STCH02

Offline PWM controller for ultra-low standby adapters

Datasheet - production data

Description
The STCH02 is a PWM quasi resonant controller
specifically designed for ultra-low standby power
supplies.
The built-in HV start-up cell with zero power
SO-8
consumption, the fully integrated blocks for
primary side constant current output regulation
and the advanced power management make this
Features IC the best choice to build a high efficiency and
ultra-low standby consumption power supply, with
 Advanced power management for ultra-low high overall and excellent dynamic performances.
standby power consumptions (under 10 mW at
230 Vac) Figure 1. Typical application
 Fully integrated primary side constant current 7PVU

output regulation (CC)

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 Automatic self-supply
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 Input voltage feedforward compensation for

mains-independent CC regulation
 Intelligent frequency jitter for EMI suppression
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 SO-8 package
Table 1. Device summary
Applications Order code Package Packing
 AC-DC chargers for smartphones, tablets, STCH02 Tube
camcorders and other handheld equipment SO-8
STCH02TR Tube and reel
 AC/DC adapters for STB, notebooks and
auxiliary power supplies

November 2016 DocID028766 Rev 4 1/24

This is information on a product in full production. www.st.com
Contents STCH02

Contents

1 Device description and block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Typical circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1 Gate driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.2 Frequency jittering for EMI reduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.3 High voltage start-up generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4 Zero current detection and triggering block . . . . . . . . . . . . . . . . . . . . . . . 13
3.5 Constant voltage operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.6 Constant current operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.7 Voltage feedforward block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.8 Burst mode operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.9 Adaptive UVLO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.10 Overvoltage protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.11 Soft-start and starter block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.12 Hiccup mode OCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1 SO-8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

2/24 DocID028766 Rev 4

STCH02 Device description and block diagram

1 Device description and block diagram

The STCH02 is a current mode controller designed for offline quasi resonant ZVS (zero
voltage switching at switch turn-on) flyback converters.
It combines a high performance low voltage PWM controller chip and a 650 V HV start-up
cell in the same package.
The device features a unique characteristic: it is capable to provide a constant output
current (CC) regulation using primary-sensing feedback. This eliminates the need for
a dedicated current reference IC, as well as the current sensor, still maintaining a quite
accurate output current regulation.
The quasi resonant operation is achieved by means of a transformer demagnetization
sensing input that triggers MOSFET's turn-on, connected on the ZCD pin. This input serves
also to monitor the output voltage monitor and to achieve the mains independent CC
regulation (line voltage feedforward).
The maximum switching frequency is top-limited below 260 kHz, so that at the medium-
light-load a special function automatically lowers the operating frequency still maintaining
the operation as close to ZVS as possible. At the very light-load, the device enters
a controlled burst mode operation that, along with the zero power high voltage start-up
circuit, the extremely low quiescent current of the device, helps minimize the residual input
consumption, thus meeting the requirements of the most stringent standards.
During the CC regulation, where the flyback voltage generated by the auxiliary winding
drops and may be not enough to supply the internal circuits, the chip is able to power itself
directly from the rectified mains through the high voltage start-up circuit.
During the burst mode operation the self-supply feature is disabled (due to very stringent no
load consumption requirement), and the VDD supply voltage has to be guaranteed by proper
application design.
In any case, an innovative adaptive UVLO helps minimize the issues related to the
fluctuations of the self-supply voltage with the output load, due to transformer's parasitic and
further reducing the IC's bias consumption.
In addition to the said functions that optimize power handling under different operating
conditions, the device offers also a protection against the transformer saturation and
secondary diode short-circuit and an adjustable output overvoltage protection. All of them
are in the autorestart mode.
An embedded leading edge blanking on the current sense input for greater noise immunity
completes the equipment of this device.

DocID028766 Rev 4 3/24

24
Device description and block diagram STCH02

Figure 2. Block diagram

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4/24 DocID028766 Rev 4

STCH02 Device description and block diagram

Table 2. Thermal data

Symbol Parameter Max. value Unit

Rth j-amb Thermal resistance, junction to ambient 150 °C

Table 3. Absolute maximum ratings

Symbol Pin Parameter Value Unit

VHV 1 Voltage range (referred to GND) -0.3 to 650 V

IHV 1 Output current Self limited mA
3 to 6 Analog inputs and outputs -0.3 to 3.6 V
IZCD 4 Zero current detector current ±3 mA
IGD 7 Output totem pole peak current Self limited
VDD 8 Supply voltage (ICC < 25 mA) Self limited V
IDD 8 Device supply current + internal Zener capability 25 mA
TJ Junction temperature range -40 to 150 °C
TSTG Storage temperature -55 to 150 °C

Figure 3. Pin connection (top view)

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Table 4. Pin functions

No. Name Function

High voltage start-up. The pin, able to withstand 650 V, is to be tied directly to the
rectified mains voltage. When the voltage on the pin reaches the HVSTART voltage
(50 V typ.) a 7 mA internal current source charges the capacitor connected between
VDD and GND to start-up the IC. When the voltage on the VDD pin reaches the turn-
1 HV on threshold (13 V typ.) the generator is shut down and re-enabled as the VDD
voltage falls below the turn-off threshold (10 V typ.). In this way, if the auxiliary
winding is not delivering sufficient voltage or it is not used at all, the IC keeps on
running. This feature is disabled in case a protection is tripped, and the generator is
restarted after VDD has dropped below VDDR (4.5 V typ.)
Not internally connected. A provision for clearance on the PCB to meet safety
2 NC
requirements.

DocID028766 Rev 4 5/24

24
Device description and block diagram STCH02

Table 4. Pin functions (continued)

No. Name Function

Control input for duty cycle control. A voltage set 65 mV below the threshold VFBB
3 FB activates the burst mode operation. A level close to the threshold VFBL means that we
are approaching the cycle-by-cycle overcurrent setpoint.
Transformer's demagnetization sensing for the quasi resonant operation and
input/output voltage monitor. A negative-going edge triggers the MOSFET's turn-on.
The current sourced by the pin during MOSFET's ON-time is monitored to get an
image of the input voltage to the converter, in order to compensate the internal delay
of the current sensing circuit and achieve a CC regulation independent of the mains
4 ZCD
voltage. Still, the pin voltage is sampled-and-held right at the end of transformer's
demagnetization to get an accurate image of the output voltage to be used for
overvoltage protection (OVP). Please note that the maximum IZCD sunk/sourced
current has to not exceed ± 3 mA (AMR) in the entire input voltage range. No
capacitor is allowed between the pin and the auxiliary winding of the transformer.
Input to the PWM comparators. The current flowing in the MOSFET is sensed
through a resistor connected between the pin and GND. The resulting voltage is
compared with an internal reference (0.75 V max.) to determine the MOSFET's turn-
5 SENSE off. The pin is equipped with 380 ns blanking time after the gate drive output goes
high for improved noise immunity. If a second comparison level located at 1 V is
exceeded the IC is stopped and restarted after VDD has dropped below VDDR (4.5 V
typ.).
Circuit ground reference and current return for both - the signal part of the IC and the
6 GND gate drive. All of the ground connections of the bias components should be tied to
the trace going to this pin and kept separate from any pulsed current return.
7 GD A gate driver with a totem pole output stage for the external power MOSFET.
Supply voltage of the device. An electrolytic capacitor, connected between this pin
and ground, is initially charged by the internal high voltage start-up generator. When
the device is running the same generator will keep it charged in case the voltage
8 VDD supplied by the auxiliary winding is not sufficient. This feature is disabled in case
a protection is tripped. Sometimes a small bypass capacitor (0.1 µF typ.) connected
between the pin and GND might be useful to get a clean bias voltage for the signal
part of the IC.

6/24 DocID028766 Rev 4

STCH02 Device description and block diagram

Table 5. Electrical characteristics

(Tj = -25 °C to 125 °C, VDD = 14 V, unless otherwise specified)
Symbol Parameter Test condition Min. Typ. Max. Unit

High voltage start-up generator

VHV HV voltage IHV < 2 µA, Tj = 25 °C 650 V

ILEAKAGE HV leakage current VHV = 400 V, Tj = 25 °C 1 µA
HVSTART HV start voltage 40 50 60 V
VHV > HVSTART; VDD  0.6 V 0.3 0.6 0.9
ICHARGE VDD start-up charge current VHV > HVSTART; mA
4.5 7 10.3
2 < VDD < VDDOn
VDD-FOLD VDD foldback threshold VHV > HVSTART 1 2 V

Supply voltage

VDD Operating range After turn-on 11.5 23 V

VDD-ON Turn-on threshold 12 13 14 V
VDD-OFF Restart threshold VFB > VFBF 9 10 11 V
VFB > VFBF 8.55 9.5 10.45 V
VDD-UVLO UVLO threshold
VFB < (0.6 - 65 mV) 6.75 7.5 8.25 V
After protection tripping 4.5
VDDR VDD restart voltage (falling) V
In burst mode 3.2
VZ VZ clamping voltage IDD = 20 mA 23 26.5 V

Supply current

IQ Quiescent current Burst operation 190 230 µA

IDD Operating supply current Cout = 1 nF, fsw = 100 KHz 2.3 2.7 mA
IDD-FAULT Fault quiescent current During hiccup 330 420 µA

Start-up timer and frequency limit

TSTART Start timer period 220 µs

FLIM Internal frequency limit 260 kHz

Zero current detector

IZCDb Input bias current VZCD = 0.1 to 2.7 V 1 µA

VZCDH Upper clamp voltage IZCD = 1 mA 3 V
VZCDL Lower clamp voltage IZCD = - 1 mA -60 mV
VZCDA Arming voltage Positive-going edge 80 110 140 mV
VZCDT Triggering voltage Negative-going edge 40 60 80 mV

Trigger blanking time after MOSFET's VFB 1.65 V 3.8

TBLANK µs
turn-on VFB = 0.6 V 24

DocID028766 Rev 4 7/24

24
Device description and block diagram STCH02

Table 5. Electrical characteristics

(Tj = -25 °C to 125 °C, VDD = 14 V, unless otherwise specified) (continued)
Symbol Parameter Test condition Min. Typ. Max. Unit

TD-ON Turn-on delay time after triggering VGATE = 6 V, CGATE = 1 nF 270 ns

TFORCE Force turn-on time after blanking 10 14 µs

Gate driver

VDD = 8.5 V; IGATE = 5 mA 7

VGDL Output high voltage V
IGATE = 5 mA 10.5 13
TRISE Rising time CGATE = 1 nF 70 110 150 ns
TFALL Falling time CGATE = 1 nF 20 40 60 ns
Isource Source current CGATE = 1 nF 64 87 137 mA
Isink Sink current CGATE = 1 nF 160 240 480 mA
VGDL Output low voltage IGD-SINK = 50 mA 1 V

Line feedforward

RFF Equivalent feedforward resistor IZCD = 1 mA 60 80 

Feedback input

VFBH Upper saturation 3.45 V

HFB Current sense gain 3.22 3.29 3.36
IFB Feedback source current 70 100 130 µA
VFBB Burst mode threshold Voltage falling 0.54 0.6 0.66 V
VFBF Exit burst mode threshold 0.64 0.72 0.8 V
VHYST Burst mode hysteresis 50 65 75 mV

Current reference

VREFx Maximum value Internal, not measured 0.8 V

KI Current loop gain 0.19 0.2 0.21 V

Overvoltage protection

VOVP OVP threshold 2.375 2.5 2.625

V
NOVP Consecutive cycles for OVP triggering VOVP = 2.5 V 4

Current sense

TLEB Leading edge blanking VGATE = 6 V, COUT = 1 nF 270 380 490 ns

TD Gate delay to output VGATE = 6 V, COUT = 1 nF 150 ns
VCSx Max. clamp value dVCS/dt = 200 mV/µs 0.7 0.75 0.8 V
VOCP Hiccup mode OCP level 0.95 1 1.05 V
VSENSE_BM Minimum burst mode sense voltage 72 mV

8/24 DocID028766 Rev 4

STCH02 Device description and block diagram

Table 5. Electrical characteristics

(Tj = -25 °C to 125 °C, VDD = 14 V, unless otherwise specified) (continued)
Symbol Parameter Test condition Min. Typ. Max. Unit

Frequency jittering

FD Modulation frequency 9 kHz

VZCDH Modulation duty cycle 50 %
Ipk Peak current change 5 %

DocID028766 Rev 4 9/24

24
Typical circuit STCH02

2 Typical circuit

Figure 4. Typical configuration

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10/24 DocID028766 Rev 4

STCH02 Application information

3 Application information

The STCH02 is an offline CC mode primary sensing switching controller, specific for offline
quasi resonant ZVS (zero voltage switching at switch turn-on) flyback converters.
Depending on converter's load condition, the device is able to work in different modes (see
Figure 5):
1. QR mode at the heavy load. Quasi resonant operation lies in synchronizing MOSFET's
turn-on to the transformer's demagnetization by detecting the resulting negative-going
edge of the voltage across any winding of the transformer. Then the system works
close to the boundary between discontinuous (DCM) and continuous conduction
(CCM) of the transformer. As a result, the switching frequency will be different for
different line/load conditions (see the hyperbolic-like portion of the curves in Figure 5).
Minimum turn-on losses, low EMI emission and safe behavior in the short-circuit are
the main benefits of this kind of operation.
2. Valley-skipping mode at the medium/light-load. Depending on voltage on the FB pin,
the device defines the maximum operating frequency of the converter. As the load is
reduced MOSFET's turn-on will not any more occur on the first valley but on the
second one, the third one and so on. In this way the switching frequency will no longer
increase.
3. Burst mode with no or a very light-load. When the load is extremely light or
disconnected, the converter will enter a controlled on/off operation with the constant
peak current. Decreasing the load will then result in frequency reduction, which can go
down even to few hundred hertz, thus minimizing all frequency related losses and
making it easier to comply with energy saving regulations or recommendations. Being
the peak current very low, no issue of audible noise arises.

Figure 5. Multi-mode operation of STCH02

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DocID028766 Rev 4 11/24

24
Application information STCH02

3.1 Gate driver

The gate driver of the power MOSFET is designed to supply a controlled gate current during
both turn-on and turn-off in order to minimize the common mode EMI. Under UVLO
conditions an internal pull-down circuit holds the gate low in order to ensure that the power
MOSFET cannot be turned on accidentally.

3.2 Frequency jittering for EMI reduction

Although the STCH02 device works in the QR mode and the switching frequency is already
modulated at twice of the mains frequency, dedicated frequency jittering circuitry is
embedded inside the IC to further reduce the EMI filtering. A proprietary frequency jitter
technique is implemented in the controller, based on the injection of a modulating signal at
9 kHz (above the feedback loop bandwidth) with 50% duty cycle on the current sense
signal: this signal is a square waveform that modulates the amplitude of the peak primary
current. The percentage of this amplitude is set as a default at 5%. As the peak current
reduces with decreasing load levels, the effect of this modulation automatically attenuates at
lower loads, where the energy of EMI noise is highly reduced.

3.3 High voltage start-up generator

Based on a 650 V rated depletion MOSFET embedded into the start-up cell, the HV current
generator is supplied through the DRAIN pin and is enabled only if the voltage on the HV pin
is higher than the HVSTART threshold (50 V typical value).
With reference to the timing diagram in Figure 6, when the power is applied to the circuit and
the voltage on the input bulk capacitor is high enough, the HV generator is sufficiently
biased to start operating, thus it will draw the current ICHARGE (7 mA typ. value) through the
HV pin and will charge the capacitor connected between the VDD pin and ground. This
charging current will be reduced at 0.6 mA in case the voltage on the VDD is lower than
VDD-FOLD, in order to prevent exceeding IC dissipation when the pin is accidentally shorted
to ground or during a restart after protection triggering.
As the VDD voltage reaches the start-up threshold (13 V typ.) the chip starts operating and
the control logic disables the HV generator.
While the generator is off, there are virtually no losses across the HV start-up cell, except
a few hundreds nA of the leakage current through the depletion MOSFET.
The IC is powered by the energy stored in the VDD capacitor until the self-supply circuit
(typically an auxiliary winding of the transformer and a steering diode) develops a voltage
high enough to sustain the operation.
The chip is able to power itself directly from the rectified mains: when the voltage on the VDD
pin falls below VDD-OFF (10 V typ.), the HV current generator is turned on and charges the
supply capacitor until it reaches the VDD-ON threshold.
In this way, the self-supply circuit develops a voltage high enough to sustain the operation of
the device. This feature is useful especially during the CC regulation, when the flyback
voltage generated by the auxiliary winding alone may not be able to keep VDD within the
operative range.

12/24 DocID028766 Rev 4

STCH02 Application information

At converter power-down the system will the lose the regulation as soon as the input voltage
falls below HVSTART. This prevents converter's restart attempts and ensures monotonic
output voltage decay at system power-down.

Figure 6. Timing diagram: normal power-up and power-down sequences

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3.4 Zero current detection and triggering block

The zero current detection (ZCD) and triggering blocks switch on the power MOSFET if
a negative-going edge falling below 50 mV is applied to the ZCD pin. To do so, the triggering
block must be previously armed by a positive-going edge exceeding 100 mV.
This feature is used to detect transformer demagnetization for the QR operation, where the
signal for the ZCD input is obtained from the transformer's auxiliary winding used also to
supply the IC.
The triggering block is blanked after the MOSFET's turn-off to prevent any negative-going
edge that follows leakage inductance demagnetization from triggering the ZCD circuit
erroneously.
This blanking time is dependent on the voltage on the FB pin: it is TBLANK = 24 µs for
VFB = 0.6 V, and decreases linearly down to TBLANK = 3.8 µs for VFB  1.65 V.
The voltage on the pin is both top and bottom limited by a double clamp. The upper clamp is
typically located at 3 V, while the lower clamp is located at -60 mV. The interface between
the pin and the auxiliary winding will be a resistor divider. Its resistance ratio as well as the
individual resistance values will be properly chosen (see Section 3.10: Overvoltage
protection on page 18 and Section 3.7: Voltage feedforward block on page 16).

DocID028766 Rev 4 13/24

24
Application information STCH02

Please note that the maximum IZCD sunk/sourced current has to not exceed ± 3 mA
(AMR) in all the Vin range conditions (88 - 265 Vac). No capacitor is allowed between
the ZCD pin and the auxiliary winding of the transformer.
The switching frequency is top-limited below 260 kHz, as the converter's operating
frequency tends to increase excessively at the light-load and high input voltage.
A starter block is also used to start-up the system when the signal on the ZCD pin is not high
enough to trigger the MOSFET
After the first few cycles initiated by the starter, as the voltage developed across the auxiliary
winding becomes large enough to arm the ZCD circuit, MOSFET's turn-on will start to be
locked to transformer demagnetization, hence setting up the QR operation.
The starter is activated also when the IC is in the CC regulation and the output voltage is not
high enough to allow the ZCD triggering.
If the demagnetization completes - hence a negative-going edge appears on the ZCD pin -
after a time exceeding time TBLANK from the previous turn-on, the MOSFET will be turned
on again, with some delay to ensure minimum voltage at turn-on. If, instead, the negative-
going edge appears before TBLANK has elapsed, it will be ignored and only the first
negative-going edge after TBLANK will turn-on the MOSFET. In this way one or more drain
ringing cycles will be skipped (“valley-skipping mode”, Figure 7) and the switching frequency
will be prevented from exceeding 1/TBLANK.

Figure 7. Drain ringing cycle skipping as the load is progressively reduced

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When the system operates in the valley-skipping mode, uneven switching cycles may be
observed under some line/load conditions, due to the fact that the OFF-time of the MOSFET
is allowed to change with discrete steps of one ringing cycle, while the OFF-time needed for
cycle-by-cycle energy balance may fall in between. Thus one or more longer switching
cycles will be compensated by one or more shorter cycles and vice versa. However, this
mechanism is absolutely normal and there is no appreciable effect on the performance of
the converter or on its output voltage.

14/24 DocID028766 Rev 4

STCH02 Application information

3.5 Constant voltage operation

The device is specific for secondary feedback. The FB pin is connected to an optocoupler
which transmits the error signal from the regulation loop located on the secondary side of
the converter. Typically, a TS431 is used as a voltage reference.
The FB pin is driven directly by the phototransistor's collector to modulate the duty cycle.
The voltage coming from the FB pin is compared with the voltage across the sense resistor,
controlling the peak drain current cycle-by-cycle.

Figure 8. Voltage control principle: internal schematic

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3.6 Constant current operation

The voltage of the auxiliary winding is fed into the internal CC block trough the ZCD pin to
achieve an output constant current regulation.
Equation 1 can be used to define to output current in CC mode.

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This formula shows that the average output current does not depend anymore on the input
or the output voltage, neither on transformer inductance values. The external parameters
defining the output current are the transformer ratio and the sense resistor RSENSE. The
current loop gain KI is internally defined (see Table 5 on page 7).

DocID028766 Rev 4 15/24

24
Application information STCH02

3.7 Voltage feedforward block

The current control structure uses the voltage VC to define the output current, according to
Equation 1. Actually, the CC comparator will be affected by an internal propagation delay
Td, which will switch off the MOSFET with a peak current than higher the foreseen value.
The STCH02 device implements a line feedforward function, which solves the issue by
introducing an input voltage dependent offset on the current sense signal, in order to adjust
the cycle-by-cycle current limitation.
The external schematic configuration is shown in Figure 9.

Figure 9. Feedforward compensation: internal schematic

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The RZCD resistor can be calculated as follows:

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In this case the peak drain current does not depend on input voltage anymore.

16/24 DocID028766 Rev 4

STCH02 Application information

3.8 Burst mode operation

When the voltage at the FB pin falls down 65 mV below than VFBB, the burst mode
operation starts: the MOSFET is turned OFF in order to reduce the consumption. After the
MOSFET turn OFF, the FB pin voltage, as result of the feedback reaction to the energy
delivery stop, increases up to the VFBB and the device restarts the switch again.
During these switching cycles the max. peak current is fixed (about VSENSE_BM/RSENSE) by
an internal clamp inside the current limit circuit. The effect of the burst mode operation is to
reduce the equivalent switching frequency, which can go down even to few hundred hertz,
minimizing all frequency related losses and making it easier to comply with energy saving
regulations.
This kind of operation, shown in the timing diagrams of Figure 10 along with the other ones,
is audible noise free since the peak current is low.

Figure 10. Adaptive minimum restart time: timing diagrams

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DocID028766 Rev 4 17/24

24
Application information STCH02

3.9 Adaptive UVLO

A major problem when optimizing a converter for minimum no load consumption is that the
voltage generated by the auxiliary winding under these conditions falls considerably as
compared even to a few mA load. This very often causes the supply voltage VDD of the
control IC to drop and, as the HV start-up is disabled during the burst mode, it can go below
the UVLO threshold so that the operation becomes intermittent, which is undesired.
Furthermore, this must be traded off against the need of generating a voltage not exceeding
the maximum allowed by the control IC at the full load but low enough to reduce the bias
losses as much as possible.
To help the designer to overcome this problem, the device besides reducing its own
consumption during the burst mode operation, also features a proprietary adaptive UVLO
function.
It consists of shifting the VDD-UVLO threshold downwards at the light-load, namely when the
voltage at the FB pin falls 65 mV below the burst mode threshold VFBB (0.6 V typ.), to have
more headroom.
To prevent any malfunction the normal threshold (9.5 V typ.) is re-established when the
voltage at the FB pin exceeds the exit burst mode threshold VFBF.
The normal UVLO threshold ensures that at full medium-heavy loads the MOSFET will be
driven with a proper gate to source voltage.
The mode of operation is reported in Figure 10.

3.10 Overvoltage protection

The overvoltage function of the STCH02 device monitors the voltage on the ZCD pin during
MOSFET's OFF-time, where the voltage generated by the auxiliary winding tracks
converter's output voltage. If the voltage applied to the pin exceeds an internal 2.5 V
reference, a comparator is triggered, an overvoltage condition is assumed and the device is
shut down.
Once RZCD is fixed by feedforward considerations (see Section 3.7: Voltage feedforward
block) it is possible to calculate the value of the ROVP resistor to activate the OVP protection
for a certain output voltage level, VOUT-OVP:

Equation 3

Where VOVP is the internal OVP threshold, NSEC and NAUX are the secondary and auxiliary
turn's number respectively.
To reduce sensitivity to noise and prevent the latch from being erroneously activated, the
OVP comparator must be triggered for four consecutive oscillator cycles before the STCH02
device is stopped. A counter, which is reset every time the OVP comparator is not triggered
in one oscillator cycle, is provided to this purpose.
Figure 11 illustrates the timing of the function.

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STCH02 Application information

Once the protection is tripped, the condition is maintained until VDD goes below VDDR restart
voltage. While it is disabled, however, no energy is coming from the self-supply circuit; and
the voltage on the VDD capacitor will drop down to VDDR restart voltage, before the VDD
capacitor is charged again and the device restarted (VDD-ON). Ultimately, this will result into
a low frequency intermittent operation (hiccup mode operation).

Figure 11. OVP function: timing diagram

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3.11 Soft-start and starter block

The soft start feature is automatically implemented by the constant current block, as the
primary peak current will be limited from the voltage on the internal CC block capacitor.
During the start-up, as the output voltage is zero, the IC will start in the CC mode with no
high peak current operations. In this way the voltage on the output capacitor will increase
slowly and the soft-start feature will be ensured.

3.12 Hiccup mode OCP

The device is also protected against the short-circuit of the secondary rectifier, short-circuit
on the secondary winding or a hard-saturated flyback transformer. A comparator monitors
continuously the voltage on the RSENSE and activates protection circuitry if this voltage
exceeds the VOCP value (1 V typ. value).
To distinguish an actual malfunction from a disturbance (e.g.: induced during ESD tests), the
first time the comparator is tripped the protection circuit enters a “warning state”. If in the
subsequent switching cycle the comparator is not tripped, a temporary disturbance is
assumed and the protection logic will be reset in its idle state; if the comparator will be
tripped again a real malfunction is assumed and the device will be stopped.
Once the protection is tripped, the condition is maintained until VDD goes below VDDR restart
voltage. While it is disabled, however, no energy is coming from the self-supply circuit;
hence the voltage on the VDD capacitor will decay and cross the UVLO threshold after some

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24
Application information STCH02

time, which clears the latch. The internal start-up generator is still off, then the VDD voltage
still needs to go below its restart voltage before the VDD capacitor is charged again and the
device restarted. Ultimately, this will result in a low frequency intermittent operation (hiccup
mode operation), with very low stress on the power circuit. This special condition is
illustrated in the timing diagram of Figure 12.

Figure 12. Hiccup mode OCP: timing diagram

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STCH02 Package information

4 Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

4.1 SO-8 package information

Figure 13. SO-8 package outline

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24
Package information STCH02

Table 6. SO-8 package mechanical data

Dimensions

Symbol mm inch

Min. Typ. Max. Min. Typ. Max.

A 1.35 1.75 0.053 0.069

A1 0.10 0.25 0.004 0.010
A2 1.10 1.65 0.043 0.065
B 0.33 0.51 0.013 0.020
C 0.19 0.25 0.007 0.010
D(1) 4.80 5.00 0.189 0.197
E 3.80 4.00 0.15 0.157
e 1.27 0.050
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.020
L 0.40 1.27 0.016 0.050
k 0° (min.), 8° (max.)
ddd 0.10 0.004
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15 mm (0.006 inch) in total (both sides).

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STCH02 Revision history

5 Revision history

Table 7. Document revision history

Date Revision Changes

15-Dec-2015 1 Initial release.

Updated Figure 2 on page 4 (replaced by new figure).
03-Mar-2016 2
Minor modifications throughout document.
Updated document status to Datasheet - production
data on page 1.
Updated Table 5 on page 7 (updated values of RFF).
05-May-2016 3 Updated Figure 6 on page 13 (replaced by new figure).
Updated Section 3.9 on page 18 (replaced “self-supply”
by “HV start-up”).
Minor modifications throughout document.
Updated Figure 2 on page 4 (replaced “COMP” by “FB”
pin).
Updated Table 5 on page 7 (added Isource and Isink
18-Nov-2016 4
symbols, minor modifications).
Updated Figure 9 on page 16 (replaced “Rfb” by
“Rovp”).

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24
 STCH02

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