EClamp2378P

ESD/EMI Protection
for Color LCD Interfaces
PROTECTION PRODUCTS - EMIClampTM PRELIMINARY
Description Features
The EClampTM2378P is a low pass filter array with ‹ Bidirectional EMI/RFI filter with integrated TVS
integrated TVS diodes. It is designed to suppress for ESD protection
unwanted EMI/RFI signals and provide electrostatic
‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,
discharge (ESD) protection in portable electronic
±15kV (air), ±8kV (contact)
equipment. This state-of-the-art device utilizes solid-
‹ Filter performance: 30dB minimum attenuation
state silicon-avalanche technology for superior clamp-
1.8GHz to 2.5GHz
ing performance and DC electrical characteristics.
They have been optimized for protection of color ‹ TVS working voltage: 5V
LCD panels in cellular phones and other portable ‹ Resistor: 100Ω +/− 15%
electronics. ‹ Typical Capacitance: 20pF (VR = 0V)
‹ Protection and filtering for eight lines
The device consists of eight identical circuits comprised ‹ Solid-state technology
of TVS diodes for ESD protection, and a resistor -
capacitor network for EMI/RFI filtering. A series
Mechanical Characteristics
resistor value of 100Ω and a capacitance value of ‹ SLP4016P16 16-pin package
10pF are used to achieve 30dB minimum attenuation ‹ RoHS/WEEE Compliant
from 1.8GHz to 2.5GHz. The TVS diodes provide ‹ Nominal Dimensions: 4.0 x 1.6 x 0.58 mm
effective suppression of ESD voltages in excess of ‹ Lead Pitch: 0.5mm
±15kV (air discharge) and ±8kV (contact discharge) per
‹ Lead finish: NiPd
IEC 61000-4-2, level 4.
‹ Marking : Marking Code
The EClamp2378P is in a 16-pin, RoHS/WEEE compli- ‹ Packaging : Tape and Reel per EIA 481
ant, SLP4016P16 package. It measures 4.0 x 1.6 x Applications
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack- ‹ Color LCD Protection
age makes it ideal for use in portable electronics such ‹ Cell Phone CCD Camera Lines
as cell phones, digital still cameras, and PDAs. ‹ Clamshell Cell Phones

Circuit Diagram (Each Line) Package Configuration

4.00
1 2
100 Ω
IN OUT
1.60
10pF 10pF

0.50 BSC
GND

0.58

Device Schematic (8X) 16 Pin SLP package (Bottom Side View)

Nominal Dimensions in mm

Revision 12/6/2005 1 www.semtech.com

 EClamp2378P

PROTECTION PRODUCTS PRELIMINARY

Maximum Ratings
R ating Symbol Value Units

ESD p er IEC 61000-4-2 (Air) +/- 17

VESD kV
ESD p er IEC 61000-4-2 (Contact) +/- 12

Junction Temp erature TJ 125 o

C

Op erating Temp erature Top -40 to +85 o

C

Storage Temp erature TSTG -55 to +150 o

C

Electrical Characteristics (T = 25oC)

P a r a met er Symb ol C on d i t i on s Mi n i mu m Ty p i c a l M a xi m u m Un i ts

T VS Reverse Stand-Of f Voltage VRWM 5 V

T VS Reverse Breakdown Voltage VBR It = 1mA 6 8 10 V

T VS Reverse Leakage Current IR VRWM = 3.0V 0.5 µA

Total Series Resistance R Each Line 85 100 115 Ohms

Total Capacitance C in Input to Gnd, 16 20 24 pF

Each Line
VR = 0V, f = 1MHz

Total Capacitance C in Input to Gnd, 9 11 13 pF

Each Line
VR = 2.5V, f = 1MHz

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PROTECTION PRODUCTS PRELIMINARY

Typical Characteristics
Typical Insertion Loss S21 (Each Line) Analog Crosstalk (Each Line)
CH1 S21 LOG 6 dB / REF 0 dB
CH1 S21 LOG 20 dB /REF 0 dB
1: -9.1473 dB
297.671 MHz

2: -19.559 dB
0 dB 900 MHz

-6 dB 3: -30.645 dB
1.8 GHz
1
-12 dB 4: -34.705 dB
2.5 GHz
-18 dB
2

-24 dB

-30 dB
3 4

-36 dB

-42 dB

-48 dB
1 10 100 1 3 START. 030 MHz STOP 3000. 000000 MHz
MHz MHz MHz GHz GHz

START. 030 MHz STOP 3000. 000000 MHz

ESD Clamping (+8kV Contact) ESD Clamping (-8kV Contact)

Capacitance vs. Reverse Voltage

(Normalized to 0 volts)
1.1

0.9

0.8
CJ(VR) / CJ(VR=0)

0.7

0.6

0.5

0.4

0.3

0.2

0.1
f = 1 MHz
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

Reverse Voltage - VR (V)

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PROTECTION PRODUCTS PRELIMINARY

Applications Information
Device Connection Figure 1 - Pin Identification and Configuration
The EClamp2378P is comprised of eight identical (Top Side View)
circuits each consisting of a low pass filter for EMI/RFI
suppression and dual TVS diodes for ESD protection. In 1 1 16
Out 1
The device is in a 16-pin SLP package. Electrical
In 2 Out 2
connection is made to the 16 pins located at the
bottom of the device. A center tab serves as the In 3 Out 3
ground connection. The device has a flow through In 4 Gnd Out 4
design for easy layout. Pin connections are noted in In 5 Out 5
Figure 1. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance In 6 Out 6
in the board traces. Recommendations for the ground In 7 Out 7
connection are given below. In 8 8 9 Out 8

Ground Connection Recommendation

Pin Identification
Parasitic inductance present in the board layout will
affect the filtering performance of the device. As 1-8 Inp ut Lines
frequency increases, the effect of the inductance
becomes more dominant. This effect is given by 9 - 16 Outp ut Lines
Equation 1.
Center Tab Ground
Equation 1: The Impedance of an Inductor at
Frequency XLF
Figure 2 - Inductance of Rectangular Wire Loops
XLF( L, f ) = 2 * π * f * L
Ground Ground
Where: Via 1 Via 2
L= Inductance (H)
f = Frequency (Hz)
d Signal Layer
x
Via connections to the ground plane form rectangular
wire loops or ground loop inductance as shown in
Figure 2. Ground loop inductance can be reduced by
using multiple vias to make the connection to the Ground Layer
y
ground plane. Bringing the ground plane closer to the Layer
signal layer (preferably the next layer) also reduces
ground loop inductance. Multiple vias in the device
Equation 2: Inductance of Rectangular Wire Loop
ground pad will result in a lower inductive ground loop
over two exterior vias. Vias with a diameter d are
separated by a distance y run between layers sepa- LRECT(d, x , y) = 10.16 *10 −9 * x * ln [ [ ] + y * ln[ ]]
2*y
d
2*x
d
rated by a distance x. The inductance of the loop path
is given by Equation 2. Thus, decreasing distance x Where:
and y will reduce the loop inductance and result in d = Diameter of the wire (in)
better high frequency filter characteristics. x = Length of wire loop (in)
y = Breath of wire loop (in)

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PROTECTION PRODUCTS PRELIMINARY

Applications Information
Figure 3 shows the recommended device layout. The Figure 4 - Filter Characteristics Using Recommended
ground pad vias have a diameter of 0.008 inches Layout with Internal Vias
(0.20 mm) while the two external vias have a diameter
of 0.010 inches (0.250mm). The internal vias are CH1 S21 LOG 6 dB / REF 0 dB

spaced approximately evenly from the center of the 1: -9.1473 dB

297.671 MHz
pad. The designer may choose to use more vias with a 2: -19.559 dB
smaller diameter (such as 0.005 inches or 0.125mm) 0 dB 900 MHz

since changing the diameter of the via will result in -6 dB 3: -30.645 dB

1.8 GHz
little change in inductance (i.e. the log function in -12 dB
1

4: -34.705 dB
Equation 2 in highly insensitive to parameter d) . -18 dB
2.5 GHz

Figure 4 shows a typical insertion loss (S21) plot for 2

-24 dB
the device using Semtech’s filter evaluation board with
50 Ohm traces and the recommended via configura- -30 dB
3 4

tion. Figure 5 shows a typical insertion loss (S21) plot -36 dB

using a similar board without the internal ground pad -42 dB

vias. The result is a more inductive ground loop. Note -48 dB
1 10 100 1 3
the “hump” at a frequency of 2.5GHz. This is the MHz MHz MHz GHz GHz
resonant frequency of the higher ground loop induc- START . 030 MHz STOP 3000. 000000 MHz

tance.

Figure 3 - Recommended Layout Using Ground Vias Figure 5 - Filter Characteristics Using Layout without
Internal Ground Vias

CH1 S21 LOG 6 dB / REF 0 dB

1: -8.9400 dB
288.002 MHz

2: -20.032 dB
900 MHz

3: -23.761 dB
1.8 GHz
0 dB 4: -16.085 dB
2.5 GHz
-6 dB
1
-12 dB 4

-18 dB
2

-24 dB
3

-30 dB

-36 dB
1 10 100 1 3
MHz MHz MHz GHz GHz

START . 030 MHz STOP 3000. 000000 MHz

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PROTECTION PRODUCTS PRELIMINARY

Applications Information - Spice Model

Line In 1.4nH 1.4nH Line Out

Figure 1 - EClamp2378P Spice Model

Table 1 - EClamp2378P Spice Parameters

Parameter Unit D1 (T VS) D2 (T VS)

IS Amp 2E-15 2E-15

BV Volt 7.42 7.42

VJ Volt 0.775 0.775

RS Ohm 1.00 1.00

IB V Amp 1E-3 1E-3

CJO Farad 9.8E-12 9.8E-12

TT sec 2.541E-9 2.541E-9

M -- 0.246 0.246

N -- 1.1 1.1

EG eV 1.11 1.11

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 EClamp2378P

PROTECTION PRODUCTS PRELIMINARY

Outline Drawing - SLP4016P16

A D B
DIMENSIONS
INCHES MILLIMETERS
DIM
MIN NOM MAX MIN NOM MAX
E A .020 .023 .026 0.50 0.58 0.65
PIN 1 A1 .000 .001 .002 0.00 .003 0.05
INDICATOR (.005) (0.13)
(LASER MARK) A2
b .007 .010 .012 0.20 0.25 0.30
D .153 .157 .161 3.90 4.00 4.10
D1 .122 .126 .130 3.10 3.20 3.30
E .059 .063 .067 1.50 1.60 1.70
A SEATING E1 .010 .016 .020 0.25 0.40 0.50
aaa C PLANE e .020 BSC 0.50 BSC
L .011 .013 .015 0.28 0.33 0.38
A2 A1 C N 16 16
aaa .003 0.08
D1 bbb .004 0.10
1 2
LxN
E/2
E1

N
bxN
e bbb C A B
D/2

NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.

Land Pattern - SLP4016P16

P
X
DIMENSIONS
DIM INCHES MILLIMETERS
B .130 3.30
C .060 1.52
(C) F .018 0.45
Z G F G .035 0.89
P .020 0.50
X .012 0.30
Y Y .025 0.63
Z .085 2.15

NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET

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PROTECTION PRODUCTS PRELIMINARY

Marking Ordering Information
Qty per
Part Number R eel Size
Reel

PIN 1
INDICATOR
2378P EClamp 2378P.TCT 3000 7 Inch

(LASER MARK) EMIClamp and EClamp are marks of Semtech Corporation

Tape and Reel Specification

Pin 1 Location

User Direction of feed

Device Orientation in Tape

A0 B0 K0

1.78 +/-0.10 mm 4.30 +/-0.10 mm 0.74 +/-0.10 mm

Tape K
B, (Max) D D1 E F P P0 P2 T(MAX) W
Width (MAX)

1.5 + 0.1 mm 1.750±.10 4.0±0.1 4.0±0.1 12.0 mm

1.0 mm 5.5±0.05 2.0±0.05m-
8.2 mm - 0.0 mm mm 4.5 mm mm mm 0.4 mm + 0.3 mm
12 mm ±0.05 mm m
(.476) (0.59 +.005 (.069±.004) (.177) (.157±.00- (.157±.00- (.016) - 0.1 mm
(.039) (.217±.002) (.079±.002)
- .000) 4) 4) (.472±.012)

Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804

 2005 Semtech Corp. 8 www.semtech.com