Registration No:
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Total Number of Pages: 02
02 3 Course: B.Tech
Sub_Code: REI6D001
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th
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7 Semester/Regular/Back Examination: 2023-24
9 -
SUBJECT:1 BRANCH(S): MECH
Micro Electronic Mechanical Systems
10 Time: 3 Hour
Max Marks: 100
Q.Code : N056
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Answer Question No.1 (Part-1) which is compulsory, any eight from Part-II and any two
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from Part-III.
The figures in the right hand margin indicate marks.
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1 5 / Part-I
Q1
a)
10 9-
Answer the following questions:
1
What is the significance of the miniaturization aspect in MEMS devices?
(2 x 10)
b) What are the advantages of thin film deposition?
3 --
c)
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List the functional units of a typical PECVD system.
2 2
d)
2/
Enlist various materials used in the fabrication of MEMS devices.
e)
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What are the advantages of sputtering based thin film deposition?
f)
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What do you mean by System-in-a-Chip technology?
g)
h) 109
What is the photoelectric effect?
Write the principle of operation of MEMS accelerometer.
i) What is a phase shifter? Enlist the applications of phase shifters.
j)
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How many basic elements exist in case of a thermal system?
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1 2 /2 Part-II
Q2
Twelve)
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Only Focused-Short Answer Type Questions- (Answer Any Eight out of (6 × 8)
a)
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Define machining and micromachining processes. How do they differ from each
other? 1 -- 1
2 3
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b) What do you mean by a wafer? What kind of material is commonly used for wafer?
c)
3 / 2 0
With suitable schematic diagram and using two types of photoresists, describe in
20 2
detail the process of photolithography.
/1 2
1 2
d) / 1 5
What are the main advantages of using MEMS technology in sensors?
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What do you understand from Ion Implantation Process? Briefly explain its various
10 9 f) What is the principle of operation and types of MEMS resonator?
g) How do MEMS-based actuators differ from traditional macro-scale actuators?
h) Briefly explain the principle of operation of actuators. Write down some of the
important applications of microactuators.
i) How many basic elements exist in case of a Fluid system? Define fluid resistance
and fluid capacitance.
j) Discuss in detail about different actuation mechanisms in MEMS switches.
k)
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What design considerations are involved in the packaging of MEMS systems?
l)
photoconductive transducers.
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Discuss in detail about the transduction principle in photoemissive,
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1 5 /1
9 - Part-III
10 Type Questions (Answer Any Two out of Four)
Only Long Answer
Q3 Compare and contrast different microfabrication techniques used in MEMS (16)
manufacturing, such as bulk micromachining, surface micromachining, and LIGA.
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Highlight the advantages and limitations of each technique.
Q4 a)
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Describe the Young’s modulus (E), Bulk modulus (K), Shear modulus (G) and (8x2)
12 /
Poisson’s ratio and discuss about their relationship.
b)
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Explain in detail about the basic modeling elements of mechanical elements with
1
9-
necessary equations and diagrams.
0 does an MEMS gyroscope work? Define coriolis -force
1How 1 and coriolis
in -process of fabricating
Q5 (16)
acceleration. Discuss the compensation techniques used 3
the gyroscope.
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1 2 /
Q6 Write short notes on the following
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(i) Micropump
9-
10
(ii) MOEMS
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10 3 - - 1
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109