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Copyright© 2023 KAYTUS. All rights reserved. BJ 07/2023
 V2
KAYTUSTM Series
Servers Brochure

World-Leading
IT Infrastructure
Provider
 KAYTUS
V2 Series Servers
Brochure

Compute Power
Defines Productivity

V2

V2

01
 KAYTUS
V2 Series Servers

Computing Server
04 KR2280V2 06 KR1280V2 08 KR1270V2
2-socket rack server High-density computing Streamlined
for all scenarios rack server high-density
computing rack server

V2

V2

9 KR2180V2 10 KR1180V2 11 KT3020V2

2U Dense and 1U Dense and Entry-level single-socket
cost-effective rack server cost-effective rack server tower server

V2

V2

Storage Server

12 KR2266V2 13 KR4266V2 14 KR4276V2

High-density 2U General-purpose 4U High-density 4U storage
storage rack server storage rack server rack server

V2

02
 KAYTUS
V2 Series Servers
Brochure

Multi-node Server

15 K24V2
2U4N high-density multi-node
server for new-generation
data centers

Mission Critical Server

19 KR2460V2 20 KR4480V2 21 KR6880V2
High-density 2U 4-socket 4U 4-socket server bearing High-end 8-socket rack
rack server for computing mission critical workloads server
platforms for highly-scalable computing
platforms

V2

V2

Infrastructure Software Suite

22 InManage
Management Software

Global Business Operations

23 Global Manufacturing 24 Ultimate Innovation

03
 KR2280V2
2-Socket Rack Server for All Scenarios
Overview
The KR2280V2 is a mainstream high-end 2U 2-socket rack server that features the 4th Gen Intel® Xeon® Scalable processors,
the 4th Gen AMD EPYCTM processors, and the Ampere One processors, spanning three major computing platforms from Intel.
In addition, it supports front I/O, liquid cooling, and other deployment options. The server is built upon four key design
addition, it supports front I/O, liquid cooling, and other deployment options. The server is built upon four key design principles
of break-thru innovation, green and sustainability, intelligence and high efficiency, and open innovation, and offers versatile
configurations to cater to the diverse demands of various industries and scenarios.

KR2280V2 Powered
Intel Processors

Features
V2

Excellent Performance Flexible System Architecture Safety and Reliability

The server provides the maximum Two deployment modes are supported:
computing, storage, and networking front I/O and rear I/O, thus effectively
performance supported in the industry improving the operation and mainte-
and allows flexible combinations nance of NICs, optical modules and
through modular design; supports up to other thermo -sensitive components in
45 × 2.5-inch drives or 20 × 3.5-inch the cold aisle. The server also supports
drives and up to 20 PCIe expansion optional air cooling or cold-plated liquid
cards (including 2 hot-swap OCP x16 cooling solutions to reduce the PUE of
cards and 1 mezz RAID controller card). server rooms and comply with carbon
neutrality policy.

Specifications
Model Maintenance Cooling
KR2280-X2-A0-R0-00 Rear I/O Air cooling

KR2280-X2-A0-F0-00 Front I/O Air cooling

KR2280-X2-C0-R0-00 Rear I/O Cold-plated liquid cooling

Processor Up to two 4th Gen Intel® Xeon® Scalable processors

Memory 32 DDR5 DIMM slots, delivering a memory capacity of up to 16 TB

Storage Front: Up to 12 × 3.5-inch SAS/SATA/NVMe drives, 24/25 × 2.5-inch SAS/SATA/NVMe drives, or 24 × E3.S SSDs
Internal: Up to 4 × 3.5-inch SAS/SATA drives or 10 × 2.5-inch SAS/SATA drives
Rear: Up to 4 × 3.5-/2.5-inch SAS/SATA/NVMe drives, 4 × 3.5-inch drives/2 × SATA M.2 SSD/E1.S SSDs, 10 × 2.5-inch SAS/SATA/NVMe drives,
or 24 × E3.S SSDs
I/O Expansion Slot Internal: 1 × mezz RAID controller card
Rear: 8 × PCIe 5.0 slots (6 × full-height 3/4-length + 2 × FHHL), 10 × PCIe 5.0 slots (4 × full-height 3/4-length + 2 × FHHL + 4 × half-height
3/4-length), or 13 × HHHL PCIe 5.0 slots; up to 4 × dual-width GPU
Front: 6 × FHHL PCIe slots (for front I/O models)
Power Supply 1+1 redundant PSUs with the output power of 800W/1,300W/1,600W/2,000W/2,700W

Operating Temperature 5°C to 50°C (For details, refer to the White Paper)

Computing Server Storage Server Multi-node Server

04
KR2280V2 Powered by
AMD Processors

Features
V2

Excellent Computing Performance Diverse Storage Configurations Flexible Network Expansion

Features 4th Gen AMD EPYCTM processors, Up to 20 × 3.5-inch SATA/SAS drives, Up to 7 or 8 PCIe 5.0 expansion cards or
with up to 96 cores, 12 CCDs, 192 28/29 × 2.5-inch SATA/SAS drives, 28 × 2 optional OCP 3.0 modules, providing
threads, an L3 cache of up to 384 MB, U.2 NVMe SSDs, or 24 × E3.S SSDs, and multiple network port options and a
and up to 400W TDP per CPU; supports internal SATA/NVMe M.2 SSDs, meeting more flexible network structure for
up to 24 DDR5 DIMMs, delivering diverse storage needs. applications.
superior speed, high availability, and a
memory capacity of up to 12 TB.

Specifications
Model Maintenance Cooling
KR2280-E2-A0-F0-00 Rear I/O Air cooling

KR2280-E2-C0-R0-00 Rear I/O cold-plated liquid cooling

Processor Up to two 4th Gen AMD EPYCTM processors

Memory 24 DDR5 DIMM slots, delivering a memory capacity of up to 12 TB

Storage Front: 12 × 3.5-inch SATA/SAS/NVMe drives | 24 × 2.5-inch SATA/SAS/NVMe/E3.S drives | 25 × 2.5-inch SATA/SAS drives (with 4 NVMe
drives supported)
Internal: 2 × SATA M.2 SSDs or 2 × NVMe M.2 SSDs | 4 × 3.5-inch SATA/SAS drives
Rear: Up to 4 × 3.5-inch SAS/SATA drives | Up to 4 × 2.5-inch SAS/SATA/NVMe drives | Up to 2 × M.2 SSDs or 2 × E1.S SSDs

I/O Expansion Slot An air-cooled server and a liquid-cooled server support up to 8 and 7 PCIe slots respectively.
Both the servers support 2 hot-swap OCP 3.0 x8/x16 cards with the multi-host function.
Power Supply 1+1 redundant Platinum/Titanium PSUs with the output power of 550W/800W/1,300W/1,600W/2,000W/2,700W

Operating Temperature 10°C to 35°C (5°C to 45°C for some models. For details, refer to the White Paper)

KR2280V2 Powered by
ARM Processors

Features
V2

Multi-core and Single-thread Native System Architecture Low TCO

Featuring a remarkably high number of It shares the same system architecture Thanks to its streamlined instruction set
physical cores, it offers stable perfor- with mobile-side devices and does not and CPU design, it has a cost advantage
mance benchmarks for various scenari- require the conversion of instruction and lower power consumption
os and workloads, making it suitable for sets, thus significantly saving computing compared to servers powered by x86
resource allocation among cloud power required by cloud gaming and CPUs with the same number of threads.
tenants. This allows for a significant cloud mobile device scenarios.
increase in the number of deployable
instances.

Specifications
Model Maintenance Cooling
KR2280-R2-A0-R0-00 Rear I/O Air cooling

Processor Up to 2 Ampere One processors

Memory 32 DDR5 DIMM slots, delivering a memory capacity of up to 16 TB

Storage Front: Up to 12 × 3.5-inch SAS/SATA drives, 24/25 × 2.5-inch SAS/SATA/NVMe drives, or 24 × E3.S SSDs
Rear: Up to 4 × 2.5-inch SAS/SATA/NVMe drives
I/O Expansion Slot Rear: 8 × PCIe 5.0 slots (6 × full-height 3/4-length cards + 2 × FHHL cards) | Up to 4 dual-width GPUs

Power Supply 1+1 redundant PSUs with the output power of 1,300W/1,600W/2,000W/2,700W

Operating Temperature 5°C to 50°C (For details, refer to the White Paper)

Mission Critical Server Infrastructure Software Suite Global Business Operations

05
 KR1280V2
High-density Computing Rack Server

Overview
The KR1280V2 is a mainstream high-end 1U 2-socket rack server that features the 4th Gen Intel® Xeon® Scalable processors,
the 4th Gen AMD EPYCTM processors, and the Ampere One processors, spanning three major computing platforms of Intel,
AMD, and ARM. It is almost perfectly designed in terms of performance, density, and scalability. In addition, it provides the
most diverse storage matrices in the industry, and introduces multi-dimensional cooling solutions (air cooling, cold-plated
liquid cooling, and immersion cooling) for 1U models, catering for virtualization, high performance computing, all-flash
storage, and other application scenarios and meeting the low PUE requirements of high-density data centers.

KR1280V2 Powered
Intel Processors
V2

Features
All-flash Density Optimization Flexible I/O Design High Energy Efficiency and Carbon
Applicable to the latest storage medium Supports 2 hot-swap OCP 3.0 cards, Reduction
in the industry, the server supports up to front I/O, and up to 8 PCIe expansion Supports cold-plated liquid cooling and
32 hot-swap PCIe 5.0 E1.S SSDs, cards, simplifying operation and immersion cooling, providing compre-
realizing the maximum parallel storage maintenance and improving the hensive liquid cooling solutions for data
performance in the industry and offering operating stability of thermo-sensitive centers to achieve a PUE below 1.1.
tens of millions of IOPS to services. components such as NICs and optical
modules.

Specifications
Model Maintenance Cooling
KR1280-X2-A0-R0-00 Rear I/O Air cooling

KR1280-X2-A0-F0-00 Front I/O Air cooling

KR1280-X2-C0-R0-00 Rear I/O Cold-plated liquid cooling

KR1280-X2-M0-U0-00 Front I/O Immersion cooling

Processor Up to two 4th Gen Intel® Xeon® Scalable processors

Memory 32 DDR5 DIMM slots, delivering a memory capacity of up to 16 TB

Storage General Front I/O

Front: 32 × E1.S SSDs Front: 12 × E1.S SSDs + 2 × M.2 SSDs
12 × 2.5-inch SAS/SATA/NVMe drives (up to 12 × NVMe SSDs) 4 × E3.S SSDs or 4 × 2.5-inch SAS/SATA/NVMe drives
10 × 2.5-inch SAS/SATA/NVMe drives
8 × 2.5-inch SAS/SATA/NVMe drives + 2 × M.2 SSD + 2 × E1.S SSDs
4 × 3.5-inch SAS/SATA/NVMe drives + 2 × M.2 SSD + 2 × E1.S SSDs
4 × 3.5-inch SAS/SATA/NVMe drives + 4 × 2.5-inch SAS/SATA/N-
VMe drives
Rear: 2 × 2.5-inch SAS/SATA drives
Internal: Up to 2 × SATA M.2 SSDs or 2 × NVMe M.2 SSDs

I/O Expansion Slot Up to 3 PCIe 5.0 slots, 2 hot-swap OCP 3.0 slots, Up to 4 PCIe 5.0 slots (2 front slots and 2 rear slots),
and 1 internal mezz RAID controller slot 3 hot-swap OCP 3.0 cards (1 front slot and 2 rear slots),
and 1 internal mezz RAID controller slot
Power Supply 1+1 redundant CRPS PSUs with the output power of 550W/800W/1,300W/1,600W/2,000W

Operating Temperature 5°C to 50°C (For details, refer to the White Paper)

Computing Server Storage Server Multi-node Server

06
KR1280V2 Powered by
AMD Processors
V2

Features
Excellent Computing Performance Diverse Storage Configurations Flexible Network Expansion
Features 4th Gen AMD EPYCTM proces- Up to 4 × 3.5-inch SAS/SATA/NVMe Up to 2 or 3 PCIe 5.0 expansion cards or
sors, with up to 96 cores, 12 CCDs, 192 drives + 4 × 2.5-inch SAS/SATA/NVMe 2 optional OCP 3.0 modules, providing
threads, an L3 cache of up to 384 MB drives or 12 × 2.5-inch SAS/SATA/NVMe multiple network port options and a
and up to 400W TDP per CPU; supports drives, and internal SATA/NVMe M.2 more flexible network structure for
up to 24 DDR5 DIMMs, delivering SSDs, meeting diverse storage needs. applications.
superior speed, high availability, and a
memory capacity of up to 12TB.

Specifications
Model Maintenance Cooling
KR1280-E2-A0-R0-00 Rear I/O Air cooling

KR1280-E2-C0-R0-00 Rear I/O cold-plated liquid cooling

Processor Up to two 4th Gen AMD EPYCTM processors

Memory 24 DDR5 DIMM slots, delivering a memory capacity of up to 12 TB

Storage Front: 4 × 3.5-inch SAS/SATA/NVMe drives + 4 × 2.5-inch SAS/SATA/NVMe drives | 4 × 3.5-inch SAS/SATA/NVMe drives + 2 × E1.S SSDs + 2
× M.2 SSDs | 12 × 2.5-inch SAS/SATA/NVMe drives
Internal: 2 × SATA M.2 SSDs or 2 × PCIe M.2 SSDs (optional)

I/O Expansion Slot An air-cooled server and a liquid-cooled server support up to 3 and 2 PCIe 5.0 slots respectively.
Both the servers support 2 hot-swap OCP 3.0 x8/x16 cards with the multi-host function.
Power Supply 1+1 redundant Platinum/Titanium PSUs with the output power of 550W/800W/1,300W/1,600W/2,000W

Operating Temperature 10°C to 35°C (5°C to 45°C for some models. For details, refer to the White Paper)

KR1280V2 Powered by
ARM Processors V2

Features
Multi-core and Single-thread Native System Architecture for Cloud Low TCO
Featuring a remarkably high number of Gaming and Cloud Mobile Device Thanks to its streamlined instruction set
physical cores, it offers stable perfor- It shares the same system architecture and CPU design, it has a cost advantage
mance benchmarks for various scenari- with mobile-side devices and does not and lower power consumption
os and workloads, making it suitable for require the conversion of instruction compared to servers powered by x86
resource allocation among cloud sets, thus significantly saving computing CPUs with the same number of threads.
tenants. This allows for a significant power required by cloud gaming and
increase in the number of deployable cloud mobile device scenarios.
instances.

Specifications
Model Maintenance Cooling
KR1280-R2-A0-R0-00 Rear I/O Air cooling

Processor Up to 2 Ampere One processors

Memory 32 DDR5 DIMM slots, delivering a memory capacity of up to 16 TB

Storage Front: Up to 12 × 2.5-inch SAS/SATA/NVMe drives

I/O Expansion Slot Rear: 2 × FHHL PCIe 5.0 slots

Power Supply 1+1 redundant PSUs with the output power of 1,300W/1,600W/2,000W

Operating Temperature 5°C to 50°C (For details, refer to the White Paper)

Mission Critical Server Infrastructure Software Suite Global Business Operations

07
 KR1280V2
Streamlined High-density Computing
Rack Server

Overview
The KR1270V2 is a streamlined, cost-effective 1U 2-socket rack server that features the 4th Gen Intel® Xeon® Scalable
processors. It combines the minimalist configuration with high computing density to achieve the optimal balance between
overall performance and scalability, and meets the light-weight service load needs upon the refined design, catering for cloud
computing, virtualization and other high-density computing scenarios whilst satisfying the deployment demand in high-densi-
ty data centers.

KR1270V2 Powered
Intel Processors

Features
Minimalist Design and Flexible Security, Reliability, and Service Efficient Carbon Reduction and
Configuration Stability Eco-friendly Energy Saving
Flexible and streamlined configuration, The redundant design of core compo- The KAYTUS's unique intelligent zoned
with 4 × 3.5-inch drives + 2 × M.2 SSDs + nents such as BIOS/BMC enables the control technology enables real-time fan
2 × E1.S SSDs or 10 × 2.5-inch drives and system to switch to the standby flash for speed control and precise air supply for
up to 4 PCIe expansion cards, meeting startup in case of a single flash failure. optimal energy efficiency and environ-
the light-weight service load needs. Besides, BMC can be upgraded online mental friendliness. Key components
without interrupting services, improving satisfy lead-free requirements (RoHS),
the continuity of customer services. with package materials 100% recyclable.

Specifications
Model Maintenance Cooling
KR1270-X2-A0-R0-00 Rear I/O Air cooling

Processor Up to two 4th Gen Intel® Xeon® Scalable processors

Memory 16 DDR5 DIMM slots, delivering a memory capacity of up to 8 TB

Storage Front: 10 × 2.5-inch SAS/SATA/NVMe drives | 4 × 3.5-inch SAS/SATA/NVMe drives + 2 × M.2 SSDs + 2 × E1.S SSDs
Internal: Up to 2 × M.2 SSDs
I/O Expansion Slot Up to 3 PCIe 4.0 cards and 1 internal mezz RAID controller card

Power Supply 1+1 redundant CRPS PSUs with the output power of 550W/800W/1,300W

Operating Temperature 5°C to 45°C (For details, refer to the White Paper)

Computing Server Storage Server Multi-node Server

08
KR2180V2
2U Dense and Cost-effective
Rack Server

Overview
The KR2180V2 is an dense and cost-effective 2U single-socket rack server series that features 4th Gen AMD EPYCTM proces-
sor. Designed with multiple cores, high base frequency and large cache, it provides maximized storage and expansion
capabilities in a 2U space, making it suitable for application scenarios such as big data, distributed storage, video transcod-
ing and HPC and effectively improving TCO benefits.

KR2180V2 Powered
AMD Processors

Features
V2

Powerful Performance Ultra-high Scalability Openness and Security

Features one 4th Gen AMD EPYCTM Large local storage: Up to 20 x 3.5-inch
processor, with up to 96 cores, 192 SATA/SAS drives, 28/29 x 2.5-inch
threads, a base frequency of up to 4.4 SATA/SAS drives, 28 x U.2 NVMe
GHz, and an L3 cache of up to 384 MB; SSDs, or 24 × E3.S SSDs.
supports 12 memory channels, 24 DDR5 Ultra-high l/O expansion: Up to 8
DIMM slots and up to 128 PCIe 5.0 full-height PCle slots and 2 OCP 3.0
channels per CPU. slots.

Specifications
Model Maintenance Cooling
KR2180-E2-A0-R0-00 Rear I/O Air cooling

Processor One 4th Gen AMD EPYCTM processor

Memory 24 DDR5 DIMM slots, delivering a memory capacity of up to 12 TB

Storage Front: 12 × 3.5-inch SAS/SATA/NVMe drives | 24 × 2.5-inch SAS/SATA/NVMe/E3.S drives | 25 × 2.5-inch SATA/SAS drives (with 4 NVMe
drives supported)
Internal: 2 × SATA/PCIe M.2 SSDs | 4 × 3.5-inch SATA drives
Rear: 4 × 3.5-inch SAS/SATA drives | 4 × 2.5-inch SAS/SATA/NVMe drives

I/O Expansion Slot Up to 8 PCIe slots | Up to 2 hot-swap OCP 3.0 x8/x16 slots

Power Supply 1+1 redundant PSUs

Operating Temperature 5°C to 45°C (For details, refer to the White Paper)

Mission Critical Server Infrastructure Software Suite Global Business Operations

09
 KR1180V2
1U Dense and Cost-effective
Rack Server

Overview
The KR1180V2 is an dense and cost-effective 1U single-socket rack server series that features 4th Gen AMD EPYC™ proces-
sor. It is designed with multiple cores, high base frequency and large cache, providing ultimate computing performance in a
1U high-density space. With balanced networking and expansion features, it saves server room space and is suitable for
application scenarios such as cloud computing, virtualization, big data, and distributed all-flash storage.

KR1180V2 Powered
AMD Processors
V2

Features
Powerful Performance Extremely High Density Openness and Security
Features one 4th Gen AMD EPYC™ Flexible storage: 4 × 3.5-inch drives + 4 ×
processor, with up to 96 cores, 192 2.5-inch drive/10 × 2.5-inch drives/16 ×
threads, a base frequency of up to 4.4 E1.S SSDs/8 × 2.5-inch drives + 2 × PCle
GHz, and an L3 cache of up to 384 MB; slots.
supports 12 memory channels, 24 DDR5 Ultimate l/O: Up to 5 PCle slots and 2
DIMM slots and up to 128 PCIe 5.0 OCP 3.0 slots.
channels per CPU.

Specifications
Model Maintenance Cooling
KR1180-E2-A0-R0-00 Rear I/O Air cooling

Processor One 4th Gen AMD EPYCTM processor

Memory 24 DDR5 DIMM slots, delivering a memory capacity of up to 12 TB

Storage Front: Up to 4 × 3.5-inch SAS/SATA/NVMe drives + 4 × 2.5-inch SAS/SATA/NVMe drives | Up to 10 × 2.5-inch SAS/SATA/NVMe drives | Up to
16 × E1.S SSDs
Internal: 2 × SATA/PCIe M.2 SSDs
I/O Expansion Slot Front: Up to 2 PCIe slots
Rear: Up to 3 PCIe slots | Up to 2 OCP 3.0 x8/x16 slots

Power Supply 1+1 redundant PSUs

Operating Temperature 5°C to 45°C (For details, refer to the White Paper)

Computing Server Storage Server Multi-node Server

10
KT3020V2
Entry-level Single-socket
Tower Server

Overview
The KT3020V2 is an entry-level single-socket tower server series that features Intel® Xeon® E Tatlow series or Pentium®
series processor. The KT3020V2 series is designed to provide a reliable and cost-effective hardware basis for customers'
overall office, mail, and printing solutions. It can be flexibly expanded based on the customer's specific application environ-
ment, and can function as an efficient workstation in complex operating environments.

KT3020V2 Powered
Intel Processors

Features
High Performance and Low Price
The server supports one Intel® Xeon® E-series Tatlow Platform
or Pentium® series processor and 4 DDR4 DIMMs.

Low Noise
Low noise design (≤30 dB in idle status and ≤40 dB under full
configuration), providing perfect user experience.

Specifications
Model Maintenance Cooling
KT3020-X2-A0-R0-00 Rear I/O Air cooling

Processor One Intel® Xeon® E-series Tatlow Platform or Pentium® series processor
Memory 4 DDR5 DIMM slots, delivering a memory capacity of up to 128 GB

Storage Front: 4 × 3.5-inch SAS/SATA drives or 4 × 2.5-inch SAS/SATA drives

Internal: 1 × 2280/22110 SATA/PCIe M.2 SSD

I/O Expansion Slot Rear: 2 PCIe 4.0 expansion slots

Power Supply Single PSU with the output power of 300W/550W, or 1+1 redundant PSUs with the output power of 500W

Operating Temperature 5°C to 35°C (For details, refer to the White Paper)

Mission Critical Server Infrastructure Software Suite Global Business Operations

11
 KR2266V2
High-density 2U Storage
Rack Server

Overview
The KR2266V2 is a high-density 2U2S storage-optimized server powered by the 4th Gen Intel® Xeon® Scalable processors. It
features an innovative three-tier storage architecture that significantly improves storage density, computing power, network
bandwidth, and intelligent management. In addition, the balanced and symmetric system architecture provides increased
data capacity, larger data throughput, and stronger data processing capabilities, making it highly suitable for big data, CDN,
hyper-converged storage, distributed storage, and other application scenarios.

KR2266V2 Powered
Intel Processors
V2

Features
High-density Storage High Computing Power
Supports up to 38 drives in a 2U space, providing a 158% Supports two 4th Gen Intel® Xeon® Scalable processors with up
storage density increase compared to traditional 2U 12-drive to 350W TDP and the computing performance 60% higher than
servers. It also offers a maximum SSD:HDD ratio of 1:2 for high that of its predecessor, meeting the increasing computing
cache capacity, meeting the demands of large-capacity and power demands of big data analysis services.
high-density storage as well as high cache.

High Bandwidth Intelligent Environmental Perception

With I/O expansion capacities, the product supports PCIe 5.0 With professional hardware and software design, the product can
cards with a data rate of up to 32 GT/s, doubling the rate of monitor the temperature, air flow, and air pressure of the operating
PCIe 4.0 cards. It supports 400 Gb networking, enabling environment in real time, intelligently control the cooling strategy
low-latency application experiences. to improve the drive life, and predict storage media faults through
AI technology and give proper solutions to eliminate the faults,
ensuring the stable operation of the system.

Specifications
Model Maintenance Cooling
KR2266-X2-A0-R0-00 Rear I/O Air cooling

Processor Up to two 4th Gen Intel® Xeon® Scalable processors

Memory 16 DDR5 DIMM slots, delivering a memory capacity of up to 8 TB

Storage Front: Up to 24 × 3.5-/2.5-inch hot-swap SAS/SATA drives

Internal: Up to 8 × 2.5-inch SAS/SATA drives
Rear: Up to 8 × hot-swap 2.5-inch SAS/SATA/NVMe/E1.S drives or 4 × hot-swap 3.5-inch SAS/SATA drives |
2 × SATA/PCIe M.2 SSDs
I/O Expansion Slot Up to 8 PCIe 5.0 slots, including 1 OCP 3.0 slot

Power Supply 1+1 redundant Platinum PSUs that support HVDC, and Titanium level PSUs

Operating Temperature 5°C to 40°C (For details, refer to the White Paper)

Computing Server Storage Server Multi-node Server

12
KR4266V2
General-purpose 4U Rack Storage Server

Overview
The KR4266V2 is a 4U2S general-purpose storage-optimized server powered by 4th Gen Intel® Xeon® Scalable processors. In
a 4U space, it provides high storage capacity, powerful computing performance, ultimate I/O expansion capabilities and high
energy efficiency, making itself highly suitable for application scenarios such as warm/cold data storage, video surveillance
storage, big data storage and cloud storage pooling. In addition, the storage model adopts a multi-dimensional cooling
solution incorporating both air cooling and cold-plated liquid cooling for the first time, satisfying the demand for low PUE in
high-density data centers.

KR4266V2 Powered
Intel Processors

Features
High Storage Capacity High Energy Efficiency and Carbon Reduction
Supports up to 46 × 3.5-inch drives, providing an ultra-large Supports cold-plated liquid cooling, providing comprehensive
storage capacity of up to 1 PB to meet local storage needs. liquid cooling solutions for data centers to achieve a PUE below
1.1.

Ultimate I/O Expansion Capabilities Powerful Computing Performance

Up to 13 PCIe expansion slots that further improve I/O expan- The server features a complete series of new-generation
sion capabilities and support multiple storage modules, network processors, which can provide up to a 60% increase in comput-
modules and GPU modules, enabling users to make flexible ing performance compared to its predecessors. It also supports
configurations for specific service needs, eliminate I/O bottle- 2 dual-width GPUs or 8 single-width GPUs, meeting the needs
necks and improve server performance. of IVA scenarios and implementing efficient analysis of local
data and real-time AI application.

Specifications
Model Maintenance Cooling
KR4266-X2-A0-R0-00 Rear I/O Air cooling

KR4266-X2-C0-R0-00 Rear I/O Cold-plated liquid cooling

Processor Up to two 4th Gen Intel® Xeon® Scalable processors

Memory 32 DDR5 DIMM slots, delivering a memory capacity of up to 16 TB

Storage Front: 24 × 3.5-inch hot-swap SATA/SAS drives

Rear: 16 × 3.5-inch hot-swap SATA/SAS drives | 4 × 2.5-inch hot-swap SATA/SAS/NVMe SSDs | 2 × SATA/PCIe M.2 SSDs or 2 ×
E1.S SSDs | Up to 16 × U.2 NVMe SSDs
Internal: 6 × 3.5-inch SATA/SAS drives | Up to 2 × TF cards

I/O Expansion Slot Up to 13 PCIe 5.0 slots, including 1 dedicated PCIe expansion slot for the RAID controller card and 2 OCP 3.0 slots
Power Supply 1+1 redundant Platinum PSUs that support HVDC, and Titanium level PSUs

Operating Temperature 5°C to 45°C (For details, refer to the White Paper)

Mission Critical Server Infrastructure Software Suite Global Business Operations

13
 KR4276V2
High-density 4U Rack Storage Server

Overview
The KR4276V2 is a 4U2S high-capacity high-density storage rack server powered by 4th Gen Intel® Xeon® Scalable proces-
sors. With a compact size, flexible I/Os, energy saving and other ultimate designs, it provides a huge storage capacity to
meet the user's current and future needs for service expansion. In a 4U space, the server supports 60 × 3.5-inch drives to
meet the strict requirements on space and storage costs, making it suitable for cloud storage, video storage, big data,
archiving and other application scenarios.

KR4276V2 Powered
Intel Processors

Features
Compact Size, Large Capacity Flexible I/O Design Eco-friendly Energy Saving
With innovative solutions, the server The server provides both front and rear The KAYTUS’ power consumption
supports 60 × 3.5-inch drives in a 4U I/O configurations for you to choose management technology enables you to
space, which maximizes the storage from. The front I/O configuration accurately monitor and control the
capacity and density and delivers a innovates the design of the hot/cold power consumption of the system in real
storage capacity of up to 1.3 PB. aisle, reducing the average failure rate of time. The KAYTUS’ drive sleep mode
thermo-sensitive components by over technology enables you to customize the
90% and improving the service life of the deep sleep of drives and elaborately
components by over 300%. manage and control the power
consumption of the whole server,
reducing the total power consumption
by 70%.

Specifications
Model Maintenance Cooling
KR4276-X2-A0-R0-00 Rear I/O Air cooling

KR4276-X2-A0-F0-00 Front I/O Air cooling

Processor Up to two 4 Gen Intel Xeon Scalable processors

th ® ®

Memory 32 DDR5 DIMM slots, delivering a memory capacity of up to 16 TB

Storage General Front I/O

Up to 60 × 3.5-inch hot-swap SAS/SATA drives Up to 60 × 3.5-inch hot-swap SAS/SATA drives
10 × 2.5-inch hot-swap SAS/SATA drives, Up to 4 × 2.5-inch SAS/SATA/NVMe SSDs
up to 8 × NVMe drives (optional) 2 × SATA/PCIe M.2 SSDs
2 × SATA/PCIe M.2 SSDs

I/O Expansion Slot Up to 9 PCIe 5.0 slots, including 2 OCP 3.0 slots Up to 5 PCIe 5.0 slots, including 1 OCP 3.0 slot
Power Supply 1+1 redundant Platinum PSUs that support HVDC, and Titanium level PSUs

Operating Temperature 5°C to 40°C (For details, refer to the White Paper)

Computing Server Storage Server Multi-node Server

14
K24V2
2U4N High-density Multi-node Server
for New-generation Data Centers
Overview
The K24V2 is a high-density multi-node server that features Intel & AMD platforms and offers 4 single- or dual-socket
compute node options. It provides optimal performance, high reliability, intelligent PSU and fan control, and flexible storage
configurations in a standard 2U cabinet, occupying less cabinet space and reducing energy consumption and cabinet
deployment costs. The K24V2 is suitable for high-performance computing, virtualization and other computing-intensive
application scenarios, providing flexible solutions for a variety of application scenarios with distributed system architectures,
such as HPC, cloud resource pooling, and big data analysis.

K24V2-2S Powered
Intel Processors

Features
Intelligent O&M Efficient Liquid Cooling
The server supports node-level leak detection, with the liquid The cold plates carrying warm water cover CPUs, DIMMs and
cooling cabinets integrated with dynamic loop monitoring VR modules, with a liquid-cooling coverage ratio of over 80%,
equipment to intelligently monitor the temperature, humidity contributing to low PUE of only 1.1 and reducing the data center
and leak information. TCO by more than 30%.

Leading Performance Flexible Deployment

Eight 4 Gen Intel Xeon Scalable processors in a 2U space,
th ® ®
Exclusive mobile air- and liquid-cooling CDU solution supports
with up to 350W TDP per CPU; 16 DDR5 DIMM slots per node; integrated delivery of cabinets, simplifying the deployment
400 Gb NDR Infiniband for high-bandwidth node interconnec- procedure on customer’s site.
tion.

Specifications
Chassis Model Maintenance Cooling
K24-X2-A0-R0-00 Rear I/O Air cooling

K24-X2-C0-R0-00 Rear I/O Cold-plated liquid cooling

Form Factor 2U rack chassis, including 4 independent hot-swap 2-socket compute nodes
Storage Configuration 1: 8 × 2.5-inch SSDs (7 mm) | Configuration 2: 4 × 2.5-inch SSDs (15 mm)

Power Supply 4 N+N redundant hot-swap 2,200W Platinum/Titanium PSUs

System Cooling 4 front 8086 system cooling fans with N+1 redundancy; liquid cooling enabled node

Operating Temperature 5°C to 35°C

Node Model Maintenance Cooling

KM1270-X2-A0-R0-00 Rear I/O Air cooling

KM1270-X2-C0-R0-00 Rear I/O Cold-plated liquid cooling

Form Factor 1U half-width 2-socket compute node

Processor Two 4th Gen Intel® Xeon® Scalable processors per node

Memory Up to 16 DDR5 DIMMs per node, delivering a memory capacity of up to 8 TB

PCIe Expansion Air cooling: 1 × PCIe 4.0 x16 slot + 1 × PCIe 5.0 x16 slot per node | Liquid cooling: 1 × PCIe 5.0 x16 slot per node

I/O Expansion Slot Front: 2 × USB 2.0 ports, 1 × VGA port, 1 × power button, and 1 × UID button per node |
Rear: 1 × RJ45 port, 1 × UID button, 1 × RST button, 1 × micro USB for debug, and 1 × micro USB per node

Storage Configuration 1: 8 × 2.5-inch SSDs (7 mm) | Configuration 2: 4 × 2.5-inch SSDs (15 mm) | 2 × internal SATA/PCIe M.2 SSDs per node

Mission Critical Server Infrastructure Software Suite Global Business Operations

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 K24V2-1S Powered by
Intel Processors

Features
High Density, High Efficiency and High Cost Performance Extreme Performance and Flexible
Optimized System Architecture Adaptability
Features the 4th Gen Intel® Xeon® Up to 24 × 2.5-inch NVMe/SAS/SATA
Scalable processor, with up to 350W drives, 8 × E1.S SSDs, or configuration
TDP; provides the highest virtual machine with no drives or backplanes.
density, high core counts and ultimate Up to 2 optional internal SATA/NVMe
performance in a single-CPU socket. M.2 SSDs modules, meeting diverse
Four 2-socket server nodes can be storage needs.
deployed in a 2U space, which quadru-
ples the computing density of a 2U rack
server and thus greatly improves the
space usage efficiency of customers'
server rooms

Specifications
Chassis Model Maintenance Cooling
K24-X2-A0-R0-00 Rear I/O Air cooling

Form Factor 2U rack chassis, including 4 independent hot-swap single-socket compute nodes
Storage 24 × 2.5-inch SSDs (7 mm)/8 × E1.S SSDs

Power Supply 4 hot-swap 2,200W/2,000W Platinum/Titanium PSUs with N+N redundancy

System Cooling 6 front 6056 system cooling fans with N+1 rotor redundancy

Operating Temperature 5°C to 35°C

Node Model Maintenance Cooling

KM1160-X2-A0-R0-00 Rear I/O Air cooling

Form Factor 1U half-width single-socket computing node

Processor One 4th Gen Intel® Xeon® Scalable processor per node

Memory Up to 8 DDR5 DIMMs per node, delivering a memory capacity of up to 4 TB

PCIe Expansion 2 × PCIe 5.0 x16 slots per node

I/O Expansion Slot Front: 2 × USB 2.0 ports, 1 × VGA port, 1 × power button, and 1 × UID button per node
Rear: 1 × RJ45 port, 1 × UID button, 1 × RST button, 1 × micro USB for debug, and 1 × micro USB per node
Internal: 1 × USB 3.0 port per node

Storage 24 × front 2.5-inch SSDs or 8 × front E1.S SSDs, and 2 × internal SATA/PCIe M.2 SSDs per node

Computing Server Storage Server Multi-node Server

16
K24V2-2S Powered by
AMD Processors

Features
Intelligent O&M Efficient Liquid Cooling
The server supports node-level leak detection, with the liquid The cold plates carrying warm water cover CPUs, DIMMs and
cooling cabinets integrated with dynamic loop monitoring VR modules, with a liquid-cooling coverage ratio of over 80%,
equipment to intelligently monitor the temperature, humidity contributing to low PUE of only 1.1 and reducing the data center
and leak information. TCO by more than 30%.

Leading Performance Flexible Deployment

Eight 4 Gen AMD EPYC processors in a 2U space
th TM
Exclusive mobile air- and liquid-cooling CDU solution supports
24 DDR5 DIMM slots per node, delivering a memory capacity of integrated delivery of cabinets, simplifying the deployment
up to 12 TB procedure on customer’s site.
400 Gb NDR Infiniband for high-bandwidth node interconnec-
tion.

Specifications
Chassis Model Maintenance Cooling
K24-E2-A0-R0-00 Rear I/O Air cooling

K24-E2-C0-R0-00 Rear I/O Cold-plated liquid cooling

Form Factor 2U rack chassis, including 4 independent hot-swap 2-socket compute nodes
Storage 8 × 2.5-inch SSDs (7 mm)

Power Supply 4 N+N redundant hot-swap 2,200W Platinum/Titanium PSUs

System Cooling 4 front 8086 system cooling fans with N+1 redundancy; liquid cooling enabled node

Operating Temperature 5°C to 35°C

Node Model Maintenance Cooling

KM1280-E2-A0-R0-00 Rear I/O Air cooling

KM1280-E2-A0-R0-00 Rear I/O Cold-plated liquid cooling

Form Factor 1U half-width 2-socket compute node

Processor Two 4th Gen AMD EPYCTM processors per node

Memory Up to 24 DDR5 DIMMs per node, delivering a memory capacity of up to 12 TB

PCIe Expansion Air cooling: 1 × PCIe 4.0 x16 slot + 1 × PCIe 5.0 x16 slot per node | Liquid cooling: 1 × PCIe 5.0 x16 slot per node

I/O Expansion Slot Front: 2 × USB 2.0 ports, 1 × VGA port, 1 × power button, and 1 × UID button per node
Rear: 1 × RJ45 port, 1 × UID button, 1 × RST button, 1 × micro USB for debug, and 1 × micro USB per node
Internal: 1 × USB 3.0 port per node

Storage 8 front 2.5-inch SSDs (7 mm) and 2 internal SATA/PCIe M.2 SSDs per node

Mission Critical Server Infrastructure Software Suite Global Business Operations

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 K24V2-1S Powered by
Intel Processors

Features
High Density, High Efficiency and High Cost Performance Extreme Performance and Flexible
Optimized System Architecture Adaptability
Features the 4th Gen AMD EPYCTM proces- Up to 24 × 2.5-inch NVMe/SAS/SATA-
sor, with up to 96 cores, 196 threads, up to drives or 8 × E1.S SSDs, or configuration
400W TDP, a boost frequency of 4.4 GHz, with no drives or backplanes
and an L3 cache of up to 384 MB per CPU; Up to 2 optional internal SATA/NVMe
provides the highest virtual machine density, M.2 SSD modules, meeting diverse
high core counts and ultimate performance storage needs.
in a single-CPU socket
Four 2-socket server nodes can be deployed
in a 2U space, which quadruples the
computing density of a 2U rack server and
thus greatly improves the space usage
efficiency of customers' server rooms.

Specifications
Chassis Model Maintenance Cooling
K24-E2-A0-R0-00 Rear I/O Air cooling

Form Factor 2U rack chassis, including 4 independent hot-swap single-socket compute nodes
Storage 24 × 2.5-inch SSDs (7 mm)/8 × E1.S SSDs

Power Supply 4 hot-swap 2,200W/2,000 W Platinum/Titanium PSUs with N+N redundancy

System Cooling 6 front 6056 system cooling fans with N+1 rotor redundancy

Operating Temperature 5°C to 35°C

Node Model Maintenance Cooling

KM1160-E2-A0-R0-00 Rear I/O Air cooling

Form Factor 1U half-width single-socket computing node

Processor One 4th Gen AMD EPYCTM processor per node

Memory Up to 12 DDR5 DIMMs per node, delivering a memory capacity of up to 6 TB

PCIe Expansion 2 × PCIe 5.0 x16 slots per node

I/O Expansion Slot Front: 2 × USB 2.0 ports, 1 × VGA port, 1 × power button, and 1 × UID button per node
Rear: 1 × RJ45 port, 1 × UID button, 1 × RST button, 1 × micro USB for debug, and 1 × micro USB per node
Internal: 1 × USB 3.0 port per node

Storage 24 × front 2.5-inch SSDs or 8 × E1.S SSDs, and 2 × internal SATA/PCIe M.2 SSDs per node

Computing Server Storage Server Multi-node Server

18
KR2460V2
Cloud Optimization-oriented 2U 4-socket Rack Server
for High-density Computing Platforms

Overview
The KR2460V2 is a high-end 4-socket rack server that features the 4th Gen Intel® Xeon® Scalable processors. It meets the
demands for high computing performance and large memory capacity, and also provides good solutions for customers
having density and storage requirements. Hence, it is perfect for application scenarios requiring high-density servers, such as
virtualization, database, SAP HANA, and HPC.

KR2460V2 Powered
Intel Processors

Features
High-density Computing Perfor- Diverse Storage Configurations Extremely High Scalability
mance
Two or four 4th Gen Intel® Xeon® Scalable Up to 24 × front 2.5-inch SAS/SATA/N- Up to 9 rear PCIe expansion slots and 2
processors integrated in a 2U space, VMe/E3.S drives or 25 × front 2.5-inch OCP 3.0 slots that can flexibly configure
with up to 60 cores, 120 threads, and up SAS/SATA drives, and 2 × internal M.2 1/10/25/100 Gb NICs, providing multiple
to 350W TDP per CPU; 3 UPI links per SSDs, meeting diverse storage needs. network interfaces options and a more
CPU at up to 16 GT/s; 64 DDR5 ECC flexible network structure for applica-
DIMMs (RDIMMs) at 4,800 MT/s, tions.
delivering superior speed, high availabili-
ty, and a memory capacity of up to 32TB.

Specifications
Model Maintenance Cooling
KR2460-X2-A0-R0-00 Rear I/O Air cooling

KR2460-X2-A0-F0-00 Front I/O Air cooling

KR2460-X2-C0-R0-00 Rear I/O Cold-plated liquid cooling

Processor Two or four 4 Gen Intel Xeon Scalable processors

th ® ®

Memory 64 DDR5 DIMM slots, delivering a memory capacity of up to 32 TB

Storage General Front I/O

Front: 24 × 2.5-inch SAS/SATA/NVMe/E3.S drives | 24 × E3.S Front: 8 × 2.5-inch SAS/SATA/NVMe drives
SSDs | 25 × 2.5-inch SAS/SATA drives
Internal: 2 × M.2 SSDs
I/O Expansion Slot Up to 9 PCIe expansion slots and 2 OCP 3.0 slots Up to 6 front PCIe expansion slots
Power Supply 1+1 redundant PSUs with the output power of 800W/1,300W/1,600W/2,000W/3,200W

Operating Temperature 5°C to 45°C (For details, refer to the White Paper)

Mission Critical Server Infrastructure Software Suite Global Business Operations

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 KR4480V2
4U 4-socket Mission Critical Server
for Highly-scalable Computing Platforms

Overview
The KR4480V2 is a high-end 4-socket rack server that features the 4th Gen Intel® Xeon® Scalable processors. Optimized with
powerful computing performance, flexible modular design, excellent scalability, better reliability and security features for
customers' data-intensive critical services, it is suitable for application scenarios such as large transaction databases,
in-memory databases, virtualization integration, HPC, deep learning, and ERP.

V2

KR4480V2 Powered
Intel Processors

Features
Powerful Computing Performance Diverse Storage Configurations Extremely High Scalability
Two or four 4 Gen Intel Xeon Scalable
th ® ®
Up to 24 × front 2.5-inch SAS/SATA/N- The server supports up to 16 PCIe
processors, with up to 60 cores, 120 VMe drives or 25 × front 2.5-inch expansion slots, including 1 dedicated
threads, and up to 350W TDP per CPU; 3 SAS/SATA drives, and 2 × internal M.2 slot for the OCP 3.0 card, or up to 15
UPI links per CPU at up to 16 GT/s; 64 SSDs, meeting diverse storage needs. PCIe expansion slots, including 2
DDR5 ECC DIMMs (RDIMMs) at 4,800 dedicated slots for OCP 3.0 cards,
MT/s, delivering superior speed, high providing multiple network port options
availability, and a memory capacity of up and a more flexible network structure for
to 32 TB. applications.

Specifications
Model Maintenance Cooling
KR4480-X2-A0-R0-00 Rear I/O Air cooling

Processor Two or four 4th Gen Intel® Xeon® Scalable processors

Memory 64 DDR5 DIMM slots, delivering a memory capacity of up to 32 TB

Storage Front: 24 × 2.5-inch SAS/SATA/NVMe drives, 25 × 2.5-inch SAS/SATA drives, 21 × 2.5-inch SAS/SATA drives + 4 × 2.5-inch SAS/SATA/NVMe
drives, or 12 × 3.5-inch SAS/SATA drives + 8 × 2.5-inch SAS/SATA/NVMe drives
Internal: 8 × SATA drives; NVMe RAID key; 2 × 2280/22110 M.2 SSDs with software and hardware RAID supported; 2 × TF cards
I/O Expansion Slot Up to 16 PCIe expansion slots, including 1 dedicated slot for the OCP 3.0 card;
or up to 15 PCIe expansion slots, including 2 dedicated slots for OCP 3.0 cards

Power Supply 1+1 redundant PSUs with the output power of 800W/1,300W/1,600W/2,000W

Operating Temperature 5°C to 45°C (For details, refer to the White Paper)

Computing Server Storage Server Multi-node Server

20
KR6880V2
High-end 8-socket Rack Server

Overview
The KR6880V2 is a high-end 8-socket server powered by 4th Gen Intel® Xeon® Scalable processors. With superb computing-
performance and extremely high reliability, it is dedicated for customers’ mission critical applications and is perfect for
scenarios such as large-scale transaction databases, SAP HANA, ERP, HPC, and mission critical virtualization.

V2

KR6880V2 Powered
Intel Processors

Features
Superb Computing Performance Ultra-high Stability Design Easy Maintenance
Eight 4 Gen Intel Xeon Scalable
th ® ®
The server adopts a fully modular The server supports dynamic load
processors, UPI links at up to 16 GT/s, design, with full redundancy of critical monitoring and intuitive display of its
fully upgraded DDR5 and PCIe 5.0, and vulnerable components and chips; it load status; supports LCD display to
I/O-balanced design that significantly includes SmartPPR supported memory improve human-machine interaction
reduces I/O access latency and and PSUs that supports dynamic power experience; supports embedded
improves entire server performance. capping; it also supports the fault oscilloscope and memory offline
warning mechanism that prioritizes diagnosis to quickly locate faults. It also
prevention over troubleshooting. supports one-click BIOS setting mode to
perfectly match customers’ service
applications.

Specifications
Model Maintenance Cooling
KR6880-X2-A0-R0-00 Rear I/O Air cooling

Processor Eight 4th Gen Intel® Xeon® Scalable processors

Memory 128 DDR5 DIMM slots, delivering a memory capacity of up to 64 TB

Storage Front: Up to 24 × 2.5-inch SAS/SATA/NVMe drives

Internal: 2 M.2 SSDs with software and hardware RAID supported, and up to 3 TF cards

I/O Expansion Slot Up to 18 PCIe slots, including 2 dedicated slots for RAID controller cards, and up to 4 OCP 3.0 slots
Power Supply 4 standard N+M redundant CRPS PSUs with the output power of 1,300W/1,600W/2,000W/2,200W/2,700W

Operating Temperature 5°C to 45°C (For details, refer to the White Paper)

Mission Critical Server Infrastructure Software Suite Global Business Operations

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 InManage
Overview
KAYTUS InManage is a new-generation intelligent IT infrastructure O&M management platform for industrial data centers.
This platform is applicable to multiple vendors’ IT devices on the market and provides functions such as resource manage-
ment, fault monitoring, performance monitoring, energy consumption management, report statistics, topology display, server
fault diagnosis, automatic repair reporting, firmware update/configuration, and OS deployment. InManage enables the unified
management of heterogeneous devices such as servers, storage devices, network devices, and security devices. It truly
promotes the intelligent management of data centers, helping customers build unattended data centers, improve O&M
efficiency, reduce O&M costs, and ensure the safe, reliable and stable operation of data centers.

Operation Interface

Features
Unified Asset Management Intelligent Energy Consumption Management
InManage provides fully automatic, end-to-end asset manage- InManage can use AI algorithms to aggregate and analyze data
ment capabilities, including: equipment installation, location such as device temperature, airflow and CUPS, and provide
identification, configuration verification, asset location changes, intelligent power consumption strategies and optimization
component changes, and equipment removal, enabling the suggestions; it provides carbon asset and carbon emission
tracking of asset changes throughout the full lifecycle. management functions for data centers, helping users achieve
carbon neutral goals.

Visual Topology Massive Monitoring

InManage implements the automatic topology of device InManage provides 24/7 real-time monitoring and fault warning
network links and 3D topology of cabinets in the server room, of devices by combining active and passive methods, thus
dynamically displaying the information about device tempera- supporting root cause analysis of failures and second-level
ture, power consumption, state, etc. monitoring of in-band performance indicators.

Efficient Stateless Management Third-party Integration

InManage provides the deviation alarm and automatic fix of Northbound interfaces, such as standard RESTful and SNMP,
firmware base version to upgrade and manage all device are provided to connect to third-party management systems.
firmware.

Computing Server Storage Server Multi-node Server

22
Global Manufacturing
and Business Operations
Milpitas CA Office Germany Office Taiwan R&D Center Singapore Operation Center

UK Office Turkey Office Korea Office Japan Office

India Call Center

2022

US Milpitas US Newark Facility 2020Vietnam PCBA and Server Factory Taiwan PCBA and Server Factory
Intelligent Factory Annual Capacity:100,000 Servers Annual Capacity: Annual Capacity:
Annual Capacity: 240,000 PCBA, 120,000 Servers 50,000 Servers, 50,000 PCBA
200,000 Servers

2 operation centers in Singapore and the U.S.A.

4 manufacturing facilities in the U.S.A., Vietnam, and Taiwan.
2 R&D centers
Meet the requirements of global customers with full market coverage, grow local sales coverage in U.S., Europe, UK, Japan, Korea
and Southeast Asia

Mission Critical Server Infrastructure Software Suite Global Business Operations

23
 Ultimate Innovation
Rigorous Standards Guarantee High Product Quality
KAYTUS has dedicated labs for product quality testing and process development. Thousands of tests in 40 categories are
provided for the entire lifecycle of servers from development to components, production, delivery and O&M. �The labs
conduct more than 2,000 tests on each product, including over 30 extreme-use tests.

Mechanical Environment Test Climatic Environment Test Power Integrity (PI) Test
Each product is subjected to thousands of shocks and The eight test categories, including highly accelerated The industry's first automated PI test platform covering
drops. In particular, the test to simulate a magnitude 9 life tests (HALT), high temperature, low temperature, high the entire process allows dynamic response testing at
earthquake goes beyond the existing standard for humidity, low humidity, temperature and humidity 40% higher stress than standard testing.
earthquake resistance (magnitude 8) for most buildings. cycling, rapid temperature cycling and thermal shock,
ensure that products can withstand harsh climates.

Signal Integrity (SI) Simulation Signal Integrity Test Electromagnetic Compatibility Test
Full-wave electromagnetic field simulation at DC 80 GHz The industry's first fully automated press-contact SI This test simulates the interference of static electricity,
analyzes signal transmission, reflection, and matching testing platform has positioned accuracy down to the μm lightning strikes, voltage transients, electrical fast
properties of 3D structures of server components. range, delivering a tenfold increase in efficiency. transient bursts, power-frequency magnetic fields, and
radiation emission in complex electromagnetic
environments.

Structural Heat Dissipation Test Failure Analysis Test DC Business Simulation Test
Accurate wind tunnel measurements ensure that fan and 46 tests in 6 categories include the PCB and component The world's largest aging stress test line supports
air duct designs meet fluid mechanics requirements and failure analysis; analysis of physical, chemical, and concurrent stress testing on 6400 �servers for up to 50
maximize heat dissipation performance to reduce power mechanical properties, �and board reliability test. hours.
consumption by 8%.

Computing Server Storage Server Multi-node Server

24
Mission Critical Server Infrastructure Software Suite Global Business Operations