Objective lenses

Parfocal distance 60mm CFI60 series

Objective lens Ｗ.Ｄ.（mm） ＮＡ
5× 23. 50 0.15
10× 17. 50 0. 30
20× 4. 50 0.45
50× Apo 2.0 0 0. 80
10 0× Apo 2.0 0 0.9 0
150× Apo 1. 50 0.9 0
Objective lens (long working distance) Ｗ.Ｄ.（mm） ＮＡ
20× ELWD 19.0 0 0.40
50× ELWD 11.0 0 0.60
10 0× ELWD 4. 50 0. 80
Objective lens (super long working distance) Ｗ.Ｄ.（mm） ＮＡ
10× SLWD 37.0 0 0. 20
20× SLWD 30.0 0 0. 30
50× SLWD 22.0 0 0.40
10 0× SLWD 10.0 0 0.60
Objective lens (glass thickness correction) Ｗ.Ｄ.（mm） ＮＡ
20× LCD 10.0 0 0.45
50× LCD 3.0 0 0.70
10 0× LCD 0. 85/0.95 0. 85

Parfocal distance 45mm Special objective lens (high NA)

Objective lens (high NA) Ｗ.Ｄ.（mm） ＮＡ
50× Apo 0. 35 0.95
100× Apo 0. 32 0.95
Special objective lens (high NA) Ｗ.Ｄ.（mm） ＮＡ
5× LT 10 . 50 0. 25
10× LT 1.60 0. 50
20× LT 0.70 0.75

Dimensions, Exterior HYBRID LASER MICROSCOPE

Dimensions
1570
710

Unit: mm

Lasertec HQ was certified ISO9001:2008 in June 2009.

Laser radiation
Safety precautions: Read manuals before use. Use properly. Do not look into a laser beam.
● This catalog provides information as of January 2015.
405nm continuous wave with
● The descriptions in this catalog are based on our research as of the product release. 100µW maximum
● Product specifications are subject to change without notice. Neither manufacturer Class 2 laser product
nor seller assumes any responsibility for damage caused by specification change. JIS C 6802 : 2011
● Screen images are simulated.

Head Office 2-10-1 Shin-yokohama, Kohoku-ku,

Solution Sales Department Ⅱ Yokohama 222-8552 Japan
Phone +81-45-478-7330
Subsidiaries U.S. Phone +1-408-437-1441
outside Japan Korea Phone +82-31-8015-0540
Taiwan Phone +886-3-657-9120
Homepage http://www.Lasertec.co.jp/
E-mail [email protected] 15/08-03
 Optical technology at its best! Performance Multi-functional and high-performance HYBRID
surpassing laser-scanning microscopes
In 1985, Lasertec released the world’s first industrial-quality White light confocal
RGB confocal laser-scanning microscope
Lasertec then released red laser and violet laser microscopes and, in 2001,
white light confocal scanning microscopes
Laser Confocal
1985
World’s
first
1987 1999 2001 2003 2007
White light confocal and laser confocal
2LM11
The world’s first
1LM21
Red laser-scanning
VL2000D
Violet laser-scanning
HD100D
White light confocal
S130/C130
White light confocal
H1200WIDE
High-speed and
6 functions in one body
RGB confocal laser microscope microscope scanning scanning multi-functional white Featuring two sets of confocal optics combined with additional functions including
scanning microscope microscope microscope with light confocal scanning
for industrial use wavelength selection microscope interferometer, differential interference contrast observation,
and spectroscopic reflectometry film thickness measurement,
HYBRID performs multiple tasks that normally require several different tools.

World’s ● High-definition 24bit full color observation ● High magnification

first Today ● Wide FOV observation/measurement
● Transparent film thickness measurement in micrometer scale
● High resolution
● High contrast
With laser and white light source combined in one body
● Visualization of ● Height measurement
Multi-functional high-performance confocal microscope nanometer-scale
defects and particles
in nanometer scale
● Wide FOV in millimeter
on flat surface scale
White light confocal Laser confocal

Differential Vertically scanned

interference contrast white light
observation interferometer
Spectroscopic Phase shift
reflectometry film thickness interferometer
measurement

● Film thickness measurement in ● Height measurement in Angstrom scale

nanometer scale

Faster, wider and more accurate

Wide coverage and highly accurate measurement One-stop solution
Tool Interferometer Typical Contact-type
surface SEM roughness AFM
1mm Criteria profiler CLSM gauge
Digital microscope Resolution
(XY)
Conventional
Height resolution

confocal laser scanning

microscope Color image
1µm
SEM Wide FOV

Optical
3D
interference-based measurement
3D surface
AFM profiler
Nano-scale
1nm profile
measurement
Sample
preparation
1nm 1µm 1mm
XY resolution Speed

1 2
 Confocal optics - basic principle of technology Unique confocal optics of HYBRID
Basic principle Unique confocal optics of HYBRID
Confocal optics detects only the rays of light focused on In focus Out of focus
the sample surface. Light emitted from the source and Detector Detector
Multiple functions and high-definition
reflected by the sample surface reaches the detector only Pinhole Pinhole 1 Two types of light source - white light and violet laser
24bit full color imaging
if it is focused at the pinhole in front of it (Figure1). This
takes place only for the rays of light focused at the
sample surface. The light rays from the sample surface in Detectors that detect each of RGB wavelengths
Beam splitter Beam splitter 2 simultaneously and separately
Detection channel switching function
focal plane reach the detector but all others do not
(Figure2). Confocal optics detects in-focus information
Point Point
only. light light Proprietary light scanning method that maximizes the performance
Pinhole
source
Pinhole
source 3 of large-aperture low magnification objective lens
Up to 15mm wide FOV

Objective lens Objective lens

Sample
Focus position Focus position
Sample
Figure 1 Figure 2

Merits of confocal optics

Detector
1. High resolution Confocal optics
Non-confocal optics
2. High-contrast high-definition images without
scattered light interference (Figure3)
3. Optical sectioning effect (see below)
I (intensity)

These merits enable HYBRID to provide highly

accurate measurement in x, y and z directions.

Laser light source

Z (focus direction)
IZ curve Figure 3

Optical sectioning effect

White light source
HYBRID continuously captures in-focus images of a
sample being moved in z direction by taking advantage of
the confocal optics principle that reflected light has its
maximum brightness when it is in focus (Figure 4).

Effect1
By recording maximum brightness at each pixel,
all-focused images can be captured (Figure 5).

Effect2
By recording the z position of each pixel at its peak Figure 5
brightness, 3D measurement such as shape and surface
roughness measurement is possible (Figure6).

Figure 4 Figure 6
3 4
 White light confocal
White light confocal Laser confocal

Differential Vertically scanned

interference contrast white light
means observation interferometer
Spectroscopic Phase shift
reflectometry film thickness interferometer
measurement

Wide FOV for efficient observation High-definition images of white light confocal
FOV 1.6 times wider than a typical CLSM ※ When objective lens of the same magnification is used With the use of Xenon lamp similar to sunlight as light source, high-definition images with good color separation and high
■ 10x objective lens (FOV 1,500um) 3D image depth of field are available.
■ Black and white image from CLSM ■ Color image from CLSM ■ Color image from HYBRID

1.6 times
larger area

Typical CLSM

Terminals

High precision measurement at low magnification

With the use of our special objective lens, high precision measurement at low magnification, which CLSM is hard to achieve, Butterfly scales Composite image with non-confocal color image High definition image of white light confocal
is made possible.
Widening applications with detector channel switching
Objective lens designed especially for wide FOV Magnification Normal objective Special objective FOV
lens NA lens NA Detector channel switching allows observation and measurement to be performed in the most suitable wavelength.
and high precision measurement It also widens your applications to samples for which laser light cannot provide a clear picture.
5× 0.15 0.25 3,000×3,000µm
High-NA objective lens available for 5x, 10x, 20x ■ Different observation result of each channel
magnification 10× 0.30 0.50 1,500×1,500µm Upper layer observation: blue channel Middle layer observation: green channel Lower layer observation: red channel
20× 0.45 0.75 750×750µm

■ 3D image from normal objective lens (10x) ■ 3D image from our special objective lens (10x)

←Noise
PI-coated communication device

Profile data Profile data Widening applications with light wavelength selection
The selection of 6 different wavelengths of light source is available. It allows you to select the best wavelength for your
Wide FOV and high precision observation and measurement and widens your applications to samples susceptible to damage in a particular wavelength of
light, such as resist film or UV curable resin, and samples that absorb a particular wavelength of light.
FOV 6.5 times wider than typical CLSM is possible, thanks to HYBRID’s wide FOV and the use of special high-NA low
magnification objective lens.
■ Image from typical CLSM ■ High-definition
20x objective lens
(NA 0.46)
wide-FOV image
available with HYBRID 6.5 times
larger area
White
light PI coat surface
10x objective lens Red Blue (436nm)
(NA 0.50) 633nm 436nm

Yellow Blue
green
578nm 486nm Surface of
Yellow substrate
green Green (633nm)
546nm 514nm
Copper wire (FOV 670µm×500µm)

Multi layer observation using wavelength selection PI-coated flexible printed circuit board
(FOV 1,500µm) (concept illustration)
5 6
 Laser confocal Differential interference contrast
White light confocal Laser confocal White light confocal Laser confocal

means
Differential
interference contrast
observation
Vertically scanned
white light
interferometer means observation / In-situ observation Differential
interference contrast
observation
Vertically scanned
white light
interferometer
Spectroscopic Phase shift Spectroscopic Phase shift
reflectometry film thickness interferometer reflectometry film thickness interferometer
measurement measurement

High-magnification, high-resolution observation Nanometer-scale surface morphology visualization

The 405nm-laser light source allows you to capture the nanometer-scale world in an instant. Ultrafine structures can be High contrast visualization of nanometer-scale surface morphology based on the combination of confocal and differential
visualized clearly. interference contrast (DIC) optics.
■ Without DIC ■ Digitally-processed DIC image ■ Optical DIC image from HYBRID

Epitaxial defects on S : C (FOV 1,500um) Not clear Clearly visible

not visible

Sodium niobate domain observation Si wafer backside

(FOV 25um, 11,000x magnification on monitor) (FOV 75um, 3,700x magnification on monitor)

Step bunching on SiC wafer Not clear Clearly visible

(FOV 1,500um) not visible

Polymer blend crystal 3D image of polymer blend crystal

(FOV150um, 1,850x magnification on monitor) (FOV150um)

GaN epitaxial defects (FOV 1,500um) Not clear Clearly visible

not visible

In-situ observation
■ Before transition ■ In transition ■ After transition
Real-time observation of
liquid and other samples

Typical usages
● Observation of phase transition
of metal and inorganic samples
under changing temperature
conditions
● Video capture of crystal
growth or phase transition in
liquids
Solar cell texture Active material of lithium ion battery Crystal growth and transition in a cadmium iodide liquid
(FOV50um, 5,500x magnification on monitor) (FOV75um, 3,700x magnification on monitor) (high-definition video capture and playback at high speeds up to 15 frames per second is available)
7 8
 Optical interference Spectroscopic reflectometry
White light confocal Laser confocal White light confocal Laser confocal

means measurement
Differential
interference contrast
observation
Vertically scanned
white light
interferometer means film thickness measurement Differential
interference contrast
observation
Vertically scanned
white light
interferometer
Spectroscopic Phase shift Spectroscopic Phase shift
reflectometry film thickness interferometer reflectometry film thickness interferometer
measurement measurement

Nanometer-scale height measurement in a wide FOV Transparent film thickness measurement

Nanometer-scale precise height measurement in a millimeter-scale FOV is possible. You can measure the thickness of transparent films using the capability to select 6 wavelengths in white light. Measurement
area is user-settable. This function is applicable to either all surface coated films or patterned films.
Features
Features ■ Wide range of measurement coverage of HYBRID
The resolution in height measurement using optical
interference is independent from objective lens NA. It is Spectroscopic reflectometry is available to measure
therefore possible to have high resolution even in a wide transparent film thickness in nanometer scale. It
FOV. This is suitable for measuring ultrafine concave/convex, compensates for the shortcoming of confocal optics, Spectroscopic Confocal method
surface roughness and unevenness while maintaining a which cannot detect a focus position for a film with reflectometry method
millimeter-scale wide FOV. You can dramatically broaden a thickness close to the wavelength of light, thus failing
range of measurement applications by complementing this to m e a s u r e t h e t h i c k n e s s . H Y B R I D o f f e r s t h i s Spectroscopic reflectometry
method with confocal, which is more suited to measure spectroscopic reflectometry to broaden its applications film thickness measurement
slopes and rough surfaces. to such a thin film measurement.
Simplified spectroscopic
thickness monitor

Basic principle of optical interference Samples Thin film thickness measurement

in narrow area is possible Spectral ellipsometer
measurement ● Oxidized film
S u r f a c e p r of il e s a r e m e a s u r e d i n n a n o m e te r- s c a l e ● SOI multi-layer film SiO2
0.1nm 1nm 10nm 100nm 1µm 10µm

resolution from the analysis of inter ference pat terns ● Other transparent film ※Confocal's XZ cross section measurement is suitable for measuring film
Silicon substrate
generated by interference objective lens. Light is split into ● Residue from etching thicknesses more than 1um.
two arrays by a beam splitter inside the objective lens. One Reference
of the arrays is reflected by the sample surface while the mirror
Reference
other array goes to the reference mirror and reflected there.
Both reflected beams are superimposed in the objective Beam splitter
mirror
Principle of spectroscopic reflectometry
lens to form interference patterns caused by optical path
differences. As the tool is adjusted to have no optical path Spectroscopic reflectometry Thin film interference: multiple reflections inside film
Mirau-type Michaelson-type
difference in a focus position, interference fringes indicate

{
Film thickness can be measured using the reflectance
concaves and convexes on sample surface. Typical interferometer objective lens spectrum obtained from spectroscopic reflectometry after
parameter fitting with optical simulation model.

Two types of interference measurement method Reflectance spectrum Thin film 1

Vertically-scanned white light interferometry Phase shift interferometry It shows the relation between absolute reflectance and
wavelength. It varies depending on film thicnknesses and
Interference fringes have the strongest contrast at in-focus Height measurement in Angstrom-scale accuracy is optical constants.
plane. The peak of brightness in interference fringe is detected available from the phase analysis of interference fringes in a Thickness
to measure height with the operability of confocal microscope. single wavelength of light (546nm) that are obtained as the Absolute reflectance
phase is being changed in multiple steps. The measurement Substrate
range is limited within a half wavelength but the merit is its It is determined by thin film interference caused by multiple
short measurement time, which is a few seconds. reflections of light between film surface and substrate.

■ Example of measurement (45nm height) ■ Example of measurement (8nm in height)

Spectroscopic reflectometry of HYBRID
Vertically-scanned white light interferometry Phase shift interferometry
Six wavelengths are selected from white light to obtain a reflection image for
150
each and to calculate reflectance.
Optical constants (refractive index and extinction coefficient) for thin film and
substrate are used in optical model to calculate absolute reflectance from
Fresnel coefficient and to measure film thickness after parameter fitting.

■ Example of measurement (Oxide film patterns on Si wafer)

00
nm

Observed Oxide Si Film thickness analysis (parameter fitting) Film thickness measurement (distribution)
FOV 1,400µm FOV 800µm image film Film thickness: 392nm Z scale: 500nm
9 10
 means White light confocal
Laser Confocal
High speed and high precision measurement White light confocal and laser confocal

Industry- Industry-leading
leading speed measurement accuracy
Industry-leading measurement speed Industry-leading measurement accuracy and repeatability

HYBRID achieves 15Hz frame rate, about 4 160 High accuracy required for measurement tools True focus position
1/4 process time compared to typical CLSM. not detected
times faster than a typical CLSM, which

Measurement time (second)

makes it a powerful tool for high-speed auto 140 Focus
position
measurement, patchwork and high-speed 120 High accuracy detected
video observation.
100 Line width: ±[0.02x(100 / objective）+L/1000] µm
Conventional
Process time Height measurement: ±（0.11+L/100）µm

1/4
80 method
Both at industry-leading level
60
40
20 True focus position

Intensity
※0.1um step of height measurement detected
0
CLSM 10 20 30 40 50 Focus
position
Z measurement range (um) detected

Search peak /
High speed patchwork fine peak
Z position
This function allows you to stitch
a large object as the one shown Seach peak / fine peak can provide
highly accurate measurement results
on the right with ease. It creates in a short time
a wide FOV image smoothly. The
process time is about 1/6 of that
required for a t ypical CLSM. Reference
(Number of screens required: High level of repeatability
1/1.5, measurement time per accuracy
screen: 1/4) Line width measurement 3σ：10nm Probability
density
Height measurement σ：10nm
Process time Patchwork of typical CLSM Patchwork of HYBRID 3D image

1/6
HYBRID achieves an industry-leading repeatability and
(Diameter 22mm)
※Number of shots above simulated
detects a true peak located in a measurement gap based
on IZ curve calculated with a special algorithm.

Image capture range in Z axis direction

High-speed automatic
optimization of
measurement range Auto optimization OFF
Value
In patchwork, height gap within deviation
each FOV is automatically
detected to adjust measurement
range. It prevents image input
errors and dramatically shortens Reliability Traceability system
scan time. Auto optimization ON
Outgoing inspection is per formed on HYBRID using OPTELICS HYBRID is calibrated comforming to the
reference samples with correct traceability to ensure strict standards traceable to National Institute of Standards and
Cross section of patchwork quality assurance. Technology

Area mapping
NIST
Current measurement position National Institute of Standards and Technology
can be displayed on a wider
FOV image. The function also
a l l o w s y o u to m ove to t h e
measurement point with one
c l i c k , a u to p a tc hwo r k i n a
specified area on the map and Width reference sample
VLSI Height Standard
coordinate information control NIST SRM473
in a specified position.

Critical dimension Surface topography

measurement measurement

11 12
 means White light confocal
Laser Confocal
Various measurement and analytical functions White light confocal and laser confocal

Applicable to various usages

Profile / comparison 2D measurement [4]247.247um

measurement
Measurement of 2 dimensional

[1
]5
45
features such as length, angles,

.5
38
radius and counting of features

um
Surface shape measurement [3]135.123deg

on a user-specified line.
Comparison measurement is
available for measuring the [2]797.028um

[5]1002.034um
difference in multiple lines.
■ Measurement criteria: width,
height, angle, proximate
radius, deviation Nanoimprint mold 3D profile / step height: 45nm

Width and pitch Height difference [1-2]3.513um

measurement measurement

Ideal for measuring semiconductor Measurement of height difference [1-1]3.284um

pattern line widths. Industry-leading in a user-specified area [1-4]3.996um

accuracy and repeatability is achieved

with unique optics and detectors. [1-5]4.256um

■ Accuracy: ±[ 0.02×
（ 100/ objective magnification ）+Ｌ/1000 ]µm
(Ex. ±0.025µm for 5µm line width ) Line width standard
■ Repeatabilty: 3σ＝0.01µm

Brightness graph
Film thickness measurement
Surface roughness (XZ cross section
measurement measurement)

Z position
Surface roughness measurement Film thickness is obtained by
comforming to JIS and ISO optically calculating the
parameters. High resolution distance between film surface
roughness measurement is and substrate surface using
possible for any type of samples reflected light.
thanks to its non-contact Film thickness 26.460µm Brightness
measurement.
2 dimensional roughness Diamond grinding stone 3D image
Surface roughness: Ra,Rp,Rv,
Rc,Rt,Rq,Rsm,Rk,Rpk,Rvk, etc.
100μm Data management
JIS B0671：Rk,Rpk,Rvk,Mr1,
Mr2,A1,A2, etc.
50μm
■ LMWS file ■ Spreadsheet ■ Layout report ■ Data output
Rmr
A dedicated file for storing A spreadsheet for storing Capability to generate Output in image file, CSV file
3D roughness
measurement conditions, multiple measurement data reports containing images and CAD data (STEP file) is
Roughness parameters：Sa,Sp, 0μm results, etc. and measurement data available
Sv,Sz,Sq, etc. Profile of cross section at measurement line charts
Volume parameters：Sk,Spk,Svk,
Smr1,Vvc,Vvv, etc.

Analysis of geometric ■ Binary image

properties Measurement data
Scan information Lens information
HYBRID analyzes more than Measurement
20 properties including area, condition
volume, center of gravity, etc.
Output of analysis result is
ava il a b l e in a s p re a d s h e e t
Measurement
format. result in
spreadsheet/layout
3D
CAD printer

Bump Analysis result

13 14
 means means White light confocal
Laser Confocal
Ease of use and high skills for all users Options White light confocal and laser confocal

Expert mode and Bigginner's mode Software programs for automated operation

Example of operation guidance

in Beginner's mode Auto-measurement software
1.Adjusting XY of the observation
position This software is used with a motorized
stage to automatically perform pre-set
Move the observation position to the center
of the screen. Use the UP, DOWN, LEFT and
recipes, for example, on the measurement
RIGHT buttons of the XY control or click on of semiconductor pattern dimensions
the screen to move the stage. and surface roughness.

Auto-measurement of bumps
Expert mode Beginner's mode

Use this mode for advanced operation and detailed "Operation Guidance" gives you step-by-step Auto-measurement Measurement Measurement Data list display
setting. instructions to walk you through the measurement software start complete
process.
Sample setting One click Start measuring Complete

Macro Auto-inspection software

This sof tware is used to inspect a

Macro whole wafer or glass substrate for
small defects and particles on surface.
It also enables you to review defects in
an area specified on defect-distribution
map and categorize each defect (e.g.,
by size, white/black, pit/bump).
Microscope operation Image processing Measurement

Process recording One click execution

One click on Play button does it all!

Whole wafer inspection for 0.5µmPSL

Auto-inspection
software Inspection start Review Categorize

Expert Operator
Operate a measurement Per form the exper t's
sequence or analysis measurement and
proce s s while s aving analysis with one click
commands in a macro. that recalls the saved
commands.
15 16
 means means White light confocal
Laser Confocal
Options Flexibility White light confocal and laser confocal

Optional features for your specific needs Specifications

Model / Specification Basic functions Multifunctions Diverse applications

Motorized stage Electrostatic holder Basic model C3 Standard model L3 High-end model L7
White light confocal White light confocal White light confocal
The motorized stage significantly enhances the efficiency This is a stage to hold a film sample with static electricity. Laser confocal Laser confocal
of sequential and patchwork measurements. (XY stroke Differential interference
150mm x 150mm) Optical interference measurement
Spectroscopic reflectometry
film thickness measurement

Laser － 40 5nm 40 5nm

Light source 436nm,4 86nm,514nm,5 46nm,
Xenon / Hg-Xe R,G,B R,G,B
578nm,633nm,White light

Objective On-screen
magnification FOV (HxV)
lens

1× 18.5× 15,0 0 0×15,0 0 0μm

2.5× 46.2× 6,0 0 0×6,0 0 0μm
5× 92.5× 3,0 0 0×3,0 0 0μm

White 10× 185× 1,50 0×1,50 0μm

light 2 0× 370× 750×750μm
FOV /
Magnification 50× 92 5× 30 0×30 0μm
10 0× 1,850× 150×150μm
150× 2,775× 10 0×10 0μm
50× 1,850× － 150×150μm
Laser 10 0× 3,70 0× － 75×75μm
150× 5,550× － 50×50μm
Zooming 1～8×
Brightness 1,02 4×1,02 4×12bit / High definition mode 2,04 8×2,04 8×12biｔ
Frame memory
Tilt stage Large / special stage Height 1,02 4×1,02 4×16bit / High definition mode 2,04 8×2,04 8×16biｔ
Frame rate 15Hz～12 0Hz
This is a stage to hold a sample in a tilted position for We can provide specially-designed stages to meet your Minimum unit of measurement 0.0 01μm
interference measurement and roughness measurement. various needs based on our inspection expertise. Width ±[ 0.02×（10 0/Objective lens magnification）+Ｌ/10 0 0 ]μm
Accuracy
measurement
Repeatability (3σ) ※1 10nm
Scale resolution 0.1nm

Height Accuracy ±（ 0.11+ L/10 0）μm

measurement Repeatability (σ) ※2 10nm
Measurement range※3 7mm
Z stroke 10 0mm 80mm
Nosepiece 5 -hole motorized revolving nosepiece (with auto lens position recognition)
Manual ○ －
XY stage
Motorized Options ○
Differential interference contrast observation Options ○
Optical interference measurement Options ○
Spectroscopic reflectometer measurement Options ○

Image capture Patchwork, HDR mode, search peak, first peak, multi-gain, etc.
Basic functions Measurement of height, line width and surface roughness ( J IS, ISO), and 3D display
Software Image processing Filter, tilt correction, binarization, nose elimination, bit depth conversion, size conversion, color balance, etc.
Geometric property calculation About 20 properties including area, volume, surface area, Feret diameter, center, roundness, maximum length, aspect ratio, etc.
Report generation Layout, image database, template, file extension batch conversion

Utility AC 10 0 -2 40V, 50/60Hz, 1,50 0VA

Microscope unit 3 82（ Ｗ）×511（D）×669（ H）mm 41kg

Dimensions Control unit 431（ Ｗ）×450（ D）×10 6（H）mm 7.1kg

and weight Light source unit 142（Ｗ）×311（D）×227（ H）mm 6.7kg
PC 175（Ｗ）×417（D）×360（ H）mm 9.6kg
Traceability ○
※1 Based on reference pattern measurement using 150x ( NA0.95) under no vibration condition.
※2 Based on the measurement of VL SI Standards' step height standards using 10 0x ( NA0.95) under no vibration condition.
※3 Up to the maximum distance of objective lens movement

17 18