Customer Engg.

Approval /Date (if Req'd):

Prototype : Prelaunch: Production:
Control Plan No : 92-20-A02-1-3
Control Plan
Part No/s.: A 400 545 13 05 -ZGS 002 Customer Quality Approval /Date(if Req'd):

Part Name: CONTROLLER Assy.REAR FOG LAMP (RFL 06) Key Contact/Phone - Rohit Diwaker Organization /Plant Approval /Date: Other Approval /Date(if Req'd):

Organization /Plant : Core Team : Other Approval /Date:(if Req'd) :

I NTERFACE MICROSYSTEMS V. K Gaur,M.S. Rawat, Manmohan, Rohit, Neelam, Pradeep, Govind, Rohit, Abhishek Tiwari, Deepak,
PLOT NO. 340~342, PHASE-2 UDYOGVIHAR,GURGAON Mahavir

Organization Code: Date(Orig) : 04.11.2015 Rev.No/Date: 03/30.07.2021

Characteristics Sp. Method

Opn Operation Machine, Device, Jig, Chara. Sample
Product/ Process Evaluation Measurement Reaction Plan
No. Description Tools Description No. Product Process Class Size Freq. Control Method
Specification. technique
10 Incoming Inspection of child As Per Incoming Inspection Standard (QSF11-10)
parts
20 Storage Storage racks / Temp. & 1 Storage location Part Storage at identified location as per Visual verification w.r.t. location chart Each lot Location chart Put in store at correct location
Humidity meter location chart

2 Components quality Storage of components under Temperature controlled as per Temp & Humidity meter 2 Per Shift Temp./ humidity record Correct to bring the required
deterioration environmental controlled Temp./humidity sheet sheet condition.
condition Temperature-≤ 30 ° C
Hmudity - 60 % RH

3 Mixup of child part Storage of material No Mixup of child part. 100% Visual Inspection 1 week(Audit) Visual as per inter- Part storage in correct location
Material Kept in identified location. operation Handling
Location Chart

4 Material Damage Over stacking Material can not exceed over height as 100% Visual Inspection 1 week(Audit) Visual as per inter- Arrange material as per
stacked in top covered rack operation Handling defined height

5 FIFO System FIFO system to be followed 100% Visual Inspection 100% Daily Visual as per inter- Material replaced
operation Handling
Month Code Sticker

30 Send material from store to Vehicle / Packing material 1 Component & PCB damage Handling of material Proper stacking of PCB assy. in bins Visual verification as per packing Each lot Visual as per inter- Get stacked properly.
SMT Line during transpotation Handled carefully during transportation. standard operation Handling &
Every bin should be covered before packaging.
sending the material. Packing Standard
Material Properly stacking in vechile
No Damage to component or PCB during
Transpotation

40 Storage of PCB & SMD Storage racks / Temp. & 1 Storage location Storage at identified location as per Visual verification w.r.t. location chart Each lot Location chart Put in store at correct location
Components before production Humidity meter location chart

2 Components quality Storage of components under Temperature controlled as per Temp & Humidity meter 2 Per Shift Temp./ humidity record Correct to bring the required
deterioration environmental controlled Temp./humidity sheet sheet condition.
condition Temperature- ≤30 ° C
Hmudity -6 0 % RH
Solder Paste-5 ~10 ° C

3 Mixup of child part Storage of material No Mixup of child part. 100% Visual Inspection 1 week(Audit) Visual as per inter- Part storage in correct location
Material storage in defined location. operation Handling
Location Chart

4 Material Damage Over stacking Top covered rack used for storage of 100% Visual Inspection 1 week(Audit) Visual as per inter- Arrange material as per
material operation Handling defined height

5 FIFO System FIFO system to be followed 100% Visual Inspection 100% Daily Visual as per inter- Material replaced
operation Handling
Month Code Sticker

50 PCB Panel Loading in carrier & PCB panel Carrier, Panel 1 Unpacked PCB panel from Handle carefully PCB panel while opening Visual 100% Visual as per inter- Reject sticker pasting on PCB
Keep Carrier in Machine protective poly bag the packaging , Follow ESD norms . operation Handling
Loader
 Customer Engg.Approval /Date (if Req'd):
Prototype : Prelaunch: Production:
Control Plan No : 92-20-A02-1-3
Control Plan
Part No/s.: A 400 545 13 05 -ZGS 002 Customer Quality Approval /Date(if Req'd):

Part Name: CONTROLLER Assy.REAR FOG LAMP (RFL 06) Key Contact/Phone - Rohit Diwaker Organization /Plant Approval /Date: Other Approval /Date(if Req'd):

Organization /Plant : Core Team : Other Approval /Date:(if Req'd) :

I NTERFACE MICROSYSTEMS V. K Gaur,M.S. Rawat, Manmohan, Rohit, Neelam, Pradeep, Govind, Rohit, Abhishek Tiwari, Deepak,
PLOT NO. 340~342, PHASE-2 UDYOGVIHAR,GURGAON Mahavir

Organization Code: Date(Orig) : 04.11.2015 Rev.No/Date: 03/30.07.2021

Characteristics Sp. Method

Opn
50 Operation
PCB Panel Machine,
Loading in carrier & PCB Device,
panel Carrier, Panel Jig, Chara. Sample
Product/ Process Evaluation Measurement Reaction Plan
No. Description
Keep Carrier in Machine Tools Description No. Product Process Class Size Freq. Control Method
Loader Specification. technique
2 As Per
Dust or Incoming Inspection Standard
contanimation (QSF11-10)
Inspection of PCB panel No dust or contanimation on PCB Panel Visual 5 panel / pack checking as per sampling Reject sticker pasting on PCB
accumination on PCB before loading Check warpage on plain surface
No track cut / damage mark

3 PCB loading direction in Arrow mark on PCB & Visual Each carrier Poka Yoke in Machine Load in correct direction
carrier Match fiducial point of PCB

4 PCB Panel stress. PCB Panel should not very tight w.r.t. By sliding the length of carrier Each carrier Setup Verification Reset the carrier length for
setting gauge panel
No stress of PCB Panel

5 Loading Sequence PCB loaded in carrier Bottom to Top Manually Every magazine Working Standard Correct sequence followed

6 ESD Precaution PCB handling ESD glooves used for handling the PCB Visually initially Working Standard ESD glooves to be used

7 Magazine with PCB panel Magazine with PCB panel loaded in Visually initially Error proofing in M/C Load in correct direction
loaded in loader correct direction in Machine loader

70 PCB Panel Cleaning by Air PCB Cleaner Machine 1 Main Air Pressure 0.20 ~0. 40 Mpa Auto verification by machine. M/C will 1 4 hour Setup Verification Reset the air pressure
Cleaning Machine not operate if out of range. (Poke Yoke)

2 Blower OFF Delay Time 7 Sec. Machine Display Panel 1 4 hour PLC Control Reset Parameter
Setup Verification

3 Ionize OFF Delay Time 7 Sec. Machine Display Panel 1 4 hour PLC Control Reset Parameter
Setup Verification

4 Cleaner OFF Delay Time 10 Sec. Machine Display Panel 1 4 hour PLC Control Reset Parameter
Setup Verification

5 Dust & Foreign particle etc Presence of any forign particle or Dust Auto cleaning of PCB Panel by Machine 100% 100% Monitoring by Reset the process
From PCB Panel etc are cleaned machine

80 Cleaning of stencil before Stencil Cleaning Machine / 1 DI Water : Chemical Vigon SC 4L:1L Visual on Vessel Every Mixture Measuring mug Re-mix
loading Stencil 200

2 Air pressure 4~ 6 Kg/cm2 Pressure Gauge 1 4 hours Poka Yoke in Machine Reset air pressure.
Setup verification

3 Wash Time 5 Minute Visual 1 4 hours Setup verification Reset Parameter

4 Dry Time 10 Minute Visual 1 4 hours Setup verification Reset Parameter

5 forign particle/Dust free Fully cleaning of stencil Auto cleaning of stencil by Machine 100% 100% Monitoring Reset the process
Apperture of Stencil No appreatures Block FPA done 2 times
No foregn particle ,Dust & Solder paste on
apperatures
 Customer Engg.Approval /Date (if Req'd):
Prototype : Prelaunch: Production:
Control Plan No : 92-20-A02-1-3
Control Plan
Part No/s.: A 400 545 13 05 -ZGS 002 Customer Quality Approval /Date(if Req'd):

Part Name: CONTROLLER Assy.REAR FOG LAMP (RFL 06) Key Contact/Phone - Rohit Diwaker Organization /Plant Approval /Date: Other Approval /Date(if Req'd):

Organization /Plant : Core Team : Other Approval /Date:(if Req'd) :

I NTERFACE MICROSYSTEMS V. K Gaur,M.S. Rawat, Manmohan, Rohit, Neelam, Pradeep, Govind, Rohit, Abhishek Tiwari, Deepak,
PLOT NO. 340~342, PHASE-2 UDYOGVIHAR,GURGAON Mahavir

Organization Code: Date(Orig) : 04.11.2015 Rev.No/Date: 03/30.07.2021

Characteristics Sp. Method

Opn Operation Machine, Device, Jig, Chara. Sample
Product/ Process Evaluation Measurement Reaction Plan
No. Description Tools Description No. Product Process Class Size Freq. Control Method
Specification. technique
90 Pasting of solder paste of Screen printing Machine l As Per Incoming Inspection Standard (QSF11-10)
Air pressure 0.45 ~0. 55 Mpa Auto verification by machine. M/C will 1 4 hours Setup Verification Reset the air pressure
bottom side of PCB Assy. Stencil ,Squeege,Solder Paste not operate if Air pressre out of range. M/C will not operate if Air
(Poke Yoke) pressre out of range. (Poke
Yoke)

2 Solder paste throwing time 4 hours Timer controller Jar Initially Poka yoke in Jar Re throwing process of solder
paste

3 Squeeze Printing pressure 4 ~ 10 Kg PLC Control 1 4 hours Setup Verification Reset the air pressure
Visual on m/c dislay

4 Solder paste mixing time 1 min Atomatic machine will stop after 1 min initially Poka Yoke in Mixing Again mixing if mixing not
machine proper

5 Viscosity range 130 ± 40 PA.S Rehometer Solder Paste Viscosity initially Started Viscosity record sheet Solder Paste Container Scrap
machine & Replace with new OK

6 Squeegee Blade Replacement 2 lack Panel Visual Daily Check Daily Verification Replace the Squeegee Blade
Frequency

7 Stencil Replacement 1 lack Board Visual Daily Check Daily Verification Replace the stencil
Frequency Stencil History sheet

8 Solder Paste type Sn 62, Pb 36, Ag 2 As printed on solder paste container Initially Valore System Use coorect solder type.
(Leaded Solder)

9 Tensile stregth of stencil 30 ~ 50 N/cm. Tensile Gauge initially Setup Verification Not used stencil before tensile
strength

10 Machine program selection Select as per Program Name Visual on Monitor Initially Setup Verification Reopen correct file in M/C PC.

11 Alignment of PCB w.r.t stencil Tinning areas to align with stencil First off Piece verification initially & Hourly. Setup Verification Realign the Stencil.
printer openings.

12 Stencil Apertures Cleaning 2 ~ 5 cycles M/c program. initially PLC Control Reset cleaning frequency in
frequency Setup Verification. Program.

13 Squeeze Speed 40 ~ 120 mm/sec M/c program. initially PLC Control Reset Squeze Spped in
Setup Verification Program.

14 Solder paste Quality & No less / Excess solder paste on PCB. 3D SPI to checking solder paste 100% First off piece verification Reset the process .
Volume No shifting of solder paste w.r.t tinning volume (Poke Yoke) sheet
Solder Paste shifted w.r.t area.
tinning area No bridging / Splash at IC Pins SPC study 1 per Lot SPC Study
Bridging / Splash at IC Pins No Less volume of solder paste one side
Less Volume of Solder SC of component Pads
Paste No Solder Balls at IC pins
Solder ball at IC pins No Dry Solder
Dry Solder

100 Solder paste inspection 3D solder paste inspection 1 Air pressure 0.45 ~ 0.55 Mpa Auto verification by machine. M/C will 1 4 hours Setup Verification Reset the air pressure
Machinne not Operate if out of range. (Poke Yoke)
 Customer Engg.Approval /Date (if Req'd):
Prototype : Prelaunch: Production:
Control Plan No : 92-20-A02-1-3
Control Plan
Part No/s.: A 400 545 13 05 -ZGS 002 Customer Quality Approval /Date(if Req'd):

Part Name: CONTROLLER Assy.REAR FOG LAMP (RFL 06) Key Contact/Phone - Rohit Diwaker Organization /Plant Approval /Date: Other Approval /Date(if Req'd):

Organization /Plant : Core Team : Other Approval /Date:(if Req'd) :

I NTERFACE MICROSYSTEMS V. K Gaur,M.S. Rawat, Manmohan, Rohit, Neelam, Pradeep, Govind, Rohit, Abhishek Tiwari, Deepak,
PLOT NO. 340~342, PHASE-2 UDYOGVIHAR,GURGAON Mahavir

Organization Code: Date(Orig) : 04.11.2015 Rev.No/Date: 03/30.07.2021

Characteristics Sp. Method

100 Solder paste inspection 3D solder paste inspection
Opn Operation Machine, Device, Jig, Chara. Sample
Machinne Product/ Process Evaluation Measurement Reaction Plan
No. Description Tools Description No. Product Process Class Size Freq. Control Method
Specification. technique
2 As Per Incoming Inspection Standard
Machine(QSF11-10)
program selection Select As per Program Name Visual on Monitor Initially Setup Verification Reopen correct file in M/C PC.

3 Solder paste Quality & No less / Excess solder paste on PCB. Automatic inspection by machine (Poke 100% FPA done 2 times Clean & Rework the process
Volume No shifting of solder paste w.r.t tinning Yoke) Error proofing in M/C
area.
SC Refer Annexure A-51-00-2148-3-02 1 per Lot
SPC Study

110 Mounting of SMD components Pick & Place Machine 1 Machine program selection Select as Per Program name Visual on Monitor Initial Setup verification Select Correct Program in PC
on bottom side of PCB

2 Air pressure 0.45 ~ 0.60 Mpa Auto verification by machine. M/C will 1 4 hours Air pressure sheet Reset the pressure
not operate if out of range. (Poke Yoke) M/C will not operate if out
of range. (Poke Yoke)
Setup Verification

3 Component feeder loading Loading in correct positions Barcode Scanning Initially & during replacement. Feeder verification Sheet. Load correct component feeder
Barcode scanning method followed M/c cannot accept feeder at wrong
location (Poke Yoke)

4 Component Value , Mounting of correct value component at Visual verification by operator Initial & hourly First off piece Inspection Machine will give error. Reset
defined location M/c cannot mount wrong package Record Process.
Lifting of IC Pin No Lifting of IC Pin (Dropped component component & reverse polairty of No wrong value component
not to be used and put in red tray after component reel mount in Machine
that those parts handover to store ) M/c cannot miss component mounting (Poka Yoke in Valor
Component Missing SC No missing component (Poke Yoke) system)
Component Shift No shifting of component
Component Reverse No Reverse Polarity & direction of
components
Component Up side down No Component up side down

120 Reflow soldering of bottom Reflow oven 1 Temperatue profile checking Compare with standard profile Visual on PC 100% Temp. profile record Reset Profile
side componenets. Online profile run for every parts if temperature profile out of
range PC show red
indication on PC (Poka
Yoke)
SPC Study 1 Month SPC study

2 Temperature Profile program Program selection as per part name Visual on Monitor Initial Setup Verification Reopen correct file in M/C PC.
selection

3 Air pressure 0.55 ~ 0.65 Mpa Auto verification by machine. M/C will 1 4 hours Air pressure sheet Reset the air pressure
not operate if out of range. (Poke Yoke) M/C will not operate if out
of range. (Poke Yoke)
Setup Verification
4 Conveyor speed. Automatic Adjust according to Program Visual on M/C Program Initially M/C Program Reset Program.
Setup Verification
 Customer Engg.Approval /Date (if Req'd):
Prototype : Prelaunch: Production:
Control Plan No : 92-20-A02-1-3
Control Plan
Part120
No/s.: Reflow
A 400soldering
545 13 05 -ZGS 002 Reflow oven
of bottom Customer Quality Approval /Date(if Req'd):
side componenets.

Part Name: CONTROLLER Assy.REAR FOG LAMP (RFL 06) Key Contact/Phone - Rohit Diwaker Organization /Plant Approval /Date: Other Approval /Date(if Req'd):

Organization /Plant : Core Team : Other Approval /Date:(if Req'd) :

I NTERFACE MICROSYSTEMS V. K Gaur,M.S. Rawat, Manmohan, Rohit, Neelam, Pradeep, Govind, Rohit, Abhishek Tiwari, Deepak,
PLOT NO. 340~342, PHASE-2 UDYOGVIHAR,GURGAON Mahavir

Organization Code: Date(Orig) : 04.11.2015 Rev.No/Date: 03/30.07.2021

Characteristics Sp. Method

Opn Operation Machine, Device, Jig, Chara. Sample
Product/ Process Evaluation Measurement Reaction Plan
No. Description Tools Description No. Product Process Class Size Freq. Control Method
Specification. technique
5 As Per Joint
Solder Incoming Inspection Standard (QSF11-10)
of SMT No lifting/tilting of components Visual Initially & Hourly . First off piece Inspection Reset the program.
component after soldering No dry joint Record
No shorting
Component tombstone SC No Component tombstone

130 Automatic Optical Inspection 3D AOI machine 1 Air Pressure 400 ~ 500 Kpa Auto verification by machine. M/C will 1 4 hours Setup Verification Reset the air pressure
(ON LINE) not operate if out of range. (Poke Yoke)

2 Solder Quality: Automatic verification by machine 100% 100% Monitoring by Verify the defective location
Dry solder No Dry solder (Poke Yoke) machine physically & take decision for
Shorting/Bridging No Shorting/Bridging FPA done 2 times Ok/NG.
Solder ball No Solder ball
Unwanted solder No Unwanted solder PPM Monitoring
SC

3 Component position & Automatic verification by machine 100% 100% Monitoring by Put reject pcs in red tray,
condition : (Poke Yoke) machine inform to incharge.
Component location Location as per circuit FPA done 2 times
Missing component No missing of components
Component shifting No Component shifting PPM Monitoring 1 per Lot PPM Monitoring
Component Tombstone No Component Tombstone
Polarity of Components No reverse polarity mounting.
Refer Annexure A-51-00-2149-3-02

140 Visual inspection of SMD assy. Manual / Magnifying lens 1 Solder Quality: Visual Inspection of PCB Visual on Magnifying lens 100% Rejection record sheet Put reject pcs in red tray,
Dry solder Assy. No Dry solder FPA done 2 times inform to incharge.
Shorting/Bridging No Shorting/Bridging
Solder ball No Solder ball
Unwanted solder No Unwanted solder

SC
2 Component position & Location as per circuit 100% Rejection record sheet Put rejected pieces in red tray
condition : No missing of components FPA done 2 times & inform to SMD incharge
Correct Value as per Part list
No missing of components.
No reverse polarity mounting.

150 Send PCB assy from SMT to Manually 1 Insertion of PCB assy in Stack properly so that don't fall during Visual verification Each lot Packing standard Part not send to one Plant to
Wave Soldering line. magazine transportation Poka Yoke ( Rod to be another Plant if Rod not insert
Packing as per packing standard insert in between two layers between layeys of PCB in
One extra rod to be insert in between two of PCB in magazine to magazine
layers of PCB in magazine to prevent prevent of Component
contact of 2 panels kept in same slot damage)

2 Handling of Magazine Magazine to be kept upright at right angle Visually 100% 100% Monitoring Training to be provide to
handling the magazine

3 Damage free PCB Assy. No Damage to component or PCB Visual Each lot Working Standard Put reject pcs in red tray

160 Mounting of Capacitor & Relay Manual 1 Mounting location & value of Mounting of Capacitor Capacitor value of 100 uf/50V at location Visual 100% Working Standard Put reject pcs in red tray
capacitors C1 .
 Customer Engg.Approval /Date (if Req'd):
Prototype : Prelaunch: Production:
Control Plan No : 92-20-A02-1-3
Control Plan
Part No/s.: A 400 545 13 05 -ZGS 002 Customer Quality Approval /Date(if Req'd):

Part Name: CONTROLLER Assy.REAR FOG LAMP (RFL 06) Key Contact/Phone - Rohit Diwaker Organization /Plant Approval /Date: Other Approval /Date(if Req'd):

Organization /Plant : Core Team : Other Approval /Date:(if Req'd) :

I NTERFACE MICROSYSTEMS V. K Gaur,M.S. Rawat, Manmohan, Rohit, Neelam, Pradeep, Govind, Rohit, Abhishek Tiwari, Deepak,
PLOT NO. 340~342, PHASE-2 UDYOGVIHAR,GURGAON Mahavir

Organization Code: Date(Orig) : 04.11.2015 Rev.No/Date: 03/30.07.2021

Characteristics Sp. Method

Opn Operation Machine, Device, Jig, Chara. Sample
160 Mounting of Capacitor & Relay Manual Product/ Process Evaluation Measurement Reaction Plan
No. Description Tools Description No. Product Process Class Size Freq. Control Method
Specification. technique
2 As Per Incoming Inspection Standard (QSF11-10)
Capacitors polarity To match (+ sign) as on PCB Visual 100% Working Standard Put reject pcs in red tray

3 Mounting location Mounting Of Relay RL1 location & Relay24 V Visual 100% Working Standard Put reject pcs in red tray
No lifting of relays & No gap between Batch code record
relay & PCB
No Relay Missing

170 Soldering of Capacitor & Relay Manual, Soldering Iron Setup 1 Solder type Lead Free As printed on solder roll 1 per 4 Hour Setup Verification Replace the solder roll

2 Iron's bit temperature 355°C ~ 375° C Thermometer 1 per 4 Hour Setup Verification Reset the temp./ inform to
Control Chart incharge

3 Tip Voltage Less than 1 V Voltmeter 1 per 4 Hour Setup Verification Recheck & inform to incharge

4 Cleaning of Iron bit Operator must clean iron bit with wet foam Visual 100% 100% monitoring Replace foam with new one
and should not jerk the soldering Iron. when it damage

5 Contact time of Iron bit to Operator should not keep more than 3 sec Visual 100% Skill Matrix (Level 3 Put reject pcs in red tray,
the track the soldering Iron on PCB track Operator ) inform to incharge

6 Solder Quality: Visual 100% Working Standard Put reject pcs in red tray,
Dry solder No Dry solder inform to incharge
Shorting No Shorting
Solder ball No Solder ball
Track damage No Track damage
Unwanted solder Solder No Unwanted solder
crack No crack in solder
Pad lifting No Pad lifting

180 De-paneling of PCB from the De-paneling M/c & Fixture 1 Program selection As per Programming Annexure Verify visually for Program annexure 1 4 hour Program Annexure Select correct program.
panel. Setup verification

2 Bit size selection 2.2 mm Visual 1 4 hour Set up verification Select correct Bit Size

3 Bit life Max. 100 Meters Visual Whenever panel is PokaYoke (Machine stop if Change bit after 100 meters
cutting bit exceed of 100 m) used

4 Ionizer indication Should be glow with green indication Visually check on M/c cutting head 1 4 hour Setup Verification Reset M/c parameter

5 Cutting Speed As per Programming Annexure Visual on Machine 1 4 hour Set up verification Reset M/c parameter

6 Mis Alignment with fixture of Fixture Alignment done before starting the Visual 1 4 hour First Piece Approval(2 Put reject pcs in red tray,
PCB Assy. Part times) inform to incharge.
 Customer Engg.Approval /Date (if Req'd):
Prototype : Prelaunch: Production:
180 De-paneling of PCB from the De-paneling M/c & Fixture
Control Plan No : 92-20-A02-1-3
panel.
Control Plan
Part No/s.: A 400 545 13 05 -ZGS 002 Customer Quality Approval /Date(if Req'd):

Part Name: CONTROLLER Assy.REAR FOG LAMP (RFL 06) Key Contact/Phone - Rohit Diwaker Organization /Plant Approval /Date: Other Approval /Date(if Req'd):

Organization /Plant : Core Team : Other Approval /Date:(if Req'd) :

I NTERFACE MICROSYSTEMS V. K Gaur,M.S. Rawat, Manmohan, Rohit, Neelam, Pradeep, Govind, Rohit, Abhishek Tiwari, Deepak,
PLOT NO. 340~342, PHASE-2 UDYOGVIHAR,GURGAON Mahavir

Organization Code: Date(Orig) : 04.11.2015 Rev.No/Date: 03/30.07.2021

Characteristics Sp. Method

Opn Operation Machine, Device, Jig, Chara. Sample
Product/ Process Evaluation Measurement Reaction Plan
No. Description Tools Description No. Product Process Class Size Freq. Control Method
Specification. technique
7 As Per Incoming Inspection Standard
Kept PCB(QSF11-10)
in fixture Fixture to have poka-yoke to prevent Visual 1 4 hour Poka Yoke in Fixture Put reject pcs in red tray,
fitment of PCB panel in wrong direction. Setup Verification inform to incharge.

8 Air pressure 4 ~ 6 bar Visual on Pressure gauge 1 4 hours Air Pressure Record Sheet Reset air pressure.

9 Component Damage Routing & Handling of PCB No Damage of component Visual 100% 100% Monitoring Put reject pcs in red tray,
Excess/Over Cutting of PCB Assy. No excess cutting or over cutting edges. First Piece Approval inform to incharge.
Keep PCB in Magazine after depanneling

190 Fixing of Base terminal after Manual Soldering 1 Base & terminal quality Visual 100% Working Standard Put reject pcs in red tray,
that Soldering of Connectors Fixture 1.Moulding defect No moulding defect. inform to incharge
terminal 2.Bending of terminal No bending of terminals.
3.Flash No flash on terminal area.
4.Terminal length Adequate height of terminal

2 Solder Type Leaded Solder(63:37) Visual 1 4 Hour Setup Verification Select correct solder type

3 Tip Voltage Less than 1 V Voltmeter 1 per 4 Hour Setup Verification Recheck & inform to incharge

4 Iron's bit temperature 355°C ~ 375 °C Temperature meter 1 per 2 Hour Xbar & R chart (5 time per Reset the temp.
shift) &
SC Setup Verification (per 4
hour)

7 Solder Quality Visual 100% First Piece Approval(2 Put reject pcs in red tray,
Solder Bridging/Sorting No Bridging/Sorting times) inform to incharge
Dry Solder No Dry solder
Solder splash on PCB No Solder Splash on PCB
Solder Missing No Solder Missing
PCB Track Damage No Track damage

200 Ultrasonic Cleaning Ultrasonic cleaner 1 Cleaning Temperature 65°C ~ 80°C Thermometer 1 Per 4 hour Setup Verification Reset temperature.

2 Solvent Level in chamber Ultrasonic Chamber tank full & Visual 1 Per 4 hour Setup Verification Add chemical to the Level.
Degreasing chamber tank level not below
wire mesh

3 Ratio of TCE & IPA TCE-50% & IPA-50% by volume. Measuring Mug. Whenever new Measuring mug Re mixing TCE & IPA
mixture added

4 Placement of PCB Assy in IC side of PCB towards bottom of basket Visual 100% Working Standard Place the PCB Properly in the
basket basket

5 Cleaning time 10 Sec. Timer on machine(Poka Yoke) 100% Poka Yoke in UltraSonic Reset the Cleaning time
Machine

6 Cleaning of flux on PCB No residue except light marks on PCB Visual 100% 100% Monitoring Clean again , if required
 Customer Engg.Approval /Date (if Req'd):
Prototype : Prelaunch: Production:
Control Plan No : 92-20-A02-1-3
Control Plan
Part No/s.: A 400 545 13 05 -ZGS 002 Customer Quality Approval /Date(if Req'd):

Part Name: CONTROLLER Assy.REAR FOG LAMP (RFL 06) Key Contact/Phone - Rohit Diwaker Organization /Plant Approval /Date: Other Approval /Date(if Req'd):

Organization /Plant : Core Team : Other Approval /Date:(if Req'd) :

I NTERFACE MICROSYSTEMS V. K Gaur,M.S. Rawat, Manmohan, Rohit, Neelam, Pradeep, Govind, Rohit, Abhishek Tiwari, Deepak,
PLOT NO. 340~342, PHASE-2 UDYOGVIHAR,GURGAON Mahavir

Organization Code: Date(Orig) : 04.11.2015 Rev.No/Date: 03/30.07.2021

Characteristics Sp. Method

Opn Operation Machine, Device, Jig, Chara. Sample
Product/ Process Evaluation Measurement Reaction Plan
No. Description Tools Description No. Product Process Class Size Freq. Control Method
Specification. technique
210 Send PCB Assy. from 248 to Vehicle 1 As Per Incoming Inspection Standard
Insertion(QSF11-10)
of PCB assy in Stack properly so that don't fall during Visual verification Each lot Packing standard Part not send to one Plant to
180 Producton line. magazine transportation Poka Yoke ( Rod to be another Plant if Rod not insert
Packing as per packing standard insert in between two layers between layers of PCB in
of PCB in magazine to magazine
prevent of Component
2 Component damage & No Damage to component or PCB Visual Each lot damage)
Working Standard Put reject pcs in red tray
Scratch on PCB due to No Scratch on PCB Assy
movement .

220 Visual inspection of PCB Assy. Camera Based TV Monitor Solder & Component Quality Visual Inspection of PCB Visual 100% First Piece Approval(2 Put reject pcs in red tray ,
under Camera based TV Dry solder Assy. times) inform to incharge
monitor. Shorting No Dry solder P Chart
Solder ball No Shorting
Track damage No Solder ball
Unwanted solder SC No Track damage
Component damage No Unwanted solder
Component missing No Component Damage
Component Lifting No Component missing
No Component lifting

230 Testing-1st @ 24 V & IC Pin up Test set up,DMM Power Supply Voltage 24V Display on Power Supply 1 4 hour Programmable Power Reset Voltage from Power
programming supply supply

Set-up Verification Verification with OK /NG reference sample Test set up 1 4 Hour Setup verification Manage as per Abnormal
situation handling
management
Voltage check Pin No 1 ,2 & 3 - 4.8 ~ 5.2 V DMM 100% Check sheet Put reject pcs in red tray,
Pin No 4 - 0 inform to incharge

IC programming Cyclone programmer display Pass Visually on cyclone programmer 100% Work standard Again Programming on part
(Green) /Fail (Red) indication after
programming.

240 Function Testing@ 24 V Test set up 1 Power Supply Voltage 24V Display on Power Supply 1 4 hour Programmable Power Reset Voltage from Power
Power Supply supply supply

2 Set-up Verification Verification with OK /NG reference sample Visual 1 4 Hour Setup verification Manage as per Abnormal
SC situation handling
management

5 Testing of Part Function Testing Must Operate Test setup 100% 100% Monitoring Put rejected pcs in red tray &
Refer As per Working standard FPA done inform to incharge

250 Apply silicon adhesive arround Robotic Machine 1 Adhesive type RTV Silicon Visual 1 4 Hour Setup verification Put reject pcs in red bin
Capacitor C1 Fixture

2 Air pressure 2 ~ 4 bar Pressure gauge 1 4 Hour Setup verification Reset the pressure
 Customer Engg.Approval /Date (if Req'd):
Prototype : Prelaunch: Production:
Control Plan No : 92-20-A02-1-3
Control Plan
Part No/s.: A 400 545 13 05 -ZGS 002 Customer Quality Approval /Date(if Req'd):

Part Name: CONTROLLER Assy.REAR FOG LAMP (RFL 06) Key Contact/Phone - Rohit Diwaker Organization /Plant Approval /Date: Other Approval /Date(if Req'd):

Organization /Plant : Core Team : Other Approval /Date:(if Req'd) :

I NTERFACE MICROSYSTEMS V. K Gaur,M.S. Rawat, Manmohan, Rohit, Neelam, Pradeep, Govind, Rohit, Abhishek Tiwari, Deepak,
PLOT NO. 340~342, PHASE-2 UDYOGVIHAR,GURGAON Mahavir

Organization Code: Date(Orig) : 04.11.2015 Rev.No/Date: 03/30.07.2021

250 Apply silicon adhesive arround Robotic Machine
Capacitor C1 Fixture
Characteristics Sp. Method
Opn Operation Machine, Device, Jig, Chara. Sample
Product/ Process Evaluation Measurement Reaction Plan
No. Description Tools Description No. Product Process Class Size Freq. Control Method
Specification. technique
3 As Per Incoming Inspection Standard (QSF11-10)
Applied adhesive arround Adequate amount of adhesive arround of Visual 100% 100% Monitoring Put reject pcs in red tray,
Capacitor Capacitor FPA done inform to incharge
Poka yoke in Machine(No
missing)

260 Housing fixing Housing Fixing Die Quality of housing & cover Visual 100% 100% Monitoring Put reject pcs in red tray ,
plate- FPA done inform to in charge
1.Moulding defect No moulding defects
2.Scratches No scratches
3.Crack No crack
4. Damage No damage mark
5.Lock shape Lock shape to be proper

Housing Colour Yellow Visual 1 4 hour Setup Verification Rework if wrong Colour
housing used

Fixing of PCB Assy with Proper fixing of PCB Assy with housing Visual 100% 100% Monitoring Put reject pcs in red tray ,
housing Poka Yoke in housing(Part inform to in charge
not fitted in reverse
direction)
FPA done

Locking of base to housing. Properly locked / No looseness between Visual 100% 100% Monitoring Put reject pcs in red tray ,
base & housing. FPA done inform to in charge
Noise feel for locking

270 Apply Epoxy between housing Automatic Epoxy Machine 1 Epoxy Type Dr Beck 505 Visual Initial Setup Verification Select correct part Number of
& base Epoxy

2 Hardner Type hardner 758 Visual Initial Setup Verification Select correct part Number of
Hardner

3 Colour of Epoxy Black Visual 100% Setup Verification Select correct adhesive.

4 Epoxy Resin : hardener 10:1 Weight Machine Every Mixture Setup Verification Remix.

5 Air Pressure 0.3 ~ 0.8 bar (Sealing) Pressure Gauge 1 per 4 Hours Setup Verification Reset the Air pressure
1~ 3 bar (Epoxy)

6 Epoxy level in barrel As per Min level marking on barrel. Visual on Barrel 100% 100% monitoring Refill epoxy in barrel

SC
7 Epoxy level between housing UniformThin layer between housing & Visual 100% First Piece Approval(2 Rework
& base base times)
Poka yoke in Machine

8 Curing of Epoxy 4 Hours By Watch 100% Time Tag Recure.

 Customer Engg.Approval /Date (if Req'd):
Prototype : Prelaunch: Production:
Control Plan No : 92-20-A02-1-3
Control Plan
Part No/s.: A 400 545 13 05 -ZGS 002 Customer Quality Approval /Date(if Req'd):

Part Name: CONTROLLER Assy.REAR FOG LAMP (RFL 06) Key Contact/Phone - Rohit Diwaker Organization /Plant Approval /Date: Other Approval /Date(if Req'd):

Organization /Plant : Core Team : Other Approval /Date:(if Req'd) :

I NTERFACE MICROSYSTEMS V. K Gaur,M.S. Rawat, Manmohan, Rohit, Neelam, Pradeep, Govind, Rohit, Abhishek Tiwari, Deepak,
PLOT NO. 340~342, PHASE-2 UDYOGVIHAR,GURGAON Mahavir

Organization Code: Date(Orig) : 04.11.2015 Rev.No/Date: 03/30.07.2021

SC

Characteristics Sp. Method

Opn Operation Machine, Device, Jig, Chara. Sample
Product/ Process Evaluation Measurement Reaction Plan
No. Description Tools Description No. Product Process Class Size Freq. Control Method
Specification. technique
9 As Per Incoming Inspection Standard (QSF11-10)
Epoxy level between housing Fill upto the top edge of housing between Visual 100% First Piece Approval(2 Rework
& base parting line of base & housing. times)
Separator will be provided
to prevent the splash of
epoxy during other parts
epoxy process
10 Epoxy Quality Visual 100% First Piece Approval(2 Put reject pcs in red bin /inform
Bubbles No bubbles times) to in charge
Pin hole No pin hole

11 Curing of Epoxy 6 Hours By Watch 100% Time Tag Recure.

280 Final Testing @ 18V & 30V Test set up 1 Power Supply Voltage 18 V & 30 V Display on Power Supply 1 4 hour Programmable Power Reset Voltage from Power
Power Supply supply supply

2 Set-up Verification Verification with OK /NG reference sample Test set up 1 4 Hour Setup verification Manage as per Abnormal
situation handling
management

3 Testing of Part Function test @ 18 V Must Operate Test Set Up 100% 100% Monitoring Put reject pcs in red tray,
FPA done inform to incharge

4 Function test @ 30 V Must Operate Test Set Up 100% 100% Monitoring Put reject pcs in red tray,
FPA done inform to incharge

290 Clamp Fixing Clamp Fixing Die 1 Losseness of Clamp with Fixing Of Clamp Clamp should be proper tight with Housing Visual 100% 100% Monitoring Put reject pcs in red tray,
housing Assy FPA done inform to incharge
No Looseness

300 Laser Marking of part details Laser marking Machine 1 Machine program selection 03- RFL 06-Daimler Visual on Monitor Intital Setup Verification Reopen correct file in M/C PC.
and batch code Refer Annexure A-29

2 Laser Height Setting Refer As per WI Visual 100% FPA done 2 times Follow as per NC Part
WS -51-00-2945-3 Management (WI 22-01) Put
reject pcs in red tray, inform to
Line incharge

3 Laser Marking Should be legible Visual 100% 100% Monitoring Housing Scrap
Legibility Not to be shifted towards housing Edges FPA done
Location No Wrong Printing
No Missing Laser marking on part
Keep part after Laser marking in defined
bins and paste identification tag on bin
No Mix-up without Laser marking parts
with Laser marked parts
310 Packing Manually & Weight Machine 1 Placing of parts in box. Checking of Laser marking No Missing Laser marking on part Visual 100% Work instruction Reject.
No Letter cut
Refer - WS/Master sample
 Customer Engg.Approval /Date (if Req'd):
Prototype : Prelaunch: Production:
Control Plan No : 92-20-A02-1-3
Control Plan
Part No/s.: A 400 545 13 05 -ZGS 002 Customer Quality Approval /Date(if Req'd):

Part Name: CONTROLLER Assy.REAR FOG LAMP (RFL 06) Key Contact/Phone - Rohit Diwaker Organization /Plant Approval /Date: Other Approval /Date(if Req'd):

Organization /Plant : Core Team : Other Approval /Date:(if Req'd) :

I NTERFACE MICROSYSTEMS V. K Gaur,M.S. Rawat, Manmohan, Rohit, Neelam, Pradeep, Govind, Rohit, Abhishek Tiwari, Deepak,
PLOT NO. 340~342, PHASE-2 UDYOGVIHAR,GURGAON Mahavir

Organization Code: Date(Orig) : 04.11.2015 Rev.No/Date: 03/30.07.2021

Characteristics Sp. Method

Opn
310 Packing
Operation Machine, Device, Jig,
Manually & Weight Machine Chara. Sample
Product/ Process Evaluation Measurement Reaction Plan
No. Description Tools Description No. Product Process Class Size Freq. Control Method
Specification. technique
2 As Per Incoming
Adequate packingInspection Standard
Adequate(QSF11-10)
packing As per packing standard Visual 100% Packing Standard Repack.
No missing of part Weighing machine
No wrong part packed in box provided for check part
No mixing of part quantity.If part less in box
machine will show error
(Poka yoke)
320 Final inspection As per PDI Inspection report - 92-14-A02-1-0 Reject & Recheck 100%

Digitally signed by V K

PREPARED BY: Rohit Diwaker Rohit

Diwaker
Digitally signed by
Rohit Diwaker
Date: 2021.08.11
13:48:53 +05'30'
APPORVED BY: V K GAUR V K Gaur Gaur
Date: 2021.08.11 17:43:14
+05'30'

Rev No.: Rev Date Revision Summary Reason for Revision

01 04.07.2018 Added Pinup Board for Programming at process 230 Quality Improvement

02 14.11.2019 Manual Ink Printing process change from INK to Laser Marking at Process No 300 Quality Improvement

03 30.07.2021 Added check points for Laser marking at process 300 & 310 To prevent faliure at customer end