Registration No :
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Total Number of Pages : 02
02 3 Course: BTech
Sub Code: REI6D001
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th
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7 Semester/Regular/Back Examination: 2022-23
SUBJECT2: Micro Electronic Mechanical Systems
0 9 - BRANCH(S): MECH
1 Time : 3 Hour
Max Marks : 100
Q.Code : L057
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Answer Question No.1 (Part-1) which is compulsory, any eight from Part-II and any two
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from Part-III.
The figures in the right hand margin indicate marks.
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2 2 / Part-I
9-
Q1 Answer the following questions : (2 x 10)
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a) Define machining and micromachining processes.
b) Briefly discuss about the process of photolithography.
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c)
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What do you mean by a wafer? What kind of material is commonly used for wafer?
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d)
e)
Distinguish between wet etching and dry etching.
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What are the advantages of sputtering based thin film deposition?
f)
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Briefly describe the anisotropic etching and isotropic etching in the wet etching
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process.
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g) What is the elastic potential energy of the spring when a 20 millinewtons force is
required to stretch a spring to a distance of 40 micrometer?
h) What is a phase shifter? Mention the applications of phase shifters.
i)
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Briefly explain the working of the piezoresistive pressure sensor.
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j)
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How do polymers are used in the area of microsystem design?
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Q2
Twelve)
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Only Focused-Short Answer Type Questions- (Answer Any Eight out of (6 × 8)
a) 9 -
What is RF-MEMS? Enlist some application of RF MEMS.
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b) 1
Discuss about the various types of the sensors in MEMS.
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c) What is the role of spin-coating and how is it performed?
d)
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What do you understand from microfluidic system? Enlist important building blocks
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of microfluidic systems.
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e)
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Find out the desired viscosity to density ratio of a photoresist solution to be
prepared for the spin coating by using a vacuum chunk. The allowed time of
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rotation of the chunk within a production process is 2 minutes and the desired
10 9 height of photoresist is 75 microns. The rotor rotates at 8,000 rpm. Assume that
the original height is 500 microns.
f) Discuss the process of Evaporation and Sputtering with suitable diagrams.
g) How many basic elements exist in case of a thermal system? Define thermal
capacitance and thermal resistance.
h) What do you understand by macrofluidics and microfluidics?
i) Briefly describe the working principle and types MEMS resonator using neat
j)
sketches.
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What do you mean by impurity doping? Give an example with respect to
semiconductor device.
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k)
acceleration. 2 2
How does an MEMS gyroscope work? Define coriolis force and coriolis
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l)
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What is CVD? Explain the different parameters that influence CVD.
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1 Part-III
Only Long Answer Type Questions (Answer Any Two out of Four)
Q3 (a) Discuss the following lithography methods. (a) X-ray lithography (b) E-beam (8x2)
lithography
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(b)
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Discuss in detail the need of the actuators and the type of the actuators typically
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used for the active optical MEMS applications using suitable diagrams.
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Q4 (a)
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Discuss in detail about the PECVD technique for thin film deposition with neat (8x2)
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schematic diagram.
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(b) What is the role of a photomask in a typical photolithography process? How are
photomasks prepared?
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Q5 (a) Describe the Young’s modulus (E), Bulk modulus (K),
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Poisson’s ratio and discuss about their relationship. 2 Shear modulus (G) and (8x2)
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(b) Explain in detail about the basic modeling elements
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necessary equations and diagrams.
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Q6 Write short answer on following:10 (8x2)
(a) LIGA.
(b) MEMS micromirror. - - 1
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