ESP-02S
Product ——2.4GHz Wi-Fi Module
Version: 1.2 Date: May.18, 2018
Specification
Features Module Interface
SOC features 1 x UART
5 x PWM
Built-in Tensilica L106 ultra-low power
consumption 32-bit MCU, the main 1 x EN
frequency can be 80MHz and 160MHz, also Internal 2M SPI Flash
support RTOS;
Working temperature：-40℃-105℃
Built-in TCP/IP protocol stack;
Built-in 1 channel 10-bit high precision ADC; Module size：15mm×17.3mm×3mm
Interfaces include HSPI, UART, I2C, I2S, IR Applications
Remote Control, PWM, GPIO;
● Serial transparent transmission;
20uA deep-sleep current, less than 10uA cut-
off current; ● WiFi prober;
2ms wake-up time; ● Smart power plug/Smart LED light;
1.0mW consume power (DTIM3 and standby ● Mesh networks;
state); ● Sensor networks;
Wi-Fi features ● Wireless location recognition;
● Wireless location system beacon;
Support 802.11 b/g/n/e/i
● Industrial wireless control.
Support three modes: Station, SoftAP, and
SoftAP+STA; Module Type
Support Wi-Fi Direct (P2P);
Name Antenna Type
Support hardware acceleration for CCMP
(CBC-MAC, computation mode), TKIP (MIC, ESP-02S PCB ANT
RC4), WAPI(SMS4), WEP(RC4), CRC;
P2P detection, P2P GO mode/GC mode and Module Structure
P2P power management;
WPA/PA2 PSK and WPS;
Support 802.11 i security: pre-certification
and TSN;
Support 802.11n (2.4 GHz);
802.1h/RFC1042 frame encapsulation;
Support seamless roam;
Support AT remote upgrade and cloud OTA
upgrade;
Support Smart config function for Android
and iOS device.
Update Record
Date Version Update
2017-3-14 V1.0 Initial version
2017-3-18 V1.1 Add PCB design
2018-5-18 V1.2 Add system design
Table of Contents
1. Introduction ....................................................................................................................... 1
2. Interface Definition ........................................................................................................... 3
3. Shape and Size................................................................................................................... 5
4. Electronica Characteristics ................................................................................................ 6
5. Power Consumption .......................................................................................................... 6
6. Wi-Fi RF Characteristics ................................................................................................... 7
7. Recommended Sold Temperature Curve .......................................................................... 8
8. Minimum User System...................................................................................................... 9
9. Recommended Layout Design ......................................................................................... 9
10. Peripheral Design Suggestion ....................................................................................... 11
11. Product Handling........................................................................................................... 11
12. Packing Instruction ........................................................................................................ 11
1. Introduction
The WiFi module ESP-02S is manufactured by using a high-performance chip named ESP8266. This
small chip is encapsulated an enhanced Tensilica’s L106 diamond series 32-bit kennel CPU with a
SRAM. Thus, ESP8266 has the complete function Wi-Fi function; it can be applied independently, and
also can be used as a slaver working with other host CPU. When ESP8266 is applied as a slaver, it can
start from the onboard flash. The built-in high-speed buffer is not only benefit to improve the system
performance, but optimize the store system. In addition, ESP-02S WiFi module can be used as Wi-Fi
adapter by SPI/SDIO or I2C/UART interface, when it is applied to other MCU design.
The ESP-02S WiFi module supports the standard IEEE802.11 b/g/n/e/i protocol and the complete TCP/IP
protocol stack. User can use it to add the WiFi function for the installed devices, and also can be viewed
as an independent network controller. Anyway, ESP-02S module provides many probabilities with the
best price.
Fig. 1.1 ESP-02S Module Structure
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Technical parameters for ESP-02S are listed as follows.
Table 1.1 ESP-02S Parameters
Type Items Parameters
Frequency 2.4G~2.5G(2400M~2483.5M)
802.11b: +20 dBm
Transmit power 802.11g: +17 dBm
802.11n: +14 dBm
Wi-Fi
802.11b: -91 dBm (11Mbps)
Receiver sensitivity 802.11g: -75 dBm（54Mbps）
802.11n: -72 dBm（MCS7）
Antenna PCB antenna
CPU Tensilica L106 32 bit MCU
UART/SDIO/SPI/I2C/I2S/IR control
Interface
GPIO/ADC/PWM/SPI/I2C/I2S
Working voltage 2.8V ~ 3.6V
Hardware
Working current Average current: 80 mA Peak current: >200mA
Working temperature -40°C ~105°C
Environment temperature -40°C ~ 105°C
Shape 15 x 17.3 x 3mm
Wi-Fi working mode Station/SoftAP/SoftAP+Station
Security mode WPA/WPA2
Encryption type WEP/TKIP/AES
Software
Update firmware UART Download/OTA
Software develop Non-RTOS/RTOS/Arduino IDE etc.
Network protocol IPv4, TCP/UDP/HTTP/FTP/MQTT
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2. Interface Definition
ESP-02S module interface definition is shown as below.
Fig. 2.1 ESP-02S Pins Definition
Working mode and pins function are shown in Table 2.1.
Table 2.1 Working mode
Mode D0 Level D2 Level
UART Download Mode Low High
Flash Boot Mode High High
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Table 2.2 Pin Function Definition
Num. Definition Type Function
1 RST I Effective: Low level. Used to reset the module. Internal pull-up;
2 AD I/O A/D pin. Voltage Range: 0-1V. 10bit resolution;
3 D13 I/O GPIO13
4 D4 I/O GPIO4
5 D5 I/O GPIO5
6 D14 I/O GPIO14
7 D12 I/O GPIO12
8 TX0 I/O GPIO1; UART Txd;
9 RX0 I/O GPIO3; UART Rxd; Irad control pin. Refer to the appendix;
10 GND P GND;
11 VCC P POWER：3.3V/200mA;
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3. Shape and Size
Shape and size for ESP-02S can be shown as follows. The internal flash of ESP-02S is 16 Mbits.
Fig.3.1 Shape for ESP-02S
(a) Vertical View
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(b) Side View
Fig. 3.2 Size for ESP-02S
Fig. 3.3 PCB Layout for ESP-02S
Table 3.1 Size for ESP-02S
Length Width Height PAD Size (bottom) Distance between Pins
15 mm 20 mm 3 mm 1 mm x 1.6mm 2.0 mm
4. Electronica Characteristics
Table 4.1 Electronica Characteristics
Parameters Condition Min Classical Max Unit
Store Temperature - -40 Normal 125 ℃
IPC/JEDEC
Sold Temperature - - 260 ℃
J-STD-020
Working Voltage - 2.8 3.3 3.6 V
VIL/VIH - -0.3/0.75VIO - 0.25VIO/3.6
I/O
I/O VOL/VOH - N/0.8VIO - 0.1VIO/N
IMAX - - - 12 mA
Electrostatic release
TAMB=25℃ - - 2 KV
quantity (Human model)
Electrostatic release
TAMB=25℃ - - 0.5 KV
quantity (Machine model)
5. Power Consumption
Table 5.1 Power Consumption
Parameters Min Classical Max Unit
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Tx802.11b, CCK 11Mbps, POUT=+17dBm - 170 - mA
Tx802.11g, OFDM 54 Mbps, POUT =+15dBm - 140 - mA
Tx802.11n,MCS7,POUT =+13dBm - 120 - mA
Rx 802.11b，1024 Bytes, -80dBm - 50 - mA
Rx 802.11g，1024 Bytes, -70dBm - 56 - mA
Rx 802.11n，1024 Bytes, -65dBm - 56 - mA
Modem-sleep① - 15 - mA
Light-sleep② - 0.9 - mA
Deep-sleep③ - 20 - μA
Note:
① : Modem-Sleep mode can be used for the case that CPU is always working, e.g., PWM or I2S etc. If
WiFi is connected and no data is to transmit, in this case, WiFi modem can be closed to save power
energy. For example, if at DTIM3 status, keep asleep at 300ms, then the module can wake up to receive
the Beacon package within 3ms and the current being 15mA.
②: Light-Sleep mode can used for the case that CUP can stop the application temporally, e.g., Wi-Fi
Switch. If Wi-Fi is connected and there is no data packet to transmitted, by the 802.11 standard (e.g., U-
APSD), module can close Wi-Fi Modem and stop CPU to save power. For example, at DTIM3, keep up
sleeping at 300ms, it would receive the Beacon package from AP after each 3ms, then the whole average
current is about 0.9mA.
③ Deep-Sleep mode is applied to the case that Wi-Fi is not necessary to connect all the time, just send a
data packet after a long time (e.g., transmit one temperate data each 100s) . It just need 0.3s-1s to
connect AP after each 300s, and the whole average current is much smaller 1mA.
6. Wi-Fi RF Characteristics
The data in the following Table is gotten when voltage is 3.3V and 1.1V in the indoor temperature
environment.
Table 6.1 Wi-Fi RF Characteristics
Parameters Min Classical Max Unit
Input frequency 2412 - 2484 MHz
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Input impedance - 50 - Ω
Input reflection - - -10 dB
At 72.2Mbps, output power consumption for PA 15.5 16.5 17.5 dBm
At 11b mode, output power consumption for PA 19.5 20.5 21.5 dBm
Sensibility
DSSS, 1Mbps - -98 - dBm
CCK11, Mbps - -91 - dBm
6Mbps(1/2 BPSK) - -93 - dBm
54Mbps(3/4 64-QAM) - -75 - dBm
HT20, MCS7(65 Mbps, 72.2 Mbps) - -72 - dBm
Adjacent Inhibition
OFDM, 6Mbps - 37 - dB
OFDM, 54Mbps - 21 - dB
HT20, MCS0 - 37 - dB
HT20, MCS7 - 20 - dB
7. Recommended Sold Temperature Curve
(1) Reflow Times <= 2 times (Max.)
(2) Max Rising Slope: 3℃/sec
(3) Max Falling Slope: -3℃/sec
(4) Over 217℃ Time: 60~120 sec
(5) Peak Temp:240℃~250℃
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Fig.7.1 Recommended Reflow Profile
8. Minimum User System
This module can work just at 3.3V working voltage:
Note:
(1) The working voltage for module is DC 3.3V;
(2) The max current from IO of this module is 12mA;
(3) RST Pin is enabled when it is low level; and EN pin is enabled when it is high level;
(4) WiFi module is at update mode: GPIO0 is low level, then module reset to power; Wi-Fi module is at
working mode: GPIO0 is at high level, and then reset to power;
(5) Wi-Fi module is connected to RXD of the other MCU, and TXD is connected to RXD of the other
MCU.
9. Recommended Layout Design
ESP-02S module can be sold on PCB board directly. For the high RF performance for the device, please
notice the placement of the module. There are three ways to use the module for Wi-Fi Module with PCB
antenna.
Solution 1: optical solution. The Wi-Fi module is placed on the side of the board, and the antennas are all
exposed, and there is no metal material around the antenna, including wires, metal casings, weight plates,
and the like.
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Solution 2: sub-optical solution. The Wi-Fi module is placed on the side of the board, and the antenna
below is hollowed out. There is a gap of not less than 5 mm reserved with the PCB, and there is no metal
material around the antenna, including wires, metal casings, weight plates, and the like.
Solution 3: The Wi-Fi module is placed on the side of the board, and the PCB area under the antenna is
empty, and copper cannot be laid.
Fig.9.1 Solution 1
Fig.9.2 Solution 2
Fig.9.3 Solution 3
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10. Peripheral Design Suggestion
Wi-Fi module is already integrated into high-speed GPIO and Peripheral interface, which may be
generated the switch noise. If there is a high request for the power consumption and EMI characteristics,
it is suggested to connect a serial 10~100 ohm resistance, which can suppress overshoot when switching
power supply, and can smooth signal. At the same time, it also can prevent electrostatic discharge (ESD).
11. Product Handling
11.1 Storage Conditions
The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
60%RH. If the above conditions are not met, the module needs to be baked.
11.2 Electrostatic Discharge (ESD)
• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V
12. Packing Instruction
The product is packed in a tray, as shown in the following figure.
The size of the single box is: 340 x 360 x 60mm, and 1000 pieces module is in the box. And the outer box
size is 355 x 375 x 325mm, including 5 single box which include 5000 pieces module.
Fig.13.1 Module package
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