August 2022| Volume 01 | Issue 02 | Pages 36-45

Zuhanee Khan /Future Technology August 2022| Volume 01 | Issue 02 | Pages

36-45 Technology
Future
Journal homepage: https://fupubco.com/futech
Open Access Journal

ISSN 2832-0379
https://doi.org/10.55670/fpll.futech.1.2.5

Review

A review of phase change materials (PCMs) in

electronic device cooling applications
Zuhanee Khan*
Department of Mechanical Engineering, Arkansas Tech University, 1811 N Boulder Ave, Russellville, AR, 72801, USA

ARTICLE INFO ABSTRACT

Article history: The portable electronic devices in everyday life have been getting increasingly
Received 02 July 2022 compact day by day, and with the advancement in wireless technology, they are
Received in revised form expected to facilitate multitasking. In this context, efficient heat dissipation to
03 August 2022 maintain consistent thermal performance has become quite a challenge. Phase
Accepted 07 August 2022 change materials (PCMs) have emerged as a viable option to eliminate problems
regarding the thermal management of compact electronics. This review looks
Keywords: into the different types of PCMs investigated by researchers so far, especially in
Phase change materials, the case of cooling compact electronic devices. It also discusses the parameters
Passive cooling, microencapsulation, critical to its efficiency and implementation, encapsulation, etc. The merit of
Thermal conductivity enhancers, internal fins, nanomaterials, and metal foams as thermal conductivity
Internal fins, nanoparticles enhancers along with shortcomings in the current literature have also been
noted in this review.
*Corresponding author
Email address: [email protected]

DOI: 10.55670/fpll.futech.1.2.5

1. Introduction compact electronics [10,11]. Phase change material (PCM)

The compact electronic devices used in everyday life are comes into play for the thermal management of compact
getting smaller, slicker, and more lightweight in design. This mobile electronics on account of being compact, static, and
inevitably makes their internal geometry more complex, and passive [12-14], which helps minimize throttling due to
assembly strictly limited in volume. Therefore, proper and transient loads. Owing to the fact that passive heat sinks do
consistent heat dissipation in these devices is becoming more not consume any additional power and have no moving
challenging. In addition, the evolution of wireless component, PCM-based passive heat sinks have grabbed the
technologies has notably increased the bandwidth, capacity, attention of researchers as a reliable solution for quite a while
and utility of portable electronic devices, and will continue to now [15]. PCMs have been acknowledged as competent
do so in the coming future. Thus, while the scope of multi- candidates by many researchers to regulate the thermal
tasking with compact electronics has expanded, the loads on performance of a wide range of systems [16-18] including
the processors in these devices have also become highly thermal protection systems [19-21], energy storage systems
variable and more likely to experience temporary power [16, 22, 23], and electronic cooling systems [24, 25]. They are
surges. Hence, without an appropriate thermal management substances that can absorb and subsequently release a
system in place, temperature rise would result in sufficient amount of energy during phase transition to
performance deterioration, critical failure of components facilitate effective heating and cooling. Generally, PCMs have
[1,2], and discomfort in interaction with the device [3-5]. The relatively high latent heat capacity. Between sensible heat
criticality of temperature management in electronics may be and latent heat, the latter is the more efficient way to store
emphasized by the fact that over 55% of electronic device thermal energy since it provides significantly higher energy
failures are associated with high temperatures [6,7]. storage density along with a lower difference in temperature
Moreover, the electronic device failure rate may decrease by during heat absorption and release [16]. There is a broad
4% if the component temperature can be lowered by just 1°C. variety of PCMs that switches between solid and liquid phases
On the other hand, the failure rate may increase by 100% if at a wide range of operating temperatures. Such
the device temperature rises by 10–20°C [8]. To make things characteristics make them lucrative to implement in a
worse, factors like noise, maintenance, additional cost, and number of applications. Figure 1 illustrates the heat
power consumption [9] make conventional thermal absorption and emission process of a phase change material.
management systems unsuitable for implementation in

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Figure 1. Heat absorption and emission process of a phase change material

In fact, passive cooling systems using PCMs have been 2. Encapsulation of PCMs
dubbed the next-generation electronic cooling system by Encapsulation of phase change materials (PCMs) is an
some researchers [27]. Research showed that PCM-based essential process that provides several benefits in a thermal
passive thermal systems could achieve significant management system. For an ideal encapsulated PCM system
improvement in thermal control provided that the with satisfactory storage efficiency, the shell layer needs to
temperature control set points and the fluctuation range of possess good mechanical property, should protect inner PCM
the ambient temperature were enveloped by the phase from leakage, and occupy only a small fraction of the system
change range of the PCM [28]. Over the past few years, volume. So, the core (PCM) to shell ratio is important in
researchers have been extensively investigating phase successful encapsulation. Among the advantages of PCM
change heat storage to attain an alternative solution to encapsulation are larger heat transfer area, reduced reactivity
existing thermal management problems [29-31]. On account with the surroundings, and precise volumetric control at the
of their relatively high latent heat capacity, PCMs have the outset of phase transition [16]. More than two hundred
ability to delay the elevation of temperature and store it for materials melting from 10°C to 90°C have been identified by
a certain duration, which is called effective thermal control Lane [34, 35], to be potentially used for encapsulation of
time [32, 33]. This is an indication that the application of PCMs. In order to prevent leakage of melted PCMs and
PCM can effectively regulate the temperature of electronics simultaneously control the volume fluctuations during the
within the desired range. Commonly used PCMs, such as – occurrence of phase change, the microencapsulation
paraffin waxes, are cheap and possess a moderate level of technique is employed [36, 37]. Such a microencapsulation
thermal storage density. However, they have low thermal method called the Pickering emulsion templating method has
conductivity and consequently require a large surface area emerged as a promising method to fabricate
for adequate heat transfer. On the other hand, hydrated salts microencapsulated phase change materials (microPCMs)
as PCMs can provide larger energy storage density and [38]. Stabilization of Pickering emulsions by solid particles
higher thermal conductivity but they go through has been recognized as a more stable and eco-friendly option
supercooling and phase separation during the transition, than conventional emulsions [39, 40]. Not only that, but it has
which means that their application needs to be combined also shown compatibility with a variety of polymeric shell
with some appropriate nucleating and thickening agents materials. Stabilizers such as– Fe3O4 [41], TiC [42], TiO2 [43],
[16]. Classification of phase change materials is shown in BN [44], SiO2 nanoparticles [45], have already been used to
Figure 2. produce microPCMs. Multiple studies have reported an
encapsulation ratio between 62.5% to 72.0% and commented
that the emulsification efficiency was limited by the Pickering
particle used, to a great extent. Zhang et al. [46] achieved a
slightly better encapsulation ratio (78%) and latent heat of
186.8 J/g, using double-walled shells (polystyrene/ graphene
oxide). These approaches have brought about several
advantages of micro- or nano-encapsulated PCMs, namely,
better encapsulation ratio, enhanced thermal conductivity,
and improved protection against leakages. Zhu et al. [47]
prepared microPCMs composited with silicone rubber, in the
shape of a sheet and studied its capability to delay
temperature rise against scenarios where processor demands
are high, e.g., gaming and multitasking. The internal structure
Figure 2. Classification of phase change materials [26] of the PCM/ rubber composites was also observed by them. It
was reported that the shell of the microencapsulation

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remained intact without any visible oil stains, which implies that PCM could control the maximum temperature below 48.0
that those microcapsules possess the mechanical strength to °C. Analytical modeling and optimization of the Li-ion battery
survive sheer force and heating at the time of its composition. pack by Parhizi et al. [57] have revealed that the thermal
The analysis of the life cycle of the encapsulated PCMs showed conductivity of PCMs has a substantial impact on the cell core
that it could be expected to be the same as that of the service temperature. A numerical and experimental study by Huang
life of the device, meaning it would not be necessary to be et al. [58] proposed and investigated various flexible form-
replaced during the device’s lifetime. For the stable composite PCMs (CPCMs) and embedded them in a Li-
microencapsulation of organic phase change materials ion battery pack. The experimental results showed a
(OPCMs), polymeric nanoparticles have also been utilized. temperature drop of 18 °C at a 10 °C discharge rate, which
Lignin nanoparticles [48], Cellulose nanocrystals (CNCs) [49] allowed the battery pack to operate safely for a longer
have been employed as Pickering stabilizers to achieve an duration without exceeding the critical upper-temperature
encapsulation ratio between 81.4% and 83.5%. Moreover, limit. The study found flexible CPCM for low power levels and
Nanochitin has been proved to be a super-efficient choice for low ambient temperatures; and another one for high power
a Pickering stabilizer due to its effectiveness at ultra-low levels, fluctuating heat fluxes, and high ambient
concentrations [50-52], compared with CNCs and lignin. In temperatures. Addressing the problem of space limitation,
their investigation, [47, 51] studied the physiochemical complex irregular internal geometry, and proper contact with
properties of regenerated nanochitin (RCh) and the internal components, Wanwan et al. [59] managed to develop
corresponding Pickering emulsions. It was mentioned that a flexible PCM (FPCM) of 0.4 mm thickness [60, 61].
usage of RCh also concurs with the sustainability Subsequently, the researchers conducted experimental
requirement [47]. Encapsulated paraffin wax (PW) in studies on small-type compact electronic devices and
polyurea (PU) shells and used RCh as a stabilizer to prepare confirmed the stability of shape, thermophysical properties,
microPCMs with high payload and phase transition enthalpy. and durability. The developed FPCM film achieved overall
Morphological analysis, thermal storage capacity, thermal thermal conductivity of 1.68 W/m·K and reduced the
reliability, and stability were subsequently analyzed. In temperature of the chip by 11°C at 2.5 W operating power.
addition, those microPCMs were blended with silicone rubber Despite that, the FPCM was unable to provide proper heat
and attached to the central processing unit (CPU) within a flow along the in-plane direction inside the device. Therefore,
mobile phone, which could potentially avoid any drastic graphene film with transverse thermal conductivity of 1500
temperature rise during operation. Figure 3 demonstrates a W/m·K was used to increase the heat diffusion area along the
schematic diagram illustrating the preparation and in-plane direction. The results showed improvement in heat
implementation of the RCh/PU microPCMs [47]. diffusion along with 32.4% extension in thermal control time
at 3.2 W. Figure 4 and Figure 5 demonstrate FPCM film
developed by Wanwan et al. [59] and Heat diffusion FPCM
film composited with a graphene sheet.

Figure 3. Schematic diagram illustrating the preparation and

implementation of the RCh/PU microPCMs [47]
In conclusion, the RCh/PU microPCMs showed
significant effectiveness in cooling of compact electronic
devices, particularly in case of delaying spike in temperature
during heavy loading (>80% CPU utilization), and hence, it
possesses massive potential in the passive thermal
management of such devices. Tomizawa et al. [53] fabricated Figure 4. FPCM film developed by Wanwan et al. [59]
a microencapsulated PCM sheet with a thickness between
1.60~2.45 mm to embed in mobile devices. It was claimed
that the development of a sufficiently thin PCM sheet or film
would successfully solve the problems in phase change
thermal management of compact electronics.
3. PCM: Variety, Performance, and Applications
Understandably, researchers have been exploring the
application of a wide variety of PCMs to be employed in
compact electronic devices. Hydrocarbon like n-eicosane has
been used in conjunction with finned heat sinks for thermal
control of portable electronic devices [54]. The effect of
power levels and orientation have also been studied. An
experimental study of multiwall carbon nanotube/paraffin as
heat sink revealed that nano-PCM module can enhance
thermal control of electronic chipset by reducing the cooling
time up to 6.0% [55]. Jieshan He et al. [56] made a composite Figure 5. Heat diffusion FPCM film composited with
PCM to conduct battery thermal management and observed graphene sheet [59]

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4. Thermal conductivity enhancement electronic device cooling, its proper implementation is still
A critical issue that restricts the application of PCMs is subject to optimizations in terms of the quantity of PCMs,
the thermal conductivity property. Because of low thermal number of fins, power level of the heat source, etc. In order to
conductivity, especially in organic PCMs (0.1~0.4 W/m·K), improve the thermal conductivity of passive thermal
the heat transfer rate within a PCM block remains limited. management systems, Hafiz et al. [78] used pin-fins in an n-
Thus, the latent heat capacity of PCMs can only be partially eicosane-based circular heat sink. The study found definitive
utilized. Inability to melt sufficiently during heat absorption evidence of positive thermal control performance. Having
causes them to become thermal insulators, which is severely said that, the optimal thickness was found to be 3 mm, which
damaging to the heat dissipation of the electronic device [62]. is still unsuitable for compact electronics. Theoretical and
For PCM cooling to become suitable for electronic cooling numerical study of Gallium-based PCM heat sink with copper
applications, it is necessary to combine it with materials that fin structures were conducted to determine the ability of such
would boost its thermal conductivity and consequently result systems to cope with ultra-high thermal shocks. The findings
in better heat conduction. Such materials are known as suggested that copper could be used under ultra-high thermal
thermal conductivity enhancers (TCEs). As a result, shock conditions. However, its effectiveness was critically
researchers have leaned towards composite PCMs dependent on factors such as the geometric dimension of the
manufactured with TCEs such as internal fins, metallic foams fin and the number of fins within the limit [79]. Several
[63], carbon-based matrix [64], nanomaterials, etc. to investigations focused on the efficiency of pin fins for PCM
counteract the challenges with thermal conductivity. To (paraffin wax, n-eicosane) based heat sinks while varying the
optimize the problem regarding thermal conductivity, fin thickness, volumetric fraction, and heat flux [80- 84]. It has
researchers have explored thermal conductivity been shown that pin-fins can serve as thermal conductivity
enhancement techniques. In PCM composited with carbon enhancers (TCE) at a constant volume fraction [85]; the
foam support structures, the calculations showed that number of fins and volumetric fraction were crucial in such
controlled temperature could drop by 59°C provided that the cases [86]. Moreover, research efforts have been made to
thermal conductivity of the carbon foam was increased by determine heat sink matrix performance under different heat
50% [65]. The incorporation of inorganic nanoparticles into inputs. Srikanth et al. [87] conducted a numerical and
paraffin wax achieved a maximum 16% increment in its experimental study to optimize a PCM-based composite pin-
thermal conductivity, with 0.3% added weight [66]. For fin matrix heat sink in order to extend the thermal operation
organic PCMs, the fabrication of the carbon nanotube/Cu- time during heating and reduce the duration of the
foam hybrid resulted in an enhancement of thermal discharging cycle. Numerous studies explored the
conductivity of the paraffin matrix by a factor of 3.1 [67]. In effectiveness of pin-fins as TCE in PCM-based thermal
high-power Li-ion battery modules, an integrated copper systems and found positive outcomes. Nevertheless, research
microfibrous–metal cooling tube structure was developed to also showed that the number of fins, PCM quantity, power
increase heat transfer [26]. The study found that the battery rating of the heat input [88, 89], the volumetric fraction of
cell temperature could be much lower than the threshold and fins, and convection [90] were decisive factors in these
the heat transfer could reach about 58.0 W/m·K. scenarios, both for constant and sporadic thermal loading. A
Nevertheless, the corresponding volume of the structure was comparative study of pure PCM, PCM in a graphite matrix, and
0.57L, which is considered oversized for compact electronics. PCM in silicone matrix in pin-fin heat sinks discovered that
In the study of the melting performance of PCMs in a thermal the graphite matrix packed with PCM dominates over other
storage system, Xu et al. [68] used porous metallic media in patterns [91]. Hafiz et al. [92] assessed the effects of various
an effort to increase the thermal response of PCMs. The study parameters on the passive cooling of electronic devices. The
found silicon carbide to be a suitable practical choice because study was conducted within a power level of 5W to 8W, with
it has relatively high thermal conductivity, is chemically inert, three different pin-fin configurations (circular, rectangular,
and inexpensive. Wei & Malen [69] explored the advantages and triangular cross-sections) and six different phase change
of spatially dependent reinforcements to enhance thermal materials (paraffin wax, RT-54, RT-44, RT-35HC, SP-31, and
conductivity on the charge and discharge rates of PCMs. The n-eicosane); at a constant volumetric fraction of both pin-fins
combination of copper fibers with PCM-based heat sinks also (9.0%) and PCMs (90.0%). The outcomes suggested that pin-
showed massive potential for thermal conductivity fins with triangular cross-sections were dominant over
enhancement of the PCMs [70]. Usage of PCM boards others, followed by rectangular and circular ones,
displayed high thermal storage capacity and improved respectively. Heat sinks with different pin-fin configurations
thermal conductivity, indicating its suitability in electronic have been shown in Figure 6.
cooling applications [71]. Various passive cooling methods
were enlisted and evaluated in a review by Sahoo et al. [72].
4.1 Internal fins as TCE
The numerical study by Shatikian et al. [73, 74] revealed
the melting characteristics of a PCM-based passive thermal (a)Circular pin-fins (b)Rectangular pin-fins (c)Triangular pin-fins
system containing internal fins. The effect of various
parameters including different fin dimensions, the thickness Figure 6. Heat sinks with different pin-fin configurations [92]
of PCM layers, and heat flux was investigated. Another
numerical study by Wang et al. [75] explored some key factors It may be noted that although PCM with pin fins results
affecting the thermal performance of PCM-based multi-fin in better performance, about 70% of the studies have used
heat sinks and reported that such heat sinks would be plate fins simply because of the ease of manufacturing. Also,
favorable for maintaining stable operational temperature in 57% of internal fin-related studies used eicosane as the phase
electronic devices. However, while researchers such as Fok et change material [72]. As discussed above, a considerable
al. [76] and Kalbasi et al. [77] concur that PCM-based systems number of research have been conducted on phase change
with internal fins are potentially pragmatic solutions for material-based thermal systems. There are findings that can

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potentially provide a better performance, for example, the variable mass fraction of EG revealed that EG composites at a
development of thin PCM sheets. But the current progress is 10% mass fraction could potentially be the most promising
yet to match the high degree of compactness and equally option for passive thermal storage systems [97]. Other
complicated internal geometry of the compact devices so that studies revealed that the addition of EG had no effect on the
they would be assembled perfectly with other internal parts. thermal properties of the paraffin/EG composite PCM while
the charging duration for the composite was shorter
4.2 Nanomaterials as TCE compared with pure paraffin PCM [98]. Wang et al. [99]
Metallic fins do improve the thermal performance of the
conducted an experimental study to obtain enhanced heat
passive cooling systems, but they also add to the weight of the
transfer performance at different power levels by fabricating
system while reducing the volume of PCM. Understandably, it
a composite PCM embedded in a porous metal matrix. It has
somewhat negates its beneficial effect. Highly conductive
been suggested to include low melting point liquid metals as
nanoparticles added at a small volume fraction may work as
a new category of PCM. Regarding this, a cooling system with
an excellent thermal conductivity enhancer (TCE) and be a
gallium-PCM is said to be a feasible choice in such systems
great contender for electronic device cooling applications.
[100, 101]. Embedding PCM in carbon foam to achieve
Composite PCMs with different nanoparticles at varied mass
enhanced heat transfer has been stated as the most promising
concentrations have been assessed in many studies.
enhancement technique by some authors [102]. Fabrication
Dispersion of copper oxide nanoparticles at different mass
and testing of a low melting point alloy (LMPA) by Zhao et al.
loading showed that there is a linear relationship between the
[95] showed comparative performance of the prepared PCM
thermal conductivity and mass loading of nanoparticles [93].
with traditional organic PCM (paraffin, RT-60). The
Similarly, composite PCMs made with nano-graphite (NG)/
comparison showed up to 50 times better thermal
paraffin demonstrated a gradual increase in thermal conductivity in LMPA as well as 2.11 times higher thermal
conductivity along with the NG content [94]. It has been found
energy storage capacity per unit volume. Its performance held
that for a fixed power level, the base temperature of the
up, particularly at lower heat flux (3000–5000 Wm-2), but not
device decreases when the nanoparticle loading is increased.
so much at higher heat flux (~7000 Wm-2), possibly due to
However, for higher power levels, the effect of nanoparticle
heat leakage at higher flux. To remedy that, the researchers
loading becomes immaterial. In addition, more nanoparticle
added Poco foam to the LMPA and reported satisfactory
also means reduced melting duration due to lower volume of
performance even at higher heat flux. About two-third of the
the PCM. Nonetheless, these observations may vary
studies with metal foams have used eicosane as the PCM. Also,
depending on the size, shape, and type of PCMs. Hence, the
two-third of the metal foams were made of aluminum while
current research findings are still not sufficient to draw any
the rest were made of copper [72]. Copper foam as a thermal
conclusive remark regarding the performance and
conductivity enhancer has shown to make internal heat
applicability of nano-enhanced PCMs. More thorough
transfer in paraffin PCMs more uniform and reduce the heat
research is essential to establish relationships between base
storage duration of paraffin wax [103]. It should be noted that
temperature, melting period, power level, particle loading
although copper and carbon foam have been used as foam
level, etc. [72]. materials, a comprehensive study regarding its corrosion
4.3 Metal foams as TCE behavior is required before its stable application.
The applicability of metallic foams with PCMs has
5. Conclusion
grabbed the attention of researchers in recent years mainly
Since electronic and wireless technology have been
due to significantly better thermal conductivity and
focused on becoming increasingly compact, portable, and
lightweight. Combining the ability of PCM to store thermal
capable of multitasking, the challenge of dissipating excess
energy with the ability of metal foams to transport heat away
heat due to additional power consumption is only getting
from the electronic chips and distribute it uniformly
more critical day by day. Due to its high latent heat capacity,
throughout the PCM has become the key objective to them.
phase change materials have emerged as a promising solution
With internal fins, despite the improvement in thermal
in establishing an efficient passive thermal cooling system.
performance, non-uniform heat transfer and the added
The main points of focus have been to regulate temperature
weight of the fins are still an issue. With nanoparticles, there
of electronic devices such that it concurs with the phase
are issues with particle loading at higher power levels, and
change range of PCMs and to extend the effective thermal
PCM–nanoparticle compatibility is also a problem in many
control time for consistent heat dissipation. A variety of PCMs
cases. Metal foam composite PCMs can circumvent these
by themselves and along with incorporating other organic
issues and still provide desired results. In comparison with
and inorganic materials have been evaluated and found
conventional PCMs (paraffin, acid, and hydrous salt), most
promising results. Moreover, the encapsulation process,
alloys provide certain advantages such as relatively high
which determines the efficiency and longevity of PCMs, has
thermal conductivity, lower volume expansion, higher
also been discussed. As volumetric restrictions and complex
volume latent heat and accurate phase change temperature,
internal geometry have limited the application of PCM-based
etc [95]. Tian and Zhao [96] numerically investigated the
systems, some studies devoted to developing flexible PCM
implementation of metallic foams with PCMs and their effect
sheet/ film have been discussed above. The addition of
on heat transfer enhancement in the system. Their study
composite materials such as- graphene matrix seemed to
stated that for a variety of metal foam samples, the heat
enhance thermal performance in flexible PCM sheets. Finally,
transfer rate can be further improved by using metal foams
approaches towards the enhancement of thermal
with relatively small porosities and larger pore densities.
conductivity via three different approaches (internal fins,
Porosity, pore density, interstitial heat transfer, and thermal
nanoparticles, and metal foams) have been discussed. It is
conductivity dictate the suitability of metal foams composited
evident that phase change materials in electronic device
with PCMs. The use of metal foams reduces the time lag of the
cooling have been the center of attention in numerous
response from the PCM which in turn provides better
analytical and experimental studies. That said, more
resistance to overheating of the device. Experimental studies
exhaustive research is still required to understand and
on paraffin/ expanded graphite (EG) composites with a

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[12] R. Kandasamy, X.-Q. Wang, and A. S. Mujumdar,
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