SiT3521 Datasheet
SiT3521 Datasheet
Description Features
The SiT3521 is an ultra-low jitter, user programmable ◼ Programmable frequencies (factory or via I2C/SPI)
oscillator which offers the system designer great flexibility from 1 MHz to 340 MHz
and functionality. ◼ Digital frequency pulling (DCO) via I2C/SPI
The device supports two in-system programming options ▪ Output frequency pulling with perfect pull linearity
after powering up at a default, factory programmed startup ▪ 13 programmable pull range options to ±3200 ppm
frequency:
▪ Frequency pull resolution as low as 5 ppt (0.005 ppb)
◼ Any-frequency mode where the clock output can be ◼ 0.21 ps typical integrated phase jitter (12 kHz to 20 MHz)
re-programmed to any frequency between 1 MHz and
◼ Integrated LDO for on-chip power supply noise filtering
340 MHz in 1 Hz steps
◼ 0.02 ps/mV PSNR
◼ Digitally controlled oscillator (DCO) mode where the clock
◼ -40°C to 105°C operating temperature
output can be steered or pulled by up to ±3200 ppm with
5 to 94 ppt (parts per trillion) resolution. ◼ LVPECL, LVDS, or HCSL outputs
▪ Programmable LVPECL, LVDS Swing
The device’s default start-up frequency is specified in the
ordering code. User programming of the device is achieved ▪ LVDS Common Mode Voltage Control
via I2C or SPI. Up to 16 I2C addresses can be specified by ◼ RoHS and REACH compliant, Pb-free, Halogen-free
the user either as a factory programmable option or via and Antimony-free
hardware pins, enabling the device to share the I2C with
other I2C devices. Applications
The SiT3521 utilizes SiTime’s unique DualMEMS® ◼ Ethernet: 1/10/40/100/400 Gbps
temperature sensing and TurboCompensation® technology ◼ G.fast and xDSL
to deliver exceptional dynamic performance:
◼ Optical Transport: SONET/SDH, OTN
◼ Resistant to airflow and thermal shock ◼ Clock and data recovery
◼ Resistant to shock and vibration ◼ Processor over-clocking
◼ Low jitter clock generation
◼ Superior power supply noise rejection
◼ Server, storage, datacenter
Combined with wide frequency range and user ◼ Test and measurement
programmability, this device is ideal for telecom, networking ◼ Broadcasting
and industrial applications that require a variety of
frequencies and operate in noisy environment.
OE / NC 1 8 VDD
OE / NC 2 7 OUT-
GND 3 6 OUT+
4 5
A1 A0
/N /N
C/ C/
M SS
O
SI
Ordering Information
Revision Letter
“A” is the revision of Silicon
Frequency
1.000000 to 340. 000000 MHz
Temperature Range
“C” : Extended Commercial, -20 to 70°C
DCXO Pull Range
“ I ” : Industrial, -40 to 85°C
“E” : Extended Industrial, -40 to 105°C[1] “M” : ± 25 ppm
“B” : ± 50 ppm
“C” : ± 80 ppm
Signaling Type
“E” : ±100 ppm
“1”: LVPECL
“F” : ±125 ppm
“2”: LVDS
“G” : ±150 ppm
“4”: HCSL
“H” : ±200 ppm
“X” : ±400 ppm
Package Size “L” : ± 600 ppm
“Y” : ±800 ppm
“C”: 5.0 x 3.2 mm
“S” : ±1200 ppm
“Z” : ±1600 ppm
Frequency Stability/Grade “U” : ±3200 ppm
Notes:
1. -40 to 105°C option available only for I2C operation.
2. Bulk is available for sampling only.
TABLE OF CONTENTS
Description ................................................................................................................................................................................... 1
Features....................................................................................................................................................................................... 1
Applications ................................................................................................................................................................................. 1
Block Diagram ............................................................................................................................................................................. 1
Ordering Information .................................................................................................................................................................... 2
1 Electrical Characteristics ......................................................................................................................................................... 4
2 Device Configurations and Pin-outs ........................................................................................................................................ 9
3 Waveform Diagrams ............................................................................................................................................................. 11
4 Termination Diagrams ........................................................................................................................................................... 13
LVPECL .................................................................................................................................................................... 13
LVDS ........................................................................................................................................................................ 14
HCSL ........................................................................................................................................................................ 15
5 Test Circuit Diagrams ........................................................................................................................................................... 16
6 Architecture Overview ........................................................................................................................................................... 18
7 Functional Overview ............................................................................................................................................................. 18
User Programming Interface ..................................................................................................................................... 18
Start-up output frequency and signaling types ........................................................................................................... 18
In-system programmable options.............................................................................................................................. 18
8 In-system Programmable Functional Description.................................................................................................................. 19
Any-frequency function ............................................................................................................................................. 19
DCO Functional Description ..................................................................................................................................... 23
Pull Range, Absolute Pull Range .............................................................................................................................. 25
Software OE Functional Description ......................................................................................................................... 27
9 I2C/SPI Control Registers...................................................................................................................................................... 28
Register Address: 0x00. DCO Frequency Control Least Significant Word (LSW) .................................................... 28
Register Address: 0x01. OE Control, DCO Frequency Control Most Significant Word (MSW) ................................. 29
Register Address: 0x02. DCO PULL RANGE CONTROL ........................................................................................ 29
Register Address: 0x03. Frac-N PLL Feedback Divider Integer Value and Frac-N PLL Feedback Divider Fraction
Value MSW ............................................................................................................................................................... 30
Register Address: 0x04. Frac-N PLL Feedback Divider Fraction Value LSW ........................................................... 30
Register Address: 0x05. Forward Divider, Driver Control ......................................................................................... 30
Register Address: 0x06. Driver Divider, Driver Control ............................................................................................. 31
10 I2C Operation ........................................................................................................................................................................ 32
I2C protocol ............................................................................................................................................................... 32
I2C Timing Specification ............................................................................................................................................ 35
I2C Device Address Modes ....................................................................................................................................... 36
11 SPI Operation ....................................................................................................................................................................... 37
Schematic Examples ................................................................................................................................................................. 40
Dimensions and Patterns ........................................................................................................................................................... 43
Additional Information ................................................................................................................................................................ 44
Revision History ......................................................................................................................................................................... 45
1 Electrical Characteristics
All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with
standard output terminations shown in the termination diagrams. Typical values are at 25°C and nominal supply voltage.
Table 1. Electrical Characteristics – Common to LVPECL, LVDS and HCSL
Parameter Symbol Min. Typ. Max. Unit Condition
Frequency Range
Output Frequency Range f 1 – 340 MHz Factory or user programmable, accurate to 6 decimal places
Frequency Stability
Frequency Stability F_stab -10 – +10 ppm Inclusive of initial tolerance, operating temperature, rated
power supply voltage and load variations.
-20 – +20 ppm
-25 – +25 ppm
-50 – +50 ppm
First Year Aging F_1y – ±1 – ppm 1st-year aging at 25°C
Temperature Range
Operating Temperature Range T_use -20 – +70 °C Extended Commercial
-40 – +85 °C Industrial
-40 – +105 °C Extended Industrial. Available only for I2C operation, not SPI.
Supply Voltage
Supply Voltage Vdd 2.97 3.3 3.63 V
2.7 3.0 3.3 V
2.52 2.8 3.08 V
2.25 2.5 2.75 V
Input Characteristics – OE Pin
Input Voltage High VIH 70% – – Vdd OE pin
Input Voltage Low VIL – – 30% Vdd OE pin
Input Pull-up Impedance Z_in – 100 – kΩ OE pin, logic high or logic low
Output Characteristics
Duty Cycle DC 45 – 55 %
Startup and Output Enable/Disable Timing
Start-up Time T_start – – 3.0 ms Measured from the time Vdd reaches its rated minimum value
Output Enable/Disable Time – T_oe_hw – – 3.8 µs Measured from the time OE pin reaches rated VIH and VIL to
Hardware control via OE pin the time clock pins reach 90% of swing and high-Z.
See Figure 9 and Figure 10
Output Enable/Disable Time – T_oe_sw – – 6.5 µs Measured from the time the last byte of command is
Software control via I2C/SPI transmitted via I2C/SPI (reg1) to the time clock pins reach 90%
of swing and high-Z. See Figure 30 and Figure 31
Note:
3. Measured according to JESD65B.
Output Characteristics
Differential Output Voltage VOD 250 – 455 mV f = 156.25MHz See Figure 7
Delta VOD ΔVOD – – 50 mV See Figure 7
Offset Voltage VOS 1.125 – 1.375 V See Figure 7
Delta VOS ΔVOS – – 50 mV See Figure 7
Rise/Fall Time Tr, Tf – 400 470 ps Measured with 2 pF capacitive loading to GND, 20% to 80%,
see Figure 8
Jitter
RMS Phase Jitter (random) – T_phj – 0.21 0.275 ps f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
DCO Mode Only all Vdd levels
– 0.1 0.12 ps f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
RMS Phase Jitter (random) – T_phj – 0.21 0.367 ps f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
Any-frequency Mode Only all Vdd levels
– 0.1 0.12 ps f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
RMS Period Jitter[4] T_jitt – 1 1.6 ps f = 100, 156.25 or 212.5 MHz, Vdd = 3.3 V or 2.5 V
Note:
4. Measured according to JESD65B.
Note:
5. Measured according to JESD65B.
Table 5. I2C Electrical Characteristics – SCLK, SDA, 1 MHz SCLK, 255 Ohm, 550 pF (Max I2C Bus Load)
Parameter Symbol Min. Typ. Max. Unit Condition
Input Voltage Low VIL – – 30% Vdd
Input Voltage High VIH 70% – – Vdd
Output Voltage Low VOL – – 0.4 V
Input Leakage current[6] IL 0.5 – 24 µA 0.1 Vdd < VOUT < 0.9 Vdd
Input Capacitance CIN – – 5 pF
Note:
6. Including leakage current from 160 kOhm pull resister at typical condition to Vdd.
Table 7. Typical Phase Noise: Default start-up or reprogrammed frequency in DCO mode – LVDS output clock
Output Frequency Phase Noise (dBc/Hz)
Frequency Offsets
156.25 MHz 322.265625 MHz
100 Hz -97.8 -91.5
1 kHz -122.9 -116.5
10 kHz -131.1 -124.6
100 kHz -132.9 -126.3
1 MHz -148.2 -132.0
10 MHz -156.9 -153.0
20 MHz -157.7 -154.2
Table 8. Typical Phase Noise: Reprogrammed frequency in any-frequency Mode – LVDS output clock
Output Frequency Phase Noise (dBc/Hz)
Frequency Offsets
156.25 MHz 322.265625 MHz
100 Hz -98.5 -92.7
1 kHz -123.0 -116.6
10 kHz -131.9 -125.3
100 kHz -134.8 -127.9
1 MHz -146.9 -131.2
10 MHz -156.7 -152.7
20 MHz -157.7 -154.1
Note:
7. Exceeding this temperature for an extended period of time may damage the device.
Note:
8. Refer to JESD51 for JA and JC definitions, and reference layout used to determine the JA and JC values in the above Table 10.
9. Value for JA assumes the center pad is soldered down.
Note:
10. Datasheet specifications are not guaranteed if junction temperature exceeds the maximum operating junction temperature.
SCLK
SCLK
MISO
SDA
10 9 10 9
OE / NC 1 8 VDD OE / NC 1 8 VDD
OE / NC 2 7 OUT- OE / NC 2 7 OUT-
SS
A1 / NC
A0 / NC
Notes:
11. In OE mode for noisy environments, a pull-up resistor of 10 kΩ or less is recommended if pin 1 is not externally driven. If OE pin needs to be left floating,
use the NC option.
12. 0.1 μF capacitor in parallel with a 10 μF capacitor are required between VDD and GND.
3 Waveform Diagrams
OUT-
VOH
OUT+
VOL
GND
Figure 5. LVPECL, HCSL Voltage Levels per Differential Pin (i.e. OUT+, or OUT-)
80% 80%
V_ Swing
0V
t
20% 20%
Tr Tf
Figure 6. LVPECL, HCSL Voltage Levels Across Differential Pair (i.e. OUT+ minus OUT-)
OUT-
VOD
OUT+
VOS
GND
Figure 7. LVDS Voltage Levels per Differential Pin (i.e. OUT+, or OUT-)
80% 80%
0V
t
20% 20%
Tr Tf
Vdd Vdd
OE Voltage
VIH
VIL
T_oe_hw
OE Voltage
T_oe_hw
OUT- 90% OUT-
HZ HZ
OUT+ OUT+
GND GND
4 Termination Diagrams
LVPECL
OUT- Zo = 50Ω D-
0.1μF
RB RB VDD RB
50 Ω 50 Ω
3.3 V 100 Ω
VT
2.5 V 48.7 Ω
VDD
Thevenin-equivalent
Termination network
R1 R1
LVPECL
OUT+ Zo = 50Ω D+
OUT- Zo = 50Ω D-
VDD R1 R2 R2 R2
Figure 12. LVPECL DC-coupled Load Termination with Thevenin Equivalent Network
Y-Bias Termination
network
LVPECL
OUT+ Zo = 50Ω D+
OUT- Zo = 50Ω D-
R1 R2
VDD R1 R2 R3
3.3 V 50 Ω 50 Ω 50 Ω C1 R3
0.1μF
2.5 V 50 Ω 50 Ω 18 Ω
Shunt Bias
LVPECL Termination network
OUT+ Zo = 50Ω D+
OUT- Zo = 50Ω D-
50 Ω 50 Ω
VT=VDD-2V
LVDS
OUT+ Zo = 50Ω OUT+
100 Ω
OUT- Zo = 50Ω OUT-
LVDS 0.1μF
OUT+ Zo = 50Ω OUT+
100 Ω 100 Ω 0.1μF
OUT- Zo = 50Ω OUT-
Figure 16. LVDS Double AC Termination with Capacitor Close to the Load
LVDS
OUT+ Zo = 50Ω OUT+
100 Ω 100 Ω
OUT- Zo = 50Ω OUT-
R1
OUT+ Zo = 50Ω D+
OUT- Zo = 50Ω D-
R2
50Ω 50Ω
R1 = R2 = 33 Ω
Test Point
Vout Termination
VDD
SDA
9 8 7 6
A1/NC
1 2 3 4
VDD
OE 1 kΩ NC
Figure 19. Test Circuit (I2C mode and OE Function for Pin 1)
Test Point
Vout Termination
VDD
SDA
9 8 7 6
A1/NC
1 2 3 4
VDD
NC
1 kΩ
OE
Figure 20. Test Circuit (I2C mode and OE Function for Pin 2)
Test Point
Vout Termination
VDD
SDA
9 8 7 6
A0/NC
1 2 3 4
NC NC
Figure 21. Test Circuit (I2C mode and NC Function for both Pin1 and Pin2)
Test Point
Vout Termination
VDD
MISO 8 7
9 6
1 4 SS
2 3
VDD
OE 1 kΩ NC
Figure 22. Test Circuit (SPI mode and OE Function for Pin 1)
Test Point
Vout Termination
VDD
MISO 8 7
9 6
2 4 SS
2 3
VDD NC
1 kΩ
OE
Figure 23. Test Circuit (SPI mode and OE Function for Pin 2)
Test Point
Vout Termination
VDD
MISO
9 8 7 6
Power 0.1 uF
SCL SS
10 uF 10 5
Supply
MOSI
1 2 3 4
NC NC
Figure 24. Test Circuit (SPI mode and NC Function for both Pin1 and Pin2)
Software
OE
Frac-N OUT+
Forward
MEMS PLL
Divider
94 MHz (feedback
(M)
divider N) OUT-
Driver
DCO Control
To re-program device to the desired output frequency, Table 19 below shows implementation of this step for the
user should calculate the most appropriate Frac-N PLL 75 MHz output frequency example. The combination
feedback and forward divider combination. For a given satisfying above conditions is highlighted in blue.
output frequency, the choice of dividers combination Table 19. Frac-N PLL Feedback Divider and Forward
must fall within the allowable ranges (See the Table 18). Divider Combination Calculation for Output Frequency
Calculation of the appropriate N and M values and = 75 MHz
selection of proper Driver Control values consist of the M N
following steps. Throughout these steps, and example Within 2 to 8191 Within 13.08511 to 15.96875
using LVPECL 75 MHz output frequency will be used. 16 12.76596
17 13.56383
18 14.36170
19 15.15957
20 15.95745
Step 2: Calculate N and M Dividers Binary Values Step 3: Select appropriate Drive Control values
The selected combination of Frac-N PLL feedback Select appropriate Drive Control values based on Table 20.
divider and forward divider values should be converted Table 20. Driver Control settings
to binary words and then written to the device’s control
registers. Number conversion, conditioning and write Drive Control
Output Frequency
Output Driver Reg
procedure are as follows. The values calculated in the (MHz)
[5:0]
previous steps for 75 MHz output frequency will be used
1 to 250 110110b
for example purposes. LVPECL
250.000001 to 340 101110b
Step 2.1: Convert N value to binary word (N_reg)
1 to 250 001000b
32 bits are intended for N divider value: MSB 5 bits for LVDS or HCSL
250.000001 to 340 000000b
integer and LSB 27 for fractional parts
In the example, Driver Control Reg[5:0]: = 110110b
1) Take the integer part of the N divider value and
convert to binary.
Step 4: Write N and M binary values to the device
In our example, integer part is dec: 13 and
bin: 01101 Step 4.1: Read back the contents of 0x06[15:0]
2) Execute bitwise XOR operation on the integer Reg6 read back is needed to capture the value of this
part (01101b) and 01110b mask. register so the same values can be written along with
The reason for the 01110b mask is to set the the Driver Control Reg[2:0] value
default value when the device is in an un- Step 4.2: Write registers to the device in the
programmed state and all bit values are 0. following sequence
Frac-N PLL[15:0]
Driver Cotrol[2:0]
0x06[15:8] 0x06[7:0]
0x05[15:8] 0x05[7:0]
Rest of
write
Slave Drives Bit(s) on Bus
transaction
Tprogramming
Master Drives Bit(s) on Bus Output Frequency f0 Output Frequency f1
OUT+
St Start OUT-
Sp Stop
Tdisable
W Write Output Disabled
R Read OUT+ = High-Z
A Acknowledge OUT- = High-Z
ReSt Repeated Start
Figure 26. Changing the Default Start-up Output Frequency Using Auto Address Incrementing (I2C)
Frac-N PLL[15:0]
Driver Control[2:0]
0x06[15:8] 0x06[7:0]
0x05[15:8] 0x05[7:0]
Rest of
write
transaction
Tprogramming
Output Frequency f0 Output Frequency f1
OUT+
OUT-
Tdisable
Output Disabled
OUT+ = High-Z
OUT- = High-Z
Figure 27. Changing the Default Start-up Output Frequency Using Auto Address Incrementing (SPI)
Table 21. Output Disable and Enable Times when Changing the Output Frequency
Parameter Symbol Min. Typ. Max. Unit Condition
DCO Functional Description The pull range is specified by the value loaded in the
The DCO feature allows users to steer (pull) output digital pull range control register. The 16 pull range
frequency by up to ±3200 ppm with 5 to 94 ppt resolution choices are specified in the control register and range
through the I2C or SPI digital interface. from ±6.25 ppm to ±3200 ppm.
There are several advantages of DCO relative to analog Table 22 below shows the frequency resolution vs. pull
voltage control (VCXO) range programmed value.
a. Frequency Control Resolution as low as 5 ppt. Table 22. Frequency Resolution vs. Pull Range
This high resolution minimizes accumulated time Programmed Pull Range Frequency Precision
error in synchronization applications. ±25 ppm 5x10-12
b. Lower system cost – A VCXO may need a Digital ±50 ppm 5x10-12
to Analog Converter (DAC) to drive the control ±80 ppm 5x10-12
voltage input. In a DCO, the frequency control is ±100 ppm 5x10-12
achieved digitally by register writes to the control ±125 ppm 5x10-12
registers via I2C, thereby eliminating the need for a ±150 ppm 5x10-12
DAC. ±200 ppm 5x10-12
c. Better Noise Immunity – The analog signal used to ±400 ppm 1x10-11
drive the voltage control pin of a VCXO can be
±600 ppm 1.4x10-11
sensitive to noise and the trace over which the
±800 ppm 2.1x10-11
signal is routed can be susceptible to noise
±1200 ppm 3.2x10-11
coupling from the system. The DCO does not
±1600 ppm 4.7x10-11
suffer from analog noise coupling since the
±3200 ppm 9.4x10-11
frequency control is performed digitally through
I2C.
d. No Frequency Pull non-linearity. The frequency The ppm frequency offset is specified by the 26-bit DCO
pulling is achieved via fractional feedback divider Frequency control register in two’s complement format as
of the PLL, eliminating any pull non-linearity described in the I2C/SPI Register Descriptions. The power
concern which is typical of quartz based VCXOs. up default value is 00000000000000000000000000b
This improves dynamic performance in closed which sets the output frequency at its nominal value
loop operations. (0 ppm). To change the output frequency, a frequency
control word is written to 0x00[15:0] (Least Significant
e. Programmable Wide Pull Range – The DCO
Word) and 0x01[9:0] (Most Significant Word). The LSW
pulling mechanism is via the fractional feedback
value should be written first followed by the MSW value;
divider and is therefore not constrained by
the frequency change is initiated after the MSW value is
resonator pullability as in quartz based solutions.
written.
The SiT3521 offers 16 frequency pull range
options from ±6.25 ppm to ±3200 ppm, thereby
giving system designers great flexibility.
Figure 28 shows how the two’s complement signed value of Two examples follow, assuming the ±200 ppm pull range.
the frequency control word sets the output frequency within
the ppm pull range set by 0x02[3:0]. This example shows Example 1:
use of ±200 ppm pull range. Therefore, to set the desired Default start-up output frequency = 156.25 MHz
output frequency, one just needs to calculate the fraction of Desired output frequency = 156.2640625 MHz (+90 ppm)
full scale value ppm, covert to two’s complement binary and
225-1 corresponds to +200 ppm, and the fractional value
then write the values to the frequency control registers.
required for +90 ppm can be calculated as follows.
90 ppm/200 ppm * (225-1) = 15,099,493.95
The following formula generates the control word value:
Rounding to the nearest whole number yields 15,099,494
Control word Value = and converting to two complement gives a binary value of
= RND((225-1) * ppm shift from nominal/pull range) 111001100110011001100110 and E66666 in hex.
where RND is the rounding function which rounds the Example 2:
number to the nearest whole number.
Default start-up output frequency = 122.88 MHz
Desired output frequency = 122.873856 MHz (-50 ppm)
Following formula shown above,
(-50 ppm/200 ppm) * (225-1) = -8,388,607.75
Rounding to the nearest whole number results in
-8,388,608.
Converting to two’s complement binary results in
11100000000000000000000000 and 3800000 in hex.
To Summarize, the procedure for calculating the It is important to note that the maximum DCO Frequency
frequency control word associated with a given ppm Control update rate is 38 kHz regardless of I2C/SPI bus speed.
offset is as follows:
Pull Range, Absolute Pull Range
1) Calculate the fraction of the half pull range
needed. For example, if the total pull range is set Pull range (PR) is the amount of frequency deviation that will
for ±100 ppm and a +20 ppm shift from the result from changing the control voltage over its maximum
range under nominal conditions.
nominal frequency is needed, this fraction is
20 ppm/100 ppm = 0.2 Absolute pull range (APR) is the guaranteed controllable
frequency range over all environmental and aging conditions.
2) Multiply this fraction by the full half scale word Effectively, it is the amount of pull range remaining after
value, 225-1 = 33,554,431, round to the nearest taking into account frequency stability tolerances over
whole number and convert the result to two’s variables such as temperature, power supply voltage, and
complement binary. Following the +20 ppm aging, i.e.:
example, this value is 0.2 * 33,554,431 =
6,710,886.2 and rounded to 6,710,886. APR = PR − Fstability − Faging
3) Write the two’s complement binary value starting
with the Least Significant Word (LSW) where Fstability is the device frequency stability due to initial
0x00[16:0], followed by the Most Significant
tolerance and variations on temperature, power supply, and load.
Word (MSW), 0x01[9:0]. If the user desires that
the output remains enabled while changing the Table 23 below shows the pull range and corresponding APR
frequency, a 1 must also be written to the OE values for each of the frequency vs. temperature ordering
control bit 0x01[10] if the device has software options.
OE Control Enabled.
M ±25 ±10 – – –
X X X X X OE 9 8 A MSW[7:0] A Sp
0x01[15:8] 0x01[7:0]
STOP
condition f0 + f1 ±0.5%
Output f0 Tsettle
Frequency
Tfdelay
Slave Drives Bit(s) on Bus
St Start
Sp Stop
W Write
R Read
A Acknowledge
OE Output Enable
OE
NOT USED[15:11]
Control[10] DCO Frequency Control[9:0]
T_oe_sw
OUT+
OUT-
Output Disabled
OUT+
Output Disabled
OUT-
OE
NOT USED[15:11]
Control[10] DCO Frequency Control[9:0]
T_oe_sw
OUT+
OUT-
Output Disabled
OUT+
Output Disabled
OUT-
Register Descriptions
Register Address: 0x00. DCO Frequency Control Least Significant Word (LSW)
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Access RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW
Default 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Name DCO FREQUENCY CONTROL LEAST SIGNIFICANT WORD (LSW)[15:0]
This power up default values of all 26 bits are 0 which sets the output frequency at
its nominal value. After powerup, the system can write to these two registers to pull
the frequency across the pull range. The register values are 2’s complement to
support positive and negative control values. The LSW value should be written
before the MSW value because the frequency change is initiated when the new
values are loaded into the MSW. More details and examples are discussed in the
next section.
Register Address: 0x01. OE Control, DCO Frequency Control Most Significant Word (MSW)
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Access R R R R R RW RW RW RW RW RW RW RW RW RW RW
Default 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Name NOT USED OE DCO FREQUENCY CONTROL[9:0] MSW
This bit is only active if the output enable function is under software control. If the
device is configured for hardware control using an OE pin, writing to this bit has no
effect.
9:0 DCO FREQUENCY CONTROL RW Bits [9:0] are the upper 10 bits of the 26 bit Frequency Control Word and are the Most
MOST SIGNIFICANT WORD (MSW) Significant Word (MSW). The lower 16 bits are in register 0x00[15:0] and are the least
significant Frequency Control Word (MSW). Theses lower 16 bits together with upper
10 bits specify a 26-bit frequency control word.
This power up default values of all 26 bits are 0 which sets the output frequency at its
nominal value. After powerup, the system can write to these two registers to pull the
frequency across the pull range. The register values are 2’s complement to support
positive and negative control values. The LSW value should be written before the
MSW value because the frequency change is initiated when the new values are
loaded into the MSW. More details and examples are discussed in the next section.
Note:
13. Default values are factory set but can be over-written after power-up.
3:0 DCOs PULL RANGE CONTROL RW Sets the digital pull range of the DCO. The table below shows the available pull range
values and associated bit settings. The default value is factory programmed.
Bit
3210
0000: Not used
0001: Not used
0010: Not Used
0011: ±25 ppm
0100: ±50 ppm
0101: ±80 ppm
0110: ±100 ppm
0111: ±125 ppm
1100: ±150 ppm
1001: ±200 ppm
1010: ±400 ppm
1011: ±600 ppm
1100: ±800 ppm
1101: ±1200 ppm
1110: ±1600 ppm
1111: ±3200 ppm
Register Address: 0x03. Frac-N PLL Feedback Divider Integer Value and Frac-N PLL Feedback
Divider Fraction Value MSW
Bit 15 14 13 12 11 10 9 6 5 6 5 4 3 2 1 0
Access RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW
Default x x x x x x x x x x x x x x x x
Frac-N PLL Feedback Divider Integer
Name Frac-N PLL Feedback Divider Fraction Value, MSW
Value
10:0 Frac-N PLL Feedback Divider RW Most Significant Word (MSW) of Frac-N PLL feedback divider fraction value. The MSW
Fraction Value, MSW comprises the upper 11 bits of the 27-bit control word. The default value is factory
programmed to correspond to the desired output frequency (hence the x notation in the
default value field) and can be changed by the user after powerup.
Register Address: 0x04. Frac-N PLL Feedback Divider Fraction Value LSW
Bit 15 14 13 12 11 10 9 6 5 6 5 4 3 2 1 0
Access RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW
Default x x x x x x x x x x x x x x x x
Name Frac-N PLL Feedback Divider Fraction Value, LSW
15:0 Frac-N PLL Feedback Divider RW Sets the Least Significant Word of the Frac-N PLL feedback divider fraction. The
Fraction Value, LSW default value is factory programmed to correspond to the desired output frequency
(hence the x notation in the default value field) and can be changed by the user after
powerup.
10 I2C Operation
I2C protocol
Data valid START and STOP conditions
The SDA line must be stable during the high period of the The idle I2C bus state occurs when both SCLK and SDA
SCLK. SDA transitions are allowed only during SCLK low are not being driven by any master and are therefore in a
level for data communication. Only one transition is logic HI state due to the pull up resistors. Every
allowed during low SCLK pulse to communicate one bit of transaction begins with a START (S) signal and ends with
data. Figure 32 shows the detailed timing diagram. a STOP (P) signal. A START condition is defined by a
high to low transition on the SDA while SCLK is high. A
STOP condition is defined by a low to high transition on
the SDA while SCLK is high. START and STOP conditions
are always generated by master. This slave module also
supports repeated START (Sr) condition which is same as
START condition instead of STOP condition (Blue color
line shows repeated START in Figure 33).
SDA
SCLK
SDA
hold time hold time setup time
SCLK
S P
START Condition STOP Condition
SDA
MSB acknowledge acknowledge
from slave from slave
SCLK S or 1 2 7 8 9 1 2 3 to 8 9 P or
Sr ACK ACK Sr
SDA
1 to 7 8 9 1 to 8 9 1 to 8 9 1 to 8 9
SCL S P
START slave W ACK register ACK data-MSB ACK data-LSB ACK STOP
condition address address condition
SDA
1 to 7 8 9 1 to 8 9 1 to 8 9
SCL S P
START slave R ACK data-MSB ACK data-LSB ACK STOP
condition address condition
tf tr tSU;DAT
VIH
SDA
VIL
VIH
SCLK 1 2 8 9
VIL
tHD;STA
1/fSCLK tLOW
S
START Condition
tBUF
SDA
SCLK 8 9
P S
Sr
STOP Condition START Condition
Repeated START Condition
Notes:
14. Fast mode plus is not supported in Extended Industrial temperature range.
Table 27. Factory Programmed I2C Address Control Ordering Information Table is only valid for the ISP-DCXO
I2C Address Ordering Code Device I2C Address device option which uses pin control (A0, A1) of the I2C
0 1100000 address. This mode corresponds to ordering code “G” in
the I2C address section of the ordering code table.
1 1100001
2 1100010
3 1100011
4 1100100
5 1100101
6 1100110
7 1100111
8 1101000
9 1101001
A 1101010
B 1101011
C 1101100
D 1101101
E 1101110
F 1101111
11 SPI Operation
SPI (Serial Peripheral Interface) is a 4-pin synchronous The following Figure 38 illustrates the logical connection
serial protocol that allows a master device to initiate half- between one SPI master and 3 SPI slaves. Note that this
duplex communication with one or more slave devices. diagram is shows only an example logical connection and
The pin functions are as follows: is not a detailed schematic intended to show pull-up
resistors and other components which may also be
SCLK: Serial Clock which supports up to 5 MHz operating required.
frequency.
There are two allowed states for idle SCLK state, HI and
MOSI: Master Output Slave Input. This is the data input LOW and these states are called clock phase. There are
pin to the SiT3521 and is used by the master to write data also two modes for clock sampling edge, rising edge and
to the SiT3521 control registers. falling edge and these modes are called clock polarity.
MISO: Master Input Slave Output. This is the data output Since there are two allowed clock phases and two allowed
pin of the SiT3521 and is used by the master to read data clock polarities, this means there are four total modes of
from the SiT3521 control registers. SPI operation as illustrated below in Figure 39.
SCLK
SCLK
MOSI
MISO
MOSI
MISO
MOSI
MISO
SS
SS
SS
SPI
Master
MOSI
MISO
SCLK
SS0
SS1
SS2
Low
At Start Falling
Mode 1 Edge
Falling
Mode 2 Edge
High
At Start
Rising
Mode 3 Edge
High
At Start
The SiT3521 can support all four operating modes. By The detail register descriptions are covered in the I2C/SPI
default, modes 0 and 3 are supported, but modes 1 and 2 Control Registers.
can be supported in the future.
A description of DCO control is in DCO Functional
The serial byte interface format is shown below: 8-bit Description and a description of changing the output center
command (read or write), 8-bit SPI address and 16-bit data. frequency is in any-frequency Functional Description.
The serial order is most significant bit (MSB) first. The SPI The below Figure 41 shows the timing diagram for modes
protocol also supports auto address incrementing which 0 and 3.
means the address will automatically increment after the
first transaction. Auto address incrementing will result in
higher data throughput when writing to registers with
contiguous addresses. If it is required to write to non-
contiguous addresses, a write command and register
address must be used for each transaction after the
delay (125 us min). Without such delay, the device will
consider command and address bytes as a data for the
consequent register.
WRITE: 57h
READ: A5h 00: DCXO Frequency Control
01: DCXO Frequency Control, OE
02: DCXO Pull Range Control
03: PFM Control
04: PFM Control
05: PLL Post Divider Control
Differential Drive Strength
06: Differential Driver Control
VIH
SS
VIL
tSCLK
tsSU tHIGH tsH
SCLK
MOSI
tV
VOH
MISO
VOL
Notes:
15. SPI is not supported in Extended Industrial temperature range.
Schematic Examples
Notes:
16. Top Marking: Y denotes manufacturing origin and XXXX denotes manufacturing lot number. The value of “Y” will depend on the assembly location of the
device.
17. The center pad has no electrical function. Soldering down the center pad to the GND is recommended for best thermal dissipation, but is optional.
Additional Information
Table 30. Additional Information
Document Description Download Link
ECCN #: EAR99 Five character designation used on the —
commerce Control List (CCL) to identify dual
use items for export control purposes.
HTS Classification Code: A Harmonized Tariff Schedule (HTS) code —
8542.39.0000 developed by the World Customs Organization
to classify/define internationally traded goods.
Part number Generator Tool used to create the part number based on https://www.sitime.com/part-number-generator
desired features.
Manufacturing Notes Tape & Reel dimension, reflow profile and https://www.sitime.com/support/resource-library/manufacturing-notes-sitime-
other manufacturing related info products
Qualification Reports RoHS report, reliability reports, http://www.sitime.com/support/quality-and-reliability
composition reports
Performance Reports Additional performance data such as phase http://www.sitime.com/support/performance-measurement-report
noise, current consumption, and jitter for
selected frequencies
Termination Techniques AN10029 Termination design http://www.sitime.com/support/application-notes
recommendations
Layout Techniques AN10006 Layout recommendations http://www.sitime.com/support/application-notes
Time Master Web Based Tool to establish proper programming https://www.sitime.com/time-master-web-based-configurator
Configurator
Revision History
Table 31. Revision History
Revisions Release Date Change Summary
0.1 3-Mar-2017 Initial draft
0.2 10-Mar-2017 Added I2C Timing diagram for ISP Function
Modified Block Diagram to include approximate MEMS frequency (47 MHz)
Updated ISP function procedure
Updated Package Drawing
0.21 10-Mar-2017 Added Table 5, I 2C Electrical Characteristics
0.22 11-Oct-2017 Fixed I2C Timing diagram on page 12 to show output disabled when first PFM value is written.
Added Output Drive Strength Control to Block Diagram on page 9
Changed PFM Range from 12.59 - 16.34 to 13.83 – 15.43.
Changed 156.25 MHz programming example so that it corresponds to the new PFM range.
Updated logo and company address, other page layout changes
0.90 2-Apr-2018 Preliminary release
0.99 22-Aug-2018 Updated thermal numbers, fixed minor errors
0.991 25-Apr-2020 ±10 ppm option
Updated POD (Dimensions Drawings)
Added Evaluation and Demo Boards reference in Additional Information
Other page layout changes
Added HTS classification code
Added 105°C support for I2C operation
Increased max operating junction temperature for 70°C and 85°C ambient
Updated Frac-N PLL numbers in Table 19
Updated I2C Timing Requirements for “Fall time of both SCLK and SDA”
1.0 4-Nov-2020 Updated I2C Write/Read Sequence section
Updated schematics
Updated frequency re-programming section
Updated register description section
Removed HCSL maximum output current specification
Changed rev table date format
Final release
1.01 30-Apr-2021 Updated Table 17
Updated hyperlink to Manufacturing Notes; Changed date format
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