MV S111158 00 88Q5050 Datasheet
MV S111158 00 88Q5050 Datasheet
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Note: Provides related information or information of special importance.
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Caution: Indicates potential damage to hardware or software, or loss of data.
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Warning: Indicates a risk of personal injury.
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Disclaimer
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MARVELL CONFIDENTIAL
No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose,
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Copyright © 1999–2018. Marvell International Ltd. All rights reserved. Alaska, ARMADA, Avanta, Avastar, CarrierSpan, FLC, HyperDuo, Kirkwood, Link Street, LinkCrypt,
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Patent(s) Pending—Products identified in this document may be covered by one or more Marvell patents and/or patent applications.
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Table of Contents
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Introduction ............................................................................................................................................. 11
Document Scope ................................................................................................................................................ 11
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Related Documentation ...................................................................................................................................... 11
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1 88Q5050 Functional Description ................................................................................................... 12
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1.1 Overview ............................................................................................................................................................. 12
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1.3 Application Cases ............................................................................................................................................... 16
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1.3.3 Unmanaged Switch .............................................................................................................................. 17
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1.4 Data Path and Control Paths .............................................................................................................................. 18
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2.1 Pinout .................................................................................................................................................................. 20
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2.2 Pin Descriptions .................................................................................................................................................. 21
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2.2.1 Clock, Reset, Interrupt, and Reference ................................................................................................ 21
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2.2.2 100BASE-T1 Interface (Ports 1 to 5) .................................................................................................... 22
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2.2.3 100BASE-TX Interface (Port 6) ............................................................................................................ 22
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2.2.5 xMII (Port 5/6/7) .................................................................................................................................... 23
2.2.6 xMII/GMII (Port 8) ................................................................................................................................. 26
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QSPI ..................................................................................................................................................... 29
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3 Device Physical Interfaces ............................................................................................................. 44
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3.1 Port Configuration ............................................................................................................................................... 44
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3.2 Interfaces ............................................................................................................................................................ 46
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3.2.1 100BASE-T1 PHY Interface ................................................................................................................. 46
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3.2.2 100BASE-TX PHY Interface ................................................................................................................. 46
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3.2.3 SERDES Interface ................................................................................................................................ 47
3.2.3.1 Triple-Speed PHY SERDES Interface Option .................................................................. 47
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3.2.3.2 IEEE 1000BASE-X SERDES Interface Option ................................................................. 47
3.2.3.3 Port Status Registers ....................................................................................................... 47
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3.2.4 Digital Interface Options ....................................................................................................................... 47
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3.2.4.1 MII MAC Mode ................................................................................................................. 48
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3.2.4.2 MII PHY Mode .................................................................................................................. 49
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3.2.4.4 RMII PHY Mode ............................................................................................................... 50
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3.2.4.5 RGMII Mode ..................................................................................................................... 51
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3.2.5 PHY Polling Unit (PPU) ........................................................................................................................ 54
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4.2 Recommended Operating Conditions ................................................................................................................. 56
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4.3.1 Main Clock ............................................................................................................................................ 56
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4.3.3 100BASE-TX Transceiver .................................................................................................................... 57
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4.3.4.1 Common Mode Voltage (VOffset) Calculations .................................................................. 59
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4.3.5 Digital Pins ............................................................................................................................................ 62
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Low Power Signal Detect ..................................................................................................................... 67
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4.4 AC Electrical Characteristics ............................................................................................................................... 67
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4.4.15 Low Power Signal Detect ..................................................................................................................... 85
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5 Package Specifications .................................................................................................................. 86
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5.1 Thermal Information ............................................................................................................................................ 86
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5.2 Mechanical Drawing ............................................................................................................................................ 87
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6 Part Order Numbering/Package Marking ...................................................................................... 89
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6.1 Part Order Numbering ......................................................................................................................................... 89
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6.2 Package Marking ................................................................................................................................................ 90
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A Acronyms and Abbreviations ........................................................................................................ 91
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B Revision History ............................................................................................................................. 96
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List of Tables
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Introduction............................................................................................................................................... 11
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1 88Q5050 Functional Description ..................................................................................................... 12
Table 1: Interface Combinations .....................................................................................................................13
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2 Signal Description ............................................................................................................................ 20
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Table 2: Pin Type Definitions ..........................................................................................................................21
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Table 3: Clock, Reset, Interrupt, and Reference ............................................................................................21
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Table 4: 100BASE-T1 Interface (Ports 1 to 5) ................................................................................................22
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Table 6: Gigabit SERDES Interface (Port 7)...................................................................................................23
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Table 7: xMII (Port 5/6/7) ................................................................................................................................23
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Table 10: QSPI .................................................................................................................................................29
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Table 11: TWSI .................................................................................................................................................30
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Table 12: GPIO Interface ..................................................................................................................................30
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Table 15: JTAG Interface..................................................................................................................................33
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Table 16: Test ...................................................................................................................................................33
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Table 18: Low-Power Signal Detect .................................................................................................................34
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Table 34: Port 8 Configuration ..........................................................................................................................46
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4 Electrical Specifications .................................................................................................................. 55
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Table 35: Absolute Maximum Ratings ..............................................................................................................55
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Table 36: Recommended Operating Conditions...............................................................................................56
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Table 37: Main Clock (XTAL_IN) DC Characteristics .......................................................................................56
Table 38: 100BASE-T1 Transceiver DC Characteristics ..................................................................................57
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Table 39: 100BASE-TX Transceiver DC Characteristics..................................................................................57
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Table 40: SGMII Output DC Characteristics .....................................................................................................58
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Table 41: Programmable SGMII Output Amplitude (SERDES Page 1 Register 26) ........................................58
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Table 42: SGMII Input DC Characteristics........................................................................................................62
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Table 43: DC Characteristics for Pins GPIO[4:0], INTn, MDC_CPU, MDC_PHY, MDIO_CPU,
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MDIO_PHY, RESETn, SPI_CS, SPI_SCLK, SPI_SIO[3:0], TCK, TDI, TDO, TEST, TMS,
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TRSTn ..............................................................................................................................................62
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P8_IND[3:0], P8_INDV .....................................................................................................................63
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Table 45: DC Characteristics for Pins P567_OUTCLK, P567_OUTD[3:0], P567_OUTEN, P8_OUTCLK,
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Table 47: DC Characteristics for Pins TRACECLK, TRACEDATA[3:0], TRACESWO .....................................65
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Table 48: DC Characteristics for Pin R_LEDn[2:0] ..........................................................................................66
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Table 49: DC Characteristics for 5V Tolerant OC Pins TWSI_SCK, TWSI_SDA ............................................66
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Table 52: Power-On Reset AC Characteristics ................................................................................................68
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Table 53: 100BASE-T1 Transceiver AC Characteristics ..................................................................................68
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Table 64: Output (OUTCLK (TXC)) Timing when RGMII Tx Delay Control (Offset 0x01, Bit 14) = 0...............77
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Table 65: Output (OUTCLK (TXC)) Timing when RGMII Tx Delay Control (Offset 0x01, Bit 14) = 1...............77
Table 66: Input (INCLK (RXC)) Timing when RGMII Rx Delay Control (Offset 0x01, Bit 15) = 0.....................78
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Table 67: Input (INCLK (RXC)) Timing when RGMII Rx Delay Control (Offset 0x01, Bit 15) = 1.....................78
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Table 73: QSPI AC Characteristics ..................................................................................................................83
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Table 74: TWSI AC Characteristics ..................................................................................................................83
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Table 75: EEPROM AC Characteristics ...........................................................................................................84
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Table 76: JTAG AC Characteristics ..................................................................................................................85
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Table 77: Low Power Signal Detect AC Characteristics ...................................................................................85
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5 Package Specifications.................................................................................................................... 86
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Table 78: 128-Pin LQFP Package Thermal Information ...................................................................................86
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Table 79: 128-Pin LQFP Package Dimensions ................................................................................................88
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6 Part Order Numbering/Package Marking........................................................................................ 89
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A Acronyms and Abbreviations .......................................................................................................... 91
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List of Figures
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Introduction............................................................................................................................................... 11
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1 88Q5050 Functional Description ..................................................................................................... 12
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Figure 1: 88Q5050 Block Diagram...................................................................................................................14
Figure 2: Device Configuration During Boot Process ......................................................................................15
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Figure 3: Switch Managed by Internal CPU .....................................................................................................16
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Figure 5: Switch Managed by External CPU (Connected over Ethernet) ........................................................17
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Figure 6: Unmanaged Switch...........................................................................................................................17
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Figure 8: Data Path and Control Paths ............................................................................................................19
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3 Device Physical Interfaces............................................................................................................... 44
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Figure 10: MII MAC Interface Pins .....................................................................................................................48
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Figure 13: RMII PHY Interface Pins ...................................................................................................................50
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Figure 14: RGMII Pins .......................................................................................................................................51
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Figure 16: GMII PHY Interface Pins...................................................................................................................53
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Figure 31: Output (OUTCLK (TXC)) Timing when RGMII Tx Delay Control (Bit 14) = 1 ...................................77
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Figure 32: Input (INCLK (RXC)) Timing when RGMII Rx Delay Control (Bit 15) = 0 .........................................78
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Figure 33: Input (INCLK (RXC)) Timing when RGMII Rx Delay Control (Bit 15) = 1 .........................................78
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Figure 34: GMII Input Timing .............................................................................................................................79
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Figure 35: GMII Output Timing ..........................................................................................................................80
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Figure 36: SMI Clock Timing – CPU Set............................................................................................................81
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Figure 37: SMI Data Timing – CPU Set .............................................................................................................81
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Figure 38: SMI Output Timing – PHY Set ..........................................................................................................82
Figure 39: SMI Input Timing – PHY Set .............................................................................................................83
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Figure 40: TWSI Timing .....................................................................................................................................84
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Figure 41: EEPROM Interface Timing ...............................................................................................................84
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5 Package Specifications.................................................................................................................... 86
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Figure 42: 128-Pin LQFP Package Drawing ......................................................................................................87
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6 Part Order Numbering/Package Marking........................................................................................ 89
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Figure 43: Sample Part Number ........................................................................................................................89
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B Revision History ............................................................................................................................... 96
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Introduction
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Document Scope
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This document is intended to provide information about the Marvell® 88Q5050 device for system design. It includes the
device’s pinout, electrical specifications, package type, and high level functionalities.
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Related Documentation
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The following documents are related to this datasheet:
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88Q5050 Functional Specification, MV-S111254-00
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RD-ACE-88Q5050-1 Automotive Ethernet Switch Reference Design, MV-L101155
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88Q5050 Functional Description
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1.1 Overview
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The Marvell® 88Q5050 device is an AEC-Q100 qualified 8-port Ethernet switch, which is optimized
for Automotive applications. Being equipped with configurable interfaces that support a combination
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of eight IEEE 100BASE-T1, 100BASE-TX, RGMII/RMII/MII, GMII, and SGMII ports, the switch is
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ideally suited for various application cases. The switching core is designed to support all MAC ports
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operating at 1000 Mbps.
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protocols such as Precision Time Protocol (PTP). It provides support for TCAM with a Policy Control
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List (PCL) engine that supports 256 rules.
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Both the low-power PHYs and the MACs integrated in the device comply fully with the applicable
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sections of the IEEE 802.3 standards. The IEEE 100BASE-T1 PHYs are all fully interoperable with
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the OPEN Alliance BroadR-Reach® (OABR) PHYs.
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The 88Q5050 device's feature set is complemented by comprehensive local and remote
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management capabilities, which allow for easy access and configuration of the device.
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Package Characteristics
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128-pin LQFP package, 0.5 mm pitch, 14 mm × 20 mm
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Power supplies: 1.0V, 1.8V, 2.5V (optional), 3.3V
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Estimated power consumption: ~ 1.5W
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General Features
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Environment
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Rated for Automotive Grade 2 operation: -40 to +105 degrees C ambient temperature
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Interfaces
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• 1 × IEEE 100BASE-T1
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• 1 × 100BASE-TX
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• 1 × SGMII
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2 × SMI
• Master interface to connect to external PHYs or additional switches
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Overview
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Configurable GPIOs
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QSPI with configurable frequencies of 19.2 MHz up to 83.3 MHz
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• Supported commands: Single (Read, Fast Read, Write (PP)), Dual (Output Read, I/O Read),
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Quad (Output Read, I/O Read)
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• Supported single data rate clock modes: Mode 0 and Mode 3
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EEPROM Slave interface with loader that can be used to configure the switch
Supported EEPROM devices: 32 Kb up to 512 Kb
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TWSI Master interface
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Shared JTAG interface for either ATE or debugging
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Table 1 lists the possible interface combinations that can be configured for the 88Q5050 device’s
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ports. “xMII” stands for “MII/ RMII/ RGMII”. Each table row shows one combination, that is, there is a
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Table 1: Interface Combinations
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100BASE-T1 100BASE-T 100BASE-T SGMII xMII /
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100BASE-T1 xMII 100BASE-T SGMII xMII Ports 5, 6, and 7 are shared. If any of
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100BASE-T1 100BASE-T xMII SGMII xMII
PHY or SERDES, respectively (that is,
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port 5 configured as 100BASE-T1
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100BASE-T1 100BASE-T 100BASE-T xMII xMII interface, port 6 as 100BASE-TX interface,
1 X and port 7 as SGMII).
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100BASE-T1 100BASE-T 100BASE-T SGMII GMII If port 8 is configured as GMII, ports 5, 6,
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respectively.
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Figure 1 shows the 88Q5050 device’s block diagram.
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Figure 1 shows a high-level block diagram of the 88Q5050 device; Figure 2 provides a more detailed
view.
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Packet Memory CPU
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GPIO
+ 1 KB MAC Memory ARM Cortex-M7
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with Integrated SRAM
QSPI
Queue Controller
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Master
8-Level QoS per Port
256-Entry TCAM
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JTAG
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Gigabit Switch Fabric
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AVB/TSN Queue Shaping Ingress AVB Policy
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802.1Qav/Qbv and Rate Limiting SMI
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1.2 Device Configuration
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The initial configuration of the 88Q5050 device takes place during the boot process, as shown in
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Figure 2. There are three options available for configuring the 88Q5050 device:
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Which of these options are used depends on the application case, and additionally on the timing
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requirements. The bootstrap option is very fast, that is, the configuration pin settings already take
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effect even before a PHY link is established. The EEPROM interface runs at a speed of up to
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200 kHz. Once the EEPROM loader is finished (in case an EEPROM is attached), the SPI firmware
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continues with the device configuration. The load time of the firmware in the SPI memory device
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depends on the size of the firmware, boot procedure (trusted/non-trusted), and the SPI configuration
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Device Configuration
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Power On
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Bootstrap Pins
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EEPROM
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Configuration Data1
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1
Only if an EEPROM is attached
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SPI Firmware2 2
Only if the internal CPU is enabled
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to be attached)
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After the boot process is finished, the 88Q5050 device can be configured further by RMU, JTAG,
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M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
1.3 Application Cases
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Depending on its configuration, the 88Q5050 device can be used for various application cases:
9 0 tr
Switch managed by the internal CPU
16 lec
Switch managed by an external CPU
12 e E
Unmanaged switch
In all cases, an external EEPROM can optionally be attached. For a detailed description of the
A# ing
application cases, see the following subsections.
ND i H
1.3.1 Switch Managed by the Internal CPU
a
ER gh
In this application case, the internal CPU is enabled and manages the switch. It requires an external
., L
, U Sh
Figure 3: Switch Managed by Internal CPU
Co
AL *
TI tlfs
y
88Q5050
g
EN 23
lo
CPU
no
ID -jq
ch
NF jx
CO z1m
Te
ic
LL 8vd
35 on
90 tr
VE jm
16 lec
1.3.2 Switch Managed by an External CPU
AR b
M 9stk
12 e E
In this application case, the internal CPU is disabled, and an external CPU manages the switch. The
external CPU can be connected either over the SMI or over Ethernet.
A# ing
f5
z4
a
Figure 4: Switch Managed by External CPU (Connected over SMI)
60
ER gh
o
ND an
ih
88Q5050 SMI
, U Sh
Management
vd
CPU
2
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
If the external CPU is connected over Ethernet, either of the following ports can be used for Remote
Management Unit (RMU) management frames: port 1 (IEEE 100BASE-T1 PHY), port 7
VE jm
(SGMII/xMII), or port 8 (GMII/xMII). The RMU port configuration is done by the configuration pins.
AR b
M 9stk
5
4f
sz
0z
o6
no
Application Cases
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
9 0 tr
88Q5050
16 lec
12 e E
A# ing
Ethernet Management
RMU
CPU
ND i H
a
ER gh
., L
, U Sh
Co
In this application case, the internal CPU and RMU are disabled, that is, the switch is unmanaged.
AL *
yg
Unmanaged Switch without External EEPROM
EN 23
lo
no
ID -jq
ch
NF jx
Te
ic
88Q5050
LL 8vd
35 on
90 tr
VE jm
16 lec
AR b
M 9stk
12 e E
A# ing
f5
z4
ND i H
zs
ER gh
o
With an external EEPROM attached, configuration data can be loaded using a register loader.
ND an
ih
, U Sh
vd
AL *
4o
TI tlfs
88Q5050
m
MARVELL CONFIDENTIAL
EEPROM
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
1.4 Data Path and Control Paths
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ic
35 on
The 88Q5050 device consists of two main blocks: the switch core and the CPU subsystem.
As shown in Figure 8, the so-called UniMacAV connects the switch core’s network ports directly to
9 0 tr
16 lec
the internal CPU’s RAM (a Tightly Coupled Memory (TCM)). The paths available for control of the
88Q5050 device depend on the application case (also see Section 1.3, Application Cases):
12 e E
Switch managed by the internal CPU – Configuration is done via boot ROM, SPI firmware, and
by the internal CPU.
A# ing
Switch managed by an external CPU – Configuration is done by the external CPU that is
ND i H
connected either over SMI (direct register access) or over Ethernet (register access through the
Remote Management Unit (RMU)).
a
ER gh
Unmanaged switch – Configuration only (no control) is done via an EEPROM, if attached.
., L
, U Sh
The 88Q5050 device’s JTAG interface offers additional programming and debugging options; it has
Co
direct access to the QSPI, the internal CPU, and the switch core.
AL *
TI tlfs
yg
EN 23
lo
no
ID -jq
ch
NF jx
CO z1m
Te
ic
LL 8vd
35 on
90 tr
VE jm
16 lec
AR b
M 9stk
12 e E
A# ing
f5
z4
ND i H
zs
a
60
ER gh
o
ND an
ih
, U Sh
2 vd
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Data Path and Control Paths
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
Figure 8: Data Path and Control Paths
35 on
9 0 tr
16 lec
Flash JTAG
Memory Interface
12 e E
Legend
A# ing
88Q5050 Data Path
ND i H
CPU Subsystem Control Path if Internal CPU
a
Control Path if External CPU
ER gh
Boot ROM QSPI JTAG (SMI or Ethernet)
Master
., L
, U Sh Configuration Path if EEPROM
Co
JTAG Access
AL *
TI tlfs
yg
Internal CPU
EN 23
lo
no
RAM
ID -jq
ch
NF jx
CO z1m
Te
ic
LL 8vd
35 on
Switch Core
90 tr
VE jm
16 lec
EEPROM
AR b
Registers
UniMacAV
M 9stk
12 e E
SMI
A# ing
f5
RMU
z4
ND i H
zs
a
External
60
ER gh
CPU
o
ND an
ih
, U Sh
vd
Ethernet
2
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Signal Description
9 0 tr
16 lec
12 e E
2.1 Pinout
A# ing
Figure 9 shows the pinout for the 88Q5050 chip, manufactured in a 14 mm × 20 mm 128-pin
LQFP package.
ND i H
For shared/multi-function pins, the functionality in their default operational mode is shown first, then
a
ER gh
the extra functionality that they have under certain conditions. They are described in detail in the
following sections.
., L
The colors represent the 88Q5050 chip’s different I/O domains.
, U Sh
Co
AL *
yg
EN 23
lo
no
R_LEDn[1] / P567_VDDO_SEL[1]
R_LEDn[0] / P567_VDDO_SEL[0]
ID -jq
TRACEDATA[0] / P1_MASTER
TRACEDATA[1] / P2_MASTER
TRACEDATA[2] / P3_MASTER
TRACEDATA[3] / P4_MASTER
R_LEDn[2] / P8_VDDO_SEL[0]
TRACESWO / P5_MASTER
C_LED[3] / P567_MODE[2]
C_LED[2] / P567_MODE[1]
ch
NF jx
TRACECLK / CPU_EN
CO z1m
C_LED[1] / EE_DIO
Te
TDO / ADDRn[4]
XTAL_OUT
ic
WAKE_IN
XTAL_IN
LL 8vd
AVDD18
RESETn
AVSSC
TSTPT
TRSTn
VDDO
VDDO
VDDO
VDDO
VDDO
VDDO
35 on
RSET
VLPR
VLPF
VDD
VDD
VDD
TMS
TCK
INH
TDI
90 tr
VE jm
16 lec
HSDACP 103 64 VDD
AR b
12 e E
P1_MDIP 106 61 P8_IND2
P1_MDIN 107 60 P8_IND1
A# ing
f5
ER gh
ND an
AL *
GPIO[1] / P8_MODE[1]
GPIO[2] / P4_ACTIVEn
VDDO
VDD
GPIO[3] / RMU_SELn[0]
GPIO[4] / RMU_SELn[1]
INTn
TWSI_SDA
TWSI_SCK
VDD
VDDO
SPI_CS / ADDRn[2]
SPI_SIO0 / P2_WAKE_DIS
SPI_SCLK / P1_WAKE_DIS
SPI_SIO3 / P5_WAKE_DIS
VDDO
SPI_SIO2 / P4_WAKE_DIS
SPI_SIO1 / P3_WAKE_DIS
VDDO
VDDO_EFUSE
P7_S_RXN
P7_S_RXP
S_AVDD18
P7_S_TXN
P7_S_TXP
VDD
MDC_PHY / P567_MODE[0]
MDIO_PHY
P567_OUTD3 / P2_ACTIVEn
P567_OUTD2 / P1_ACTIVEn
VDDO_P567
P567_OUTD1 / P567_SELn[0]
P567_OUTD0 / ADDRn[1]
VDDO_P567
P567_OUTEN / P567_SEL[1]
P567_OUTCLK / ADDRn[0]
VDD
LL 8vd
VE jm
AR b
M 9stk
5
4f
no
Pin Descriptions
ch
Te
2.2 Pin Descriptions
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ic
35 on
Table 2: Pin Type Definitions
9 0 tr
16 lec
P in Typ e D e f in it io n
12 e E
A Analog
A# ing
I Input
ND i H
I/O Input/Output
a
ER gh
O Output
., L
, U Sh
PU Internal Pull-Up
Co
AL *
TI tlfs
PD Internal Pull-Down
yg
EN 23
lo
no
ID -jq
ch
NF jx
If not specified otherwise, the information in the pin type column of the following tables
CO z1m
Te
is valid when the pins are in their default operational mode. It does not reflect the pins’
behavior in other possible modes
ic
Note
LL 8vd
35 on
90 tr
VE jm
16 lec
AR b
M 9stk
12 e E
Table 3: Clock, Reset, Interrupt, and Reference
A# ing
f5
P in # P in N a m e P in Ty p e Description
z4
96 XTAL_IN I ND i H
25 MHz System Reference Clock Input provided from
zs
the board
a
This is the only clock required. The clock source can
60
ER gh
ND an
oscillator.
ih
, U Sh
vd
AL *
4o
EN 23
to ground.
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
2.2.2 100BASE-T1 Interface (Ports 1 to 5)
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ic
35 on
Table 4: 100BASE-T1 Interface (Ports 1 to 5)
9 0 tr
P in # P in N a m e P in Ty p e Description
16 lec
106 P1_MDIP I/O Media Dependent Interface – Positive/Negative
12 e E
107 P1_MDIN In 100BASE-T1, MDIN/P are used for transmit and
receive.
A# ing
110 P2_MDIP
Can be left open if not used.
111 P2_MDIN
ND i H
112 P3_MDIP
a
113 P3_MDIN
ER gh
116 P4_MDIP
., L
, U Sh
118 P5_MDIP
Co
119 P5_MDIN
AL *
TI tlfs
yg
2.2.3 100BASE-TX Interface (Port 6)
EN 23
lo
no
ID -jq
ch
NF jx
CO z1m
P in # P in N a m e P in Ty p e Description
Te
126 P6_RXP I/O Receiver Input – Positive
ic
LL 8vd
35 on
• MDIX: Connects to another device’s RXP.
90 tr
VE jm
16 lec
ground.
AR b
M 9stk
12 e E
125 P6_RXN I/O Receiver Input – Negative
A# ing
f5
a
ground.
60
ER gh
ND an
, U Sh
AL *
TI tlfs
ground.
m
MARVELL CONFIDENTIAL
no
Pin Descriptions
ch
Te
2.2.4 Gigabit SERDES Interface (Port 7)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Table 6: Gigabit SERDES Interface (Port 7)
9 0 tr
P in # P in N a m e P in Ty p e Description
16 lec
23 P7_S_RXP I Receiver Input – Positive
12 e E
Connects directly to another device’s TXP.
Can be left open if not used.
A# ing
22 P7_S_RXN I Receiver Input – Negative
ND i H
Connects to another device’s TXN.
Can be left open if not used.
a
ER gh
26 P7_S_TXP O Transmitter Output – Positive
., L
Can be left open if not used.
, U Sh
Co
25 P7_S_TXN O Transmitter Output – Negative
AL *
y
Can be left open if not used.
g
EN 23
lo
no
ID -jq
ch
NF jx
This interface can be configured as MII, RMII, or RGMII. For further details, see Section 3.2.4,
CO z1m
Te
Digital Interface Options, on page 47.
ic
LL 8vd
35 on
P in # P in N a m e P in Ty p e Description
90 tr
VE jm
16 lec
39 P567_INCLK I/O Input Clock
AR b
M 9stk
12 e E
Expected speeds:
A# ing
125 MHz, 50 MHz, 25 MHz, or 2.5 MHz,
f5
ND i H
Mode-dependent functionality:
zs
ER gh
ND an
ih
, U Sh
vd
EN 23
P567_OUTCLK.
Mode-dependent functionality:
ID -jq
ou
used as IND[4].
CO z1m
Mode-dependent functionality:
• If the P8 interface is configured as GMII, this pin is
used as IND[5].
5
4f
sz
0z
o6
no
Datasheet
ch
Te
Table 7: xMII (Port 5/6/7) (Sheet 2 of 3)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
P in # P in N a m e P in Ty p e Description
35 on
43 P567_IND2 I Input Data 2
9 0 tr
16 lec
Receives the data to be sent to the switch.
Must be synchronous to P567_INCLK for all modes
12 e E
except RMII modes.
Mode-dependent functionality:
A# ing
• In RMII modes, this pin is not used.
• If the P8 interface is configured as GMII, this pin is
ND i H
used as IND[6].
a
ER gh
44 P567_IND3 I Input Data 3
., L
, U Sh Must be synchronous to P567_INCLK for all modes
except RMII modes.
Co
AL *
Mode-dependent functionality:
TI tlfs
yg
• If the P8 interface is configured as GMII, this pin is
EN 23
lo
used as IND[7].
no
ID -jq
ch
NF jx
CO z1m
Te
Used to indicate whether P567_IND[3:0] contain frame
ic
information.
LL 8vd
35 on
Must be synchronous to P567_INCLK for all modes
except RMII modes, where it must be synchronous to
90 tr
VE jm
16 lec
P567_OUTCLK.
AR b
Mode-dependent functionality:
M 9stk
12 e E
• In RGMII mode, this pin is used as RX_CTL.
A# ing
f5
ADDRn[0] ND i H
Reference for P567_OUTEN and P567_OUTD[3:0]
zs
ER gh
Expected speeds:
125 MHz, 50 MHz, 25 MHz, or 2.5 MHz,
o
ND an
ih
Mode-dependent functionality:
vd
AL *
TI tlfs
no
Pin Descriptions
ch
Te
Table 7: xMII (Port 5/6/7) (Sheet 3 of 3)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
P in # P in N a m e P in Ty p e Description
35 on
36 P567_OUTEN / O, PD Output Enable
9 0 tr
16 lec
P567_SEL[1] Used to indicate whether P567_OUTD[3:0] or P567_
OUTD[1:0] contain frame information.
12 e E
Is synchronous to P567_OUTCLK in all modes.
Mode-dependent functionality:
A# ing
• In RGMII mode, this pin is used as TX_CTL.
Multi-function pin, which is used as P567_SEL[1]
ND i H
during hardware reset. For details, see Section 2.3,
a
Configuration Pins (Bootstrapping), on page 36.
ER gh
., L
, U Sh
ADDRn[1] Transmits the data to be sent from the switch.
Is synchronous to P567_OUTCLK in all modes.
Co
AL *
Mode-dependent functionality:
TI tlfs
yg
used as OUTD[4].
EN 23
lo
Multi-function pin, which is used as ADDRn[1]
no
ID -jq
ch
NF jx
CO z1m
Te
P567_SELn[0] Transmits the data to be sent from the switch.
ic
Is synchronous to P567_OUTCLK in all modes.
LL 8vd
35 on
Mode-dependent functionality:
• If the P8 interface is configured as GMII, this pin is
90 tr
VE jm
16 lec
used as OUTD[5].
AR b
12 e E
during hardware reset. For details, see Section 2.3,
Configuration Pins (Bootstrapping), on page 36.
A# ing
f5
P1_ACTIVEn ND i H
Transmits the data to be sent from the switch.
zs
ER gh
Mode-dependent functionality:
• In RMII modes, this pin is tri-stated.
o
ND an
ih
used as OUTD[6].
vd
AL *
TI tlfs
EN 23
Mode-dependent functionality:
CO z1m
used as OUTD[7].
Multi-function pin, which is used as P2_ACTIVEn
during hardware reset. For details, see Section 2.3,
VE jm
no
Datasheet
ch
Te
2.2.6 xMII/GMII (Port 8)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
This interface can be configured as MII, RMII, RGMII, or GMII. For further details, see Section 3.2.4,
Digital Interface Options, on page 47.
9 0 tr
16 lec
Table 8: xMII/GMII (Port 8) (Sheet 1 of 3)
12 e E
P in # P in N a m e P in Ty p e Description
A# ing
57 P8_INCLK I/O Input Clock
Reference for P8_INDV and P8_IND[3:0].
ND i H
Expected speeds:
a
125 MHz, 50 MHz, 25 MHz, or 2.5 MHz,
ER gh
depending on the port speed and configuration
Mode-dependent functionality:
., L
, U Sh
• In RMII modes, this pin is not used.
Co
• In RGMII mode, this pin is used as RXC.
AL *
yg
59 P8_IND0 I Input Data
EN 23
lo
Receives the data to be sent to the switch.
no
ID -jq
ch
NF jx
to P8_OUTCLK.
CO z1m
Te
60 P8_IND1 I Input Data
ic
Receives the data to be sent to the switch.
LL 8vd
35 on
Must be synchronous to P8_INCLK for all modes
except for RMII modes, where it must be synchronous
90 tr
VE jm
to P8_OUTCLK.
16 lec
AR b
M 9stk
12 e E
Receives the data to be sent to the switch.
Must be synchronous to P8_INCLK for all modes
A# ing
f5
ND i H
Mode-dependent functionality:
zs
ER gh
AL *
4o
information.
ou
P8_OUTCLK.
Mode-dependent functionality:
LL 8vd
no
Pin Descriptions
ch
Te
Table 8: xMII/GMII (Port 8) (Sheet 2 of 3)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
P in # P in N a m e P in Ty p e Description
35 on
55 P8_OUTCLK / I/O, PU Output Clock
9 0 tr
16 lec
P3_ACTIVEn Reference for P8_OUTEN and P8_OUTD[3:0] when
the port is in MII modes.
12 e E
Expected speeds:
125 MHz, 50 MHz, 25 MHz, or 2.5 MHz,
A# ing
depending on the port speed and configuration
Mode-dependent functionality:
ND i H
• In MII PHY mode, this pin is an output.
a
In MII MAC mode, this pin is an input.
ER gh
• In RMII PHY mode, this pin is an output.
., L
, U Sh • In GMII 10/100 Mbps MAC mode, this pin is used
as TX_CLK input.
Co
In GMII PHY mode, this pin is not used.
AL *
y
during hardware reset. For details, see Section 2.3,
g
EN 23
lo
no
ID -jq
ch
NF jx
Te
Is synchronous to P8_OUTCLK in all modes.
Mode-dependent functionality:
ic
LL 8vd
35 on
• In GMII modes, this pin is used as TX_EN.
90 tr
VE jm
16 lec
during hardware reset. For details, see Section 2.3,
AR b
M 9stk
12 e E
52 P8_OUTD0 / O, PU Output Data 0
A# ing
f5
a
during hardware reset. For details, see Section 2.3,
60
ER gh
ND an
ih
AL *
TI tlfs
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
Table 8: xMII/GMII (Port 8) (Sheet 3 of 3)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
P in # P in N a m e P in Ty p e Description
35 on
49 P8_OUTD2 / O, PU Output Data 2
9 0 tr
16 lec
P7_ACTIVEn Transmits the data to be sent from the switch.
Is synchronous to P8_OUTCLK in all modes.
12 e E
Mode-dependent functionality:
• In RMII modes, this pin is tri-stated.
A# ing
Multi-function pin, which is used as P7_ACTIVEn
during hardware reset. For details, see Section 2.3,
ND i H
Configuration Pins (Bootstrapping), on page 36.
a
48 P8_OUTD3 / O, PU Output Data 3
ER gh
P8_ACTIVEn Transmits the data to be sent from the switch.
., L
, U Sh Mode-dependent functionality:
• In RMII modes, this pin is tri-stated.
Co
AL *
yg
Configuration Pins (Bootstrapping), on page 36.
EN 23
lo
no
ID -jq
2.2.7 SMI
ch
NF jx
CO z1m
Te
Table 9: SMI (Sheet 1 of 2)
ic
LL 8vd
P in # P in N a m e P in Ty p e Description
35 on
46 MDC_CPU I, PU Management Data Clock, Slave
90 tr
VE jm
16 lec
AR b
12 e E
A continuous clock stream is not expected. The
maximum frequency supported is 20 MHz.
A# ing
Powered by VDDO_P8.
f5
ND i H
open when unused.
zs
a
28 MDC_PHY / O, PU Management Data Clock, Master
60
ER gh
ND an
Powered by VDDO_P567.
, U Sh
vd
TI tlfs
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Pin Descriptions
ch
Te
Table 9: SMI (Sheet 2 of 2)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
P in # P in N a m e P in Ty p e Description
35 on
47 MDIO_CPU I/O, PU Management Data I/O, Slave
9 0 tr
16 lec
Used to transfer management data in and out of the
device, synchronously to MDC_CPU.
12 e E
The 88Q5050 device uses one or all of the 32 possible
SMI port addresses (two modes are supported). The
A# ing
configuration pins ADDRn[4] and ADDRn[2:0] together
with ADDR[3] (which is fixed) specify the initial
ND i H
address(es) to be used. For details, see Section 2.3,
a
Configuration Pins (Bootstrapping), on page 36.
ER gh
Requires an external 1.5 kpull-up resistor.
., L
, U Sh open when unused.
Powered by VDDO_P8.
Co
AL *
yg
device, synchronously to MDC_PHY.
EN 23
lo
Requires an external 1.5 kpull-up resistor.
no
ID -jq
ch
NF jx
Powered by VDDO_P567.
CO z1m
Te
ic
LL 8vd
2.2.8 QSPI
35 on
90 tr
VE jm
16 lec
AR b
P in # P in N a m e P in Ty p e Description
M 9stk
12 e E
13 SPI_CSn / O, PU QSPI Chip Select, low active
A# ing
ADDRn[2] Used to access an SPI memory device containing the
f5
ND i H
Multi-function pin, which is used as ADDRn[2]
zs
ER gh
ND an
TI tlfs
EN 23
no
Datasheet
ch
Te
Table 10: QSPI (Sheet 2 of 2)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
P in # P in N a m e P in Ty p e Description
35 on
18 SPI_SIO2 / I/O, PU • Single I/O mode: SPI Write Protect
9 0 tr
• Dual I/O mode: Not used
16 lec
P4_WAKE_DIS
• Quad I/O mode: SPI Data I/O 2
12 e E
Transfers data (O, I/O) and address (I/O).
Multi-function pin, which is used as P4_WAKE_DIS
A# ing
during hardware reset. For details, see Section 2.3,
Configuration Pins (Bootstrapping), on page 36.
ND i H
16 SPI_SIO3 / I/O, PU • Single I/O mode: SPI Hold
a
P5_WAKE_DIS • Dual I/O mode: Not used
ER gh
• Quad I/O mode: SPI Data Input/Output 3
., L
Multi-function pin, which is used as P5_WAKE_DIS
, U Sh
during hardware reset. For details, see Section 2.3,
Co
AL *
yg
2.2.9 TWSI
EN 23
lo
no
ID -jq
ch
NF jx
CO z1m
P in # P in N a m e P in Ty p e Description
Te
10 TWSI_SCK O, OD TWSI Clock
ic
LL 8vd
5V tolerant pin.
35 on
9 TWSI_SDA I/O, OD TWSI Data
90 tr
VE jm
16 lec
5V tolerant pin.
AR b
M 9stk
12 e E
2.2.10 GPIO Interface
A# ing
f5
z4
P in # P in N a m e P in Ty p e Description
a
60
ER gh
ND an
TI tlfs
no
Pin Descriptions
ch
Te
Table 12: GPIO Interface (Sheet 2 of 2)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
P in # P in N a m e P in Ty p e Description
35 on
6 GPIO[3] / I/O, PU General Purpose I/O 3
9 0 tr
16 lec
RMU_SELn[0] Can be configured to be input or output signal.
Multi-function pin, which is used as RMU_SELn[0]
12 e E
during hardware reset. For details, see Section 2.3,
Configuration Pins (Bootstrapping), on page 36.
A# ing
7 GPIO[4] / I/O, PU General Purpose I/O 4
ND i H
RMU_SELn[1] Can be configured to be input or output signal.
Multi-function pin, which is used as RMU_SELn[1]
a
during hardware reset. For details, see Section 2.3,
ER gh
Configuration Pins (Bootstrapping), on page 36.
., L
, U Sh
2.2.11 LED and EEPROM Interface
Co
AL *
TI tlfs
yg
EN 23
lo
P in # P in N a m e P in Ty p e Description
no
ID -jq
ch
EE_CLK / Used to connect to the anode of LED column 0 for
NF jx
Te
EEPROM Clock
ic
If an external EEPROM is connected, this pin provides
LL 8vd
35 on
the clock for the EEPROM at system start. Afterwards,
the functionality changes to C_LED[0].
90 tr
VE jm
16 lec
AR b
12 e E
Configuration Pins (Bootstrapping), on page 36.
79 C_LED[1] / I/O, PU LED Column 1
A# ing
f5
ER gh
ND an
, U Sh
vd
AL *
4o
no
Datasheet
ch
Te
Table 13: LED and EEPROM Interface (Sheet 2 of 2)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
P in # P in N a m e P in Ty p e Description
35 on
73 R_LEDn[0] / I/O, PU LED Row 0, active low
9 0 tr
16 lec
P567_VDDO_ The R_LEDn pins directly drive the ports’ LEDs,
SEL[0] supporting a range from 1 to 12 LEDs in a multiplexed
12 e E
fashion. In this mode, the cathode of each LED
connects to these pins through a series current limiting
A# ing
resistor. The anode of each LED connects to one of
the C_LED pins.
ND i H
Multi-function pin, which is used as P567_VDDO_
a
SEL[0] during hardware reset. For details, see
ER gh
Section 2.3, Configuration Pins (Bootstrapping),
., L
74
, U Sh
R_LEDn[1] / I/O, PU LED Row 1, active low
P567_VDDO_ For details, see the description of the R_LEDn[0]n pin.
Co
AL *
yg
Section 2.3, Configuration Pins (Bootstrapping),
EN 23
lo
on page 36.
no
ID -jq
ch
NF jx
Te
during hardware reset. For details, see Section 2.3,
ic
Configuration Pins (Bootstrapping), on page 36.
LL 8vd
35 on
90 tr
VE jm
The physical LEDs on the 88Q5050 device’s pins are organized as 3 rows with 2 columns.
16 lec
AR b
12 e E
Table 14: LED Port-to-PHY Mapping
A# ing
f5
a
R_LEDn[1] Port 3 LED 0 Port 3 LED 1 Port 4 LED 0 Port 4 LED1
60
ER gh
ND an
ih
, U Sh
2 vd
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Pin Descriptions
ch
Te
2.2.12 JTAG Interface
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
The JTAG interface is shared between the system Debug Access Port (DAP) and the Test Access
Port (TAP).
9 0 tr
16 lec
Table 15: JTAG Interface
12 e E
P in # P in N a m e P in Ty p e Description
A# ing
128 TEST I, PD Test Mode Enable
• 0: JTAG interface connected to system DAP
ND i H
controller
a
• 1: JTAG interface connected to TAP controller
ER gh
66 TCK I, PD JTAG Test Clock
., L
, U Sh
70 TDO / O, PU JTAG Test Data Out
Co
AL *
yg
Configuration Pins (Bootstrapping), on page 36.
EN 23
lo
69 TMS I, PU JTAG Test Mode Select
no
ID -jq
ch
NF jx
CO z1m
Te
2.2.13 Test
ic
LL 8vd
35 on
Table 16: Test
90 tr
VE jm
16 lec
P in # P in N a m e P in Ty p e Description
AR b
M 9stk
12 e E
104 HSDACN Brings out TX_TCLK for IEEE testing and AC test
A# ing
points for debugging.
f5
ground. ND i H
zs
ER gh
, U Sh
vd
AL *
4o
TI tlfs
EN 23
P in # P in N a m e P in Ty p e Description
ID -jq
ou
no
Datasheet
ch
Te
Table 17: Internal CPU Trace Interface (Sheet 2 of 2)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
P in # P in N a m e P in Ty p e Description
35 on
88 TRACEDATA[2] / O, PU Trace Data 2
9 0 tr
16 lec
P3_MASTER Multi-function pin, which is used as P3_MASTER
during hardware reset. For details, see Section 2.3,
12 e E
Configuration Pins (Bootstrapping), on page 36.
86 TRACEDATA[3] / O, PU Trace Data 3
A# ing
P4_MASTER Multi-function pin, which is used as P4_MASTER
ND i H
during hardware reset. For details, see Section 2.3,
Configuration Pins (Bootstrapping), on page 36.
a
ER gh
85 TRACESWO / O, PU Trace Serial Wire Output
P5_MASTER Multi-function pin, which is used as P5_MASTER
., L
, U Sh
Configuration Pins (Bootstrapping), on page 36.
Co
AL *
TI tlfs
yg
EN 23
lo
Table 18: Low-Power Signal Detect
no
ID -jq
ch
P in # P in N a m e P in Ty p e Description
NF jx
CO z1m
Te
97 WAKE_IN A, I Wake Signal
Used to trigger INH.
ic
LL 8vd
35 on
used.
90 tr
VE jm
16 lec
the 88Q5050 device.
AR b
M 9stk
12 e E
Triggered by WAKE_IN or by the 100BASE-T1 PHY’s
signal detect.
A# ing
Must be left open if LPSD is not used.
f5
ND i H
buffer components will be required.
zs
a
100 VLPF A, I Used as feedback pin for the external regulator.
60
ER gh
ND an
ih
VBAT
Must be left open if LPSD is not used.
2
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Pin Descriptions
ch
Te
2.2.16 Power and Ground
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Table 19: Power and Ground (Sheet 1 of 2)
9 0 tr
P in # P in N a m e Description
16 lec
93 AVDD18 Analog 1.8V Supply
12 e E
Power to the analog core used to power the on-chip
XTAL (pins 94, 96).
A# ing
105, 109, 115, 121 AVDD18 Analog 1.8V Supply
ND i H
Power to the analog core used to power the interfaces
of ports 1 to 5 (pins 106, 107, 110–113, 116–119), the
a
ER gh
test pins (pins 101, 103, 104), and the RSET pin
(pin 102).
., L
124 AVDD18 Analog 1.8V Supply
, U Sh
Power to the analog core used to power the interface
Co
of port 6 (pins 122, 123, 125, 126).
AL *
TI tlfs
y
108, 114, 120 AVDD33 Analog 3.3V Supply
g
Power to the analog core used to power the interfaces
EN 23
lo
of ports 1 to 5 (pins 106, 107, 110–113, 116–119), the
no
ID -jq
test pins (pins 101, 103, 104), the RSET pin (pin 102),
ch
NF jx
Te
95 AVSSC Ground
Used for the on-chip XTAL.
ic
LL 8vd
35 on
24 S_AVDD18 Analog 1.8V Supply
Power to the analog core used to power the interface
90 tr
VE jm
16 lec
AR b
12 e E
5, 11, 27, 38, 53, 64, VDD 1.0V Core Supply
71, 78, 84, 127
A# ing
f5
ND i H
Power to the GPIO pins (pins 1–3, 6, 7), to the TWSI
zs
ER gh
ND an
TI tlfs
86, 88–91).
m
MARVELL CONFIDENTIAL
28, 29) and to the interfaces of port 5/6/7 (pins 30, 31,
33, 34, 36, 37, 39–44).
VE jm
on page 36.
M 9stk
no
Datasheet
ch
Te
Table 19: Power and Ground (Sheet 2 of 2)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
P in # P in N a m e Description
35 on
51, 56, 63 VDDO_P8 1.8V/2.5V/3.3V Supply
9 0 tr
16 lec
Power to the MDC_CPU and MDIO_CPU pins (pins
46, 47) and to the interface of port 8 (pins 48–50, 52,
12 e E
54, 55, 57–62).
Configured by P8_VDDO_SEL[1:0]. For details, see
A# ing
Section 2.3, Configuration Pins (Bootstrapping),
on page 36.
ND i H
NOTE: If configured to 2.5V, the supplied pins are
a
NOT 3.3V tolerant.
ER gh
E-PAD N/A Ground
., L
, U Sh package with an exposed die pad on the bottom of the
package. This E-PAD must be soldered to VSS as it is
Co
AL *
yg
EN 23
lo
2.3 Configuration Pins (Bootstrapping)
no
ID -jq
ch
NF jx
Te
The configuration pins are used to configure the 88Q5050 device during hardware reset. When
ic
RESETn is asserted, these configuration pins become input pins, and their configuration information
LL 8vd
35 on
is latched at the rising edge of RESETn.
90 tr
VE jm
Table 20 lists the 88Q5050 device’s configuration pins and describes their functionality. In the
16 lec
AR b
descriptions, a High signal is represented by a 1, and a Low signal is represented by a 0. There are
M 9stk
12 e E
two types of configuration pins:
Pins that specify a setting per portAn example of pins that specify a setting per port are the Px_
A# ing
f5
ACTIVEn pins. P1_ACTIVEn specifies the setting for port 1, P2_ACTIVEn specifies the setting
z4
ER gh
An example of pins that specify a certain configuration are the P567_VDDO_SEL[1:0] pins,
o
which are configured to the power supply voltage that is connected to the P567 interface. The
ND an
ih
pins’ signals are combined as follows (with the higher-numbered pin representing the higher
, U Sh
vd
value):
2
AL *
• 0b00 – P567_VDDO_SEL[1] low (0) and P567_VDDO_SEL[0] low (0) – selects 3.3V
4o
TI tlfs
• 0b01 – P567_VDDO_SEL[1] low (0) and P567_VDDO_SEL[0] high (1) – selects 2.5V
m
MARVELL CONFIDENTIAL
EN 23
• 0b10 – P567_VDDO_SEL[1] high (1) and P567_VDDO_SEL[0] low (0) – selects 1.8V
ID -jq
• 0b11 – P567_VDDO_SEL[1] high (1) and P567_VDDO_SEL[0] high (1) – selects 3.3V
ou
(default)
NF jx
CO z1m
The default setting (here: 0b11) is the setting that the configuration pins have if they are left
unconnected. To achieve the default settings, all configuration pins have an internal pull-down
LL 8vd
or pull-up resistor. For the P567_VDDO_SEL[1:0] pins, the default setting is achieved by
internal pull-up resistors.
VE jm
AR b
M 9stk
The external signals for some of the listed pins are inverted. In these cases, the actual
5
no
Configuration Pins (Bootstrapping)
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Pi n # D e f au l t C o n fi gu r a t io n F un c ti o na l it y
Pin Name P in N a m e
9 0 tr
16 lec
37 P567_OUTCLK ADDRn[0] These pins specify the slave address for the MDC/MDIO_
34 P567_OUTD0 ADDRn[1] CPU interface.
12 e E
13 SPI_CSn ADDRn[2] • 0b00000 [0b1-111]: Slave address = 0x0 (default)
70 TDO ADDRn[4] • 0b00001 [0b1-110]: Slave address = 0x1
A# ing
• …
ND i H
• 0b10111 [0b0-000]: Slave address = 0x17
NOTE: These pins are internally pulled high.
a
NOTE: ADDR[3] is tied to 0, that is, slave addresses
ER gh
0x8…0xF and 0x18…0x1F are not supported.
., L
, U Sh
disabled.
Co
• 0b0: CPU disabled
AL *
y
NOTE: This pin is internally pulled high.
g
EN 23
lo
31 P567_OUTD2 P1_ACTIVEn These pins specify the state that the appropriate port will have
no
ID -jq
ch
NF jx
Te
49 P8_OUTD2 P7_ACTIVEn • 0b1 [0b0]: Port enabled/forwarding
48 P8_OUTD3 P8_ACTIVEn NOTE: These pins are internally pulled high.
ic
LL 8vd
35 on
90 TRACEDATA[0] P1_MASTER These pins specify the PHY mode for the appropriate
89 TRACEDATA[1] P2_MASTER 100BASE-T1 port.
90 tr
VE jm
16 lec
AR b
12 e E
NOTE: These pins are internally pulled high.
15 SPI_SCLK P1_WAKE_DIS These pins specify whether the appropriate 100BASE-T1 PHY
A# ing
f5
19 SPI_SIO1 P3_WAKE_DIS ND i H
• 0b0: PHY able to wake up the device
zs
ER gh
28 MDC_PHY P567_MODE[0]
ND an
ih
AL *
4o
EN 23
• 0b011: Reserved
NF jx
no
Datasheet
ch
Te
Table 20: Bootstrap Options (Sheet 2 of 3)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
Pi n # D e f au l t C o n fi gu r a t io n F un c ti o na l it y
35 on
Pin Name P in N a m e
9 0 tr
These pins select which of the P567 is connected to xMII1.
16 lec
33 P567_OUTD1 P567_SELn[0]
36 P567_OUTEN P567_SEL[1] • 0b00 [0b01]: Port 5 connected to 100BASE-T1 PHY,
12 e E
port 6 connected to 100BASE-TX PHY,
port 7 connected to SERDES (SGMII)
A# ing
(default)
• 0b01 [0b00]: Port 5 connected to xMII (instead of being
ND i H
connected to the 100BASE-T1 PHY of
a
port 5, which is powered down)
ER gh
• 0b10 [0b11]: Port 6 connected to xMII (instead of being
., L
, U Sh port 6, which is powered down)
• 0b11 [0b10]: Port 7 connected to xMII (instead of being
Co
connected to the SERDES of port 7, which is
AL *
powered down)
TI tlfs
y
NOTE: P567_SELn[0] is internally pulled high, whereas
g
EN 23
lo
no
ID -jq
73 R_LEDn[0] P567_VDDO_SEL[0] These pins must be configured to the power supply voltage
74 R_LEDn[1] P567_VDDO_SEL[1] that is connected to the P567 interface (including SMI master).
ch
NF jx
• 0b00: 3.3V
CO z1m
Te
• 0b01: 2.5V
• 0b10: 1.8V
ic
LL 8vd
35 on
NOTE: These pins are internally pulled high.
90 tr
VE jm
16 lec
VDDO_SEL and by P8_VDDO_SEL must be the
AR b
M 9stk
same.
12 e E
1 GPIO[0] P8_MODE[0] These pins specify the P8 mode1.
A# ing
f5
2 GPIO[1] P8_MODE[1] • 0b000 [0b100]: MII PHY mode (full duplex only)
z4
a
• 0b001 [0b101]: MII PHY mode
60
ER gh
ND an
TI tlfs
EN 23
no
Configuration Pins (Bootstrapping)
ch
Te
Table 20: Bootstrap Options (Sheet 3 of 3)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
Pi n # D e f au l t C o n fi gu r a t io n F un c ti o na l it y
35 on
Pin Name P in N a m e
9 0 tr
16 lec
75 R_LEDn[2] P8_VDDO_SEL[0] These pins must be configured to the power supply voltage
76 C_LED[0] / EE_CLK P8_VDDO_SEL[1] that is connected to the P8 interface (including SMI slave).
12 e E
• 0b00: 3.3V
• 0b01: 2.5V
A# ing
• 0b10: 1.8V
• 0b11: 3.3V (default)
ND i H
NOTE: These pins are internally pulled high.
a
NOTE: In P8 GMII mode, the voltages selected by P8_
ER gh
VDDO_SEL and by P567_VDDO_SEL must be the
., L
6 GPIO[3]
, U Sh RMU_SELn[0] These pins select the RMU port.
7 GPIO[4] RMU_SELn[1] If RMU is enabled for a port, this port allows RMU
Co
AL *
yg
• 0b00 [0b11]: RMU disabled (default)
EN 23
lo
• 0b01 [0b10]: RMU enabled on port 1
no
ID -jq
ch
NF jx
Te
1. For an overview of the configuration options for ports 5/6/7 and port 8, also see Section 3.1, Port Configuration, on page 44.
ic
LL 8vd
35 on
2.3.2 Pin Connection Information
90 tr
VE jm
16 lec
This section lists the possible configuration combinations and specifies how to connect the
AR b
M 9stk
12 e E
appropriate pins. In the following tables, “Pull-Down” stands for an external pull-down resistor and
“Pull-Up” for an external pull-up resistor; both with a recommended resistance value of 4.7 k.
A# ing
“Unconnected” means no external bootstrap resistor at the pin.
f5
z4
ND i H
2.3.2.1 Slave Address (MDC/MDIO_CPU Interface)
zs
a
60
ER gh
The ADDRn[4] and ADDRn[2:0] pins specify the slave address for the MDC/MDIO_CPU interface.
Table 21 shows how to connect the pins for the different configurations.
o
ND an
ih
, U Sh
vd
AL *
TI tlfs
Address
m
MARVELL CONFIDENTIAL
0x0 (default) Unconnected / Pull-Up Unconnected / Pull-Up Unconnected / Pull-Up Unconnected / Pull-Up
EN 23
ID -jq
NF jx
no
Datasheet
ch
Te
Table 21: ADDRn[4], ADDRn[2:0] Configuration (Sheet 2 of 2)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
Slave ADDRn[4] ADDRn[2] ADDRn[1] ADDRn[0]
35 on
Address
9 0 tr
16 lec
0x12 Pull-Down Unconnected / Pull-Up Pull-Down Unconnected / Pull-Up
0x13 Pull-Down Unconnected / Pull-Up Pull-Down Pull-Down
12 e E
0x14 Pull-Down Pull-Down Unconnected / Pull-Up Unconnected / Pull-Up
A# ing
0x15 Pull-Down Pull-Down Unconnected / Pull-Up Pull-Down
ND i H
0x16 Pull-Down Pull-Down Pull-Down Unconnected / Pull-Up
a
0x17 Pull-Down Pull-Down Pull-Down Pull-Down
ER gh
., L
2.3.2.2 CPU State
, U Sh
Co
The CPU_EN pin specifies whether the internal CPU is enabled or disabled. Table 22 shows how to
AL *
yg
Table 22: CPU_EN Configuration
EN 23
lo
no
ID -jq
C P U S ta t e C P U _E N
ch
NF jx
Te
CPU disabled Pull-Down
ic
LL 8vd
35 on
2.3.2.3 Port State
90 tr
VE jm
The Px_ACTIVEn pins specify the state that the appropriate port will have after reset (the “x” in the
16 lec
AR b
pin name refers to ports 1 to 8). Table 23 shows how to connect the pins for the different
M 9stk
12 e E
configurations.
A# ing
f5
P or t S ta t e ND i H
P x _A C T I VE n
zs
a
• Port disabled, if RMU disabled for the port Unconnected / Pull-Up
60
ER gh
(default)
ND an
ih
, U Sh
AL *
4o
The Px_MASTER pins specify the PHY mode for the appropriate 100BASE-T1 port (the “x” in the
EN 23
pin name refers to ports1 to 5). Table 24 shows how to connect the pins for the different
ID -jq
ou
configurations.
NF jx
CO z1m
Slave Pull-Down
AR b
M 9stk
5
4f
sz
0z
o6
no
Configuration Pins (Bootstrapping)
ch
Te
2.3.2.5 100BASE-T1 Wake Mode
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
The Px_WAKE_DIS pins specify whether the appropriate 100BASE-T1 PHY is enabled to wake up
35 on
the device from a low-power state (the “x” in the pin name refers to ports1 to 5). Table 25 shows how
9 0 tr
to connect the pins for the different configurations.
16 lec
Table 25: Px_WAKE_DIS Pin Configuration
12 e E
1 0 0 B A S E - T 1 Wa k e M od e P x _ WA K E _ D I S
A# ing
PHY not able to wake up the device (default) Unconnected / Pull-Up
ND i H
PHY able to wake up the device Pull-Down
a
ER gh
2.3.2.6 P567 Mode
., L
, U Sh
The P567_MODE[2:0] pins specify the P567 mode. Table 26 shows how to connect the pins for the
different configurations.
Co
AL *
TI tlfs
yg
EN 23
lo
P567 Mode P 56 7 _ M O D E [ 2 ] P 5 67 _ M O D E [ 1 ] P 5 6 7_ M O D E [ 0 ]
no
ID -jq
ch
NF jx
Te
RMII MAC Unconnected / Pull-Up Pull-Down Unconnected / Pull-Up
ic
LL 8vd
35 on
Reserved Pull-Down Unconnected / Pull-Up Unconnected / Pull-Up
90 tr
VE jm
16 lec
MII MAC Pull-Down Unconnected / Pull-Up Pull-Down
AR b
M 9stk
12 e E
MII PHY Pull-Down Pull-Down Unconnected / Pull-Up
MII PHY (full duplex only) Pull-Down Pull-Down Pull-Down
A# ing
f5
z4
ND i H
2.3.2.7 P567 Interface Select
zs
a
60
ER gh
The P567_SEL[1] and P567_SELn[0] pins select which of the P567 is connected to xMII. Table 27
shows how to connect the pins for the different configurations.
o
ND an
ih
, U Sh
P 56 7 In t e r f a c e P 5 67 _ S E L[ 1 ] P 5 6 7_ S E L n [ 0 ]
AL *
4o
TI tlfs
(default)
NF jx
no
Datasheet
ch
Te
2.3.2.8 P567 Power Supply Voltage Select
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
The P567_VDDO_SEL[1:0] pins must be configured to the power supply voltage that is connected
35 on
to the P567 interface (including SMI master). Table 28 shows how to connect the pins for the
9 0 tr
different configurations.
16 lec
Table 28: P567_VDDO_SEL[1:0] Configuration
12 e E
P 56 7 P ow e r S u p pl y P 5 67 _ V D D O _ S E L [ 1 ] P 5 6 7_ V D D O _ S E L [ 0]
A# ing
3.3V (default) Unconnected / Pull-Up Unconnected / Pull-Up
ND i H
1.8V Unconnected / Pull-Up Pull-Down
a
ER gh
2.5V Pull-Down Unconnected / Pull-Up
., L
, U Sh
Co
AL *
TI tlfs
yg
EN 23
lo
no
ID -jq
ch
NF jx
CO z1m
Te
ic
LL 8vd
35 on
90 tr
VE jm
16 lec
AR b
M 9stk
12 e E
A# ing
f5
z4
ND i H
zs
a
60
ER gh
o
ND an
ih
, U Sh
2 vd
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Configuration Pins (Bootstrapping)
ch
Te
2.3.2.9 P8 Mode
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
The P8_MODEn[2] and P8_MODE(1:0] pins specify the P8 mode. Table 29 shows how to connect
35 on
the pins for the different configurations.
9 0 tr
16 lec
Table 29: P8_MODEn[2], P8_MODE[1:0] Configuration
12 e E
P8 M o d e P 8_ M O D E n [2 ] P 8 _M O D E [1 ] P 8 _ M O D E [ 0]
A# ing
RGMII (default) Unconnected / Pull-Down Unconnected / Pull-Up Unconnected / Pull-Up
xMII disabled Unconnected / Pull-Down Unconnected / Pull-Up Pull-Down
ND i H
RMII MAC Unconnected / Pull-Down Pull-Down Unconnected / Pull-Up
a
ER gh
RMII PHY Unconnected / Pull-Down Pull-Down Pull-Down
., L
, U Sh
MII MAC Pull-Up Unconnected / Pull-Up Pull-Down
Co
AL *
y
MII PHY (full duplex only) Pull-Up Pull-Down Pull-Down
g
EN 23
lo
no
ID -jq
ch
NF jx
The P8_VDDO_SEL[1:0] must be configured to the power supply voltage that is connected to the P8
CO z1m
Te
interface (including SMI slave). Table 30 shows how to connect the pins for the different
ic
configurations.
LL 8vd
35 on
Table 30: P8_VDDO_SEL[1:0] Configuration
90 tr
VE jm
16 lec
P 8 P ow e r S u p pl y P 8 _V D D O _ S E L[ 1 ] P 8 _ VD D O _ S E L[ 0 ]
AR b
M 9stk
12 e E
3.3V (default) Unconnected / Pull-Up Unconnected / Pull-Up
1.8V Unconnected / Pull-Up Pull-Down
A# ing
f5
ND i H
3.3V Pull-Down Pull-Down
zs
a
60
ER gh
ND an
ih
, U Sh
The RMU_SELn[1:0] pins select the RMU port. Table 31 shows how to connect the pins for the
vd
different configurations.
2
AL *
4o
TI tlfs
EN 23
RMU Port R M U _ S EL n [ 1 ] R M U _ S EL n [ 0 ]
ID -jq
ou
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Device Physical Interfaces
9 0 tr
16 lec
12 e E
The 88Q5050 device contains a number of interfaces that support copper media. Table 32 shows
the possible interface combinations that can be configured for the 88Q5050 device’s ports. “xMII”
A# ing
stands for “MII / RMII / RGMII”.
ND i H
Each table row shows one combination, that is, there is a total of 5 possible interface combinations.
For connection details, see Section 3.2, Interfaces, on page 46.
a
ER gh
Table 32: Interface Combinations
., L
Po rt s 1 to 4 P or t 5 P or t 6 P or t 7 P or t 8 N o t es
, U Sh
Co
100BASE-T1 100BASE-T 100BASE-T SGMII xMII
AL *
1 X
TI tlfs
y
100BASE-T1 xMII 100BASE-T SGMII xMII Ports 5, 6, and 7 are shared. If any of
g
EN 23
lo
X these ports is configured as MII, RMII, or
no
ID -jq
ch
NF jx
1
port 5 configured as 100BASE-T1
CO z1m
Te
100BASE-T1 100BASE-T 100BASE-T xMII xMII interface, port 6 as 100BASE-TX interface,
1 X and port 7 as SGMII).
ic
LL 8vd
35 on
100BASE-T1 100BASE-T 100BASE-T SGMII GMII If port 8 is configured as GMII, ports 5, 6,
1 X and 7 can only be PHY or SERDES,
90 tr
VE jm
respectively.
16 lec
AR b
M 9stk
12 e E
3.1 Port Configuration
A# ing
f5
z4
ND i H
The configuration of ports 5/6/7 and port 8 is done once at reset by the configuration pins P567_
zs
SELx[1:0], P567_MODE[2:0], and P8_MODEx[2:0]. For details, also see Section 2.3, Configuration
a
60
ER gh
ND an
Table 33 and Table 34 list the possible settings for the port configuration pins and their
ih
dependencies
, U Sh
2 vd
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
The external signals for some of the listed pins are inverted. In these cases, the actual
external signals to be applied are shown in brackets.
ID -jq
ou
Caution
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Port Configuration
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
P567_ P567 P8_ R e s u lt in g P o r t Resulting Port R e s u lti n g Notes
S E L [1 ] , _ M O D E n [2 ], 5 6 Port 7
9 0 tr
P567_ MOD P8_ C o n fi gu r a t io n C o nf ig u r a ti on C o nf ig u r a ti o
16 lec
SE L n [0 ] E M O D E [1 : 0 ] n
12 e E
[ 2 :0 ]
0x0 [0x1] don’t don’t care 100BASE-T1 PHY 100BASE-TX PHY SERDES
A# ing
(default) care (SGMII)
ND i H
0x1 [0x0] 0x0 All values Full-duplex MII 100BASE-TX PHY SERDES Setting
a
except 0x3 [0x7] PHY (SGMII) P567_
ER gh
MODE[2:
0x1 MII PHY
0]
., L
, U Sh
[0x2] is
0x4 RMII PHY
Co
not
AL *
y
0x6 Disabled (undefine
g
d).
EN 23
lo
0x7 RGMII
no
ID -jq
(defaul P8_
ch
NF jx
t) MODEx[
CO z1m
2:0] must
Te
0x2 [0x3] 0x0 All values 100BASE-T1 PHY Full-duplex MII SERDES
except 0x3 [0x7] PHY (SGMII) not
ic
be set to
LL 8vd
35 on
0x1 MII PHY 0x3 [0x7]
(GMII
90 tr
VE jm
16 lec
mode).
AR b
12 e E
0x5 RMII MAC
A# ing
0x6 Disabled
f5
z4
0x7 RGMII
ND i H
zs
(defaul
a
t)
60
ER gh
0x3 [0x2] 0x0 All values 100BASE-T1 PHY 100BASE-TX PHY Full-duplex MII
o
ND an
ih
AL *
TI tlfs
m
EN 23
0x6 Disabled
NF jx
0x7 RGMII
CO z1m
(defaul
t)
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
P8_ P 56 7 _ S E L[ 1 ], P567_ Resulting Port 8 Notes
MODEn[2], P 56 7 _ S E Ln [0 ] M O D E [2 : 0 ] C o nf ig u r a ti on
9 0 tr
P8_
16 lec
MODE[1:0]
12 e E
0x0 [0x4] don’t care Full-duplex MII PHY
A# ing
0x1 [0x5] MII PHY
ND i H
0x2 [0x6] MII MAC
0x3 [0x7] 0x0 [0x1] don’t care GMII • P567_SELx[1:0] must be
a
ER gh
set to 0x0 [0x1].
• P567_VDDO_SEL and
., L
, U Sh
set to the same value.
Co
0x4 [0x0] don’t care RMII PHY
AL *
TI tlfs
y
0x5 [0x1] RMII MAC
g
EN 23
lo
0x6 [0x2] Disabled
no
ID -jq
ch
(default)
NF jx
CO z1m
Te
ic
LL 8vd
35 on
3.2 Interfaces
90 tr
VE jm
16 lec
AR b
12 e E
Ports1 to 5 of the 88Q5050 device support a 100 Mbps PHY interface that is compliant to the
A# ing
f5
100BASE-T1 copper IEEE standard. The MAC inside the switch works the same way regardless of
z4
ND i H
the external interface being used. Each PHY’s link, speed, duplex, and flow control information is
zs
directly communicated to the MAC that it is attached to, so the MAC tracks (and follows) the mode
a
60
ER gh
ND an
For a detailed description of the PHY functionality and registers, see the 88Q5050 Functional
ih
AL *
TI tlfs
m
MARVELL CONFIDENTIAL
Port 6 of the 88Q5050 device supports a 10/100 Mbps PHY interface that is compliant to the
EN 23
10BASE-T and 100BASE-TX copper IEEE standards. The MAC inside the switch works the same
ID -jq
way regardless of the external interface being used. Each PHY’s link, speed, duplex, and flow
ou
control information is directly communicated to the MAC that it is attached to, so the MAC tracks
NF jx
For a detailed description of the PHY functionality and registers, see the 88Q5050 Functional
LL 8vd
no
Interfaces
ch
Te
3.2.3 SERDES Interface
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Port 7 is a SERDES interface. It can be used for the following options:
Connection to Marvell® triple speed 10/100/1000 Mbps copper PHYs
9 0 tr
16 lec
Connection to 1000BASE-X fiber modules
SGMII
12 e E
Cross-chip connection to other Marvell switch devices
A# ing
For a detailed description of the SERDES functionality and registers, see the 88Q5050 Functional
Specification and 88Q5050 Register Specification.
ND i H
a
3.2.3.1 Triple-Speed PHY SERDES Interface Option
ER gh
., L
mode, the SERDES uses the SGMII protocol. The in-band link, speed, and duplex signals in the
, U Sh
SGMII protocol are ignored. The external PHY’s link, speed, duplex, and flow control information
Co
AL *
must be transferred to the port’s MAC so that the MAC is in the correct mode. This can either be
TI tlfs
done in the software (if the port’s PHYDetect bit is 0 – switch core’s PORT offset 0x00), or it is done
yg
automatically by the PHY Polling Unit (see Section 3.2.5, PHY Polling Unit (PPU), on page 54).
EN 23
lo
no
ID -jq
ch
NF jx
Port 7’s SERDES can be configured for 100BASE-FX or 1000BASE-X/SGMII modes. If configured
CO z1m
Te
for 1000BASE-X mode, the port enters 1000BASE-X mode even if an external PHY is detected at
the port’s SMI address.
ic
LL 8vd
35 on
The 1000BASE-X mode uses a PCS to auto-negotiate with a link partner to determine if flow control
should be supported or not (auto-negotiation can be disabled). The link will be automatically
90 tr
VE jm
16 lec
established if the port’s PCS determines Sync is OK (sets the port’s SyncOK to 1). The link will
AR b
automatically go down if SyncOK is 0. The speed is always 1000 Mbps, and the duplex mode is
M 9stk
12 e E
always full-duplex on 1000BASE-X ports. An interrupt can be generated on the ports when the link
changes its state (see switch core’s GLB2 offsets 0x00 and 0x01).
A# ing
f5
z4
a
Each switch port of the 88Q5050 device has a status register that reports information about that
60
ER gh
port’s MAC, SERDES, or digital interface. These registers can be used to check the current port
o
ND an
, U Sh
vd
AL *
4o
TI tlfs
The xMII/GMII digital interface supports many different modes defined in the following sections. The
m
MARVELL CONFIDENTIAL
mode to use is configured once at reset by the configuration pins (see Section 2.3, Configuration
EN 23
Pins (Bootstrapping), on page 36). If any of the ports is not connected to an external device, the port
ID -jq
ou
should be disabled.
NF jx
CO z1m
xMII/GMII PHY mode and xMII/GMII MAC mode are discussed in the following
sections. Electrically, there is no difference since the interface uses
LL 8vd
source-synchronous clocks. Each concept is discussed separately since the port can
Note be connected to either an external PHY (that is, MAC mode—where the port looks like
VE jm
a MAC supporting 10/100/1000 Mbps) or to an external MAC (that is, PHY mode—
AR b
where the port looks like a PHY supporting 1000 Mbps only).
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
3.2.4.1 MII MAC Mode
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
MII MAC mode, sometimes called “Forward MII”, configures port 5/6/7’s and/or port 8’s GMAC
35 on
inside the 88Q5050 device to act as a MAC so that it can be directly connected to an external
9 0 tr
MII-based PHY. In this mode, the 88Q5050 device receives the interface clocks (Px_OUTCLK and
16 lec
Px_INCLK) from the PHY and will work at any frequency from DC to 50 MHz. Both full-duplex and
12 e E
half-duplex modes are supported and need to be selected to match the mode of the link partner’s
MAC. The MII MAC mode is compliant with IEEE 802.3 clause 22. For auto-negotiation results to be
A# ing
properly communicated from the PHY to the MAC by the internal PPU, the PHY’s SMI address must
be set to the appropriate port number (0x05 for port 5, 0x06 for port 6, and so on) .
ND i H
Figure 10: MII MAC Interface Pins
a
ER gh
., L
, U Sh
Co
AL *
Px_INCLK RX_CLK
TI tlfs
Px_IND[3:0] RXD[3:0]
yg
Px_INDV RX_DV
EN 23
lo
no
ID -jq
ch
NF jx
Port 5/6/7
CO z1m
Te
acting as a with MII
ic
MAC
LL 8vd
35 on
90 tr
VE jm
Px_OUTCLK TX_CLK
16 lec
AR b
Px_OUTD[3:0] TXD[3:0]
M 9stk
12 e E
Px_OUTEN TX_EN
TX_ER
A# ing
f5
z4
ND i H
zs
a
60
ER gh
o
ND an
ih
, U Sh
2 vd
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Interfaces
ch
Te
3.2.4.2 MII PHY Mode
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
MII PHY mode, sometimes called “Reverse MII”, configures port 5/6/7’s and/or port 8’s GMAC inside
35 on
the 88Q5050 device to act as a PHY so that it can be directly connected to an external MAC. In this
9 0 tr
mode, the 88Q5050 device drives the interface clocks (INCLK and OUTCLK). The MII PHY mode is
16 lec
compliant with IEEE 802.3 clause 22.
12 e E
Figure 11: MII PHY Interface Pins
A# ing
ND i H
88Q5050
a
ER gh
Px_INCLK TX_CLK
Px_IND[3:0] TXD[3:0]
., L
Px_INDV
, U Sh TX_EN
Co
AL *
TI tlfs
Port 5/6/7
yg
and/or Port 8 CPU Device
EN 23
lo
acting as a with MII MAC
no
ID -jq
PHY
ch
NF jx
CO z1m
Te
Px_OUTCLK RX_CLK
ic
LL 8vd
Px_OUTD[3:0] RXD[3:0]
35 on
Px_OUTEN RX_DV
90 tr
VE jm
RX_ER
16 lec
AR b
M 9stk
12 e E
3.2.4.3 RMII MAC Mode
A# ing
f5
z4
RMII MAC mode supports 10 Mbps or 100 Mbps and full-duplex or half-duplex. In RMII MAC mode,
ND i H
REFCLK is an input and is expected to be 50 MHz for all data rates.
zs
a
60
ER gh
ND an
ih
, U Sh
88Q5050
2 vd
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
Px_IND[1:0] RXD[1:0]
Px_INDV CRS_DV
ID -jq
ou
NF jx
CO z1m
Port 5/6/7
and/or Port 8
RMII PHY
acting as a
LL 8vd
MAC
VE jm
Px_OUTCLK REFCLK
AR b
Px_OUTD[1:0] TXD[1:0]
M 9stk
Px_OUTEN TX_EN
RX_ER
5
4f
sz
0z
o6
no
Datasheet
ch
Te
3.2.4.4 RMII PHY Mode
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
RMII PHY mode, sometimes called “Reduced MII”, configures the desired MAC inside the 88Q5050
35 on
device to act as a 10 Mbps or 100 Mbps PHY, enabling it to be directly connected to an external
9 0 tr
CPU supporting an RMII. In RMII PHY mode, REFCLK is sourced internally and is 50 MHz for all
16 lec
data rates.
12 e E
Figure 13: RMII PHY Interface Pins
A# ing
ND i H
88Q5050
a
ER gh
., L
, U Sh
Px_INDV TX_EN
Co
AL *
TI tlfs
y
Port 5/6/7
g
and/or Port 8
EN 23
lo
RMII MAC
acting as a
no
ID -jq
PHY
ch
NF jx
CO z1m
Px_OUTCLK REFCLK
Te
Px_OUTD[1:0] RXD[1:0]
ic
Px_OUTEN CRS_DV
LL 8vd
35 on
RX_ER
90 tr
VE jm
16 lec
AR b
M 9stk
12 e E
A# ing
f5
z4
ND i H
zs
a
60
ER gh
o
ND an
ih
, U Sh
2 vd
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Interfaces
ch
Te
3.2.4.5 RGMII Mode
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
RGMII mode configures port 5/6/7’s and/or port 8’s GMAC to act as a Reduced Gigabit Media
35 on
Independent Interface (RGMII) so that it can be directly connected to an external RGMII-based
9 0 tr
Gigabit PHY or CPU. When RGMII mode is selected, transmit control (Px_OUTEN) is presented on
16 lec
both clock edges of Px_OUTCLK. Receive control (Px_INDV) is presented on both clock edges of
12 e E
Px_INCLK. A triple-speed interface is supported in RGMII mode (that is, 10 Mbps, 100 Mbps, and
1000 Mbps). When the PHY completes auto-negotiation and brings the link up, the auto-negotiated
A# ing
speed, duplex, and flow control information must be moved from the PHY to the MAC so that the
MAC matches the PHY’s settings. This is done automatically by the PPU if the port’s PHYDetect bit
ND i H
is set to 1 (switch core’s PORT offset 0x00).
a
ER gh
Figure 14: RGMII Pins
., L
, U Sh
88Q5050
Co
AL *
TI tlfs
y
Px_INCLK RXC
g
EN 23
lo
Px_IND[3:0] RXD[3:0]
no
ID -jq
Px_INDV RX_CTL
ch
NF jx
CO z1m
Te
Port 5/6/7 Device
ic
LL 8vd
35 on
90 tr
VE jm
16 lec
AR b
M 9stk
Px_OUTCLK TXC
12 e E
Px_OUTD[3:0] TXD[3:0]
A# ing
Px_OUTEN TX_CTL
f5
z4
ND i H
zs
a
60
ER gh
o
ND an
ih
, U Sh
2 vd
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
3.2.4.6 GMII MAC Mode
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
GMII MAC mode, sometimes called “Forward GMII”, configures port 8’s GMAC inside the 88Q5050
35 on
device to act as a Gigabit MAC (GMAC) so that it can be directly connected to an external
9 0 tr
GMII-based Gigabit PHY. In this mode, the 88Q5050 device receives the interface clocks (OUTCLK
16 lec
and INCLK) from the PHY, but generates GTX_CLK for the PHY. 10 Mbps, 100 Mbps, or 1000 Mbps
12 e E
is supported in this configuration. Full-duplex and half-duplex modes are supported at 10 Mbps or
100 Mbps. Full-duplex is supported at 1000 Mbps. When the PHY completes auto-negotiation and
A# ing
brings the link up, the auto-negotiated speed, duplex, and flow control information must be moved
from the PHY to the MAC so that the MAC matches the PHY’s settings. This is done automatically
ND i H
by the PPU if the port’s PHYDetect bit is set to 1 (switch core’s PORT offset 0x00). The interface
a
pins will track the speed that the MAC is set to.
ER gh
The speed and mode in the external PHY’s auto-negotiation must be restricted from advertising the
., L
, U Sh
This is done automatically by the PPU. The GMII MAC mode is compliant with IEEE 802.3
Co
clause 28. For auto-negotiation results to be properly communicated from the PHY to the MAC by
AL *
the internal PPU, the PHY’s SMI address must be set to 0x08 for port 8.
TI tlfs
yg
Figure 15: GMII MAC Interface Pins
EN 23
lo
no
ID -jq
88Q5050
ch
NF jx
CO z1m
Te
1
IND[7:4] = P567_IND[3:0]
P8_INCLK RX_CLK IND[3:0] = P8_IND[3:0]
ic
IND[7:0]1 RXD[7:0]
LL 8vd
2
OUTCLK = P8_OUTCLK
35 on
P8_INDV RX_DV 3
GTX_CLK = P567_OUTCLK
90 tr
VE jm
16 lec
4
OUTD[7:4] = P567_OUTD[3:0]
AR b
OUTD[3:0] = P8_OUTD[3:0]
M 9stk
12 e E
Port 8
PHY Device
A# ing
acting as a
f5
with GMII
GMAC
z4
ND i H
zs
OUTCLK2 TX_CLK
a
60
ER gh
GTX_CLK3 GTX_CLK
o
OUTD[7:0]4
ND an
TXD[7:0]
ih
P8_OUTEN TX_EN
, U Sh
vd
TX_ER
2
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
If port 8 is configured as GMII, it uses some of the port 5/6/7 interface pins.
CO z1m
Note
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Interfaces
ch
Te
3.2.4.7 GMII PHY Mode
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
GMII PHY mode, sometimes called “Reverse GMII”, configures port 8’s GMAC inside the 88Q5050
35 on
device to act as a Gigabit PHY so that it can be directly connected to an external GMAC. In this
9 0 tr
mode, the 88Q5050 device drives the transmit interface clock (GTX_CLK) and accepts the receive
16 lec
interface clock (INCLK). Only Gigabit full-duplex mode is supported, and it must match the mode of
12 e E
the link partner’s GMAC. The GMII PHY mode is compliant with IEEE 802.3 clause 28 in Gigabit
full-duplex. In this mode, there is no external PHY for port 8, so it is skipped by the PPU.
A# ing
This configuration is identical to the GMII MAC mode described above, except that a CPU is
ND i H
connected instead of a PHY. The lack of an external PHY device restricts the interface to Gigabit
speed only, with the link initially being down. This grants the CPU time to initialize itself before it
a
ER gh
enables the switch port connected to it by forcing link up in the switch port’s MAC (in the port’s
Physical Control Register – switch core’s PORT offset 0x01).
., L
, U Sh
Figure 16: GMII PHY Interface Pins
Co
AL *
TI tlfs
88Q5050
yg
EN 23
1
IND[7:4] = P567_IND[3:0]
lo
INCLK GTX_CLK IND[3:0] = P8_IND[3:0]
no
ID -jq
IND[7:0]1 TXD[7:0] 2
GTX_CLK = P567_OUTCLK
ch
NF jx
INDV TX_EN 3
OUTD[7:4] = P567_OUTD[3:0]
CO z1m
Te
OUTD[3:0] = P8_OUTD[3:0]
ic
LL 8vd
35 on
Port 8
CPU Device
acting as a
90 tr
VE jm
16 lec
PHY
AR b
M 9stk
12 e E
A# ing
GTX_CLK2 RX_CLK
f5
OUTD[7:0]3
z4
RXD[7:0]
OUTEN RX_DV
ND i H
zs
a
RX_ER
60
ER gh
o
ND an
ih
, U Sh
2 vd
AL *
4o
TI tlfs
If port 8 is configured as GMII, it uses some of the port 5/6/7 interface pins.
m
MARVELL CONFIDENTIAL
EN 23
Note
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
3.2.5 PHY Polling Unit (PPU)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
The 88Q5050 device contains a PHY Polling Unit (PPU) to transfer link, speed, duplex, and pause
information from an external 100BASE-TX or 1000BASE-T PHY to its associated MAC (the internal
9 0 tr
PHYs use a direct approach such that this information is transferred even if PHY polling is disabled
16 lec
on the port by its PHYDetect bit being 0 – switch core’s PORT offset 0x00). The PPU can perform
12 e E
this job only if the SMI address of the external PHY matches the physical port number that it is
connected to in the switch (that is,the PHY connected to port 5 uses SMI address 0x05, the PHY
A# ing
connected to port 6 uses SMI address 0x06 and so on) .
ND i H
If PHY polling is disabled on a port (that is, the port’s PHYDetect bit is 0), the software must perform
the job of setting the switch MAC’s mode to the mode of the PHY (for the external PHYs) by forcing
a
ER gh
the MAC’s link, speed, duplex, and pause settings (in the port’s Physical Control Register – switch
core’s PORT offset 0x01) based upon what it sees in the PHY’s registers. Link up must be the last
., L
, U Sh
duplex, and pause modes must only be changed while the port’s link is down).
Co
AL *
Even though the PPU has full access to the external and internal PHY’s registers, the software can
TI tlfs
access all PHY registers at any time by using the SMI PHY Command and Data registers (switch
yg
core’s GLB2 offsets 0x18 and 0x19).
EN 23
lo
no
ID -jq
ch
NF jx
The PPU is designed to work with 100BASE-TX and 1000BASE-T PHYs. It does not
CO z1m
Te
support 100BASE-T1 or 1000BASE-T1 PHYs.
If 100BASE-T1 or 1000BASE-T1 PHYs are connected externally, the CPU must poll
ic
Note
LL 8vd
35 on
90 tr
VE jm
16 lec
AR b
M 9stk
12 e E
A# ing
f5
z4
ND i H
zs
a
60
ER gh
o
ND an
ih
, U Sh
2 vd
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Absolute Maximum Ratings
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Electrical Specifications
9 0 tr
16 lec
12 e E
4.1 Absolute Maximum Ratings
A# ing
Table 35: Absolute Maximum Ratings
ND i H
Stresses above the absolute maximum ratings listed here may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.
a
ER gh
Sy m b o l Parameter Min Ty p Max U ni t
., L
, U Sh
S_AVDD18
Co
VDDA(33) 3.3V Power Supply Voltage1 on AVDD33 -0.30 -- 3.60 V
AL *
TI tlfs
y
VDD(1.0) 1.0V Power Supply Voltage on VDD -0.30 -- 1.20 V
g
EN 23
lo
VDDO Power Supply Voltage on VDDO, VDDO_P567, -0.30 -- 3.60 V
no
and VDDO_P8
ID -jq
ch
VDDO(EFUS -0.30 -- 2.75 V
NF jx
CO z1m
E)
Te
VPIN Voltage applied to any Digital Input Pin -0.30 -- 3.60 V
ic
LL 8vd
or VDDO + 0.7
35 on
whichever is less
90 tr
VE jm
16 lec
AR b
12 e E
2
TSTORAGE Storage Temperature -55 -- +125 °C
A# ing
f5
For extended storage time greater than 24 hours, +85°C should be the maximum.
a
60
ER gh
o
ND an
ih
, U Sh
2 vd
AL *
TI tlfs
Caution
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
4.2 Recommended Operating Conditions
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Table 36: Recommended Operating Conditions
9 0 tr
16 lec
Sy m b o l Parameter C o n d iti o n Min Ty p Max Un
it
12 e E
VDDA(18) AVDD18 Supply1 For AVDD18 and S_AVDD18 1.71 1.80 1.89 V
A# ing
1
VDDA(33) AVDD33 Supply For AVDD33 3.14 3.30 3.46 V
VDD Supply1
ND i H
VDD(1.0) For VDD 0.95 1.00 1.05 V
VDDO Supply1,2 • For VDDO at 1.8V
a
VDDO 1.71 1.80 1.89 V
ER gh
• For VDDO at 2.5V 2.37 2.50 2.63 V
., L
, U Sh
VDDO(EFUS VDDO Supply1,3 • For VDDO_EFUSE at 1.71 1.80 1.89 V
Co
1.8V
AL *
E)
TI tlfs
y
• For VDDO_EFUSE at 2.37 2.50 2.63 V
g
2.5V
EN 23
lo
no
TA Ambient Operating For AEC-Q100 Grade 2 -40 -- 105 °C
ID -jq
Temperature
ch
NF jx
Te
RSET Internal Bias Reference External resistor value 4950 5000 5050
ic
LL 8vd
required to be placed
35 on
between RSET and VSS pins
90 tr
VE jm
16 lec
AR b
2. Some VDDO pins can be configured to either 1.8V, 2.5V, or 3.3V. To guarantee proper operation, the voltage must be set within the
M 9stk
12 e E
appropriate ranges in this table. VDDO voltages between 1.89V and 2.37V and between 2.63V and 3.14V are not supported.
3. The VDDO_EFUSE pin can be configured to either 1.8V or 2.5V. To guarantee proper operation, the voltage must be set within the
A# ing
appropriate ranges in this table. VDDO(EFUSE) voltages between 1.89V and 2.37V are not supported.
f5
z4
ND i H
zs
ER gh
o
ND an
, U Sh
vd
AL *
4o
(Over full range of values listed in the Recommended Operating Conditions, unless otherwise specified)
TI tlfs
m
S ym bo l P ar a m e te r Min Ty p Max U ni t
MARVELL CONFIDENTIAL
EN 23
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
DC Electrical Characteristics
ch
Te
4.3.2 100BASE-T1 Transceiver
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
IEEE tests are typically based on templates and cannot simply be specified by a number. For an
exact description of the template and the test conditions, see the IEEE Standard 802.3bw.
9 0 tr
16 lec
Table 38: 100BASE-T1 Transceiver DC Characteristics
(Over full range of values listed in the Recommended Operating Conditions, unless otherwise specified)
12 e E
Sy m b o l Parameter C o n d iti o n Min Ty p Max U ni t
A# ing
VODIFF Absolute Peak Differential Output 100BASE-T1 mode -- -- 2.2 V
ND i H
Voltage1
a
VDIST Peak Distortion IEEE test mode 4 -- -- 15 mV
ER gh
1. Transmit power conforms to IEEE 802.3bw Transmit PSD mask.
., L
, U Sh
4.3.3 100BASE-TX Transceiver
Co
AL *
TI tlfs
yg
IEEE tests are typically based on templates and cannot simply be specified by a number. For an
EN 23
lo
exact description of the template and the test conditions, see the following specifications:
no
ID -jq
ch
NF jx
Te
Table 39: 100BASE-TX Transceiver DC Characteristics
ic
LL 8vd
(Over full range of values listed in the Recommended Operating Conditions, unless otherwise specified)
35 on
Sy m b o l Parameter C o n d iti o n Min Ty p Max U ni t
90 tr
VE jm
16 lec
VODIFF Absolute Peak Differential • 10BASE-T no cable -- 2.0 2.1 V
AR b
Output Voltage
M 9stk
• 10BASE-Te no cable
12 e E
1.54 1.75 1.96
• 10BASE-T cable 5851 -- -- mV
A# ing
f5
model
z4
a
Overshoot2 100BASE-TX mode 0 -- 5% V
60
ER gh
ND an
(positive/ negative)
ih
, U Sh
vd
AL *
4o
TI tlfs
peak-peak
EN 23
peak-peak
NF jx
1. IEEE Standard 802.3-2008 Clause 14, Figure 14-9 shows the template for the “far-end” wave form. This template allows as little as
CO z1m
form.
3. The ANSI TP-PMD Specification requires that any received signal with peak-to-peak differential amplitude greater than 1000 mV should
VE jm
turn on signal detect (internal signal in 100BASE-TX mode). The device will accept signals typically with 460 mV peak-to-peak differential
amplitude.
AR b
4. The ANSI-PMD Specification requires that any received signal with peak-to-peak differential amplitude less than 200 mV should
M 9stk
de-assert signal detect (internal signal in 100BASE-TX mode). The device will reject signals typically with peak-to-peak differential
amplitude less than 360 mV.
5
4f
sz
0z
o6
no
Datasheet
ch
Te
4.3.4 SGMII
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
The SGMII specification is a de-facto standard proposed by Cisco. It uses a modified LVDS
specification based on the IEEE Standard 1596.3. For the exact definition of the terminology used in
9 0 tr
the following table, see the standard. The 88Q5050 device adds flexibility by allowing programmable
16 lec
output voltage swing and supply voltage option.
12 e E
Table 40: SGMII Output DC Characteristics
A# ing
(Over full range of values listed in the Recommended Operating Conditions, unless otherwise specified)
ND i H
S ym bo l P ar a m e te r 1 Min Ty p Max U ni t
a
VOH Output Voltage High -- -- 1600 mV
ER gh
VOL Output Voltage Low 700 -- -- mV
., L
, U Sh
2
|VOD| Output Voltage Swing (differential, peak) Programmable – see Table 41 mV
Co
AL *
peak
TI tlfs
y
VOffset Output Offset Voltage Variable – see Section 4.3.4.1 mV
g
(also called Common Mode Voltage)
EN 23
lo
no
ID -jq
ch
NF jx
CO z1m
Te
Delta VOD Change in VOD between 0 and 1 -- -- 25 mV
ic
LL 8vd
35 on
Delta VOffset Change in VOffset between 0 and 1 -- -- 25 mV
90 tr
VE jm
16 lec
AR b
12 e E
shorted
IX+, IX- Power-Off Leakage Current -- -- 10 A
A# ing
f5
z4
1. Parameters are measured with outputs AC connected with 100 differential load.
ND i H
2. Output amplitude is programmable by writing to SERDES register 26_1.2:0.
zs
a
60
ER gh
Table 41: Programmable SGMII Output Amplitude (SERDES Page 1 Register 26)
o
ND an
ih
, U Sh
B it s F ie l d D e s cr ip t i o n
2 vd
Amplitude1
TI tlfs
000: 14 mV
001: 112 mV
m
MARVELL CONFIDENTIAL
EN 23
010: 210 mV
011: 308 mV
ID -jq
ou
100: 406 mV
NF jx
101: 504 mV
CO z1m
110: 602 mV
111: 700 mV
LL 8vd
NOTE: Internal bias minus the differential peak voltage must be greater
than 700 mV.
VE jm
1. Cisco SGMII specification limits are |VOD| = 150 mV to 400 mV peak differential.
AR b
M 9stk
5
4f
sz
0z
o6
no
DC Electrical Characteristics
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
CML Outputs CML Inputs
9 0 tr
16 lec
Internal Bias1 Internal Bias1
12 e E
A# ing
50 ohm 50 ohm 50 ohm
ND i H
TXP
a
TXN RXP
ER gh
., L
, U Sh
Co
AL *
TI tlfs
Internal Bias
y
Isink
g
EN 23
lo
no
ID -jq
50 ohm
ch
NF jx
CO z1m
Te
RXN
ic
LL 8vd
35 on
AVDD supply and is typically 1.05V.
90 tr
VE jm
16 lec
AR b
M 9stk
12 e E
A# ing
f5
ND i H
There are four different main configurations for the SGMII/fiber interface connections:
zs
a
DC connection to an LVDS receiver
60
ER gh
ND an
ih
AL *
If AC coupling or DC coupling to an LVDS receiver is used, the DC output levels are determined by
4o
TI tlfs
the following:
m
MARVELL CONFIDENTIAL
Internal bias. See Figure 17 for details. (If AVDD18 is used to generate the internal bias, the
EN 23
The output voltage swing is programmed by register 26_1.2:0 (see Table 41).
NF jx
VOffset = internal bias - single-ended peak-peak voltage swing. See Figure 18 for details.
CO z1m
If DC coupling is used with a CML receiver, the DC levels will be determined by a combination of the
MAC’s output structure and the input structure shown in the CML Inputs diagram in Figure 19.
LL 8vd
Assuming the same MAC CML voltage levels and structure, the common mode output levels will be
determined by:
VE jm
VOffset = internal bias - single-ended peak-peak voltage swing/2. See Figure 19 for details.
AR b
If DC coupling is used, the output voltage DC levels are determined by the AC coupling
M 9stk
considerations above, plus the I/O buffer structure of the MAC.
5
4f
sz
0z
o6
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
9 0 tr
CML Outputs
16 lec
Internal Bias1
12 e E
V = Internal Bias - Vpeak AC
A# ing
Coupling
50 ohm 50 ohm Cap.
ND i H
TXP V = VOffset
a
TXN
ER gh
(opposite
of TXP)
., L
, U Sh
Co
AL *
TI tlfs
I sink
yg
EN 23
lo
no
ID -jq
ch
NF jx
CO z1m
Te
AVDD supply and is typically 1.05V.
ic
LL 8vd
35 on
90 tr
VE jm
16 lec
AR b
M 9stk
12 e E
(Internal Bias) - Vpeak
A# ing
f5
z4
Vpeak ND i H
zs
ER gh
o
ND an
ih
, U Sh
2 vd
TI tlfs
EN 23
ID -jq
ou
NF jx
CO z1m
TXN
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
DC Electrical Characteristics
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
CML Outputs CML Inputs
9 0 tr
16 lec
Internal Bias1
Internal Bias1
12 e E
V = Internal Bias
50 ohm
A# ing
50 ohm 50 ohm
TXP V = VOffset
ND i H
TXN RXP
a
ER gh
(opposite
of TXP) V = (Internal Bias) -
., L
, U Sh
Internal Bias
Co
AL *
I
TI tlfs
sink
y
50 ohm
g
EN 23
lo
no
ID -jq
RXN
ch
NF jx
CO z1m
Te
1. Internal bias is generated from the
AVDD supply and is typically 1.05V.
ic
LL 8vd
35 on
90 tr
VE jm
16 lec
AR b
M 9stk
12 e E
Internal
Bias
A# ing
f5
z4
Vpeak ND i H
zs
ER gh
o
ND an
ih
, U Sh
2 vd
TI tlfs
Bias
EN 23
ID -jq
ou
NF jx
CO z1m
TXN
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
(Over full range of values listed in the Recommended Operating Conditions, unless otherwise specified)
35 on
S ym bo l P ar a m e te r Min Ty p Max U ni t
9 0 tr
16 lec
VI Input Voltage Range a or b 675 -- 1725 mV
12 e E
VIDTH1 Input Differential Threshold -50 -- 50 mV
|RXP - RXN|
A# ing
VHYST2 Input Differential Hysteresis 25 -- -- mV
ND i H
RIN Receiver 100W Differential Input 80 -- 120 W
Impedance
a
ER gh
1. Receiver is at high level when VRXP - VRXN is greater than VIDTH and is at low level when VRXP - VRXN is less than
., L
, U Sh
2. A minimum hysteresis of VHYST is present between -VIDTH and +VIDTH as shown in Figure 20.
Co
AL *
TI tlfs
yg
EN 23
lo
Receiver High
no
ID -jq
ch
NF jx
-50 mV +50 mV
CO z1m
Te
ic
LL 8vd
VS_IN+ - VS_IN-
35 on
-VIDTH +VIDTH
90 tr
VE jm
16 lec
AR b
Receiver Low
M 9stk
12 e E
VHYST
A# ing
f5
z4
ND i H
4.3.5 Digital Pins
zs
a
60
ER gh
Table 43: DC Characteristics for Pins GPIO[4:0], INTn, MDC_CPU, MDC_PHY, MDIO_CPU, MDIO_
o
ND an
ih
PHY, RESETn, SPI_CS, SPI_SCLK, SPI_SIO[3:0], TCK, TDI, TDO, TEST, TMS, TRSTn
, U Sh
vd
(Sheet 1 of 2)
2
AL *
TI tlfs
1 • 1.8V Operation
VDDO Power Supply Voltage 1.71 1.8 1.89 V
m
MARVELL CONFIDENTIAL
EN 23
no
DC Electrical Characteristics
ch
Te
Table 43: DC Characteristics for Pins GPIO[4:0], INTn, MDC_CPU, MDC_PHY, MDIO_CPU, MDIO_
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
PHY, RESETn, SPI_CS, SPI_SCLK, SPI_SIO[3:0], TCK, TDI, TDO, TEST, TMS, TRSTn
35 on
(Sheet 2 of 2)
9 0 tr
Sy m b o l Parameter C o n d iti o n Min Ty p Max U ni t
16 lec
2 • 1.8V Operation
VOH Output High Voltage VDDO - 0.2 -- VDDO V
12 e E
• 2.5V Operation VDDO - 0.4 -- VDDO V
A# ing
• 3.3V Operation VDDO - 0.4 -- VDDO V
ND i H
Pull-Up Strength (applicable VPAD = 0.5 × VDDO 10 -- 50 A
to pull-up pad only)
a
ER gh
Pull-Down Strength VPAD = 0.5 × VDDO 10 -- 50 A
., L
only)
, U Sh
Output Low Current1 • 1.8V Operation
Co
IOL 3 -- -- mA
AL *
@ 0.2V
TI tlfs
y
• 2.5V Operation 7 -- -- mA
g
EN 23
@ 0.4V
lo
no
ID -jq
• 3.3V Operation 7 -- -- mA
@ 0.4V
ch
NF jx
Te
@ VDDO - 0.2V
ic
LL 8vd
• 2.5V Operation 7 -- -- mA
35 on
@ VDDO - 0.4V
90 tr
VE jm
• 3.3V Operation 7 -- -- mA
16 lec
@ VDDO - 0.4V
AR b
M 9stk
12 e E
CI Input Capacitance -- -- 5 pF
A
A# ing
IIN Input Leakage Current VDDO is ON, -- -- 2
f5
ND i H
zs
1. The characteristics for 2.5V and 1.8V only apply to MDC_CPU, MDC_PHY, MDIO_CPU, and MDIO_PHY. All other pins are always
a
supplied by 3.3V.
60
ER gh
2. The characteristics apply to GPIO[4:0], INTn, MDC_CPU, MDC_PHY, MDIO_CPU, MDIO_PHY, SPI_CS, SPI_SCLK, SPI_SIO[3:0], TDO.
o
ND an
ih
, U Sh
vd
Table 44: DC Characteristics for Pins P567_INCLK, P567_IND[3:0], P567_INDV, P8_INCLK, P8_
2
IND[3:0], P8_INDV
AL *
4o
TI tlfs
EN 23
+ 0.1
AR b
CI Input Capacitance -- -- 5 pF
IIN Input Leakage Current VDDO is ON, -- -- 2 A
5
4f
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
OUTCLK, P8_OUTD[3:0], P8_OUTEN (Sheet 1 of 2)
35 on
Symbol P a r a m e te r C o nd i tio n Min Ty p Max U ni t
9 0 tr
16 lec
VDDO Power Supply Voltage • 1.8V Operation 1.71 1.8 1.89 V
12 e E
• 2.5V Operation 2.37 2.5 2.63 V
• 3.3V Operation 3.14 3.3 3.46 V
A# ing
VIL Input Low Voltage • 1.8V Operation -0.4 -- 0.4 V
ND i H
• 2.5V Operation -0.4 -- 0.4 V
a
ER gh
• 3.3V Operation -0.4 -- 0.4 V
., L
, U Sh
• 2.5V Operation 1.7 -- VDDO + 0.4 V
Co
• 3.3V Operation
AL *
2 -- VDDO + 0.4 V
TI tlfs
y
VHYS Voltage Hysteresis 150 -- -- mV
g
EN 23
lo
VOL Output Low Voltage • 1.8V Operation 0 -- 0.2 V
no
ID -jq
ch
NF jx
Te
VOH Output High Voltage • 1.8V Operation VDDO - 0.2 -- VDDO V
ic
LL 8vd
35 on
• 3.3V Operation VDDO - 0.4 -- VDDO V
90 tr
VE jm
16 lec
Pull-Up Strength VPAD = 0.5 × VDDO 10 -- 50 A
AR b
(applicable to pull-up
M 9stk
12 e E
pad only)
A# ing
Pull-Down Strength VPAD = 0.5 × VDDO 10 -- 50 A
f5
(applicable to
z4
a
CI Input Capacitance -- -- 5 pF
60
ER gh
ND an
ih
ZP/ZN = 0000 -- -- -- mA
AL *
4o
TI tlfs
ZP/ZN = 0111 2 -- -- mA
m
ZP/ZN = 1111 6 -- -- mA
MARVELL CONFIDENTIAL
EN 23
ZP/ZN = 0000 2 -- -- mA
ZP/ZN = 0111 6 -- -- mA
NF jx
ZP/ZN = 1111 9 -- -- mA
CO z1m
ZP/ZN = 0000 2 -- -- mA
ZP/ZN = 0111 6 -- -- mA
VE jm
ZP/ZN = 1111 9 -- -- mA
AR b
M 9stk
5
4f
sz
0z
o6
no
DC Electrical Characteristics
ch
Te
Table 45: DC Characteristics for Pins P567_OUTCLK, P567_OUTD[3:0], P567_OUTEN, P8_
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
OUTCLK, P8_OUTD[3:0], P8_OUTEN (Sheet 2 of 2)
35 on
Symbol P a r a m e te r C o nd i tio n Min Ty p Max U ni t
9 0 tr
16 lec
IOH Output High Current 1.8V Operation @ VDDO - 0.4V,
ZP/ZN = 0000 -- -- -- mA
12 e E
ZP/ZN = 0111 2 -- -- mA
ZP/ZN = 1111 6 -- -- mA
A# ing
2.5V Operation @ VDDO - 0.4V,
ND i H
ZP/ZN = 0000 2 -- -- mA
ZP/ZN = 0111 6 -- -- mA
a
ER gh
ZP/ZN = 1111 9 -- -- mA
., L
, U Sh ZP/ZN = 0000 2 -- -- mA
ZP/ZN = 0111 6 -- -- mA
Co
ZP/ZN = 1111 9 -- -- mA
AL *
TI tlfs
yg
EN 23
lo
no
ID -jq
ch
NF jx
Te
VIL Input Low Voltage -0.4 -- 0.3 × VDDO V
ic
VIH Input High Voltage 0.7 × VDDO -- VDDO + 0.4 V
LL 8vd
35 on
VHYS Voltage Hysteresis 150 -- -- mV
90 tr
VE jm
16 lec
VOL Output Low Voltage 0 -- 0.4 V
AR b
M 9stk
12 e E
Pull-Up Strength (applicable VPAD = 0.5 × VDDO 10 -- 50 A
A# ing
f5
CI Input Capacitance ND i H
-- -- 5 pF
zs
A
a
IIN Input Leakage Current VDDO is ON, -- -- 2
60
ER gh
ND an
, U Sh
vd
AL *
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
no
Datasheet
ch
Te
Table 47: DC Characteristics for Pins TRACECLK, TRACEDATA[3:0], TRACESWO
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
Symbol P a r am et e r C on d it io n Min Ty p Max U ni t
35 on
Pull-Up Strength VPAD = 0.5 × VDDO 10 -- 50 A
9 0 tr
16 lec
(applicable to pull-up
pad only)
12 e E
Pull-Down Strength VPAD = 0.5 × VDDO 10 -- 50 A
(applicable to pull-down
A# ing
pad only)
ND i H
CI Input Capacitance -- -- 5 pF
a
IIN Input Leakage Current VDDO is ON, -- -- 2 A
ER gh
0V < VPAD < VDDO
., L
, U Sh
ZP/ZN = 0000 1 -- -- mA
Co
ZP/ZN = 0111 5 -- -- mA
AL *
ZP/ZN = 1111 9 -- -- mA
TI tlfs
yg
IOH Output High Current 3.3V Operation @ VDDO - 0.4V,
EN 23
lo
ZP/ZN = 0000 1 -- -- mA
no
ID -jq
ZP/ZN = 0111 5 -- -- mA
ZP/ZN = 1111 9 -- -- mA
ch
NF jx
CO z1m
Te
Table 48: DC Characteristics for Pin R_LEDn[2:0]
ic
LL 8vd
35 on
Sy m b o l Parameter C o n di ti o n Min Ty pe Max Unit
90 tr
VE jm
16 lec
AR b
DO
M 9stk
12 e E
VIH Input High Voltage 0.7 × VDDO -- VDDO + V
0.4
A# ing
f5
ND i H
VOL Output Low Voltage 0 -- 0.4 V
zs
a
60
ER gh
ND an
only)
2
AL *
CI Input Capacitance -- -- 5 pF
4o
TI tlfs
EN 23
no
AC Electrical Characteristics
ch
Te
Table 49: DC Characteristics for 5V Tolerant OC Pins TWSI_SCK, TWSI_SDA (Sheet 2 of 2)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
Sy m b o l Parameter C o n d iti o n Min Ty p Max U ni t
35 on
IOL Output Low Current @ 0.4V 16 -- -- mA
9 0 tr
16 lec
CI Input Capacitance -- -- 5 pF
12 e E
IIN Input Leakage Current • VDDO is ON, -- -- 10 A
0V < VPAD <
A# ing
VDDO
• VDDO is OFF, A
ND i H
-- -- 10
0V < VPAD <
a
VDDO
ER gh
., L
, U Sh
Co
Internal Resistors
AL *
TI tlfs
y
S ym bo l P ar a m e te r Min Ty p Max U ni t
g
EN 23
lo
RPull-Up Pull-Up Resistance 29.7 -- 181.5 k
no
ID -jq
ch
NF jx
CO z1m
Te
4.3.7 Low Power Signal Detect
ic
LL 8vd
35 on
Table 50: Low Power Signal Detect DC Characteristics
(Over full range of values listed in the Recommended Operating Conditions, unless otherwise specified)
90 tr
VE jm
16 lec
Sy m b o l Parameter C o n d iti o n Min Ty p Max U ni t
AR b
M 9stk
12 e E
ISTANDBY Standby Current VBAT = 12V -- -- 50 A
IINH INH pin Source Current -- -- 50 A
A# ing
f5
z4
a
60
ER gh
o
ND an
ih
AL *
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
P ar a m e te r Min Ty p Max U ni t
NF jx
CO z1m
ppm ppm
High Time 13 20 27 ns
VE jm
Low Time 13 20 27 ns
AR b
M 9stk
ps1
4f
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
1. Broadband peak-to-peak = 200 ps, Broadband rms = 3 ps, 12 kHz to 20 MHz rms = 1 ps.
ic
35 on
4.4.2 Power-On Reset
9 0 tr
16 lec
#
12 e E
(Over full range of values listed in the Recommended Operating Conditions, unless otherwise specified)
A# ing
S ym bo l P ar a m e te r Min Ty p Max U ni t
ND i H
TPU_RESET Valid power to RESETn de-asserted 10 -- -- ms
a
TSU_XTAL_IN Number of valid reference clock 10 -- -- clock
ER gh
cycles prior to RESETn de-asserted cycles
., L
, U Sh
Figure 21: Power-On Reset Timing
Co
AL *
TI tlfs
T PU_RESET
yg
EN 23
lo
Power T SU_XTAL_IN
no
ID -jq
ch
NF jx
CO z1m
Te
XTAL
ic
LL 8vd
35 on
90 tr
VE jm
16 lec
RESETn
AR b
M 9stk
12 e E
4.4.3 100BASE-T1 Transceiver
A# ing
f5
z4
IEEE tests are typically based on templates and cannot simply be specified by a number. For an
ND i H
exact description of the template and the test conditions, see the IEEE Standard 802.3bw.
zs
a
#
60
ER gh
(Over full range of values listed in the Recommended Operating Conditions, unless otherwise specified)
ND an
ih
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
NF jx
IEEE tests are typically based on templates and cannot simply be specified by number. For an exact
CO z1m
description of the templates and the test conditions, see the following specifications:
10BASE-T: IEEE Standard 802.3-2008 Clause 14
LL 8vd
S ym bo l P ar a m e te r Min Ty p Max U ni t
TRISE Rise Time 3.0 4.0 5.0 ns
5
4f
no
AC Electrical Characteristics
ch
Te
Table 54: 100BASE-TX Transceiver AC Characteristics (Sheet 2 of 2)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
(Over full range of values listed in the Recommended Operating Conditions, unless otherwise specified)
35 on
S ym bo l P ar a m e te r Min Ty p Max U ni t
9 0 tr
16 lec
TRISE/TFALL Rise/Fall Time Symmetry 0 -- 0.5 ns
Symmetry
12 e E
DCD Duty Cycle Distortion 0 -- 0.51 ns,
peak-peak
A# ing
Transmit Jitter 0 -- 1.4 ns,
ND i H
peak-peak
a
ER gh
1. ANSI X3.263-1995 Standard, Figure 9-3
., L
4.4.5 SGMII
, U Sh
Co
AL *
(Over full range of values listed in the Recommended Operating Conditions, unless otherwise specified)
yg
EN 23
S ym bo l P ar a m e te r Min Ty p Max U ni t
lo
no
ID -jq
ch
NF jx
Te
1
TSKEW1 Skew between two members of a -- -- 20 ps
differential pair
ic
LL 8vd
35 on
TOutputJitter Total Output Jitter Tolerance -- 127 -- ps
(Deterministic + 14 × rms Random)
90 tr
VE jm
16 lec
AR b
12 e E
Figure 22: Serial Interface Rise and Fall Times
A# ing
f5
z4
ND i H
zs
a
60
ER gh
T X P /N
o
ND an
T R IS E T FALL
ih
, U Sh
vd
TT X P / N
2
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
(Over full range of values listed in the Recommended Operating Conditions, unless otherwise specified)
NF jx
S ym bo l P ar a m e te r Min Ty p Max U ni t
CO z1m
no
Datasheet
ch
Te
4.4.6 MII
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
4.4.6.1 PHY Mode
9 0 tr
16 lec
In PHY mode, the
P[x]_INCLK pins are outputs
12 e E
P[x]_OUTCLK pins are outputs
A# ing
Table 57: MII PHY Mode Input AC Characteristics Timing
ND i H
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
a
Sy m b o l Parameter C o n d iti o n Min Ty p Max U ni t
ER gh
TP_TX_CLK1 P[x]_INCLK Period • 10BASE mode -- 400 -- ns
., L
, U Sh • 100BASE mode -- 40 -- ns
TH_TX_CLK P[x]_INCLK High • 10BASE mode 160 200 240 ns
Co
AL *
• 100BASE mode
TI tlfs
16 20 24 ns
yg
TL_TX_CLK P[x]_INCLK Low • 10BASE mode 160 200 240 ns
EN 23
lo
• 100BASE mode 16 20 24 ns
no
ID -jq
ch
NF jx
Te
going high
ic
THD_TX MII Inputs (P[x]_IND[3:0], 0 -- -- ns
LL 8vd
35 on
P[x]_INDV) valid after P[x]_INCLK
90 tr
going high
VE jm
16 lec
AR b
12 e E
A# ing
Figure 23: MII PHY Mode Input Timing
f5
z4
ND i H
zs
TH _ T X _ C L K
a
60
ER gh
o
T
ND an
IN C L K L_TX _C LK
ih
, U Sh
2 vd
T P_ TX _C LK
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
IN P U T S
ID -jq
ou
NF jx
T H D _TX
CO z1m
T SU _TX
LL 8vd
VE jm
NOTE: IN C L K is th e c lo c k u s e d to c lo c k th e in p u t d a ta .
It is a n o u tp u t in th is m o d e .
AR b
M 9stk
5
4f
sz
0z
o6
no
AC Electrical Characteristics
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
35 on
Sy m b o l Parameter C o n d iti o n Min Ty p Max U ni t
9 0 tr
16 lec
TP_RX_CLK1 P[x]_OUTCLK Period • 10BASE mode -- 400 -- ns
12 e E
• 100BASE mode -- 40 -- ns
TH_RX_CLK P[x]_OUTCLK High • 10BASE mode 160 200 240 ns
A# ing
• 100BASE mode 16 20 24 ns
ND i H
TL_RX_CLK P[x]_OUTCLK Low • 10BASE mode 160 200 240 ns
a
ER gh
• 100BASE mode 16 20 24 ns
., L
(P[x]_OUTD[3:0], P[x]_OUTEN) valid
, U Sh
Co
TCQ_MIN P[x]_OUTCLK to outputs 10 -- -- ns
AL *
(P[x]_OUTD[3:0], P[x]_OUTEN)
TI tlfs
y
invalid
g
EN 23
lo
1. 2.5 MHz for 10 Mbps or 25 MHz for 100 Mbps.
no
ID -jq
ch
NF jx
Te
ic
TH _ R X _ C L K
LL 8vd
35 on
90 tr
VE jm
16 lec
O U TC LK L _R X_C LK
AR b
M 9stk
12 e E
T P _R X_C LK
A# ing
f5
z4
ND i H
zs
a
OUTPUTS
60
ER gh
o
ND an
T CQ_M AX T C Q _ M IN
ih
, U Sh
2 vd
O U T C L K is th e c lo c k u s e d to c lo c k th e o u tp u t d a ta .
AL *
NO TE:
4o
TI tlfs
It is a n o u tp u t in th is m o d e .
m
MARVELL CONFIDENTIAL
EN 23
NF jx
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
35 on
Sy m b o l Parameter C o n d iti o n Min Ty p Max U ni t
9 0 tr
16 lec
TSU_RX MII inputs (P[x]_IND[3:0], P[x]_INDV) With 10 pF load 10 -- -- ns
valid prior to P[x]_INCLK going high
12 e E
THD_RX MII inputs (P[x]_IND[3:0], P[x]_INDV) With 10 pF load 10 -- -- ns
A# ing
valid after P[x]_INCLK going high
ND i H
a
Figure 25: MII MAC Mode Input Timing
ER gh
., L
, U Sh
Co
AL *
IN C L K
TI tlfs
yg
EN 23
lo
no
ID -jq
T H D _R X
ch
NF jx
CO z1m
Te
IN P U T S
ic
LL 8vd
35 on
T SU _R X
90 tr
VE jm
16 lec
AR b
NOTE: IN C L K is th e c lo c k u s e d to c lo c k th e in p u t d a ta .
M 9stk
12 e E
It is a n in p u t in th is m o d e .
A# ing
f5
ND i H
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
zs
a
Sy m b o l Parameter C o n d iti o n Min Ty p Max U ni t
60
ER gh
o
AL *
(P[x]_OUTD[3:0], P[x]_OUTEN)
4o
TI tlfs
invalid
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
AC Electrical Characteristics
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
9 0 tr
16 lec
12 e E
O U TC LK
A# ing
ND i H
a
ER gh
OUTPUTS
., L
, U Sh
T CQ_M AX T C Q _ M IN
Co
AL *
TI tlfs
y
NOTE: O U T C L K is th e c lo c k u s e d to c lo c k th e o u tp u t d a ta .
g
EN 23
lo
It is a n in p u t in th is m o d e .
no
ID -jq
ch
NF jx
4.4.7 RMII
CO z1m
Te
Table 61: RMII Input AC Characteristics, Using OUTCLK
ic
LL 8vd
35 on
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
90 tr
Sy m b o l Parameter C o n d iti o n Min Ty p Max U ni t
VE jm
16 lec
period1
AR b
12 e E
TH_TX_CLK P[x]_OUTCLK High 100BASE mode 8 10 12 ns
A# ing
TL_TX_CLK P[x]_OUTCLK Low 100BASE mode 8 10 12 ns
f5
z4
a
60
ER gh
ND an
ih
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
TH _ T X _ C L K
9 0 tr
16 lec
12 e E
O U TC LK
T L_TX_C LK
A# ing
T P_ TX _C LK
ND i H
a
ER gh
IN P U T S
., L
, U Sh
T H D _TX
Co
AL *
T SU _TX
TI tlfs
yg
EN 23
lo
NOTE: O U T C L K is th e c lo c k u s e d to c lo c k th e in p u t d a ta .
no
ID -jq
It is a n o u tp u t in th is m o d e .
ch
NF jx
CO z1m
Te
Table 62: RMII Output AC Characteristics, Using OUTCLK
ic
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
LL 8vd
35 on
Sy m b o l Parameter C o n d iti o n Min Ty p Max U ni t
90 tr
VE jm
16 lec
AR b
12 e E
TL_RX_CLK P[x]_OUTCLK Low 100BASE mode 8 10 12 ns
A# ing
f5
ER gh
(P[x]_OUTD[1:0], P[x]_OUTEN)
invalid
o
ND an
ih
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
AC Electrical Characteristics
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
TH _ R X _ C L K
9 0 tr
16 lec
T
12 e E
O U TCLK L_R X_C LK
A# ing
T P_R X_C LK
ND i H
a
ER gh
OUTPUTS
., L
, U Sh
T CQ_M AX T C Q _ M IN
Co
AL *
TI tlfs
y
NOTE: O U T C L K is th e c lo c k u s e d to c lo c k th e o u tp u t d a ta .
g
EN 23
lo
It is a n o u tp u t in th is m o d e .
no
ID -jq
ch
NF jx
4.4.8 RGMII
CO z1m
Te
Table 63: RGMII AC Characteristics
ic
LL 8vd
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
35 on
Also see Section 4.4.8.1, Output Timing With/Without Delay Control and Section 4.4.8.2, Input Timing
90 tr
VE jm
16 lec
AR b
S ym bo l P ar a m e te r Min Ty p Max U ni t
M 9stk
12 e E
TskewT Data to Clock output Skew, at -500 0 500 ps
A# ing
Transmitter
f5
z4
ER gh
1
TCYCLE_ High Time for 1000BASE-T 3.6 4.0 4.4 ns
o
ND an
HIGH1000
ih
, U Sh
1. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet’s clock
AL *
4o
domain as long as minimum duty cycle is not violated and stretching occurs for no more than three TCYCLE of the
TI tlfs
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
Page 76
z4
f5
M 9stk
AR b
VE jm
LL 8vd
vd EN 23
ih
at Transmitter
at Transmitter
RX_CLK (RXC)
OUTCLK (TXC)
OUTCLK (TXC)
at Receiver
INCLK (RXC)
INDV (RX_CTL)
at Receiver
OUTEN (TX_CTL)
IND[7:4][3:0]
OUTD[7:4][3:0]
o6 TI tlfs
AL *
0z , U Sh
sz ND an
4f
5 ER gh
M 9stk a
AR b ND i H
INDV
OUTEN
IND[3:0]
VE jm A# ing
OUTD[3:0]
LL 8vd 12 e E
CONFIDENTIAL
CO z1m 16 lec
Figure 29: RGMII Multiplexing and Timing
9 0 tr
NF jx 35 on
ID -jq IND[7:4]
ic
EN 23 Te
OUTD[7:4]
ER gh
a
ND i H
A# ing
12 e E
16 lec
90 tr
35 on
TskewR
TskewR
ic
Te
no
AC Electrical Characteristics
ch
Te
4.4.8.1 Output Timing With/Without Delay Control
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Table 64: Output (OUTCLK (TXC)) Timing when RGMII Tx Delay Control (Offset
0x01, Bit 14) = 0
9 0 tr
16 lec
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
12 e E
S ym bo l P ar a m e te r Min Ty p Max U ni t
Tskew RGMII Tx Delay Control (bit 14) = 0 -0.5 -- 0.5 ns
A# ing
ND i H
Figure 30: Output (OUTCLK (TXC)) Timing when RGMII Tx Delay Control (Bit 14) = 0
a
ER gh
., L
, U Sh
Co
AL *
TI tlfs
O U T D [3 : 0 ] ( T X D [3 : 0 ]) ,
y
O U T E N (T X _ C T L )
g
EN 23
lo
no
ID -jq
T skew T skew
ch
NF jx
CO z1m
Te
T skew T skew
ic
LL 8vd
35 on
Table 65: Output (OUTCLK (TXC)) Timing when RGMII Tx Delay Control (Offset
90 tr
VE jm
16 lec
0x01, Bit 14) = 1
AR b
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
M 9stk
12 e E
S ym bo l P ar a m e te r Min Ty p Max U ni t
A# ing
f5
Thold ND i H 1.0 -- -- ns
zs
a
60
ER gh
Figure 31: Output (OUTCLK (TXC)) Timing when RGMII Tx Delay Control (Bit 14) = 1
o
ND an
ih
, U Sh
vd
O U T C L K (T X C )
2
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
O U T D [3 :0 ] ( T X D [3 :0 ]) ,
ID -jq
O U T E N (T X _ C T L )
ou
NF jx
CO z1m
T h o ld T h o ld
LL 8vd
T s e tu p T s e tu p
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
4.4.8.2 Input Timing With/Without Delay Control
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Table 66: Input (INCLK (RXC)) Timing when RGMII Rx Delay Control (Offset 0x01,
Bit 15) = 0
9 0 tr
16 lec
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
12 e E
S ym bo l P ar a m e te r Min Ty p Max U ni t
Tsetup RGMII Rx Delay Control (bit 15) = 0 1.0 -- -- ns
A# ing
Thold 0.8 -- -- ns
ND i H
a
Figure 32: Input (INCLK (RXC)) Timing when RGMII Rx Delay Control (Bit 15) = 0
ER gh
., L
, U Sh
IN C L K ( R X C )
Co
AL *
TI tlfs
yg
IN D [ 3 : 0 ] ( R X D [3 : 0 ]) ,
EN 23
lo
IN D V (R X _ C T L )
no
ID -jq
ch
NF jx
T h o ld T h o ld
CO z1m
Te
T s e tu p T s e tu p
ic
LL 8vd
35 on
90 tr
VE jm
16 lec
Table 67: Input (INCLK (RXC)) Timing when RGMII Rx Delay Control (Offset 0x01,
AR b
Bit 15) = 1
M 9stk
12 e E
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
A# ing
f5
S ym bo l P ar a m e te r Min Ty p Max U ni t
z4
a
thold 2.7 -- -- ns
60
ER gh
o
ND an
ih
Figure 33: Input (INCLK (RXC)) Timing when RGMII Rx Delay Control (Bit 15) = 1
, U Sh
2 vd
AL *
4o
IN C L K ( R X C )
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
IN D [3 :0 ] ( R X D [3 :0 ]),
NF jx
IN D V (R X _ C T L )
CO z1m
T s e tu p T s e tu p
LL 8vd
T h o ld T
VE jm
h o ld
AR b
M 9stk
5
4f
sz
0z
o6
no
AC Electrical Characteristics
ch
Te
4.4.9 GMII
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Table 68: GMII Input AC Characteristics
9 0 tr
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
16 lec
S ym bo l P ar a m e te r Min Ty p Max U ni t
12 e E
TSU_GMII_INCLK GMII Setup Time 2.0 -- -- ns
A# ing
THD_GMII_INCLK GMII Hold Time 0 -- -- ns
1
TH_GMII_INCLK INCLK High 2.5 -- -- ns
ND i H
1
TL_GMII_INCLK INCLK Low 2.5 -- -- ns
a
ER gh
TP_GMII_INCLK INCLK Period 7.51 8.0 8.5 ns
., L
, U Sh
TR_GMII_INCLK INCLK Rise Time -- -- 1.0 ns
Co
AL *
yg
1. RX_CLK toggle rate is “don’t care” if link is down, or if not in 1000BASE-T mode.
EN 23
lo
no
ID -jq
ch
NF jx
CO z1m
Te
TP_GMII_INCLK
ic
LL 8vd
TL_GMII_INCLK
35 on
TH_GMII_INCLK
90 tr
VE jm
16 lec
VIH_GMII (Min.)
AR b
INCLK
M 9stk
12 e E
VIL_GMII (Max.)
TF_GMII_INCLK TR_GMII_INCLK
A# ing
f5
VIH_GMII (Min.)
z4
IND[7:0]
ND i H
zs
INDV
a
VIL_GMII (Max.)
60
ER gh
THD_GMII_INCLK
o
ND an
ih
TSU_GMII_INCLK
, U Sh
2 vd
AL *
4o
TI tlfs
EN 23
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
ID -jq
S ym bo l P ar a m e te r Min Ty p Max U ni t
ou
NF jx
no
Datasheet
ch
Te
Table 69: GMII Output AC Characteristics (Sheet 2 of 2)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
35 on
S ym bo l P ar a m e te r Min Ty p Max U ni t
9 0 tr
2
16 lec
TRSLEW_GMII_GTX_ GTX_CLK Rising Slew Rate 0.6 -- -- V/ns
CLK
12 e E
TFSLEW_ GMII_GTX_ GTX_CLK Falling Slew Rate 0.62 -- -- V/ns
A# ing
CLK
1. GTX CLK numbers not guaranteed during transition between 10/100/1000BASE-T operation.
ND i H
2. Instantaneous change during internal VIH_GMII (Min.) and VIL_GMII (Max.).
a
ER gh
., L
, U Sh
TP_GMII_GTX_CLK
Co
AL *
TI tlfs
y
TH_GMII_GTX_CLKTL_GMII_GTX_CLK
g
EN 23
lo
no
VOH_GMII (Min.)
ID -jq
GTX_CLK
ch
NF jx
VOL_GMII (Max.)
CO z1m
Te
TF_GMII_GTX_CLK TR_GMII_GTX_CLK
ic
VOH_GMII (Min.)
LL 8vd
35 on
OUTD[7:0]
OUTEN
90 tr
VOL_GMII (Max.)
VE jm
16 lec
THD_GMII_GTX_CLK
AR b
M 9stk
12 e E
TSU_GMII_GTX_CLK
A# ing
f5
z4
ND i H
4.4.10 SMI
zs
a
60
ER gh
ND an
ih
, U Sh
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
2
AL *
4o
TI tlfs
S ym bo l P ar a m e te r Min Ty p Max U ni t
m
MARVELL CONFIDENTIAL
TP MDC Period 50 -- -- ns
EN 23
(max. 20 MHz)
ID -jq
ou
no
AC Electrical Characteristics
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
TP
9 0 tr
16 lec
TH TL
12 e E
A# ing
M D C
ND i H
a
TR TF
ER gh
., L
, U Sh
4.4.10.2 SMI Data – CPU Set (Slave)
Co
AL *
y
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
g
EN 23
lo
S ym bo l P ar a m e te r Min Ty p Max U ni t
no
ID -jq
ch
NF jx
Te
THD MDIO (Input) to MDC Hold Time 10 -- -- ns
ic
LL 8vd
35 on
Figure 37: SMI Data Timing – CPU Set
90 tr
VE jm
16 lec
AR b
M 9stk
12 e E
M DC
A# ing
f5
z4
ND i H
zs
a
60
ER gh
M DIO (O utput)
o
ND an
ih
, U Sh
vd
T D LY _M D IO
2
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
M DC
EN 23
ID -jq
ou
T HD
NF jx
T SU
CO z1m
M DIO (Input)
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
4.4.10.3 SMI – PHY Set (Master)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Table 72: SMI AC Characteristics – PHY Set
9 0 tr
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
16 lec
S ym bo l P ar a m e te r Min Ty p Max U ni t
12 e E
TP MDC Period 64 128 256 ns
(min. 3.90625 MHz, typ. 7.8125 MHz,
A# ing
max. 15.625 MHz)
ND i H
TH MDC High Time 20 -- -- ns
a
TL MDC Low Time 20 -- -- ns
ER gh
TR MDC Rise Time -- -- 6 ns
., L
TF , U Sh MDC Fall Time -- -- 6 ns
TTX_SU MDIO Output Setup Time1 10 -- -- ns
Co
AL *
1
TTX_HD MDIO Output Hold Time 10 -- -- ns
TI tlfs
yg
TRX_SU MDIO Input Setup Time -- -- -- --
EN 23
lo
TRX_HD MDIO Input Hold Time -- -- -- --
no
ID -jq
2
TDLY_MDIO MDC to MDIO (Output) Delay Time 0 5 ns
ch
NF jx
CO z1m
Te
1. MDIO input setup and hold time is intentionally sampled with respect to the MDC falling edge.
2. MDIO data is intentionally clocked out on the falling edge of MDC.
ic
LL 8vd
35 on
Figure 38: SMI Output Timing – PHY Set
90 tr
VE jm
16 lec
AR b
TP
M 9stk
12 e E
TH TL
A# ing
f5
z4
ND i H
zs
MDC
a
60
ER gh
o
ND an
TR TF
ih
, U Sh
vd
TTX_HD
2
TTX_SU
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
MDIO (Output)
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
AC Electrical Characteristics
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
9 0 tr
16 lec
MDC
12 e E
A# ing
TRX_HD
TRX_SU
ND i H
a
MDIO (Input)
ER gh
., L
, U Sh
Co
4.4.11 QSPI
AL *
TI tlfs
y
Table 73: QSPI AC Characteristics
g
EN 23
lo
(Over full range of values listed in the Recommended Operating Conditions unless otherwise
no
ID -jq
specified)
ch
NF jx
S ym bo l P ar a m e te r Min Ty p Max U ni t
CO z1m
Te
fQSPI Clock Frequency 19.23 -- 83.33 MHz
ic
D Duty Cycle -- 50 -- %
LL 8vd
35 on
90 tr
VE jm
4.4.12 TWSI
16 lec
AR b
M 9stk
12 e E
Table 74: TWSI AC Characteristics
(Over full range of values listed in the Recommended Operating Conditions unless otherwise
A# ing
f5
specified)
z4
S ym bo l P ar a m e te r
ND i H Min Ty p Max U ni t
zs
a
fSCK SCK Clock Frequency 0 -- 400 kHz
60
ER gh
ND an
ih
AL *
4o
1. A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(min) of the
SCK signal) to bridge the undefined region of the falling edge of SCK.
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
TF THigh TR
9 0 tr
16 lec
TLow
SCK
12 e E
THD;DAT
TSU;STA TSU;DAT TSU;STO
A# ing
THD;STA
ND i H
SDA
TBUF
a
ER gh
TF
TR
., L
, U Sh
4.4.13 EEPROM Interface
Co
AL *
TI tlfs
y
Table 75: EEPROM AC Characteristics
g
EN 23
lo
(Over full range of values listed in the Recommended Operating Conditions unless otherwise specified)
no
ID -jq
S ym bo l P ar a m e te r Min Ty p Max U ni t
ch
NF jx
Te
TH EE_CLK High Time -- 2500 -- ns
ic
TL EE_CLK Low Time -- 2500 -- ns
LL 8vd
35 on
TIN EE_CLK Input Time 50 -- 1250 ns
90 tr
VE jm
16 lec
TOUT EE_CLK Output Time 0 -- 2500 ns
AR b
M 9stk
12 e E
Figure 41: EEPROM Interface Timing
A# ing
f5
z4
ND i H
zs
EE_CLK
a
60
ER gh
o
ND an
ih
, U Sh
2 vd
AL *
4o
TI tlfs
EE_DIO
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
TIN/OUT
NF jx
CO z1m
TL TH
TP
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
AC Electrical Characteristics
ch
Te
4.4.14 JTAG Interface
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Table 76: JTAG AC Characteristics
9 0 tr
(Over full range of values listed in the Recommended Operating Conditions unless otherwise
16 lec
specified)
12 e E
P ar a m e te r Min Ty p Max U ni t
Clock Frequency -- 25 -- MHz
A# ing
ND i H
4.4.15 Low Power Signal Detect
a
ER gh
Table 77: Low Power Signal Detect AC Characteristics
., L
, U Sh
Sy m b o l Parameter C o n d iti o n Min Ty p Max U ni t
Co
AL *
TMDI, LAT Latency from MDI signals to INH assertion Normal link -- -- 2 s
TI tlfs
y
1
TWAKE, PW WAKE_IN pin Pulse Width to Wake-Up LPSD 10 -- 50 s
g
EN 23
lo
1. Default value.
no
ID -jq
ch
NF jx
CO z1m
Te
ic
LL 8vd
35 on
90 tr
VE jm
16 lec
AR b
M 9stk
12 e E
A# ing
f5
z4
ND i H
zs
a
60
ER gh
o
ND an
ih
, U Sh
2 vd
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Package Specifications
9 0 tr
16 lec
12 e E
5.1 Thermal Information
A# ing
Table 78: 128-Pin LQFP Package Thermal Information
ND i H
Sy m b o l Parameter C o n d iti o n Min Ty p Max U ni t
a
ER gh
JA Junction-to-Ambient Thermal JEDEC 3 in. × 4.5 in. 4-layer -- 17.7 -- °C/W
Resistance PCB with no air flow
., L
JEDEC 3 in. × 4.5 in. 4-layer -- 15.9 -- °C/W
, U Sh
JA = (TJ - TA) / P
PCB with 1 m/sec air flow
Co
P = Total Power Dissipation
AL *
y
PCB with 2 m/sec air flow
g
EN 23
lo
JEDEC 3 in. × 4.5 in. 4-layer -- 14.3 -- °C/W
no
PCB with 3 m/sec air flow
ID -jq
JB
ch
Junction-to-Board Thermal JEDEC with no air flow -- 8.1 -- °C/W
NF jx
Resistance
CO z1m
Te
JB = (TJ - TB) / PBOTTOM
ic
LL 8vd
35 on
PBOTTOM = Power dissipation
from the bottom of the package
90 tr
VE jm
16 lec
AR b
12 e E
Resistance
A# ing
f5
ER gh
JB Junction-to-Board Thermal JEDEC 3 in. × 4.5 in. 4-layer -- 7.60 -- °C/W
Characteristics Parameter PCB with no air flow
o
ND an
ih
AL *
EN 23
Parameter
JEDEC 3 in. × 4.5 in. 4-layer -- 0.57 -- °C/W
LL 8vd
E−PAD
4o ID -jq
2vd EN 23
ih TI tlfs
o6 AL *
0z , U Sh
sz ND an
4f
5
Figure 42: 128-Pin LQFP Package Drawing
ER gh
M 9stk a
AR b ND i H
Mechanical Drawing
VE jm A# ing
LL 8vd 12 e E
CONFIDENTIAL
CO z1m 16 lec
9 0 tr
NF jx 35 on
ID -jq ic
EN 23 Te
12 e E
16 lec
90 tr
35 on
ic
Te
Package Specifications
Page 87
ch
no
lo
gy
Co
., L
ou0vm4o2vdiho60zsz4f59stkbjm8vdz1mjx-jq23tlfs * Shanghai Hinge Electronic Technologyt Co., Ltd. * UNDER NDA# 121690
Co
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Symbol D i m e n s io n i n m m
9 0 tr
Min Nom Max
16 lec
A -- -- 1.60
12 e E
A1 0.05 -- 0.15
A# ing
A2 1.35 1.40 1.45
b 0.17 0.22 0.27
ND i H
b1 0.17 0.20 0.23
a
ER gh
c 0.09 -- 0.20
., L
, U Sh
D 21.90 22.00 22.10
Co
AL *
y
D2 7.80 8.00 8.20
g
EN 23
lo
E 15.90 16.00 16.10
no
ID -jq
ch
NF jx
Te
e 0.50 BSC
ic
LL 8vd
35 on
L1 1.00 REF
90 tr
VE jm
16 lec
R1 0.08 -- --
AR b
M 9stk
12 e E
R2 0.08 -- 0.20
A# ing
S 0.20 -- --
f5
z4
0° 3.5° 7° ND i H
zs
1 4° TYP
a
60
ER gh
2 12° TYP
o
ND an
3 12° TYP
ih
, U Sh
2 vd
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
Part Order Numbering
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Part Order Numbering/Package Marking
9 0 tr
16 lec
12 e E
6.1 Part Order Numbering
A# ing
Figure 43 shows the part order numbering scheme for the 88Q5050 device. Refer to Marvell Field
Application Engineers (FAEs) or representatives for further information when ordering parts.
ND i H
a
Figure 43: Sample Part Number
ER gh
., L
, U Sh
88Q5050 –xx–LKJ2A000–xxxx
Co
AL *
TI tlfs
yg
Custom Code (optional)
EN 23
lo
no
ID -jq
Custom Code
ch
NF jx
Part Number
000 = Automotive Grade
CO z1m
Product Number
Te
ic
LL 8vd
35 on
Temperature Code
90 tr
VE jm
A= Automotive
Custom Code/
16 lec
AR b
Die Revision
M 9stk
12 e E
Environmental Code
2 = RoHS 6/6 + Halogen-free
A# ing
f5
(Green)
z4
ND i H
zs
a
60
ER gh
o
Package Code
ND an
ih
, U Sh
2 vd
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
NF jx
no
Datasheet
ch
Te
6.2 Package Marking
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Figure 44 shows a sample package marking and pin 1 location for the 88Q5050 device.
9 0 tr
Figure 44: Sample Package Marking and Pin 1 Location
16 lec
12 e E
A# ing
Marvell Logo
ND i H
Part Identifier, Package Code, Environmental
a
ER gh
Code
Country of Origin 88Q5050-LKJ2 88Q5050 = Part Identifier
., L
, U Sh
mold ID or marked as YYWW xx@ 2= Environmental Code:
Country of Origin RoHS 6/6 + Halogen-free (Green)
Co
the last line on the
AL *
package.)
TI tlfs
yg
EN 23
lo
Pin 1 Location
no
ID -jq
ch
NF jx
Te
@ = Assembly Plant Code
ic
LL 8vd
35 on
Note: The above drawing is not drawn to scale. Location of markings is approximate.
90 tr
VE jm
16 lec
AR b
M 9stk
12 e E
A# ing
f5
z4
ND i H
zs
a
60
ER gh
o
ND an
ih
, U Sh
2 vd
AL *
4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
ID -jq
ou
NF jx
CO z1m
LL 8vd
VE jm
AR b
M 9stk
5
4f
sz
0z
o6
no
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Acronyms and Abbreviations
9 0 tr
16 lec
12 e E
AC Alternating Current
A# ing
ACK Acknowledgement
ND i H
ADC Analog-to-Digital Converter
a
AEC Automotive Electronics Council
ER gh
AGC Automatic Gain Control
., L
AHB Advanced High-performance Bus
, U Sh
®
Co
ARM Advanced RISC Machine
AL *
TI tlfs
yg
ATU Address Translation Unit
EN 23
lo
no
ID -jq
ch
NF jx
CO z1m
Te
BPDU Bridge Protocol Data Unit
ic
LL 8vd
35 on
CBS Committed Burst Size
90 tr
VE jm
16 lec
AR b
12 e E
CPU Central Processing Unit
A# ing
f5
CSMA/CD
ND i H
Carrier Sense Multiple Access / Collision Detection
zs
a
C-TAG Customer's Tag
60
ER gh
ND an
ih
, U Sh
vd
DA Destination Address
2
AL *
4o
TI tlfs
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
EBS Excess Burst Size
35 on
9 0 tr
ECC Error-Correction Code
16 lec
EEE Energy Efficient Ethernet
12 e E
EEPROM Electronically Erasable Programmable Read Only Memory
A# ing
eFUSE Electronic Fuse
EMD Egress Monitor Destination
ND i H
EMI Electromagnetic Interference
a
ER gh
EMS Egress Monitor Source
., L
, U Sh
Co
AL *
y
FEFI Far-End Fault Indication
g
EN 23
lo
FFE Feed-Forward Equalizer
no
ID -jq
ch
NF jx
Te
FIR Finite Impulse Response
ic
LL 8vd
35 on
FPP Fast Page Programming
90 tr
VE jm
16 lec
FPri Frame Priority
AR b
M 9stk
12 e E
GARP Generic Attribute Registration Protocol
A# ing
f5
ND i H
zs
ER gh
ND an
ih
, U Sh
vd
AL *
4o
TI tlfs
IC Integrated Circuit
m
MARVELL CONFIDENTIAL
EN 23
ID Identifier
ID -jq
ou
I/O Input/Output
AR b
M 9stk
IP Internet Protocol
IPG Inter-Packet Gap
5
4f
no
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
IPv6 Internet Protocol version 6
35 on
9 0 tr
IRL Ingress Rate Limiting
16 lec
ITCM Instruction Tightly Coupled Memory
12 e E
ITSM Isochronous Time Slot Metering
A# ing
JTAG Joint Test Action Group
ND i H
a
ER gh
LAC Link Aggregation Control
., L
, U Sh
LAN Local Area Network
Co
AL *
y
LED Light Emitting Diode
g
EN 23
lo
LPI Low Power Idle
no
ID -jq
ch
NF jx
Te
LVDS Low Voltage Differential Signaling
ic
LL 8vd
35 on
MAC Media Access Controller
90 tr
VE jm
16 lec
MDC Management Data Clock
AR b
M 9stk
12 e E
MDI Media Dependent Interface
MDIO Management Data Input/Output
A# ing
f5
ND i H
zs
MGMT Management
a
60
ER gh
ND an
, U Sh
vd
TI tlfs
EN 23
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
PAV Port Association Vector
35 on
9 0 tr
PCL Policy Control List
16 lec
PCP Priority Code Point
12 e E
PCS Physical Coding Sublayer
A# ing
PECL Positive Emitter Coupled Logic
PFC Priority Flow Control
ND i H
PIRL Port Ingress Rate Limiter
a
ER gh
PLL Phase-Locked Loop
., L
, U Sh
PMD Physical Media Dependent
Co
AL *
y
PPS Pulse Per Second
g
EN 23
lo
PPU PHY Polling Unit
no
ID -jq
ch
NF jx
Te
ic
LL 8vd
QC Queue Controller
35 on
QoS Quality of Service
90 tr
VE jm
16 lec
QPri Queue Priority
AR b
M 9stk
12 e E
QSPI Quad Serial Peripheral Interface
A# ing
f5
ND i H
zs
a
60
ER gh
ND an
, U Sh
vd
TI tlfs
EN 23
R/W Read/Write
NF jx
Rx Receive
CO z1m
LL 8vd
SA Source Address
SERDES Serializer/Deserializer
VE jm
no
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
SoC System-on-Chip
ic
SPI Serial Peripheral Interface
35 on
9 0 tr
SQE Signal Quality Error
16 lec
SRAM Static Random Access Memory
12 e E
SRP Stream Reservation Protocol
A# ing
SSRAM Synchronous SRAM
S-TAG Service Tag
ND i H
STP Spanning Tree Protocol
a
ER gh
STU SID Translation Unit
., L
, U Sh
TAI Time Application Interface
Co
AL *
y
TCAM Ternary Content Addressable Memory
g
EN 23
lo
TCP Transmission Control Protocol
no
ID -jq
ch
NF jx
Te
TOD, ToD Time of Day
ic
LL 8vd
35 on
TSN Transport block Sequence Number
90 tr
VE jm
16 lec
TWSI Two-Wire Serial Interface
AR b
M 9stk
12 e E
Tx Transmit
A# ing
f5
ND i H
zs
ER gh
o
ND an
, U Sh
vd
TI tlfs
EN 23
ID -jq
ou
XTAL Crystal
AR b
M 9stk
5
4f
sz
0z
o6
no
Datasheet
ch
Te
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
Revision History
9 0 tr
16 lec
12 e E
Table 1: Revision History (Sheet 1 of 5)
A# ing
R e v i s io n Date Description
ND i H
Rev. -- February 14, 2018 Pre-release draft version
a
v0.15 Section 2, Signal Description
ER gh
• Section‚ LED and EEPROM Interface, on page 31: Table 15,
., L
Section 4, Electrical Specifications, on page 55
, U Sh
• Updated tables 46, 47, 48, 49, 50 and 51.
Co
AL *
TI tlfs
yg
v0.14 • Table 78, 88Q5050 Part order Options: Updated the Part
EN 23
lo
Order Number.
no
ID -jq
ch
NF jx
v0.13
CO z1m
Te
• Table 18, Low-Power Signal Detect, on page 34: updated
ic
description of VLPF pin.
LL 8vd
35 on
• Table 19, Power and Ground, on page 35: updated
description of AVDD18 pin.
90 tr
VE jm
16 lec
Section 4, Electrical Specifications
AR b
12 e E
page 67: updated ISTANDBY.
• Table 35, Absolute Maximum Ratings, on page 55: updated
A# ing
f5
VDDA(18).
z4
a
• Table 43, DC Characteristics for Pins GPIO[4:0], INTn,
60
ER gh
ND an
TI tlfs
EN 23
NF jx
updated.
Section 4, Electrical Specifications
VE jm
no
ch
Te
Table 1: Revision History (Sheet 2 of 5)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
R e v i s io n Date Description
9 0 tr
Rev. – April 24, 2017 Pre-release draft version
16 lec
v0.11 Section 2, Signal Description
12 e E
• Table 9, SMI, on page 28: Resistor information for MDIO_
CPU and MDIO_PHY pins updated.
A# ing
• Table 20, Bootstrap Options, on page 37: Table introduction
extended; Default Pin Name column added; more details
ND i H
added to Functionality column.
a
• Section 2.3.2, Pin Connection Information, on page 39
ER gh
added.
., L
• Table 37, Main Clock (XTAL_IN) DC Characteristics, on
, U Sh
page 56 updated.
Co
AL *
y
Appendix A, Acronyms and Abbreviations updated.
g
EN 23
lo
Rev. – February 14, 2017 Pre-release draft version
no
ID -jq
ch
NF jx
Te
• Table 19, Power and Ground, on page 35: E-PAD added.
ic
LL 8vd
35 on
• Figure 12, RMII MAC Interface Pins, on page 49 updated.
90 tr
VE jm
16 lec
• Section 4.4.2, Power-On Reset, on page 68 added.
AR b
M 9stk
12 e E
Section 5, Package Specifications
• Table 42, 128-Pin LQFP Package Drawing, on page 87:
A# ing
f5
E-PAD labeled.
z4
ND i H
zs
a
Rev. – December 15, 2016 Pre-release draft version
60
ER gh
ND an
Interfaces updated.
, U Sh
vd
AL *
TI tlfs
added.
ID -jq
ou
MDC_CPU description.
• Table 18, Low-Power Signal Detect, on page 34: Pin
VE jm
descriptions updated.
AR b
updated.
• Table 20, Bootstrap Options, on page 37: Notes updated.
5
4f
sz
0z
o6
no
Datasheet
ch
Te
Table 1: Revision History (Sheet 3 of 5)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
R e v i s io n Date Description
9 0 tr
Rev. – December 15, 2016 Pre-release draft version
16 lec
v0.9 (Cont.) Section 4, Electrical Specifications
12 e E
(Cont.) • Section 4.1, Absolute Maximum Ratings, on page 55
updated.
A# ing
• Section 4.2, Recommended Operating Conditions,
on page 56 updated.
ND i H
• Section 4.3, DC Electrical Characteristics, on page 56: New
a
subsections added.
ER gh
• Table 45 on page 64: Maximum values for VIL updated.
., L
, U Sh subsections added.
Section 5, Package Specifications
Co
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Values for D2 and E2 updated.
EN 23
lo
Appendix A, Acronyms and Abbreviations updated.
no
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ch
Rev. – September 14, 2016 Pre-release draft version
NF jx
v0.8
CO z1m
Introduction added.
Te
Section 2, Signal Description
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LL 8vd
35 on
Termination resistor information added.
90 tr
VE jm
16 lec
AR b
12 e E
Rev. – August 10, 2016 Pre-release draft version
A# ing
f5
ND i H
• Section 4.3.5, Digital Pins, on page 62 added.
zs
ER gh
ND an
ih
AL *
4o
TI tlfs
v0.6
EN 23
no
ch
Te
Table 1: Revision History (Sheet 4 of 5)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
R e v i s io n Date Description
9 0 tr
Rev. – July 26, 2016 Pre-release draft version
16 lec
v0.5 Section 2, Signal Description
12 e E
• Pin positions updated:
All pins rotated clockwise by one position (that is, pin 128 is
A# ing
now pin 127, pin 127 is now pin 126, …, and pin 1 is now
pin 128).
ND i H
Pins P7_S_TXN and P7_S_TXP swapped.
a
Section 3, Device Physical Interfaces added.
ER gh
Section 4, Electrical Specifications
., L
, U Sh
updated.
Co
• Table 36, Recommended Operating Conditions, on page 56
AL *
updated.
TI tlfs
yg
Rev. – July 6, 2016 Pre-release draft version
EN 23
lo
v0.4
no
Section 1, 88Q5050 Functional Description
ID -jq
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• Pin positions updated:
P6_RXP/N
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LL 8vd
P6_TXP/N
35 on
RSET
90 tr
VE jm
TSTPT
16 lec
• Pins renamed:
AR b
M 9stk
12 e E
VBATF to VLPF
A# ing
VBATR to VLPR
f5
XTAL_1 to XTAL_IN
z4
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XTAL_2 to XTAL_OUT
zs
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description added.
• Section 2.2.5, xMII (Port 5/6/7), on page 23: Editorial
o
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changes.
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4o
TI tlfs
m
MARVELL CONFIDENTIAL
EN 23
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NF jx
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VE jm
AR b
M 9stk
5
4f
sz
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o6
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Datasheet
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Table 1: Revision History (Sheet 5 of 5)
0v - UNAUTHORIZED DISTRIBUTION OR USE STRICTLY PROHIBITED
ic
35 on
R e v i s io n Date Description
9 0 tr
Rev. – June 7, 2016 Pre-release draft version
16 lec
v0.3 Section 1, 88Q5050 Functional Description
12 e E
• Section 1.1, Overview, on page 12 updated.
Section 2, Signal Description
A# ing
• Several pin positions updated; pin descriptions updated
ND i H
accordingly.
• ADDRn[3] pin removed.
a
• Pins renamed:
ER gh
P1..5_WAKE to P1..5_WAKE_DIS
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P567_SEL_1 to P567_SEL[1]
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P8_MODE_0 to P8_MODE[0]
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P8_MODE_1 to P8_MODE[1]
TI tlfs
P8_MODE_2_n to P8_MODEn[2]
yg
• Table 14, LED Port-to-PHY Mapping, on page 32 added.
EN 23
lo
• Table 19, Power and Ground, on page 35: VDDO_EFUSE
no
ID -jq
ch
NF jx
description updated.
CO z1m
Te
Rev. – May 4, 2016 Pre-release draft version
ic
LL 8vd
v0.2
35 on
90 tr
VE jm
16 lec
AR b
M 9stk
12 e E
A# ing
f5
z4
ND i H
zs
a
60
ER gh
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ND an
ih
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MARVELL CONFIDENTIAL
EN 23
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VE jm
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5
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9 0 tr
NF jx 35 on
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Tel: 1.408.222.2500
Santa Clara, CA 95054, USA
Marvell Semiconductor, Inc.
http://www.marvell.com
Fax: 1.408.988.8279