c08049272
c08049272
Overview
HP EliteBook 840 14 inch G9 Notebook PC
Left
Overview
Right
1. Power Button Key 4. Nano Security Lock Slot (Lock sold separately)
2. Audio Combo Jack 5. SIM Card Slot (Optional)
3. SuperSpeed USB Type-A 5Gbps signaling rate 6. Touch Fingerprint Sensor (Select models)
(Charging) (USB 3.2 Gen 1)
Overview
AT A GLANCE
• Preinstalled with Windows 11 versions or FreeDOS
• New premium ultraslim design with precision-crafted all-metal chassis for a premium look and feel
• 12th Generation Intel® Core™ i5, i7 U series and i5, i7 P series Processors up to fourteen-core
• New 16:10 ratio screen reduces the need to scroll by showing more vertical content than 16:9
• Optional ultrabright displays with HP Eye Ease, ambient light and ambient color sensors
• New 5MP camera4 with HP Auto Frame8 allows you around a little without losing viewers’ attention during video calls
• New DDR5 memory and PCI Gen4 SSDs provide fast access to your work.
• Choice of displays:
35.6 cm (14”) diagonal WUXGA IPS Anti-Glare LED-backlit, 250 nits, 45% NTSC
35.6cm (14") diagonal WUXGA IPS Anti-Glare On-Cell LED-backlit touch, 250 nits, 45% NTSC
35.6 cm (14”) diagonal WUXGA IPS Anti-Glare LED-backlit non-touch 400 nits, 100% sRGB with HP Eye Ease
35.6cm (14”) diagonal WUXGA IPS Anti-Glare LED-backlit non-touch, 1000 nits, 100% sRGB with HP Sure View Reflect
with HP Eye Ease
• Redesigned keyboard layout to include easy use of discrete PgUp/Dn, End, and Home keys
• Choose from 38Whr or 51Whr battery options
• HP Wolf Security for Business creates a hardware-enforced, always-on, resilient defense.
• Larger Clickpad surface for easier, more intuitive input
• Connectivity with optional Intel® 5000 5G/WWAN available world-wide, and Thunderbolt™ Docking (Dock sold separately)
• Passed MIL-STD 810H tests1
• Supports fast charging (50% in 30 minutes) with no impact on battery recharge cycles
• Designed to support all HP docking options including the HP Universal Dock G5
1. MIL-STD 810H is not intended to demonstrate fitness of U.S. Department of Defense contract requirements or for military use.
Test results are not a guarantee of future performance under these test conditions. Accidental damage requires an optional HP
Accidental Damage Protection Care Pack.
NOTE: See important legal disclosures for all listed specs in their respective features sections.
Technical Specifications
PRODUCT NAME
HP EliteBook 840 G9 14 inch G9 Notebook PC
OPERATING SYSTEMS
Preinstalled Windows 11 Pro
Windows 11 Pro Education 1
Windows 11 Home – HP recommends Windows 11 Pro for Business1
Windows 11 Home Single Language – HP recommends Windows 11 Pro for Business1
Windows 11 Pro (Windows 11 Enterprise or Windows 10 Enterprise available with a Volume Licensing
Agreement) 1
Windows 11 Pro (preinstalled with Windows 10 Pro Downgrade) 1,2
FreeDOS
1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately
purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows is
automatically updated and enabled. High speed internet and Microsoft account required. ISP fees may apply and additional
requirements may apply over time for updates. See http://www.windows.com.
2. This system is preinstalled with Windows 10 Pro software and also comes with a license for Windows 11 Pro software and
provision for recovery software. You may only use one version of the Windows software at a time. Switching between
versions will require you to uninstall one version and install the other version. You must back up all data (files, photos, etc.)
before uninstalling and installing operating systems to avoid loss of your data.
PROCESSORS
Max Turbo Base
Number Number Intel
L3 Frequency Frequency
Processor 3,4,5,6,7 Cores of of Threads SIPP/vPro®
Cache P- E- P- E-
P-cores E-cores Enterprise
cores cores cores cores
Intel® Core™ i7- 14 6 8 20 24MB 4.8 3.6 1.8 1.3 X
1280P GHz GHz GHz GHz
Intel® Core™ i7- 12 4 8 16 18MB 4.8 3.5 2.2 1.6 X
1270P GHz GHz GHz GHz
Intel® Core™ i7- 12 4 8 16 18MB 4.7 3.4 2.1 1.5
1260P GHz GHz GHz GHz
Intel® Core™ i5- 12 4 8 16 12MB 4.4 3.3 1.7 1.2 X
1250P GHz GHz GHz GHz
Intel® Core™ i5- 12 4 8 16 12MB 4.4 3.3 1.2 1.3
1240P GHz GHz GHz GHz
Intel® Core™ i7- 10 2 8 12 12MB 4.8 3.6 1.8 1.3 X
1265U GHz GHz GHz GHz
Intel® Core™ i7- 10 2 8 12 12MB 4.7 3.5 1.7 1.2
1255U GHz GHz GHz GHz
Intel® Core™ i5- 10 2 8 12 12MB 4.4 3.3 1.2 1.2 X
1245U GHz GHz GHz GHz
Intel® Core™ i5- 10 2 8 12 12MB 4.4 3.3 1.3 0.9
1235U GHz GHz GHz GHz
Technical Specifications
3. Multicore is designed to improve performance of certain software products. Not all customers or software applications
will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application
workload and your hardware and software configurations. Intel’s numbering, branding and/or naming is not a
measurement of higher performance.
4. Processor speed denotes maximum performance mode; processors will run at lower speeds in battery optimization
mode.
5. Intel® Turbo Boost performance varies depending on hardware, software and overall system configuration. See
www.intel.com/technology/turboboost for more information.
6. In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on
products configured with Intel and AMD 7th generation and forward processors or provide any Windows 8 or Windows 7
drivers on http://www.support.hp.com
7. Intel vPro® requires Windows 10 Pro 64 bit or higher, a vPro supported processor, vPro enabled chipset, vPro enabled
wired LAN and/or Wi-Fi 6E WLAN and TPM 2.0. Some functionality requires additional 3rd party software in order to run.
Features of vPro® Essentials and Enterprise vary. See http://intel.com/vpro
CHIPSET
Chipset is integrated with processor
GRAPHICS
Integrated
Intel® Iris® Xᵉ Graphics 8
Supports
Support HD decode, DX12, HDMI 2.0b, HDCP 2.3 9
8. Intel® Iris® Xᵉ Graphics capabilities require system to be configured with Intel® Core™ i5 or i7 processors and dual channel
memory. Intel® Iris® Xᵉ Graphics with Intel® Core™ i5 or 7 processors and single channel memory will only function as UHD
graphics.
9. HDMI cable sold separately
DISPLAY
Non-Touch
35.56 cm (14") diagonal WUXGA Bent, anti-glare UWVA, 250 nits, 45% NTSC for 5MP camera (1920 x 1200) 10,11
35.56 cm (14") diagonal WUXGA Bent, anti-glare UWVA, 250 nits, 45% NTSC for 5MP+IR camera (1920 x 1200) 10,11
35.56 cm (14") diagonal WUXGA Bent, anti-glare UWVA, 250 nits, 45% NTSC for WWAN (1920 x 1200) 10,11
35.56 cm (14") diagonal WUXGA Bent, anti-glare UWVA, 250 nits, 45% NTSC for 5MP camera for WWAN (1920 x 1200) 10,11
35.56 cm (14") diagonal WUXGA Bent, anti-glare UWVA, 250 nits, 45% NTSC for 5MP+IR camera for WWAN (1920 x 1200) 10,11
35.56 cm (14") diagonal WUXGA Bent, anti-glare UWVA eDP1.2, micro-edge, 250 nits, 45% NTSC, Narrow Bezel
(1920 x 1200) 10,11
35.56 cm (14") diagonal WUXGA Bent, Low Blue Light, anti-glare UWVA eDP+PSR, 400 nits, 100% sRGB, Low Power, Ambient
Light Sensor+Ambient Color Sensor for 5MP Camera (1920 x 1200) with HP Eye Ease 10,11
35.56 cm (14") diagonal WUXGA Bent, Low Blue Light, anti-glare UWVA eDP+PSR, 400 nits, 100% sRGB, Low Power, Ambient
Light Sensor+Ambient Color Sensor for 5MP+IR Camera (1920 x 1200) with HP Eye Ease 10,11
35.56 cm (14") diagonal WUXGA Bent, Low Blue Light, anti-glare UWVA eDP+PSR, 400 nits, 100% sRGB, Low Power, Ambient
Light Sensor+Ambient Color Sensor for 5MP+IR Camera for WWAN (1920 x 1200) with HP Eye Ease 10,11
Technical Specifications
35.56 cm (14") diagonal WUXGA Bent, Low Blue Light, anti-glare UWVA eDP1.3+PSR, 1000 nits, 100% sRGB with HP Sure View
Reflect integrated privacy screen, Ambient Light Sensor+Ambient Color Sensor for 5MP camera (1920 x 1200) with HP Eye
Ease 10,11,12,13
35.56 cm (14") diagonal WUXGA Bent, Low Blue Light, anti-glare UWVA eDP1.3+PSR, 1000 nits, 100% sRGB with HP Sure View
Reflect integrated privacy screen, Ambient Light Sensor+Ambient Color Sensor for 5MP+IR camera (1920 x 1200) with HP Eye
Ease 10,11,12,13
35.56 cm (14") diagonal WUXGA Bent, Low Blue Light, anti-glare UWVA eDP1.3+PSR, 1000 nits, 100% sRGB with HP Sure View
Reflect integrated privacy screen, Ambient Light Sensor+Ambient Color Sensor for 5MP+IR camera for WWAN (1920 x 1200)
with HP Eye Ease 10,11,12,13
Touch
35.56 cm (14") diagonal WUXGA Bent, anti-glare UWVA, 250 nits, 45% NTSC for 5MP+IR camera Touch on Panel
(1920 x 1200) 10,11,13
35.56 cm (14") diagonal WUXGA Bent, anti-glare UWVA, 250 nits, 45% NTSC for 5MP+IR camera for WWAN Touch on Panel
(1920 x 1200) 10,11,13
DisplayPort™ 1.4
HDMI 2.0 Support resolution up to 4K @60 Hz 9
Displays support
Supports dual display through the dock
Technical Specifications
STORAGE AND DRIVES
Primary M.2 Storage
2 TB PCIe® Gen4x4 NVMe™ M.2 SSD TLC 14
1 TB PCIe®️ Gen4x4 NVMe™ M.2 SSD TLC 14,15
512 GB PCIe® Gen4x4 NVMe™ M.2 SSD TLC 14
512 GB PCIe® Gen4x4 NVMe™ SED TLC OPAL2 14
512 GB PCIe® NVMe™ Value M.2 SSD 14
256 GB PCIe® Gen4x4 NVMe™ M.2 SSD TLC 14
256 GB PCIe® Gen4x4 NVMe™ SED TLC OPAL2 14
256 GB PCIe® NVMe™ Value M.2 SSD 14
14. For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10 and 11) is reserved for system recovery software.
15. Available only to HK (Hong Kong), TW (Taiwan) and CN (China).
MEMORY
Maximum Memory
64GB DDR5-4800 MT/s 16
Memory
64GB DDR5-4800 MT/s (2x32GB) 16
32GB DDR5-4800 MT/s (2x16GB) 16
32GB DDR5-4800 MT/s (1x32GB) 16
16GB DDR5-4800 MT/s (2x8GB) 16
16GB DDR5-4800 MT/s (1x16GB) 16
8GB DDR5-4800 MT/s (1x8GB) 16
Memory Slots
2 SODIMM
DDR5 SODIMMS, system runs at 4800 MT/s
Supports Dual Channel Memory
16. Due to the non-industry standard nature of some third-party memory modules, we recommend HP branded memory to
ensure compatibility. If you mix memory speeds, the system will perform at the lower memory speed.
NETWORKING/COMMUNICATIONS
WLAN
Intel® AX211 Wi-Fi6E+BT5.3 M.2 160MHz CNVi WLAN vPro Wireless Card17,18,19
Intel® AX211 Wi-Fi6E+BT5.3 M.2 160MHz CNVi WLAN non-vPro Wireless Card 17,19
WWAN
Intel® 5000 5G Solution WWAN 20,21
Intel® XMM 7560 R+ LTE-Advanced Pro WWAN (Cat 16) 20
NFC
Near Field Communication (NFC) module 22
HP Module with NXP NFC Controller NPC300 I2C NCI
Miracast
Technical Specifications
Native Miracast Support 22
17. Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, to function in the 6GHz band. Availability of public wireless access
points limited. Wi-Fi 6E is backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is
supported.
18. For full Intel® vPro™ functionality, Windows, a vPro supported processor, vPro enabled chipset, vPro enabled WLAN card
and discrete TPM 2.0 are required. See https://www.intel.com/content/www/us/en/architecture-and-technology/vpro/vpro-
platform-general.html
19. Wi-Fi 6E is designed to support gigabit data rate when transferring files between two devices connected to the same
router. Requires a wireless router, sold separately, that supports 80MHz and higher channels.
20. WWAN module is an optional feature, requires factory configuration and requires separately purchased service contract.
Check with service provider for coverage and availability in your area. Connection speeds will vary due to location,
environment, network conditions, and other factors. 4G LTE not available on all products, in all regions.
21. Intel 5G module is optional and must be configured at the factory. Module designed for 5G NR NSA (non-standalone)
networks as carriers deploy Evolved-Universal Terrestrial Radio Access New Radio Dual Connectivity (ENDC) with both 100Mhz
of 5G NR and LTE channel bandwidth, using 256QAM 4x4 as defined by 3GPP. Module requires activation and separately
purchased service contract. Check with service provider for coverage and availability in your area. Data connection, upload and
download speeds will vary due to network, location, environment, network conditions, and other factors. Backwards
compatible to 4G LTE and 3G HSPA technologies. 5G module planned to be available in select platforms and select countries,
where carrier supported.
22. Sold separately or as an optional feature.
23. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming.
AUDIO/MULTIMEDIA
Audio
Audio by Bang & Olufsen
2 Integrated stereo speakers
Discrete Amplifiers
Integrated dual array microphone
Speaker Power
1W/8ohm Per speaker
Camera
5 MP camera 22
5 MP+IR camera 22
Sensors
ALS (ambient light sensor)
Magnetometer
Hall Sensor
Gyro
Accelerometer
HP Tamper Lock 24
Technical Specifications
KEYBOARDS/POINTING DEVICES/BUTTONS & FUNCTION KEYS
Keyboard
HP Premium Keyboard, spill resistant, Backlit keyboard and DuraKeys 25
HP Premium Keyboard, spill resistant, Non-Backlit keyboard and DuraKeys
HP Premium Keyboard, spill resistant, Backlit keyboard and DuraKeys Privacy
Pointing Device
Clickpad with multi-touch gesture support, taps enabled as default
Microsoft Precision Touchpad Default Gestures Support
Function Keys
ESC: system information
F1 - Display Switching
F2 - Blank or Privacy
F3 - Brightness Down
F4 - Brightness Up
F5 - Audio Mute
F6 - Volume Down
F7 - Volume Up
F8 - Mic Mute
F9 - Blank or Backlit Toggle
F10 - Insert
F11 - Airplane Mode
F12 - HP Programmable Key
home
end
Power Button (with LED)
delete
Technical Specifications
SOFTWARE AND SECURITY
Software
HP Quick Touch
HP Quick Drop 26
HP Easy Clean 27
HP PC Hardware Diagnostics Windows
myHP
HP Smart Support 28
HP Connection Optimizer
HP Hotkey Support
HP Support Assistant 29
HP Notifications
HP Privacy Settings
HP Power Manager
Buy Microsoft Office (Sold separately)
Manageability Features
HP Image Assistant Gen5 (download)
HP Manageability Integration Kit (download) 30
HP Client Management Script Library (download)
HP Driver Packs (download)
HP Cloud Recovery 31
HP Client Catalog (download)
NOTE: To enhance brightness, level go to the Intel® Graphics Command Center app, click on System and turn off the Display
Power Savings function.
Security Management
HP Wolf Security of Business 32 includes:
HP Sure Click 33
HP Sure Sense 34
HP Sure Run Gen5 35
HP Sure Recover Gen5 36
HP Sure Start Gen7 37
HP Tamper Lock
HP Sure Admin 38
HP Client Security Manager Gen7 39
BIOS
HP BIOSphere Gen6 40
HP Secure Erase 41
Absolute Persistence Module 42
HP DriveLock & Automatic DriveLock
BIOS Update via Network
HP Wake on WLAN
HP Fingerprint Sensor 43
Secured-Core PC Enable 44
TPM 2.0 Embedded Security Chip (Common Criteria EAL4+ Certified) (FIPS 140-2 Level 2 Certified)
Technical Specifications
Security
TPM
Model: Infineon SLB9672VU2.0
Version: 15.21
Revision: TPM 2.0
FIPS 140-2 Compliant: Yes
Smartcard Reader
Model number: Alcor AU9560
FIPS 201 Compliant: Yes
IPv6 Support
Yes
FirstNet Certified
Yes
Is the BIOS on this notebook ISO/IEC 19678:2015 (formerly NIST 800-147) compliant?: Yes
UEFI version: 2.7
Class: 3
26. HP Quick Drop requires Internet access and Windows 10 or higher PC preinstalled with HP QuickDrop app and either an
Android device (phone or tablet) running Android 7 or higher with the Android HP QuickDrop app, and /or an iOS device (phone
or tablet) running iOS 12 or higher with the iOS HP QuickDrop app.
27. HP Easy Clean requires Windows 10 RS3 and higher and will disable the keyboard, touchscreen, and clickpad only. Ports are
not disabled. See user guide for cleaning instructions.
28. HP Smart Support automatically collects the telemetry necessary upon initial boot of the product to deliver device-level
configuration data and health insights and is available preinstalled on select products, thru HP Factory Configuration Services;
or it can be downloaded. For more information about how to enable HP Smart Support or for download, please visit
http://www.hp.com/smart-support.
29. HP Support Assistance requires Windows and Internet Access.
30. HP Manageability Integration Kit can be downloaded from
http://www8.hp.com/us/en/ads/clientmanagement/overview.html.
31. HP Cloud Recovery is available for Z by HP, HP Elite and Pro desktops and laptops PCs with Intel® or AMD processors and
requires an open, wired network connection. NOTE: You must back up important files, data, photos, videos, etc. before use to
avoid loss of data. Detail please refer to: https://support.hp.com/us-en/document/c05115630.
32. HP Wolf Security for Business requires Windows 10 or higher, includes various HP security features and is available on HP
Pro, Elite, RPOS and Workstation products. See product details for included security features and OS requirement.
33. HP Sure Click requires Windows 10 Pro or higher or Enterprise. See https://bit.ly/2PrLT6A_SureClick for complete details.
34. HP Sure Sense is available on select HP PCs with Windows 10 Pro, Windows 10 Enterprise, Windows 11 Pro, or Windows 11
Enterprise OS.
35. HP Sure Run Gen5 is available on select HP PCs and requires Windows 10 and higher.
36. HP Sure Recover Gen5 with Embedded Reimaging is an optional feature which requires Windows 10 and higher must be
configured at purchase. You must back up important files, data, photos, videos, etc. before use to avoid loss of data. Network
based recovery using Wi-Fi is only available on PCs with Intel Wi-Fi Module
37. HP Sure Start Gen7 is available on select HP PCs and requires Windows 10 and higher
38. HP Sure Admin requires Windows 10 or higher, HP BIOS, HP Manageability Integration Kit from
http://www.hp.com/go/clientmanagement and HP Sure Admin Local Access Authenticator smartphone app from the Android
or Apple store.
Technical Specifications
39. HP Client Security Manager Gen7 requires Windows and is available on the select HP Elite and Pro PCs.
40. HP BIOSphere Gen6 features may vary depending on the platform and configuration.
41. HP Secure Erase for the methods outlined in the National Institute of Standards and Technology Special Publication 800-
88 "Clear" sanitation method. HP Secure Erase does not support platforms with Intel® Optane™.
42. Absolute firmware module is shipped turned off and can only be activated with the purchase a license subscription and full
activation of the software agent. License subscriptions can be purchased for terms ranging multiple years. Service is limited,
check with Absolute for availability outside the U.S. Certain conditions apply. For full details visit:
https://www.absolute.com/about/legal/agreements/absolute/.
43. HP Fingerprint sensor is an optional feature that must be configured at purchase.
44. Secured-Core PC Enable requires an Intel® vPro®, AMD Ryzen™ Pro processor or Qualcomm® processor with SD850 or
higher and requires 8 GB or more system memory. Secured-core PC is enabled from the factory.
Technical Specifications
POWER
Power Supply
HP Smart 65 W USB Type-C adapter 45
HP Smart 45 W USB Type-C adapter 45
Battery
HP Long Life 3-cell, 38 Wh Polymer 46,47
HP Long Life 3-cell, 51 Wh Polymer 46,47
Compliant with UL 1642 Standard
Power Cord
3-wire plug - 1m
2-wire plug - 1m
Battery Life
Up to 10 hours (38Whr) 15W 48
Up to 13 hours 30 minutes (51Whr) 28W 48
Up to 14 hours (51Whr) 15W 48
Product Dimensions (W x D x H)
12.42 x 8.82 x 0.76 in
31.56 x 22.405 x 1.92 cm
49. Weight will vary by configuration. Does not include power adapter.
Technical Specifications
PORTS/SLOTS
2 Thunderbolt™ 4 with USB4 Type-C® 40Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4) 50
2 Super Speed USB Type-A 5Gbps signaling rate (1 charging) (USB 3.2 Gen 1)
1 HDMI 2.0 9
1 Headphone/microphone combo jack
1 Nano Security Lock Slot (Lock sold separately)
1 Smartcard reader (Optional)
1 nano SIM card slot
Technical Specifications
SERVICE AND SUPPORT
1-year warranty and 90 day software limited warranty options depending on country. Batteries have a default one year
limited warranty except for HP Long Life batteries which will follow the one or three year warranty of the platform. Refer to
http://www.hp.com/support/batterywarranty/ for additional battery information. On-site service and extended coverage is
also available. HP Care Pack Services are optional extended service contracts that go beyond the standard limited
warranties. To choose the right level of service for your HP product, use the HP Care Pack Services Lookup Tool at:
http://www.hp.com/go/cpc. 51
51. HP Care Packs are sold separately. Service levels and response times for HP Care Packs may vary depending on your
geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit
www.hp.com/go/cpc. HP services are governed by the applicable HP terms and conditions of service provided or indicated to
Customer at the time of purchase. Customer may have additional statutory rights according to applicable local laws, and
such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided with
your HP Product.
Technical Specifications
SYSTEM UNIT
Stand-Alone Power Requirements Type-C Adapter
(AC Power)
Nominal Operating Voltage AC 20V
Average Operating Power
Integrated graphics Yes
Discrete Graphics N/A
Temperature
Operating 32° to 95° F (0° to 35° C)
Non-operating 41° to 95° F (5° to 35° C) (writing optical)
Relative Humidity
Operating 10% to 90%, non-condensing
Non-operating 5% to 95%, 101.6° F (38.7° C) maximum wet bulb temperature
Shock
Operating 40 G, 2 ms, half-sine
Non-operating 200 G, 2 ms, half-sine
Random Vibration
Operating 0.75 grams
Non-operating 1.50 grams
Altitude (unpressurized)
Operating -50 to 10,000 ft (-15.24 to 3,048 m)
Non-operating -50 to 40,000 ft (-15.24 to 12,192 m)
Planned Industry Standard
Certifications
Regulatory Model Number HSN-I45C-4
UL Yes
CSA Yes
FCC Compliance Yes
ENERGY STAR® Certified 52
EPEAT® EPEAT® Gold in the United States 53
ICES Yes
Australia / Yes
NZ A-Tick Compliance Yes
CCC Yes
Japan VCCI Compliance Yes
KC Yes
BSMI Yes
CE Marking Compliance Yes
BNCI or BELUS Yes
CIT Yes
GOST Yes
Saudi Arabian Compliance (ICCP) Yes
SABS Yes
Technical Specifications
52. Configurations of the HP EliteBook 840 G9 that are ENERGY STAR® qualified are identified as HP EliteBook 840 G9 ENERGY
STAR on HP websites and on http://www.energystar.gov.
53. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. EPEAT® status varies by country. Visit
http://www.epeat.net for more information.
DISPLAYS
NOTE: All specifications represent the typical specifications provided by HP's component manufacturers; actual performance may
vary either higher or lower.
1. Actual brightness will be lower with touchscreen or HP Sure View.
14.0 in WUXGA Outline Dimensions (W x H x D) 307.590 x 199.550 (max)
(1920 x 1200) Anti-Glare Active Area 301.590 X 188.500 (typ)
UWVA LED NTSC NB2X 250
Weight 300 (max)
eDP 1.2 w/o PSR 45 bent
LCD Panel Diagonal Size 14
Thickness 3.0 / 5.0 (max)
Interface eDP 1.2
Surface Treatment Anti-Glare
Touch Enabled No
Contrast Ratio 1000:1(typ)
Refresh Rate 60 Hz
Brightness 250 nits
Pixel Resolution - Format 1920 x 1200 (WUXGA)
Backlight WLED
Pixel Resolution RGB
Color Gamut Coverage NTSC 45%
Color Depth 8 bits
Viewing Angle UWVA 89/89/89/89
Low Blue Light No
Power Consumption (W, EBL@ 2.20 (max) / 2.70 (max)
150nits max/ 200nits max)
Technical Specifications
Color Gamut Coverage NTSC 45%
Color Depth 8 bits
Viewing Angle UWVA 89/89/89/89
Low Blue Light No
Power Consumption (W, EBL@ 2.10 (max) / 2.60 (max)
150nits max/ 200nits max)
Technical Specifications
Viewing Angle UWVA 85/85/85/85
Low Blue Light Yes
Power Consumption (W, EBL@
150nits max/ 200nits max) N/A
Technical Specifications
STORAGE AND DRIVES
For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows 10 and 11)
is reserved for system recovery software.
Technical Specifications
Logical Blocks 2,000,409,264
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features Pyrite 2.0; TRIM; L1.2
Technical Specifications
Maximum Sequential Write 3500 MB/s ±20%
Logical Blocks 1,000,215,215
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features TCG Opal 2.0; TRIM; L1.2
Technical Specifications
SSD 1 TB 2280 PCIe NVMe Form Factor M.2 2280
Value1 Capacity 1TB
NAND Type TLC
Interface PCIe NVMe Gen4X4
Maximum Sequential Read Up to 3200 MB/s ±20%
Maximum Sequential Write Up to 2700 MB/s ±20%
Logical Blocks 2,000,409,264
Features Pyrite 2.0; TRIM; L1.2
1. Available only to HK (Hong Kong), TW (Taiwan) and CN (China).
Technical Specifications
NETWORKING/COMMUNICATIONS
Intel® AX211 Wi-Fi 6E + Wireless LAN Standards IEEE 802.11a
Bluetooth® 5.3 M.2 IEEE 802.11b
160MHz CNVi WLAN IEEE 802.11g
IEEE 802.11n
vPro® Wireless Card1
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified
Frequency Band •802.11b/g/n/ax
2.402 – 2.482 GHz
•802.11a/n/ac/ax
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
5.955 – 6.415 GHz
6.435 – 6.515 GHz
6.535 – 6.875 GHz
6.895 – 7.115 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac : 1733Mbps
• 802.11ax : max 2.4Gbps
Modulation Direct Sequence Spread Spectrum
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security2 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• WPA3 certification
• IEEE 802.11i
• WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power3 • 802.11b : +17dBm minimum
• 802.11g : +16dBm minimum
• 802.11a : +17dBm minimum
• 802.11n HT20(2.4GHz) : +14dBm minimum
• 802.11n HT40(2.4GHz) : +13dBm minimum
Technical Specifications
• 802.11n HT20(5GHz) : +14dBm minimum
• 802.11n HT40(5GHz) : +13dBm minimum
• 802.11ac VHT80(5GHz) : +10dBm minimum
• 802.11ac VHT160(5GHz) : +10dBm minimum
• 802.11ax HE40(2.4GHz) : +12dBm minimum
• 802.11ax HE80(5GHz) : +10dBm minimum
• 802.11ax HE160(5GHz) : +10dBm minimum
Power Consumption • Transmit mode 2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
4
Receiver Sensitivity • 802.11b, 1Mbps : -93.5dBm maximum
• 802.11b, 11Mbps : -84dBm maximum
• 802.11a/g, 6Mbps : -86dBm maximum
• 802.11a/g, 54Mbps : -72dBm maximum
• 802.11n, MCS07 : -67dBm maximum
• 802.11n, MCS15 : -64dBm maximum
• 802.11ac, MCS0(VHT80) : -84dBm maximum
• 802.11ac, MCS9(VHT80) : -59dBm maximum
• 802.11ac, MCS9(VHT160) : -58.5dBm maximum
• 802.11ax, MCS11(HE40): -57dBm maximum
• 802.11ax, MCS11(HE80): -54dBm maximum
• 802.11ax, MCS11(HE160): -53.5dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions 1. Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight 1. Type 2230 : 2.8g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED White – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2/5.3 Wireless Card
Bluetooth Specification 4.0/4.1/4.2/5.0/5.1/5.2/5.3 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Legacy : 0~79 (1 MHz/CH)
Channels BLE : 0~39 (2 MHz/CH)
Data Rates and Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps
Throughput BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels
Technical Specifications
Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 9.5 dBm for BR and EDR.
Power Consumption Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Bluetooth Software Microsoft Windows Bluetooth Software
Supported
Link Topology
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth Profiles BT4.1-ESR 5/6/7 Compliance
Supported LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
BT5.2
ESR9/10 Compliance
LE Advertisement Extensions
Channel Selection Algo
Limited High Duty Cycle Non-Connectable Advertising
2Mbps LE
LE Long Range
1. Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, to function in the 6GHz band. Availability of public wireless access points
limited. Wi-Fi 6E is backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is supported. Wi-Fi 6E
is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a
wireless router, sold separately, that supports 80MHz and higher channels.
2. Check latest software/driver release for updates on supported security features.
3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for
802.11a/g (OFDM modulation).
Technical Specifications
Intel® AX211 Wi-Fi 6E + Wireless LAN Standards IEEE 802.11a
Bluetooth® 5.3 M.2 IEEE 802.11b
160MHz CNVi WLAN non- IEEE 802.11g
IEEE 802.11n
vPro® Wireless Card1
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified
Frequency Band •802.11b/g/n/ax
2.402 – 2.482 GHz
•802.11a/n/ac/ax
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
5.955 – 6.415 GHz
6.435 – 6.515 GHz
6.535 – 6.875 GHz
6.895 – 7.115 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac : 1733Mbps
• 802.11ax : max 2.4Gbps
Modulation Direct Sequence Spread Spectrum
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security2 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• WPA3 certification
• IEEE 802.11i
• WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power3 • 802.11b : +17dBm minimum
• 802.11g : +16dBm minimum
• 802.11a : +17dBm minimum
• 802.11n HT20(2.4GHz) : +14dBm minimum
• 802.11n HT40(2.4GHz) : +13dBm minimum
• 802.11n HT20(5GHz) : +14dBm minimum
• 802.11n HT40(5GHz) : +13dBm minimum
Technical Specifications
• 802.11ac VHT80(5GHz) : +10dBm minimum
• 802.11ac VHT160(5GHz) : +10dBm minimum
• 802.11ax HE40(2.4GHz) : +12dBm minimum
• 802.11ax HE80(5GHz) : +10dBm minimum
• 802.11ax HE160(5GHz) : +10dBm minimum
Power Consumption • Transmit mode 2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
4
Receiver Sensitivity • 802.11b, 1Mbps : -93.5dBm maximum
• 802.11b, 11Mbps : -84dBm maximum
• 802.11a/g, 6Mbps : -86dBm maximum
• 802.11a/g, 54Mbps : -72dBm maximum
• 802.11n, MCS07 : -67dBm maximum
• 802.11n, MCS15 : -64dBm maximum
• 802.11ac, MCS0(VHT80) : -84dBm maximum
• 802.11ac, MCS9(VHT80) : -59dBm maximum
• 802.11ac, MCS9(VHT160) : -58.5dBm maximum
• 802.11ax, MCS11(HE40): -57dBm maximum
• 802.11ax, MCS11(HE80): -54dBm maximum
• 802.11ax, MCS11(HE160): -53.5dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
Weight 1. Type 2230: 2.8g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber Radio OFF; LED Off – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2/5.3 Wireless Card
Bluetooth Specification 4.0/4.1/4.2/5.0/5.1/5.2/5.3 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Legacy: 0~79 (1 MHz/CH)
Channels BLE: 0~39 (2 MHz/CH)
Data Rates and Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
Throughput BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Technical Specifications
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 9.5 dBm for BR and EDR.
Power Consumption Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Bluetooth Software Microsoft Windows Bluetooth Software
Supported
Link Topology
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth Profiles BT4.1-ESR 5/6/7 Compliance
Supported LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
BT5.2
ESR9/10 Compliance
LE Advertisement Extensions
Channel Selection Algo
Limited High Duty Cycle Non-Connectable Advertising
2Mbps LE
LE Long Range
1. Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, to function in the 6GHz band. Availability of public wireless access points
limited. Wi-Fi 6E is backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is supported. Wi-Fi 6E
is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a
wireless router, sold separately, that supports 80MHz and higher channels.
2. Check latest software/driver release for updates on supported security features.
3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for
802.11a/g (OFDM modulation).
Technical Specifications
Intel® 5G Solution 50001 Technology/Operating WCDMA/HSPA+ operating bands:
bands Band 1: 1920 to 1980 MHz (UL), 2110 to 2170 MHz (DL)
Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL)
Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL)
Band 5: 824 to 849 MHz (UL), 869 to 894 MHz (DL)
Band 8: 880 to 915 MHz (UL), 925 to 960 MHz (DL)
LTE FDD/TDD operating bands:
Band 1: 1920 to 1980 MHz (UL), 2110 to 2170 MHz (DL)
Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL)
Band 3: 1710 to 1785 MHz (UL), 1805 to 1880 MHz (DL)
Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL)
Band 5: 824 to 849 MHz (UL), 869 to 894 MHz (DL)
Band 7: 2500 to 2570 MHz (UL), 2620 to 2690 MHz (DL)
Band 8: 880 to 915 MHz (UL), 925 to 960 MHz (DL)
Band 12: 699 to 716 MHz (UL), 729 to 746 MHz (DL)
Band 13: 777 to 787 MHz (UL), 746 to 756 MHz (DL)
Band 14: 788 to 798 MHz (UL), 758 to 768 MHz (DL)
Band 17: 704 to 716 MHz (UL), 734 to 746 MHz (DL)
Band 18: 815 to 830 MHz (UL), 860 to 875 MHz (DL)
Band 19: 830 to 845 MHz (UL), 875 to 890 MHz (DL)
Band 20: 832 to 862 MHz (UL), 791 to 821 MHz (DL)
Band 25: 1850 to 1915 MHz (UL), 1930 to 1995 MHz (DL)
Band 26: 814 to 849 MHz (UL), 859 to 894 MHz (DL)
Band 28: 703 to 748 MHz (UL), 758 to 803 MHz (DL)
Band 29: 717 to 728 MHz (DL)
Band 30: 2305 to 2315 MHz (UL) 2350 to 2360 MHz (DL)
Band 32: 1452 to 1496 MHz (DL)
Band 34: 2010 to 2025 MHz (UL/DL)
Band 38: 2570 to 2620 MHz (UL/DL)
Band 39: 1880 to 1920 MHz (UL/DL)
Band 40: 2300 to 2400 MHz (UL/DL)
Band 41: 2496 to 2690 MHz (UL/DL)
Band 42: 3400 to 3600 MHZ (UL/DL)
Band 43: 3400 to 3800 MHZ (UL/DL)
Band 46: 5150 to 5925 MHZ (DL)
Band 48: 3550 to 3700 MHZ (UL/DL)
Band 66: 1710 to 1800 MHz (UL), 2110 to 2200 MHz (DL)
Band 71: 663 to 698 MHz (UL), 617 to 652 MHz (DL)
5GNR Sub 6GHZ
n1: 1920 to 1980 MHz (UL), 2110 to 2170 MHz (DL)
n2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL)
n3: 1710 to 1785 MHz (UL), 1805 to 1880 MHz (DL)
n5: 824 to 849 MHz (UL), 869 to 894 MHz (DL)
n7: 2500 to 2570 MHz (UL), 2620 to 2690 MHz (DL)
n8: 880 to 915 MHz (UL), 925 to 960 MHz (DL)
n20: 832 to 862 MHz (UL), 791 to 821 MHz (DL)
n25: 1850 to 1915 MHz (UL), 1930 to 1995 MHz (DL)
n28: 703 to 748 MHz (UL), 758 to 803 MHz (DL)
n38: 2570 to 2620 MHz (UL/DL)
n40: 2300 to 2400 MHz (UL/DL)
n41: 2496 to 2690 MHz (UL/DL)
n48: 3550 to 3700 MHZ (UL/DL)
n66: 1710 to 1800 MHz (UL), 2110 to 2200 MHz (DL)
n71: 663 to 698 MHz (UL), 617 to 652 MHz (DL)
n77: 3300 to 4200 MHz (UL/DL)
n78: 3300 to 3800 MHz (UL/DL)
n79: 4400 to 5000 MHz (UL/DL)
Technical Specifications
Wireless protocol standards 5GNR Air Interface
3GPP Rel15 5G NR sub-6
LTE Rel14
20 layers and 2 Gbps downlink (DL) throughput – 4 × 4 MIMO across
5x CA
200 Mbps/uplink (UL) throughput – 40 MHz ULCA and 256 QAM
WCDMA R99,
3GPP Release 5, 6, 7 and 8 UMTS Specification
Technical Specifications
Intel® XMM™ 7560 R+ Technology/Operating FDD LTE: 2100 (Band 1), 1900 (Band 2), 1800 (Band 3),
LTE-Advanced Pro1 bands 1700/2100 (Band 4), 850 (Band 5), 2600 (Band 7), 900 (Band 8), 700
(Band 12 lower), 700 (Band 13 upper), 700 (Band 14 upper), 700 (Band
17 lower), 850 (Band 18 lower), 850 (Band 19 upper), 800 (Band 20),
1900 (Band 25), 850 (Band 26), 700 (Band 28), 700 (Band 29 RX only),
2300 (Band 30), 1700/2100 (Band 66), 600 (band 71).
TDD LTE: 2100 (Band 34), 2600 (Band 38), 1900 (Band 39), 2400 (Band
40), 2500 (Band 41), 3500 (Band 42), 3700 (Band 43), 3700 (band 48),
5200 (Band 46 RX only) MHz;
HSPA+: 2100 (Band 1), 1900 (Band 2), 1700/2100 (Band 4),
850 (Band 5), 900 (Band 8) MHz
Wireless protocol 3GPP Release 12 LTE Specification DL-CAT.16, DL 100MHz BW
standards throughput up to 978Mbps; UL-CAT.13 40MHz throughput up to
150Mbps
WCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification
GPS Standalone GPS/Beidou/Glonass, A-GPS (MS-A, MS-B)
GPS bands 1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz, Beidou 1561.098
MHz
Maximum data rates LTE: 978 Mbps (Download), 150 Mbps (Upload)
DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)
Maximum output power LTE: 23 dBm in all band except B41
LTE B41 HPUE = 26dBm
HSPA+: 23.5 dBm
Maximum power LTE: 1,200 mA (peak); 900 mA (average)
consumption HSPA+: 1,100 mA (peak); 800 mA (average)
Form Factor M.2, 3042-S3 Key B
Weight 6g
Dimensions 42 x 30 x 2.3 mm
(Length x Width x
Thickness)
eSIM Support
1. Mobile Broadband is an optional feature, Connection requires wireless data service contract, network support, and is not
available in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due to
location, environment, network conditions, and other factors. 4G LTE is not available on all products, in all regions.
Technical Specifications
Near Field Dimensions (L x W x H) Module 25 mm by 10 mm by 2.0 mm
Communications Chipset NPC100
Controller (optional)
System interface I2C
NFC RF standards ISO/IEC 14443 A
ISO/IEC 14443 B
ISO/IEC 15693
ISO/IEC 18092
ECMA-340 NFCIP-1 Target and Initiator
ECMA-320 NFCIP-2
NFC Forum Support Tag Type 1, Type 2, Type3 and Type 4, NFCIP-1 and NFCIP-2
Reader (PCD-VCD) ISO/IEC 14443 A
Mode ISO/IEC 14443 B
ISO/IEC 15693
MIFARE 1K
MIFARE 4K
MIFARE DESFire
FeliCa
Jewel and Topaz cards
Card Emulation (PICC- ISO/IEC 14443 A
VICC) Mode ISO/IEC 14443 B and B’
MIFARE
FeliCa
Frequency 13.56 MHz
NFC Modes Supported Reader/Writer, Peer-to-Peer
Raw RF Data Rates 106, 212, 424, 848 kbps
Operating temperature 0°C to 70°C
Storage temperature -20°C to 125°C
Humidity 10-90% operating
5-95% non-operating
Supply Operating voltage 4.35 to 5.25 Volts
I/O Voltage 1.8V or 3.3V
Power Consumption
(Booster enable, VBAT=
3.3V, VCC_BOOST = 5V)
Mode Power Consumption, Typical
Polling 7.3 mA
Detected Test Tag Type 1 Total 283.8 mA
Net Module 236.8 mA
Detected Test Tag Type 2 Total 288.8 mA
Net Module 241.8 mA
Detected Test Tag Type 3 Total 287.7 mA
Net Module 240.7 mA
Detected Test Tag Type 4 Total 282.3 mA
Net Module 235.3 mA
Antenna Antenna connector, 0.5mm pitch, 7 connector FPC. Antenna matching is
external to module.
Technical Specifications
POWER
1. Actual battery Watt-hours (Wh) will vary from design capacity. Battery capacity will naturally decrease with shelf life, time,
usage, environment, temperature, system configuration, loaded apps, features, power management settings and other factors
AC Adapter 45 Watt nPFC Dimensions (H x W x D) 94.0mm x 40.0mm x 26.5mm
Standard USB type C Weight 192.5g +/-10%
Straight 1.8m
Input Input Efficiency Average Efficiency of 25%, 50%, 75%, 100%
load condition with 115Vac/230Vac Spec:
5V : 81.5%
9V : 86.7%
12V : 87.41%
15V : 87.8%
Input frequency range 47 ~ 63Hz
Input AC current Max. 1.4 A at 90 Vac
Output Output power 5V/15W
9V/27W
12V/36W
15V/45W
DC output 5V/9V/12V/15V
Hold-up time 5ms at 115 Vac input
Output current limit <5.0A
Connector C6
Environmental Design Operating 32°F to 95°F (0° to 35°C)
temperature
Technical Specifications
Output Output power 65W
DC output 5V/9V/12V/15V/20V
Hold-up time 5ms at 115 Vac input
Output current limit <8.0A
Connector C6
Environmental Design Operating 32°F to 95°F (0° to 35°C)
temperature
Technical Specifications
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
EMI and Safety Eg:
Certifications *CE Mark - full compliance with LVD and EMC directives
* Worldwide safety standards - IEC60950-1 and/or IEC62368-1,
EN60950-1 and/or EN62368-1, UL60950-1 and/or UL62368-1, Class1,
SELV;
Agency approvals - C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC
Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
* MTBF - over 200,000 hours at 25°C ambient condition.
HP 3-cell Long Life Li-Ion Dimensions (H x W x D) 251.8 x 66.1 x 6.82mm (9.91 x 2.6 x 0.27 inch)
(38 Wh)1
Weight 0.184kg +/- 10g(0.406lb)
Cells/Type 3cell Lithium-Ion Polymer cell / 564975
Energy Voltage 11.58V
Amp-hour capacity 3.283Ah
Watt-hour capacity1 38Wh
Temperature Operating (Charging) 32˚ to 113˚ F (0˚ to 45˚ C)
Operating (Discharging) 14˚ to 140˚ F (-10˚ to 60˚ C)
Fuel Gauge LED NA
Warranty Follow product spec
Optional Travel Battery No
Available
Technical Specifications
AUDIO
HD Stereo Codec Realtek ALC3315
Audio I/O Ports Headset: CTIA only and Headphone-out
Internal Speaker Amplifier Cirrus Logic High-Efficiency Boosted Class D Amplifier
Multi-streaming Capable Playback multi-streaming can be enabled in the audio control panel to allow independent audio.
Following MSFT Behaviour
Sampling DAC: 44.1k/48kHz
ADC: 48kHz
Wavetable Syntheses
Analog Audio Support 3.5mm Headset: CTIA only and Headphone-out
# of Channels on Line-Out
Internal Speaker Yes
FINGERPRINT READER
Sensor vendor Main source : Synaptics FS7605
2nd source : ELAN 80SW
Sensor type Capacitive
DPI resolution Main source : 363 DPI
2nd source : 508 DPI
Scan area Main source : 7.4x6mm sensor area
2nd source : 80x80 pixels
False Rejection Rate Main source: <1%
2nd source : FRR=≤ 3%
False Acceptance Rate Main source : FAR 1:50K FAR
2nd source : < 0.001%
Mobile Voltage Operation Main source : 3.0V to 3.6V
2nd source : 2.7V~3.6V
Operating Temperature Main source : 0°C~60°C
2nd source : -20°C - +80°C
Current Consumption Main source : 100mA max
Image 2nd source : 35mA peak
Low Latency Wait For Main source : 260uA
Finger 2nd source : 300uA
Capture Rate Main source:<30msec per image
2nd source : 50 frame/sec
ESD Resistance IEC 61000-4-2 4B (+15KV)
Detection Matrix Main source : 363 dpi / 7.4x6mm sensor area
2nd source : 508 dpi / 4x4mm sensor area
Technical Specifications
ENVIRONMENTA DATA
Eco-Label Certifications & This product has received or is in the process of being certified to the following approvals and may
declarations be labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT Gold registered in the United States. See http://www.epeat.net for registration
status in your country.
• TCO Certified
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label*
Sustainable Impact • Ocean-bound plastic in Speaker
Specifications • 60% post-consumer recycled plastic
• Low halogen
• Outside Box and corrugated cushions are 100% sustainably sourced and recyclable
• Molded Paper Pulp Cushion inside box is 100% sustainably sourced and recyclable
• Bulk packaging available
System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Notebook model is based on a “Typically Configured Notebook”.
Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation (Sort
idle) 5.88 W 6.17 W 5.92 W
Normal Operation (Long
idle) 1.66 W 1.85 W 1.76 W
Sleep 1.66 W 1.85 W 1.76 W
Off 0.46 W 0.48 W 0.41 W
NOTE:
Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model
family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S.
Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model
family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is
for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a
Microsoft Windows® operating system.
*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is
attained for one hour.
Technical Specifications
Typically Configured – Idle 2.9 21.6
Fixed Disk – Random writes 3.6 28.5
Optical Drive – Sequential 4.1 33.2
reads
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the
Spare parts are available throughout the warranty period and or for up to “5” years after the end of
production.
Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS)
directive - 2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe
Drinking Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680 (EPEAT) standard at the Gold level, see
www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and
ISO1043.
• This product is 95.4% recycle-able when properly disposed of at end of life.
Material Usage This product does not contain any of the following substances in excess of regulatory limits (refer
to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
Technical Specifications
• Chlorinated Paraffins
• Bis(2-Ethylhexyl) phthalate (DEHP)
• Benzyl butyl phthalate (BBP)
• Dibutyl phthalate (DBP)
• Diisobutyl phthalate (DIBP)
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently
handled or carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has
been voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in
packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management HP offers end-of-life HP product return and recycling programs in many geographic areas. To
and Recycling recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest
HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for
each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers.
These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.
HP, Inc. Corporate For more information about HP’s commitment to the environment:
Environmental
Information Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
Technical Specifications
footnotes • Percentage of ocean-bound plastic contained in each component varies by product
• Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018
standard.
• External power supplies, WWAN modules, power cords, cables and peripherals excluded.
• 100% outer box packaging and corrugated cushions made from sustainably sourced
certified and recycled fibers.
• Fiber cushions made from 100% recycled wood fiber and organic materials.
COUNTRY OF ORIGIN
China
Options and Accessories (Sold separately and availability may vary by country)
DOCKING (Sold Separately)
Docking station model #1 HP Thunderbolt Dock G2
Total number of supported displays
4
(incl. the notebook display)
Max. resolutions supported Dual 4K @30Hz or dual 4K UHD @ 60Hz is supported
Single 8K@ 30Hz (multiple tiles) for Thunderbolt hosts
Non-TBT hosts DP 1.4 in high res mode (1) 8K video single cable@30Hz [10]
Dock Connectors 2xDP, 1xVGA, 1xTB, 1xUSB-C alt-mode
Technical limitations Thunderbolt Hosts:
Maximum of (4) displays with maximum resolution of 5K@ 30Hz running
Thunderbolt host.
Max resolution possible is dual 8K displays @ 60Hz running Thunderbolt host
or running a non-Thunderbolt host in High Resolution mode @30Hz
Non-Thunderbolt hosts:
The highest resolution for dual displays running a non-Thunderbolt host in
multi-function mode is
(1) 5K dual cable (using both DP ports) +(1) 4K on USB-C DP port
Non-Thunderbolt hosts support (3) displays with a max resolution of: (2) 5K
single cable + (1) 4K UHD @ 60 Hz in high resolution mode. In multi-function
mode the maximum resolution for (3) displays is (2) 5K single cable @ 30Hz +
(1) 4K UHD @ 30Hz.
Options and Accessories (Sold separately and availability may vary by country)
Dual 8K single cable@30 for TB hosts or USB-C hosts DP 1.4 with DSC in high
res mode
Dock Connectors 2xDP, 1xHDMI, 1xTB, 1xUSB-C Alt Mode
Technical limitations Maximum resolution and display support is dependent on the maximum
capability of the notebook.
Thunderbolt Hosts:
Maximum of (4) displays with maximum resolution of 5K@ 30Hz running
Thunderbolt host.
Maximum resolution possible is dual 8K displays @ 60Hz running Thunderbolt
host or running a non-Thunderbolt host in high resolution mode @30Hz
Non-Thunderbolt hosts:
The highest resolution for dual displays running a non-Thunderbolt host in
multifunction mode is (1) 5K dual cable (using both DP ports) +(1) 4K on USB-C
DP port
Non-Thunderbolt hosts support (3) displays with a maximum resolution of (2)
5K single cable + (1) 4K UHD @ 60 Hz in high resolution mode. In multi-
function mode the maximum resolution for (3) displays is (2) 5K single cable
@ 30Hz + (1) 4K UHD @ 30Hz.
Options and Accessories (Sold separately and availability may vary by country)
Type Description Part Number
Audio/Video HP Wired USB-A Stereo Headset 428K6AA
HP Wired 3.5mm Stereo Headset 428K7AA
Options and Accessories (Sold separately and availability may vary by country)
HP 655 Wireless Keyboard and Mouse Combo 4R009AA
HP 225 Wired Mouse and Keyboard Combo 286J4AA
HP 235 Wireless Mouse and Keyboard Combo 1Y4D0AA
HP Slim Wireless Keyboard and Mouse T6L04AA
HP Wired Desktop 320MK Mouse and Keyboard 9SR36AA
HP Wireless Rechargeable 950MK Mouse and Keyboard 3M165AA
Change Log
Date of change: Version History: Description of change:
June 10, 2022 V1 to V2 Updated Function Keys section; added note in Manageability feature
September 7, 2022 V2 to V3 Removed Tile App
September 30, 2022 V3 to V4 Updated Product weight section
October 19, 2022 V4 to V5 Updated Bluetooth version
December 7, 2022 V5 to V6 Updated Windows OS
January 3, 2023 V6 to V7 Updated At a Glance section MIL-STD testing
January 20, 2023 V7 to V8 Updated Operating Systems
February 6, 2023 V8 to V9 Updated eSim support on Intel 5000 5G Solution, added Thunderbolt Dock G4
March 2, 2023 V9 to V10 Updated Networking and communication section
April 6, 2023 V10 to V11 Updated DisplayPort TM in Display section
May 18, 2023 V11 to V12 Updated Storage and Drives section
August 25, 2023 V12 to V13 Updated Intel® 5G Solution 5000 disclaimer
February 20, 2024 V13 to V14 Added Fingerprint Reader Section
April 26, 2024 V14 to V15 Update MT/s units to memory speeds
© Copyright 2024 HP Development Company, L.P. The information contained herein is subject to change without notice. The only
warranties for HP products and services are set forth in the express warranty statements accompanying such products and
services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial
errors or omissions contained herein.
Intel, Core and Intel vPro are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and
other countries. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video Electronics Standards Association
(VESA®) in the United States and other countries. USB Type-C® and USB-C® are trademarks of USB Implementers Forum. ENERGY
STAR is a registered trademark of the U.S. Environmental Protection Agency. Microsoft and Windows are either registered
trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.