AOZ6689CI
AOZ6689CI
Applications
General Point of Load
LCD TV
Cable modems and Gateway
Typical Application
EN EN RT R1
GND FB
CO
R2
Ordering Information
Part Number Ambient Temperature Range Package Environmental
AOZ6689CI -40°C to +125°C TSOT23-6L RoHS
AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/media/AOSGreenPolicy.pdf for additional information.
Pin Configuration
GND 1 6 BST
LX 2 5 EN
VIN 3 4 FB
TSOT23
(Top View)
Pin Description
Pin Number Pin Name Pin Function
1 GND System ground.
2 LX Switching node connects to main inductor terminal.
Supply voltage input. When VIN rises above the UVLO threshold and EN is logic high, the
3 VIN
device will start up.
Feedback input. The FB pin is used to set the output voltage through a resistor voltage
4 FB
divider between the Output and GND.
Enable input. Pull EN to logic high will enable the device. Pull EN to logic low will disable
5 EN
the device. EN pin must be connected to VIN if no Enable control is required.
6 BST Bootstrap input. Connect a capacitor to LX (Pin 2). Typical value is 0.1µF.
Parameter Rating
Supply Voltage (VIN) -0.3V to 20V Supply Voltage (VIN) 4.5V to 18V
High Voltage Input (EN) -0.3V to 20V Output Voltage Range 0.8V to 6V
Switching Node DC -0.3V to VIN+0.3V Junction Temperature (TJ) -40°C to +125°C
(LX to GND) Package Thermal Resistance 90°C/W
Switching Node Transient (20ns) -5V to 22V TSOT23-6L (θJA)
(LX to GND)
Low Voltage Input (FB) -0.3V to 6V
Bootstrap Voltage (BST to LX) 6V
Junction Temperature (TJ) 150°C
Storage Temperature (TS) -65°C to 150°C
(1)
ESD Rating 2.0kV
Note:
1. Devices are inherently ESD sensitive, handling precautions are
required. Human body model rating: 1.5k in series with 100pF.
Electrical Characteristics
TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V, unless otherwise specified. Specifications in Bold indicate an ambient temperature range
of -40°C to +85°C. These specifications are guaranteed by design.
Electrical Characteristics
TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V, unless otherwise specified. Specifications in Bold indicate an ambient temperature range
of -40°C to +85°C. These specifications are guaranteed by design.
Note:
2. Guaranteed by design and not production tested.
BST VIN
UVLO
LDO
EN &
POR REGULATOR
ISEN
SOFT REFERENCE Q1
START & ILIMIT
BIAS HS Drv
+
+ PWM
+ PWM
EAMP – COMP CONTROL
FB - LOGIC
+
LX
VCC
Q2
LS Drv
750 kHz
OSCILLATOR
+
-
1V OVP
PEM +
OTP NCD
LOGIC -
GND
Typical Characteristics
TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V, unless otherwise specified.
LX
(5V/div) LX
(5V/div)
IL VO Ripple
(1A/div) (50mV/div)
VO Ripple VIN
(50mV/div) (0.2V/div)
VIN Ripple
(0.2V/div) IL
(1A/div)
1us/div 0.5us/div
LX LX
(5V/div) (5V/div)
VO
VO (0.2V/div)
(0.2V/div)
IL
IL
(2A/div)
(2A/div)
0.1ms/div 0.1ms/div
Figure 4. PEM to PWM Mode Change Figure 5. PWM to PEM Mode Change
LX
(5V/div)
LX VO
(5V/div) (1V/div)
IL
VO
(2A/div)
(1V/div)
IL
(2A/div)
20ms/div 20ms/div
VIN
(5V/div)
VO VO
(1V/div) (0.2V/div)
IO
(2A/div) IO
(1A/div)
5ms/div 0.1ms/div
100 3.1
90
3.0
80
2.9
Efficiency (%)
70
Current (A)
60 2.8
5V OUTPUT L=4.7UH
50 3.3V OUTPUT L=3.3UH
2.7
2.5V OUTPUT L=3.3UH
40 1.8V OUTPUT L=2.2UH
1.2V OUTPUT L=2.2UH 2.6
30
20 2.5
0.01 0.1 1 10 25 35 45 55 65 75 85
Io (A) Ambient Temperature (oC)
Figure 10. Efficiency vs Output Current. VIN=12V Figure 11. Thermal Derating Curve with 12VIN
Light Load and PWM Operation Some standard value of R1, R2 and most used output
Under low output current condition, AOZ6689CI will voltage values are listed in Table 1.
operate in pulse energy mode to achieve high efficiency.
In pulse energy mode, the PWM will not turn off until the VO (V) R1 (kΩ) R2 (kΩ)
on time get a fixed time which is defined by Input Voltage
(VIN), Output Voltage (Vout), and Switching Frequency. 0.8 1.0 open
1.2 5.0 10
Steady-State Operation 1.5 10.0 11.5
Under normal to heavy load steady-state condition, 1.8 12.7 10.2
AOZ6689CI operates in fixed frequency and Continuous- 2.5 21.5 10
Conduction Mode (PWM).
3.3 31.1 10
AOZ6689CI integrates internal high-side and low-side 5.0 52.3 10
power MOSFET. Inductor current is sensed through the
current being conducted by the power MOSFET. Output Table 1. Typical Resistor Divider Values for FB Input
voltage is determined by the external voltage divider
between Vout, FB, and GND. The difference of the FB Combination of R1 and R2 should be large enough to
voltage and internal reference is amplified by the avoid drawing excessive current from the output, which
transconductance error amplifier. The error voltage is will cause power loss.
compared against the current signal (sum of inductor
current signal and input and output modulated voltage
ramp compensation signal) at PWM comparator stage. If
the current signal is less than the error voltage, the
internal high-side switch is on. The inductor current flows
from the input through the inductor to the output. When
the current signal exceeds the error voltage, the high-
side switch is off. The inductor current is freewheeling
through the internal low-side switch to output. The
internal adaptive MOSFET driver guarantees no turn on
overlap between high-side and low-side switch.
Protection Features The relation between the input capacitor RMS current
and voltage conversion ratio is calculated and shown in
AOZ6689CI has multiple protection features to prevent
Figure 11 below. It can be seen that when VOUT is half of
system circuit damage under abnormal conditions.
VIN, CIN is under the worst current stress. The worst cur-
Over Current Protection (OCP) rent stress on CIN is 0.5·IOUT.
The cycle by cycle current limit is applied for over current 0.5
protection.
0.4
Power-On Reset (POR)
A power-on reset circuit monitors the VIN voltage. When ICIN_RMS(m) 0.3
VIN voltage exceeds 4.1V, the converter will start to IO
0.2
operate. When VIN voltage falls below 3.7V, the
converter will be shut down.
0.1
Thermal Protection
0
An internal temperature sensor monitors the junction 0 0.5 1
temperature. It shuts down the internal control circuit and m
high side switch if the junction temperature exceeds Figure 2. ICIN vs. Voltage Conversion Ratio
150ºC. The regulator will restart automatically under the
control of soft-start circuit when the junction temperature For reliable operation and best performance, the input
decreases to 100ºC. capacitors must have current rating higher than ICIN-RMS
at worst operating conditions. Ceramic capacitors are
Application Information preferred for input capacitors because of their low ESR
The basic AOZ6689CI application circuit is show in and high current rating. Depending on the application
Figure 1. Component selection is explained below. circuits, other low ESR tantalum capacitor may also be
used. When selecting ceramic capacitors, X5R or X7R
Input Capacitor type dielectric ceramic capacitors should be used for
The input capacitor must be connected to the VIN (Pin 3) their better temperature and voltage characteristics.
and GND (Pin 1) of AOZ6689CI to maintain steady input Note that the ripple current rating from capacitor
voltage and filter out the pulsing input current. The manufactures are based on certain amount of life time.
voltage rating of input capacitor must be greater than Further de-rating may be necessary in practical design.
maximum input voltage plus ripple voltage.
Inductor
The input ripple voltage can be approximated by The inductor is used to supply constant current to output
equation below: when it is driven by a switching voltage. For given input
and output voltage, inductance and switching frequency
I OUT V OUT V OUT
V IN = ----------------- 1 – --------------
- --------------- together decide the inductor ripple current as below:
f C IN V IN V IN V OUT V OUT
I L = --------------- 1 – --------------
-
fL V IN
Since the input current is discontinuous in a buck
converter, the current stress on the input capacitor is
another concern when selecting the capacitor. For a buck The peak inductor current is:
circuit, the RMS value of input capacitor current can be
I
calculated by: I Lpeak = I OUT + -------L-
2
VOUT V High inductance gives low inductor ripple current but
I CIN _ RMS I OUT (1 OUT )
VIN VIN requires larger size inductor to avoid saturation. Low
ripple current reduces inductor core losses. It also
reduces RMS current through inductor and switches,
if let m equal the conversion ratio: which results in less conduction loss. Usually, peak to
VO peak ripple current on inductor is designed to be 20% to
--------
- = m 40% of output current.
V IN
When selecting the inductor, make sure it is able to For lower output ripple voltage across the entire
handle the peak current without saturation even at the operating temperature range, X5R or X7R dielectric type
highest operating temperature. of ceramic, or other low ESR tantalum are recommended
to be used as output capacitors.
The inductor takes the highest current in a buck circuit.
The conduction loss on inductor needs to be checked for In a buck converter, output capacitor current is
thermal and efficiency requirements. continuous. The RMS current of output capacitor is
decided by the peak to peak inductor ripple current. It can
Surface mount inductors in different shape and styles are be calculated by:
available from Coilcraft, Elytone and Murata. Shielded
inductors are small and radiate less EMI noise. But they I L
I CO_RMS = ----------
cost more than unshielded inductors. The choice 12
depends on EMI requirement, price and size.
Usually, the ripple current rating of the output capacitor is
For the current mode control, the minimum inductor
a smaller issue because of the low current stress. When
2.2uH is recommended to prevent the current running
the buck inductor is selected to be very small and
away in the extreme case.
inductor ripple current is high, output capacitor could be
Output Capacitor overstressed.
The output capacitor is selected based on the DC output
voltage rating, output ripple voltage specification and
ripple current rating. The capacitor must have a higher
rated voltage specification than the maximum desired
output voltage including ripple. De-rating needs to be
considered for long term reliability.
1
V O = I L -------------------------
8fC O
V O = I L ESR CO
Thermal Management and Layout The thermal performance of the AOZ6689CI is strongly
Consideration affected by the PCB layout. Extra care should be taken
by users during design process to ensure that the IC will
In the AOZ6689CI buck regulator circuit, high pulsing
operate under the recommended environmental
current flows through two circuit loops. The first loop
conditions.
starts from the input capacitors, to the VIN pin, to the LX
pin, to the filter inductor, to the output capacitor and load, The AOZ6689CI is TSOT23-6L package. Several layout
and then return to the input capacitor through ground. tips are listed below for the best electric and thermal
Current flows in the first loop when the high side switch is performance.
on. The second loop starts from inductor, to the output
capacitors and load, to the low side switch. Current flows 1. Do not use thermal relief connection to the VIN and
in the second loop when the low side switch is on. the GND pin. Maximize copper area to the GND pin
and the VIN pin to help thermal dissipation.
In PCB layout, minimizing the two loops area reduces the
noise of this circuit and improves efficiency. A ground 2. Input capacitor should be connected to the VIN pin
plane is strongly recommended to connect input and the GND pin as close as possible.
capacitor, output capacitor, and GND pin of the 3. Make the current trace from LX pin to L to Co to the
AOZ6689CI. GND as short as possible.
The major power dissipating components in this buck 4. Pour copper plane on all unused board area and
converter application are AOZ6689CI and the output connect it to stable DC nodes, like VIN, GND or
inductor. The total power dissipation of converter circuit VOUT
can be measured by input power minus output power. 5. Place the feedback resistors as close to the chip as
possible
P total_loss = V IN I IN – V OUT I OUT
6. Keep sensitive signal trace away from the LX pin
The power dissipation of inductor can be approximately
calculated by output current and DCR of inductor.
SEATING PLANE
GAUGE PLANE
6 5 4
1 2 3
B B
b
b1
c1 c
BASE METAL
WITH PLATING
SECTION B-B
NOTE
1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH OR GATE BURRS.
MOLD FLASH AT THE NON-LEAD SIDES SHOULD BE LESS THAN 6 MILS EACH.
2. TOLERANCE +0.100 mm (4 mil) UNLESS OTHERWISE SPECIFIED.
3. DIMENSION L IS MEASURED IN GAUGE PLANE.
4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED INCH DIMENSIONS
ARE NOT NECESSARILY EXACT.
5. ALL DIMENSIONS ARE IN MILLIMETERS.
Part Marking
AOZ6689CI
(TSOT23-6L)
LT
D BO W
Product number code Year and week code
Option code and assembly location
LEGAL DISCLAIMER
Applications or uses as critical components in life support devices or systems are not authorized. AOS does not
assume any liability arising out of such applications or uses of its products. AOS reserves the right to make changes
to product specifications without notice. It is the responsibility of the customer to evaluate suitability of the product
for their intended application. Customer shall comply with applicable legal requirements, including all applicable
export control rules, regulations and limitations.
AOS' products are provided subject to AOS' terms and conditions of sale which are set forth at:
http://www.aosmd.com/terms_and_conditions_of_sale
ALPHA AND OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
As used herein:
1. Life support devices or systems are devices or 2. A critical component in any component of a life
systems which, (a) are intended for surgical implant into support, device, or system whose failure to perform can
the body or (b) support or sustain life, and (c) whose be reasonably expected to cause the failure of the life
failure to perform when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can be effectiveness.
reasonably expected to result in a significant injury of
the user.