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FusionServer XH321 V5 Server Node Technical White Paper

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54 views76 pages

FusionServer XH321 V5 Server Node Technical White Paper

Uploaded by

unitechtecnico
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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FusionServer XH321 V5 Server Node

Technical White Paper

Issue 06
Date 2023-02-28

xFusion Digital Technologies Co., Ltd.


Copyrights © xFusion Digital Technologies Co., Ltd. 2023. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior written
consent of xFusion Digital Technologies Co., Ltd.

Trademarks and Permissions


and other xFusion trademarks are trademarks of xFusion Digital Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.

Notice
In this document, "xFusion" is used to refer to "xFusion Digital Technologies Co., Ltd." for concise
description and easy understanding, which does not mean that "xFusion" may have any other meaning. Any
"xFusion" mentioned or described hereof may not be understood as any meaning other than "xFusion Digital
Technologies Co., Ltd.", and xFusion Digital Technology Co., Ltd. shall not bear any liability resulting from
the use of "xFusion".
The purchased products, services and features are stipulated by the contract made between xFusion and
the customer. All or part of the products, services and features described in this document may not be within
the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.

xFusion Digital Technologies Co., Ltd.


Address: 9th Floor, Building 1, Zensun Boya Square, Longzihu Wisdom Island
Zhengdong New District 450046
Zhengzhou, Henan Province
People's Republic of China
Website: https://www.xfusion.com

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FusionServer XH321 V5 Server Node
Technical White Paper Contents

Contents

About This Document ........................................................................................................ v


1 Product Overview ........................................................................................................... 7
2 Features ........................................................................................................................... 8
3 Physical Structure ........................................................................................................ 11
4 Logical Structure .......................................................................................................... 13
5 Hardware Description ................................................................................................... 14
5.1 Front Panel ...........................................................................................................................................14
5.1.1 Appearance .......................................................................................................................................14
5.1.2 Indicators and Buttons........................................................................................................................15
5.1.3 Ports ..................................................................................................................................................17
5.1.4 Installation Positions...........................................................................................................................18
5.2 Processor .............................................................................................................................................18
5.3 Memory.................................................................................................................................................19
5.3.1 DDR4 Memory ...................................................................................................................................19
5.3.1.1 Memory Identifier ............................................................................................................................19
5.3.1.2 Memory Subsystem Architecture .....................................................................................................21
5.3.1.3 Memory Compatibility ......................................................................................................................21
5.3.1.4 DIMM Installation Rules ...................................................................................................................23
5.3.1.5 Memory Installation Positions ..........................................................................................................24
5.3.1.6 Memory Protection Technologies .....................................................................................................25
5.4 Storage .................................................................................................................................................25
5.4.1 Drive Configuration ............................................................................................................................25
5.4.2 Drive Numbering ................................................................................................................................26
5.4.3 Drive indicators ..................................................................................................................................28
5.4.4 RAID Controller Card .........................................................................................................................28
5.5 Network ................................................................................................................................................28
5.5.1 LOMs .................................................................................................................................................28
5.6 I/O Expansion .......................................................................................................................................31
5.6.1 PCIe Cards ........................................................................................................................................31
5.6.2 PCIe Slots ..........................................................................................................................................31
5.6.3 PCIe Slot Description .........................................................................................................................31

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Technical White Paper Contents

5.7 Boards ..................................................................................................................................................32


5.7.1 Mainboard ..........................................................................................................................................32

6 Product Specifications ................................................................................................. 34


6.1 Technical Specifications ........................................................................................................................34
6.2 Environmental Specifications .................................................................................................................37
6.3 Physical Specifications ..........................................................................................................................39

7 Software and Hardware Compatibility......................................................................... 40


8 Safety Instructions........................................................................................................ 41
8.1 Security.................................................................................................................................................41
8.2 Maintenance and Warranty....................................................................................................................44

9 System Management .................................................................................................... 45


10 Certifications ............................................................................................................... 47
A Appendix ....................................................................................................................... 48
B Glossary ........................................................................................................................ 68
C Acronyms and Abbreviations ...................................................................................... 71

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Technical White Paper About This Document

About This Document

Purpose
This document describes the FusionServer XH321 V5 server node in terms of
features, structure, specifications, and component hardware and software
compatibility.

Intended Audience
This document is intended for pre-sales engineers.

Symbol Conventions
The symbols that may be found in this document are defined as follows.

Symbol Description
Indicates a hazard with a high level of risk which, if not
avoided, will result in death or serious injury.
Indicates a hazard with a medium level of risk which, if
not avoided, could result in death or serious injury.
Indicates a hazard with a low level of risk which, if not
avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to
personal injury.
Supplements the important information in the main text.
NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.

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Technical White Paper About This Document

Change History
Issue Date Description
06 2023-02-28 ⚫ Updated 5.7.1 Mainboard .
⚫ Added A.5 Sensor List.

05 2022-11-11 Updated 8.1 Security.


04 2022-08-12 ⚫ Optimized 6.3 Physical Specifications .
⚫ Added A.1 Node Label.
03 2022-06-25 ⚫ Added a figure that shows how to measure
dimensions.
⚫ Updated 5.4.1 Drive Configuration and 5.4.2
Drive Numbering.
⚫ Added 5.4.3 Drive indicators.
02 2022-03-18 Added 10 Certifications.
01 2021-12-20 This issue is the first official release.

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FusionServer XH321 V5 Server Node
Technical White Paper 1 Product Overview

1 Product Overview

The FusionServer XH321 V5 (XH321 V5) is a server node designed for X6000
servers. An X6000 can house up to four XH321 V5 server nodes in a 2U chassis.
The XH321 V5 delivers supreme performance and high storage density in limited
space through innovative design. It is easy to manage and maintain.
The XH321 V5 supports six 2.5-inch SAS/SATA/NVMe drives or three 3.5-inch
SAS/SATA drives, up to 16 DDR4 memory modules, and two PCIe standard cards.
The XH321 V5 is ideal for data center, cloud computing, Big Data, and Internet
applications.

Figure 1-1 XH321 V5

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Technical White Paper 2 Features

2 Features

Performance and Scalability


⚫ Powered by two Intel® Xeon® Scalable Skylake or Cascade Lake processors, the
server provides up to 28 cores, 3.8 GHz frequency, a 38.5 MB L3 cache, and two
10.4 GT/s UPI links between the processors, which deliver supreme processing
performance.
− It supports up to two processors with 56 cores and 112 threads to maximize
the concurrent execution of multithreaded applications.
− An L2 cache is added. Each core can exclusively use 1 MB of L2 cache and
at least 1.375 MB of L3 cache.
− Intel Turbo Boost Technology 2.0 allows processor cores to run faster than
the frequency specified in the Thermal Design Power (TDP) configuration if
they are operating below power, current, and temperature specification
limits.
− Intel Hyper-Threading Technology enables each processor core to run up to
two threads, improving parallel computation capability.
− The hardware-assisted Intel® Virtualization Technology (Intel® VT) allows
operating system (OS) vendors to better use hardware to address
virtualization workloads.
− Intel® Advanced Vector Extensions (Intel AVX 2.0 and Intel AVX-512)
significantly accelerate floating-point performance for computing-intensive
applications.
− The Cascade Lake processors support Intel® Deep Learning Boost vector
neural network instructions (VNNI) to improve the performance of deep
learning applications.
⚫ The 1.2 V DDR4 memory modules consume 20% less power than 1.35 V DDR3L
memory modules used by the previous-generation platform.
⚫ The server node supports double data rate 4 (DDR4) registered dual in-line
memory modules (RDIMMs) and load-reduced DIMMs (LRDIMMs) with error
checking and correcting (ECC). A server node fully configured with sixteen 2933
MT/s memory modules (only available with Cascade Lake processors) provides 1
TB memory space and the maximum theoretical memory bandwidth of 274.97
GB/s.
⚫ With Intel integrated I/O, the Intel® Xeon® Scalable processors integrate the PCIe
3.0 controller to shortens I/O latency and improve overall system performance.

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Technical White Paper 2 Features

⚫ It supports six SATA/SAS HDDs and NVMe SSDs. The SSDs deliver higher I/O
performance than HDDs. An SSD supports approximately 100 times more I/O
operations per second (IOPS) than a typical HDD.
⚫ Two half-height half-length (HHHL) PCIe SSD cards can be configured to support
high-bandwidth low-delay data access.

Availability and Serviceability


⚫ Carrier-class components with process expertise ensure high system reliability
and availability.
⚫ The server node supports six 2.5-inch or three 3.5-inch hot-swappable drives. It
supports RAID 0, 1, 1E, 5, 6, 10, 50, and 60, depending on the RAID controller
card used. It also uses a supercapacitor to protect the RAID cache data against
power failures.
⚫ The server provides simplified O&M and efficient troubleshooting through the
UID/HLY LED indicators on the front panel, fault diagnosis LED, and iBMC
WebUI.
⚫ The SSDs offer better reliability than HDDs, ensuring continued system
performance.
⚫ The iBMC monitors system parameters in real time, triggers alarms, and
performs recovery actions in case of failures, minimizing system downtime.
⚫ For more information about the warranty in the Chinese market, see Warranty.

Manageability and Security


⚫ The built-in iBMC monitors server operating status and provides remote
management.
⚫ The integrated Unified Extensible Firmware Interface (UEFI) improves setup,
configuration, and update efficiency and simplifies fault handling.
⚫ The Advanced Encryption Standard–New Instruction (AES NI) algorithm allows
faster and stronger encryption.
⚫ Intel Execute Disable Bit (EDB) function prevents certain types of malicious buffer
overflow attacks when working with a supported OS.
⚫ The Network Controller Sideband Interface (NC-SI) allows a network port to
serve as a management port and a service port for maximized return on
investment (ROI) for customers. The NC-SI feature is disabled by default and can
be enabled through the iBMC or BIOS.
⚫ Intel Trusted Execution Technology enhances security using hardware-based
defense against malicious software attacks, allowing applications to run
independently.
⚫ The trusted platform module (TPM) 2.0 provides advanced encryption functions,
such as digital signatures and remote authentication.

The service port with NC-SI enabled supports the following configuration:
⚫ Configuring the LOM port (NIC Mezz) of the server as the service port with NC-SI enabled.
LOM port 1 is configured by default.
⚫ Enabling, disabling, and setting a virtual local area network (VLAN) ID for this port. The VLAN
ID is 0 and disabled by default.
⚫ Configuring IPv4 addresses (IPv4 address, subnet mask, and gateway) and IPv6 addresses
(IPv6 address, prefix length, and gateway) for this port.

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Technical White Paper 2 Features

Energy Efficiency
⚫ The Intel® Xeon® Scalable processors outperform the previous-generation
processors while fitting into the same TDP.
⚫ Efficient voltage regulator-down (VRD) power supplies for boards minimize the
energy loss from DC/DC power conversion.
⚫ Intel® Intelligent Power Capability allows a processor to be powered on or off
based on requirements.
⚫ Low-voltage Intel® Xeon® Scalable processors consume less energy, ideally
suited for data centers and telecommunications environments constrained by
power and thermal limitations.
⚫ Staggered spin-up for drives reduces the server boot power consumption.
⚫ The 1.2 V DDR4 RDIMMs consume 20% less energy than 1.5 V DDR3 RDIMMs.
⚫ SSDs consume 80% less power than HDDs.
⚫ The server supports intelligent frequency scaling of processors for energy
conservation and consumption reduction.
⚫ The quadrilateral ventilation holes on the node panel provide higher ventilation
density than round holes, increasing the system cooling efficiency.

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Technical White Paper 3 Physical Structure

3 Physical Structure

Figure 3-1 XH321 V5 physical structure

1 Air duct 2 Air duct for the


supercapacitor
3 RAID controller card/PCIe 4 Supercapacitor
card
5 Narrow conjoined heat sink 6 Wide conjoined heat sink
7 Battery 8 Mainboard
9 Processor 10 PCIe riser module

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Technical White Paper 3 Physical Structure

11 PCIe card 12 Memory


13 Node case 14 M.2 SSD card
15 TPM (with M.2 ports) - -

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Technical White Paper 4 Logical Structure

4 Logical Structure

Figure 4-1 XH321 V5 logical structure

⚫ The server supports one or two Intel® Xeon® Scalable processors.


⚫ The server supports up to 16 memory modules.
⚫ The CPUs (processors) interconnect with each other through two UPI links at a
speed of up to 10.4 GT/s.
⚫ The PCIe cards connected to the processors provide service ports.
⚫ The RAID controller card connects to the mainboard using a SAS cable and
connects to the system backplane through a connector.
⚫ The BMC chipset interconnects with the PCH through PCIe and LPC buses to
provide a management interface.
⚫ The BMC integrates the graphics card, video compression, and virtual media
component to provide device management functions, such as power control, slot
ID acquisition, power supply detection, and KVM over IP.

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Technical White Paper 5 Hardware Description

5 Hardware Description

5.1 Front Panel


5.2 Processor
5.3 Memory
5.4 Storage
5.5 Network
5.6 I/O Expansion
5.7 Boards

5.1 Front Panel


5.1.1 Appearance
Figure 5-1 Front view

1 PCIe card (RAID controller 2 PCIe cards


card not configured)
3 Slide-out label plate (with - -

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an SN label)

5.1.2 Indicators and Buttons


Indicator and Button Positions

Figure 5-2 Indicators and buttons on the front panel

1 LOM port indicator 2 Power button/indicator


3 UID button/indicator 4 Health status indicator
5 LOM port indicator 6 Data transmission status
indicator of the
management network port
7 Connection status indicator - -
of the management
network port

Indicator and Button Descriptions

Table 5-1 Description of indicators and buttons on the front panel


Sign Indicator and Description
Button
- LOM port For details, see 5.5.1 LOMs .
indicator
Power Power indicator:
button/indicato ⚫ Off: The device is not powered on.
r
⚫ Steady green: The device is powered on.
⚫ Blinking yellow: The iBMC is starting. The
power button is locked and cannot be
pressed. The iBMC is started in about 1
minute, and then the power indicator is steady

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Sign Indicator and Description


Button
yellow.
⚫ Steady yellow: The device is standby.
Power button:
⚫ When the device is powered on, you can
press this button to gracefully shut down the
OS.
NOTE
For different OSs, you may need to shut down the OS
as prompted.
⚫ When the device is powered on, holding down
this button for 6 seconds will forcibly power off
the device.
⚫ When the power indicator is steady yellow,
you can press this button to power on the
device.
Health status ⚫ Off: The device is powered off or is faulty.
indicator ⚫ Blinking red at 1 Hz: A major alarm has been
generated on the system.
⚫ Blinking red at 5 Hz: A critical alarm has been
generated on the system.
⚫ Steady green: The device is operating
properly.
UID The UID button/indicator helps identify and
button/indicato locate a device.
r UID indicator:
⚫ Off: The device is not being located.
⚫ Blinking or steady blue: The device is being
located.
UID button description:
⚫ You can control the UID indicator status by
pressing the UID button or using the iBMC.
⚫ You can press this button to turn on or off the
UID indicator.
⚫ You can press and hold down this button for 4
to 6 seconds to reset the iBMC.
- Data ⚫ Off: No data is being transmitted.
transmission ⚫ Blinking yellow: Data is being transmitted.
status
indicator of the
management
network port
- Connection ⚫ Off: The network port is not connected.
status ⚫ Steady green: The network port is properly
indicator of the connected.

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Technical White Paper 5 Hardware Description

Sign Indicator and Description


Button
management
network port

5.1.3 Ports
Port Positions
⚫ Ports on the front panel

Figure 5-3 Ports on the front panel

1 Universal connector port 2 LOM port 1


3 LOM port 2 4 Management network port

⚫ Ports on the multi-port cable

Figure 5-4 Ports on the multi-port cable

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1 VGA port 2 Two USB ports


3 Serial port 4 One USB port
5 Universal connector port - -

Port Description

Table 5-2 Ports on the front panel


Tool Type Quantity Description
LOM port 1 10GE optical 2 For details, see 5.5.1 LOMs .
port
LOM port 2 GE electrical 2
port
Universal - 1 Used to connect a multi-port
connector port cable, which provides one
DB-15 VGA port, three USB 2.0
ports, and one RJ45 serial port.
Management RJ45 1 Used for server management.
network port NOTE
The management network port is a
GE port that supports 100 Mbit/s
and 1000 Mbit/s auto-negotiation.

5.1.4 Installation Positions


An X6000 can house a maximum of four XH321 V5 nodes in a 2U chassis.

Figure 5-5 Installation positions

5.2 Processor
⚫ The server supports one or two processors.
⚫ If only one processor is required:
− Install it in socket CPU1.
− NVMe SSDs are not supported.

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⚫ The processor heat sink varies depending on the processor power:


− If the maximum processor power is 165 W, use a narrow conjoined heat sink.

When Intel® Xeon® Scalable (Gold 6144, Gold 6146, Gold 6244, or Gold 6252N) processors are
configured, wide conjoined heat sinks are required to meet the high heat dissipation
requirement.
− If the processor power is higher than 165 W, use a wide conjoined heat sink.
⚫ The same model of processors must be used in a server.
⚫ Contact your local sales representative or use the Compatibility Checker to
determine the components to be used.

Figure 5-6 Processor positions

5.3 Memory
5.3.1 DDR4 Memory
5.3.1.1 Memory Identifier
You can determine the memory module properties based on the label attached to the
memory module.

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Figure 5-7 Memory identifier

Callout Description Definition


1 Capacity of the memory module ⚫ 8 GB
⚫ 16 GB
⚫ 32 GB
⚫ 64 GB
⚫ 128 GB
2 Number of ranks of the memory ⚫ 1R: single-rank
module ⚫ 2R: dual-rank
⚫ 4R: quad-rank
⚫ 8R: octal-rank
3 Data width on the DRAM ⚫ X4: 4-bit
⚫ X8: 8-bit
4 Type of the memory interface ⚫ PC3: DDR3
⚫ PC4: DDR4
5 Maximum memory speed ⚫ 2133 MT/S
⚫ 2400 MT/S
⚫ 2666 MT/S
⚫ 2933 MT/S
⚫ 3200 MT/S
6 Column Access Strobe (CAS) ⚫ P: 15
latency ⚫ T: 17
7 DIMM type ⚫ R: RDIMM
⚫ L: LRDIMM

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Technical White Paper 5 Hardware Description

5.3.1.2 Memory Subsystem Architecture


The XH321 V5 provides 16 memory slots. Each processor integrates six memory
channels.
Install the memory modules in the primary memory channels first. If the primary
memory channel is not populated, the memory modules in secondary memory
channels cannot be used.

Table 5-3 Memory channels


CPU Memory Channel Memory Slot
CPU 1 1A (primary) DIMM000(A)
1A DIMM001(G)
1B DIMM010(B)
1C DIMM020(C)
1D (primary) DIMM030(D)
1D DIMM031(H)
1E DIMM040(E)
1F DIMM050(F)
CPU 2 2A (primary) DIMM100(A)
2A DIMM101(G)
2B DIMM110(B)
2C DIMM120(C)
2D (primary) DIMM130(D)
2D DIMM131(H)
2E DIMM140(E)
2F DIMM150(F)

5.3.1.3 Memory Compatibility


Observe the following rules when configuring DDR4 DIMMs:

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⚫ A server must use the same model of DDR4 DIMMs, and all the DIMMs operate at
the same speed, which is the smallest value of:
⚫ Memory speed supported by a processor
⚫ Maximum operating speed of a DIMM
⚫ The DDR4 DIMMs of different types (RDIMM and LRDIMM) and specifications
(capacity, bit width, rank, and height) cannot be used together.
⚫ Contact your local sales representative or use the Compatibility Checker to
determine the components to be used.
⚫ The memory can be used with Intel® Xeon® Scalable Skylake and Cascade Lake
processors. The maximum memory capacity supported varies depending on the
processor model.
− Skylake processors
◼ M processors: 1.5 TB/socket
◼ Other processors: 768 GB/socket
− Cascade Lake processors
◼ L processors: 4.5 TB/socket
◼ M processors: 2 TB/socket
◼ Other processors: 1 TB/socket
⚫ The total memory capacity is the sum of the capacity of all DDR4 DIMMs.

The total memory capacity cannot exceed the maximum memory capacity supported
by the CPUs.
⚫ Use the Compatibility Checker to determine the capacity type of a single memory
module.
⚫ The maximum number of DIMMs supported by a server varies depending on the
CPU type, memory type, rank quantity, and operating voltage.

Each memory channel supports a maximum of 8 ranks. The number of DIMMs supported by
each channel varies depending on the number of ranks supported by each channel:
Number of DIMMs supported by each channel ≤ Number of ranks supported by each memory
channel/Number of ranks supported by each DIMM
⚫ A memory channel supports more than eight ranks for LRDIMMs.

A quad-rank LRDIMM generates the same electrical load as a single-rank RDIMM on a memory
bus.

Table 5-4 DDR4 memory specifications


Parameter Specifications
Maximum capacity per DDR4 DIMM (GB) 64

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Technical White Paper 5 Hardware Description

Parameter Specifications
Rated speed (MT/s) 2933
Operating voltage (V) 1.2
Maximum number of DDR4 DIMMs in a nodea 16
Maximum DDR4 memory capacity of the node (GB)b 1024
Maximum operating 1DPCc 2933d
speed (MT/s)
2DPC 2666
⚫ a: The maximum number of DDR4 memory modules is based on dual-processor
configuration. The value is halved for a server with only one processor.
⚫ b: The maximum DDR4 memory capacity varies depending on the processor
type. The value listed in this table is based on the assumption that DIMMs are
fully configured.
⚫ c: DPC (DIMM per channel) indicates the number of DIMMs per channel.
⚫ d: If the Cascade Lake processor is used, the maximum operating speed of a
DIMM can reach 2933 MT/s. If the Skylake processor is used, the maximum
operating speed of a DIMM can reach 2666 MT/s only. Different CPUs possess
different specifications, For details about the CPU parameters, see the Intel
official website.
⚫ The information listed in this table is for reference only. For details, consult the
local sales representative.

5.3.1.4 DIMM Installation Rules


⚫ Observe the following when configuring DDR4 memory modules:
− Install memory modules only when corresponding processors are installed.
− Do not install LRDIMMs and RDIMMs in the same server.
− Install filler memory modules in vacant slots.
⚫ Observe the following when configuring DDR4 memory modules in specific
operating mode:
− Memory sparing mode
◼ Comply with the general installation guidelines.
◼ Each memory channel must have a valid online spare configuration.
◼ The channels can have different online spare configurations.
◼ Each populated channel must have a spare rank.
− Memory mirroring mode
◼ Comply with the general installation guidelines.
◼ Each processor supports two integrated memory controllers (IMCs). At
least two channels of each IMC are used for installing memory modules
(channels 1 and 2, or channels 1, 2, and 3). The installed memory
modules must be identical in size and organization.
◼ For a multi-processor configuration, each processor must have a valid
memory mirroring configuration.

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Technical White Paper 5 Hardware Description

− Memory scrubbing mode


◼ Comply with the general installation guidelines.

5.3.1.5 Memory Installation Positions


An XH321 V5 supports a maximum of 16 DDR4 DIMMs. To maximize the
performance, balance the total memory capacity between the installed processors
and load the channels similarly whenever possible.

At least one DDR4 DIMM must be installed in the memory slots corresponding to CPU
1.

Figure 5-8 Memory slots

Figure 5-9 DDR4 memory installation guidelines (1 processor)

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Technical White Paper 5 Hardware Description

Figure 5-10 DDR4 memory installation guidelines (2 processors)

5.3.1.6 Memory Protection Technologies


The following memory protection technologies are supported:
⚫ ECC
⚫ Full mirroring
⚫ Address range mirroring
⚫ SDDC
⚫ SDDC+1
⚫ Rank sparing mode
⚫ Static virtual lockstep
⚫ Faulty DIMM isolation
⚫ Memory thermal throttling
⚫ Memory address parity protection
⚫ Memory demand/patrol scrubbing
⚫ Device tagging
⚫ Data scrambling
⚫ Adaptive double device data correction (ADDDC)
⚫ ADDDC+1

5.4 Storage
5.4.1 Drive Configuration
Table 5-5 Drive configuration
Specifies the hard drive Maximum Drives Drive Management
type. Mode
Built-in M.2 SSD 2 -

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Specifies the hard drive Maximum Drives Drive Management


type. Mode
⚫ Slots 1 to 2 support
only M.2 SSD a
M.2 FRU SSD 2 -
⚫ Slots 0 to 1 support
only M.2 FRU SSD
6 x 2.5-inch drives 6 ⚫ SAS drive: one PCIe
configuration b RAID controller card
(SAS/SATA/NVMe) ⚫ SATA drive: one PCIe
RAID controller
card/PCH
pass-through
⚫ NVMe drive: CPU
pass-through
3 x 3.5-inch drives 3 ⚫ SAS/SATA drive: one
configuration b PCIe RAID controller
(SAS/SATA) card
⚫ SAS/SATA drive: one
PCIe RAID controller
card/PCH
pass-through
⚫ a: The M.2 SSDs come in two sizes 2242 and 2280, and support the SATA
interface.
⚫ b: For details about the drives, see the FusionServer X6000 Server V100R005
User Guide
⚫ Contact your local sales representative or use the Compatibility Checker to
determine the components to be used.

5.4.2 Drive Numbering

The XH321 V5 supports six 2.5-inch SAS/SATA/NVMe drives or three 3.5-inch SAS/SATA drives.
For details about the drives, see the .

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Figure 5-11 M.2 SSD numbering

Figure 5-12 M.2 FRU SSD numbering

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5.4.3 Drive indicators


M.2 FRU Indicators

Figure 5-13 M.2 FRU indicators

Table 5-6 M.2 FRU indicator description

Indicator Description
M.2 FRU fault indicator ⚫ Off: The M.2 FRU is running properly.
⚫ Blinking yellow: The M.2 FRU is being located, or
RAID is being rebuilt.
⚫ Steady yellow: The M.2 FRU is faulty or not detected.
M.2 FRU activity ⚫ Off: The M.2 FRU is not in position or is faulty.
indicator ⚫ Blinking green: Data is being read, written, or
synchronized.
⚫ Steady green: The M.2 FRU is inactive.

5.4.4 RAID Controller Card


The RAID controller card supports RAID configuration, RAID level migration, and
drive roaming.
⚫ Contact your local sales representative or use the Compatibility Checker to
determine the components to be used.
⚫ For details about the RAID controller card, see V5 Server RAID Controller Card
User Guide.

5.5 Network
5.5.1 LOMs
LOMs provide network expansion capabilities.

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Table 5-7 LOM description


NIC Chip Port Type Numb Rate Supported Rates Not
Type Model er of Negotiatio Rates Supported
Ports n Mode
LOM X722 10GE 2 Auto-negoti 10000M 10/100/100
s optical ation 0M
port 10,000
Mbit/s (full
duplex)
GE 2 Auto-negoti 1000M 10/100M
electrical ation 1000
port Mbit/s (full
duplex)
⚫ Use Compatibility Checker to obtain information about the cables and optical
modules supported by the LOM ports.
⚫ The LOM ports do not support forced rates.
⚫ The electrical LOM ports cannot be connected to power over Ethernet (PoE)
devices (such as a switch with PoE enabled). Connecting a LOM port to a PoE
device may cause link communication failure or even damage the NIC.
⚫ The electrical LOM ports (GE electrical ports) do not support SR-IOV.
⚫ Forcibly powering off a server will cause intermittent NC-SI disconnection and
disable the WOL function of the LOM ports. To restore the NC-SI connection,
refresh the iBMC WebUI.

Figure 5-14 LOM port

1 10GE optical port (LOM 2 10GE optical port (LOM


port 1) port 2)
3 GE electrical port (LOM 4 GE electrical port (LOM
port 3) port 4)

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Indicator Positions

Figure 5-15 LOM indicators

1 Connection status 2 Data transmission rate


indicator/Data transmission indicator for a 10GE optical
status indicator for a 10GE port
optical port
3 Data transmission status 4 Connection status indicator
indicator of a GE electrical of a GE electrical port
port

Indicator Description

Table 5-8 LOM indicators


Indicator Description
Connection status ⚫ Off: The network port is not connected.
indicator/Data ⚫ Blinking green: Data is being transmitted.
transmission status
indicator for a 10GE
⚫ Steady green: The network port is properly connected.
optical port
Data transmission rate ⚫ Off: The network port is not connected.
indicator for a 10GE ⚫ Steady green: The data transmission rate is 10 Gbit/s.
optical port
Connection status ⚫ Off: The network port is not connected.
indicator of a GE ⚫ Steady green: The network port is properly connected.
electrical port
Data transmission ⚫ Off: Inactive.
status indicator of a ⚫ Steady yellow: Active, but no data is being transmitted.
GE electrical port
⚫ Blinking yellow: Data is being transmitted.

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5.6 I/O Expansion


5.6.1 PCIe Cards
PCIe cards provide ease of expandability and connection.
⚫ The electrical ports provided by PCIe NICs cannot be connected to power over
Ethernet (PoE) devices (such as a switch with PoE enabled). Connecting such an
electrical port to a PoE device may cause link communication failure or even
damage the NIC.
⚫ Contact your local sales representative or use the Compatibility Checker to
determine the components to be used.
⚫ When IB cards are used to build an IB network, ensure that the IPoIB modes of
the IB cards at both ends of the network are the same. For details, contact
technical support.

5.6.2 PCIe Slots


Figure 5-16 PCIe Slot

5.6.3 PCIe Slot Description

The PCIe slots mapping to a vacant CPU socket are unavailable.

Table 5-9 PCIe slot description


PCIe CPU PCIe Connec Bus Port B/D/F Slot
Slot Standa tor Width No. Size
rds Width
RAID CPU 1 PCIe x8 x8 Port1C 1c/00/0 -
controll 3.0
er card
LOM CPU 1 PCIe - x8 Port1A 17/00/0 -
3.0
Slot 1 CPU 1 PCIe x16 x16 Port3A 5d/00/0 HHHL
3.0

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PCIe CPU PCIe Connec Bus Port B/D/F Slot


Slot Standa tor Width No. Size
rds Width
Slot 2 CPU 1 PCIe x16 x16 Port2A 3a/00/0 HHHL
3.0
⚫ The B/D/F (Bus/Device/Function Number) values are the default values when
the server is fully configured with PCIe devices. The values may vary if the
server is not fully configured with PCIe devices or if a PCIe card with a PCI
bridge is configured.
⚫ The PCIe x16 slots are backward compatible with PCIe x8, PCIe x4, and PCIe
x1 cards. The PCIe cards are not forward compatible. That is, the PCIe slot
width cannot be smaller than the PCIe card link width.

5.7 Boards
5.7.1 Mainboard
Figure 5-17 XH321 V5 mainboard

1 PCIe card slot 1 (J3) 2 Southbridge (U4214)


3 RAID controller card 4 Slimline connector
connector (J48) (J20008/corresponding to
CPU1)
5 CPU1 (J15) 6 DIMM050 connector (J32)
7 DIMM040 connector (J30) 8 DIMM030 connector (J28)
9 DIMM031 connector 10 CPU2 (J12)
(J20004)
11 DIMM150 connector (J44) 12 DIMM140 connector (J42)
13 DIMM130 connector (J40) 14 DIMM131 connector

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(J20006)
15 Left guide sleeve (J168) 16 Slimline connector
(J20009/corresponding to
CPU2)
17 Power connector (J14) 18 Power connector (J16)
19 Signal connector (J18) 20 Signal connector (J2)
21 Signal connector (J19) 22 Right guide sleeve (J169)
23 DIMM101 connector 24 DIMM100 connector (J34)
(J20005)
25 DIMM110 connector (J36) 26 DIMM120 connector (J72)
27 DIMM001 connector 28 DIMM000 connector (J22)
(J20003)
29 DIMM010 connector (J24) 30 DIMM020 connector (J26)
31 M.2 connector Port 0 32 OPA signal connector
(J20010) (J20002)
33 M.2 connector Port 1 34 TPM signal connector (J55)
(J20011)
35 PCIe card slot 2 (J5) 36 NC-SI connector (J1)
37 Soft RAID key connector a 38 RTC battery (U4042)
(J130)
39 iBMC management 40 Onboard GE port 4 (J10)
network port (J11)
41 Onboard GE port 3 (J9) 42 UID button/indicator (S2)
43 Power button/indicator (S1) 44 2 x 10GE optical ports (F1)
45 Optical port indicator 46 High-density interface (J13)
(LED4/LED7)
a: The port is reserved.

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6 Product Specifications

6.1 Technical Specifications


6.2 Environmental Specifications
6.3 Physical Specifications

6.1 Technical Specifications


Table 6-1 Technical Specifications
Component Specifications
Form factor 2U4 server node
Chipset Intel® C622
Processor Supports one or two processors.
⚫ Intel® Xeon® Scalable (Skylake and Cascade Lake)
processors
⚫ Built-in memory controller and six memory channels
⚫ Built-in PCIe controller, supporting PCIe 3.0 and 48
lanes per processor
⚫ Two UPI buses between processors, providing up to
10.4GT/s transmission per channel
⚫ Up to 28 cores per processor
⚫ Max. 3.8 GHz
⚫ Min. 1.375 MB L3 cache per core
⚫ Max. 205 W TDP
NOTE
The preceding information is for reference only. Use the
Compatibility Checker to obtain specific information.

DIMM Supports 16 memory modules of the following types:


⚫ Up to 16 DDR4 memory modules
⚫ Max. 2933 MT/s memory speed

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Component Specifications
⚫ RDIMM and LRDIMM support
⚫ The DDR4 memory modules of different types
(RDIMM and LRDIMM) and specifications (capacity,
bit width, rank, and height) cannot be used together.
NOTE
The preceding information is for reference only. Use the
Compatibility Checker to obtain specific information.

Storage Supports a variety of drive configurations. For details, see


5.4.1 Drive Configuration .
⚫ Supports two or four M.2 SSDs.
− The PCH supports two M.2 SSDs. If an Avago
SAS3004iMR RAID controller card is configured,
the Avago SAS3004iMR supports two M.2 SSDs.
− When the Avago SAS3004iMR RAID controller
card is used with an SR450C-M, SR430C-ML, or
SR150-M RAID controller card, the drive letter of
the M.2 SSDs managed by the Avago
SAS3004iMR RAID controller card cannot be sda
on the OS.
NOTE
⚫ The M.2 SSD module is used only as the boot device when
the OS is installed. Small-capacity (32 GB or 64 GB) M.2
SSDs do not support logging due to poor endurance. If a
small-capacity M.2 SSD is used as the boot device, a
dedicated log drive or log server is required for logging. For
example, you can dump VMware logs in either of the following
ways:
⚫ Redirect /scratch. For details, see
https://kb.vmware.com/s/article/1033696.
⚫ Configure syslog. For details, see
https://kb.vmware.com/s/article/2003322.
⚫ The M.2 SSD cannot be used to store data due to poor
endurance. In write-intensive applications, the M.2 SSD will
wear out in a short time.
Use enterprise-level high endurance (HE) SSDs or HDDs for
data storage.
⚫ The M.2 SSD is not recommended for write-intensive service
software due to poor endurance.
⚫ Do not use the M.2 SSD as the cache.
⚫ Supports hot swap of SAS/SATA drives.
⚫ Supports a variety of RAID controller cards. Use the
Compatibility Checker to obtain information about the
specific RAID controller cards supported.
− The RAID controller card supports RAID
configuration, RAID level migration, and drive
roaming.
− The RAID controller card does not occupy a
standard PCIe slot.
For details about the RAID controller card, see V5

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Component Specifications
Server RAID Controller Card User Guide.
Network Supports LOM.
⚫ Supports two 10GE optical ports and two GE electrical
ports via the NIC chip integrated on the mainboard.
⚫ The LOM ports support NC-SI, WOL, and PXE.
NOTE
⚫ The electrical ports provided by LOMs and PCIe NICs cannot
be connected to PoE devices (such as a switch with PoE
enabled). Connecting such an electrical port to a PoE device
may cause link communication failure or even damage the
NIC.
⚫ Forcibly powering off a server will cause intermittent NC-SI
disconnection and disable the WOL function of the LOM ports.
To restore the NC-SI connection, refresh the iBMC WebUI.

I/O expansion 3 PCIe 3.0 slots:


⚫ One slot dedicated for a screw-in RAID controller card
and two for standard PCIe cards.
For details, see 5.6.2 PCIe Slots and 5.6.3 PCIe Slot
Description.
⚫ Support PCIe SSD cards to bolster I/O performance
for applications such as searching, caching, and
download services.
⚫ When IB cards are used to build an IB network, ensure
that the IPoIB modes of the IB cards at both ends of
the network are the same. For details, contact
technical support.
NOTE
The preceding information is for reference only. Use the
Compatibility Checker to obtain specific information.

Port Supports a variety of ports.


⚫ Ports on the front panel:
− One universal connector port
− One system management port
− Two GE electrical ports
− Two 10GE optical ports
⚫ Built-in ports:
− Two SATADOM ports
Video card An SM750 video chip with 32 MB display memory is
integrated on the mainboard. The maximum display
resolution is 1920 x 1200 at 60 Hz with 16 M colors.
NOTE
⚫ SM750 is not supported by servers running the Windows
Server 2019 or Windows Server 2019 Hyper-V operating
systems that are in secure boot mode.
⚫ The integrated video card can provide the maximum display
resolution (1920 x 1200) only after the video card driver

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Component Specifications
matching the operating system version is installed. Otherwise,
only the default resolution supported by the operating system
is provided.

System management ⚫ Supports UEFI.


⚫ Supports iBMC.
⚫ Supports NC-SI.
⚫ Supports integration with third-party management
systems.
Security feature ⚫ Power-on password
⚫ Administrator password
⚫ TPM (only outside China)
⚫ Secure boot

6.2 Environmental Specifications


Table 6-2 Environmental specifications
Category Specifications
Temperature ⚫ Operating temperature: 5°C to 35°C (41°F to 95°F)
(ASHRAE Class A1/A2 compliant)
⚫ Storage temperature (within three months): –30°C to
+60°C (–22°F to +140°F)
⚫ Storage temperature (within six months): –15°C to
+45°C (5°F to 113°F)
⚫ Storage temperature (within one year): –10°C to
+35°C (14°F to 95°F)
⚫ Maximum rate of temperature change: 20°C (36°F) per
hour, 5°C (9°F) per 15 minutes
NOTE
⚫ If a single fan is faulty:

⚫ The highest operating temperature supported is 30°C (86°F).


⚫ If the power consumption of the processor is 125 W or higher,
the system performance may be affected or a temperature
alarm may be generated.
⚫ When the server is configured with 6248R or 6258R
processors, the highest operating temperature is 30°C (86°F).
⚫ The highest operating temperature varies depending on the
server configuration. For details, see A.3 Operating
Temperature Limitations.

Relative humidity (RH, ⚫ Operating humidity: 8% to 90%


non-condensing) ⚫ Storage humidity (within three months): 8% to 85%
⚫ Storage humidity (within six months): 8% to 80%

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Category Specifications
⚫ Storage humidity (within one year): 20% to 75%
⚫ Maximum change rate: 20%/h
Operating altitude ≤3050m
⚫ When the server configuration complies with ASHRAE
Classes A1 and A2 and the altitude is above 900 m
(2952.76 ft), the highest operating temperature
decreases by 1°C (1.8°F) for every increase of 300 m
(984.25 ft).
⚫ HDDs cannot be used at an altitude of over 3050 m
(10006.44 ft).
⚫ Titanium PSUs are required for the altitude higher than
3050 m (10006.44 ft).
Corrosive gaseous Maximum corrosion product thickness growth rate:
contaminant ⚫ Copper corrosion rate test: 300 Å/month (meeting
level G1 requirements of the ANSI/ISA-71.04-2013
standard on gaseous corrosion)
⚫ Silver corrosion rate test: 200 Å/month
Particle contaminant ⚫ The equipment room environment meets the
requirements of ISO 14664-1 Class 8.
⚫ There is no explosive, conductive, magnetic, or
corrosive dust in the equipment room.
NOTE
It is recommended that the particulate pollution in the equipment
room be monitored by a professional agency.

SSDs and HDDs (including NL-SAS, SAS, and SATA) cannot be preserved for a long time in the
power-off state. Data may be lost or faults may occur if the preservation duration exceeds the
specified maximum duration. When drives are preserved under the storage temperature and
humidity specified in the preceding table, the following preservation time is recommended:
⚫ Maximum preservation duration of SSDs:
⚫ 12 months in power-off state without data stored
⚫ 3 months in power-off state with data stored
⚫ Maximum preservation duration of HDDs:
⚫ 6 months in unpacked/packed and powered-off state
⚫ The maximum preservation duration is determined according to the preservation
specifications provided by drive vendors. For details, see the manuals provided by drive
vendors.

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6.3 Physical Specifications


Table 6-3 Physical specifications
Item Description
Dimensions (H x W x 40.5 mm x 177.9 mm x 545.5 mm (1.59 in. x 7.00 in. x
D) 21.48 in.)

Figure 6-1 Physical dimensions

NOTE
See Figure 6-1 for methods in measuring physical dimensions of
the server node.

Fully equipped weight ⚫ Net weight: 4.2 kg (9.26 lb)


⚫ Packaging material weight: 2.73 kg (6.02 lb)
Energy consumption The power consumption parameters vary with server
configurations, including the configurations complying
with energy-related products (ErP) requirements. Use the
Power Calculator to obtain specific information.

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Technical White Paper 7 Software and Hardware Compatibility

7 Software and Hardware Compatibility

Use the Compatibility Checker to obtain information about the operating systems and
hardware supported.

⚫ If incompatible components are used, the device may be abnormal. This fault is
beyond the scope of technical support and warranty.
⚫ The performance of servers is closely related to application software, basic
middleware software, and hardware. The slight differences of the application
software, middleware basic software, and hardware may cause performance
inconsistency between the application layer and test software layer.
⚫ If the customer has requirements on the performance of specific application
software, contact sales personnel to apply for POC tests in the pre-sales phase to
determine detailed software and hardware configurations.
⚫ If the customer has requirements on hardware performance consistency, specify
the specific configuration requirements (for example, specific drive models, RAID
controller cards, or firmware versions) in the pre-sales phase.

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Technical White Paper 8 Safety Instructions

8 Safety Instructions

8.1 Security
8.2 Maintenance and Warranty

8.1 Security
General Statement
⚫ Comply with local laws and regulations when installing devices. These Safety
Instructions are only a supplement.
⚫ The "DANGER", "WARNING", and "CAUTION" information in this document does
not represent all the safety instructions, but supplements to the safety
instructions.
⚫ Observe all safety instructions provided on the device labels when installing
hardware. Follow them in conjunction with these Safety Instructions.
⚫ Only qualified personnel are allowed to perform special tasks, such as performing
high-voltage operations and driving a forklift.

If this device works in a residential environment, the wireless interference may be


generated.

Human Safety
⚫ This equipment is not suitable for use in places where children may be present.
⚫ Only certified or authorized personnel are allowed to install the device.
⚫ Discontinue any dangerous operations and take protective measures. Report
anything that could cause personal injury or device damage to a project
supervisor.
⚫ Do not move devices or install racks and power cables in hazardous weather
conditions.

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⚫ Do not carry the weight that is over the maximum load per person allowed by
local laws or regulations. Before moving or installing equipment, check the
maximum equipment weight and arrange required personnel.
⚫ Wear clean protective gloves, ESD clothing, a protective hat, and protective
shoes, as shown in Figure 8-1.

Figure 8-1 Safety work wear

⚫ Before touching a device, wear ESD clothing and gloves (or wrist strap), and
remove any conductive objects (such as watches and jewelry). Figure 8-2 shows
conductive objects that must be removed before you touch a device.

Figure 8-2 Removing conductive objects

Figure 8-3 shows how to wear an ESD wrist strap.


a. Put your hands into the ESD wrist strap.
b. Tighten the strap buckle and ensure that the ESD wrist strap is in contact
with your skin.
c. Insert the ground terminal attached to the ESD wrist strap into the jack on the
grounded rack or chassis.

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Figure 8-3 Wearing an ESD wrist strap

⚫ Exercise caution when using tools.


⚫ If the installation position of the device is higher than the shoulders of the
installation personnel, use a vehicle such as a lift to facilitate installation. Prevent
the equipment from falling down and causing personal injury or damage to the
equipment.
⚫ The equipment is powered by high-voltage power sources. Direct or indirect
contact (especially through damp objects) with high-voltage power sources may
result in serious injury or death.
⚫ Ground the equipment before powering it on. Otherwise, personal injury may be
caused by high electricity leakage.
⚫ When a ladder is used, ensure that another person holds the ladder steady to
prevent accidents.
⚫ When connecting, testing, or replacing an optical cable, do not look into the
optical port without eye protection.

Equipment Safety
⚫ Use the recommended power cables at all times.
⚫ Use power cables only for dedicated servers. Do not use them for other devices.
⚫ Before operating equipment, wear ESD clothes and gloves to prevent
electrostatic-sensitive devices from being damaged by ESD.
⚫ When moving a device, hold the bottom of the device. Do not hold the handles of
the installed modules, such as the PSUs, fan modules, drives, and the mainboard.
Handle the equipment with care.
⚫ Exercise caution when using tools that could cause personal injury.
⚫ If the device is configured with active and standby PSUs, connect power cables
of active and standby PSUs to different power distribution units (PDUs) to ensure
reliable system operating.
⚫ Ground the equipment before powering it on.

Transportation Precautions
Improper transportation may damage equipment. Contact the manufacturer for
precautions before attempting transportation.
Transportation precautions include but are not limited to:
⚫ The logistics company engaged to transport the device must be reliable and
comply with international standards for transporting electronics. Ensure that the

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Technical White Paper 8 Safety Instructions

equipment being transported is always kept upright. Take necessary precautions


to prevent collisions, corrosion, package damage, damp conditions and pollution.
⚫ Transport the equipment in its original packaging.
⚫ If the original packaging is unavailable, package heavy, bulky parts (such as
chassis and blades) and fragile parts (such as PCIe GPUs and SSDs) separately.

Use Compatibility Checker to obtain information abut the components supported by a node or
server.
⚫ Power off all devices before transportation.

Maximum Weight Carried by a Person

To reduce the risk of personal injury, comply with local regulations with regard to the
maximum weight one person is permitted to carry.

Table 8-1 lists the maximum weight one person is permitted to carry as stipulated by a
number of organizations.

Table 8-1 Maximum weight carried per person


Organization Weight (kg/lb)
European Committee for 25/55.13
Standardization (CEN)
International Organization for 25/55.13
Standardization (ISO)
National Institute for Occupational 23/50.72
Safety and Health (NIOSH)
Health and Safety Executive (HSE) 25/55.13

For more information about safety instructions, see Server Safety Information.

8.2 Maintenance and Warranty


For details about the maintenance policy, visit Customer Support Service.
For details about the warranty policy, visit Warranty.

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Technical White Paper 9 System Management

9 System Management

The server uses the next-generation Intelligent Baseboard Management Controller


(iBMC) to implement remote server management. The iBMC complies with IPMI 2.0
and provides highly reliable hardware monitoring and management.

Features
The iBMC supports the following features and protocols:
⚫ KVM and text console redirection
⚫ Remote virtual media
⚫ IPMI
⚫ SNMP
⚫ Common information model (CIM)
⚫ Redfish
⚫ Browser-based login

Specifications

Table 9-1 iBMC specifications


Specifications Description
Management interface Integrates with any standard management system
through the following interfaces:
⚫ IPMI
⚫ CLI
⚫ HTTPS
⚫ SNMP
⚫ Redfish
Fault Detection Detects and accurately locates faults in a field
replaceable unit (FRU).
System watchdog Supports BIOS POST, OS watchdog, and automatic
system reset after fault timeout. Users can enable or
disable these features individually.

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Technical White Paper 9 System Management

Specifications Description
Setting of boot device Supports out-of-band configuration for the boot
device.
Alarm management Supports alarm management and reports alarms
using the SNMP trap, SMTP, and syslog service to
ensure 24/7 operating.
Integrated virtual KVM Provides remote maintenance measures and VNC
service for troubleshooting.
Integrated virtual media Virtualizes local media devices, images, USB keys,
and folders into media devices on a remote server,
simplifying OS installation. (The virtual DVD-ROM
drive supports a maximum transmission rate of 8
MB/s.)
WebUI Provides a user-friendly graphical user interface
(GUI), which simplifies users' configuration and query
operations.
Fault reproduction Reproduces faults to facilitate fault diagnosis.
Screen snapshots and Allows users to view screenshots and videos without
videos login, facilitating routine preventive maintenance
inspection (PMI).
Black Box Allows users to enable or disable the black box
function and download black box data.
DNS/LDAP Supports domain management and directory
services, which significantly simplify network and
configuration management.
Dual-image backup Allows a boot from the backup image when the active
software crashes.
Device asset management Provides intelligent asset management, supporting
unified management and stocktaking of assets in
use.
Intelligent power Uses the power capping technology to increase
management deployment density, and uses dynamic energy
saving to lower operating expenses.
IPv6 Supports IPv6 to help build an all-IPv6 environment.
Network Controller Supports NC-SI, allowing access to the iBMC through
Sideband Interface (NC-SI) the service network port.

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Technical White Paper 10 Certifications

10 Certifications

Region Country Certification Certification Mark


China China CCC

RoHS

Europe European Union CE-DOC

ROHS NA
REACH NA
WEEE

UK UKCA NA
North America North America NRTL-ETL/MET

US FCC

Canada IC
Asia Pacific Japan VCCI

Global IECEE members CB NA

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FusionServer XH321 V5 Server Node
Technical White Paper A Appendix

A Appendix

A.1 Node Label


Figure A-1 Position of the XH321 V5 label

Table A-1 XH321 V5 label description


No. Description
1 Serial number of the server node.
For details, see A.2 Product SN.

A.2 Product SN
The serial number (SN) on the slide-out label plate uniquely identifies a device. The
SN is required when you contact technical support.

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Figure A-2 Example SN

Table A-2 SN description


No. Description
1 ESN ID (two characters), which can only be 21.
2 Material ID (eight characters), that is, the processing code.
3 Vendor code (two characters), that is, the code of the processing
place.
4 Year and month (two characters).
⚫ The first character indicates the year.
− Digits 1 to 9 indicate years 2001 to 2009, respectively.
− Letters A to H indicate years 2010 to 2017, respectively.
− Letters J to N indicate years 2018 to 2022, respectively.
− Letters P to Y indicate years 2023 to 2032, respectively.
NOTE
The years from 2010 are represented by upper-case letters excluding I, O,
and Z because the three letters are similar to the digits 1, 0, and 2.
⚫ The second character indicates the month.
− Digits 1 to 9 indicate January to September, respectively.
− Letters A to C indicate October to December, respectively.
5 Serial number (six digits).
6 RoHS compliance (one character). Y indicates RoHS compliant.
7 Internal model (product name) of the board.

A.3 Operating Temperature Limitations

For configurations not listed in the table, the operating temperature range is 5°C (41°F) to 30°C
(86°F). For special configuration and temperature requirements, contact technical support.

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A.3.1 Operating Temperature Limitations (Supercapacitor for


the RAID Controller Card Configured)
Table A-3 Operating temperature specifications (with a RAID controller card
supercapacitor configured)
Drive Drive Quantity (Q) CPU Power (P) Maximum
Backplane Temperature
X6000 V5 C00 16 < Q ≤ 24 P ≤ 165 W 30°C (86°F)
24 NVMe
backplane 8 < Q ≤ 16 125 W ≤ P ≤ 165 W 30°C (86°F)
P < 125 W 35°C (95°F)
X6000 V5 C00 16 < Q ≤ 24 125 W ≤ P ≤ 165 W 32°C (89.6°F)
24 SAS
backplane P < 125 W 35°C (95°F)
8 < Q ≤ 16 140 W ≤ P ≤ 165 W 32°C (89.6°F)
P < 140 W 35°C (95°F)
0<Q≤8 P ≤ 165 W 35°C (95°F)
X6000 V5 C10 16 < Q ≤ 24 165 W < P ≤ 205 W N/A
24 NVMe
backplane P ≤ 165 W 30°C (86°F)
8 < Q ≤ 16 165 W < P ≤ 205 W N/A
125 W ≤ P ≤ 165 W 30°C (86°F)
P < 125 W 35°C (95°F)
0 < Q ≤ 8 (NVMe / /
backplane not used)
X6000 V5 C10 16 < Q ≤ 24 165 W < P ≤ 205 W N/A
24 SAS
backplane 125 W ≤ P ≤ 165 W 32°C (89.6°F)
P < 125 W 35°C (95°F)
8 < Q ≤ 16 165 W < P ≤ 205 W 30°C (86°F)
140 W ≤ P ≤ 165 W 32°C (89.6°F)
P < 140 W 35°C (95°F)
0<Q≤8 165 W < P ≤ 205 W 32°C (89.6°F)
P ≤ 165 W 35°C (95°F)
X6000 V5 C10 8 < Q ≤ 12 165 W < P ≤ 205 W N/A
12 x 3.5" SAS
backplane 125 W ≤ P ≤ 165 W 32°C (89.6°F)
P < 125 W 35°C (95°F)
4<Q≤8 165 W < P ≤ 205 W 30°C (86°F)

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Drive Drive Quantity (Q) CPU Power (P) Maximum


Backplane Temperature

140 W ≤ P ≤ 165 W 32°C (89.6°F)


P < 140 W 35°C (95°F)
0<Q≤4 165 W < P ≤ 205 W 32°C (89.6°F)
P ≤ 165 W 35°C (95°F)

A.3.2 Operating Temperature Limitations (Optical Modules


Configured)
Table A-4 Operating temperature specifications (with an optical module configured)
Drive Drive CPU Power Maximum Maximum
Backplane Quantity (Q) (P) Temperature Temperature
(Onboard (PCIe Optical
Optical Module)
Module)
X6000 V5 C00 16 < Q ≤ 24 140 W < P ≤ 30°C (86°F) 30°C (86°F)
24 NVMe 165 W
backplane
125 W < P ≤ 35°C (95°F) 30°C (86°F)
140 W
P ≤ 125 W 35°C (95°F) 35°C (95°F)
8 < Q ≤ 16 140 W < P ≤ 30°C (86°F) 30°C (86°F)
165 W
125 W < P ≤ 35°C (95°F) 30°C (86°F)
140 W
P ≤ 125 W 35°C (95°F) 35°C (95°F)
0<Q≤8 140 W < P ≤ 35°C (95°F) 30°C (86°F)
165 W
P ≤ 140 W 35°C (95°F) 35°C (95°F)
X6000 V5 C00 16 < Q ≤ 24 140 W < P ≤ 35°C (95°F) 30°C (86°F)
24 SAS 165 W
backplane
P ≤ 140 W 35°C (95°F) 30°C/86°F
(35°C/95°F for
10GE optical
modules)
8 < Q ≤ 16 140 W < P ≤ 35°C (95°F) 30°C (86°F)
165 W
P ≤ 140 W 35°C (95°F) 35°C (95°F)

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Drive Drive CPU Power Maximum Maximum


Backplane Quantity (Q) (P) Temperature Temperature
(Onboard (PCIe Optical
Optical Module)
Module)
0<Q≤8 P ≤ 165 W 35°C (95°F) 35°C (95°F)
X6000 V5 C10 16 < Q ≤ 24 165 W < P ≤ N/A N/A
24 NVMe 205 W
backplane
140 W < P ≤ 30°C (86°F) 30°C (86°F)
165 W
125 W < P ≤ 35°C (95°F) 30°C (86°F)
140 W
P ≤ 125 W 35°C (95°F) 35°C (95°F)
8 < Q ≤ 16 165 W < P ≤ N/A N/A
205 W
140 W < P ≤ 30°C (86°F) 30°C (86°F)
165 W
125 W < P ≤ 35°C (95°F) 30°C (86°F)
140 W
P ≤ 125 W 35°C (95°F) 35°C (95°F)
0<Q≤8 165 W < P ≤ 30°C (86°F) 30°C (86°F)
205 W
140 W < P ≤ 35°C (95°F) 30°C (86°F)
165 W
P ≤ 140 W 35°C (95°F) 35°C (95°F)
X6000 V5 C10 16 < Q ≤ 24 165 W < P ≤ N/A N/A
24 SAS 205 W
backplane
140 W < P ≤ 35°C (95°F) 30°C (86°F)
165 W
P ≤ 140 W 35°C (95°F) 30°C/86°F
(35°C/95°F for
10GE optical
modules)
8 < Q ≤ 16 165 W < P ≤ 30°C (86°F) 30°C (86°F)
205 W
140 W < P ≤ 35°C (95°F) 30°C (86°F)
165 W
P ≤ 140 W 35°C (95°F) 35°C (95°F)
0<Q≤8 165 W < P ≤ 35°C (95°F) 30°C (86°F)
205 W

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Drive Drive CPU Power Maximum Maximum


Backplane Quantity (Q) (P) Temperature Temperature
(Onboard (PCIe Optical
Optical Module)
Module)
P ≤ 165 W 35°C (95°F) 35°C (95°F)
X6000 V5 C10 8 < Q ≤ 12 165 W < P ≤ N/A N/A
12 x 3.5" SAS 205 W
backplane
140 W < P ≤ 35°C (95°F) 30°C (86°F)
165 W
P ≤ 140 W 35°C (95°F) 30°C/86°F
(35°C/95°F for
10GE optical
modules)
4<Q≤8 165 W < P ≤ 30°C (86°F) 30°C (86°F)
205 W
140 W < P ≤ 35°C (95°F) 30°C (86°F)
165 W
P ≤ 140 W 35°C (95°F) 35°C (95°F)
0<Q≤4 165 W < P ≤ 35°C (95°F) 30°C (86°F)
205 W
P ≤ 165 W 35°C (95°F) 35°C (95°F)

A.3.3 Operating Temperature Limitations (Avago SAS3004iMR


RAID Controller Card + M.2 FRU Configured)
Table A-5 Operating temperature specifications (with Avago SAS3004iMR RAID
controller card + M.2 FRU configured)
Drive Drive Quantity (Q) CPU Power (P) Maximum
Backplane Temperature
X6000 V5 C00 16 < Q ≤ 24 140 W < P ≤ 165 W 28°C (82.4°F)
24 x 2.5"
NVMe P ≤ 140 W 32°C (89.6°F)
backplane
8 < Q ≤ 16 140 W < P ≤ 165 W 30°C (86°F)
P ≤ 140 W 35°C (95°F)
0<Q≤8 140 W < P ≤ 165 W 35°C (95°F)
P ≤ 140 W 35°C (95°F)
X6000 V5 C00 16 < Q ≤ 24 140 W < P ≤ 165 W 30°C (86°F)
24 x 2.5" SAS
P ≤ 140 W 35°C (95°F)

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Drive Drive Quantity (Q) CPU Power (P) Maximum


Backplane Temperature
backplane 8 < Q ≤ 16 140 W < P ≤ 165 W 32°C (89.6°F)
P ≤ 140 W 35°C (95°F)
0<Q≤8 P ≤ 165 W 35°C (95°F)
X6000 V5 C10 16 < Q ≤ 24 165 W < P ≤ 205 W N/A
24 x 2.5"
NVMe 140 W < P ≤ 165 W 30°C (86°F)
backplane
P ≤ 140 W 35°C (95°F)
8 < Q ≤ 16 165 W < P ≤ 205 W N/A
140 W < P ≤ 165 W 32°C (89.6°F)
P ≤ 140 W 35°C (95°F)
0<Q≤8 165 W < P ≤ 205 W 28°C (82.4°F)
P ≤ 165 W 35°C (95°F)
X6000 V5 C10 16 < Q ≤ 24 165 W < P ≤ 205 W N/A
24 x 2.5" SAS
backplane 140 W < P ≤ 165 W 30°C (86°F)
P ≤ 140 W 35°C (95°F)
8 < Q ≤ 16 165 W < P ≤ 205 W 28°C (82.4°F)
P ≤ 165 W 35°C (95°F)
0<Q≤8 165 W < P ≤ 205 W 32°C (89.6°F)
P ≤ 165 W 35°C (95°F)
X6000 V5 C10 8 < Q ≤ 12 165 W < P ≤ 205 W N/A
12 x 3.5" SAS
backplane 140 W < P ≤ 165 W 30°C (86°F)
P ≤ 140 W 35°C (95°F)
4<Q≤8 165 W < P ≤ 205 W 30°C (86°F)
140 W < P ≤ 165 W 35°C (95°F)
0<Q≤4 P ≤ 205 W 35°C (95°F)

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A.3.4 Operating Temperature Limitations (Different Models of


Processors)
Table A-6 Operating temperature specifications (different models of processors)
Drive Processor Heat Sink Drive and Max. Air Inlet
Backplane Model Memory Temperature
Configuratio
n
X6000 V5 C00 Intel® Xeon® Narrow ⚫ Drives ≤ 24 35°C (95°F)
24 x 2.5" SAS Scalable conjoined heat ⚫ DIMMs ≤
backplane (Skylake and sinks 16
Cascade
Lake)
processor (P ≤
165 W)a
X6000 V5 C00 Intel® Xeon® Narrow ⚫ Drives ≤ 24 35°C (95°F)
24 x 2.5 Scalable conjoined heat ⚫ DIMMs ≤
NVMe (Skylake and sinks 16
backplane Cascade
Lake)
processor (P ≤
165 W)a
X6000 V5 C10 Intel® Xeon® Wide ⚫ 0 < drives ≤ 30°C (86°F)
24 x 2.5" Scalable conjoined heat 8
NVMe (Skylake and sinks ⚫ DIMMs ≤
backplane Cascade 12
Lake)
processor
(165 W < P ≤
205 W)
Intel® Xeon® Narrow ⚫ Drives ≤ 24 35°C (95°F)
Scalable conjoined heat ⚫ DIMMs ≤
(Skylake and sinks 16
Cascade
Lake) Wide ⚫ 0 < drives ≤ 30°C (86°F)
processor (P ≤ conjoined heat 8
165 W) sinksb ⚫ DIMMs ≤
12
X6000 V5 C10 Intel® Xeon® Wide ⚫ 8 < drives ≤ 30°C (86°F)
24 x 2.5" SAS Scalable conjoined heat 16
backplane (Skylake and sinks ⚫ DIMMs ≤
Cascade 12
Lake)
processor ⚫ 0 < drives ≤ 35°C (95°F)
(165 W < P ≤ 8
205 W) ⚫ DIMMs ≤
12
Intel® Xeon® Narrow ⚫ Drives ≤ 24 35°C (95°F)

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Drive Processor Heat Sink Drive and Max. Air Inlet


Backplane Model Memory Temperature
Configuratio
n
Scalable conjoined heat ⚫ DIMMs ≤
(Skylake and sinks 16
Cascade
Lake) Wide ⚫ 8 < drives ≤ 30°C (86°F)
processor (P ≤ conjoined heat 16
165 W) sinksb ⚫ DIMMs ≤
12
⚫ 0 < drives ≤ 35°C (95°F)
8
⚫ DIMMs ≤
12
X6000 V5 C10 Intel® Xeon® Wide ⚫ 4 < drives ≤ 30°C (86°F)
12 x 3.5" SAS Scalable conjoined heat 8
backplane (Skylake and sinks ⚫ DIMMs ≤
Cascade 12
Lake)
processor ⚫ 0 < drives ≤ 35°C (95°F)
(165 W < P ≤ 4
205 W) ⚫ DIMMs ≤
12
Intel® Xeon® Narrow ⚫ Drives ≤ 12 35°C (95°F)
Scalable conjoined heat ⚫ DIMMs ≤
(Skylake and sinks 16
Cascade
Lake) Wide ⚫ 4 < drives ≤ 30°C (86°F)
processor (P ≤ conjoined heat 8
165 W) sinksb ⚫ DIMMs ≤
12
⚫ 0 < drives ≤ 35°C (95°F)
4
⚫ DIMMs ≤
12
⚫ a: The C00 model does not support Intel® Xeon® Scalable (Gold 6144, Gold
6146, Gold 6244, and Gold 6252N) processors.
⚫ b: When Intel® Xeon® Scalable (Gold 6144, Gold 6146, Gold 6244, or Gold
6252N) processors are configured, wide conjoined heat sinks are required to
meet the high heat dissipation requirement.

A.4 RAS Features


The server supports a variety of Reliability, Availability, and Serviceability (RAS)
features. You can configure these features for better performance.

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For details about how to configure these features, see the Server Purley Platform
BIOS Parameter Reference.

Table A-7 Supported RAS features

Module Feature Description


CPU Corrected Machine Check Corrects error-triggered interrupts.
Interrupt (CMCI)

Memory Failed DIMM Isolation Identifies faulty DIMMs to facilitate


isolation and replacement of the faulty
DIMMs.
Memory Thermal Throttling Automatically adjusts the memory
temperature to prevent the memory from
being damaged due to overheat.
Rank Sparing Uses some memory ranks for backup to
prevent the system from breaking down
due to uncorrectable errors.
Memory Address Parity Detects memory command and address
Protection errors.
Memory Demand and Corrects correctable errors upon
Patrol Scrubbing detection. If these errors are not
corrected in a timely manner,
uncorrectable errors may occur.
Memory Mirroring Provides high reliability for the system
via mirroring.

Single Device Data Corrects single-chip multi-bit errors to


Correction (SDDC) improve memory reliability.
Device Tagging Degrades and rectifies memory faults to
improve memory availability.
Data Scrambling Optimizes data flow distribution to
reduce the error probability and improve
memory data flow reliability and address
error detection.
PCIe PCIe Advanced Error Provides a PCIe advanced error
Reporting reporting mechanism to improve server
serviceability.
UPI Intel UPI Link Level Retry Provides a retry mechanism to improve
the reliability of UPI links.
Intel UPI Protocol Provides cyclic redundancy check
Protection via CRC (CRC) protection for UPI data packets to
improve system reliability.
System Core Disable For FRB Isolates a faulty CPU core during startup
(Fault Resilient Boot) to improve system reliability and
availability.

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Module Feature Description


Corrupt Data Containment Marks the memory storage unit when a
Mode data error occurs to limit the impact on
the running program and improve
system reliability.
Socket disable for FRB Isolates a faulty socket during the BIOS
(Fault Resilient Boot) startup process to improve system
reliability.
Architected Error Records With the features such as eMCA, the
BIOS collects error information recorded
in hardware registers in compliance with
UEFI specifications, notifies the OS
through the APEI interface of the ACPI,
and locates the error unit, improving
system availability.
Error Injection Support Implements fault injection to verify RAS
features.
Machine Check Provides a software repair function to
Architecture (MCA) rectify uncorrectable errors to improve
system availability.
Enhanced Machine Check Improves system availability.
Architecture (eMCA): Gen2
OOB access to MCA The out-of-band system can access
registers MCA registers through the PECI. When
a fatal error occurs in the system, the
out-of-band system can collect onsite
data to facilitate subsequent fault
analysis and locating and improve
system serviceability.
BIOS Abstraction Layer for The BIOS processes errors and reports
Error Handling error information to the OS based on
specifications, improving system
serviceability.
BIOS-based Predictive The OS takes the lead. The BIOS
Failure Analysis (PFA) provides information about physical
memory error units. The OS tracks,
predicts, and handles the errors.

A.5 Sensor List


Sensor Description Component
Inlet Temp Chassis air inlet Left mounting ear
temperature
Outlet Temp Air outlet temperature Mainboard

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Sensor Description Component


Raid BBU Temp RAID controller card RAID controller card
capacitor temperature
RAID Card BBU BBU of the screw-in RAID RAID controller card
controller card
PCH Temp PCH bridge temperature Mainboard
CPU1 Core Rem CPU core temperature CPU 1
CPU2 Core Rem CPU core temperature CPU 2
CPU1 DTS CPU DTS value CPU 1
CPU2 DTS CPU DTS value CPU 2
CPU1 Margin CPU Margin CPU 1
CPU2 Margin CPU Margin CPU 2
CPU1 Prochot CPU Prochot CPU 1
CPU2 Prochot CPU Prochot CPU2
CPU1 VDDQ Temp CPU VDDQ temperature Mainboard
CPU2 VDDQ Temp CPU VDDQ temperature Mainboard
CPU1 VRD Temp CPU VRD temperature Mainboard
CPU2 VRD Temp CPU VRD temperature Mainboard
CPU1 MEM Temp CPU DIMM temperature DIMMs of CPU 1
CPU2 MEM Temp CPU DIMM temperature DIMMs of CPU 2
CPU1 DDR VPP1 VPP_ABC voltage CPU 1
CPU1 DDR VPP2 VPP_DEF voltage CPU 1
CPU2 DDR VPP1 VPP_GHJ voltage CPU 2
CPU2 DDR VPP2 VPP_KLM voltage CPU 2
CPU1 VSA CPU 1 VSA voltage Mainboard
CPU2 VSA CPU 2 VSA voltage Mainboard
CPU1 VCCIO CPU 1 VCCIO voltage Mainboard
1 indicates the CPU
number.

CPU2 VCCIO CPU 2 VCCIO voltage Mainboard


2 indicates the CPU
number.
PCH VPVNN PCH VPVNN voltage Mainboard
PCH PRIM 1V05 PCH PRIM voltage Mainboard

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Sensor Description Component


SYS 3.3V Mainboard 3.3 V voltage Mainboard
SYS 5V Mainboard 5 V voltage Mainboard
SYS 12V_1 Mainboard 12 V voltage Mainboard
SYS 12V_2 Mainboard 12 V voltage Mainboard
CPU1 VCore 1.8 V CPU voltage Mainboard
CPU2 VCore 1.8 V CPU voltage Mainboard
CPU1 DDR VDDQ 1.2 V DIMM voltage Mainboard
CPU1 DDR VDDQ2 1.2 V DIMM voltage Mainboard
CPU2 DDR VDDQ 1.2 V DIMM voltage Mainboard
CPU2 DDR VDDQ2 1.2 V DIMM voltage Mainboard
MOS Volt Drop MOS transistor voltage Mainboard
drop of the mainboard
soft-start circuit
RAID Temp Temperature of the RAID RAID controller card
controller card
Disks Temp Maximum drive Drive
temperature
Power Board power PSU
FAN1 F Speed Fan speed Fan module 1
1 indicates the fan module
number.
FAN1 R Speed Fan speed Fan module 1
1 indicates the fan module
number.
FAN2 F Speed Fan speed Fan module 2
2 indicates the fan module
number.
FAN2 R Speed Fan speed Fan module 2
2 indicates the fan module
number.
FAN3 F Speed Fan speed Fan module 3
3 indicates the fan module
number.
FAN3 R Speed Fan speed Fan module 3
3 indicates the fan module
number.

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Sensor Description Component


FAN4 F Speed Fan speed Fan module 4
4 indicates the fan module
number.
FAN4 R Speed Fan speed Fan module 4
4 indicates the fan module
number.
Power1 PSU 1 input power PSU 1
1 indicates the PSU
number.
Power2 PSU 2 input power PSU 2
2 indicates the PSU
number.
PS1 VIN PSU 1 input voltage PSU 1
1 indicates the PSU
number.

PS2 VIN PSU 2 input voltage PSU 2


2 indicates the PSU
number.

CPU Usage CPU usage N/A


Memory Usage Memory usage N/A
CPU1 Status CPU status detection CPU 1
1 indicates the CPU
number.
CPU2 Status CPU status detection CPU 2
2 indicates the CPU
number.
CPU1 Memory DIMM status DIMMs of the CPU
1 indicates the DIMM
number.
CPU2 Memory DIMM status DIMMs of the CPU
2 indicates the DIMM
number.
PwrOk Sig. Drop Voltage drop status N/A
PS1 Presence PSU presence status PSU
1 indicates the PSU
number.
PS1 Status PSU fault status PSU
1 indicates the PSU
number.

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Sensor Description Component


PS2 Presence PSU presence status PSU
2 indicates the PSU
number.
PS2 Status PSU fault status PSU
2 indicates the PSU
number.
PS1 Fan Status PSU fan fault status PSU
1 indicates the PSU
number.
PS2 Fan Status PSU fan fault status PSU
2 indicates the PSU
number.
ACPI State ACPI status N/A
SysFWProgress Software processes and N/A
system startup errors
Power Button Power button pressed Right mounting ear
status
SysRestart System restart causes N/A
Boot Error Boot error N/A
Watchdog2 Watchdog N/A
Mngmnt Health Management subsystem N/A
health status
DISK0 Drive status Drive
0 indicates the physical
drive slot number.
DISK1 Drive status Drive
1 indicates the physical
drive slot number.
DISK2 Drive status Drive
2 indicates the physical
drive slot number.
DISK3 Drive status Drive
3 indicates the physical
drive slot number.
DISK4 Drive status Drive
4 indicates the physical
drive slot number.
DISK5 Drive status Drive

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Sensor Description Component


5 indicates the physical
drive slot number.
FAN1 F Presence Fan presence Fan module 1
1 indicates the fan module
number.
FAN1 R Presence Fan presence Fan module 1
1 indicates the fan module
number.
FAN2 F Presence Fan presence Fan module 2
2 indicates the fan module
number.
FAN2 R Presence Fan presence Fan module 2
2 indicates the fan module
number.
FAN3 F Presence Fan presence Fan module 3
3 indicates the fan module
number.
FAN3 R Presence Fan presence Fan module 3
3 indicates the fan module
number.
FAN4 F Presence Fan presence Fan module 4
4 indicates the fan module
number.
FAN4 R Presence Fan presence Fan module 4
4 indicates the fan module
number.
FAN1 F Status Fan fault status Fan module 1
1 indicates the fan module
number.
FAN1 R Status Fan fault status Fan module 1
1 indicates the fan module
number.
FAN2 F Status Fan fault status Fan module 2
2 indicates the fan module
number.
FAN2 R Status Fan fault status Fan module 2
2 indicates the fan module
number.
FAN3 F Status Fan fault status Fan module 3
3 indicates the fan module

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Sensor Description Component


number.
FAN3 R Status Fan fault status Fan module 3
3 indicates the fan module
number.
FAN4 F Status Fan fault status Fan module 4
4 indicates the fan module
number.
FAN4 R Status Fan fault status Fan module 4
4 indicates the fan module
number.

UID Button UID button status Indicator board on the


front panel

RAID Presence RAID controller card RAID controller card


presence
Riser1 Card Hardware presence Riser card 1
1 indicates the riser card
slot number.
Riser2 Card Hardware presence Riser card 2
2 indicates the riser card
slot number.
RTC Battery RTC battery status. An RTC battery on the
alarm is generated when mainboard
the voltage is lower than 1
V.
SAS Cable Hardware presence N/A
PS Cable PSU backplane signal PSU backplane
cable presence
FAN Backplane Fan backplane signal Fan board
cable presence
ChassisMgmtCable Aggregation network port Convergence network
backplane signal cable port backplane
presence
RAID Status RAID controller card RAID controller card
health status
DIMM000 DIMM status DIMM
000 indicates the DIMM
slot number.
DIMM001 DIMM status DIMM
001 indicates the DIMM
slot number.

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Sensor Description Component


DIMM010 DIMM status DIMM
010 indicates the DIMM
slot number.
DIMM020 DIMM status DIMM
020 indicates the DIMM
slot number.
DIMM030 DIMM status DIMM
030 indicates the DIMM
slot number.
DIMM031 DIMM status DIMM
031 indicates the DIMM
slot number.
DIMM040 DIMM status DIMM
040 indicates the DIMM
slot number.

DIMM050 DIMM status DIMM


050 indicates the DIMM
slot number.

DIMM100 DIMM status DIMM


100 indicates the DIMM
slot number.
DIMM101 DIMM status DIMM
101 indicates the DIMM
slot number.
DIMM110 DIMM status DIMM
110 indicates the DIMM
slot number.
DIMM120 DIMM status DIMM
120 indicates the DIMM
slot number.
DIMM130 DIMM status DIMM
130 indicates the DIMM
slot number.
DIMM131 DIMM status DIMM
131 indicates the DIMM
slot number.
DIMM140 DIMM status DIMM
140 indicates the DIMM
slot number.

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Sensor Description Component


DIMM150 DIMM status DIMM
150 indicates the DIMM
slot number.
PCIE Status Incorrect PCIe status PCIe device
PwrOn TimeOut Power-on timeout Mainboard
PwrCap Status Power capping status N/A
HDD Backplane Hardware presence N/A
Port# Link Down Network port link status N/A
Eth Heartbeat Heartbeat status N/A
RAID PCIE ERR RAID controller card fault RAID controller card
diagnosis health status
PS Redundancy Redundancy failure due PSU
to PSU removal
BMC Boot Up BMC startup event N/A
SEL Status SEL full or events being N/A
cleared
System Notice Hot restart reminder and Management board and
fault diagnosis program switch module
information collection
System Error System suspension or N/A
restart. Check the
background logs.
PCH Status PCH chip fault diagnosis Mainboard
health status
CPU1 UPI Link CPU QPI link fault Mainboard or CPU 1
diagnosis health status
CPU2 UPI Link CPU QPI link fault Mainboard or CPU 2
diagnosis health status
Op. Log Full Operation log full or N/A
events being cleared
Sec. Log Full Security log full or events N/A
being cleared
SSD Disk0 Temp SSD temperature SSD 0
0 indicates the drive slot
number.
SSD Disk1 Temp SSD temperature SSD 1
1 indicates the drive slot
number.

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FusionServer XH321 V5 Server Node
Technical White Paper A Appendix

Sensor Description Component


SSD Disk2 Temp SSD temperature SSD 2
2 indicates the drive slot
number.
SSD Disk3 Temp SSD temperature SSD 3
3 indicates the drive slot
number.
SSD Disk4 Temp SSD temperature SSD 4
4 indicates the drive slot
number.
SSD Disk5 Temp SSD temperature SSD 5
5 indicates the drive slot
number.
BMC Time Hopping Time hopping N/A
NTP Sync Failed NTP synchronization N/A
failure and recovery
events
Cert OverDue Certificate expiration N/A
check
Host Loss System monitoring N/A
software (BMA) link loss
detection
IB$ Temp IB NIC temperature PCIe card or IB card
CPU1 DCPMM Temp CPU DCPMM CPU 1
temperature
CPU2 DCPMM Temp CPU DCPMM CPU 2
temperature

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FusionServer XH321 V5 Server Node
Technical White Paper B Glossary

B Glossary

B.1 A-E
E
ejector lever A part on the panel of a device used to facilitate
installation or removal of the device.
Ethernet A baseband local area network (LAN) architecture
developed by Xerox Corporation by partnering with Intel
and DEC. Ethernet uses the Carrier Sense Multiple
Access/Collision Detection (CSMA/CD) access method
and allows data transfer over various cables at 10 Mbit/s.
The Ethernet specification is the basis for the IEEE 802.3
standard.

B.2 F-J
G
Gigabit Ethernet (GE) An extension and enhancement of traditional shared
media Ethernet standards. It is compatible with 10M and
100M Ethernet and complies with IEEE 802.3z standards.

H
hot swap Replacing or adding components without stopping or
shutting down the system.

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Technical White Paper B Glossary

B.3 K-O
K
KVM A hardware device that provides public keyboard, video
and mouse (KVM).

B.4 P-T
P
panel An external component (including but not limited to
ejector levers, indicators, and ports) on the front or rear of
the server. It seals the front and rear of the chassis to
ensure optimal ventilation and electromagnetic
compatibility (EMC).
Peripheral A computer bus PCI, which uses the existing PCI
Component programming concepts and communication standards,
Interconnect Express but builds a faster serial communication system. Intel is
(PCIe) the main sponsor for PCIe. PCIe is used only for internal
interconnection. A PCI system can be transformed to a
PCIe one by modifying the physical layer instead of
software. PCIe delivers a faster speed and can replace
almost all AGP and PCI buses.

R
redundancy A mechanism that allows a backup device to
automatically take over services from a faulty device to
ensure uninterrupted running of the system.
redundant array of A storage technology that combines multiple physical
independent disks drives into a logical unit for the purposes of data
(RAID) redundancy and performance improvement.

S
server A special computer that provides services for clients over
a network.
system event log Event records stored in the system used for subsequent
(SEL) fault diagnosis and system recovery.

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Technical White Paper B Glossary

B.5 U-Z
U
U A unit defined in International Electrotechnical
Commission (IEC) 60297-1 to measure the height of a
cabinet or chassis. 1 U = 44.45 mm

UltraPath A point-to-point processor interconnect developed by


Interconnect (UPI) Intel.

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FusionServer XH321 V5 Server Node
Technical White Paper C Acronyms and Abbreviations

C Acronyms and Abbreviations

C.1 A-E
A
AC alternating current
AES Advanced Encryption Standard New Instruction Set
ARP Address Resolution Protocol
AVX Advanced Vector Extensions

B
BBU backup battery unit
BIOS Basic Input/Output System

C
CD calendar day
CE Conformite Europeenne
CIM Common Information Model
CLI command-line interface

D
DC direct current
DCPMM DC persistent memory module

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Technical White Paper C Acronyms and Abbreviations

DDR3 Double Data Rate 3


DDR4 Double Data Rate 4
DDDC double device data correction
DEMT Dynamic Energy Management Technology
DIMM dual in-line memory module
DRAM dynamic random-access memory
DVD digital video disc

E
ECC error checking and correcting
ECMA European Computer Manufacturer Association
EDB Execute Disable Bit
EN European Efficiency
ERP enterprise resource planning
ETS European Telecommunication Standards

C.2 F-J
F
FB-DIMM Fully Buffered DIMM
FC Fiber Channel
FCC Federal Communications Commission
FCoE Fibre Channel over Ethernet
FTP File Transfer Protocol

G
GE Gigabit Ethernet
GPIO General Purpose Input/Output
GPU graphics processing unit

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FusionServer XH321 V5 Server Node
Technical White Paper C Acronyms and Abbreviations

H
HA high availability
HDD hard disk drive
HPC high-performance computing
HTTP Hypertext Transfer Protocol
HTTPS Hypertext Transfer Protocol Secure

I
iBMC intelligent baseboard management controller
IC Industry Canada
ICMP Internet Control Message Protocol
IDC Internet Data Center
IEC International Electrotechnical Commission
IEEE Institute of Electrical and Electronics Engineers
IGMP Internet Group Message Protocol
IOPS input/output operations per second
IP Internet Protocol
IPC intelligent power capability
IPMB Intelligent Platform Management Bus
IPMI Intelligent Platform Management Interface

C.3 K-O
K
KVM keyboard, video, and mouse

L
LC Lucent connector
LRDIMM load-reduced dual in-line memory module
LED light emitting diode

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Technical White Paper C Acronyms and Abbreviations

LOM LAN on motherboard

M
MAC media access control
MMC module management controller

N
NBD next business day
NC-SI Network Controller Sideband Interface

C.4 P-T
P
PCIe Peripheral Component Interconnect Express
PDU power distribution unit
PHY physical layer
PMBUS power management bus
POK power OK
PWM pulse-width modulation
PXE Preboot Execution Environment

Q
QPI Quick Path Interconnect

R
RAID redundant array of independent disks
RAS reliability, availability and serviceability
RDIMM registered dual in-line memory module
REACH Registration Evaluation and Authorization of Chemicals

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Technical White Paper C Acronyms and Abbreviations

RJ45 registered jack 45


RoHS Restriction of the Use of Certain Hazardous Substances
in Electrical and Electronic Equipment

S
SAS Serial Attached Small Computer System Interface
SATA Serial Advanced Technology Attachment
SCM supply chain management
SDDC single device data correction
SERDES serializer/deserializer
SGMII serial gigabit media independent interface
SMI serial management interface
SMTP Simple Mail Transfer Protocol
SNMP Simple Network Management Protocol
SOL serial over LAN
SONCAP Standards Organization of Nigeria-Conformity
Assessment Program
SSD solid-state drive
SSE Streaming SIMD Extensions

T
TACH tachometer signal
TBT Turbo Boost Technology
TCG Trusted Computing Group
TCM trusted cryptography module
TCO total cost of ownership
TDP thermal design power
TELNET Telecommunication Network Protocol
TET Trusted Execution Technology
TFM TransFlash module
TFTP Trivial File Transfer Protocol

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Technical White Paper C Acronyms and Abbreviations

TOE TCP offload engine


TPM trusted platform module

C.5 U-Z
U
UDIMM unbuffered dual in-line memory module
UEFI Unified Extensible Firmware Interface
UID unit identification light
UL Underwriter Laboratories Inc.
USB Universal Serial Bus

V
VCCI Voluntary Control Council for Interference by Information
Technology Equipment
VGA Video Graphics Array
VLAN virtual local area network
VRD voltage regulator-down

W
WEEE waste electrical and electronic equipment
WSMAN Web Service Management

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