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Memory Subsystem: This Chapter Describes The Memory Subsystem of The Device

Chapter 7 of the document details the memory subsystem of the device, focusing on the General-Purpose Memory Controller (GPMC) and its features, integration, and connectivity attributes. The GPMC supports various external memory types and provides a flexible programming model for interfacing with these devices. Additionally, it includes specifications for clock and reset management, as well as unsupported features of the GPMC module.

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0% found this document useful (0 votes)
7 views5 pages

Memory Subsystem: This Chapter Describes The Memory Subsystem of The Device

Chapter 7 of the document details the memory subsystem of the device, focusing on the General-Purpose Memory Controller (GPMC) and its features, integration, and connectivity attributes. The GPMC supports various external memory types and provides a flexible programming model for interfacing with these devices. Additionally, it includes specifications for clock and reset management, as well as unsupported features of the GPMC module.

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Chapter 7

SPRUH73H – October 2011 – Revised April 2013

Memory Subsystem

This chapter describes the memory subsystem of the device.

Topic ........................................................................................................................... Page

7.1 GPMC ............................................................................................................. 251


7.2 OCMC-RAM ..................................................................................................... 398
7.3 EMIF ............................................................................................................... 400
7.4 ELM ............................................................................................................... 476

250 Memory Subsystem SPRUH73H– October 2011 – Revised April 2013


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7.1 GPMC

7.1.1 Introduction
The general-purpose memory controller (GPMC) is an unified memory controller dedicated to interfacing
external memory devices:
• Asynchronous SRAM-like memories and application-specific integrated circuit (ASIC) devices
• Asynchronous, synchronous, and page mode (only available in non-multiplexed mode) burst NOR flash
devices
• NAND Flash
• Pseudo-SRAM devices

7.1.1.1 GPMC Features


The general features of the GPMC module include:
• Data path to external memory device can be 16- or 8-bit wide
• 32-bit OCPIP 2.0 compliant core, single slave interface. Support non-wrapping and wrapping burst up
to 16x32bits.
• Up to 100 MHz external memory clock performance (single device)
• Support for the following memory types:
– External asynchronous or synchronous 8-bit width memory or device (non burst device)
– External asynchronous or synchronous 16-bit width memory or device
– External 16-bit non-multiplexed NOR Flash device
– External 16-bit address and data multiplexed NOR Flash device
– External 8-bit and 16-bit NAND flash device
– External 16-bit pSRAM device
• Up to 16-bit ECC support for NAND flash using BCH code (t=4, 8 or 16) or Hamming code for 8-bit or
16-bit NAND-flash, organized with page size of 512 bytes, 1K bytes, or more.
• Support 512M Bytes maximum addressing capability which can be divided into seven independent
chip-select with programmable bank size and base address on 16M Bytes, 32M Bytes, 64M Bytes, or
128M Bytes boundary
• Fully pipelined operation for optimal memory bandwidth usage
• Support external device clock frequency of 1, 2, 3 and 4 divider from L3 clock.
• Support programmable auto-clock gating when there is no access.
• Support Midlereq/SidleAck protocol
• Support the following interface protocols when communicating with external memory or external
devices.
– Asynchronous read/write access
– Asynchronous read page access (4-8-16 Word16)
– Synchronous read/write access
– Synchronous read burst access without wrap capability (4-8-16 Word16)
– Synchronous read burst access with wrap capability (4-8-16 Word16)
• Address and Data multiplexed access
• Each chip-select as independent and programmable control signal timing parameters for Setup and
Hold time. Parameters are set according to the memory device timing parameters, with one L3 clock
cycle timing granularity.
• Flexible internal access time control (wait state) and flexible handshake mode using external WAIT
pins monitoring (up to two WAIT pins)
• Support bus keeping
• Support bus turn around

SPRUH73H – October 2011 – Revised April 2013 Memory Subsystem 251


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• Pre-fetch and write posting engine associated with system DMA to get full performance from NAND
device with minimum impact on NOR/SRAM concurrent access.
• On the fly ECC Hamming Code calculation to improve NAND usage reliability with minimum impact on
SW

7.1.1.2 Block Diagram


The GPMC can access various external devices through the L3 Slow Interconnect. The flexible
programming model allows a wide range of attached device types and access schemes. Based on the
programmed configuration bit fields stored in the GPMC registers, the GPMC is able to generate all
control signals timing depending on the attached device and access type. Given the chip-select decoding
and its associated configuration registers, the GPMC selects the appropriate device type control signals
timing.
Figure 7-1 shows the GPMC functional block diagram. The GPMC consists of six blocks:
• Interconnect port interface
• Address decoder, GPMC configuration, and chip-select configuration register file
• Access engine
• Prefetch and write-posting engine
• Error correction code engine (ECC)
• External device/memory port interface

252 Memory Subsystem SPRUH73H– October 2011 – Revised April 2013


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Figure 7-1. GPMC Block Diagram

Interconnect port interface

Address

GPMC Address decoder


Data configuration

Chip-select
configuration CS selection Address

Access engine

FIFO

Data Address
Prefetch and write-
posting engine

Control

ECC

NAND access only

External memory port interface

7.1.1.3 Unsupported GPMC Features


The following module features are not supported in this device.

Table 7-1. Unsupported GPMC Features


Feature Reason
Chip Select 7 Not pinned out
32-bit devices Only 16 data lines pinned out
WAIT[3:2] Not pinned out. All CS regions must use WAIT0 or WAIT1

SPRUH73H – October 2011 – Revised April 2013 Memory Subsystem 253


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7.1.2 Integration
An instantiation of GPMC provides this device with access to NAND Flash, NOR Flash, and other
asynchronous and synchronous interface peripherals. Figure 7-2 shows the integration of the GPMC
module in this device.

Figure 7-2. GPMC Integration

Device GPMC CLKRET GPMC Pads


L3 Slow CLK GPMC_CLK
Interconnect ADD[27:11] GPMC_A[27:11]
ADD[10:0] GPMC_A[10:0]
DATA[15:0] GPMC_AD[15:0]
MPU Subsystem SINTERRUPT CSn[6:0] GPMC_CSn[6:0]
ADVn/ALE GPMC_ADVn_ALE
EDMA SDMAREQ_N OEn/REn GPMC_OEn_REn
WEn GPMC_WEn
Module
Control

BE0n/CLE GPMC_BEN0_CLE
BE1n GPMC_BEN1
WPn GPMC_WPn
CONTROL_STATUS

SYSBOOT[11]
LCD_DATA11 WAIT[1:0] GPMC_WAIT[1:0]
SYSBOOT[10] ADMUX
LCD_DATA10 CS0MuxDevice[1:0] DIR2 GPMC_DIR
SYSBOOT[8] BW BootDeviceSize0
LCD_DATA8 WAITEN
SYSBOOT[9] BootWaitEn DATA[31:16]
LCD_DATA9
WaitSelectPin[1:0] CS[7]
BootDeviceSize1 WAIT[3:2]

7.1.2.1 GPMC Connectivity Attributes


The general connectivity attributes for the GPMC module are shown in Table 7-2.

Table 7-2. GPMC Connectivity Attributes


Attributes Type
Power Domain Peripheral Domain
Clock Domain PD_PER_L3S_GCLK
Reset Signals PER_DOM_RST_N
Idle/Wakeup Signals Smart Idle
Interrupt Requests 1 interrupt to MPU Subsystem (GPMCINT)
DMA Requests 1 DMA request to EDMA (GPMCEVT)
Physical Address L3 Slow Slave Port
Memory and control register regions qualified with
MAddressSpace bit

7.1.2.2 GPMC Clock and Reset Management


The GPMC is a synchronous design and operates from the same clock as the Slow L3. All timings use
this clock as a reference.

Table 7-3. GPMC Clock Signals


Clock Signal Max Freq Reference / Source Comments
prcm_gpmc_clk 100 MHz CORE_CLKOUTM4 / 2 pd_per_l3s_gclk
Interface / Functional clock From PRCM

254 Memory Subsystem SPRUH73H– October 2011 – Revised April 2013


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