CYT4BF TRAVEO™ T2G Automotive MCU Based On 32-BIT ARM (R) CORTEX (R) - M7 Dual
CYT4BF TRAVEO™ T2G Automotive MCU Based On 32-BIT ARM (R) CORTEX (R) - M7 Dual
T RAV E O ™ T 2 G 3 2 - b i t A u tom ot i ve M CU
Based on Arm® Cortex®-M7 dual
General description
CYT4BF is a family of TRAVEO™ T2G microcontrollers targeted at automotive systems such as high-end
body-control units. CYT4BF has two Arm® Cortex®-M7 CPUs for primary processing, and an Arm® Cortex®-M0+ CPU
for peripheral and security processing. These devices contain embedded peripherals supporting Controller Area
Network with Flexible Data rate (CAN FD), Local Interconnect Network (LIN), Gigabit Ethernet, and FlexRay.
TRAVEO™ T2G devices are manufactured on an advanced 40-nm process. CYT4BF incorporates a low-power flash
memory, multiple high-performance analog and digital peripherals, and enables the creation of a secure
computing platform.
Features
• CPU subsystem
- Two 350-MHz 32-bit Arm® Cortex®-M7 CPUs, each with
• Single-cycle multiply
• Single/double-precision floating point unit (FPU)
• 16-KB data cache, 16-KB instruction cache
• Memory protection unit (MPU)
• 16-KB instruction and 16-KB data tightly-coupled memories (TCM)
- 100-MHz 32-bit Arm® Cortex® M0+ CPU with
• Single-cycle multiply
• Memory protection unit (MPU)
- Inter-processor communication in hardware
- Three DMA controllers
• Peripheral DMA controller #0 (P-DMA0) with 143 channels
• Peripheral DMA controller #1 (P-DMA1) with 65 channels
• Memory DMA controller (M-DMA0) with 8 channels
• Integrated memories
- 8384 KB of code-flash with an additional 256 KB of work-flash
• Read-While-Write (RWW) allows updating the code-flash/work-flash while executing from it
• Single- and dual-bank modes (specifically for Firmware update Over The Air [FOTA])
• Flash programming through SWD/JTAG interface
- 1024-KB of SRAM with selectable retention granularity
• Cryptography engine
- Supports Enhanced Secure Hardware Extension (eSHE) and Hardware Security Module (HSM)
- Secure boot and authentication
• Using digital signature verification
• Using fast secure boot
- AES: 128-bit blocks, 128-/192-/256-bit keys
- 3DES: 64-bit blocks, 64-bit key
- Vector unit supporting asymmetric key cryptography such as Rivest-Shamir-Adleman (RSA) and Elliptic Curve
(ECC)
- SHA-1/2/3: SHA-512, SHA-256, SHA-160 with variable length input data
- CRC: supports CCITT CRC16 and IEEE-802.3 CRC32
- True random number generator (TRNG) and pseudo random number generator (PRNG)
- Galois/Counter Mode (GCM)
Datasheet Please read the Important Notice and Warnings at the end of this document 002-21617 Rev. *M
www.infineon.com page 1 2024-01-25
TRAVEO™ T2G 32-bit Automotive MCU
Based on Arm® Cortex®-M7 dual
Features
Table of contents
General description ...........................................................................................................................1
Features ...........................................................................................................................................1
Table of contents ...............................................................................................................................5
1 Features list ...................................................................................................................................6
1.1 Communication peripheral instance list ...............................................................................................................8
2 Blocks and functionality..................................................................................................................9
Architecture block diagram ................................................................................................................9
3 Functional description ..................................................................................................................10
3.1 CPU subsystem .....................................................................................................................................................10
3.1.1 CPU .....................................................................................................................................................................10
3.1.2 DMA controllers..................................................................................................................................................10
3.1.3 Flash ...................................................................................................................................................................10
3.1.4 SRAM...................................................................................................................................................................10
3.1.5 ROM ....................................................................................................................................................................10
3.1.6 Cryptography accelerator for security..............................................................................................................10
3.2 System resources..................................................................................................................................................11
3.2.1 Power system .....................................................................................................................................................11
3.2.2 Regulators ..........................................................................................................................................................11
3.2.3 Clock system ......................................................................................................................................................13
3.2.4 Reset ...................................................................................................................................................................14
3.2.5 Watchdog timer..................................................................................................................................................14
3.2.6 Power modes .....................................................................................................................................................14
3.3 Peripherals ............................................................................................................................................................15
3.3.1 Peripheral clock dividers ...................................................................................................................................15
3.3.2 Peripheral protection unit.................................................................................................................................15
3.3.3 12-bit SAR ADC ...................................................................................................................................................15
3.3.4 Timer/counter/PWM (TCPWM) block ................................................................................................................16
3.3.5 Serial communication blocks (SCB)..................................................................................................................16
3.3.6 CAN FD ................................................................................................................................................................17
3.3.7 Local interconnect network (LIN) .....................................................................................................................17
3.3.8 FlexRay interface................................................................................................................................................17
3.3.9 Ethernet MAC......................................................................................................................................................17
3.3.10 External memory interface..............................................................................................................................17
3.3.11 SDHC interface .................................................................................................................................................18
3.3.12 Audio interface.................................................................................................................................................18
3.3.13 One-time-programmable (OTP) eFuse ...........................................................................................................18
3.3.14 Event generator ...............................................................................................................................................18
3.3.15 Trigger multiplexer ..........................................................................................................................................18
3.4 I/Os.........................................................................................................................................................................18
3.4.1 Port nomenclature.............................................................................................................................................19
3.4.2 GPIO Standard (GPIO_STD) ...............................................................................................................................19
3.4.3 GPIO Enhanced (GPIO_ENH) .............................................................................................................................19
3.4.4 HSIO Standard (HSIO_STD) ...............................................................................................................................19
3.4.5 Smart I/O ............................................................................................................................................................19
4 CYT4BF address map .....................................................................................................................20
5 Flash base address map.................................................................................................................22
6 Peripheral I/O map........................................................................................................................23
7 CYT4BF clock diagram ...................................................................................................................25
8 CYT4BF CPU start-up sequence ......................................................................................................26
9 Pin assignment .............................................................................................................................27
10 High-speed I/O matrix connections ...............................................................................................31
1 Features list
Table 1-1 CYT4BF feature list for all packages
Packages
Features
176-TEQFP 272-BGA 320-BGA
CPU
Core Two 32-bit Arm® Cortex®-M7 CPUs and a 32-bit Arm® Cortex® M0+ CPU
Functional safety ASIL-B
Operating voltage 2.7 V to 5.5 V
Operating voltage for HSIO_STD Not supported 2.7 V to 3.6 V
Core voltage 1.05 V to 1.15 V
Operating frequency Arm® Cortex®-M7 350 MHz (max for each) and Arm® Cortex®-M0+ 100
MHz (max)
MPU, PPU Supported
FPU Supports both single (32-bit) and double (64-bit) precision
DSP-MUL/DIV/MAC Supported by Arm® Cortex®-M7 CPUs
TCM 16-KB instruction and 16-KB data for each Cortex®-M7 CPU
Memory
Code-flash 8384 KB (8128 KB + 256 KB)
Work-flash 256 KB (192 KB + 64 KB)
SRAM (configurable for retention) 1024 KB
ROM 64 KB
Communication interfaces
CAN0 (CAN-FD: Up to 8 Mbps) 5 ch
CAN1 (CAN-FD: Up to 8 Mbps) 5 ch
CAN RAM 40 KB per instance (5 ch), 80 KB in total
Serial communication block (SCB/UART) 10 ch 11 ch
2
Serial communication block (SCB/I C) 10 ch 11 ch
Serial communication block (SCB/SPI) 10 ch 11 ch
LIN 17 ch 20 ch
1 ch × 10/100 2 ch (option) × 10/100/1000
ETH0: MII/RMII on
GPIO_STD,
ETH0: MII/RMII on ETH1: MII/RMII/GMII/
Ethernet MAC ETH0: MII/RMII on GPIO_STD, RGMII on HSIO_STD
GPIO_STD ETH1: RGMII on ETH0: RGMII on
HSIO_STD HSIO_STD,
ETH1: RGMII on
HSIO_STD
FlexRay 1 interface of FlexRay supporting ch A and ch B (option)
Memory interfaces
eMMC/SD 1 ch (GPIO_STD at 26 MHz) 1 ch (HSIO_STD at 50 MHz, GPIO_STD at 26 MHz)
Single SPI / Dual SPI / Quad SPI / Octal SPI 1 ch (GPIO_STD at 32 MHz) 1 ch (HSIO_STD at 100 MHz, GPIO_STD at 32 MHz)
/ HYPERBUS™
Note
1. Enhanced Secure Hardware Extension (eSHE) and Hardware Security Module (HSM) support are enabled by third-party firmware.
143 Channel
Arm Cortex M7 ROM
M-DMA0
350 MHz
P-DMA0
P-DMA1
65 Channel
8 Channel
8384 KB Code-flash 512 KB 256 KB 256 KB AES,SHA,CRC,
350 MHz
FPU D$ I$
+ 256 KB Work-flash TRNG,RSA,ECC Cortex M0+ 64 KB
(SP/DP)
FPU D$16KB I$ 16KB 100 MHz
AHBP NVIC, MPU, AXI AHBS SRAM SRAM SRAM
System Resources (SP/DP) 16 KB 16 KB 8 KB $
Initiator/MMIO ROM Controller
Controller Controller Controller MUL, NVIC, MPU
AHBP NVIC, MPU, AXI AHBS FLASH Controller
Power
Sleep Control
POR BOD
OVD LVD System Interconnect (Multi Layer AXI/AHB, IPC, MPU/SMPU)
REF
PWRSYS-HT
LDO PCLK Peripheral Interconnect (MMIO,PPU)
SD/SDIO/eMMC
FLL CSV
Event Generator
118x TCPWM
I2S/TDM In/Out
I2C,SPI,UART,LIN
I2C,SPI,UART,LIN
1x FLEXRAY
SAR
CAN-FD Interface
FlexRay Interface
3x AUDIOSS
1x SMIF
10x CANFD
4xPLL
2x ETH
SDHC
EVTGEN
10x SCB
ADC
20x LIN
1x SCB
LIN/UART
eFUSE
Reset
IOSS GPIO
(12-bit)
Reset Control
XRES
Test
TestMode Entry x3
Digital DFT
Analog DFT
SARMUX
WCO 96 ch
RTC
The Architecture block diagram shows the CYT4BF architecture, giving a simplified view of the interconnection
between subsystems and blocks. CYT4BF has four major subsystems: CPU, system resources, peripherals, and
I/O[2, 3, 4]. The color-coding shows the lowest power mode where the particular block is still functional.
CYT4BF provides extensive support for programming, testing, debugging, and tracing of both hardware and
firmware.
Debug-on-chip functionality enables in-system debugging using the production device. It does not require
special interfaces, debugging pods, simulators, or emulators.
The JTAG interface is fully compatible with industry-standard third-party probes such as I-jet, J-Link, and GHS.
The debug circuits are enabled by default.
CYT4BF provides a high level of security with robust flash protection and the ability to disable features such as
debug.
Additionally, each device interface can be permanently disabled for applications concerned with phishing
attacks from a maliciously reprogrammed device or attempts to defeat security by starting and interrupting flash
programming sequences. All programming, debug, and test interfaces are disabled when maximum device
security is enabled.
Notes
2. GPIO_STD supports 2.7 V to 5.5 V VDDIO range.
3. GPIO_ENH supports 2.7 V to 5.5 V VDDIO range with higher currents at lower voltages.
4. HSIO_STD supports 2.7 V to 3.6 V VDDIO range with high-speed signalling and programmable drive strength.
3 Functional description
3.1 CPU subsystem
3.1.1 CPU
The CYT4BF CPU subsystem contains a 32-bit Arm® Cortex®-M0+ CPU with MPU, and two 32-bit Arm® Cortex®-M7
CPUs, each with MPU, single/double-precision FPU, and 16-KB data and instruction caches. This subsystem also
includes P-/M-DMA controllers, a cryptographic accelerator, 8384 KB of code-flash, 256 KB of work-flash, 1024 KB
of SRAM, and 64 KB of ROM.
The Cortex-M0+ CPU provides a secure, un-interruptible boot function. This guarantees that, following
completion of the boot function, system integrity is valid and privileges are enforced. Shared resources (flash,
SRAM, peripherals, and so on) can be accessed through bus arbitration, and exclusive accesses are supported by
an inter-processor communication (IPC) mechanism using hardware semaphores.
Each Cortex-M7 CPU has 16 KB of instruction and 16 KB of data TCM with programmable read wait states. Each
TCM is clocked by the associated Cortex-M7 CPU clock.
3.1.3 Flash
CYT4BF has 8384 KB (8128 KB with a 32-KB sector size, and 256 KB with an 8-KB sector size) of code-flash with an
additional work-flash of 256 KB (192 KB with a 2-KB sector size, and 64 KB with a 128-B sector size). Work-flash is
optimized for reprogramming many more times than code-flash. Code-flash supports Read-While-Write (RWW)
operation allowing flash to be updated while the CPU is active. Both the code-flash and work-flash areas support
dual-bank operation for over-the-air (OTA) programming.
3.1.4 SRAM
CYT4BF has 1024 KB of SRAM with three independent controllers. SRAM0 provides DeepSleep retention in 32-KB
increments while SRAM1/2 are selectable between fully retained and not retained.
3.1.5 ROM
CYT4BF has 64 KB of ROM that contains boot and configuration routines. This ROM enables secure boot and
authentication of user flash to guarantee a secure system.
3.2.2 Regulators
CYT4BF contains three regulators that provide power to the low-voltage core transistors: DeepSleep, core
internal, and core external. These regulators accept a 2.7-V to 5.5-V VDDD supply and provide a low-noise 1.1-V
supply to various parts of the device. These regulators are automatically enabled and disabled by hardware and
firmware when switching between power modes. The core internal and core external regulators operate in Active
mode, and provide power to the CPU subsystem and associated peripherals.
3.2.2.1 DeepSleep
The DeepSleep regulator is used to maintain power in a small number of blocks when in DeepSleep mode.
These blocks include the ILO and WDT timers, BOD detector, SCB0, SRAM memories, Smart I/O, and other
configuration memories. The DeepSleep regulator is enabled when in DeepSleep mode, and the core internal
regulator is disabled. It is disabled when XRES_L is asserted (LOW) and when the core internal regulator is
disabled.
Note
5. When CYT4BF is in Hibernate mode, the GPIO used to control the core external regulator are High-Z. This may require an external
pull-up or pull-down resistor to disable the external regulator and configure it for minimum operating current.
The core external regulator may be implemented with either an external NPN pass transistor, PMIC, or linear
regulator (LDO). Each implementation requires different external components on the PCB, and different
connections to CYT4BF for both regulation and control.
Vpwr
(2.7-5.5V)
VDDD 10 uF
NPN transistor
TRAVEOTM T2G Emitter Follower
ZXT849K
DRV_VOUT etc
EXT_PS_CTL0 0.1Ω
1/4W
1%
EXT_PS_CTL1
CS1
Vin
R2
- PMIC EN pin polarity is HIGH for enable. PMIC PG pin polarity is HIGH for power good.
- If EN pin of PMIC does not have the internal pull-down resistor, an external pull-down resistor must be placed to keep the PMIC disabled during power-on reset.
- See the Electrical Specifications section for more information on CS1.
- Output voltage setting resistors (R1, R2) are needed according to the selected PMIC.
Both the core internal and core external regulators require an external bulk storage capacitor connected to the
VCCD pin. This capacitor provides charge under the dynamic loads of the low-voltage core transistors.
Note
6. Operation of reference-timed peripherals (like a UART) with an FLL-based reference is not recommended due the allowed frequency error.
3.2.3.5 EXT_CLK
One of three GPIO_STD I/Os can be used to provide an external clock input of up to 80 MHz. This clock can be used
as the source clock for either the PLL or FLL, or can be used directly by the CLK_HF domain.
3.2.3.6 ECO
The ECO provides high-frequency clocking using an external crystal connected to the ECO_IN and ECO_OUT pins.
It supports fundamental mode (non-overtone) quartz crystals, in the range of 8 to 33.34 MHz. When used in
conjunction with the PLL, it generates CPU and peripheral clocks up to device’s maximum frequency. ECO
accuracy depends on the selected crystal. If the ECO is disabled, the associated pins can be used for any of the
available I/O functions.
3.2.3.7 WCO
The WCO is a low-power, watch-crystal oscillator intended for real-time-clock applications. It requires an external
32.768-kHz crystal connected to the WCO_IN and WCO_OUT pins. The WCO can also be configured as a clock
reference for CLK_LF, which is the clock source for the MCWDT and RTC.
3.2.4 Reset
CYT4BF can be reset from a variety of sources, including software. Most reset events are asynchronous and
guarantee reversion to a known state. The reset cause (POR, BOD, OVD, overcurrent, XRES_L, WDT, MCWDT,
software reset, fault, CSV, Hibernate wakeup, debug) is recorded in a register, which is sticky through reset and
allows software to determine the cause of the reset. An XRES_L pin is available for external reset.
3.3 Peripherals
3.3.1 Peripheral clock dividers
Integer and fractional clock dividers are provided for peripheral and timing purposes.
Table 3-2 Clock dividers - CPUSS Group (Nr. 0)
Divider type Instances Description
div_8 4 Integer divider, 8 bits
div_16 3 Integer divider, 16 bits
div_24_5 1 Fractional divider, 24.5 bits (24 integer bits, 5 fractional bits)
Note
7. VREF_L prevents IR drops in the VSSIO and VSSA paths from impacting the measurements. VREF_L, when properly connected, reduces
or removes the impact of IR drops in the VSSIO and VSSA paths from measurements.
Notes
8. This is not 100% compliant with the I2C-bus specification; I/Os are not overvoltage-tolerant, do not support the 20-mA sink require-
ment of Fast-mode Plus, and violate the leakage specification when no power is applied.
9. Only Port 0 with the slew rate control enabled meets the minimum fall time requirement.
10.The Easy SPI (EZSPI) protocol is based on the Motorola SPI protocol operating in any mode (0, 1, 2, or 3). It allows communication
between master and slave while reducing the need for CPU intervention.
3.3.6 CAN FD
CYT4BF contains two CAN FD controller blocks, each supporting five CAN FD channels. All CAN FD controllers are
compliant with the ISO 11898-1:2015 standard; an ISO 16845:2015 certificate is available. It also implements the
time-triggered CAN (TTCAN) protocol specified in ISO 11898-4 (TTCAN protocol levels 1 and 2) completely in
hardware. All functions concerning the handling of messages are implemented by the Rx and Tx handlers. The Rx
handler manages message acceptance filtering, transfer of received messages from the CAN core to a message
RAM, and provides receive-message status. The Tx handler is responsible for the transfer of transmit messages
from the message RAM to the CAN core, and provides transmit-message status.
Notes
11.The Easy I2C (EZI2C) protocol is a unique communication scheme built on top of the I2C protocol by Cypress. It uses a meta protocol
around the standard I2C protocol to communicate to an I2C slave using indexed memory transfers. This reduces the need for CPU
intervention.
12.Only 10/100 Mbps is available in the 176-TEQFP packaged devices.
3.4 I/Os
CYT4BF has up to 240 programmable I/Os.
The I/Os are organized as logical entities called ports, which are a maximum of 8 bits wide. During power-on, and
reset, the I/Os are forced to the High-Z state. During the Hibernate mode, I/Os are frozen.
Every I/O can generate an interrupt (if enabled) and each port has an interrupt request (IRQ) and interrupt service
routine (ISR) associated with it.
I/O port power source mapping is listed in Table 3-4. The associated supply determines the VOH, VOL, VIH, and VIL
levels when configured for CMOS and Automotive thresholds.
0xFFFF FFFF
Arm System
Space CPU & Debug Registers
0xE000 0000
Reserved
0xA011 3FFF
0xA011 0000 16 KB CM7_1 DTCM Core CM7_1 Data TCM
Reserved
0xA010 3FFF
0xA010 0000 16 KB CM7_1 ITCM Core CM7_1 Instruction TCM
Reserved
0xA001 3FFF
0xA001 0000 16 KB CM7_0 DTCM Core CM7_0 Data TCM
Reserved
0xA000 3FFF
0xA000 0000 16 KB CM7_0 ITCM Core CM7_0 Instruction TCM
Reserved
0x67FF FFFF
128 MB SMIF_XIP Serial Memory Interface XIP
0x6000 0000
Reserved
0x43FF FFFF
Peripheral
Mainly used for on-chip peripherals;
Interconnect or
e.g., AHB or APB peripherals
Memory map
0x4000 0000
Reserved
0x280F FFFF
0x280C 0000
256 KB SRAM2
0x280B FFFF General purpose RAM,
0x2808 0000
256 KB SRAM1 mainly used for data
0x2807 FFFF
510 KB SRAM0
0x2800 0800 2 KB
0x2800 0000
Reserved CM7 internal address map for its
0x2000 3FFF
0x2000 0000 16 KB CM7 DTCM Data TCM
Reserved Used to store manufacture specific
0x1780 7FFF Alternate Flash
0x1780 0000 32 KB Supervisory data like flash protection settings, trim
Reserved settings, device addresses, serial numbers,
0x1700 7FFF
0x1700 0000 32 KB Flash Supervisory calibration data, etc.
Reserved
0x1403 FFFF
64 KB
0x1403 0000 (128B Small Sectors) Work flash used for long
0x1402 FFFF Work flash
192 KB term data retention
(2 KB Large Sectors)
0x1400 0000
Reserved
0x1082 FFFF
256 KB
0x107F 0000 (8 KB Small Sectors)
0x107E FFFF
0x1000 0000
Reserved Secured Boot ROM to set user specified
0x0100 FFFF
0x0100 0000 64 KB ROM Mirror protection levels, trim and configuration
Reserved data, code authentication, jump to user mode, etc.
0x0000 FFFF
0x0000 0000 64 KB ROM
CM7 internal address map for its instruction TCM.
0x0000 3FFF
0x0000 0000 16 KB CM7 ITCM The address overlaps with portion of ROM region.
Notes
13.The size representation is not up to scale.
14.First 2KB of SRAM is reserved, not available for users. User must keep the power of first 32-KB block of SRAM0 in enabled or retained in
all Active, LP Active, Sleep, LP Sleep, DeepSleep modes.
Note
15.These Programmable PPUs are configured by the Boot ROM and are available for the user based on the access rights. Refer to the
device-specific TRM to know more about the configuration of these programmable PPUs.
ECO LS LS LS
Prescaler
LS
CLK_ CLK_ CLK_ CLK_ CLK_ CLK_
CLK_REF_HF
PATH0 PATH1 PATH2 PATH3 PATH4 PATH5 WDT
MUX
CLK_LF CLK_BAK
RTC
CSV
CLK_ILO0 MUX MUX MUX MUX MUX MUX MUX MUX MCWDT
CSV CSV CSV CSV CSV CSV CSV CSV CLK_ILO0 CLK_LF
CLK_REF_HF
SDHC
Event Generator
Divider CLK_GR5
(1-256) CAN FD
FLEX-RAY
LIN
TCPWM[1]
Divider CLK_GR6
(1-256) SCB[*] Serial Interface Clock
SCB[0]
Divider CLK_GR9
(1-256) SAR ADC
PCLK_CANFD[x]_CLOCK_CAN[y]
PCLK_FLEXRAY_CLK_FLEXRAY
Peripheral PCLK_LIN_CLOCK_CH_EN[x]
Clock Dividers #1 PCLK_TCPWM1_CLOCKS[x]
PCLK_SCB[x]_CLOCK
PCLK_PASS_CLOCK_SAR[x]
Divider CLK_FAST_0
CM7_0
(1-256)
Divider CLK_FAST_1
CM7_1
(1-256)
SMIF
Divider CLK_MEM
(1-256)
ROM/SRAM/FLASH
Divider CLK_SLOW
(1-256) CM0+
LEGEND 1:
Active Domain
DeepSleep Domain CPUSS Slow Infrastructure
Hibernate Domain
P-DMA / M-DMA
Divider CLK_GR8
EFUSE
(1-256)
LEGEND 3:
One Clock Line
IOSS
Multiple Clock Lines
TCPWM[0]
Peripheral
Clock Dividers #0 CPUSS(DEBUG) TCK/SWDCLK from a Debugger
Divider CLK_TRC_DBG
(1-256) PCLK_SMARTIO[x]_CLOCK
PCLK_TCPWM0_CLOCKS[x]
PCLK_CPUSS_CLOCK_TRACE_IN
Note
16.Port configuration of SWD/JTAG pins will be changed from the default GPIO mode to support debugging after the boot process, refer
to Table 11-1 for pin assignments.
9 Pin assignment
Note: Thermal pad needs to be connected to VSSD.
DRV_VOUT
XRES_L
VDDD
VCCD
VDDD
VSSD
VSSD
VSSD
P23.2
P23.3
P22.4
P21.7
P23.7
P23.6
P23.5
P23.4
P23.1
P23.0
P22.7
P22.6
P22.5
P22.3
P21.5
P21.4
P20.6
P20.3
P20.0
P19.1
P22.2
P22.1
P21.6
P21.3
P21.2
P21.1
P21.0
P20.7
P20.5
P20.4
P20.2
P20.1
P19.4
P19.3
P19.2
P19.0
170
176
171
164
159
175
174
173
172
169
168
167
166
165
163
162
161
160
158
157
156
155
154
153
152
151
150
149
148
146
145
144
143
142
141
140
139
138
137
136
135
134
133
147
VSSD 1 132 VDDD
P0.0 2 131 P18.7
P0.1 3 130 P18.6
P0.2 4 129 P18.5
P0.3 5 128 P18.4
P1.0 6 127 P18.3
P1.1 7 126 P18.2
P1.2 8 125 P18.1
P1.3 9 124 P18.0
P2.0 10 123 P17.7
P2.1 11 122 P17.6
P2.2 12 121 P17.5
P2.3 13 120 P17.4
P2.4 14 119 P17.3
P2.5 15 118 P17.2
P3.0 16 117 P17.1
P3.1 17 116 P17.0
P3.2 18 115 P16.3
P3.3 19 114 VSSD
P3.4 20 113 VCCD
P3.5 21 112 VCCD
VDDD
VSSD
22
23
176-TEQFP 111
110
VCCD
VDDD
P4.0 24 109 P15.3
P4.1 25 108 P15.2
P4.2 26 107 P15.1
P4.3 27 106 P15.0
P4.4 28 105 P14.7
P5.0 29 104 P14.6
P5.1 30 103 P14.5
P5.2 31 102 P14.4
P5.3 32 101 P14.3
P5.4 33 100 P14.2
P5.5 34 99 P14.1
P6.0 35 98 P14.0
P6.1 36 97 P13.7
P6.2 37 96 P13.6
P6.3 38 95 P13.5
P6.4 39 94 P13.4
P6.5 40 93 P13.3
P6.6 41 92 P13.2
P6.7 42 91 P13.1
VDDD 43 90 P13.0
VDDIO_1 44 89 VSSD
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
VSSD
VCCD
VCCD
P7.0
P7.1
P7.2
P7.3
P7.4
P7.5
P7.6
P7.7
P8.0
P8.1
P8.2
P8.3
P8.4
P9.0
P9.1
P9.2
P9.3
P10.0
P10.1
P10.2
P10.3
P10.4
P10.5
P10.6
P10.7
P11.0
P11.1
P11.2
VREFL
VSSA
VDDA
VREFH
P12.0
P12.1
P12.2
P12.3
P12.4
P12.5
P12.6
P12.7
VDDIO_2
PWM1_30/PWM1_29_N/TC1_30_TR0/TC1_29_TR1/TC1_H_2_TR1/SCB2_SEL2 (1)/LIN5_RX/ADC[2]_29
PWM1_45/PWM1_46_N/TC1_45_TR0/TC1_46_TR1/SCB1_RTS (1)/SCB1_SCL (1)/SCB1_CLK (1)
PWM1_44/PWM1_45_N/TC1_44_TR0/TC1_45_TR1/SCB1_CTS (1)/SCB1_SEL0 (1)/CAN1_4_TX
PWM1_29/PWM1_28_N/TC1_29_TR0/TC1_28_TR1/TC1_H_2_TR0/SCB2_SEL1 (1)/ADC[2]_28
PWM1_29/PWM1_30_N/TC1_29_TR0/TC1_30_TR1/PWM1_H_8/SCB6_SEL2 (1)/LIN7_RX
PWM1_30/PWM1_31_N/TC1_30_TR0/TC1_31_TR1/SCB6_SEL1 (1)/TRACE_CLOCK (1)
PWM1_48/PWM1_49_N/TC1_48_TR0/TC1_49_TR1/TC1_H_3_TR1/LIN5_EN/ADC[2]_31
PWM1_49/PWM1_30_N/TC1_49_TR0/TC1_30_TR1/TC1_H_3_TR0/LIN5_TX/ADC[2]_30
PWM1_27/PWM1_28_N/TC1_27_TR0/TC1_28_TR1/TC1_H_8_TR0/LIN14_RX/LIN7_EN
PWM1_40/PWM1_41_N/TC1_40_TR0/TC1_41_TR1/EXT_CLK/TRIG_DBG[1]/ECO_IN
PWM1_43/PWM1_44_N/TC1_43_TR0/TC1_44_TR1/SCB1_SEL1 (1)/CAN1_4_RX
PWM1_38/PWM1_39_N/TC1_38_TR0/TC1_39_TR1/HIBERNATE_WAKEUP[0]
PWM1_42/PWM1_43_N/TC1_42_TR0/TC1_43_TR1/SCB1_SEL2 (1)/WCO_IN
PWM1_28/PWM1_29_N/TC1_28_TR0/TC1_29_TR1/PWM1_H_8_N/LIN7_TX
PWM1_36/PWM1_37_N/TC1_36_TR0/TC1_37_TR1/LIN0_TX/LIN13_RX
PWM1_41/PWM1_42_N/TC1_41_TR0/TC1_42_TR1/WCO_OUT
PWM1_39/PWM1_40_N/TC1_39_TR0/TC1_40_TR1/ECO_OUT
DRV_VOUT
XRES_L
VDDD
VCCD
VDDD
VSSD
VSSD
VSSD
P23.7
P23.6
P23.3
P23.1
P22.7
P22.6
P22.4
P22.3
P21.7
P21.6
P21.3
P21.1
P21.2
P20.6
P20.2
P20.0
P19.4
P19.3
P19.1
P19.0
P23.5
P23.2
P23.4
P23.0
P22.5
P22.2
P22.1
P21.5
P21.4
P21.0
P20.7
P20.5
P20.4
P20.3
P20.1
P19.2
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
VSSD 1 132 VDDD
PWM1_18/PWM1_22_N/TC1_18_TR0/TC1_22_TR1/PWM0_H_0/SCB0_RX (0)/SCB7_SDA (2)/SCB0_MISO (0)/LIN1_RX P0.0 2 131 P18.7 PWM1_50/PWM1_51_N/TC1_50_TR0/TC1_51_TR1/TC0_M_2_TR1/ETH0_TXD_3 (0)/PWM1_H_3_N/CAN1_2_RX/TRACE_DATA_3 (0)/ADC[2]_23
PWM1_17/PWM1_18_N/TC1_17_TR0/TC1_18_TR1/PWM0_H_0_N/SCB0_TX (0)/SCB7_SCL (2)/SCB0_MOSI (0)/LIN1_TX P0.1 3 130 P18.6 PWM1_51/PWM1_52_N/TC1_51_TR0/TC1_52_TR1/TC0_M_2_TR0/ETH0_TXD_2 (0)/PWM1_H_3/SCB1_SEL3 (0)/CAN1_2_TX/TRACE_DATA_2 (0)/ADC[2]_22
PWM1_14/PWM1_17_N/TC1_14_TR0/TC1_17_TR1/TC0_H_0_TR0/SCB0_RTS (0)/SCB0_SCL (0)/SCB0_CLK (0)/SCB4_MISO (2)/LIN1_EN/CAN0_1_TX P0.2 4 129 P18.5 PWM1_52/PWM1_53_N/TC1_52_TR0/TC1_53_TR1/PWM0_M_2_N/ETH0_TXD_1 (0)/PWM1_H_2_N/SCB1_SEL2 (0)/TRACE_DATA_1 (0)/ADC[2]_21
PWM1_13/PWM1_14_N/TC1_13_TR0/TC1_14_TR1/TC0_H_0_TR1/SCB0_CTS (0)/SCB0_SDA (0)/SCB0_SEL0 (0)/SCB4_MOSI (2)/CAN0_1_RX P0.3 5 128 P18.4 PWM1_53/PWM1_54_N/TC1_53_TR0/TC1_54_TR1/PWM0_M_2/ETH0_TXD_0 (0)/PWM1_H_2/SCB1_SEL1 (0)/SCB3_SEL0 (2)/TRACE_DATA_0 (0)/ADC[2]_20
PWM1_12/PWM1_13_N/TC1_12_TR0/TC1_13_TR1/PWM1_H_4/SCB0_SCL (1)/SCB0_MISO (1)/SCB4_CLK (2) P1.0 6 127 P18.3 PWM1_54/PWM1_55_N/TC1_54_TR0/TC1_55_TR1/ETH0_TX_CLK (0)/PWM1_H_1_N/SCB1_CTS (0)/SCB1_SEL0 (0)/SCB3_CLK (2)/TRACE_CLOCK (0)/ADC[2]_19
PWM1_11/PWM1_12_N/TC1_11_TR0/TC1_12_TR1/PWM1_H_5/SCB0_SDA (1)/SCB0_MOSI (1)/SCB4_SEL0 (2) P1.1 7 126 P18.2 PWM1_55/PWM1_M_7_N/TC1_55_TR0/TC1_M_7_TR1/ETH0_TX_ER (0)/PWM1_H_1/SCB1_RTS (0)/SCB1_SCL (0)/SCB1_CLK (0)/SCB3_MOSI (1)/ADC[2]_18
PWM1_10/PWM1_11_N/TC1_10_TR0/TC1_11_TR1/PWM1_H_6/SCB0_CLK (1)/LIN0_RX/TRIG_IN[0] P1.2 8 125 P18.1 PWM1_M_7/PWM1_M_6_N/TC1_M_7_TR0/TC1_M_6_TR1/ETH0_TX_CTL (0)/PWM1_H_0_N/SCB1_TX (0)/SCB1_SDA (0)/SCB1_MOSI (0)/SCB3_MISO (1)/FAULT_OUT_1/ADC[2]_17
PWM1_8/PWM1_10_N/TC1_8_TR0/TC1_10_TR1/PWM1_H_7/SCB0_SEL0 (1)/LIN0_TX/TRIG_IN[1] P1.3 9 124 P18.0 PWM1_M_6/PWM1_M_5_N/TC1_M_6_TR0/TC1_M_5_TR1/ETH0_REF_CLK (0)/PWM1_H_0/SCB1_RX (0)/SCB1_MISO (0)/LIN12_TX/FAULT_OUT_0/ADC[2]_16
PWM1_7/PWM1_8_N/TC1_7_TR0/TC1_8_TR1/TC1_H_4_TR0/SCB7_RX (0)/SCB0_SEL1 (0)/SCB7_MISO (0)/LIN0_RX/CAN0_0_TX/SWJ_TRSTN/TRIG_IN[2] P2.0 10 123 P17.7 PWM1_M_5/PWM1_M_4_N/TC1_M_5_TR0/TC1_M_4_TR1/LIN15_EN/LIN12_RX/ADC[2]_15
PWM1_6/PWM1_7_N/TC1_6_TR0/TC1_7_TR1/TC1_H_5_TR0/SCB7_TX (0)/SCB7_SDA (0)/SCB0_SEL2 (0)/SCB7_MOSI (0)/LIN0_TX/CAN0_0_RX/TRIG_IN[3] P2.1 11 122 P17.6 PWM1_M_4/PWM1_56_N/TC1_M_4_TR0/TC1_56_TR1/PWM1_H_2_N/LIN15_TX/SCB3_SEL2 (1)/ADC[2]_14
PWM1_5/PWM1_6_N/TC1_5_TR0/TC1_6_TR1/ETH0_RX_ER (0)/TC1_H_6_TR0/SCB7_RTS (0)/SCB7_SCL (0)/SCB0_SEL3 (0)/SCB7_CLK (0)/LIN0_EN/TRIG_IN[4] P2.2 12 121 P17.5 PWM1_56/PWM1_57_N/TC1_56_TR0/TC1_57_TR1/PWM1_H_2/LIN15_RX/SCB3_SEL1 (1)/ADC[2]_13
PWM1_4/PWM1_5_N/TC1_4_TR0/TC1_5_TR1/ETH0_ETH_TSU_TIMER_CMP_VAL (0)/TC1_H_7_TR0/SCB7_CTS (0)/SCB7_SEL0 (0)/LIN5_RX/TRIG_IN[5] P2.3 13 120 P17.4 PWM1_57/PWM1_58_N/TC1_57_TR0/TC1_58_TR1/PWM1_H_3_N/SCB3_CTS (1)/SCB3_SEL0 (1)/TRIG_IN[27]/ADC[2]_12
PWM1_3/PWM1_4_N/TC1_3_TR0/TC1_4_TR1/PWM1_H_4_N/SCB7_SEL1 (0)/LIN5_TX/TRIG_IN[6] P2.4 14 119 P17.3 PWM1_58/PWM1_59_N/TC1_58_TR0/TC1_59_TR1/PWM1_H_3/SCB3_RTS (1)/SCB3_SCL (1)/SCB3_CLK (1)/TRIG_IN[26]/ADC[2]_11
PWM1_2/PWM1_3_N/TC1_2_TR0/TC1_3_TR1/PWM1_H_5_N/SCB7_SEL2 (0)/LIN5_EN/TRIG_IN[7] P2.5 15 118 P17.2 PWM1_59/PWM1_60_N/TC1_59_TR0/TC1_60_TR1/SCB3_TX (1)/SCB3_SDA (1)/LIN11_EN/ADC[2]_10
PWM1_1/PWM1_2_N/TC1_1_TR0/TC1_2_TR1/ETH0_MDIO (0)/PWM1_H_6_N/SCB6_RX (0)/SCB6_MISO (0)/CAN0_3_TX/TRIG_DBG[0] P3.0 16 117 P17.1 PWM1_60/PWM1_61_N/TC1_60_TR0/TC1_61_TR1/SCB3_RX (1)/LIN11_TX/CAN1_1_RX/ADC[2]_9
PWM1_0/PWM1_1_N/TC1_0_TR0/TC1_1_TR1/ETH0_MDC (0)/PWM1_H_7_N/SCB6_TX (0)/SCB6_SDA (0)/SCB6_MOSI (0)/CAN0_3_RX/TRIG_DBG[1] P3.1 17 116 P17.0 PWM1_61/PWM1_62_N/TC1_61_TR0/TC1_62_TR1/LIN11_RX/CAN1_1_TX/ADC[2]_8
PWM1_M_3/PWM1_0_N/TC1_M_3_TR0/TC1_0_TR1/TC1_H_4_TR1/SCB6_RTS (0)/SCB6_SCL (0)/SCB6_CLK (0) P3.2 18 115 P16.3 PWM1_62/PWM1_62_N/TC1_62_TR0/TC1_62_TR1/PWM1_H_1_N/ADC[2]_3
PWM1_M_2/PWM1_M_3_N/TC1_M_2_TR0/TC1_M_3_TR1/TC1_H_5_TR1/SCB6_CTS (0)/SCB6_SEL0 (0) P3.3 19 114 VSSD
PWM1_M_1/PWM1_M_2_N/TC1_M_1_TR0/TC1_M_2_TR1/TC1_H_6_TR1/SCB6_SEL1 (0)/LIN1_RX P3.4 20 113 VCCD
176-TEQFP
PWM1_M_0/PWM1_M_1_N/TC1_M_0_TR0/TC1_M_1_TR1/TC1_H_7_TR1/SCB6_SEL2 (0)/LIN1_TX P3.5 21 112 VCCD
VDDD 22 111 VCCD
VSSD 23 110 VDDD
PWM1_4/PWM1_M_0_N/TC1_4_TR0/TC1_M_0_TR1/EXT_MUX[0]_0/SCB5_RX (0)/SCB5_MISO (0)/LIN1_RX/TRIG_IN[10] P4.0 24 109 P15.3 PWM1_59/PWM1_58_N/TC1_59_TR0/TC1_58_TR1/AUDIOSS2_RX_SDI/TC1_H_7_TR1/SCB9_CTS (0)/SCB9_SEL0 (0)/ADC[1]_31
PWM1_5/PWM1_4_N/TC1_5_TR0/TC1_4_TR1/EXT_MUX[0]_1/SCB5_TX (0)/SCB5_SDA (0)/SCB5_MOSI (0)/LIN1_TX/TRIG_IN[11] P4.1 25 108 P15.2 PWM1_58/PWM1_57_N/TC1_58_TR0/TC1_57_TR1/AUDIOSS2_RX_WS/TC1_H_7_TR0/SCB9_RTS (0)/SCB9_SCL (0)/SCB9_CLK (0)/ADC[1]_30
PWM1_6/PWM1_5_N/TC1_6_TR0/TC1_5_TR1/EXT_MUX[0]_2/SCB5_RTS (0)/SCB5_SCL (0)/SCB5_CLK (0)/LIN1_EN/TRIG_IN[12] P4.2 26 107 P15.1 PWM1_57/PWM1_56_N/TC1_57_TR0/TC1_56_TR1/AUDIOSS2_RX_SCK/TC1_H_6_TR1/SCB9_TX (0)/SCB9_SDA (0)/SCB9_MOSI (0)/CAN1_3_RX/ADC[1]_29
PWM1_7/PWM1_6_N/TC1_7_TR0/TC1_6_TR1/EXT_MUX[0]_EN/SCB5_CTS (0)/SCB5_SEL0 (0)/CAN0_1_TX/TRIG_IN[13] P4.3 27 106 P15.0 PWM1_56/PWM1_55_N/TC1_56_TR0/TC1_55_TR1/AUDIOSS2_CLK_I2S_IF/TC1_H_6_TR0/SCB9_RX (0)/SCB9_MISO (0)/CAN1_3_TX/ADC[1]_28
PWM1_8/PWM1_7_N/TC1_8_TR0/TC1_7_TR1/LIN15_RX/SCB5_SEL1 (0)/CAN0_1_RX P4.4 28 105 P14.7 PWM1_55/PWM1_54_N/TC1_55_TR0/TC1_54_TR1/TC1_H_5_TR1/LIN14_EN/TRIG_IN[25]/ADC[1]_27
PWM1_9/PWM1_8_N/TC1_9_TR0/TC1_8_TR1/PWM0_M_0/PWM1_H_10/LIN15_TX/SCB5_SEL2 (0)/LIN7_RX/TRIG_IN[38] P5.0 29 104 P14.6 PWM1_54/PWM1_53_N/TC1_54_TR0/TC1_53_TR1/TC1_H_5_TR0/LIN14_TX/TRIG_IN[24]/ADC[1]_26
PWM1_10/PWM1_9_N/TC1_10_TR0/TC1_9_TR1/PWM0_M_0_N/PWM1_H_10_N/SCB9_SEL3 (1)/LIN7_TX/TRIG_IN[39] P5.1 30 103 P14.5 PWM1_53/PWM1_52_N/TC1_53_TR0/TC1_52_TR1/AUDIOSS2_TX_SDO/TC1_H_4_TR1/SCB2_SEL2 (0)/LIN14_RX/ADC[1]_25
PWM1_11/PWM1_10_N/TC1_11_TR0/TC1_10_TR1/TC0_M_0_TR0/TC1_H_10_TR0/LIN10_RX/LIN7_EN P5.2 31 102 P14.4 PWM1_52/PWM1_51_N/TC1_52_TR0/TC1_51_TR1/AUDIOSS2_TX_WS/TC1_H_4_TR0/SCB2_SEL1 (0)/LIN6_EN/ADC[1]_24
PWM1_12/PWM1_11_N/TC1_12_TR0/TC1_11_TR1/TC0_M_0_TR1/TC1_H_10_TR1/LIN10_TX/LIN2_RX P5.3 32 101 P14.3 PWM1_51/PWM1_50_N/TC1_51_TR0/TC1_50_TR1/TC0_M_1_TR1/PWM1_H_7_N/SCB2_SEL0 (0)/SCB2_CTS (0)/LIN6_TX/ADC[1]_23
PWM1_13/PWM1_12_N/TC1_13_TR0/TC1_12_TR1/LIN9_RX/PWM1_H_11/LIN2_TX P5.4 33 100 P14.2 PWM1_50/PWM1_49_N/TC1_50_TR0/TC1_49_TR1/TC0_M_1_TR0/PWM1_H_7/SCB2_CLK (0)/SCB2_SCL (0)/SCB2_RTS (0)/LIN6_RX/ADC[1]_22
PWM1_14/PWM1_13_N/TC1_14_TR0/TC1_13_TR1/LIN9_TX/PWM1_H_11_N/LIN2_EN P5.5 34 99 P14.1 PWM1_49/PWM1_48_N/TC1_49_TR0/TC1_48_TR1/PWM0_M_1_N/AUDIOSS2_TX_SCK/PWM1_H_6_N/SCB2_MOSI (0)/SCB2_SDA (0)/SCB2_TX (0)/CAN1_0_RX/ADC[1]_21
PWM1_M_0/PWM1_14_N/TC1_M_0_TR0/TC1_14_TR1/PWM0_0/LIN9_EN/TC1_H_11_TR0/SCB4_RX (0)/SCB4_MISO (0)/LIN3_RX/ADC[0]_0 P6.0 35 98 P14.0 PWM1_48/PWM1_47_N/TC1_48_TR0/TC1_47_TR1/PWM0_M_1/AUDIOSS2_MCLK/PWM1_H_6/SCB2_MISO (0)/SCB2_RX (0)/CAN1_0_TX/ADC[1]_20
PWM1_0/PWM1_M_0_N/TC1_0_TR0/TC1_M_0_TR1/TC1_H_11_TR1/SCB4_TX (0)/SCB4_SDA (0)/SCB4_MOSI (0)/LIN3_TX/ADC[0]_1 P6.1 36 97 P13.7 PWM1_47/PWM1_M_11_N/TC1_47_TR0/TC1_M_11_TR1/AUDIOSS1_RX_SDI/PWM1_H_5_N/TRIG_IN[23]/ADC[1]_19
PWM1_M_1/PWM1_0_N/TC1_M_1_TR0/TC1_0_TR1/PWM0_0_N/SDHC_CARD_MECH_WRITE_PROT (0)/PWM1_H_12/SCB4_RTS (0)/SCB4_SCL (0)/SCB4_CLK (0)/LIN3_EN/CAN0_2_TX/ADC[0]_2 P6.2 37 96 P13.6 PWM1_M_11/PWM1_46_N/TC1_M_11_TR0/TC1_46_TR1/LIN8_EN/AUDIOSS1_RX_WS/PWM1_H_5/SCB3_SEL3 (0)/TRIG_IN[22]/ADC[1]_18
PWM1_1/PWM1_M_1_N/TC1_1_TR0/TC1_M_1_TR1/SPIHB_CLK (0)/SDHC_CARD_CMD (0)/PWM1_H_12_N/SCB4_CTS (0)/SCB4_SEL0 (0)/LIN4_RX/CAN0_2_RX/CAL_SUP_NZ/ADC[0]_3 P6.3 38 95 P13.5 PWM1_46/PWM1_M_10_N/TC1_46_TR0/TC1_M_10_TR1/LIN8_TX/AUDIOSS1_RX_SCK/PWM1_H_4_N/SCB3_SEL2 (0)/ADC[1]_17
PWM1_M_2/PWM1_1_N/TC1_M_2_TR0/TC1_1_TR1/TC0_0_TR0/SPIHB_RWDS (0)/SDHC_CLK_CARD (0)/TC1_H_12_TR0/SCB4_SEL1 (0)/LIN4_TX/ADC[0]_4 P6.4 39 94 P13.4 PWM1_M_10/PWM1_45_N/TC1_M_10_TR0/TC1_45_TR1/LIN8_RX/AUDIOSS1_CLK_I2S_IF/PWM1_H_4/LIN2_TX/SCB3_SEL1 (0)/ADC[1]_16
PWM1_2/PWM1_M_2_N/TC1_2_TR0/TC1_M_2_TR1/TC0_0_TR1/SPIHB_SEL0 (0)/SDHC_CARD_DETECT_N (0)/TC1_H_12_TR1/SCB4_SEL2 (0)/LIN4_EN/ADC[0]_5 P6.5 40 93 P13.3 PWM1_45/PWM1_M_9_N/TC1_45_TR0/TC1_M_9_TR1/AUDIOSS1_TX_SDO/EXT_MUX[2]_EN/SCB3_CTS (0)/LIN2_RX/SCB3_SEL0 (0)/ADC[1]_15
PWM1_M_3/PWM1_2_N/TC1_M_3_TR0/TC1_2_TR1/SCB4_SEL3 (0)/TRIG_IN[8]/ADC[0]_6 P6.6 41 92 P13.2 PWM1_M_9/PWM1_44_N/TC1_M_9_TR0/TC1_44_TR1/PWM0_2/AUDIOSS1_TX_WS/EXT_MUX[2]_2/SCB3_RTS (0)/SCB3_SCL (0)/LIN3_EN/SCB3_CLK (0)/ADC[1]_14
PWM1_3/PWM1_M_3_N/TC1_3_TR0/TC1_M_3_TR1/TRIG_IN[9]/ADC[0]_7 P6.7 42 91 P13.1 PWM1_44/PWM1_M_8_N/TC1_44_TR0/TC1_M_8_TR1/PWM0_2_N/AUDIOSS1_TX_SCK/EXT_MUX[2]_1/SCB3_TX (0)/SCB3_SDA (0)/LIN3_TX/SCB3_MOSI (0)/ADC[1]_13
VDDD 43 90 P13.0 PWM1_M_8/PWM1_43_N/TC1_M_8_TR0/TC1_43_TR1/TC0_2_TR0/AUDIOSS1_MCLK/EXT_MUX[2]_0/SCB3_RX (0)/LIN3_RX/SCB3_MISO (0)/ADC[1]_12
VDDIO_1 44 89 VSSD
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
VSSD
VCCD
VCCD
P7.0
P7.1
P7.2
P7.3
P7.4
P7.5
P7.6
P7.7
P8.0
P8.1
P8.2
P8.3
P8.4
P9.0
P9.1
P9.2
P9.3
P10.0
P10.1
P10.2
P10.3
P10.4
P10.5
P10.6
P10.7
P11.0
P11.1
P11.2
VREFL
VSSA
VDDA
VREFH
P12.0
P12.1
P12.2
P12.3
P12.4
P12.5
P12.6
P12.7
VDDIO_2
PWM1_M_4/PWM1_3_N/TC1_M_4_TR0/TC1_3_TR1/PWM0_1/SPIHB_SEL1 (0)/SDHC_CARD_IF_PWR_EN (0)/SCB5_RX (1)/SCB5_MISO (1)/LIN4_RX/ADC[0]_16
PWM1_15/PWM1_M_4_N/TC1_15_TR0/TC1_M_4_TR1/SPIHB_DATA0 (0)/SDHC_CARD_DAT_3TO0_0 (0)/SCB5_TX (1)/SCB5_SDA (1)/SCB5_MOSI (1)/LIN4_TX/ADC[0]_17
PWM1_M_5/PWM1_15_N/TC1_M_5_TR0/TC1_15_TR1/PWM0_1_N/SPIHB_DATA1 (0)/SDHC_CARD_DAT_3TO0_1 (0)/SCB5_RTS (1)/SCB5_SCL (1)/SCB5_CLK (1)/LIN4_EN/ADC[0]_18
PWM1_16/PWM1_M_5_N/TC1_16_TR0/TC1_M_5_TR1/TC0_1_TR0/SPIHB_DATA2 (0)/SDHC_CARD_DAT_3TO0_2 (0)/SCB5_CTS (1)/SCB5_SEL0 (1)/CAN0_4_TX/ADC[0]_19
PWM1_M_6/PWM1_16_N/TC1_M_6_TR0/TC1_16_TR1/TC0_1_TR1/SPIHB_DATA3 (0)/SDHC_CARD_DAT_3TO0_3 (0)/SCB5_SEL1 (1)/CAN0_4_RX/ADC[0]_20
PWM1_17/PWM1_M_6_N/TC1_17_TR0/TC1_M_6_TR1/PWM0_H_2/SPIHB_DATA4 (0)/SDHC_CARD_DAT_7TO4_0 (0)/LIN10_RX/SCB5_SEL2 (1)/ADC[0]_21
PWM1_M_7/PWM1_17_N/TC1_M_7_TR0/TC1_17_TR1/LIN10_TX/TRIG_IN[16]/ADC[0]_22
PWM1_18/PWM1_M_7_N/TC1_18_TR0/TC1_M_7_TR1/LIN10_EN/TRIG_IN[17]/ADC[0]_23
PWM1_19/PWM1_18_N/TC1_19_TR0/TC1_18_TR1/PWM0_H_2_N/SPIHB_DATA5 (0)/SDHC_CARD_DAT_7TO4_1 (0)/PWM1_H_8/LIN2_RX/CAN0_0_TX
PWM1_20/PWM1_19_N/TC1_20_TR0/TC1_19_TR1/TC0_H_2_TR0/SPIHB_DATA6 (0)/SDHC_CARD_DAT_7TO4_2 (0)/PWM1_H_8_N/LIN2_TX/CAN0_0_RX/TRIG_IN[14]/ADC[0]_24
PWM1_21/PWM1_20_N/TC1_21_TR0/TC1_20_TR1/TC0_H_2_TR1/SPIHB_DATA7 (0)/SDHC_CARD_DAT_7TO4_3 (0)/TC1_H_8_TR0/LIN2_EN/TRIG_IN[15]/ADC[0]_25
PWM1_22/PWM1_21_N/TC1_22_TR0/TC1_21_TR1/TC1_H_8_TR1/LIN16_RX/TRIG_DBG[0]/ADC[0]_26
PWM1_23/PWM1_22_N/TC1_23_TR0/TC1_22_TR1/LIN16_TX/TRIG_DBG[1]/ADC[0]_27
PWM1_24/PWM1_23_N/TC1_24_TR0/TC1_23_TR1/PWM1_H_9/LIN16_EN/ADC[0]_28
PWM1_25/PWM1_24_N/TC1_25_TR0/TC1_24_TR1/PWM1_H_9_N/LIN12_RX/ADC[0]_29
PWM1_26/PWM1_25_N/TC1_26_TR0/TC1_25_TR1/TC1_H_9_TR0/LIN12_TX/ADC[0]_30
PWM1_27/PWM1_26_N/TC1_27_TR0/TC1_26_TR1/TC1_H_9_TR1/LIN12_EN/ADC[0]_31
PWM1_28/PWM1_27_N/TC1_28_TR0/TC1_27_TR1/PWM1_H_10/SCB4_RX (1)/SCB4_MISO (1)/LIN7_RX/TRIG_IN[18]
PWM1_29/PWM1_28_N/TC1_29_TR0/TC1_28_TR1/PWM1_H_10_N/SCB4_TX (1)/SCB4_SDA (1)/SCB4_MOSI (1)/LIN7_TX/TRIG_IN[19]
PWM1_30/PWM1_29_N/TC1_30_TR0/TC1_29_TR1/LIN8_RX/TC1_H_10_TR0/SCB4_RTS (1)/SCB4_SCL (1)/SCB4_CLK (1)/FLEXRAY_RXDA
PWM1_31/PWM1_30_N/TC1_31_TR0/TC1_30_TR1/LIN8_TX/TC1_H_10_TR1/SCB4_CTS (1)/SCB4_SEL0 (1)/FLEXRAY_TXDA
PWM1_32/PWM1_31_N/TC1_32_TR0/TC1_31_TR1/LIN8_EN/PWM1_H_11/SCB4_SEL1 (1)/FLEXRAY_TXENA_N/ADC[1]_0
PWM1_33/PWM1_32_N/TC1_33_TR0/TC1_32_TR1/PWM1_H_11_N/SCB4_SEL2 (1)/LIN13_RX/FLEXRAY_RXDB/ADC[1]_1
PWM1_33_N/TC1_33_TR1/PWM1_34/TC1_H_11_TR0/TC1_34_TR0/LIN13_TX/FLEXRAY_TXDB/ADC[1]_2
PWM1_35/PWM1_34_N/TC1_35_TR0/TC1_34_TR1/TC1_H_11_TR1/LIN13_EN/FLEXRAY_TXENB_N/ADC[1]_3
PWM1_61/PWM1_62_N/TC1_61_TR0/TC1_62_TR1/AUDIOSS0_MCLK/ADC[0]_M
PWM1_60/PWM1_61_N/TC1_60_TR0/TC1_61_TR1/AUDIOSS0_TX_SCK/ADC[1]_M
PWM1_59/PWM1_60_N/TC1_59_TR0/TC1_60_TR1/AUDIOSS0_TX_WS/ADC[2]_M
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
A VSSD P6.5 P6.2 P31.2 P31.0 P5.0 P4.4 P4.0 P29.5 P29.1 P29.0 P3.1 P3.0 P2.0 P1.1 P1.0 P0.2 VSSD
B P6.7 P6.6 P6.3 P6.0 P31.1 P5.1 P30.0 P4.1 P29.6 P29.2 P3.5 P3.2 P2.4 P2.1 P1.2 P0.3 P0.1 P0.0
C P32.0 P32.1 P6.4 P6.1 P5.4 P5.2 P30.1 P4.2 P29.7 P29.3 P3.6 P3.3 P2.5 P2.2 P1.3 P28.7 P28.6 P28.5
D P32.2 P32.3 P32.4 P32.5 P5.5 P5.3 P30.2 P4.3 VSSD P29.4 P3.7 P3.4 P2.6 P2.3 P1.4 P28.4 P28.3 P28.2
F P7.2 P7.3 P7.4 P7.5 VCCD P30.3 VDDD VDDIO VDDIO VDDIO
_1 _1 _1
P2.7 VCCD P23.5 P23.4 P23.3 P22.3
G P7.6 P7.7 P8.0 P8.1 P8.2 VSSD VSSD P23.2 P23.1 P23.0 P22.7 P22.2
DRV_
J P9.2 P9.3 P24.0 P24.1 VDDIO
_3
VSSIO
_3
VSSD VSSD VSSD VDDD VSSD P21.7 P21.6
VOUT
XRES_
K P24.2 P24.3 P24.4 P25.0 VREFH VREFL VSSD VSSD VSSD VDDD P20.7 P20.6 P21.5
L
M P10.0 P25.5 P25.6 P25.7 P11.0 VSSD VSSD P20.3 P20.2 P20.1 P21.2 P21.3
R P12.0 P12.1 P12.2 P11.2 VSSD P14.4 P14.7 P26.1 P26.5 P27.1 P27.5 P27.7 P16.5 VSSD P18.6 P18.5 P19.1 P19.0
T P12.3 P12.4 P12.5 P13.5 P13.7 P14.3 P14.6 P26.0 P26.4 P27.0 P27.4 P27.6 P16.4 P16.6 P17.4 P18.4 P18.3 P18.2
U P12.6 P12.7 P13.2 P13.4 P13.6 P14.2 P15.1 P15.3 P26.3 P26.7 P27.3 P16.1 P16.3 P17.1 P17.3 P17.6 P18.1 P18.0
V VSSD P13.0 P13.1 P13.3 P14.0 P14.1 P15.0 P15.2 P26.2 P26.6 P27.2 P16.0 P16.2 P17.0 P17.2 P17.5 P17.7 VSSD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
A VSSD P6.2 P6.0 P5.3 P5.0 P30.1 P4.5 P4.1 P4.0 P29.2 P29.0 P3.2 P3.0 P2.2 P2.0 P1.1 P1.0 P0.0 P28.7 VSSD
B P6.3 P6.4 P6.1 P5.4 P5.1 P30.2 P4.6 P4.2 P29.5 P29.3 P29.1 P3.3 P3.1 P2.3 P2.1 P1.2 P0.2 P0.1 P28.6 P28.5
C P6.5 P6.6 VSSD P5.5 P5.2 P30.3 P30.0 P4.3 P29.6 VSSD P3.6 P3.4 P2.6 P2.4 P1.4 P1.3 P0.3 VSSD P28.4 P28.3
E P32.3 P32.4 P32.5 P32.2 P31.2 P31.0 P4.4 P29.7 P29.4 P3.7 P3.5 P2.7 P2.5 P1.5 P28.0 P23.4 P23.3 P23.2
F P7.0 P7.1 P32.6 P32.7 VCCD P31.1 VDDD VDDD VDDIO VDDIO VDDIO VDDIO
_1 _1 _1 _1
P1.6 VCCD P23.6 P23.1 P23.0 P22.3
G P7.2 P7.3 P7.4 P7.5 P7.6 P23.7 P22.7 P22.5 P22.4 P22.2
DRV_
J P8.3 P8.4 P9.2 P9.3 VDDIO
_3
VSSIO
_3
VSSD VSSD VSSD VSSD VSSD VDDD P20.7 VSSD P21.5
VOUT
M P24.4 P25.0 P25.1 P10.2 VREFH VREFL VSSD VSSD VSSD VSSD VSSD VDDD P20.2 P20.1 P21.2 P21.3
P P25.5 P25.6 P25.7 P11.0 P11.1 P19.3 P19.2 P19.1 P19.0 VSSD
_2
R P10.4 P10.5 P10.6 P11.2 VCCD P14.6 VDDIO VDDIO VDDIO VDDIO
_2 _4 _4 _4
VDDD VDDD P17.3 VCCD P18.7 P34.7 P34.6 P34.5
T P10.7 P12.0 P12.1 P14.1 P14.5 P14.7 P15.3 P16.0 P16.1 P16.2 P16.3 P16.4 P17.2 P18.5 P18.6 P34.4 P34.3 P34.2
V P12.5 P12.6 VSSD VSSD P14.0 P14.4 P15.2 P26.2 P26.5 P27.0 P27.3 P27.5 P27.7 P17.1 VSSD P18.0 P33.1 P33.3 P33.6 P33.5
W P12.7 P13.1 P13.3 P13.5 P13.7 P14.3 P15.1 P26.1 P26.4 P26.7 P27.2 P27.4 P27.6 P17.0 P17.5 P17.7 P18.2 P33.0 P33.2 P33.4
Y VSSD P13.0 P13.2 P13.4 P13.6 P14.2 P15.0 P26.0 P26.3 P26.6 P27.1 P16.5 P16.6 P16.7 P17.4 P17.6 P18.1 P18.3 P18.4 VSSD
Notes
17.HCon refers to High Speed I/O matrix connection reference as per Table 10-1.
18.DeepSleep ordering (DS #0, DS #1, DS #2) does not have any impact on choosing any alternate functions; the HSIOM module handles the individual alternate function assignment.
2024-01-25
19.All port pin functions available in DeepSleep mode are also available in Active mode.
20.Refer to Table 14-1 for more information on pin multiplexer abbreviations used.
21.For any function marked with an identifier (n), the AC timing is only guaranteed within the respective group "n".
Table 11-1 Pin selector and alternate pin functions in DeepSleep (DS) mode, Analog, Smart I/O (continued)[20, 21]
P4.5 A7 NA NA GPIO_STD
P4.6 B7 NA NA GPIO_STD
P5.0 A5 A6 29 GPIO_STD
P5.1 B5 B6 30 GPIO_STD
P5.2 C5 C6 31 GPIO_STD
P5.3 A4 D6 32 GPIO_STD
P5.4 B4 C5 33 GPIO_STD
P5.5 C4 D5 34 GPIO_STD
P6.0 A3 B4 35 GPIO_STD ADC[0]_0
P6.1 B3 C4 36 GPIO_STD ADC[0]_1
P6.2 A2 A3 37 GPIO_STD ADC[0]_2
P6.3 B1 B3 38 GPIO_STD ADC[0]_3
P6.4 B2 C3 39 GPIO_STD ADC[0]_4
P6.5 C1 A2 40 GPIO_STD ADC[0]_5
002-21617 Rev. *M
Notes
2024-01-25
22.I/O pins that support an oscillator function (WCO or ECO) must be configured for high-impedance if the oscillator is enabled.
23.This I/O has increased leakage to ground when the VDDD supply is below the POR threshold.
Table 11-1 Pin selector and alternate pin functions in DeepSleep (DS) mode, Analog, Smart I/O (continued)[20, 21]
P31.1 F7 B5 NA GPIO_STD
P31.2 E6 A4 NA GPIO_STD
P32.0 D2 C1 NA GPIO_STD ADC[0]_8
P32.1 D3 C2 NA GPIO_STD ADC[0]_9
P32.2 E5 D1 NA GPIO_STD ADC[0]_10
P32.3 E1 D2 NA GPIO_STD ADC[0]_11
P32.4 E2 D3 NA GPIO_STD ADC[0]_12
P32.5 E3 D4 NA GPIO_STD ADC[0]_13
P32.6 F3 E3 NA GPIO_STD ADC[0]_14
P32.7 F5 E4 NA GPIO_STD ADC[0]_15
P33.0 W18 NA NA HSIO_STD
P33.1 V17 NA NA HSIO_STD
P33.2 W19 NA NA HSIO_STD
P33.3 V18 NA NA HSIO_STD
002-21617 Rev. *M
[24]
VCCD F6, F15, R6, R15 F6, F13, N6, N13 46, 47, 111, 112, 113, 156 Main regulated supply. Driven by LDO regulator (either internal LDO or external
LDO/PMIC)
VREFH M6 K6 79 High reference voltage for SAR ADCs
VREFL M8 K8 76 Low reference voltage for SAR ADCs
VDDA N6 L6 78 Main analog supply for SAR ADCs
VSSA N8 L8 77 Main analog ground
Note
002-21617 Rev. *M
24.The VCCD pins must be connected together to ensure a low-impedance connection. (see the requirement in Figure 27-2)
2024-01-25
13 Alternate function pin assignments
Name ACT #0[26] ACT #1 ACT #2 ACT #3 ACT #4 ACT #5 ACT #6 ACT #7 ACT #8 ACT #9 ACT #10 ACT #11 ACT #12 ACT #13 ACT #14 ACT #15
P0.0 PWM1_18 PWM1_22_N TC1_18_TR0 TC1_22_TR1 SCB0_RX (0) SCB7_SDA (2) LIN1_RX PWM0_H_0
P0.1 PWM1_17 PWM1_18_N TC1_17_TR0 TC1_18_TR1 SCB0_TX (0) SCB7_SCL (2) LIN1_TX PWM0_H_0_N
P0.2 PWM1_14 PWM1_17_N TC1_14_TR0 TC1_17_TR1 SCB0_RTS (0) SCB4_MISO (2) LIN1_EN CAN0_1_TX TC0_H_0_TR0
P0.3 PWM1_13 PWM1_14_N TC1_13_TR0 TC1_14_TR1 SCB0_CTS (0) SCB4_MOSI (2) CAN0_1_RX TC0_H_0_TR1
P1.4 PWM1_71 PWM1_70_N TC1_71_TR0 TC1_70_TR1 SCB8_RX (1) SCB8_MISO (1) LIN8_RX
P2.0 PWM1_7 PWM1_8_N TC1_7_TR0 TC1_8_TR1 TC1_H_4_TR0 SCB7_RX (0) SCB7_MISO (0) LIN0_RX CAN0_0_TX TRIG_IN[2]
P2.1 PWM1_6 PWM1_7_N TC1_6_TR0 TC1_7_TR1 TC1_H_5_TR0 SCB7_TX (0) SCB7_SDA (0) SCB7_MOSI (0) LIN0_TX CAN0_0_RX TRIG_IN[3]
P2.2 PWM1_5 PWM1_6_N TC1_5_TR0 TC1_6_TR1 TC1_H_6_TR0 SCB7_RTS (0) SCB7_SCL (0) SCB7_CLK (0) LIN0_EN ETH0_RX_ER (0) TRIG_IN[4]
P2.3 PWM1_4 PWM1_5_N TC1_4_TR0 TC1_5_TR1 TC1_H_7_TR0 SCB7_CTS (0) SCB7_SEL0 (0) LIN5_RX ETH0_ETH_TSU_- TRIG_IN[5]
TIMER_CMP_VAL
(0)
P2.4 PWM1_3 PWM1_4_N TC1_3_TR0 TC1_4_TR1 PWM1_H_4_N SCB7_SEL1 (0) LIN5_TX TRIG_IN[6]
P2.5 PWM1_2 PWM1_3_N TC1_2_TR0 TC1_3_TR1 PWM1_H_5_N SCB7_SEL2 (0) LIN5_EN TRIG_IN[7]
P3.0 PWM1_1 PWM1_2_N TC1_1_TR0 TC1_2_TR1 PWM1_H_6_N SCB6_RX (0) SCB6_MISO (0) CAN0_3_TX ETH0_MDIO (0) TRIG_DBG
[0]
P3.1 PWM1_0 PWM1_1_N TC1_0_TR0 TC1_1_TR1 PWM1_H_7_N SCB6_TX (0) SCB6_SDA (0) SCB6_MOSI (0) CAN0_3_RX ETH0_MDC (0) TRIG_DBG
[1]
P3.2 PWM1_M_3 PWM1_0_N TC1_M_3_TR0 TC1_0_TR1 TC1_H_4_TR1 SCB6_RTS (0) SCB6_SCL (0) SCB6_CLK (0)
P3.3 PWM1_M_2 PWM1_M_3_N TC1_M_2_TR0 TC1_M_3_TR1 TC1_H_5_TR1 SCB6_CTS (0) SCB6_SEL0 (0)
Notes
2024-01-25
25.High Speed I/O matrix connection (HCon) reference as per Table 10-1.
26.Active Mode ordering (ACT #0, ACT #1, and so on) does not have any impact on configuring alternate functions; the HSIOM module handles the alternate function assignments.
27.Refer to Table 14-1 for more information on pin multiplexer abbreviations used.
28.For any function marked with an identifier (n), the AC timing is only guaranteed within the respective group "n".
Table 13-1 Alternate pin functions in Active mode (continued)[19, 27, 28]
Name ACT #0[26] ACT #1 ACT #2 ACT #3 ACT #4 ACT #5 ACT #6 ACT #7 ACT #8 ACT #9 ACT #10 ACT #11 ACT #12 ACT #13 ACT #14 ACT #15
P4.0 PWM1_4 PWM1_M_0_N TC1_4_TR0 TC1_M_0_TR1 EXT_MUX[0]_0 SCB5_RX (0) SCB5_MISO (0) LIN1_RX TRIG_IN[10]
P4.1 PWM1_5 PWM1_4_N TC1_5_TR0 TC1_4_TR1 EXT_MUX[0]_1 SCB5_TX (0) SCB5_SDA (0) SCB5_MOSI (0) LIN1_TX TRIG_IN[11]
P4.2 PWM1_6 PWM1_5_N TC1_6_TR0 TC1_5_TR1 EXT_MUX[0]_2 SCB5_RTS (0) SCB5_SCL (0) SCB5_CLK (0) LIN1_EN TRIG_IN[12]
P4.3 PWM1_7 PWM1_6_N TC1_7_TR0 TC1_6_TR1 EXT_MUX[0]_EN SCB5_CTS (0) SCB5_SEL0 (0) CAN0_1_TX TRIG_IN[13]
P5.0 PWM1_9 PWM1_8_N TC1_9_TR0 TC1_8_TR1 PWM1_H_10 LIN15_TX SCB5_SEL2 (0) LIN7_RX PWM0_M_0 TRIG_IN[38]
P5.1 PWM1_10 PWM1_9_N TC1_10_TR0 TC1_9_TR1 PWM1_H_10_N SCB9_SEL3 (1) LIN7_TX PWM0_M_0_N TRIG_IN[39]
P6.0 PWM1_M_0 PWM1_14_N TC1_M_0_TR0 TC1_14_TR1 TC1_H_11_TR0 SCB4_RX (0) SCB4_MISO (0) LIN3_RX PWM0_0 LIN9_EN
P6.1 PWM1_0 PWM1_M_0_N TC1_0_TR0 TC1_M_0_TR1 TC1_H_11_TR1 SCB4_TX (0) SCB4_SDA (0) SCB4_MOSI (0) LIN3_TX
P6.2 PWM1_M_1 PWM1_0_N TC1_M_1_TR0 TC1_0_TR1 PWM1_H_12 SCB4_RTS (0) SCB4_SCL (0) SCB4_CLK (0) LIN3_EN CAN0_2_TX PWM0_0_N SDHC_CARD_-
MECH_WRITE_PROT
(0)
P6.3 PWM1_1 PWM1_M_1_N TC1_1_TR0 TC1_M_1_TR1 PWM1_H_12_N SCB4_CTS (0) SCB4_SEL0 (0) LIN4_RX CAN0_2_RX SPIHB_CL SDHC_CARD_CMD (0) CAL_SUP_
K (0) NZ
P6.4 PWM1_M_2 PWM1_1_N TC1_M_2_TR0 TC1_1_TR1 TC1_H_12_TR0 SCB4_SEL1 (0) LIN4_TX TC0_0_TR0 SPIHB_R SDHC_CLK_CARD (0)
WDS (0)
P6.5 PWM1_2 PWM1_M_2_N TC1_2_TR0 TC1_M_2_TR1 TC1_H_12_TR1 SCB4_SEL2 (0) LIN4_EN TC0_0_TR1 SPIHB_SE SDHC_CARD_DE-
L0 (0) TECT_N (0)
P7.0 PWM1_M_4 PWM1_3_N TC1_M_4_TR0 TC1_3_TR1 SCB5_RX (1) SCB5_MISO (1) LIN4_RX PWM0_1 SPIHB_SE SDHC_CARD_IF_P-
L1 (0) WR_EN (0)
002-21617 Rev. *M
P7.1 PWM1_15 PWM1_M_4_N TC1_15_TR0 TC1_M_4_TR1 SCB5_TX (1) SCB5_SDA (1) SCB5_MOSI (1) LIN4_TX SPIHB_- SDHC_CARD_DAT_3-
DATA0 (0) TO0_0 (0)
P7.2 PWM1_M_5 PWM1_15_N TC1_M_5_TR0 TC1_15_TR1 SCB5_RTS (1) SCB5_SCL (1) SCB5_CLK (1) LIN4_EN PWM0_1_N SPIHB_- SDHC_CARD_DAT_3-
2024-01-25
P7.3 PWM1_16 PWM1_M_5_N TC1_16_TR0 TC1_M_5_TR1 SCB5_CTS (1) SCB5_SEL0 (1) CAN0_4_TX TC0_1_TR0 SPIHB_- SDHC_CARD_DAT_3-
DATA2 (0) TO0_2 (0)
Table 13-1 Alternate pin functions in Active mode (continued)[19, 27, 28]
Name ACT #0[26] ACT #1 ACT #2 ACT #3 ACT #4 ACT #5 ACT #6 ACT #7 ACT #8 ACT #9 ACT #10 ACT #11 ACT #12 ACT #13 ACT #14 ACT #15
P7.4 PWM1_M_6 PWM1_16_N TC1_M_6_TR0 TC1_16_TR1 SCB5_SEL1 (1) CAN0_4_RX TC0_1_TR1 SPIHB_- SDHC_CARD_DAT_3-
DATA3 (0) TO0_3 (0)
P7.5 PWM1_17 PWM1_M_6_N TC1_17_TR0 TC1_M_6_TR1 LIN10_RX SCB5_SEL2 (1) PWM0_H_2 SPIHB_- SDHC_CARD_DAT_7-
DATA4 (0) TO4_0 (0)
P8.0 PWM1_19 PWM1_18_N TC1_19_TR0 TC1_18_TR1 PWM1_H_8 LIN2_RX CAN0_0_TX PWM0_H_2_N SPIHB_- SDHC_CARD_DAT_7-
DATA5 (0) TO4_1 (0)
P8.1 PWM1_20 PWM1_19_N TC1_20_TR0 TC1_19_TR1 PWM1_H_8_N LIN2_TX CAN0_0_RX TC0_H_2_TR0 SPIHB_- SDHC_CARD_DAT_7- TRIG_IN[14]
DATA6 (0) TO4_2 (0)
P8.2 PWM1_21 PWM1_20_N TC1_21_TR0 TC1_20_TR1 TC1_H_8_TR0 LIN2_EN TC0_H_2_TR1 SPIHB_- SDHC_CARD_DAT_7- TRIG_IN[15]
DATA7 (0) TO4_3 (0)
P10.0 PWM1_28 PWM1_27_N TC1_28_TR0 TC1_27_TR1 PWM1_H_10 SCB4_RX (1) SCB4_MISO (1) LIN7_RX TRIG_IN[18]
P10.1 PWM1_29 PWM1_28_N TC1_29_TR0 TC1_28_TR1 PWM1_H_10_N SCB4_TX (1) SCB4_SDA (1) SCB4_MOSI (1) LIN7_TX TRIG_IN[19]
P10.2 PWM1_30 PWM1_29_N TC1_30_TR0 TC1_29_TR1 TC1_H_10_TR0 SCB4_RTS (1) SCB4_SCL (1) SCB4_CLK (1) LIN8_RX FLEXRAY_R
XDA
P10.3 PWM1_31 PWM1_30_N TC1_31_TR0 TC1_30_TR1 TC1_H_10_TR1 SCB4_CTS (1) SCB4_SEL0 (1) LIN8_TX FLEXRAY_T
XDA
P10.4 PWM1_32 PWM1_31_N TC1_32_TR0 TC1_31_TR1 PWM1_H_11 SCB4_SEL1 (1) LIN8_EN FLEXRAY_T
XENA_N
P10.5 PWM1_33 PWM1_32_N TC1_33_TR0 TC1_32_TR1 PWM1_H_11_N SCB4_SEL2 (1) LIN13_RX FLEXRAY_R
XDB
P12.0 PWM1_36 TC1_36_TR0 SCB8_RX (0) TC1_35_TR1 SCB8_MISO (0) CAN0_2_TX PWM0_H_1 PWM1_35 AUDIOSS0_TX_SDO TRIG_IN[20]
_N
2024-01-25
P12.1 PWM1_37 PWM1_36_N TC1_37_TR0 TC1_36_TR1 SCB8_TX (0) SCB8_SDA (0) SCB8_MOSI (0) LIN6_EN CAN0_2_RX PWM0_H_1_N AUDIOSS0_- TRIG_IN[21]
CLK_I2S_IF
P12.2 PWM1_38 PWM1_37_N TC1_38_TR0 TC1_37_TR1 EXT_MUX[1]_EN SCB8_RTS (0) SCB8_SCL (0) SCB8_CLK (0) LIN6_RX TC0_H_1_TR0 AUDIOSS0_RX_SCK
Table 13-1 Alternate pin functions in Active mode (continued)[19, 27, 28]
Name ACT #0[26] ACT #1 ACT #2 ACT #3 ACT #4 ACT #5 ACT #6 ACT #7 ACT #8 ACT #9 ACT #10 ACT #11 ACT #12 ACT #13 ACT #14 ACT #15
P12.3 PWM1_39 PWM1_38_N TC1_39_TR0 TC1_38_TR1 EXT_MUX[1]_0 SCB8_CTS (0) SCB8_SEL0 (0) LIN6_TX TC0_H_1_TR1 AUDIOSS0_RX_WS
P12.4 PWM1_40 PWM1_39_N TC1_40_TR0 TC1_39_TR1 EXT_MUX[1]_1 SCB8_SEL1 (0) CAN1_1_TX TC0_2_TR1 AUDIOSS0_RX_SDI
P13.0 PWM1_M_8 PWM1_43_N TC1_M_8_TR0 TC1_43_TR1 EXT_MUX[2]_0 SCB3_RX (0) LIN3_RX SCB3_MISO (0) TC0_2_TR0 AUDIOSS1_MCLK
P13.1 PWM1_44 PWM1_M_8_N TC1_44_TR0 TC1_M_8_TR1 EXT_MUX[2]_1 SCB3_TX (0) SCB3_SDA (0) LIN3_TX SCB3_MOSI (0) PWM0_2_N AUDIOSS1_TX_SCK
P13.2 PWM1_M_9 PWM1_44_N TC1_M_9_TR0 TC1_44_TR1 EXT_MUX[2]_2 SCB3_RTS (0) SCB3_SCL (0) LIN3_EN SCB3_CLK (0) PWM0_2 AUDIOSS1_TX_WS
P13.3 PWM1_45 PWM1_M_9_N TC1_45_TR0 TC1_M_9_TR1 EXT_MUX[2]_EN SCB3_CTS (0) LIN2_RX SCB3_SEL0 (0) AUDIOSS1_TX_SDO
P13.4 PWM1_M_1 PWM1_45_N TC1_M_10_TR0 TC1_45_TR1 PWM1_H_4 LIN2_TX SCB3_SEL1 (0) LIN8_RX AUDIOSS1_-
0 CLK_I2S_IF
P13.5 PWM1_46 PWM1_M_10_ TC1_46_TR0 TC1_M_10_TR PWM1_H_4_N SCB3_SEL2 (0) LIN8_TX AUDIOSS1_RX_SCK
N 1
P13.6 PWM1_M_1 PWM1_46_N TC1_M_11_TR0 TC1_46_TR1 PWM1_H_5 SCB3_SEL3 (0) LIN8_EN AUDIOSS1_RX_WS TRIG_IN[22]
1
47
P14.0 PWM1_48 PWM1_47_N TC1_48_TR0 TC1_47_TR1 PWM1_H_6 SCB2_MISO (0) SCB2_RX (0) CAN1_0_TX PWM0_M_1 AUDIOSS2_MCLK
P14.1 PWM1_49 PWM1_48_N TC1_49_TR0 TC1_48_TR1 PWM1_H_6_N SCB2_MOSI (0) SCB2_SDA (0) SCB2_TX (0) CAN1_0_RX PWM0_M_1_N AUDIOSS2_TX_SCK
P14.2 PWM1_50 PWM1_49_N TC1_50_TR0 TC1_49_TR1 PWM1_H_7 SCB2_CLK (0) SCB2_SCL (0) SCB2_RTS (0) LIN6_RX TC0_M_1_TR0
P14.3 PWM1_51 PWM1_50_N TC1_51_TR0 TC1_50_TR1 PWM1_H_7_N SCB2_SEL0 (0) SCB2_CTS (0) LIN6_TX TC0_M_1_TR1
P14.4 PWM1_52 PWM1_51_N TC1_52_TR0 TC1_51_TR1 TC1_H_4_TR0 SCB2_SEL1 (0) LIN6_EN AUDIOSS2_TX_WS
P14.5 PWM1_53 PWM1_52_N TC1_53_TR0 TC1_52_TR1 TC1_H_4_TR1 SCB2_SEL2 (0) LIN14_RX AUDIOSS2_TX_SDO
P15.0 PWM1_56 PWM1_55_N TC1_56_TR0 TC1_55_TR1 TC1_H_6_TR0 SCB9_RX (0) SCB9_MISO (0) CAN1_3_TX AUDIOSS2_-
CLK_I2S_IF
P15.1 PWM1_57 PWM1_56_N TC1_57_TR0 TC1_56_TR1 TC1_H_6_TR1 SCB9_TX (0) SCB9_SDA (0) SCB9_MOSI (0) CAN1_3_RX AUDIOSS2_RX_SCK
P15.2 PWM1_58 PWM1_57_N TC1_58_TR0 TC1_57_TR1 TC1_H_7_TR0 SCB9_RTS (0) SCB9_SCL (0) SCB9_CLK (0) AUDIOSS2_RX_WS
P15.3 PWM1_59 PWM1_58_N TC1_59_TR0 TC1_58_TR1 TC1_H_7_TR1 SCB9_CTS (0) SCB9_SEL0 (0) AUDIOSS2_RX_SDI
002-21617 Rev. *M
Name ACT #0[26] ACT #1 ACT #2 ACT #3 ACT #4 ACT #5 ACT #6 ACT #7 ACT #8 ACT #9 ACT #10 ACT #11 ACT #12 ACT #13 ACT #14 ACT #15
P17.2 PWM1_59 PWM1_60_N TC1_59_TR0 TC1_60_TR1 SCB3_TX (1) SCB3_SDA (1) LIN11_EN
P17.3 PWM1_58 PWM1_59_N TC1_58_TR0 TC1_59_TR1 PWM1_H_3 SCB3_RTS (1) SCB3_SCL (1) SCB3_CLK (1) TRIG_IN[26]
P17.4 PWM1_57 PWM1_58_N TC1_57_TR0 TC1_58_TR1 PWM1_H_3_N SCB3_CTS (1) SCB3_SEL0 (1) TRIG_IN[27]
P18.0 PWM1_M_6 PWM1_M_5_N TC1_M_6_TR0 TC1_M_5_TR1 PWM1_H_0 SCB1_RX (0) SCB1_MISO (0) LIN12_TX ETH0_REF_CLK FAULT_O
48
(0) UT_0
P18.1 PWM1_M_7 PWM1_M_6_N TC1_M_7_TR0 TC1_M_6_TR1 PWM1_H_0_N SCB1_TX (0) SCB1_SDA (0) SCB1_MOSI (0) SCB3_MISO (1) ETH0_TX_CTL (0) FAULT_O
UT_1
P18.2 PWM1_55 PWM1_M_7_N TC1_55_TR0 TC1_M_7_TR1 PWM1_H_1 SCB1_RTS (0) SCB1_SCL (0) SCB1_CLK (0) SCB3_MOSI (1) ETH0_TX_ER (0)
P18.3 PWM1_54 PWM1_55_N TC1_54_TR0 TC1_55_TR1 PWM1_H_1_N SCB1_CTS (0) SCB1_SEL0 (0) SCB3_CLK (2) ETH0_TX_CLK (0) TRACE_-
CLOCK (0)
P18.4 PWM1_53 PWM1_54_N TC1_53_TR0 TC1_54_TR1 PWM1_H_2 SCB1_SEL1 (0) SCB3_SEL0 (2) PWM0_M_2 ETH0_TXD_0 (0) TRACE_-
DATA_0 (0)
P18.5 PWM1_52 PWM1_53_N TC1_52_TR0 TC1_53_TR1 PWM1_H_2_N SCB1_SEL2 (0) PWM0_M_2_N ETH0_TXD_1 (0) TRACE_-
DATA_1 (0)
P18.6 PWM1_51 PWM1_52_N TC1_51_TR0 TC1_52_TR1 PWM1_H_3 SCB1_SEL3 (0) CAN1_2_TX TC0_M_2_TR0 ETH0_TXD_2 (0) TRACE_-
DATA_2 (0)
P18.7 PWM1_50 PWM1_51_N TC1_50_TR0 TC1_51_TR1 PWM1_H_3_N CAN1_2_RX TC0_M_2_TR1 ETH0_TXD_3 (0) TRACE_-
DATA_3 (0)
P19.0 PWM1_M_3 PWM1_50_N TC1_M_3_TR0 TC1_50_TR1 TC1_H_0_TR0 SCB2_MISO (1) SCB2_RX (1) CAN1_3_TX ETH0_RXD_0 (0) FAULT_O
UT_2
P19.1 PWM1_26 PWM1_M_3_N TC1_26_TR0 TC1_M_3_TR1 TC1_H_0_TR1 SCB2_MOSI (1) SCB2_SDA (1) SCB2_TX (1) CAN1_3_RX ETH0_RXD_1 (0) FAULT_O
UT_3
P19.2 PWM1_27 PWM1_26_N TC1_27_TR0 TC1_26_TR1 TC1_H_1_TR0 SCB2_CLK (1) SCB2_SCL (1) SCB2_RTS (1) ETH0_RXD_2 (0) TRIG_IN[28]
P19.3 PWM1_28 PWM1_27_N TC1_28_TR0 TC1_27_TR1 TC1_H_1_TR1 SCB2_SEL0 (1) SCB2_CTS (1) ETH0_RXD_3 (0) TRIG_IN[29]
Name ACT #0[26] ACT #1 ACT #2 ACT #3 ACT #4 ACT #5 ACT #6 ACT #7 ACT #8 ACT #9 ACT #10 ACT #11 ACT #12 ACT #13 ACT #14 ACT #15
P20.3 PWM1_47 PWM1_48_N TC1_47_TR0 TC1_48_TR1 SCB1_RX (1) SCB1_MISO (1) CAN1_2_TX
P20.4 PWM1_46 PWM1_47_N TC1_46_TR0 TC1_47_TR1 SCB1_TX (1) SCB1_SDA (1) SCB1_MOSI (1) CAN1_2_RX
P20.5 PWM1_45 PWM1_46_N TC1_45_TR0 TC1_46_TR1 SCB1_RTS (1) SCB1_SCL (1) SCB1_CLK (1)
P20.6 PWM1_44 PWM1_45_N TC1_44_TR0 TC1_45_TR1 SCB1_CTS (1) SCB1_SEL0 (1) CAN1_4_TX
P21.5 PWM1_37 PWM1_38_N TC1_37_TR0 TC1_38_TR1 TC1_35_TR1 TC1_34_TR0 LIN0_RX CAN1_1_TX PWM1_34 PWM1_35 ETH0_RX_CTL (0) TRACE_-
_N DATA_0 (1)
P21.7 PWM1_35 PWM1_36_N TC1_35_TR0 TC1_36_TR1 SCB6_RX (1) SCB6_MISO (1) LIN0_EN LIN13_TX CAL_SUP_
NZ
P22.1 PWM1_33 PWM1_34_N TC1_33_TR0 TC1_34_TR1 SCB6_TX (1) SCB6_SDA (1) SCB6_MOSI (1) CAN1_1_RX TRACE_-
DATA_1 (1)
P22.2 PWM1_32 PWM1_33_N TC1_32_TR0 TC1_33_TR1 SCB6_RTS (1) SCB6_SCL (1) SCB6_CLK (1) TRACE_-
DATA_2 (1)
P22.3 PWM1_31 PWM1_32_N TC1_31_TR0 TC1_32_TR1 SCB6_CTS (1) SCB6_SEL0 (1) TRACE_-
DATA_3 (1)
P23.0 PWM1_M_8 PWM1_27_N TC1_M_8_TR0 TC1_27_TR1 TC1_H_8_TR1 SCB7_RX (1) LIN14_TX SCB7_MISO (1) CAN1_0_TX FAULT_O
UT_0
P23.1 PWM1_M_9 PWM1_M_8_N TC1_M_9_TR0 TC1_M_8_TR1 SCB7_TX (1) SCB7_SDA (1) SCB7_MOSI (1) CAN1_0_RX FAULT_O
UT_1
P23.2 PWM1_M_1 PWM1_M_9_N TC1_M_10_TR0 TC1_M_9_TR1 SCB7_RTS (1) SCB7_SCL (1) SCB7_CLK (1) LIN6_RX FAULT_O
0 UT_2
P23.3 PWM1_M_1 PWM1_M_10_ TC1_M_11_TR0 TC1_M_10_TR SCB7_CTS (1) SCB7_SEL0 (1) LIN6_TX ETH0_RX_CLK (0) TRIG_IN[30] FAULT_O
1 N 1 UT_3
002-21617 Rev. *M
P23.4 PWM1_25 PWM1_M_11_ TC1_25_TR0 TC1_M_11_TR PWM1_H_9 SCB2_MISO (2) SCB7_SEL1 (1) TRIG_IN[31] TRIG_DBG
N 1 [0]
P23.5 PWM1_24 PWM1_25_N TC1_24_TR0 TC1_25_TR1 PWM1_H_9_N SCB2_MOSI (2) SCB7_SEL2 (1) LIN9_RX
2024-01-25
Name ACT #0[26] ACT #1 ACT #2 ACT #3 ACT #4 ACT #5 ACT #6 ACT #7 ACT #8 ACT #9 ACT #10 ACT #11 ACT #12 ACT #13 ACT #14 ACT #15
P23.7 PWM1_22 PWM1_23_N TC1_22_TR0 TC1_23_TR1 TC1_H_9_TR1 SCB2_SEL0 (2) EXT_CLK LIN9_EN CAL_SUP_
NZ
P26.0 ETH1_REF
_CLK (0)
P26.1 ETH1_TX_
CTL (0)
P26.2 ETH1_TX_
CLK (0)
P26.3 ETH1_TXD
_0 (0)
P26.4 ETH1_TXD
_1 (0)
P26.5 ETH1_TXD
_2 (0)
P26.6 ETH1_TXD
_3 (0)
002-21617 Rev. *M
P26.7 ETH1_RXD
_0 (0)
P27.0 ETH1_RXD
2024-01-25
_1 (0)
P27.1 ETH1_RXD
_2 (0)
Table 13-1 Alternate pin functions in Active mode (continued)[19, 27, 28]
Name ACT #0[26] ACT #1 ACT #2 ACT #3 ACT #4 ACT #5 ACT #6 ACT #7 ACT #8 ACT #9 ACT #10 ACT #11 ACT #12 ACT #13 ACT #14 ACT #15
P27.2 ETH1_RXD
_3 (0)
P27.3 ETH1_RX_
CTL (0)
P27.4 ETH1_RX_
CLK (0)
P27.5 ETH1_MDI
O (0)
P27.6 ETH1_MD
C (0)
P27.7 ETH1_ETH
_TSU_-
TIMER_C-
MP_VAL
(0)
P28.0 PWM1_63 PWM1_65_N TC1_63_TR0 TC1_65_TR1 PWM1_H_12 SCB10_RX (0) SCB10_MISO (0)
P28.1 PWM1_64 PWM1_63_N TC1_64_TR0 TC1_63_TR1 PWM1_H_12_N SCB10_TX (0) SCB10_SDA (0) SCB10_MOSI (0) LIN17_RX
P28.2 PWM1_65 PWM1_64_N TC1_65_TR0 TC1_64_TR1 TC1_H_12_TR0 SCB10_RTS (0) SCB10_SCL (0) SCB10_CLK (0) LIN17_TX
P28.3 PWM1_66 PWM1_65_N TC1_66_TR0 TC1_65_TR1 TC1_H_12_TR1 SCB10_CTS (0) SCB10_SEL0 (0) LIN17_EN
51
P30.0 PWM1_83 PWM1_83_N TC1_83_TR0 TC1_83_TR1 SCB9_RTS (1) SCB9_SCL (1) SCB9_CLK (1) TRIG_IN[34]
P30.1 PWM1_82 PWM1_83_N TC1_82_TR0 TC1_83_TR1 SCB9_CTS (1) SCB9_SEL0 (1) LIN16_RX TRIG_IN[35]
002-21617 Rev. *M
P30.2 PWM1_81 PWM1_82_N TC1_81_TR0 TC1_82_TR1 SCB9_SEL1 (1) LIN16_TX CAN1_3_TX TRIG_IN[36]
P30.3 PWM1_80 PWM1_81_N TC1_80_TR0 TC1_81_TR1 SCB9_SEL2 (1) LIN16_EN CAN1_3_RX TRIG_IN[37]
2024-01-25
Name ACT #0[26] ACT #1 ACT #2 ACT #3 ACT #4 ACT #5 ACT #6 ACT #7 ACT #8 ACT #9 ACT #10 ACT #11 ACT #12 ACT #13 ACT #14 ACT #15
P32.0 PWM1_76 PWM1_77_N TC1_76_TR0 TC1_77_TR1 SCB10_RX (1) SCB10_MISO (1) TRIG_IN[40]
P32.1 PWM1_75 PWM1_76_N TC1_75_TR0 TC1_76_TR1 SCB10_TX (1) SCB10_SDA (1) SCB10_MOSI (1) TRIG_IN[41]
P32.2 PWM1_74 PWM1_75_N TC1_74_TR0 TC1_75_TR1 SCB10_RTS (1) SCB10_SCL (1) SCB10_CLK (1) LIN18_RX TRIG_IN[42]
P32.3 PWM1_73 PWM1_74_N TC1_73_TR0 TC1_74_TR1 SCB10_CTS (1) SCB10_SEL0 (1) LIN18_TX TRIG_IN[43]
P32.4 PWM1_72 PWM1_73_N TC1_72_TR0 TC1_73_TR1 LIN10_RX SCB10_SEL1 (1) LIN18_EN TRIG_IN[44]
P32.5 PWM1_71 PWM1_72_N TC1_71_TR0 TC1_72_TR1 LIN10_TX SCB10_SEL2 (1) LIN19_RX TRIG_IN[45]
P32.6 PWM1_70 PWM1_71_N TC1_70_TR0 TC1_71_TR1 LIN10_EN SCB10_SEL3 (1) LIN19_TX CAN1_4_TX TRIG_IN[46]
P33.0 ETH0_REF_CLK
(1)
P34.7 ETH0_ETH_TSU_-
TIMER_CMP_VAL
(1)
2024-01-25
TRAVEO™ T2G 32-bit Automotive MCU
Based on Arm® Cortex®-M7 dual
Pin mux descriptions
Note
29.User interrupt cannot be used for CM0+ application, as it is used internally by system calls. Note, this does not impact CM7
application.
17 Trigger multiplexer
Green number in mux means Mux TriggerGroupNr.
[0:31] [1:32]
P-DMA0: PDMA0_TR_OUT[0:142]
[0:15] [33:48]
P-DMA1: PDMA1_TR_OUT[0:64]
[0:7] [49:56]
M-DMA: MDMA_TR_OUT[0:7]
[0:4] [57:61]
[0:16]
[0:4] [62:66] 0 P-DMA0: PDMA0_TR_IN[0:15]
1 [67]
[0:23] [68:91]
HSIOM: HSIOM_IO_INPUT[0:47]
[0:3] [92:95]
CPUSS: FAULT_TR_OUT[0:3]
[0:2] [1:3]
TCPWM[0]16: TCPWM0_16_TR_OUT0[0:2]
[0:2] [4:6]
TCPWM[0]16M: TCPWM0_16M_TR_OUT0[0:2]
[0:2] [7:9]
TCPWM[0]32: TCPWM0_32_TR_OUT0[0:2]
[0:29] [10:39]
TCPWM[1]16: TCPWM1_16_TR_OUT0[0:83]
[0:11] [40:51] [0:16]
TCPWM[1]16M: TCPWM1_16M_TR_OUT0[0:11] 1 P-DMA0: PDMA0_TR_IN[16:31]
[0:12] [52:64]
TCPWM[1]32: TCPWM1_32_TR_OUT0[0:12]
[0:5] [65:70]
PASS: PASS_GEN_TR_OUT[0:5]
[0:1] [71:72]
CPUSS: CTI_TR_OUT[0:1]
[0:3] [73:76]
EVTGEN: EVTGEN_TR_OUT[0:15]
[0:15] [1:16]
[0:31] [17:48]
[0:16]
[30:83] [49:102] 2 P-DMA1: PDMA1_TR_IN[0:15]
[24:47] [103:126]
[0:2] [1:3]
[0:7]
3 M-DMA: MDMA_TR_IN[0:7]
[0:2] [4:6]
FLEXRAY: FLEXRAY_TT_TR_OUT
[0:31] [1:32]
[0:15] [33:48]
[0:7] [49:56]
[0:2] [57:59]
[0:2] [60:62]
[0:2] [63:65]
[0:15] [66:81] [0:11]
4 TCPWM[0]: TCPWM0_ALL_CNT_TR_IN[0:11]
[0:5] [82:87]
[0:6] [88:94]
1 [95]
SMIF: SMIF_TX_TR_OUT
1 [96]
SMIF: SMIF_RX_TR_OUT
AUDIOSS[0]: I2S0_TX_TR_OUT
AUDIOSS[0]: I2S0_RX_TR_OUT [0],[0],...,[2],[2] [97:102]
:
AUDIOSS[2]: I2S2_TX_TR_OUT
AUDIOSS[2]: I2S2_RX_TR_OUT [0:2] [1:3]
[0:2] [4:6]
[0:2] [7:9]
[0:83] [10:93]
[0:11] [94:105]
[0:12] [106:118]
[0:4] [119:123]
CAN[0]: CAN0_DBG_TR_OUT[0:4]
[0:4] [124:128]
CAN[0]: CAN0_FIFO0_TR_OUT[0:4] [0:11]
[0:4] [129:133] 5 TCPWM[1]: TCPWM1_ALL_CNT_TR_IN[0:11]
CAN[0]: CAN0_FIFO1_TR_OUT[0:4]
[0:4] [134:138]
CAN[1]: CAN1_DBG_TR_OUT[0:4]
[0:4] [139:143]
CAN[1]: CAN1_FIFO0_TR_OUT[0:4]
[0:4] [144:148]
CAN[1]: CAN1_FIFO1_TR_OUT[0:4]
[0:4] [149:153]
CAN[0]: CAN0_TT_TR_OUT[0:4]
[0:4] [154:158]
CAN[1]: CAN1_TT_TR_OUT[0:4]
1 [159]
[4:11] [160:167]
[0:15] [1:16]
1 [17]
SCB[0]: SCB_TX_TR_OUT[0]
1 [18]
SCB[0]: SCB_RX_TR_OUT[0]
1 [19]
SCB[0]: SCB_I2C_SCL_TR_OUT[0]
27 [20:46]
(repeat from [1] to [9])
1 [47]
SCB[10]: SCB_TX_TR_OUT[10]
1 [48]
SCB[10]: SCB_RX_TR_OUT[10] [0:28]
1 [49] 6 TCPWM[1]: TCPWM1_ALL_CNT_TR_IN[12:40]
SCB[10]: SCB_I2C_SCL_TR_OUT[10]
1 [50]
FLEXRAY: FLEXRAY_IBUF_TR_OUT
1 [51]
FLEXRAY: FLEXRAY_OBUF_TR_OUT
[0:5] [52:57]
[0:47] [58:105]
[0:1] [106:107]
[0:3] [108:111]
[0:31] [1:32]
[0:11] [33:44]
[0:12] [45:57] [0:11]
7 PASS: PASS_GEN_TR_IN[0:11]
[0:7] [58:65]
[12:14] [66:68]
[0]
HSIOM: HSIOM_IO_OUTPUT[0]
[1]
HSIOM: HSIOM_IO_OUTPUT[1]
[2:3]
CPUSS: CTI_TR_IN[0:1]
[4]
PERI: PERI_DEBUG_FREEZE_TR_IN
[1:5] [5]
TR_GROUP10_OUTPUT[0:4] PASS: PASS_DEBUG_FREEZE_TR_IN
[6:10] [6]
TR_GROUP11_OUTPUT[0:4] 9 SRSS: SRSS_WDT_DEBUG_FREEZE_TR_IN
[11:15] [7]
TR_GROUP12_OUTPUT[0:4] SRSS: SRSS_MCWDT_DEBUG_FREEZE_TR_IN[2]
[8]
SRSS: SRSS_MCWDT_DEBUG_FREEZE_TR_IN[1]
[9]
SRSS: SRSS_MCWDT_DEBUG_FREEZE_TR_IN[0]
[10]
TCPWM[0]: TCPWM0_DEBUG_FREEZE_TR_IN
[11]
TCPWM[1]: TCPWM1_DEBUG_FREEZE_TR_IN
[0:142] [1:143]
[0:10] [144:154]
[0:10] [155:165]
[0:10] [166:176]
[0:4] [177:181]
[0:4] [182:186]
[0:4] [187:191]
[0:4] [192:196] [0:4]
10 TR_GROUP9_INPUT[1:5]
[0:4] [197:201]
[0:4] [202:206]
[0:4] [207:211]
[0:4] [212:216]
[0:1] [217:218]
[0:3] [219:222]
[0:15] [223:238]
[0:12] [1:13]
[0:2] [14:16]
[0:11] [17:28]
[0:2] [29:31]
[0:83] [32:115]
[0:2] [116:118]
1 [119] [0:4]
11 TR_GROUP9_INPUT[6:10]
1 [120]
1 [121]
1 [122]
1 [123]
[0],[0],...,[2],[2] [124:129]
[0:47] [130:177]
[0:64] [1:65]
[0:7] [66:73]
[0:2] [74:76]
TCPWM[0]16: TCPWM0_16_TR_OUT1[0:2]
[0:2] [77:79]
TCPWM[0]16M: TCPWM0_16M_TR_OUT1[0:2]
[0:2] [80:82] [0:4]
TCPWM[0]32: TCPWM0_32_TR_OUT1[0:2] 12 TR_GROUP9_INPUT[11:15]
[0:83] [83:166]
TCPWM[1]16: TCPWM1_16_TR_OUT1[0:84]
[0:11] [167:178]
TCPWM[1]16M: TCPWM1_16M_TR_OUT1[0:11]
[0:12] [179:191]
TCPWM[1]32: TCPWM1_32_TR_OUT1[0:13]
[0:5] [192:197]
Note
31.“x:y” depicts a range starting from ‘x’ through ‘y’.
20 Triggers one-to-one
One-To-One TriggerGroupNr = 0
CAN[0]: CAN0_DBG_TR_OUT[0] P-DMA0: PDMA0_TR_IN[32]
CAN[0]: CAN0_FIFO0_TR_OUT[0] P-DMA0: PDMA0_TR_IN[33]
CAN[0]: CAN0_FIFO1_TR_OUT[0] P-DMA0: PDMA0_TR_IN[34]
CAN[0]: CAN0_DBG_TR_OUT[1] P-DMA0: PDMA0_TR_IN[35]
CAN[0]: CAN0_FIFO0_TR_OUT[1] P-DMA0: PDMA0_TR_IN[36]
CAN[0]: CAN0_FIFO1_TR_OUT[1] P-DMA0: PDMA0_TR_IN[37]
CAN[0]: CAN0_DBG_TR_OUT[2] P-DMA0: PDMA0_TR_IN[38]
CAN[0]: CAN0_FIFO0_TR_OUT[2] P-DMA0: PDMA0_TR_IN[39]
CAN[0]: CAN0_FIFO1_TR_OUT[2] P-DMA0: PDMA0_TR_IN[40]
CAN[0]: CAN0_DBG_TR_OUT[3] P-DMA0: PDMA0_TR_IN[41]
CAN[0]: CAN0_FIFO0_TR_OUT[3] P-DMA0: PDMA0_TR_IN[42]
CAN[0]: CAN0_FIFO1_TR_OUT[3] P-DMA0: PDMA0_TR_IN[43]
CAN[0]: CAN0_DBG_TR_OUT[4] P-DMA0: PDMA0_TR_IN[44]
CAN[0]: CAN0_FIFO0_TR_OUT[4] P-DMA0: PDMA0_TR_IN[45]
CAN[0]: CAN0_FIFO1_TR_OUT[4] P-DMA0: PDMA0_TR_IN[46]
One-To-One TriggerGroupNr = 1
PASS[0]: PASS0_CH_DONE_TO_PDMA0[0:31] P-DMA0: PDMA0_TR_IN[47:78]
PASS[0]: PASS0_CH_DONE_TO_PDMA0[32:63] P-DMA0: PDMA0_TR_IN[79:110]
PASS[0]: PASS0_CH_DONE_TO_PDMA0[64:95] P-DMA0: PDMA0_TR_IN[111:142]
One-To-One TriggerGroupNr = 2
SCB[0]: SCB0_TX_TR_OUT P-DMA1: PDMA1_TR_IN[16]
SCB[0]: SCB0_RX_TR_OUT P-DMA1: PDMA1_TR_IN[17]
… …
… …
SCB[10]: SCB10_TX_TR_OUT P-DMA1: PDMA1_TR_IN[36]
SCB[10]: SCB10_RX_TR_OUT P-DMA1: PDMA1_TR_IN[37]
One-To-One TriggerGroupNr = 3
SMIF: SMIF_TX_TR_OUT P-DMA1: PDMA1_TR_IN[53]
SMIF: SMIF_RX_TR_OUT P-DMA1: PDMA1_TR_IN[54]
One-To-One TriggerGroupNr = 4
CAN[1]: CAN1_DBG_TR_OUT[0] P-DMA1: PDMA1_TR_IN[38]
CAN[1]: CAN1_FIFO0_TR_OUT[0] P-DMA1: PDMA1_TR_IN[39]
CAN[1]: CAN1_FIFO1_TR_OUT[0] P-DMA1: PDMA1_TR_IN[40]
CAN[1]: CAN1_DBG_TR_OUT[1] P-DMA1: PDMA1_TR_IN[41]
CAN[1]: CAN1_FIFO0_TR_OUT[1] P-DMA1: PDMA1_TR_IN[42]
CAN[1]: CAN1_FIFO1_TR_OUT[1] P-DMA1: PDMA1_TR_IN[43]
CAN[1]: CAN1_DBG_TR_OUT[2] P-DMA1: PDMA1_TR_IN[44]
CAN[1]: CAN1_FIFO0_TR_OUT[2] P-DMA1: PDMA1_TR_IN[45]
CAN[1]: CAN1_FIFO1_TR_OUT[2] P-DMA1: PDMA1_TR_IN[46]
CAN[1]: CAN1_DBG_TR_OUT[3] P-DMA1: PDMA1_TR_IN[47]
CAN[1]: CAN1_FIFO0_TR_OUT[3] P-DMA1: PDMA1_TR_IN[48]
CAN[1]: CAN1_FIFO1_TR_OUT[3] P-DMA1: PDMA1_TR_IN[49]
CAN[1]: CAN1_DBG_TR_OUT[4] P-DMA1: PDMA1_TR_IN[50]
CAN[1]: CAN1_FIFO0_TR_OUT[4] P-DMA1: PDMA1_TR_IN[51]
CAN[1]: CAN1_FIFO1_TR_OUT[4] P-DMA1: PDMA1_TR_IN[52]
One-To-One TriggerGroupNr = 5
AUDIO: AUDIO0_TX_TR_OUT P-DMA1: PDMA1_TR_IN[55]
AUDIO: AUDIO0_RX_TR_OUT P-DMA1: PDMA1_TR_IN[56]
AUDIO: AUDIO1_TX_TR_OUT P-DMA1: PDMA1_TR_IN[57]
AUDIO: AUDIO1_RX_TR_OUT P-DMA1: PDMA1_TR_IN[58]
AUDIO: AUDIO2_TX_TR_OUT P-DMA1: PDMA1_TR_IN[59]
AUDIO: AUDIO2_RX_TR_OUT P-DMA1: PDMA1_TR_IN[60]
One-To-One TriggerGroupNr = 6
PASS[0]: PASS0_CH_RANGEVIO_TR_OUT[0:3] TCPWM[1]16M: TCPWM1_16M_ONE_CNT_TR_IN[0,3,6,9]
PASS[0]: PASS0_CH_RANGEVIO_TR_OUT[4:31] TCPWM[1]16: TCPWM1_16_ONE_CNT_TR_IN[0:27]
PASS[0]: PASS0_CH_RANGEVIO_TR_OUT[32:35] TCPWM[1]16M: TCPWM1_16M_ONE_CNT_TR_IN[1,4,7,10]
PASS[0]: PASS0_CH_RANGEVIO_TR_OUT[36:63] TCPWM[1]16: TCPWM1_16_ONE_CNT_TR_IN[28:55]
PASS[0]: PASS0_CH_RANGEVIO_TR_OUT[64:67] TCPWM[1]16M: TCPWM1_16M_ONE_CNT_TR_IN[2,5,8,11]
PASS[0]: PASS0_CH_RANGEVIO_TR_OUT[68:95] TCPWM[1]16: TCPWM1_16_ONE_CNT_TR_IN[56:83]
One-To-One TriggerGroupNr = 7
TCPWM[1]16M: TCPWM1_16M_TR_OUT1[0,3,6,9] PASS[0]: PASS0_CH_TR_IN[0..3]
TCPWM[1]16: TCPWM1_16_TR_OUT1[0:27] PASS[0]: PASS0_CH_TR_IN[4:31]
TCPWM[1]16M: TCPWM1_16M_TR_OUT1[1,4,7,10] PASS[0]: PASS0_CH_TR_IN[32:35]
TCPWM[1]16: TCPWM1_16_TR_OUT1[28:55] PASS[0]: PASS0_CH_TR_IN[36:63]
TCPWM[1]16M: TCPWM1_16M_TR_OUT1[2,5,8,11] PASS[0]: PASS0_CH_TR_IN[64:67]
TCPWM[1]16: TCPWM1_16_TR_OUT1[56:83] PASS[0]: PASS0_CH_TR_IN[68:95]
One-To-One TriggerGroupNr = 8
One-To-One TriggerGroupNr = 9
P-DMA0: PDMA0_TR_OUT[32] CAN[0]: CAN0_DBG_TR_ACK[0]
P-DMA0: PDMA0_TR_OUT[35] CAN[0]: CAN0_DBG_TR_ACK[1]
P-DMA0: PDMA0_TR_OUT[38] CAN[0]: CAN0_DBG_TR_ACK[2]
P-DMA0: PDMA0_TR_OUT[41] CAN[0]: CAN0_DBG_TR_ACK[3]
P-DMA0: PDMA0_TR_OUT[44] CAN[0]: CAN0_DBG_TR_ACK[4]
One-To-One TriggerGroupNr = 10
TCPWM[1]16: TCPWM1_16_TR_OUT0[0:19] LIN[0]: LIN0_CMD_TR_IN[0:19]
One-To-One TriggerGroupNr = 11
FLEXRAY: FLEXRAY_IBF_TR_OUT P-DMA1: PDMA1_TR_IN[61]
FLEXRAY: FLEXRAY_OBF_TR_OUT P-DMA1: PDMA1_TR_IN[62]
One-To-One TriggerGroupNr = 12
P-DMA1: PDMA1_TR_OUT[61] P-DMA1: PDMA1_TR_IN[63]
P-DMA1: PDMA1_TR_OUT[62] P-DMA1: PDMA1_TR_IN[64]
One-To-One TriggerGroupNr = 13
P-DMA1: PDMA1_TR_OUT[63] FLEXRAY: FLEXRAY_IBF_TR_IN
P-DMA1: PDMA1_TR_OUT[64] FLEXRAY: FLEXRAY_OBF_TR_IN
Note
32.The diagram shows only the TRIG_LABEL; the final trigger formation is based on the formula TRIG_{PREFIX(IN_1TO1/OUT_1-
TO1)}_{x}_{TRIG_LABEL} and the information provided in Table 20-1 on page 77.
0 PASS0_CH_RANGEVIO_TR_OUT[0] TCPWM1_16M_ONE_CNT_TR_IN[0] SAR0 ch#0[33], range violation to TCPWM1 Group #1 Counter #00 trig = 4
1 PASS0_CH_RANGEVIO_TR_OUT[1] TCPWM1_16M_ONE_CNT_TR_IN[3] SAR0 ch#1, range violation to TCPWM1 Group #1 Counter #03 trig = 4
2 PASS0_CH_RANGEVIO_TR_OUT[2] TCPWM1_16M_ONE_CNT_TR_IN[6] SAR0 ch#2, range violation to TCPWM1 Group #1 Counter #06 trig = 4
3 PASS0_CH_RANGEVIO_TR_OUT[3] TCPWM1_16M_ONE_CNT_TR_IN[9] SAR0 ch#3, range violation to TCPWM1 Group #1 Counter #09 trig = 4
4 PASS0_CH_RANGEVIO_TR_OUT[4] TCPWM1_16_ONE_CNT_TR_IN[0] SAR0 ch#4, range violation to TCPWM1 Group #0 Counter #00 trig = 4
5 PASS0_CH_RANGEVIO_TR_OUT[5] TCPWM1_16_ONE_CNT_TR_IN[1] SAR0 ch#5, range violation to TCPWM1 Group #0 Counter #01 trig = 4
6 PASS0_CH_RANGEVIO_TR_OUT[6] TCPWM1_16_ONE_CNT_TR_IN[2] SAR0 ch#6, range violation to TCPWM1 Group #0 Counter #02 trig = 4
7 PASS0_CH_RANGEVIO_TR_OUT[7] TCPWM1_16_ONE_CNT_TR_IN[3] SAR0 ch#7, range violation to TCPWM1 Group #0 Counter #03 trig = 4
8 PASS0_CH_RANGEVIO_TR_OUT[8] TCPWM1_16_ONE_CNT_TR_IN[4] SAR0 ch#8, range violation to TCPWM1 Group #0 Counter #04 trig = 4
9 PASS0_CH_RANGEVIO_TR_OUT[9] TCPWM1_16_ONE_CNT_TR_IN[5] SAR0 ch#9, range violation to TCPWM1 Group #0 Counter #05 trig = 4
10 PASS0_CH_RANGEVIO_TR_OUT[10] TCPWM1_16_ONE_CNT_TR_IN[6] SAR0 ch#10, range violation to TCPWM1 Group #0 Counter #06 trig = 4
11 PASS0_CH_RANGEVIO_TR_OUT[11] TCPWM1_16_ONE_CNT_TR_IN[7] SAR0 ch#11, range violation to TCPWM1 Group #0 Counter #07 trig = 4
12 PASS0_CH_RANGEVIO_TR_OUT[12] TCPWM1_16_ONE_CNT_TR_IN[8] SAR0 ch#12, range violation to TCPWM1 Group #0 Counter #08 trig = 4
13 PASS0_CH_RANGEVIO_TR_OUT[13] TCPWM1_16_ONE_CNT_TR_IN[9] SAR0 ch#13, range violation to TCPWM1 Group #0 Counter #09 trig = 4
14 PASS0_CH_RANGEVIO_TR_OUT[14] TCPWM1_16_ONE_CNT_TR_IN[10] SAR0 ch#14, range violation to TCPWM1 Group #0 Counter #10 trig = 4
Note
33.Each logical channel of SAR ADC[x] can be connected to any of the SAR ADC[x]_y external pin. (x = 0, or 1, or, 2 and y=0 to max 31)
16 PASS0_CH_RANGEVIO_TR_OUT[16] TCPWM1_16_ONE_CNT_TR_IN[12] SAR0 ch#16, range violation to TCPWM1 Group #0 Counter #12 trig = 4
17 PASS0_CH_RANGEVIO_TR_OUT[17] TCPWM1_16_ONE_CNT_TR_IN[13] SAR0 ch#17, range violation to TCPWM1 Group #0 Counter #13 trig = 4
18 PASS0_CH_RANGEVIO_TR_OUT[18] TCPWM1_16_ONE_CNT_TR_IN[14] SAR0 ch#18, range violation to TCPWM1 Group #0 Counter #14 trig = 4
19 PASS0_CH_RANGEVIO_TR_OUT[19] TCPWM1_16_ONE_CNT_TR_IN[15] SAR0 ch#19, range violation to TCPWM1 Group #0 Counter #15 trig = 4
20 PASS0_CH_RANGEVIO_TR_OUT[20] TCPWM1_16_ONE_CNT_TR_IN[16] SAR0 ch#20, range violation to TCPWM1 Group #0 Counter #16 trig = 4
21 PASS0_CH_RANGEVIO_TR_OUT[21] TCPWM1_16_ONE_CNT_TR_IN[17] SAR0 ch#21, range violation to TCPWM1 Group #0 Counter #17 trig = 4
22 PASS0_CH_RANGEVIO_TR_OUT[22] TCPWM1_16_ONE_CNT_TR_IN[18] SAR0 ch#22, range violation to TCPWM1 Group #0 Counter #18 trig = 4
23 PASS0_CH_RANGEVIO_TR_OUT[23] TCPWM1_16_ONE_CNT_TR_IN[19] SAR0 ch#23, range violation to TCPWM1 Group #0 Counter #19 trig = 4
24 PASS0_CH_RANGEVIO_TR_OUT[24] TCPWM1_16_ONE_CNT_TR_IN[20] SAR0 ch#24, range violation to TCPWM1 Group #0 Counter #20 trig = 4
25 PASS0_CH_RANGEVIO_TR_OUT[25] TCPWM1_16_ONE_CNT_TR_IN[21] SAR0 ch#25, range violation to TCPWM1 Group #0 Counter #21 trig = 4
26 PASS0_CH_RANGEVIO_TR_OUT[26] TCPWM1_16_ONE_CNT_TR_IN[22] SAR0 ch#26, range violation to TCPWM1 Group #0 Counter #22 trig = 4
27 PASS0_CH_RANGEVIO_TR_OUT[27] TCPWM1_16_ONE_CNT_TR_IN[23] SAR0 ch#27, range violation to TCPWM1 Group #0 Counter #23 trig = 4
28 PASS0_CH_RANGEVIO_TR_OUT[28] TCPWM1_16_ONE_CNT_TR_IN[24] SAR0 ch#28, range violation to TCPWM1 Group #0 Counter #24 trig = 4
29 PASS0_CH_RANGEVIO_TR_OUT[29] TCPWM1_16_ONE_CNT_TR_IN[25] SAR0 ch#29, range violation to TCPWM1 Group #0 Counter #25 trig = 4
30 PASS0_CH_RANGEVIO_TR_OUT[30] TCPWM1_16_ONE_CNT_TR_IN[26] SAR0 ch#30, range violation to TCPWM1 Group #0 Counter #26 trig = 4
31 PASS0_CH_RANGEVIO_TR_OUT[31] TCPWM1_16_ONE_CNT_TR_IN[27] SAR0 ch#31, range violation to TCPWM1 Group #0 Counter #27 trig = 4
32 PASS0_CH_RANGEVIO_TR_OUT[32] TCPWM1_16M_ONE_CNT_TR_IN[1] SAR1 ch#0, range violation to TCPWM1 Group #1 Counter #01 trig = 4
33 PASS0_CH_RANGEVIO_TR_OUT[33] TCPWM1_16M_ONE_CNT_TR_IN[4] SAR1 ch#1, range violation to TCPWM1 Group #1 Counter #04 trig = 4
34 PASS0_CH_RANGEVIO_TR_OUT[34] TCPWM1_16M_ONE_CNT_TR_IN[7] SAR1 ch#2, range violation to TCPWM1 Group #1 Counter #07 trig = 4
35 PASS0_CH_RANGEVIO_TR_OUT[35] TCPWM1_16M_ONE_CNT_TR_IN[10] SAR1 ch#3, range violation to TCPWM1 Group #1 Counter #10 trig = 4
36 PASS0_CH_RANGEVIO_TR_OUT[36] TCPWM1_16_ONE_CNT_TR_IN[28] SAR1 ch#4, range violation to TCPWM1 Group #0 Counter #28 trig = 4
37 PASS0_CH_RANGEVIO_TR_OUT[37] TCPWM1_16_ONE_CNT_TR_IN[29] SAR1 ch#5, range violation to TCPWM1 Group #0 Counter #29 trig = 4
38 PASS0_CH_RANGEVIO_TR_OUT[38] TCPWM1_16_ONE_CNT_TR_IN[30] SAR1 ch#6, range violation to TCPWM1 Group #0 Counter #30 trig = 4
39 PASS0_CH_RANGEVIO_TR_OUT[39] TCPWM1_16_ONE_CNT_TR_IN[31] SAR1 ch#7, range violation to TCPWM1 Group #0 Counter #31 trig = 4
40 PASS0_CH_RANGEVIO_TR_OUT[40] TCPWM1_16_ONE_CNT_TR_IN[32] SAR1 ch#8, range violation to TCPWM1 Group #0 Counter #32 trig = 4
41 PASS0_CH_RANGEVIO_TR_OUT[41] TCPWM1_16_ONE_CNT_TR_IN[33] SAR1 ch#9, range violation to TCPWM1 Group #0 Counter #33 trig = 4
42 PASS0_CH_RANGEVIO_TR_OUT[42] TCPWM1_16_ONE_CNT_TR_IN[34] SAR1 ch#10, range violation to TCPWM1 Group #0 Counter #34 trig = 4
43 PASS0_CH_RANGEVIO_TR_OUT[43] TCPWM1_16_ONE_CNT_TR_IN[35] SAR1 ch#11, range violation to TCPWM1 Group #0 Counter #35 trig = 4
44 PASS0_CH_RANGEVIO_TR_OUT[44] TCPWM1_16_ONE_CNT_TR_IN[36] SAR1 ch#12, range violation to TCPWM1 Group #0 Counter #36 trig = 4
45 PASS0_CH_RANGEVIO_TR_OUT[45] TCPWM1_16_ONE_CNT_TR_IN[37] SAR1 ch#13, range violation to TCPWM1 Group #0 Counter #37 trig = 4
46 PASS0_CH_RANGEVIO_TR_OUT[46] TCPWM1_16_ONE_CNT_TR_IN[38] SAR1 ch#14, range violation to TCPWM1 Group #0 Counter #38 trig = 4
47 PASS0_CH_RANGEVIO_TR_OUT[47] TCPWM1_16_ONE_CNT_TR_IN[39] SAR1 ch#15, range violation to TCPWM1 Group #0 Counter #39 trig = 4
48 PASS0_CH_RANGEVIO_TR_OUT[48] TCPWM1_16_ONE_CNT_TR_IN[40] SAR1 ch#16, range violation to TCPWM1 Group #0 Counter #40 trig = 4
49 PASS0_CH_RANGEVIO_TR_OUT[49] TCPWM1_16_ONE_CNT_TR_IN[41] SAR1 ch#17, range violation to TCPWM1 Group #0 Counter #41 trig = 4
50 PASS0_CH_RANGEVIO_TR_OUT[50] TCPWM1_16_ONE_CNT_TR_IN[42] SAR1 ch#18, range violation to TCPWM1 Group #0 Counter #42 trig = 4
51 PASS0_CH_RANGEVIO_TR_OUT[51] TCPWM1_16_ONE_CNT_TR_IN[43] SAR1 ch#19, range violation to TCPWM1 Group #0 Counter #43 trig = 4
52 PASS0_CH_RANGEVIO_TR_OUT[52] TCPWM1_16_ONE_CNT_TR_IN[44] SAR1 ch#20, range violation to TCPWM1 Group #0 Counter #44 trig = 4
53 PASS0_CH_RANGEVIO_TR_OUT[53] TCPWM1_16_ONE_CNT_TR_IN[45] SAR1 ch#21, range violation to TCPWM1 Group #0 Counter #45 trig = 4
54 PASS0_CH_RANGEVIO_TR_OUT[54] TCPWM1_16_ONE_CNT_TR_IN[46] SAR1 ch#22, range violation to TCPWM1 Group #0 Counter #46 trig = 4
55 PASS0_CH_RANGEVIO_TR_OUT[55] TCPWM1_16_ONE_CNT_TR_IN[47] SAR1 ch#23, range violation to TCPWM1 Group #0 Counter #47 trig = 4
56 PASS0_CH_RANGEVIO_TR_OUT[56] TCPWM1_16_ONE_CNT_TR_IN[48] SAR1 ch#24, range violation to TCPWM1 Group #0 Counter #48 trig = 4
57 PASS0_CH_RANGEVIO_TR_OUT[57] TCPWM1_16_ONE_CNT_TR_IN[49] SAR1 ch#25, range violation to TCPWM1 Group #0 Counter #49 trig = 4
58 PASS0_CH_RANGEVIO_TR_OUT[58] TCPWM1_16_ONE_CNT_TR_IN[50] SAR1 ch#26, range violation to TCPWM1 Group #0 Counter #50 trig = 4
59 PASS0_CH_RANGEVIO_TR_OUT[59] TCPWM1_16_ONE_CNT_TR_IN[51] SAR1 ch#27, range violation to TCPWM1 Group #0 Counter #51 trig = 4
61 PASS0_CH_RANGEVIO_TR_OUT[61] TCPWM1_16_ONE_CNT_TR_IN[53] SAR1 ch#29, range violation to TCPWM1 Group #0 Counter #53 trig = 4
62 PASS0_CH_RANGEVIO_TR_OUT[62] TCPWM1_16_ONE_CNT_TR_IN[54] SAR1 ch#30, range violation to TCPWM1 Group #0 Counter #54 trig = 4
63 PASS0_CH_RANGEVIO_TR_OUT[63] TCPWM1_16_ONE_CNT_TR_IN[55] SAR1 ch#31, range violation to TCPWM1 Group #0 Counter #55 trig = 4
64 PASS0_CH_RANGEVIO_TR_OUT[64] TCPWM1_16M_ONE_CNT_TR_IN[2] SAR2 ch#0, range violation to TCPWM1 Group #1 Counter #02 trig = 4
65 PASS0_CH_RANGEVIO_TR_OUT[65] TCPWM1_16M_ONE_CNT_TR_IN[5] SAR2 ch#1, range violation to TCPWM1 Group #1 Counter #05 trig = 4
66 PASS0_CH_RANGEVIO_TR_OUT[66] TCPWM1_16M_ONE_CNT_TR_IN[8] SAR2 ch#2, range violation to TCPWM1 Group #1 Counter #08 trig = 4
67 PASS0_CH_RANGEVIO_TR_OUT[67] TCPWM1_16M_ONE_CNT_TR_IN[11] SAR2 ch#3, range violation to TCPWM1 Group #1 Counter #11 trig = 4
68 PASS0_CH_RANGEVIO_TR_OUT[68] TCPWM1_16_ONE_CNT_TR_IN[56] SAR2 ch#4, range violation to TCPWM1 Group #0 Counter #56 trig = 4
69 PASS0_CH_RANGEVIO_TR_OUT[69] TCPWM1_16_ONE_CNT_TR_IN[57] SAR2 ch#5, range violation to TCPWM1 Group #0 Counter #57 trig = 4
70 PASS0_CH_RANGEVIO_TR_OUT[70] TCPWM1_16_ONE_CNT_TR_IN[58] SAR2 ch#6, range violation to TCPWM1 Group #0 Counter #58 trig = 4
71 PASS0_CH_RANGEVIO_TR_OUT[71] TCPWM1_16_ONE_CNT_TR_IN[59] SAR2 ch#7, range violation to TCPWM1 Group #0 Counter #59 trig = 4
72 PASS0_CH_RANGEVIO_TR_OUT[72] TCPWM1_16_ONE_CNT_TR_IN[60] SAR2 ch#8, range violation to TCPWM1 Group #0 Counter #60 trig = 4
73 PASS0_CH_RANGEVIO_TR_OUT[73] TCPWM1_16_ONE_CNT_TR_IN[61] SAR2 ch#9, range violation to TCPWM1 Group #0 Counter #61 trig = 4
74 PASS0_CH_RANGEVIO_TR_OUT[74] TCPWM1_16_ONE_CNT_TR_IN[62] SAR2 ch#10, range violation to TCPWM1 Group #0 Counter #62 trig = 4
75 PASS0_CH_RANGEVIO_TR_OUT[75] TCPWM1_16_ONE_CNT_TR_IN[63] SAR2 ch#11, range violation to TCPWM1 Group #0 Counter #63 trig = 4
76 PASS0_CH_RANGEVIO_TR_OUT[76] TCPWM1_16_ONE_CNT_TR_IN[64] SAR2 ch#12, range violation to TCPWM1 Group #0 Counter #64 trig = 4
77 PASS0_CH_RANGEVIO_TR_OUT[77] TCPWM1_16_ONE_CNT_TR_IN[65] SAR2 ch#13, range violation to TCPWM1 Group #0 Counter #65 trig = 4
78 PASS0_CH_RANGEVIO_TR_OUT[78] TCPWM1_16_ONE_CNT_TR_IN[66] SAR2 ch#14, range violation to TCPWM1 Group #0 Counter #66 trig = 4
79 PASS0_CH_RANGEVIO_TR_OUT[79] TCPWM1_16_ONE_CNT_TR_IN[67] SAR2 ch#15, range violation to TCPWM1 Group #0 Counter #67 trig = 4
80 PASS0_CH_RANGEVIO_TR_OUT[80] TCPWM1_16_ONE_CNT_TR_IN[68] SAR2 ch#16, range violation to TCPWM1 Group #0 Counter #68 trig = 4
81 PASS0_CH_RANGEVIO_TR_OUT[81] TCPWM1_16_ONE_CNT_TR_IN[69] SAR2 ch#17, range violation to TCPWM1 Group #0 Counter #69 trig = 4
82 PASS0_CH_RANGEVIO_TR_OUT[82] TCPWM1_16_ONE_CNT_TR_IN[70] SAR2 ch#18, range violation to TCPWM1 Group #0 Counter #70 trig = 4
83 PASS0_CH_RANGEVIO_TR_OUT[83] TCPWM1_16_ONE_CNT_TR_IN[71] SAR2 ch#19, range violation to TCPWM1 Group #0 Counter #71 trig = 4
84 PASS0_CH_RANGEVIO_TR_OUT[84] TCPWM1_16_ONE_CNT_TR_IN[72] SAR2 ch#20, range violation to TCPWM1 Group #0 Counter #72 trig = 4
85 PASS0_CH_RANGEVIO_TR_OUT[85] TCPWM1_16_ONE_CNT_TR_IN[73] SAR2 ch#21, range violation to TCPWM1 Group #0 Counter #73 trig = 4
86 PASS0_CH_RANGEVIO_TR_OUT[86] TCPWM1_16_ONE_CNT_TR_IN[74] SAR2 ch#22, range violation to TCPWM1 Group #0 Counter #74 trig = 4
87 PASS0_CH_RANGEVIO_TR_OUT[87] TCPWM1_16_ONE_CNT_TR_IN[75] SAR2 ch#23, range violation to TCPWM1 Group #0 Counter #75 trig = 4
88 PASS0_CH_RANGEVIO_TR_OUT[88] TCPWM1_16_ONE_CNT_TR_IN[76] SAR2 ch#24, range violation to TCPWM1 Group #0 Counter #76 trig = 4
89 PASS0_CH_RANGEVIO_TR_OUT[89] TCPWM1_16_ONE_CNT_TR_IN[77] SAR2 ch#25, range violation to TCPWM1 Group #0 Counter #77 trig = 4
90 PASS0_CH_RANGEVIO_TR_OUT[90] TCPWM1_16_ONE_CNT_TR_IN[78] SAR2 ch#26, range violation to TCPWM1 Group #0 Counter #78 trig = 4
91 PASS0_CH_RANGEVIO_TR_OUT[91] TCPWM1_16_ONE_CNT_TR_IN[79] SAR2 ch#27, range violation to TCPWM1 Group #0 Counter #79 trig = 4
92 PASS0_CH_RANGEVIO_TR_OUT[92] TCPWM1_16_ONE_CNT_TR_IN[80] SAR2 ch#28, range violation to TCPWM1 Group #0 Counter #80 trig = 4
93 PASS0_CH_RANGEVIO_TR_OUT[93] TCPWM1_16_ONE_CNT_TR_IN[81] SAR2 ch#29, range violation to TCPWM1 Group #0 Counter #81 trig = 4
94 PASS0_CH_RANGEVIO_TR_OUT[94] TCPWM1_16_ONE_CNT_TR_IN[82] SAR2 ch#30, range violation to TCPWM1 Group #0 Counter #82 trig = 4
95 PASS0_CH_RANGEVIO_TR_OUT[95] TCPWM1_16_ONE_CNT_TR_IN[83] SAR2 ch#31, range violation to TCPWM1 Group #0 Counter #83 trig = 4
4:31 TCPWM1_16_TR_OUT1[0:27] PASS0_CH_TR_IN[4:31] TCPWM1 Group #0 Counter #00 through 27 (PWM1_0 to PWM1_27) to SAR0
ch#4 through SAR0 ch#31
32 TCPWM1_16M_TR_OUT1[1] PASS0_CH_TR_IN[32] TCPWM1 Group #1 Counter #01 (PWM1_M_1) to SAR1 ch#0
36:63 TCPWM1_16_TR_OUT1[28:55] PASS0_CH_TR_IN[36:63] TCPWM1 Group #0 Counter #28 through 55 (PWM1_28 to PWM1_55) to SAR1
ch#4 through SAR1 ch#31
64 TCPWM1_16M_TR_OUT1[2] PASS0_CH_TR_IN[64] TCPWM1 Group #1 Counter #02 (PWM1_M_2) to SAR2 ch#0
68:95 TCPWM1_16_TR_OUT1[56:83] PASS0_CH_TR_IN[68:95] TCPWM1 Group #0 Counter #56 through 83 (PWM1_56 to PWM1_83) to SAR2
ch#4 through SAR2 ch#31
MUX Group 8: Acknowledge triggers from P-DMA1 to CAN1
21 Peripheral clocks
Table 21-1 Peripheral clock assignments
Output Destination Description
CPUSS root clocks (Group 0)
0 PCLK_CPUSS_CLOCK_TRACE_IN Trace clock
1 PCLK_SMARTIO12_CLOCK Smart I/O #12
2 PCLK_SMARTIO13_CLOCK Smart I/O #13
3 PCLK_SMARTIO14_CLOCK Smart I/O #14
4 PCLK_SMARTIO15_CLOCK Smart I/O #15
5 PCLK_SMARTIO17_CLOCK Smart I/O #17
6 PCLK_TCPWM0_CLOCKS0 TCPWM0 Group #0, Counter #0
7 PCLK_TCPWM0_CLOCKS1 TCPWM0 Group #0, Counter #1
8 PCLK_TCPWM0_CLOCKS2 TCPWM0 Group #0, Counter #2
9 PCLK_TCPWM0_CLOCKS256 TCPWM0 Group #1, Counter #0
10 PCLK_TCPWM0_CLOCKS257 TCPWM0 Group #1, Counter #1
11 PCLK_TCPWM0_CLOCKS258 TCPWM0 Group #1, Counter #2
12 PCLK_TCPWM0_CLOCKS512 TCPWM0 Group #2, Counter #0
13 PCLK_TCPWM0_CLOCKS513 TCPWM0 Group #2, Counter #1
14 PCLK_TCPWM0_CLOCKS514 TCPWM0 Group #2, Counter #2
COMM root clocks (Group 1)
0 PCLK_CANFD0_CLOCK_CAN0 CAN0, Channel #0
1 PCLK_CANFD0_CLOCK_CAN1 CAN0, Channel #1
2 PCLK_CANFD0_CLOCK_CAN2 CAN0, Channel #2
3 PCLK_CANFD0_CLOCK_CAN3 CAN0, Channel #3
4 PCLK_CANFD0_CLOCK_CAN4 CAN0, Channel #4
5 PCLK_CANFD1_CLOCK_CAN0 CAN1, Channel #0
6 PCLK_CANFD1_CLOCK_CAN1 CAN1, Channel #1
7 PCLK_CANFD1_CLOCK_CAN2 CAN1, Channel #2
8 PCLK_CANFD1_CLOCK_CAN3 CAN1, Channel #3
9 PCLK_CANFD1_CLOCK_CAN4 CAN1, Channel #4
10 PCLK_LIN0_CLOCK_CH_EN0 LIN0, Channel #0
11 PCLK_LIN0_CLOCK_CH_EN1 LIN0, Channel #1
12 PCLK_LIN0_CLOCK_CH_EN2 LIN0, Channel #2
13 PCLK_LIN0_CLOCK_CH_EN3 LIN0, Channel #3
14 PCLK_LIN0_CLOCK_CH_EN4 LIN0, Channel #4
15 PCLK_LIN0_CLOCK_CH_EN5 LIN0, Channel #5
16 PCLK_LIN0_CLOCK_CH_EN6 LIN0, Channel #6
17 PCLK_LIN0_CLOCK_CH_EN7 LIN0, Channel #7
18 PCLK_LIN0_CLOCK_CH_EN8 LIN0, Channel #8
19 PCLK_LIN0_CLOCK_CH_EN9 LIN0, Channel #9
20 PCLK_LIN0_CLOCK_CH_EN10 LIN0, Channel #10
21 PCLK_LIN0_CLOCK_CH_EN11 LIN0, Channel #11
22 Faults
Table 22-1 Fault assignments
Fault Source Description
CM0+ SMPU violation
DATA0[31:0]: Violating address.
DATA1[0]: User read.
DATA1[1]: User write.
DATA1[2]: User execute.
DATA1[3]: Privileged read.
0 CPUSS_MPU_VIO_0 DATA1[4]: Privileged write.
DATA1[5]: Privileged execute.
DATA1[6]: Non-secure.
DATA1[11:8]: Master identifier.
DATA1[15:12]: Protection context identifier.
DATA1[31]: '0' MPU violation; '1': SMPU violation.
1 CPUSS_MPU_VIO_1 CRYPTO SMPU violation. See CPUSS_MPU_VIO_0 description.
2 CPUSS_MPU_VIO_2 P-DMA0 MPU/SMPU violation. See CPUSS_MPU_VIO_0 description.
3 CPUSS_MPU_VIO_3 P-DMA1 MPU/SMPU violation. See CPUSS_MPU_VIO_0 description.
4 CPUSS_MPU_VIO_4 M-DMA0 MPU/SMPU violation. See CPUSS_MPU_VIO_0 description.
5 CPUSS_MPU_VIO_5 SDHC MPU/SMPU violation. See CPUSS_MPU_VIO_0 description.
9 CPUSS_MPU_VIO_9 Ethernet0 MPU/SMPU violation. See CPUSS_MPU_VIO_0 description.
10 CPUSS_MPU_VIO_10 Ethernet1 MPU/SMPU violation. See CPUSS_MPU_VIO_0 description.
13 CPUSS_MPU_VIO_13 CM7_1 MPU/SMPU violation. See CPUSS_MPU_VIO_0 description.
14 CPUSS_MPU_VIO_14 CM7_0 MPU/SMPU violation. See CPUSS_MPU_VIO_0 description.
15 CPUSS_MPU_VIO_15 Test Controller MPU/SMPU violation. See CPUSS_MPU_VIO_0 description.
Correctable ECC error in CM7_1 TCM memory
DATA0[23:2]: Violating address.
16 CPUSS_CM7_1_TCM_C_ECC DATA1[7:0]: Syndrome of code word (at address offset 0x0).
DATA1[31:30]: 0= ITCM, 2=D0TCM, 3=D1TCM
Non Correctable ECC error in CM7_1 TCM memory.
17 CPUSS_CM7_1_TCM_NC_ECC
See CPUSS_CM7_1_TCM_C_ECC description.
Correctable ECC error in CM7_0 Cache memories
18 CPUSS_CM7_0_CACHE_C_ECC DATA0[16:2]: location information: Tag/Data SRAM, Way, Index and line Offset, see CM7 UGRM
IEBR0/DEBR0 description for details.
DATA0[31]: 0=Instruction cache, 1= Data cache
Non Correctable ECC error in CM7_0 Cache memories.
19 CPUSS_CM7_0_CACHE_NC_ECC See CPUSS_CM7_0_CACHE_C_ECC description.
Correctable ECC error in CM7_1 Cache memories.
20 CPUSS_CM7_1_CACHE_C_ECC See CPUSS_CM7_0_CACHE_C_ECC description.
Non Correctable ECC error in CM7_1 Cache memories.
21 CPUSS_CM7_1_CACHE_NC_ECC See CPUSS_CM7_0_CACHE_C_ECC description.
P-DMA1 Peripheral Master Interface PPU violation.
25 PERI_MS_VIO_4 See PERI_MS_VIO_0 description.
Peripheral protection SRAM correctable ECC violation
26 PERI_PERI_C_ECC DATA0[10:0]: Violating address.
DATA1[7:0]: Syndrome of SRAM word.
27 PERI_PERI_NC_ECC Peripheral protection SRAM non-correctable ECC violation
CM0+ Peripheral Master Interface PPU violation
DATA0[31:0]: Violating address.
DATA1[0]: User read.
DATA1[1]: User write.
DATA1[2]: User execute.
DATA1[3]: Privileged read.
28 PERI_MS_VIO_0 DATA1[4]: Privileged write.
DATA1[5]: Privileged execute.
DATA1[6]: Non-secure.
DATA1[11:8]: Master identifier.
DATA1[15:12]: Protection context identifier.
DATA1[31:28]: “0”: master interface, PPU violation, “1': timeout detected, “2”: bus error, other:
undefined.
CM7_0 Peripheral Master Interface PPU violation.
29 PERI_MS_VIO_1 See PERI_MS_VIO_0 description.
CM7_1 Peripheral Master Interface PPU violation.
30 PERI_MS_VIO_2 See PERI_MS_VIO_0 description.
Note
34.Fixed PPU is configured inside the Boot and user is not allowed to change the attributes of this PPU.
24 Bus masters
The Arbiter (part of flash controller) performs priority-based arbitration based on the master identifier. Each bus
master has a dedicated 4-bit master identifier. This master identifier is used for bus arbitration and IPC function-
ality.
Table 24-1 Bus masters for access and protection control
ID No. Master ID Description
0 CPUSS_MS_ID_CM0 Master ID for CM0+
1 CPUSS_MS_ID_CRYPTO Master ID for Crypto
2 CPUSS_MS_ID_DW0 Master ID for P-DMA0
3 CPUSS_MS_ID_DW1 Master ID for P-DMA1
4 CPUSS_MS_ID_DMAC Master ID for M-DMA0
5 CPUSS_MS_ID_SLOW0 Master ID for External AHB-Lite Master 0 (SDHC)
9 CPUSS_MS_ID_FAST0 Master ID for External AXI Master 0 (ETH0)
10 CPUSS_MS_ID_FAST1 Master ID for External AXI Master 1 (ETH1)
13 CPUSS_MS_ID_CM7_1 Master ID for CM7_1
14 CPUSS_MS_ID_CM7_0 Master ID for CM7_0
15 CPUSS_MS_ID_TC Master ID for DAP Tap Controller
25 Miscellaneous configuration
Table 25-1 Miscellaneous configuration for CYT4BF devices
Sl. No. Configuration Number/Instances Description
0 SRSS_NUM_CLKPATH 7 Number of clock paths. One for each of FLL, PLL, Direct and CSV
26 Development support
CYT4BF has a rich set of documentation, programming tools, and online resources to assist during the devel-
opment process. Visit www.infineon.com to find out more.
26.1 Documentation
A suite of documentation supports CYT4BF to ensure that you can find answers to your questions quickly. This
section contains a list of some of the key documents.
26.2 Tools
CYT4BF is supported on third-party development tool ecosystems such as IAR and GHS. CYT4BF is also supported
by Cypress programming utilities for programming, erasing, or reading using Cypress’ MiniProg4 or Segger J-link.
More details are available in the documentation section at www.infineon.com.
27 Electrical specifications
27.1 Absolute maximum ratings
Use of this device under conditions outside the Min and Max limits listed in Table 27-1 may cause permanent
damage to the device. Exposure to conditions within the limits of Table 27-1 but beyond those of normal
operation for extended periods of time may affect device reliability. The maximum storage temperature is 150 °C
in compliance with JEDEC Standard JESD22-A103, High Temperature Storage Life. When operated under condi-
tions within the limits of Table 27-1 but beyond those of normal operation, the device may not operate to speci-
fication.
Power considerations
The average chip-junction temperature, TJ, in °C, may be calculated using Equation 1:
T J = T A + P D JA
Equation. 1
Where:
TA is the ambient temperature in °C.
θJA is the package junction-to-ambient thermal resistance, in °C/W.
PD is the sum of PINT and PIO (PD = PINT + PIO).
PINT is the chip internal power. (PINT = VDDD × IDD + VDDA × IA)
PIO represents the power dissipation on input and output pins; user determined.
For most applications, PIO < PINT and may be neglected.
On the other hand, PIO may be significant if the device is configured to continuously drive external modules
and/or memories.
WARNING:
• The recommended operating conditions are required to ensure the normal operation of the semiconductor
device. All of the device's electrical characteristics are guaranteed when the device is operated under these
conditions.
• Operation under any conditions other than those mentioned in the respective “Details/Conditions” may
adversely affect reliability of the device and can result in device failure.
• No guarantee is made with respect to any use, operating conditions, or combinations not represented in this
datasheet. If you want to operate the device under any condition other than those listed herein, contact the
sales representatives.
Notes
35.These parameters are based on the condition that VSSD = VSSA = VSSIO_3 = VSSIO_4 = 0.0 V.
36.A current-limiting resistor must be provided such that the current at the I/O pin does not exceed rated values at any time, including
during power transients. Refer to Figure 27-1 for more information on the recommended circuit.
37.VDDD and VDDIO must be sufficiently loaded or protected to prevent them from being pulled out of the recommended operating range
by the clamp current.
38.When the conditions of [36], [37] and SID18A/B/C/D are met, |ICLAMP_ABS| supersedes VIA_ABS and VI_ABS.
39.The definition of “closer” depends on the package. In TEQFP packaging, “closest” is determined by counting pins. For example, in a
176-TEQFP package, P17.4 (pin 120) is closer to the VDDD on pin 110 than on pin 132. Ports 11 and 21 should not be used for injection
currents. The impact of injection currents is only defined for GPIO_STD/GPIO_ENH type I/Os. In BGA packaging, the following IO port
groups are treated as having separate supply pins: Ports 0, 1, 2, 22, 23, and 28; Ports 3, 4, 5, 29, 30, and 31; Ports 6, 7, 8, 9, and 32;
Ports 10, 12, 13, 14, 15, 26, and 27; Ports 16 and 17; Ports 18, 19, and 20.
VDDD or VDDIO
Current
Protection limiting
Diode resistor
+B input
Protection
Diode
VSS
WARNING:
Semiconductor devices may be permanently damaged by application of stress (including, without limitation, voltage, current, or
temperature) in excess of absolute maximum ratings. Do not exceed any of these ratings.
Notes
44.The total output power dissipation is the maximum power dissipation flowing through all I/Os. PIO = (VDDD,VDDIO_1,VDDIO_2) ×
(|∑IOH_ABS_GPIO| + |∑IOL_ABS_GPIO|) + (VDDIO_3, VDDIO_4) × (|∑IOH_ABS_HSIO| + |∑IOL_ABS_HSIO|)
45.+B is the positive battery voltage around 45 V.
VCCD VREF_L
Single-point connection
between analog and
digital grounds
Notes
46.VDDD, VDDIO_1, VDDIO_2, VDDIO_3, VDDIO_4, and VDDA do not have any sequencing limitation and can establish in any order. These supplies (except
VDDA and VDDIO_2) are independent in voltage level. See 12-Bit SAR ADC DC Specifications when using ADC units.
47.3.0 V ±10% is supported with a lower BOD setting option for VDDD and VDDA. This setting provides robust protection for internal timing but
BOD reset occurs at a voltage below the specified operating conditions. A higher BOD setting option is available (consistent with down to
3.0 V) and guarantees that all operating conditions are met.
48.5.0 V ±10% is supported with a higher OVD setting option for VDDD and VDDA. This setting provides robust protection for internal and interface
timing, but OVD reset occurs at a voltage above the specified operating conditions. A lower OVD setting option is available (consistent with
up to 5.0 V) and guarantees that all operating conditions are met. Voltage overshoot to a higher OVD setting range for VDDD and VDDA is
permissible, provided the duration is less than 2 hours cumulated. Note that during overshoot voltage condition electrical parameters are
not guaranteed.
49.eFuse programming must be executed with the part in a “quiet” state, with minimal activity (preferably only JTAG or a single LIN/CAN channel
on VDDD domain, no activity on VDDIO_1).
50.Smoothing capacitor, CS1 is required per chip (not per VCCD pin). The VCCD pins must be connected together to ensure a low-impedance
connection (see the requirement in Figure 27-2).
51.Capacitors used for power supply decoupling or filtering are operated under a continuous DC-bias. Many capacitors used with DC power
across them provide less than their target capacitance, and their capacitance is not constant across their working voltage range. When
selecting capacitors for use with this device, ensure that the selected components provide the required capacitance under the specific
operating conditions of temperature and voltage used in your design. While the temperature coefficient is normally found within a part’s
catalog (such as, X7R, C0G, Y5V), the matching voltage coefficient may only be available on the component datasheet or direct from the
manufacturer. Use of components that do not provide the required capacitance under the actual operating conditions may cause the device
to operate to less than datasheet specifications.
27.3 DC specifications
Table 27-3 DC specifications, CPU current, and transition time specifications
All specifications are valid for –40 °C TA 125 °C and for 2.7 V to 5.5 V except where noted.
Spec ID Parameter Description Min Typ Max Units Details/Conditions
Active/Sleep mode
CM0+ and CM7_0 clocked at 8 MHz
with IMO.
CM7_1 powered off.
VDDD current in internal All peripherals are disabled. No IO
regulator mode, LPACTIVE toggling. CPUs CM7_0 and CM0+
IDD_VDDD_CM0 mode
SID49C1 – 10 17 mA executing Dhrystone from flash
7_8_1 (CM0+ and CM7_0 at 8 MHz, all with cache enabled.
peripherals are disabled) Typ: TA = 25 °C, VDDD = 5.0 V,
process typ (TT)
Max: TA = 25 °C, VDDD = 5.5 V,
process worst (FF)
CM0+ and CM7_0 clocked at 8 MHz
with IMO.
CM7_1 powered off.
All peripherals are enabled. No IO
toggling.
VDDD current in internal M-DMA transferring data from
regulator mode, LPACTIVE code + work flash, P-DMA chains
IDD_VDDD_CM0
SID49C mode – 12 226 mA with maximum trigger activity.
7_8 (CM0+ and CM7_0 at 8 MHz, all CPUs CM7_0 and CM0+ executing
peripherals are enabled) Dhrystone from flash with cache
enabled.
Typ: TA = 25 °C, VDDD = 5.0 V,
process typ (TT)
Max: TA = 105 °C, VDDD = 5.5 V,
process worst (FF)
PLL enabled at 350 MHz with ECO
reference.
All peripherals are enabled. No IO
toggling.
CM7_1 powered off.
VCCD current in external M-DMA transferring data from
PMIC/transistor mode, Active code + work flash, P-DMA chains
IDD1_VC-
SID49E1 mode (CM7_0 at – 155 431 mA with maximum trigger activity.
CD_CM7_350 350 MHz, CM0+ at 100 MHz, all CPUs CM7_0 and CM0+ executing
peripherals are enabled) Dhrystone from flash with cache
enabled.
Typ: TA = 25 °C, VCCD = 1.15 V,
process typ (TT)
Max: TA = 125 °C, VCCD = 1.20 V,
process worst (FF)
Table 27-3 DC specifications, CPU current, and transition time specifications (continued)
All specifications are valid for –40 °C TA 125 °C and for 2.7 V to 5.5 V except where noted.
Spec ID Parameter Description Min Typ Max Units Details/Conditions
PLL enabled at 350 MHz with ECO
reference.
All peripherals are enabled. No IO
toggling.
CM7_1 powered off.
VDDD current in external M-DMA transferring data from
PMIC/transistor mode, Active code + work flash, P-DMA chains
IDD1_-
SID49E2 mode (CM7_0 at – 7 9 mA with maximum trigger activity.
VDDD_CM7_350 350 MHz, CM0+ at 100 MHz, all
CPUs CM7_0 and CM0+ executing
peripherals are enabled) Dhrystone from flash with cache
enabled.
Typ: TA = 25 °C, VDDD = 5.0 V,
process typ (TT)
Max: TA = 125 °C, VDDD = 5.5 V,
process worst (FF)
PLL enabled at 350 MHz with ECO
reference.
All peripherals are enabled. No IO
toggling.
M-DMA transferring data from
VCCD current in external code + work flash, P-DMA chains
PMIC/transistor mode, Active with maximum trigger activity.
SID50A1 IDD1_VCCD_F mode (CM7 CPUs at 350 MHz, – 209 543 mA
CM0+ at 100 MHz, all periph- CM7 CPUs and CM0+ executing
erals are enabled) Dhrystone from flash with cache
enabled.
Typ: TA = 25 °C, VCCD = 1.15 V,
process typ (TT)
Max: TA = 125 °C, VCCD = 1.20 V,
process worst (FF)
PLL enabled at 350 MHz with ECO
reference.
All peripherals are enabled. No IO
toggling.
M-DMA transferring data from
VDDD current in external code + work flash, P-DMA chains
PMIC/transistor mode, Active with maximum trigger activity.
SID50A2 IDD1_VDDD_F mode (CM7 CPUs at 350 MHz, – 7 9.3 mA
CM0+ at 100 MHz, all periph- CM7 CPUs and CM0+ executing
erals are enabled) Dhrystone from flash with cache
enabled.
Typ: TA = 25 °C, VDDD = 5.0 V,
process typ (TT)
Max: TA = 125 °C, VDDD = 5.5 V,
process worst (FF)
IMO clocked at 8 MHz.
All peripherals, PLL, FLL,
peripheral clocks, interrupts, CSV,
VDDD current in internal DMA are disabled. No IO toggling.
SID53A IDD2_8_VDDD regulator mode. CM7_1=OFF, – 7 218 mA
Other CPUs in Sleep. Typ: TA = 25 °C, VDDD = 5.0 V,
process typ (TT)
Max: TA = 105 °C, VDDD = 5.5 V,
process worst (FF)
Table 27-3 DC specifications, CPU current, and transition time specifications (continued)
All specifications are valid for –40 °C TA 125 °C and for 2.7 V to 5.5 V except where noted.
Spec ID Parameter Description Min Typ Max Units Details/Conditions
TA = 25 °C, 64-KB SRAM retention,
Event generator operates with
ILO0 in DeepSleep and LP Active,
Smart I/O operates with ILO0,
CM0+, CM7_0: Retained,
CM7_1: OFF.
Typ: VDDD = 5.0 V,
process typ (TT)
Max: VDDD = 5.5 V,
process worst (FF)
This average current is achieved
under the following conditions.
1. MCU repetitively goes from
DeepSleep to LP Active with a
Average current for cyclic
wake-up operation. This is the period of 32 ms.
average current for the 2. One of the I/Os is toggled using
SID58A IDD_CWU2 specified LPACTIVE mode and – 60 198 µA Smart I/O to activate an external
DeepSleep mode (RTC, WDT, sensor connected to an analog
and Event Generator input of A/D in DeepSleep
operating).
3. After 200 µs delay, the CM7_0
wakes up by Event generator
trigger to LP Active mode with IMO
and A/D conversion is triggered by
software.
4. Group A/D conversion is
performed on 5 channels with the
sampling time of 1 µs each.
5. Once the group A/D conversion
is finished, and the results fit in the
window of the range comparator,
the I/O is toggled back by software
to de-activate the sensor and the
CM7_0 goes back to DeepSleep.
DeepSleep mode
DeepSleep Mode (RTC, WDT, and
event generator operating, all
other peripherals are off except for
retention registers),
64-KB SRAM retention, ILO0
SID64A IDD_DS64A operation
– 50 176 µA CM0+, CM7_0: Retained
TA = 25 °C
Typ: VDDD = 5.0 V, process typ (TT)
Max: VDDD = 5.5 V,
process worst (FF)
DeepSleep Mode steady state at TA
= 125 °C (RTC, WDT, and event
generator operating, all other
peripherals are off except for
64 KB SRAM retention, ILO0 retention registers),
SID64C IDD_DS64C operation
– 1.4 5.5 mA CM0+, CM7_0: Retained
Typ: VDDD = 5.0 V, process worst
(TT)
Max: VDDD = 5.5 V, process worst
(FF)
Table 27-3 DC specifications, CPU current, and transition time specifications (continued)
All specifications are valid for –40 °C TA 125 °C and for 2.7 V to 5.5 V except where noted.
Spec ID Parameter Description Min Typ Max Units Details/Conditions
Hibernate mode
ILO0/WDT operating. All other
peripherals, and all CPUs are off.
SID66 IDD_HIB1 Hibernate Mode – 8 – µA TA = 25 °C, VDDD = 5.0 V,
Process typ (TT)
ILO0/WDT operating. All other
peripherals, and all CPUs are off.
SID66A IDD_HIB2 Hibernate Mode – – 180 µA TA = 125 °C, VDDD = 5.5 V,
Process worst (FF)
Power mode transition times
When the IMO is already running and
Power down time from Active all HFCLK roots are at least 8 MHz.
SID69 tACT_DS to DeepSleep
– – 2.8 µs HFCLK roots that are slower than
this will require additional time to
turn off.
Note
52.At cold temperature –5 °C to –40 °C, the DeepSleep to Active transition time can be higher than the max time indicated by as much
as 20 µs.
Table 27-3 DC specifications, CPU current, and transition time specifications (continued)
All specifications are valid for –40 °C TA 125 °C and for 2.7 V to 5.5 V except where noted.
Spec ID Parameter Description Min Typ Max Units Details/Conditions
ROM boot startup time or Guaranteed by Design, CM0+
SID80A tRB_N wakeup time from hibernate in – – 1640 µs clocked at 100 MHz (Flash boot
NORMAL protection state version 3.1.0.554 and later)
ROM boot startup time or Guaranteed by Design, CM0+
SID80B tRB_S wakeup time from hibernate in – – 2330 µs clocked at 100 MHz (Flash boot
SECURE protection state version 3.1.0.554 and later)
Guaranteed by Design,
Flash boot startup time or
TOC2_FLAGS=0x2CF, CM0+
wakeup time from hibernate in
SID81A tFB NORMAL/SECURE protection
– – 80 µs clocked at 100 MHz (Flash boot
version 3.1.0.554 and later),
state
Listen window = 0 ms
SID81B tFB_A Flash boot with app – – 5000 µs Guaranteed by Design,
authentication time in TOC2_FLAGS=0x24F, CM0+
NORMAL/SECURE protection clocked at 100 MHz (Flash boot
state version 3.1.0.554 and later),
Listen window = 0 ms, Public key
exponent e = 0x010001, App size is
64 KB with the last 256 bytes being
a digital signature in
RSASSA-PKCS1-v1.5
Valid for RSA-2048.
ROM boot startup time or Guaranteed by design, CM0+
SID80A_2 tRB_N_2 wakeup time from hibernate in – – 2640 µs clocked at 50 MHz (Flash boot
NORMAL protection state version earlier than 3.1.0.554)
ROM boot startup time or Guaranteed by design, CM0+
SID80B_2 tRB_S_2 wakeup time from hibernate in – – 3890 µs clocked at 50 MHz (Flash boot
SECURE protection state version earlier than 3.1.0.554)
Guaranteed by design,
Flash boot startup time or TOC2_FLAGS=0x2CF, CM0+
wakeup time from hibernate in
SID81A_2 tFB_2 NORMAL/SECURE protection
– – 200 µs clocked at 50 MHz (Flash boot
version earlier than 3.1.0.554),
state Listen window = 0 ms
SID81B_2 tFB_A_2 Flash boot with app – – 10000 µs Guaranteed by design,
authentication time in TOC2_FLAGS=0x24F, CM0+
NORMAL/SECURE protection clocked at 50 MHz (Flash boot
state version earlier than 3.1.0.554),
Listen window = 0 ms, Public key
exponent e = 0x010001, App size is
64 KB with the last 256 bytes being
a digital signature in
RSASSA-PKCS1-v1.5
Valid for RSA-2048.
Regulator specifications
Core supply voltage (transient
SID600 VCCD 1.05 1.1 1.15 V
range)
Core supply voltage (static
SID600A VCCD_S 1.075 1.1 1.125 V Guaranteed by design
range, no load)
Regulator operating current in
SID601 IDDD_ACT Active/Sleep mode
– 900 1500 µA Guaranteed by design
Table 27-3 DC specifications, CPU current, and transition time specifications (continued)
All specifications are valid for –40 °C TA 125 °C and for 2.7 V to 5.5 V except where noted.
Spec ID Parameter Description Min Typ Max Units Details/Conditions
High current regulator output
SID605 IHCROUT – – 600 mA Using an external pass transistor
current for operation
Output voltage LOW level for
SID606 VOL_HCR external PMIC enable output – – 0.5 V IOL = 1 mA
(EXT_PS_CTL1)
Output voltage HIGH level for
VDDD –
SID606A VOH_HCR external PMIC enable output
0.5
– – V IOH = –1 mA
(EXT_PS_CTL1)
Input voltage HIGH threshold
0.7 ×
SID607 VIH_HCR for external PMIC power OK
VDDD – – V
input (EXT_PS_CTL0)
Input voltage LOW threshold
0.3 ×
SID607A VIL_HCR for external PMIC power OK – – V
VDDD
input (EXT_PS_CTL0)
Hysteresis for external PMIC 0.05 ×
SID607B VHYS_HCR – – V
power OK input (EXT_PS_CTL0) VDDD
DRV_VOUT pin output current See Architecture TRM for external
SID608 IDRV_VOUT to external NPN base current – – 9 mA NPN transistor selection
System clock
1 2 3 4
1: SID68/68A/68B: Time from HV/LV reset release until CM0+ begins executing ROM boot
2: SID80A/80B: ROM boot code operation
3: SID81A/81B: Flash boot code operation
4: User code operation
27.5 I/O
All specifications are valid for –40 °C TA 125 °C and for 2.7 V to 5.5 V except where noted.
Table 27-5 I/O specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
GPIO_STD Specifications for ports P1 through P23, P28 to P32
IOL = 6 mA
drive_sel<1:0> = 0b0X,
SID650 VOL1_GPIO_STD Output voltage LOW level – – 0.6 V
4.5 V ≤ VDDD or VDDIO_1 or
VDDIO_2 ≤ 5.5 V
IOL = 5 mA
drive_sel<1:0> = 0b0X,
SID650C VOL1C_GPIO_STD Output voltage LOW level – – 0.4 V 4.5 V ≤ VDDD or VDDIO_1 or
VDDIO_2 ≤ 5.5 V
IOL = 2 mA
drive_sel<1:0> = 0b0X,
SID651 VOL2_GPIO_STD Output voltage LOW level – – 0.4 V
2.7 V ≤ VDDD or VDDIO_1 or
VDDIO_2 < 4.5 V
IOL = 1 mA
drive_sel<1:0> = 0b10,
SID652 VOL3_GPIO_STD Output voltage LOW level – – 0.4 V
2.7 V ≤ VDDD or VDDIO_1 or
VDDIO_2 < 4.5 V
IOL = 2 mA
drive_sel<1:0> = 0b10,
SID652C VOL3C_GPIO_STD Output voltage LOW level – – 0.4 V 4.5 V ≤ VDDD or VDDIO_1 or
VDDIO_2 ≤ 5.5 V
IOL = 0.5 mA
drive_sel<1:0> = 0b11,
SID653 VOL4_GPIO_STD Output voltage LOW level – – 0.4 V
2.7 V ≤ VDDD or VDDIO_1 or
VDDIO_2 < 4.5 V
IOL = 1 mA
drive_sel<1:0> = 0b11,
SID653C VOL4C_GPIO_STD Output voltage LOW level – – 0.4 V
4.5 V ≤ VDDD or VDDIO_1 or
VDDIO_2 ≤ 5.5 V
(VDDD, IOH = –2 mA
VDDIO_1, or drive_sel<1:0> = 0b0X,
SID654 VOH1_GPIO_STD Output voltage HIGH level – – V
VDDIO_2) – 2.7 V ≤ VDDD or VDDIO_1 or
0.5 VDDIO_2 < 4.5 V
(VDDD, IOH = –5 mA
SID655 VOH2_GPIO_STD Output voltage HIGH level VDDIO_1, or – – V drive_sel<1:0> = 0b0X,
VDDIO_2) – 4.5 V ≤ VDDD or VDDIO_1 or
0.5 VDDIO_2 ≤ 5.5 V
(VDDD, IOH = –1 mA
VDDIO_1, or drive_sel<1:0> = 0b10,
SID656 VOH3_GPIO_STD Output voltage HIGH level – – V
VDDIO_2) – 2.7 V ≤ (VDDD, VDDIO_1, or
0.5 VDDIO_2) < 4.5 V
(VDDD, IOH = –2 mA
VDDIO_1, or drive_sel<1:0> = 0b10,
SID656C VOH3C_GPIO_STD Output voltage HIGH level – – V
VDDIO_2) – 4.5 V ≤ (VDDD, VDDIO_1, or
0.5 VDDIO_2) ≤ 5.5 V
(VDDD, IOH = –0.5 mA
SID657 VOH4_GPIO_STD Output voltage HIGH level VDDIO_1, or – – V drive_sel<1:0> = 0b11,
VDDIO_2) – 2.7 V ≤ (VDDD, VDDIO_1, or
0.5 VDDIO_2) < 4.5 V
(VDDD, IOH = –1 mA
VDDIO_1, or drive_sel<1:0> = 0b11,
SID657C VOH4C_GPIO_STD Output voltage HIGH level – – V
VDDIO_2) – 4.5 V ≤ (VDDD, VDDIO_1, or
0.5 VDDIO_2) ≤ 5.5 V
SID658 RPD_GPIO_STD Pull-down resistance 25 50 100 kΩ
SID659 RPU_GPIO_STD Pull-up resistance 25 50 100 kΩ
0.7 × (VDDD,
SID660 VIH_CMOS_GPIO_STD Input voltage HIGH threshold V
in CMOS mode DDIO_1, or – – V
VDDIO_2)
Input voltage HIGH threshold
SID661 VIH_TTL_GPIO_STD in TTL mode 2.0 – – V
0.8 × (VDDD,
Input voltage HIGH threshold
SID662 VIH_AUTO_GPIO_STD VDDIO_1, or – – V
in AUTO mode VDDIO_2)
SID671 tR or tF (fast)_20_0_GPI- Rise time or fall time (10% to 1 – 10 ns 20-pF load, drive_sel<1:0> = 0b00
O_STD 90% of VDDIO)
tR or tF (fast)_50_0_GPI- Rise time or fall time (10% to
SID672 1 – 20 ns 50-pF load, drive_sel<1:0> = 0b00
O_STD 90% of VDDIO)
tR or tF (fast)_20_1_GPI- Rise time or fall time (10% to
SID673 1 – 20 ns 20-pF load, drive_sel<1:0> = 0b01
O_STD 90% of VDDIO)
SID674 tR or tF (fast)_10_2_GPI- Rise time or fall time (10% to 1 – 20 ns 10-pF load, drive_sel<1:0> = 0b10
O_STD 90% of VDDIO)
tR or tF (fast)_6_3_GPI- Rise time or fall time (10% to
SID675 1 – 20 ns 6-pF load, drive_sel<1:0> = 0b11
O_STD 90% of VDDIO)
10-pF to 400-pF load, RPU = 767 Ω,
Fall time (30% to 70% of
SID676 tF (fast)_100_GPIO_STD 0.35 – 250 ns drive_sel<1:0>= 0b00,
VDDIO)
Freq = 100 kHz
10-pF to 400-pF load, RPU = 350 Ω,
Fall time (30% to 70% of
SID677 tF (fast)_400_GPIO_STD 0.35 – 250 ns drive_sel<1:0>= 0b00,
VDDIO)
Freq = 400 kHz
SID678 fIN_GPIO_STD Input frequency – – 100 MHz
20-pF load,
drive_sel<1:0>= 00,
SID679 fOUT_GPIO_STD0H Output frequency – – 50 MHz
4.5 V ≤ VDDD or VDDIO_1 or VDDIO_2
≤ 5.5 V
20-pF load,
drive_sel<1:0>= 00,
SID680 fOUT_GPIO_STD0L Output frequency – – 32 MHz
2.7 V ≤ VDDD or VDDIO_1 or VDDIO_2
< 4.5 V
Note
53.If a longer pulse suppression width is necessary, use Smart I/O.
0xFFF
Actual conversion
characteristics
1.5 LSb
0xFFE
0xFFD
Digital output
VN T
0x003
Actual conversion
characteristics
0x002
Ideal
characteristics
0x001
0.5 LSb
Where:
IINJECTED is the injected current in mA.
ILEAK is the calculated leakage current in mA.
VERROR is the voltage error calculated due to leakage currents in V.
VREF is the ADC reference voltage in V.
Note
54.VDDD must be greater than 0.8 × VDDA when ADC[2] is enabled. VDDIO_1 must be greater than 0.8 × VDDA when ADC[0] is enabled.
0xFFF
Ideal
characteristics
Actual conversion
0xFFE N+1
characteristics
Digital output
N
Digital output
VN T
(Measured value)
0x004
Integral linearity error of digital output N = (VNT – {1 LSb × (N – 1) + VZT}) / 1 LSb [LSb]
Differential linearity error of digital output N = (V(N + 1)T – VNT – 1 LSb ) / 1 LSb [LSb]
VZT: Voltage for which digital output changes from 0x000 to 0x001
VFST: Voltage for which digital output changes from 0xFFE to 0xFFF.
VD DIO
Channel selection MUX and ADC
REX T RVIN
CVIN
CEX T CIN
ESD Protection
K = value of 9.0 is recommended to get ±0.5 LSb sampling accuracy at 12-bit (LSbSA MPL E = ±0.5)
27.7 AC specifications
Unless otherwise noted, the timings are defined with the guidelines mentioned in the Figure 27-7.
VDDD or VDDIO_x
80 % 80 %
20 % 20 %
VSSD or VSSD_x or VSSIO_x
tR tF
VDDD or VDDIO_x
1: tPWMENEXT, tQRES
2: tPWMEXT
Open-drain at 3 mA
SID165 VOL_F LOW level output voltage 0 – 0.4 V sink current
SID166 IOL_F LOW level output current 3 – – mA VOL = 0.4 V
Notes
55.In order to drive full bus load at 400 kHz, 6 mA IOL is required at 0.6 V VOL.
56.In order to drive full bus load at 1 MHz, 20 mA IOL is required at 0.4 V VOL. However, this device does not support it.
Only for
SID193A tHMOA SPI Master: Previous MOSI data –3.5 – – ns SCB4_MOSI/P0.3 and
hold time
SCB4_CLK/P1.0
0.5 ×
SID194 tW_SCLK_H_L SPI SCLK pulse width HIGH or 0.4 × (1 / (1 / 0.6 × (1 / ns
LOW fSPI) fSPI)
fSPI)
SPI Master: MISO hold time after
SID196 tDHI SCLK capturing edge 0 – – ns
SID198 tEN_SETUP SSEL valid, before the first SCK 0.5 × – – ns Min is half clock period
capturing edge (1/fSPI)
SSEL hold, after the last SCK 0.5 ×
SID199 tEN_SHOLD – – ns Min is half clock period
capturing edge (1/fSPI)
SID195 CSPIM_MS SPI capacitive load – – 10 pF
SPI interface slave (internally clocked) [Conditions: drive_sel<1:0>= 0x]
SID205 fSPI_INT SPI operating frequency – – 10 MHz
SPI Slave: MOSI Valid before
SID206 tDMI_INT Sclock capturing edge 5 – – ns
8 9 7
70% 70% 70% 70%
SDA
30% 30% 30% 30%
6 12
8 9 4
70% 70% 70% 70% 70%
SCL
30% 30% 30% 30% 30% 30% 30%
2
1 3
START condition
11
70% 70% 70% 70%
SDA
30% 30% 30%
14 10
13
5 2 9th clock
SSEL
2 1 3
SCLK
(CPOL=0) 4 4
SCLK
(CPOL=1)
5 6
MISO
(input)
7 8
MOSI
(output)
Figure 27-10 SPI master timing diagrams with LOW clock phase
SSEL
2 3
1
SCLK
(CPOL=0) 4 4
SCLK
(CPOL=1)
5 6
MISO
(input)
7 8
MOSI
(output)
Figure 27-11 SPI master timing diagrams with HIGH clock phase
10
SSEL
2 1 3
SCLK
(CPOL=0) 4 4
SCLK
(CPOL=1)
8 7 9
MISO
(output)
5 6
MOSI
(input)
Figure 27-12 SPI slave timing diagrams with LOW clock phase
SSEL
2 3
1
SCLK
(CPOL=0) 4
SCLK
(CPOL=1)
7 8
MISO
(output)
5 6
MOSI
(input)
Figure 27-13 SPI slave timing diagrams with HIGH clock phase
27.9 Memory
All specifications are valid for –40 °C TA 125 °C and for 2.7 V to 5.5 V except where noted.
Table 27-14 Flash DC specifications
Spec ID Parameter Description Min Typ Max Units Details/Conditions
SID260A VPE Erase and program voltage 2.7 – 5.5 V
Note
57.The code-flash includes a 'Write Buffer' of 4096-bit. If the application software writes this buffer multiple times, to get the overall write
time multiply one sector write time with the corresponding factor (say for factor 64, example, 64 x 512 B = 32 KB [one sector]).
VDDD
CPU and CPU and
Peripherals Regulators I/O Peripherals Regulators I/O
6.0 V
Reset
High-Z
By HV OVD
HV OVD rising trip
(Default: 5.548 V to
5.892 V)
Normal Normal
Enable
Reset Operation Operation
By
XRES_L
Disable High-Z
HV BOD rising trip
(Default: 2.474 V to
2.627 V) Reset
By HV BOD
POR rising trip
(1.5 V to 2.35 V)
Reset
High-Z
By POR
CMOS threshold
Disable
(0.7 V)
OFF OFF
-0.3 V
VDDD
2.3 V
VDDD
tDLY_POR
VDDD
tPOFF
1.45 V
VDDD, VDDA
VTR_2P7_R or VTR_3P0_R
VTR_2P7_F or VTR_3P0_F
tDLY_ACT/DS_HVBOD
tDLY_ACT/DS_HVBOD
VDDD, VDDA
tRES_HVBOD
VTR_2P7_F or VTR_3P0_F
VCCD
VTR_R_LVBOD
VTR_F_LVBOD
tDLY_ACT/DS_LVBOD tDLY_ACT/DS_LVBOD
VCCD
tRES_LVBOD
VTR_F_LVBOD
VTR_5P0_R or VTR_5P5_R
VTR_5P0_F or VTR_5P5_F
VDDD/VDDA
tDLY_ACT/DS_HVOVD
tDLY_ACT/DS_HVOVD
VTR_5P0_R or VTR_5P5_R
tRES_HVOVD
VDDD/VDDA
VTR_R_LVOVD
VTR_F_LVOVD
VCCD
tDLY_ACT/DS_LVOVD
tDLY_ACT/DS_LVOVD
VTR_R_LVOVD
tRES_LVOVD
VCCD
VDDD
tDLY_ACT/DS_LVD
tDLY_ACT/DS_LVD
VDDD
tRES_LVD
LVD falling detection point
TCK
tJH
tJS U
TDI/TMS
tJC O tJX Z
tJZX
TDO
Electrical specifications
All specifications are valid for –40 °C TA 125 °C and for 2.7 V to 5.5 V except where noted.
FLL 100 NA NA 96 NA NA
PLL400#1 125 122 122 119 117 117
CLK_HF4 125 Ethernet Channel#0, Ethernet Channel#1 internal clock
FLL 100 NA NA 96 NA NA
PLL400#1 196.608 193 196.608 189 185 187 I2S channel#0, I2S channel#1, I2S channel#2 interface clock, Ethernet Channel#0 TSU,
CLK_HF5 196.608
FLL 100 NA NA 96 NA NA Ethernet Channel#1 TSU
Notes
58. Intermediate clocks that are not listed have the same limitations as that of their parent clock.
59. Maximum clock frequency after the corresponding clock source (PLL/FLL + dividers). All internal tolerances and affects are covered by these frequencies.
2024-01-25
60. For ECO: up to ±150 ppm uncertainty of the external clock source are tolerated by design.
61. The IMO operation frequency tolerance is included. When DeepSleep mode isn't used, maximum permitted clock frequency setting of clock source IMO case is equal to clock source ECO case.
62. CLOCK_SLOW and CLK_HF0 are related by integer frequency ratio (that is, 1:1, 1:2, 1:3, and so on).
Table 27-20 Root and intermediate clocks[58] (continued)
Electrical specifications
Maximum permitted clock frequency setting (MHz)[59]
Max permitted
Clock clock frequency Source PLL/FLL Clock source: ECO[60] PLL/FLL Clock source: IMO[61] Description
(MHz)[59]
Integer SSCG Fractional Integer SSCG Fractional
PLL200#0 200 NA NA 190 NA NA
200
FLL 100 NA NA 96 NA NA
CLK_MEM Generated by clock gating CLK_HF0, intermediate clock for SMIF, Flash, Ethernet
PLL200#0 100 NA NA 98 NA NA
100
FLL 100 NA NA 96 NA NA
PLL200#0 100 NA NA 98 NA NA Generated by clock gating CLK_MEM, intermediate clock for CM0+, P-DMA, M-DMA,
CLK_SLOW 100
FLL 100 NA NA 96 NA NA Crypto, SMIF, SDHC
PLL200#0 100 NA NA 98 NA NA Generated by clock gating CLK_HF0, intermediate clock for IOSS, TCPWM0, CPU trace,
CLK_PERI 100 SMIF
FLL 100 NA NA 96 NA NA
163
002-21617 Rev. *M
2024-01-25
TRAVEO™ T2G 32-bit Automotive MCU
Based on Arm® Cortex®-M7 dual
Electrical specifications
MCU VDDD
ITrim
Rf
RTrim ECO_IN: External crystal oscillator input pin
ECO_IN ECO_OUT: External crystal oscillator output pin
C1, C2: Load Capacitors
C1 C3* GT rim
C3*, C4*: Stray Capacitance of the PCB
VSSD
ECO
VSSD
C2 C4*
ECO_OUT
Rd Rd
0R FTrim
Notes
63.Mainly depends on the external crystal.
64.Refer to the family-specific Architecture TRM for more information on crystal requirements (002-24401, TRAVEO™ T2G Automotive
MCU body controller high architecture technical reference manual).
VDDD
MCU
Rf
WCO_IN: Watch crystal oscillator input pin
WCO_IN WCO_OUT: Watch crystal oscillator output pin
C1, C2: Load Capacitors
C1 C3* C3*, C4*: Stray Capacitance of the PCB
WCO
VSSD
VSSD
C2 C4*
WCO_OUT
Rd
0R
Notes
65.Mainly depends on the external crystal.
66.Refer to the family-specific Architecture TRM for more information on crystal requirements (002-24401, TRAVEO™ T2G Automotive
MCU body controller high architecture technical reference manual).
Active
CLK_ECO_CONFIG.ECO_EN
8 MHz
ECO_OUT
CLK_ECO_STATUS.ECO_READY
10 ms
CLK_PLL_CONFIG.ENABLE
CLK_PLL_STATUS.LOCKED
35 µs 160 MHz
PLL_OUTPUT
CLK_FLL_CONFIG.FLL_ENABLE
CLK_FLL_STATUS.LOCKED
5 µs 100 MHz
FLL_OUTPUT
Active
CTL.WCO_EN
32.768 kHz
WCO_OUT
STATUS.WCO_OK
1000 ms
CLK_FLL_CONFIG.FLL_ENABLE
CCO is already up-and-running
CLK_FLL_STATUS.LOCKED
5 µs 100 MHz
FLL_OUTPUT
RX_CLK 2.0 V
0.8 V
2 3
RXD, RX_CTL,
RX_ER 2.0 V
0.8 V
2.0 V
TX_CLK
0.8 V
4
2.0 V
TXD, TX_CTL,
TX_ER 0.8 V
MDC 2.0 V
0.8 V
2 3
MDIO
2.0 V
0.8 V
2.0 V
MDC
0.8 V
4
2.0 V
MDIO
0.8 V
REF_CLK
1.4 V
2 3
2.0 V
TXD, TX_CTL
0.8 V
TX_CLK or 1.9 V
RX_CLK
0.7 V
2 3
TXD, TX_CTL,
TX_ER or RXD, 1.9 V
RX_CTL,
RX_ER 0.7 V
1
100 %
RX_CLK,
TX_CLK 50 %
0%
TX_CTL, 100 %
RX_CTL, TXD,
RXD 50 %
0%
2 2
2 2
1
100 %
RX_CLK,
TX_CLK 50 %
0%
TX_CTL, 100 %
RX_CTL, TXD,
RXD 50 %
0%
2 2 2 2
SID876 tIS_LP_eM- Input setup time of CMD/DAT 9.7 – – ns Clock period less
MC_BWC prior to CLK output delay
tIH_eM- Input hold time of CMD/DAT
SID878 8.3 – – ns
MC_BWC after CLK
eMMC: SDR timing specifications for HSIO_STD
fLP_eM-
SID880 Interface clock period – – 52 MHz 19.2-ns period
MC_SDR
CD_eM-
SID882 I/O loading at DATA/CMD pins – – 30 pF
MC_SDR
CC_eM-
SID883 I/O loading at CLK pins – – 30 pF
MC_SDR
1 VDDIO_1
or VDDIO_3
CLK 0.5 x VDDIO_1
or VDDIO_3
VSSD or VSSIO_3
2 3
VDDIO_1 1
or
VDDIO_3
CLK 0.5 x VDDIO_1
or VDDIO_3
VSSD or VSSIO_3
2 3
1 VDDIO_1
or VDDIO_3
CLK 0.5 x VDDIO_1
or VDDIO_3
VSSD or VSSIO_3
2 3
VDDIO_1 1
or
VDDIO_3
CLK 0.5 x VDDIO_1
or VDDIO_3
VSSD or VSSIO_3
2 3
1
VDDIO_3
VSSIO_3
2 3 2 3
1
VDDIO_3
VSSIO_3
2 3 2 3
VDDIO_2
TX/RX_SCK
or TX_SCK 0.5 x VDDIO_2
output
VSSD
VDDIO_2
TX/RX_WS
or TX_SDO 0.5 x VDDIO_2
output
VSSD
VDDIO_2
RX_SCK
0.5 x VDDIO_2
output
VSSD
1 2
VDDIO_2
RX_SDI
input 0.5 x VDDIO_2
VSSD
VDDIO_2
RX_SCK
0.5 x VDDIO_2
output
VSSD
1 2
VDDIO_2
RX_SDI
input 0.5 x VDDIO_2
VSSD
VDDIO_2
VDDIO_2
TX_SCK input
(TX_CTL.B_CLOCK_INV = 1) 0.5 x VDDIO_2
VSSD
VDDIO_2
VSSD
VDDIO_2
TX/RX_SCK
or RX_SCK 0.5 x VDDIO_2
input
VSSD
1 2
VDDIO_2
TX/RX_WS
or RX_SDI 0.5 x VDDIO_2
input
VSSD
VDDIO_1 tCK
or
VDDIO_3
CK
VSSD
or
VSSIO_3
tSU tHD
VDDIO_1 tCK
or
VDDIO_3
CK
VSSD
or
VSSIO_3
tV tHO
tCK VDDIO_1
or
VDDIO_3
CK
VSSD
or
VSSIO_3
tSU tHD tSU tHD
tCK
VDDIO_1
or
VDDIO_3
CK
VSSD
tHO or
tV tHO VSSIO_3
CK
1 6
Chip
select
2 3
4 5 8
CK
7
1
Chip
select
2 3 2 3 4 5 5 8
tCK VDDIO_1
or
VDDIO_3
CK
VSSD
or
VSSIO_3
tIS tIH tIS tIH
9
Chip
select
10
1
CK
2 5
RWDS
3 4 3 4
DQ[7:0]
(output)
Command Address Host drives DQ[7:0] and RWDS
6
DQ[7:0]
(input)
7 8
Memory drives DQ[7:0] and RWDS
Ordering information
The CYT4BF microcontroller part numbers and features are listed in Table 28-1. The Arm® TAP JTAG ID is 0x6BA0 0477.
Temperature Grade
Ordering Code[67]
Work-flash (KB)
Code-flash (KB)
JTAG ID Code
Device Code
SD/eMMC
Channels
Channels
Channels
Channels
RAM (KB)
Ethernet
Package
FlexRay
Cores
CM7
ADC
SCB
LIN
CYT4BF8CES CYT4BF8CEDQ0AESGS 176-TEQFP 2 8384[68] 256[69] 1024 81 10 17 1 0 1 S[70] 0x2E5D3069[74]
CYT4BF8CEE CYT4BF8CEDQ0AEEGS 176-TEQFP 2 8384 256 1024 81 10 17 1 0 1 E[71] 0x2E5D3069
[73]
CYT4BF8CDS CYT4BF8CDDQ0AESGS 176-TEQFP 2 8384 256 1024 81 10 17 1 1 1 S 0x2E5D7069
CYT4BF8CDE[72] CYT4BF8CDDQ0AEEGS 176-TEQFP 2 8384 256 1024 81 10 17 1 1 1 E 0x2E5D7069
CYT4BFBCJS CYT4BFBCJDQ0BZSGS 272-BGA 2 8384 256 1024 96 11 20 2 0 1 S 0x2E5EB069
CYT4BFBCJE CYT4BFBCJDQ0BZEGS 272-BGA 2 8384 256 1024 96 11 20 2 0 1 E 0x2E5EB069
CYT4BFBCHS CYT4BFBCHDQ0BZSGS 272-BGA 2 8384 256 1024 96 11 20 2 1 1 S 0x2E5EF069
198
Notes
67.Supported shipment types are “Tray” (default) and “Tape and Reel”. Add the character ‘T’ at the end to get the ordering code for “Tape and Reel” shipment type.
002-21617 Rev. *M
29 Packaging
CYT4BF microcontroller is offered in the packages listed in the Table 29-1.
Table 29-1 Package information
Package Dimensions[75] Contact/Lead pitch Coefficient of thermal expansion[80] I/O Pins
[76] [77]
a1 = 8.4 ppm/°C, a2 = 29.4
176-TEQFP 24 × 24 × 1.70 mm (max) 0.5-mm 148
ppm/°C
a1[76] = 11.9 ppm/°C, a2[77] = 34.3
272-BGA 16 × 16 × 1.70 mm (max) 0.8-mm 220
ppm/°C
a1[76] = 11.9 ppm/°C, a2[77] = 34.5
320-BGA 17 × 17 × 1.70 mm (max) 0.8-mm ppm/°C 240
Table 29-3 Solder reflow peak temperature, package moisture sensitivity level (MSL), IPC/JEDEC
J-STD-2
Maximum peak temperature Maximum time at peak temperature
Package MSL
(°C) (seconds)
176-TEQFP 260 30 3
272-BGA 260 30 3
320-BGA 260 30 3
Notes
75.The dimensions (column 2) are valid for room temperature.
76.a1 = CTE (Coefficient of Thermal Expansion) value below Tg (ppm/°C) (Tg is glass transition temperature which is 131°C).
77.a2 = CTE value above Tg (ppm/°C).
78.Maximum value °C/Watt shown is for TA = 125 °C.
79.Board condition complies to JESD51-7(4 Layers).
80.The numbers are estimated values based simulation only and are based on a single bill of material combination per package type.
002-25324 **
002-24865 *A
002-23091 *A
30 Appendix
30.1 Bootloading or end-of-line programming
• Triggered at device startup, if a trigger condition is applied
• Either CAN or LIN communication may be used
• Bootloader polls for the communication on CAN or LIN at the separate time frames, until the overall 300-second
timeout is reached
• If a bootloader command is received on either communication interface, the polling stops and bootloader starts
using this interface
10 ms 10 ms 150 ms
VSS
CAN
TRAVEOTM T2G MCU Transceiver
EN (Low) NSTB
EN (High) EN
TX TX
RX RX
VDDD / VDDIO
LIN
TRAVEOTM T2G MCU
Transceiver
EN (Low)
EN
EN (High)
TX TX
RX RX
31 Acronyms
Table 31-1 Acronyms used in the document
Acronym Description Acronym Description
A/D Analog to Digital PLL Phase Locked Loop
ABS Absolute POR Power-on reset
ADC Analog to Digital converter PPU Peripheral protection unit
AES Advanced encryption standard PRNG Pseudo-random number generator
AHB AMBA (advanced microcontroller bus PSoC Programmable system on chip
architecture) high-performance bus, Arm®
data transfer bus
Arm® Advanced RISC machine, a CPU architecture PWM Pulse-width modulation
ASIL Automotive safety integrity level MCU Microcontroller Unit
BOD Brown-out detection MCWDT Multi-counter watchdog timer
CAN FD Controller Area Network with Flexible Data M-DMA Memory-Direct Memory Access
rate
CMOS Complementary metal-oxide-semiconductor MISO Master-in slave-out
CPU Central Processing Unit MMIO Memory mapped I/O
CRC Cyclic redundancy check, an error-checking MOSI Master-out slave-in
protocol
CSV Clock supervisor MPU Memory protection unit
CTI Cross Trigger Interface NVIC Nested vectored interrupt
controller
DES Data encryption standard RAM Random access memory
ECC Error correcting code RISC Reduced-instruction-set
computing
ECO External crystal oscillator ROM Read only memory
ETM Embedded Trace Macrocell RTC Real-time clock
FLL Frequency Locked Loop SAR Successive approximation register
FPU Floating point unit SCB Serial communication block
GHS Green hills tool chain with IDE SCL I2C serial clock
GPIO General purpose input/output SDA I2C serial data
HSM Hardware security module SHA Secure hash algorithm
I/O Input/output SHE Secure hardware extension
I2C Inter-Integrated Circuit, a communications SMPU Shared memory protection unit
protocol
I2S Inter-Integrated Circuit Sound SPI Serial peripheral interface, a
communications protocol
ILO Internal low-speed oscillator SRAM Static random access memory
IMO Internal main oscillator SWD Single wire debug
IPC Inter-processor communication TCM Tightly Coupled Memory
IrDA Infrared interface TCPWM Timer/Counter Pulse-width
modulator
IRQ Interrupt request TTL Transistor-transistor logic
JTAG Joint test action group TRNG True random number generator
32 Errata
This section describes the errata for the CYT4BF product family. Details include trigger conditions, scope of
impact, available workaround, and silicon revision applicability. Contact your local Cypress Sales Representative
if you have further questions.
Part numbers affected
Part numbers
All CYT4BF parts
2. CAN FD debug message handling state machine is not reset to Idle state when CANFD_CH_CCCR.INIT is set
Problem Definition If either of the CANFD_CH_CCCR.INIT bits is set by the Host or when the M_TTCAN module enters BusOff state, the debug
message handling state machine stays in its current state instead of being reset to Idle state. Configuring the bit
CANFD_CH_CCCR.CCE does not change CANFD_CH_RXF1S.DMS.
Parameters Affected NA
Trigger Condition(s) Either of the CANFD_CH_CCCR.INIT bits is set by the Host or when the M_TTCAN module enters BusOff state.
Scope of Impact The errata is limited to the use case when the debug on CAN functionality is active. Normal operation of the CAN module
is not affected, in which case the debug message handling state machine always remains in Idle state. In the described
use case, the debug message handling state machine is stopped and remains in the current state signaled by the
CANFD_CH_RXF1S.DMS bit. In case CANFD_CH_RXF1S.DMS is set to 0b11, the DMA request remains active.
Bosch classifies this as a non-critical error with low severity, there is no fix for the IP. Bosch recommends the workaround
listed here.
Workaround In case the debug message handling state machine has stopped while CANFD_CH_RXF1S.DMS is 0b01 or 0b10, it can be
reset to Idle state by hardware reset or by reception of debug messages after CANFD_CH_CCCR.INIT is reset to zero.
Fix Status No silicon fix planned. Use workaround.
5. CAN FD controller message order inversion when transmitting from dedicated Tx Buffers configured with same Message ID
Problem Definition Configuration:
Several Tx buffers are configured with same Message ID. Transmission of these Tx buffers is requested sequentially with
a delay between the individual Tx requests.
Expected behavior:
When multiple Tx buffers that are configured with the same Message ID have pending Tx requests, they shall be trans-
mitted in ascending order of their Tx buffer numbers. The Tx buffer with lowest buffer number and pending Tx request
is transmitted first.
Observed behavior:
It may happen, depending on the delay between the individual Tx requests, that if multiple Tx buffers are configured
with the same Message ID, the Tx buffers are not transmitted in order of the Tx buffer number (lowest number first).
Parameters Affected NA
Trigger Condition(s) When multiple Tx buffers configured with the same Message ID have pending Tx requests.
Scope of Impact In the case described, it is possible that Tx buffers configured with the same Message ID and pending Tx request are not
transmitted with lowest Tx buffer number first (message order inversion).
Workaround Any of the following:
1) First, write the group of Tx message with the same Message ID to the Message RAM and then afterwards request
transmission of all these messages concurrently by a single write access to CANFDx_CHy_TXBAR. Before requesting a
group of Tx messages with this Message ID ensure that no message with this Message ID has a pending Tx request.
2) Use the Tx FIFO instead of dedicated Tx buffers for the transmission of several messages with the same Message ID in
a specific order.
Applications not able to use workaround #1 or #2 can implement a counter within the data section of their messages
sent with same ID in order to allow the recipients to determine the correct sending sequence.
Fix Status No silicon fix planned. Use workaround.
6. CAN FD incomplete description of Dedicated Tx Buffers and Tx Queue related to transmission from multiple buffers configured with the same
Message ID
Problem Definition The following are the updated description in Sections "Dedicated Tx Buffers" and "Tx Queue" of the Architecture TRM
related to the transmission from multiple buffers configured with the same Message ID.
Dedicated Tx buffers
- TRM Statement: If multiple Tx buffers are configured with the same Message ID, the Tx buffer with the lowest buffer
number is transmitted first.
- Enhancement: These Tx buffers shall be requested in ascending order with lowest buffer number first. Alternatively all
Tx buffers configured with the same Message ID can be requested simultaneously by a single write access to CANFDx-
_CHy_TXBAR.
Tx queue
- TRM statement: If multiple queue buffers are configured with the same Message ID, the queue buffer with the lowest
buffer number is transmitted first.
- Replacement: If multiple Tx queue buffers are configured with the same Message ID, the transmission order depends
on numbers of the buffers where the messages were stored for transmission. As these buffer numbers depend on the
then current states of the PUT Index, a prediction of the transmission order is not possible.
- TRM statement: An Add Request cyclically increments the Put Index to the next free Tx Buffer.
- Replacement: The PUT Index always points to that free buffer of the Tx Queue with the lowest number.
Parameters Affected NA
Trigger Condition(s) Using multiple dedicated Tx buffers or Tx queue buffers configured with the same Message ID.
Scope of Impact If the dedicated Tx buffers with the same Message ID are not requested in ascending order or at the same time, or if there
are multiple Tx queue buffers with the same Message ID, it cannot be guaranteed, that these messages are transmitted
in ascending order with lowest buffer number first.
Workaround In case a defined order of transmission is required the Tx FIFO shall be used for transmission of messages with the same
Message ID. Alternatively dedicated Tx buffers with the same Message ID shall be requested in ascending order with
lowest buffer number first or by a single write access to CANFDx_CHy_TXBAR. Alternatively a single Tx Buffer can be used
to transmit those messages one after the other.
Fix Status No silicon fix planned. Use workaround. TRM was updated.
7. Misleading status is returned for Flash and eFuse system calls, if there are pending NC ECC faults in SRAM controller #0
Problem Definition Flash and eFuse system calls will return misleading status of 0xF0000005 (“Page is write protected”) even for
non-protected row, or 0xF0000002 (“Invalid eFuse address”) for valid eFuse address in case of pending NC ECC faults in
SRAM controller #0.
Parameters Affected Return status of Flash and eFuse system calls.
Trigger Condition(s) NC ECC fault(s) pending in SRAM controller #0 and SWPUs are populated in the design.
Scope of Impact Flash and eFuse system calls will not work until the NC ECC fault(s) pending in SRAM controller #0 is/are properly
handled.
Workaround If the NC ECC fault(s) are not due to HW malfunction (i.e. if the faults are due to usage of non-initialized SRAM or improper
SRAM initialization), then clearing of these pending faults will resolve the issue.
Fix Status No silicon fix planned. TRM was updated.
10.Crypto ECC errors may be set after boot with application authentication
Problem Definition Due to the improper initialization of the Crypto memory buffer, Crypto ECC errors may be set after boot with application
authentication.
Parameters Affected N/A
Trigger Condition(s) Boot device with application authentication.
Scope of Impact Crypto ECC errors may be set after boot with application authentication.
Workaround Clear or ignore Crypto ECC errors which generated during boot with application authentication.
Fix Status No silicon fix planned. TRM was updated.
11.Incomplete erase of Code Flash cells could happen Erase Suspend / Erase Resume is used along with Erase Sector operation in Non-Blocking
mode
Problem Definition Code Flash memory can be erased in “Non-Blocking” mode; a Non-Blocking mode supported option allows users to
suspend an ongoing erase sector operation. When an ongoing erase operation is interrupted using “Erase Suspend” and
“Erase Resume”, Flash cells may not have been erased completely, even after the erase operation complete is indicated
by FLASHC_STATUS register. Only Code Flash is impacted by this issue, Work Flash and Supervisory Flash (SFlash) are
not impacted.
Parameters Affected N/A
Trigger Condition(s) Using EraseSector System Call in Non-Blocking mode for CM0+ to erase Code Flash and the ongoing erase operation is
interrupted using EraseSuspend and EraseResume System calls.
Scope of Impact When Code Flash sectors are erased in Non-Blocking mode and the ongoing erase operation is interrupted by Erase
Suspend / Erase Resume, it cannot be guaranteed that the Code Flash cells are fully erased. Any read on the Code Flash
area after the erase is complete or read on the programmed data after ProgramRow is complete can trigger ECC errors.
Workaround Use any of the following:
1) Use Non-Blocking mode for EraseSector, but do not interrupt the erase operation using Erase Suspend / Erase Resume.
2) If a Code Flash sector erase operation is interrupted using Erase Suspend / Erase Resume, then erase the same sector
again without Erase Suspend / Erase Resume before reading the sector or programming the sector.
Fix Status Fixed to update the Flash settings from date code 312xxxxx.
12.Limitation for keeping the port state from peripheral IP after wakeup from DeepSleep
Problem Definition The port state is not retained when the port selects peripheral IP (except for LIN or CAN FD) and MCU wakes up from
DeepSleep.
Parameters Affected N/A
Trigger Condition(s) The port selects peripherals (except for LIN or CAN-FD) and MCU wakes up from DeepSleep.
Scope of Impact Unexpected port output change might affect user system.
Workaround If the port selects peripherals (except for LIN or CAN FD), and the port output value need to be maintained after wakeup
from DeepSleep, set HSIOM_PRTx_PORT_SEL.IOy_SEL = 0 (GPIO) before DeepSleep and set the required output value
in GPIO configuration registers. After wakeup, change HSIOM_PRTx_PORT_SEL.IOy_SEL back to the peripheral module
as needed.
Fix Status No silicon fix planned. TRM was updated.
13.A part of the PWR_CTL2.BGREF_LPMODE description is lacked in the existing register TRM
Problem Definition The following is missing from the PWR_CTL2.BGREF_LPMODE description in the existing register TRM.
This register will not set unless CLK_ILO0_CONFIG.ILO0_ENABLE = 1. When changing back to continuous operation, keep
ILO0 enabled for at least 5 ILO0 cycles after clearing this bit to allow for internal synchronization.
Parameters Affected N/A
Trigger Condition(s) Using the PWR_CTL2.BGREF_LPMODE
Scope of Impact PWR_CTL2.BGREF_LPMODE may not be set or cleared.
Workaround Use the PWR_CTL2.BGREF_LPMODE according to the following description. This register will not set unless CLK_ILO0_-
CONFIG.ILO0_ENABLE==1. When changing back to continuous operation, keep ILO0 enabled for at least 5 ILO0 cycles
after clearing this bit to allow for internal synchronization.
Fix Status No silicon fix planned. TRM was updated.
Trigger Condition(s) Use of the related function and wakeup from DeepSleep mode.
Scope of Impact The values before entering DeepSleep are not retained.
Workaround For PASSx_SARy_CHz_RESULT, any of following can be used as a workaround:
1) Store the conversion values at another memory location before entering DeepSleep mode
2) Restart the conversion after wakeup from DeepSleep mode
For the other registers: Rewrite the register value or read the status flags again after wakeup.
Fix Status No silicon fix planned. TRM was updated.
17.Hardfault may occur when calling the SROM APIs listed below while executingw EraseSector or ProgramRow in non-blocking mode
Problem Definition The following SROM APIs read data from bank#0 (or bank#1 if dual bank mode with mapping B is used) in SFlash. While
doing that, the check for active non-blocking erase or program of bank#0 (or bank#1 if dual bank mode with mapping B
is used) is not performed. Therefore, reading bank#0 (or bank#1 if dual bank mode with mapping B is used) while there
is an active erase/program operation triggers a bus error, which can result in a hardfault occurrence based on FLASH-
C_FLASH_CTL register settings.
Affected SROM APIs:
- ReadSWPU
- WriteSWPU
- GenerateHash
- Checksum*
- ComputeBasicHash*
- CheckFactoryHash
- ProgramWorkFlash**
- SwitchOverRegulators
- LoadRegulatorsTrims
*: Do not call it to calculate on the bank where programming/erasing is in progress.
**: Do not use it during non-blocking operation.
Parameters Affected N/A
Trigger Condition(s) Calling the affected SROM APIs while executing EraseSector or ProgramRow in non-blocking mode on bank#0 (or
bank#1 if dual bank mode with mapping B is used).
Scope of Impact The affected SROM APIs cannot be used while executing EraseSector or ProgramRow in non-blocking mode on bank#0
(or bank#1 if dual bank mode with mapping B is used).
Workaround Do not use the affected SROM APIs while executing EraseSector or ProgramRow in non-blocking mode on bank#0 (or
bank#1 if dual bank mode with mapping B is used).
Fix Status No silicon fix planned. TRM will be updated.
Impact on Infineon software S-LLD, HSM-Perf-Lib: While executing EraseSector or ProgramRow in non-blocking mode on bank#0 (or bank#1 if dual
bank mode with mapping B is used), users must not do any of following:
a) call CySldProt_GetSwpuFlashStructCfg
b) call CySldProt_VerifySecureDomainFlashWriteProtection if CySldProt_SwpuFlashStructGroupConfigu-
rations is non-empty
18.CAN FD sporadic data corruption (payload) in case acceptance filtering does not finish before reception of data R3 (DB7..DB4) is
complete
Problem Definition During frame reception the Rx Handler accesses the external Message RAM for acceptance filtering (read accesses)
and for storing of the accepted messages (write accesses).
The time needed for acceptance filtering and for storing of a received message depends on
• The Host clock frequency
• The worst-case latency of the read and write accesses to the external Message RAM
• The number of configured filter elements
• The workload of the transmit message (Tx) handler in parallel to the receive message (Rx) handler
Received data bytes (DB0..DBm) from the CAN Core are buffered in the cache of the Rx Handler before they are written
to the Message RAM (in words of 4 byte). Data words inside the Message RAM are numbered from R2 to Rn (n ≤ 17).
Under the following conditions, a received message has corrupted data while the received message is signaled as
valid to the host.
1) The data length code (DLC) of the received Message is greater than 4 (DLC > 4)
2) The storage of Ri of a received message into the Message RAM (after acceptance filtering is done) has not completed
before R(i+1) is transferred from the CAN Core into the cache of the Rx Handler (where 2 ≤ i ≤ 5).
3) While condition 1) and 2) apply, a concurrent read of data word Ri from the cache and write of data word R(i+1)
into the cache of the Rx handler happens.
The data will be corrupted in a way, that in the Message RAM R(i+1) has the same content as Ri.
Despite the corrupted data, the M_TTCAN signals the storage of a valid frame in the Message RAM:
• Rx FIFO: FIFO put index RXFnS.FnPI is updated.
• Dedicated Rx Buffer: New Data flag NDATn.NDxx is set.
• Interrupt flag IR.MRAF is not set.
The issue may occur in the FD Frame Format as well as in the Classic Frame Format.
Figure 2 shows how the available time for acceptance filtering and storage is reduced.
18.CAN FD sporadic data corruption (payload) in case acceptance filtering does not finish before reception of data R3 (DB7..DB4) is
complete
Table 1 TRAVEO™ T2G: Minimum host clock frequency for CAN FD when DLC = 5
Number of Number of Arbitration bit rate = 0.5 Mbps Arbitration bit rate = 1 Mbps
configured active active CAN Data bit Data bit Data bit Data bit Data bit Data bit Data bit rate Data bit rate
filter element channels in an rate = 0.5 rate = 1 rate = 2 rate = 4 rate = 1 rate = 2 = 4 Mbps = 5 Mbps
11-bit IDs / 29-bit instance Mbps Mbps Mbps Mbps Mbps Mbps
IDs 1,2
32 / 16 2 3.9 MHz 7.1 MHz 13.1 MHz 22.8 MHz 7.7 MHz 14.1 MHz 26.1 MHz 31.5 MHz
3 5.4 MHz 9.9 MHz 18.3 MHz 31.8 MHz 10.7 MHz 19.7 MHz 36.5 MHz 44.0 MHz
4 6.9 MHz 12.7 MHz 23.5 MHz 40.8 MHz 13.8 MHz 25.3 MHz 46.9 MHz 56.5 MHz
5 8.4 MHz 15.5 MHz 28.6 MHz 49.9 MHz 16.8 MHz 30.9 MHz 57.2 MHz 69.0 MHz
64 / 32 2 7.4 MHz 13.5 MHz 24.9 MHz 43.4 MHz 14.7 MHz 26.9 MHz 49.8 MHz 60.0 MHz
3 10.3 MHz 18.8 MHz 34.9 MHz 60.7 MHz 20.5 MHz 37.6 MHz 69.7 MHz 84.0 MHz
4 13.2 MHz 24.2 MHz 44.8 MHz 78.0 MHz 26.3 MHz 48.4 MHz 89.5 MHz 107.9 MHz3
5 16.1 MHz 29.6 MHz 54.7 MHz 95.3 MHz 32.1 MHz 59.1 MHz 109.4 MHz3 131.8 MHz3
96 / 48 2 10. 8 MHz 19.9 MHz 36.8 MHz 64.0 MHz 21.6 MHz 39.7 MHz 73.5 MHz 88.6 MHz
3 15.1 MHz 27.8 MHz 51.5 MHz 89.6 MHz 30.2 MHz 55.6 MHz 102.9 MHz3 124.0 MHz3
4 19.4 MHz 35.7 MHz 66.1 MHz 115.1 MHz3 38.8 MHz 71.4 MHz 132.2 MHz3 159.3 MHz3
5 23.7 MHz 43.6 MHz 80.8 MHz 140.7 MHz3 47.4 MHz 87.2 MHz 161.5 MHz3 194.7 MHz3
128 / 64 2 14.3 MHz 26.3 MHz 48.6 MHz 84.7 MHz 28.4 MHz 52.5 MHz 97.2 MHz 117.2 MHz3
3 20.0 MHz 36.8 MHz 68.0 MHz 118.5 MHz3 40.0 MHz 73.5 MHz 136.0 MHz3 164.0 MHz3
4 25.7 MHz 47.2 MHz 87.5 MHz 152.3 MHz3 51.4 MHz 94.4 MHz 174.9 MHz3 210.8 MHz3
5 31.4 MHz 57.7 MHz 106.9 MHz3 186.1 MHz3 62.7 MHz 115.4 MHz3 213.7 MHz3 257.5 MHz3
1.M_TTCAN always starts at filter element #0 and proceeds through the filter list to find a matching element. Accep-
tance filtering stops at the first matching element and the following filter elements are not evaluated for this
message. Therefore, the sequence of configured filter elements has a significant impact on the performance of the
filtering process.
2.Acceptance filtering search for 11-bit IDs and 29-bit IDs filter element runs separately; only one configured filter
setting should be considered. Searching for one 29-bit filter element requires approximately double cycles for one
11-bit filter element.
3.Frequency is not reachable since the maximum host clock frequency for M_TTCAN in TRAVEO™ T2G is 100 MHz.
Parameters Affected N/A
Trigger Condition(s) Under the following conditions a received message has corrupted data while the received message is signaled as
valid to the host:
1) The data length code (DLC) of the received message is greater than 4 (DLC > 4)
2) The storage of Ri of a received message into the Message RAM (after acceptance filtering is done) has not completed
before R(i+1) is transferred from the CAN Core into the cache of the Rx Handler (where 2 ≤ i ≤ 5).
3) While condition 1) and 2) apply, a concurrent read of data word Ri from the cache and write of data word R(i+1)
into the cache of the Rx handler happens.
Scope of Impact The erratum is limited to the case when the Host clock frequency used in the actual device is below the limit shown
in Table 1.
Corrupted data is written to the Rx FIFO element from the respective dedicated Rx Buffer.
The received frame is nevertheless signaled as valid.
18.CAN FD sporadic data corruption (payload) in case acceptance filtering does not finish before reception of data R3 (DB7..DB4) is
complete
Workaround Check whether the minimum Host clock frequency (shown in Table 1) is below the Host clock frequency used in the
actual device.
If yes, there is no problem with the selected configuration.
If no, use one of the following two workarounds.
1) Try a different configuration by changing the following parameters until the actual Host clock frequency
(CLK_GR5) is above the minimum host frequency shown in Table 1:
• Increase the CLK_GR5 frequency in the actual device
• Reduce the CAN-FD data bit rate
• Reduce the number of configured filter elements
• Reduce the number of active CAN channels in an instance
Also, use DLC ≥ 8 instead of DLCs 5, 6, and 7 in the CAN environment/system, as they place higher demands on the
minimum Host clock frequency (the worst case is DLC = 5) or restrict your CAN environment/system to DLC 4.
Note: While changing the actual host clock frequency, CLK_GR5 must always be equal to or higher than PCLK_-
CANFD[x]_CLOCK_CAN[y] for all configurations.
2) Due to condition 3) listed in “Trigger Conditions”, the issue occurs only sporadically. Use an end-to-end (E2E)
protection (for example, checksum or CRC covering the data field) and add it to all messages in the CAN system, to
detect data corruption in the received frames.
Fix Status No silicon fix planned. Use workaround.
Impact on Infineon Impact: Limitation
software Related modules: CAN, MCU
Comment: The user must evaluate the impact of the erratum for each CAN instance separately. A CAN instance
is the entirety of CanControllers with the same CanControllerInstance value.
1) For the number of active CAN nodes: Use the maximum number of CanController configurations of a CAN
instance that can be active (Autosar controller state STARTED or SLEEP) at a time.
2) For the host clock frequency: In McuPeriGroupSettings, locate the setting with McuPeriGroup =
MCU_PERI_GROUP5_MMIO5 and take the value from McuPeriGroupClockFrequency.
4) For the number of configured active filter element 11-bit IDs / 29-bit IDs: Use the corresponding values from
the "Message RAM (…) linking table" in the generated Can_PBcfg.h file. Note that each CanController has its
separate table. Take the maximum values.
5) For the arbitration bit rate: Use the maximum CanControllerBaudRate value of all the CanControllers.
6) For the data bit rate: Use the maximum CanControllerFdBaudRate value of all the CanControllers if
configured. Otherwise use CanControllerBaudRate.
19.Description for PASS SARx to TCPWMx direct connect triggers one-to-one is incorrect in datasheet
Problem Definition The existing datasheet shows the incorrect TCPWM input trigger selection (TR_IN_SEL) value,'trig=2', in the description
for PASS SARx to TCPWMx direct connect triggers one-to-one. The correct value to calculate is '4' as shown in the archi-
tecture TRM chapter 25 descriptions and table 25-2.
Parameters Affected N/A
Trigger Condition(s) Using the triggers one-to-one for PASS SARx to TCPWMx direct connect
Scope of Impact The triggers one-to-one for PASS SARx to TCPWMx direct connect cannot work if TCPWM's input trigger selection is not
correct.
Workaround Use '4' as TCPWM's input trigger selection (TR_IN_SEL) value for PASS SARx to TCPWMx direct connect
Fix Status No silicon fix planned. Datasheet was updated.
Impact on Infineon software Impact: No
Related modules: PWM
Comment: MCAL PWM module does not support one-to-one triggers.
Revision histor y
Document Date of release Description of changes
version
** 2018-02-23 New datasheet
Updated Features and Features list.
Updated Blocks and functionality.
Updated Functional description.
Updated CYT4BF address map, Flash base address map, and Peripheral I/O map.
Added CYT4BF clock diagram.
Added Pin assignment
*A 2018-05-04 Updated Electrical specifications.
Added the following timing diagrams in Electrical specifications:
Reset, TCPWM, SCB (I2C, SPI), Crystal Connection Scheme, SAR ADC, System Resources, and JTAG.
Added Interrupts and wake-up assignments, Peripheral clock assignments, Trigger multiplexer,
Triggers group inputs, Triggers group outputs, Triggers one-to-one, and Faults.
Added Peripheral I/O map
Added Packaging.
Updated Features and Features list.
Updated Blocks and functionality.
Updated Pin assignment.
*B 2018-07-27 Updated Electrical specifications.
Added Timing Diagrams for Ethernet, SMIF
Updated SCB Diagrams
Added Ordering information.
Updated Features list and Peripheral I/O map.
Updated Functional description.
Updated Pin assignment and Package pin list and alternate functions.
*C 2018-09-28 Updated Trigger multiplexer, Core interrupt types, and Peripheral clock assignments.
Added General P-DMA descriptions and Clock Dividers.
Updated CYT4BF clock diagram.
Updated Electrical specifications.
Updated Design Review.
Updated Features list and Peripheral I/O map.
Updated Functional description.
*D 2019-01-16 Updated Pin assignment for 176-TEQFP package
Updated Electrical specifications.
Updated Design and Expert Reviews.
Updated Features list, CYT4BF address map, Peripheral I/O map.
Updated Pin assignment, Alternate function pin assignments.
Updated Trigger Group tables.
Updated Peripheral clocks and Peripheral protection unit fixed structure pairs.
Updated Bus masters and Miscellaneous configuration.
*E 2019-06-06
Updated Electrical specifications.
Updated and SPI Diagrams.
Updated Table 27-20.
Updated Ordering information and Packaging.
Updated Appendix.
Updated TCPWM Channels and Programmable Analog in Features.
Updated Ethernet MAC, TCPWM, SAR ADC, Audio I2S, and Debug Trace in Features list.
Updated TCPWM channels in Architecture block diagram.
Updated DeepSleep, PLL and FLL, TCPWM, and External Memory Interface sections in Functional
description.
Updated SRAM details in CYT4BF address map.
Added eFUSE and updated PERI Programmable PPU in Peripheral I/O map.
*F 2019-11-15
Added VSSD_2 in Power pin assignments.
Updated PASS interrupts in Interrupts and wake-up assignments.
Added Note 40 in Peripheral protection unit fixed structure pairs.
Changed MiniProg3 to MiniProg4 in Development support.
Updated , ADC Calculation of impact of neighboring pins, Clock Specifications, and SMIF Diagrams in
Electrical specifications.
Updated Ordering information and Packaging.
Updated Functional description.
Updated Power pin assignments.
Updated Pin mux descriptions.
Updated Fault assignments.
*G 2020-05-04 Updated ECO spec from 3.988 MHz to 8 MHz.
Updated Electrical specifications.
Updated Ordering information.
Added Errata.
Document
version Date of release Description of changes
Updated Features.
Updated Features list.
Updated Regulators.
Updated Clock system.
Updated Peripheral I/O map.
Updated Power pin assignments.
Updated Pin mux descriptions.
*H 2020-09-23 Updated DC specifications.
Updated Ethernet specifications.
Updated Packaging.
Updated Appendix.
Updated Electrical specifications.
Please refer to Revision history change logRev. *M electrical spec updates for the detailed list of
changes for this revision.
Removed Preliminary status.
Updated Features.
Updated Clock system.
Updated Power modes.
Updated Audio interface.
Updated I/Os.
Updated Pin assignment.
Updated High-speed I/O matrix connections.
*I 2021-10-27 Updated Alternate function pin assignments.
Updated Interrupts and wake-up assignments.
Updated Faults.
Updated Electrical specifications.
Updated Part number nomenclature.
Added Errata
Please refer to Rev. *M electrical spec updatesRevision history change log for the detailed list of
changes for this revision.
Updated System resources.
*J 2022-02-18 Updated Serial memory interface specifications.
Updated Errata.
Updated External memory interface.
Updated Alternate function pin assignments.
*K 2022-10-10 Updated Electrical specifications.
Added note in Packaging.
Updated Errata.
Updated Features list.
Updated Blocks and functionality.
Updated Peripherals, and Peripheral I/O map.
Updated Package pin list and alternate functions and Power pin assignments.
*L 2023-07-12
Updated Pin mux descriptions.
Updated Electrical specifications.
Added note in Packaging.
Updated Errata.
Updated Ethernet MAC.
Updated CYT3BB/4BB CPU start-up sequence.
*M 2024-01-25 Updated Triggers one-to-one.
Updated figures in Serial memory interface specifications.
Updated Errata.
Fix Status:
No silicon fix planned. Datasheet will be
updated.
Reason for
Section Change Description Current Spec New Spec change
31. Errata 17.Hardfault may occur when Problem Definition: Problem Definition: Updated errata
calling the SROM APIs listed below ReadSWPU or WriteSWPU read data from The following SROM APIs read data from
while executing EraseSector or bank#0 (or bank#1 if dual bank mode with bank#0 (or bank#1 if dual bank mode with
ProgramRow in non-blocking mapping B is used) in SFlash. While doing mapping B is used) in SFlash. While doing that,
mode that, the check for active non-blocking erase the check for active non-blocking erase or
Problem Definition: or program of bank#0 (or bank#1 if dual program of bank#0 (or bank#1 if dual bank
Trigger Condition(s): bank mode with mapping B is used) is not mode with mapping B is used) is not
Scope of Impact: performed. Therefore, reading bank#0 (or performed. Therefore, reading bank#0 (or
Workaround: bank#1 if dual bank mode with mapping B is bank#1 if dual bank mode with mapping B is
Fix Status: used) while there is an active erase/program used) while there is an active erase/program
operation will trigger a bus error, which can operation triggers a bus error, which can result
result in a hardfault occurrence based on in a hardfault occurrence based on FLASHC_
FLASHC_FLASH_CTL register settings. FLASH_CTL register settings.
Trigger Condition(s):
Calling the affected SROM APIs while executing
EraseSector or ProgramRow in non-blocking
mode on bank#0 (or bank#1 if dual bank mode
with mapping B is used).
Scope of Impact:
The affected SROM APIs cannot be used while
executing EraseSector or ProgramRow in
non-blocking mode
on bank#0 (or bank#1 if dual bank mode with
mapping B is used).
Workaround: Workaround:
Do not use ReadSWPU or WriteSWPU while Do not use the affected SROM APIs while
executing EraseSector or ProgramRow in executing EraseSector or ProgramRow in
non-blocking mode non-blocking mode on
on bank#0 (or bank#1 if dual bank mode bank#0 (or bank#1 if dual bank mode with
with mapping B is used). mapping B is used).
Spec ID Description Changed Item Current Spec New Spec Reason for Change
SID69 Power down time Max Max: 2.5 μs Max: 2.8 μs Updated spec
from Active to
DeepSleep
SID194 SPI Master: MISO valid Min Min: - Min: 0.4 X (1 / fSPI) ns Updated spec
before SCLK capturing Typ Typ: 0.4 X (1 / fSPI) ns Typ: 0.5 X (1 / fSPI) ns
edge Max Max: - Max: 0.6 X (1 / fSPI) ns
SID769 Data setup time Description Description: Data setup time Description: Data setup time (fCK = 100 MHz) Updated condition
(fCK = 100 MHz) Details/Conditions Details/Conditions: none Details/Conditions: For other frequencies: tSU =
tSU_min + 0.45 ×
(tCK - tCK_min)
tSU_min = value at min of SID769
tCK_min = value at min of SID763
tCK = actual clock period
SID769B Data setup time (fCK = Description Description: Data setup time Description: Data setup time (fCK = 90 MHz) Updated condition
90 MHz) Details/Conditions Details/Conditions: none Details/Conditions: For other frequencies: tSU =
tSU_min + 0.225 ×
(tCK - tCK_min)
tSU_min = value at min of SID769B
tCK_min = value at min of SID763B
tCK = actual clock period
SID780 Data hold time (fCK = Description Description: Data hold time Description: Data hold time (fCK = 100 MHz) Updated condition
100 MHz) Details/Conditions Details/Conditions: none Details/Conditions: For other frequencies: tHD =
tHD_min + 0.45 ×
(tCK - tCK_min)
tHD_min = value at min of SID780
tCK_min = value at min of SID763
tCK = actual clock period
SID780B Data hold time (fCK = Description Description: Data hold time Description: Data hold time (fCK = 90 MHz) Updated condition
90 MHz) Details/Conditions Details/Conditions: none Details/Conditions: For other frequencies:
tHD = tHD_min + 0.225 × (tCK - tCK_min)
tHD_min = value at min of SID780B
tCK_min = value at min of SID763B
tCK = actual clock period
SID781 Clock LOW to input Description Description: Clock LOW output valid Description: Clock LOW to input data valid Updated description
data valid
SID781A Clock LOW to input Description Description: Clock LOW output valid Description: Clock LOW to input data valid Updated description
data valid
SID781B Clock LOW to input Descriptiong Description: Clock LOW output valid Description: Clock LOW to input data valid Updated description
data valid
SID781C Clock LOW to input Description Description: Clock LOW output valid Description: Clock LOW to input data valid Updated description
data valid
SID812 I/O loading at Min Min: 40 pF Min: - Updated condition
DATA/CMD pins
SID813 I/O loading at CLK pins Min Min: 40 pF Min: - Updated condition
SID822 I/O loading at Min Min: 40 pF Min: - Updated condition
DATA/CMD pins
SID823 I/O loading at CLK pins Min Min: 40 pF Min: - Updated condition
SID872 I/O loading at Min Min: 30 pF Min: - Updated condition
DATA/CMD pins
SID873 I/O loading at CLK pins Min Min: 30 pF Min: - Updated condition
SID882 I/O loading at Min Min: 30 pF Min: - Updated condition
DATA/CMD pins
SID883 I/O loading at CLK pins Min Min: 30 pF Min: - Updated condition
SID893 I/O loading at Min Min: 20 pF Min: - Updated condition
DATA/CMD pins
SID894 I/O loading at CLK pins Min Min: 20 pF Min: - Updated condition
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