[Product#]

Distributed I/O Platform

Catalog Data
Issue date October 2019
CA912005EN Supersedes August 2018

SMP™ I/O Distributed I/O Platform

Contents
DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
TYPICAL APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
PRODUCT OVERVIEW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
GENERAL FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
BENEFITS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
PRODUCT CONFIGURATION . . . . . . . . . . . . . . . . . . . . . . . . . . 3
I/O FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
COMMUNICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
CONFIGURATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
SMP I/O MANAGER SOFTWARE . . . . . . . . . . . . . . . . . . . . . . 4
SMP TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
SMP I/O PLATFORM SPECIFICATIONS . . . . . . . . . . . . . . . . . . 6
TYPE TESTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
TEMPERATURE DERATING . . . . . . . . . . . . . . . . . . . . . . . . . . 10
DIMENSION DRAWINGS. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Technical Data CA912005EN SMP™I/O Distributed I/O Platform
Issue date October 2019

Description Product Overview

Eaton’s SMP I/O platform is the first generation of substation-grade The SMP I/O platform is composed of a base unit that can
distributed I/O platforms, specially designed to meet modern accept up to four field-installable I/O cards. The base unit
industry and utility requirements. provides 2 programmable form-C output relays, RS-485 and
Ethernet communications interfaces, and an IRIG-B interface.
It supports binary input and binary output cards, operates with AC
or DC voltage, and communicates using the DNP3 protocol over All wiring is on the rear panel, through removable terminal
serial RS-485, or TCP/IP using fiber or copper Ethernet. It can be blocks. The front panel displays the status of the device and
used with the SMP Gateway automation platform, or as a stand- the state of all I/O signals. A Local/Remote control disables all
alone I/O module that connects directly to a DNP3 master station. control commands from the master station, for operator safety
during system maintenance.
Eaton relies on the same expertise and high industry standards
used to develop our successful SMP Gateway product line to offer When using the SMP Gateway automation platform, besides
a highly reliable,easy to set up and flexible I/O module, at a very acting as a DNP3 master, the SMP Gateway extends the
competitive price. capabilities of the SMP I/O by adding the following capabilities:
• Integrate devices using legacy protocols such as MODICON
Typical applications MODBUS, TEJAS, COOPER 2179, or new modern protocols
The SMP I/O platform deployed as a standalone unit can be such as IEC 61850 and IEC 60870-5- 104.
connected directly to a DNP3 master station and used for asset
• Provide maintenance and engineering users with
monitoring and control with accurate IRIG-B time stamping.
passthrough access to substation IEDs.
Multiple SMP I/O devices can be distributed throughout the
substation using an RS-485 multi-drop architecture, or using • Support local operation using the SMP Gateway HMI option
either copper or fiber Ethernet.
• Implement local automation functions using the built-in logic
When deployed behind an SMP Gateway automation platform, processor and Soft PLC.
the SMP I/O platform also adds access to the SMP Gateway
advanced logic and HMI’s numerous functions like the status • Distribute accurate time using the SMP Gateway
dashboard, name plate information, real-time data and the automation platform built-in GPS clock option (available on
Commissioning Tool, for an enhanced device setup. some automation platforms).

Eaton’s RTU replacement solution is fully compatible with this

I/O platform. General features
Hardware
• Rack-mount (with 1U form factor) and wall-mout models
• Two built-in Form C relays for system alarm (configurable)
• Design for growth with field upgradable I/O cards (total of
32 + 2 I/O per SMP I/O platform)
• No moving part
• System status LEDs

Software
• SMP I/O Manager Software for device management
• Seamless integration with the SMP Gateway
Figure 1.  Typical application, deployed behind an SMP
Gateway automation platform Security
• Built-in firewall to limit connections to specific IP addressses
or subnetworks
System
• Error detection features to ensure data integrity
• Integrated watchdog timer
• Internal clock synchronization using IRIG-B
• Local/Remote control button for safe system maintenance

Protocols
• DNP3 Serial or TCP/IP links
Figure 2.  Typical application, deployed as a stand alone unit • IEC 61850 GOOSE messaging

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SMP™I/O Distributed I/O Platform Technical Data CA912005EN
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Benefits I/O features

With its robust and scalable design, the SMP I/O platform
replaces traditional centralized RTU installations and provides Analog Inputs
a flexible solution that adapts to evolving automation An analog input card has 8 isolated inputs that can be used
requirements. to measure either voltage or current values. It is designed
for DC value measurements only, it is not intended for AC
Reliability measurements. The analog card is equipped with a Delta-Sigma
The substation-grade SMP I/O meets industrial and utility 16 bits ADC for each channel and is factory calibrated to ensure
standards for vibration, electrical surges, fast transients, and high accuracy reading over all the operation temperature range.
extreme temperature ranges. It is also designed to evolve • 8 input/card (up to 24 analog inputs per SMP I/O)
through regular software and firmware updates, ensuring a
future-proof automation system. • In addition to the real-time values, the analog input card
• Independently certified as per IEC 61850-3 and IEEE1613 provides the minimum and maximum reach for every input.
standards Four alarm and warning threshold values can also be set for
every input.
Scalablility • There are two models of analog input card. The standard
Designed for growth, the SMP I/O platform is field-upgradable. and the high isolation models. The following table shows the
• I/O cards cards can be added in minutes, without removing differences between the models:
the unit from the rack. Analog input
card model Characteristics

Productivity Standard 1500 VAC / 2100 VDC channel to ground isolation

The SMP I/O saves on cabling, commissioning and configuration Can be inserted in slots A, B and/or C. Slot D can still be
time, especially when it is used with the SMP Gateway used to insert any other type of I/O card.
automation platform. Its removable connectors speed up High isolation 1500 VAC / 2100 VDC channel to ground isolation
hardware changes. 1500 VAC / 2100 VDC channel to channel galvanic isolation
(each channel is electrically totally independent)
• Reduced engineering efforts Can only be inserted in slots A and/or C. Slot B and D can
still be used to insert any other type of I/O card.
Accuracy
The SMP I/O’s error detection features ensure data integrity
between the data point and the control center. It supports IRIG-B
synchronization for precise timestamping.. Binary Inputs
• Independently certified as per IEC 61850-3 and IEEE1613 The SMP I/O binary input card provide 8 electrically independent
standards opto-isolated connections. Various binary input card models
are available for all commonly used voltage ranges. Cards with
Product configuration different voltage ranges can be installed in the same unit
Flexible inputs and outputs card configuration with up to four (4) • 8 input/card (up to 32 binary inputs per SMP I/O)
field-upgradable I/O cards for a total of 32 + 2 I/Os, making it
adaptable to your evolving needs (two 2 form-C relay outputs are • Circuitry is specially designed to ensure at least 10%
available at the base unit rear panel). The wall-mount model has hysteresis at all temperatures, ensuring noise immunity over
the same same LED, buttons and terminal blocks as the rack- the complete temperature range.
mount model. • An advanced debouncing filter provides additional stability
when reading status changes. The inputs can be inverted to
I/O configuration card possibilities support negative-going impulses.
I/O Possible Slot location • The optional error detection circuit adds a second
card location (rear panel)
independent circuit for each input. If a discrepancy between
Binary output (max 2 cards) Slot B inputs is detected, a front-panel LED turns red and the data
Slot D quality is marked as bad.
Binary input (max 4 cards) Slot A Slot A: top left • Each binary input is mapped to three DNP3 data points that
Slot B Slot B: bottom left
Slot C Slot C: top middle provide: the current state, the count of pulses or transitions
Slot D and the frozen count.
Slot D: bottom middle
Analog input (max 3 cards) Slot A
Slot B
Slot C Binary Outputs
Externally, all card types are similar, with two screw terminals The SMP I/O supports up to 18 control relays. The base unit
per point. I/O cards can be added and removed using a simple provides two built-in Form C relays that can be used to report
screwdriver, without removing theSMP I/O from the rack. All the current system state or control external devices. The SMP
connections are made through removable terminal blocks. All I/O binary outputs are specially designed for the power industry.
connectors are keyed to prevent accidental insertions that would They provide the following characteristics:
damage the I/O module or its peripherals. • 8 outputs/card (up to 16 + 2 output relays per SMP I/O)
The wall mount enclosure provide the same features as the 19” • High load carrying capability reduces the need for
rack mount, uses the same I/O cards, but provides different interposing relays.
packaging for different space installation. The front panel can be
rotated to accommodate different mounting sides.
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Technical Data CA912005EN SMP™I/O Distributed I/O Platform
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• Each relay output is monitored by an input point that SMP I/O Manager software
provides the state of a second auxiliary contact. If the
auxiliary contact does not match the requested output state, The SMP I/O Manager software automatically locates all SMP
data quality is marked as bad, and the front-panel LED turns I/O devices connected to the network segment. Select the
red. appropriate SMP I/O and perform the following operations:
• Outputs are protected against single component failure. The • Configure TCP/IP and RS-485 communications settings
relay control circuit is designed so that the failure of a single
• Configure DNP3 settings
component cannot accidentally energize the relay.
• Configure the built-in firewall to limit connections to specific
• Trip/close pair, latch, pulse, pulse to open and pulse to close
IP addresses or subnetworks
support
• Possibility to lock the settings to prevent accidental or
Behavior Descripton malevolent configuration changes
Trip-close pair One address is used to control two relays. When the master
station sends an Open command, the first relay is pulsed.
When the master station sends a Close command, the sec-
ond relay is pulsed. Trip-close relays are paired as follows:
1- 2, 3-4, 5-6 and 7-8. The two built-in relays can also be
paired.
Latch Energize or de-energize the relay upon reception of a master
station command.
Pulse Energize the relay for a specified duration. The duration can
be preset or provided by the master station.
Pulse to open and Two separate addresses are used to control the relay. The
pulse to close master station pulses one address to energize the relay, and
a different address to de-energize the relay.

• The current state of each binary output is monitored by an

associated binary input. In case of a malfunction, the quality
of this input will be marked as bad.
Figure 3.  SMP I/O Manager, main window

Communications
The SMP I/O is accessible via the DNP3 protocol over RS-485 or SMP Tools
TCP/IP. It has one RS-485 serial port and one Ethernet connector
(copper or fiber). The SMP I/O is designed to integrate seamlessly with the
SMP Gateway automation platform. The SMP Config tool
The SMP I/O is compatible with any DNP3 master station. It is provides a quick configuration wizard that detects the SMP I/O
a level 2 DNP3 device and thus supports report-by-exception for configuration and automatically sets up all DNP3 indexes, default
reduced bandwidth usage. names and descriptions. You will only need to configure output
The SMP I/O’s clock can be synchronized by the DNP3 protocol, modes and input processing functions.
or by an external IRIG-B time source for greater accuracy.
• 1 x RS-485 serial interface
• 1 x 10/100 Mb/s Ethernet port (metallic or fiber LC)
• Secured remote maintenance using transparent connection
when used with an SMP Gateway automation platform

Configuration
Configuring the SMP I/O is a simple two-step process. First,
you connect the device to your network and configure the
communication settings using the SMP I/O Manager application.
Then, you use SMP Config to attach the SMP I/O to an SMP
Gateway automation platform and configure the operation of
binary outputs and the processing of binary inputs.
You can also use SMP I/O Manager to perform all configuration
steps for applications where the SMP I/O is not used with an
SMP Gateway automation platform.
Figure 4.  SMP Tool from SMP Manager (SMP Gateway
automation platform software application)

The SMP Gateway HMI provides an easy way to view all I/O
signals using a standard web browser.

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Figure 5.  SMP I/O platform front view

Figure 6.  SMP I/O platform rear view

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SMP I/O platform specifications

This section presents the complete specifications of the SMP I/O- platform.

Table 1.  General specifications

Dimensions Rack-mount unit: 1U

SMP I/O platform 1.72 in. H x 19 in. W x 8 in. L
43.6 mm H x 482.6 mm W x 203.2 mm L

Wall-mount unit:
4 in. H x 11.9 in. W x 6.85 in. L
101 mm H x 302 mm W x 174 mm L
Warranty 5 year limited
Operating temperature Rack-mount unit: See temperature derating section for continuous
-40 °C to 80 °C* (-40 °F to 176 °F) maximum operation.
Wall-mount unit:
-40 °C to 75 °C* (-40 °F to 167 °F)
Storage temperature -40 °C to 85 °C (-40 °F to 185 °F)
Humidity 5% to 95%, non-condensing
MTBF MIL-HDBK-217 22.5 years at 25°C
Telcordia SR-232 35.36 years at 25°C
Maximum altitude 2000 m
Terminal blocks I/O connection 300V / 15A max
28-12 AWG Solid Wire
30-12 AWG Stranded Wire
Wire screw max torque = 6 in-lbf Terminal block
screw max torque = 4 in-lbf

Table 2.  Power Supply

Low voltage mode Rated supply voltage: 24-48 VDC

Input voltage range: 18-75 VDC
Inrush current: 1.18 A/18 VDC
Power consumption: up to 15 watts
High voltage model Rated supply voltage: 110-250 VDC / 110-
240 VAC Input voltage range: 100-300 VDC /
85-264 VAC Frequency range: 50/60 Hz
Inrush current: 18 A/120 VAC, 36 A/230 VAC
Power consumption: up to 15 watts

Table 3.  Communication ports

1 Ethernet Port Rear access No LED indicators on rear panel

Metallic connectors (standard) 10/100/BASE-TX RJ-45 connector

Fiber-optic (option) 100BASE-FX, up to 2 km LC connectors

Multimode 1300 nm
Serial Port 1 x RS-485 terminal block connectors

2-wire RS-485 support (multidrop) Up to 1200 m (4000ft.)

32 devices

Table 4.  Time Tagging

IRIG-B Demodulated 2V high level detection

Vin max up to 12 VDC
Opto-isolated
Terminal blocks
Current sink at 5 V IRIG-B 5.7 mA
Current sink at 12 V IRIG-B; 15.7 mA

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Table 5.  Binary Inputs

Independent inputs, opto-isolated 24 VDC On: 18.3 - 30 VDC, Off: 5.5 VDC
48 VDC On: 37.5 - 60 VDC, Off: 10.5 VDC
110 VDC On: 82.5 – 137.5 VDC, Off: 21.3 VDC
125 VDC On: 91.5 – 156 VDC, Off: 23.5 VDC
220 VDC On: 169.5 - 275VDC, Off: 42.2 VDC
250 VDC On: 187.5 – 312.5 VDC, Off: 46.5 VDC
Current sink Error Detection Circuit (EDC) input option 4 mA maximum
Non-EDC input option 2 mA maximum
Hysteresys ratio 10% noise immunity guarantee All voltage detection threshold

Table 6.  Binary Outputs

Output relays Form C relays (built-in) 300 VAC/150 VDC, 12.5 J MOV protection across
Form A relays (output card) contact pairs
Operating time Pickup 7 ms typical
Dropout 4 ms typical
Rating 8 A at 250 VAC resistive All relay types
10 A at 30 VDC resistive
0.4 A at 125 VDC resistive
0.2 A at 150 VDC resistive
½ HP at 125 VAC
1/4 HP at 250 VAC
Rated insulation voltage 300 V RMS All relay types
Maximum voltage 400 VAC / 150 VDC All relay types
Continious carry 10A @ 85 °C All relay types
Maximum load 75 A for 1 second All relay types

Minimum load 10mA at 5Vdc All relay types

Cycling capacity (2.5 cycle/second) 24 VDC / 0.8 A L/R= 40 ms All relay types
per IEC 60255-0-20:1974 48 VDC / 0.5 A L/R= 40 ms
Breaking capacity (10 000 125 VDC / 0.3 A L/R= 40 ms All relay types
operations) per IEC 60255-0-20:1974 150 VDC / 0.2 A L/R= 40 ms
Make and carry 30 A as per IEEE-C37.90.1989

Table 7.  Analog Inputs

Input range Operation mode (voltage or current) is

configurable via jumpers
Voltage mode ± 10 V
Current mode ± 4 mA (4 – 20 mA transducers) Current mode targeted toward 0-1 mA
transducers with over-range capability
Input impedance
Voltage mode > 100 MΩ
Current mode 2.5 kΩ
Resolution 16 Bits
Accuracy Factory calibrated
Voltage mode ± 0.02 % of full scale @ 25 °C ±0.0015% / °C
Current mode ± 0.05 % of full scale @ 25 °C ±0.0015% / °C
Accuracy variation ± 0.015 % / °C of full scale @ 25 °C Customer calibration possible (zero offset)
Isolation
Standard model 1500 VAC / 2100 VDC channel to ground
High isolation model (HIM) 1500 VAC / 2100 VDC channel to channel On the HIM model, each input channel is
totally electrically independent (galvanic
isolation)
Common Mode Rejection (CMR) @ > 90 dB
50/60 Hz

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Table 8.  Accessories

Jumper straps Aluminum 6061

Insulating: Black epoxy UL-94V0 8 pos.
0.4 inch pin space Maximum current: 15 A
Maximum voltage: 300 V

Type tests
This section presents all tests that were conducted on the SMP I/O platform.

Table 9.  Type tests

Environmental
Dry heat IEC 60068-2-2:1974 85°C, 16 hours
Cold IEC 60068-2-2:1974 -40°C, 24 hours
5 cold boots in 16 hours
Sinusoidal vibration - response IEC 60255-21-1:1988, Class 1 0.5 g from 10-150 Hz all axis
Sinusoidal vibration – endurance IEC 60255-21-1:1988, Class 2 2 g from 10-150 Hz all axis
Shock resistance IEC 60255-21-2:1988, Class 1 5 g all axis powered
15 g all axis
Sinusoidal vibration – seismic IEC 60255-21-3:1993, Method A, Class 2 2 g all axis powered
10 g all axis
Sinusoidal vibration – stationary IEC 870-2-2:1996, Class B 1 g and 1.5 g from 2-500 Hz all axis
Damp heat, steady state IEC 600068-2-78:2001 40°C, 93% relative humidity, 4 days
Damp heat, cyclic IEC 60068-2-30:1980 + A1:1985 25-55°C, 6 Cycles, 95% relative humidity
Flammability UL94-V0 System
UL224 VW-1 Internal harnesses
Electromagnetic Interference (EMI)
Impulse IEC 60255-5:2000 5 kV 0.5 J on supply
IEEE C37.90-1989 5 kV 0.5 J on relay outputs
5 kV 0.5 J on digital inputs
5 kV 0.5 J on IRIG-B inputs
5 kV 0.5 J on analog inputs
Dielectric IEC 60255-5:2000 2500 VAC - 3500 VDC on relay BO (I/O)
IEEE C37.90-1989 3000 VAC - 4000 VDC on digital inputs
2500 VAC - 4000 VDC on IRIG-B input
500 VAC - 1000 VDC on RJ 45 port
1500 VAC - 2100 VDC on relay CPU
1500 VAC – 2100 VDC on analog inputs
Electrostatic discharge immunity IEC 61000-4-2: 2001, Level 4 8 kV contact on enclosure
IEC 60255-22-2: 1996 8 kV contact on RJ-45 shield 8 kV contact on LC shield
IEEE 37.90.3-2001 15 kV air on supply contacts
15 kV air on IRIG-B contacts 15 kV air on RS-485 contacts
15 kV air on relay contacts
15 kV air on digital input contacts
15 kV air on analog inputs
Radiated RF immunity IEC 61000-4-3: 2000, Level 3 10 V/m 80-1000 MHz
Fast transient/burst immunity IEC 61000-4-4: 1995 + A1: 2000, Level 4 4 kV at 2.5 kHz on supply
2 kV at 5 kHz on all other ports
Surge immunity IEC 61000-4-5: 2001, Level 4 4 kV common on all ports
2 kV differential on all ports
2 kV common on all analog inputs
Conducted RF immunity IEC 61000-4-6: 2004, Level 3 140 dBµV (10 Vrms) from 150 kHz to 80 MHz
Magnetic field immunity IEC 61000-4-8:2001 1000 A/m for 3 seconds
100 A/m for 1 minute
Damp oscillatory wave immunity and surge IEC 61000-4-12: 1995 + A1: 2000, Level 3 2.5 kV common on all ports 1 kV differential on all ports
withstand capability immunity IEC 60255-22-1: 2005
RF radiated disturbance IEC CISPR-22: 1997 + A1: 2000, Class A
RF conducted disturbance IEC CISPR-22: 1997 + A1: 2000, Class A
Supply
Voltage variation immunity for AC IEC 61000-4-11:1994 + A1: 2001 90 ms without reboot
equipment
Polarity inversion for DC equipment SN-62.1008d: 1997 For 1 minute

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Table 9. Type Tests (continued)

Accidental grounding immunity for DC SN-62.1008d: 1997

equipment
Short interruption for DC equipment SN-62.1008d: 1997
Voltage dips for DC equipment SN-62.1008d: 1997
Residual wave for DC equipment SN-62.1008d: 1997 5%PK-PK of VIN at 120 Hz
Accessories
Jumper strap IEC 60695-11-5: Flame test
IEC 60950-1: Paragraph 2.6.3.4

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Temperature derating
Table 10.  Ambient temperature reduction (oC) for I/O cards

Maximum value Duty factor BO card BI card BI card

(without EDC) (with EDC)
6A Continuous 7.5 N/A N/A
3A Continuous 5.0 N/A N/A
0A Continuous 2.5 N/A N/A
250 VDC Continuous N/A 5 10
220 VDC Continuous N/A 4.5 9
125 VDC Continuous N/A 2.5 5
110 VDC Continuous N/A 2.25 4.5
48 VDC Continuous N/A 1 2
24 VDC Continuous N/A 0.5 1

Table 11.  Ambient temperature reduction (oC) for analog cards

Analog card type Rack-mount model Wall-mount model

Temperature reduction Temperature reduction
High-isolation model
IOA or IOC (1 card) 17 °C 14 °C
IOA + IOC (2 cards) 21 °C 17.5 °C
Standard model
IOA or IOB or IOC (1 card) 1 °C 1 °C

Note: A, B and C are referring to the expansion card slot identification.

Table 12.  Derating table

Configuration Derating Details

Rack-Mount enclosure with CPU Board and Copper ∆T ≥ 5ºC ; Ta = 85oC – (IOA + IOB + IOC + IOD) ∆T is the SUM of I/O slot temperature derating
Ethernet Interface o o (IOA + IOB + IOC + IOD)
∆T ≤ 5 C ; Ta = 80 C
Rack-Mount enclosure with CPU Board and Fiber ∆T ≥ 17oC ; Ta = 85oC – (IOA + IOB + IOC + IOD) Ta is the ambient temperature
Ethernet Interface A, B and C are referring to the expansion card
Wall-Mount Enclosure (All configurations) Ta = 75oC – (IOA + IOB + IOC + IOD) slot identification

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Dimension drawings

Figure 7.  SMP I/O rack-mount unit, dimension drawings

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Figure 8.  SMP I/O wall-mount unit, dimension drawings

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Ordering information

Table 13.  Ordering information

4 5 6 7
Description P - PRTU - 0 - 1 2 3 SlotA SlotB SlotC SlotD 8 9
Mounting
[R] SMP I/O rack-mount base unit R
[A] SMP I/O wall-mount CB base unit A
(front panel buttom oriented)
[B] SMP I/O wall-mount CL base unit B
(front panel left oriented)
[C] SMP I/O wall-mount CT base unit C
(front panel top oriented)
[D] SMP I/O wall-mount CR base unit D
(front panel right oriented)
Port
[C] Copper Ethernet C
[F] Fiber Ethernet (LC) F
Power Supply
[A] 24-60 VDC A
[B] 125-250 VDC / 110-240 VAC B
I/O Cards
[0] empty 0 0 0 0
[A] 8-Port relay output module A A
[B] 8-Port 24 VDC digital input B B B B
[C] 8-Port 48 VDC digital input C C C C
[D] 8-Port 110 VDC digital input D D D D
[E] 8-Port 125 VDC digital input E E E E
[F] 8-Port 220 VDC digital input F F F F
[G] 8-Port 250 VDC digital input G G G G
[H] 8-Port 24 VDC EDC digital input H H H H
[I] 8-Port 48 VDC EDC digital input I I I I
[J] 8-Port 110 VDC EDC digital input J J J J
[K] 8-Port 125 VDC EDC digital input K K K K
[L] 8-Port 220 VDC EDC digital input L L L L
[M] 8-Port 250 VDC EDC digital input M M M M
[N] 8-Port DC analog input, standard model N N N
[P] 8-Port DC analog input, high isolation model P P
Options
[0] NONE 0
[A] Additional connectivity option A
(second DNP3 slave)
[B] IEC 61850 GOOSE option B
Jumper strap options
[0] NONE 0
[A] Package of 1 jumper strap A
[B] Package of 2 jumper strap B
[C] Package of 3 jumper strap C
[D] Package of 4jumper strap D

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