Document No.

ME-01-02-075

SPECIFICATION
MEMS Microphone

RoHS Compliance & Halogen Free

Product : 3.76x2.95x1.1mm Analog Bottom Port+MAX RF

GETTOP P/N : MA-BRA383-G13-1

Version : V1.0

Designed by Checked by Confirmed by Approved by Released Date

Limei Zhang Mary Li Pengfei Li Zhiyong Liu 1-18-2014

ISO/TS 16949 : 2009

ISO 9001 : 2008
ISO 14001：2004+Cor1 : 2009
BS OHSAS 18001 : 2007
QC080000 :2005

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 Revision History

Date Version Description Controller

1-18-2014 V1.0 Initial release Mary Li

68 Fengshan Road, Fangzi District, Weifang, Shandong, China Tel: +86-536-228 3666x977 Fax: +86-536-760 5903 www.gettopacoustic.com

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 Contents
1. Scope.................................................................................................................................... 3
2. Product Type ....................................................................................................................... 3
3. Electro-Acoustic Specifications ......................................................................................... 3
4. Frequency Response .......................................................................................................... 4
5. Measurement System Setup ............................................................................................... 5
6. Dimension Unit：mm ...................................................................................................... 6
7. Reliability Tests ................................................................................................................... 6
7.1 Hi-Temperature Test...................................................................................................................... 6
7.2 Low-Temperature Test .................................................................................................................. 6
7.3 Humidity & Heat Test .................................................................................................................... 6
7.4 Thermal Shocking Test ................................................................................................................. 7
7.5 Vibration Test ................................................................................................................................ 7
7.6 Drop Test....................................................................................................................................... 7
7.7 Electrostatic Discharge ................................................................................................................. 7
8. Packaging ............................................................................................................................ 8
9. Application Design Suggestions........................................................................................ 9
9.1 Recommended PCB Design: ........................................................................................................ 9
9.2 Temperature Profile during Reflow Process： .............................................................................. 9
9.3 Recommended nozzle for reflow MIC: ........................................................................................ 10
10. Special Cautions ............................................................................................................. 11
10.1 Air Rifle Cleaning Restriction ...................................................................................................... 11
10.2 Board Wash Restriction .............................................................................................................. 11
10.3 Vacuum Restriction ..................................................................................................................... 11
10.4 Environmental Condition ............................................................................................................. 11
10.5 Storage ....................................................................................................................................... 11
11. References ...................................................................................................................... 11

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1. Scope
This document is the technical specification of a MEMS microphone.

2. Product Type
Product Number:
MA-BRA383-G13-1
Product Description:

3.76x2.95x1.1mm Analog Bottom Port, with MAXRF protection.

3. Electro-Acoustic Specifications
Test condition: +20℃, 45%～75% RH, 86~106Kpa, Vdd=2V, unless specified differently.
Table 3-1 Electrical Specifications

Limits
No. Parameter Symbol Condition Unit
Min Nom. Max
f=1kHz, Pin=1Pa,
3.1 Sensitivity S -41 -38 -35 dB
0dB=1V/Pa
3.2 Directivity Omni-directional
Output
3.3 ZOUT f=1kHz 400 Ω
Impedance
Current
3.4 I 1.6V to 3.6V 250 µA
Consumption
f=1kHz, Pin=1Pa,
3.5 S/N Ratio S/N 63 dB
(A-Weighted)
3.6 Operating Voltage 1.6 2 3.6 V
Sensitivity vs.
3.7 ΔS Vs= 3.6V to 1.6V <0.5 dB
Voltage

Total Harmonic 100dB SPL @1KHz 1

3.8 THD %
Distortion 115dB SPL @1KHz 5

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4. Frequency Response

+20
+15
Relative Response(dB)

+10 +8
+5 +3 +4
+2 +2 +2
0
-5 -2 -2 -2 -2 -2 -2
-10
-15
-20
50 100 200 500 1k 3k 5k 10k

Fig. 4-1 Frequency Response

Table 4-1 Frequency Response Limit Template

Frequency 100 200 500 3K 5K 8K
[Hz]
Upper Limit 2 2 2 3 4 8
[dB]
Lower Limit -2 -2 -2 -2 -2 -2
[dB]
* Limits for intermediate frequencies are found by drawing straight lines between the breaking points in the

table on a linear dB – logarithmic frequency scale.

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5. Measurement System Setup

Test signal: Sinusoid, Sweep,

Frequency Range: 50Hz-17KHz

Step: 1/12 octave

B&K 3560C

Transfer data through transmission line

Anechoic
Output Input Turn-table controller chamber

B&K4191 L001
Free field 1/2 inch MIC

DUT MIC
Free field 50cm Tannoy Speaker

2716C-001
Audio amplifier

Fig. 5-1 Measurement System Setup

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6. Dimension Unit：mm

xxxx
Date
Code

BOTTOM VIEW TOP VIEW

Pad definition: 1--OUTPUT 2-- GND 3--GND 4-- GND 5-- V DD 6-- GND
Fig. 7-1 Dimension

7. Reliability Tests
All the test conditions of the Reliability Tests are specified in the reference document,
listed in Section 12.

After conducting any of the following tests, the sensitivity change of DUT shall be less
than ±3dB from its initial value and shall keep its initial operation and appearance.
7.1 Hi-Temperature Test
Temperature: +85℃
Duration: 240 hours

7.2 Low-Temperature Test

Temperature: -40℃
Duration: 240 hours

7.3 Humidity & Heat Test

Temperature: +70℃
Humidity: 93% RH
Duration: 240 hours

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 7.4 Thermal Shocking Test
Temperature & Duration: -40℃, 30 minutes
Temperature & Duration: +80℃, 30 minutes,
Cycles: 32 cycles
7.5 Vibration Test
Frequency: 10-55Hz
Amplitude: 1.52mm
Direction: 2 directions
Duration: 2 hours
7.6 Drop Test
Drop the microphones to the floor without package.
Height: 1.5m
Reference Surface: slippery marble floor
Duration: 5 times

7.7 Electrostatic Discharge

The tests are performed acc. to IEC61000-4-2 level 3:
a. Contact Discharge
Discharge Position: Output of Microphone
Charge Voltage: ±6000VDC
Discharge Network: 150pF & 330Ω
b. Air Discharge
Discharge Position: Sound Hole
Charge Voltage: ±8000VDC
Discharge Network: 150pF & 330Ω

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8. Packaging
* Use ESD reel and tape for microphone packaging.
* Anti-static measures should be applied during packaging operation.

1.75± 0.1
8.0± 0.1
4.0± 0.1 4.0± 0.1 1.23± 0.05
B
0.3± 0.05

A A

12± 0.3

3.25± 0.05
B B B

5.5± 0.05
SOUND PORT

120°
2
10° MAX 20.
+0.5
13-0.2
4.05± 0.05
A A

2.4± 0.1

A(10:1)
33 18.4MAX
0M
AX 06

PS
100± 0.5

PS

06

+2
12.4 0

A
Tape and Reel φ330mm 5,500PCS×1=5,500PCS
Batch Box 120mm*350mm*365mm 5,500PCS×5=27,500PCS
Shipping Box 265mm*375mm*400mm 27,500PCS×2=55,000PCS
Fig. 9-1 Packaging

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9. Application Design Suggestions
9.1 Recommended PCB Design:

2.03 0.63

0.56

1.22

0.61

2.1
2- 0.72

1.93 0.61

Fig. 10-1 Recommended PCB Design

9.2 Temperature Profile during Reflow Process：

Table 10-1 Temperature Profile during Reflow Process

Parameter Reference Specification

Average Temperature Gradient in Preheating 2.5°C/s

Soak Time Tsoak 2-3 minutes

Time above 217°C t1 Max 60s

Time above 230°C t2 Max 50s

Time above 250°C t3 Max 10s

Peak Temperature in Reflow Tpeak 255°C (–0/+5°C)

Temperature Gradient in Cooling Max -5°C/s

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 Temperature Not to scale, for reference only

T peak
T3
T2
T1

t3 Time
t soak
t2
t1

Fig. 10-2 Reflow Profile

*After the initial reflow, the MIC shall be resumed to room temperature if more reflow is
needed.
*The test should be conducted after the MIC unit has been exposed to room temperature for
3 hours.
*The reflow times can not over than 4 times.
9.3 Recommended nozzle for reflow MIC:
External diameter is Φ1.8mm
Inside diameter is Φ1.2mm

1.2

1.8

Fig. 10-3 Recommended nozzle for reflow MIC

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10. Special Cautions
10.1 Air Rifle Cleaning Restriction

Do not bring air rifle to the port hole directly.

Recommended Condition:
Air pressure < 0.3MPa;
Distance > 5cm;
Time < 5 sec.
10.2 Board Wash Restriction
It is prohibited to wash the board after reflow process. This could damage the MIC.
10.3 Vacuum Restriction
It is prohibited to use a vacuum over the port hole of the MIC. This could damage the
MIC.
10.4 Environmental Condition
Storage Condition: -40℃~+100℃
Operation Condition: -40℃~+100℃
Arbitration Condition: 20℃±2℃, R.H. 60%~70%, Air pressure: 86~106KPa

10.5 Storage
The component needs to meet the requirement of MSL(Moisture Sensitivity Level) class
2a. Please keep MICs in warehouse with humidity less than 75% and without sudden
temperature change, acid air, and any other harmful air or strong magnetic field.
Please protect products against moist, shock, sunburn and pressure.
Please take proper measures against ESD in the process of assembly and
transportation..
Please use the shipping package for long-term storage.

11. References

1) “Reliability Test Manual at Shandong Gettop Acoustic Co. Ltd.”, SM-III-S080-04-E.

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