FusionServer XH321 V5 Server Node Technical White Paper
FusionServer XH321 V5 Server Node Technical White Paper
Issue 06
Date 2023-02-28
Notice
In this document, "xFusion" is used to refer to "xFusion Digital Technologies Co., Ltd." for concise
description and easy understanding, which does not mean that "xFusion" may have any other meaning. Any
"xFusion" mentioned or described hereof may not be understood as any meaning other than "xFusion Digital
Technologies Co., Ltd.", and xFusion Digital Technology Co., Ltd. shall not bear any liability resulting from
the use of "xFusion".
The purchased products, services and features are stipulated by the contract made between xFusion and
the customer. All or part of the products, services and features described in this document may not be within
the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
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FusionServer XH321 V5 Server Node
Technical White Paper Contents
Contents
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Technical White Paper Contents
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FusionServer XH321 V5 Server Node
Technical White Paper About This Document
Purpose
This document describes the FusionServer XH321 V5 server node in terms of
features, structure, specifications, and component hardware and software
compatibility.
Intended Audience
This document is intended for pre-sales engineers.
Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol Description
Indicates a hazard with a high level of risk which, if not
avoided, will result in death or serious injury.
Indicates a hazard with a medium level of risk which, if
not avoided, could result in death or serious injury.
Indicates a hazard with a low level of risk which, if not
avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to
personal injury.
Supplements the important information in the main text.
NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.
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Technical White Paper About This Document
Change History
Issue Date Description
06 2023-02-28 ⚫ Updated 5.7.1 Mainboard .
⚫ Added A.5 Sensor List.
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Technical White Paper 1 Product Overview
1 Product Overview
The FusionServer XH321 V5 (XH321 V5) is a server node designed for X6000
servers. An X6000 can house up to four XH321 V5 server nodes in a 2U chassis.
The XH321 V5 delivers supreme performance and high storage density in limited
space through innovative design. It is easy to manage and maintain.
The XH321 V5 supports six 2.5-inch SAS/SATA/NVMe drives or three 3.5-inch
SAS/SATA drives, up to 16 DDR4 memory modules, and two PCIe standard cards.
The XH321 V5 is ideal for data center, cloud computing, Big Data, and Internet
applications.
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Technical White Paper 2 Features
2 Features
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Technical White Paper 2 Features
⚫ It supports six SATA/SAS HDDs and NVMe SSDs. The SSDs deliver higher I/O
performance than HDDs. An SSD supports approximately 100 times more I/O
operations per second (IOPS) than a typical HDD.
⚫ Two half-height half-length (HHHL) PCIe SSD cards can be configured to support
high-bandwidth low-delay data access.
The service port with NC-SI enabled supports the following configuration:
⚫ Configuring the LOM port (NIC Mezz) of the server as the service port with NC-SI enabled.
LOM port 1 is configured by default.
⚫ Enabling, disabling, and setting a virtual local area network (VLAN) ID for this port. The VLAN
ID is 0 and disabled by default.
⚫ Configuring IPv4 addresses (IPv4 address, subnet mask, and gateway) and IPv6 addresses
(IPv6 address, prefix length, and gateway) for this port.
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Technical White Paper 2 Features
Energy Efficiency
⚫ The Intel® Xeon® Scalable processors outperform the previous-generation
processors while fitting into the same TDP.
⚫ Efficient voltage regulator-down (VRD) power supplies for boards minimize the
energy loss from DC/DC power conversion.
⚫ Intel® Intelligent Power Capability allows a processor to be powered on or off
based on requirements.
⚫ Low-voltage Intel® Xeon® Scalable processors consume less energy, ideally
suited for data centers and telecommunications environments constrained by
power and thermal limitations.
⚫ Staggered spin-up for drives reduces the server boot power consumption.
⚫ The 1.2 V DDR4 RDIMMs consume 20% less energy than 1.5 V DDR3 RDIMMs.
⚫ SSDs consume 80% less power than HDDs.
⚫ The server supports intelligent frequency scaling of processors for energy
conservation and consumption reduction.
⚫ The quadrilateral ventilation holes on the node panel provide higher ventilation
density than round holes, increasing the system cooling efficiency.
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Technical White Paper 3 Physical Structure
3 Physical Structure
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Technical White Paper 3 Physical Structure
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Technical White Paper 4 Logical Structure
4 Logical Structure
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Technical White Paper 5 Hardware Description
5 Hardware Description
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Technical White Paper 5 Hardware Description
an SN label)
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5.1.3 Ports
Port Positions
⚫ Ports on the front panel
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Port Description
5.2 Processor
⚫ The server supports one or two processors.
⚫ If only one processor is required:
− Install it in socket CPU1.
− NVMe SSDs are not supported.
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Technical White Paper 5 Hardware Description
When Intel® Xeon® Scalable (Gold 6144, Gold 6146, Gold 6244, or Gold 6252N) processors are
configured, wide conjoined heat sinks are required to meet the high heat dissipation
requirement.
− If the processor power is higher than 165 W, use a wide conjoined heat sink.
⚫ The same model of processors must be used in a server.
⚫ Contact your local sales representative or use the Compatibility Checker to
determine the components to be used.
5.3 Memory
5.3.1 DDR4 Memory
5.3.1.1 Memory Identifier
You can determine the memory module properties based on the label attached to the
memory module.
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Technical White Paper 5 Hardware Description
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⚫ A server must use the same model of DDR4 DIMMs, and all the DIMMs operate at
the same speed, which is the smallest value of:
⚫ Memory speed supported by a processor
⚫ Maximum operating speed of a DIMM
⚫ The DDR4 DIMMs of different types (RDIMM and LRDIMM) and specifications
(capacity, bit width, rank, and height) cannot be used together.
⚫ Contact your local sales representative or use the Compatibility Checker to
determine the components to be used.
⚫ The memory can be used with Intel® Xeon® Scalable Skylake and Cascade Lake
processors. The maximum memory capacity supported varies depending on the
processor model.
− Skylake processors
◼ M processors: 1.5 TB/socket
◼ Other processors: 768 GB/socket
− Cascade Lake processors
◼ L processors: 4.5 TB/socket
◼ M processors: 2 TB/socket
◼ Other processors: 1 TB/socket
⚫ The total memory capacity is the sum of the capacity of all DDR4 DIMMs.
The total memory capacity cannot exceed the maximum memory capacity supported
by the CPUs.
⚫ Use the Compatibility Checker to determine the capacity type of a single memory
module.
⚫ The maximum number of DIMMs supported by a server varies depending on the
CPU type, memory type, rank quantity, and operating voltage.
Each memory channel supports a maximum of 8 ranks. The number of DIMMs supported by
each channel varies depending on the number of ranks supported by each channel:
Number of DIMMs supported by each channel ≤ Number of ranks supported by each memory
channel/Number of ranks supported by each DIMM
⚫ A memory channel supports more than eight ranks for LRDIMMs.
A quad-rank LRDIMM generates the same electrical load as a single-rank RDIMM on a memory
bus.
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Technical White Paper 5 Hardware Description
Parameter Specifications
Rated speed (MT/s) 2933
Operating voltage (V) 1.2
Maximum number of DDR4 DIMMs in a nodea 16
Maximum DDR4 memory capacity of the node (GB)b 1024
Maximum operating 1DPCc 2933d
speed (MT/s)
2DPC 2666
⚫ a: The maximum number of DDR4 memory modules is based on dual-processor
configuration. The value is halved for a server with only one processor.
⚫ b: The maximum DDR4 memory capacity varies depending on the processor
type. The value listed in this table is based on the assumption that DIMMs are
fully configured.
⚫ c: DPC (DIMM per channel) indicates the number of DIMMs per channel.
⚫ d: If the Cascade Lake processor is used, the maximum operating speed of a
DIMM can reach 2933 MT/s. If the Skylake processor is used, the maximum
operating speed of a DIMM can reach 2666 MT/s only. Different CPUs possess
different specifications, For details about the CPU parameters, see the Intel
official website.
⚫ The information listed in this table is for reference only. For details, consult the
local sales representative.
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At least one DDR4 DIMM must be installed in the memory slots corresponding to CPU
1.
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5.4 Storage
5.4.1 Drive Configuration
Table 5-5 Drive configuration
Specifies the hard drive Maximum Drives Drive Management
type. Mode
Built-in M.2 SSD 2 -
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The XH321 V5 supports six 2.5-inch SAS/SATA/NVMe drives or three 3.5-inch SAS/SATA drives.
For details about the drives, see the .
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Indicator Description
M.2 FRU fault indicator ⚫ Off: The M.2 FRU is running properly.
⚫ Blinking yellow: The M.2 FRU is being located, or
RAID is being rebuilt.
⚫ Steady yellow: The M.2 FRU is faulty or not detected.
M.2 FRU activity ⚫ Off: The M.2 FRU is not in position or is faulty.
indicator ⚫ Blinking green: Data is being read, written, or
synchronized.
⚫ Steady green: The M.2 FRU is inactive.
5.5 Network
5.5.1 LOMs
LOMs provide network expansion capabilities.
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Technical White Paper 5 Hardware Description
Indicator Positions
Indicator Description
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5.7 Boards
5.7.1 Mainboard
Figure 5-17 XH321 V5 mainboard
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Technical White Paper 5 Hardware Description
(J20006)
15 Left guide sleeve (J168) 16 Slimline connector
(J20009/corresponding to
CPU2)
17 Power connector (J14) 18 Power connector (J16)
19 Signal connector (J18) 20 Signal connector (J2)
21 Signal connector (J19) 22 Right guide sleeve (J169)
23 DIMM101 connector 24 DIMM100 connector (J34)
(J20005)
25 DIMM110 connector (J36) 26 DIMM120 connector (J72)
27 DIMM001 connector 28 DIMM000 connector (J22)
(J20003)
29 DIMM010 connector (J24) 30 DIMM020 connector (J26)
31 M.2 connector Port 0 32 OPA signal connector
(J20010) (J20002)
33 M.2 connector Port 1 34 TPM signal connector (J55)
(J20011)
35 PCIe card slot 2 (J5) 36 NC-SI connector (J1)
37 Soft RAID key connector a 38 RTC battery (U4042)
(J130)
39 iBMC management 40 Onboard GE port 4 (J10)
network port (J11)
41 Onboard GE port 3 (J9) 42 UID button/indicator (S2)
43 Power button/indicator (S1) 44 2 x 10GE optical ports (F1)
45 Optical port indicator 46 High-density interface (J13)
(LED4/LED7)
a: The port is reserved.
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Technical White Paper 6 Product Specifications
6 Product Specifications
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Technical White Paper 6 Product Specifications
Component Specifications
⚫ RDIMM and LRDIMM support
⚫ The DDR4 memory modules of different types
(RDIMM and LRDIMM) and specifications (capacity,
bit width, rank, and height) cannot be used together.
NOTE
The preceding information is for reference only. Use the
Compatibility Checker to obtain specific information.
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Technical White Paper 6 Product Specifications
Component Specifications
Server RAID Controller Card User Guide.
Network Supports LOM.
⚫ Supports two 10GE optical ports and two GE electrical
ports via the NIC chip integrated on the mainboard.
⚫ The LOM ports support NC-SI, WOL, and PXE.
NOTE
⚫ The electrical ports provided by LOMs and PCIe NICs cannot
be connected to PoE devices (such as a switch with PoE
enabled). Connecting such an electrical port to a PoE device
may cause link communication failure or even damage the
NIC.
⚫ Forcibly powering off a server will cause intermittent NC-SI
disconnection and disable the WOL function of the LOM ports.
To restore the NC-SI connection, refresh the iBMC WebUI.
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Technical White Paper 6 Product Specifications
Component Specifications
matching the operating system version is installed. Otherwise,
only the default resolution supported by the operating system
is provided.
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Category Specifications
⚫ Storage humidity (within one year): 20% to 75%
⚫ Maximum change rate: 20%/h
Operating altitude ≤3050m
⚫ When the server configuration complies with ASHRAE
Classes A1 and A2 and the altitude is above 900 m
(2952.76 ft), the highest operating temperature
decreases by 1°C (1.8°F) for every increase of 300 m
(984.25 ft).
⚫ HDDs cannot be used at an altitude of over 3050 m
(10006.44 ft).
⚫ Titanium PSUs are required for the altitude higher than
3050 m (10006.44 ft).
Corrosive gaseous Maximum corrosion product thickness growth rate:
contaminant ⚫ Copper corrosion rate test: 300 Å/month (meeting
level G1 requirements of the ANSI/ISA-71.04-2013
standard on gaseous corrosion)
⚫ Silver corrosion rate test: 200 Å/month
Particle contaminant ⚫ The equipment room environment meets the
requirements of ISO 14664-1 Class 8.
⚫ There is no explosive, conductive, magnetic, or
corrosive dust in the equipment room.
NOTE
It is recommended that the particulate pollution in the equipment
room be monitored by a professional agency.
SSDs and HDDs (including NL-SAS, SAS, and SATA) cannot be preserved for a long time in the
power-off state. Data may be lost or faults may occur if the preservation duration exceeds the
specified maximum duration. When drives are preserved under the storage temperature and
humidity specified in the preceding table, the following preservation time is recommended:
⚫ Maximum preservation duration of SSDs:
⚫ 12 months in power-off state without data stored
⚫ 3 months in power-off state with data stored
⚫ Maximum preservation duration of HDDs:
⚫ 6 months in unpacked/packed and powered-off state
⚫ The maximum preservation duration is determined according to the preservation
specifications provided by drive vendors. For details, see the manuals provided by drive
vendors.
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Technical White Paper 6 Product Specifications
NOTE
See Figure 6-1 for methods in measuring physical dimensions of
the server node.
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Technical White Paper 7 Software and Hardware Compatibility
Use the Compatibility Checker to obtain information about the operating systems and
hardware supported.
⚫ If incompatible components are used, the device may be abnormal. This fault is
beyond the scope of technical support and warranty.
⚫ The performance of servers is closely related to application software, basic
middleware software, and hardware. The slight differences of the application
software, middleware basic software, and hardware may cause performance
inconsistency between the application layer and test software layer.
⚫ If the customer has requirements on the performance of specific application
software, contact sales personnel to apply for POC tests in the pre-sales phase to
determine detailed software and hardware configurations.
⚫ If the customer has requirements on hardware performance consistency, specify
the specific configuration requirements (for example, specific drive models, RAID
controller cards, or firmware versions) in the pre-sales phase.
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Technical White Paper 8 Safety Instructions
8 Safety Instructions
8.1 Security
8.2 Maintenance and Warranty
8.1 Security
General Statement
⚫ Comply with local laws and regulations when installing devices. These Safety
Instructions are only a supplement.
⚫ The "DANGER", "WARNING", and "CAUTION" information in this document does
not represent all the safety instructions, but supplements to the safety
instructions.
⚫ Observe all safety instructions provided on the device labels when installing
hardware. Follow them in conjunction with these Safety Instructions.
⚫ Only qualified personnel are allowed to perform special tasks, such as performing
high-voltage operations and driving a forklift.
Human Safety
⚫ This equipment is not suitable for use in places where children may be present.
⚫ Only certified or authorized personnel are allowed to install the device.
⚫ Discontinue any dangerous operations and take protective measures. Report
anything that could cause personal injury or device damage to a project
supervisor.
⚫ Do not move devices or install racks and power cables in hazardous weather
conditions.
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Technical White Paper 8 Safety Instructions
⚫ Do not carry the weight that is over the maximum load per person allowed by
local laws or regulations. Before moving or installing equipment, check the
maximum equipment weight and arrange required personnel.
⚫ Wear clean protective gloves, ESD clothing, a protective hat, and protective
shoes, as shown in Figure 8-1.
⚫ Before touching a device, wear ESD clothing and gloves (or wrist strap), and
remove any conductive objects (such as watches and jewelry). Figure 8-2 shows
conductive objects that must be removed before you touch a device.
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Technical White Paper 8 Safety Instructions
Equipment Safety
⚫ Use the recommended power cables at all times.
⚫ Use power cables only for dedicated servers. Do not use them for other devices.
⚫ Before operating equipment, wear ESD clothes and gloves to prevent
electrostatic-sensitive devices from being damaged by ESD.
⚫ When moving a device, hold the bottom of the device. Do not hold the handles of
the installed modules, such as the PSUs, fan modules, drives, and the mainboard.
Handle the equipment with care.
⚫ Exercise caution when using tools that could cause personal injury.
⚫ If the device is configured with active and standby PSUs, connect power cables
of active and standby PSUs to different power distribution units (PDUs) to ensure
reliable system operating.
⚫ Ground the equipment before powering it on.
Transportation Precautions
Improper transportation may damage equipment. Contact the manufacturer for
precautions before attempting transportation.
Transportation precautions include but are not limited to:
⚫ The logistics company engaged to transport the device must be reliable and
comply with international standards for transporting electronics. Ensure that the
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Technical White Paper 8 Safety Instructions
Use Compatibility Checker to obtain information abut the components supported by a node or
server.
⚫ Power off all devices before transportation.
To reduce the risk of personal injury, comply with local regulations with regard to the
maximum weight one person is permitted to carry.
Table 8-1 lists the maximum weight one person is permitted to carry as stipulated by a
number of organizations.
For more information about safety instructions, see Server Safety Information.
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Technical White Paper 9 System Management
9 System Management
Features
The iBMC supports the following features and protocols:
⚫ KVM and text console redirection
⚫ Remote virtual media
⚫ IPMI
⚫ SNMP
⚫ Common information model (CIM)
⚫ Redfish
⚫ Browser-based login
Specifications
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Technical White Paper 9 System Management
Specifications Description
Setting of boot device Supports out-of-band configuration for the boot
device.
Alarm management Supports alarm management and reports alarms
using the SNMP trap, SMTP, and syslog service to
ensure 24/7 operating.
Integrated virtual KVM Provides remote maintenance measures and VNC
service for troubleshooting.
Integrated virtual media Virtualizes local media devices, images, USB keys,
and folders into media devices on a remote server,
simplifying OS installation. (The virtual DVD-ROM
drive supports a maximum transmission rate of 8
MB/s.)
WebUI Provides a user-friendly graphical user interface
(GUI), which simplifies users' configuration and query
operations.
Fault reproduction Reproduces faults to facilitate fault diagnosis.
Screen snapshots and Allows users to view screenshots and videos without
videos login, facilitating routine preventive maintenance
inspection (PMI).
Black Box Allows users to enable or disable the black box
function and download black box data.
DNS/LDAP Supports domain management and directory
services, which significantly simplify network and
configuration management.
Dual-image backup Allows a boot from the backup image when the active
software crashes.
Device asset management Provides intelligent asset management, supporting
unified management and stocktaking of assets in
use.
Intelligent power Uses the power capping technology to increase
management deployment density, and uses dynamic energy
saving to lower operating expenses.
IPv6 Supports IPv6 to help build an all-IPv6 environment.
Network Controller Supports NC-SI, allowing access to the iBMC through
Sideband Interface (NC-SI) the service network port.
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Technical White Paper 10 Certifications
10 Certifications
RoHS
ROHS NA
REACH NA
WEEE
UK UKCA NA
North America North America NRTL-ETL/MET
US FCC
Canada IC
Asia Pacific Japan VCCI
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Technical White Paper A Appendix
A Appendix
A.2 Product SN
The serial number (SN) on the slide-out label plate uniquely identifies a device. The
SN is required when you contact technical support.
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Technical White Paper A Appendix
For configurations not listed in the table, the operating temperature range is 5°C (41°F) to 30°C
(86°F). For special configuration and temperature requirements, contact technical support.
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For details about how to configure these features, see the Server Purley Platform
BIOS Parameter Reference.
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Technical White Paper B Glossary
B Glossary
B.1 A-E
E
ejector lever A part on the panel of a device used to facilitate
installation or removal of the device.
Ethernet A baseband local area network (LAN) architecture
developed by Xerox Corporation by partnering with Intel
and DEC. Ethernet uses the Carrier Sense Multiple
Access/Collision Detection (CSMA/CD) access method
and allows data transfer over various cables at 10 Mbit/s.
The Ethernet specification is the basis for the IEEE 802.3
standard.
B.2 F-J
G
Gigabit Ethernet (GE) An extension and enhancement of traditional shared
media Ethernet standards. It is compatible with 10M and
100M Ethernet and complies with IEEE 802.3z standards.
H
hot swap Replacing or adding components without stopping or
shutting down the system.
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Technical White Paper B Glossary
B.3 K-O
K
KVM A hardware device that provides public keyboard, video
and mouse (KVM).
B.4 P-T
P
panel An external component (including but not limited to
ejector levers, indicators, and ports) on the front or rear of
the server. It seals the front and rear of the chassis to
ensure optimal ventilation and electromagnetic
compatibility (EMC).
Peripheral A computer bus PCI, which uses the existing PCI
Component programming concepts and communication standards,
Interconnect Express but builds a faster serial communication system. Intel is
(PCIe) the main sponsor for PCIe. PCIe is used only for internal
interconnection. A PCI system can be transformed to a
PCIe one by modifying the physical layer instead of
software. PCIe delivers a faster speed and can replace
almost all AGP and PCI buses.
R
redundancy A mechanism that allows a backup device to
automatically take over services from a faulty device to
ensure uninterrupted running of the system.
redundant array of A storage technology that combines multiple physical
independent disks drives into a logical unit for the purposes of data
(RAID) redundancy and performance improvement.
S
server A special computer that provides services for clients over
a network.
system event log Event records stored in the system used for subsequent
(SEL) fault diagnosis and system recovery.
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Technical White Paper B Glossary
B.5 U-Z
U
U A unit defined in International Electrotechnical
Commission (IEC) 60297-1 to measure the height of a
cabinet or chassis. 1 U = 44.45 mm
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Technical White Paper C Acronyms and Abbreviations
C.1 A-E
A
AC alternating current
AES Advanced Encryption Standard New Instruction Set
ARP Address Resolution Protocol
AVX Advanced Vector Extensions
B
BBU backup battery unit
BIOS Basic Input/Output System
C
CD calendar day
CE Conformite Europeenne
CIM Common Information Model
CLI command-line interface
D
DC direct current
DCPMM DC persistent memory module
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Technical White Paper C Acronyms and Abbreviations
E
ECC error checking and correcting
ECMA European Computer Manufacturer Association
EDB Execute Disable Bit
EN European Efficiency
ERP enterprise resource planning
ETS European Telecommunication Standards
C.2 F-J
F
FB-DIMM Fully Buffered DIMM
FC Fiber Channel
FCC Federal Communications Commission
FCoE Fibre Channel over Ethernet
FTP File Transfer Protocol
G
GE Gigabit Ethernet
GPIO General Purpose Input/Output
GPU graphics processing unit
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Technical White Paper C Acronyms and Abbreviations
H
HA high availability
HDD hard disk drive
HPC high-performance computing
HTTP Hypertext Transfer Protocol
HTTPS Hypertext Transfer Protocol Secure
I
iBMC intelligent baseboard management controller
IC Industry Canada
ICMP Internet Control Message Protocol
IDC Internet Data Center
IEC International Electrotechnical Commission
IEEE Institute of Electrical and Electronics Engineers
IGMP Internet Group Message Protocol
IOPS input/output operations per second
IP Internet Protocol
IPC intelligent power capability
IPMB Intelligent Platform Management Bus
IPMI Intelligent Platform Management Interface
C.3 K-O
K
KVM keyboard, video, and mouse
L
LC Lucent connector
LRDIMM load-reduced dual in-line memory module
LED light emitting diode
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Technical White Paper C Acronyms and Abbreviations
M
MAC media access control
MMC module management controller
N
NBD next business day
NC-SI Network Controller Sideband Interface
C.4 P-T
P
PCIe Peripheral Component Interconnect Express
PDU power distribution unit
PHY physical layer
PMBUS power management bus
POK power OK
PWM pulse-width modulation
PXE Preboot Execution Environment
Q
QPI Quick Path Interconnect
R
RAID redundant array of independent disks
RAS reliability, availability and serviceability
RDIMM registered dual in-line memory module
REACH Registration Evaluation and Authorization of Chemicals
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Technical White Paper C Acronyms and Abbreviations
S
SAS Serial Attached Small Computer System Interface
SATA Serial Advanced Technology Attachment
SCM supply chain management
SDDC single device data correction
SERDES serializer/deserializer
SGMII serial gigabit media independent interface
SMI serial management interface
SMTP Simple Mail Transfer Protocol
SNMP Simple Network Management Protocol
SOL serial over LAN
SONCAP Standards Organization of Nigeria-Conformity
Assessment Program
SSD solid-state drive
SSE Streaming SIMD Extensions
T
TACH tachometer signal
TBT Turbo Boost Technology
TCG Trusted Computing Group
TCM trusted cryptography module
TCO total cost of ownership
TDP thermal design power
TELNET Telecommunication Network Protocol
TET Trusted Execution Technology
TFM TransFlash module
TFTP Trivial File Transfer Protocol
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Technical White Paper C Acronyms and Abbreviations
C.5 U-Z
U
UDIMM unbuffered dual in-line memory module
UEFI Unified Extensible Firmware Interface
UID unit identification light
UL Underwriter Laboratories Inc.
USB Universal Serial Bus
V
VCCI Voluntary Control Council for Interference by Information
Technology Equipment
VGA Video Graphics Array
VLAN virtual local area network
VRD voltage regulator-down
W
WEEE waste electrical and electronic equipment
WSMAN Web Service Management
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