JAWED IBRAHIMI

COMPUTER CENTER
INSTRUCTOR: MOHAMMAD ISMAIL SAHAK

A+
Hardware
IN THIS CHAPTER WE WILL LEARN:

 Describe how computing devices work

 Identify common connectors and devices on a typical computer system
 Discus features common to operating software.
CHARLES BABBAGE AND COMPUTER
WHAT IS A COMPUTER

output

 A Computer is an electronic machine

 It takes input data

Processes
 Processes that data
 And give output according to instruction of a user

Input
STAGES OF PROCESS

 Input
 Processing
 Output
COMPLETE STAGE OF COMPUTER PROCESS AND COMPONENTS

 Input
 Process
 Output
 Storage
 Network
COMPUTING DEVICES
COMPUTING DEVICES
COMPUTING DEVICES
COMPUTER PARTS

 Modern Computing Device Consists of :

 Hardware
 Software
HARDWARE AND SOFTWARE
FRONT AND BACK PANEL OF CONNECTIONS
INSIDE OF A PC
COMPUTER SOFTWARE

 Software is set of programs that run computer hardware

Software

System Software Application software

1. Application Software
1. Operating system Ms Office
Windows, Mac, Linux 2. Custom
2. Device drivers ▪ Azay pay
▪ database
OPERATING SYSTEM

 Is the core software of a computer

 An interface between user and computer hardware
 Set of many software that runs the computer hardware and control the activities of a compuer.
OPERATING SYSTEM

 We have two types of OS according to source code:

 Open source (Linux, Ubuntu, Red Hate, Android
 Close source ( Windows, IOS)
USER INTERFACE

 GUI (Graphical User Interface) CLI (Command Line Interface)

MICROPROCESSOR
MICROPROCESSOR
ALSO KNOWN AS CPU

 CPU stand for central processing unit

 CPU, or central processing unit, controls and directs all the activities of the computer.
WHAT IS A CPU OR PROCESSOR?
(PHYSICAL)

 Processor is a small silicon chip consist of:

 Million of transistors
 Some registers
PROCESSOR

 It takes the input data, process that data and gives

the output (information) to the output device.
HOW DOES IT WORKS?
LOGICAL

output

Processes
Input
BUS

 What is bus?
 Tiny lines or traces on any circuit board of computer through which data is transferred is called bus.
 The speed of a bus is measured in mega hertz (Mega Hertz)
MODERN CPU DEVELOPER
MODEL NAME

 Market intel AMD

 Desktop Core i3/i5/i7/i9 A-Series Pro/Ryzen/ Ryzen Thread-ripper

 Budget Desktop Pentium/Celeron Sempron/Athlon/FX/A-Series

 Portable/ Mobile Core i3/i5/i7(mobile), Ryzen/A-Series

core M, Atom
 Server Xeon Opteron

 Workstation Xeon Ryzen pro/Ryzen thread-ripper

 INTEL CPU GENERATION
Series & Brand Name Year Generation
Core i3/i5/i7 2010 1st Gen
Core i3/i5/i7 2011 2nd Gen
Core i3/i5/i7 2012 3rd Gen
Core i3/i5/i7 2013 4th Gen
Core i3/i5/i7 2014 5th Gen
Core i3/i5/i7 2015 6th Gen
Core i3/i5/i7 2016 7th Gen
Core i3/i5/i7 2017 8th Gen
Core i3/i5/i7/i9 2018 9th Gen
Core i3/i5/i7/i9 2019 10th Gen
Core i3/i5/i7/i9 2021 11th Gen
Core i3/i5/i7/i9 2021 12th Gen
CODE NAMES

 AMD FX8370E  T= Power- Optimized life

 Intel Core i5 6500T
 FX =Series Name  H-Higher Performance
Graphic
 8 = Number of Core  Core =Series Name
 i5 = brand within Core  HQ= Quad Core, high
 3= Generation number
Performance Graphic
 70= SKU Number  6= Generation number
 U= Ultra low power
 E= Product Suffix  500= SKU Number
 S=Performance- optimized
 T= Product Suffix
lifestyle
 Y=extremely lower power
64 BIT PROCESSING

x86 = x32 processing

 32 but width
 32 bit data processing
 Supports up to 4 GB RAM

X86 – 64 bit processing

 64 bus width
 64 bit data processing
 Support up to 16 EB RAM
CPU COOLING SYSTEM
THERMAL PASTE
TROUBLESHOOTING CPU
VIRTUALIZATION
 The ability of a CPU to run multiple OS at a time virtually through an application
 CACHE MEMORY
Cache memory is buffer between RAM and CPU
It stores most Frequently used data for CPU
RAM
WHAT IS MEMORY?
Location where we store data
Random Access Memory (RAM)
It the most common

RAM is Volatile
While SSD and HDD are not volatile

Data and programs can only be used when moved to RAM

TYPE OF RAM
WE HAVE TWO TYPES OF RAM

 Static RAM (SRAM)

 Very fast memory
 Very expensive memory
 Very big memory
 Used in processor cache
 L1, L2, L3
 DRAM (Dynamic Random Access Memory)
 Common memory that we know in computer
 Dynamic
MEMORY

SRAM DRAM
 It is like table and has 8 column  RAM is like table and has 8 column
 And has 4 to 6 transistor for keeping 1bit  Have two chips for each bit
 Transistor
 Receive bit
 Capacitor
 Random Access
 To give voltage to the transistor
 Any storage location can be accessed directly
 unlike magnetic tape
TYPE OF RAM:
SDRAM

 Most modern systems use some form of synchronous DRAM (SDRAM).

 SDRM is still DRAM, but it is synchronous – Tied to the clock.
 DRAM made its debut in 1996 on a stick called a dual inline memory module (DIMM)
DRAM STICKS
SIMM VS DIMM
SINGLE SIDED VS DUAL SIDED
SINGLE- CHANNEL & MULTI-CHANNEL MEMORY
SDR SDRAM

 ( Single Data Rate ) (synchronous DRAM)

 SDRAM is Synchronous with the common system clock
 168 Pin
DDRAM (DOUBLE DATA RATE)

 Double the data rate of SDR

 At the same clock speed
 184 pins
 DDR 200 million transferee per second
 Multiply by 8 to get total throughput in megabytes per second
 200 mb/s x 8 = 1600pc
 DDR SPEEDS
Dual-
Transistor Channel
Module Chip Clock Speed Bus Speed But Width
Rate transistor
standard Type (MHZ) (MTPS) (Bytes)
(Bytes) Rate
(MBPS)
PC1600 DDR200 100 200 8 1600 3200

PC2100 DDR266 133 266 8 2133 4266

PC2700 DDR333 166 333 8 2667 5333

PC3200 DDR400 200 400 8 3200 6400

DDR2 (DOUBLE DATA RATE 2)

 Twice as fast as DDR

 Not Compatible with DDR (200 pins and notch)

DDR2

DDR
DDR3 (DOUBLE DATA RATE 3

 Twice the data rate of ddr2

 Larger chip capacities 240 pins – one notch – not compatible with DDR2
DDR4 (DOUBLE DATA RATE 4)

 Twice the data rate of DDR3

 Larger chips capacities - 288 pins – one notch not compatible with DDR3
DDR5 SDRAM

 Twice the data rate of DDR4

 Generation: 5th generation
 Voltage: 1.1
COMPARISON OF DDR MODULES FOR DESKTOP PCS (DIMM)

Developer JEDEC

Type Synchronous dynamic random access memory

DDR: 2000
DDR2: 2003 pc2
Generation and release date DDR3: 2007 pc3
DDR4: 2014 pc4
DDR5: 2019 pc5

DDR: 2.5 / 2.6

DDR2: 1.8
Voltage DDR3: 1.5 / 1.35
DDR4: 1.2 / 1.05
DDR5 1.1
LATENCY

 When the memory controller starts to grab a line of memory, for example, a slight delay occurs.
 The delay in RAM’s response time is called its latency.
 RAM with a lower latency – such as CL2 – is faster than RAM with a higher latency such as CL3.
 The CL refers to clock cycle delays.
 The 2 means that the memory delays two clock cycles before delivering the requested data; the 3 means a three
cycle delay.
REGISTERED OR BUFFERED MEMORY
WORKING WITH RAM

 Like many other pieces of the PC, RAM is very

sensitive to ESD (Electrostatic Discharge) and other
technician abuse.
 Don’t do this! Grabbing the contacts is a bad idea!
 Always store RAM sticks in anti static packaging
whenever they’re not in use, and use strict ESD
handling procedures
INSTALLING DIMMS AND RIMMS