EMI/EMC Testing of Automotive Components

Contents

• Basics of EMI / EMC

1

• EMI EMC Tests of Auto Electronics and Components

2

• Specification of Test Setups for EMI EMC Testing

3

• Conclusion
4

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 EMI/EMC

Electromagnetic Interference (EMI):

The process by which disruptive electromagnetic (EM) energy is transmitted from one
electrical/electronic device to another via radiated or conducted paths (or both).
Electromagnetic Compatibility (EMC):
The capability of electrical and electronic systems, equipment, and devices to operate in
their intended electromagnetic environment within a defined margin of safety and at
design levels or performance without suffering or causing unacceptable degradation as a
result of Electromagnetic Interference (EMI).

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 Sources of EMI

Sources of EMI can be broadly classified into:

A. Natural Causes:
Natural occurring phenomenon in the environment such as Lighting, Thunders, Solar
flares, Nebula, galaxies Collision etc., for which human don't have control.

B. Man-made Causes:
Man made causes can be classifies as Intentional and Unintentional.

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 Major Automotive EMC Standards

Standard Name of the Test Standard Name of the Test

CISPR 12 Radiated Emission ISO 11452-2 Radiated Immunity
(Protection of off board receivers) (Component Level)
CISPR 25 Radiated Emission & Conducted Emission ISO 11452-3 Transverse Electromagnetic Cell
(Protection of off board receivers) (TEM Cell)

ISO 11451-2 Radiated Immunity ISO 11452-4 Bulk Current Injection

(Vehicle Level) (Component Level)
ISO 11451-3 On-board Transmitter Simulation ISO 11452-5 Stripline (Component Level)
(Vehicle level)
ISO 11451-4 Bulk Current Injection ISO 11452-8 Immunity to magnetic fields
(Vehicle Level) (Component Level)
ISO 7637-2 Electrical transient conduction along ISO 16750-2 Environmental conditions and
supply lines only testing for electrical
(Component level) and electronic equipment

ISO 7637-3 Electrical transient transmission by

capacitive and inductive coupling via lines
other than supply lines
(Component level) 5
 Component Level EMI EMC Tests

 Radiated Emission Test

Radiated Immunity
Bulk Current Injection Regulatory Tests as per
AIS 004 Part 3
Conducted Transient Emission Test
Conducted Transient Immunity Test

Conducted Emission Test

Harmonic Current Emission Test
Flicker Voltage Emission Test Other Applicable tests
Electrostatic Discharge Immunity Test
Magnetic Emission & Immunity Test

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 Radiated Emission
Radiated Emission Test Setup Specifications

Standard / Parameter Specification

Setup
CISPR 25 Frequency 150 kHz to 2.5 GHz
(Upto 5.925 GHz as
per Ed. 2021)
AIS 004 Part 3 Frequency 30 MHz to 1 GHz
CISPR 25 / AIS Polarization Horizontal & Vertical
004 Part 3
Antenna 150 kHz to 30 MHz Monopole
Antenna 30 MHz to 300 MHz Biconical
Antenna 300 MHz to 1GHz Log-Periodic

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 Radiated Emission
Checklist of Test Setup:

Parameters Specifications
Total test Harness length < 2000 mm
Placement of Harness Low relative permittivity material (εr ≤ 1,4) with height (50 ± 5) mm
above the ground plane.
Length of test harness running parallel (1500 ± 75) mm
to Ground Plane
Ground Plane Height (900 ± 100) mm above floor
D.C resistance of Ground plane to < 2.5 mΩ
Wall/Floor of Shielded Enclosure
Distance between edge of ground strap ≤ 300 mm
to next edge
L:W of Ground Strap 7:1
LISN Specs 5 µH/50 Ω
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 Radiated Immunity
Radiated Immunity Test Setup – ISO 11452-2 Specifications

Standard Parameter Specification

ISO 11452-2 Frequency 80 MHz to 18 GHz

AIS 004 Part 3 Frequency 20 MHz to 2 GHz

ISO 11452-2 Polarization Horizontal (> 400 MHz)

Vertical (> 20 MHz)

AIS 004 Part 3 Polarization Vertical (20 MHz to 2 GHz)

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 Radiated Immunity
Checklist of Test Setup
Parameters Specifications
Total test Harness length < 2000 mm
Placement of Harness Low relative permittivity material (εr ≤ 1,4) with height (50 ± 5) mm
above the ground plane.
Length of test harness running parallel (1500 ± 75) mm
to Ground Plane
Ground Plane Height (900 ± 100) mm above floor
D.C resistance of Ground plane to < 2.5 mΩ
Wall/Floor of Shielded Enclosure
Distance between edge of ground strap ≤ 300 mm
to next edge
L:W of Ground Strap 7:1
Minimum length & width of Ground 2000 mm x 1000 mm
plane (Lmin x Wmin)
LISN Specs 5 µH/50 Ω
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 Bulk Current Injection
Bulk Current Injection Test Setup – Substitution Method
Standard : ISO 11452-4:2011

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 Bulk Current Injection
Bulk Current Injection Test Setup – Closed Loop Method with power limitation
Standard: ISO 11452-4:2011

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 Bulk Current Injection
Checklist of Test Setup
Parameters Specifications
Harness length b/w (DUT & Load) (1700 mm + 300 mm)- Substitution Method
(1000 mm + 200 mm) – Closed Loop with Power Limitation
Placement of Harness Low relative permittivity material (εr ≤ 1,4) with height (50 ± 5)
mm above the ground plane.
Length of test harness running (1400 ± 75) mm – Substitution method
parallel to Ground Plane Full length of harness - Closed Loop with Power limitation
Ground Plane Height (900 ± 100) mm above floor
D.C resistance of Ground plane to < 2.5 mΩ
Wall/Floor of Shielded Enclosure
Distance between edge of ground ≤ 300 mm
strap to next edge
L:W of Ground Strap 7:1
Minimum length & width of 1500 mm x 1000 mm – Closed Loop with Power limitation
Ground plane (Lmin x Wmin) 2000 mm x 1000 mm – Substitution Method
LISN Specs 5 µH/50 Ω 13
 Conducted Transient Emission Test

Conducted Transient Emission Test Setup – ISO 7637-2

Fig a. Test Setup for Slow Pulse Fig b. Test Setup for Fast Pulse

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 Conducted Transient Emission Test
Checklist for Test Setup
Parameters Specifications

Ambient Temperature (23 ± 5) °C

Supply Voltage for 12 V System (13.5 ± 0.5) V

Supply Voltage for 24 V System (27 ± 1) V

Wiring connections & Component spacing (50 ± 5) mm

from DUT
Placement of DUT Non Conductive Material with height (50 ± 5) mm
above the ground plane.

Artificial network L = 5 μH; C = 0,1 μF; R = 50 Ω.

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 Conducted Transient Immunity Test

Conducted Transient Immunity Test Setup – ISO 7637-2

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 Conducted Transient Immunity Test

Conducted Transient Immunity (ISO 7637-2)

1. Pulse 1
2. Pulse 2a
3. Pulse 2b
4. Pulse 3a
5. Pulse 3b
6. Pulse 4

Note : Until ISO 7637-2:2004, Pulse 5a and Pulse 5b was incorporated in the standard
and after the subsequent editions, these two pulses are placed in ISO 16750-2.

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 Conducted Transient Immunity Test

Parameters Specifications

Ambient Temperature (23 ± 5) °C

Supply Voltage for 12 V System (13.5 ± 0.5) V

Supply Voltage for 24 V System (27 ± 1) V

Harness Length for Pulse 3a & 3b (500 ± 100) mm

Placement of DUT Low relative permittivity material (εr ≤ 1,4) with

height (50 ± 5) mm above the ground plane.

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 Conducted Transient Immunity Test

Pulse 1: This test is a simulation of transients due to supply disconnection from

inductive loads.

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 Conducted Transient Immunity Test

Pulse 2a: This pulse simulates transients due to sudden interruption of currents in a
device connected in parallel with the DUT due to the inductance of the wiring
harness

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 Conducted Transient Immunity Test

Pulse 2b: This pulse simulates transients from DC motors acting as generators after
the ignition is switched off.

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 Conducted Transient Immunity Test

Pulse 3a: These test pulses are a simulation of transients, which occur as a result of
the switching processes.
The characteristics of these transients are influenced by distributed capacitance
and inductance of the wiring harness

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 Conducted Transient Immunity Test

Pulse 3b: These test pulses are a simulation of transients, which occur as a result of
the switching processes.
The characteristics of these transients are influenced by distributed capacitance
and inductance of the wiring harness

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 Conducted Transient Immunity Test

Pulse 4: This pulse simulates supply voltage reduction caused by energizing the starter-
motor circuits of internal combustion engines,excluding spikes associated with starting.

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 Conducted Emission Test

Conducted Emission Test Setup (Voltage Method)

Standard / Parameter Specification

Setup
CISPR 25 Frequency 150 kHz to 108 MHz
Length of wiring Length from LISN 200 +200
0 mm
Harness to Connector of
DUT

Reference Standard: CISPR 25 Ed. 3:2008

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 Conducted Emission Test

Conducted Emission Test Setup (Current Probe Method)

Standard / Parameter Specification

Setup

CISPR 25 Frequency 150 kHz to 108 MHz

Length of Length from LISN to 1700 +300

0 mm
wiring Connector of DUT
Harness
Position of Position is taken 5 cm & 75 cm
Current from Connector of
Probe the DUT

Reference Standards: CISPR 25 Ed. 3:2008

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 Electrostatic Discharge Immunity Test

Electrostatic Discharge Immunity Test Setup – ISO 10605

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 Harmonic Current Emission Test
Purpose of the Test:
 To measure the Harmonic current injected into public Power lines.
 Main Sources of Harmonic Currents are Rectifiers in Equipment like PC, TV etc.,

Test Supply Requirements:

 230 V for single phase 400 V for three phase with ± 2%
 Total Harmonic Distortion (THD) shall be less than 3%
 Frequency shall be 50 Hz ± 0.25 Hz

Test Requirements:
 Even & Odd harmonics upto 40th Harmonics to be measured.
 Limits as per AIS 004 Part 3, Rev 1, 2020 as referred in IEC 61000-3-2 & IEC 61000-3-11
 Class A Limits to be Chosen as per IEC 61000-3-2

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 Flicker Voltage Emission Test
Purpose of the Test:
To measure the voltage changes / fluctuations (Flicker) produced by the Device Under Test
(DUT).

Limits Specified under standard IEC 61000-3-3

 The value of Pst shall not be greater than 1.0

 The value of Plt shall not be greater than 0.65

 Tmax, the accumulated time value of d(t) with a deviation exceeding 3.3 % during a single
voltage change at the DUT terminals, shall not exceed 500 ms.

 The maximum relative steady state voltage change dc shall not exceed 3.3% and other
conditions as laid down in the standard.

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 Magnetic Field Immunity
Radiated Immunity Test Setup – ISO 11452-8
A. Radiating Loop method

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 Magnetic Field Immunity
Checklist of Test Setup
Parameters Specifications
Radiating Loop Diameter 120 mm
No. of turns 20
Diameter of Wire (Approximately) 2.0 mm
DUT size partitioning 100 mm x 100 mm to get exposure to field
Radiating loop distance from DUT 2000 mm
monitoring Equipment
Magnetic field generator At least 1 m
placement from metallic surfaces
Power supply As per ISO 11452-1
Placement of DUT Non-Conducting,Non ferromagnetic material (Eg. Wooden table)
Radiating loop Distance from DUT 50 mm from each face of DUT

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