FCM360W Hardware Design

Wi-Fi&Bluetooth Module Series

Version: 1.0

Date: 2023-10-18

Status: Released
 Wi-Fi&Bluetooth Module Series

At Quectel, our aim is to provide timely and comprehensive services to our customers. If you
require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd.

Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District,
Shanghai 200233, China
Tel: +86 21 5108 6236
Email: [email protected]

Or our local offices. For more information, please visit:

http://www.quectel.com/support/sales.htm.

For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm.
Or email us at: [email protected].

Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we
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analysis and evaluation in designing intended products, and we provide reference designs for illustrative
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 Wi-Fi&Bluetooth Module Series

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to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel
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of dealing or usage of trade.

Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers,
including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the
relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the
purpose of performing the service only or as permitted by applicable laws. Before data interaction with
third parties, please be informed of their privacy and data security policy.

Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein.
c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless
otherwise provided by valid agreement, we make no warranties of any kind, either implied or
express, and exclude all liability for any loss or damage suffered in connection with the use of
features and functions under development, to the maximum extent permitted by law, regardless of
whether such loss or damage may have been foreseeable.
d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness
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Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

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 Wi-Fi&Bluetooth Module Series

Safety Information
The following safety precautions must be observed during all phases of operation, such as usage,
service or repair of any terminal or mobile incorporating the module. Manufacturers of the terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure
to comply with these precautions.

Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.

Switch off the terminal or mobile before boarding an aircraft. The operation of
wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.

Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.

Terminals or mobiles operating over radio signal and cellular network cannot be
guaranteed to connect in certain conditions, such as when the mobile bill is unpaid
or the (U)SIM card is invalid. When emergency help is needed in such conditions,
use emergency call if the device supports it. In order to make or receive a call, the
terminal or mobile must be switched on in a service area with adequate cellular
signal strength. In an emergency, the device with emergency call function cannot
be used as the only contact method considering network connection cannot be
guaranteed under all circumstances.

The terminal or mobile contains a transceiver. When it is ON, it receives and

transmits radio frequency signals. RF interference can occur if it is used close to
TV sets, radios, computers or other electric equipment.

In locations with explosive or potentially explosive atmospheres, obey all posted

signs and turn off wireless devices such as mobile phone or other terminals. Areas
with explosive or potentially explosive atmospheres include fueling areas, below
decks on boats, fuel or chemical transfer or storage facilities, and areas where the
air contains chemicals or particles such as grain, dust or metal powders.

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 Wi-Fi&Bluetooth Module Series

About the Document

Revision History

Version Date Author Description

- 2023-03-08 Mark WU Creation of the document

1.0 2023-10-18 Rudolf YANG/Orange LI First official release

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Contents

Safety Information ....................................................................................................................................... 3

About the Document ................................................................................................................................... 4
Contents ....................................................................................................................................................... 5
Table Index ................................................................................................................................................... 7
Figure Index ................................................................................................................................................. 8

1 Introduction .......................................................................................................................................... 9
1.1. Special Marks.............................................................................................................................. 9

2 Product Overview............................................................................................................................... 10
2.1. Key Features ............................................................................................................................. 11
2.2. Functional Diagram ................................................................................................................... 12

3 Application Interfaces ....................................................................................................................... 13

3.1. Pin Assignment ......................................................................................................................... 13
3.2. Pin Description .......................................................................................................................... 14
3.3. GPIO Multiplexing ..................................................................................................................... 17
3.4. Application Interfaces ................................................................................................................ 19
3.4.1. UARTs ............................................................................................................................ 19
3.4.2. SPI .................................................................................................................................. 21
3.4.3. I2C Interface* ................................................................................................................. 22
3.4.4. SDIO Interface* .............................................................................................................. 23
3.4.5. PWM Interfaces .............................................................................................................. 24
3.4.6. I2S Interface ................................................................................................................... 24
3.4.7. ADC Interfaces ............................................................................................................... 25

4 Operating Characteristics ................................................................................................................. 26

4.1. Power Supply ............................................................................................................................ 26
4.1.1. Reference Design for Power Supply .............................................................................. 26
4.2. Turn On ..................................................................................................................................... 27
4.3. Reset ......................................................................................................................................... 28
4.4. Download Mode ........................................................................................................................ 29

5 RF Performances ............................................................................................................................... 30
5.1. Wi-Fi Performances .................................................................................................................. 30
5.2. Bluetooth Performances ........................................................................................................... 31
5.3. Antenna/Antenna Interfaces ..................................................................................................... 32
5.3.1. Pin Antenna Interface (ANT_WIFI/BT) ......................................................................... 32
5.3.1.1. Reference Design................................................................................................ 32
5.3.1.2. Antenna Design Requirements ........................................................................... 33
5.3.1.3. RF Routing Guidelines ........................................................................................ 33
5.3.1.4. RF Connector Recommendation ........................................................................ 35
5.3.2. PCB Antenna ................................................................................................................ 37
5.3.3. Coaxial RF Connector .................................................................................................. 38

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5.3.3.1. Receptacle Specifications ................................................................................... 38

5.3.3.2. Assemble Coaxial Cable Plug Manually ............................................................. 40
5.3.3.3. Assemble Coaxial Cable Plug with Jig ............................................................... 41
5.3.3.4. Recommended Manufacturers of RF Connector and Cable .............................. 42

6 Electrical Characteristics & Reliability ............................................................................................ 43

6.1. Absolute Maximum Ratings ...................................................................................................... 43
6.2. Power Supply Ratings ............................................................................................................... 43
6.3. Power Consumption .................................................................................................................. 44
6.4. Digital I/O Characteristics ......................................................................................................... 44
6.5. ESD Protection.......................................................................................................................... 45

7 Mechanical Information ..................................................................................................................... 46

7.1. Mechanical Dimensions ............................................................................................................ 46
7.2. Recommended Footprint .......................................................................................................... 48
7.3. Top and Bottom Views .............................................................................................................. 49

8 Storage, Manufacturing & Packaging .............................................................................................. 51

8.1. Storage Conditions.................................................................................................................... 51
8.2. Manufacturing and Soldering .................................................................................................... 52
8.3. Packaging Specifications .......................................................................................................... 54
8.3.1. Carrier Tape ................................................................................................................... 54
8.3.2. Plastic Reel .................................................................................................................... 55
8.3.3. Mounting Direction ......................................................................................................... 55
8.3.4. Packaging Process ........................................................................................................ 56

9 Appendix References ........................................................................................................................ 57

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Table Index

Table 1: Special Marks ................................................................................................................................. 9

Table 2: Basic Information ......................................................................................................................... 10
Table 3: Key Features ................................................................................................................................ 11
Table 4: Parameter Description ................................................................................................................. 14
Table 5: Pin Description ............................................................................................................................. 14
Table 6: GPIO Multiplexing ........................................................................................................................ 17
Table 7: Pin Definition of UARTs ............................................................................................................... 19
Table 8: Pin Definition of SPI ..................................................................................................................... 21
Table 9: Pin Definition of I2C Interface ...................................................................................................... 22
Table 10: Pin Definition of SDIO Interface ................................................................................................. 23
Table 11: Pin Definition of PWM Interfaces ............................................................................................... 24
Table 12: Pin Definition of I2S Interface .................................................................................................... 25
Table 13: Pin Definition of ADC Interfaces ................................................................................................ 25
Table 14: ADC Features ............................................................................................................................ 25
Table 15: Pin Definition of Power Supply and GND Pins .......................................................................... 26
Table 16: Pin Definition of CHIP_EN ......................................................................................................... 27
Table 17: Pin Definition of RESET_N ........................................................................................................ 28
Table 18: Wi-Fi Performances ................................................................................................................... 30
Table 19: Bluetooth Performances ............................................................................................................ 31
Table 20: ANT_WIFI/BT Pin Definition ...................................................................................................... 32
Table 21: Antenna Design Requirements .................................................................................................. 33
Table 22: PCB Antenna Specifications ...................................................................................................... 37
Table 23: Major Specifications of the RF Connector ................................................................................. 39
Table 24: Absolute Maximum Ratings (Unit: V) ......................................................................................... 43
Table 25: Module Power Supply Ratings (Unit: V) .................................................................................... 43
Table 26: Power Consumption in Non-signaling Mode (Unit: mA) ............................................................ 44
Table 27: VBAT I/O Characteristics (Unit: V) ............................................................................................. 44
Table 28: ESD Characteristics (Unit: kV) ................................................................................................... 45
Table 29: Recommended Thermal Profile Parameters ............................................................................. 53
Table 30: Carrier Tape Dimension Table (Unit: mm) ................................................................................. 54
Table 31: Plastic Reel Dimension Table (Unit: mm) .................................................................................. 55
Table 32: Related Documents.................................................................................................................... 57
Table 33: Terms and Abbreviations ........................................................................................................... 57

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Figure Index

Figure 1: Functional Diagram ..................................................................................................................... 12

Figure 2: Pin Assignment (Top View) ........................................................................................................ 13
Figure 3: Level-shifting Circuit for UART0 ................................................................................................. 20
Figure 4: UART1/UART2 Reference Design ............................................................................................. 20
Figure 5: SPI Connection (Master Mode) .................................................................................................. 21
Figure 6: SPI Connection (Slave Mode) .................................................................................................... 21
Figure 7: Reference Design for I2C Interface ............................................................................................ 22
Figure 8: Reference Design for SDIO Interface ......................................................................................... 23
Figure 9: VBAT Reference Circuit .............................................................................................................. 27
Figure 10: Turn-on Timing.......................................................................................................................... 27
Figure 11: Reference Circuit of RESET_N by Using A Driving Circuit ...................................................... 28
Figure 12: Reference Circuit of RESET_N with A Button .......................................................................... 28
Figure 13: Reset Timing ............................................................................................................................. 29
Figure 14: Reference Design for Download Mode..................................................................................... 29
Figure 15: RF Antenna Reference Design ................................................................................................. 32
Figure 16: Microstrip Design on a 2-layer PCB ......................................................................................... 33
Figure 17: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 34
Figure 18: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 34
Figure 19: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 34
Figure 20: Dimensions of the Receptacle (Unit: mm) ................................................................................ 35
Figure 21: Specifications of Mated Plugs................................................................................................... 36
Figure 22: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 36
Figure 23: Keepout Area on Motherboard ................................................................................................. 37
Figure 24: Prohibited Area for Routing ...................................................................................................... 38
Figure 25: Dimensions of the Receptacle (Unit: mm) ................................................................................ 39
Figure 26: Specifications of Mated Plugs (Unit: mm)................................................................................. 40
Figure 27: Plug in a Coaxial Cable Plug .................................................................................................... 40
Figure 28: Pull out a Coaxial Cable Plug ................................................................................................... 41
Figure 29: Install the Coaxial Cable Plug with Jig...................................................................................... 41
Figure 30: Top and Side Dimensions ......................................................................................................... 46
Figure 31: Bottom Dimensions (Bottom View) ........................................................................................... 47
Figure 32: Recommended Footprint .......................................................................................................... 48
Figure 33: Top and Bottom Views (Pin Antenna Interface) ....................................................................... 49
Figure 34: Top and Bottom Views (PCB Antenna) .................................................................................... 49
Figure 35: Top and Bottom Views (RF Coaxial Connector) ...................................................................... 50
Figure 36: Recommended Reflow Soldering Thermal Profile ................................................................... 52
Figure 37: Tape Specifications................................................................................................................... 54
Figure 38: Plastic Reel Dimension Drawing............................................................................................... 55
Figure 39: Mounting Direction .................................................................................................................... 55
Figure 40: Packaging Process ................................................................................................................... 56

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 Wi-Fi&Bluetooth Module Series

1 Introduction
QuecOpen® is a solution where the module acts as the main processor. Constant transition and evolution
of both the communication technology and the market highlight its merits. It can help you to:

⚫ Realize embedded applications’ quick development and shorten product R&D cycle
⚫ Simplify circuit and hardware structure design to reduce engineering costs
⚫ Miniaturize products
⚫ Reduce product power consumption
⚫ Apply OTA technology
⚫ Enhance product competitiveness and price-performance ratio
⚫ Apply anti-copy encryption technology to enhance product safety

This document defines FCM360W in QuecOpen® solution and describes its air interfaces and hardware
interfaces, which are connected with your applications.

With this document, you can quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of the module. The document, coupled with
application notes and user guides, makes it easy to design and set up mobile applications with the
module.

1.1. Special Marks

Table 1: Special Marks

Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin
name, AT command, argument, and so on, it indicates that the function, feature, interface, pin,
*
AT command, argument, and so on, is under development and currently not supported; and
the asterisk (*) after a model indicates that the sample of the model is currently unavailable.

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2 Product Overview
FCM360W is a high-performance MCU Wi-Fi and Bluetooth module supporting IEEE 802.11b/g/n/ax and
BLE 5.1 standards. The module provides multiple interfaces including UART, SPI, I2C*, I2S, SDIO*, ADC
and PWM for various applications.

FCM360W is an SMD module with compact packaging. It includes:

⚫ 240 MHz RISC processor

⚫ 48 KB ROM, 512 KB SRAM and a built-in 4 MB/ 8 MB flash
⚫ Support secondary development

Table 2: Basic Information

FCM360W

Packaging type LCC

Pin counts 39

Dimensions (25.5 ±0.2) mm × (18.0 ±0.2) mm × (3.2 ±0.2) mm

Weight Approx. 1.65 g

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2.1. Key Features

Table 3: Key Features

Basic Information

⚫ Wi-Fi Protocols: IEEE 802.11b/g/n/ax

Protocols and Standards ⚫ Bluetooth protocol: BLE 5.1
⚫ All hardware components are fully compliant with EU RoHS directive
VBAT Power Supply:
Power Supply ⚫ 3.0–3.6 V
⚫ Typ.: 3.3 V
⚫ Design Solution 1:
- Operating temperature: -40 to +85 °C
1
- Storage temperature: -45 to +95 °C
Temperature Ranges
⚫ Design Solution 2:
- Operating temperature: -40 to +105 °C
- Storage temperature: -45 to +115 °C
2
EVB Kit FCM360W TE-B

Antenna/Antenna Interface

⚫ Pin antenna interface (ANT_WIFI/BT)

Antenna/Antenna ⚫ PCB antenna
Interfaces 3 ⚫ RF coaxial connector
⚫ 50 Ω characteristic impedance
4
Application Interfaces

Application Interfaces UART, SPI, I2C*, I2S, SDIO*, PWM, ADC

1 The module is provided with two temperature design solutions. For more details, please contact Quectel Technical
Support. Within the operating temperature range, the module’s related performance meets IEEE and Bluetooth
specifications.
2 For more details about the EVB, see document [1].
3 The module is provided with one of the three antenna/antenna interface designs. For more details, please contact

Quectel Technical Support.

4 For more details about the interfaces, see Chapter 3.3 and Chapter 3.4.

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2.2. Functional Diagram

The following figure shows a block diagram of the module and illustrates the major functional parts.

VBAT

Flash
CHIP_EN

ANT_WIFI/BT

RESET_N Main Chip

RF Matching RF Coaxial
Connector

UART

PCB Antenna
GPIOs 26 MHz
XO

Figure 1: Functional Diagram

NOTE

The module is provided with one of the three antenna/antenna interface designs. For more details,
please contact Quectel Technical Support.

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3 Application Interfaces

3.1. Pin Assignment

GND 1 FCM360W
A NT _WIFI /B T 2

GND 3 30 GND

V BA T 4 29 GP IO2

CHIP _EN 5 28 RES E RV ED

GP IO20 6 27 UART 0_T XD

GP IO15 7 26 UART 0_RX D

GP IO14 8 35 34 33 25 RES E RV ED
GND GND GND
GP IO4 9 24 RES E RV ED
36 39 32
GP IO16 10 GND GND GND 23 GP IO3

RES E T_N 11 37 38 31 22 GP IO0

GND GND GND
GP IO21 12 21 GP IO1

GP IO22 13 20 UART 2_T XD

GP IO23 14 19 UART 2_RX D

GP IO24 15 18 RES E RV ED

GP IO25 16 17 V DD_E FUSE

RF Power GND GPIO UART Control RESERVED

Figure 2: Pin Assignment (Top View)

NOTE

1. Keep all RESERVED and unused pins open.

2. All GND pins should be connected to ground.
3. The module provides 2 UARTs and 14 GPIO interfaces by default. In the case of multiplexing, it
supports interfaces including SPI, I2C*, SDIO*, PWM, I2S and ADC. For more details, see Chapter
3.3 and Chapter 3.4.

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3.2. Pin Description

Table 4: Parameter Description

Parameter Description

AIO Analog Input/Output

DI Digital Input

DO Digital Output

DIO Digital Input/Output

PI Power Input

DC characteristics include power domain and rated current.

Table 5: Pin Description

Power Supply

DC
Pin Name Pin No. I/O Description Comment
Characteristics
Vmax = 3.6 V It must be provided with
Power supply for the
VBAT 4 PI Vmin = 3.0 V sufficient current more
module
Vnom = 3.3 V than 0.6 A.
Vmax = 3.3 V
Power supply for
VDD_EFUSE 17 PI Vmin = 0 V If unused, keep it open.
eFuse programming
Vnom = 1.8 V

GND 1, 3, 30, 31–39

Control Signals

DC
Pin Name Pin No. I/O Description Comment
Characteristics
Internally pulled up to
RESET_N 11 DI Reset the module VBAT.
Active low.
VBAT
Internally pulled up to
CHIP_EN 5 DI Enable the module VBAT.
Active high.

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UARTs

DC
Pin Name Pin No. I/O Description Comment
Characteristics

UART0_TXD 27 DO UART0 transmit

UART0_RXD 26 DI UART0 receive

VBAT
UART2_TXD 20 DO UART2 transmit
Test points must be
reserved.
UART2_RXD 19 DI UART2 receive

GPIO Interfaces

DC
Pin Name Pin No. I/O Description Comment
Characteristics
General-purpose
GPIO20 6 DIO
input/output
General-purpose
GPIO15 7 DIO
input/output
General-purpose
GPIO14 8 DIO
input/output
General-purpose
GPIO4 9 DIO
input/output
General-purpose
GPIO16 10 DIO
input/output
General-purpose
GPIO21 12 DIO
input/output
General-purpose
GPIO22 13 DIO
input/output
VBAT
General-purpose
GPIO23 14 DIO
input/output
General-purpose
GPIO24 15 DIO
input/output
General-purpose
GPIO25 16 DIO
input/output
General-purpose
GPIO1 21 DIO
input/output
Interrupt wakeup.
General-purpose
GPIO0 22 DIO
input/output
General-purpose
GPIO3 23 DIO
input/output
General-purpose
GPIO2 29 DIO Interrupt wakeup.
input/output

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RF Antenna Interface

DC
Pin Name Pin No. I/O Description Comment
Characteristics
Wi-Fi/Bluetooth 50 Ω characteristic
ANT_WIFI/BT 2 AIO
antenna interface impedance.

RESERVED Pins

Pin Name Pin No. Comment

RESERVED 18, 24, 25, 28 Keep them open.

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3.3. GPIO Multiplexing

The module provides 14 GPIO interfaces by default, and can support up to 18 GPIO interfaces in the case of multiplexing. Pins are defined as follows:

Table 6: GPIO Multiplexing

Alternate
Pin Alternate Alternate Alternate Alternate Alternate
Pin Name Function 0 Comment
No. Function 1 Function 2 Function 3 Function 4 Function 5
(GPIO No.)

GPIO4 9 GPIO4 TRST UART0_RTS PWM0 SPI_CS2 - TRST: JTAG test reset

GPIO16 10 GPIO16 PWM2 UART1_CTS IR_OUT - - IR_OUT: IrDA output

GPIO21 12 GPIO21 SDIO_CMD UART0_RXD I2S_TXD I2C_SDA -

GPIO22 13 GPIO22 PWM0 SDIO_DATA0 UART0_TXD I2S_TX_WS -

GPIO23 14 GPIO23 PWM1 SDIO_DATA1 UART1_RTS I2S_TX_SCK -

GPIO24 15 GPIO24 PWM2 SDIO_DATA2 UART1_CTS I2S_MCLK -

GPIO25 16 GPIO25 PWM3 SDIO_DATA3 I2C_SDA - -

GPIO20 6 GPIO20 ADC2 PWM3 I2S_MCLK SD_DET -

GPIO15 7 GPIO15 ADC1 BOOTMODE1 PWM5 I2S_TX_WS -

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GPIO14 8 GPIO14 ADC0 BOOTMODE0 PWM4 I2S_TXD -

UART2_RXD 19 GPIO17 WAKEUP SPI_WP PWM5 I2S_TX_WS -

UART2_TXD 20 GPIO13 SDIO_CLK I2C_SCL I2S_RXD - -

TMS: JTAG test mode

GPIO1 21 GPIO1 SPI_CS0 TMS UART1_RXD PWM1 I2S_RXD
selection

GPIO0 22 GPIO0 SPI_CLK TCK UART2_TXD PWM0 I2S_TX_SCK TCK: JTAG test clock

GPIO3 23 GPIO3 SPI_MISO TDI UART0_CTS PWM3 I2C_SDA TDI: JTAG test data input

GPIO2 29 GPIO2 SPI_MOSI TDO UART1_TXD PWM2 I2C_SCL TDO: JTAG test data output

UART0_RXD 26 GPIO5 40M_CLK_OUT IR_OUT I2S_RX_WS XTAL_I_32K - IR_OUT: IrDA output

UART0_TXD 27 GPIO6 COLD_RESET 32K_CLK_OUT I2S_RX_SCK XTAL_O_32K -

NOTE

1. The GPIO0, GPIO1, GPIO2 and UART2_RXD can be used as interrupt wake-up to wake up the module and then make the module into operating state by
pulling them down.
2. The maximum number of application interfaces multiplexed through GPIOs isn't available simultaneously. For the maximum number of different application
interfaces that the module can support, see Chapter 3.4 for details.

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3.4. Application Interfaces

3.4.1. UARTs

The module supports 2 UARTs by default: UART0 and UART2. In the case of multiplexing, it supports 3
UARTs: UART0, UART1 and UART2.

Table 7: Pin Definition of UARTs

Multiplexing
Pin Name Pin No. I/O Description Comment
Function

UART0_TXD 27 - DO UART0 transmit

UART0_RXD 26 - DI UART0 receive

Clear to send signal to the

GPIO3 23 UART0_CTS DO
module
Request to send signal from
GPIO4 9 UART0_RTS DI
the module

GPIO2 29 UART1_TXD DO UART1 transmit Other configurations

for UART, see
GPIO1 21 UART1_RXD DI UART1 receive Table 6.
Clear to send signal to the
GPIO16 10 UART1_CTS DO
module
Request to send signal from
GPIO23 14 UART1_RTS DI
the module

UART2_TXD 20 - DO UART2 transmit

UART2_RXD 19 - DI UART2 receive

The UART0 can be used for data transmission with the baud rate of 115200 bps by default, and the
actual measurement can reach 2 Mbps. The UART0 can also be used for firmware upgrade with the
baud rate of 921600 bps by default, and the baud rate can be configurable. Among them, the default
UART0 (pins 26 and 27) can be used for data transmission, downloading, debugging, and log printing;
the UART0 multiplexed through pins 12 and 13 can only be used for data transmission and debugging.

The module provides 3.3 V UARTs. You can use a voltage-level translator between the module and
external MCU’s UART if the MCU is equipped with a 1.8 V UART.

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 Wi-Fi&Bluetooth Module Series

4.7K
VDD_1V8
VBAT
1 nF
10K

UART_TXD UART0_RXD

UART_RXD UART0_TXD
10K 1 nF

VDD_1V8 VDD_1V8
4.7K

GND GND

MCU Module

Figure 3: Level-shifting Circuit for UART0

NOTE

The transistor level-shifting circuit above is not suitable for applications with baud rates exceeding
460800 bps.

The UART1 and UART2 can all be used for data transmission, AT command communication and
debugging with default baud rate of 115200 bps, but they are not recommended to be used for
downloading. The UART2 is used for AT command communication by default in the standard firmware.

UART1_TXD/
UART2_TXD

UART1_RXD/
Test Points
UART2_RXD

ESD

Module

Figure 4: UART1/UART2 Reference Design

NOTE

Test points must be reserved for UART1_TXD, UART2_TXD, UART1_RXD and UART2_RXD.

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 Wi-Fi&Bluetooth Module Series

3.4.2. SPI

In the case of multiplexing, the module provides one SPI that supports both master and slave modes.
The maximum clock frequency of the interface can reach 20 MHz in slave mode, and 40 MHz in master
mode.

SPI_CS0 SPI_CS0

SPI_CLK SPI_CLK

SPI_MOSI SPI_MOSI

SPI_MISO SPI_MISO

Module SPI (Slave)

Figure 5: SPI Connection (Master Mode)

SPI_CS0 SPI_CS0

SPI_CLK SPI_CLK

SPI_MOSI SPI_MOSI

SPI_MISO SPI_MISO

Module SPI (Master)

Figure 6: SPI Connection (Slave Mode)

Table 8: Pin Definition of SPI

Multiplexing
Pin Name Pin No. I/O Description Comment
Function
In master mode, it is an output
GPIO1 21 SPI_CS0 DIO SPI chip select signal;
In slave mode, it is an input signal.
In master mode, it is an output
GPIO0 22 SPI_CLK DIO SPI clock signal;
In slave mode, it is an input signal.

GPIO3 23 SPI_MISO DIO SPI master-in In master mode, it is an input

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 Wi-Fi&Bluetooth Module Series

slave-out signal;
In slave mode, it is an output
signal.
In master mode, it is an output
SPI master-out
GPIO2 29 SPI_MOSI DIO signal;
slave-in
In slave mode, it is an input signal.

3.4.3. I2C Interface*

In the case of multiplexing, the module provides one I2C interface that supports both master and slave
modes. It supports:

⚫ AMBA 2.0 APB bus protocol

⚫ Standard-mode (100 kbps) and fast-mode (400 kbps)
⚫ Programmable master and slave modes
⚫ 7-bit and 10-bit addressing modes
⚫ Automatic clock stretching
⚫ Programmable clock and data timing
⚫ DMA data transmission
⚫ Universal call address

Table 9: Pin Definition of I2C Interface

Multiplexing
Pin Name Pin No. I/O Description Comment
Function

GPIO2 29 I2C_SCL OD I2C serial clock

Other configurations for I2C,
see Table 6.
GPIO3 23 I2C_SDA OD I2C serial data

I2C_SCL I2C_SCL

I2C_SDA I2C_SDA

Module Host
4.7K

4.7K

VBAT

Figure 7: Reference Design for I2C Interface

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 Wi-Fi&Bluetooth Module Series

3.4.4. SDIO Interface*

In the case of multiplexing, the module provides one SDIO interface that supports master mode only.

Table 10: Pin Definition of SDIO Interface

Pin Name Pin No. Multiplexing Function I/O Description

GPIO21 12 SDIO_CMD DIO SDIO command

UART2_TXD 20 SDIO_CLK DI SDIO clock

GPIO25 16 SDIO_DATA3 DIO SDIO data bit 3

GPIO24 15 SDIO_DATA2 DIO SDIO data bit 2

GPIO22 13 SDIO_DATA0 DIO SDIO data bit 0

GPIO23 14 SDIO_DATA1 DIO SDIO data bit 1

GPIO20 6 SD_DET DI SD card hot-plug detect

The SDIO interface connection between the module and the SD card connector is illustrated in the
following figure.

VBAT

VDD_3V3
470K
NM
NM

NM
NM

NM

NM
NM

VDD
100μF 100nF 33pF 10pF

0R
SDIO_CLK SDIO_CLK
0R
SDIO_CMD SDIO_CMD
0R
SDIO_DATA0 SDIO_DATA0
0R
SDIO_DATA1 SDIO_DATA1
0R
SDIO_DATA2 SDIO_DATA2
0R
SDIO_DATA3 SDIO_DATA3

SD_DET DETECTIVE
NM NM NM NM NM VSS

TVS Array
SD Card
Module
Connector

Figure 8: Reference Design for SDIO Interface

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 Wi-Fi&Bluetooth Module Series

To ensure compliance of interface design with the SDIO 3.0 specification, please comply with the
following principles for SDIO interface design.

⚫ To enhance signal quality, add 0 Ω resistors in series and reserve capacitors (not mounted by
default) between the module and the SD card connector. All resistors and capacitors should be
placed close to the connector.
⚫ Place the TVS array close to the SD card connector with a parasitic capacitance no greater than 2
pF.
⚫ Route the SDIO traces in inner layer of the PCB, and surround the traces with ground on that layer
and with ground planes above and below. The impedance of SDIO signal trace is 50 Ω ±10 %.
⚫ Keep SDIO signals far away from other sensitive circuits/signals, such as RF circuits and analog
signals, as well as noisy signals such as clock signals and DC-DC signals.
⚫ The distance between SDIO signals and other signals must be greater than twice the trace width,
and the bus load capacitance must be less than 15 pF.
⚫ SDIO signal traces need to be equal length (the distance between the traces should be less than
0.5 mm).

3.4.5. PWM Interfaces

In the case of multiplexing, the module supports 6 PWM channels. Pin description of PWM interfaces are
as follows.

Table 11: Pin Definition of PWM Interfaces

Pin Name Pin No. Multiplexing Function I/O Description Comment

GPIO16 10 PWM2 DO PWM2 out

GPIO23 14 PWM1 DO PWM1 out

GPIO25 16 PWM3 DO PWM3 out

Other configurations for
PWM, see Table 6.
GPIO15 7 PWM5 DO PWM5 out

GPIO14 8 PWM4 DO PWM4 out

GPIO4 9 PWM0 DO PWM0 out

3.4.6. I2S Interface

In the case of multiplexing, the module supports one I2S interface for transmission of digital audio data
between internal components of the system, such as Codec, DSP, digital input/output interface, ADC,
DAC and digital filter.

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 Wi-Fi&Bluetooth Module Series

Table 12: Pin Definition of I2S Interface

Multiplexing
Pin Name Pin No. I/O Description Comment
Function
GPIO1 21 I2S_RXD DI I2S receive data

GPIO14 8 I2S_TXD DO I2S transmit data

GPIO20 6 I2S_MCLK OD I2S master clock Other configurations for

I2S transmit serial I2S, see Table 6.
GPIO0 22 I2S_TX_SCK DIO
clock
I2S transmit word
GPIO15 7 I2S_TX_WS DIO
select

3.4.7. ADC Interfaces

In the case of multiplexing, the module supports 3 ADC interfaces, whose voltage range is 0–3.3 V. To
improve ADC accuracy, surround ADC trace with ground.

Table 13: Pin Definition of ADC Interfaces

Pin Name Pin No. Multiplexing Function I/O Description

GPIO20 6 ADC2 AI General-purpose ADC interface

GPIO15 7 ADC1 AI General-purpose ADC interface

GPIO14 8 ADC0 AI General-purpose ADC interface

Table 14: ADC Features

Parameter Min. Typ. Max. Unit

ADC Voltage Range 0 - 3.3 V

ADC Resolution - 12 - bit

ADC Sample Rate - 1.25 - MHz

NOTE

1. It is prohibited to directly supply any voltage to ADC interfaces when the module is not powered by
the VBAT.
2. It is recommended to use resistor divider circuit for ADC interface application with 1 % accuracy
resistor divider.

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4 Operating Characteristics

4.1. Power Supply

Power supply pin and ground pins of the module are defined in the following table.

Table 15: Pin Definition of Power Supply and GND Pins

Pin Name Pin No. I/O Description Min. Typ. Max. Unit

Power supply for the

VBAT 4 PI 3.0 3.3 3.6 V
module

GND 1, 3, 30, 31–39

4.1.1. Reference Design for Power Supply

The module is powered by VBAT, and it is recommended that the power supply chip for VBAT provide
sufficient current of 0.6 A at least. For better power supply performance, it is recommended to parallel a
22 μF decoupling capacitor, and two filter capacitors (1 μF and 100 nF) near the module’s VBAT pin.
Reserve C4 for debugging which is not mounted by default. In addition, it is recommended to add a TVS
near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the
VBAT trace is, the wider it should be.

VBAT reference circuit is shown below:

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 Wi-Fi&Bluetooth Module Series

VBAT

R1 0R
VBAT

D1
C1 C2 C3 C4
22 μF 1 μF 100 nF NM

Module

Figure 9: VBAT Reference Circuit

4.2. Turn On

After the module VBAT is powered on, keep the CHIP_EN pin at high level to realize the automatic startup
of the module.

Table 16: Pin Definition of CHIP_EN

Pin Name Pin No. I/O Description Comment

Internally pulled up to VBAT.

CHIP_EN 5 DI Enable the module
Active high.

The turn-on timing is shown below:

˂ 10 ms

> 1 μs

VBAT

CHIP_EN

Module Status Booting Active

Figure 10: Turn-on Timing

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 Wi-Fi&Bluetooth Module Series

4.3. Reset

Drive RESET_N low for at least 100 ms and then release it to reset the module.

Table 17: Pin Definition of RESET_N

Pin Name Pin No. I/O Description Comment

Internally pulled up to VBAT.

RESET_N 11 DI Reset the module
Active low.

The reference design for resetting the module is shown below. An open collector driving circuit can be
used to control the RESET_N pin.

RESET_N

Control 33 Ω
Q1
R1

47 kΩ

R2

Figure 11: Reference Circuit of RESET_N by Using A Driving Circuit

Another way to control the RESET_N is by using a button directly. A TVS component should be placed
near the button for ESD protection.

S1
RESET_N

TVS

Closed to S1

Figure 12: Reference Circuit of RESET_N with A Button

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 Wi-Fi&Bluetooth Module Series

The module reset timing is illustrated in the following figure.

VBAT
T 100 ms

RESET_N VIH 2.4 V

VIL 0.5 V

Figure 13: Reset Timing

4.4. Download Mode

Keep RESET_N of the module at low level during resetting or power-up and the module will enter
download mode. In the download mode, the firmware can be download through the UART0. During the
hardware design, connect the RESET_N of the module to the RTS of the serial port chip, or control
RESET_N through the host GPIO according to the waveform in the figure, otherwise the download will
fail.

RESET_N
RTS

Serial Port Chip

Figure 14: Reference Design for Download Mode

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 Wi-Fi&Bluetooth Module Series

5 RF Performances

5.1. Wi-Fi Performances

Table 18: Wi-Fi Performances

Operating Frequency

2.4 GHz: 2.400–2.4835 GHz

Modulation

BPSK, QPSK, CCK, 16QAM, 64QAM

Operating Mode
⚫ AP
⚫ STA
Encryption Mode

WPA-PSK, WPA2-PSK, WPA3-SAE, AES-128

Transmission Data Rate

⚫ 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps
⚫ 802.11g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps
⚫ 802.11n: HT20 (MCS 0–MCS 7), HT40 (MCS 0–MCS 7)
⚫ 802.11ax: HT20 (MCS 0–MCS 7)

Typ.; Unit: dBm, Tolerance: ±2 dB

Condition (VBAT = 3.3 V; Temp. 25°C) EVM
Transmitting Power Receiving Sensitivity

802.11b @ 1 Mbps 17 -92

≤ 35 %
802.11b @ 11 Mbps 17 -86
2.4 GHz
802.11g @ 6 Mbps ≤ -5 dB 14 -89

802.11g @ 54 Mbps ≤ -25 dB 14 -73

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 Wi-Fi&Bluetooth Module Series

802.11n, HT20 @ MCS 0 ≤ -5 dB 14 -89

802.11n, HT20 @ MCS 7 ≤ -27 dB 14 -70

802.11n, HT40 @ MCS 0 ≤ -5 dB 13 -87

802.11n, HT40 @ MCS 7 ≤ -27 dB 13 -67

802.11ax, HT20 @ MCS 0 ≤ -5 dB 14 -89

802.11ax, HT20 @ MCS 7 ≤ -27 dB 14 -69

5.2. Bluetooth Performances

Table 19: Bluetooth Performances

Operating Frequency

2.400–2.4835 GHz

Modulation

GFSK

Operating Mode

BLE

5
Typ.; Unit: dBm, Tolerance: ±2 dB
Condition (VBAT = 3.3 V; Temp. 25°C)
Transmitting Power Receiving Sensitivity

BLE (1 Mbps) 6 -90

BLE (2 Mbps) 6 -89

5 The tolerance for Bluetooth receiving sensitivity is ±4 dB in high channel (CH39).

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 Wi-Fi&Bluetooth Module Series

5.3. Antenna/Antenna Interfaces

Appropriate antenna type and design should be used with matched antenna parameters according to
specific application. It is required to perform a comprehensive functional test for the RF design before
mass production of terminal products. The entire content of this chapter is provided for illustration only.
Analysis, evaluation and determination are still necessary when designing target products.

The module is provided in one of the three antenna/antenna interface designs: pin antenna interface
(ANT_WIFI/BT), PCB antenna and RF coaxial connector. The RF coaxial connector is not available
when the module is designed with ANT_WIFI/BT antenna interface or PCB antenna.

5.3.1. Pin Antenna Interface (ANT_WIFI/BT) 6

Table 20: ANT_WIFI/BT Pin Definition

Pin Name Pin No. I/O Description Comment

50 Ω characteristic
ANT_WIFI/BT 2 AIO Wi-Fi/Bluetooth antenna interface
impedance.

5.3.1.1. Reference Design

The circuit of RF antenna interface is shown below. For better RF performance, it is necessary to reserve
a π matching circuit and add ESD protection components. Reserved matching components such as R1,
C1, C2, and D1 should be placed as close to the antenna as possible. C1, C2, and D1 are not mounted by
default. The parasitic capacitance of TVS should be less than 0.05 pF and R1 is recommended to be 0 Ω.

R1
ANT_WIFI/BT
0R

C1 C2 D1
NM NM NM
Module

Figure 15: RF Antenna Reference Design

6The module is provided with one of the three antenna/antenna interface designs. For more details, please contact
Quectel Technical Support.

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 Wi-Fi&Bluetooth Module Series

5.3.1.2. Antenna Design Requirements

Table 21: Antenna Design Requirements

Parameter Requirement

Frequency Range (GHz) 2.400–2.4835

Cable Insertion Loss (dB) <1

VSWR ≤2

Gain (dBi) 1 (Typ.)

Max. input power (W) 50

Input impedance (Ω) 50

Polarization type Vertical

5.3.1.3. RF Routing Guidelines

For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The
impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric
constant, the height from the reference ground to the signal layer (H), and the spacing between RF
traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control
characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with
different PCB structures.

Figure 16: Microstrip Design on a 2-layer PCB

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 Wi-Fi&Bluetooth Module Series

Figure 17: Coplanar Waveguide Design on a 2-layer PCB

Figure 18: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)

Figure 19: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)

To ensure RF performance and reliability, follow the principles below in RF layout design:

⚫ Use an impedance simulation tool to control the characteristic impedance of RF traces to 50 Ω.

⚫ GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully
connected to the ground.
⚫ The distance between the RF pins and the RF connector should be as short as possible and all
right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
⚫ There should be clearance under the signal pin of the antenna connector or solder joint.

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 Wi-Fi&Bluetooth Module Series

⚫ The reference ground of RF traces should be complete. In addition, adding some ground vias
around RF traces and the reference ground could help to improve RF performance. The distance
between the ground vias and RF traces should be at least twice the width of RF signal traces (2 ×
W).
⚫ Keep RF traces away from interference sources, and avoid intersection and paralleling between
traces on adjacent layers.

For more details about RF layout, see document [2].

5.3.1.4. RF Connector Recommendation

If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector
provided by Hirose.

Figure 20: Dimensions of the Receptacle (Unit: mm)

U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT
connector.

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 Wi-Fi&Bluetooth Module Series

Figure 21: Specifications of Mated Plugs

The following figure describes the space factor of mated connectors.

Figure 22: Space Factor of Mated Connectors (Unit: mm)

For more details, please visit http://www.hirose.com.

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 Wi-Fi&Bluetooth Module Series

5.3.2. PCB Antenna 7

Table 22: PCB Antenna Specifications

Parameter Requirement

Frequency Range (GHz) 2.400–2.500

Input Impedance (Ω) 50

VSWR ≤3

Gain (dBi) -0.38 (Typ.)

Efficiency 26 %

When using the PCB antenna on the module, the module should be placed at the side of the motherboard.
The distance between the PCB antenna and connectors, vias, traces, ethernet port and any other metal
components on the motherboard should be at least 16 mm. All layers in the PCB of the motherboard
under the PCB antenna should be designed as a keepout area.

Figure 23: Keepout Area on Motherboard

Do not routing at the RF test point at the bottom of the module to ensure its performances during PCB
design.

7The module is provided with one of the three antenna/antenna interface designs. For more details, please contact
Quectel Technical Support.

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 Wi-Fi&Bluetooth Module Series

Figure 24: Prohibited Area for Routing

5.3.3. Coaxial RF Connector 8

5.3.3.1. Receptacle Specifications

The mechanical dimensions of the receptacle supported by the module are as follows.

8The module is provided with one of the three antenna/antenna interface designs. For more details, please contact
Quectel Technical Support.

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 Wi-Fi&Bluetooth Module Series

Figure 25: Dimensions of the Receptacle (Unit: mm)

Table 23: Major Specifications of the RF Connector

Item Specification

Nominal Frequency Range DC to 6 GHz

Nominal Impedance 50 Ω

Temperature Rating -40 °C to +85 °C

Meet the requirements of:

Voltage Standing Wave Ratio (VSWR) Max. 1.3 (DC–3 GHz)
Max. 1.45 (3–6 GHz)

The mated plug listed in the following figure can be used to match the connector.

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 Wi-Fi&Bluetooth Module Series

Figure 26: Specifications of Mated Plugs (Unit: mm)

5.3.3.2. Assemble Coaxial Cable Plug Manually

The pictures for plugging in a coaxial cable plug is shown below, θ = 90° is acceptable, while θ ≠ 90° is
not.

Figure 27: Plug in a Coaxial Cable Plug

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 Wi-Fi&Bluetooth Module Series

The pictures of pulling out the coaxial cable plug is shown below, θ = 90° is acceptable, while θ ≠ 90° is
not.

Figure 28: Pull out a Coaxial Cable Plug

5.3.3.3. Assemble Coaxial Cable Plug with Jig

The pictures of installing the coaxial cable plug with a jig is shown below, θ = 90° is acceptable, while θ ≠
90°is not.

Figure 29: Install the Coaxial Cable Plug with Jig

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 Wi-Fi&Bluetooth Module Series

5.3.3.4. Recommended Manufacturers of RF Connector and Cable

RF connectors and cables by I-PEX are recommended. For more details, visit https://www.i-pex.com.

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 Wi-Fi&Bluetooth Module Series

6 Electrical Characteristics & Reliability

6.1. Absolute Maximum Ratings

Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are
listed in the following table.

Table 24: Absolute Maximum Ratings (Unit: V)

Parameter Min. Max.

VBAT -0.3 3.6

Voltage at Digital Pins -0.3 3.6

Voltage at ADC[0:2] 0 3.3

6.2. Power Supply Ratings

Table 25: Module Power Supply Ratings (Unit: V)

Parameter Description Condition Min. Typ. Max.

The actual input voltages must be kept

Power supply
VBAT between the minimum and maximum 3.0 3.3 3.6
for the module
values.

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 Wi-Fi&Bluetooth Module Series

6.3. Power Consumption

Table 26: Power Consumption in Non-signaling Mode (Unit: mA)

Condition IVBAT (Typ.)

Tx 1Mbps @ 17 dBm 285

802.11b
Tx 11 Mbps @ 17 dBm 277

Tx 6 Mbps @ 14 dBm 182

802.11g
Tx 54 Mbps @ 14 dBm 167

Tx HT20 MCS 0 @ 14 dBm 184

2.4 GHz 802.11n
Tx HT20 MCS 7 @ 14 dBm 179

Tx HT40 MCS 0 @ 13 dBm 183

802.11n
Tx HT40 MCS 7 @ 13 dBm 172

Tx HT20 MCS 0 @ 14 dBm 184

802.11ax
Tx HT20 MCS 7 @ 14 dBm 180

6.4. Digital I/O Characteristics

Table 27: VBAT I/O Characteristics (Unit: V)

Parameter Description Min. Max.

VIH High-level input voltage 0.7 × VBAT VBAT

VIL Low-level input voltage 0 0.3 × VBAT

VOH High-level output voltage 0.9 × VBAT -

VOL Low-level output voltage - 0.1 × VBAT

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 Wi-Fi&Bluetooth Module Series

6.5. ESD Protection

Static electricity occurs naturally and may damage the module. Therefore, applying proper ESD
countermeasures and handling methods is imperative. For example, wear anti-static gloves during the
development, production, assembly and testing of the module; add ESD protection components to the
ESD sensitive interfaces and points in the product design.

Table 28: ESD Characteristics (Unit: kV)

Model Test Result Standard

Human Body Model (HBM) ±4 ANSI/ESDA/JEDEC JS-001-2017

Charged Device Model (CDM) ±0.5 ANSI/ESDA/JEDEC JS-002-2018

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 Wi-Fi&Bluetooth Module Series

7 Mechanical Information
This chapter describes the mechanical dimensions of the module. All dimensions are measured in
millimeters (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.

7.1. Mechanical Dimensions

Figure 30: Top and Side Dimensions

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 Wi-Fi&Bluetooth Module Series

Figure 31: Bottom Dimensions (Bottom View)

NOTE

The package warpage level of the module refers to the JEITA ED-7306 standard.

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 Wi-Fi&Bluetooth Module Series

7.2. Recommended Footprint

Figure 32: Recommended Footprint

NOTE

Keep at least 3 mm between the module and other components on the motherboard to improve
soldering quality and maintenance convenience.

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 Wi-Fi&Bluetooth Module Series

7.3. Top and Bottom Views

Figure 33: Top and Bottom Views (Pin Antenna Interface)

Figure 34: Top and Bottom Views (PCB Antenna)

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 Wi-Fi&Bluetooth Module Series

Figure 35: Top and Bottom Views (RF Coaxial Connector)

NOTE

1. Images above are for illustrative purposes only and may differ from the actual module. For
authentic appearance and label, please refer to the module received from Quectel.
2. The RF coaxial connector is not mounted on the module when using pin antenna interface
(ANT_WIFI/BT) or PCB antenna.

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 Wi-Fi&Bluetooth Module Series

8 Storage, Manufacturing & Packaging

8.1. Storage Conditions

The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage
requirements are shown below.

1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity
should be 35–60 %.

2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.

3. Floor life: 168 hours 9 in a factory where the temperature is 23 ±5 °C and relative humidity is below
60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow
soldering or other high-temperature operations within 168 hours. Otherwise, the module should be
stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).

4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under
the following circumstances:

⚫ The module is not stored in Recommended Storage Condition;

⚫ Violation of the third requirement mentioned above;
⚫ Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
⚫ Before module repairing.

5. If needed, the pre-baking should follow the requirements below:

⚫ The module should be baked for 8 hours at 120 ±5 °C;

⚫ The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put
in a dry environment such as in a dry cabinet.

9 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start
the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to,
or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready
for soldering.

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 Wi-Fi&Bluetooth Module Series

NOTE

1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to
the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before
baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

8.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean
stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the
module is recommended to be 0.15–0.18 mm. For more details, see document [3].

The recommended peak reflow temperature should be 235–246 ºC, with 246 ºC as the absolute
maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is
recommended that the module should be mounted only after reflow soldering for the other side of PCB
has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.

Temp. (°C)
Reflow Zone
Ramp-up slope: Cool-down slope:
0–3 °C/s C -3–0 °C/s
246
235
217
B D
200
Soak Zone

150 A

100
Ramp-to-soak slope:
0–3 °C/s

Figure 36: Recommended Reflow Soldering Thermal Profile

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Table 29: Recommended Thermal Profile Parameters

Factor Recommended Value

Soak Zone

Ramp-to-soak slope 0–3 °C/s

Soak time (between A and B: 150 °C and 200 °C) 70–120 s

Reflow Zone

Ramp-up slope 0–3 °C/s

Reflow time (D: over 217 °C) 40–70 s

Max. temperature 235–246 °C

Cool-down slope -3–0 °C/s

Reflow Cycle

Max. reflow cycle 1

NOTE

1. The above profile parameter requirements are for the measured temperature of solder joints. Both
the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still
clearly identifiable and the QR code is still readable, although white rust may be found.
4. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the
module.
6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance
for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in document [3].

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8.3. Packaging Specifications

This chapter describes only the key parameters and process of packaging. All figures below are for
reference only. The appearance and structure of the packaging materials are subject to the actual
delivery.

The module adopts carrier tape packaging and details are as follow:

8.3.1. Carrier Tape

Carrier tape dimensions are detailed below:

Figure 37: Tape Specifications

Table 30: Carrier Tape Dimension Table (Unit: mm)

W P T A0 B0 K0 K1 F E

44 32 0.4 18.4 25.9 3.7 6.8 20.2 1.75

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8.3.2. Plastic Reel

Figure 38: Plastic Reel Dimension Drawing

Table 31: Plastic Reel Dimension Table (Unit: mm)

øD1 øD2 W

330 100 44.5

8.3.3. Mounting Direction

Figure 39: Mounting Direction

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8.3.4. Packaging Process

Place the modules into the carrier tape and

use the cover tape to cover them; then wind
the heat-sealed carrier tape on the plastic reel
and use the protective tape for protection. 1
plastic reel can load 250 modules.

Place the packaged plastic reel, 1 humidity

indicator card and 1 desiccant bag into a
vacuum bag, then vacuumize it.

Place the vacuum-packed plastic reel inside

the pizza box.

Place 4 packaged pizza boxes inside 1 carton

box and seal it. 1 carton box can pack 1000
modules.

Figure 40: Packaging Process

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9 Appendix References

Table 32: Related Documents

Document Name

[1] Quectel_FCM360W_TE-B_User_Guide

[2] Quectel_RF_Layout_Application_Note

[3] Quectel_Module_SMT_Application_Note

Table 33: Terms and Abbreviations

Abbreviation Description

ADC Analog-to-Digital Converter

AES Advanced Encryption Standard

AMBA Advanced Microcontroller Bus Architecture

AP Access Point

APB Advanced Peripheral Bus

BLE Bluetooth Low Energy

BPSK Binary Phase Shift Keying

CCK Complementary Code Keying

CDM Charged Device Model

CS Chip Select

DAC Digital-to-Analog Converter

DC Direct Current

DMA Direct Memory Access

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DSP Digital Signal Processor

ESD Electrostatic Discharge

EVM Error Vector Magnitude

GFSK Gauss frequency Shift Keying

GND Ground

GPIO General-Purpose Input/Output

HT High Throughput

I/O Input/Output

I2C Inter-Integrated Circuit

I2S Inter-IC Sound

IrDA Infrared Data Association

JTAG Joint Test Action Group

IEEE Institute of Electrical and Electronics Engineers

LNA Low Noise Amplifier

LCC Leadless Chip Carrier (package)

MCS Modulation and Coding Scheme

Mbps Million Bits Per Second

MISO Master In Slave Out

MMC MultiMedia Card

MOSI Master Out Slave In

OTA Over-the-Air

PA Power Amplifier

PCB Printed Circuit Board

PMU Power Management Unit

PSK Pre-Shared Key

PWM Pulse Width Modulation

QAM Quadrature Amplitude Modulation

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QPSK Quadrature Phase Shift Keying

RF Radio Frequency

RISC Reduced Instruction-Set Computer

RoHS Restriction of Hazardous Substances

ROM Read Only Memory

SAE Simultaneous Authentication of Equals

SMT Surface Mount Technology

SPI Serial Peripheral Interface

SRAM Static Random Access Memory

STA Station

TVS Transient Voltage Suppressor

UART Universal Asynchronous Receiver/Transmitter

(U)SIM (Universal) Subscriber Identity Module

VIH High-level Input Voltage

VIL Low-level Input Voltage

Vmax Maximum Voltage

Vmin Minimum Voltage

Vnom Nominal Voltage

VOH High-level Output Voltage

VOL Low-level Output Voltage

VSWR Voltage Standing Wave Ratio

WPA Wi-Fi Protected Access

XO Crystal Oscillator

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