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Prospects For Advances in Power Magnetics

The document discusses the importance of magnetics in power conversion circuits, highlighting their impact on size, power loss, cost, and design complexity. It explores avenues for improvement, including better designs, materials, and the potential for higher frequencies to enable miniaturization and efficiency gains. The document also addresses challenges and opportunities in developing air-core versus magnetic core inductors and the ongoing research in thin-film and nano-composite magnetic materials.

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hunterpeter2023
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0% found this document useful (0 votes)
27 views57 pages

Prospects For Advances in Power Magnetics

The document discusses the importance of magnetics in power conversion circuits, highlighting their impact on size, power loss, cost, and design complexity. It explores avenues for improvement, including better designs, materials, and the potential for higher frequencies to enable miniaturization and efficiency gains. The document also addresses challenges and opportunities in developing air-core versus magnetic core inductors and the ongoing research in thin-film and nano-composite magnetic materials.

Uploaded by

hunterpeter2023
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 57

Prospects for Advances

i Power
in P Magnetics
M ti
C
Charles R. S
Sullivan
[email protected]

Dartmouth Magnetics and Power


Electronics Research Group

http://power.engineering.dartmouth.edu 1
Why Magnetics?
 Magnetics
g ((inductors and transformers)) are
required for most power conversion circuits, but
are responsible for much of the
 Size ((volume
Si l and
d weight)
i ht)
 Power loss
 Cost
 Difficulty in design (long development cycles)
 Magnetics are (almost) only used for power
 Less R&D than semiconductors.
 Less expertise among designers and users
users.

power.thayer.dartmouth.edu 2
Improvement avenues
 Better designs and design methods
methods.
 Better materials.
 Higher frequencies enabled by SiC and GaN.
GaN
(size 1/f ?)
 Or Si at low voltage; or circuit designs
designs…
 Materials and design needed for higher
frequencies.
 Higher frequencies enable new designs and
materials.

power.thayer.dartmouth.edu 3
Directions nott mutually
t ll exclusive
l i

Miniaturization:
V
Very hi h ffrequency,
high
integrated, thin-film, small,
and (eventually) low cost.

Ultra-high efficiency:
Efficiencies in the high
g
90’s without increasing
size or cost.

High-power
High-frequency,
high-efficiency at
m lti MW scale.
multi-MW scale

power.thayer.dartmouth.edu 4
Miniaturization vs
vs. efficiency
Reduced size at constant efficiencyy

Balanced benefits
Technology
Power allowing
Improved efficiency at constant size
density miniaturization

Th
Thermal
l limit
li it
size

loss Efficiency
 Because of thermal limits, miniaturization dividends
must be taken partly in efficiency.

power.thayer.dartmouth.edu 5
Miniaturization vs.
vs efficiency vs.
vs cost
Not an option

Short term: increased or constant cost


Long term: reduced cost
Technology
Power allowing
Increased cost
density miniaturization

Th
Thermal
l lilimitit
size

loss Efficiency
 Bottom line: any progress on cost, size, or efficiency can be used to
improve all of the above.
 In addition: Reduced cost facilitates adoption of efficient technology.

power.thayer.dartmouth.edu 6
Miniaturization theory and
practice
■ Simple theory: increase frequency
volume  mass  cost  1/f
■ Problem: power losses  fX
■ Windings: skin effect and proximity effect.
Skin Depth
Frequency 60 Hz 20 kHz 200 kHz 1 MHz 10 MHz
Skin depth, δ 8.5 mm 0.467 mm 0.148 μm 66 μm 21 μm
AWG for d = δ AWG 0 AWG 24 AWG 35 AWG 42 AWG 51

■ Cores: hysteresis, eddy-current, and “anomolous”


losses increase with frequency.

power.thayer.dartmouth.edu 7
“Performance factor” for
MnZn power ferrites
ferroxcube
 Curves of BB·ff
product for 30 kHz·T
constant power
loss density.
density
 Looks like 200 mT

rapidly 20 kHz·T
accelerating
gains beyond 1
MHz!
 Shouldn’t
Sh ld ’t we
see frequencies
above 1 MHz plotted for 500 mW/cm3
rapidly
idl adopted?
d t d?

power.thayer.dartmouth.edu 100 kHz 1 MHz 8


Performance factor
factor, linear scale
90
80
70
T)

60
f x B ((MHz mT

50
40
30
20
10
0
0 1 2 3 4 5 6 7
f (MHz)
power.thayer.dartmouth.edu 9
Performance factor,
factor log scale
100
T)
f x B ((MHz mT

Slope = 1/2

10
0.01 0.1 1 10
f (MHz)
power.thayer.dartmouth.edu 10
Modified performance factor
 Accounts for worse winding loss at HF
HF.
 B x f 0.75 70
60
^0.75 mT MHz^0.75
5

50

40

30

20
f x B^

10

0
0.01 0.1 1 10
f (MHz)
power.thayer.dartmouth.edu 11
Material requirements for >1 MHz
 Performance factor must increase at least ~ f 0.5
 Goal: modified performance factor
> 100 (mT MHz 0.5 ) at 500 mW/cm3
 Consider higher power density spec for small components.
 Nothing commercial but much research activity.
 Some thin-film
S thi fil materials
t i l
 Many projects on ARPA-E ADEPT program
 IEEE Power System-On-Chip
y p Workshop p ((PowerSoC))
San Franciso Nov. 16-18.
 Many sessions on soft materials announced for
intermag/MMM Jan 2013
2013.

power.thayer.dartmouth.edu 12
Air core vs
Air-core vs. magnetic core

coil coil
Magnetic
Core:
soft
ft
magnetic
material
 “Air core”  Magnetic core with relative
is really any increases L (inductance) permeability
non-magnetic,
g by a factor μr, μr >> 1
dielectric typ. 4 ~10,000
material.  Allows smaller volume,
fewer turns for same L ((B = μr·μ
μ0·H))

power.thayer.dartmouth.edu 13
The case for air
air-core
core
 At veryy high
g frequencies
q
(e.g. VHF = 30 MHz to 300 MHz), the inductance value is
small and readily achievable without magnetic materials.
 Always gets better at higher frequency:
At constant η (constant Q): Volume proportional to f -3/2
At constant heat flux: Volume proportional to f -1/2
with Q improving as f 1/3
 Avoid magnetic material disadvantages:
 Power losses due to hysteresis and eddy currents.
 Frequency limitations: any material gets too lossy above some
frequency, often only a few MHz.
 Not available in standard IC or packaging processes.
 Can be used as a flotation device in case of flooding
flooding.

power.thayer.dartmouth.edu 14
Air core challenges
Air-core
 Low permeability leads to low flux density, which
requires substantial volume for sufficient flux.
 Requires more turns → more winding loss.
 Fl is
Flux i nott contained
t i d by
b a core; external
t l flflux can
cause EMI problems and eddy-current loss in nearby
conductors.
 Requires significant air volume.

power.thayer.dartmouth.edu 15
Air core geometries
Air-core
Our work
C.P. Yue,
CMU

Toroid Planar spiral


 No external flux  Flux in substrate,
problem. surroundings.
g
 Field is parallel to
 Field perpendicular to
conductor: low eddy
currents. conductor: high eddy currents.
 Easy to make.
 Harder to make.

 Q: can be > 100  Typical Q:

< 10 for 1 GHz


< 4 for 100 MHz
power.thayer.dartmouth.edu 16
Air-core performance limits

100
um Q

 Field between two


layers of copper (e
(e.g.
g
Maximu

large-footprint toroid)

300 MHz 100 MHz 30 MHz


10

1
10 μm 100 μm 1
mm  Requires height for
Height
flux path!
power.thayer.dartmouth.edu 17
Air core: area requirement
Air-core:
140
 Data for: Solenoid
120 1:1 Solenoid
 3 mm height Toroid
 10 MHz y x
100
 For >10 MHz best design
1.3 X
and moderate 80
4X
miniaturization, 60
Q of b

air-core can
work. 40

 S l
Solenoidid may 20
require 4X
smaller area. 0
0.01
0 01 01
0.1 1 10 100 1000
2
area (cm )

power.thayer.dartmouth.edu 18
Options to improve vs
vs. air
air-core
core
 Multilayer copper
copper—each
each layer thin compared
to a skin depth. Can improve Q by a factor: p
where p is number of copper
pp layers.
y
 Magnetic material. Can improve by a factor μr,
the relative p
permeability,
y e.g.
g 10 to 10,000, if:
 Avoid saturation.
 Loss in the magnetic material is negligible.

power.thayer.dartmouth.edu 19
Thin film magnetic materials
Thin-film
 Typically alloys with Fe
Fe, Co and or NiNi.
 Sputtered or electroplated.
 R l ti permeability
Relative bilit μr in
i th
the 100’
100’s or 1000’
1000’s.
 Resistivity ~ 20 – 600 μΩ·cm;
 High end preferred for low eddy-current loss
 May still need laminations.
 Hysteresis loss?

power.thayer.dartmouth.edu 20
Magnetic anisotropy
 Hard axis loop provides:
 Low
1 5 permeability
1.5
needed to avoid Easy Axis
saturation
1.0 in inductors.
 Low
L h
hysteresis
t i lloss.
0.5
Hard Axis:
M ((T)

00
0.0 Near perfect
Near-perfect
lossless loop
-0.5

-1.0

-1.5
-1 5
-200 -100 0 100 200
Field (Oe)
power.thayer.dartmouth.edu 21
Nano composite magnetic materials
Nano-composite
Magnetic Metal
(3~5 nm Co
Particles)

Ceramic (Al2O3, ZrO2, etc.)

Advantages:
 Ferromagnetic (coupled particles)

 High resistivity (300 ~ 600 μΩ·cm) controls eddy-


currentt loss
l independent
i d d t off flflux di
direction.
ti
 Some have strong anisotropy for low permeability

and low hysteresis loss.

power.thayer.dartmouth.edu 22
Permeabilty vs.
vs frequency
1000


100  c
Q = 370 Q = 37
eability

10  
Perme

 c
1

01
0.1
1 10 100 1000 10000
Frequency ( MHz )
power.thayer.dartmouth.edu 23
TEM of multilayer nanogranular film
Co
C
O
Si

HRTEM11

100 nm

power.thayer.dartmouth.edu 24
Modified Performance Factor
 Preliminary results on a single sample
sample….
300
Ni-Fe-Zr-O
^0.75 mT MHz^0.75
5

250

200

150

100
f x B^

Ferrites
50

0
0.01 0.1 1 10
f (MHz)
power.thayer.dartmouth.edu 25
T
Two types
t off inductors
i d t
Pot-core Toroidal

 Core wraps winding  Winding wraps core

power.thayer.dartmouth.edu 26
Microfabricated inductors
Pot-core Toroidal
(MCM) (CMC)

 Two magnetic depositions  Does not work with


 Uses magnetic material uniaxial anisotropy
only in hard axis
power.thayer.dartmouth.edu 27
Racetrack inductors fabricated at Dartmouth
18

16

14
12

Quality factor
10

6 7-turn inductor A
7 turn inductor B
7-turn
4 8-turn inductor A
2 8-turn inductor B
Previous 7-turn
0
1 10 100
Frequency (MHz)
1000

800

Inductance (nH)
600

400
7-turn inductor A
7-turn inductor B
200 8-turn inductor A
8-turn inductor B
Previous 7-turn
0
2/25/2013 1 10 100 28
Frequency (MHz)
Other inductors
we’ve
we ve developed
 V-groove
V groove 1
1-turn
turn inductor
for high current (up to 12 A)
 Polyimide
P l i id substrate
b t t withith sputtered
tt d
material on both sides
 Microfabricated coupled inductors
(2004, with Tyndall)

power.thayer.dartmouth.edu 29
Performance:
power density and efficiency
efficiency.
 2011 V-groove:
V groove: 2011
V-groove
measured
inductor with 2005 2012
calculated
l l t d circuit
i it V-groove Racetrack

 2012 Racetrack:
100 V in,
36 V out,
First test—
process in
progress.

power.thayer.dartmouth.edu 30
Flux crossing magnetic laminations

 Problem in corners
where top and bottom
magnetic core halves
j i
join.
 Excess eddy currents
limit efficiency and Q.

31
Solution: Toroidal inductors
 Advantage:
 Flux stays in plane, minimizing eddy-current losses.
 Challenge:
 Flux direction varies;; sometimes oriented incorrectlyy for the
magnetic material anisotropy.
 Solution:
 Induced radial anisotropy,py, such that flux travel is always
y in the
low-loss hard-axis direction.
Winding Radial anisotropy

Core
Flux

32
Concept

 Use permanent-magnet
permanent magnet array to apply field
during deposition
ring
i magnets
t di magnets
disc
iron sheet

33
Fixture to deposit toroidal cores with
radial anisotropy
1st g
gen. Toroidal core size:
substrate
19 mm 
copper

iron
8 mm
ID=8 mm, OD=16 mm

magnet 12 4 mm
12.4

8 mm
25 4 mm
25.4

Polyimide
substrate

Copper

Iron

Magnets

power.thayer.dartmouth.edu
Iron 34
Hysteresis measurements confirm
radial anisotropy

A square sample about 1 mm


Square by
sample 1 mm was cut for
B-H loops
p with a radial field: p without a radial field:
B-H loops
measurements
1.5 1.5
easy-axis loop
radial loop
hard-axis loop
1 hard-axis minor loop 1 1 circumferential loop
hard-axis minor loop 2

0.5 0.5

B (unncalibrated)
ncalibrated)

0 0
B (un

-0.5 -0.5

-1 -1

-1.5 -1.5
-200 -150 -100 -50 0 50 PowerChip
100 -200
150 - Integrated
200 -150 -100
Power -50 0 50 100 150 200
drive field (Oe) Electronics drive field (Oe) 35
Complex permeability of toroidal
samples

1000

relatiive permeaability

Q r

100
 
r
10

0.1
10 100 1000 3000
f (MHz)

36
Ultra high efficiency
Ultra-high
Miniaturization:
V
Very hi h ffrequency,
high
integrated, thin-film,
small, and (eventually)
low cost.
cost

Ultra-high efficiency:
Efficiencies in the high
g
90’s without increasing
size or cost.

High-power
High-frequency, high-
efficiency at multi-MW
scale
scale.

power.thayer.dartmouth.edu 37
Ultra high efficiency
Ultra-high
 Accurate loss models are essential:
 Understand all sources of loss.
 Optimize to get ultra-high
ultra high efficiency without high
cost.
 Co-design with circuits.
 Frequency and material choice:
 Magnetic material for > 1 MHz?
 Probably < 1 MHz, using advanced
semiconductors for low loss not high frequency.

power.thayer.dartmouth.edu 38
Loss modeling and optimization
 Cores: data sheets report loss with sine
waves, but power converters use square
waves. Nonlinear behavior means Fourier
analysis doesn’t help.
 Methods available but more research needed.
 Windings:
Need wire much smaller than a skin depth.

power.thayer.dartmouth.edu 39
Present best technology for low
winding loss: litz wire

Image: Noah Technologies

power.thayer.dartmouth.edu 40
Litz wire progress
 History
 Invention: 1888, Sebastian de Ferranti.
 A l i 1917 H
Analysis Howe; 1926 BButterworth.
tt th
 Optimization, 1997, 1998; CAD tools 2003.
 Low loss up to ~1 MHz.
 Needs:
 Extend to 10~100 MHz.
 Lower cost.

power.thayer.dartmouth.edu 41
Litz wire design options
Litz-wire
10
32

34

36
L
Loss
rmalized Loss

38
Full-bobbin design—
40 double the loss of cheaper
Norm

design.
42
1
Cheaper and 44
Good design
lower loss 46
requires optimization
48
50
0.1 1 10 100
Cost….~ amount of Cu
Normalized Cost

power.thayer.dartmouth.edu
Litz > 1 MHz
 Available improvement vs
vs. single
single-layer
layer
solid wire:

60 Hz 20 kHz 200 kHz 1 MHz 10 MHz


8.5 mm 0.467 mm 0.148 μm 66 μm 21 μm
AWG 0 AWG 24 AWG 35 AWG 42 AWG 51

 Factor of 3
3.6
6 with AWG 48 at 1 MHz
 Factor of 1.4 at 10 MHz with AWG 50

power.thayer.dartmouth.edu 43
Litz > 3 MHz
 Goal: dimensions smaller than 15 μm
 Possibilities:
 Improved wire drawing and handling.
 Foils and films…might need to interchange
layers.
 Research goal: achieve current sharing
b t
between layers
l without
ith t iinterchanging.
t h i

power.thayer.dartmouth.edu 44
Other metals?
Metal Resistivity ρ (conductor
( d t grade)
d )

Silver (Ag) 1.59 Ω·cm


C
Copper (C
(Cu)) 1 72 Ω·cm
1.72 Ω
Gold (Au) 2.44 Ω·cm
Aluminum (Al) 2.83 Ω·cm
 Note units: cm not kg g
 Price per kg is irrelevant:
consider price per volume
volume.

power.thayer.dartmouth.edu
Costs: Cu vs
vs. Al
 Mass:
$9.20/kg vs. $2.40/kg (Irrelevant)
 Volume:
8.2 ¢/cm3 vs. 0.65 ¢/cm3 12X
 Resistance:
$Ω $Ω
14 m2 vs. 1.8 m2 7.7X
 Actual Al magnet
g wire p
prices aren’t that g
good,, but
even at the same price per kg, Al is ½ the price for
the same resistance.

power.thayer.dartmouth.edu
Can Al work at high frequency?

power.thayer.dartmouth.edu 47
Measured transformer ac resistance

Rac

Al 28%
worse
(30%
measured)
 29 turns of 0.5
mm (AWG 24) Al
wire. Al no worse
 T
Two layers
l on
EE19 core. Cu
Al 64% worse (61% measured)

power.thayer.dartmouth.edu
Cost and loss of Al vs.
vs Cu
 For same dc resistance
resistance, Al is >7X cheaper
(commodity price).
 Advantages at high frequency are even
greater than at low frequency.
 Only reasons for Cu:
 Where compact size is more important than
efficiency,
y, cost,, temperature
p or weight.
g
 If termination cost difference exceeds wire
cost difference.

power.thayer.dartmouth.edu
Directions Miniaturization:
atu at o
• Higher frequency
• Thin film
microfabrication
• Ferrites > 10 MHz,
conductors > 10 MHz

Ultra-high
Ult hi h efficiency:
ffi i
Materials and
techniques to lower
cost and optimize
designs

High-power
High-frequency, high-
efficiency at multi-MW
scale
scale.

power.thayer.dartmouth.edu 50
High Power
Miniaturization:
V
Very high
hi h ffrequency,
integrated, thin-film,
small, and (eventually)
low cost.
cost

Ultra-high efficiency:
Efficiencies in the high
g
90’s without increasing
size or cost.

High-power
High-frequency, high-
efficiency at multi-MW
scale
scale.

power.thayer.dartmouth.edu 51
High power characteristics
High-power
 Large size makes two particular
challenges
h ll severe:
 Overall winding size is large compared to
skin
ki ddepth.
th 10 cm scalel att 10 kH
kHz h
has th
the
same ratio (150) as mm scale for 100 MHz.
 Th
Thermal l management—low
t l surface-area
f
to volume ratio.
 Nanocrystalline
N t lli magnetic ti materials:
t i l
better than ferrite at < 100 kHz, high flux
density.
densit
power.thayer.dartmouth.edu 52
Existing magnetics
10 MW

1 MW

100 kW

10 kW

1 kW

100 W

10 W
Emerging
1W thin-film
60 Hz 1kHz 10 kHz 100 kHz 1MHz 10 MHz 100 MHz

power.thayer.dartmouth.edu 53
Needed with new semiconductors
10 MW

1 MW

100 kW

10 kW

1 kW

100 W

10 W
Emerging
1W thin-film
60 Hz 1kHz 10 kHz 100 kHz 1MHz 10 MHz 100 MHz

power.thayer.dartmouth.edu 54
Projected capability
10 MW

1 MW

100 kW

10 kW

1 kW

100 W

10 W
Emerging
1W thin-film
60 Hz 1kHz 10 kHz 100 kHz 1MHz 10 MHz 100 MHz

power.thayer.dartmouth.edu 55
Research opportunities
10 MW

1 MW
New magnetic
100 kW materials and
conductor
10 kW apporaches?

1 kW ?
100 W

10 W
Emerging
1W thin-film
60 Hz 1kHz 10 kHz 100 kHz 1MHz 10 MHz 100 MHz

power.thayer.dartmouth.edu 56
Selected references
Tutorial/overview on integrating magnetics for on-chip power converters with 66 references and
more extensive discussion of air-core and magnetic-core miniaturized power magnetics:
 C.R. Sullivan, “Integrating Magnetics for On-Chip Power: Challenges and Opportunities,”
Invited paper. IEEE Custom Integrated Circuits Conference, Sept. 2009.
Ad
Advanced d modeling
d li off losses
l in
i multilayer
ltil thi
thin-film
fil materials,
t i l andd also
l iintroduces
t d a modified
difi d
performance factor for magnetic materials that is more appropriate for high-frequency designs:
 Di Yao and C.R. Sullivan, “Effect of Capacitance on Eddy-Current Loss in Multi-Layer
Magnetic Films for MHz Magnetic Components,” IEEE Energy Conversion Conference and
Exposition Sept.
Exposition, Sept 2009.
2009
Measurements of losses in ferrites with non-sinusoidal waveforms that show phenomena not
expected based on existing models:
 C.R. Sullivan, J.H. Harris, E. Herbert “Core Loss Predictions for General PWM Waveforms
from a Simplified
p Set of Measured Data,”, IEEE Applied
pp Power Electronics Conference,, Feb.
25, 2010.
A high-level theoretical overview of the potential for reducing winding loss:
 M.E. Dale and C.R. Sullivan. “Comparison of Single-Layer and Multi-Layer Windings with
Physical Constraints or Strong Harmonics.” IEEE International Symposium on Industrial
Electronics, July 2006.
Aluminum windings for high-frequency applications:
 C.R. Sullivan, "Aluminum Windings and Other Strategies for High-Frequency Magnetics
Design in an Era of High Copper and Energy Costs." IEEE Transactions on Power
El t i
Electronics, 23(4) JJuly
l 2008

power.thayer.dartmouth.edu 57

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