BONDJET BJ820

USER MANUAL

© 2013 Hesse GmbH

 Document information

USER MANUAL
FINE WIRE BONDER

Machine name: BONDJET BJ820

Machine number: BJ820-____

Machine type: Ultrasonic Wedge-Wedge Bonder

Documentation: Version Jan. 2013

Translation of Original Documentation

Software version: 3.77

© 2013 Hesse GmbH

This document contains proprietary information which is protected by copyright. No part of this
document may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying, recording, or by any information storage retrieval
system, or translated into another language, without prior written consent of Hesse GmbH.
The information in this document is subject to change without notice. Hesse GmbH no
warranty of any kind with regard to this material, including, but not limited to, the implied
warranties of merchantability and fitness for a particular purpose.
Hesse GmbH shall not be liable for errors contained herein nor for incidental or consequential
damages in connection with the furnishing, performance or use of this material.
 TABLE OF CONTENTS
CHAPTER0

1 Bondjet BJ820
1.1 Introduction ............................................................................... 1-1
1.2 Technical Capability: ................................................................. 1-1
1.3 Machine Assembly .................................................................... 1-3
1.3.1 Axes System ........................................................................................... 1-3
1.4 Bondhead 45° ........................................................................... 1-4
1.5 Bondhead 89° (Deep Access) .................................................. 1-5
1.6 Process integrated Quality Control = PiQC (Option) ................ 1-6
1.7 Wire Despooling Station ........................................................... 1-6
1.8 Optics ........................................................................................ 1-7
1.8.1 Bondhead Camera .................................................................................. 1-7
1.8.2 Inspection Camera (optional) .................................................................. 1-7
1.8.3 Camera for Bond Position Control (optional) .......................................... 1-8
1.8.4 Microscope (optional) ............................................................................. 1-8
1.9 User Interface Devices ............................................................. 1-8
1.9.1 Operation Panel ...................................................................................... 1-8
1.9.2 Monitor .................................................................................................... 1-9
1.9.3 Keypad .................................................................................................. 1-10
1.9.4 Trackball ............................................................................................... 1-11
1.9.5 Keyboard .............................................................................................. 1-11
1.9.6 User interface ....................................................................................... 1-12
1.9.7 Main Switch .......................................................................................... 1-12
1.10 Safety Equipement ................................................................. 1-12
1.10.1 Safety Circuit ........................................................................................ 1-12
1.10.2 Safety Circuit Switch ............................................................................. 1-13
1.10.3 Safety Cover ......................................................................................... 1-13
1.10.4 Keyswitch for Adjustment Mode ........................................................... 1-14
1.10.5 E-Stop Switch ....................................................................................... 1-14
1.10.6 ESD-Bonding point ............................................................................... 1-15
1.10.7 Signal Lamps ........................................................................................ 1-15
1.11 Connections ............................................................................ 1-16
1.11.1 External Connections ............................................................................ 1-16
1.11.2 Internal Connections ............................................................................. 1-17
1.12 Heat shield box and air blower (option) .................................. 1-17

2 User Manual
2.1 Using this Manual ..................................................................... 2-1
2.2 Summery of contents ................................................................ 2-1
2.2.1 Remarks and Symbols ............................................................................ 2-2
2.2.2 Typographical Styles used in this Manual .............................................. 2-2

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2.3 Customer Contact ..................................................................... 2-3

3 Safety
3.1 General Safety Instructions ...................................................... 3-1
3.2 Personal Qualification ............................................................... 3-1
3.3 Safety Devices .......................................................................... 3-2
3.4 Electrical Installation Safety ...................................................... 3-2
3.5 Warning Signs and Notices on the BJ820 ................................ 3-3
3.6 Basic Intended Use ................................................................... 3-5
3.7 Remarks on Protection of Rights .............................................. 3-5
3.8 Conformity Statement According to Directive
2006/42/ EG EG ....................................................................... 3-7

4 Transport and Storage

4.1 Transport .................................................................................. 4-1
4.1.1 Special Safety Warnings ......................................................................... 4-1
4.1.2 Transport Requirements ......................................................................... 4-1
4.1.3 Transport Locks ...................................................................................... 4-1
4.1.4 Packaging ............................................................................................... 4-3
4.1.5 Lifting Points for Lifting Equipment ......................................................... 4-5
4.1.6 Transport Monitoring ............................................................................... 4-6
4.2 Storage ..................................................................................... 4-7
4.3 Delivery Contents ..................................................................... 4-8

5 Installation and Setup

5.1 Required Floor Space ............................................................... 5-1
5.1.1 Environmental Influences ....................................................................... 5-1
5.2 Assembly .................................................................................. 5-1
5.3 Alignment .................................................................................. 5-3
5.4 Energy Requirements: Type, Amount and Quality ................... 5-3
5.5 Power Up .................................................................................. 5-3
5.6 System Start-up ........................................................................ 5-5
5.7 Buy-Off Procedure .................................................................... 5-7

6 Mechanical Settings
6.1 Overview ................................................................................... 6-1
6.2 Buy-Off Procedure .................................................................... 6-2
6.3 Settings to 45° Bondhead ......................................................... 6-2
6.3.1 Setting the Clamp Position ..................................................................... 6-8
6.3.2 Setting the Wire Feed ........................................................................... 6-10
6.3.3 Setting the Clamp Force ....................................................................... 6-10
6.3.4 Adjustment of the Wire Clamp Opening Gap ........................................ 6-11

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6.3.5 Setup Wire ............................................................................................ 6-13
6.3.6 Changing the Wedge ............................................................................ 6-15
6.4 Settings on the DA Bondhead ................................................ 6-16
6.4.1 Setting the Distance from the Clamp Blade to Wedge ......................... 6-16
6.4.2 Setting the Height of the Clamp Blade .................................................. 6-18
6.4.3 Setting the Angle of the Clamp Blade ................................................... 6-18
6.4.4 Setting of the Alignment of the Clamp Blade to the Wedge Tool .......... 6-19
6.4.5 Threading Position of the Clamp Blade ................................................ 6-20
6.4.6 Setting the Wire Clamp Opening .......................................................... 6-20
6.4.7 Setting the Clamp Force ....................................................................... 6-21
6.4.8 Exchanging the Wedge ......................................................................... 6-22
6.4.9 Threading .............................................................................................. 6-22
6.4.10 Wire feed for Ribbon ............................................................................. 6-23

7 User interface
7.1 Login to the System .................................................................. 7-1
7.1.1 Smart Login ............................................................................................ 7-1
7.2 User Authorization .................................................................... 7-2
7.3 Monitor Layout .......................................................................... 7-3
7.3.1 Menu Bar ................................................................................................ 7-4
7.3.2 Axis Positions ......................................................................................... 7-4
7.3.3 Logout, Switching off .............................................................................. 7-4
7.3.4 Navigation Bar ........................................................................................ 7-5
7.3.5 Program Window .................................................................................... 7-5
7.3.6 Information Bar ....................................................................................... 7-5
7.3.7 Other Displays ........................................................................................ 7-5
7.4 General Operation .................................................................... 7-6
7.5 General Functions .................................................................... 7-9
7.5.1 Referencing ............................................................................................ 7-9
7.5.2 Threading ................................................................................................ 7-9
7.5.3 Offbond ................................................................................................. 7-10
7.5.4 Move to Start Position ........................................................................... 7-11
7.5.5 Move to Park Position ........................................................................... 7-11
7.5.6 Index Step ............................................................................................. 7-11
7.5.7 Markings ............................................................................................... 7-11
7.5.8 View ...................................................................................................... 7-12
7.5.9 Factors .................................................................................................. 7-14
7.6 Logout ..................................................................................... 7-15
7.6.1 Logout ................................................................................................... 7-15
7.6.2 Shutdown .............................................................................................. 7-15
7.7 Operation of Key Combinations .............................................. 7-16
7.8 Add-on for Software-Update 3.77 ........................................... 7-19
7.8.1 Referring to Chapter 7.4 “General Operation” ..................................... 7-19
7.8.2 Referring to Chapter 7.5.8 “View” ........................................................ 7-19

8 Calibration

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8.1 Group Calibrations .................................................................... 8-2
8.1.1 Bondhead (1) .......................................................................................... 8-2
8.1.2 Camera (2) .............................................................................................. 8-2
8.1.3 Sensor (3) ............................................................................................... 8-8
8.1.4 Bondforce (4) .......................................................................................... 8-8
8.1.5 Ultrasonic Generator (5) ....................................................................... 8-11
8.1.6 Wedge (6) ............................................................................................. 8-12
8.1.7 P Axis (7) .............................................................................................. 8-16
8.2 Group Wire Handling .............................................................. 8-19
8.2.1 Wire (1) ................................................................................................. 8-20
8.2.2 Wire Clamp (2) ...................................................................................... 8-22
8.2.3 Offbond (3) ............................................................................................ 8-24
8.2.4 E Box (4) ............................................................................................... 8-26
8.3 Group Holder .......................................................................... 8-28
8.4 Group Quality .......................................................................... 8-39
8.4.1 Counter (1) ............................................................................................ 8-39
8.4.2 Deformation (2) / Current (3) ................................................................ 8-40
8.5 Add-on for Software-Update 3.77 ........................................... 8-42
8.5.1 Referring to Chapter 8.2 “Group Wire Handling” -
new function „Tool cleaning“ .................................................................. 8-42
8.5.2 Referring to Chapter 8.2.3 “Offbond (3)” .............................................. 8-44
8.5.3 Referring to Chapter 8.2.4 “E Box (4)” ................................................. 8-45

9 Programming
9.1 Introduction ............................................................................... 9-1
9.2 Program Administration ............................................................ 9-1
9.2.1 Create New Program .............................................................................. 9-1
9.2.2 Load Program ......................................................................................... 9-2
9.2.3 Save Program ......................................................................................... 9-4
9.2.4 Program Directory ................................................................................... 9-5
9.2.5 Program Information ............................................................................... 9-5
9.2.6 Compare Program .................................................................................. 9-6
9.3 Program Settings ...................................................................... 9-7
9.3.1 Default Settings .................................................................................... 9-11
9.4 Teach Reference System ....................................................... 9-11
9.4.1 General ................................................................................................. 9-11
9.4.2 Teach Order .......................................................................................... 9-12
9.4.3 Auto Functions ...................................................................................... 9-14
9.4.4 Teach Manual Points ............................................................................ 9-15
9.4.5 Teach Automatic Pattern ...................................................................... 9-17
9.4.6 Edit Reference Systems ....................................................................... 9-20
9.4.7 Pattern Recognition .............................................................................. 9-20
9.4.8 Reference System Dependency ........................................................... 9-21
9.4.9 Chip Reference Point ............................................................................ 9-22
9.4.10 Badmark Recognition ........................................................................... 9-22
9.4.11 Reference System Parameters ............................................................. 9-25
9.5 Teach Boards ......................................................................... 9-30

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9.6 Teach Wire ............................................................................. 9-33
9.6.1 Teach Order .......................................................................................... 9-33
9.6.2 Auto Functions ...................................................................................... 9-34
9.6.3 Create Wire ........................................................................................... 9-35
9.6.4 Wire Functions ...................................................................................... 9-36
9.6.5 Edit Wires ............................................................................................. 9-37
9.6.6 Edit Series of Wires .............................................................................. 9-42
9.6.7 Wire Parameters ................................................................................... 9-44
9.7 Program Bonding .................................................................... 9-45
9.7.1 Auto Functions ...................................................................................... 9-46
9.7.2 Adjustment ............................................................................................ 9-46
9.7.3 Measure Height .................................................................................... 9-46
9.7.4 Bonding ................................................................................................. 9-46
9.7.5 Step By Step Mode ............................................................................... 9-48
9.7.6 Parameters ........................................................................................... 9-48
9.7.7 Bond Plan ............................................................................................. 9-49
9.8 Bond Position Control (Optional) ............................................ 9-51
9.9 Bond Charts ............................................................................ 9-52
9.9.1 Create Profile ........................................................................................ 9-54
9.9.2 Edit Profile ............................................................................................ 9-55
9.9.3 Use Profile ............................................................................................ 9-55
9.9.4 Delete Profile ........................................................................................ 9-56
9.10 Data Exchange ....................................................................... 9-57
9.10.1 Import/Export Programs ........................................................................ 9-57
9.10.2 CAD Import/Export ................................................................................ 9-57
9.10.3 Backup .................................................................................................. 9-57
9.10.4 Restore ................................................................................................. 9-58
9.11 Add-on for Software-Update 3.77 ........................................... 9-59
9.11.1 Referring to Chapter 9.4.1 “General” ................................................... 9-59
9.11.2 Referring to Chapter 9.4.5 “Teach Automatic Pattern” ........................ 9-59
9.11.3 Referring to Chapter 9.6.2 “Auto Functions” ........................................ 9-62
9.11.4 Referring Chapter 9.6.5 “Edit Wires” ................................................... 9-63
9.11.5 Referring Chapter 9.7.7 “Bond Plan” ................................................... 9-63
9.11.6 Referring Chapter 9.9 “Bond Charts” ................................................... 9-64
9.11.7 Referring Chapter 9.10.1 “Import/Export Programs” ............................ 9-64

10 Manual Bonding
10.1 Basics ..................................................................................... 10-1
10.1.1 Menu - Overview ................................................................................... 10-1
10.2 Manual bonding ...................................................................... 10-2
10.2.1 Teaching Wires ..................................................................................... 10-2
10.2.2 Height Measurement ............................................................................ 10-3
10.2.3 Teaching a Group of Wires ................................................................... 10-3
10.2.4 Bond parameters .................................................................................. 10-5
10.2.5 Bonding ................................................................................................. 10-5
10.2.6 PiQC in Manual Bonding (Optional) ...................................................... 10-6

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11 Bonding Process
11.1 Overview ................................................................................. 11-1
11.2 Explanation of Parameters ..................................................... 11-2
11.2.1 Touchdown Parameters ........................................................................ 11-2
11.2.2 Bonding Parameters ............................................................................. 11-3
11.2.3 Loop Parameters .................................................................................. 11-4
11.2.4 Welding Parameters ............................................................................. 11-9
11.2.5 Quality Control .................................................................................... 11-10
11.2.6 Tear Off Parameters ........................................................................... 11-11
11.3 Parameter Limits ................................................................... 11-13
11.4 Process optimization ............................................................. 11-13
11.5 Wire types ............................................................................. 11-14
11.6 Wedge tool types .................................................................. 11-14
11.7 Add-on for Software-Update 3.77 ......................................... 11-16
11.7.1 Referring to Chapter 11.2.3 “Loop Parameters” ................................ 11-16

12 Production
12.1 Introduction ............................................................................. 12-1
12.2 Production Process ................................................................. 12-2
12.3 Management of Jobs .............................................................. 12-5
12.4 Material Change ..................................................................... 12-7
12.4.1 Automatic Change ................................................................................ 12-7
12.4.2 Manual Change .................................................................................... 12-7
12.5 General Functions .................................................................. 12-8
12.6 Error Management .................................................................. 12-8
12.6.1 Bonding Error ........................................................................................ 12-8
12.6.2 Pattern Recognition (PR) Errors ......................................................... 12-10
12.7 Rework .................................................................................. 12-11
12.7.1 Readjust .............................................................................................. 12-11
12.7.2 Rebond ............................................................................................... 12-12
12.8 Data Documentation ............................................................. 12-13
12.9 Add-on for Software-Update 3.77 ......................................... 12-15
12.9.1 New Function „Positioning Errors“ ...................................................... 12-15

13 Administration
13.1 Instructions ............................................................................. 13-1
13.2 User Administration ................................................................ 13-1
13.2.1 Creating a New User ............................................................................ 13-1
13.2.2 User List ................................................................................................ 13-2
13.2.3 Access Rights ....................................................................................... 13-3
13.3 Settings ................................................................................... 13-4
13.3.1 Parameter Limits ................................................................................... 13-4
13.3.2 Program Variants .................................................................................. 13-5
13.3.3 Bond Quality ....................................................................................... 13-12

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13.3.4 Checklists ........................................................................................... 13-13
13.3.5 Bond Matrix ......................................................................................... 13-14
13.4 SPC Properties ..................................................................... 13-15
13.4.1 Settings ............................................................................................... 13-15
13.4.2 Shifts ................................................................................................... 13-20
13.4.3 Date and Time .................................................................................... 13-21
13.4.4 Lamp Tower Editor ............................................................................. 13-21
13.4.5 Language ............................................................................................ 13-22
13.4.6 Axes Parameters ................................................................................ 13-23
13.5 Data Backup ......................................................................... 13-23
13.5.1 Restore/ Backup... .............................................................................. 13-24
13.5.2 Program Conversion ........................................................................... 13-24
13.5.3 Reset Program List ............................................................................. 13-24
13.6 Production Mode - Configuration Screen .............................. 13-25
13.7 Add-on of Software-Update 3.77 .......................................... 13-29
13.7.1 Referring to Chapter 13.4 “SPC Properties” ...................................... 13-29

14 Pattern Recognition
14.1 Introduction ............................................................................. 14-1
14.2 Pattern Recognition Methods ................................................. 14-1
14.2.1 Method „Fine Structure“ ........................................................................ 14-2
14.2.2 Method „Rough Structure“ .................................................................... 14-3
14.2.3 Method „Closed Contour“ ..................................................................... 14-3
14.2.4 Method „Lead Locator“ ......................................................................... 14-4
14.2.5 Method „Corner Detection“ ................................................................... 14-5
14.3 Setting Possibilities ................................................................. 14-7
14.3.1 Teach and Search Parameters ............................................................. 14-7
14.3.2 Alternative Patterns .............................................................................. 14-9
14.3.3 Lighting ............................................................................................... 14-12
14.3.4 View Pattern/Points ............................................................................ 14-12
14.3.5 Defect Recognition ............................................................................. 14-13
14.3.6 Tolerances .......................................................................................... 14-13
14.4 Error messages .................................................................... 14-13
14.4.1 Teaching ............................................................................................. 14-13
14.4.2 Searching ............................................................................................ 14-16
14.5 Lighting ................................................................................. 14-18

15 Preventive maintenance
15.1 Special danger warnings referring to adjustments .................. 15-1
15.2 Lubrication of axis system ...................................................... 15-3
15.3 Exchanging the Wire Spool .................................................... 15-4
15.4 Adjusting the pressure air ....................................................... 15-6
15.5 Exchanging the Wire Guide Tube ........................................... 15-6
15.6 Exchanging the bondhead ...................................................... 15-9
15.6.1 Removing the bondhead ....................................................................... 15-9

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15.6.2 Mounting the bondhead ...................................................................... 15-11

16 Error Messages
17 Technical Data

18 CAD file format

18.1 Syntax ..................................................................................... 18-1
18.1.1 Program Name ..................................................................................... 18-1
18.1.2 Reference System Coordinates ............................................................ 18-1
18.1.3 Pad Coordinates ................................................................................... 18-2
18.1.4 Reference System Ultrasonic Power .................................................... 18-2
18.1.5 Reference System Bondforce ............................................................... 18-2
18.1.6 Reference Sytem Welding Time ........................................................... 18-3
18.1.7 Pad Ultrasonic Power ........................................................................... 18-3
18.1.8 Pad Bondforce ...................................................................................... 18-3
18.1.9 Pad Welding Time ................................................................................ 18-4
18.2 Example .................................................................................. 18-4

19 Menu Overview

20 Process integrated Quality Control (PiQC)

20.1 Functionality of the PiQC System ........................................... 20-1
20.2 General Procedure When Using the PiQC System ................ 20-2
20.3 Program Settings in the Bond Program .................................. 20-3
20.4 Manual Bond Settings ............................................................. 20-4
20.5 Calculation Methods for the Total Quality Index ..................... 20-4
20.6 Create / Load Quality Specifications ....................................... 20-5
20.6.1 Creating a Quality Specification ............................................................ 20-5
20.6.2 Loading a Quality Specification ............................................................ 20-6
20.7 Teaching Quality Specifications .............................................. 20-8
20.7.1 Automatic Teach Mode ......................................................................... 20-8
20.7.2 Manual Teach Mode ........................................................................... 20-10
20.8 Adjusting Quality Specification Parameters .......................... 20-12
20.8.1 Threshold ............................................................................................ 20-12
20.8.2 Number of Teach Bonds ..................................................................... 20-13
20.8.3 Tolerance ............................................................................................ 20-13
20.8.4 Sensitivity ............................................................................................ 20-14
20.8.5 Weighting ............................................................................................ 20-14
20.9 Export, Import and Deleting Quality Specifications ............... 20-15
20.9.1 Exporting Quality Specifications ......................................................... 20-15
20.9.2 Importing Quality Specifications ......................................................... 20-15
20.9.3 Deleting Quality Specifications ........................................................... 20-16
20.10 Update to Version 1.2 - New Functions ................................ 20-17

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20.11 Bonding with PiQC in Programming Mode ........................... 20-19
20.11.1 Bonding with PiQC in the „Bond Program“ Function .......................... 20-19
20.11.2 Bonding with PiQC in „Manual Bonding“ Mode .................................. 20-20
20.12 Bonding with PiQC in Production Mode ............................... 20-20
20.13 Wedge Exchange ................................................................. 20-22
20.14 Base Signals in PiQC System .............................................. 20-22
20.15 Individual Quality Indices in PiQC System ........................... 20-24
20.15.1 Individual Quality Index Frequency f ................................................... 20-24
20.15.2 Individual Quality Index Friction Fr ..................................................... 20-24
20.15.3 Individual Quality Index Ultrasonic US ................................................ 20-25
20.15.4 Individual Quality Index Wedge Wdg .................................................. 20-25
20.15.5 Individual Quality Index Wire Wr ......................................................... 20-25
20.16 PiQC Radar Chart ................................................................ 20-25

21 Glossary

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 1 Bondjet BJ820

BONDJET BJ820
CHAPTER1

1.1 Introduction
In microelectronics, conducting wires are produced by welding wires in
various procedures. Ultrasonic bonding produces wires using friction with
frequencies above the audible range. This is the procedure used in the
BONDJET BJ820.
The BONDJET BJ820 is an ultrasonic wedge-wedge bonder developed
by Hesse GmbH for fully automatic processes on various types of
substrate, chip or other materials. The system can be used for fully-
automatic or manual operations.

1.2 Technical Capability:

This is a flexible system with 4 accurate, fast-moving axes. The X and Y
axes move the bonding head within a working area of up to 305 mm x
410 mm (12“ x 16“). The Z axis has a working range of 30 mm. The P
axis has a rotation of up to 420°. The available working area also allows
bonding on large substrates.
The system can process wire with a diameter of 12,5 µm (0.7 mil) up to
85 µm(3.3 mil) or ribbon ranging from 6 µm x 35 µm (0.24 mil x 1.4 mil) to
25 µm x 250 µm (1.0 mil x 10.0 mil). The wires are terminated by using
either “clamp tear“ or “table tear“ method.
The software offers a multitude of convenient functions that support
programming, calibration and production. The entire process procedure
can be programmed in detail and saved as a program. The generated
programs are portable and can be adapted quickly to special
requirements.
The BONDJET BJ820 can be used as an individual machine for manual
mounting with vacuum, compressed air, or mechanical clamping of the
substrate. Integration in a production line with SMEMA communication is
also possible as well as fitting a magazine handling system or customer-
specific conveying systems.

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1 Bondjet BJ820

Pattern Recognition
For pattern recognition the system is fitted with a CCD camera controlled
with Hesse GmbH software. Reference points on the substrate or
patterns on the chips can be taught and automatically recognized. This
guarantees high-quality results and enables fully-automatic production.
Errors in the positioning of products or chips can be recognized and
corrected in relation to other reference systems.

Carrier Clamping
Various types of clamping or fixing the unprocessed carriers can be used.
A large vacuum plate is available for smooth, flat PC boards or ceramic
carriers. Mechanical clamping or specific solutions can be used for matrix
applications or substrates with uneven lower surfaces.

Product Presentation
For automatic presentation of substrates into the working area or loading
and unloading by magazines the bonder can easily be fitted with a
standard indexer and magazine lift system at any time. It can equally well
be integrated in a manufacturing line by SMEMA interface.
Product presentation can occur by several different methods:
• Manually
• Semi-automatic
• Fully automatic (indexer systems)
• by internal PLC
• by a SMEMA compatible system
• by Profibus from an external controller

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 1 Bondjet BJ820

1.3 Machine Assembly

Safety cover

User
interface
elements

Working area
User panel with bondhead

Figure 1-1: Machine overview

1.3.1 Axes System

The BONDJET BJ820 axes system has three translateral axes (X,Y and
Z) and a rotational axis (P). The X, Y and Z axes are arranged in a gantry
system at right angles to each other. The P axis, responsible for the
rotation of the bondhead, is located at the end of the Z axis. The two
synchronized Y-axes are driven by iron-free linear motors, the X- and Z-
axes are driven by iron core linear motors.
The P-axis is driven by a belt drive with according gear ratio.
Bonding is possible inside the following working area
- X-axis = 305 mm (12“)
- Y-axis = 410 mm (16“)
- Z-axis = 30 mm
- P-axis = 420°

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1 Bondjet BJ820

1.4 Bondhead 45°

The following illustrations show the bondhead in 45° wire feed version.
Hesse „mechatronic“ bondhead was developed and optimized by
methods of mechatronical engineering. The superior advantages of this
bondhead result from the optimized arrangement of carefully selected
sensors and actuators:

Figure 1-2: Bondhead 45° side view

• The wedge tool is held vertical at all times. There is no transducer

rotation and no rotation bearing.
• No consumable parts, wear free and maintenance free.
• Robustness against particle contamination. The mechatronic
bondhead runs equally well under non-cleanroom conditions.
• New generation of transducer matching new style Hesse digital
ultrasonic generator.
• Extremely high resolution reliable touchdown sensing.
• All welding parameters such as bond force, ultrasonic energy,
overtravel, welding time, etc. are exclusively software-controlled.
There are no mechanical adjustments to perform.
• Extremely high resolution deformation sensor with integrated
temperature compensation.
• Clamp control by software. Clamp gap, tear-off stroke and tail length
can be controlled by software without the need for mechanical
adjustments.
• The new style programmable lighting module based on 40 LED’s for
diffuse illumination can be exchanged easily with different colors to
optimize recognition contrast.

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 1 Bondjet BJ820

Figure 1-3: Bondhead 45° Front view

1.5 Bondhead 89° (Deep Access)

This compact design bondhead is available for bonding inside difficult to
access devices or tight packages and provides a cavity access of 14mm
with a 1“ wedge tool length. The pivot-free transducer suspension
guarantees a constantly vertical wedge alignment. Wear- and
maintenance free components increase the lifetime and minimize the
time for machine maintenance.
Tail length, tear off stroke and wire clamp gap are free programmable.
The additional wire clamp above the transducer allows optimum control
of the clamping force. The touchdown force is also free programmable
and especially reproducible for applications with very small wire
diameters and minimal bondfoot geometries.

Figure 1-4: Bondhead 89° Deep Access

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1.6 Process integrated Quality Control = PiQC (Option)

The PiQC system (PiQC = Process integrated Quality Control) is a real-
time quality control system for quality control of the bond process without
loss of time. A sensor integrated into the transducer allows a multi-
dimensional signal analysis of the bond process. The quality control
system evaluates the mechanical oscillation behaviour of the wedge tip,
the friction behavior during the welding process and the wire deformation.
The system uses these values to calculate a quality index in real time.
The wire bond is not subjected to any mechanical stress. The individual
elements which are considered in combination to calculate the quality
index, can be viewed at any time in graphical form.
For further detailed information regarding the system and its use, please
refer to the chapter 20 about PiQC.

1.7 Wire Despooling Station

The wire despooling station is located on the Z-axis above the bondhead.
The wire spool sits firmly on a spool holder which is driven by a stepper
motor. For automatical wire feeding the wire is guided through a slot in
which a light barrier can detect the wire. Inside this slot the wire rides on
an air cushion to maintain proximity to the light sensor. Triggered by the
sensor, the wire spool is automatically turned to feed more wire. After the
sensor slot the wire feed proceeds to the bondhead and finally to the
wedge tool through a PTFE tube which is running inside a metal sleeve.
The spool holder is compatible with a wire spool width of 1“ up to 1 1/2“
and a spool diameter of 2“.
The slot in the wire sensor must be adapted to a wider width if ribbon
should be used.

Wire sensor
slot

Wire spool

PTFE tube
inside metal
sleeve

Figure 1-5: Wire despooling station

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1.8 Optics

1.8.1 Bondhead Camera

A camera scanning the current bonding material in 256 gray scales is
attached to the Z axis. It supports the pattern recognition system
integrated in the software which determines the exact position of the
chips and substrates. This allows teaching of reference patterns on the
substrates for automatic recognition.
LED ring lighting and vertical light for optimal lighting of the objects are
available. Different surface structures on the substrates require different
lighting settings for optimal contrast. The light conditions influence the
performance of the pattern recognition and can be freely programmed.

1.8.2 Inspection Camera (optional)

Repeatable bond quality requires maximum precision of setup during the
periodic replacement of wedge tools. Achieving this setup with micron
accuracy may be difficult and time consuming.
The inspection camera helps to satisfy two needs at once: quick
adjustment and visual inspection by the operator.
The optional inspection camera is installed underneath the right side of
the Y-axis.
The target positions for the wedge tool, the wire clamp, in case of the
deep access bondhead the clamp blade and the tolerance areas of each
of the above can be defined in the software and superimposed on the
camera image by adjustment lines. The tools can be set up with the help
of these adjustment lines and are therefore always reproducible.
Compared to the traditional way of setup this can lead to a significant
reduction of setup time and increase in tool lifetime.

Figure 1-6: Inspection camera

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1.8.3 Camera for Bond Position Control

(optional)

Figure 1-7: Bond position control - angled camera

This additional camera is mounted to the Z/P axis module and is aimed
directly at the tip of the wedge tool. When targeting bonds in difficult to
access locations this camera can be used to check if the position can be
reached without the risk of hitting an obstacle. Optimal illumination for
this camera image is achieved by an additional light source.

1.8.4 Microscope (optional)

A microscope may be included in the accessory equipment of the
BONDJET BJ820. This can be used for optical control of the bond
connections. Light is supplied by an LED lighting ring. The power supply
of this lighting ring is integrated into the miroscope holder. The
microscope magnifies in a range of 7 to 43 times with a recommended
working distance of 311 mm.

1.9 User Interface Devices

1.9.1 Operation Panel

The BONDJET BJ820 is operated using a keypad, keyboard and
trackball. These interface devices are built into a panel which can be
fitted either to the left or right side of the bonder frame and can be height
adjusted. Visual control works via a flat screen monitor above the
keypad. For program editing, a complete keyboard can be pulled out if
the panel.

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monitor

keypad

trackball

keyboard

Figure 1-8: Operating panel

Alternatively, the machine can be delivered with a front console. This is

integrated into the front machine cover and can not be adjusted. It
comprises the same elements as the panel, the monitor is then located at
a fixed height on the right or left machine frame.

Figure 1-9: Alternative: front console

1.9.2 Monitor
Using the 16“ flat screen monitor the bond process can be visually
controlled, and in a section of the screen, a live video image can be
viewed.

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1.9.3 Keypad
The keypad contains the number keys with the standard functions, and is
additionally fitted with special functions for operating the machine. The
markings on the keys are described as follows:

Index Change material

Shift + Index/Clamp Clamp open/closed

Step Moves to the next position in „Step by step

mode“

Shift + Step/Stop The bond process is stopped after ongoing

cycle.

Z Axis moves up (in „Threading“ mode the P

axis rotates in a pos. direction).
Shift + The Z axis moves in double speed.

The Z axis moves downwards (in „Threading“

mode, the P axis turns in negative direction)

Shift + The Z axis moves downwards in double

speed.

WF Wire feed – Moves the wire by one clamp

stroke.

Shift + WF/WI Wire insert – Opens the ”wire insert” dialog.

The bondhead can be moved to the threading
position.

WC Wire clamp – Opens and closes the wire

clamp.

Shift + WC/Offbond Changes into Offbond-mode

Num Lock To switch between number keys and cursor

keys.
Esc Stopp of actual der aktuell performed function
OK Confirmation of entry

The bonder can be stopped immediately at the current operation using

the HALT key, situated above the keypad.

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Figure 1-10: Keypad

1.9.4 Trackball
The trackball is integrated into the operating panel. It is used to steer the
movable crosshair or pointer and to manually drive the X/Y axes. The
trackball crosshair becomes a pointer if moved outside of the camera
window. Keep the left trackball button pressed in order to move the
bondhead. The right trackball button must be pressed to teach patterns,
or if prompted by the software dialog. For more information see chapter
4.5 General Operation.

Figure 1-11: Trackball

1.9.5 Keyboard
The standard PC keyboard is generally used for installation, user login or
programming when the keys on the keypad are not sufficient. The
keyboard should be stored in the operating panel during everyday
production.

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1.9.6 User interface

One floppy disc drives and 3 USB-ports are located at the top inside of
the machine. The drive and the left USB port ( Main USB) can be used by
the operator for backup and data transfer. This drive can also be used to
import or export externally generated programs.
The middle USB port (Controller USB) is for service and maintenance.
The right USB-Port is used for Updates of PiQC-Software.

Figure 1-12: User interface

1.9.7 Main Switch

The main switch is situated on the right side of the machine frame and
can be locked. The systems power supply is activated / deactivated by
turning the switch to the left or right until ON or OFF appears in the switch
window.

Figure 1-13: Main switch

1.10 Safety Equipement

1.10.1 Safety Circuit

The safety circuit is connected directly to the controller which carries out
all the axes movements and index steps. It controls the flawless

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operation of several machine components. Operation will be interrupted if

differences occur in any of the components.
The safety circuit consists of the following components:

• Emergency stop switch

• Safety circuit switch

• X, Y, Z and P axis servo amplifier

• Safety cover interlock

• Watchdog

• Emergency stop switch for the indexer (optional)

• Motor temperature control

1.10.2 Safety Circuit Switch

Axis movement is only possible if the safety circuit is switched on. The
status of the safety circuit switch is indicated by an integrated light inside
the switch.

GREEN I = ON

RED O = OFF

Figure 1-14: Safety circuit switch

1.10.3 Safety Cover

The BONDJET BJ820 is fitted with a complete safety cover. Operation is
only possible when the cover is completely closed.

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1 Bondjet BJ820

Figure 1-15: Bonder in closed state

During the production process, the safety cover can only be opened for
changing material manually. The axes are powered down and the
bondhead is in a free programmable material change position.

1.10.4 Keyswitch for Adjustment Mode

The A-mode keyswitch has to be switched to 1 to enter the setup mode
(Adjustment mode). The safety cover can now be opened and the axis
will move with reduced speed.

Figure 1-16: Keyswitch adjustment-mode

1.10.5 E-Stop Switch

The lockable Emergency stop switch is located on the right side rail of
the bonder. Any axis movements or index steps will be aborted
immediately if the E-stop switch is pressed.

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Figure 1-17: E-stop switch

1.10.6 ESD-Bonding point

An ESD contact button is positioned on the front right frame of the
machine where the user can connect his ESD wrist strap in order to
maintain ground potential.

Figure 1-18: ESD contact button

1.10.7 Signal Lamps

The signal lamps on the machine housing show the actual status of the
BONDJET BJ820. The lamps have the following standard meanings:

red - Error or interference

yellow - The system awaits user input

green - Production running

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Figure 1-19: Signal lamp

The meaning of the signal lamps can be altered by software according to

customer specifications. An optional acoustic alarm can be fitted.
The orange warning lamp inside the machine will flash when the machine
is in adjustment mode. The safety cover can be lifted and the axes will
move with reduced speed.

Figure 1-20: Warning lamp

1.11 Connections

1.11.1 External Connections

The following external connections can be found on the rear side of the
bonder:

1. Flexible mains cable, type HO7-RNF3 G 2,5 with plug, 5m long

2. ESD ground plug (4mm), this allows the user to connect the bonder to
adjacent ground plugs, for example in manufacturing lines.

3. 3/8“ pressure air connector. Pressure of 4-6 bar is required.

4. 3/8“ connector for vacuum. Vacuum must have a minimum pressure

difference of 800 hPa.

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5. A mains cable 3 x 2.5² 2,5m long is provided in case a heater is used

for the manufacturing process.

6. A cat 5 cable is installed for data communication.

1.11.2 Internal Connections

Various interfaces are located on the rear wall inside the machine to
enable the connection of external systems.

Figure 1-21: Internal interfaces

• SMEMA IN and OUT:connections for systems, such as magazine

handlers, which are positioned before or after the production
process
• Vacuum is switched by the software and requires compressed air
for the vacuum valve.
• Comp. Air is for the continuous supply of compressed air when the
safety circuit is switched on.
• Comp. Air (SW) is for the switched supply of compressed air when
the safety circuit is switched on.
• User in and User out is for programmable 24V connections.

• 230V is for the continuous power supply for indexers which are
switched with the main switch of the machine.

• 230V SW is for the supply of equipment that requires a switched

power supply.
• Heating is for connecting heating cartridges contained in indexers,
for instance.
• SC EXT is for connecting the safety circuit for the Hesse indexer.
• EMERGENCY STOP EXT is for connecting an external emergency
stop switch, or an additional safety circuit.

1.12 Heat shield box and air blower (option)

Processing devices over a heated workholder can cause changes to the
bondhead components and disturbances of the pattern recognition by

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1 Bondjet BJ820

heat convection. To compensate these effects a heat shield box can be

fitted underneath the X-axis. A controlled airflow is blown out of holes in
the face of the heat shield box which cools the area of the bondhead.
Another benefit of the heat shield box is the compensation of the
additional heat which the x-axis linear motor would get from the heated
workholder.
The viewing area of the bondhead camera is likewise protected from heat
convection by an air blower nozzle, which stabilizes the pattern
recognition process by continuous controlled airflow.

Figure 1-22: Heat shield box and air flow above heated workholder

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 2 User Manual

USER MANUAL
CHAPTER 2

2.1 Using this Manual

The user manual must be read before the system is unpacked and
installed. The instructions must be followed exactly.
This manual contains important information to ensure safe, correct and
economic use of the system. Compliance with the instructions minimizes
danger, down time and repair costs, and maximizes operating life time.
This manual should always be kept at the operating site.
The customers current domestic procedures for work safety and accident
prevention must be added to this user manual.
The machine may only be installed, operated and maintained by
personnel familiar with the user manual and current regulations for work
safety and accident prevention. Only properly trained or instructed
personnel above the legal minimum age may operate the machine.

2.2 Summery of contents

The user manual comprises 20 chapters regarding the following topics:
Chapter 1 “Bondjet BJ820”
Chapter 2 “User Manual”
Chapter 3 “Safety”
Chapter 4 “Transport and Storage”
Chapter 5 “Installation and Setup”
Chapter 6 “Mechanical Settings”
Chapter 7 “User interface”
Chapter 8 “Calibration”
Chapter 9 “Programming”
Chapter 10 “Manual Bonding”
Chapter 11 “Bonding Process”
Chapter 12 “Production”
Chapter 13 “Administration”

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Chapter 14 “Pattern Recognition”

Chapter 15 “Preventive maintenance”
Chapter 16 “Error Messages”
Chapter 17 “Technical Data”
Chapter 18 “CAD file format”
Chapter 19 “Menu Overview”
Chapter 20 “Process integrated Quality Control (PiQC)” and
Chapter 21 “Glossary”

2.2.1 Remarks and Symbols

The following notes and symbols are used throughout this manual to
indicate especially important information. Noncompliance may result in
injury or damage of the machine and could lead to loss of warranty.

Danger: Remarks with this label are concerned with the

avoidance of injuries or significant damage to the
machine and must be followed exactly.

Attention: This label is used when noncompliance with the

instructions could lead to object damage.

2.2.2 Typographical Styles used in this Manual

The following typographical styles are used in this manual:
Italics This marks menus or words used in the user
interface.
Bold This highlights words or indicates newly introduced
words. It additionally indicates selected menu
items.
KEYS Names written in this form indicate the keys you
may or must press.
Key combinations are marked with the + symbol.
[Menu/Menu item] This marks menu commands and means: select
the Menu item or the Function in the Menu.

Hint: Remarks regarding the economic use of the machine.

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Important: Remarks that must be complied with to ensure error free

machine operation. Noncompliance leads to loss of
warranty.

2.3 Customer Contact

Should you have any questions concerning this manual or machine
operation, please contact us directly. In such a case it would be helpful to
have the machine data of your BJ820 at hand. The registration plate
contains all important machine data and can be found on the right hand
side of the machine frame.

Figure 2-1: Registration plate

Our service personnel is available during normal business hours at the

following contact address:

Hesse GmbH
Vattmannstraße 6
D-33100 Paderborn
Telephone: +49 - 52 51 15 60 333
Fax: +49 - 52 51 15 60 590
E-mail: [email protected]

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 3 Safety

SAFETY
KAPITEL3

3.1 General Safety Instructions

• The safety instructions contained in this manual must be read before
using the machine. Non-observance can lead to injury.
• The safety- and risk- conscious operation of the machine under
observation of the manual must be monitored.
• All safety and danger warnings on the machine must be observed.
• All warnings on the machine must be kept in good, readable condition.
• Changes, additions or alterations may not be made to the machine
without the permission of the manufacturer.
• Spare parts must comply to the technical requirements stipulated by
the manufactuer. This is guaranteed with original spare parts from
Hesse GmbH.
• Changes to the programmable control system of the machine may not
be made! This does not apply to the programs generated for material
processing, but for manufacturer, service and parameter settings.
• The deadlines given for regular maintenance and inspection works
must be adhered to. Any necessary personal protection and
maintenance equipment required for maintenance measures must be
supplied by the operators of the machine.

3.2 Personal Qualification

All work on the machine may only be carried out by skilled employees.
Skilled Employees:
A skilled employee is one who, due to their specialist training, knowledge
and experience, is able to recognize danger and take appropriate
measures for avoidance of injury. They must comply to the relevant,
specific regulations, be familiar with, and understand all warnings and
regulation procedures according to the documentation.
The responsibilities of the personnel for setup, maintenance, inspection
and operation are to be defined by the user.
Personnel in training and apprentices may only operate the machine
under constant supervision of an experienced member of staff.

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Certified Electrician:
Work on the electrical components of the machine may only be carried
out by a certified electrician, or a person under constant supervision of a
certified electrician in accordance with the electrotechnical guidelines.
The certified electrician is, due to his training, knowledge, experience and
intensive knowledge of the relevant norms and regulations, able to work
on all electrical installations and to recognize and avoid any danger and
risks.

3.3 Safety Devices

These devices ensure safe operation of the machine.

• Main Switch
The electrical energy is switched off by the main switch, which can be
locked. It is located at the front of the machine.
• Emergency Stop Switch
The red emergency stop switch is located on the right frame of the
machine. When the emergency stop button is pressed, the safety circuit
is switched off immediately. All moveable components are stopped
immediately.
• Safety Cover, Safety Device
Moveable parts of the machine are secured by safety devices.

3.4 Electrical Installation Safety

The local electricity supply company guidelines and connection
requirements must be observed when connecting the machine.
All work on the electrical connections must be carried out by a certified
electrician.
Electrical installations and components must be inspected at regular
intervals. All defects, such as loose connections, charred cabels or
similar must be rectified immediately!

Important: Only use original fuses for the required amperage.

Important: The machine must be switched off immediately in case of

dysfunction.

All machine and equipment components undergoing inspection,

maintenance or repair work must, if compulsory, be disconnected from
the electricity supply. Check the voltage free components and cover any
nearby components still connected to the electricity supply.

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 3 Safety

3.5 Warning Signs and Notices on the BJ820

Stickers have been attached to the machine which highlight dangers
where extreme care must be taken.

Important: Make sure that all warning stickers are kept in good,
readable condition.

In this manual, warning signs are used for respective working steps
which describe the danger and give explanations on how to avoid
danger.

Hot Surface Warning:

This warning is fixed to all motors where the cover becomes hot during
continuous operation.
If the bonder is fitted with a heating station, this warning refers to the
heated surface.
Touching hot surfaces can lead to injury!

Warning of Pinching or Cutting Hazard

This warning is fitted to the upper part of the safety cover.
Reaching into the side area of the open safety cover and simultaneously
closing the cover can lead to hand or arm injury.

Dangerous Electrical Voltage and Compressed Air Warning:

This warning with the symbol for dangerous electrical voltage and
compressed air is fitted to the cover of the electronics enclosure on the
rear of the machine.
Before removing the cover, the power supply and compressed air must
be switched off.
Improper handling when opening the bonder casing can lead to injury
caused by live parts if the power supply is not disconnected.

Take note that the following components in the electronics

enclosure are still live after the main switch has been switched off.
• Mains power supply cable
• Mains filter connectors
• Cable to main switch in the enclosure door

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Dangerous Electrical Voltage Warning

This warning is fixed to the machine rear above the power connectors
and warns about areas with mains power even when the machine is
switched off.
Improper handling when opening the bonder casing can lead to injury
caused by live parts if the power supply is not disconnected.
Work within the electronics enclosure may only be carried out by a
certified electrician. Apt measure must be taken to ensure the machine is
not switched on while work is being carried out.

Pinch Point Warning

This warning is fixed to the opening area of the safety cover.
Danger of injury between the lower part of the safety cover and the
machine frame by improper handling while closing the safety cover.

Warning about magnetic fields - danger for persons with implanted

medical devices:
This warning label is attached to both Y-axis linear motor magnets.
Electrical, magnetic or electro-magnetic fields can induce disturbances
into pacemakers and cause malfunction, blocking or damage to these
devices. For this reason persons with such implanted medical devices
have to exercise special caution.
The warning labels are fitted on components which require a minimum
safety distance of 30 cm (approx. 12“).

Pinch Point Warning:

This warning label is attached to the right and left side of the bonder, if
this is not completely closed for the installation of an indexer. The
moveable parts of the indexer are covered as far as possible. It is not
possible to cover certain areas, so there is a residual risk here.
Hand injury can occur at these points if you reach into the area during
running operation.

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3.6 Basic Intended Use

The machine may only be operated for the intended use if it is in a perfect
technical condition. It must be operated in accordance with all safety
measures and the user manual. Any defects compromising safety must
be corrected immediately!

Intended use of the BONDJET BJ820

The BONDJET BJ820 is a machine intended for fully automatic or semi
automatic ultrasonic wedge-wedge bonding. Its production capabilities
are determined by its physical dimensions and options in the software. Its
use for any other purpose is not permitted.

3.7 Remarks on Protection of Rights

Many of the machines components are protected by patents or trade
mark rights. The lack of any notice on a component does not
automatically allow its reproduction. Please contact Hesse GmbH in case
of doubt.

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 3 Safety

3.8 Conformity Statement According to Directive

2006/42 EG

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 4 Transport and Storage

TRANSPORT AND STORAGE

CHAPTER4

4.1 Transport
4.1.1 Special Safety Warnings

Danger: Do not stand, move or work under suspended goods.

Falling goods can be fatal or cause severe injury.
- Only registered and checked lifting equipment for means
of transport may be used with a minimum load bearing of
1500kg!
- The machine‘s center of gravity is asymmetrical due to
the built in granite.
- Ensure that nobody is able to walk beneath the
suspended goods! The area must be cordoned off and apt
warning signs fitted.

The local guidelines for health and safety and the general recognized
codes of practice apply for lifting and transport of goods.

4.1.2 Transport Requirements

The bonder is transported by a haulage contractor authorized by
Hesse GmbH who is familiar with the transport requirements.
Hard jolts and bumps must be avoided during transportation. Mechanical
damage must be avoided and moisture and dirt particles must not enter
the machine.

4.1.3 Transport Locks

The machine is prepared for transportation ex-factory. Important
components are fixed with mechanical fixtures.
The granite base is secured at a relative position to the machine frame.
This is achieved with locking plates. These are fixed with threaded pins
from above and secured by nuts below the machine base plate. The
transportation locks must be loosened before machine installation.

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Figure 4-1: Transportation locks

Each time the machine is moved, these transportation locks have to be

reinstalled. To do this, the threaded bolts have to be tightened with a
torque of 2Nm against the granite base and locked with the nuts.

The gantry systemis fixed with two transportation locks in the horizontal
and one transportation lock in the vertical direction to inhibit uncontrolled
axes movement. These red transportation locks must be removed before
machine operation. They must be replaced before any machine transport
or movement.

Y-axis YA-axis
Figure 4-2: Transportation locks horizontal

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 4 Transport and Storage

Z-axis
Figure 4-3: Transportation locks - vertical

4.1.4 Packaging
The machine is packed according to the transport route, storage at the
customer site, or in accordance with customer specifications.
Packing types are:
• On a frame and covered with a protective foil
• In a closed wooden crate

For transport within Germany, the machine is stored in a special wooden

frame and covered with an air-cushioned cover for protection against
contamination and moisture.
For transport within the EU and for air or sea transport, a special wooden
crate is used in accordance with the regulations of the recipient country.

Figure 4-4: Bonder transport crate

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4 Transport and Storage

The machine is covered with an air-cushioned foil in the crate and the
frame is screwed to the crate floor. The machine is then also attached to
the frame with heavy duty belts. A drying agent is also included in the
crate according to climatic requirements.
The machine is lifted by a lifting device from the front into the crate. The
front is fixed with 3 screws at the top and bottom and 3 screws at side in
the angle profiles.
The crate is additionally secured with straps in the horizontal and vertical
direction for transport to the USA.

Figure 4-5: Transport crate - front side

Symbols are printed on the side of the crate which refer to special
transport requirements. These symbols must be observed.

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 4 Transport and Storage

Top Fragile
Protect against moisture Protect against heat
Figure 4-6: Transport crate symbols / notices

Additional written warnings are on the crate which must be observed.

4.1.5 Lifting Points for Lifting Equipment

The basic frame of the crate is constructed so that transport is only
possible from the front and rear side. The forks of the lifting device have
to be at least as long as the edge length of the crate or longer!

Figure 4-7: Transport crate

The basic frame of the BONDJET BJ820 is made of a welded frame

which is supported by 4 vibration dampening feet. The following must be
observed when transporting the machine with lifting equipment.
• Only use lifting equipment where the forks are long enough to reach
completely under the front of the machine and protrude at the back.
• Select the fork width of the lifting equipment so that the machine lies
on the forks at the points as shown in the illustration.
• Move the machine slowly, do not move over steps, avoid any bumps
and jolts.

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4 Transport and Storage

300mm

700mm
Figure 4-8: Lifting points

The machine can be transported from the front or back in the same way.
(With protruding forks centralized between 300mm and 700mm both
sides).

4.1.6 Transport Monitoring

A shock watch is placed in the service compartment (see Figure 4-9:
“Shock watch in service compartment”) which monitors the transport. If
the defined shock value is exceeded it changes color and indicates
incorrect transport.

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Indicator colored red

Figure 4-9: Shock watch in service compartment

Further indicators are fitted to the side walls of the transport crate which
register bumps and jolts. If shock or tilt watches are fitted, it indicates the
necessity of especially careful transport of the product. Jolts or bumps
which are larger than the allowed limit can be proved by the shock watch
indicator. The tilt indicator displays if the product has been tilted beyond
the acceptable limit.

Tilt-Watch Shock-Watch
Figure 4-10: Transport - monitoring system

All indicators must be checked at delivery. If any violation of limit is

indicated, a damage notice must be completed in the presence of the
transporter.

4.2 Storage
The protective cover should not be removed for intermediate temporary
storage. The storage room must be dry and protected against major
temperature fluctuations in order to avoid repeated formation of

©2013 Hesse GmbH User manual-BJ820-3.77 4-7

4 Transport and Storage

condensation. The storage room should be free from vibrations, and the
machine must be protected against mechanical damage.
The transport crate is not suitable for long-term storage.

4.3 Delivery Contents

The following standard components are included in the delivery. They
may be delivered in the bonder crate or in a separate package:
• Monitor in original packaging
• Microscope with mounting bar
• 4 adjustable machine feet
• The user manual and OEM parts documentation
• The bondhead in a plastic box which provides safe transport and
storage of the bondhead
• The bonder accessory box with various tools for work on the
bondhead, screws and adjustment gauges.

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 5 Installation and Setup

INSTALLATION AND SETUP

CHAPTER5

5.1 Required Floor Space

The frame of the machine requires a footprint of 750mm x 1250mm. The
machine is operated using an adjustable operator panel comprising a
keyboard, keypad, trackball and monitor. A free area of 800mm x 720mm
is required for operation and maintenance of the machine. If the machine
is to be fitted with an indexer, more free space should be allowed on both
sides of the machine. There should be enough room at the back for
connecting the machine supplies.
The floor must be able to endure the weight of 1500kg. The machine feet
can compensate irregularities on the floor surface of +/- 5mm.

5.1.1 Environmental Influences

For operation of the bonder a cleanroom class of 100’000 is sufficient.
The requirements for specific applications may be much higher. It is
recommended to prevent visible dust and humidity condensation.
Normally the floor vibrations are damped sufficiently by the anti-vibration
feet of the bonder. The vibration transmission of loading- and off-loading
systems need to be considered.

Important:. The relative humidity must not exceed 80%!

The allowed room temperature is between 20°C and
30°C. Furthermore, temperature fluctuations of more
than +/- 5°C must be avoided!

The machine should stand at its location of installation to acclimatize. A

time frame of approx. 8 hours is recommended.

5.2 Assembly
The front beam of the wooden frame is removed first and the machine is
pulled forward by the fork lift truck and transported to the installation
location.

©2013 Hesse GmbH User manual-BJ820-3.77 5-1

5 Installation and Setup

Figure 5-1: Machine placed on the feet

The protective cover can be removed and discarded or stored for future
use.
If the machine is delivered in a transport crate the front side must first be
removed.
• Remove the 3 screws on the upper and lower front edge.
• The front is fixed with 3 screws in metal brackets to the sides of the
crate. These must also be removed.
• The front can now be removed.
• Remove the 4 screws of the front beam on the wooden frame which
is fixed to the crate floor.
• The machine can now be lifted out of the crate by a fork lift truck and
positioned at its final location on the machine feet.

Figure 5-2: Transport crate front

The original cover and crate must be used If the machine needs to be
moved or transported.

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 5 Installation and Setup

5.3 Alignment
To ensure error free operation the machine must be horizontally level.

• Place a spirit level longways and sideways on the work surface.

• Slowly turn the screws on the machine feet until the machine is
completely balanced.

5.4 Energy Requirements: Type, Amount and Quality

Warning: Only a trained electrician may carry out the electrical
installation. The current safety and installation
regulations must be observed (e.g. VDE 0100).

The bonder requires a voltage supply of single phase AC 230V/50Hz. A

lead for connecting the machine to the wall outlet is enclosed with the
delivery. The machine power supply is fitted with a protective contact
plug according to CEE7.
The maximum power consumption is 2,0kW.
The compressed air supply is obtained via a standardized 3/8“ quick
connector. Incoming pressure in range from 4-6 bar (approx. 60-90 psi) is
required.

Hint: The pressure air supplied to the bonder has to reach

the following specifications:
Dryness: Dew point of -35°C
Volume airflow: 0-100 l/min
Volume airflow: 0-250 l/min for AirFlow System
Leakage flow vacuum: 0-50 l/min

If vacuum parts clamping is used, a special vacuum connection will be

required. The vacuum should have a minimum pressure difference of 800
hPa. The quality of the vacuum should be at least 40% abs. Compressed
air to be used as a pilot for switching the valves is generally required
when using a vacuum.

5.5 Power Up
The following must be observed before switching on the machine:

1 Vacuum and compressed air must be connected correctly.

2 Specified connection values for vacuum and compressed air (see
Chapter 17 Technical Data)

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5 Installation and Setup

The supply connectors for the machine are located at the rear of the
bonder:

Potential-
equalization
Compressed air
Optional
cable entry Vacuum

Mains supply

Network connection Network connection

Main RJ45/CAT5e PiQC RJ45/CAT5e
Figure 5-3: Connectors at the rear of the machine

• Before connecting the machine to the power supply, the main switch
must be in the „OFF“ position (the middle of the main switch is
horizontal).
• Plug the connecting cable of the BONDJET BJ820 into a protective
contact plug with the following specifications:

Voltage Frequency Overcurrent protection

230 V~ 50-60 Hz 16 A

Alternatively, the machine can be connected to the main power line with a
fixed connection.

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 5 Installation and Setup

5.6 System Start-up

Attention:. Only properly trained and instructed personnel are
permitted to operate the machine. Personnel in
training or apprentices may only operate the machine
under the constant supervision of an experienced
operator.

Important: An ESD wristband must be worn and connected to the

ESD bonding point when working inside the machine
(when the safety cover is open). Non-compliance results
in the loss of warranty for damage caused by electrostatic
discharges.

• Only start the machine if all safety devices are installed and
functioning.
• Turn the main switch handle to the right until it is in a vertical
position and ON can be seen in the display window. (Main switch
handle is vertical.)
• Push the axis manually into the center of the working area.

Figure 5-4: Main switch ON

• Close the safety cover and turn the A-mode key switch to 0.

Figure 5-5: A-Mode switch

• Switch on the safety circuit by pressing the green part of the switch
to turn on the servo amplifiers.

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5 Installation and Setup

Figure 5-6: Safety circuit switch

The X/Y-axes move independently for a short distance to define the

phase position of the axes.
The light on the safety circuit lights up when it is switched on.
The software starts automatically. The graphic mode is opened after
switching on the machine and initialization of the system and the current
initialization routine is displayed in the status bar. The access dialog is
then displayed on the monitor.
Besides the entry fields, there is also information regarding the software
version, control software version and security level.
A password is required for the first access to all operation modes which is
given by Hesse GmbH to an authorized administrator.

Figure 5-7: Start dialog

System Log-in
In the start window of the software dialog, you can log in with a log-in
name and a password. You can then access those operation modes for
which you have been given access rights by the administrator.

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 5 Installation and Setup

The system requires a reference move before any actions can be made
on the software dialog. This is only possible if the safety circuit is
switched on.

In the reference move, all axes are moved to the positive limit switch,
afterwards, the X and Y axes move a defined distance back. At the end of
this movement, the axes have reached a defined position.
The position values appear with the values X:0,000 mm - Y:0,000 mm-
Z:0,000 mm- P: 90° in black lettering on the user dialog.
The start position may not be changed, so that bond programs which
were written on other bonders can be used on this bonder.

The Bonder is now ready for operation.

The reference move can be started from all operation modes in the menu
Action - Reference move.

Hint: If the LED on the monitor remains off, check that the
monitor is switched on. If the monitor cannot be switched
on it could be an error in the cable connection.

5.7 Buy-Off Procedure

To guarantee a repeatable process stability, the BONDJET BJ820 must
pass a buyoff procedure at the initial installation. For this purpose a bond
test should be carried out either on the Hesse test substrate or on a
customer application. These bonded wires have to be inspected and
evaluated either according to the Hesse standard specification or a
customer specification, commonly agreed upon. Quality criteria, which
should be considered are pull test values, positioning accuracy and loop
consistency.
A final buyoff report should document the recorded results of the
inspected quality criteria and the parameters being used.

©2013 Hesse GmbH User manual-BJ820-3.77 5-7

5 Installation and Setup

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 6 Mechanical Settings

MECHANICAL SETTINGS
CHAPTER6

6.1 Overview
After the initial machine installation some machine components require
mechanical setup to adapt to customer specific requirements or to
maintain safe operation and constant high quality of production. These
settings have to be carried out very thoroughly.
It is most important to consider the necessary subsequent calibration
routines which may have to follow after mechanical setup, replacement or
modification of the bondhead, wedge tool, camera, sensor, wire clamp or
wire.
User access rights are required for setup and calibration mode. Click the
icon to change into setup mode from any other operation mode.

Special safety remarks regarding the setup routines

Only specially trained and instructed personnel may carry out any setup
operations.
The safety cover of the BONDJET BJ820 prevents user access to the
working area during the production cycle. For setup operations, manual
material change or inspection of the axis movements the bonder must be
put into adjustment mode with the A-mode key switch.

• Turn the A-Mode key switch to 1.

The safety cover can now be opened and the orange warning light inside
the machine interior blinks.

Warning: The bonder is now in unsafe mode and there is a risk

of injury by moving parts. Any movements are
reduced to 25% of the normal speed.

©2013 Hesse GmbH User manual-BJ820-3.77 6-1

6 Mechanical Settings

6.2 Buy-Off Procedure

To guarantee consistent process stability, the BONDJET BJ820 must
pass a buy-off procedure at the initial installation. For this purpose a bond
test should be carried out on the Hesse test substrate or on a customer
application. These bonded wires must be inspected and evaluated
according to the Hesse standard specifications or a commonly agreed
upon customer specification. Quality criteria which should be considered
are pull test values, positioning accuracy and loop consistency.
A final buy-off report should document the recorded results of the
inspected quality criteria and the parameters being used.

6.3 Settings to 45° Bondhead

Important: The piezos and the wire clamp are extremely sensitive
mechanical components which can be easily
damaged by incorret use. Therefore, it is essential to
observe the following points when disassembling the
wire clamp or exchanging the wedge:

• No mechanical stress or strain must be used in the vertical direction

during assembly or disassembly of the wire clamp. See figure below!
• Assembly or disassembly of the wire clamp may only be carried out
when the clamp is in closed position.

Figure 6-1: Piezos

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 6 Mechanical Settings

• When exchanging the wedge, make sure that the wedge gauge does
not collide with the wire clamp. There is a risk of damaging the wire
spool and the clamp during touchdown of the wire clamp on the wedge
gauge. Therefore, it is recommended to slide the wedge gauge in from
the side to the transducer just before touchdown is reached.

wrong !

Figure 6-2: exchanging wedge- wrong way!

correct !

Figure 6-3: exchanging wedge- correct way!

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6 Mechanical Settings

• When tightening the wedge clamping screw, make sure that does not
lie on the wire clamp screw. See figures below!

wrong !

Figure 6-4: tightening the wedge srew - wrong way !

correct !
Figure 6-5: tightening the wedge srew - correct way

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 6 Mechanical Settings

• After setting the clamp gap, the movable clamping bracket must be
removed in order to tighten the locking nut.

wrong !
Figure 6-6: Removing wire clamp - wrong way!

correct !
Figure 6-7: Removing wire clamp - correct way!

• Make sure that the clamping surface does not come into contact with
the ground or lie flat!

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6 Mechanical Settings

• If the clamp position needs to be changed (clamp : wedge distance),

make sure that no pressure is placed on the moveable assembly when
moving the Piezo spool assembly.

wrong !
Figure 6-8: changing clamp position - wrong way!

correct !
Figure 6-9: changing clamp position -correct way!

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 6 Mechanical Settings

• Do not overload the spring: For a wire diameter of 12 to 25 µm, the

distance between the setting ring and the base body for a completely
mounted wire clamp should be 10,7mm +/- 0,2mm. When using a
50 µm wire, the clamp force should only be increased minimally by pre-
loading the setting screw a half or maximum one rotation.

Note: The kurled nut is fixed using an allen-head screw. This may
only work on the free place on the clamping screw (slot) and
not on the thread!

wrong !
Figure 6-10: clamping screw - wrong adjustment!

slot
10,7 mm

correct !
Figure 6-11: clamping screw - correct adjustment!

• When not in use e.g. when exchanging the wedge, place the clamp in
a safe place where the clamp surface cannot be damaged (e.g. on a
sponge).

Figure 6-12: wire clamp in a safe place

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6 Mechanical Settings

6.3.1 Setting the Clamp Position

The transducer position is set prior to delivers and may not be changed. If
the delivered gauge is used for installing the wedge, the position of the
wedge is defined by this. Settings to the relative position of the wedge
and the clamp to each other can therefore only be carried out at the wire
clamp.
The position of the wire clamp can be set in three directions:
• distance to the wedge
• clamp height
• side direction for straight wire direction

setting the
distance between clamp height
clamp and
wedge

Figure 6-13: Clamp setting

Every position setting is secured with locking screws to avoid

unintentional movement. After correcting a position, these locking screws
must be tightened again (see Figure 6-13: “Clamp setting”).

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 6 Mechanical Settings

setting screw for

left/right position
of the clamp

Figure 6-14: Setting the side position of the clamp

For setting the side position of the clamp, the locking screw first must be
loosened. The clamp can then be moved to the left or right with the
setting screw (see Figure 6-14: “Setting the side position of the clamp”).
The wire track can be checked with the mirror (accessory box) by aligning
the microscope to the mirror positioned under the bondhead (see Figure
6-15: “Setting the clamp in the mirror image”).

moveable
fixed clamp
clamp bracket
bracket

wedge bond wire

Figure 6-15: Setting the clamp in the mirror image

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6 Mechanical Settings

6.3.2 Setting the Wire Feed

For the adjustment of the wire feed, the wire should be pulled through the
wedge hole and straightened between wire brake and wedge tool. The
grip area of clamp should be parallel to the wire and safely grip the wire.
If the wire does not run parallel to the clamp, the wire brake (which is
attached by two fixing screws) has to be adjusted. The wire clamp should
be placed as close as possible to the wedge tool.

Setting the Wire Brake

The wire brake was properly set at Hesse GmbH. The wire track in the
wire brake is lined up with the wire clamp and the wedge hole and should
not need any adjustment in this direction. If for any reason the height of
the wire brake or the entry angle of the wire into the wedge tool needs to
be changed, it is possible to move the wire brake after loosening the two
fixing screws (see Figure 6-16: “Setting the wire feed”).

wire brake
fixing screws

Figure 6-16: Setting the wire feed

6.3.3 Setting the Clamp Force

The wire clamp is adjusted ex-factory for safe clamping of a range of wire
diameters between 17µm and 35µm. If larger wire diameters have to be
clamped the clamp force might not be sufficient and require an
adjustment to increase.
• Loosen the set screw which locks the position of the adjustment
screw (knurl).
• Slowly turn the adjustment screw clockwise to increase the preload.
• When finished, fix the new adjustment by tightening the set screw in
the knurl.
• Pay attention not to increase the clamp force too much as to avoid
clamp marks on the wire.

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 6 Mechanical Settings

adjustment screw
for clamp force
setting

Figure 6-17: Setting the clamp force

6.3.4 Adjustment of the Wire Clamp Opening Gap

The opening gap of the wire clamp has to match the wire diameter
installed on the bonder. The ideal setting is achieved if the opening gap is
about double the wire diameter. If the wire clamp is not opened far
enough, this can lead to looping problems or wire breaks because of
excessive friction. An opening gap which is too large could lead to tail
inconsistency because the wire might slip between the clamp brackets
during tear-off.

• Remove the wire from the wire clamp.

• Move the bondhead to a suitable position such as the threading
position.
• Make sure the wire clamp is closed.
• Loosen the locking nut on the adjustment screw.
• Turn the bondhead into the 90° position.
• To inspect the opening gap, align the microscope and the inspection
mirror from the bonder accessory box in such a way, that the wire
clamp appears in focus from below. If the machine is equipped with
the „E-Box“ feature, the visual check can occur by this feature. To
do so, move the bondhead into the viewing area of the inspection
camera and select the view „Below“.
• Select the operation mode Setup and the register Wire Handling.
Open the Wire Clamp Setup dialog and close the clamp actuator to
by selecting the radio button Close.

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6 Mechanical Settings

Figure 6-18: Setup dialog for the wire clamp

• Turn the adjustment screw clockwise until some resistence can be

felt. Lightly tighten the adjustment screw with the locking nut.

Locking nut Adjustment screw

Figure 6-19: Mechanical setup of the opening gap of the wire clamp

• Enter a value of 10% in the Open entry of the dialog. Open the
clamp actuator by clicking the Open radio button. The wire clamp
should not open with this setting.
• Enter a value of 20% in the Open entry of the dialog. Open the
clamp actuator by clicking the Open radio button. The wire clamp
should just open with this setting. If this is not the case, select the
Close radio button and turn the adjustment screw slightly in
(towards the piezo actuator). If the wire clamp opens significantly at
a value of 20%, this means an opening gap can already be seen
clearly, the adjustment screw must be turned slightly back. Repeat
this adjustment step until the wire clamp just opens slightly at 20%
without showing a significant opening gap.
• Secure the setting of the adjustment screw by turning the locking nut
slightly(!) clockwise, without altering the previously found set point.
• Take off the moveable clamp bracket.

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 6 Mechanical Settings

• Secure the setting of the adjustment screw by tightening the locking

nut properly. The locking nut must never be fully tightened while the
moveable clamp bracked is attached to the bondhead! This could
cause damage to the piezo actuator.
• Re-install the moveable clamp bracket.

The adjustment of the wire clamp opening gap is now complete. The
opening gap should be about double the diameter of the installed wire.

6.3.5 Setup Wire

• Click the WI button on the key board or choose Threading in the
menu Action. It is available in all access levels.

Figure 6-20: Threading dialog

• In the Threading dialog the bondhead can be driven to the

Threading position with the corresponding button. The P-axis of
the bondhead can be rotated with the arrow keys in the dialog or the
function keypad.
• Switch off the Automatic wire despooler with the corresponding
check-box and click the button for Air off.
• Take the wire end under the start indication (colored sticker as
explained on spool) and unwind about two rotations of the wire with
a pair of tweezers.
• Place the wire spool on the spool holder so that the wire is unwound
in clockwise direction.
• Use the tweezers to guide the wire end through the vertical slot in
the wire sensor.

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6 Mechanical Settings

wire sensor
slot

wire spool

wire guide

Figure 6-21: Wire guide

• With the corresponding command buttons switch the Air on and

enable the Automatic wire despooler.
• Use the fishing wire to pull the wire through the wire guide tube and
the bondhead wire guide tube.
Below the wire feed tube, continue threading the wire through the
bondhead assembly with a pair of tweezers as follows:

• Feed the wire through the slot in the transducer.

Transducer

Wire brake
Wire clamp

Wedge

Figure 6-22: Wire path at bondhead

• Check that the automatic function is activated in the threading
dialog. Wire is then automatically fed when the sensor detects wire
is being used.
• Guide the wire around the wire brake.

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 6 Mechanical Settings

• Focus the microscope to the wedge tip with zoom factor 1.6.
• Use the arrow keys (left, right) on the keyboard to rotate the
bondhead to the 40° position in order to have a good view into the
wedge hole.
• Use the setting screw to remove the moveable clamping bracket.
• Straighten the wire in front of the clamp and make a „clean“ cut.
Approx. 5mm „tail“ should remain visible.
• Grip the wire by tweezers and feed the end through the hole in the
wedge tool. This step requires some training and may take some
time for an inexperienced operator. The key to success it to point the
wire end into the hole under the correct feeding angle. Pull some
wire through the wedge tool and straighten it.
• Mount the moveable bracket back on the wire clamp and feed the
wire by pressing the button WF until any bends in the wire are
removed. Cut the remaining wire.

6.3.6 Changing the Wedge

Before mounting the wedge, all obstacles must be removed from the
movement area of the bondhead.
• Move the bondhead to a free area with good access. Enter the
threading mode with the WI key and close the clamp by clicking the
WC key once.

• For easy access, remove the moveable clamping bracket by

removing the thumb screw. Avoid any mechanical stress or pulling
on the piezo actors. Place the clamping part carefully with the
clamping surface facing upwards in a safe place.

• Open the transducer screw and remove the old wedge tool by
pulling it downwards out of the transducer.

• Use the tweezers to guide the wedge tool from below into the hole of
the transducer. The wedge tool should protrude out of the
transducer (see Figure 6-23: “Exchanging the wedge”).

• Tighten the transducer screw hand tight.

• Place the wedge gauge on the holder. The standard protrusion is

21.8mm for a standard 1“ tool.

• Use the arrow keys on the keypad to move the bondhead slowly
downwards until the tip of the transducer touches the wedge gauge
and the error message Unexpected touchdown appears.

• Loosen the transducer screw so far until the wedge slides to the
bottom and rests on the gauge. The wedge tool must face with the
flat side to the front when tightening the screw.

• Tighten the transducer screw with the torque wrench until the
specified torque is reached (clicking sound).

• Reset the bondhead counter in the software.

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6 Mechanical Settings

Important: Make sure that the setting of the torque wrench is

between 12 cNm and 15 cNm. The torque wrench is
part of the bonder accessory box.

Hint: After changing the wedge, impedance and wedge

geometry calibrations must be carried out again.

Figure 6-23: Exchanging the wedge

6.4 Settings on the DA Bondhead

For a machine fitted with a Deep Access Bondhead several settings differ
to the procedures for the 45° bondhead. Apart from the settings
described in the following, all other chapters in the manual, especially
programming and operation remain unchanged.
The deep access bondhead is fitted with a wire clamp and a clamp blade.
These components are always switched simultaneously. The tear off is
carried out in controlled way when wire clamp is closed. The closed
clamp bade is used for controlled wire feed.

6.4.1 Setting the Distance from the Clamp Blade to

Wedge
The distance of the clamp blade relative to the wedge is set to factory
settings during bondhead setup and normally requires no adjustments.

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 6 Mechanical Settings

When exchanging the clamp blade or if it is moved unintentionally, the

following settings can be carried out.
• First check that the clamp blade can be opened and closed without
problem.
• Close the clamp blade by pressing the WC key on the keypad.
• Loosen the screws A and B which fix the complete clamping
assembly.
• Loosen the screw C which fixes the set screw D.
• You can then alter the distance with the set screw D. Turn the set
screw inwards to decrease the distance and outwards to increase
the distance.
• Fix the settings with the screw C.
• Tighten screws A and B.

D
A

C
B

Figure 6-24: Distance clamp blade to wedge

Optimum setting is achieved when the closed clamp blade has just
contact to wedge tip without wire between clamp blade and wedge.

Figure 6-25: Adjustment of clamp blade to wedge

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6 Mechanical Settings

6.4.2 Setting the Height of the Clamp Blade

Retrofitting the machine to a different wire diameter or using another
wedge sometimes requires settings to the height of the clamp blade.
In the optimum adjustment the lower edge of the clamp blade should be
at about the height of the upper edge of the hole in the wedge tool. It is
important to be aware that the bonds which lie close together, will not be
damaged when ist clamp blade opens.
The height can be set as follows:
• Make sure that the clamp blade is closed.
• Loosen screws E and F.
• Move the clamp blade assembly in the slotted holes and guide
upwards and downwards by using the knurl. The height can be
adjusted with a tolerance of +/- 1mm.
• Tighten the screws once the correct setting has been made.

E
Knurl
F

Figure 6-26: Clamp blade height

6.4.3 Setting the Angle of the Clamp Blade

Different clamp force is required for different wire diameters, material or
ribbon. This force can be set by changing the angle of the clamp blade to
the wedge. The distance and the angle to the wedge influence each
other. The optimum setting is reached if, with closed clamp, the force is
enough to tear off the wire without damaging it. This is the case if the
clamp has a contact area rather than a single point contact. For this, the
angle should be set as low as possible.
• Setting the angle is carried out as follows:
• Loosen screw G which fixes the setting screw.
• Turn the setting screw H inwards to reduce the angle and outwards
to increase it.
• Tighten screw G once the optimum setting is reached.

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 6 Mechanical Settings

H
G
Figure 6-27: Clamp blade angle

6.4.4 Setting of the Alignment of the Clamp Blade to the

Wedge Tool
The clamp blade is set at factory settings so that it is exactly central to the
wedge tool. Small alterations can occur when exchanging the clamp
blade. Adjustments must be carried out to ensure perfect clamping.
• Loosen both screws I which fix the clamp blade to the moveable
clamp holder.
• Move the clamp blade in the holes so that it is as flush as possible
with the wedge tool.
• Tighten the screws.

Figure 6-28: Alignment clamp blade to wedge tool

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6 Mechanical Settings

6.4.5 Threading Position of the Clamp Blade

For easy threading or for exchanging the wedge the clamp blade can be
swung to the side without losing any of the settings.

Figure 6-29: Threading position clamp blade

6.4.6 Setting the Wire Clamp Opening

The clamp opening is set by Hesse GmbH at bondhead calibration.
Alterations to the opening could be necessary after changing to a
different wire diameter. Optimum setting: Clamp opening approx. 2-3
times the wire diameter with a clamp opening of 50%.
• Move the bondhead to a suitable position e.g. the threading position.
• Make sure that the wire clamp is closed.
• Loosen the locking nut on the setting screw K.
• Rotate the bondhead so that you see the side of the clamp opening.
• Open the Wire Clamp menu in operation mode Setup. In the Open
dialog, select Up (wire clamp). Set the clamp actuator to Closed.
• Screw in the setting screw until you feel slight resistance. Tighten
the setting screw slightly.
• In the dialog Open, enter a value of 20%. Switch the clamp actuator
to Open, the wire clamp must not open with this setting.
• Close the clamp actuator. Alter the setting of the setting screw if
necessary.
• In the dialog Open, enter a value of 30%. Switch the clamp actuator
to Open, the wire clamp should open just slightly with this setting.
• Close the clamp actuator. Alter the setting of the setting screw if
necessary.
• In the Open dialog, enter a value of 50%. Switch the clamp actuator
to Open, the wire clamp should open 2 - 3 times the wire diameter
with this setting.
• Close the clamp actuator.

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 6 Mechanical Settings

• Lock the setting screw K with the locking nut without altering the
settings made.

K
Locking nut

Figure 6-30: Wire clamp opening

6.4.7 Setting the Clamp Force

The same conditions apply to the wire clamp as for the clamping blade.
The force should be enough to clamp the wire with closed clamp for a
controlled tear off. Too great a force could leave clamp marks or wire
slivers on the wire surface. Set the clamp force as follows:
• Loosen the set screw L which fixes with knurl M.
• Turn the knurl inwards to so the spring load increases the force.
Turn it outwards to loosen the spring and reduce the force.
• Lock the optimum settings with the set screw L again.

Figure 6-31: Wire clamp force

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6.4.8 Exchanging the Wedge

The wedge is exchanged in the same manner as with a 45° bondhead.
For a deep access bondhead the wedge gauge is used for 22,3 mm
protrusion. The protrusion may have to be set depending on the tool or
wire material and the clamp blade height adjusted.
Option: Tools with other lengths are required for larger diving depths. In
order to achieve a clean tear off, other clamp blades of different
dimensions are available.
The torque of the transducer screw is the same as for a 45° bondhead:
12cNm to 15 cNm.
After wedge exchange an impedance measurement and wedge
calibration should be carried out.

6.4.9 Threading
Threading the wire from the despooling station through the wire guide is
the same procedure as for the 45° bondhead. The wire is drawn through
the plastic tube inside the metal wire guide with the threading wire.
Below the wire guide, threading is carried out with tweezers.
• Disassemble the moveable clamp bracket.
• Turn the knurl out and remove the clamp bracket. The force setting
is not altered.
• Guide the wire past the fixed clamp bracket.
• Place the wire below the wire clamp between the two pins to ensure
optimum positioning to the transducer hole.
• Swing the clamp blade to the rear by lightly pressing the knurl J
against the spring and rotate it clockwise. The clamp blade is held in
this position until you turn the knurl back.
• Thread the wire through the transducer hole.
• Push the wire as far through as required, so that you can use the
tweezers to thread it through the hole in the wedge.
• Replace the moveable clamp bracket and guide the wire through by
pressing the WI key until a perfect straight wire end is reached. Cut
off the rest of the wire.

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Wire feed tube-

Wire clamp
Guide pins

Clamp blade
Wedge

Figure 6-32: Threading

• Check the functionality of the wire clamp and the clamp blade with
the WC key.

6.4.10 Wire feed for Ribbon

The wire feed unit below the clamp is designed to guide the wire between
two pins straight through the transducer feeding hole. It fits wires in a
range of 25 - 70 µm diameter by default.
For bonding ribbon this unit has to be changed. The guide pins in the
ribbon feed assembly are spaced at a greater distance. This additional
wire feed unit is delivered in the bonder accessory box.

Figure 6-33: Wire feed unit

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6 Mechanical Settings

• Position the bondhead as shown in the figure above. Loosen the

screw which is marked P with an allen wrench.
• Pull the unit off the bondhead.
• Place the new unit onto the bondhead. The ideal position is reached
when the wire or ribbon will be feed in the center of the transducer
feeding hole. The position is limited by the dimension of the
elongated hole.
• Fix the wire feed unit by tightening the allen screw marked with P.

6.4.10.1 Adjust the Gap Width on the Wire Sensor

For processing ribbon up to 250 µm width, the gap width on the wire
sensor must be adjusted as well as the wire guide on the bondhead, so
that the wire transport is possible without contact to the surrounding
surfaces. The standard cover plate is disassembled and replaced by one
with a larger gap width. (Art.-Nr. 33025)

Cover plate

Figure 6-34: Wire sensor

The cover plate is fixed by 4 allen screws. After removing these screws,
the cover plate can be removed and replaced by the new one using the
same screws for fixing.
the cover plate can be adjusted to position tolerance in the slotted holes.
During assembly, make sure that the sensor is exactly above the
reflection surface (hole) in the cover plate. If this is not the case, the wire
cannot be recognized optimally, or the amplifier displays a value below
4000.

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Reflection surface Sensor

Figure 6-35: Wire sensor, ribbon cover plate

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 7 User interface

USER INTERFACE
CHAPTER7

7.1 Login to the System

Enter a login name and a password into the login screen.

Figure 7-1: Login screen

The initial login to all operation modes requires a password given by

Hesse GmbH to an adequately trained and instructed administrator.
All further logins can be allocated by the administrator according to the
experience and tasks of the individual operator.

7.1.1 Smart Login

Whilst the machine is in „Production mode“, a further user with access
authorization can log in to the „Programming“ and „Setup“ modes to
make program changes and carry out tests. The operator does not need
to logout for this. The changes made can be stored permanently.
Production can be resumed after returning to the „Production“ mode.

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Hint: The machine will automatically return to Production

mode if no further changes have been made during the
last 5 minutes. The user must login again to work in
another mode.

The option Smart-Login can only be activated or deactivated by the

administrator in menu Program Variants/Miscellaneous. It can be
limited to production mode.

7.2 User Authorization

User rights are divided into five access levels according to the experience
of the operator:
• Production (Manufacturing)
• Manual Bonding
• Installation and Calibration
• Programming
• Administration
• Service

Production
The currently loaded program is processed in Production mode. The
production process is controlled in this level and all production related
settings and adjustments are possible. Access to higher levels is not
possible.

Manual Bonding
In this mode, all users who create programs or carry out machine setup
can manually bond wires without creating a complete program. The main
purpose of this mode is to test wires, to check quality, find correct
parameters or check anything else that influences bond results.

Setup and Calibration

The prerequisites for the use of the bonder are defined in this level. This
is where the general parameters are set and all necessary calibrations
made for a smooth production process. The necessary mechanical
settings for the wedge and wire guide are entered in Setup mode.

Programming
Programming requires extensive knowledge of the performance of the
BONDJET BJ820 and its software. The functions and commands in this
level enable the compilation and processing of bonding programs.

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Administration
The administrator is primarily responsible for administrative tasks. He can
save, edit and administrate all machine data, process data and
programs. He is also responsible for user administration by allocating
access rights and establishing a log book, transferring data between the
bonder and an external PC and the PBS200, a host PC via network or
profibus communication. The system parameters can be viewed in this
mode and a process window can be defined by the administrator by
entering parameter limits.

Service
The service menu should only be accessible to trained personnel and is
therefore not described further in this operator manual. Operators who
have taken part in a service training of the Hesse GmbH will receive a
special service manual concerning error diagnostics, repairs and
maintenance. Service personnel perform error diagnostics and have
access to internal machine parameters in the hardware and axis
configuration.

7.3 Monitor Layout

The multifunctional interface of the BONDJET BJ820 has a similar layout
to conventional program layouts. It consists of:
• A menu bar.
• A status bar.
• A symbol bar showing the positions of the axes, the lamp status and
the network connection.
• The program window with the live camera image or a background
image and the operation interface for programming and setup.
• An information bar where some system modes can display action
commands.
• The navigation bar to change to another access level.
• Symbols for light and zoom functions.
• Display for the light status, the Num-Lock and clamping status and
the clock.
• Information bar concerning the current program.

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Menu bar program window status bar logout

with camera image shutdown
axis position

illumination navigation bar zoom clamp status

program info information bar
Figure 7-2: Program Interface

7.3.1 Menu Bar

The menu bar of the software interface contains all items necessary for
full access to the menus available at the given level. It is displayed in all
modes.
After a menu has been selected a list of menu items or functions is
opened. Menu items followed by dots, e.g. Setup user access..., open
dialog or editing windows. If a menu item is followed by an arrow it
contains submenus.

7.3.2 Axis Positions

The current axis positions are displayed on the right side of the symbol
bar. The X, Y and Z axis are shown in mm and the P axis in degrees.

7.3.3 Logout, Switching off

The logout symbol, next to the position display, opens the logout dialog.
A user can logout here and allow access for another user without having
to switch off the machine. The current user name is shown under the

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logout symbol. If the off button is clicked, a warning appears and the
action has to be confirmed. The bonder can now be switched off.

7.3.4 Navigation Bar

Here, all accessible modes are displayed with symbols:
Production, Manual bonding, Setup, Programming, Administration
and Service.

7.3.5 Program Window

The program window is the interface between the operator and the
machine.
In programming and setup modes, the live camera image is displayed in
the left part of the program window. The image is in gray scales and is
updated continuously. A crosshair represents the center of the camera
image.
The bonding program, the movement limits, bonding area and working
area are displayed next to the current image.
The axes movement using the trackball is depicted by a crosshair when
the pointer is inside the camera image.
The depiction of the trackball pointer, crosshair, limits of movement,
bonding and production areas can be individually customized.
The scale at the bottom right of the camera image shows the zoom factor.
In modes where no camera image is displayed, the monitor displays a
background image, editing window or diagram.
To the right of the camera image on the screen is the operating window
for programming and setup. It contains buttons for opening dialog or
editing windows.
Dialogs opened by selecting commands or functions appear in the center
of the screen.

7.3.6 Information Bar

This bar contains information about the steps required for programming.
They are shown in green when a teach point needs to be defined.
Commands or instructions are shown in red if a correction is possible, or
necessary.

7.3.7 Other Displays

The currently loaded program is shown in the Program Information
under the camera window. An star appears before the program name if
the program has been changed, but not yet saved.
The Material Clamping display is shown on the right hand side. The
symbol is displayed red for open status and green for closed status.

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The Safety Cover status symbol is displayed in different colors as

follows:

green = safety cover open and safety circuit off

red = safety cover open and key switch on I (adjustment

mode). The warning lamp in the machine flashes

yellow = manual material change

gray = safety cover closed and locked

The Num-Lock function is displayed when activated.

The Current time is displayed in the far right corner of the status bar. It
can be adjusted to the users time zone.
The status of the Signal Lamps is shown in the top right corner next to
the axes positions display. The two adjacent indicators are only activated
if a profibus communication or a PBS200 communication is installed.

7.4 General Operation

Operation of the software interface and movement of the axes generally
takes place using the keypad, the trackball and the trackball buttons. For
some operational purposes it is advisable to use either the keyboard
integrated into the console or a software keyboard that can be activated
in certain dialogs.

Menus and menu items

To select a menu, position the trackball pointer on it and click the left
trackball button. A list of menu items and functions is automatically
displayed. Menu items followed by three dots, e.g. Define User... have
further dialogs or editing displays. Menu items followed by an arrow
branch into further submenus. To select a menu item or activate a
function, position the trackball pointer and confirm by clicking the left
trackball button.

Camera Window
In the camera window the axes can be moved by using the trackball.
Pulling the trackball pointer from the program interface into the camera
window changes it into a crosshair. By clicking the left trackball button
and moving the trackball the axes are moved in the X/Y direction.
Releasing the button stops the movement. The speed and direction of the
movement depend on the position of the trackball crosshair in relation to
the fixed camera crosshair. The greater the distance, the higher the
speed. In keeping with a normal coordinate system the axes move in a
positive or negative direction. If the option Sizing is activated, the display
of the trackball pointer in the camera window changes to a ruler, or can
be changed individually.

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Figure 7-3: Movement and direction of the axes

Clicking the icon will open two scroll bars which regulate the light
sources. The upper scroll bar is for the vertical light of the camera, the
lower scroll bar is for the LED ring light on the bondhead.

Figure 7-4: Scroll bar for illumination and zoom

The zoom function is activated by clicking the symbol. The size of the
camera image can be altered with the scroll bar. The current zoom factor
is displayed in the upper right corner of the camera image.
The measurement function is activated by clicking the symbol. A
distance in the camera image can be measured with this function. The
start point is determined by clicking the right trackball button. Clicking
again defines the end position. A line connects the two positions and the
length is displayed.

Buttons and Radio Buttons

Functions are activated or dialog and editing boxes are opened by
clicking on radio buttons or buttons. Buttons with a number can be
activated by the appropriate number on the keypad or keyboard.

Figure 7-5: Function buttons

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7 User interface

In front of some buttons there is a small button with a + symbol. Clicking

this opens a parameter window. The button with a - symbol closes this
and returns the user to the original dialog box.

Figure 7-6: Additional dialogs

Dialog and Editing Boxes

There are various operation elements for entering text or digits into the
dialog boxes. Digits can be entered by using the number block of the
keypad.
In some dialogs, a previous entry can be changed by clicking the up or
down arrow button next to the box, or by using the scroll bar.

Figure 7-7: Editing box

To move between dialog boxes use the arrow keys on the keypad or
position the trackball pointer and confirm with the trackball button.
To enter text use the keyboard in the console.
Next to some editing boxes there is a key symbol that activates a display
keyboard when it is clicked with the left trackball button. Select the letter
by clicking with the trackball and confirming with the ENTER key.

Figure 7-8: Display keyboard

Lists and Directories

Some menu items open lists or directories. To select items use the arrow
keys or position the trackball pointer and confirm with the left trackball

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 7 User interface

button or the ENTER key. The selection then appears in the header of the
editing box and can be processed by using further commands.

Register
Some menu items open dialog boxes with registers. To change the
register click on the desired register card with the left trackball button.

Figure 7-9: Register

Selecting Colors
The color of some screen elements can be selected from a color range
and altered. In the menu item Display there are various color scales in
which the current color is outlined. A new color can be selected by
clicking the arrow keys or using the scroll bar next to the color range. The
new selection must be confirmed using the ENTER key or the left
trackball button.

Figure 7-10: Color range

7.5 General Functions

There are some general functions necessary for operating and setting up
the machine already available in the software. They can be found in the
menu Settings or Action.

7.5.1 Referencing
After switching on the machine and activating the safety circuit the axes
must be referenced, i.e. all axes are moved to the starting position so the
controls can be given a defined starting position. The position display of
the axes takes this as the zero position.

7.5.2 Threading
Threading is a function that is often necessary for the setup and the
production process and is thus available on this access level. The
command Threading... opens the dialog box.

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Figure 7-11: Threading

When the button Threading position is clicked the bondhead moves to a

freely programmable axes position. When the Original position button is
clicked it returns to its previous position. The P axis can be changed to a
convenient threading position by using the arrow keys. If the function
Automatic is active, the wire feeding is automatic. If manual wire feeding
is required or if the wire sensor cannot register any wire, the button Wire
spool must be clicked.

7.5.3 Offbond
An offbond is carried out in order to create a defined tail e.g. after a height
measurement or after threading. Offbond positions are specially defined
for every holder in the calibration menu.
• Select the menu Action/Offbond to move to the predefined
position. The camera window for the defined offbond position
automatically appears.
• If more than one Position was defined, you can select the position
in the dialog box below the camera image.
• Confirm and start offbond with the right trackball button.
• In operation mode Setup/Wire Handling under the Settings menu,
the option Automatic can be activated which initiates automatic
offbond after error or after a number of x bonds.
• Offbond can be started with the key combination Shift + Stop or
Shift + F6.

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Figure 7-12: Offbond

7.5.4 Move to Start Position

With this function the bondhead is moved to the zero position.

7.5.5 Move to Park Position

The bondhead is moved to the set parking position.

7.5.6 Index Step

This function initiates a material change. Clamping is activated. The
clamping status is displayed on the monitor.

7.5.7 Markings
In the menu Settings/Markings..., the dialog is opened where the
display of pad markings, wires, search areas and reference points can be
altered. Colors, line thickness and text can be set. The activated settings
can be viewed in a preview window

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Figure 7-13: Markings

7.5.8 View
The individual indicators displayed in the camera window can be altered
as required.
Crosshair: The crosshair showing the center of the camera can be
turned on or off and the color can be selected.
The trackball in the camera window: The type of trackball pointer can
be set. If the option Pad marking is selected, the trackball pointer in the
camera picture is the same as the setting in the dialog Marking for the
pad marking. If the trackball pointer is set to a crosshair, its dimensions
can also be set. It is divided into 50 µm sections by the option Sizing. If
the option Pattern size is activated, a rectangle the size of the search
pattern is displayed when teaching a pattern.
The depiction of the crosshair can additionally be set to Alternate and
Inverse.

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Figure 7-14: View settings

If the option Inverse has been selected for the crosshair, the „negative
color“ appears in every pixel of the camera image. i.e. the crosshair is
black on a white background, and white on a black background for better
contrast.

Figure 7-15: Crosshair „Inverse“

With the option Alternate, the crosshair is shown in alternating color for
better visibility, the color can be selected from the list.

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Figure 7-16: Crosshair alternating

Both options can be used simultaneously.

Limits: The display of the limits can be switched on and off. Movement
outside the limits is impossible. The bonding area is the area in which
bonding takes place. Bonding can safely take place at any angle inside
the main bonding area.
Readouts: With this setting, the options Scale, Zoom, Score and Lighting
can be activated and the colors for the individual options can be selected.
When zooming in the camera image, the factor is shown in the upper
right in the selected color. When teaching patterns, the score is displayed
in the selected color. If the illumination display is clicked, the % value of
the light intensity is shown in the selected color and the scale in the lower
right of the camera image has the selected color.

7.5.9 Factors
The setting of the Factors in Settings\Factors... influences the overall
speed of the bonder and can be used to match up slight deviations in the
effect of the welding parameters from one machine to another. The
values are changed as a percentage of the normal output.

The Bond Override affects the speed during the bonding process.
The Movement Override affects the speed of all axes movements. In
adjustment mode the movement override is limited to 25%.
The US Factor affects all ultrasonic output.

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Figure 7-17: Factors

In Administration mode there is another factor to limit the axis

movement, while user invention. This can be found in menu axes
parameters. The Override User is set to 25%. This is to protect the user
while observing the process through the microscope.

7.6 Logout
The functions Logout and Shutdown Bonder are available at all access
levels. They can be found in the list of menu items in the first menu or can
be activated by clicking the symbol: for logout or: for
shutdown in the upper right corner of the screen.

7.6.1 Logout
The software is exited with the command Logout. Additionally, other
users can log in to their specified access level.

Figure 7-18: Logout

7.6.2 Shutdown
The function Shutdown is used to securely switch off the machine. A
dialog box appears which must be confirmed.

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Figure 7-19: Bonder Shutdown

By confirmation all data is saved and the machine can be switched off.

7.7 Operation of Key Combinations

Many program functions can be controlled directly over the keyboard with
hotkeys (individual keys or key combinations). The use of the hotkeys is
dependant on the respective operation mode.

Hotkeys General

Hotkey Meaning

Esc Abort current function, exit a menu

Cursor Z axis higher
Cursor Z axis lower
Shift+Cursor Z axis quick higher
Shift+Cursor Z axis quick lower
F2 Compressed air on/off
F3 Threading
Shift + F4 E-Box
F4 Wire feed (only thin wire bonder)
F5 Wire clamp open/closed
F6 Stop
Shift + F6 Offbond
F7 Clamping open/closed
Shift + F7 Vacuum on/off
F8 Lock
F9 Index step
F10 Step
Alt + B Cycle time per loop

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Hotkey Meaning

Alt + C Cycle time per chip

Alt + L Brightness display
Alt + M Microscope lighting on/off
Alt + P Fieldbus diagnostics
Alt + S Screenshot
Alt + T Save camera image
Alt + V Open bondplan
Alt + X Logout
Alt + Z Stop watch
Alt + 1 Operation mode Production
Alt + 2 Operation mode Manual bonding
Alt + 3 Operation mode Setup
Alt + 4 Operation mode Programming
Alt + 5 Operation mode Administration
Alt + 6 Operation mode Service
Load
Strg + O

Save
Strg + S

Exit
Strg + Q

Parameter
Strg + P

Special Hotkeys for Operation Mode Production

Hotkey Meaning

Enter Start production

Strg + T Step
Strg + S Reason for downtime

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Special Hotkeys for Operation Mode Programming

Hotkey Meaning

Strg + A Teach reference system

Strg + B Teach board / chip
Strg + C Teach wire
Strg + D Bond program
Strg + N Create program
Strg + K Copy reference system in register Teach
Ref.system
Copy series of wires in register Teach
Wires
Strg + S Save program
Strg + V Move series of wires
Strg + Einfg Insert series of wires
Strg + Entf Delete series of wires
Einfg Insert reference system / wire
Entf Delete reference system / wire
Strg + F Define focus
Strg + R PR Parameter
Strg + H Measure height

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7.8 Add-on for Software-Update 3.77

7.8.1 Referring to Chapter 7.4 “General Operation”
Clicking the symbol allows reduction of manually initiated movements
to one axis. If XY is selected, both axes are moved. If X is selected, only
the X-axis is moved. If Y is selected, only the Y-axis is moved.

Figure 7-20: manually initiated axes movement

7.8.2 Referring to Chapter 7.5.8 “View”

With Advanced, an additional object can be placed in the center of the
crosshair when teaching a pattern or teaching a bond pad. This can be a
pattern marking (acc. a bond pad marking) or a user defined form (circle /
rectangle).

Figure 7-21: view settings - new

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Figure 7-22: view settings - “Advanced“

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 8 Calibration

CALIBRATION
CHAPTER8

The machine is generally delivered with all devices already calibrated.

The devices are measured under the given conditions and the values are
documented in a protocol. Calibration should be carried out again after
any changes made due to exchanging or modifying parts or after any
settings.
Calibrations will be enforced in user authorization Setup but users
must have this access rights.
The user interface in the setup menu is split into 4 groups. Click the
register to select a specific group.

Calibrations: All the input dialogs for calibration of the devices are
found in this register.

Wire handling: All wire specific settings are carried out in this register.

Holder: The settings for possible holders or indexers are

outlined in this register.

Quality: Settings regarding quality control of wires can be dealt

with in this register.

In the active register, a dialog can be selected by clicking the command

button or entering the respective number.
If the trackball is in the camera window, some dialogs will display
instructions in green writing in the information bar.

Important: Data must be saved after every successful calibration

step. Only saved data is used! Calibration values which
are outside the allowed tolerances are displayed in the
values box in red.

The measured values for all devices are displayed in the registers
Calibration and Wire handling.
The currently selected calibration function is displayed in the status bar.

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8.1 Group Calibrations

Figure 8-1: Register calibrations - overview

8.1.1 Bondhead (1)

Every bondhead has its own bondhead disk which contains the hardware
data.
When a bondhead is installed, the data from this disk is loaded and
displayed in the calibration dialog.
• Check that the data corresponds with the installed bondhead.
• Check the calibration data in the Bondforce and Wire Clamp dialogs.
When the command button Bondhead (1) is clicked you will be asked if a
bondhead disk should be created from the current data.
• If you confirm with OK, you will be asked to place a disk in the disk
drive. The progress is displayed by a progress indicator.
• You can leave the dialog with Cancel.
• If you confirm with No, you will be asked to insert a disk for the new
bondhead so the data can be loaded.
• You can leave the dialog with Cancel.
A bondhead disk can be created in Administration mode/Extras under
the option Create bondhead disk...

8.1.2 Camera (2)

The software supports 3 cameras with different functions. The bondhead
camera (1) is used for pattern recognition. With the taught patterns which
are found on the substrate, exact positioning of the wire can be effected.

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With the inspection camera (2) the wedge and wire guide settings can be
checked and reproduced.
An optional additional camera which is fitted above the bondhead can be
aligned at an angle to the bondtool. This serves for checking the
accessibility of bond positions (3).

Bondhead
camera 1

Bondposition camera 3
Figure 8-2: Bondhead camera and bond position camera

Figure 8-3: Inspection camera - “camera 2 - E-Box“

Calibration of a camera is generally only necessary if individual

components of the pattern recognition system have been exchanged or if
settings have been altered.

Calibrate Bondhead Camera 1

• Click the command button Camera 1 to open the dialog.
• Select the camera with the arrow keys or edit the number.

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Figure 8-4: Camera 1 - calibration

Settings
In this dialog, the conditions for determining the pixel relation are defined.
This also means the parameters for pattern recognition and for the X - Y
direction moving distance.
• Click the command button Settings.
• Define the selected distance Offset.
• Activate the function Auto Detect. A comparable pattern is
automatically searched for with the pattern recognition. The settings
for pattern recognition can be changed in the Parameter dialog.
• Confirm with OK.

Figure 8-5: PR parameters for camera calibration

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Focus Distance
• Move the bondhead to a position on the current holder where the
measurements can be made.
• Focus the image using the arrow keys.

Figure 8-6: Teach focus distance

• Confirm the dialog. The bondhead moves with the tip of the wedge
tool to touchdown and measures the height.

Pixel Relation
A pattern is taught at a manually determined point to determine the pixel
relation of the camera image. Then the bondhead moves in the X and Y
direction to the Offset entered in the calibration parameters. The taught
pattern is then searched for with the pattern recognition and the relation
(µm/pixel) is calculated.

Hint: The selected pattern should be on a chip. It should have a

clear structure and good contrast. There should be no
similar patterns in the immediate vicinity.

• Click the command button Pixel relation.

• Move a prominent point to the center of the camera image and
confirm with the right trackball button.
• The camera teaches the selected pattern, the bondhead moves over
the offset in X and Y direction. The taught pattern is then searched
for and the pixel relation (µm/pixel) is calculated.

Hint: The displayed values for the pixel relation should be

almost the same for the X and Y direction. Deviations
indicate misalignment.

• Values which are outside of the allowed parameter limits are

displayed in red. Calibration must be carried out again. Check the
parameter limits if the problem has still not been rectified.
• Save the measured values.

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8 Calibration

• The command Back returns you to the main dialog of the calibration
menu.

Calibrate Inspection Camera (Optional)

The inspection camera is generally fitted below the left Y axis and serves
the reproducible settings of the wedge.

• If this camera should be calibrated, click the radio button Camera 2

in the camera calibration menu.
• Manually move the bondhead to a suitable position in the image
area of the inspection camera. You can automatically move to an
already defined position in the E-Box menu with the command Move
to.

Figure 8-7: Calibrate inspection camera 2

• Under Settings, define a camera offset of 500 µm and under

Parameters, select the algorithm, the search area size and pattern
and the search accuracy.
• Click the command button Pixel relation.
• Move a distinctive point to the center of the camera image and
confirm with the right trackball button.
• The camera teaches the selected pattern. The bondhead moves
over the offset in X - Y direction. The taught pattern is then searched
for by pattern recognition and the relation (µm/pixel) is calculated.
• Save the measured values.

The calibration values for pixel relation are displayed in the box
Measured values. They are displayed in red if they are outside of the
allowed tolerances. In this case, calibration should be repeated.

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 8 Calibration

• The command Back returns you to the main dialog of the calibration
menu.

Calibrate Optional 2nd Bondhead Camera

The 2nd bondhead camera is aligned to the wedge tip at an angle of 45°
and serves the position control. During calibration, the pixel relation and
the offset are calculated to bondhead camera 1.
• Select the camera Camera 3 in the calibration menu. The 2nd
bondhead camera is displayed in the camera window.

Figure 8-8: Calibrate bond position camera 3

• Click the command button Pixel relation.

• The system automatically changes to bondhead camera 1. If the
trackball is moved in the camera window, a prompt appears below
the information bar to teach 2 points.
• Move the bondhead camera over the substrate and mark 2 points
without moving the axes. If this step is confirmed with Quit, the bond
position camera dialog to activated.

Figure 8-9: Bond position camera 3 - pixel relation

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8 Calibration

• Move the bond position camera over the substrate and teach both
these points with this camera.
• After confirming the 2nd point, the pixel relation is calculated from
the offset. Unlike the bondhead camera where the pixel relation in X
and Y should be almost the same, a deviation in the X and Y for the
bond position camera is normal.
• Save the calibration results and exit the dialog with Back.

8.1.3 Sensor (3)

The sensor has already been electronically preset and requires no further
calibration. This command button cannot be activated.

8.1.4 Bondforce (4)

The effective bondforce during bonding is made up of 3 factors:
1. Force from the bondforce actuator (force constant)
2. Force from the bondforce spring (force offset)
3.Force from the parallelogram (spring constant)

To determine these parameters, 3 measurements are carried out.

(Optionally, a 4-point or 6-point calibration can be initiated which leads to
increased accuracy in the border area of the force range. The results of
the force constants are displayed under K2 for 4 point and K3 for 3 point
calibrations).
• Click the command button Bondforce 4 in the calibration dialog.
• Click the function Calibration.

Figure 8-10: Calibrate bondforce

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• Move the bondhead to a position on the holder where the scales can
be placed on a secure surface.
• Move the z axis to the highest possible position.
• Place the scales centrally under the wedge.
• Move the bondhead downwards until a safe distance between
wedge and scales surface has been reached.

Figure 8-11: Scale for force calibration

• Click Start in the dialog.

• The bondhead touches down on the scales with force 1. A defined
voltage is applied to the bondforce actuator. The force value can be
read in the display of the scales.
• Enter the value in the dialog.
• Click the command Next.
• The bondhead touches down on the scales with force 2. A new
defined voltage is applied to the bondforce actuator. Read the force
value from the display on the scales.
• Enter the measured value.
• Carry on as above to measure a 3rd value.
• The values are displayed on the right next to the camera image in
the values box.
• Click the command button Characteristic to view the graph.
• The value can be changed in the editing box Overtravel and a
graph generated.

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8 Calibration

Figure 8-12: Bondforce graph

Hint: The graph should be a straight line from -10V to +10V and
intersect the 0V line at roughly 85cN +/- 10cN.

• Click the command button Test to check the calibration results. The
wire must be threaded and lie in the groove. The encoder roller must
not be folded away.
• Click the radio button Bondforce.
• Enter the force in the dialog (which is dependant on the wire
diameter and the bondforce spring) and start the test process by
clicking the command button.

Figure 8-13: Test bondforce

• This value must be reached on the scales after touchdown. The

calibration should be repeated if there are large deviations. A
tolerance of +/-3cN is allowed.
• Save the calibration values.
• The calibration values are displayed under Values. If they are
outside of the allowed tolerances they are displayed in red.
Calibration must be repeated.
• The command Back returns you to the main dialog of the calibration
menu.

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8.1.5 Ultrasonic Generator (5)

Calibration of the ultrasonic generator is necessary after exchanging the
bondhead or the transducer. Calibration should also be carried out in
case of bond quality changes with parameters that have previously given
good results. The target of this calibration is the determination of the
digital resonance word where the PLL of the ultrasonic generator
engages safely at the expected frequency.
Click the command button Ultrasonic Generator 5 in the Calibration
menu.

Figure 8-14: Calibrate ultrasonic

• Remove the wire from the wedge.

• Open the Settings dialog by clicking the command button. Enter the
target frequency of the bondhead. Enter an interval in the Search
area box where the resonance frequency can be determined.

Figure 8-15: Ultrasonic generator settings

• Click the command button Calibrate to start automatic calibration. In

the search area, the appropriate voltage values are determined in
small steps starting from the frequency word respective to the
smallest frequency.

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All values are recorded and displayed as a graph under Characteristic.

Figure 8-16: Ultrasonic graph (example)

• Save the calibration values.

• The calibration values are displayed under Values. Values outside
the allowed tolerances are displayed in red. In this case, repeat
calibration.
• The command Back returns you to the main dialog of the calibration
menu.

8.1.6 Wedge (6)

The position of the rotational axis relative to the wedge and the camera
offset is determined during calibration. 2 or 4 bonds or marks are carried
out and their positions calculated.
The position of the wedge can vary if the wedge has been changed or
settings have been made to the bondhead.
• Select the command button Wedge 6, to open the calibration dialog.

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 8 Calibration

Figure 8-17: Calibrate wedge

Settings
The specific data for the wedge and other settings for the calibration are
made in the Wedge Settings dialog before calibration can take place.
During calibration, the bondhead moves to the defined park position.

Figure 8-18: Calibrate wedge- settings

• Enter a Name for the wedge.

• Enter the Serial number if available.
• The bonds or markings are placed at the distance entered in the
editing box Y-Offset.
• Enter the Distance between the Source and Destination bond.
• Define if Wires, Single bonds where only destination bonds are
placed or only Markings should be carried out.

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• Activate or deactivate the function Step by step if the bond process

should be stopped at each defined position.
• For carrying out the bonds, you can select parameters from a list of
Bond Parameters for the wire diameter by clicking the symbol.
Click the symbol , to edit the parameter set.
• Confirm with OK.

Measure Height
Before a wire is bonded, the height must be defined where the
touchdown is expected.
• Move the bondhead with the moveable crosshair in the camera
window to a suitable position on the test substrate.
• Click the command button Measure height.
• The bondhead moves to touchdown.
This calibration step is urgently required. Changes settings at wedges
can damage the bondhead when bonding with at modified height. For this
reason the height measurement can be enforced, if activated in Program
variants - Miscellaneous/Height measuring before wedge calibration

Calibration
• Move the bondhead to a free position on the test substrate.
• Activate the product clamping if necessary.
• Once all settings have been made, click the command button
Calibrate to start the program for calibration of the Wedge/Camera
Offset.
• If Wire - 2 points was activated in the settings dialog, the bonder
bonds 2 wires with the predefined S-D distance and Y Offset at an
angle of 180°. Only the destination bond is bonded if Single bond
was selected. If the setting Marking was selected, the bonder only
places a mark on the surface with force and ultrasonic without
expecting a bond.
• After bonding, the bonder automatically moves with the camera
crosshair near to the first destination bond.
• Position the moveable crosshair as accurately as possible in the
Center of the Bondfoot.

Hint: It is helpful to use the zoom function in the camera

window for exact positioning.

• Confirm the position by clicking the right trackball button.

• The bondhead automatically moves to the second destination bond.
• Position the moveable crosshair as accurately as possible over the
Center of the second Bondfoot.
• Confirm this position with the right trackball button.

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 8 Calibration

• If 4 point was activated under settings, continue as described above

for the remaining 2 points.

Source Bond 2
Destination Bond 2 Crosshair 2

3rd.wire (opt.) 4th wire (opt.)

Destination Bond 1
Crosshair 1
Source Bond 1

Figure 8-19: Wedge calibration (3rd and 4th wire optional)

• Save the values for the wedge calibration.

• The values are displayed in the dialog Values.

Ultrasonic
The ultrasonic generator is activated with 50% power with the Ultrasonic
function. This function is necessary for optimum tightening of the
transducer screw which should be tightened to 12 - 15 cNm.

Impedance
The Impedance of the ultrasonic system must be checked after every
wedge tool exchange.

• Remove the wire from the wedge.

• Click the command button Impedance to carry out the
measurement. The value should be about the same as the previous
value. A large deviation could indicate that the wedge was not
installed correctly, or that it is defective. Deviations in the impedance
between different wedge types or materials can occur.

Wedge Counter
• The command button Wedge Counter opens a dialog for entering
the Max. number of bonds with a wedge.
• The command Reset should be activated after exchanging the
wedge, to set the counter back to 0.
• If a used wedge is fitted, any number can be entered here.
• In Administrator mode/Program variants, the option Wedge
Counter Reset can be activated so that the function Number of
bonds is only available for the reset option.

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8 Calibration

• A warning occurs when the Maximum number is reached, if this

was activated.

Figure 8-20: Wedge counter

8.1.7 P Axis (7)

The rotational axis of the wedge must be exactly parallel to the Z axis and
exactly vertical to the XY surface. If this is not the case, the wedge will
form an ellipse during rotation instead of a perfect circle. This results in a
positioning error which is relative to the difference between the circle and
the ellipse at this angle. To avoid this positioning error, the P axis must be
calibrated. During calibration, the positioning error is measured so it can
be taken into account at later positioning.

Hint: Calibration data existing from a previous calibration must

be deleted first.

• Select P Axis 7 in the calibration menu to carry out calibration of the

bondhead rotation accuracy.

During the process, the bondhead automatically moves to the park

position.

Settings
• Open the Settings dialog. The following information is necessary:

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 8 Calibration

Figure 8-21: P axis settings

The X Offset determines the distance between two calibration bonds.

• Carry out the first bond with the set values
• If necessary, change the values in X Offset.

The S-D Distance defines the length of the calibration bond. This is the
distance between Source and Destination.
• Carry out the first bond with the set values.
• If necessary, change the value in Distance S-D.

The type of Bond can be defined.

• Click the respective function.

The bond process can be carried out in Step by step mode. The process
is stopped at the predefined positions and proceeds with the STEP key.
• Activate this function, if necessary to observe the process more
exactly.
• Bond parameters are defined to carry out the bonds and can be
selected from a directory. Click the symbol to select the
parameters. To edit the selected parameters, click the symbol .
• Confirm with OK.

Measure Height
• Move the bondhead to a free position over the calibration substrate.

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8 Calibration

• Confirm with command Measure height. The bondhead moves with

the wedge to touchdown.

Calibration
• Move the bondhead to a large and free area under the camera and
click the right trackball button to start.
Bonds are placed with the predefined dimensions in a circle at an angle
of 10°. The center of the camera moves automatically to near to first
destination bond.

Figure 8-22: Calibrate P axis

• Move the moveable crosshair to the bond position and enter with the
right trackball button.
• Confirm the correct position with the right trackball button.
The bondhead automatically moves to the second destination position.
• Correct this position and all further position with the same
procedure.
The correct position is displayed in the status bar. Other positions can be
moved to the with the arrow keys (← and →).
• Click the command button Characteristic to view the graph
displaying the deviations of the circle.

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 8 Calibration

Figure 8-23: P axis graph -example

• The command Save saves all changes in the calibration menu.

• The command Back returns you to the main menu of Calibration
mode.

8.2 Group Wire Handling

Figure 8-24: Register wire handling - overview

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8.2.1 Wire (1)

The parameters for the wire are defined in this calibration menu. After
exchanging the wire, these settings must be updated. If the wire diameter
has been changed the bondforce must be calibrated.

• Select the command button Wire 1 in the group Wire handling to

open the dialog for wire calibration.

Figure 8-25: Calibrate wire

• Enter the Wire diameter under Wire.

• Enter a Charge number in the editing box.

Threading
After changing the wire spool or if threading is necessary, manual wire
transport can be carried out with the command button Wire spool.

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 8 Calibration

Figure 8-26: Threading dialog

• Wire transport is carried out automatically if Automatic is activated.

• Click the command button Threading position or Original position
to move the bondhead to the defined position.
• The bondhead P axis can be rotated with the arrow buttons in the
dialog or the arrow keys on the keyboard.

Threading Position
• The bondhead moves to a predefined threading position with the
command button Move to.
• To determine a new threading position, move the bondhead to a
position where you have comfortable handling space for threading
and/or settings to the bondhead.
• Confirm this position with the command button Define. The
bondhead moves to this position with the command Threading
position.

Spool Parameters
• Click the command button Spool Parameters to open the dialog.

Figure 8-27: Wire - spool parameters

• The wire is transported from the despooling station through the wire
transport tube for a defined Spool length.

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• A warning appears if no wire is detected by the sensor in the wire

buffer after a defined number of despooling steps. This number can
be entered under Attempts.
• Confirm with OK or leave the dialog with Cancel.
• Save the calibration values.
• The command Back returns you to the main menu of the calibration
menu.

8.2.2 Wire Clamp (2)

This menu contains the adjustment tools for the wire clamp, like tail
length, tear off and clamp opening. The parameters tail length and tear
off are mainly used for adjustment of the tail length (see Figure 8-28:
“Geometry of source bond”and Figure 8-29: “Wire clamp settings”).

d
bon
n
io
at
To es it n
Tail D
s
s

ee diu
diu

(H ckra
tra

l)
n

Ba
Fro

Cut
Bondflat

Sourcebond

Figure 8-28: Geometry of source bond

Figure 8-29: Wire clamp settings

Hint: Absolute numbers for the setting of the parameters Tail

length and Tear off cannot be given because factors like
wedge geometry and material characteristics have to be
taken into account. Typical start values for a 25µm wire
are about 120µm for each „Tail length“ and „Tear off“.

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 8 Calibration

Adjustment of the tail length

• If the tail is too long, the parameters Tail length and Tear off shall
be reduced at about the same percentage. The reduction should be
done in small steps.
• For tail optimization it is always easier to start with a tail which is too
long (high values for Tail length and Tear off) and then reduce the
tail step by step.

Hint: Many applications require a short and consistent tail. If the

tail is adjusted too short however, bonding inconsistency
can occure. There should always be some visible tail at
every source bond.

Gap of the wire clamp

In order to change the wire clamp gap in regards to different wire
diameters, you can change the entry "Open" in the dialog shown in
Figure 8-29: “Wire clamp settings”. When viewed with the inspection
mirror through the microscope, that the opening gap should be about 2 to
4 times the wire diameter.

Attention: The mechanical gap is properly adjusted by the

manufacturer. This setting should not be changed. If a
new setting is required please contact Hesse GmbH.

Gap of wire clamp on DA bondhead

Figure 8-30: Calibration/Wire Clamp

• First select the clamp module. By selecting Upper you set the
opening gap of the wire clamp. With Lower you set the opening gap
of the clamp blade.
• The entry in the parameter box Open defines the percentage of
clamp actuator output. The actuator should open the clamp 2-3 wire
diameters.

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8.2.3 Offbond (3)

A free offbond wire can be created with the offbond function in order to
have a defined tail after wire spool exchange for example. A separate
offbond position must be taught for every holder and, if necessary, every
index position or index track. The bondhead is always moved to the
defined position during offbond.

• Select the command button Offbond 3 in the Wire Handling register.

Settings
• Open the dialog and define the geometry of the offbond wires.

Figure 8-31: Calibrate offbond - settings

• If several offbonds are to be placed in a grid, edit the Distances in X

and Y direction for a number of Columns and Lines.
• Select a Wire or a Single bond.
• Enter the distance from Source to Destination. This editing box is
inactive for a single bond.
• Confirm by clicking the button Material necessary to activate the
clamp.

During bonding, Bond parameters are used which are dependant on the
wire diameter. They can be loaded from a directory.

• Click the symbol and select the parameters.

• Click the symbol , to edit the loaded parameter set.

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Measure Height
• Move to a suitable position on the substrate.
• Click the button Measure height and move the trackball in the
camera window.
• Below the camera image the prompt appears: right trackball button
> start height measurement.
• By confirming the prompt with the right trackball button, the
focussed image and the suitable offbond position are displayed.
• Confirm the prompt.
The bondhead moves to touchdown at the defined offbond position and
measures the touchdown height.

Offbond Position
• To define a new offbond position, move the bondhead over the
respective position and click the command button Define.
• With the command Move to, the bondhead automatically moves to
a predefined offbond position.

Offbond
• With the command Start, the Position which number is displayed
above the start command is moved to.
• The prompt: right trackball button > start offbond is displayed below
the camera image when the trackball is in the camera window.
• Click the right trackball button to start offbonding.
• Save the calibration values.
• Calibration values displayed in red are outside the allowed tolerance
limits. In this case, repeat calibration.

Offbond in Production Mode

• The offbond dialog can be opened with the key combination Shift +
stop or in the menu Action/Offbond. The bondhead moves to the
defined offbond position which is shown in the camera window. The
position corresponds to the offbond wire which can be carried out
after clicking the right trackball button.
• If several offbond wires have been setup during calibration, the
position can be changed here. With only 1 offbond position, this
position notice is not displayed.

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Figure 8-32: Offbond - dialog

Program Variants Offbond

• In the program variants (Administrator mode), the option Auto
Offbond can be activated. This effects that bonding takes place
automatically after every height measurement, every bond error and
every bondhead setup
• Furthermore, the variant Automatically switch offbond position
can be activated. This causes counting to continue after an offbond,
but the camera stops at the last bond. The next position is moved to
by pressing the ENTER key.

8.2.4 E Box (4)

The bonder is fitted with an additional camera which is attached to the left
machine frame below the Y axis. If the bondhead is located in the image
area of this camera, images from the tool are taken and displayed on the
user interface. 4 side views and a view from below are created which are
projected with a swivel mounted mirror. This camera is called the E Box
in the user interface.
All wedge and wire guide settings are displayed as control lines in graph
form. With these lines, the position of the tools in the current camera
image can be controlled and deviations can be adjusted with the
respective mechanical settings.

• Click the command button E-Box or E to open the dialog for

calibration of the E-Box.

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Figure 8-33: E Box calibration

• Use the arrow keys to bring the axes in a position within the image
area of the inspection camera.
• A previously defined side view can be moved to by clicking the
command button Move to or 1 on the keypad.
• If a side view position was already defined, this can be moved to.
• To define a new position, first move to a suitable position and click
the command button Set.
• The front and back views are determined automatically. The
bondhead rotates from the defined side view for + or -90°.
• Move to the position Bottom view or define a new position in the
same manner. Ensure that the position is within the field of view of
the swivel mounted mirror.
• New positions defined with the command Set must be saved so they
are permanently used with the Move to command.
• Click the command button Settings to open the editing box. All data
entered here are shown graphically in the camera image as control
lines.

Figure 8-34: E Box - settings

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• Enter the inclination of the outer edge of the tool in ° in the editing
box Wedge angle.
• Enter a length for the foot geometry of the wedge in the editing box
Bondflat.
• Enter a Distance to define the position of the wedge to the clamp.
• Enter a Distance and a Height difference with a Tolerance of 0 to
define the position of wedge to clamp.

8.3 Group Holder

Figure 8-35: Register holder - overview

The foundation for optimum bonding results is a holder which is

optimized for the application. The holder must ensure that the substrate
is securely clamped and sufficient counter pressure is built up on the
bondpads. Clamping is either mechanical, with compressed air or with
vacuum. The connectors for this are on the bonder.

Hint: After exchanging the holder, the reference positions and

all heights of the programs must be newly defined.

Several settings must be edited for the setup up the holder, which differ
by holder type.
The actual holder is displayed in the dialog.

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Load
A holder can be loaded from a list or a new one can be entered.
• Click the command button Load to open the list of available holders.

Figure 8-36: Load holder

• Select the holder and confirm with OK.

• To enter a new holder, enter the Name in the editing box and
confirm with OK.
• Delete a holder from the list by selecting a holder and clicking the
command button Delete.

Holder Type
The bonder requires information about the holder type for every holder.
They differ in their connection types to external data processing, material
input via an indexer or manual holder.
• Click the command button Holder type in the Holder register. A list
of available holders is opened.
• Select the respective holder type and confirm with OK.

Figure 8-37: Holder type

Settings
Specific settings must be made for every holder type which can be
adjusted for the respective holder.
• Click the command button Settings after selecting a holder type to
edit the respective dialog.

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Holder Type Manual Clamping

In a Manual Clamping holder, the substrate is transported manually
before bonding. Clamping takes place either mechanically, with
compressed air, with vacuum or electrically. The respective radio button
must be selected.

Figure 8-38: Manual clamping - settings

Holder Type SMEMA

• This indexer module supports the Hesse GmbH standard bonder
input „Available“ and bonder output „Not Busy“. The Double lane
indexer and the Single board recognition can be initiated with the
radio buttons.

Figure 8-39: SMEMA indexer - settings

In an Automatic Holder, the substrates are automatically loaded and

unloaded to and from the bond station. Clamping is also automatic. A
PLC program takes over the controls of the indexer. If this function is
active, the command buttons of the PLC are unlocked.

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Holder Type Soft PLC

In the settings of the PLC indexer, the number of lanes are entered for a
multilane indexer and the 1st lane is determined. A description can be
entered for every lane.

Figure 8-40: PLC - settings

The PLC can support a serial barcode reader for identification of boards
and chips. The barcode identification is activated in the dialog Barcode.
The barcode can contain a type ID and/or a part ID. The start position
and the number of positions is edited for the respective ID. For multi
boards with 1 barcode/board, the option Barcode per board is activated.
The editing box No. of boards is then unlocked.
In the Barcode dialog, the settings for data transmission can be made.
The Curr. barcodes are displayed in a list and can be individually
deleted or the entire list can be removed, if parts were manually removed
after scanning.

Figure 8-41: PLC - barcode settings

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• In the dialog Program assignment, a bond program can be loaded

for every Type ID. A Type ID must be entered and a program loaded
from the directory. The assignment is defined and put in the list with
the command button Apply.

Figure 8-42: PLC - program assignment

• The list of recorded PLC programs is Ioaded with the PLC register.
• Select a program and confirm with OK.

Figure 8-43: PLC program

Simulation:
A loaded PLC program can be simulated with this function.

• The simulation of a loaded program can be started or ended, an

index step can be initialized or the clamping switched by clicking the
respective command button

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Figure 8-44: PLC simulation

• Click the command button Program or Symbol table to open the

program editor. The program can now be edited.

Figure 8-45: Edit PLC program

The PLC program is written in Step 5 ®. The commands for programming

are reduced to those necessary to program a simple indexer control
system.

Notice
• To show error texts, an error file is created in the table where the
error number is allocated the appropriate error text. The table has
the following format:
0 = Indexer control/Unknown error
1 = Indexer control/Crash at input lift

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This table is an example which must be adapted to the error numbers of

the controls.

IO Settings
The input and outputs and the commandos are defined in the I/O
assignment file.

Figure 8-46: PLC - IO settings

Symbol Table:
Symbols can be used as operands for entering inputs, outputs, marks,
timers or counters instead of the usual direct input. These symbols are
defined in the symbol table. The syntax of this file can be drawn from the
following example:

A 0.0 MOT ; Motor

In this line, the symbol MOT is defined for the output 0.0. After a semi-
colon, the rest of the line is ignored as a comment.

The following line is a valid instruction:

= -MOT
It is equivalent to the instruction:
= A 0.0

Holder Type Profibus

With this holder type, the controls are taken over via profibus. The
settings dialog is split into the registers Program assignment and
Lanes.

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Figure 8-47: Profibus - settings

In the Program assignment register a bond program can be loaded for

every type ID. The type ID must be entered and a program loaded from
the directory. The command Apply defines the assignment and takes it
into the list.
In the Lanes register, the number of the available transport lanes is
entered. A name can be edited for every lane. If several lanes are
defined, you must define which lane should be activated first.

Holder Type Wafer

For a wafer holder, the center position is determined in the settings
dialog.
• Edit the position manually or apply the current position with the
command button Curr. position.

Figure 8-48: Wafer holder - settings

Holder Type Integrated Indexer

This indexer is controlled completely by the bonder during automatic
operation. A PLC program initializes the process cycle by implementing
the entered parameters for the indexer. The standard indexer comprises
3 transport segments, the substrate input, the bond station and the
output. The individual stations can be optionally fitted with heating
modules. Input and output lifts are also controlled by the bonder software.
The indexer carries out automatic initialization at every new start of the
bonder once referencing is complete.

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All material input and output components are setup in the indexer
settings dialog (see Figure 8-49:).
• Select the integrated indexer in the list Holder Type.
• Open the Settings dialog by clicking the command button.

The input and output lifts and the 3 transport segments are illustrated
symbolically in the dialog. The working conditions of the lifts and the
transport segments are displayed here.
• The system carries out an initialization with the command Reset.

Figure 8-49: Integrated indexer - settings overview

• Open the program directory by clicking the button and load an

Indexer program. Confirm with OK.

Figure 8-50: Integrated indexer - load program

• Carry out a complete index step (material input, transport through

the segments and output) with the command button Index step.
• For manual operation of the individual index steps, enter the indexer
setup by clicking the Setup command button in the indexer dialog.

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Figure 8-51: Integrated indexer - setup

• Click the arrow keys to open or close the clamping, to operate the
pusher to transport the substrate to a further segment, provided that
this segment is free.
• Click the button to open the parameter list in the settings dialog
if you wish to carry out changes to the individual process steps.
• Transport segments can be corrected, time-outs, speed or, as in this
example, the heating station temperature can be altered.

Figure 8-52: Integrated indexer - parameters - example without heating station

• Changes made to this dialog must be saved with the command

Download, otherwise they will not be applied after leaving the
dialog.
• For manual operation of all lift functions, click the command buttons
Input lift or Output lift.
• Transport movements, pusher operation, magazine change
positions or slot movements can be carried out in this dialog by
clicking the arrow keys.

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Figure 8-53: Integrated indexer - input lift

Backup
• With this function, the holder files can be saved to disk. A prompt
appears asking you to place a disk in the disk drive and to label
respectively after successful downloading.

Default
• The original condition is restored by clicking this function.

Park Position
The park position should be selected to ensure optimum and collision
free material change.
• Click the command button Move to. The bondhead moves to the
predefined position.
• Define a new position with the command button.

Save
• All data changes are saved in the holder register with the command
Save.

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8.4 Group Quality

Figure 8-54: Register quality - overview

8.4.1 Counter (1)

4 counters can be setup in this list dialog where the control intervals for
the wedge, bondhead, bond quality and inspection can be defined.
• Click the command button Check counter to open the overview.

Figure 8-55: Check counter list

• Open the dialog of the counter you wish to edit with the button.
• Activate the counter by clicking the checkbox. After every bond, the
counter automatically counts +1.
• Define an Interval for the activated counter to trigger an event.
• Activate the option Message and enter a text which should be
displayed once the interval is reached.
• The current counter value is displayed in the line Curr. value. The
counter can be set to 0 with the Reset button.
• Activate the function AutoReset to automatically reset the counter
once the interval has been reached without operator intervention.

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Figure 8-56: Setup check counter - example wedge control

8.4.2 Deformation (2) / Current (3)

The graphs for deformation, current flow, and shear and pull tests can be
viewed in all operation modes where bonds are created in the menu
Extras/bond graphs. A profile is created once optimum deformation and
current graphs have been found. During bonding, the graph is measured
and is compared to this profile. The smaller the deviation from the profile,
the better the quality value. The profiles are saved in a directory which is
displayed in the calibration menu.

Figure 8-57: Calibration - dialog deformation/current

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• Select a Profile and click the command Edit. The tolerance band
can be altered by entering other values for variance and minimum
distance. The acceptance of the bond quality is influenced by
altering the threshold.
• The changes are applied with the command button Apply.
• The bond quality check is carried out when this is activated in the
parameter dialog for bond parameters and a profile has been
selected which is applied.

Figure 8-58: Edit quality profile - example

• After calibration is completely achieved do not forget to Save

calibration results!

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8.5 Add-on for Software-Update 3.77

8.5.1 Referring to Chapter 8.2 “Group Wire Handling” -
new function „Tool cleaning“
With the Tool Cleaning function (only BJ820 with wire feed), the
wedge can be freed from wire residue which accumulates during
bonding. A bond is placed on the tool cleaning position and a wire
tear-off is carried out. The clamp remains at the back. Then, several
bonds are carried out without wire. Finally, wire feed is carried out and
bonding can commence normally.
Setup
• Select the command Tool Cleaning 5 in the Wire Handling register.
• With the command button Settings, open the tool cleaning
settings dialog.

Figure 8-59: Tool cleaning settings

• Define a matrix consisting of Rows, Columns, X Pitch and Y Pitch

in which bonding should be carried out.
• Define and edit the Bond Parameters.
• Define the Number of bonds.
• Define After how many bonds automatic tool cleaning should be
carried out.
• As an option, tool cleaning can be carried out Without
Prompting.
• Material Necessary must be active if tool cleaning should be
carried out directly on the substrate.
• The counter verification, whether tool cleaning has to be carried
out can take place after completing a Chip, Board or Substrate.

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Measure Height
• Move to a suitable position where the tool cleaning should be carried
out.
• Click the command button Measure Height and move the
trackball pointer into the camera window.
• The prompt: “Right trackball button > start height
measurement” appears below the camera image.
• The prompt for image focusing and tool cleaning position appears
after confirming with the right trackball button.
• The bondhead moves to the defined tool cleaning position to
touchdown and measures the touchdown height.

Tool Cleaning Position

• To define a new tool cleaning position, move the bondhead over the
respective position and click the command button Define.
• With the command Move To, the bondhead moves automatically
to a predefined tool cleaning position.

Tool Cleaning

• With the command Start, the position which number is displayed

above the start command is moved to.
• The prompt: "Right trackball button > start tool cleaning" is
displayed below the camera image when the pointer is within the
camera window.
• Click the right trackball button to start the tool cleaning process.
• Save the data settings.

Tool Cleaning in Process Mode

• The tool cleaning dialog can be opened in the menu Action/Tool

Cleaning. The bondhead moves to the defined tool cleaning
position which is displayed in the camera window.
• Confirm with the right trackball button to carry out a complete tool
cleaning process at this position.
• If automatic tool cleaning is configured, a window is opened
before bonding the substrate if the set number of bonds has been
exceeded since the last tool cleaning process.
• If tool cleaning without prompt has been setup, no dialog is
opened before automatic tool cleaning. Tool cleaning is carried
out at the next free position.

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8.5.2 Referring to Chapter 8.2.3 “Offbond (3)”

Setup
• Select the command button Offbond 3 in the Wire Handling register.
• With the command button Settings, open the Offbond Settings
dialog to edit the settings.

Figure 8-60: Offbond settings

• Define a matrix consisting of Rows, Columns, X Pitch and Y Pitch

in which bonding should be carried out.
• Determine the Distance S-D and the Bond Angle to specify the
destination bond position.
• Define and edit the Bond Parameters.
• Specify the method Wire if a complete wire should be placed as
an offbond.
• Specify the method Single Bond if a single bond and tear off
should be carried out for offbonding.
• Define if automatic offbonding should be carried out After error.
• Define After how many bonds automatic offbonding should be
carried out.
• As an option, offbonding can be carried out Without Prompting.
• Material Necessary must be active if offbonding should be
carried out directly on the substrate.

Offbond in Process Mode

• The offbond dialog can be opened with the key combination
Shift+Stop or in the menu Action/Offbond. The bondhead
moves to the defined offbond position which is displayed in the
camera window.
• This position is used for offbonding by clicking the right trackball
button.

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• If automatic offbond is configured, the window is opened before

bonding a substrate, if the set number of bonds has been
exceeded since the last offbond.
• If offbond without prompt is setup, no dialog is opened.
Offbonding is carried out at the next free position.
• If several offbond wires were setup, the desired position can be
selected here. This position entry box is not available for a single
offbond wire.

8.5.3 Referring to Chapter 8.2.4 “E Box (4)”

Figure 8-61: E-Box

• Similar to other camera windows, the position of the bondhead in

the E-Box can be altered with the trackball in the window. The
arrow keys and are used to focus the bondhead and the
respective P-axis buttons are used to rotate the bondhead.
• Only the view from below can be moved to at any time the mirror
assembly is swung out.

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 9 Programming

PROGRAMMING
CHAPTER9

9.1 Introduction
A bond program contains all information regarding the substrate, the
position of the bonds and all parameters for optimization of movement,
pattern recognition and the bond process.
A substrate and the components on it do not normally have the exact
same position as the substrate on which the bond program was created.
With the pattern recognition system of the BONDJET BJ820, patterns are
taught and are searched on the component and their positions are
automatically calculated.
The bonds lie on components which can vary in their position. They can
be calculated exactly if the position of the component is known. When
defining a bond, every bond position must be allocated to a reference
system. The bond positions are referred to as Source for the first bond
position and Destination for the 2nd bond position.
After creating a bond program, it is worked through completely or in part
in order to check that it runs without error in the production process and
that the bonds show the required attributes. Afterwards, optimization with
regards to quality and process requirements is carried out.
Access to the programming functions must be set up in the user list.
Enter operation mode Programming by clicking the symbol.

9.2 Program Administration

9.2.1 Create New Program
A new program can be created in operation mode Teach Reference
System.

• In the Program menu select the command New...

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• Enter a name for the new program in the directory and confirm with
OK.
• The program name is now in the directory, but the actual program
will only be listed after saving the program file.

Figure 9-1: New program

9.2.2 Load Program

The command Load in the Program menu must be activated to load an
existing program.

• Select a program from the list by marking it with the trackball.

• Confirm the selection with OK.

The program is loaded and displayed in the status bar.

Program information is displayed with the function Info.

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Figure 9-2: Load program

In order to run the program, the currently installed holder and the holder
with which this program was created, the wire and the wedge must
correspond.
If the holders correspond but they have been changed in the meantime,
or if the program was created on another bonder with the same holder
the program can be loaded, but there is a risk that the bond positions do
not correspond.
Manual adjustment is automatically activated if the patterns are not found
due to large deviations. After the manual points for the first reference
system have been entered, the remaining reference systems are found
by the automatic adjustment.
When importing a program from another machine, it is always necessary
to check the heights. When updating a focus height, a prompt appears
where you must define which focus heights are to be updated.
Only one position can be updated if the option Only this is selected.
With the option Whole reference system, all heights for the reference
system are updated. The offset for the measured focus height is
automatically taken into account for all heights in this reference system.
With the option All reference systems, the offset is applied to all
reference systems.
When creating a new program, these options can also be used if it is
necessary to adjust the focus height, e.g. if the bond surface of a single
bond position should be checked again (see Figure 9-48: “Teach wires”,
command button Focus).

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Figure 9-3: Update focus

9.2.3 Save Program

A newly created program or any program change can be saved. You can
save at any time if there is a asterix in the information bar in the lower left
corner of the screen.

Figure 9-4: Program status - not saved

• Program changes can be saved under the current program name

with the command Save in the Program menu.
• If changes should be saved under a new name, select the command
Save as.... The list of existing files is displayed.
• Edit a new program name and confirm with OK.

Figure 9-5: Save bond program

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9.2.4 Program Directory

A directory can be created for all new or imported bond programs. This
function is found in the Program menu under Create Directory.

• Enter a directory name in the editing box and confirm with OK. The
directory is now created.

Figure 9-6: Program directory

• Directories can be deleted with the function Delete directory. Only

empty directories can be deleted.

9.2.5 Program Information

• Select Program information in the Program menu.

This contains all information concerning the currently loaded program for
example program name, number of boards, number of chips etc. You can
check that all file structures are complete. The login name of the user
who edited the program is also saved to the program.

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Figure 9-7: Program information

9.2.6 Compare Program

With this function, the currently loaded program can be compared to a
program from the directory.
• Select the program for comparing from the directory and confirm
with OK.
All differences between the programs are illustrated in a table in the
comparison protocol e.g. reference system data, chips or wires.

Figure 9-8: Compare program - example

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Only programs with the same amount of reference systems, chips and
wires can be compared.
If this is not the case it is displayed in the protocol.

Figure 9-9: Compare program - example - not comparable

9.3 Program Settings

Global settings are defined for a newly created program which are valid
for the complete program. They can be defined or altered at any time
during creating the program but must be saved with the program. The
optional settings are compiled in a list dialog.

• Select Program settings in the Program menu.

Figure 9-10: Program settings

Write Protect
Programs can be write protected to avoid intentional or unintentional
overwriting of important program data. The parameter sets can only be
viewed if this option is activated. Reference systems and wires are
shown in the camera window but can not be edited or altered.
Write protection can only be set or removed by a user with administrator
access rights. The option Write protect for a program can be activated or
deactivated in the menu Program/Program Settings.

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Figure 9-11: Program settings - write protect

If write protection is activated, this is displayed above the camera

window.

Figure 9-12: Program write protected

General

Figure 9-13: Program settings - general

• Define a Working height which ensures collision free bondhead

movement above the substrates. If you define the Z axis working
height to 12,4 mm, the bondhead moves to its highest position. A
lower working height helps avoid unnecessary long Z axis
movements and increases productivity.
• Activate the function Automatically move above angle difference to
enable editing of the angle. Here you can define at which angle
difference the bondhead automatically moves over the working
height to the next wire. This avoids the bondhead colliding with
components on the substrate during P-axis rotation.
• The option tear off before welding is an programm specific setting
activated for applications with lower ultrasonic.
• Chip to chip height is the height at which the bondhead moves
between the individual chips during bonding. The same height as for

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the working height can be entered here, although a lower height is

more effective. Carefully check for collision free movement!
• If the Pad Locator option is used in the wire parameters. It can be
globally (de)activated in the program settings under the option Use
pad locator.
• For manual referencing, the taught alignment point is shown in the
upper left corner of the camera image as a helper pattern. The Size
of this square Helper pattern can be edited within an area of 50 to
250 pixels. The crosshair is shown in the same color as the
moveable crosshair in the camera window. You can select the color
in the menu Settings/View/ Mouse under Camera image/
Crosshair. Changes to this setting must be made before teaching a
pattern.

Helper
pattern

Figure 9-14: Program settings - large helper pattern

Skip

Figure 9-15: Program settings - skip settings

• With the Skip functions, you can define how to deal with pattern
recognition errors during production. If an error occurs and the
function Skip when PR error is activated, the complete chip is
skipped and production carries on at the next chip. With the function
Skip per refsys, only the reference system which is not found will
be skipped.

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• If the Skip limit is exceeded, fully automatic production is aborted.

Define a number of chips (n) per board (m). The sum of the skipped
chips on the last (m) board may not exceed the (n) chips.

Adjust

Figure 9-16: Program settings - adjust settings

The type of Adjustment is determined by the selection of Method and

Direction. This influences the sequence been adjustment and bond
process in production.
• Per Substrate: Before bonding, all chips on the substrate are
adjusted.
• Per Board: Before bonding, all chips on the board are adjusted.
Any pattern recognition errors on substrate or board adjustment
automatically open the pattern correction mode after confirming the error
message. The alignment points can be manually reworked here.
• Per Chip: Adjustment is carried out for the current chip. Afterwards,
the bond process for this chip is started.
• Direction: Chip/Board backwards: The adjustment order is
determined with this option. By selecting a product specific order,
movement times during production can be optimized.

Pre Warning

Figure 9-17: Program settings - pre warning

With this function, you can define the bond position at which the machine
changes to low material status. This is signalized by the respective
setting on the lamp tower (Administration mode Settings/lamp tower/low
material)
• Activate the function Remaining amount and edit the number.
• Click the respective radio button to define for which components this
number should apply. Select between boards, chips or wires.
• Confirm the program settings with OK or exit with Cancel.
• Do not forget to Save all global program settings.

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PiQC (Optional)
If the bondhead is fitted with a PiQC sensor, activation of the quality
control by PiQC must be defined in the program settings for the bond
program used. It must be defined here, whether quality indeces should
be calculated and by which method the total quality index should be
calculated.

9.3.1 Default Settings

A newly created program is based on default settings. The list dialog is
identical to the program settings. Default values are already entered into
some editing boxes which are based on experience and can simplify the
first steps to an original product specific program.

Figure 9-18: Default settings

9.4 Teach Reference System

9.4.1 General
A reference system is created for every bond level which can vary in its
position or height relative to other bond levels. The first reference system
is the base substrate itself. This is important, as all further reference
system are dependant on it. Moving this substrate automatically moves
the components on it.
Every reference system contains special information and has its own
settings. This includes the parameters for pattern recognition, the
measured heights, the definition of the number of manual points and
patterns and the bond parameters which should be used for all bonds in
this reference system.
Additional settings which can be made for teaching reference systems
are described in detail at a different location in the manual.

• In menu Operation Mode, select Teach reference system, or click

the register.
• The information bar shows that the register Teach reference system
is active. The teachpoint number and the status of the point or
pattern is also displayed here.

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Figure 9-19: Teach reference system

9.4.2 Teach Order

When creating a reference system, all manual points and automatic
points which are necessary for defining the position are taught.
In the editing window on the right of the screen, the number of points and
patterns can altered between 0, 1 and 2. This has an influence on the
positioning of this reference system.
If 0 is selected, the reference system can not be manually adjusted, it
must be attached to another reference system and follows this reference
system.
This is by default the 1st reference system. For more than 2 reference
systems, a different relation as the one for the first reference system can
be defined with the option Depends.
With 1 point, the X/Y position can be identified, the rotation cannot be
calculated.
With 2 points, the exact position can be determined. The X/Y position of
the reference system can be identified and the rotation can also be
calculated.

Manual Points
The position of the reference system can be determined with the help of
the manual reference points. These points are moved to during manual
adjustment of the board or chip. They are also used in case of error
during automatic adjustment.
The illustration of the manual points can be edited in the menu Settings/
Markings/Reference points.

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Automatic Pattern
The position of the reference system can be automatically determined by
pattern recognition with the help of reference points.
If 2 patterns have been taught for the current reference system, the
distance between both patterns should be as large as possible.
A message is given if the system does not accept a pattern. A new
pattern must be searched.
For successful teaching and searching process, the settings in the PR
parameters must be adjusted to the existing conditions. The
fundamentals of pattern recognition are described in detail in chapter 14.
The properties of the graphical illustration of automatic patterns can be
edited in the menu Settings/Markings/Search area. Search area and
pattern can be displayed with different line thickness and text.

Focus Height
For successful pattern recognition, all focus heights of the individual
points and patterns must be known, as well as the X/Y position. These
are saved with the images. The focus height is altered by a manual
upwards / downwards movement of the Z axis until the image is
focussed. For automatic adjustment, the bondhead moves to the focus
height of the respective pattern.

Illumination
The illumination can be altered for every taught pattern for optimum
contrast by moving the scroll bars for the vertical light or the ring light.
Illumination should be set so there is good contrast, but no over shining
at the contour edge. The intensity of the light source is displayed as a
percentage next to the scroll bar and the value is saved for every pattern.
These values can be checked in the dialog Pattern X.

Define Color
A color can be selected for the wires in a reference system. This color is
for all wires in this reference system. It can be altered for each individual
wire in the mode Wires.

Figure 9-20: Color selection editor

Default PR Parameters for Pattern Recognition

All patterns in a reference system of a new program are based on the
default PR parameter settings. These encompass all pattern parameters
where the search algorithm is selected, search area and pattern size are
edited and quality values and alternatives are defined. Differentiation of
the parameters occurs when different conditions occur during teaching

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patterns in the individual reference systems. These must be altered

respectively.

Figure 9-21: Default PR parameters

9.4.3 Auto Functions

In the dialog Teach reference system there are several functions which
support the teach and search process or help to optimize the work steps.

Figure 9-22: Auto functions

With the Teach point function the taught pattern is automatically moved
to the center of the camera image. You can use the arrow keys to move
to the next or previous teach point.
The current pattern is searched with the Search function without the
bondhead moving to the previously saved position. The pattern is then
moved to the center of the camera.
If Auto increment is active, the next teachpoint is automatically switched
to. If the final teachpoint has been taught, a message appears asking for
a new reference system. The instructions appear below the camera
image when the trackball pointer is inside the camera window. Teach
points are displayed in green text and teachpoint corrections in red.
If Auto position is activated, the position of the pattern to be taught is
assumed to be near the manual position. The bondhead automatically
moves to this position when teaching a new pattern. If the pattern is
already taught, the taught position is moved to.
Taught patterns are automatically tested for their suitability with the Auto
test function. The search score is displayed in the camera window.
The best pattern within a definable area can be taught with the
AutoTeach function which can be activated in the menu Settings/Auto
teach parameters. This area is displayed as an additional frame in the
camera window. The search process is aborted if the Maximum time is
reached.

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Figure 9-23: AutoTeach function

A defined reference system is assigned a color in which all wires in this

reference system are displayed. This improves the overview. In the status
bar the symbol --> is displayed in the selected color. Click the left
trackball button on this symbol to open a color selection where a different
color can be selected. Right click returns the color to the default setting.

9.4.4 Teach Manual Points

The register Teach references systems is selected.
„Refsys:1“, Points:2 and Pattern:2 are preset. Auto increment is active.
• Move the pointer into the camera window. The command bar
prompts: right trackball button -> teach first manual point.

Figure 9-24: 1. Teach manual point

• With the moveable crosshair, move to a distinct point on the

substrate, the lower left corner is recommended.
• Focus the image by moving the Z axis up or down and confirm with
the Focus height command button.
• Confirm the point with the right trackball button. The taught pattern is
automatically moved to the camera center. The point is marked and

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labeled in the selected display style. In the status bar of the camera
window the message: 1st point complete is displayed.
• If the option Auto Increment is active, the following message is
displayed in the command bar: Right trackball button -> teach
2nd manual point. If the option is not activated, the second manual
point must be selected.

Figure 9-25: Teach manual point - example

• With the moveable crosshair, move to the 2nd point. A point on the
diagonally opposite corner of the substrate is recommended.
• Confirm this point with the right trackball button, it is moved to the
center of the camera. The 2nd position is also displayed graphically
and labeled. The message 2nd point - complete appears in the
status bar.
• The manual points can be checked in the dialog PR Parameters
under the option Point x view.

Figure 9-26: Manual point X view - example

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9.4.5 Teach Automatic Pattern

Individual pattern parameters can be defined for teaching automatic
patterns if they should not be defined by the general default parameters.
This can be carried out in the dialog PR Parameters before teaching
patterns. The quality of the accepted patterns in automatic pattern
recognition can be corrected after searching.
In this dialog individual settings for search method, search area and
pattern size, pattern quality and possible alternatives can be made. The
taught pattern is displayed under the option pattern x, the settings for
illumination, focus height and teach score are displayed.

Edit PR Parameters
• Click the command button PR Parameter to open the list dialog.
• The reference system for which these parameters apply is displayed
in the upper line of the dialog.
• Select the Search method suitable for your substrate. You can
select between fine structure and rough structure. If there is an
adjustment aid on the substrate e.g. a cross or marking, select the
method closed contour. The method leadtip locator is for recognition
of lead tips on substrates.

Hint: Further information regarding pattern recognition can be

found in special chapter of this manual.

Figure 9-27: PR parameters

• Determine the size of the Search area, default 352 pixel. A pixel
number which exceeds the size of the camera image can be entered
here, max. 1536 = (3 x 512) pixel. This results in the scanning of the
search area by automatic camera movement. This is carried out
from the center in anti-clockwise direction.

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Figure 9-28: Large search area - example

• With the Pattern size, the size of the pattern to be searched for can
be defined. Select a high contrast pattern which is unique within the
search area.
• The search method can be optimized by activating the Search
options.
• Edit a % value for the Search and teach score which defines the
lowest acceptable quality of the pattern. A message appears if this
quality is not reached during searching.
• If problems occur with pattern recognition during operation, this can
be corrected by teaching alternative patterns. This option only
applies to the methods Fine structure and Rough structure.
• Enter the Maximum number of alternative patterns which should be
taught by recurring non recognition. (The more alternative patterns,
the longer the search process will take). With the entry Defined, the
taught alternatives are numbered.

Teach 1st Automatic Pattern

The register Teach Reference System is selected. Manual points are
defined.
• Move the moveable crosshair, which takes the form of a square, to a
suitable position in the camera window. A position near the first
manual point is recommended.
• Focus the image by moving the Z axis upwards or downwards and
confirm the height with the command button Focus height.
• Adjust the Lighting if necessary.
• Teach the first automatic pattern by clicking the right trackball
button. The teach score is displayed in the upper left corner of the
camera image.

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• The marked and labeled pattern for the reference system is

displayed in the camera window. The message 1st pattern -
complete appears in the status bar.

Teach 2nd Automatic Pattern

The system automatically expects the 2nd pattern if the option auto
increment is activated. If the option auto position is active the 2nd manual
point is automatically moved to.
• Carry out the steps as for the first automatic pattern.
• Define the focus height and adjust the illumination if necessary.
• Teach the second automatic pattern by clicking the right trackball
button.
• The second pattern is displayed in the camera window. The status
bar displays 2nd pattern - complete.
• If the reference system is completely taught a prompt appears
asking to define another reference system.
• Confirm the prompt if you wish to define another reference system.
The display counter Refsys automatically increases by 1.
• If no further reference system is required, confirm with No.

Pattern X View
The option Pattern X view is available in the dialog PR Parameters where
the taught pattern is displayed in the size of the alignment aid pattern.
This does not apply for the algorithms Closed Contour, Leadtip Locator
and Inkdot Recognition.
With this pattern, the settings for Lighting, Focus height during teaching
of the pattern, the Teach score and Last search score are displayed.
The value Found gives the number of times the pattern was found in
relation to the number of search processes.

Figure 9-29: PR parameters - pattern view

Tolerances
In the dialog Tolerances, the maximum deviation of the distance
between both patterns for this reference system can be entered in the

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editing box Max. pattern distance error. The maximum allowed rotation
can be entered under Max. rotation.
If the option Calculate stretch factor is activated, the relation of the
distance of two patterns or manual points to the distance of the taught
patterns is interpreted as a stretch factor and used for the calulation of
the bond position. The cause for this stretching could be the heat
treatment of the substrate for example. When using this option, take note
that the patterns may not be taught diagonally, but must be aligned
horizontally or vertically in order to avoid a pillow effect. Several
reference systems may have to be taught on one substrate in order to
achieve optimum results.
As a standard there are 4 different focus heights within a reference
system . Each pattern, the bond area and a badmark are each taught on
an own focus height. If the option Identical Focus Heights is activated,
all focus heights are identical.

Figure 9-30: PR parameter - tolerances

9.4.6 Edit Reference Systems

Copy/Insert
A selected reference system can be copied with the function Copy and
inserted in front of the current reference system with the function Insert.
The inserted reference system is automatically given the values for the
copied reference system. the numbers of the following reference systems
are increased by 1 and the wire structures corrected accordingly.

Delete
A selected reference system can be removed by clicking the function
Delete. This results in all wires with a source or destination bond in this
reference system to also being deleted. The numbers of the following
reference system are updated and the wire structures adjusted
accordingly.

9.4.7 Pattern Recognition

Once a reference system has been completely defined the prompt for
pattern recognition automatically appears.
• To carry out pattern recognition for this reference system, confirm
with Yes.
• Exit with No if you do not wish to carry out pattern recognition.

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All defined points and patterns of the entered positions are searched for
by the pattern recognition. An error message appears if the patterns are
not found. Points and patterns can be corrected manually.

Manual (1)
With the function Manual, manual adjustment is carried out on the
current chip or board. The manual points must be entered for all
reference systems. The taught manual points are displayed in a helper
pattern in the upper left corner of the camera window.

Figure 9-31: Manual adjustment - example

Chip (2)
Automatic adjustment of the chip is carried out with this function. the
taught patterns are automatically searched. Manual mode is
automatically activated if an error occurs so the manually taught points
can be entered.

9.4.8 Reference System Dependency

When teaching a program, the substrate is generally taught as the first
reference system. By defining 2 points and 2 patterns, the position of the
substrate can be precisely defined in the X/Y position and the rotation.
For the chips on the substrate, additional reference systems are defined.
The chips are located in a position relative to the substrate. The definition
of a single point is sufficient to determine the position of the chip. If the
position of a substrate is altered, the position of the chip relative to it is
also altered. If the chip positions on the substrate vary, it is wise to teach
2 points and 2 patterns for each chip reference system.
The dependency is relative only to the positions and not to the heights or
parameters.

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If it is necessary to define several reference systems because of

customer specific components, the dependency can be allocated
differently.
• Select the number of the reference system for the allocation of
dependency. If there are only 2 reference systems, 1 is
automatically displayed here.

Figure 9-32: Reference system dependency

• Take the relative position to the selected master reference system

into account.
One special case is a number of different wire groups which are to be
bonded from one same component. Additional reference systems,
dependant on the reference system of this component but with 0 points
and 0 patterns are defined. Parameters for each wire group can be
altered by editing the respective reference system parameters.

9.4.9 Chip Reference Point

For substrates consisting of several identical circuits, it is recommended
to define a chip duplication. To define the relative position of the
components on the substrate, a Chip reference point is defined on a
reference chip. This point can only be defined in the 1st reference
system.

9.4.10 Badmark Recognition

During production, defect or bad chips can be skipped with the Skip
function. Two procedures are available during pattern recognition to
differentiate a good chip from a bad chip. In the first method, a pattern of
a good chip is taught so that during production, pattern recognition errors
on the board / chip can be excluded, or skipped. The procedure is the
same as for pattern recognition of a reference pattern. The search
methods for fine and rough structures can be selected as well as closed
contour. Search area, pattern size and search accuracy are defined.
For the second method the option Inkdot recognition is selected. An ink
dot on a chip is taught with pattern recognition. The size of the defect
marking should be selected so large that the ink dot can still be located
without prior recognition of the chip.

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Teach Badmark
• Activate the option Badmark recognition in Teach reference
system mode.
• Open the option Badmark recognition in PR Parameters.
• Select the search method suitable for the surface structure and
define all parameters as for reference pattern.

Figure 9-33: Badmark recognition - PR Parameter

• Look for a suitable position on the chip, measure the focus height
and confirm this pattern with the right trackball button. This pattern is
marked with the text Badmark in the camera window.

Figure 9-34: Badmark recognition - example

Teach Inkdot
• In Teach reference system mode, activate the option Badmark
recognition by clicking the button.
• Open the option Badmark recognition under PR Parameters.
• Select the method Inkdot recognition.

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Figure 9-35: Inkdot recognition PR parameter

• Determine a Radius for the pattern size of the inkdot.

• Under Tolerance, define the maximum allowed deviation of this
pattern in the search area.
• Search for the marking which differentiates a good chip from a bad
one. Measure the focus height and confirm the pattern with the right
trackball button. It is marked with the text Badmark recognition in
the camera window.

Figure 9-36: Inkdot recognition - example

Badmark View
Just like the reference pattern, the taught badmark recognition pattern
can be viewed in the dialog PR Parameters under Badmark recognition.
The values for focus height, lighting and scores and the number of found
patterns are displayed here.

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Figure 9-37: Badmark view - example

Board Height
With this option, a height is determined for the 1st board on the 1st
reference system which is measured on the substrate. For board
duplication it is assumed that all boards have the same height. If the
height should be measured on a different board, settings can be made in
the mode Teach board.

9.4.11 Reference System Parameters

Default Parameters
The available default parameters are applied to all wires in a new
program. These are the parameters for touchdown, bonding, loop,
welding, tear off, inline test (optional) and quality control.

• Click the + key to open the individual parameter dialogs and to view
or edit the values.
• If the values should be applied, confirm with OK.
• Cancel returns you to the previous menu.

Figure 9-38: Default parameters

Reference System Parameters

For every reference system, the bond parameters can be adjusted to the
product specific requirements. The default values are applied initially.

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• Click the command button Parameter in Teach reference system

mode to open the following dialog:

Figure 9-39: Reference system parameters

These parameters apply for all wires in the reference system which
number is displayed in the top line.
Parameter sets for different wire diameters can be loaded from an
existing library.
• Click the symbol to open the parameter library.

Figure 9-40: Load bond parameters

• Select the parameter set for the respective wire diameter by clicking
it and confirm with OK.
• A dialog appears, where it can be defined if all parameter groups
from this set or only certain parameter groups should be loaded.

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Figure 9-41: Parameter selection

• Select the checkbox(es) and confirm with OK.

• With the function Check plausibility of the parameters, a check is
carried out if all wire in this reference system can be bonded with
these parameters.
• A warning is displayed if a parameter is not plausible and wires can
not be bonded. Confirm the warning and alter one or more bonds
respectively. Carry out the plausibility check again if necessary.

Figure 9-42: Reference system parameters - general settings

• The information Basic parameter set displays from which

parametrer set this reference system was created. This information
is displayed by selecting a dataset from the parameter directory with
the command Load bond parameter.

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• If the option Exclude indidivual parameters is active, only

parameters identical with the reference system parameters before
alterations were made are overwritten when copying the alterations
to all wire parameters from this referfence system.
• The information Parameter limits displays which parameter limit set
is laoded for this reference system. A data set can be loaded by
clicking the symbol , and can be edited by clicking the symbol
. A parameter set can be allocated to several reference systems.
The parameter sets are saved together with the bond programs. If
no parameter set is selected, the data set in Administrator mode is
valid.
• If the option Deactivate height measurement is active, no height
measurement is made for this reference system. The touchdown
heights are assumed the same as the reference system from which
it is dependant. This option can not be activated for the first
reference system.
• Do not forget to save all alterations so they are applied to the
program. Select the function Save or Save as... in the program
menu to save under a new program.

Copy Parameters
Settings to the reference system can be copied in whole or in part to
another reference system with the command Copy parameters... in the
Extras menu. The possibilities available greatly simplify program
optimization and are described below.

Figure 9-43: Copy parameters

Parameter set: The copy options between the selected reference

systems can be saved as a parameter set and are then available to run or
for automatic update. The copy parameters set can be saved under the
given name with the command Save. A selected parameter set can be
deleted with the command Delete.
From: The reference system from where the parameters are to be copied
must be entered here (copy source).
To: An individual reference system or a group of reference systems can
be entered here where the source parameters should be copied to (copy

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destination). The following syntax can be used for entering the

destination reference system(s):
2 The source is copied only to reference system 2.
2,3 Reference systems 2 and 3 are the copy destination.
2-5 All reference systems from 2 to 5 (inclusive) are copy destination.
2,3,4-6 A combination of the above mentioned forms.

All parameters: All parameters or a selection of parameters can be

copied. Click Selection to open the following dialog:

to be copied
not to be copied

Figure 9-44: Selection of parameters to copy

In this dialog, individual checkboxes can be clicked to select which

parameter groups are to be copied. With the + symbol in front of the
parameter groups the individual parameters within a group can be viewed
and selected for copying. If a group of parameters is selected for copying,
all the individual parameters within it are copied.
All wires update: With this option, you have the possibility to apply the
new data immediately to all wire structures. This is normally required.
Individual parameters exclude: Individual wires which deviate from the
parameters of the respective reference system (e.g. special loop forms)
can be excluded from this copy operation.
Automatic update: This option has the effect that the selected
parameters from the source and destination reference systems are
permanently linked to each other as soon as the command button Save
is pressed! This means that all later changes to the parameters of the
source reference system are also changed in the destination reference
system(s).
The command Launch carries out the copy process according to the
selected settings and options.

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The command Quit closes the copy parameter dialog.

9.5 Teach Boards

In a matrix of identical boards which are systematically placed within an
area, the position of the boards can be manually defined by teaching the
individual boards or with duplication of boards. This function can be used
for substrates with several identical board or for boards with several
identical chips.

Figure 9-45: Teach board (example for rotated board)

Insert Boards
With the insert option, a new board is inserted in front of an existing one.
The insert option is therefore only available from the 2nd board. The
numbering is altered accordingly.
• In the board options, click the command button Insert if the board
number is at least 2.
• Confirm that you wish to insert a board. In the status display, the
teaching step is shown as Undefined.
• The prompt to enter the board offset appears if you move the
moveable crosshair in the camera image.
• With the pattern marking, move to the same pattern which was used
for the 1st board and confirm the position with the right trackball
button.
• The markings for search area, point, pattern and reference system
from the 1st board are displayed with the new numbering.
• Once this option has been carried out successfully, the status bar
displays „complete“. Adjustment can then be carried out.

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Insert Rotated Board

In order to teach a board which is rotated 90°, 180° or 270° (-90°)
compared to the original board, the respective rotational angle must be
entered before entering the first pattern from reference system 1.
• Click the respective radion button below the board number

• Reference system or wires can be taught in rotated boards.

Rotation of the patterns for the pattern recognition in a rotated board is
carried out automatically.

Delete Boards
• A complete or undefined board can be manually removed with the
Delete option.
• Click the command button Delete and confirm the warning.
• The process is aborted if you answer the warning with No.
• Make sure that the counter displays the board number which is to be
deleted. The numbering is altered accordingly after deleting.

Duplicate Boards

Hint: A bond program can encompass a matrix of several

boards on which a multitude of chips are placed. The
difference between multi boards and multi chips is as
follows: Each board has its own reference system 1
(usually on the substrate) which is adjusted automatically
on every board with pattern recognition. Each chip
however, is linked to the first reference system of the
board. The pattern recognition can find every chip on
every board, but it expects to find it in a relative position to
reference system 1 on the board.

• Multi boards or multi chips can be created by defining the first and
last chip and the number of lines and columns. Before they are
defined, click the arrow keys in the Number box and move to the
camera crosshair to the last chip on the line. Click the arrow keys in
the number box again and move to the last chip in the column.

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• Click the command button Duplicate to open the dialog.

Figure 9-46: Duplicate chip/board

• The offset is automatically calculated by entering the number of

lines and columns.
Several Methods can be selected for chip or board duplication. You can
differentiate between horizontal and vertical direction and then between
sequential and line by line processing.
When selecting the method, take note of which boards must be taught in
the respective order to create the matrix with the correct numbering and
processing method.
The sequential order is displayed in the dialog Chip/Board duplication
with red markings on the button. Click to select the respective method.

Figure 9-47: Duplicate chip/board methods

• If a wafer was defined during setup of the holder, the Circle option
can be used. To create a circular duplication, only one chip must be
defined which remains the first chip. The radius determines the size
of the circle. X and Y offset define the distances between the chips.
Starting with the first chip, further chips are defined in the Y direction
until a circle is formed. Then the column is changed to the left and
chips are defined from bottom to top. The column is changed again

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at the upper edge of the circle. This process is repeated until the left
edge of the circle is reached.

9.6 Teach Wire

After teaching the reference systems and the positioning of the chips, the
wires are taught.
• In the menu Operation mode, select Teach wire or click the
respective register in programming mode.

Figure 9-48: Teach wires

For a complete wire, a source and a destination point must be entered.

The source point is the 1st bond point and the destination is the 2nd point
of a wire, which, unlike the source point is supplemented with the tear off
parameters. Every point is assigned to a reference system. The default
parameters for the reference system parameters are initially applied and
can be adjusted individually in the parameters dialog later.
All source and destination points for all wires can be defined wire by wire,
or alternatively all source points can be defined first and then all
destination points. The current teach point is displayed in the status bar.

9.6.1 Teach Order

The teach order for the teach points is defined with the functions S → D,
D → S, S and D.

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S→D The start point (source) is taught first and

the end point (destination) is taught next for
each wire.
D→S First the end point (destination) and then
the start point (source) are taught for each
wire.
S Only source points are taught.
D Only destination points are taught.

An exception for the teach order is the creation of Stitch bonds. To

define such a bond chain, first a source bond is taught. Then a
destination bond is taught, but the Tear off option (checkbox) is
deactivated. As long as Tear off is deactivated, additional destination
bonds can be taught. A second loop is automatically created where the
1st destination is labelled as source in the parameter dialog, and the 2nd
point is destination. Take special note of the allocation to the correct
reference system.

9.6.2 Auto Functions

In the teach wires dialog, there are functions to support the teaching
process or help to optimize the programming steps.
If the function Auto Increment is activated, the next teach point is
automatically switched to after every teach process i.e. after confirming a
teach point with the right trackball button. If a wire is completely taught, a
new wire is automatically created. The last wire must be deleted if it is not
required.
If the function Auto Position is activated, the bondhead automatically
moves the next teach point under the current crosshair position after
every teach process. The offset for both previous wires is determined and
the offset for the last wire is assumed for the next wire. This option is only
useful if new wires are taught and the option Auto Increment is active.
Source and destination must be at equal distances.
With the function Auto Centering, during bond pad teaching the bond
position is automatically centralized over the pad. In AC parameters the
pattern recognition parameters can be defined.

Figure 9-49: Auto centering parameters

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The current pad is searched with the Search function without moving the
bondhead to the pre-set position. The found pad is then moved to the
center of the window. For the Center of gravity search method the
search area and the search accuracy are given. For the Leadtip locator
method, the search area is manually edited or defined with the auto
functions. The position can be defined more accurately. The distance to
the leadtip is calculated from the % value of the width of the leadtip. If 2 or
more bonds must be placed on the leadtip at different positions, this is
possible by deactivating the position in %.

Figure 9-50: Leadtip locator- search area auto- example

9.6.3 Create Wire

To create a wire, move to the position using the trackball. Pressing the
left trackball button brings the crosshair to the center of the pad position.
Press the right trackball button to confirm the position.
A graphical display of the wire can be defined in the menu Options/
Markings. The bond positions are marked S for source and D for
destination according the to the selected teach order.
Every wire is given a number which is displayed in the Wire editing box.
The reference system can be found under Refsys.
Instructions are given in the information bar and the current status,
complete or incomplete, is shown in the status bar.

Hint: Make sure that the source and destination points are in
the correct reference system.

All wires for a program are taught and saved with the program in this way.

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Select Wire Color

Every complete wire can be given a color. Initially the wires are given the
color of the respective reference system to which they belong.
Afterwards, individual wire colors can be defined with the color editor in
the status bar.
• Select the wire for which you wish to define the color. Use the arrow
key in the Wire: display.
• Click with the left trackball button on the --> symbol in the status bar
to open the color selection.
• Select a color and confirm with the left trackball button. The wire is
marked with the selected color.
• Left click in any position outside the color selection to close the
window.

Figure 9-51: Wire color - selection

• Clicking with the right trackball button in the --> symbol automatically
changes the wire color back to the defined color of the reference
system.

9.6.4 Wire Functions

Individual wires can be given the following attributes:

Tear off Tear off takes place after the destination

bond. If this function is not switched on a
bond must follow for which only the
destination is taught (stitch bond).

Test wire The wire stays programmed but is not

bonded in normal production. With the
option Bond test, the wires defined as test
wires are bonded.

Height S This function is activated to measure the

height of the reference system at the
source pad of this wire.

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Height D This function is activated to measure the

height of the reference system at the
destination pad of this wire.

9.6.5 Edit Wires

Insert
• Move to the wire before which a single wire should be inserted by
entering the number in the Wire entry box or using the arrow keys.
• Click the command button Insert.
• A new wire is inserted in front of the current wire. The numbers of all
following wires is altered accordingly.

Delete
• To delete a single wire, it must be selected in the Wire entry box
either by entering the wire number or using the arrow keys.
• Click the command button Delete to remove the selected wire.
• The bond marking is removed. The numbers of all wires are altered
accordingly.

Copy
A defined number of programmed wires can be copied to another
position with this function.
• Move the fixed crosshair to the insert position.
• Click the command button Copy under the option Series of Wires.
• A dialog is opened where the first and last number of the wires to be
copied must be defined. The movement direction and the distance
must be entered here. Confirm with OK.
• A series of wires with exactly the same bonds is created at the new
position. If the insert position is within a series of wires, the new
series is placed at the end.

Correct
Individual bond positions can be corrected at any time. If a bond is
continually placed at an incorrect position, the position must be corrected
in the program.
• Select the wire by entering the number in the Wire dialog or use the
arrow keys.
• Move to the source or destination point by clicking the command
button Teach point. You can change between the teach points with
the arrow keys.
• Move the crosshair to the new position and confirm with the right
trackball button to correct the position.
• The possibility to correct positions is displayed in the information bar
in red text. In an existing program, the alteration is shown in the
status bar by a star in front of the program name.

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All changes must be saved before the values and position are applied to
the program.

Exchange
For wires defined in the program which are always bonded from source to
destination, the options „Exchange current wire“ and „Exchange all
wires“ are available in the Extras menu.
With this option, the source and destination points and the parameters
are exchanged. The respective reference systems are allocated
accordingly.
The following illustrations show an example. In the model program, 2
reference systems have been created. The wires have the source bonds
in reference system 1 and the destination bonds in reference system 2.

Figure 9-52: Exchange wires - example 1

In the wire parameter dialog, the allocation of bond points to reference

systems is displayed in the information bar.

Figure 9-53: Exchange wires - parameter display

After using the command „Exchange current wire“ the selected wire
was marked.

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Figure 9-54: Exchange wires - example 2

This exchange is also shown in the wire parameters.

Figure 9-55: Exchange wires - parameter display 2

• With the command „Exchange all wires“ all wires are exchanged in
this way. The processing direction remains as it was, from source to
destination.

Alignment
This option simplifies the alignment of positions for applications with
several parallel wires which are created between 2 reference systems
between which a 3rd is located with a different bond level. This reference
system is displayed in the example connected by loops from reference
system 5 to the middle.

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Ref.sys 3

Ref.sys 4

Ref.sys 5

Figure 9-56: Align wires - application example

If reference system 4 is displaced in the X direction because of a die

bonding error and the bond positions are altered accordingly, the wires
would collide as shown in the example.

Ref.sys 3

Ref.sys 4

Ref.sys 5

Figure 9-57: Align wires - example displacement in X direction

With a displacement of reference system 4 in the Y direction and fixed

bond positions and loop lengths of the red wires, the bond points would
fall outside the reference system.

Ref.sys 3

Ref.sys 4

Ref.sys 5

Figure 9-58: Align wires - example displacement in Y direction

Such position problems can be quickly corrected with the option Wire
alignment. The wires can be aligned individually or in groups to another,
in this example to the blue wires.
• Select the option Wire alignment in the menu Extras to open the
following dialog:

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Figure 9-59: Wire alignment dialog

• Activate the option Preset wires set and enter the numbers or
series which are to be aligned.
• A further option is the Preset reference systems to automatically
select all wires which accord to the criteria.
• Define the Fixed position by clicking the radio button for source or
destination which will be the reference system for the alignment.
• Select one of the Align at options, to which the defined wire should
be orientated. It is possible to align the wire to the previous or next
wire, a numerically defined wire or to a reference system.
• In example 1 for example, giving the wires the fixed position at
source bond and the alignment to previous wire or to wire 1 would
solve this positioning problem.
• With the option Absolute and entering the Angle, the alignment of
the red wires can be corrected so that they run parallel to the blue
wires again.
• A further option is the alignment at a defined Angle to the
Reference system.
• To correct a displacement of the reference system in the Y direction,
the definition of a Const. length for the red wires of the example
above can result in correct positioning.
• With the command Launch all values are applied and the wires are
repositioned. The result of the alignment criteria can be checked.
• All values for an alignment command can be saved as a Parameter
set with a specific name e.g. Ref4-Ref5 in the left side of the editor.
• If the option Automatic update is activated, changes are applied
during the automatic processing of a program.

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9.6.6 Edit Series of Wires

If a series of wires is to be programmed with identical distance and
direction, the programming can be automated with the option Series of
wires. The option Insert optimizes the programming of substrates with
many wires at identical pitch and dimensions.

Insert
• Move to a wire in front of which a series of wires should be inserted.
Enter the wire number or use the arrow keys.
• Click the command button Insert under the section Series of wires.
• A dialog is opened where the number and distances of the new
wires can be defined. If the define distance checkbox is deactivated
the defined number of wires is inserted between the previous wire
and the current wire at identical distances.
• Insert source or destination and Auto centering function are
additional available options.

Figure 9-60: Insert wires

Series of wires between already defined bonds are inserted after the
current wire and the numbering is altered accordingly.

Delete
• Click the command button Delete under the section Series of wires.
• A dialog is opened where the first and last number of the wires
which are to be deleted must be defined. It is also possible to delete
only wires with odd or even numbers. With the options source and
destination, bond points or complete wires can be defined. Confirm
with OK.
• The selection of wires can be restricted with the option Define
reference system.

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• All wires or individual bond points which were entered in the dialog
are deleted. The numbers of all following wires are automatically
updated.

Figure 9-61: Delete wires

Move Wires
• Click the command button Move wires under the section Series of
wires.
• A dialog is opened where the first and last number of the wires
which are to be moved must be defined. The movement direction
and the distance must be entered here. It is possible to move only
wires with odd or even numbers, or all wires between 2 defined
individual wires. It is also possible to move only source or
destination bonds or complete wires. Confirm with OK.
• All selected wires or individual source or destination bonds are
moved to the defined position.
• If you do not wish to use this option, it is possible to define a
selection by reference systems.

Figure 9-62: Move wires

Each time these dialogs are opened, all values are returned to the start
values in the dialogs Copy Wires, Move Wires and Insert Wires.

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Change Reference System Assignment

This function can be found in menu Extras/Reference system
assignment. It is used to define the assignment of one or several wires
at once.
• Define the wire by entering the number, for several wires enter the
number x to number y.
• If you do not wish to use this option, it is possible to define a
selection by reference systems.
• Specify the new assignment by entering the current reference
system and the new one to which the wire should be assigned.
• Restrictions can be set under Options.

Figure 9-63: Reference system assignment

All changes are applied after confirming the dialog. They are shown in the
display for wire parameters.

9.6.7 Wire Parameters

Initially, all new wires are given the parameters from the reference system
settings which are either default values or those loaded from a bond
parameter directory (see chapter Bond process for parameter meanings).
Individual settings can be made for every wire.
• Click the symbol to open the parameter directory.
• Select a directory by clicking it with the trackball. The selection is
then highlighted. Confirm with OK.
These parameters then apply for the wire displayed above in the
reference system and for both bond positions.
Touchdown parameters, bond parameters and welding parameters can
be defined for every bondpoint. The loop parameters are set for the wire.
The tear off parameters are only relevant for the destination point.
If the option inline test is activated, test parameters and the quality
threshold can be defined for every bond position.
The respective parameter dialog is opened by clicking + symbol.

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Parameters can be individually edited here, these changes must be

made separately in the respective column for source and destination.
The edited parameter set can be saved under a new name in the
directory and can be loaded when required.
• Click the symbol , enter a file name and confirm with OK.
Changes to the wire parameters are reset to the original values by
clicking arrow symbol behind the editing box.
All changes must be permanently saved with the command Program/
Save.

Figure 9-64: Wire parameters

9.7 Program Bonding

Once a program has been created, all functions and positions taught
should be tested.

• In the menu Operation mode, select the menu item Program

bonding or click the respective register.

Figure 9-65: Program bonding

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9.7.1 Auto Functions

If the function Auto Increment is activated, the next step, as defined in
the bond method, is switched to immediately after bonding.
If the function Auto Adjust is activated, the automatic adjustment
process is started after moving to a component which is not yet adjusted.

9.7.2 Adjustment
Before automatic bonding is started, the type of adjustment for the
complete program can be selected. The functions manual, chip, board,
substrate or pads are available and are activated by clicking the
command button or pressing the respective number on the keypad.

Manual Adjustment
Manual adjustment can be carried out on the current chip with the
function Manual. The manually taught points must be entered for all
reference systems. Adjustment can be automatically carried out by
clicking the command button Chip.

Automatic Adjustment
In automatic adjustment, the taught patterns are searched automatically.
You can select between adjustment for Board, Chip or Substrate.
If the pattern can not be found an error message appears before
switching to manual adjustment so that the manually taught points can be
entered.

9.7.3 Measure Height

Before the program can be bonded, height measurement must be carried
out for all reference systems.
• Click the command button Height 9 or enter the number on the
number block.
• Unless another bondpad was marked for the height measurement
under „Teach wires“, the bondhead moves to programmed bond
position 1 in reference system 1 and carries out a touchdown
measurement. Then the bondhead moves to the first bond position
of all reference systems and automatically measures all the heights.

9.7.4 Bonding
The functions Wire, Chip, Board or Substrate are available for bonding.

Bond Wire
A single wire is bonded with the function Wire.

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• This wire can be selected by entering the respective number in the

Wire entry box.
• Click the command button below the Bonding function to bond a
single wire.
• If Auto increment is activated, the next wire is moved to after the
bond process.

Bond Board / Chip

• The current chip or board is completely bonded with the functions
Chip or Board.
• The chip or board can be selected by entering the respective
number in the dialog boxes chip or board.
• Click one of the command buttons under the function Bond to start
the bond process.
• If the function Auto increment is activated the next board/chip is
moved to after the bond process and automatically adjusted.

Bond Substrate
• The function Substrate will bond the complete substrate from the
current wire position.

Hint: For all functions: The bond process can be stopped after
completion of the current wire with the STOP key on the
keypad. The bond process is stopped immediately at the
current position with the HALT key.

Correction
Every pad can be corrected e.g. if a substrate is used that has already
been bonded.
• Select the position to be corrected and click the command button
Correction. The correction position is marked by a red frame.
• The correction is carried out by moving and confirming the new
position.
• A correction can be reversed by clicking the command button
Original. A corrected pad is only bonded at the corrected position in
the current chip / board. After renewed adjustment every bond is
placed on the original position.

Bond Test
Single bonds which are defined as „Test wire“ in the „Teach wire“ mode
are bonded with this function. The bondhead automatically moves to
these pre-defined wires and bonds only these wires.

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9.7.5 Step By Step Mode

If the function Step by step is activated, the bond process is stopped at
predefined step positions. The bond process is always stopped at each
activated step point. The user can select the step points. These settings
can be made in the menu Settings/Step by step points...
With the command All on or All off, all the points related to the
parameters or hardware are activated or deactivated. Points which are
not available can not be activated e.g. differences for frontcut and
backcut parameters.

To carry out the next step, click the STEP key or the ENTER key.

Figure 9-66: Step by step points (Backcut)

9.7.6 Parameters
For teaching reference systems in a new program, the PR default values
are applied for the pattern recognition. Teaching wires is also based on
default values. These could be changed while creating the program.
These values are displayed under the command button Reference
systems and can be altered according to requirements. Wire parameters
can also be updated.
By clicking the command button Curr. Wire, the parameter set is
displayed separately for source and destination with the information for
the associated reference system. Changes to this dialog only apply to the
current wire. The gray arrow symbol next to the editing box changes in
color if changes are made, changes can be undone by clicking this arrow.

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9.7.7 Bond Plan

In a bond plan, the complete program is displayed graphically as an
overview. This plan contains the substrate, all boards, chips, reference
systems and wires.
This program overview can be opened in the menu Extras with the option
Bond plan... or with the hotkey Alt+V.
The color editor is available for the graphic appearance of this overview
in which every component can be allocated its own color.

Figure 9-67: Bondplan - color editor

The bond plan can be zoomed larger or smaller with the keys . or - on the
keypad or with the keys PgUp or PgDn. A segment can be selected with
the trackball which can be zoomed larger.

Figure 9-68: Bondplan overview

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The labeling of the board or chip numbers are displayed if the zoom
factor is set to provide enough room for the label.

Figure 9-69: Bondplan zoom

Reference systems and wire numbers are displayed in a larger zoom

factor.

Figure 9-70: Bondplan zoom 2

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The segment can be moved freely by clicking and holding the left
trackball button.

9.8 Bond Position Control (Optional)

If the bonder is fitted with a 2nd angled camera on the bondhead which is
aligned to the wedge tip the option Bond position control is available in
the programming register Teach Wire or Bond program under Extras.
The function is active after successful adjustment of the component has
been carried out, otherwise the function remains inactive. A message
appears in the information bar.
After selection of a wire and the respective bond position, the axes move
to the working height over the bond position. By manual or automatic
movement of the Z axis you can observed in the camera image if the tool
can touch down at this position without restriction by any obstacles.
The functions for illumination settings, dimensioning and zoom are
available, as familiar from the bond camera.

Figure 9-71: Bond position control

• In the Extras menu, activate the option Bond position control. An

illustration of a wedge tool is visible in the camera image.
• Define a Wire by entering the number or using the arrow keys.
• Select Source or Destination for this wire.
• Confirm the position with the command button Move to.
• Move the Z axis to the position with the keys on the keypad or the
keyboard or use the function Touchdown for automatic touchdown
on the substrate. Check in the camera image if the wedge tip can
touch down on the substrate without obstruction.
• Close the dialog with the command Quit.

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9.9 Bond Charts

In all operation modes where wires are created, the deformation, the
progression of the current curve can be checked in the menu Extras/
Bond Charts. Editing charts which are already saved is possible in the
menu Calibration/Register Quality/Deformation and Current.
With the functions Source or Destination, the progression on the source
or destination bonds is displayed. If the option Last Chip is activated,
only the charts for the wires on the last chip are displayed. If this option is
deactivated, a selection of any of the last bonded wires can be made.
With the option Choose from list the respective chart can be selected
from the list.
From a selection of deformation curves, the Mean value is shown as a
green curve and the Variance as a yellow curve. With the Minimum and
Maximum, the upper and lower red curves, the range around the middle
value is calculated. A Grid is displayed behind the coordination system if
this option is activated.

Figure 9-72: Bond chart - deformation - example

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Figure 9-73: Bond chart - US Current - example

For machines which are fitted with the optional PiQC box, there is a
function in this dialog for viewing the quality values.

Figure 9-74: Bond charts - example for PiQC quality values

Below the deformation charts the charts for ultrasonic energy and
bondforce are also displayed which give conclusions to the effectiveness
of the bond phases.
• The command Quit returns you to the previous dialog.
• The bond charts can be deleted individually or completely by
clicking the command buttons Delete this chart or Delete all
charts. A warning appears which must be confirmed to either delete
the charts or abort.
• The displayed charts can be printed if a Printer has been
configured.
• The charts for deformation and US current can be converted to
profiles and saved in the Profile directory with the function Save.

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Figure 9-75: Profile directory

9.9.1 Create Profile

After reaching the optimum deformation curve, a profile is created from
the mean value, minimum and maximum. The deformation curve can be
corrected upwards or downwards. Alternatively, the range can be
automatically calculated by clicking the command button Apply. The
upper and lower limit from the product, the Variance and the standard
deviation is given. The distance between the target curve, the upper or
lower limits is at least as large as the Min. distance.
During bonding, the current wire deformation is measured and compared
to the profile. The smaller the actual deviation of the deformation to the
profile, the better the quality. A quality value is calculated using the
deformation curve and the tolerance range. A value of 0.0 means that the
current deformation curve lies within the tolerance range. The larger the
value, the poorer the profile and the poorer the quality of the wire. If the
sum of the deviations above and below the tolerance range is greater that
the accepted Threshold, the bond is classified as suspective and must
be checked.
To determine a reasonable value for the tolerance, the quality values for
all wires of a chip can be taken. The quality value is only determined if
Quality control has been activated. Using these values and the
corresponding shear strength of the wire, the threshold can be defined so
that wires with low shear strength generate an error message or will be
entered in the job protocol.

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Figure 9-76: Example - deformation profile

This profile is saved with all entered values to the directory with the
command OK.

9.9.2 Edit Profile

The list of available profiles can be opened with the function Profiles... in
the Settings menu,

Figure 9-77: Profiles directory

9.9.3 Use Profile

The application of this profile for quality control is set in the parameter
screen.
• Select Quality control in the parameter list and open the profile
directory by clicking the + symbol.
• Activate the functions Deformation profile and US current profile.

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Figure 9-78: Quality control parameters

• Default profiles are generally used here. To load a corresponding

profile, click the symbol .
• Select the profile from the profile directory by clicking it and
confirming with OK.

Figure 9-79: Load profile

New profiles can be created and existing profiles can be deleted or

edited.
A New profile is created by giving a profile a new name and entering the
default profile. The profile is only put in the list once it has been edited.

9.9.4 Delete Profile

If a profile is deleted, this step can not be undone. If a profile that was
deleted was refered to in a bond program, a message appears when

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loading this program. The default profile is entered but the name of the
original profile is retained.
The complete profile list can be saved to disk with the backup function.
The saved profile list can be imported from a disk. The existing profile list
is then overwritten.

9.10 Data Exchange

9.10.1 Import/Export Programs
Program exchange is carried out over the disk drive which is located
below the operator panel. The network can also be used as an option.
To import a program, a disk must be inserted in the right disk drive from
which the program should be read. If a program with the same name
already exists on the machine, this will be overwritten without warning.
Only program files are displayed during the import function, even if other
backup files exist on the same disk.

Figure 9-80: Program import

• Select the bond program and the target directory and confirm with
Import.
• The selected program is loaded and saved to the target directory.
• For program export, place a formatted disk in the right disk drive and
confirm.

9.10.2 CAD Import/Export

The bonder software supports a CAD interface, which enables bond
programs to be imported from a CAD system. The interface is an ASCII
interface file which is described in detail in chapter 18.

9.10.3 Backup
In the Extras menu machine files e.g. programs, parameter files, user
lists, interpreter programs, holder files or profiles can be saved externally

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with the menu item Data Backup. Backup of these files may only be
carried out by users with the respective access rights. The files are saved
to disk with the command Backup. An empty disk must be placed in the
right disk drive. Existing files on the disk will be overwritten.

9.10.4 Restore
Files stored to backup can be restored with the function Restore in the
menu item Data Backup.

Figure 9-81: Restore example

• Select the respective file by clicking the radio button or with the
command button All or No.
• Confirm with OK. The files are restored to the original directory.

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9.11 Add-on for Software-Update 3.77

9.11.1 Referring to Chapter 9.4.1 “General”
A name can be assigned to every reference system. A newly created
reference system is automatically given the default name „Rx“, with x
being the number of the reference system. This label can of course be
changed in the PR parameters. This label is being used for the
markings on the screen and for selecting reference systems.

9.11.2 Referring to Chapter 9.4.5 “Teach Automatic

Pattern”

Figure 9-82: PR Parameters

PR Parameters

• Search options are removed.

For each algorithm individual parameters are set by clicking the “Edit”
button.

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Figure 9-83: Settings Fine Structure

Figure 9-84: Settings Closed Contour

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Figure 9-85: Settings Lead Locator

Figure 9-86: Settings Corner Detection

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Tolerances / Options

Figure 9-87: Tolerances / Options

If the option 2nd pattern optional is selected, only the first pattern is
used to determine the position of the reference system. In case of
recognition error, the second pattern is attempted as an alternative.
If the machine is equipped with a second bondhead camera, this
camera (typically no. 3 as no. 2 is reserved for the E-Box) can be used
for pattern recognition. It is necessary to calibrate this camera in setup
mode first. Since the camera selection can be set for each reference
system, the pattern recognition can switch between cameras from
reference system to reference system.

9.11.3 Referring to Chapter 9.6.2 “Auto Functions”

At the PR algorithms Closed Structure and Lead Locator are

additional filter functions and a corresponding preview available.
When selecting the Lead Locator algorithm, the selection Tip
Detection is available to guarantee centered bond placement also on
elongated objects.

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9.11.4 Referring Chapter 9.6.5 “Edit Wires”

Alignment
If multiple parameter sets are saved, the working order can be changed
later. The alignment angle is optional. The default value is 90°, because
wires are normally teached orthogonal to a reference system.

Figure 9-88: Wire Alignment

9.11.5 Referring Chapter 9.7.7 “Bond Plan”

A wire is highlighted in the wiring diagram by moving the trackball
pointer over it. Clicking this wire with the left trackball button leads to a
selection, which is displayed below the diagram with the associated
reference systems at source and destination. The parameters for this
wire can be edited directly, providing the currently logged in operator
has the required rights.

Figure 9-89: Wiring Diagram

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9.11.6 Referring Chapter 9.9 “Bond Charts”

Frequency graphs are displayed as well as deformation graphs and
current graphs. Profiles can be generated from the frequency graphs,
and used for bond quality calculations.

9.11.7 Referring Chapter 9.10.1 “Import/Export

Programs”
Alternatively to floppy disk, import / export can also occur to a USB stick.
Required conditions:
The USB stick must have > 512MB and < 2GB capacity
The USB stick must be formatted with FAT16
The USB stick must be inserted in the USB slot of the machine during
boot-up.

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 10 Manual Bonding

MANUAL BONDING
CHAPTER10

10.1 Basics
The Manual bonding function is used to bond single wires without
having to create a complete program. This mode is useful for instance to
optimize parameters on a test substrate.
Access right to Manual bonding mode has to be assigned by the
administrator. Any user with Programming access rights can
automatically access Manual bonding mode.

• Click the icon in the navigation bar to enter Manual Bonding

mode.

Figure 10-1: Manual bonding

10.1.1 Menu - Overview

Only a reduced selection of functions, necessary for the process steps
herein are available in Manual bonding mode.

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In the Action menu the functions Offbond, Threading, Reference move,

Move to start position, Move to park position, Index step, Clamping,
Logout and Shut down bonder can be found:
An Offbond can be carried out when necessary to create a defined tail.
The Threading function opens a dialog where the P-axis can be moved
by the arrow keys, the Wire spool can be turned by the respective
function key or automatically if this checkbox is clicked. The command
buttons Threading position and Original position move the bondhead
to these predefined positions.
A Reference move can be carried out to move all axes into home
position and bring the controls into a defined starting condition.
The Logout function is used to exit the software and the Shut down
bonder function is used to power down the machine.
Under Settings the menu items Markings, View, Profiles,
Bondparameters, Step-by-step points and Factors can be found:
The graphical display can be defined by the functions Markings and
View. The Profiles function opens a directory of available profiles, which
can be edited, and the function Bondparameters opens the parameter
library.
Step-by-step points can be defined at which the bond process can be
stopped to carry out checks. Between each point the STEP- or ENTER-
key has to be pressed.
The Factors dialog allows definition of reduced movement speeds,
ultrasonic power and cut depth adjustment factors.
The Extras menu contains the functions Bond charts and Information:
Deformation and ultrasonic current graphs, inline shear test and pull test
curves can be viewed and analyzed with the function Bond charts. Once
the optimum parameters have been identified, the charts can be stored
as profiles for further use in quality control. The Information dialog
contains information about the system and software.

10.2 Manual bonding

10.2.1 Teaching Wires
• Click the Source radio button to start teaching a bond. Define the
position of the source bond by right-clicking it in the camera window.
The teachpoint is only brought to the center of the camera window if
the button Move to is clicked.
• Click the Destination radio button to continue and define the
position of the destination bond by right-clicking it in the camera
window. This position can be moved to the center of the camera
window by clicking the Move to button.
• The distance between source and destination is displayed for this
bond.

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10.2.2 Height Measurement

• Measuring the height is mandatory after the machine has been
restarted or if the height appears out of focus. A warning message
appears which suggests a height measurement.

Figure 10-2: Manual bonding - Height measurement

• Confirm this message with Yes and carry out the height
measurement as described hereunder.
• Bring the bond position into the center of the camera window by
clicking the respective radio button and the Move to command
button and then bring the image in focus by moving Z with the arrow
keys.
• Click the Measure height command button. The bondhead will
move down to touchdown and record the height.

10.2.3 Teaching a Group of Wires

• Click the command button Settings to open the dialog where the
parameters for single wires or a group of wires can be defined.
• Open the section General.

Figure 10-3: Manual bonding - settings

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10 Manual Bonding

• You can create a group of identical wires by entering the Amount of

wires and the Distance in X and Y between the wires.
• Enter the height for collision-free bondhead movement over the
substrate in the Working height entry field.
• The currently loaded Holder is displayed underneath the Working
height entry field. This must coincide with the actually installed
workholder.
• The option Length setting can be used to define the exact length of
the wire(s) in µm. After teaching the source bond, the destination
bond is automatically created based on the set length.

Figure 10-4: Manual bonding - length setting

• By defining a Bond angle you can set the direction in ° towards the
destination bond relative to the X axis coordinate of the source
bond.

Figure 10-5: Manual bonding - bond angle

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10.2.4 Bond parameters

• The stored parameters sets in the library can be opened with the
Load command button.

Figure 10-6: Bond parameters directory

• Select the parameter set which fits the installed wire diameter and
confirm with OK. The current selection is displayed on the screen.
• If this parameter set should be modified, click the Edit command
button. The list dialog with the parameter groups is displayed.

Figure 10-7: Edit bond parameters

• Confirm any changes in the editing fields with OK or abort the dialog
without saving by clicking Cancel.

10.2.5 Bonding
• The bonding of the wires begins after clicking the Start command
button.
• The Single wire function causes that only the wire currently
displayed under „Pos.“ will be bonded even if a larger group of wires
was defined. If this function is unchecked, all wires will be bonded
consecutive and the wire number is updated automatically.
• The bond process can be interrupted at each defined point by
activating the Step by step function. Press the STEP key to execute
the next step.

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10.2.6 PiQC in Manual Bonding (Optional)

In manual bonding, the calculation of the quality index is activated, and
the calculation method selected under Settings in the PiQC group. A
quality specification must then be activated in the bond parameters,
reference data must be created and the quality specification must be
adjusted to the application requirements. The programmed wires can
then be bonded. The bonder bonds the programmed bonds and the PiQC
system calculates the total quality index for each bond.

Further information regarding use of PiQC can be found in chapter 20 of

this user manual.

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 11 Bonding Process

BONDING PROCESS
CHAPTER11

11.1 Overview
To ensure optimum bonding quality, the process parameters must be
adapted to the materials used in the bonding procedure.
This chapter contains an overview of the relevant process parameters
with explanations of their settings.
The following groups of process parameters are relevant for the
BONDJET BJ820:

- Touchdown parameters
- Bonding parameters
- Loop parameters
- Welding parameters
- Quality parameters
- Tear-off parameters

These parameter groups are shown in the first Parameter Dialog. The
individual subdirectories are opened by clicking the symbol + and closed
by clicking the symbol -.
For initial use, default parameters are available in the BONDJET BJ820
for pattern recognition and the bonding process. These can be changed
to customer specific values. Parameter sets for various wire diameters
and applications with characteristic surfaces are available in the
parameter library. The following figures show the file 25 µm which
contains the settings for aluminum wire with a diameter of 25 µm.

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11 Bonding Process

11.2 Explanation of Parameters

11.2.1 Touchdown Parameters
Generally during the bonding process the source and destination bonds
are not at the same height. This means that the height related
parameters for each bond must be defined separately.

Figure 11-1: Touchdown parameters

- Touchdown:
This is the height of the Z axis at which the wedge touches down on
the surface. This height is measured by the bonder and cannot be
changed manually.

- Starting height:
After the first complete loop in a reference system, the start height
is equivalent to the movement height to the next loop in the same
reference system. The value should be high enough to avoid any
obstacles.

-Touchdown area:
This defines the distance above the expected touchdown, at which
the bonder reduces Z axis speed, expecting a touchdown signal.

- Lower tolerance:
This defines the maximum search distance below the expected
touchdown height. If no surface contact is made at this position, the
movement stops and an error message is given.

- Touchdown velocity:
This defines a lower speed for the Z axis, for a soft touchdown.

- Touchdown force:
This is the force that is applied during touchdown.

- Tail Offset
at tear off with wire clamp an individually tail length for source bond
can edit, this box is only available, if in tear off parameter method
„wire clamp“ is activated

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 11 Bonding Process

11.2.2 Bonding Parameters

Figure 11-2: Bond parameters

- Shape angle:
One feature of the BONDJET BJ820 is the possibility of bonding S-
shaped bonds. The shape angle defines the angle of the bondfoot
offset at the source and destination positions. This angle is freely
programmable, but a maximum angle of +/- 90° relative to the wire
direction is a reasonable limit for automatic production. Large S-
shape angles will weaken the heel of the bond.

Figure 11-3: S-Shape Bonds

- Overtravel:
After touchdown the Z axis continues to move downwards for a
defined distance. This makes controlled deformation possible
during bonding. A recommended value is the wire diameter.

- Pad locator:
If this function is enabled, the pattern recognition system
automatically positions the bond positions in the center of each
bond pad. Before bondpad recognition with the pad locator, all
following bondpads are combined whose search area fit into a
camera window. Before recognition, the camera center is moved in
such a way that all these bondpads can be searched without
requiring axes movements. In the parameter dialog, the search
method, search area, options, filter, tolerance and position are
defined.

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11 Bonding Process

- Delay:
This parameter starts the bonding process after a defined delay.

- Turning height: <only destination, if activated>

If an S-shape is used at destination bond location and a turning
height is defined, the wedge tool will first touch down in bond
direction to center the wire under the wedge tool. After this initial
touchdown, the bondhead travels up to the programmed Turning
Height overtravel and turns the wire into the programmed S-shape
angle. Then the destination bond is bonded. If, however, no turning
height is defined, the turning movement of the bondhead will take
place during the loop between source and destination bond. When
using larger S-shape angles without defining a turning height, there
is a risk of the wire slipping out underneath the bond foot of the tool
during this turning move.

11.2.3 Loop Parameters

After bonding the source bond, the standard loop trajectory leads in a
defined angle to the radius of an imaginary cylinder. From here the
movement proceeds upwards to the intermediate height.

intermediateheight
intermediate
Zwischenhöhe height

Radius

starting angle

Figure 11-4: Graphical illustration of the intermediate radius

Afterwards, a reverse move can be carried out and a vertical move which
can be skipped for some loop forms by entering „0“. The Z axis then
moves towards the apex. If a loop angle has been defined, the apex is
approached at this angle. The X/Y position of the apex is influenced by
the definition of the loop shape. The wire clamp is closed at the apex. The
intermediate height above destination is then moved to. The descent
movement from here is defined by the touchdown parameters.

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 11 Bonding Process

100% 80% 40% 0%

Loop shape

Intermediate height
Loop
angle

destination
Height apex

distance
Reverse distance
Vertical
Intermediate

Start-
height

angle
Source
Destination
Figure 11-5: Reverse trajectory

Four methods are available for determining the Z position of the apex:

Method Loop Height S or D

- In the most common method „loop height“, the apex height results
from the calculated amount of wire necessary to reach the defined
loop height. All loops created in this way have nearly to the same
height regardless of the S-D distance. By selecting either S or D,
the loop height parameter can be defined relative to this bond
position.

Method Apex Height

- In this method, the height of the apex is defined. The editing box
Height correction is active for this method. An additional wire length
is taken into account at the apex height calculated from the
horizontal distance between S and D and this correction factor.

Method Wire Length

- The wire length is directly defined in this method. Loops are created
which all have identical wire length and which may show different
heights, if the distance between source and destination differs. The
height of the apex results from this defined wire length. This method
is often used in high frequency applications.

The value for Loop shape is a percentage which reflects the relation
between the displayed movement segments b and the source -
destination distance. This value can be programmed from -100% to
+200% in order to create different loop shapes. Two examples are
illustrated in the following figures:

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11 Bonding Process

S-D distance = a
a -b

Figure 11-6: Special case loop shape between -100% und 0%

For loop shape parameters smaller than 0%, the bondhead moves over
and beyond the destination bond position. Especially high loops can be
created in this way.

b
S-D distance = a

Figure 11-7: Special case loop shape between 100% and 200%

For loop shape parameters over 100%, the bondhead carries out a
kickback movement which causes a distinct loop peak.
The trajectory formed by the parameters is illustrated in the dialog under
the destination entry page and therefore all changes can be traced.
Furthermore, all necessary wire lengths for the defined loops are given.
In the wire length method, this value is identical with the value in the
editing box.

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 11 Bonding Process

Figure 11-8: Loop parameters - illustration of the trajectory

If inconclusive parameters are entered for the loop trajectory which could
lead to a height conflict or a loss of wire, a message is given in the box for
the trajectory illustration which suggests which value must be altered.

Figure 11-9: Loop formation - message - inconclusive parameters

- Intermediate height:
Fixed point in the loop trajectory over the source position and over
the destination position. The loop is created between these two
points.

- Intermediate radius:
Radius and height define an imaginary cylinder around the first
bond position. After welding the source bond, the wedge moves
away from the bond position under the start angle to the imaginary
cylinder and then vertically upwards. A radius helps to avoid heel
damage.

- Destination max.:
If this function is activated, the intermediate height destination is at
the highest possible position above the destination position of the
loop trajectory.

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- Start angle:
This is the take-off angle of the bondtool after the source bond
under which it moves to the radius.

- Reverse movement:
This is the horizontal reverse movement of the bondhead.

- Vertical movement:
This is the vertical movement after the reverse move.

- Loop angle:
This is the movement angle to the apex height. If this option is
deactivated, the apex is moved to directly.

- Loop height: < can only be edited in method Loop Height >
The loop height is defined with this setting. Before bonding a wire
the necessary wire length is calculated to ensure the set loop height
is reached.

- Apex height < can only be edited in method Apex Height >
This setting defines the highest point in the trajectory above the
source or destination bond.

- Height correction < can only be edited in method Apex Height >
The apex hight is increased by the distance S-D factor.

- Wire length: < can only be edited in this method >

With this setting, the absolute wire length is defined. All loops will
have the same wire length with different loop heights varying by the
distances between source and destination.

- Loop shape:
This parameter defines the X/Y position on which the apex point is
reached when forming a loop. The values mean:

0% The highest position of the loop trajectory is vertically

above the destination position.

50% This position is in the middle between source and

destination.

100% This position is vertically above the source position.

The area of this parameter ranges from -100% (position
behind the destination position) to +200%.

- Clamp remains open:

This option causes the wire clamp to stay open during the entire
looping movement. This can help to achieve especially low loop
shapes, but it involves a rik of loop deviation, because the wire
could be pushed back up the wedge tool when the head travels
downwards.

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 11 Bonding Process

11.2.4 Welding Parameters

In wire bonding, wires of different materials are welded on different types
of surfaces by ultrasonic welding. In this process, several factors
influence the results and the quality of the weld e.g. clamping, surface
composition, suitable tool etc. All of these factors can be optimized
individually to eliminate their influence.
The two most important parameters for this process remain; Ultrasonic
and Bondforce. They must be set with the right relation to each other.
It must be taken into account that the welding time is sufficient and the
deformation gradient is in accordance with the specifications.
The welding process can be split into 4 individual intervals which can be
edited. Two of them are shown in the parameter dialog with all editing
boxes.
The display can be changed by clicking the next interval in the editing box
Interval: x.

Figure 11-10: Welding parameters

- Process Control:

Constant Ultrasonic
This is the standard method where the set ultrasonic level is given
out constantly during bonding. The applied current alters
depending on the impendance during the welding process.
Constant Current
This method is only available if a DDS ultrasonic board or a PiQC
box are fitted. The set current level is given out during bonding.

- Stop after deformation

The welding process is stopped when the set deformation is
reached. Deformation is defined in % of wire diameter.

- Maximum welding time

This is displayed for information only. The maximum welding time is
the total time from the sum of interval times.

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11 Bonding Process

- No. of intervals 1/2/3/4

Each welding process can be set with up to four phases with
different settings for ultrasonic energy and bondforce.

- Ultrasonic:
Ultrasonic power is programmed as a percentage value of the
maximum available generator output.

- Bondforce:
The bondforce is programmed in cN.

- Duration:
The duration of each interval is defined. After this amount of time
the next interval is changed to. The welding process is aborted if
the deformation % is reached before the end of all intervals.

- Ramp:
If this function is activated, the ultrasonic power and bondforce
increase in the defined time linear until reaching the defined value
of this interval. If the time window of the ramp is smaller than the
interval duration, the ultrasonic power will stay constant for the
remaining duration.

11.2.5 Quality Control

The quality control of the bonds is carried out on the base of the profile
which is saved in the profile directory after reaching an optimum bond
curve. Production is stopped if the bond quality does not reach a
predefined threshold value if this option is activated.

- Deformation Profile:
The deformation progression of the current bond is compared to the
selected profile. Production is stopped if the actual value is not
within the threshold values.

- US Current Profile:
The transducer current of the actual bond is compared to the
predefined profile. Production is stopped if the actual value is not
within the threshold values.

- PiQC Quality specification (optional):

The PiQC quality calculation is activated in this dialog if the PiQC
option is installed.

Figure 11-11: Quality control

Profiles are selected from the directory and loaded. Reset to default
values by clicking the X button.

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 11 Bonding Process

11.2.6 Tear Off Parameters

Terminating the wire after second bond can take place with an active wire
clamp in case of the 45° and 60° bondhead or with an XY-movement in
case of the deep access bondhead. In case of wire clamp tear off the
parameters for the tailing are defined in the Setup mode. In
Programming mode an additional XY-movement ca be defindes to seat
the teil firmly under the bondfoot of the wedgetool.

Figure 11-12: Tear off parameters - clamp tear

Extra movement with clamp tear

The option to add an extra XY-movement after clamp tear is used (mostly
on 60° bondheads) to bend the wire underneath the bondfoot of the
wedge tool. This extra movement is defined by the following parameters
in the dialog, which are also explained in Figure 11-13: “Optional extra
movement with clamp tear”.

- Z distance: <depending on available space>

defines the distance, the bondhead lifts off the destination bond
after clamp tear off.

- Safety distance:
is the distance between wedge tool and bond surface after the extra
movement to bend the tail. Should be greater than the wire
diameter to avoid touchdown.

- XY-distance:
is the distance, the bondhead travels in XY-direction while travelling
down to bend the tail.

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11 Bonding Process

XY-distance

vertical
distance

safety distance

Destination
bondfoot

Figure 11-13: Optional extra movement with clamp tear

Tear off by XY-movement (deep access)

The tear off method by XY-movement is standard for deep access
bondheads. It is defined by the following parameters in the dialog
explained in Figure 11-14: “Tear off parameter XY-movement”:

Figure 11-14: Tear off parameter XY-movement

- Tail angle:
Amount of tail being pulled out under the tail angle before tear off.
This tail length does not equal exactly the tail length as measured
on the bonded wire, because the geometry of the wedge tool bond
foot and radius have to be taken into account.

- Safety distance:
is the distance between wedge tool and bond surface at tear off.
Should be greater than the wire diameter to avoid touchdown.

- Tear off distance:

is the amount of movement in XY-direction to tear off the wire or
ribbon with closed wire clamp. Depends on the elasticity of the wire
or ribbon.

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 11 Bonding Process

- Tear off angle:

is the angle of the tear off movement.

tear off
distance

h
ngt
le
il
Ta

tear off angle

Tail angle safety distance

Destination
bondfoot

Figure 11-15: Tear off by XY-movement

11.3 Parameter Limits

An administrator can define a process window by defining minimum and
maximum limits for program creation, setup and the bond process for all
programs.
These limits are dependant on several factors. The main factors are the
frequency of the ultrasonic and the wire diameter used. If the wire
diameter is changed, the parameter limit set must be loaded which fits to
the wire diameter and the ultrasonic frequency to be used.
When editing the parameters in programming mode, a warning appears
in the editing box in red if the limits are exceeded or are too low.

11.4 Process optimization

Setting the process order of the pattern recognition and production of a
multi-device substrate can positively influence machine productivity.
The correct selection of the Adjustment type can safe time by avoiding
extra movements. Adjustment per chip means that pattern recognition is
carried out for each chip and the chip is immediately bonded. If a pattern
is not found, the chip can be skipped. If the skip number is exceeded,
production is stopped. If a pattern recognition error occurs, it must be
immediately corrected before production is resumed. Adjustment per
board or substrate means that pattern recognition is initially carried out
on all chips on a board or all chips of all boards on a substrate. Errors can
be immediately corrected as the bonder changes from production mode

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11 Bonding Process

into adjustment mode. When all errors have been corrected, bonding can
be started.

To optimize production time, the Production path of an job can be set in

the BONDJET BJ820. It may be useful to recognize the chips in reverse
order for boards with a lot of chips. There are two settings for this. The
functions Board backwards or Chip backwards enable production to
begin immediately after pattern recognition has been finished without the
bondhead having to return to the first chip or board.

11.5 Wire types

The BONDJET BJ820 has been developed for use with wire of a
diameter in the range of 12,5 µm - 85 µm. Bond wires made of aluminum
with silicon doping (AlSi1%) or doped gold wires or ribbons can be used.
Please contact Hesse GmbH for advise, if you intend to use wires of
other materials.
The wire despooler is designed for the use of standard 2“ wire spools.
The amount of wire or ribbon on one spool depends on the wire diameter
and the winding type, where single winding and cross-winding is
possible.

Hint: Make sure you avoid any contamination such as finger

prints on the wire or wire spool. It is recommended to use
protective gloves, when changing the wire spool or
rethreading the wire.

11.6 Wedge tool types

The BONDJET BJ820 can use a variety of wedge tool with 1“ tool length.
Wedge tools of tungsten carbide (W) are recommended for aluminum
bonding, while tools of titanium carbide (Ti) are recommended for the use
with gold wire or ribbon. Wedge tools with a ceramic tp (CER) can be
used for all wire materials and usually achieve a longer tool life time. The
recommended standard tool type has a concave bond foot design for
better wire support. When bonding gold wire or ribbon, the use of „cross
groove“ (CG) wedge tools is recommended, because these tools create a
better form-fit on gold wire.

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 11 Bonding Process

Example for the wedge tool definition (SPT):

GW45 - Ti - 2015 - 1“ - CG
cross groove
tool length 1“
bond foot size
1.5mil = ca. 38µm
hole diameter
2.0mil = ca. 50µm
material
style (type) 45°

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11.7 Add-on for Software-Update 3.77

11.7.1 Referring to Chapter 11.2.3 “Loop Parameters”
The trajectory defined by the loop parameters is displayed below the
destination entry side in the wire parameter dialog. If a segment of the
trajectory is marked by moving the trackball pointer over it, the meaning
of the respective segment is labeled above the graph.

Figure 11-16: Loop Parameters new

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 12 Production

PRODUCTION
CHAPTER12

12.1 Introduction
The production process of the BONDJET BJ820 is carried out on the
basis of an existing program where all process steps haven been
programmed. The parameters have been optimized to ensure an error
free bonding result in accordance with the quality requirements.
Furthermore, it must be ensured that bond material is present and
securely clamped at the working position.
The process can be run in various modes for a production job:

• Fully automatic production runs a complete program. The material

flow is also fully automatic. The production process need only be
interrupted to change the wire spool, change the magazine or
replace worn consumables.

• Semi-automatic production differs in that the substrates are

manually placed and removed.

The production process takes place with the safety cover closed. It can
only be opened for manually changing the substrates.

The tasks of the operator are:

• Management of the production jobs

• Supervision of fully automatic production

• Rework of individual wires

• Rework of complete substrates

• Quality control

Production mode is the lowest mode in the user hierarchy where the user
only has default access rights necessary for production jobs. Further
access right can only be assigned by the administrator.
After confirming the login dialog, the production dialog is opened.

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• Click the symbol to change to production from any other mode.

The standard interface in production mode includes a selection of
gadgets as default settings.

Figure 12-1: Production monitor (default)

The interface design for production mode can be configured by the

administrator in the menu Settings/Production. Within an area of 1024
X 550 pixels, a selection of gadgets which are freely programmable in
their size, position and title can be selected to create the interface design.
Every interface design can be saved as a file and can be exported as a
backup to other machines.

12.2 Production Process

Hint: To achieve perfect production results, take note of the
following instructions:
Always use the correct wire.
Always wear protective gloves to avoid contact while
changing the spool or threading the wire.
Do not touch the lower surface of the wedge to prevent
contamination or sweat on the surface.
Take care that the parts to be bonded are free from dust,
chemical residue or other contamination.

After start up of the machine or when changing from a different operation

mode, the machine switches to automatic mode.

Load Program
The last used program is loaded. Changing to another program is carried
out by user intervention.

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 12 Production

• To load another program, open the menu Job/Load program... and

select a program from the directory by clicking it with the pointer.
• Confirm with OK. The selection is displayed in the footnote of the
user interface.

Hint: If the bonder is controlled over a PBS200 system and the

option Master Programming is activated in Administrator
mode/BDE Settings/PBS200 settings, only the programs
from the database of the server can be loaded. Programs
saved locally to the bonder can not be loaded.

The bonder now waits for component input, manually or automatically. It

processes these and switches the clamp so that the components can be
removed or an index step can take place.

Start
There are 3 possibilities for starting production:
1. Confirm the Automatic command button
2.The ENTER key on the keyboard
3.The OK button on the keypad

After confirming the automatic button, Auto is displayed with a gray

background in the status bar. The bonder is in „Ready“ mode.
The display Auto changes to a green background after a component is
loaded either manually or by an index step and the Automatic button has
been clicked again.
The prompt Specify position appears.

Figure 12-2: Specify position

• Enter a board number.

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12 Production

• Select the position of board, chip and wire from where production
should begin, either directly by entering the number in the editing
box or by increasing the number with clicking the arrow keys.
• This position is moved to the camera image with the command
Move to.
• Confirm with OK to carry out reference system adjustment for this
wire.
If a touchdown height is already defined, the bonder automatically starts
working through the program after successful adjustment until it is
stopped by manual intervention, because of an error or for material input.

If no touchdown height has been defined yet or if the option Reset height
was activated the following message appears:

Figure 12-3: Reset height

• Confirm with Yes to automatically start height measurement and

production start.
• Confirm with No to manually carry out height measurement.
• Enter Programming mode and carry out the height measurement
with the command Height. Afterwards, return to Production mode
and start positioning if you carried out the height measurement at a
different position. Production starts without any further requests for
height measurement.
The option Reset Pattern Recognition can only be activated if adjustment
of the current reference system has already been carried out. If
adjustment has not been carried out, it can not be reset.

Halt
Production can be stopped by manual intervention. Click the Automatic
button in the user interface, the STOP key on the keypad or the ESC key
on the keyboard.
Production stops after completing the current wire or series of wires, in
automatic material input, the complete substrate is processed.
If production should commence, the prompt for positioning appears.
Production is automatically stopped if the allowed Skip number is
exceeded or is an error occurs. Both are displayed by an error message.
Manual intervention is necessary to commence production.

Stop
With the Red STOP key, production is stopped immediately at the
current position. Production can continue after trouble shooting.

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 12 Production

End
Production is automatically ended after the terminating the last
programmed wire.

Control
The production process can be controlled on the software dialog if the
selection of respective gadgets allows it. For example, the use of tools
can be checked using counters. Pie-charts can display workload and
statistical data can be recorded and displayed. Graphs can give
information regarding deformation or ultrasonic current.
Information which is always displayed includes the wire diameter,
frequency, bondhead option frontcut or backcut and the name of the
loaded program.

Automatic Write Protection

A running program which has been used for a certain time in production
can be given an automatic write protection. This is enabled out in
Administration mode under Program Variants. This ensures that no
changes are made to the program. Changes can only be made if the
program is saved under another name which has no write protection.

12.3 Management of Jobs

Production can be split into separate jobs.

Loading a Job
A job is set up by giving it a job name or loading a job from the directory.

• In the Job menu select Load job.

• Click to select from the directory.

• After selecting, press the Load button.

Figure 12-4: Load Job

If a checklist was set up in Administration mode which should appear at

job start, a login dialog will appear when creating a new job. Production
can then be started.

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Figure 12-5: Create job - example

Editing a Job
• In the dialog box Edit jobs, you can enter a description for the job.
Either use the keyboard attached to the operator panel or open a
keyboard dialog by clicking the symbol. Here you can enter the Max.
number of substrates.
• You can enter the dialog Edit Job by the menu Job/Edit.

Figure 12-6: Edit job

Deleting a Job
• A selected job can be deleted from the directory with the command
Delete. This dialog is only available in the Load Job dialog and is
not accessible over the menu Job as for Edit and Info.

Closing a Job
• In the menu Job/Close there is an option to close a job.

Resetting a Job
• This option is opened under Menu/Reset and can reset all counters
for this job to 0.

Job Information
• By clicking the command button Info in the Load Job directory or in
the menu Job/Information, an information window is opened where
data and bond errors can be checked.
• The first row contains the description of the Job, the second
contains the name of the Bond porgram. Further enteries are the
number of the processed Boards, the number of bonded Chips and
the number of errors. These Errors are displayed in the error list.
• With the option Last Board, only the errors of the last board are
displayed, in order to have a better overview of the currently bonded

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 12 Production

wires. If this option is not active, all errors from the complete job are
displayed.

Figure 12-7: Job data

12.4 Material Change

12.4.1 Automatic Change
If the BONDJET BJ820 is equipped with an indexer, material change
takes place fully automatic.The bondhead moves to the park position, an
indexing step is performed and the clamping is activated. Finally, pattern
recognition automatically adjusts the parts for bonding. When the
program for the substrate is finished, the clamp opens and the material
moves to the output station.
This procedure can be stopped immediately with the emergency stop on
the indexer or the HALT key on the operating panel.

12.4.2 Manual Change

If manual change is selected, a message requests the material change.

Figure 12-8: Material change

The bondhead moves to the park position and the clamp is opened. The
safety cover lock is released and material can be placed on the
workholder. Finally, the bondhead moves back to the starting position
and the clamp is closed. In the status bar the status of the material
clamping is displayed with a symbol.

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Adjustment of the parts takes place automatically if pattern recognition

marks have been defined at programming. If no patterns have been
taught and only manual points defined, adjustment must be carried out by
giving these manual points.

12.5 General Functions

Several general functions which are available in the menus Action,
Settings or Extras in Production mode as well as other modes have
already been described in chapter 7.
Action menu offers the following functions: Offbond, threading,
referencing, move to start position, move to park position, index step and
clamping.
The factors can be edited in the Settings menu: Speed, ultrasonic and
cut offset are affected.
The functions for the view of bond graphs or bond plans are available in
the Extras menu.
In Operation mode the registers can be altered which are arranged on
the user interface in production mode: Production-readjust-rebond. The
current register is distinguished with a marking.
The general functions such as setup printer, change password, logout or
switch off bonder are available in the menu Job. The option Bond
parameters... opens the current parameters of wires which are being
processed. These can not be edited here, but are only for information.

12.6 Error Management

12.6.1 Bonding Error
If an error occurs during automatic production, the procedure being
carried out on the current bond wire is interrupted. After confirming the
error message the bonder switches automatically to the operation mode
Bond correction. The current bond appears in the center of the camera
window.
The following dialog is opened for bond correction:

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 12 Production

Figure 12-9: Bond Correction Mode

• To correct a bond wire, move the crosshair in the camera window.

• Alter the position of the bond using the trackball pointer and confirm
this new position with the right trackball button.

• All Parameters, the ultrasonic Power and the Force factor can be
temporarily changed for the bond to be corrected.

• With the option Skip, chips or boards can be skipped.

Hint: Any correction of a bond position or parameter alteration

carried out in this mode does not affect the program.

• To correct other positions, you can change between source and

destination bond with the buttons Src and Dst or use the
appropriate arrow keys.

• To correct a bond other than the current one, use the buttons Prev.
or Next or the numeric keys.

• Activate the Step by step function if necessary.

• After correction start bonding with the command Bonding or press

the ENTER key.

• To exit the correction mode press the Halt button or the ESC key.

• The current position of the production within the program is shown in

the information box.

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Hint: If a „previous“ wire was corrected, the current wire must

be located with the Next button before continuing
production.

12.6.2 Pattern Recognition (PR) Errors

If an error occurs during adjustment in automatic production, after the
error message is confirmed the machine switches immediately into the
operation mode Readjust pattern.

Figure 12-10: Readjust pattern mode

If the current chip or the complete substrate is defect, this can be skipped
and excluded from production.

• To bypass a chip or board click the button Skip Chip or Skip Board,
or press the respective numeric keys „3“ or „4“.

• If the reference system is to be skipped, click the button Skip

Refsys or press the numeric key „5“ on the keypad.

• If a complete board is defective, it can be skipped by executing an

Indexstep 0.

• To manually adjust a chip, target the manual positions with the

moveable crosshair and confirm with the right trackball button. After
a successful correction, production is automatically resumed at the
termination position.

• The command Production or the ENTER key requests the start

position for resuming production.

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• The command Abort opens a dialog box where the reason for
stopping must be entered. This information is documented in the
logbook.

12.7 Rework
Rework of individual wires, chips or substrates is possible in Readjust
and Rebond modes.

12.7.1 Readjust
Readjust is usually used if a chip has not been bonded because a chip or
board was skipped.

• Click the Readjust register to change to this mode.

• A dialog box opens, in which the bonding position to be rebonded

has to be entered.

Figure 12-11: Readjust

• Automatic recognition takes place with the function Readjust. The

bondhead moves automatically to the previously defined position.

• Use the commands Src and Dst or the arrow keys to move between
the source and destination position.

• Use the commands Prev. or Next or the according numeric keys to

move to the appropriate position.

• Click the command Bonding to start bonding.

• If further bonds need to be corrected re-click the button Readjust.

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• With the function Index step the substrate is unloaded, in case of

manual clamping a new substrate is requested.

• The command Abort returns you to the production mode main

menu.

The bond position of automatic production is not influenced. Production

can continue from the position where it was interrupted.

12.7.2 Rebond
In Rebond mode, single wires on a partially completed board can be
corrected. The parameters, and ultrasonic power can be altered for the
bond to be corrected.

• To activate the rebond function, click the Rebond register or press

the numeric key „2“ on the keypad.

• A dialog box opens, in which the bonding position to be rebonded

has to be entered.

• After the automatic adjustment is completed, the bonder moves the

crosshair to above the source point of the given connection.

• Use the commands Src and Dst or the arrow keys to move between
the source and destination position.

• Use the commands Prev. or Next or the numeric keys to move to

the appropriate position.

• After correction start bonding with the command Bonding.

• If further bonds need to be corrected re-click the button Rebond.

• With the function Index step the substrate is unloaded, in case of

manual clamping a new substrate is requested.

• The command Abort returns you to the production mode main

menu.

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Figure 12-12: Rebond

In Rebond mode, only the current bond can be corrected. After changing
to another bond, the original values are restored.
The bond position in automatic production is not affected. Production
continues from the position where it was interrupted.

For bonders where the material input is carried out by an external PLC
via Profibus, any reworking is also controlled by the PLC. The bonder
must be set to Automatic in the operation mode Production. There are
two types of rework, the PLC decides which mode is used.
Fully Automatic Rework :
• The reworked part is bonded just like a normal part.
Semi Automatic Rework :
• The bonder switches to the Rebond mode so that the bond position
can be corrected before bonding a wire.

12.8 Data Documentation

The production process data is documented in the logbook, set up by the
administrator. The logbook settings contain the stopping reasons that are
shown during production and need to be documented.

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Figure 12-13: Logbook example

If automatic production is stopped, an error message is given which must

be confirmed.

Figure 12-14: Reason for stopping - example

• This dialog must be completed. Termination without an entry is not

possible.

• Select the appropriate Reason for stopping. An information bar is

available for further entries which are also documented in the
logbook.

• Confirm with OK.

• You automatically return to production mode.
After clearing an error, automatic production can resume at the
termination position.
In menu Settings under submenu Reason for stopping, a dialog is
opened with a list of user specific reasons.

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12.9 Add-on for Software-Update 3.77

12.9.1 New Function „Positioning Errors“
The appearance of a constant offset of all bond positions after bonding
may indicate that the calibration of the camera offset relative to the
rotation center of the P-axis is no longer valid. This may be caused by
temperature drift since the last wedge calibration. The function
Recalibrate from the Action menu can be used for a quick correction of
the calibration by means of the bonded wires.
Already bonded bonds are targeted individually in this function and the
actual position is marked on the camera image with the right trackball
button. This can be done on several bonds or several times on the same
bond, in which case only the last correction is considered. The camera
offset will be corrected by the mean value of the taught bond position
offsets.

Figure 12-15: Recalibrate

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ADMINISTRATION
CHAPTER13

13.1 Instructions
Optimum and safe use of the BONDJET BJ820 is based on extensive
knowledge of the production process and the use of the software.
Access rights can be allocated according to the user’s qualifications. The
allocation of various rights is possible in the main administration menu.
An administrator trained by Hesse GmbH should be responsible for
allocating the rights within a company. The administrator’s tasks include
the creation of a user list, allocation of passwords, removal of users from
the list and saving user data.
With access to the settings dialogs, the administrator is able to limit the
editable parameters, change axes parameters or activate/deactivate
program variants.
• To change into administration mode, click the Administration icon
on the navigation bar . You need to have access rights for
this mode.

13.2 User Administration

The administrator can allocate new user access rights on one or more
levels, can change access or remove a user from the list. Click the
symbol to enter Administration mode.

13.2.1 Creating a New User

In administration mode select New in the menu User. The dialog box
Create new user is opened.
• Enter a Login name for the new user.
• Click the symbol next to the editing box if you want to use the
software keyboard.
• Enter a Name for the new user. This name will appear in the upper
right corner of the screen when this user is logged in.

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• Click selected checkboxes to allocate the access rights.

• The access rights in the Programming level are differentiated. The
access to parameters, reference systems and bond positions can be
set independently.
• Confirm with OK to add the user data to the list.
• If you end the entry with Cancel, the list remains unchanged.

Figure 13-1: Create new user

13.2.2 User List

Edit User List
In the menu User/Edit, access rights can be altered or new user data
entered. The dialog Edit User displays the complete user list.
• A new user can be added to the list with the command New.
• The command Delete removes the selected user from the list.
• Click Info to view the data of the selected user.
• With the Backup function, user data can be saved directly to disk.
Place a formatted disk in the disk drive and confirm with OK.

Figure 13-2: Edit user

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Edit User Data

• In this dialog you can change the data of the selected user.

Figure 13-3: Edit user data

• If a user has forgotten his or her password, the old password can be
deleted in this dialog box by clicking the command button Delete. A
new password must be defined at the next login.
• The command Lock prevents a user from using his or her login until
this lock is removed.

13.2.3 Access Rights

The user access can be limited or enlarged in different areas with
individually adjusted access rights.
• Select Access Rights in the Settings menu.

Figure 13-4: Access rights

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• Select the area where you wish to edit the access rights with the +
key.
• The abbreviations shown above stand for the different user levels
and the sub groups in the programming level (see notes at bottom of
dialog).

Figure 13-5: Edit access rights

• The default values appear when this dialog is opened.

• To increase or reduce the access rights for certain areas click the
respective checkboxes.

13.3 Settings
The administrator can access different functions in the Settings menu
which generally influence program and process windows. With the option
Limits per wire diameter, a loaded parameter set is saved together with
the wire diameter so that the parameter set can automatically be loaded
when the wire diameter is changed.

13.3.1 Parameter Limits

By entering minimum and maximum limits, a process window for program
generation, setup and the global machine setting can be defined.
• Click the function Parameter Limits in the menu Settings.
• In the dialog, you can activate if a parameter set should be
automatically loaded for the set wire diameter.
• From the directory, load a file you wish to edit.
• Open a parameter group by clicking +.

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Figure 13-6: Parameter limits

The measurement results of the calibration limit values can be defined in

the parameter group Calibration parameters.

13.3.2 Program Variants

In the Settings menu the function Program variants... allows numerous
options and functions to be activated, which show effect across all
programs (machine global). The available options are listed in a
structured dialog:

Figure 13-7: Program variants - Overview

The available options are explained individually in the following:

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Production:

Figure 13-8: Program variants - Production

1 Mode single step:

The „step-by-step“ mode is always activated for production.

2 Calibration check:
Checks the calibration data against parameter limits when changing to
production mode.
Never: Does not check calibration data.
Message: Displays a warning message if calibration is out of parameter
limits.
Error: Does not allow to load a program if calibration is out of parameter
limits.

3 Program check:
Checks the bonding program data against parameter limits when
changing to production mode.
Never: Does not check calibration data.
Message: Displays a warning message if calibration is out of parameter
limits.
Error: Does not allow to load a program if calibration is out of parameter
limits.

4 Stop on quality error after wire

If quality control is carried out by comparison with profiles, the production
process can be stopped in case of errors by activating this option. The
current wire is bonded to the end.

5 Stop immediately on quality error:

In case of a quality error on the source bond, the process is stopped
immediately with this option. In this case the destination bond is not
bonded.
6 On retrofit measure program heights:

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This option will force a measurement of the reference system heights to

occur after each product change (program change).

7 On retrofit measure offbond heights:

This option will force a measurement of the offbond height to occur after
each product change (program change).

8 Auto write protection after:

A write protection for the running program is activated. After a delay,
which can be edited, the protect is automatically activated in production
mode. A program which has already been bonded with can not be altered
afterwards. Editing the program is only possible after is has been saved
under another name without write protection.

Bond Parameters:

Figure 13-9: Program variants - Bond parameters

1 Version loop length:

The length of the wire for each loop is calculated based on one of the
following algorithms.
1 : Default for fine wire bonder, can result in high loops in some cases
2 : Default algorithm
3 : For especially low loops, resulting loop height is always less or equal
than programmed loop height.

2 Force switching mode:

This section deals with the method of switching between touchdown force
and the force of the first welding interval.
If Auto is selected, the bonder will switch with a SinQ-profile.
If No is selected, the touchdown force will be equal to the force of the first
welding interval.
The Ramp option will result in a „hard“ switching method.
The SinQ option will result in a „soft“ switching method.

3 Allow large intermediate heights:

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This option will avoid the error message „Destination intermediate height
can not be reached“.

4 Clamp at apex always closed:

If this option is activated, the loop parameter „Clamp remains open“ can
no longer be set.

5 Tear off bondforce:

With this force the destination will be hold during tear off movement off
wire clamp.

Heights:

Figure 13-10: Program variants - Heights

1 Adaptive touchdown height adjustment:

With this option all target heights within a reference system are adjusted
to the actual heights of the previous bond. This function can only be used
properly if the bond positions within a reference system are next to each
other. This way, height differences on a slanted chip can be compensated
without increasing the touchdown height.
2 Adaptive loop height adjustment:
With this option, the loop trjectory can be adjusted using the heights of
the previous bond. This function can, for example, be used if the loop
heights should follow a slanted chip. Take note: loop heights of the first
two wires within a references system do not have the exact height of the
following wires, as the loop height adjustment only shows its full effect
after the third wire.
3 Adjust offset at destination:
The adaptive adjustment routine applies the measured offset from the
source bond automatically to the destination bond before the destination
height has been determined by touchdown.

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Overtravel:

Figure 13-11: Program variants - overtravel 1

1 Overtravel bonding:
If this option is activated, the ultrasonic energy is already applied while
the bonder applies the overtravel.

2 Overtravel delay:
An additional settling time before bonding can be defined with this entry.

3 Back move old method:

The old method of calculating the back move considers the wire diameter
and the factor.

4 Back move factor:

The back move of the Z axis after welding is calculated from the wire
diameter times this factor.

5 Back move new method:

The new method of calculating the back move considers the sensor and
the back move distance.

6 Back move distance:

This entry is an additional distance for the Z axis to move up after
clearing the touchdown signal.

Figure 13-12: Program variants - Overtravel 2

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7 Stop after back move:

If this option is activated, the movement between the (overtravel) back
move and the intermediate height is omitted.

8 Back move source slow:

The (overtravel) back move of the Z axis is carried out with reduced
speed on the source bond.

9 Back move dest. slow:

The (overtravel) back move of the Z axis is carried out with reduced
speed on the destination bond.

Adjustment:

Figure 13-13: Program variants - Adjustment

1 Show all reference systems:

If this option is activated, the graphical overlay images of all reference
systems are displayed. Otherwise only the current reference system is
displayed on the video.

2 Update markings immediately:

With this option the graphical overlay images are already updated, while
the adjustment is in progress.

3 Ignore tolerance after manual adjustment:

With this option the manual alignment points during adjustment are
accepted even if the tolerance value in the PR parameter is not met.

4 Teaching alternatives at diff. positions:

If this option is activated the axes can be moved when teaching an
alternative pattern. This way, an alternative pattern can be taught at a
different position to the original pattern.

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Positioning:

Figure 13-14: Program variants - positioning

1 Accuracy:
This entry defines the positioning accuracy before welding.

2 Tear off accuracy:

This entry defines the movement accuracy before the tear off process
step.

3 Smooth radius:
This entry defines the radius for all movements, which are „smoothed off“.

Miscellaneous:

Figure 13-15: Program variants - Miscellaneous

1 Auto offbond:
If this option is activated, an offbond is automatically enforced after every
height measurement, bond quality error or bondhead setup.

2 Increment offbond pos. automatically

After offbonding the position will not be counted up. The camera stands
still on last bond. The ENTER key must be hit to move to the next
position.

3 External trigger for inline test:(not relevant

If this option is activated, the bonder will wait for an external signal before
starting the inline test process.

4 Moving with open clamping allowed:

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Some movements are normally prohibited if the substrate clamping

(workholder) is not ready. This option allows a work-around for these
cases.

5 Smart Login:
Off: Disables the „Smart Login“ feature.
Prod.: The feature is limited to production mode.
Ever: The feature is working in every operation mode.

6 Wedge counter reset:

If this option is activated, the wedge counter can only be reset to zero. If
the option is not activated, the wedge counter can also be edited.

7 Height measuring before wedge calibration:

If this option is activated, a height measurement is automatically carried
out before every wedge calibration or P axis calibration in setup mode.

13.3.3 Bond Quality

In the menu Settings/Bond Quality, global parameters can be set for the
quality assessment, chart display or appraisal. The list dialog is
separated in the editor for bond charts and thresholds.

Figure 13-16: Bond quality settings

Bond Charts
In the general settings for bond charts the conditions are defined for
quality measurements and the values for chart resolution and value
range can be changed.
A warning is given after changing the resolution values and the software
must be rebooted. Only after rebooting the altered values are applied to
the bond charts.
From the number of measured values and the measurement duration the
system calculates how many charts can be saved in the user defined
chart memory.

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Figure 13-17: Bond quality - bond chart parameters

Threshold
These values define the limits at which the quality of the wire deformation
is no longer accepted and triggers a respective error message.

Figure 13-18: Bond quality - threshold values

13.3.4 Checklists
In menu Settings, the menu item Checklists... opens an editing box
where the administrator can type in instructions for the operators to guide
them through their daily routines.
A checklist is then active when the content of the editor is not empty.
Each row of the checklist contains either a static display or a checkbox if
the row is prefixed by a *.
• Select the relevant operation by clicking the according register and
type in the company labor instruction for this operation.

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Figure 13-19: Checklists

The checklist Automatic start is displayed if the operator activates

automatic mode.
The checklist Start a job is displayed when a new job is started.
The checklist Shift turnover is displayed after shift change. Take note
that production is not halted at the exact time of shift turnover, the current
substrate is first completed.
The checklist Wedge control is displayed after a wedge was exchanged
and registered by resetting the counter or changing the wedge number.
The checklist Cutter change is displayed after exchanging the cutter and
resetting the cutter counter or changing the cutter number. (Not available
at Bonder BJ820)

Figure 13-20: Checkboxes in checklist

• The checklist must be worked through completely and the operator

must confirm with a valid user login if all checkboxes have been
clicked. This confirmation is saved in the logbook.
• Login name and checklist edits are noted in the logbook. Using
these checklists can help minimize the risk of operator errors.

13.3.5 Bond Matrix

Under the Settings menu in Administrator mode, a Matrix can be
created for bond positions which are used for every substrate in
production.

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• Activate the bond matrix by clicking the radio button. This will
enable the other editing boxes.
• If the option Request per substrate is activated, the position which
should be bonded within the matrix is requested for every bond of a
substrate in production.
• Define the geometry of the matrix for source and destination by
entering the number for rows and columns as well as the offsets for
X and Y.

Figure 13-21: Bond matrix

13.4 SPC Properties

13.4.1 Settings
Depending on the installed options of the machine various
communication methods can be activated and configured under menu
item Settings\SPC Properties...
• Activate the option by clicking the respective radio button.

Figure 13-22: SPC properties

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Profibus
With the command Setup, the parameters for the Profibus
communication method are displayed in a list, sorted by inputs and
outputs. Select the appropriate radio button.

Figure 13-23: Profibus properties

PBS 200
With the process / production data acquiring system (PBS) the most
important production data of the BONDJET BJ820 can be collected and
evaluated in a database on the host computer.
The PBS enables online monitoring of the bonder from a distant location.
The program used, the product being processed and the user currently
logged in are observed. Directly after bonding a wire, the progression of
deformation and the last bond time can be viewed. The bonder can be
monitored on the screen.
The data collected in the database can be analyzed over numerous
evaluations and compared, if several bonders are attached together. This
gives an overview of the substrates produced. The PBS also monitors the
production times which are collected according to shifts.
The setup of the PBS 200 is described in a separate manual.
The following settings must be carried out in the bonder software after
activating the option PBS 200:

Figure 13-24: PBS 200 Settings

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• From the list select the server by which communication should be

carried out and confirm with Apply.
• Change between online or offline mode to connect or disconnect. A
light button signalizes the status in the setting dialog. The status is
displayed by a blue signal icon in the title line of the user interface.
• If the system should only authorize the user list over the server,
activate the function User administration via server. The local
user list can then not be accessed or edited.
• With the function Master Programming, only programs from the
database of the server can be loaded. Programs saved locally can
not be loaded or edited.

Logbook
In the logbook, the times are recorded which the machine has spent in
each of the different operation modes. If the logbook function is
deactivated, an analog clock is displayed on the monitor in administration
mode.
• To activate the logbook click the according check box and open the
Setup dialog.
• New login must be carried out after activating or deactivating the
logbook mode to ensure changes are applied.
• The logbooks are listed by month and year.
• Set the logbook properties in the following dialog:

Figure 13-25: Logbook properties

• From this dialog you can View a monthly logbook by clicking the
appropriate button.
• With the function Export you can save a chosen logbook to disk in
disk drive 2.
• One function of the logbook is to track all downtime of the machine
and allow a statistical evaluation of the amount of time the machine
spends in each mode. For this purpose the machine automatically
records 22 conditions which affect machine utilization:

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1 Switch on
2 Switch off
3 Programming
4 Setup
5 Calibration
6 Administration
7 Production
8 Start
9 Stop - allows identification of customer specific reason!
10 Pattern recognition (PR) error
11 Wire change
12 Material change
13 Bond correction
14 Repair
15 Skip
16 Check interval production expired
17 Check interval shift expired
18 Check interval inspection counter expired
19 Check interval wedge expired
20 (Check interval cutter expired)
21 Check interval wire guide expired
22 Bond counter

In addition to the 22 predefined events, customer specific downtime

reasons may be individually defined in the setup dialog of the PLC
setting.
• Click command button Downtime reasons to enter customer
specific options into the following dialog:

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Figure 13-26: Customer specific downtime reasons

Every time an operator stops the production by pressing the HALT or

STOP key or by clicking the stop command button, the machine will
prompt the operator to select a reason for stopping from this list. If this list
is empty, the dialog does not appear and the machine only records the 21
predefined conditions in the logbook without further information.

Hint: The logbook function uses extensive system memory and

should not be activated unless absolutely necessary.

RS232
All conditions for data communication over serial interfaces are specified
in the dialog RS232 Settings...
• Open the dialog by clicking the function.
• Select the interface using the arrow key or by entering the number. 6
interfaces can be activated.
• Define the data communication conditions for the activated
interface. Click the respective radio buttons.

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Figure 13-27: RS232 settings

13.4.2 Shifts
In the menu SPC Settings a dialog box is opened where the shift
turnover can be defined and where the set performance per shift can be
entered for the statistical evaluation.
With the start of the first shift and the shift duration, the shift turnover is
automatically calculated.
The shift performance is calculated with the value for the set performace
per shift.

Figure 13-28: Shifts

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13.4.3 Date and Time

The real-time clock shows the current local time. If necessary, this clock
can be set in menu Settings with menu item Date and time...

Figure 13-29: Date and Time

If the bonder is connected to a PBS 200 server, the date and time are
synchronized automatically.

13.4.4 Lamp Tower Editor

The status of the Lamp Tower can be set to customer specifications
under the menu Settings.

Figure 13-30: Lamp tower editor

Activate the audio alarm for the respective operation mode by clicking the
single checkbox.
The lamp status Material deficit is connected to the program settings in
administrator mode. Color and function status are activated if the warning
by a defined remaining amount of boards, chips or wires has been edited.

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For permanently activating the audio alarm, the icon constantly keeps the
color.
To activate the Interval function, the button must be clicked until the
icon flashes.
The Interval length also applies for the audio alarm.

13.4.5 Language
A user registered as an administrator can alter the language settings with
the function Language. The languages German and English are
available as a standard selection. Further languages can be inserted on
demand.
• Select the function Language in the Settings menu.

Figure 13-31: Select Language

The highlighted language is the currently loaded one.

• If this should be changed, select a different language (currently only
English) by clicking it and confirming with Load.
Log off occurs automatically so that the new language selection can be
applied.
• Login again with your login name and password.
In the respective language setting, all the terms used in the software
interface can be altered.
• Select the function Edit to open the language editor.

Figure 13-32: Language Editor

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• Select the entry which you want to alter.

• Use the Search function by entering a term and confirming with
ENTER.
• With the arrow keys next to the list you can scroll the listing upwards
and downwards.
• Click the arrow key next to the selection. The term is then shown in
the editing box. Rewrite the entry and confirm with OK.
• The language must be reloaded. Log off occurs automatically so
that the altered terms can be applied.
• Login with your login name and password.

13.4.6 Axes Parameters

• Click the function Axes Parameters under the Settings menu.
• In this dialog, the maximum movement speed, the acceleration and
the negative acceleration of the 4 axes can be edited. For moving
the axes with the trackball, the speed can be reduced for each axis
in the editing box V vmode.
• By entering a factor in the editing box Override User, you can
reduce the speed in setup mode. This speed override is used when
the A-mode key-switch is set to 1 (unsafe operation mode).
• The speed during height measurement or sensor calibration can be
set in the editing box V touchdown.

Figure 13-33: Axes Parameters

13.5 Data Backup

In the menu Extras, several functions are available to the administrator
for Data Backup. The file transfer status is shown in a progress bar when
saving data to disk.

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With the function Create bondhead disk... all files which are relevant for
the bondhead are saved to disk. After bondhead exchange, all files of the
new bondhead can be loaded from the disk.
Using the Configuration disk, data from a machine can be exported to
another enabling the same basic conditions for all machines in a
production line.
When creating a disk with Complete configuration, all machine data is
saved. this disk may NOT to loaded to another machine.

13.5.1 Restore/ Backup...

With the function Restore, machine and user data stored to disk with the
backup function can be restored. Programs which were saved directly to
disk can also be imported.

13.5.2 Program Conversion

The function BPG Conversion is available under the menu Action.
Programs created in older software versions can be converted into new
file format.

Figure 13-34: BPG Conversion

• Click the button Start to start the conversion. If the function Delete
after conversion is activated, old program files are deleted after
successful conversion.
Successful conversions are shown in the dialog.

13.5.3 Reset Program List

In the Program menu, the last 4 edited programs are displayed in a list
and at system start the last edited program is loaded. With the option
Reset program list, this list is deleted and a new program can be
loaded. This option is helpful if a damaged program can not be loaded.
By resetting to the initial conditions, a new program can be loaded.

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 13 Administration

13.6 Production Mode - Configuration Screen

The screen in production mode can be configured in this software
version. A user defined selection can be made from 33 free placeable,
dynamic display elements. These are then arranged on the screen in
production mode. A complete screen design can be saved in an internal
directory. With the backup option, the file is saved to disk and can be
reproduced on another machine. All settings for this function are carried
out in administrator mode under the Production... menu. In the setup
dialog, all available gadgets are listed in the left column, the gadgets
used for the current screen configuration are listed in the right column

Setup
• Select a display element by clicking it with the right trackball button.
Click the arrow key to move this element from one column to the
other, from „available“ to „installed“ or vice versa. An installed
gadget is arranged on the user interface in a default position.
• The list view of the gadgets can be changed using the scroll bars.
• The trackball, the upwards/downwards arrow symbols or the arrow
keys on the keyboard can be used for selecting installed gadgets.
• In the row above the function command buttons, the currently
loaded user interface is displayed with the file name.

Figure 13-35: Production screen setup dialog

• The design of the selected gadgets can be arranged with the Edit
function.

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Figure 13-36: Edit gadgets

• Enter a Text which should appear in the display. If nothing is

entered here, the Type description is applied.
• Alignment of the text can be defined by clicking the radio button
Left, Centered or Right.
• The Position of this gadget can be defined by entered the distance
from the left and upper screen edge. The dimension unit for this
value is pixel.
• The value for the Size is also in pixel and is edited in width and
height.
• For the description of the screen in production mode the Default
Text radio button can be selected. A different Text can be entered
manually.
• Confirm with OK or quit with the option Cancel.

Preview
• Click the function Preview in the setup dialog to check the design
and arrangement.
• Exit the preview with the command Back.

Figure 13-37: Production screen - preview (example)

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 13 Administration

• After completing your screen design, go to operation mode

Production. The result of the example displayed above is shown as
follows:

Figure 13-38: Production screen - example result

Backup
• Create a backup disk of the production screen with the Backup
function.
• When prompted, place a disk in the disk drive and confirm with OK.
• The following message appears after successful backup:

Figure 13-39: Production screen backup prompt

• To install a screen design on another machine, place the disk in the

disk drive and save the file.
• Importing this file to another machine is carried out over the restore-
backup function in the settings menu.

Load
• To load an existing screen design, click the command Load and
select a file from the directory.
• Confirm with OK.

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13 Administration

Figure 13-40: Production screen - load file

Copy
• An existing file can be copied by clicking the command button Copy.
Select the file from the list and change the name by which the copy
should be saved. Confirm with OK.

Figure 13-41: Production screen - copy file

Save
• If changes were made to the loaded file, the command button Save
is active. Click here to save changes to the file.

Delete
• To Delete a file with the ending .pro click the respective command
button and confirm the warning with OK. The list of installed gadgets
is also deleted.

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13.7 Add-on of Software-Update 3.77

13.7.1 Referring to Chapter 13.4 “SPC Properties”
Logbook
The output of the logbook events can be filtered. Only events which are
selected in the filter will be used. An empty filter means that all events
should be recorded.
Valid filter entries are 1-3 or 10,20 or combinations such as 2-5,10,12-14.

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 14 Pattern Recognition

PATTERN RECOGNITION
CHAPTER14

14.1 Introduction
In the BONDJET BJ820, a pattern recognition system finds the exact
location of bondpad and lead positions. Production tolerances can be
taken into account without influencing the quality.
A common function of automatic pattern recognition is the automated
measurement of objects (position and rotation). High precision placement
of components is essential in semiconductor production. To guarantee
precision, an image of the component is taken and automatically
measured. For example, the position of a corner of a chip is measured in
an image. With this information, the chip can be precisely positioned.
Generally, the geometric patterns are searched (corner, circle, cross...) or
a pattern which is taught from a „golden sample“. For example on a die
bonder, a chip is moved in front of the camera and a pattern is taught on
the chip. For all further chips, this pattern is automatically searched with
the pattern recognition and the position measured in the image.
The following chapter explains the available methods and the favored
field of application.

14.2 Pattern Recognition Methods

Five methods are available:
• Fine structure
• Rough structure
• Closed contour
• Leadtip locator
• Corner detection

In all methods, the system is first taught a pattern, an object or a

structure. This will be described in the following as Pattern. This pattern
is then checked for suitability and its properties are saved. This process
will be described in the following as Teaching. A taught pattern can be
successfully applied if it is found suitable for the respective method. The

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taught pattern is then used for the second part of pattern recognition
which is described as Search. The position of the pattern is then
determined in any given camera image.
A maximum of 2 patterns can be taught in every reference system. For
every pattern, the method can be selected and individual parameters can
be set. A search area can be set in all methods. The search area is a
rectangular section of the camera image whose center corresponds to
the center of the camera image. Generally, the search area should
remain set to the largest possible value. This allows displaced patterns to
be found. Reduction of the search area is only desired to avoid confusion
when 2 pattern segments are located in the search area, which are the
same as the pattern. The search area should then be reduced so that
only the desired pattern is located in the camera image. A smaller search
area generally leads to a shorter search time.

14.2.1 Method „Fine Structure“

This method is based on the grayscale analysis, which is a classic
pattern search with a comparison function. The comparison function used
here is the normed grayscale correlation. The function allows images to
be compared which have different brightness and contrast. If the pattern
and the camera image differ in the lighting the search is not influenced. In
principle, the pattern is placed on every possible image section in the
search area and a comparison value is determined. The best comaprison
value is then searched. The comparison value is given as a percentage,
100% is a complete match. A search result is also given if the pattern is
not within the search area. The result is the pattern with the best
comparison which will be less than 100%. A threshold must be set which
must at least be reached before acceptance. This threshold can be
defined under „Minimum search score“.
With the correct setting of the threshold, the stability of the pattern
recognition can be improved. Every change in the image compared to the
pattern, be it contamination, rotation or reflection, leads to a lesser
comparison value. If the best comparison value falls below the threshold,
the image is considered as not found. If the threshold is set too low,
incorrect images could possibly be found if the pattern is not in the search
area.
Several identical patterns in a search area with each search score above
the threshold should already be intercepted during the teaching of the
pattern. An error message appears that the pattern is unsuitable.
A pattern is checked for its suitability when it is taught. The most
important criteria is that the pattern can be distinctly found, even with
slight changes to the search image. The exact position definition is
especially important. The grayscale analysis is an optimized algorithm.
This optimization requires that the pattern has large structures. If the
pattern only partly fulfills the criteria, this leads to a decreased teach
score. The smaller the pattern is in its dimensions, the smaller the
amount of patterns with a high teach score.
The position accuracy can be improved with the Subpixel option. A real
image under a camera is not moved by multitude of pixels, but only by a
definable value. The positioning can be optimized by using the subpixel

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 14 Pattern Recognition

option. Generally, an improvement of up to 1/4 is achieved. The position

can be exactly defined up to 1/4 pixel in good patterns with minimum
rotation. It is recommended to always leave this option activated as the
additional time required is only 2-3ms.

14.2.2 Method „Rough Structure“

The method „Rough Structure“ was developed from the normal grayscale
analysis and is optimized for large patterns and search areas. The mode
of operation remains unchanged. The greatest problems of the normal
pattern search regarding substrates e.g. with gold are with the fine
structures on the surface of the circuit leads. The method „fine structure“
is developed for these fine structures. This is a fundamental problem as
such small structures are different from board to board. This leads to
frequent pattern recognition errors.
The altered algorithm uses large patterns from 128 x 128 up to 256 x 256
pixels. Therefore, particularly large structures are decisive for the
correspondance of two patterns. This search algorithm is especially
suitable for the adjustment on substrates. The precision of the searched
position is +/- 1 pixel.

14.2.3 Method „Closed Contour“

It is becoming common practice to include alignment structures on the
substrates in order simplify pattern recognition. Such alignment marks
may be crosses or two squares which are diagonally aligned to each
other. The „Closed Contour“ method is designed for such objects. The
method works internally with a binary image which is created over a
threshold value. The threshold for the binary image defines up to which
gray scale an image pixel will be taken for a black pixel and above
which a white pixel is assumed. This threshold can be set as a fixed,
dynamic or manual entry. If the threshold is fixed, the threshold
determined in the teaching process is applied during subsequent
search actions. If the threshold is dynamic, it is determined newly
every time. A threshold which was set manually in the settings is
applied as a constant value every time. The respective option can be
found in the teach parameters. The area of the object’s binary image is
used for calculating the reference point. A condition for the use of this
algorithm is that the object has a closed structure. An alignment mark is a
closed object. If the object exceeds the binary image it is not closed and
the position can not be determined here. When using binary images, the
object must be brighter than the surface otherwise it will not be found.
Dark objects on a light surface can also be found with the respective
option. This adjustment method is tolerant to changes in the size. This is
especially interesting for substrates with over and under etching where
an alignment mark may appear larger or smaller. The tolerance can be
limited manually. The precision of this method is less than a pixel.
When using this pattern recognition method for the pad locator, the option
Centered always gives the center of gravity of the object as the bond
position. If the option Centered is deactivated, the entered position
relative to the center of gravity is saved.

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14 Pattern Recognition

Figure 14-1: Pad locator

14.2.4 Method „Lead Locator“

The lead locator method searches for leads or lead tips. This method is
typically used to determine bond positions exactly in the pad locator
function. It can however also be used for pattern recognition in reference
systems, in which case just the lead tips are relevant rather than
exclusive positions on the lead. The settings are restricted to the color
and the threshold in this case.
The threshold for the binary image defines up to which gray scale an
image pixel will be taken for a black pixel and above which a white pixel is
assumed. This threshold can be set as a fixed, dynamic or manual
entry. If the threshold is fixed, the threshold determined in the teaching
process is applied during subsequent search actions. If the threshold is
dynamic, it is determined newly every time. A threshold which was set
manually in the settings is applied as a constant value every time.
The binary image is filtered to remove disturbances in the image. The
filter strength can be adjusted.
The size of the object is recorded in the teach process. The maximum
allowed size deviation in % of the taught pattern can be defined in order
to avoid unintended finding of a similar nearby object.

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 14 Pattern Recognition

Figure 14-2: Lead locator

14.2.5 Method „Corner Detection“

The corner detection is based on edge detection and searches for two
prominent edges within the search area which form a specified 90°
corner. The corner must be located within the specified pattern size. The
corner recognition method is able to calculate the angle of a corner as
well as its position. Therefore only a single recognition is necessary to
determine the offset and rotation of a reference system. Other PR
algorithms need two points for this.
The selectable options for the corner are Upper left, Upper right, Lower
left or Lower right. The object with the corner can either be a Dark
object or a bright one.
Disturbances are filtered out of the image before the search for the corner
begins. The Filter is set by a scroll bar between 1 (low filter effect) and 30
(high filter effect). A threshold value for the Black value is then
determined below which all gray scales are eliminated. The remaining
gray scale values above the threshold are scaled up over the entire
range, which increases the contrast of the image.
During the edge detection several small edges may be found and can be
combined to one edge. This is allowed if the small edge segments show
the same orientation and are separated by only a small gap between the
edge segments. This Max. gap can be defined between 2 and 50 (pixel).
The result of the corner detection can be seen in the preview. The found
edges which form the corner are shown in light gray in the filtered image.
All other found edges are shown in dark gray. Additionally the calculated
search score and the determined absolute angle are given.

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14 Pattern Recognition

Figure 14-3: Corner Detection

Tolerances
Position deviatons between the taught and found patterns can be
accepted up to a certain definable value, or not accepted when this value
is exceeded. A pattern recognition error is then displayed.
The Max. pattern distance error limits the deviation between the distance
of 2 patterns or manual points of a reference system relative to the
distance of the taught positions. The rotation of a reference is accepted
up to the Max. rotation value.
With the option Calculate stretch factor, the relation of the distance
between two patterns or manual points to the distance between the
taught patterns is interpreted as a stretch factor and is used for the
calculation of the bond position.
As a standard, there are 4 different focus heights within a reference
system. These focus heights remain identical with the option Identical
focus height.

Figure 14-4: Tolerances

Movement optimization
Normally, the camera is moved exactly over the position where a pattern
is assumed, and then the pattern is searched for within the search area.
This movement does not have to be made if the whole search area is
already within the live camera window and the focus height is set.
If this is not the case, the system will predict if the search areas of both
patterns of the next reference system will fit in a single camera window
(field of view). In this case the camera will move to a position exactly
between both patterns. Should the first pattern be found in a position
which will render the second pattern likely to be outside the window, the
second pattern must yet be moved to.

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 14 Pattern Recognition

Movement optimization for the pad locator

Before searching for individual pads with the pad locator, all pads are
grouped in sequence as long as the sum of the search areas still fits in
one camera window (field of view). The position exactly in the center of
these search areas is then moved to and all pads which fit in the current
field of view are searched for simultaneously.

14.3 Setting Possibilities

14.3.1 Teach and Search Parameters
Now that the fundamentals of pattern recognition have been described,
this paragraph will describe the setting possibilities on the BONDJET
BJ820.
Before every teach process the image should be focussed. The arrow
keys ↓ ↑ on the keypad can be used for this.
Optimum lighting is also necessary for effective pattern recognition. The
user must be familiar with the properties of the surface of the application
to be able to optimize the lighting for the pattern.
The pattern recognition parameters are displayed in a list dialog and are
divided into manual points, pattern, settings for tolerance, defect
recognition and bond level.
In the „View“ dialogs, the taught pattern is displayed using the helper
pattern, the measured focus height, settings for lighting, teach score and
results of the last search are displayed.

Figure 14-5: PR parameter list

The Auto Teach function helps the search for a suitable pattern. This
must be activated in the menu Settings/Auto Teach Parameter. These
settings are applied globally for all pattern search processes. In addition
to the pattern size, an Area in pixel is also defined in which the search
process is carried out. This is displayed as an additional frame around
the defined pattern rectangle. If the time has run out which was entered

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14 Pattern Recognition

under Maximum duration, the pattern with the largest teach score is
selected. If, however, a pattern was found which reached a higher teach
score as that defined in the PR parameters for every individual defined
minimum teach score, this will be selected and the teach process is
aborted prematurely.

Figure 14-6: AutoTeach parameters

It is important that the corresponding reference system is selected when

editing PR parameters. The system which is being edited is displayed in
the title of the dialog.
• Select the pattern to be edited. Every pattern has its own editor.
• Define a Search method which is suitable for the application.
• Define the size of the Search area where the pattern should be
searched. If a search area is selected that is larger than the screen
segment, this will be scanned. The search process will take longer.
• With the Pattern size, the size of the selected image segment is
defined. By default, a segment of 64 x 64 pixel is sufficient for most
applications.

Figure 14-7: PR parameter for pattern x

• Activate the option Subpixel to increase the precision of the search

process. This option is only available for the method „fine structure“.
• A pattern can be taught with the Search option „Dark object“ in the
search method „Closed contour“ where a dark object is on a light
background. Also, with this method you can set if the Threshold is
„dynamically“ defined for every search process or „fixed“ when
teaching the object. The tolerance for this method can be limited by

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 14 Pattern Recognition

entereing a % value, as this method is tolerant with changes in size,

especially on substrates with over and under etching.
• By defining a Minimum search score, a quality limit is defined up to
which the pattern is accepted.
• With the Minimum teach score, the quality target is defined for a
taught pattern.

Hint: The teach parameters are only related to this teach

process. The search parameters are used for every
search process.

Hint: If the pattern size of an already taught pattern is changed,

or if the lighting settings are altered, the pattern must be
retaught.

14.3.2 Alternative Patterns

In the production process of die bonding, „tilting“ of chips can occur due
to different adhesive deposition. Tilted chips appear different for the
pattern recognition system and are often not found. This leads to a
pattern recognition error and the production is halted. To reduce the
number of pattern recognition errors, a number of alternative patterns can
be defined for every taught pattern. This setting is carried out in the PR
parameter dialog.

Figure 14-8: Define alternative pattern

The alternative is normally taught at the same position where the pattern
is that could not be found.
The axes positions can be altered when teaching alternatives if this
option is allowed in administrator mode under Settings/Program
variants/Adjustment.

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14 Pattern Recognition

Figure 14-9: Teach alternatives at different positions

• Enter the Maximum number of alternative patterns which should be

taught by repeated non recognition. (The more alternatives taught
the longer the search process will take). With the Defined function,
the taught alternative patterns are numbered.
• If a pattern is not accepted, you will be prompted to move exactly to
the manual points of the affected reference system and confirm with
the right trackball button. The teach point is displayed in the upper
left corner of the camera window.
• The pattern which was not found by the pattern recognition is then
displayed in a dialog.
In the dialog Teach alternatives, the camera center is displayed with the
search area, the pattern and the moveable crosshair.
• The position of the alternative pattern can be moved to with the
trackball by keeping the right button pressed if this option was
activated in the program variants.

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 14 Pattern Recognition

Figure 14-10: Teach alternatives

• Confirm the dialog by clicking the command button Yes to

automatically teach the alternative patterns. For every alternative
pattern, the lighting on the ring light and the vertical light can be
adjusted by clicking the symbol and using the scroll bars. After
clicking the command button No, production continues without
saving alternative patterns.
• Already defined alternative patterns can be viewed or deleted by
clicking the command button Alternatives...

Figure 14-11: Edit alternatives

• The alternative pattern is displayed. The following data is displayed

in the footnote: Lighting, Date when the pattern was learned,
Number of hits.
• Click the arrow keys to view the defined patterns and remove the
currently displayed pattern with the command Delete. The
command Back returns you to production mode.
• In the dialog Edit alternatives, you can enter the PR parameter
dialog by clicking the command button if a number of defined
patterns are displayed.

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14.3.3 Lighting
Lighting which is set correctly for the surface condition of the pattern
improves the stability of pattern recognition. Two light sources are
available for the pattern recognition system on the BONDJET BJ820, the
vertical light and the ring light which can be set independantly. The 3rd
light setting is for the ring light on the E-Box.
When teaching a pattern, the lighting setting is determined and saved for
every pattern. If different patterns are to be taught, the lighting has to be
set according to the respective pattern. Changes to the lighting settings
can result in patterns not being found and the teach process must be
repeated.
A rough surface has a significantly different reflectivity than a level
surface, which is why the choice of light source has to be adapted to the
surface condition. The following lighting method is recommended:

Level surfaces such as chips. Primarily alter the intensity of

the vertical light (keep ring light at a minimum).
Rough surfaces such as substrate structures. Primarily alter the
intensity of the ring light (keep vertical light at a
minimum).

14.3.4 View Pattern/Points

After defining the PR parameters and teaching the pattern, the result is
displayed in the „View“ dialog. The result can not be changed in this
dialog.
• Open the view dialog by clicking the selected pattern or point.

Figure 14-12: PR parameter - view

In the Point x view the image of the defined manual point is displayed
along with the focus height. To find the point again, axes coordinates
have to be given by the operator in manual alignment.

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 14 Pattern Recognition

14.3.5 Defect Recognition

Bad products can be skipped automatically in production. The pattern
recognition system can use either of two methods to decide between
good or bad parts.
For the first method a pattern is taught on a good part. If this pattern can
not found in production because the part is missing or marked as defect,
the machine can skip the bad part automatically. Teaching works in the
same way as for a normal reference pattern. The search algorithms for
fine structure, rough structure or closed contour can be selected. Search
area, pattern size and search accuracy have to be defined.
For the second option the search algorithm Inkdot recognition has to be
selected. A pattern of an inkdot has to be taught on a defect part. The
size of this pattern can be defined according to the radius of the inkdot
plus a tolerance for the search area.
The result of the teaching process is displayed in the view dialog.

Figure 14-13: PR parameter - Badmark

14.3.6 Tolerances
The pattern recognition considers the distance between the two patterns
of a reference system. If large deviations occur during pattern recognition
a misalignment is assumed and the adjustment is aborted with an error
message. The Max. diagonal tolerance sets an upper limit for accepting
a pattern with such a deviation.
The Max. rotation of a pattern can be limited in the same way.

14.4 Error messages

14.4.1 Teaching
In this section there is a brief explanation of the error messages that may
be given during the teaching of a pattern.

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14 Pattern Recognition

Teaching score not reached

This error may occur during the teaching of a pattern. It can be caused by
a pattern with too little contrast or if there are similar patterns in the
search area. It is recommended to select a lower teach score.
As these errors are frequently caused by a choice of unsuitable patterns,
the following show some examples of good and bad choices of a pattern.

Figure 14-14: Bad choice of pattern

As can be seen in this example there is an identical pattern in the

immediate neighborhood.

Hint: Never teach bond pads as patterns. The pads cannot be

recognized after wire bonding and they usually contain
probe marks which can vary from chip to chip.

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Figure 14-15: Good choice of pattern

The object shown in this example clearly differs in its geometry from
objects in its immediate surrounding area and is therefore ideal for a
„pattern on chip“ search method.

Hint: Alternatively a pattern can be taught using the „Auto

Teach“ function. This function suggests an optimal
pattern. This simplifies teaching.

There is more than one identical object in the search area

(closed contour)
An object was selected that, in size and form, appears at least twice in
the search area. This is the case, for example, when using bond pads. To
avoid this, reduce the search area so that only one object is within the
search area or select a different object.

No object found.
There was no object under the crosshair when the right trackball button
was pressed. There may also have been a lighter object in the image
causing the internal binary pattern not to recognize the selected object as
such.

The selected object is too small.

The taught object was too small.

No closed object found.

The object taught was not closed. The following pictures show examples
of suitable closed objects.

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14 Pattern Recognition

Figure 14-16: Closed object: example 1

Figure 14-17: Closed object: example 2

14.4.2 Searching
The following describes which errors could occur when searching for a
pattern.

Image not found

This error can occur during production. It can have many causes:

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• There may be more than one similar or identical object in the area. It
is recommended that a new pattern is taught. The „Auto Teach“
function is helpful in this case.

• The taught pattern has very little contrast.

• The search accuracy is set as “very good“. Production variations

between chips may cause pattern recognition to recognize
significant deviation from the taught pattern. It is recommended that
a “lower“ search accuracy is selected.

• The found pattern is rotated by more than 5° compared with the

taught pattern.

• The selected search area is too small. If there is a deviation of the

board position caused by production tolerance, an offset occurs.
This offset can be corrected by suitable selection of the „Search
area“ and „Pattern size“. The maximum permitted offset can be
calculated with the set pattern size MG and search area SB
according to:

μm
max .Offset = ( SB − MG ) * 319
,4
pixel

No object found
No object could be found in the search image. If this error occurs, teach
this object again or select another object.

No closed object found

Either the taught object is not completely in the search area and is
therefore no longer closed, or changes in the contrast prevent correct
recognition.

The deviation from the taught pattern is too large

An object was found that was either much larger or smaller than the
taught object or an incorrect object was recognized. Possibly, the
searched object is no longer in the search area.

The reference points are outside the tolerance

This error occurs when the connection line between the center of two
taught patterns or two manually taught points is not inside the set
tolerance. This may occur due to production variations of the application.
If necessary the tolerance can be increased. The following illustration
explains the term „tolerance“.

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Δx
Picture 2

Picture 2*

Picture 1

Figure 14-18: Definition of tolerance in pattern recognition

Picture 2 is the originally taught pattern. In the production, a similar

pattern picture 2* was found. This is, however, not the previously taught
pattern. A difference DX occurs. If this is larger than the defined tolerance
an error message is displayed.

Hint: The positioning accuracy of an automatic indexer must be

at least s= ±3 mm. Additionally, the rotation of the
substrate must not be greater than 5°.

14.5 Lighting
Optimizing the lighting to the surface characteristics of the pattern can
help to increase the efficiency of the pattern recognition. The two light
sources in the BONDJET BJ820 can be programmed individually.
A rough surface has a significantly different reflection behaviour
compared to a smooth surface, therefore, the choice of lighting has to be
modified to take this into account. We recommend :

smooth surfaces such as chips, primarily to vary the intensity of

the vertical lighting. (Ring lighting intensity at
minimum.)
rough surfaces such as substrates, primarily to vary the inten-
sity of the ring lighting. (Vertical lighting inten-
sity at minimum.)

Hint: The selected lighting intensity is applied to the complete

reference system.

14-18 User manual-BJ820-3.77 ©2013 Hesse GmbH

 15 Preventive maintenance

PREVENTIVE MAINTENANCE
CHAPTER15

This Chapter summarizes the maintenance timetable for the BONDJET

BJ820.

15.1 Special danger warnings referring to adjustments

All measures of adjustment serve the safe operation of the system and
guarantee the steadily high quality of the products. That is why they have
to be executed carefully according to the statements of the producer.

Attention: Maintenance work is only allowed to be executed

while the machine is switched off. Unintentional
switching on of operatively alive parts and of moving
parts has to be prevented by apt measures.

The attendance crew has to be informed timely about works of

inspection, attendance, maintenance and repair as well as about work in
order to do away with disturbances. It has also to be informed regarding
the supervising person!
The maintenance area has to be widely closed if necessary!
If the system is switched off completely during maintenance and repair
work, it has to be secured against unexpected switching on!
• Close the facilities of the main commands and pull out the key.
• Put a danger sign on the main switch.

Danger: Single parts and bigger components have to fixed and

secured carefully at lifting jacks during the exchange.
Use only perfect lifting jacks! Do not stand or work
below hanging weights!

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15 Preventive maintenance

Works of adjustment, maintenance and inspection and dates have to be

kept to as it is stipulated in the operating manual! For detailed
informations use the documentation of manufacturer.

Note: These jobs are only allowed to be executed by trained

and qualified personell!

In order to guarantee a reliable quality of the BONDJET BJ820 please

perform maintenance within the stipulated intervals. You may be
prompted to refer to the OEM parts documentation

maintenance overview

Material
Assembl
Things to do Interval requirement Notes
y
s
CH=check
CL=clean
P=perform
CHG=change
L=lubricate
C=calibrate

Bondhead Wire sensor CH Annual Refer to OEM

parts manual /
User manual

Deformation C Semi- User manual

sensor annual

Transducer- CHG, CH Semi- Spare part, Each time the

screw annual refer to Hesse wedge tool was
GmbH changed

Bondhead cable CH Semi- Spare part,

FLEX annual refer to Hesse
GmbH

Bondforce C Semi- calibrate force

spring annual

Wedge tool CH, Every Refer to Chap- Depends on

CHG 400.000 ter 5 / User the choosen
Bonds manual process

Axis movement bea- L 5000 km Lubricant ISO- Refer to OEM

rings X,Y-axes or FLEX Topas parts manual /
24 month NCA 52 User manual

Axes movement ca after each Refer to OEM

test inspection parts manual /
User manual

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 15 Preventive maintenance

maintenance overview

Material
Assembl
Things to do Interval requirement Notes
y
s
Frame Ultrasonic-gene- C impe-
rator dance test
after each
wedge
exchange

signal lamp CH yearly function test at

bonding start

Safety hard stops CH quarterly

cover

safety interlock CH quarterly

15.2 Lubrication of axis system

The lubrication and maintenance intervals of the axis system are
dependant on the demands made on the system. The lubrication
intervals for the carriage systems are shown in the appendix. The
carriages in the X and Y axes are fitted with grease nipples. The correct
lubricant and amount must be used for each component.

Lubricating the X and Y carriages

The X and Y axes each have 4 slide carriages. Each carriage is fitted with
a grease nipple. The lubrication intervals and lubricant are stated below.

grease nipple

Figure 15-1: grease nipple slide carriages (X and Y axes size 15)

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15 Preventive maintenance

Lubricating the Z axis

The Z axis has life long lubrication. This axis requires no further
lubrication.

Tabelle 1: Lubrication intervals

X Achse Y Achse

X Axis Y Axis
Amount of lubricant: 0,7 cm³ per carriage 0,7 cm³ per carriage
(both sides) (both sides)

Interval: 5000 km or 24 months 5000 km or 24 months

Lubricant: Isoflex TOPAS NCA 52 Isoflex TOPAS NCA 52

(Klüber) (Klüber)

15.3 Exchanging the Wire Spool

It is necessary to exchange the wire spool if it is empty or if a different
wire diameter is to be used.
• Open the function with the key WI on the key pad or with the
command Threading, which is available in all process levels under
the Action menu.

Figure 15-2: Threading Dialog

• In threading mode, the bondhead is automatically moved to a

predefined position by clicking the Threading position command
button. The bondhead P axis can be rotated by using the arrow keys
or clicking the arrow symbols in the dialog.
• Deactivate the Automatic function and switch the Air off.

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 15 Preventive maintenance

• Remove the wire spool.

• Remove the start of the wire spool under the start marking (usually a
sticker on the spool) and use tweezers to unwind it c. double the
spool circumference.
• Place the spool on the holder so that the wire is unwound clockwise.
• Use tweezers to guide the wire end through the vertical slit in the
wire sensor.
• Switch the Air on and activate the Automatic function.

• Use the threading wire to pull the wire through the wire guide tube
(see Figure 15-3: “wire feed”).

wire sensor entrance

wire spool

wire guide

Figure 15-3: wire feed

Threading with tweezers and without threading wire below the wire guide
is carried out as follows:
• Thread the wire through the slit in the transducer.
• Check that the automatic function in the threading dialog is
activated. Wire will be automatically transported when the sensor
recognizes wire use.
• Guide the wire around the wire brake.
• Focus the microscope to 1.6 times magnification of the wedge tip.
• With the arrow keys, rotate the bondhead to the 40° position to get a
good view of the through hole of the wedge.
• Remove the moveable clamp bracket with the thumb screw.
• Pull the wire from the clamp straight and cut it clean. A wire tail of
5mm should remain.

©2013 Hesse GmbH User manual-BJ820-3.77 15-5

15 Preventive maintenance

• Thread the wire tail through the hole in the wedge with tweezers.
This steps requires some practise and can take some time for the
inexperienced user. It is easier if the wire tail is bent to the correct
angle. Pull the wire through the hole and straighten.
• Replace the moveable clamp bracket and use the WF key to feed
wire until a perfectly straight wire tail is achieved. Cut off the rest of
the wire.

15.4 Adjusting the pressure air

A flow regulator for the air can be found to the top left in the machine
interior, next to the controller unit. If the pressure is set too low, the wire
might not get blown up into the sensor range in the slot of the wire
sensor. If the pressure is too high, the wire might get blown up too far for
the sensor to work properly. Changing the wire diameter on the machine
might require an adjustment of the air pressure.
• Set the air flow with the regulator until the wire gets blown safely into
the range of the wire sensor without too much „dancing“.

air regulator

Figure 15-4: Pressure air regulator

15.5 Exchanging the Wire Guide Tube

The wire guide tube enables the wire to be safely guided through the
bondhead to the wire brake.The tube is a PTFE tube which is cut to a
length of 28.5cm. The tube is covered by a metal pipe.
Exchanging the tube is necessary if there is too much wear residue which
can restrict the wire transport. If the tube is damaged by bending, this
could also cause wire transport restriction.
• Move the bondhead to a suitable position, this is generally the
threading position.
• Remove the wire by cutting it above the wire guide and pulling it
downwards out of the bondhead.
• Remove the screws which attach the tube (see Figure 15-6: “Wire
guide tube”).
• Pull the tube downwards out of the bondhead.

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 15 Preventive maintenance

Important: The wire guide tube must not bend!

• Guide the new tube from above in the metal pipe through the
bondhead shaft.

metal sleeve
wire guide

Figure 15-5: wire guide

• Push it through until it can be reached with tweezers below the drive
pulley.
• Pull the tube so far until is reaches through the LED ring up to the
transducer and clamp it with the screws into the wire brake.

wire guide tube

clamping screws
wire guide tube

Figure 15-6: Wire guide tube

• If the tube has been inserted correctly, it is only barely visible on the
upper end of the cover pipe.
• The wire can now be rethreaded.

Procedure for deep access bondhead

• Move the bondhead to a suitable position, this is generally the
threading position.
• Deactivate the Automatic wire despooling in the Threading dialog.

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15 Preventive maintenance

• Remove the moveable wire clamp bracket and swing the clamp
blade away from the wedge.
• Remove the wire by cutting it to the right side of the wire sensor slot
and pulling it downwards out of the bondhead.
• Remove the connector and cable for the LED ring from the socket
and unscrew the LED ring assembly. Place it aside in a safe place.
• Loosen the screw on one side of the restraint (see Figure 15-7:).
Remove the other screw completely. Use the small size flat head
screw driver which is part of the bonder accessory box. Swing the
restraint out of the way.
• Free the white PTFE wire guide tube from its groove and pull it
downwards out of the bondhead.

entry for wire

guide tube
connector
wire guide
LED ring
tube
light

groove for
wire guide
tube

screw
restraint
screw

Figure 15-7: Wire guide tube on deep access bondhead

The white PTFE wire guide tube can be obtained as a spare part pre-cut
to the right length.
• Insert the new wire guide tube from below into the metal sleeve on
the bondhead and push it all the way up. Excert caution that the wire
guide tube is not bent, kinked or damaged in any way.
• The wire guide tube must be placed in the groove in such a way that
the end is flush with the bottom edge of the bondhead body.
• Swing the restraint back into position and insert the screw which has
been removed before. Turn both screws hand tight.
• Fit the LED ringlight back on the bondhead and turn the screw hand
tight. Connect the cable again. The polarity can not be reversed
because the connector is coded.

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 15 Preventive maintenance

• Trim the end of the wire guide tube short above the the metal sleeve
of the bondhead. The tube may not touch the fixed metal tube above
the bondhead.
• Rethread the wire all the way down to the wedge tool.
• Reinstall the moveable wire clamp bracket and swing the clamp
blade back against the wedge tool.
• Carry out an offbond to produce a defined tail.

15.6 Exchanging the bondhead

Take note of the following before all work on the bondhead.

Important: 1. Move the bondhead to a suitable assembly

position. This is generally the threading position!
2. Make sure there is enough space below the
bondhead so damage can be avoided!
3. Switch the safety circuit to 0 and the main switch to
OFF!

Attention: Take apt measures to ensure that the machine is not

switched on before assembly work is completed!

15.6.1 Removing the bondhead

• Move the bondhead to a suitable position. This is generally the
threading position. Select under Action the command Threading or
press the WI key on the keypad. Confirm with Enter.
• Cut the threaded wire with scissors between the wire sensor and the
wire guide tube.
• Open the wire clamp (WC key) and remove the wire from the
bondhead.
• Rotate the bondhead in the P axis so that the transducer shows with
the wedge to the front. All screws required for disassembly can be
easily reached from this position. Click the arrow keys in the
threading dialog or on the keypad to alter the position of the P axis in
the positive or negative direction.
• Switch the bonder off. The safety circuit switch must be set to 0 and
the main switch to OFF.
• Unscrew the 3 screws on the cover and remove it to the front.

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15 Preventive maintenance

screws for
bondhead cover
screws
bondhead
cover

Figure 15-8: Bondhead cover

• Release the plug and pull the flex cable from the bondhead circuit
board.

plug
bondhead cable

Figure 15-9: Bondhead cable

• Always hold on to the bondhead on the LED ring light, never on

moveable parts.
• Remove both screws which fix the bondhead to the toothed belt.
Keep the washers safe, they are needed for reassembly.
• Pull the bondhead vertically downwards. Carefully guide the flex
cable through the drill hole to avoid any damage.
• The dowel pins click out.
• Carefully wind up the flex cable and secure with the transport ring.
• Store the bondhead in the transport box and fix with the screws
M3x8 at base plate, which mounted the bondhead to the toothed
belt. Tighten the screws that they don´t loosen.
• Removal only at the base plate!
• Do not touch the wire-feed unit and the transducer!

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 15 Preventive maintenance

Bondhead DA Bondhead 45°

Figure 15-10: Bondhead base plate in transport box

Important: Never rotate the P axis drive pulley when the

bondhead is removed because the settings will be
lost.

15.6.2 Mounting the bondhead

• Move the bondhead to a suitable assembly position, this is generally
the threading position.
• Move the main switch to OFF to switch the bonder off.
• Take the bondhead from the transport box. Hold on to it on the LED
ring light and not on any moveable part. (see Figure 15-11:
“Bondhead assembly”)

©2013 Hesse GmbH User manual-BJ820-3.77 15-11

15 Preventive maintenance

Figure 15-11: Bondhead assembly

• Make sure the flex cable is wound around the shaft and fixed with a
transport ring.
• Guide the bondhead with the flex cable shaft from below through the
drive pulley.

Important: Make sure that the flex cable does not touch the
edges of the drive pulley and the wire guide tube is
not bent.

• Place the bondhead on the bondhead circuit board so the drill holes
fit over the dowel pins which protrude from the drive pulley.
• Screw the bondhead from above with the 3 screws DIN 912 M3X8
and the correct washers which were used to screw the bondhead
transport box.

Important: Do not use screws of another thread length because

the bondhead could be damaged.

• Remove the transport ring and unwind the flex cable at least one
rotation, 2 at the most.
• Plug in the flex cable and lock.
• Switch on the bonder by switching the main switch to ON.
• Switch on the safety circuit.
• Carry out a reference move and carefully monitor the torsion of the
flex cable during rotation of the P axes. Abort the movement
immediately if the flex cable is pulled tight and adjust the winding.
• After a correct reference move, the cover can be replaced.
The bondhead assembly is now complete.
If there is a disk with calibration data for the bondhead, this can be
entered in the service menu Extras/Bondhead disk.

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 15 Preventive maintenance

• Carry out calibration of the P axis and the wedge geometry as well
as all height measurements.
If there is no bondhead disk, the following calibrations must be carried
out:
- Camera, focus height

- Sensor

- Bondforce

- Wedge, touchdown height

©2013 Hesse GmbH User manual-BJ820-3.77 15-13

15 Preventive maintenance

15-14 User manual-BJ820-3.77 ©2013 Hesse GmbH

 16 Error Messages

ERROR MESSAGES
CHAPTER16

This chapter gives an overview of error messages that may be given

during operation of the BONDJET BJ820. The list is ordered numerically.
Each error entry contains a description of its possible cause and
suggestions for correction. If errors not contained in this list occur while
using the machine, the service personnel of Hesse GmbH should be
consulted for correction possibilities. The service department can be
reached under the number +49-5251-1560-333.

Table 1: Error Messages

Error
Description Cause Solution
number
100 A problem has occured with the frame The board is defect. Phone the service team!
grabber board.

298 CAD import. Wrong file format. The syntax of the selected Select a file with the correct syntax.
CAD file is invalid.

460 No wire has been used. Check the The wire sensor has not Check the bonded wire and the wire
bonded connection and wire guide. detected any wire use. guide.

461 Wire sensor has not detected any The wire spool is empty or Replace the wire spool or check the
wire use. Wire spool is empty or wire the wire has broken. wire sensor.
has broken.

462 Wire spool nearly empty. Terminate See description Quite the warning. Change wire spool
production? and reset wire parameter

463 Less wire used. Continue bonding ? Sensor realised no wire use Check wire and wire feed

464 Wire not cut. The wire was not cut. Check the cutting parameters.

524 No height measurement made. There is no height position. Mark the bond for a height measure-
ment.

527 Focus height not yet measured. The focus height of a refe- Measure the focus height.
rence system was not
measured.

543 Program cannot be opened. File error Check program is present.

544 Holder does not exist. File error Check the correct holder is installed.

545 Program cannot be downloaded from File error Check, if program is available
PBS200 server.

546 PBS200 server is not online.Master PBS200 not online Check setting of PBS-Server
program cannot be loaded.

©2013 Hesse GmbH User manual-BJ820-3.77 16-1

16 Error Messages

Table 1: Error Messages

Error
Description Cause Solution
number
547 Calibration data outside limits. Please wrong calibration Check calibration and repeat it.
check calibration.

548 Program parameters of wire x outside See description Change parameter of wire x
parameter limits.

550 Distance between reference points in Offset too small Select a larger distance
reference system too small.

551 Distance between reference points in Offset too large Select smaller distance.
reference system ist too large.

552 Wires not saved. See description Save the edited programm

553 Reference systems not saved. See description Save the edited programm

554 Chips not saved. See description Save the edited programm

555 Rotation of reference system x too See description Teach a new reference system
large.

560 Reference points are outside the tole- See description Increase the tolerance or teach a new
rance pattern.

577 Defect marking found. See description. Use another substrate.

902 Set pattern offset too small. The offset for calibrating the Increase the pattern offset.
pixel relation is too small.

908 Pixel relation could not be determi- A pixel relation of 0 was cal- Re-calibrate the pixel relation. Increase
ned. culated. the offset if necessary.

1208 Sheartest calibraton not successful See description Calibrate sheartest again

1508 No saved file of type ??? found. Incorrect file name or file Enter the correct file name or replace
type, or defect disk. the disk.

3001 Not enough memory for this action. Main memory too small. Install more memory.
(Can be ordered from Hesse GmbH.)

3009 No information file exists. Program defect. Re-load program.

3010 - 3040 Problems with the storage medium. 1. File cannot be loaded. Harddisk is defect. Call the sevice
2. File cannot be saved. team.
3. File cannot be deleted.

3080 Disk drive. Disk is write protected. Disk is write protected. Deactivate write protection.

3081 Disk drive. Read error on disk. Disk defect. Replace the disk.

3082 Disk drive. Disk controller defect. Disk or controlle error. 1. Replace the disk.
2. If the problem occurs again, phone
the service team.

3083 Disk drive. Disk drive does not react. Communication problems 1. Check the power cables of the disk
with the disk. drive.
2. Check the data cables of the disk
drive.
3. If the problem occurs again, phone
the service team.

3200 Pattern recognition error.Pattern 1 in The defined accuracy cannot 1. Enter the manual points for the cor-
reference system x not found. be achieved. responding reference system.
2. Teach a new pattern in the cor-
responding reference system.
3. Decrease the search accuracy for
this pattern.

3201 Pattern recognition. Pattern 2 not As for Pattern 1. As for Pattern 1.

found.

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 16 Error Messages

Table 1: Error Messages

Error
Description Cause Solution
number
3202 Pattern recognition error.Algorithmus See description Choose an PR-Algorithmus in PR-
not defined. Parameter dialogue

3204 Pattern recognition error. No more See description Check the PR-Parameter
patterns can be teached.

3205 Pattern recognition. The set teaching Teach pattern: the defined 1. Teach the pattern.
score was not achieved. accuracy was not achieved. 2. Adapt the lighting.
3. Select another PR algorithm.
4. Decrease the search accuracy.

3210 Pattern recognition. The set search Search pattern: the defined 1. Teach the pattern.
score was not achieved. accuracy was not achieved 2. Adapt the lighting.
(algorithms “pattern for chip“ 3. Select another PR algorithm.
and “pattern for gold“) 4. Decrease the search accuracy.

3211 Pattern recognition. The selected pat- Teach pattern: bad pattern 1. Teach the pattern.
tern is not suitable. selected (algorithm “pattern 2. Adapt the lighting.
for gold“) 3. Select another PR algorithm.

3212 Pattern recognition. No threshold defi- The threshold was not defi- 1. Teach the pattern.
ned. ned. 2. Adapt the lighting.
(Algorithm center of gravity) 3. Select another PR algorithm.

3213 Pattern recognition. Set position not Object not correct. 1. Teach the pattern.
in search area. (Algorithm center of gravity) 2. Adapt the lighting.
3. Select another PR algorithm.

3214 Pattern recognition. No closed object Teach pattern: bad pattern 1. Teach the pattern.
found. selected (algorithm “Center 2. Adapt the lighting.
of gravity“). 3. Select another PR algorithm.
Search pattern: no object in
search area (algorithms
“Center of gravity“ and “Lead
tip locator“)

3215 Pattern recognition. No object found. Teach pattern: bad pattern 1. Teach the pattern.
selected (algorithms “Center 2. Adapt the lighting.
of gravity“ and “Lead tip loca- 3. Select another PR algorithm.
tor“).
Search pattern: no object in
search area (algorithms
“Center of gravity“ and “Lead
tip locator“).

3216 Pattern recognition. The set object is Teach pattern: bad pattern 1. Teach the pattern.
too small. selected (algorithm “Center 2. Adapt the lighting.
of gravity“). 3. Select another PR algorithm.

3217 Pattern recognition. No Pattern was Search pattern: pattern not 1. Teach the pattern.
found. found (algorithm “Pattern for 2. Adapt the lighting.
gold“ 3. Select another PR algorithm.

3218 Pattern recognition. The deviation Search pattern: object differs 1. Teach the pattern.
from the taught pattern is too large. greatly from taught object 2. Adapt the lighting.
(algorithms “Center of gra- 3. Select another PR algorithm.
vity“ and “Lead tip locator“)

3219 Pattern recognition. There is more Teach pattern: no individual 1. Teach the pattern.
than one identical object in the search pattern found (algorithms 2. Adapt the lighting.
area. “Center of gravity“ and “Lead 3. Select another PR algorithm.
tip locator“).
Search pattern: more than
one object in search area
(algorithm “Lead tip locator“).

3300 Bonding quality. No wire deformation Source bond: deformation 1. Check the wire is under the wedge.
detected on source pad. less than 2% of wire diame- 2. Check the welding parameters.
ter. 3. Check if the board is dirty.
4. Check the mounting.
5. Check the transducer impedance.
6. Check the wedge.
7. Check the deformation sensor.
8. Check the bondforce actuator.
9. Check the ultrasonic generator.

©2013 Hesse GmbH User manual-BJ820-3.77 16-3

16 Error Messages

Table 1: Error Messages

Error
Description Cause Solution
number
3301 Bonding quality. Too little wire defor- Source bond: deformation 1. Check the wire is under the wedge.
mation detected on the source pad. less than 5% of wire diame- 2. Check the welding parameters.
ter. 3. Check if the board is dirty.
4. Check the mounting.
5. Check the transducer impedance.
6. Check the wedge.
7. Check the deformation sensor.
8. Check the bondforce actuator.
9. Check the ultrasonic generator.

3302 Bonding quality. Too much wire defor- Source bond: deformation 1. Check the welding parameters.
mation detected on the source pad. more than 80% of wire dia- 2. Check the mounting.
Check the welding parameters. meter. 3. Check the transducer impedance.
4. Check the wedge.
5. Check the deformation sensor.
6. Check the bondforce actuator.
7. Check the ultrasonic generator.

3303 Bonding quality. The threshold of the Source bond has 1. Check the welding parameters.
set deformation profile has been “Quality control“ active: qua- 2. Check if the board is dirty.
exceeded on the source pad. lity value of the deformation 3. Check the wedge.
curve is higher than the defi- 4. Increase the threshold for the cor-
ned threshold. responding profile.

3304 Bonding quality. No wire deformation Destination bond: deforma- 1. Check the wire is under the wedge.
detected on destination pad. tion less than 2% of wire dia- 2. Check the welding parameters.
meter. 3. Check if the board is dirty.
4. Check the mounting.
5. Check the transducer oscillations.
6. Check the wedge.
7. Check the deformation sensor.
8. Check the bondforce actuator.
9. Check the ultrasonic generator.

3305 Bonding quality. Too little wire defor- Destination bond: deforma- 1. Check the wire is under the wedge.
mation detected on the destination tion less than 5% of wire dia- 2. Check the welding parameters.
pad. meter. 3. Check if the board is dirty.
4. Check the mounting.
5. Check the transducer oscillations.
6. Check the wedge.
7. Check the deformation sensor.
8. Check the bondforce actuator.
9. Check the ultrasonic generator.

3306 Bonding quality. Too much wire defor- Destination bond: deforma- 1. Check the wire is under the wedge.
mation on the destination pad. Check tion more than 80% of wire 2. Check the welding parameters.
the welding parameters. diameter 3. Check if the board is dirty.
4. Check the mounting.
5. Check the transducer oscillations.
6. Check the wedge.
7. Check the deformation sensor.
8. Check the bondforce actuator.
9. Check the ultrasonic generator.

3307 Bonding quality. The threshold of the Destination bond has “Quality 1. Check the welding parameters.
deformation profile has been excee- control“ active: quality values 2. Check if the board is dirty.
ded on the destination pad. of the deformation curve are 3. Check the wedge.
higher than the defined 4. Increase the threshold of the cor-
threshold. responding file.

6008 Safety circuit not active. See description. Activate safety circuit.

6009 Material change active. Clamp open. Close the protection cover or turn the
key to the right.

6010 Positioner deactivated. Safety circuit off/material Activate the safety circuit. Turn the key
change to the right.

6011 Controls deactivated. Safety circuit off/material Activate the safety circuit. Turn the key
change. to the right.

6012 Axes must be referenced. The axes have not been refe- Reference the axes.
renced.

6018 Too many control errors. The axes are not running Inspection of the axes.
smoothly.

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 16 Error Messages

Table 1: Error Messages

Error
Description Cause Solution
number
6019 Positive limit switch reached. The limit switch has been Move in the opposite direction, away
reached. from the limit switch.

6020 Negative limit switch reached. The limit switch has been Move in the opposite direction, away
reached. from the limit switch.

6027 Touchdown not reached. The touchdown height is Raise the substrate.
under the movement area.

6028 Touchdown height not left. Movement at touchdown not Raise the Z axis until there is no more
permitted. touchdown.

6322 Bonding error. Position outside the The substrate is partially out- Move the substrate into the bonding
movement area. side the bonding area. area.

6323 Bonding error. Touchdown height out- Touchdown height beneath Raise the substrate.
side the movement area. the movement area of the Z
axis.

6324 Bonding error. Touchdown area out- Touchdown area beneath the Raise the substrate.
side the movement area. movement area of the Z axis.

6325 Bonding error. Lower limit outside the Touchdown area beneath the Raise the substrate.
movement area. movement area of the Z axis.

6326 Bonding error. Tail off position outside Touchdown area beneath the Raise the substrate.
the movement area. movement area of the Z axis.

6327 Bonding error. Touchdown area or Touchdown area too small. Enlarge the touchdown area.
lower tolerance too low

6328 Bonding error. Touchdown not rea- Touchdown area beneath the Raise the substrate.
ched. movement area of the Z axis.

6329 Bonding error. Touchdown open while Overtravel too small. Increase the overtravel.
welding.

6331 Bonding error. Starting height too low Movement height too large or Decrease movement height or working
or outside movement limits work height too high. height.

6332 Bonding error. Touchdown source Touchdown height too high. Decrease the touchdown height.
outside the movement area.

6333 Bonding error. Touchdown height des- Touchdown height too high. Decrease the touchdown height.
tination outside the movement area.

6334 Bonding error. Touchdown area Touchdown area too large. Decrease the touchdown area.
source outside the movement area.

6335 Bonding error. Touchdown area desti- Touchdown area too large. Decrease the touchdown area.
nation outside the movement area.

6336 Bonding error. Lower limit source out- Lower limit too high. Decrease the lower limit.
side the movement area.

6337 Bonding error. Lower limit destination Lower limit too high. Decrease the lower limit.
outside the movement area.

6338 Bonding error. Overtravel source out- Overtravel too large. Decrease the overtravel.
side the movement area.

6339 Bonding error. Overtravel destination Overtravel too large. Decrease the overtravel.
outside the movement area.

6340 Bonding error. Source angle outside Angle too large. Decrease the angle.
the movement area.

6341 Bonding error. Destination angle out- Angle too large. Decrease the angle.
side the movement area.

6342 Bonding error. Shear height source Shear height too high. Decrease the shear height.
outside movement limits

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16 Error Messages

Table 1: Error Messages

Error
Description Cause Solution
number
6343 Bonding error. Shear height destina- Shear height too high. Decrease the shear height.
tion outside movement

6348 Bonding error. Loop length too short. Loop length too short. Increase the loop height.

6349 Bonding error. Tear-off distance out- Tear-off distance too long. Decrease the tear-off distance.
side the movement area.

6350 Bonding error. Source outside the Incorrect source position. Change the source position.
movement area.

6351 Bonding error. Destination outside the Incorrect destination position. Change the destination position.
movement area.

6353 Bonding error. Rotation height outside Rotation height too high. Change the rotation height.
the movement area.

6354 Bonding error. Overtravel at touch- Bond angle too large. Change the bond angle.
down before turning height outside
movement limits

6357 Bonding error. Reverse angle must be Incorrect reverse angle. Correct the reverse angle.
between 10 and 170 degrees.

6358 Bonding error. Overtravel reverse out- Overtravel too long. Decrease the overtravel.
side the movement area.

6359 Bonding error. Cut target outside the Cut target to large. Change the cut target.
movement area.

6362 Bonding error.Z distance outside Z-distance to large Decrease Z-distance.

movement limits

6363 Bonding error. Position in loop outside Loop too high. Decrease loop.
movement limits

6364 Bonding error. Height or angle in loop Loop too high. Decrease loop.
outside movement limits

6367 Bonding error. Touchdown closed See error description Increase the overtravel.
while welding source
1. increase touchdown speed or
2. increase touchdown force or
3. increase overtravel or
4. increase overtravel of turning
height

6368 Bonding error. Touchdown closed See error desription. Increase the overtravel.
while welding destination
1. increase touchdown speed or
2. increase touchdown force or
3. increase overtravel or
4. increase overtravel of turning
height

6369 Bonding error. Touchdown closed See error description. Increase both overtravels.
while welding source and destination
1. increase touchdown speed or
2. increase touchdown force or
3. increase overtravel or
4. increase overtravel of turning
height

6371 Bonding error. Touchdown before Touchdown before ending Increase the touchdown area.
moving down to bond position touchdown force.
Source: increase starting heig
|Destination: increase turning height

6372 Bonding error. Touchdown while force Touchdown before ending Increase the touchdown area.
switching at source: Increase touch- touchdown force.
down area

6373 Bonding error. Touchdown while force Touchdown before ending Increase the touchdown area.
switching at destination. touchdown force.
Increase touchdown area

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 16 Error Messages

Table 1: Error Messages

Error
Description Cause Solution
number
6374 Bonding error.Touchdown speed See error description. Increase the touchdown speed.
source too low.

6375 Bonding error. Touchdown force desti- See error description. Increase the touchdown speed.
nation too low.

6376 Bonding error. Minimum deformation Incorrect welding parame- Optimize the welding parameters.
on source bond not reached ters, no wire.

6377 Bonding error. Minimum deformation Incorrect welding parame- Optimize the welding parameters.
on destination bond not reached ters, no wire.

6378 Bonding error. Less wire used when See error description. Change the tail.
dragging the tail

6379 Wire spool empty. See error description. Put in a full wire spool.

6380 Bonding error. Shear destination on Error on source bond. Check the bond, rework if necessary.
inline test source outside movement
limits

6381 Bonding error.Shear destination on Error on destination. Check the bond, rework if necessary.
inline test destination outside move-
ment limits

6382 Bonding error Abreiss-Abstand Tear-off distance not correct Alter the distance.

6383 Bonding error. Cut error Wire not cut. Increase the cut depth.

6384 Bond error - Position when dragging Tail length to great Increase tail lenght
the tail outside movement limits

6385 Bond error - Position of additional Additional movement to great Increase additional movement
movement outside movement limits

6399 Bonding error. Angle in the bonded An angle > 180° occured Change the wire sequence.
connection too large. during S-shape bonding.

6500 Bonding error. Loop too short. See description. Change the loop length.

6501 Bonding error. Exit angle outside the See description. Change the exit angle.
permitted range.

6502 Bonding error. Apex not reachable. See description. Change the apex.

6503 Bonding error. Apex beneath the See description. Change the apex.
intermediate height destination.

6504 Bonding error. Loop height beneath See description. Change the loop height.
the intermediate height destination.

6505 Bonding error. Loop angle outside the See description. Change the loop angle.
permitted range.

6506 Bonding error. Intermediate height See description. Change the intermediate height.
source unreachable.

6507 Bonding error. The intermediate See description. Change the intermediate height.
height destination unreachable.

6602 Bond erroring. Source bond current See description. Change the quality value
exceeds maximum value

6603 Bonding error. Destination bond cur- See description. Change the quality value
rent exceeds maximum value

7000- 7003 Too many control errors of X,Y,Z and Axes are not running Inspect the axes.
P axes. smoothly.

7200 Unexpected touchdown signal. Unexpected touchdown Check, if a collision at bondhead has
signal. happened

7205 The deformation sensor registers See description. Recalibrate the sensor. If the error re-
implausible data. occurs, phone the service team.

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16 Error Messages

Table 1: Error Messages

Error
Description Cause Solution
number
7207 Measurement position outside the Measurement position set too Calibrate the sensor height at a higher
movement area. low during sensor calibration. position.

7211 The force calibration registers implau- See description. Recalibrate the bondforce. If the error
sible values. reoccurs, phone the service team.

7214 Force actuator does not lift (spring See description. Phone the service team.
tension too high). )

7222 Sensor is saturated. See description. Phone the service team.

7224 Defect or incorrectly set touchdown See description. Phone the service team.
sensor, shut off safety circuit.

7319 Dancer at lowest position (wire taut) Wire spool empty. Replace the wire spool.

7700-7703 X,Y,Z and P axes at end switch. See description. Move the axes away from the end
switch.

8005-8008 Servo amplifier cannot be activated. Servo amplifier defect. Phone the service team.

8009-8010 Movement command cannot be per- See description. Check the end position.
formed

8012 Reference movement cannot be See description. Check the safety circuit.
made.

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 17 Technical Data

TECHNICAL DATA
CHAPTER17

General
Bonding method ultrasonic or thermosonic wedge-wedge bonding
Operating methods teach in, full automatic bonding, step by step bonding
Operation modes Production Mode, Manual Bonding, Programming mode, Administration
mode, Service Mode
Program size 10.000 connections, 1.000 Ref.-systems

Bondhead
Bonding area X: 305 mm (12“)
Y: 410 mm (16“)
Z: 30 mm
Theta: 420°
Transducer 98 kHz
frequency Hesse digital ultrasonic generator and transducers
Wire size 12,5 µm - 85 µm, Ribbons with deep access bondhead
Angle of wire lead 45°
Bonding force 5cN - 150cN programmable
Bonding time programmable or depending on reached deformation
Ultrasonic power 30 kHz - 250 kHz, 0 - 2 W programmierbar
Loopform free programmable

Optics
Lighting programmable 0 -100%,in steps of 1%-LED-ring and through the lens
Camera Mini-CCD-Camera, CCIR-Norm

Pattern
recognition
Recognition type grey scale value image processing with 256 grey scale values
Recognition time 18 ms – 25 ms (search area: 256 x 256 pixel, pattern: 64 x 64 pixel)
Search area max. 1,2 mm x 1,2 mm
Correction of the max. 5°
rotation position
Resolution ca 3,1 µm/pixel
Accuracy ca. 1 µm (using subpixel)
Focussing programmable according to reference system

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17 Technical Data

Interfaces
Serial 1 × RS232 up to 115 kBaud
Parallel 16 digital entries and exits each, galvanically separated (24V), printer
interface
Highway Process data highway DP (optional)

Dimensions
H×B×D 2.032 mm × 720 mm × 1250 mm (without operating panel)
Height of working height of lowest bondarea at the ground 37“ - 38“
area height of lowest bondarea at machine desk 168 mm

Miscellaneous
Weight app. 1350kg
Electrical supply 2,2 kW, 230 V 50/60 Hz, fuse 16A
Compressed Air 5 bar cleaned and dried

17-2 User manual-BJ820-3.77 ©2013 Hesse GmbH

 18 CAD file format

CAD FILE FORMAT

CHAPTER18

In order to generate bond programs from CAD data, the bonder software
supports import and export to and from an ASCII interface file. This
chapter describes this ASCII interface data file. Manual points can be
given for each reference system through the interface file. Furthermore, it
is possible to define a limited number of parameters. The source and
destination coordinates can be defined for each wire. Here it is also
possible to define a limited number of parameters.

18.1 Syntax
The file is line orientated i.e. each line has a keyword and its respective
parameter(s). The keyword and parameter(s) are separated by either a
comma or a space. The decimal separation for decimal numbers is a dot.
The following sections contain descriptions of all the keywords and their
respective parameters.

18.1.1 Program Name

Defining the program name.
keyword : program
parameter 1 : name (name ∈ {'A'-'Z','a'-'z','0'-'9'})
The parameter is the program name. The name may only be 8 characters
long and should consist of letters and digits. This name is used as the file
name in 8.3 format.

18.1.2 Reference System Coordinates

Defining manual points for the reference system.
keyword: refpnt
parameter 1 : number (number ∈ {1,2,...,1000})
parameter 2 : point (point ∈ {1,2})

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18 CAD file format

parameter 3 : X (X ∈ 3) [mm]
parameter 4 : Y (Y ∈ 3) [mm]
The first parameter is the number of the reference system. If this
reference system does not exist, it will be created. The second parameter
is the point to be defined (manual point 1 or manual point 2), the third
parameter is the X coordinate and the fourth the Y coordinate of the
point. When creating a reference system the default parameters are used
for all process parameters.

18.1.3 Pad Coordinates

Defining the coordinates for a wire pad.
keyword : bondpnt
parameter 1 : number (number ∈ {1,2,...,10000})
parameter 2 : pad (pad ∈ {1,2})
parameter 3 : refsys (refsys ∈ {1,2,...,1000})
parameter 4 : X (X ∈ 3) [mm]
parameter 5 : Y (Y ∈ 3) [mm]
The first parameter is the number of the wire to be defined. The second
parameter defines the pad (1 → Source, 2 → Destination). The third
parameter defines the reference system for this pad. Parameters four
and five define the X and Y coordinates of the pad.
This command copies the parameters from the given reference system
into the wire parameters.

18.1.4 Reference System Ultrasonic Power

Defines the ultrasonic power of the required phase in the given reference
system.
keyword : refuspower
parameter 1 : number (number ∈ {1,2,...,1000})
parameter 2 : phase (phase ∈ {1,2,3})
parameter 3 : value (value ∈ {1,...,100}) [%]
The first parameter is the number of the reference system. The second
parameter is the welding phase and the third the ultrasonic value [%].

18.1.5 Reference System Bondforce

Defines the bondforce in the required phase for the given reference
system.
keyword : refforce
parameter 1 : number (number ∈ {1,2,...,1000})
parameter 2 : phase (phase ∈ {1,2,3})
parameter 3 : value (value ∈ 3) [cN]

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 18 CAD file format

The first parameter is the number of the reference system. The second is
the required welding phase, and the third the bondforce in [cN].

18.1.6 Reference Sytem Welding Time

Defines the weding time in the required phase for the given reference
system.
keyword : refustime
parameter 1 : number (number ∈ {1,2,...,1000})
parameter 2 : phase (phase ∈ {1,2,3})
parameter 3 : value (value ∈ 3) [ms]

The first parameter is the number of the reference system. The second is
the welding phase and the third is the time in [ms] for the required phase.
Please note that in contrast to the values in the bonding program, this
value is relative. I.e. the switching time from phase 2 to phase 3 can only
be correctly calculated when the length of the first phase has previously
been defined. With the length of the third phase the maximum bonding
time is defined (sum of the length of all three welding phases).

18.1.7 Pad Ultrasonic Power

Defines the ultrasonic power of the required phase for the given bond
pad.
keyword : bonduspower
parameter 1 : number (number ∈ {1,2,...,1000})
parameter 2 : pad (pad ∈ {1,2})
parameter 3 : phase (phase ∈ {1,2,3})
parameter 4 : value (value ∈ {1,...,100}) [%]
The first parameter is the number of the wire, the second defines the pad
(1 → Source, 2 → Destination). The third value is the welding phase
and the fourth the ultrasonic power in [%].
No coordinate command (compare section 18.1.3 “Pad Coordinates”)
should follow this one for this wire or this will replace the parameters
defined here.

18.1.8 Pad Bondforce

Defines the bondforce of the required phase for the given bond pad.
keyword : bondforce
parameter 1 : number (number ∈ {1,2,...,1000})
parameter 2 : pad (pad ∈ {1,2})
parameter 3 : phase (phase ∈ {1,2,3})
parameter 4 : value (value ∈ 3) [cN]

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18 CAD file format

The first parameter defines the wire and the second the pad (1 →
Source, 2 → Destination). The third value is the welding phase and the
fourth the bondforce in [cN].
Do not enter any coordinate commands (compare section 18.1.3 “Pad
Coordinates”) for this wire after this command or the parameters defined
here will be replaced.

18.1.9 Pad Welding Time

Defines the welding time of the required weding phase for the given bond
pad.
keyword : bondustime
parameter 1 : number (number ∈ {1,2,...,1000})
parameter 2 : pad (pad ∈ {1,2})
parameter 3 : phase (phase ∈ {1,2,3})
parameter 4 : value (value ∈ 3) [ms]
The first parameter defines the number of the wire and the second the
pad (1 → Source, 2 → Destination). The third value defines the
welding phase and the fourth is the time in [ms]. Please note that in
contrast to the values in the bonding program, these values are relative,
i.e. the switching time from phase 2 to phase 3 can only be calculated
correctly if the length of phase 1 has been defined previously. The length
of the third phase defines the maximum bonding time (the sum of all
three welding phases).
After this command no coordinate command (compare section 18.1.3
“Pad Coordinates”) should be given for this wire or the defined
parameters will be replaced.

18.2 Example
This example defines a simple bonding program with two reference
systems and three wires. The source points of the wire are in reference
system 1, the destination points in reference system 2. The parameters
are individually defined for wires two and three (increase 1st phase
ultrasonic power ):

program TEST

refpnt 1 1 0.0 0.0

refpnt 1 2 100.0 100.0
refuspower 1 1 1.0
refuspower 1 2 10.0
refuspower 1 3 10.0
refforce 1 1 12.0
refforce 1 2 20.0
refforce 1 3 22.0
refustime 1 1 2.0
refustime 1 2 10.0

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 18 CAD file format

refustime 1 3 38.0

refpnt 2 1 10.0 10.0

refpnt 2 2 90.0 90.0
refuspower 1 1 1.0
refuspower 1 2 15.0
refuspower 1 3 15.0
refforce 1 1 12.0
refforce 1 2 25.0
refforce 1 3 25.0
refustime 1 1 2.0
refustime 1 2 10.0
refustime 1 3 38.0

bondpnt 1 1 1 5.0 5.0

bondpnt 1 2 2 5.0 20.0

bondpnt 2 1 1 10.0 5.0

bondpnt 2 2 2 10.0 20.0
bonduspower 2 1 1 2.0
bonduspower 2 2 1 2.0

bondpnt 3 1 1 15.0 5.0

bondpnt 3 2 2 15.0 20.0
bonduspower 3 1 1 3.0
bonduspower 3 2 1 3.0

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18 CAD file format

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 19 Menu Overview

MENU OVERVIEW
CHAPTER 19

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19 Menu Overview

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 19 Menu Overview

©2013 Hesse GmbH User manual-BJ820-3.77 19-3

19 Menu Overview

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 19 Menu Overview

©2013 Hesse GmbH User manual-BJ820-3.77 19-5

19 Menu Overview

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 20 Process integrated Quality Control (PiQC)

PROCESS INTEGRATED QUALITY

CHAPTER20

CONTROL (PIQC)
20.1 Functionality of the PiQC System
Using the PiQC system, it is possible to control the quality of the welding
process during bonding on the basis of different measurement values.
The quality of the welding process is controlled solely by measurement
values which are obtained directly from the bonding process. These
values e.g. resonance frequency, ultrasonic power and friction are logged
during welding and are evaluated simultaneously with the welding
process. No additional testing time is required. This real-time quality
control ends before the next bond and enables a 100% control of all wires
without delay.
Figure 20-1: shows the architecture of the PiQC system. The base
signals: resonance frequency, wire deformation, ultrasonic voltage,
ultrasonic power and sensor voltage of the PiQC system observed during
welding run through a signal processing assembly (I) which, besides the
base values, also calculates derived values e.g., friction, simultaneously
during welding, in real time.
The base signals and several derived values is the input for an attribute
extraction process (II) which, with the deviation from the reference data
which are saved in a knowledge base(IV), calculates 5 individual quality
indices. The total quality index Q (III) is calculated from these individual
quality indices which are compared to a user defined threshold during
bonding.
To carry out this quality control, the PiQC system requires a learn phase.
In this phase, the specific bond process reference data required for
quality calculation is created. As a conclusion to the learn phase, the
buffered data is used in a automatic process to calculate the reference
data which are then stored in the knowledge base for the following quality
controls. Only components I and IV of the PiQC system are active in the
learn phase.
After completion of the learn phase and calculation of the reference data,
all bonds which are produced with the bond program in use undergo a
quality control with the obtained reference data. Furthermore, all bonds
created during the learn phase undergo a quality control with the
obtained reference data.

©2013 Hesse GmbH User manual-BJ820-3.77 20-1

20 Process integrated Quality Control (PiQC)

Quality index Attribute

calculation extraction
Resonance frequency(t)
Wire deformation d(t)
Ultrasonic voltage u(t)
Ultrasonic power i(t)
Sensor voltage us(t)

Base signals
Friction r(t)
Signal
Reference processing
data assembly

Data during
Knowledge base the learn phase

Values dervied from the

Individual quality indices: base signals
j Frequency
k Friction
l Ultrasonic
m Wedge
n Wire
Figure 20-1: PiQC system architecture

20.2 General Procedure When Using the PiQC System

The typical procedure when using the PiQC system is as follows:
1 Set Optimum Bond Process
Determine the bond parameters for a bond process which give the
best results compared to the process requirements. An optimum
bond process is the condition for using PiQC.
2 Define Program Settings
Activate the quality value calculation for the selected bond program
and select the calculation process for the quality index.
3 Setup Quality Specifications
Define new quality specifications or select from existing quality
specifications appropriate for the bond process. Define the number
of teach bonds.
4 Learn Quality Specifications
Create a new knowledge base for a quality specification from
reference bonds or adjust an existing knowledge base for the bond
process.
5 Adjust Quality Specifications Parameters
Define the threshold for the total quality index for the quality

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 20 Process integrated Quality Control (PiQC)

specifications used. Set the individual quality indices for tolerance,

sensitivity and the weighting.
6 Bonding with PiQC
Bond the selected bond program with the selected settings. During
bonding, the total quality index and the individual quality indices are
displayed for each bond.

20.3 Program Settings in the Bond Program

To activate quality control by PiQC you must first define in the program
settings for the bond program if and by what method a quality index
calculation should be carried out.
• Load the required bond program in the machine memory of the
bonder.
[Programming / Program / Load program].
• Select the menu point Program settings from the Program pull down
menu,
[Program / Program settings]
• Open the parameter group PiQC, by clicking the command button
in front of PiQC.
• Activate Calculation of quality. Select one of the available
calculation methods for the total quality index (mean value, weighted
mean value, minimum, product). See Chapter 20.5 “Calculation
Methods for the Total Quality Index”.
Confirm with OK.

Figure 20-2: Program settings for PiQC

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20 Process integrated Quality Control (PiQC)

20.4 Manual Bond Settings

To activate quality control by PiQC you must define in the settings for the
wire group if a quality index calculation should be carried out and
according to which calculation method the total quality index should be
calculated.
• Click the command button Settings. A dialog is opened to define the
settings for manual bonding.
[Manual Bond / Settings]
• Open the parameter group PiQC, by clicking the command button
in front of PiQC.
• Activate the Calculation of quality. Select one of the available
calculation methods for the total quality index (mean value, weighted
mean value, minimum, product). See Chapter 20.5 “Calculation
Methods for the Total Quality Index”.
Confirm with OK.

Figure 20-3: Manual bond settings for PiQC

20.5 Calculation Methods for the Total Quality Index

The PiQC system must know which calculation method to use in order to
determine the total quality index for the bond from the individual quality
indices.
The PiQC software offers the following possibilities:
• Mean Value: (arithmetic mean)
The total quality index is calculated as an average of all individual
quality indices.
This setting is the default setting at delivery.

• Weighted Mean Value: (weighted arithmetic mean)

The weighted mean value is determined from the weights set by the
user for the individual quality indices. See chapter 4.3.5 „Weighting“.
In this way, the effect of individual quality indices which turn out to

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 20 Process integrated Quality Control (PiQC)

be especially sensitive in the respective application can be

influenced on the total quality index. This is especially wise when the
influences of a bond error on the respective individual quality index
is known. The individual quality index remains unchanged, the effect
on the total quality index however, can be influenced.

• Minimum:
The total quality index is made equal to the lowest (worst) individual
quality index. This method reacts very sensitively to outliers of
individual quality indices.

• Product:
All individual quality indices are multiplied with each other (value
area for the individual quality indices 0 ... 1 each equates to 0% ...
100%). This method reacts very sensitively to outliers of individual
quality indices as well as combined minor deviations.

20.6 Create / Load Quality Specifications

To carry out a quality control of the welding process on the bond
positions with the PiQC system, the quality control in the currently used
bond program must be activated separately for each reference system.
The quality control can take place according to a new quality specification
or an existing quality specification.
Reference systems where exactly the same bond processes with
identical welding parameters and with similar bond conditions occur can
be grouped to one group of bonds. In this case the same name for a
quality specification must be assigned for each reference system
belonging to this group of bonds (upper/lower case is relevant!).

20.6.1 Creating a Quality Specification

• Go to operation mode Setup.
• In the Quality register, click the command button PiQC. The
available quality specifications are displayed in a list.
• To create a new quality specification, click the command button
New. A dialog window is opened where you can enter the name for
the quality specification. The name may have a maximum of 255
characters, numbers and letters may be mixed.

Figure 20-4: Creating a new PiQC quality specification

• Confirm with OK. If you choose to abort this process with Cancel, no
new quality specification is created.

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20 Process integrated Quality Control (PiQC)

• Click the command button Edit. The dialog window Edit PiQC
Quality Specifications is opened.

Individual
quality indices

Figure 20-5: Edit PiQC quality specification

• Define a threshold for the total quality index for this PiQC quality
specification and enter this value as a percentage in the editing box
Threshold.
• In No. Teach Bonds, enter a number between 10 and 1500. This
number of bonds is used for the teaching process and the reference
data is calculated to this data base.
• For every individual quality index in the list on the left, define a value
for Tolerance, Sensitivity and Weighting and enter the values in
the respective editing boxes. See chapter 20.8.3 to chapter 4.3.5.
• Confirm with OK. Click the command button Cancel to exit this
window, in which case the entered values are discarded.
• Click the command button Save to save all the defined values for
the created quality specifications.

20.6.2 Loading a Quality Specification

• Load the desired Bond Program in the machine memory of the
bonder. [Programming / Program / Load Program]
• Go to operation mode Programming in the register Bond Program.
[Programming / Bond Program]
• Click the command button Reference System in the Parameter
section of the screen.

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 20 Process integrated Quality Control (PiQC)

Figure 20-6: Creating / loading quality specification

• Select the reference system for which the PiQC quality specification
should be activated with the Reference System Counter.
• Open the parameter group Quality Check by clicking the command
button next to Quality Check.
• Activate the PiQC Quality Specification checkbox.
• Click the command button . A list is opened with the available
quality specifications on the bonder. Select the correct quality
specification for the bond process by clicking it. If no matching
quality specification exists, enter a name for the quality specification
to be created in the editing box. The name may have a maximum of
255 characters.
Confirm the selection from the list or the new entry with OK. The
selected existing quality specification is loaded or a new quality
specification is created.
• Carry out the above mentioned steps for all other reference systems
which will be monitored by a PiQC quality check.

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20 Process integrated Quality Control (PiQC)

Hint: It is only advisable to select an existing quality

specification for the exact same bond process
(welding parameters, substrate...)

20.7 Teaching Quality Specifications

Before carrying out the quality index calculation, each quality
specification must be taught on the current bond process by means of
reference bonds. During this teaching process, the reference files are
created in the PiQC system with which the measurement values and
system internal values are compared. Using these reference values, the
individual quality indices and the total quality index of the welding
process are determined for each bond position.

20.7.1 Automatic Teach Mode

Requirements:
• In the program settings, the quality index calculation is activated in
the PiQC group and a quality calculation algorithm for the total
quality index is selected.
• A quality specification is activated in the reference system
parameters in the parameter group quality control.
• The quality specification does not yet contain any reference data.

20.7.1.1 Automatic Teach Mode During Production

Teach mode is automatically started in operation mode Production after
start up of the bonder. The recording of the measurement values for
creating the reference data begins.
An activated teach process is recognized by the display „Teach“. If this
display is in gray, measurement data for a new quality specification are
being collected. If it is yellow, buffered measurement data from a
previous teach process are available. If the display Teach is flashing
green, the reference data is being calculated for the selected quality
specification from the measurement data.
The PiQC system can create the reference data from up to 1500 bonds
(max.) per quality specification. The number of teach bonds which should
be used for this quality specification can be defined customer specific in
the parameters for quality specifications. See chapter 4.3.2.
Once the defined number of teach bonds is reached, the teach process is
ended and reference data calculation is carried out automatically. During
the calculation of reference data, which does take some time, the Teach
display flashes.

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 20 Process integrated Quality Control (PiQC)

Teach process active

Figure 20-7: Automatic teach mode during production

The quality indices are calculated for all bonds created during the teach
process which are checked with a quality specification. The total quality
indices can be viewed in the menu Extras under Bond Graphs. In
production mode, these are displayed in the user interface of the bonder
before restarting production.
The teach process can be stopped before reaching the defined number
of teach bonds by left clicking PiQC Teach Mode in the Action menu. A
message dialog is displayed on the screen that enough reference data is
available. The message dialog allows the user to select how to proceed.
Click Yes to start the reference data calculation and create a quality
specification.
Click No to buffer the recorded values.
Click Cancel to discard the recorded values.

Figure 20-8: PiQC message - enough reference data

If the teach process is terminated manually, a minimum number of 10

bonds per bond group must be checked. If this number has not been

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20 Process integrated Quality Control (PiQC)

reached a message appears on the screen that there is not enough

reference data.

Figure 20-9: PiQC message - not enough reference data

Click Yes to buffer the acquired data for further use. The teach process is
started automatically when the bond process is started again and the
values are recorded until the defined number is reached or until the teach
process is terminated manually.
Click No to discard the acquired data.

20.7.1.2 Automatic Teach Mode during Programing and in

Manual Bond Mode
Before starting the teach process in programming mode and during
manual bonding, the prompt appears if the teach process should begin.
• Click Yes to start the automatic teach process as described above.
• Click No and the teach process will not be started and no quality
calculation is carried out.
• Click Cancel to exit this function. Quality calculation is not carried
out.

Figure 20-10: Warning automatic teach mode during programing

The automatic teach process is stopped after reaching the maximum

number of bonds for the reference data calculation. The process can also
be terminated manually in the Action menu, by left-clicking PiQC Teach
Mode. Reference data calculation is carried out automatically after
ending the teach process.

20.7.2 Manual Teach Mode

Quality specification teach mode can be manually activated by left-
clicking PiQC Teach Mode in the Action menu. The teach process is
similar to the automatic teach mode. The teach process is stopped
manually or automatically once the defined number of teach bonds (max.
1500 bonds per bond group) is reached.

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 20 Process integrated Quality Control (PiQC)

Start / end PiQC teach mode

Figure 20-11: Start / end PiQC manual teach mode

Hint: Existing quality specifications are over-written after

manually activating teach mode.

A message appears on the screen asking if existing quality specifications

should be over-written. Confirm with Yes to start the teach process, data
of an existing quality specification will be over-written. Answering with No
requires creating or selecting a new quality specification. Click Cancel
and the teach process will not be started.

Figure 20-12: PiQC message - to overwrite existing quality specification

20.8 Adjusting Quality Specification Parameters

For every quality specification of a bond group, parameters can be
defined which influence the calculation of the individual quality indices
and the total quality index.

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20 Process integrated Quality Control (PiQC)

The sensitivity of the PiQC can be set with the quality specifications
parameters. A suitable combination of parameters must be found for
each bond process where the PiQC system is sensitive enough to
recognize real process deviations but insensitive enough to avoid pseudo
failures. Differentiation between „good“ and „bad“ bonds is generally
given with the preset values. By changing the parameters the user can
adjust the PiQC system according to individual requirements.
Parameters for existing or newly created quality specifications can be
adjusted in operation mode Setup in the sub-group PiQC of the Quality
group. Select the required quality specification from the list and select
Edit.
The description of the individual quality indices are listed in the left half of
the dialog. In the right half, the parameters threshold, tolerance,
sensitivity and weighting can be set.

single
quality value

Figure 20-13: Editing a PiQC quality specification

20.8.1 Threshold
The Threshold parameter only applies to the bond‘s Total Quality Index
of a quality specification and only needs to be defined once for each
quality specification.
The total quality index is calculated from the five individual quality indices
according to the selected calculation specification (mean value, weighted
value, minimum, product).
The range for this parameter lies between 0% and 100%, the standard
setting is 50%.

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 20 Process integrated Quality Control (PiQC)

A bond with a total quality index which lies above the threshold is
accepted by the bonder software. A bond with a total quality index below
the threshold is classed as suspicious. A bond classed as suspicious is
displayed as a red bar in the quality flow (a continuous running bar chart)
in the production monitor. The length of the bar is relative to the value of
the total quality index.

Hint: A high value for the threshold assumes a stable,

optimally set bond process and consistent high
quality of the products used e.g. wire, surface quality,
wedge, programmed bond position etc.

20.8.2 Number of Teach Bonds

The parameter Number of teach bonds describes the number of bonds
which are created during the teaching process for the measurement data.
The value of this parameter must only be defined once for the respective
quality specification.
The range for this parameter lies between 10 and 1500 bonds.

20.8.3 Tolerance
The Tolerance must be set for each individual quality index.
A tolerance range is defined within which an individual quality index has a
value of 100% irrespective of process related deviations from the
reference value. The respective individual quality index is then only
influenced if the deviation of the measurement value from the reference
value is outside this tolerance range.
The range for this parameter lies between 0 and 10. 1,0 is standard.
A high value for this parameter makes the PiQC system more insensitive
towards process related deviations. A lower value makes the PiQC
system more sensitive.

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20 Process integrated Quality Control (PiQC)

sensitivity 50% sensitivity 40% sensitivity 1%

100%

Individual quality indices

0%

sensitivity 100% Process deviation

Tolerance range, tolerance = 1
Optimum bond process = reference process

Figure 20-14: Individual quality indices over (process deviation, sensitivity)

20.8.4 Sensitivity
The Sensitivity parameter must be set for each individual quality index.
The higher the sensitivity, the larger the influence of a deviation from the
reference process on the individual quality index.
The range for this parameter is between 1% and 100%. The standard
setting is 50%.

20.8.5 Weighting
The Weighting parameter must be set for each individual quality index.
This parameter puts an emphasis on an individual quality index in the
calculation of the total quality index as a weighted average. With the
weighting, the impact of this individual quality index is defined for the
calculation of the total quality index. The individual quality index itself is
not influenced.
The range for this parameter is between 0 and 50, 1,0 is the standard
value. The higher the parameter weighting, the higher the influence on
the total quality index.
Special Case: If an individual quality index is given the weighting 0, then
this individual quality index is not taken into account for the calculation of
the total quality index.
This special case applies for all calculation specifications of the total
quality value, mean value, weighted mean, minimum and product.

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 20 Process integrated Quality Control (PiQC)

20.9 Export, Import and Deleting Quality Specifications

With this function, existing quality specifications from one bonder can be
copied to other bonders. Quality specifications which are not required any
more can be deleted.

20.9.1 Exporting Quality Specifications

This function exports all quality specifications on the PiQC to a disk.
During file export, the name of the quality specification, the name of the
individual quality indices and the parameters for the individual quality
indices are written in a file on the disk.
• Place a formatted 3.5“ disk in the main floppy disk drive of the
bonder.
• Enter operation mode Setup. Click the command button PiQC in the
Quality register. The existing quality specifications are displayed in
the list.
• Click the command button Export. All existing quality specifications
are copied to the disk. The export is complete when the control lamp
on the main floppy drive goes off. The disk can be removed from the
disk drive.

Existing
quality specifications

Figure 20-15: Exporting quality specifications

20.9.2 Importing Quality Specifications

With these functions, quality specifications exported from a different
bonder can be transferred to the current bonder.

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20 Process integrated Quality Control (PiQC)

• Insert the disk with the exported quality specifications in the bonder
main floppy drive.
• Go to operation mode Setup. Click the command button PiQC in the
Quality register.
• Click the command button Import. The disk contents are displayed
in a selection window.
• Highlight a quality specification in the list which you wish to import to
the PiQC system.
• Click the command button Import to transfer the highlighted quality
specification.
• Repeat the steps described above to import further quality
specifications to the PiQC system. Only one quality specification can
be imported at a time.
• Click the command button Quit to end the import procedure. The
imported quality specifications are displayed in the PiQC system list
of available quality specifications.
• Click the command button Save.
• Click the command button Back to exit the function Quality PiQC
Setup.

Figure 20-16: Importing quality specifications

20.9.3 Deleting Quality Specifications

With this function, quality specifications which are no longer required can
be deleted from the PiQC system.
• Go to operation mode Setup. Click the command button PiQC in the
Quality register.

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 20 Process integrated Quality Control (PiQC)

• Highlight the quality specification you wish to delete in the list of

available quality specifications.
• Click the command button Delete.
• Answer the security prompt.
Yes: the highlighted quality specification is deleted.
No: The highlighted quality specification remains.
• Click the command button Save.
• Click the command button Back to exit the function Quality PiQC
Setup.

Figure 20-17: Deleting quality specifications

20.10 Update to Version 1.2 - New Functions

The PiQC quality specification parameter dialog has been extended with
two functions. see Figure 20-5: “Edit PiQC quality specification”

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20 Process integrated Quality Control (PiQC)

Previously learned reference data of a quality specification can be

discarded by choosing the „Drop reference data“ option. This function
enables the possibility to reteach a single quality specification while
keeping the other specifications in the bond program untouched. E.g. if
there are two quality specifications for source and destination bonds with
learned reference data and only bond parameters fort he destination
bonds have been changed after the teach procedure, then you can drop
the reference of the destination quality specificatio only. On resumption of
production only for the destination quality specification new reference
data will be recorded and calculated automatically. The quality
specification for the source bonds is maintained and used for quality
calculation even during the teach ohase of the destination bonds.
The second new function in PiQC v1.2 is the so called „Reference data history“.
To activate this function activate the checkbox „Use reference data history“ for a
previously not learned quality specification (empty teach date and Teach score
or after dropping the reference data). After the next teach process the calculated
reference data will be marked as “first reference”. On each following teach
process of the quality specification, e.g.. after a change of the bond tool, the
new calculated reference data are compared to the „first reference“ and a
so called teach score is calculated. The teach score takes values
between 0 and 1 and the closer the value is to 1 the more similar the new
reference data is to the “first reference”. The Teach score is nt intended
to be an „absolute quality indicator“. It is meant to be used as an input for
a statistical process control, e.g. using control charts. Longterm drifts in
production could then be monitored by means of the teach score.
By choosing the option „Drop data and history“ the learned reference
data will be discarded and the „first reference“ tag will be removed. After
the next teach process the the calculated reference data will be tagged
as “first reference” again.

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 20 Process integrated Quality Control (PiQC)

20.11 Bonding with PiQC in Programming Mode

20.11.1 Bonding with PiQC in the „Bond Program“
Function
The bond program can be worked through after selecting the bond
program settings (quality calculation and calculation method), activating
quality specifications in the bond parameters, creating reference data
and adjusting the parameters for the quality specification. The bonder
carries out the programmed wires and the PiQC program calculates the
total quality index for each bond.
The total quality index of the bonds are illustrated in the bond charts
display for every bond [Extras / Bond charts]. If Display PiQC data is
selected, a PiQC radar chart is displayed for the highlighted bond from
the list of bonds.

Radar chart

Total
quality
index

Display PiQC data

Figure 20-18: PiQC Radar chart and total quality index

The individual quality indices of the bonds are displayed by marking a

bond from the list and left clicking the command button Info. The radar
chart for the selected bond is displayed with the individual quality indices,
and the individual quality indices are listed in a table.

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20 Process integrated Quality Control (PiQC)

Figure 20-19: PiQC Radar chart and individual quality indices

20.11.2 Bonding with PiQC in „Manual Bonding“ Mode

In manual bonding, the quality calculation is activated and the calculation
method selected in the settings in the PiQC group. Then the quality
specifications are activated in the bond parameters, the reference data is
created and the parameters adjusted for the quality specifications. The
programmed wires can then be bonded. The bonder carries out the
programmed bonds and the PiQC system calculates the total quality
index for each bond.
The total quality index of the bonds is displayed in the bond charts for
each bond [Extras / Bond charts]. The individual quality indices of the
bonds are displayed by selecting a bond (highlight in the list) and left
clicking the command button Info. A radar chart with the individual quality
indices is displayed and the individual quality indices are displayed as a
table.

20.12 Bonding with PiQC in Production Mode

The bond program can be worked through in production mode after
selecting the bond program settings (quality calculation and calculation
method), activating quality specifications in the bond parameters,
creating reference data and adjusting the parameters for the quality
specification. The bonder carries out the programmed wires and the
PiQC program calculates the total quality index for each bond.
The pre configured screen layout PiQCDE.PRO is used for the
continuously updated display of the total and individual quality indices
during production. The pre configured screen layout PiQC2DE.PRO is
used for the total and individual quality indices and the deformation and
current graphs. This can be loaded in [Administration / Settings /
Production]. Access rights to administration mode are required for this.

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 20 Process integrated Quality Control (PiQC)

After starting automatic and the position definition for the first bond, the
bonder begins working through the bond program and creates the
programmed bonds. The PiQC system calculates the total quality index
for every bond.
The screen layout in production with PiQC is displayed in Figure 20-20:.
Besides the usual graphs for production of the current job (utilization,
etc.), three further displays provide information regarding bond quality
according to source and destination position.
In a Radar Chart, the Individual Quality Indices of the current bond
(blue) and the previous bonds (gray) are displayed. Each axis represents
one of the individual quality indices. A value of 0 corresponds to the
center of the diagram. A „good bond“ which has all individual quality
indices of 100% is displayed as an equal sided pentagon with maximum
expansion. The contours are displaced to the center of the radar chart for
bad bonds. Different bond errors display different contours.
The Total Quality Index Distribution of the last bond is displayed in a
Bar Chart.
The Statistical Control Chart of the Total Quality Index of the last 200
bonds is displayed in a bar diagram. The lowest bar is the last bond.
Bonds whose total quality index lie above the set threshold are displayed
as green bars. Bonds whose total quality index lie below the set threshold
are displayed as red bars.
The wire deformation over time, ultrasonic current over time, the total
quality index and the radar chart without individual quality index can be
viewed for every bond once the production process is stopped in the
menu Extras / Bond Charts. With the command button Info, the radar
chart for the bond, the exact value of the individual quality indices, the
total quality index and the name of the quality specification used can be
displayed.

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20 Process integrated Quality Control (PiQC)

Bar Chart: Total quality index distribution

Radar Chart: Individual quality indices
Statistical Control Chart: Total quality indices of the last 200 bonds
Total quality index of the last bond

Figure 20-20: Production screen with PiQC

20.13 Wedge Exchange

After every wedge exchange, the quality specification used is adjusted to
the new wedge by an automatic activated teach process. The same
number of bonds are taught as for teaching the quality specification. The
reference data is automatically calculated once the used number of teach
bonds is reached.

Hint: The wedge counter must be reset after every wedge

exchange.
[Setup / Calibration / Calibrate Wedge / Wedge
counter]
Changes must be saved.

20.14 Base Signals in PiQC System

The PiQC system (PiQC = Process integrated Quality Control) uses base
signals and derived values for creating the reference data and the
evaluation of the bond in the production process.

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 20 Process integrated Quality Control (PiQC)

The PiQC system uses the following base signals for the evaluation of
the welding process:
• Resonance frequency
• Wire deformation
• Ultrasonic voltage
• Ultrasonic power
• Sensor voltage of the PiQC sensor at the transducer

The following individual quality indices are calculated from these base
signals in the PiQC system:
• Frequency f
• Friction Fr
• Ultrasonic US
• Wedge Wdg
• Wire Wr

From these 5 individual quality indices, the total quality index for the bond
is calculated according to the selected quality specification.
The PiQC system evaluates the same base signals in the fine wire
bonder and the heavy wire bonder and calculates the individual quality
indices from the base signals.

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20 Process integrated Quality Control (PiQC)

20.15 Individual Quality Indices in PiQC System

Ultrasonic voltage PiQC US

Ultrasonic US
Ultrasonic power generator
Wire deformation Wr
US
Sensor voltage Distance amplifier
measurement system

Friction Fr

Frequency f
Transducer

Wedge
Wdg PiQC sensor

Substrate

Figure 20-21: PiQC Measurement values and individual quality indices

20.15.1 Individual Quality Index Frequency f

The individual quality index frequency is calculated from the base signal
resonance frequency, which describes the oscillation behavior of the
complete ultrasonic system.
The resonance frequency of the free oscillating system is defined in
operation mode Setup under the function US Generator. When the
wedge touches down on the surface and effects of the bond process start
to apply the oscillating system is off resonance. The US generator
adjusts the US frequency continuously so the system is always oscillating
in resonance. This frequency adjustment is evaluated.

20.15.2 Individual Quality Index Friction Fr

The individual quality index friction is calculated from the base signal
sensor voltage.
The individual quality index friction describes the friction between the
wedge tip and the bond wire and the bond wire and the substrate surface.

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 20 Process integrated Quality Control (PiQC)

20.15.3 Individual Quality Index Ultrasonic US

The individual quality index ultrasonic is calculated from the base signals
ultrasonic voltage and ultrasonic power.
The PiQC US generator creates an electrical ultrasonic signal which is
amplified by the ultrasonic amplifier and transmitted to the transducer. In
the transducer motor (packet of piezo plates) the electrical ultrasonic
signal is transformed to mechanical oscillation.

20.15.4 Individual Quality Index Wedge Wdg

The individual quality index Wedge is calculated from the base signal
sensor voltage of the PiQC sensor, which describes the oscillation
amplitude of the wedge tip during the bond process.

20.15.5 Individual Quality Index Wire Wr

The wire deformation is determined by the measurement system built in
to the bondhead. The individual quality index wire is calculated from this
sensor signal.

20.16 PiQC Radar Chart

The PiQC system uses the measured data and the reference data and
calculates how well the welding process at the current bond position
corresponds to the reference welding process.
A high individual quality index and a high total quality index suggest a
good comparison between the current welding process and the reference
welding process. Low individual quality indices and a low total quality
index suggest deviations from the reference welding process.
In the PiQC radar chart, the five calculated individual quality indices are
displayed graphically. The individual quality indices of 100% are
displayed at the outermost edge of the chart. Individual quality indices
lower than 100% are displayed further inwards. The minimum individual
quality index, 0%, is displayed in the center of the chart.

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20 Process integrated Quality Control (PiQC)

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 21 Glossary

GLOSSARY
CHAPTER21

A
Accuracy: The accuracy determines the
maximum positioning error of the X
respectiv to the Y axis during the
movement toward the pad.

Auto Teach: With this option the patterns in a

variable tolerance area can be taught
automatically.

B
Bonding Quality: Indicates how good the quality of a
wire is regarding the quality profile
indicated previously.

Borders of Axis Movement: The borders of axis movement are

software borders which cannot be
surpassed by positioning commands.
These borders should be reached just
before the limit switches.

C
Crosshair with Measurement: If the crosshair with measurement is
activated the distances are 10 µm per
scale unit.

D
Deformation Curve: Shows the wire deformation over time.

Delay: The value delay is programmed in

[ms]. This value indicates the waiting
time before switching on the
ultrasonic.

G
Graphics of Machine Utilization: In the graphics of machine
utilization (production screen) it is
shown what percentage of time the

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21 Glossary

machine has been operated in which

mode.

H
Holder: The holder is the area in which the
bond area lies. The limitation refers to
the admissible positioning angle of
the P axis.

L
Lower Tolerance: This indicates the maximum way
which the bondhead travels down
after having reached the expected
touchdown height. This value has to
be adjusted for the variation in the
application.

M
Main Holder: The main holder is the area in which
the machine can bond safely in every
angle.

O
Offbond: Offbonding is necessary to receive a
predetermined tail length. An offbond
should be executed after every
threading process. The offbond
options determine the number
respective tothe position of the
offbond wires.
Overtravel: Overtravel indicates the distance by
which the Z-axis is lowered after the
touchdown signal in order to
compensate wire deformation
Order List: All orders are administered in the
order list.

P
Parameters of the Reference System: Lighting -, search-, height-,
bond -, welding -, loop - and tear-off
parameters are the parameters of the
reference system.

Parking Position: Predefined X Y Z coordinates towards

which the axes can move during
material change.

Position Errors: The position errors indicate the

maximum deviation of the actual
position from the set position.

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 21 Glossary

R
Ramp: The ramp function can be activated in
the welding parameters. With the
ramp function the bondforce and
ultrasonic power are both increased
(or decreased) from the level of the
previous welding phase up to the
level of the actual welding phase. A
ramp function in the first welding
phase will ramp up force from
touchdown force and ultrasonic power
from 0 (zero) to the programmed
values.

Reference Pattern: Is a pattern for the automatic

recognition of the position. This
pattern is taught once (teach
reference systems) and afterwards it
is used in the production by the
pattern recognition to carry out the
automatic adjustment.

Reference Point: Is a point for the manual

determination of the position. This
point is taught once (teach reference
systems) and afterwards it has to be
entered by the user in the production.

Reference System: Position variant areas of a board as

for example the ‘die’ but also the
board itself define a reference
system. The absolute location of a
reference system is determined
before the bonding. This is carried out
fully automatically with the help of the
pattern recognition, if patterns have
been defined. It is carried out
manually if no patterns have been
defined or if they have not been
found. A reference system has to
contain at least one reference point or
one reference pattern. Beside these
values, the parameters of the
reference system are assigned to the
reference system.

S
Safety Area: The safety area is composed of an
„intermediate height“ measure and a
radius. That way a cylinder is defined
around the pad in which the wedge tip
is allowed to move freely without the
danger of collisions.

Search Accuracy: The search accuracy sets the

threshold for accepting a pattern. The
search speed depends on the search

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21 Glossary

accuracy and the size ratio of the

search area and pattern size.

Skip Number: Defines the maximum number of chips

or boards which are allowed to be
skipped by the pattern recognition per
substrate.

S-Shape: If the option S-shape is activated the

direction in which the bondfoot shall
be welded on the pad can be entered
for every pad.

Start Height: This moving height (relative to the

touchdown height) is used when the
bondhead moves towards the source
point of the wire.

T
Tolerance: The tolerance is the maximum
distance between the found reference
patterns compared to the distance
between the patterns during teach
operation.

Touchdown area: The touchdown area indicates the

height from which the bondhead
moves with touchdown velocity.

Touchdown height: This is the height in which the wedge

touches down.

Touchdown velocity: The touchdown velocity is the velocity

of bondhead travel in the touchdown
area and the overtravel area.

Touchdown force: This is the impact force at touchdown.

It can be understood as the force
necessary to trigger the touchdown
sensor.

S
Speed factor: Reduces the speed to a percentage of
the maximum speed. This way the
machine can be slowed down for
better observation of the bond
process.

Step by step mode: In step by step mode the bond

process stops automatically at
different event points. The user can
select freely at which step by step

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 21 Glossary

points shall be stopped. To execute

the next step the STEP button has to
be pressed on the function keyboard.

W
Wire Buffer: In % of the total buffer size the wire
buffer indicates how much wire is
used up before the wire spool motor
conveys more wire.

Working Height: For each X, Y or Pmovement the work

height is targetted by the Z axis. In
this height the bondhead should be
able to move safely in any direction.

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21 Glossary

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 LIST OF FIGURES
CHAPTER0

1 Bondjet BJ820
Figure 1-1: Machine overview ............................................................................... 1-3
Figure 1-2: Bondhead 45° side view ..................................................................... 1-4
Figure 1-3: Bondhead 45° Front view ................................................................... 1-5
Figure 1-4: Bondhead 89° Deep Access ............................................................... 1-5
Figure 1-5: Wire despooling station ...................................................................... 1-6
Figure 1-6: Inspection camera .............................................................................. 1-7
Figure 1-7: Bond position control - angled camera ............................................... 1-8
Figure 1-8: Operating panel .................................................................................. 1-9
Figure 1-9: Alternative: front console .................................................................... 1-9
Figure 1-10: Keypad ............................................................................................ 1-11
Figure 1-11: Trackball ......................................................................................... 1-11
Figure 1-12: User interface ................................................................................. 1-12
Figure 1-13: Main switch ..................................................................................... 1-12
Figure 1-14: Safety circuit switch ........................................................................ 1-13
Figure 1-15: Bonder in closed state .................................................................... 1-14
Figure 1-16: Keyswitch adjustment-mode ........................................................... 1-14
Figure 1-17: E-stop switch .................................................................................. 1-15
Figure 1-18: ESD contact button ......................................................................... 1-15
Figure 1-19: Signal lamp ..................................................................................... 1-16
Figure 1-20: Warning lamp .................................................................................. 1-16
Figure 1-21: Internal interfaces ........................................................................... 1-17
Figure 1-22: Heat shield box and air flow above heated workholder .................. 1-18

2 User Manual
Figure 2-1: Registration plate ................................................................................. 2-3

3 Safety

4 Transport and Storage

Figure 4-1: Transportation locks ............................................................................ 4-2
Figure 4-2: Transportation locks horizontal ............................................................ 4-2
Figure 4-3: Transportation locks - vertical .............................................................. 4-3
Figure 4-4: Bonder transport crate ......................................................................... 4-3
Figure 4-5: Transport crate - front side .................................................................. 4-4
Figure 4-6: Transport crate symbols / notices ........................................................ 4-5
Figure 4-7: Transport crate .................................................................................... 4-5
Figure 4-8: Lifting points ......................................................................................... 4-6
Figure 4-9: Shock watch in service compartment .................................................. 4-7
Figure 4-10: Transport - monitoring system ........................................................... 4-7

5 Installation and Setup

Figure 5-1: Machine placed on the feet .................................................................. 5-2
Figure 5-2: Transport crate front ............................................................................ 5-2

©2013 Hesse GmbH User manual-BJ820-3.77 -1

Figure 5-3: Connectors at the rear of the machine ................................................ 5-4
Figure 5-4: Main switch ON .................................................................................... 5-5
Figure 5-5: A-Mode switch ..................................................................................... 5-5
Figure 5-6: Safety circuit switch ............................................................................. 5-6
Figure 5-7: Start dialog ........................................................................................... 5-6

6 Mechanical Settings
Figure 6-1: Piezos .................................................................................................. 6-2
Figure 6-2: exchanging wedge- wrong way! .......................................................... 6-3
Figure 6-3: exchanging wedge- correct way! ......................................................... 6-3
Figure 6-4: tightening the wedge srew - wrong way ! ............................................. 6-4
Figure 6-5: tightening the wedge srew - correct way ............................................. 6-4
Figure 6-6: Removing wire clamp - wrong way! ..................................................... 6-5
Figure 6-7: Removing wire clamp - correct way! .................................................... 6-5
Figure 6-8: changing clamp position - wrong way! ................................................. 6-6
Figure 6-9: changing clamp position -correct way! ................................................. 6-6
Figure 6-10: clamping screw - wrong adjustment! ................................................. 6-7
Figure 6-11: clamping screw - correct adjustment! ................................................ 6-7
Figure 6-12: wire clamp in a safe place ................................................................. 6-7
Figure 6-13: Clamp setting ..................................................................................... 6-8
Figure 6-14: Setting the side position of the clamp ................................................ 6-9
Figure 6-15: Setting the clamp in the mirror image ................................................ 6-9
Figure 6-16: Setting the wire feed ........................................................................ 6-10
Figure 6-17: Setting the clamp force .................................................................... 6-11
Figure 6-18: Setup dialog for the wire clamp ....................................................... 6-12
Figure 6-19: Mechanical setup of the opening gap of the wire clamp .................. 6-12
Figure 6-20: Threading dialog .............................................................................. 6-13
Figure 6-21: Wire guide ........................................................................................ 6-14
Figure 6-22: Wire path at bondhead .................................................................... 6-14
Figure 6-23: Exchanging the wedge .................................................................... 6-16
Figure 6-24: Distance clamp blade to wedge ....................................................... 6-17
Figure 6-25: Adjustment of clamp blade to wedge ............................................... 6-17
Figure 6-26: Clamp blade height .......................................................................... 6-18
Figure 6-27: Clamp blade angle ........................................................................... 6-19
Figure 6-28: Alignment clamp blade to wedge tool .............................................. 6-19
Figure 6-29: Threading position clamp blade ....................................................... 6-20
Figure 6-30: Wire clamp opening ......................................................................... 6-21
Figure 6-31: Wire clamp force .............................................................................. 6-21
Figure 6-32: Threading ......................................................................................... 6-23
Figure 6-33: Wire feed unit ................................................................................... 6-23
Figure 6-34: Wire sensor ...................................................................................... 6-24
Figure 6-35: Wire sensor, ribbon cover plate ....................................................... 6-25

7 User interface
Figure 7-1: Login screen ........................................................................................ 7-1
Figure 7-2: Program Interface ................................................................................ 7-4
Figure 7-3: Movement and direction of the axes .................................................... 7-7
Figure 7-4: Scroll bar for illumination and zoom ..................................................... 7-7
Figure 7-5: Function buttons .................................................................................. 7-7

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Figure 7-6: Additional dialogs ................................................................................. 7-8
Figure 7-7: Editing box ........................................................................................... 7-8
Figure 7-8: Display keyboard ................................................................................. 7-8
Figure 7-9: Register ............................................................................................... 7-9
Figure 7-10: Color range ........................................................................................ 7-9
Figure 7-11: Threading ......................................................................................... 7-10
Figure 7-12: Offbond ............................................................................................ 7-11
Figure 7-13: Markings .......................................................................................... 7-12
Figure 7-14: View settings .................................................................................... 7-13
Figure 7-15: Crosshair „Inverse“ .......................................................................... 7-13
Figure 7-16: Crosshair alternating ........................................................................ 7-14
Figure 7-17: Factors ............................................................................................. 7-15
Figure 7-18: Logout .............................................................................................. 7-15
Figure 7-19: Bonder Shutdown ............................................................................ 7-16
Figure 7-20: manually initiated axes movement ................................................... 7-19
Figure 7-21: view settings - new .......................................................................... 7-19
Figure 7-22: view settings - “Advanced“ ............................................................... 7-20

8 Calibration
Figure 8-1: Register calibrations - overview ........................................................... 8-2
Figure 8-2: Bondhead camera and bond position camera ..................................... 8-3
Figure 8-3: Inspection camera - “camera 2 - E-Box“ .............................................. 8-3
Figure 8-4: Camera 1 - calibration ......................................................................... 8-4
Figure 8-5: PR parameters for camera calibration ................................................. 8-4
Figure 8-6: Teach focus distance ........................................................................... 8-5
Figure 8-7: Calibrate inspection camera 2 ............................................................. 8-6
Figure 8-8: Calibrate bond position camera 3 ........................................................ 8-7
Figure 8-9: Bond position camera 3 - pixel relation ................................................ 8-7
Figure 8-10: Calibrate bondforce ........................................................................... 8-8
Figure 8-11: Scale for force calibration .................................................................. 8-9
Figure 8-12: Bondforce graph .............................................................................. 8-10
Figure 8-13: Test bondforce ................................................................................. 8-10
Figure 8-14: Calibrate ultrasonic .......................................................................... 8-11
Figure 8-15: Ultrasonic generator settings ........................................................... 8-11
Figure 8-16: Ultrasonic graph (example) .............................................................. 8-12
Figure 8-17: Calibrate wedge ............................................................................... 8-13
Figure 8-18: Calibrate wedge- settings ................................................................ 8-13
Figure 8-19: Wedge calibration (3rd and 4th wire optional) ................................. 8-15
Figure 8-20: Wedge counter ................................................................................ 8-16
Figure 8-21: P axis settings .................................................................................. 8-17
Figure 8-22: Calibrate P axis ................................................................................ 8-18
Figure 8-23: P axis graph -example ..................................................................... 8-19
Figure 8-24: Register wire handling - overview .................................................... 8-19
Figure 8-25: Calibrate wire ................................................................................... 8-20
Figure 8-26: Threading dialog .............................................................................. 8-21
Figure 8-27: Wire - spool parameters .................................................................. 8-21
Figure 8-28: Geometry of source bond ................................................................ 8-22
Figure 8-29: Wire clamp settings ......................................................................... 8-22
Figure 8-30: Calibration/Wire Clamp ................................................................... 8-23

©2013 Hesse GmbH User manual-BJ820-3.77 -3

Figure 8-31: Calibrate offbond - settings .............................................................. 8-24
Figure 8-32: Offbond - dialog ............................................................................... 8-26
Figure 8-33: E Box calibration .............................................................................. 8-27
Figure 8-34: E Box - settings ................................................................................ 8-27
Figure 8-35: Register holder - overview ............................................................... 8-28
Figure 8-36: Load holder ...................................................................................... 8-29
Figure 8-37: Holder type ...................................................................................... 8-29
Figure 8-38: Manual clamping - settings .............................................................. 8-30
Figure 8-39: SMEMA indexer - settings ............................................................... 8-30
Figure 8-40: PLC - settings .................................................................................. 8-31
Figure 8-41: PLC - barcode settings .................................................................... 8-31
Figure 8-42: PLC - program assignment .............................................................. 8-32
Figure 8-43: PLC program ................................................................................... 8-32
Figure 8-44: PLC simulation ................................................................................. 8-33
Figure 8-45: Edit PLC program ............................................................................ 8-33
Figure 8-46: PLC - IO settings ............................................................................. 8-34
Figure 8-47: Profibus - settings ............................................................................ 8-35
Figure 8-48: Wafer holder - settings ..................................................................... 8-35
Figure 8-49: Integrated indexer - settings overview ............................................. 8-36
Figure 8-50: Integrated indexer - load program ................................................... 8-36
Figure 8-51: Integrated indexer - setup ................................................................ 8-37
Figure 8-52: Integrated indexer - parameters - example without heating station . 8-37
Figure 8-53: Integrated indexer - input lift ............................................................ 8-38
Figure 8-54: Register quality - overview ............................................................... 8-39
Figure 8-55: Check counter list ............................................................................ 8-39
Figure 8-56: Setup check counter - example wedge control ................................ 8-40
Figure 8-57: Calibration - dialog deformation/current ........................................... 8-40
Figure 8-58: Edit quality profile - example ............................................................ 8-41
Figure 8-59: Tool cleaning settings ...................................................................... 8-42
Figure 8-60: Offbond settings ............................................................................... 8-44
Figure 8-61: E-Box ............................................................................................... 8-45

9 Programming
Figure 9-1: New program ....................................................................................... 9-2
Figure 9-2: Load program ...................................................................................... 9-3
Figure 9-3: Update focus ........................................................................................ 9-4
Figure 9-4: Program status - not saved .................................................................. 9-4
Figure 9-5: Save bond program ............................................................................. 9-4
Figure 9-6: Program directory ................................................................................ 9-5
Figure 9-7: Program information ............................................................................ 9-6
Figure 9-8: Compare program - example ............................................................... 9-6
Figure 9-9: Compare program - example - not comparable ................................... 9-7
Figure 9-10: Program settings ................................................................................ 9-7
Figure 9-11: Program settings - write protect ......................................................... 9-8
Figure 9-12: Program write protected .................................................................... 9-8
Figure 9-13: Program settings - general ................................................................ 9-8
Figure 9-14: Program settings - large helper pattern ............................................. 9-9
Figure 9-15: Program settings - skip settings ......................................................... 9-9
Figure 9-16: Program settings - adjust settings ................................................... 9-10

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Figure 9-17: Program settings - pre warning ........................................................ 9-10
Figure 9-18: Default settings ................................................................................ 9-11
Figure 9-19: Teach reference system .................................................................. 9-12
Figure 9-20: Color selection editor ....................................................................... 9-13
Figure 9-21: Default PR parameters .................................................................... 9-14
Figure 9-22: Auto functions .................................................................................. 9-14
Figure 9-23: AutoTeach function .......................................................................... 9-15
Figure 9-24: 1. Teach manual point ..................................................................... 9-15
Figure 9-25: Teach manual point - example ........................................................ 9-16
Figure 9-26: Manual point X view - example ........................................................ 9-16
Figure 9-27: PR parameters ................................................................................. 9-17
Figure 9-28: Large search area - example ........................................................... 9-18
Figure 9-29: PR parameters - pattern view .......................................................... 9-19
Figure 9-30: PR parameter - tolerances ............................................................... 9-20
Figure 9-31: Manual adjustment - example .......................................................... 9-21
Figure 9-32: Reference system dependency ....................................................... 9-22
Figure 9-33: Badmark recognition - PR Parameter .............................................. 9-23
Figure 9-34: Badmark recognition - example ....................................................... 9-23
Figure 9-35: Inkdot recognition PR parameter ..................................................... 9-24
Figure 9-36: Inkdot recognition - example ............................................................ 9-24
Figure 9-37: Badmark view - example ................................................................. 9-25
Figure 9-38: Default parameters .......................................................................... 9-25
Figure 9-39: Reference system parameters ......................................................... 9-26
Figure 9-40: Load bond parameters ..................................................................... 9-26
Figure 9-41: Parameter selection ......................................................................... 9-27
Figure 9-42: Reference system parameters - general settings ............................ 9-27
Figure 9-43: Copy parameters ............................................................................. 9-28
Figure 9-44: Selection of parameters to copy ...................................................... 9-29
Figure 9-45: Teach board (example for rotated board) ........................................ 9-30
Figure 9-46: Duplicate chip/board ........................................................................ 9-32
Figure 9-47: Duplicate chip/board methods ......................................................... 9-32
Figure 9-48: Teach wires ..................................................................................... 9-33
Figure 9-49: Auto centering parameters .............................................................. 9-34
Figure 9-50: Leadtip locator- search area auto- example .................................... 9-35
Figure 9-51: Wire color - selection ....................................................................... 9-36
Figure 9-52: Exchange wires - example 1 ............................................................ 9-38
Figure 9-53: Exchange wires - parameter display ................................................ 9-38
Figure 9-54: Exchange wires - example 2 ............................................................ 9-39
Figure 9-55: Exchange wires - parameter display 2 ............................................. 9-39
Figure 9-56: Align wires - application example .................................................... 9-40
Figure 9-57: Align wires - example displacement in X direction ........................... 9-40
Figure 9-58: Align wires - example displacement in Y direction ........................... 9-40
Figure 9-59: Wire alignment dialog ...................................................................... 9-41
Figure 9-60: Insert wires ...................................................................................... 9-42
Figure 9-61: Delete wires ..................................................................................... 9-43
Figure 9-62: Move wires ....................................................................................... 9-43
Figure 9-63: Reference system assignment ........................................................ 9-44
Figure 9-64: Wire parameters .............................................................................. 9-45
Figure 9-65: Program bonding ............................................................................. 9-45
Figure 9-66: Step by step points (Backcut) .......................................................... 9-48

©2013 Hesse GmbH User manual-BJ820-3.77 -5

Figure 9-67: Bondplan - color editor ..................................................................... 9-49
Figure 9-68: Bondplan overview .......................................................................... 9-49
Figure 9-69: Bondplan zoom ................................................................................ 9-50
Figure 9-70: Bondplan zoom 2 ............................................................................. 9-50
Figure 9-71: Bond position control ....................................................................... 9-51
Figure 9-72: Bond chart - deformation - example ................................................ 9-52
Figure 9-73: Bond chart - US Current - example ................................................. 9-53
Figure 9-74: Bond charts - example for PiQC quality values ............................... 9-53
Figure 9-75: Profile directory ................................................................................ 9-54
Figure 9-76: Example - deformation profile .......................................................... 9-55
Figure 9-77: Profiles directory .............................................................................. 9-55
Figure 9-78: Quality control parameters ............................................................... 9-56
Figure 9-79: Load profile ...................................................................................... 9-56
Figure 9-80: Program import ................................................................................ 9-57
Figure 9-81: Restore example .............................................................................. 9-58
Figure 9-82: PR Parameters ................................................................................ 9-59
Figure 9-83: Settings Fine Structure .................................................................... 9-60
Figure 9-84: Settings Closed Contour .................................................................. 9-60
Figure 9-85: Settings Lead Locator ...................................................................... 9-61
Figure 9-86: Settings Corner Detection ................................................................ 9-61
Figure 9-87: Tolerances / Options ........................................................................ 9-62
Figure 9-88: Wire Alignment ................................................................................ 9-63
Figure 9-89: Wiring Diagram ................................................................................ 9-63

10 Manual Bonding
Figure 10-1: Manual bonding ............................................................................... 10-1
Figure 10-2: Manual bonding - Height measurement ........................................... 10-3
Figure 10-3: Manual bonding - settings ................................................................ 10-3
Figure 10-4: Manual bonding - length setting ....................................................... 10-4
Figure 10-5: Manual bonding - bond angle .......................................................... 10-4
Figure 10-6: Bond parameters directory .............................................................. 10-5
Figure 10-7: Edit bond parameters ...................................................................... 10-5

11 Bonding Process
Figure 11-1: Touchdown parameters .................................................................. 11-2
Figure 11-2: Bond parameters ............................................................................ 11-3
Figure 11-3: S-Shape Bonds ............................................................................... 11-3
Figure 11-4: Graphical illustration of the intermediate radius .............................. 11-4
Figure 11-5: Reverse trajectory ........................................................................... 11-5
Figure 11-6: Special case loop shape between -100% und 0% .......................... 11-6
Figure 11-7: Special case loop shape between 100% and 200% ....................... 11-6
Figure 11-8: Loop parameters - illustration of the trajectory ............................... 11-7
Figure 11-9: Loop formation - message - inconclusive parameters .................... 11-7
Figure 11-10: Welding parameters ...................................................................... 11-9
Figure 11-11: Quality control ............................................................................. 11-10
Figure 11-12: Tear off parameters - clamp tear ................................................ 11-11
Figure 11-13: Optional extra movement with clamp tear ................................... 11-12
Figure 11-14: Tear off parameter XY-movement .............................................. 11-12
Figure 11-15: Tear off by XY-movement ........................................................... 11-13

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Figure 11-16: Loop Parameters new ................................................................. 11-16

12 Production
Figure 12-1: Production monitor (default) ............................................................ 12-2
Figure 12-2: Specify position ................................................................................ 12-3
Figure 12-3: Reset height ..................................................................................... 12-4
Figure 12-4: Load Job .......................................................................................... 12-5
Figure 12-5: Create job - example ....................................................................... 12-6
Figure 12-6: Edit job ............................................................................................. 12-6
Figure 12-7: Job data ........................................................................................... 12-7
Figure 12-8: Material change ............................................................................... 12-7
Figure 12-9: Bond Correction Mode ..................................................................... 12-9
Figure 12-10: Readjust pattern mode ................................................................ 12-10
Figure 12-11: Readjust ....................................................................................... 12-11
Figure 12-12: Rebond ........................................................................................ 12-13
Figure 12-13: Logbook example ........................................................................ 12-14
Figure 12-14: Reason for stopping - example .................................................... 12-14
Figure 12-15: Recalibrate ................................................................................... 12-15

13 Administration
Figure 13-1: Create new user ............................................................................. 13-2
Figure 13-2: Edit user .......................................................................................... 13-2
Figure 13-3: Edit user data .................................................................................. 13-3
Figure 13-4: Access rights .................................................................................. 13-3
Figure 13-5: Edit access rights ............................................................................ 13-4
Figure 13-6: Parameter limits .............................................................................. 13-5
Figure 13-7: Program variants - Overview .......................................................... 13-5
Figure 13-8: Program variants - Production ........................................................ 13-6
Figure 13-9: Program variants - Bond parameters .............................................. 13-7
Figure 13-10: Program variants - Heights ........................................................... 13-8
Figure 13-11: Program variants - overtravel 1 .................................................... 13-9
Figure 13-12: Program variants - Overtravel 2 .................................................... 13-9
Figure 13-13: Program variants - Adjustment ................................................... 13-10
Figure 13-14: Program variants - positioning .................................................... 13-11
Figure 13-15: Program variants - Miscellaneous .............................................. 13-11
Figure 13-16: Bond quality settings ................................................................... 13-12
Figure 13-17: Bond quality - bond chart parameters ......................................... 13-13
Figure 13-18: Bond quality - threshold values ................................................... 13-13
Figure 13-19: Checklists ................................................................................... 13-14
Figure 13-20: Checkboxes in checklist ............................................................. 13-14
Figure 13-21: Bond matrix ................................................................................. 13-15
Figure 13-22: SPC properties ........................................................................... 13-15
Figure 13-23: Profibus properties ...................................................................... 13-16
Figure 13-24: PBS 200 Settings ........................................................................ 13-16
Figure 13-25: Logbook properties ..................................................................... 13-17
Figure 13-26: Customer specific downtime reasons ......................................... 13-19
Figure 13-27: RS232 settings ........................................................................... 13-20
Figure 13-28: Shifts ........................................................................................... 13-20
Figure 13-29: Date and Time ............................................................................ 13-21

©2013 Hesse GmbH User manual-BJ820-3.77 -7

Figure 13-30: Lamp tower editor ....................................................................... 13-21
Figure 13-31: Select Language ......................................................................... 13-22
Figure 13-32: Language Editor ......................................................................... 13-22
Figure 13-33: Axes Parameters ........................................................................ 13-23
Figure 13-34: BPG Conversion ......................................................................... 13-24
Figure 13-35: Production screen setup dialog .................................................. 13-25
Figure 13-36: Edit gadgets ................................................................................ 13-26
Figure 13-37: Production screen - preview (example) ...................................... 13-26
Figure 13-38: Production screen - example result ............................................ 13-27
Figure 13-39: Production screen backup prompt .............................................. 13-27
Figure 13-40: Production screen - load file ....................................................... 13-28
Figure 13-41: Production screen - copy file ...................................................... 13-28

14 Pattern Recognition
Figure 14-1: Pad locator ...................................................................................... 14-4
Figure 14-2: Lead locator .................................................................................... 14-5
Figure 14-3: Corner Detection ............................................................................. 14-6
Figure 14-4: Tolerances ...................................................................................... 14-6
Figure 14-5: PR parameter list ............................................................................ 14-7
Figure 14-6: AutoTeach parameters ................................................................... 14-8
Figure 14-7: PR parameter for pattern x ............................................................. 14-8
Figure 14-8: Define alternative pattern ................................................................ 14-9
Figure 14-9: Teach alternatives at different positions ....................................... 14-10
Figure 14-10: Teach alternatives ...................................................................... 14-11
Figure 14-11: Edit alternatives .......................................................................... 14-11
Figure 14-12: PR parameter - view ................................................................... 14-12
Figure 14-13: PR parameter - Badmark ............................................................ 14-13
Figure 14-14: Bad choice of pattern .................................................................. 14-14
Figure 14-15: Good choice of pattern ............................................................... 14-15
Figure 14-16: Closed object: example 1 ........................................................... 14-16
Figure 14-17: Closed object: example 2 ........................................................... 14-16
Figure 14-18: Definition of tolerance in pattern recognition .............................. 14-18

15 Preventive maintenance
Figure 15-1: grease nipple slide carriages (X and Y axes size 15) ..................... 15-3
Figure 15-2: Threading Dialog ............................................................................ 15-4
Figure 15-3: wire feed ......................................................................................... 15-5
Figure 15-4: Pressure air regulator ..................................................................... 15-6
Figure 15-5: wire guide ....................................................................................... 15-7
Figure 15-6: Wire guide tube ............................................................................... 15-7
Figure 15-7: Wire guide tube on deep access bondhead ................................... 15-8
Figure 15-8: Bondhead cover ............................................................................ 15-10
Figure 15-9: Bondhead cable ............................................................................ 15-10
Figure 15-10: Bondhead base plate in transport box ........................................ 15-11
Figure 15-11: Bondhead assembly ................................................................... 15-12

16 Error Messages
17 Technical Data
18 CAD file format

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19 Menu Overview
20 Process integrated Quality Control (PiQC)
Figure 20-1: PiQC system architecture ................................................................ 20-2
Figure 20-2: Program settings for PiQC ............................................................... 20-3
Figure 20-3: Manual bond settings for PiQC ........................................................ 20-4
Figure 20-4: Creating a new PiQC quality specification ....................................... 20-5
Figure 20-5: Edit PiQC quality specification ......................................................... 20-6
Figure 20-6: Creating / loading quality specification ............................................ 20-7
Figure 20-7: Automatic teach mode during production ........................................ 20-9
Figure 20-8: PiQC message - enough reference data ......................................... 20-9
Figure 20-9: PiQC message - not enough reference data ................................. 20-10
Figure 20-10: Warning automatic teach mode during programing ..................... 20-10
Figure 20-11: Start / end PiQC manual teach mode .......................................... 20-11
Figure 20-12: PiQC message - to overwrite existing quality specification ......... 20-11
Figure 20-13: Editing a PiQC quality specification ............................................. 20-12
Figure 20-14: Individual quality indices over (process deviation, sensitivity) ..... 20-14
Figure 20-15: Exporting quality specifications .................................................... 20-15
Figure 20-16: Importing quality specifications .................................................... 20-16
Figure 20-17: Deleting quality specifications ...................................................... 20-17
Figure 20-18: PiQC Radar chart and total quality index ..................................... 20-19
Figure 20-19: PiQC Radar chart and individual quality indices .......................... 20-20
Figure 20-20: Production screen with PiQC ....................................................... 20-22
Figure 20-21: PiQC Measurement values and individual quality indices ........... 20-24

21 Glossary

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