TI High-voltage

Seminar
Replacing optical and electro-
mechanical switches with TI’s
latest isolation technologies

Neel Seshan
Systems and Marketing Manager, Isolated Switches

Manasa Gadiyar
Systems Engineer, Isolation
Agenda

• Introduction to isolated switching

• TI’s isolation technology

• Overview and use cases of TI’s portfolios of opto-emulator switches &

solid-state relays

2
Isolated switches
Control high voltage load with a low voltage signal

Handle ground potential differences between communicating subsystems

Protect low-voltage circuitry from high voltages

3
Traditional isolated switches

Electro-mechanical relays (EMR) Optical relays (solid-state relays)

Solenoid based action for mechanical Optical coupling with solid-state
switching switching 4
Electro-mechanical relays
• Electrical isolation:
EMR
– Electro-mechanical relays use metal contacts instead of integrated or external
MOSFETs. This eliminates leakage current within the device due to the ability to
implement a pure mechanical disconnect, thereby providing excellent electrical
isolation

• Cost-effective:
– Simpler construction of devices leads electro-mechanical relays to be relatively
cheaper then solid-state relays

• Noise immunity:
– Less susceptible to electromagnetic interference thereby suitable for noisy
environments

• Bulky:
– Electro-mechanical relays usually have larger size (including height) because the
package needs to accommodate space for all of the parts within the device, such
as the metal contacts, coil, and spring 5
Electro-mechanical relays (EMRs)
• Slower switching speed:
EMR
– Current flowing through the metal contacts must reach a certain condition before
switching to an open/closed state (ex. not oscillating when closed), thereby
requiring a longer settling time

• Power hungry:
– Current required to magnetize the coils in the electro-mechanical relay may be
large thereby increasing the power consumption of the system

• Noisy:
– Variations on the voltage or current supply can cause opening and closing of the
contacts know as relay chatter, that reduces the life-span of the device

• Reliability concern:

– Metal contacts experience wear and tear, such as welding shut. This limits the
number of switching cycles before experiencing complete failure, thus limiting
overall reliability 6
Optical relays and photo relays
• Small size:
– Simpler construction of photo-relays leads to smaller package foot-prints

• Fast switching:
– Opto-relays switch faster than mechanical relays with minimal chatter/noise on
the output switching FETs

• Low EMI:
– Since light is used to transfer data from LED to the sensor, the emissions and
immunity performance is better than other solid-state relays

• LED degradation:
– LED’s are subject to light decay, which is the reduction of light output capacity
due to extreme conditions, such as over-temperature or over-current. As a
result, the LED within a photo relay does not have enough luminosity to drive a
gate voltage, which limits the switch functionality of the device
7
Optical relays and photo relays
• Limited temperature range:
– Typical opto-relays have limited temperature range to ensure high
performance (ex. timing). To achieve higher temperature ranges, most photo
relays have to use more expensive materials, which is not practical in most
applications

• External circuit:
– Photo relays need an external current-limiting resistor and often use
additional FETs to manage the LED’s on or off state

8
Isolated switches are everywhere

9
TI’s isolation technologies | Capacitive
• Capacitive isolation technology based on AC signal transfer across a
dielectric

• TI’s capacitive isolators are constructed using an SiO2 dielectric,

which provides very high dielectric strength

• SiO2 is an inorganic material → extremely stable over moisture and

temperature

• Proprietary methodology for multilayered capacitor and multilayer

passivation improves isolator quality and reliability by reducing the
dependence of high-voltage performance on any single layer

• Supports working voltages (VIOWM) of 2 kVRMS, withstands isolation

voltages (VISO) of 7.5 kVRMS and has a surge voltage capability of
12.8 kVPK

10
TI’s isolation technologies | Inductive
• Magnetic isolation is typically used in applications that require
high-frequency DC/DC power conversion

• TI uses a proprietary multichip module approach for magnetic

isolation, which co-packages a high-performance planar
transformer with an isolated power stage and dedicated controller
die

• Transformers with either a high-performance ferrite core to

improve coupling and transformer efficiency, or an air-core to
save cost and complexity when the application requires only
modest power transfer

• By combining both signals and power transfer over the same

integrated transformer coil, both solution cost and size are
minimized

11
TI’s opto-emulator switches & solid state relays (SSRs)
Opto-emulator switches Isolated switches and drivers

External
FET Driver

Internal
FET Switch

12
Introduction to opto-emulators | ISOM86xx

• Epoxy dielectric for isolation • SiO2 dielectric for robust isolation

• LED signal transmission, affected by aging • Diode emulated, no physical GaAs LED
• GaAs LED bias current increases with temperature • 'LED emulator' input eliminates over-compensation on bias
and lifetime operation, requires compensation current across temperature and lifetime operation
• Slower switching speeds • Faster switching speeds

13
Switchable termination on CAN/RS485

• Software configurable termination on the CAN/RS485 bus.

• Enable/disable termination for multi-node configs on the

CAN/RS485 lines

• Enable half/full duplex designs with isolated switches

• TERM = High enables the termination; TERM = Low

disables termination

• High common mode blocking voltage of ±70V, low off-state

leakage <1uA

14
Low power switching in intrusion alarms

• Detect any disturbance from sensors placed in

spaces of interest

• Based on architecture, normally closed outputs

may be needed

• ISOM86xx does not need to be compensated for

3x-4x LED current deration over lifetime
operation

• Ultra low-IF (0.8mA) very useful when sensors

directly interface with the ISOM86xx

15
Switch burden resistor in universal input module

• Enable/disable precision burden resistors on Analog input

module

• Rshunt is set for current input, disabled for voltage input

• When ctrl = High, Rshunt set for 4-20mA current input mode

• When ctrl = Low, Rshunt set for ±10V voltage input mode

• Blocks high voltage common mode up-to 70V

with <1uA leakage

• Does not require high voltage supply on switch side

16
Channel-to-channel isolated input modules

• Each differential pair multiplexed using ISOM86xx

• High voltage blocking in Channel-to-channel isolated

input modules

• Up to 70V blocking with no secondary side high

voltage supply

• ISOM86xx offers best-in-class switching time <200μs

• Blocks high voltage common mode up to 70V

with <1uA leakage

17
Compact isolated digital output modules

• Source/sink capable digital output modules

use multiple discrete elements for high
capacity
Output
RLIM
ISOLATION

Sink
+
Sou rce
- • Generally use photo-coupler with
OR
additional transistor for higher capacity,
+
bridge stage for bidirectional capability and
-
sometimes Zener diodes for high voltage
COM
LOA D
blocking
PLC

• ISOM86xx can displace all these

components with symmetrical 70V blocking
and 150mA current capacity

18
Compact isolated digital output modules

• Source/sink capable digital output modules use

multiple discrete elements for high capacity
Output
• Generally use photo-coupler with additional
Sink Sou rce
RLIM
+ - transistor for higher capacity, bridge stage for
bidirectional capability and sometimes Zener
ISOLATION

OR

+
diodes for high voltage blocking
-

COM
LOA D
• ISOM86xx can displace all these components
PLC with symmetrical 70V blocking and 150mA
current capacity

19
ISOM86xx benefits over optocoupler switches
Robust performance across temp Reliable isolation Lower power budgets

Opto performance varies widely across Part to part variation and skew is Opto-couplers consume as much as
temperature. Customers are forced to known to be high in optocouplers. 10mA per channel due to deration of
design for worst case (driving harder) Opto-emulators have FIT (failure in the LED over lifetime operation.
leading to increased power time) rates that are order of magnitudes
consumption and decreased lifetime. stronger than optocouplers. Engineers need to overdesign for
Opto-emulators can enable simpler lifetime operation, and this factor can
design with lower device variance. be as high as 3x to 4x of rated currents.

The deration factors are not readily

80% Typical available on the datasheet, making it
Input extremely challenging for the system
threshold design to work for lifetime operation.
variation
across temp

Optocoupler failure variation versus TI’s

consistent performance w/ SiO2 dielectric

20
Getting started with opto-emulator switches

Technical Collateral

Upgrading Relays With Opto-Emulator Switch

Basic isolation

ISOM8610 Upgrading your designs with TI’s Pin-to-Pin Opto-emulator switch: ISOM8610
3.75k VRMS
Demystifying Isolation Certification Standards: Optocouplers vs Opto-emulators

Opto-emulators explained: Why you should upgrade your optocoupler technology

Introduction to Opto-Emulators
Functional isolation

FAQ Forum : Opto-emulators

ISOM8600
1kVDC1-min withstand Evaluation boards
voltage
ISOM8610DFGEVM — ISOM8610DFG, Single Channel Opto-emulator switch with integrated
FET Evaluation Module

Blocking voltage = 80V

Opto-emulator switch
21
TI’s opto-emulator switches & solid state relays
Opto-emulator switches Isolated switches and drivers

External
FET Driver

Internal
FET Switch

22
Isolated switch driver integration | TPSI305x/-Q1
HV BUS

TPSI305x/-Q1 is an isolated switch driver with integrated power supply that provides a
single chip solution for FET driving.

HV BUS
DC Link
Isolated Power Powe r V DDP Capacito
Supply

12V FET EN
Control

Transformer Transformer
Driver DC Link
Capacitor
TPSI3050
V DD

FET VDD
Control

Gate
Isolator Driver

23
Isolated switch driver integration with feedback | TPSI310x/-Q1
• Back-channel communication offers diagnostic information to LV MCU
• No need for digital isolator

Power VDDP Power VDDP

VDDM VDDM

FET EN
FET EN
Control Control

Fault Sense
Status Inputs
TPSI3050 TPSI3100

24
Isolated switch driver in power distribution unit
With 1.5A/3A peak (source/sink) drive capability can switch multiple FETs as in a PDU.

TPSI3100-Q1
MCU

GPIO EN VDRV

CE POWER VDDH

SIGNAL

Control & Power Transfer

VSS P VDDM

ISOLATION
VDD VDDP VSS S

PGOOD RESP
+
+

–
Control
GPIO
FLT1 FLT1_CMP -
SIGNAL +
ALM1 ALM1_ CMP
GPIO –
+
VSS P VSS S
GND – LOAD

25
Passive pre-charge with overcurrent protection

Passive pre-charge with TPSI3100-Q1 offers a low complexity and high reliability solution.

TPSI3100-Q1 HV+
MCU
EN VDRV
+
GPIO

CE POWER VDDH
-
Main
Control & Power Transfer

SIGNAL
VSS P VDDM
Contactor
ISOLATION

Current Sense
VDD VDDP VSS S

PGOOD RESP
RSHU NT +
+

–
Control

GPIO
FLT1 FLT1_CMP -
SIGNAL +
GPIO
ALM1
–
ALM1_ CMP DC-Link

GND
VSS P
+
–
VSS S HV-
GND GND

26
Insulation monitoring: High-voltage testing
Insulation monitoring devices must pass a high voltage test up to 4.3 kV in the OFF state

Device is OFF V = 4.3 KV To verify reliability, a high voltage is

GND applied to the device while OFF. This
R
test is called a Withstand Voltage Test
+
–
IAVA or a High Potential Test.

These high voltages can cause

avalanche current (IAVA) to flow
through, even though the device is OFF.
GND

27
Isolated switch: Optimized insulation monitoring
The TPSI2140-Q1 is a solid state relay that delivers cost savings and improved measurement accuracy with
its 1mA-2mA avalanche rating and robust capacitive isolation barrier.

 4MΩ resistance to prevent avalanche

damage during OV conditions in field ✓ 1MΩ resistance for better
sensing accuracy

Additional components
required HV+
✓ <9mA VDD current HV+

+
+
TPSI2140-Q1 1M
3-5.5V 3-20V -
4M HV-
-
HV- VDD
5V

Micro
EN
✓ 1.5µA
105C
I OFF @ 1kV /

 Reed Relay to SiO 2

prevent avalanche
during HIPOT testing
Based
Capacitive
Isol atio n
✓ 1mA-2mA avalanche
robustness enabled
5V Bar rier

by custom wide pin

Micro
package.
40 k
10 k

 Photo LED
degradation ✓ High TDDB reliable capacitive
isolation barrier
over time

28
Multi-relay replacement in 400V BMS systems
• TPSI2072-Q1 integrates the function of two 600V opto-relays into a single package.
• Additionally, it can withstand up to 2mA of avalanche current, replacing external mechanical switches.

Opto-relay HV+
Micro HV+

TPSI2072-Q1
+ VDD
+

- -

ISOLATION
Micro
Chassi s EN1
GND EN2 Chassi s
Opto-relay GND

Micro + +

- -

HV- HV-

29
Isolated switches and switch drivers in BMS applications
Main Contactor
HV+

-
TPSI3100-Q1 Capacitor
Isolation Check TPSI305x-Q1 Pre-charge

+ 800V System 400V System

- TPS4141-Q1 TPSI2140-Q1

SW
SW 1200V Switch
Chassi s DC Link
High Voltage TPSI2072-Q1
Monitoring
GND
2-ch, 600V Capacitor
+ Isolated Switch TPSI3100-Q1
TPSI305x-Q1

- TPSI2140-Q1

SW
SW

1200V Switch
Capacitor
Discharge

-
Main Contactor

HV- 30
TI’s SSR benefits over EMRs and photo relays
Higher system reliability & Smarter switches with back
Integrated power & signal isolation
best-in-class isolation channel communication
• Improves system lifetime with basic • Reduces solution size and cost by • Ability to send signal and power from
isolation up to 3.75 kVRMS and reinforced integrating the power and signal transfer primary to secondary side, as well as
isolation up to 5 kVRMS by eliminating over an isolation barrier in a single chip. send diagnostics like fault and alarm
wear & tear of EMRs and LED signals from secondary to primary side.
degradation of photo relays. • Ability to provide an auxiliary power
source on the secondary side allows for • These diagnostic features can be used
low-voltage systems, such as current to detect system faults like over current
sense amplifiers, to be powered without or monitor system conditions like in-rush
TPSI3050-Q1 Insulation requiring any external power source on currents.
the secondary side of the device.
Lifetime Projection Data

TPSI3050-Q1 Insulation Lifetime Projection Data

31
 EMI optimization
• Transferring power over a capacitive or inductive isolation barrier results in higher EMI than optical
relays and EMRs

• Newer devices are designed to help minimize conducted and radiated emissions with spread
spectrum techniques, symmetric drive, optimized switching frequency etc.

• Additional system level techniques (Y-cap, stitching cap, ferrite beads) can be used to improve EMI
performance further to meet automotive standards (CISPR 25 Class 5) or industrial standards
(CISPR 32)
-
Power

EN
Isolated
LDO Switch
Primary GND Secondary side Device
PINS
Battery FB FB

Surface mounted Y-capacitor Integrated PCB stitching capacitor Ferrite beads

32
Getting started with isolated switches and drivers
Industrial Automotive
Reinforced Isolation

TPSI3050-Q1 TPSI3052-Q1 TPSI3100-Q1

5.0 kVRMS 5.0 kVRMS
5.0 kVRMS
2 Feedback Channels
Basic Isolation

TPSI2072-Q1 TPSI2140-Q1 TPSI3052 TPSI3100

TPSI3050 3.0 kVRMS
2-ch, 3.75 kVRMS 1-ch, 3.75 kVRMS
3.0 kVRMS 3.0 kVRMS
2 mA Avalanche 2mA Avalanche 2 Feedback Channels

600V Standoff 1200V Standoff 10V Gate Drive 15V Gate Drive

Isolated Switch Isolated Switch Driver

33
Getting started with isolated switches and drivers
Technical Collateral Reference Designs

Basics of Solid-State Relays TIDA-050063: High-voltage solid-state relay active precharge reference design
How solid-state relays simplify insulation monitoring designs in high-voltage applications TIDA-050059: Overcurrent and overtemperature protection for solid-state relays reference
How to Achieve Higher-reliability Isolation and a Smaller Solution Size with Solid-state Relays design

Why Pre-Charge Circuits are Necessary in High-Voltage Systems TIDA-050058: Zero-cross switching for solid-state relays reference design

How to Design High-voltage Systems with Higher Reliability While Reducing Solution Size TIDA-010232: AFE for insulation monitoring in high-voltage EV charging and solar energy
and Cost reference design
Designing Safer, Smarter and More Connected Battery Management Systems
TIDA-01513:Automotive High-Voltage and Isolation Leakage Measurements Reference
When to use SSR or Isolated Gate Driver Design

Evaluation boards Calculation Tools

TPSI3050Q1EVM — TPSI3050-Q1 evaluation module for automotive load switch driver with ACTIVE-PRECHARGE-CALC — Active precharge reference design (TIDA-050063)
reinforced isolation calculator tool
TPSI3052Q1EVM — TPSI3052-Q1 evaluation module with reinforced isolation and 15-V gate SLVRBI9 — TPSI3050-Q1, TPSI3052-Q1, TPSI3050, TPSI3052 Design Calculator
drive

TPSI31XXQ1EVM — TPSI31xx-Q1 evaluation module

TPSI2140Q1EVM — TPSI2140-Q1 evaluation module for 1200-V 50-mA isolated switch with
2-mA avalanche rating

TPSI2072Q1EVM — TPSI2072-Q1 evaluation module for two-channel 600-V isolated switch

34
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