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FDD4243 46507

Circuito integrado FDD4243

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22 views9 pages

FDD4243 46507

Circuito integrado FDD4243

Uploaded by

Tobias Gadelha
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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www.onsemi.com

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of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right
to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
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FDD4243 40V P-Channel PowerTrench® MOSFET
March 2015

FDD4243
40V P-Channel PowerTrench® MOSFET
-40V, -14A, 44mΩ
Features General Description
„ Max rDS(on) = 44mΩ at VGS = -10V, ID = -6.7A This P-Channel MOSFET has been produced using Fairchild
„ Max rDS(on) = 64mΩ at VGS = -4.5V, ID = -5.5A Semiconductor’s proprietary PowerTrench® technology to
deliver low rDS(on) and optimized Bvdss capability to offer
„ High performance trench technology for extremely low rDS(on) superior performance benefit in the applications.
„ RoHS Compliant

Application
„ Inverter
„ Power Supplies

D G
G

S
D
TO-PA K
-2 52
(TO -252) D

MOSFET Maximum Ratings TC = 25°C unless otherwise noted


Symbol Parameter Ratings Units
VDS Drain to Source Voltage -40 V
VGS Gate to Source Voltage ±20 V
Drain Current -Continuous (Package limited) TC= 25°C -14
-Continuous (Silicon limited) TC= 25°C (Note 1) -24
ID A
-Continuous TA= 25°C (Note 1a) -6.7
-Pulsed -60
EAS Single Pulse Avalanche Energy (Note 3) 84 mJ
Power Dissipation TC= 25°C 42
PD W
Power Dissipation (Note 1a) 3
TJ, TSTG Operating and Storage Junction Temperature Range -55 to +150 °C

Thermal Characteristics
RθJC Thermal Resistance, Junction to Case 3.0
°C/W
RθJA Thermal Resistance, Junction to Ambient (Note 1a) 40

Package Marking and Ordering Information


Device Marking Device Package Reel Size Tape Width Quantity
FDD4243 FDD4243 D-PAK(TO-252) 13’’ 16mm 2500 units

©2007 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com


FDD4243 Rev. 1.3
FDD4243 40V P-Channel PowerTrench® MOSFET
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units

Off Characteristics
BVDSS Drain to Source Breakdown Voltage ID = -250µA, VGS = 0V -40 V
∆BVDSS Breakdown Voltage Temperature
ID = -250µA, referenced to 25°C -32 mV/°C
∆TJ Coefficient
VDS = -32V, -1
IDSS Zero Gate Voltage Drain Current µA
VGS = 0V TJ = 125°C -100
IGSS Gate to Source Leakage Current VGS = ±20V, VDS = 0V ±100 nA

On Characteristics
VGS(th) Gate to Source Threshold Voltage VGS = VDS, ID = -250µA -1.4 -1.6 -3.0 V
∆VGS(th) Gate to Source Threshold Voltage
ID = -250µA, referenced to 25°C 4.7 mV/°C
∆TJ Temperature Coefficient
VGS = -10V, ID = -6.7A 36 44
rDS(on) Drain to Source On Resistance VGS = -4.5V, ID = -5.5A 48 64 mΩ
VGS = -10V, ID = -6.7A, TJ = 125°C 53 69
gFS Forward Transconductance VDS = -5V, ID = -6.7A 16 S

Dynamic Characteristics
Ciss Input Capacitance 1165 1550 pF
VDS = -20V, VGS = 0V,
Coss Output Capacitance 165 220 pF
f = 1MHz
Crss Reverse Transfer Capacitance 90 135 pF
Rg Gate Resistance f = 1MHz 4 Ω

Switching Characteristics
td(on) Turn-On Delay Time 6 12 ns
VDD = -20V, ID = -6.7A
tr Rise Time 15 26 ns
VGS = -10V, RGEN = 6Ω
td(off) Turn-Off Delay Time 22 35 ns
tf Fall Time 7 14 ns
Qg(TOT) Total Gate Charge at 10V VDD = -20V, ID = -6.7A 21 29 nC
Qgs Gate to Source Gate Charge VGS = -10V 3.4 nC
Qgd Gate to Drain “Miller” Charge 4 nC

Drain-Source Diode Characteristics


VSD Source to Drain Diode Forward Voltage VGS = 0V, IS = -6.7A (Note 2) 0.86 1.2 V
trr Reverse Recovery Time 29 43 ns
IF = -6.7A, di/dt = 100A/µs
Qrr Reverse Recovery Charge 30 44 nC

Notes:
1: RθJA is sum of junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is
guaranteed by design while RθJC is determined by the user’s board design.

a. 40°C/W when mounted on a 1 in2 pad of 2 oz copper

b. 96°C/W when mounted on a minimum pad.

2: Pulse Test: Pulse Width < 300µs, Duty cycle < 2.0%.
3: Starting TJ = 25°C, L = 3mH, IAS = 7.5A, VDD = 40V, VGS = 10V.

FDD4243 Rev. 1.3 2 www.fairchildsemi.com


FDD4243 40V P-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
60 3.5
VGS = -3.0V

DRAIN TO SOURCE ON-RESISTANCE


50 3.0
-ID, DRAIN CURRENT (A)

VGS = -10V VGS = -4V


VGS = -4.5V
VGS = - 6V VGS = -4.5V
40 2.5

NORMALIZED
VGS = -5V VGS = -5V
VGS = -4V
30 2.0 VGS = -6V
PULSE DURATION = 80µs
20 DUTY CYCLE = 0.5%MAX 1.5
VGS = - 3.0V
VGS = -10V
10 1.0
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
0 0.5
0 1 2 3 4 5 0 10 20 30 40 50 60
-VDS, DRAIN TO SOURCE VOLTAGE (V) -ID, DRAIN CURRENT(A)

Figure 1. On Region Characteristics Figure 2. Normalized On-Resistance


vs Drain Current and Gate Voltage

1.8 120
DRAIN TO SOURCE ON-RESISTANCE

ID = -6.7A ID = -6.7A PULSE DURATION = 80µs

SOURCE ON-RESISTANCE (mΩ)


VGS = -10V DUTY CYCLE = 0.5%MAX
1.6 100

1.4
rDS(on), DRAIN TO
NORMALIZED

80
TJ = 125oC
1.2
60
1.0 TJ = 25oC

40
0.8

0.6 20
-50 -25 0 25 50 75 100 125 150 2 3 4 5 6 7 8 9 10
TJ, JUNCTION TEMPERATURE (oC) -VGS, GATE TO SOURCE VOLTAGE (V)

Figure 3. Normalized On Resistance Figure 4. On-Resistance vs Gate to


vs Junction Temperature Source Voltage

60 30
VGS = 0V
-IS, REVERSE DRAIN CURRENT (A)

PULSE DURATION = 80µs


DUTY CYCLE = 0.5%MAX
50 10
-ID, DRAIN CURRENT (A)

TJ = 150oC
40 TJ = 150oC
TJ = 25oC
30 TJ = 25oC
1
20 TJ = -55oC

TJ = -55oC
10

0 0.1
1 2 3 4 5 6 0.4 0.6 0.8 1.0 1.2
-VGS, GATE TO SOURCE VOLTAGE (V) -VSD, BODY DIODE FORWARD VOLTAGE (V)

Figure 5. Transfer Characteristics Figure 6. Source to Drain Diode


Forward Voltage vs Source Current

FDD4243 Rev. 1.3 3 www.fairchildsemi.com


FDD4243 40V P-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
10 3000
-VGS, GATE TO SOURCE VOLTAGE(V)

ID = -6.7A
VDD = -10V
8
1000

CAPACITANCE (pF)
Ciss

6
VDD = -20V

4 VDD = -30V

Coss

2 100 f = 1MHz
VGS = 0V Crss

0 50
0 4 8 12 16 20 24 0.1 1 10 30
-VDS, DRAIN TO SOURCE VOLTAGE (V)
Qg, GATE CHARGE(nC)

Figure 7. Gate Charge Characteristics Figure 8. Capacitance vs Drain


to Source Voltage

10 25
8
-IAS, AVALANCHE CURRENT(A)

-ID, DRAIN CURRENT (A)


20 VGS = -10V
6
TJ = 25oC
4 15

10 Limited by Package
2 TJ = 125oC VGS = -4.5V
5
o
RθJC = 3.0 C/W

1 0
0.01 0.1 1 10 30 25 50 75 100 125 150
tAV, TIME IN AVALANCHE(ms) TC, CASE TEMPERATURE ( C)
o

Figure 9. Unclamped Inductive Figure 10. Maximum Continuous Drain


Switching Capability Current vs Case Temperature

100 10000
P(PK), PEAK TRANSIENT POWER (W)

FOR TEMPERATURES
VGS = -10V ABOVE 25oC DERATE PEAK
-ID, DRAIN CURRENT (A)

100us CURRENT AS FOLLOWS:


10 150 – TC
1000 I = I25 ----------------------
125

TC = 25oC
1ms
1
10ms
OPERATION IN THIS SINGLE PULSE
100
100ms
AREA MAY BE TJ = MAX RATED SINGLE PULSE
LIMITED BY rDS(on) TC = 25OC
0.1 30
-5 -4 -3 -2 -1 0 1
0.5 1 10 100 10 10 10 10 10 10 10
t, PULSE WIDTH (s)
-VDS, DRAIN to SOURCE VOLTAGE (V)

Figure 11. Forward Bias Safe Figure 12. Single Pulse Maximum
Operating Area Power Dissipation

FDD4243 Rev. 1.3 4 www.fairchildsemi.com


FDD4243 40V P-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted

2
1 DUTY CYCLE-DESCENDING ORDER

D = 0.5
NORMALIZED THERMAL

0.2
IMPEDANCE, ZθJC

0.1
0.05
0.1 0.02 PDM
0.01

t1
t2
NOTES:
0.01 DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJC x RθJC + TC
SINGLE PULSE
0.003
-5 -4 -3 -2 -1 0 1
10 10 10 10 10 10 10
t, RECTANGULAR PULSE DURATION (s)

Figure 13. Transient Thermal Response Curve

FDD4243 Rev. 1.3 5 www.fairchildsemi.com


TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPower F-PFS OPTOPLANAR®
®*
AttitudeEngine™ FRFET®
SM
Awinda® Global Power Resource ®
TinyBoost®
AX-CAP®* GreenBridge Power Supply WebDesigner TinyBuck®
BitSiC Green FPS PowerTrench® TinyCalc
Build it Now Green FPS e-Series PowerXS™ TinyLogic®
CorePLUS Gmax Programmable Active Droop TINYOPTO
CorePOWER GTO QFET® TinyPower
CROSSVOLT IntelliMAX QS TinyPWM
CTL ISOPLANAR Quiet Series TinyWire
Current Transfer Logic Making Small Speakers Sound Louder RapidConfigure TranSiC
DEUXPEED® and Better™  TriFault Detect
Dual Cool™ MegaBuck TRUECURRENT®*
EcoSPARK® Saving our world, 1mW/W/kW at a time™ SerDes
MICROCOUPLER
EfficientMax SignalWise
MicroFET
ESBC SmartMax
MicroPak
® SMART START
MicroPak2 UHC®
Solutions for Your Success
® MillerDrive Ultra FRFET
Fairchild SPM®
Fairchild Semiconductor® MotionMax UniFET
STEALTH
MotionGrid® VCX
FACT Quiet Series SuperFET®
FACT® MTi® VisualMax
SuperSOT-3
FastvCore MTx® VoltagePlus
SuperSOT-6
FETBench MVN® XS™
SuperSOT-8
mWSaver® Xsens™
FPS SupreMOS®
OptoHiT
SyncFET 仙童®
OPTOLOGIC®
Sync-Lock™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. TO OBTAIN THE LATEST, MOST UP-TO-DATE DATASHEET AND PRODUCT INFORMATION, VISIT OUR
WEBSITE AT HTTP://WWW.FAIRCHILDSEMI.COM. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF
ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF
OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE
WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.

AUTHORIZED USE
Unless otherwise specified in this data sheet, this product is a standard commercial product and is not intended for use in applications that require extraordinary
levels of quality and reliability. This product may not be used in the following applications, unless specifically approved in writing by a Fairchild officer: (1) automotive
or other transportation, (2) military/aerospace, (3) any safety critical application – including life critical medical equipment – where the failure of the Fairchild product
reasonably would be expected to result in personal injury, death or property damage. Customer’s use of this product is subject to agreement of this Authorized Use
policy. In the event of an unauthorized use of Fairchild’s product, Fairchild accepts no liability in the event of product failure. In other respects, this product shall be
subject to Fairchild’s Worldwide Terms and Conditions of Sale, unless a separate agreement has been signed by both Parties.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Terms of Use
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors
are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical
and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise.
Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global
problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Datasheet contains the design specifications for product development. Specifications may change
Advance Information Formative / In Design
in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Preliminary First Production
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
No Identification Needed Full Production
changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
Obsolete Not In Production
The datasheet is for reference information only.
Rev. I77

© Fairchild Semiconductor Corporation www.fairchildsemi.com


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