WS483

SAC305
Water Soluble Solder Paste

Features:
- 48 Hour Stencil Life - Excellent Printing Characteristics - Extended Cleaning Window
- Excellent Activity - Slump Resistant - High-Humidity Resistant
- 24 Hour Tack Time - Good for Batch or Continuous Runs - Will Not Foam During Wash

Description:
WS483 is a halogen- and halide-free organically activated formulation. WS483 offers improved heat and
humidity resistance, while maintaining high tack and resistance to slump. WS483 also provides an
exceptional post-process cleaning window and will not foam during the cleaning process, even in high-
pressure wash systems.

Printing:
- Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of
12 to 16 mm (½ to ⅝ inch) is normally sufficient to begin).
- Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry
and workable properties.
- WS483 provides the necessary tack time and force for today’s high speed placement equipment, which
will enhance product performance and reliability.
RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN
PARAMETER RECOMMENDED INITIAL SETTINGS PARAMETER RECOMMENDED INITIAL SETTINGS
Squeegee Pressure 0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade PCB Separation Distance 0.75-2.0 mm (.030-.080”)
Squeegee Speed 12-150 mm/sec (.5-6”/sec) PCB Separation Speed Slow
Snap-off Distance On Contact 0.00 mm (0.00”)

Reflow Profile:
Two unique profile families are depicted below; both can be used in ramp-spike or ramp-soak-spike applications, and
they each have similar reflow temperatures. The two profiles differ in where they reach their respective peak
temperatures, as well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller
assemblies, whereas the longer profile would apply to larger assemblies, such as backplanes or high-density boards.
The shaded area defines the process window. Oven efficiency, board size/mass, component type and density all
influence the final profile for a given assembly. These profiles are starting points, and processing boards with thermal-
couples attached is recommended to optimize the process.
 RATE OF RAMP PROGRESS TO PEAK TIME ABOVE COOLDOWN PROFILE
RISE 2°C / TO THROUGH TEMP 230°C- 217°C (425°F) ≤ 4 °C / SEC LENGTH
SEC MAX 150°C 150°C-175°C 245°C (445°F- AMBIENT
(302°F) (302°F-347°F) 474°F) TO COOL
DOWN
Short Profiles ≤ 75 Sec 30-60 Sec 45-75 Sec 30-60 Sec 45± 15 Sec 2.75-3.5 Min
Long Profiles ≤ 90 Sec 60-90 Sec 45-75 Sec 60-90 Sec 45± 15 Sec 4.5-5.0 Min
 THE RECOMMENDED REFLOW PROFILE FOR WS488 IS PROVIDED AS A GUIDELINE. OPTIMAL PROFILE MAY DIFFER DUE TO OVEN TYPE, ASSEMBLY
LAYOUT, OR OTHER PROCESS VARIABLES. CONTACT AIM TECHNICAL SUPPORT IF YOU REQUIRE ADDITIONAL PROFILING ASSISTANCE.
 THE REFLOW PROFILE FOR THE SAC305 PASTES USING A VAPOR PHASE REFLOW OVEN: PEAK TEMPERATURE RANGE I S 230°C – 245°C.

Cleaning:
WS483 can be cleaned easily with normal tap water. Deionized water is recommended for the final rinse. A
temperature of 38°C (100°F) - 66°C (150°F) is sufficient for removing residues. An in-line or other
pressurized spray cleaning system is suggested, but is not required.

Handling and Storage:

- WS483 has a refrigerated shelf life of 6 months at 4°C (40°F) - 12°C (55°F).
- Allow the solder paste to warm naturally to ambient temperature (8 hrs.) prior to breaking the seal for use.
- Mix the product lightly and thoroughly for 1 to 2 minutes to ensure even distribution of any separated
material.
- Do not store new and used paste in the same container, and reseal any opened containers while not in use.
- Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal.

Safety:
- Use with adequate ventilation and proper personal protective equipment.
- Refer to the accompanying Material Safety Data Sheet for any specific emergency information.
- Do not dispose of any lead-containing materials in non-approved containers.

Physical Properties:

ITEM SPECIFICATION

Appearance Gray, Smooth, Creamy

Alloy SAC305

Melting Point 217°C

Particle Size T3, T4, T5

Viscosity Print/Dispense

Packaging Available in all industry standard packaging.

 Test Data Summary:
CLASSIFICATION
Product
IPC Classification to J-STD-004 Copper Mirror to J-STD-004 Silver Chromate to J-STD-004
Name
WS483 ORM0 Low Pass
POWDER TESTING
No. Item Results Test Method
Type 3 – 45-25 micron
1 Powder Size J-STD-004 IPC TM 650 2.2.14
Type 4 – 38-20 micron
2 Powder Shape Spherical Microscope
FLUX MEDIUM TESTING
No. Item Results Test Method
1 Acid Value 150.02 mg KOH/g Flux J-STD-004 IPC TM 650 2.3.13
2 Fluorides Spot Test No Fluoride J-STD-004 IPC TM 650 2.3.35.1
3 Corrosivity Test/ Copper Mirror Low J-STD-004 IPC TM 650 2.3.32
4 Halide-Free/Silver Chromate Paper Test Pass J-STD-004 IPC TM 650 2.3.33
Control coupons > 1E9Ω at 96 & 168 h. - Pass
Surface Insulation Resistance Sample coupons > 1E8Ω at 96 & 168 h. - Pass
7 J-STD-004 IPC TM 650 2.6.3.3
Post-test visual inspection > No dendrite growth or
corrosion - Pass
8 Compatibility Test See list of recommended products above GR-78-CORE
VISCOSITY TESTING
No. Item Results Test Method
1 T-Bar Spindle Test Method 900 ± 10% kcps J-STD-005 IPC TM 650 2.4.34
SOLDER PASTE TESTING
No. Item Results Test Method
1 Tack Test 30.5 gf J-STD-005 IPC TM 650 2.4.44
2 Tack Test 82.8 gf JIS Z 3284 Annex 9
3 Solder Ball Test Pass J-STD-005 IPC TM 650 2.4.43
4 Wetting Test Pass J-STD-005 IPC TM 650 2.4.45
5 Paste Shelf Life 4°C (40°F) – 12°C (55°F) = 6 months AIM TM 125-11
6 Solder Paste Slump Test Pass J-STD-005 IPC TM 650 2.4.35

Canada +1-514-494-2000 · USA +1-401-463-5605 · Mexico +52-656-630-0032 · Europe +44-1737-222-258

Asia-Pacific +86-755-2993-6487 · India +91-80-41554753 · [email protected] · www.aimsolder.com
AIM IS ISO9001:2008 & ISO14001:2004 CERTIFIED

The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the assumption of
proper handling and operating conditions. All information pertaining to solder paste is produced with 45-micron powder. Liability is expressly
disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Please refer to
http://www.aimsolder.com/Home/TermsConditions.aspx to review AIM's terms and conditions.
05/15
Document Rev # 4