Configuration Register Field Descriptions (ADS1248)

Bit Field Type Reset Description
7 IOCFG[7] R/W 0h GPIO[7] (AIN7) Pin Configuration
0: GPIO[7] is not enabled (default)
1: GPIO[7] is applied to AIN7
6 IOCFG[6] R/W 0h GPIO[6] (AIN6) Pin Configuration
0: GPIO[6] is not enabled (default)
1: GPIO[6] is applied to AIN6
5 IOCFG[5] R/W 0h GPIO[5] (AIN5) Pin Configuration
0: GPIO[5] is not enabled (default)
1: GPIO[5] is applied to AIN5
4 IOCFG[4] R/W 0h GPIO[4] (AIN4) Pin Configuration
0: GPIO[4] is not enabled (default)
1: GPIO[4] is applied to AIN4
3 IOCFG[3] R/W 0h GPIO[3] (AIN3) Pin Configuration
0: GPIO[3] is not enabled (default)
1: GPIO[3] is applied to AIN3
2 IOCFG[2] R/W 0h GPIO[2] (AIN2) Pin Configuration
0: GPIO[2] is not enabled (default)
1: GPIO[2] is applied to AIN2
1 IOCFG[1] R/W 0h GPIO[1] (REFN0) Pin Configuration
0: GPIO[1] is not enabled (default)
1: GPIO[1] is applied to REFN0
0 IOCFG[0] R/W 0h GPIO[0] (REFP0) Pin Configuration
0: GPIO[0] is not enabled (default)
1: GPIO[0] is applied to REFP0

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9.6.4.10 GPIODIR—GPIO Direction Register (offset = 0Dh) [reset = 00h]

Figure 106. GPIO Direction Register (ADS1247)
7 6 5 4 3 2 1 0
0 0 0 0 IODIR[3:0]
R-0h R-0h R-0h R-0h R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 42. GPIO Direction Register Field Descriptions (ADS1247)

Bit Field Type Reset Description
7:4 RESERVED R 0h Reserved
Always write 0000
3 IODIR[3] R/W 0h GPIO[3] (AIN3) Pin Direction
Configures GPIO[3] as a GPIO input or GPIO output
0: GPIO[3] is an output (default)
1: GPIO[3] is an input
2 IODIR[2] R/W 0h GPIO[2] (AIN2) Pin Direction
Configures GPIO[2] as a GPIO input or GPIO output
0: GPIO[2] is an output (default)
1: GPIO[2] is an input
1 IODIR[1] R/W 0h GPIO[1] (REFN0) Pin Direction
Configures GPIO[1] as a GPIO input or GPIO output
0: GPIO[1] is an output (default)
1: GPIO[1] is an input
0 IODIR[0] R/W 0h GPIO[0] (REFP0) Pin Direction
Configures GPIO[0] as a GPIO input or GPIO output
0: GPIO[0] is an output (default)
1: GPIO[0] is an input

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Figure 107. GPIO Direction Register (ADS1248)

7 6 5 4 3 2 1 0
IODIR[7:0]
R/W-00h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 43. GPIO Direction Register Field Descriptions (ADS1248)

Bit Field Type Reset Description
7 IODIR[7] R/W 0h GPIO[7] (AIN7) Pin Direction
Configures GPIO[7] as a GPIO input or GPIO output
0: GPIO[7] is an output (default)
1: GPIO[7] is an input
6 IODIR[6] R/W 0h GPIO[6] (AIN6) Pin Direction
Configures GPIO[6] as a GPIO input or GPIO output
0: GPIO[6] is an output (default)
1: GPIO[6] is an input
5 IODIR[5] R/W 0h GPIO[5] (AIN5) Pin Direction
Configures GPIO[5] as a GPIO input or GPIO output
0: GPIO[5] is an output (default)
1: GPIO[5] is an input
4 IODIR[4] R/W 0h GPIO[4] (AIN4) Pin Direction
Configures GPIO[4] as a GPIO input or GPIO output
0: GPIO[4] is an output (default)
1: GPIO[4] is an input
3 IODIR[3] R/W 0h GPIO[3] (AIN3) Pin Direction
Configures GPIO[3] as a GPIO input or GPIO output
0: GPIO[3] is an output (default)
1: GPIO[3] is an input
2 IODIR[2] R/W 0h GPIO[2] (AIN2) Pin Direction
Configures GPIO[2] as a GPIO input or GPIO output
0: GPIO[2] is an output (default)
1: GPIO[2] is an input
1 IODIR[1] R/W 0h GPIO[1] (REFN0) Pin Direction
Configures GPIO[1] as a GPIO input or GPIO output
0: GPIO[1] is an output (default)
1: GPIO[1] is an input
0 IODIR[0] R/W 0h GPIO[0] (REFP0) Pin Direction
Configures GPIO[0] as a GPIO input or GPIO output
0: GPIO[0] is an output (default)
1: GPIO[0] is an input

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9.6.4.11 GPIODAT—GPIO Data Register (offset = 0Eh) [reset = 00h]

Figure 108. GPIO Data Register (ADS1247)
7 6 5 4 3 2 1 0
0 0 0 0 IODAT[3:0]
R-0h R-0h R-0h R-0h R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 44. GPIO Data Register Field Descriptions (ADS1247)

Bit Field Type Reset Description
7:4 RESERVED R 0h Reserved
Always write 0000
3 IODAT[3] R/W 0h GPIO[3] (AIN3) Pin Data
Configured as an output, read returns the register value
Configured as an input, write sets the register value only
0: GPIO[3] is low (default)
1: GPIO[3] is high
2 IODAT[2] R/W 0h GPIO[2] (AIN2) Pin Data
Configured as an output, read returns the register value
Configured as an input, write sets the register value only
0: GPIO[2] is low (default)
1: GPIO[2] is high
1 IODAT[1] R/W 0h GPIO[1] (REFN0) Pin Data
Configured as an output, read returns the register value
Configured as an input, write sets the register value only
0: GPIO[1] is low (default)
1: GPIO[1] is high
0 IODAT[0] R/W 0h GPIO[0] (REFP0) Pin Data
Configured as an output, read returns the register value
Configured as an input, write sets the register value only
0: GPIO[0] is low (default)
1: GPIO[0] is high

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Figure 109. GPIO Data Register (ADS1248)

7 6 5 4 3 2 1 0
IODAT[7:0]
R/W-00h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset; -x = variable

Table 45. GPIO Data Register Field Descriptions (ADS1248)

Bit Field Type Reset Description
7 IODAT[7] R/W 0h GPIO[7] (AIN7) Pin Data
Configured as an output, read returns the register value
Configured as an input, write sets the register value only
0: GPIO[7] is low (default)
1: GPIO[7] is high
6 IODAT[6] R/W 0h GPIO[6] (AIN6) Pin Data
Configured as an output, read returns the register value
Configured as an input, write sets the register value only
0: GPIO[6] is low (default)
1: GPIO[6] is high
5 IODAT[5] R/W 0h GPIO[5] (AIN5) Pin Data
Configured as an output, read returns the register value
Configured as an input, write sets the register value only
0: GPIO[5] is low (default)
1: GPIO[5] is high
4 IODAT[4] R/W 0h GPIO[4] (AIN4) Pin Data
Configured as an output, read returns the register value
Configured as an input, write sets the register value only
0: GPIO[4] is low (default)
1: GPIO[4] is high
3 IODAT[3] R/W 0h GPIO[3] (AIN3) Pin Data
Configured as an output, read returns the register value
Configured as an input, write sets the register value only
0: GPIO[3] is low (default)
1: GPIO[3] is high
2 IODAT[2] R/W 0h GPIO[2] (AIN2) Pin Data
Configured as an output, read returns the register value
Configured as an input, write sets the register value only
0: GPIO[2] is low (default)
1: GPIO[2] is high
1 IODAT[1] R/W 0h GPIO[1] (REFN0) Pin Data
Configured as an output, read returns the register value
Configured as an input, write sets the register value only
0: GPIO[1] is low (default)
1: GPIO[1] is high
0 IODAT[0] R/W 0h GPIO[0] (REFP0) Pin Data
Configured as an output, read returns the register value
Configured as an input, write sets the register value only
0: GPIO[0] is low (default)
1: GPIO[0] is high

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10 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

10.1 Application Information

The ADS1246, ADS1247, and ADS1248 make up a family of precision, 24-bit, ΔΣ ADCs that offers many
integrated features to ease the measurement of the most common sensor types including various types of
temperature and bridge sensors. Primary considerations when designing an application with these devices
include connecting and configuring the serial interface, designing the analog input filtering, establishing an
appropriate external reference for ratiometric measurements, and setting the common-mode input voltage for the
internal PGA. These considerations are discussed in the following sections.

10.1.1 Serial Interface Connections

The principle serial interface connections for the ADS1248 are shown in Figure 110.

47
GPIO
3.3 V
47
1 DVDD SCLK 28 SCLK

47
0.1 PF 2 DGND DIN 27 DIN

47
Microcontroller
3 CLK DOUT/DRDY 26 DOUT
with SPI
47
4 RESET DRDY 25 GPIO/IRQ

47
5 REFP0 CS 24 GPIO

47
6 REFN0 START 23 GPIO
5V 3.3 V

7 REFP1 AVDD 22 DVDD

Device
8 REFN1 AVSS 21 0.1 PF 0.1 PF DVSS

9 VREFOUT IEXC1 20

1 PF
10 VREFCOM IEXC2 19

11 AIN0 AIN0 18

12 AIN1 AIN1 17

13 AIN4 AIN7 16

14 AIN5 AIN6 15

Figure 110. Serial Interface Connections

Most microcontroller SPI peripherals can operate with the ADS1248. The interface operates in SPI mode 1
where CPOL = 0 and CPHA = 1. In SPI mode 1, SCLK idles low and data are launched or changed only on
SCLK rising edges; data are latched or read by the master and slave on SCLK falling edges. Details of the SPI
communication protocol employed by the device can be found in the Serial Interface Timing Requirements
section.
TI recommends placing 47-Ω resistors in series with all digital input and output pins (CS, SCLK, DIN,
DOUT/DRDY, DRDY, RESET and START). This resistance smooths sharp transitions, suppresses overshoot,
and offers some overvoltage protection. Care must be taken to meet all SPI timing requirements because the
additional resistors interact with the bus capacitances present on the digital signal lines.

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Application Information (continued)

10.1.2 Analog Input Filtering
Analog input filtering serves two purposes: first, to limit the effect of aliasing during the sampling process and
second, to reduce external noise from being a part of the measurement.
As with any sampled system, aliasing can occur if proper anti-alias filtering is not in place. Aliasing occurs when
frequency components are present in the input signal that are higher than half the sampling frequency of the
ADC (also known as the Nyquist frequency). These frequency components are folded back and show up in the
actual frequency band of interest below half the sampling frequency. Note that inside a ΔΣ ADC, the input signal
is sampled at the modulator frequency, fMOD and not at the output data rate. The filter response of the digital filter
repeats at multiples of the fMOD, as shown in Figure 111. Signals or noise up to a frequency where the filter
response repeats are attenuated to a certain amount by the digital filter depending on the filter architecture. Any
frequency components present in the input signal around the modulator frequency or multiples thereof are not
attenuated and alias back into the band of interest, unless attenuated by an external analog filter.
Magnitude

Sensor
Signal

Unwanted
Unwanted Signals
Signals

Output fMOD / 2 fMOD Frequency

Data Rate

Magnitude

Digital Filter

Aliasing of Unwanted
Signals

Output fMOD / 2 fMOD Frequency

Data Rate

Magnitude

External
Antialiasing Filter
Roll-Off

Output fMOD / 2 fMOD Frequency

Data Rate

Figure 111. Effect of Aliasing

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Application Information (continued)

Many sensor signals are inherently bandlimited; for example, the output of a thermocouple has a limited rate of
change. In this case, the sensor signal does not alias back into the pass-band when using a ΔΣ ADC. However,
any noise pick-up along the sensor wiring or the application circuitry can potentially alias into the pass-band.
Power line-cycle frequency and harmonics are one common noise source. External noise can also be generated
from electromagnetic interference (EMI) or radio frequency interference (RFI) sources, such as nearby motors
and cellular phones. Another noise source typically exists on the printed circuit board (PCB) itself in the form of
clocks and other digital signals. Analog input filtering helps remove unwanted signals from affecting the
measurement result.
A first-order resistor-capacitor (RC) filter is (in most cases) sufficient to either totally eliminate aliasing, or to
reduce the effect of aliasing to a level within the noise floor of the sensor. Ideally, any signal beyond fMOD/2 is
attenuated to a level below the noise floor of the ADC. The digital filter of the ADS1248 attenuates signals to a
certain degree, as illustrated in the filter response plots in the Digital Filter section. In addition, noise components
are usually smaller in magnitude than the actual sensor signal. Therefore, using a first-order RC filter with a
cutoff frequency set at the output data rate or 10x higher is generally a good starting point for a system design.
Internal to the device, prior to the PGA inputs, is an EMI filter; see Figure 52. The cutoff frequency of this filter is
approximately 47 MHz, which helps reject high-frequency interferences.

10.1.3 External Reference and Ratiometric Measurements

The full-scale range of the ADS1248 is defined by the reference voltage and the PGA gain (FSR = ±VREF / Gain).
An external reference can be used instead of the integrated 2.048-V reference to adapt the FSR to the specific
system needs. An external reference must be used if VIN > 2.048 V. For example, an external 2.5-V reference is
required in order to measure signals as large as 2.5 V. Note that the input signal must be within the common-
mode input range to be valid, and that the reference input voltage must be between 0.5 V and (AVDD – AVSS –
1 V).
The buffered reference inputs of the device also allow the implementation of ratiometric measurements. In a
ratiometric measurement the same excitation source that is used to excite the sensor is also used to establish
the reference for the ADC. As an example, a simple form of a ratiometric measurement uses the same current
source to excite both the resistive sensor element (such as an RTD) and another resistive reference element that
is in series with the element being measured. The voltage that develops across the reference element is used as
the reference source for the ADC. In this configuration, current noise and drift are common to both the sensor
measurement and the reference, therefore these components cancel out in the ADC transfer function. The output
code is only a ratio of the sensor element value and the reference resistor value, and is not affected by the
absolute value of the excitation current.

10.1.4 Establishing a Proper Common-Mode Input Voltage

The ADS1248 is used to measure various types of signal configurations. However, configuring the input of the
device properly for the respective signal type is important.
The ADS1248 features an 8-input multiplexer (while the ADS1247 has a 4-input multiplexer). Each input can be
independently selected as the positive input or the negative input to be measured by the ADC. With an 8-input
multiplexer, the user can measure four independent differential-input channels. The user can also choose to
measure 7 channels, using one input as a fixed common input. Regardless of the analog input configuration,
make sure that all inputs, including the common input are within the common-mode input voltage range.
If the supply is unipolar (e.g. AVSS = 0 V and AVDD = 5 V), then V(AINN) = 0 V is not within the common-mode
input range as shown by Equation 3. Therefore, a single-ended measurement with the common input connected
to ground is not possible. TI recommends connecting the common-input to mid-supply or alternatively to
VREFOUT. Note that the common-mode range becomes further restricted with increasing PGA gain.
If the supply is bipolar (AVSS = –2.5 V and AVDD = 2.5 V), then ground is within the common-mode input range.
Single-ended measurements with the common input connected to 0 V are possible in this case.
For a detailed explanation of the common-mode input range as it relates to the PGA see the PGA Common-
Mode Voltage Requirements section.

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Application Information (continued)

10.1.5 Isolated (or Floating) Sensor Inputs
Isolated sensors (sensors that are not referenced to the ADC ground) must have a common-mode voltage
established within the specified ADC input range. Level shift the common-mode voltage by external resistor
biasing, by connecting the negative lead to ground (bipolar analog supply), or by connecting to a dc voltage
(unipolar analog supply). The 2.048-V reference output voltage may also be used to provide level shifting to
floating sensor inputs.

10.1.6 Unused Inputs and Outputs

To minimize leakage currents on the analog inputs, leave unused analog inputs floating, connect them to mid-
supply, or connect them to AVDD. Connecting unused analog inputs to AVSS is possible as well, but can yield
higher leakage currents than the options mentioned before.
Do not float unused digital inputs or excessive power-supply leakage current may result. Tie all unused digital
inputs to the appropriate levels, DVDD or DGND, including when in power-down mode. If the DRDY output is not
used, leave the pin unconnected or tie it to DVDD using a weak pull-up resistor.

10.1.7 Pseudo Code Example

The following list shows a pseudo code sequence with the required steps to set up the device and the
microcontroller that interfaces to the ADC in order to take subsequent readings from the ADS1248 in stop read
data continuous (SDATAC) mode. In SDATAC mode, it is sufficient to wait for a time period longer than the data
rate to retrieve the conversion result. New conversion data will not interrupt the reading of registers or data on
DOUT. However in this example, the dedicated DRDY pin is used to indicate availability of new conversion data
instead of waiting a set time period for a readout. The default configuration register settings are changed to PGA
gain = 16, using the internal reference, and a data rate of 20 SPS.
Power up;
Delay for a minimum of 16 ms to allow power supplies to settle and power-on reset to complete;
Enable the device by setting the START pin high;
Configure the serial interface of the microcontroller to SPI mode 1 (CPOL = 0, CPHA =1);
If the CS pin is not tied low permanently, configure the microcontroller GPIO connected to CS as an
output;
Configure the microcontroller GPIO connected to the DRDY pin as a falling edge triggered interrupt
input;
Set CS to the device low;
Delay for a minimum of tCSSC;
Send the RESET command (06h) to make sure the device is properly reset after power up;
Delay for a minimum of 0.6 ms;
Send SDATAC command (16h) to prevent the new data from interrupting data or register transactions;
Write the respective register configuration with the WREG command (40h, 03h, 01h, 00h, 03h and 42h);
As an optional sanity check, read back all configuration registers with the RREG command (four bytes
from 20h, 03h);
Send the SYNC command (04h) to start the ADC conversion;
Delay for a minimum of tSCCS;
Clear CS to high (resets the serial interface);
Loop
{
Wait for DRDY to transition low;
Take CS low;
Delay for a minimum of tCSSC;
Send the RDATA command (12h);
Send 24 SCLKs to read out conversion data on DOUT/DRDY;
Delay for a minimum of tSCCS;
Clear CS to high;
}
Take CS low;
Delay for a minimum of tCSSC;
Send the SLEEP command (02h) to stop conversions and put the device in power-down mode;

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Application Information (continued)

10.1.8 Channel Multiplexing Example
This example applies only to the ADS1247 and ADS1248. It explains a method to use the device with two
sensors connected to two different analog channels. Figure 112 shows the sequence of SPI operations
performed on the device. After power up, 216 tCLK cycles are required before communication can be started.
During the first 216 tCLK cycles, the device is internally held in a reset state. In this example, one of the sensors is
connected to channels AIN0 and AIN1 and the other sensor is connected to channels AIN2 and AIN3. The ADC
is operated at a data rate of 2 kSPS. The PGA gain is set to 32 for both sensors. VBIAS is connected to the
negative terminal of both sensors (that is, channels AIN1 and AIN3). All these settings can be changed by
performing a block write operation on the first four registers of the device. After the DRDY pin goes low, the
conversion result can be immediately retrieved by sending in 24 SCLK pulses because the device defaults to
RDATAC mode. As the conversion result is being retrieved, the active input channels can be switched to AIN2
and AIN3 by writing into the MUX0 register in a full-duplex manner, as shown in Figure 112. The write operation
is completed with an additional eight SCLK pulses. The time from the write operation into the MUX0 register to
the next DRDY low transition is shown in Figure 112 and is 0.513 ms in this case. After DRDY goes low, the
conversion result can be retrieved and the active channel can be switched as before.
Power-up sequence ADC initial setup Multiplexer change to channel 2 Data retrieval for
channel 2 conversion
(1)
16 ms

DVDD

START

RESET

CS

WREG WREG NOP

DIN

SCLK
Conversion result Conversion result
for channel 1 for channel 2
DOUT

Initial setting:
DRDY
AIN0 is the positive channel,
AIN1 is the negative channel, 0.513 ms for
tDRDY
Internal reference selected, MUX0 write
PGA gain = 32, DR = 2 kSPS,
VBIAS is connected to pins AIN2 is the positive channel,
AIN1 and AIN3 AIN3 is the negative channel.

(1) For fCLK = 4.096 MHz.

Figure 112. SPI Communication Sequence for Channel Multiplexing

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Application Information (continued)

10.1.9 Power-Down Mode Example
This second example deals with performing one conversion after power up and then entering power-down mode.
In this example, a sensor is connected to input channels AIN0 and AIN1. Commands to set up the device must
occur at least 216 system clock cycles after powering up the device. The ADC operates at a data rate of 2 kSPS.
The PGA gain is set to 32. VBIAS is connected to the negative terminal of the sensor (that is, channel AIN1). All
these settings can be changed by performing a block write operation on the first four registers of the device. After
performing the block write operation, the START pin can be taken low. The device enters the power-down mode
as soon as DRDY goes low 0.575 ms after writing into the SYS0 register. The conversion result can be retrieved
even after the device enters power-down mode by sending 24 SCLK pulses.
ADC is put in power-down
Power-up sequence ADC initial setup mode after a single conversion.
Data are retrieved when the
16 ms(1)
ADC is powered down

DVDD

START

RESET

CS

WREG NOP

DIN

SCLK
Conversion result
for channel 1
DOUT

DRDY
Initial setting: tDRDY ADC enters
AIN0 is the positive channel, (0.575 ms) power-down
AIN1 is the negative channel, mode
Internal reference selected,
PGA gain = 32, DR = 2 kSPS,
VBIAS is connected to AIN1

(1) For fCLK = 4.096 MHz.

Figure 113. SPI Communication Sequence for Entering Power-Down Mode After a Conversion

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10.2 Typical Applications

10.2.1 Ratiometric 3-Wire RTD Measurement System
Figure 114 shows a 3-wire RTD application circuit with lead-wire compensation using the ADS1247. The two
IDAC current sources integrated in the ADS1247 are used to implement the lead-wire compensation. One IDAC
current source (IDAC1) provides excitation to the RTD element. The other current source (IDAC2) has the same
current setting, providing cancellation of lead-wire resistance by generating a voltage drop across lead-wire
resistance RLEAD2 equal to the voltage drop across RLEAD1. Because the voltage across the RTD is measured
differentially at ADC pins AIN1 and AIN2, the voltages across the lead-wire resistances cancel. The ADC
reference voltage (pins REFP0 and REFN0) is derived from the voltage across RREF with the currents from
IDAC1 and IDAC2, providing ratiometric cancellation of current-source drift. RREF also level shifts the RTD signal
to within the ADC specified common-mode input range.

IDAC1 ADS1247

IDAC2
AIN0/IEXC1
CI_CM1
RI1
AIN1
RLEAD1
RRTD CI_DIFF û
AIN2 MUX PGA
RLEAD2 ADC

RI2 AIN3/IEXC2
CI_CM2

RLEAD3
Reference
Buffer/MUX

REFP0 REFN0

CR_CM1 CR_CM2
CR_DIFF

RR1 RR2
IIDAC1 + IIDAC2

RREF

Figure 114. Ratiometric 3-Wire RTD Measurement System Featuring the ADS1247

10.2.1.1 Design Requirements

Table 46 shows the design requirements of the 3-wire RTD application.

Table 46. Example 3-Wire RTD Application Design Requirements

DESIGN PARAMETER VALUE
Supply voltage 3.3 V
Data rate 20 SPS
RTD type 3-wire PT100
RTD excitation current 1 mA
Temperature measurement range –200ºC to +850ºC
Calibrated temperature measurement accuracy at TA = 25ºC (1) ±0.05ºC

(1) Not accounting for error of RTD; a two-point gain and offset calibration are performed, as well as chopping of the excitation currents to
remove IDAC mismatch errors.

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10.2.1.2 Detailed Design Procedure

10.2.1.2.1 Topology
Figure 115 shows the basic topology of a ratiometric measurement using an RTD. Shown are the ADC with the
RTD and a reference resistor RREF. There is a single current source, labeled IDAC1 which is used to excite the
RTD as well as to establish a reference voltage for the ADC across RREF.
IDAC1

û
RRTD ADC

REFP REFN

RREF

Figure 115. Example of a Ratiometric RTD Measurement

With IDAC1, the ADC measures the RTD voltage using the voltage across RREF as the reference. This will give a
measurement such that the output code is proportional to the ratio of the RTD voltage and the reference voltage
as shown in Equation 21 and Equation 22.
Code ∝ VRTD / VREF (21)
Code ∝ (RRTD · IIDAC1) / (RREF · IIDAC1) (22)
The currents cancel so that the equation reduces to Equation 23:
Code ∝ RRTD / RREF (23)
As shown in Equation 23, the measurement depends on the resistive value of the RTD and the reference resistor
RREF, but not on the IDAC1 current value. Therefore, the absolute accuracy and temperature drift of the
excitation current does not matter. This is a ratiometric measurement. As long as there is no current leakage
from IDAC1 outside of this circuit, the measurement depends only on RRTD and RREF.
In Figure 116, the lead resistances of a 3-wire RTD are shown and another excitation current source is added,
labeled IDAC2.
IDAC1

RLEAD1

û
RRTD ADC
RLEAD2

REFP REFN
RLEAD3
IDAC2

RREF

Figure 116. Example of Lead Wire Compensation

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With a single excitation current source, RLEAD1 adds an error to the measurement. By adding IDAC2, the second
excitation current source is used to cancel out the error in the lead wire resistance. When adding the lead
resistances and the second current source, the equation becomes:
Code ∝ (VRTD + (RLEAD1 · IIDAC1) – (RLEAD2 · IIDAC2)) / (VREF · (IIDAC1 + IIDAC2)) (24)
If the lead resistances match and the excitation currents match, then RLEAD1 = RLEAD2 and IIDAC1 = IIDAC2. The
lead wire resistances cancel out so that Equation 24 reduces to the result in Equation 25 maintaining a
ratiometric measurement.
Code ∝ RRTD / (2 · RREF) (25)
RLEAD3 is not part of the measurement, since it is not in the input measurement path or in the reference input
path.
As Equation 24 shows, the two current sources must be matched to cancel the lead resistances of the RTD
wires. Any mismatch in the two current sources is minimized by using the multiplexer to swap or chop the two
current sources between the two inputs. Taking measurements in both configurations and averaging the readings
reduces the effects of mismatched current sources. The design uses the multiplexer in the ADS1247 to
implement this chopping technique to remove the mismatch error between IDAC1 and IDAC2.

10.2.1.2.2 RTD Selection

The RTD is first chosen to be a PT100 element. The RTD resistance is defined by the Callendar-Van Dusen
(CVD) equations and the resistance of the RTD is known depending on the temperature. The PT100 RTD has an
impedance of 100 Ω at 0˚C and roughly 0.385 Ω of resistance change per 1˚C in temperature change. With a
desired temperature measurement accuracy of 0.05˚C, this translates to a resistive measurement accuracy of
approximately 0.01925 Ω. The RTD resistance at the low end of the temperature range of –200˚C is 18.590 Ω
and the resistance at the high end of the temperature range of 850˚C is 390.48 Ω.

10.2.1.2.3 Excitation Current

For the best possible resolution, the voltage across the RTD should be made as large as possible compared to
the noise floor in the measurement. In general, measurement resolution improves with increasing excitation
current. However, a larger excitation current will create self-heating in the RTD, which will cause drift and error in
the measurement. The selection of excitation currents trades off resolution against sensor self-heating.
The excitation current sources in this design are selected to be 1 mA. This will maximize the value of the RTD
voltage while keeping the self-heating low. The typical range of RTD self-heating coefficients is 2.5 mW/°C for
small, thin-film elements and 65 mW/°C for larger, wire-wound elements. With 1-mA excitation at the maximum
RTD resistance value, the power dissipation in the RTD is less than 0.4 mW and will keep the measurement
errors due to self-heating to less than 0.01˚C.
As mentioned in Topology, chopping of the excitation current sources cancels mismatches between the IDACs.
This technique is necessary for getting the best possible accuracy from the system. Mismatch between the
excitation current sources is a large source of error if chopping is not implemented.
The internal reference voltage must be enabled while using the IDACs, even if an external ratiometric
measurement is used for ADC conversions.
Table 47 shows the ADS1247 register settings for setting up the internal reference and the excitation current
sources.

Table 47. Register Bit Settings for Excitation Current Sources

REGISTER (Address) BIT NAME BIT VALUES COMMENT
(1)
MUX1 (02h) VREFCON[1:0] 01 Internal reference enabled
MUX1 (02h) REFSELT[1:0] 00 REFP0 and REFN0 reference inputs selected
IDAC0 (0Ah) IMAG[2:0] 110 IDAC magnitude = 1 mA
(2)
IDAC1 (0Bh) I1DIR[3:0] 0000 IDAC1 = AIN0
IDAC1 (0Bh) I2DIR[3:0] (2) 0011 IDAC2 = AIN3

(1) The internal reference is required to be enabled to use the IDAC current sources.
(2) To implement chopping, swap IDAC1 direction for IDAC2 direction. Set I1DIR[3:0] = 0011 and I2DIR[3:0] = 0000

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10.2.1.2.4 Reference Resistor RREF

TI recommends setting the common-mode voltage of the measurement near mid-supply, this helps keep the
input within the common-mode input range of the PGA.
The reference resistor is selected to be 820 Ω. The voltage across RREF is calculated from Equation 26.
VREF = RREF · (IIDAC1 + IIDAC2) = 820 Ω · 2 mA = 1.64 V (26)
With AVDD = 3.3 V, Equation 26 shows that the input voltage is just below mid-supply.
The excitation current sources operate properly to a maximum IDAC compliance voltage. Above this compliance
voltage, the current sources lose current regulation. In this example, the output voltage of the excitation current
source is calculated from the sum of the voltages across the RTD and RREF as shown in Equation 27.
VIDAC1 MAX = RRTD MAX · IIDAC1 + (RREF · (IIDAC1 + IIDAC2)) = 0.4 V + 1.64 V = 2.04 V (27)
A compliance voltage of 3.3 V – 2.04 V = 1.26 V is sufficient for proper IDAC operation. See Figure 41 and
Figure 42 in Typical Characteristics for details.
Because the voltage across RREF sets the reference voltage for the ADC, the tolerance and temperature drift of
RREF directly affect the measurement gain. A resistor with 0.02% maximum tolerance is selected.

10.2.1.2.5 PGA Setting

Because the excitation current is small to reduce self-heating, the PGA in the ADS1247 is used to amplify the
signal across the RTD to utilize the full-scale range of the ADC. Starting with the reference voltage, the ADC will
be able to measure a differential input signal range of ±1.64 V. The maximum allowable PGA gain setting is
based on the reference voltage, the maximum RTD resistance, and the excitation current.
As mentioned previously the maximum resistance of the RTD will be seen at the top range of the temperature
measurement at 850˚C. This will give the largest voltage measurement of the ADC. RRTD@850˚C will be 390.48 Ω.
VRTD MAX = RRTD@850˚C · IIDAC1 = 390.48 Ω · 1 mA = 390.48 mV (28)
With a reference voltage of 1.64 V, the maximum gain for the PGA, without over-ranging the ADC, is shown in
Equation 29.
GainMAX = VREF / VRTD MAX = 1.64 V / 390.48 mV = 4.2 V/V (29)
Selecting a PGA gain of 4 will give a maximum measurement of 95% of the positive full-scale range. Table 48
shows the register settings to set the PGA gain as well as the inputs for the ADC.

Table 48. Register Bit Settings for the Input Multiplexer and PGA
REGISTER (ADDRESS) BIT NAME BIT VALUES COMMENT
MUX0 (01h) MUX_SP[2:0] 001 AINP = AIN1
MUX0 (01h) MUX_SN[2:0] 010 AINN = AIN2
SYS0 (03h) PGA[2:0] 010 PGA Gain = 4

10.2.1.2.6 Common-Mode Input Range

Now that the component values are selected, the common-mode input range should be verified to ensure that
the ADC and PGA are not limited in operation. Start with the maximum input voltage, which will give the most
restriction in the common-mode input range. At the maximum input voltage, the common-mode input voltage
seen by the ADC is shown in Equation 30.
VCM = VREF + (VRTD MAX / 2) = 1.64 V + (390.48 mV / 2) = 1.835 V (30)
As mentioned in Low-Noise PGA, the common-mode input range is shown in Equation 3 and is applied to
Equation 31.
AVSS + 0.1 V + (VRTD MAX · Gain) / 2 ≤ VCM ≤ AVDD – 0.1 V – (VRTD MAX · Gain) / 2 (31)
After substituting in the appropriate values, the common-mode input range can be found in Equation 32 and
Equation 33.
0 V + 0.1 V + (390.48 mV · 4) / 2 ≤ VCM ≤ 3.3 V – 0.1 V – (390.48 mV · 4) / 2 (32)
881 mV ≤ VCM ≤ 2.42 V (33)

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Because VCM = 1.835 V is within the limits of Equation 33, the RTD measurement is within the input common-
mode range of the ADC and PGA. At the RTD voltage minimum (VRTD MIN = 18.59 mV), a similar calculation can
be made to show that the input common-mode voltage will be within the range as well.

10.2.1.2.7 Input and Reference Low-Pass Filters

The differential filters chosen for this application are designed to have a –3-dB corner frequency at least 10 times
larger than the bandwidth of the ADC. The selected ADS1247 sampling rate of 20 SPS results in a –3-dB
bandwidth of 14.8 Hz. The –3-dB filter corner frequency is set to be roughly 250 Hz at mid-scale measurement
resistance. For proper operation, the differential cutoff frequencies of the reference and input low-pass filters
must be well matched. This can be difficult because as the resistance of the RTD changes over the span of the
measurement, the filter cutoff frequency changes as well. To mitigate this effect, the two resistors used in the
input filter (RI1 and RI2) are chosen to be two orders of magnitude larger than the RTD. Input bias currents of the
ADC causes a voltage drop across the filter resistors that shows up as a differential offset error if the bias
currents and/or filter resistors are not equal. TI recommends limiting the resistors to at most 10 kΩ to reduce DC
offset errors due to input bias current. RI1 and RI2 are chosen to be 4.7 kΩ.
The input filter differential capacitor (CI_DIFF) is calculated starting from the cutoff frequency as shown in
Equation 34.
f-3dB_DIFF = 1 / (2 π · CI_DIFF · (RI1 + RRTD + RI2)) (34)
f-3dB_DIFF = 1 / (2 π · CI_DIFF · (4.7 kΩ + 150 Ω + 4.7 kΩ)) (35)
After solving for CI_DIFF, the capacitor is chosen to be a standard value of 68 nF.
To ensure that mismatch of the common-mode filter capacitors does not translate to a differential voltage, the
common-mode capacitors (CI_CM1 and CI_CM2) are chosen to be 10 times smaller than the differential capacitor,
making them 6.8 nF each. This results in a common-mode cutoff frequency that is roughly 20 times larger than
the differential filter, making the matching of the common-mode cutoff frequencies less critical.
f-3dB_CM+ = 1 / (2 π CI_CM1 · (RI1 + RRTD + RREF)) (36)
f-3dB_CM- = 1 / (2 π CI_CM1 · (RI2 + RREF)) (37)
After substituting values into Equation 36 and Equation 37, the common-mode cutoff frequencies are found to be
f-3dB_CM+ = 4.13 kHz and f-3dB_CM- = 4.24 kHz.
Often, filtering the reference input is not necessary and adding bulk capacitance at the reference input is
sufficient. However, equations showing a design procedure calculating filter values for the reference inputs are
shown below.
The differential reference filter is designed to have a –3-dB corner frequency of 250 Hz to match the differential
input filter. The two reference filter resistors are selected to be 9.09 kΩ, several times larger than the value of
RREF. The reference filter resistors should not be sized larger than 10 kΩ or DC bias errors become significant.
The differential capacitor for the reference filter is calculated as shown in Equation 38.
f-3dB_DIFF = 1 / (2 π CR_DIFF · (RR1 + RRTD + RR2)) (38)
CR_DIFF ≈ 33 nF (39)
After solving for CR_DIFF, the capacitor is chosen to be a standard value of 33 nF.
To ensure that mismatch of the common-mode filter capacitors does not translate to a differential voltage, the
reference common-mode capacitors (CR_CM1 and CR_CM2) are chosen to be 10 times smaller than the reference
differential capacitor, making them 3.3 nF each. Again, the resulting cutoff frequency for the common-mode filters
is roughly 20 times larger than the differential filter, making the matching of the cutoff frequencies less critical.
f-3dB_CM+ = 1 / (2 π CR_CM1 · (RR1 + RREF)) (40)
f-3dB_CM- = 1 / (2 π CR_CM2 · RR2) (41)
After substituting values into Equation 40 and Equation 41, common-mode cutoff frequencies for the reference
filter are found to be f-3dB_CM+ = 4.87 kHz and f-3dB_CM+ = 5.31 kHz.

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10.2.1.2.8 Register Settings

The register settings for this design are shown in Table 49.

Table 49. Register Settings

REGISTER NAME SETTING DESCRIPTION
00h MUX0 0Ah Select AIN1 = AINP and AIN2 = AINN
01h VBIAS 00h
Internal reference enabled,
02h MUX1 20h
REFP0 and REFN0 reference inputs selected
03h SYS0 22h PGA Gain = 4, DR = 20 SPS
04h OFC0 (1) xxh
05h OFC1 xxh
06h OFC2 xxh
07h FSC0 (1) xxh
08h FSC1 xxh
09h FSC2 xxh
ID bits may be version dependent,
0Ah IDAC0 x6h
IDAC magnitude set to 1 mA
0Bh IDAC1 03h (2) IDAC1 set to AIN0; IDAC2 set to AIN3
0Ch GPIOCFG 00h
0Dh GPIOCDIR 00h
0Eh GPIODAT 00h

(1) A two-point gain calibration and offset calibration remove errors from the RREF tolerance, offset voltage and gain error. The results are
used for the OFC and FSC registers
(2) To chop the excitation current sources, swap output pins with IDAC1 register and set to 30h

10.2.1.3 Application Curves

To test the accuracy of the acquisition circuit, a series of calibrated high-precision discrete resistors are used as
the input to the system. Measurements are taken at TA = 25°C. Figure 117 displays the uncalibrated resistance
measurement accuracy of the system over an input span from 20 Ω to 400 Ω. The offset error can be attributed
to the offset of the ADC, while the gain error can be attributed to the accuracy of the RREF resistor and the ADC.
A linear curve-fit is applied to the results yielding the system gain and offset errors displayed in Figure 117.
Precision temperature measurement applications are typically calibrated to remove the effects of gain and offset
errors, which generally dominate the total system error. The simplest calibration method is a linear, or two-point,
calibration which applies an equal and opposite gain and offset term to cancel the measured system gain and
offset errors. Applying a gain and offset calibration yields the calibrated results shown in Figure 118.
The results in Figure 118 are converted to temperature accuracy by dividing the results by the RTD sensitivity (α)
at the measured resistance. Over the full resistance input range, the maximum total measured error is
±0.00415 Ω. Equation 42 uses the measured resistance error and the RTD sensitivity at 0°C to calculate the
measured temperature accuracy.
Error ( ) r0.00415
Error (qC) r0.0106 qC
D @0 qC 0.39083
qC (42)
Figure 119 displays the calculated temperature accuracy of the circuit assuming a linear RTD resistance to
temperature response. It does not include any linearity compensation of the RTD.

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0.12 0.005
Resistance Measurement Error ( )

Resistance Measurement Error ( )

0.004
0.1
0.003
0.08 y = 0.0002719x - 0.0064178 0.002
0.001
0.06
0
0.04
-0.001

0.02 -0.002
-0.003
0 Uncalibrated Results
-0.004
Best Fit Line
-0.02 -0.005
0 50 100 150 200 250 300 350 400 450 0 50 100 150 200 250 300 350 400 450
RRTD ( ) C002 RRTD ( ) C003

Figure 117. Resistance Measurement Results with Figure 118. Resistance Measurement Results with
Precision Resistors before Calibration Precision Resistors after Calibration

0.015
7HPSHUDWXUH 0HDVXUHPHQW (UURU Û&

0.01

0.005

-0.005

-0.01

-0.015
0 50 100 150 200 250 300 350 400 450
RTD ( ) C004

Figure 119. Calculated Temperature Error from Resistance Measurement Error

Table 50 compares the measurement accuracy with the design goal from Table 46.

Table 50. Comparison of Design Goals and Measured Performance

GOAL MEASURED
Calibrated Resistance Measurement Accuracy at TA = 25ºC ±0.01925 Ω ±0.00415 Ω
Calibrated Temperature Measurement Accuracy at TA = 25ºC ±0.05°C ±0.0106°C

For more detailed information about the design, calculations, or error analysis, see the 3-Wire RTD Measurement
System Reference Design, –200°C to 850°C, SLAU520.

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10.2.2 K-Type Thermocouple Measurement (–200°C to +1250°C) with Cold-Junction Compensation

Figure 120 shows the basic connections of a thermocouple measurement system based on the ADS1248. This
circuit uses a cold-junction compensation measurement based on the Ratiometric 3-Wire RTD Measurement
System topology shown in the previous application example. Using the IEXC1 and IEXC2 pins allow for routing
of the IDAC currents without using any other analog pins. Along with the thermocouple and cold-junction
measurements, four other analog inputs (AIN4 to AIN7 not shown in the schematic) are available for alternate
measurements or use as GPIO pins.
3.3 V 3.3 V

3.3 V
0.1 µF 0.1 µF
Isothermal
Block RB1
CI_CM1
RI1
AIN0 DVDD
AVDD
ADS1248
CI_DIFF
AIN1

û
RI2 CI_CM2 PGA
Thermocouple ADC
RB2 MUX

AIN2

AIN3 Reference Mux

RRTD_I1 CRTD_I_CM1
RRTD
IEXC1
IDAC1
CRTD_I_DIFF
3-Wire RTD Internal
IEXC2
Reference
IDAC2

RRTD_I2
CRTD_I_CM2
AVSS DGND REFP0 REFN0

CR_CM1 CR_DIFF CR_CM2

RR1 RR2

RREF

Figure 120. Thermocouple Measurement System Using the ADS1248

10.2.2.1 Design Requirements

Table 51 shows the design requirements of the thermocouple application for the ADS1248.

Table 51. Example Thermocouple Application Design Requirements

DESIGN PARAMETER VALUE
Supply voltage 3.3 V
Reference voltage Internal 2.048-V reference
Update rate ≥ 10 readings per second
Thermocouple type K
Temperature measurement range –200ºC to +1250ºC
Measurement accuracy at TA = 25ºC (1) ±0.2ºC

(1) Not accounting for error of thermocouple and the cold-junction measurement; offset calibration is performed at T(TC) = T(CJ) = 25°C; no
gain calibration.

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10.2.2.2 Detailed Design Procedure

10.2.2.2.1 Biasing Resistors

The biasing resistors RB1 and RB2 are used to set the common-mode voltage of the thermocouple to within the
specified common-mode voltage range of the PGA (in this example, to mid-supply AVDD / 2). If the application
requires the thermocouple to be biased to GND, a bipolar supply (for example, AVDD = 2.5 V and AVSS = –2.5
V) must be used for the device to meet the common-mode voltage requirement of the PGA. When choosing the
values of the biasing resistors, care must be taken so that the biasing current does not degrade measurement
accuracy. The biasing current flows through the thermocouple and can cause self-heating and additional voltage
drops across the thermocouple leads. Typical values for the biasing resistors range from 1 MΩ to 50 MΩ.
In addition to biasing the thermocouple, RB1 and RB2 are also useful for detecting an open thermocouple lead.
When one of the thermocouple leads fails open, the biasing resistors pull the analog inputs (AIN0 and AIN1) to
AVDD and AVSS, respectively. The ADC consequently reads a full-scale value, which is outside the normal
measurement range of the thermocouple voltage, to indicate this failure condition.

10.2.2.2.2 Input Filtering

Although the digital filter attenuates high-frequency components of noise, TI recommends providing a first-order,
passive RC filter at the inputs to further improve performance. The differential RC filter formed by RI1, RI2, and
the differential capacitor CI_DIFF offers a cutoff frequency that is calculated using Equation 43.
fC = 1 / (2 π · (RI1 + RI2) · CI_DIFF) (43)
Two common-mode filter capacitors (CI_CM1 and CI_CM2) are also added to offer attenuation of high-frequency,
common-mode noise components. TI recommends that the differential capacitor CI_DIFF be at least an order of
magnitude (10x) larger than the common-mode capacitors (CI_CM1 and CI_CM2) because mismatches in the
common-mode capacitors can convert common-mode noise into differential noise.
The filter resistors RF1 and RF2 also serve as current-limiting resistors. These resistors limit the current into the
analog inputs (AIN0 and AIN1) of the device to safe levels if an overvoltage on the inputs occurs. Care must be
taken when choosing the filter resistor values because the input currents flowing into and out of the device cause
a voltage drop across the resistors. This voltage drop shows up as an additional offset error at the ADC inputs.
For thermocouple measurements, TI recommends limiting the filter resistor values to below 10 kΩ.
The filter component values used in this design are: RI1 = RI2 = 1 kΩ, CI_DIFF = 100 nF, and CI_CM1 = CI_CM2 = 10
nF.

10.2.2.2.3 PGA Setting

The highest measurement resolution is achieved when matching the largest potential input signal to the FSR of
the ADC by choosing the highest possible gain. From the design requirement, the maximum thermocouple
voltage occurs at TTC = 1250°C and is VTC = 50.644 mV as defined in the tables published by the National
Institute of Standards and Technology (NIST) using a cold-junction temperature of TCJ = 0°C. A thermocouple
produces an output voltage that is proportional to the temperature difference between the thermocouple tip and
the cold junction. If the cold junction is at a temperature below 0°C, the thermocouple produces a voltage larger
than 50.644 mV. The isothermal block area is constrained by the operating temperature range of the device.
Therefore, the isothermal block temperature is limited to –40°C. A K-type thermocouple at TTC = 1250°C
produces an output voltage of VTC = 50.644 mV – (–1.527 mV) = 52.171 mV when referenced to a cold-junction
temperature of TCJ = –40°C. The maximum gain that can be applied when using the internal 2.048-V reference is
then calculated as 39.3 from Equation 44. The next smaller PGA gain setting the device offers is 32.
GainMAX = VREF / VTC MAX = 2.048 V / 52.171 mV = 39.3 (44)

10.2.2.2.4 Cold-Junction Measurement

AIN2 and AIN3 are attached to a 3-wire RTD that is used to measure the cold-junction temperature. Similar to
Ratiometric 3-Wire RTD Measurement System, the 3-wire RTD design is the same except the inputs and
excitation current sources have been changed. Note that RREF and PGA Gain can be optimized for a reduced
temperature range.
The device does not perform an automatic cold-junction compensation of the thermocouple. This compensation
must be done in the microcontroller that interfaces to the device. The microcontroller requests one or multiple
readings of the thermocouple voltage from the device and then sets the device to measure the cold junction with
the RTD to compensate for the cold-junction temperature.
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An algorithm similar to the following must be implemented on the microcontroller to compensate for the cold-
junction temperature:
1. Measure the thermocouple voltage, V(TC), between AIN0 and AIN1.
2. Measure the temperature of the cold junction, T(CJ), using a ratiometric measurement with the 3-wire RTD
across AIN2 and AIN3.
3. Convert the cold-junction temperature into an equivalent thermoelectric voltage, V(CJ), using the tables or
equations provided by NIST.
4. Add V(TC) and V(CJ) and translate the summation back into a thermocouple temperature using the NIST tables
or equations again.
There are alternate methods of measuring the cold-junction temperature. The additional analog input channels of
the device can be used in this case to measure the cold-junction temperature with a thermistor or an alternate
analog temperature sensor.

10.2.2.2.5 Calculated Resolution

To get an approximation of the achievable temperature resolution, the RMS noise of the ADS1248 at Gain = 32
and DR = 20 SPS (0.16 μVRMS) is taken from Table 5. The noise is divided by the average sensitivity of a K-type
thermocouple (41 μV/°C), as shown in Equation 45.
Temperature Resolution = 0.16 μV / 41 μV/°C = 0.004°C (45)

10.2.2.2.6 Register Settings

The register settings for this design are shown in Table 52. The inputs are selected to measure the thermocouple
and the internal reference is used and selected. The excitation current sources are selected and on. While this
does consume some power, it allows for a quick transition for the cold-junction measurement.

Table 52. Register Settings for the Thermocouple Measurement

REGISTER NAME SETTING DESCRIPTION
00h MUX0 01h Select AIN0 = AINP, AIN1 = AINN
01h VBIAS 00h
02h MUX1 30h Internal reference enabled, internal reference selected
03h SYS0 52h PGA Gain = 32, DR = 20 SPS
04h OFC0 xxh
05h OFC1 xxh
06h OFC2 xxh
07h FSC0 xxh
08h FSC1 xxh
09h FSC2 xxh
0Ah IDAC0 x6h IDAC magnitude set to 1 mA
0Bh IDAC1 89h IDAC1 set to IEXC1, IDAC2 set to IEXC2
0Ch GPIOCFG 00h
0Dh GPIOCDIR 00h
0Eh GPIODAT 00h

Changing to the cold-junction measurement, the registers are set to measure the RTD. This requires changing
the input, the reference input, the gain, and any calibration settings required for the measurement accuracy.
Table 53 shows the register settings for the RTD measurement used for cold-junction compensation.

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Table 53. Register Settings for the Cold-Junction Measurement

REGISTER NAME SETTING DESCRIPTION
00h MUX0 13h Select AIN2 = AINP, AIN3 = AINN
01h VBIAS 00h
Internal reference enabled, REFP0 and REFN0
02h MUX1 20h
selected
03h SYS0 22h PGA Gain = 4, DR = 20 SPS
Calibration values will be different between
04h OFC0 xxh
measurement settings
05h OFC1 xxh
06h OFC2 xxh
07h FSC0 xxh
08h FSC1 xxh
09h FSC2 xxh
0Ah IDAC0 x6h IDAC magnitude set to 1 mA
0Bh IDAC1 89h IDAC1 set to IEXC1, IDAC2 set to IEXC2
0Ch GPIOCFG 00h
0Dh GPIOCDIR 00h
0Eh GPIODAT 00h

10.3 Do's and Don'ts

• Do partition the analog, digital, and power supply circuitry into separate sections on the PCB.
• Do use a single ground plane for analog and digital grounds.
• Do place the analog components close to the ADC pins using short, direct connections.
• Do keep the SCLK pin free of glitches and noise.
• Do verify that the analog input voltages are within the specified PGA input voltage range under all input
conditions.
• Do float unused analog input pins to minimize input leakage current. Connecting unused pins to AVDD is the
next best option.
• Do provide current limiting to the analog inputs in case overvoltage faults occur.
• Do use a low-dropout linear regulator (LDO) to reduce ripple voltage generated by switch-mode power
supplies. This is especially true for AVDD where the supply noise may affect the performance.
• Don't cross analog and digital signals.
• Don't allow the analog and digital power supply voltages to exceed 5.5 V under all conditions, including during
power up and power down.
Figure 121 shows Do's and Don'ts of ADC circuit connections.

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Do's and Don'ts (continued)

INCORRECT
5V

AVDD
Device
AINP

24-bit
PGA
û ADC
AINN

AVSS
0V

0V

Input grounded, unipolar supply

CORRECT CORRECT
5V 2.5 V

AVDD AVDD
Device Device
AINP AINP

24-bit 24-bit
2.5 V PGA PGA
û ADC û ADC
AINN AINN

AVSS AVSS
0V

-2.5 V
0V
Input referenced to mid-supply, unipolar
Input grounded, bipolar supply
supply

5V 3.3 V
5V INCORRECT 3.3 V INCORRECT

AVDD DVDD AVDD DVDD

Device Device

24-bit 24-bit
PGA PGA
û ADC û ADC

AVSS DGND AVSS DGND

Inductive supply or ground connections AGND/DGND isolation

5V 3.3 V 2.5 V 3.3 V

CORRECT CORRECT

AVDD DVDD AVDD DVDD

Device Device

24-bit 24-bit
PGA PGA
û ADC û ADC

AVSS DGND AVSS DGND

-2.5 V

Low impedance AGND/DGND connection Low impedance AGND/DGND connection

Figure 121. Dos and Don'ts Circuit Connections

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11 Power-Supply Recommendations
The device requires two power supplies: analog (AVDD, AVSS) and digital (DVDD, DGND). The analog power
supply can be bipolar (for example, AVDD = 2.5 V, AVSS = –2.5 V) or unipolar (for example, AVDD = 3.3 V,
AVSS = 0 V) and is independent of the digital power supply. The digital supply sets the digital I/O levels (with the
exception of the GPIO levels which are set by the analog supply of AVDD to AVSS).

11.1 Power-Supply Sequencing

The power supplies can be sequenced in any order but in no case must any analog or digital inputs exceed the
respective analog or digital power-supply voltage limits. Wait at least 216 tCLK cycles after all power supplies are
stabilized before communicating with the device to allow the power-on reset process to complete.

11.2 Power-Supply Decoupling

Good power-supply decoupling is important to achieve optimum performance. AVDD, AVSS (when using a
bipolar supply) and DVDD must be decoupled with at least a 0.1-μF capacitor, as shown in Figure 122. Place the
bypass capacitors as close to the power-supply pins of the device as possible using low-impedance connections.
TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series resistance
(ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive systems,
or for systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to the device
pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall inductance and is
beneficial for connections to ground planes. TI recommends connecting analog and digital ground together as
close to the device as possible.

3.3 V 3.3 V

1 DVDD SCLK 28 1 DVDD SCLK 28

0.1 µF 2 DGND DIN 27 0.1 µF 2 DGND DIN 27

3 CLK DOUT/DRDY 26 3 CLK DOUT/DRDY 26

4 RESET DRDY 25 4 RESET DRDY 25

5 REFP0 CS 24 5 REFP0 CS 24

+2.5 V
6 REFN0 START 23 6 REFN0 START 23
5V

7 REFP1 AVDD 22 7 REFP1 AVDD 22

0.1 µF
Device Device
8 REFN1 AVSS 21 0.1 µF 8 REFN1 AVSS 21
0.1 µF

9 VREFOUT IEXC1 20 9 VREFOUT IEXC1 20

-2.5 V
1 µF 1 µF
10 VREFCOM IEXC2 19 10 VREFCOM IEXC2 19

11 AIN0 AIN0 18 11 AIN0 AIN0 18

12 AIN1 AIN1 17 12 AIN1 AIN1 17

13 AIN4 AIN7 16 13 AIN4 AIN7 16

14 AIN5 AIN6 15 14 AIN5 AIN6 15

Figure 122. Power Supply Decoupling for Unipolar and Bipolar Supply Operation

88 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated

Product Folder Links: ADS1246 ADS1247 ADS1248

 ADS1246, ADS1247, ADS1248
www.ti.com SBAS426H – AUGUST 2008 – REVISED MARCH 2016

12 Layout

12.1 Layout Guidelines

TI recommends employing best design practices when laying out a printed-circuit board (PCB) for both analog
and digital components. This recommendation generally means that the layout separates analog components
[such as ADCs, amplifiers, references, digital-to-analog converters (DACs), and analog MUXs] from digital
components [such as microcontrollers, complex programmable logic devices (CPLDs), field-programmable gate
arrays (FPGAs), radio frequency (RF) transceivers, universal serial bus (USB) transceivers, and switching
regulators]. An example of good component placement is shown in Figure 123. Although Figure 123 provides a
good example of component placement, the best placement for each application is unique to the geometries,
components, and PCB fabrication capabilities employed. That is, there is no single layout that is perfect for every
design and careful consideration must always be used when designing with any analog component.

Ground Fill or Ground Fill or

Optional: Split
Ground Cut
Ground Plane Ground Plane
Supply
Generation
Signal
Conditioning
(RC Filters
Interface
Device Microcontroller
and Transceiver
Optional: Split
Ground Cut
Amplifiers) Connector
or Antenna
Ground Fill or Ground Fill or
Ground Plane Ground Plane

Figure 123. System Component Placement

The following outlines some basic recommendations for the layout of the ADS1248 to get the best possible
performance of the ADC. A good design can be ruined with a bad circuit layout.
• Separate analog and digital signals. To start, partition the board into analog and digital sections where the
layout permits. Route digital lines away from analog lines. This prevents digital noise from coupling back into
analog signals.
• The ground plane can be split into an analog plane (AGND) and digital plane (DGND), but this is not
necessary. Place digital signals over the digital plane, and analog signals over the analog plane. As a final
step in the layout, the split between the analog and digital grounds must be connected to together at the
ADC.
• Fill void areas on signal layers with ground fill.
• Provide good ground return paths. Signal return currents will flow on the path of least impedance. If the
ground plane is cut or has other traces that block the current from flowing right next to the signal trace, it will
have to find another path to return to the source and complete the circuit. If it is forced into a larger path, it
increases the chance that the signal will radiate. Sensitive signals will be more susceptible to EMI
interference.
• Use bypass capacitors on supplies to reduce high frequency noise. Do not place vias between bypass
capacitors and the active device. Placing the bypass capacitors on the same layer as close to the active
device yields the best results.
• Consider the resistance and inductance of the routing. Often, traces for the inputs have resistances that react
with the input bias current and cause an added error voltage. Reducing the loop area enclosed by the source
signal and the return current will reduce the inductance in the path. Reducing the inductance will reduce the
EMI pickup and reduce the high frequency impedance seen by the device.
• Watch for parasitic thermocouples in the layout. Dissimilar metals going from each analog input to the sensor
may create a parasitic themocouple which can add an offset to the measurement. Differential inputs should
be matched for both the inputs going to the measurement source.
• Analog inputs with differential connections must have a capacitor placed differentially across the inputs. Best
input combinations for differential measurements use adjacent analog input lines such as AIN0, AIN1 and
AIN2, AIN3. The differential capacitors must be of high quality. The best ceramic chip capacitors are C0G
(NPO), which have stable properties and low noise characteristics.

Copyright © 2008–2016, Texas Instruments Incorporated Submit Documentation Feedback 89

Product Folder Links: ADS1246 ADS1247 ADS1248
ADS1246, ADS1247, ADS1248
SBAS426H – AUGUST 2008 – REVISED MARCH 2016 www.ti.com

12.2 Layout Example

Digital
supply

DVDD SCLK Route digital

lines away from
analog and
DGND DIN reference inputs

DOUT/
CLK DRDY
Other
Controller SPI
digital
RESET DRDY

REFP0 CS
+2.5 V Positive
analog
REFN0 START supply
Reference
inputs
REFP1 AVDD

REFN1 AVSS Negative

analog
±2.5 V supply
Internal VREFOUT IEXC1
reference Excitation currents
bypass may be routed to
Place ground elements measured
VREFCOM plane under IEXC2 by the analog inputs
device and then routed to
the reference inputs
AIN0 AIN3

AIN1 AIN2
Analog
inputs
AIN4 AIN7

Use differential AIN5 AIN6

and common-
mode capacitors
for analog inputs
as shown for AIN0
and AIN1

Figure 124. ADS124x Layout Example

90 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated

Product Folder Links: ADS1246 ADS1247 ADS1248

 ADS1246, ADS1247, ADS1248
www.ti.com SBAS426H – AUGUST 2008 – REVISED MARCH 2016

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation
For related documentation see the following:
• Example Temperature Measurement Applications Using the ADS1247 and ADS1248, SBAA180
• RTD Ratiometric Measurements and Filtering Using the ADS1148 and ADS1248 Family of Devices,
SBAA201
• 3-Wire RTD Measurement System Reference Design, –200°C to 850°C, SLAU520
• A Glossary of Analog-to-Digital Specifications and Performance Characteristics, SBAA147

13.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.

Table 54. Related Links

TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY
DOCUMENTS SOFTWARE COMMUNITY
ADS1246 Click here Click here Click here Click here Click here
ADS1247 Click here Click here Click here Click here Click here
ADS1248 Click here Click here Click here Click here Click here

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

13.4 Trademarks
E2E is a trademark of Texas Instruments.
SPI is a trademark of Motorola, Inc.
All other trademarks are the property of their respective owners.
13.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright © 2008–2016, Texas Instruments Incorporated Submit Documentation Feedback 91

Product Folder Links: ADS1246 ADS1247 ADS1248
 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

ADS1246IPW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 105 ADS1246

ADS1246IPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 105 ADS1246

ADS1247IPW ACTIVE TSSOP PW 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 ADS1247

ADS1247IPWR ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 ADS1247

ADS1248IPW ACTIVE TSSOP PW 28 50 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ADS1248

ADS1248IPWR ACTIVE TSSOP PW 28 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ADS1248

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 3-Jun-2022

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
ADS1246IPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
ADS1247IPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
ADS1248IPWR TSSOP PW 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 3-Jun-2022

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
ADS1246IPWR TSSOP PW 16 2000 367.0 367.0 35.0
ADS1247IPWR TSSOP PW 20 2000 356.0 356.0 35.0
ADS1248IPWR TSSOP PW 28 2000 356.0 356.0 35.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 3-Jun-2022

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
ADS1246IPW PW TSSOP 16 90 530 10.2 3600 3.5
ADS1247IPW PW TSSOP 20 70 530 10.2 3600 3.5
ADS1248IPW PW TSSOP 28 50 530 10.2 3600 3.5

Pack Materials-Page 3
 PACKAGE OUTLINE
PW0020A SCALE 2.500
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

SEATING
6.6 C
TYP PLANE
A 6.2
0.1 C
PIN 1 INDEX AREA
18X 0.65
20
1

2X
6.6 5.85
6.4
NOTE 3

10
11
0.30
20X
4.5 0.19 1.2 MAX
B
4.3
NOTE 4 0.1 C A B

(0.15) TYP
SEE DETAIL A

0.25
GAGE PLANE 0.15
0.05

0.75
0.50
0 -8
DETAIL A
A 20

TYPICAL

4220206/A 02/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.

www.ti.com
 EXAMPLE BOARD LAYOUT
PW0020A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

20X (1.5) SYMM

(R0.05) TYP
1
20X (0.45) 20

SYMM
18X (0.65)

10 11

(5.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 10X

SOLDER MASK METAL UNDER SOLDER MASK

METAL SOLDER MASK OPENING
OPENING

EXPOSED METAL EXPOSED METAL

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED) SOLDER MASK DETAILS
15.000

4220206/A 02/2017
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
PW0020A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

20X (1.5) SYMM

(R0.05) TYP
1
20X (0.45) 20

SYMM
18X (0.65)

10 11

(5.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 10X

4220206/A 02/2017
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
 PACKAGE OUTLINE
PW0016A SCALE 2.500
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

SEATING
PLANE
6.6 C
TYP
A 6.2
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1

2X
5.1 4.55
4.9
NOTE 3

8
9
0.30
4.5 16X 1.2 MAX
B 0.19
4.3
NOTE 4 0.1 C A B

(0.15) TYP
SEE DETAIL A

0.25
GAGE PLANE
0.15
0.05

0.75
0.50
0 -8
DETAIL A
A 20

TYPICAL

4220204/A 02/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.

www.ti.com
 EXAMPLE BOARD LAYOUT
PW0016A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

16X (1.5) SYMM

(R0.05) TYP
1
16X (0.45) 16

SYMM

14X (0.65)

8 9

(5.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 10X

SOLDER MASK METAL UNDER SOLDER MASK

METAL SOLDER MASK OPENING
OPENING

EXPOSED METAL EXPOSED METAL

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED) SOLDER MASK DETAILS
15.000

4220204/A 02/2017
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
PW0016A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

16X (1.5) SYMM

(R0.05) TYP
1
16X (0.45) 16

SYMM

14X (0.65)

8 9

(5.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 10X

4220204/A 02/2017
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
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