3peak-Tp8485e-Sr C94206
3peak-Tp8485e-Sr C94206
TP8485E
Features Description
Exceeds Requirements of EIA-485 Standard The TP8485E are IEC61000 ESD protected, 3V~5.5V
Hot Plug Circuitry - Tx and Rx Outputs Remain powered transceivers that meet the RS-485 and RS-422
standards for balanced communication. Driver outputs
Three-State During Power-up/Power-down
and receiver inputs are protected against ±18kV ESD
Data Rate: 300 bps to 250 kbps
strikes without latch-up.
Full Fail-safe (Open, Short, Terminated) Transmitters in this family deliver exceptional differential
Receivers output voltages (2.5V min/5Vcc), into the RS-485 required
Up to 256 Nodes on a Bus (1/8 unit load) 54Ω load, for better noise immunity, or to allow up to eight
Wide Supply Voltage 3V to 5.5V 120Ω terminations in “star” topologies. These devices
SOIC-8 Package for Backward Compatibility have very low bus currents so they present a true “1/8 unit
load” to the RS-485 bus. This allows up to 256
Bus-Pin Protection:
transceivers on the network without using repeaters.
– ±18 kV HBM protection
Receiver (Rx) inputs feature a “Full Fail-Safe” design,
– ±13 kV IEC61000-4-2 Contact Discharge which ensures a logic high Rx output if Rx inputs are
– +4 kV IEC61000-4-4 Fast Transient Burst floating, shorted, or on a terminated but undriven bus. Rx
Applications outputs feature high drive levels - typically 25mA @ VOL
= 1V (to ease the design of optocoupled isolated
E-Metering Networks interfaces).
Industrial Automation The TP8485E is available in an SOIC-8 and MSOP-8
HVAC Systems package, and is characterized from –40°C to 125°C.
Process Control
DMX512-Networks 3PEAK and the 3PEAK logo are registered trademarks of
Battery-Powered Applications 3PEAK INCORPORATED. All other trademarks are the property of
their respective owners.
80
+25 ℃
R 1 8 VCC
70
RD=15Ω
RE 2 7 B/Z 60 +85 ℃
A/Y
50
DE 3 6
40 RD=54Ω
D 4 5 GND
RD=20Ω
30
20
RD=100Ω
10
0
0.5 1 1.5 2 2.5 3 3.5
Differential Output Voltage (V)
Marking
Model Name Order Number Package Transport Media, Quantity
Information
TP8485E TP8485E-SR 8-Pin SOIC Tape and Reel, 4,000 TP8485E
TP8485E TP8485E-VR 8-Pin MSOP Tape and Reel, 3,000 TP8485E
NORMAL MODE
H H H L Actively drives bus High
X L Z Z Driver disabled
NORMAL MODE
VIT+ < VID L H Receive valid bus High
VIT– < VID < VIT+ L ? Indeterminate bus state
VID < VIT– L L Receive valid bus Low
X H Z Receiver disabled
Supply Voltage………………………………………………………………………………….…………….3V~5.5V
Temperature Range…………………………………………………………………………………….……-40°C to +125°C
Bus Pin Common Mode Voltage Range …………………………………………………………….…… -8V to +13V
Thermal Resistance, ΘJA (Typical)
8-Pin SOIC Package ……………………………………………………………….…………………..……158°C/W
Note 1: Tested according to TIA/EIA-485-A, Section 4.2.6 (±100V for 15μs at a 1% duty cycle).
Note 2: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
Positive-going receiver
VIT+ -75 -50 -45 mV
differential-input voltage threshold
Negative-going receiver
VIT- -185 -160 -145 mV
differential-input voltage threshold
|IOS| Driver short-circuit output current │IOS│ with VA or VB from –7 to +12 V 75 80 115 mA
DE = GND,
Driver and receiver
/RE = VCC, D= 0.7 1.4 1.5
disabled
Vcc No LOAD
DRIVER
Driver differential-output rise and
tr, tf 620
fall times
RL = 54 Ω, CL=50pF
Driver propagation delay See Figure 2 340 ns
tPHL, tPLH
tSK(P) Driver pulse skew, |tPHL – tPLH| 23
ESD
IEC61000-4-2,Air-Gap Discharge
±18 kV
RS-485 Method
Pins (A, Y, IEC61000-4-2, Contact Discharge
±13 kV
B, Z, A/Y, Method
B/Z) Human Body Model, From Bus Pins to
±18 kV
GND
All Other
Human Body Model, per MIL-STD-883 ±4 kV
Pins
RL/2 DE 375Ω
DE Vcc
Vcc Z Z
DI DI
D VOD D VOD RL=60Ω
Y Y
RL/2 VOC 375Ω
FIGURE 1A. VOD AND VOC FIGURE 1B. VOD WITH COMMON MODE LOAD
FIGURE 1. DC DRIVER TEST CIRCUITS
CL=100pF 3V
DI 1.5V 1.5V
DE 0V
Vcc Z tPLH tPHL
DI OUT(Z) VOH
D RDIFF
CL=100pF OUT(Y) VOL
Y
DIFF OUT(Y-Z) 90% 90% +VOD
SIGNAL
GENERATOR 10% 10%
-VOD
tR tF
SKEW=|tPLH-tPHL|
DE
Z 500Ω
DI VCC
D
SIGNAL SW GND
GENERATOR
Y CL
3V
DE 1.5V 1.5V
NOTE 10
CL
0V
PARAMETER OUTPUT RE DI SW
tZH,tZH(SHDN) tHZ
(pF) NOTE 10 OUTPUT HIGH
VOL-0.5V VOH
tHZ Y/Z X 1/0 GND 15 OUT(Y,Z) 2.3V
tLZ Y/Z X 0/1 VCC 15
0V
tZL,tZL(SHDN)
tLZ
tZH Y/Z 0 (Note 9) 1/0 GND 100 NOTE 10 VCC
tZL Y/Z 0 (Note 9) 0/1 VCC 100 OUT(Y,Z) 2.3V
VOL+0.5V VOL
tZH(SHDN) Y/Z 1 (Note 12) 1/0 GND 100 OUTPUT LOW
DE
Vcc Z +
DI 3V
D 60Ω CD VOD
Y DI
- 0V
SIGNAL
GENERATOR
+VOD
DIFF OUT(Y-Z) -VOD
0V
RE
B 15pF
0V RO +1.5V
A R
A 0V 0V
-1.5V
SIGNAL
tPLH tPHL
GENERATOR VCC
RO 1.5V 1.5V
0V
FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. RECEIVER PROPAGATION DELAY AND DATA RATE
RE
B RO 1kΩ VCC
GND R
A
SIGNAL SW GND
GENERATOR
15pF
NOTE 10
3V
RE 1.5V 1.5V
PARAMETER DE A SW 0V
tZH,tZH(SHDN) tHZ
tHZ 0 +1.5V GND NOTE 10 OUTPUT HIGH
tLZ 0 -1.5V VCC RO VOH-0.5V VOH
1.5V
0V
tZH(Note 10) 0 +1.5V GND tZL,tZL(SHDN)
tLZ
tZL(Note 10) 0 -1.5V VCC NOTE 10 VCC
RO 1.5V
tZH(SHDN)(Note 13) 0 +1.5V GND VOL+0.5V VOL
OUTPUT LOW
tZL(SHDN)(Note 13) 0 -1.5V VCC
Full Fail-Safe
All the receivers include a “full fail-safe” function that guarantees a high level receiver output if the receiver inputs are unconnected
(floating), shorted together, or connected to a terminated bus with all the transmitters disabled. Receivers easily meet the data rates
supported by the corresponding driver, and all receiver outputs are three-statable via the active low RE input.
COMPETITOR
FIGURE 8. HOT PLUG PERFORMANCE (TP8485E) vs Competitor WITHOUT HOT PLUG CIRCUITRY
ESD Protection
All pins on these devices include 4kV Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and
receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of ±18kV HBM and ±13kV (1/2
duplex) IEC61000-4-2. The RS-485 pins are particularly vulnerable to ESD strikes because they typically connect to an exposed port
on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might
destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the
RS-485 common mode range of -8V to +13V. This built-in ESD protection eliminates the need for board level protection structures
(e.g., transient suppression diodes), and the associated, undesirable capacitive load they present.
Transient Protection
The bus terminals of the TP8485E transceiver family possess on-chip ESD protection against ±18 kV HBM and ±13 kV
IEC61000-4-2 contact discharge. The International Electrotechnical Commision (IEC) ESD test is far more severe than the HBM
ESD test. The 50% higher charge capacitance, CS, and 78% lower discharge resistance, RD of the IEC model produce significantly
higher discharge currents than the HBM model.
As stated in the IEC 61000-4-2 standard, contact discharge is the preferred transient protection test method. Although IEC air-gap
testing is less repeatable than contact testing, air discharge protection levels are inferred from the contact discharge test results.
Figure 9. HBM and IEC-ESD Models and Currents in Comparison (HBM Values in Parenthesis)
In the case of surge transients, high-energy content is signified by long pulse duration and slow decaying pulse Power The electrical
energy of a transient that is dumped into the internal protection cells of the transceiver is converted into thermal energy. This thermal
energy heats the protection cells and literally destroys them, thus destroying the transceiver. Figure 11 shows the large differences
in transient energies for single ESD, EFT, and surge transients as well as for an EFT pulse train, commonly applied during
compliance testing.
B B
485 485
A A
Figure 12. Transient Protections Against ESD, EFT, and Surge Transients
The left circuit shown in Figure 12 provides surge protection of ≥ 500-V transients, while the right protection circuits can
withstand surge transients of 5 kV
D i f f eren t i al O u t p ut Vo l t age ( V)
Typical Performance Characteristics
100 4.5
90 RDIFF=100Ω
4
Driver Output Current (mA)
80
+25 ℃ 3.5
70
RD=15Ω 3 RDIFF=54Ω
60 +85 ℃
2.5
50
2
40 RD=54Ω
RD=20Ω 1.5
30
20 1
RD=100Ω
10 0.5
0 0
0.5 1 1.5 2 2.5 3 3.5 -40 -20 0 20 40 60 80 100 120 140
Differential Output Voltage (V) T e m p e r a t u℃)
re (
FIGURE 13. DRIVER OUTPUT CURRENT vs FIGURE 14. DRIVER DIFFERENTIAL OUTPUT
VOLTAGE DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE
100 700
90
80 600
Y OR Z = LOW
70
Output Current (mA)
60 D E=Vcc, R E=X
500
50
Icc (μA)
40
30 400
20
10 300
0
-10 Y OR Z = HIGH 200 DE=GND, RE=GND
-20
-30
-40 100
-50
-60 0
-7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 11 12 -50 -25 0 25 50 75 100 125 150
Output Voltage(V) ℃)
Temperatu re (
FIGURE 15. DRIVER OUTPUT CURRENT vs SHORT FIGURE 16. SUPPLY CURRENT vs TEMPERATURE
CIRCUIT VOLTAGE
2.5 1
0.9
2 0.8
Propagation Delay (μs)
tPLH
Skew (μs)
0.7
1.5 0.6
0.5
1 0.4
0.3
tPHL
0.5 0.2
0.1
0 0
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
Temperature (℃) ℃)
Temperatu re (
FIGURE 17. DRIVER DIFFERENTIAL PROPAGATION FIGURE 18. DRIVER DIFFERENTIAL SKEW vs
DELAY vs TEMPERATURE TEMPERATURE
FIGURE 19. DRIVER AND RECEIVER WAVEFORMS FIGURE 20. DRIVER WAVEFORMS
A2 C
θ
A1 L1
e
E
Dimensions Dimensions In
θ 0° 8° 0° 8°
Dimensions Dimensions In
θ 0° 6° 0° 6°
A1
R1
R
θ
L
L1 L2