74HC HCT4066 5
74HC HCT4066 5
DATA SHEET
74HC4066; 74HCT4066
Quad bilateral switches
Product specification 2004 Nov 11
Supersedes data of 2003 Jun 17
Philips Semiconductors Product specification
TYPICAL
SYMBOL PARAMETER CONDITIONS UNIT
74HC4066 74HCT4066
tPZH/tPZL turn-on time nE to Vos CL = 15 pF; RL = 1 kΩ; VCC = 5 V 11 12 ns
tPHZ/tPLZ turn-off time nE to Vos CL = 15 pF; RL = 1 kΩ; VCC = 5 V 13 16 ns
CI input capacitance 3.5 3.5 pF
CPD power dissipation notes 1 and 2 11 12 pF
capacitance per switch
CS maximum switch 8 8 pF
capacitance
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ[(CL + CS) × VCC2 × fo] where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
CS = maximum switch capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ[(CL + CS) × VCC2 × fo] = sum of the outputs.
2. For 74HC4066 the condition is VI = GND to VCC.
For 74HCT4066 the condition is VI = GND to VCC − 1.5 V.
2004 Nov 11 2
Philips Semiconductors Product specification
FUNCTION TABLE
See note 1.
INPUT nE SWITCH
L off
H on
Note
1. H = HIGH voltage level.
L = LOW voltage level.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE
74HC4066N −40 °C to 125 °C 14 DIP14 plastic SOT27-1
74HCT4066N −40 °C to 125 °C 14 DIP14 plastic SOT27-1
74HC4066D −40 °C to 125 °C 14 SO14 plastic SOT108-1
74HCT4066D −40 °C to 125 °C 14 SO14 plastic SOT108-1
74HC4066DB −40 °C to 125 °C 14 SSOP14 plastic SOT337-1
74HCT4066DB −40 °C to 125 °C 14 SSOP14 plastic SOT337-1
74HC4066PW −40 °C to 125 °C 14 TSSOP14 plastic SOT402-1
74HCT4066PW −40 °C to 125 °C 14 TSSOP14 plastic SOT402-1
74HC4066BQ −40 °C to 125 °C 14 DHVQFN14 plastic SOT762-1
74HCT4066BQ −40 °C to 125 °C 14 DHVQFN14 plastic SOT762-1
PINNING
11 4Y independent input/output
12 4E enable input (active HIGH)
Fig.1 Pin configuration DIP14, SO14 and
13 1E enable input (active HIGH)
(T)SSOP14.
14 VCC supply voltage
2004 Nov 11 3
Philips Semiconductors Product specification
14 VCC
terminal 1
1Y
index area
handbook, halfpage
1
1Z 2 13 1E 1Y 1
13 1E
1Z 2
2Z 3 12 4E
2Y 4 4066 11 4Y 2Y 4
5 2E
2Z 3
2E 5 VCC(1) 10 4Z
3Y 8
3E 6 9 3Z 6 3E
3Z 9
7
8
GND
3Y
4Y 11
001aac116 12 4E
4Z 10
Transparent top view
MGR254
(1) The die substrate is attached to this pad using conductive die
attach material. It can not be used as a supply pin or input.
handbook, halfpage 1 2
1 1
handbook, halfpage 1 2
13 #
X1
13 #
4 3
4 3 1 1
5 #
5 # X1
8 9
8 9
1 1
6 #
6 #
X1
11 10
11 10
12 # 1 1
12 #
MGR255 X1
MGR256
2004 Nov 11 4
Philips Semiconductors Product specification
handbook, halfpage nY
handbook, halfpage13 1 5 4 6 8 12 11
1E 1Y 2E 2Y 3E 3Y 4E 4Y nE
1Z 2Z 3Z 4Z VCC VCC
2 3 9 10
MGR257
GND nZ MGR258
2004 Nov 11 5
Philips Semiconductors Product specification
74HC4066 74HCT4066
SYMBOL PARAMETER CONDITIONS UNIT
MIN. TYP. MAX. MIN. TYP. MAX.
VCC supply voltage 2.0 5.0 10.0 4.5 5.0 5.5 V
VI input voltage GND − VCC GND − VCC V
VS switch voltage GND − VCC GND − VCC V
Tamb ambient temperature see DC and AC −40 +25 +85 −40 +25 +85 °C
characteristics −40 − +125 −40 − +125 °C
per device
tr, tf input rise and fall times VCC = 2.0 V − 6.0 1000 − 6.0 500 ns
VCC = 4.5 V − − 500 − − − ns
VCC = 6.0 V − − 400 − − − ns
VCC = 10.0 V − − 250 − − − ns
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCC supply voltage −0.5 +11.0 V
IIK input diode current VI < −0.5 V or VI > VCC + 0.5 V − ±20 mA
ISK switch diode current VS < −0.5 V or VS > VCC + 0.5 V − ±20 mA
IS switch current −0.5 V < VO < VCC + 0.5 V; note 1 − ±25 mA
ICC, IGND VCC or GND current − ±50 mA
Tstg storage temperature −65 +150 °C
Ptot power dissipation Tamb = −40 °C to +125 °C; note 2 − 500 mW
PS power dissipation per switch − 100 mW
Notes
1. To avoid drawing VCC current out of pin nZ, when switch current flows in pin nY, the voltage drop across the
bidirectional switch must not exceed 0.4 V. If the switch current flows into pin nZ, no VCC current will flow out of
pin nY. In this case there is no limit for the voltage drop across the switch, but the voltages at pins nY and nZ may
not exceed VCC or GND.
2. For DIP14 packages: above 70 °C derate linearly with 12 mW/K.
For SO14 packages: above 70 °C derate linearly with 8 mW/K.
For SSOP14 and TSSOP16 packages: above 60 °C derate linearly with 5.5 mW/K.
For DHVQFN14 packages: above 60 °C derate linearly with 4.5 mW/K.
2004 Nov 11 6
Philips Semiconductors Product specification
DC CHARACTERISTICS
Family 74HC4066
Voltages are referenced to GND (ground = 0 V); Vis is the input voltage at pins nY or nZ, whichever is assigned as an
input; Vos is the output voltage at pins nY or nZ, whichever is assigned as an output.
TEST CONDITIONS
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
OTHER VCC (V)
Tamb = −40 °C to +85 °C; note 1
VIH HIGH-level input 2.0 1.5 1.2 − V
voltage 4.5 3.15 2.4 − V
6.0 4.2 3.2 − V
9.0 6.3 4.7 − V
VIL LOW-level input voltage 2.0 − 0.8 0.50 V
4.5 − 2.1 1.35 V
6.0 − 2.8 1.80 V
9.0 − 4.3 2.70 V
ILI input leakage current VI = VCC or GND 6.0 − − ±1.0 µA
10.0 − − ±2.0 µA
IS(OFF) analog switch current per channel; VI = VIH or VIL; 10.0 − − ±1.0 µA
OFF-state VS = VCC − GND; see Fig.7
IS(ON) analog switch current VI = VIH or VIL; VS = VCC − GND; 10.0 − − ±1.0 µA
ON-state see Fig.8
ICC quiescent supply VI = VCC or GND; Vis = GND or VCC; 6.0 − − 20.0 µA
current Vos = VCC or GND 10.0 − − 40.0 µA
2004 Nov 11 7
Philips Semiconductors Product specification
TEST CONDITIONS
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
OTHER VCC (V)
Tamb = −40 °C to +125 °C
VIH HIGH-level input 2.0 1.5 − − V
voltage 4.5 3.15 − − V
6.0 4.2 − − V
9.0 6.3 − − V
VIL LOW-level input voltage 2.0 − − 0.50 V
4.5 − − 1.35 V
6.0 − − 1.80 V
9.0 − − 2.70 V
ILI input leakage current VI = VCC or GND 6.0 − − ±1.0 µA
10.0 − − ±2.0 µA
IS(OFF) analog switch current per channel; VI = VIH or VIL; 10.0 − − ±1.0 µA
OFF-state VS = VCC − GND; see Fig.7
IS(ON) analog switch current VI = VIH or VIL; VS = VCC − GND; see 10.0 − − ±1.0 µA
ON-state Fig.8
ICC quiescent supply VI = VCC or GND; Vis = GND or VCC; 6.0 − − 40.0 µA
current Vos = VCC or GND 10.0 − − 80.0 µA
Note
1. All typical values are measured at Tamb = 25 °C.
2004 Nov 11 8
Philips Semiconductors Product specification
Family 74HCT4066
Voltages are referenced to GND (ground = 0 V); Vis is the input voltage at pins nY or nZ, whichever is assigned as an
input; Vos is the output voltage at pins nY or nZ, whichever is assigned as an output.
TEST CONDITIONS
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
OTHER VCC (V)
Tamb = −40 °C to +85 °C; note 1
VIH HIGH-level input 4.5 to 5.5 2.0 1.6 − V
voltage
VIL LOW-level input voltage 4.5 to 5.5 − 1.2 0.8 V
ILI input leakage current VI = VCC or GND 5.5 − − ±1.0 µA
IS(OFF) analog switch current per channel; VI = VIH or VIL; 5.5 − − ±1.0 µA
OFF-state VS = VCC − GND; see Fig.7
IS(ON) analog switch current VI = VIH or VIL; VS = VCC − GND; see 5.5 − − ±1.0 µA
ON-state Fig.8
ICC quiescent supply VI = VCC or GND; Vis = GND or VCC; 4.5 to 5.5 − − 20.0 µA
current Vos = VCC or GND
∆ICC additional quiescent VI = VCC − 2.1 V; other inputs at VCC 4.5 to 5.5 − 100 450 µA
supply current per input or GND
Tamb = −40 °C to +125 °C
VIH HIGH-level input 4.5 to 5.5 2.0 − − V
voltage
VIL LOW-level input voltage 4.5 to 5.5 − − 0.8 V
ILI input leakage current VI = VCC or GND 5.5 − − ±1.0 µA
IS(OFF) analog switch current per channel; VI = VIH or VIL; 10.0 − − ±1.0 µA
OFF-state VS = VCC − GND; see Fig.7
IS(ON) analog switch current VI = VIH or VIL; VS = VCC − GND; see 10.0 − − ±1.0 µA
ON-state Fig.8
ICC quiescent supply VI = VCC or GND; Vis = GND or VCC; 4.5 to 5.5 − − 40.0 µA
current Vos = VCC or GND
∆ICC additional quiescent VI = VCC − 2.1 V; other inputs at VCC 4.5 to 5.5 − − 490 µA
supply current per input or GND
Note
1. All typical values are measured at Tamb = 25 °C.
2004 Nov 11 9
Philips Semiconductors Product specification
nY nZ
VI = VCC or GND A A VO = GND or VCC
GND
MGR260
nY nZ
VI = VCC or GND A A VO (open circuit)
GND
MGR261
2004 Nov 11 10
Philips Semiconductors Product specification
Notes
1. At supply voltages approaching 2 V, the analog ON-resistance switch becomes extremely non-linear. Therefore, it is
recommended that these devices are being used to transmit digital signals only, when using these supply voltages.
2. All typical values are measured at Tamb = 25 °C.
2004 Nov 11 11
Philips Semiconductors Product specification
nY
nZ
GND
MGR259
MGR262
60
handbook, halfpage
RON
(Ω) VCC = 4.5 V
50
6V
40
9V
30
20
10
0 1.8 3.6 5.4 7.2 9
Vis (V)
Vis = 0 V to VCC.
2004 Nov 11 12
Philips Semiconductors Product specification
AC CHARACTERISTICS
Type 74HC4066
GND = 0 V; tr = tf = 6 ns; CL = 50 pF; Vis is the input voltage at pins nY or nZ, whichever is assigned as an input; Vos is
the output voltage at pins nY or nZ, whichever is assigned as an output.
TEST CONDITIONS
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
OTHER VCC (V)
Tamb = −40 °C to +85 °C; note 1
tPHL/tPLH propagation delay RL = ∞; see Fig.19 2.0 − 8 75 ns
Vis to Vos 4.5 − 3 15 ns
6.0 − 2 13 ns
9.0 − 2 10 ns
tPZH/tPZL turn-on time nE to Vos RL = 1 kΩ; see Figs 20 and 21 2.0 − 36 125 ns
4.5 − 13 25 ns
6.0 − 10 21 ns
9.0 − 8 16 ns
tPHZ/tPLZ turn-off time nE to Vos RL = 1 kΩ; see Figs 20 and 21 2.0 − 44 190 ns
4.5 − 16 38 ns
6.0 − 13 33 ns
9.0 − 16 26 ns
Tamb = −40 °C to +125 °C
tPHL/tPLH propagation delay RL = ∞; see Fig.19 2.0 − − 90 ns
Vis to Vos 4.5 − − 18 ns
6.0 − − 15 ns
9.0 − − 12 ns
tPZH/tPZL turn-on time nE to Vos RL = 1 kΩ; see Figs 20 and 21 2.0 − − 150 ns
4.5 − − 30 ns
6.0 − − 26 ns
9.0 − − 20 ns
tPHZ/tPLZ turn-off time nE to Vos RL = 1 kΩ; see Figs 20 and 21 2.0 − − 225 ns
4.5 − − 45 ns
6.0 − − 38 ns
9.0 − − 30 ns
Note
1. All typical values are measured at Tamb = 25 °C.
2004 Nov 11 13
Philips Semiconductors Product specification
Type 74HCT4066
GND = 0 V; tr = tf = 6 ns; CL = 50 pF; Vis is the input voltage at pins nY or nZ, whichever is assigned as an input; Vos is
the output voltage at pins nY or nZ, whichever is assigned as an output.
TEST CONDITIONS
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
OTHER VCC (V)
Tamb = −40 °C to +85 °C; note 1
tPHL/tPLH propagation delay RL = ∞; see Fig.19 4.5 − 3 15 ns
Vis to Vos
tPZH/tPZL turn-on time nE to Vos RL = 1 kΩ; see Figs 20 and 21 4.5 − 12 30 ns
tPHZ/tPLZ turn-off time nE to Vos RL = 1 kΩ; see Figs 20 and 21 4.5 − 20 44 ns
Tamb = −40 °C to +125 °C
tPHL/tPLH propagation delay RL = ∞; see Fig.19 4.5 − − 18 ns
Vis to Vos
tPZH/tPZL turn-on time nE to Vos RL = 1 kΩ; see Figs 20 and 21 4.5 − − 36 ns
tPHZ/tPLZ turn-off time nE to Vos RL = 1 kΩ; see Figs 20 and 21 4.5 − − 53 ns
Note
1. All typical values are measured at Tamb = 25 °C.
CONDITIONS
SYMBOL PARAMETER TYP. UNIT
OTHER Vis(p-p) (V) VCC (V)
dsin sine wave distortion f = 1 kHz; RL = 10 kΩ; CL = 50 pF; 4.0 4.5 0.04 %
see Fig.17 8.0 9.0 0.02 %
f = 10 kHz; RL = 10 kΩ; CL = 50 pF; 4.0 4.5 0.12 %
see Fig.17 8.0 9.0 0.06 %
αOFF(feedthr) switch OFF signal RL = 600 Ω; CL = 50 pF; f = 1 MHz; note 1 4.5 −50 dB
feed-through see Figs 11 and 18 9.0 −50 dB
αct(s) crosstalk between any two RL = 600 Ω; CL = 50 pF; f = 1 MHz; note 1 4.5 −60 dB
switches see Fig.13 9.0 −60 dB
Vct(p-p) crosstalk voltage between RL = 600 Ω; CL = 50 pF; f = 1 MHz; − 4.5 110 mV
any input to any switch see Fig.15 (nE, square wave 9.0 220 mV
(peak-to-peak value) between VCC and GND,
tr = tf = 6 ns)
fmax minimum frequency RL = 50 Ω; CL = 10 pF; see Figs 12 note 2 4.5 180 MHz
response (−3 dB) and 16 9.0 200 MHz
CS maximum switch − − 8 pF
capacitance
Notes
1. Adjust input voltage Vis is 0 dBM level (0 dBM = 1 mW into 600 Ω).
2. Adjust input voltage Vis is 0 dBM level at Vos for 1 MHz (0 dBM = 1 mW into 50 Ω).
2004 Nov 11 14
Philips Semiconductors Product specification
MGR263
0
handbook, full pagewidth
(dB)
−20
−40
−60
−80
−100
10 102 103 104 105 106
f (kHz)
MGR264
5
handbook, full pagewidth
(dB)
−5
10 102 103 104 105 106
f (kHz)
2004 Nov 11 15
Philips Semiconductors Product specification
2RL
0.1 µF
nY/nZ nZ/nY
VI
RL
2RL CL
channel
GND
ON
MGR265
Fig.13 Test circuit for measuring crosstalk between any two switches; channels ON condition.
2RL 2RL
nY/nZ nZ/nY
Vos
2RL 2RL CL dB
channel
OFF
GND
MGR266
Fig.14 Test circuit for measuring crosstalk between any two switches; channels OFF condition.
2004 Nov 11 16
Philips Semiconductors Product specification
GND
MGR268
Fig.15 Test circuit for measuring crosstalk between control and any switch.
2RL
0.1 µF
nY/nZ nZ/nY
Vis Vos
sine-wave
2RL CL dB
channel
GND
ON
MGR269
Adjust input voltage to obtain 0 dB at Vos when fi = 1 MHz. After set-up, the frequency of fi is increased to obtain a reading of -3 dB at Vos.
2004 Nov 11 17
Philips Semiconductors Product specification
2RL
10 µF
nY/nZ nZ/nY
fi = 1 kHz Vis Vos
sine-wave
DISTORTION
2RL CL
METER
channel
ON GND
MGR270
2RL
0.1 µF
nY/nZ nZ/nY
Vis Vos
2RL CL dB
channel
GND
OFF
MGR271
2004 Nov 11 18
Philips Semiconductors Product specification
AC WAVEFORMS
Vos 50%
tPLH tPHL
MGR272
Fig.19 Waveforms showing the input (Vis) to output (Vos) propagation delays.
tf tr
90 %
nE input VM
10 %
t PLZ t PZL
output
LOW - to - OFF 50 %
OFF - to - LOW
10 %
t PHZ t PZH
90 %
output
HIGH - to - OFF 50 %
OFF - to - HIGH
2004 Nov 11 19
Philips Semiconductors Product specification
VI VO RL switch
PULSE
D.U.T. open
GENERATOR
RT CL
GND
MGR273
tr and tf
FAMILY AMPLITUDE VM fmax; PULSE
OTHER
WIDTH
74HC4066 VCC 50 % <2 ns 6 ns
74HCT4066 3.0 V 1.3 V <2 ns 6 ns
2004 Nov 11 20
Philips Semiconductors Product specification
PACKAGE OUTLINES
D ME
seating plane
A2 A
L A1
c
Z e w M
b1
(e 1)
b
14 8 MH
pin 1 index
E
1 7
0 5 10 mm
scale
UNIT
A A1 A2
b b1 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.73 0.53 0.36 19.50 6.48 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 2.2
1.13 0.38 0.23 18.55 6.20 3.05 7.80 8.3
0.068 0.021 0.014 0.77 0.26 0.14 0.32 0.39
inches 0.17 0.02 0.13 0.1 0.3 0.01 0.087
0.044 0.015 0.009 0.73 0.24 0.12 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
99-12-27
SOT27-1 050G04 MO-001 SC-501-14
03-02-13
2004 Nov 11 21
Philips Semiconductors Product specification
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
D E A
X
y HE v M A
14 8
Q
A2
(A 3) A
A1
pin 1 index
θ
Lp
1 7 L
e w M detail X
bp
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
99-12-27
SOT108-1 076E06 MS-012
03-02-19
2004 Nov 11 22
Philips Semiconductors Product specification
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1
D E A
X
c
y HE v M A
14 8
Q
A2 A
A1 (A 3)
pin 1 index
θ
Lp
L
1 7 detail X
w M
e bp
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT337-1 MO-150
03-02-19
2004 Nov 11 23
Philips Semiconductors Product specification
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
D E A
X
y HE v M A
14 8
Q
A2 (A 3)
A
A1
pin 1 index
θ
Lp
L
1 7
detail X
w M
e bp
0 2.5 5 mm
scale
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT402-1 MO-153
03-02-18
2004 Nov 11 24
Philips Semiconductors Product specification
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm SOT762-1
D B A
A
A1
E c
terminal 1 detail X
index area
terminal 1 e1 C
index area
e b v M C A B y1 C y
w M C
2 6
1 7
Eh e
14 8
13 9
Dh
X
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
A(1)
UNIT
max.
A1 b c D (1) Dh E (1) Eh e e1 L v w y y1
2004 Nov 11 25
Philips Semiconductors Product specification
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS DISCLAIMERS
Short-form specification The data in a short-form Life support applications These products are not
specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or
same type number and title. For detailed information see systems where malfunction of these products can
the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
Limiting values definition Limiting values given are in
for use in such applications do so at their own risk and
accordance with the Absolute Maximum Rating System
agree to fully indemnify Philips Semiconductors for any
(IEC 60134). Stress above one or more of the limiting
damages resulting from such application.
values may cause permanent damage to the device.
These are stress ratings only and operation of the device Right to make changes Philips Semiconductors
at these or at any other conditions above those given in the reserves the right to make changes in the products -
Characteristics sections of the specification is not implied. including circuits, standard cells, and/or software -
Exposure to limiting values for extended periods may described or contained herein in order to improve design
affect device reliability. and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information Applications that are
communicated via a Customer Product/Process Change
described herein for any of these products are for
Notification (CPCN). Philips Semiconductors assumes no
illustrative purposes only. Philips Semiconductors make
responsibility or liability for the use of any of these
no representation or warranty that such applications will be
products, conveys no licence or title under any patent,
suitable for the specified use without further testing or
copyright, or mask work right to these products, and
modification.
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2004 Nov 11 26
Philips Semiconductors – a worldwide company
Contact information
Printed in The Netherlands R44/05/pp27 Date of release: 2004 Nov 11 Document order number: 9397 750 14188