ESP32-C6-MINI-1

ESP32-C6-MINI-1U
Datasheet Version 1.2

Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and
Thread (802.15.4)
Built around ESP32-C6 series of SoCs, 32-bit RISC-V single-core microprocessor
Flash up to 8 MB in chip package
22 GPIOs, rich set of peripherals
On-board PCB antenna or external antenna connector

ESP32-C6-MINI-1 ESP32-C6-MINI-1U

www.espressif.com
1 Module Overview

1 Module Overview
Note:

Check the link or the QR code to make sure that you use the latest version of this document:
https://espressif.com/documentation/esp32-c6-mini-1_mini-1u_datasheet_en.pdf

1.1 Features

CPU and On-Chip Memory – Target wake time (TWT) that optimizes
power saving mechanisms
• ESP32-C6FH4/ESP32-C6FH8 embedded,
32-bit RISC-V single-core microprocessor, up to • Fully compatible with IEEE 802.11b/g/n protocol

160 MHz – 20 MHz and 40 MHz bandwidth

• ROM: 320 KB – Data rate up to 150 Mbps

• HP SRAM: 512 KB – Wi-Fi Multimedia (WMM)

• LP SRAM: 16 KB – TX/RX A-MPDU, TX/RX A-MSDU

• Flash up to 8 MB in chip package – Immediate Block ACK

– Fragmentation and defragmentation

Wi-Fi
– Transmit opportunity (TXOP)
• 1T1R in 2.4 GHz band – Automatic Beacon monitoring (hardware
TSF)
• Operating frequency: 2412 ~ 2484 MHz
– 4 × virtual Wi-Fi interfaces
• IEEE 802.11ax-compliant
– Simultaneous support for Infrastructure
– 20 MHz-only non-AP mode
BSS in Station mode, SoftAP mode, Station
– MCS0 ~ MCS9 + SoftAP mode, and promiscuous mode
Note that when ESP32-C6 scans in Station
– Uplink and downlink OFDMA, especially
mode, the SoftAP channel will change
suitable for simultaneous connections in
along with the Station channel
high-density environments
– 802.11mc FTM
– Downlink MU-MIMO (multi-user, multiple
input, multiple output) to increase network
Bluetooth®
capacity
• Bluetooth LE: Bluetooth 5.3 certified
– Beamformee that improves signal quality
• Bluetooth mesh
– Channel quality indication (CQI)
• High power mode (20 dBm)
– DCM (dual carrier modulation) to improve
link robustness • Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps

• Advertising extensions
– Spatial reuse to maximize parallel
transmissions • Multiple advertisement sets

Espressif Systems 2 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
1 Module Overview

• Channel selection algorithm #2 Integrated Components on Module

• LE power control • 40 MHz crystal oscillator

• Internal co-existence mechanism between Wi-Fi

Antenna Options
and Bluetooth to share the same antenna
• On-board PCB antenna (ESP32-C6-MINI-1)
IEEE 802.15.4
• External antenna via a connector
• Compliant with IEEE 802.15.4-2015 protocol (ESP32-C6-MINI-1U)

• OQPSK PHY in 2.4 GHz band Operating Conditions

• Data rate: 250 Kbps

• Operating voltage/Power supply: 3.0 ~ 3.6 V
• Thread 1.3 • Operating ambient temperature:

• Zigbee 3.0 – 85 °C version module: –40 ~ 85 °C

– 105 °C version module: –40 ~ 105 °C

Peripherals
Certification
• GPIO, SPI, parallel IO interface, UART, I2C, I2S,
RMT (TX/RX), pulse counter, LED PWM, USB • RF certification: See certificates
Serial/JTAG controller, MCPWM, SDIO2.0 slave
• Green certification: RoHS/REACH
controller, GDMA, TWAI® controller, on-chip
debug functionality via JTAG, event task matrix,
Test
ADC, temperature sensor, system timer,
general-purpose timers, and watchdog timers • HTOL/HTSL/uHAST/TCT/ESD

1.2 Description
ESP32-C6-MINI-1 and ESP32-C6-MINI-1U are two powerful, general-purpose Wi-Fi, IEEE 802.15.4, and
Bluetooth LE modules. The rich set of peripherals and high performance make the module an ideal choice for
smart homes, industrial automation, health care, consumer electronics, etc.

ESP32-C6-MINI-1 comes with a PCB antenna. ESP32-C6-MINI-1U comes with a connector for an external
antenna. They both feature an SPI flash up to 8 MB.

Espressif Systems 3 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
1 Module Overview

The series comparison for the two modules is as follows:

Table 1: ESP32-C6-MINI-1 (ANT) Series Comparison1

Ambient Temp.4 Size5

Ordering Code Flash2,3
(°C) (mm)
ESP32-C6-MINI-1-N4 –40 ~ 85
4 MB (Quad SPI)
ESP32-C6-MINI-1-H4 13.2 × 16.6 × 2.4
–40 ~ 105
ESP32-C6-MINI-1-H8 8 MB (Quad SPI)
1 This table shares the same notes presented in Table 2 below.

Table 2: ESP32-C6-MINI-1U (CONN) Series Comparison

Ambient Temp.4 Size5

Ordering Code Flash2,3
(°C) (mm)
ESP32-C6-MINI-1U-N4 –40 ~ 85
4 MB (Quad SPI)
ESP32-C6-MINI-1U-H4 13.2 × 12.5 × 2.4
–40 ~ 105
ESP32-C6-MINI-1U-H8 8 MB (Quad SPI)
2 By default, the SPI flash on the chip operates at a maximum clock frequency of
80 MHz and does not support the auto suspend feature. If you have a require-
ment for a higher flash clock frequency of 120 MHz or if you need the flash auto
suspend feature, please contact us.
3 The flash is integrated in the chip’s package.
4 Ambient temperature specifies the recommended temperature range of the en-
vironment immediately outside the Espressif module.
5 For details, refer to Section 9.1 Physical Dimensions.

At the core of the modules is ESP32-C6FH4/ESP32-C6FH8, a 32-bit RISC-V single-core processor. For more
information on ESP32-C6FH4/ESP32-C6FH8, please refer to ESP32-C6 Series Datasheet.

1.3 Applications
• Smart Home • POS machines

• Industrial Automation • Service robot

• Health Care • Audio Devices

• Consumer Electronics • Generic Low-power IoT Sensor Hubs

• Smart Agriculture • Generic Low-power IoT Data Loggers

Espressif Systems 4 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
Contents

Contents

1 Module Overview 2
1.1 Features 2
1.2 Description 3
1.3 Applications 4

2 Block Diagram 9

3 Pin Definitions 10
3.1 Pin Layout 10
3.2 Pin Description 10
3.3 Strapping Pins 11
3.3.1 SDIO Sampling and Driving Clock Edge Control 13
3.3.2 Chip Boot Mode Control 13
3.3.3 ROM Messages Printing Control 13
3.3.4 JTAG Signal Source Control 14

4 Peripherals 15
4.1 Functional Overview 15
4.2 Peripheral Pin Configurations 15

5 Electrical Characteristics 19
5.1 Absolute Maximum Ratings 19
5.2 Recommended Operating Conditions 19
5.3 DC Characteristics (3.3 V, 25 °C) 19
5.4 Current Consumption Characteristics 20
5.4.1 Current Consumption in Active Mode 20
5.4.2 Current Consumption in Other Modes 21

6 RF Characteristics 22
6.1 Wi-Fi Radio 22
6.1.1 Wi-Fi RF Transmitter (TX) Characteristics 22
6.1.2 Wi-Fi RF Receiver (RX) Characteristics 23
6.2 Bluetooth 5 (LE) Radio 25
6.2.1 Bluetooth LE RF Transmitter (TX) Characteristics 25
6.2.2 Bluetooth LE RF Receiver (RX) Characteristics 26
6.3 802.15.4 Radio 28
6.3.1 802.15.4 RF Transmitter (TX) Characteristics 29
6.3.2 802.15.4 RF Receiver (RX) Characteristics 29

7 Module Schematics 30

8 Peripheral Schematics 32

Espressif Systems 5 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
Contents

9 Physical Dimensions and PCB Land Pattern 33

9.1 Physical Dimensions 33
9.2 Recommended PCB Land Pattern 34
9.3 Dimensions of External Antenna Connector 36

10 Product Handling 37
10.1 Storage Conditions 37
10.2 Electrostatic Discharge (ESD) 37
10.3 Soldering Profile 37
10.3.1 Reflow Profile 37
10.4 Ultrasonic Vibration 38

Related Documentation and Resources 39

Revision History 40

Espressif Systems 6 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
List of Tables

List of Tables
1 ESP32-C6-MINI-1 (ANT) Series Comparison1 4
2 ESP32-C6-MINI-1U (CONN) Series Comparison 4
3 Pin Definitions 10
4 Default Configuration of Strapping Pins 12
5 Description of Timing Parameters for the Strapping Pins 12
6 SDIO Input Sampling Edge/Output Driving Edge Control 13
7 Boot Mode Control 13
8 ROM Messages Printing Control 14
9 JTAG Signal Source Control 14
10 Peripheral Pin Configurations 15
11 Absolute Maximum Ratings 19
12 Recommended Operating Conditions 19
13 DC Characteristics (3.3 V, 25 °C) 19
14 Current Consumption for Wi-Fi (2.4 GHz) in Active Mode 20
15 Current Consumption for Bluetooth LE in Active Mode 20
16 Current Consumption for 802.15.4 in Active Mode 20
17 Current Consumption in Modem-sleep Mode 21
18 Current Consumption in Low-Power Modes 21
19 Wi-Fi RF Characteristics 22
20 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 22
21 TX EVM Test1 22
22 RX Sensitivity 23
23 Maximum RX Level 24
24 RX Adjacent Channel Rejection 24
25 Bluetooth LE RF Characteristics 25
26 Bluetooth LE - Transmitter Characteristics - 1 Mbps 25
27 Bluetooth LE - Transmitter Characteristics - 2 Mbps 25
28 Bluetooth LE - Transmitter Characteristics - 125 Kbps 26
29 Bluetooth LE - Transmitter Characteristics - 500 Kbps 26
30 Bluetooth LE - Receiver Characteristics - 1 Mbps 26
31 Bluetooth LE - Receiver Characteristics - 2 Mbps 27
32 Bluetooth LE - Receiver Characteristics - 125 Kbps 28
33 Bluetooth LE - Receiver Characteristics - 500 Kbps 28
34 802.15.4 RF Characteristics 28
35 802.15.4 Transmitter Characteristics - 250 Kbps 29
36 802.15.4 Receiver Characteristics - 250 Kbps 29

Espressif Systems 7 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
List of Figures

List of Figures
1 ESP32-C6-MINI-1 Block Diagram 9
2 ESP32-C6-MINI-1U Block Diagram 9
3 Pin Layout (Top View) 10
4 Visualization of Timing Parameters for the Strapping Pins 13
5 ESP32-C6-MINI-1 Schematics 30
6 ESP32-C6-MINI-1U Schematics 31
7 Peripheral Schematics 32
8 ESP32-C6-MINI-1 Physical Dimensions 33
9 ESP32-C6-MINI-1U Physical Dimensions 33
10 ESP32-C6-MINI-1 Recommended PCB Land Pattern 34
11 ESP32-C6-MINI-1U Recommended PCB Land Pattern 35
12 Dimensions of External Antenna Connector 36
13 Reflow Profile 37

Espressif Systems 8 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
2 Block Diagram

2 Block Diagram

40 MHz
3V3 Crystal Antenna

RF Matching
EN
ESP32-C6
GPIOs

SPI Flash

GND

Figure 1: ESP32-C6-MINI-1 Block Diagram

40 MHz
3V3 Crystal Antenna

RF Matching
EN
ESP32-C6
GPIOs

SPI Flash

GND

Figure 2: ESP32-C6-MINI-1U Block Diagram

Espressif Systems 9 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
3 Pin Definitions

3 Pin Definitions

3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 9.1 Physical Dimensions.

The pin diagram is applicable for ESP32-C6-MINI-1 and ESP32-C6-MINI-1U, but the latter has no keepout
zone.

Keepout Zone
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin 41
Pin 44

Pin 42

Pin 40
Pin 48

Pin 47

Pin 46

Pin 45

Pin 43

Pin 39

Pin 38

Pin 37

Pin 36
Pin 53 Pin 50
GND GND

GND Pin 1 Pin 35 NC

GND Pin 2 Pin 34 NC
3V3 Pin 3 Pin 33 NC
GND GND GND
NC Pin 4 Pin 32 NC
IO2 Pin 5 Pin 31 TXD0
Pin 49
IO3 Pin 6 GND
GND
GND Pin 30 RXD0
NC Pin 7 Pin 29 IO23
EN Pin 8 Pin 28 IO22
GND GND GND
IO4 Pin 9 Pin 27 IO21
IO5 Pin 10 Pin 26 IO20
GND Pin 11 Pin 25 IO19
Pin 21
Pin 12

Pin 14

Pin 22

Pin 24
Pin 13

Pin 16

Pin 17

Pin 18

Pin 19

Pin 20

Pin 23
Pin 15

Pin 52 Pin 51
GND GND
IO1
GND

IO12
IO0

IO14
IO6
IO7

IO13

IO8
IO9
IO18
IO15
NC

Figure 3: Pin Layout (Top View)

3.2 Pin Description

Pin Layout (Top View)
The module has 53 pins. See pin definitions in Table 3 Pin Description.

For peripheral pin configurations, please refer to ESP32-C6 Series Datasheet.

Table 3: Pin Definitions

Name No. Type1 Function

GND 1, 2, 11, 14, 36∼53 P Ground
3V3 3 P Power supply
Cont’d on next page

Espressif Systems 10 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
3 Pin Definitions

Table 3 – cont’d from previous page

Name No. Type1 Function
NC 4 — NC
IO2 5 I/O/T GPIO2, LP_GPIO2, LP_UART_RTSN, ADC1_CH2, FSPIQ
IO3 6 I/O/T GPIO3, LP_GPIO3, LP_UART_CTSN, ADC1_CH3
NC 7 — NC
High: on, enables the chip.
EN 8 I
Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
IO4 9 I/O/T MTMS, GPIO4, LP_GPIO4, LP_UART_RXD, ADC1_CH4, FSPIHD
IO5 10 I/O/T MTDI, GPIO5, LP_GPIO5, LP_UART_TXD, ADC1_CH5, FSPIWP
IO0 12 I/O/T GPIO0, XTAL_32K_P, LP_GPIO0, LP_UART_DTRN, ADC1_CH0
IO1 13 I/O/T GPIO1, XTAL_32K_N, LP_GPIO1, LP_UART_DSRN, ADC1_CH1
IO6 15 I/O/T MTCK, GPIO6, LP_GPIO6, LP_I2C_SDA, ADC1_CH6, FSPICLK
IO7 16 I/O/T MTDO, GPIO7, LP_GPIO7, LP_I2C_SCL, FSPID
IO12 17 I/O/T GPIO12, USB_D-
IO13 18 I/O/T GPIO13, USB_D+
IO14 19 I/O/T GPIO14
IO15 20 I/O/T GPIO15
NC 21 — NC
IO8 22 I/O/T GPIO8
IO9 23 I/O/T GPIO9
IO18 24 I/O/T GPIO18, SDIO_CMD, FSPICS2
IO19 25 I/O/T GPIO19, SDIO_CLK, FSPICS3
IO20 26 I/O/T GPIO20, SDIO_DATA0, FSPICS4
IO21 27 I/O/T GPIO21, SDIO_DATA1, FSPICS5
IO22 28 I/O/T GPIO22, SDIO_DATA2
IO23 29 I/O/T GPIO23, SDIO_DATA3
RXD0 30 I/O/T U0RXD, GPIO17, FSPICS1
TXD0 31 I/O/T U0TXD, GPIO16, FSPICS0
NC 32 — NC
NC 33 — NC
NC 34 — NC
NC 35 — NC
1 P: power supply; I: input; O: output; T: high impedance.

3.3 Strapping Pins

At each startup or reset, a chip requires some initial configuration parameters, such as in which boot mode to
load the chip, etc. These parameters are passed over via the strapping pins. After reset, the strapping pins
operate as regular IO pins.

The parameters controlled by the given strapping pins at chip reset are as follows:

• SDIO sampling and driving clock edge – MTMS and MTDI

• Chip boot mode – GPIO8 and GPIO9

Espressif Systems 11 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
3 Pin Definitions

• ROM code printing to UART – GPIO8

• JTAG signal source – GPIO15

GPIO9 is connected to the chip’s internal weak pull-up resistor at chip reset. This resistor determines the
default bit value of GPIO9. Also, the resistor determines the bit value if GPIO9 is connected to an external
high-impedance circuit.

Table 4: Default Configuration of Strapping Pins

Strapping Pin Default Configuration Bit Value

MTMS Floating –
MTDI Floating –
GPIO8 Floating –
GPIO9 Pull-up 1
GPIO15 Floating –

To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If
the ESP32-C6 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by
the host MCU.

All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping
pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in
any other way. It makes the strapping pin values available during the entire chip operation, and the pins are
freed up to be used as regular IO pins after reset.

Regarding the timing requirements for the strapping pins, there are such parameters as setup time and hold
time. For more information, see Table 5 and Figure 4.

Table 5: Description of Timing Parameters for the Strapping Pins

Parameter Description Min (ms)

Setup time is the time reserved for the power rails to stabilize be-
tSU 0
fore the CHIP_PU pin is pulled high to activate the chip.
Hold time is the time reserved for the chip to read the strapping
tH pin values after CHIP_PU is already high and before these pins 3
start operating as regular IO pins.

Espressif Systems 12 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
3 Pin Definitions

tSU tH

VIL_nRST
CHIP_PU

VIH

Strapping pin

Figure 4: Visualization of Timing Parameters for the Strapping Pins

3.3.1 SDIO Sampling and Driving Clock Edge Control

The strapping pin MTMS and MTDI can be used to decide on which clock edge to sample signals and drive
output lines. See Table 6 SDIO Input Sampling Edge/Output Driving Edge Control.

Table 6: SDIO Input Sampling Edge/Output Driving Edge Control

MTMS MTDI Edge behavior

– (Floating) – (Floating) Default Configuration
0 0 Falling edge sampling, falling edge output
0 1 Falling edge sampling, rising edge output
1 0 Rising edge sampling, falling edge output
1 1 Rising edge sampling, rising edge output

3.3.2 Chip Boot Mode Control

GPIO8 and GPIO9 control the boot mode after the reset is released. See Table 7 Boot Mode Control Boot
Mode Control.

Table 7: Boot Mode Control

Boot Mode GPIO8 GPIO9

Default Configuration – (Floating) 1 (Pull-up)
SPI Boot (default) Any value 1
Download Boot 1 0
Invalid combination1 0 0
1 This combination triggers unexpected behavior
and should be avoided.

3.3.3 ROM Messages Printing Control

During the boot process, the messages by the ROM code can be printed to:

Espressif Systems 13 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
3 Pin Definitions

• (Default) UART0 and USB Serial/JTAG controller

• USB Serial/JTAG controller

• UART0

EFUSE_UART_PRINT_CONTROL and GPIO8 control ROM messages printing to UART0 as shown in Table 8 ROM
Messages Printing Control.

Table 8: ROM Messages Printing Control

eFuse1 GPIO8 ROM Code Printing

0 Ignored Always enabled
0 Enabled
1
1 Disabled
0 Disabled
2
1 Enabled
3 Ignored Always disabled
1 eFuse: EFUSE_UART_PRINT_CONTROL

EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT controls the printing to USB Serial/JTAG controller. When this

bit is 1, printing to USB Serial/JTAG controller is disabled. When this bit is 0, and USB Serial/JTAG controller is
enabled via EFUSE_DIS_USB_SERIAL_JTAG, ROM messages can be printed to USB Serial/JTAG
controller.

3.3.4 JTAG Signal Source Control

The strapping pin GPIO15 can be used to control the source of JTAG signals during the early boot process.
This pin does not have any internal pull resistors and the strapping value must be controlled by the external
circuit that cannot be in a high impedance state.

As Table 9 shows, GPIO15 is used in combination with EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG, and

EFUSE_JTAG_SEL_ENABLE.

Table 9: JTAG Signal Source Control

eFuse eFuse eFuse

GPIO15 JTAG Signal Source
1a 2b 3c
0 Ignored USB Serial/JTAG Controller
0 0 0 JTAG pins MTDI, MTCK, MTMS, and MTDO
1
1 USB Serial/JTAG Controller
0 1 Ignored Ignored JTAG pins MTDI, MTCK, MTMS, and MTDO
1 0 Ignored Ignored USB Serial/JTAG Controller
1 1 Ignored Ignored JTAG is disabled
a eFuse 1: EFUSE_DIS_PAD_JTAG
b eFuse 2: EFUSE_DIS_USB_JTAG
c eFuse 3: EFUSE_JTAG_SEL_ENABLE

Espressif Systems 14 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
4 Peripherals

4 Peripherals

4.1 Functional Overview

ESP32-C6FH4/ESP32-C6FH8 integrates a rich set of peripherals including SPI, parallel IO interface, UART, I2C,
I2S, RMT (TX/RX), LED PWM, USB Serial/JTAG controller, MCPWM, SDIO2.0 slave controller, GDMA, TWAI®
controller, on-chip debug functionality via JTAG, event task matrix, ADC, as well as up to 22 GPIOs, etc.

For detailed information about module peripherals, please refer to ESP32-C6 Series Datasheet > Section
Functional Description. Note that the ADC measurement range and accuracy in the
ESP32-C6 Series Datasheet are applicable to modules manufactured on and after the PW Number
PW-2023-06-XXX on packaging labels. For modules manufactured earlier than these PW numbers, please ask
our sales team to provide the actual range and accuracy according to batches.

Note:
The content below is excerpted from ESP32-C6 Series Datasheet > Section Peripheral Pin Configurations, so not all the
information is applicable to ESP32-C6-MINI-1 and ESP32-C6-MINI-1U. To learn more details about peripherals signals,
please refer to ESP32-C6 Technical Reference Manual > Section Peripheral Signal List.

4.2 Peripheral Pin Configurations

Table 10: Peripheral Pin Configurations

Interface Signal Pin Function

ADC ADC1_CH0 XTAL_32K_P 12-bit SAR ADC
ADC1_CH1 XTAL_32K_N
ADC1_CH2 GPIO2
ADC1_CH3 GPIO3
ADC1_CH4 MTMS
ADC1_CH5 MTDI
ADC1_CH6 MTCK
JTAG MTDI MTDI JTAG for software debugging
MTCK MTCK
MTMS MTMS
MTDO MTDO
UART U0RXD_in Any GPIO pins Two UART channels with hardware flow control
U0CTS_in and GDMA
U0DSR_in
U0TXD_out
U0RTS_out
U0DTR_out
U1RXD_in
U1CTS_in
U1DSR_in
U1TXD_out
U1RTS_out
U1DTR_out

Espressif Systems 15 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
4 Peripherals

Interface Signal Pin Function

LP UART LP_UART_DTRN XTAL_32K_P One LP UART channel with hardware flow control
LP_UART_DSRN XTAL_32K_N and GDMA
LP_UART_RTSN GPIO2
LP_UART_CTSN GPIO3
LP_UART_RXD MTMS
LP_UART_TXD MTDI
I2C I2CEXT0_SCL_in Any GPIO pins One I2C channel in slave or master mode
I2CEXT0_SDA_in
I2CEXT0_SCL_out
I2CEXT0_SDA_out
LP I2C LP_I2C_SDA MTCK One LP I2C channel in slave or master mode
LP_I2C_SCL MTDO
LED PWM ledc_ls_sig_out0~5 Any GPIO pins Six independent PWM channels
I2S I2S0O_BCK_in Any GPIO pins Stereo input and output from/to the audiocodec
I2S_MCLK_in
I2SO_WS_in
I2SI_SD_in
I2SI_BCK_in
I2SI_WS_in
I2SO_BCK_out
I2S_MCLK_out
I2SO_WS_out
I2SO_SD_out
I2SI_BCK_out
I2SI_WS_out
I2SO_SD1_out
Remote Control RMT_SIG_IN0~1 Any GPIO pins Two channels for an IR transceiver of various
Peripheral RMT_SIG_OUT0~1 waveforms
SPI0/1 SPICLK_out_mux SPICLK Support Standard SPI, Dual SPI, Quad SPI, and
SPICS0_out SPICS0 QPI that allow connection to off-package flash
SPICS1_out Any GPIO pins
SPID_in/_out SPID
SPIQ_in/_out SPIQ
SPIWP_in/_out SPIWP
SPIHD_in/_out SPIHD
SPI2 FSPICLK_in/_out_mux Any GPIO pins The following functionality is supported:

• Master mode and slave mode of SPI, Dual SPI,

Quad SPI, and QPI

• Connection to off-package flash, RAM and other

SPI devices

• Four modes of SPI transfer format

• Configurable SPI frequency

• 64-byte FIFO or GDMA buffer

FSPICS0_in/_out
FSPICS1~5_out
FSPID_in/_out

Espressif Systems 16 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
4 Peripherals

Interface Signal Pin Function

FSPIQ_in/_out
FSPIWP_in/_out
FSPIHD_in/_out
USB Serial/JTAG USB_D+ GPIO13 USB-to-serial converter, and USB-to-JTAG
USB_D- GPIO12 converter
®
TWAI TWAI0_RX Any GPIO pins Compatible with ISO 11898-1 protocol
TWAI0_TX
TWAI0_BUS_OFF_ON
TWAI0_CLKOUT
TWAI0_STANDBY
TWAI1_RX
TWAI1_TX
TWAI1_BUS_OFF_ON
TWAI1_CLKOUT
TWAI1_STANDBY
Pulse Count Controller PCNT_SIG_CH0_in0~3 Any GPIO pins Captures pulses and counts pulse edges in
PCNT_SIG_CH1_in0~3 seven modes
PCNT_CTRL_CH0_in0~3
PCNT_CTRL_CH1_in0~3
MCPWM PWM0_SYNC0~2_in Any GPIO pins One MCPWM to generate:

• differential PWM output signals

• fault input signals to be detected

• input signals to be captured

• external synchronization signals for PWM timers

PWM0_out0a
PWM0_out0b
PWM0_out1a
PWM0_F0~2_in
PWM0_out1b
PWM0_out2a
PWM0_out2b
PWM0_CAP0~2_in
PARLIO PARL_RX_DATA0~15 Any GPIO pins A module for parallel data transfer, with

• 16 pins to receive parallel data

• 16 pins to transmit parallel data

• 1 receiver clock pin (clock input)

• 2 transmitter clock pins (clock input and output)

PARL_TX_DATA0~15
PARL_RX_CLK_in
PARL_TX_CLK_in/_out
SDIO SDIO_CMD SDIO_CMD SDIO interface, conforming to the industry
SDIO_CLK SDIO_CLK standard SDIO Specification Version 2.0
SDIO_DATA0 SDIO_DATA0
SDIO_DATA1 SDIO_DATA1
SDIO_DATA2 SDIO_DATA2

Espressif Systems 17 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
4 Peripherals

Interface Signal Pin Function

SDIO_DATA3 SDIO_DATA3

Espressif Systems 18 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
5 Electrical Characteristics

5 Electrical Characteristics

5.1 Absolute Maximum Ratings

Stresses above those listed in Table 11 Absolute Maximum Ratings may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any other conditions
beyond those indicated under Table 12 Recommended Operating Conditions is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 11: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 105 °C

5.2 Recommended Operating Conditions

Table 12: Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
85 °C version 85
TA Operating ambient temperature –40 — °C
105 °C version 105

5.3 DC Characteristics (3.3 V, 25 °C)

Table 13: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

CIN Pin capacitance — 2 — pF
VIH High-level input voltage 0.75 × VDD1 — VDD1 + 0.3 V
VIL Low-level input voltage –0.3 — 0.25 × VDD1 V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
VOH 2 High-level output voltage 0.8 × VDD1 — — V
VOL 2 Low-level output voltage — — 0.1 × VDD1 V
High-level source current (VDD1 = 3.3 V, VOH
IOH — 40 — mA
>= 2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1 = 3.3 V, VOL =
IOL — 28 — mA
0.495 V, PAD_DRIVER = 3)
RP U Pull-up resistor — 45 — kΩ
RP D Pull-down resistor — 45 — kΩ
VIH_nRST Chip reset release voltage 0.75 × VDD1 — VDD1 + 0.3 V
VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD1 V

Espressif Systems 19 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
5 Electrical Characteristics

1 VDD is the I/O voltage for pins of a particular power domain.

2 VOH and VOL are measured using high-impedance load.

5.4 Current Consumption Characteristics

5.4.1 Current Consumption in Active Mode
The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature.

TX current consumption is rated at a 100% duty cycle.

RX current consumption is rated when the peripherals are disabled and the CPU idle.

Table 14: Current Consumption for Wi-Fi (2.4 GHz) in Active Mode

Work Mode RF Condition Description Peak (mA)

802.11b, 1 Mbps, DSSS @ 20.5 dBm 382
802.11g, 54 Mbps, OFDM @ 19.0 dBm 316
TX 802.11n, HT20, MCS7 @ 18.0 dBm 295
802.11n, HT40, MCS7 @ 17.5 dBm 280
Active (RF working)
802.11ax, MCS9 @ 15.5 dBm 251
802.11b/g/n, HT20 78
RX 802.11n, HT40 82
802.11ax, HE20 78

Table 15: Current Consumption for Bluetooth LE in Active Mode

Work Mode RF Condition Description Peak (mA)

Bluetooth LE @ 19.0 dBm 309
TX Bluetooth LE @ 9.0 dBm 189
Active (RF working) Bluetooth LE @ 0 dBm 131
Bluetooth LE @ –16.0 dBm 94
RX Bluetooth LE 73

Table 16: Current Consumption for 802.15.4 in Active Mode

Work Mode RF Condition Description Peak (mA)

802.15.4 @ 19.0 dBm 305
TX 802.15.4 @ 12.0 dBm 190
Active (RF working) 802.15.4 @ 0 dBm 120
802.15.4 @ –16.0 dBm 86
RX 802.15.4 73

Espressif Systems 20 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
5 Electrical Characteristics

Note:
The content below is excerpted from Section Current Consumption in Other Modes in ESP32-C6 Series Datasheet.

5.4.2 Current Consumption in Other Modes

Table 17: Current Consumption in Modem-sleep Mode

Typ (mA)
CPU Frequency
All Peripherals All Peripherals
Mode (MHz) Description
Clocks Disabled Clocks Enabled1
CPU is running 27 38
160
CPU is idle 17 28
Modem-sleep2,3
CPU is running 19 30
80
CPU is idle 14 25
1 In practice, the current consumption might be different depending on which peripherals
are enabled.
2 In Modem-sleep mode, Wi-Fi is clock gated.
3 In Modem-sleep mode, the consumption might be higher when accessing flash.

Table 18: Current Consumption in Low-Power Modes

Mode Description Typ (µA)

CPU and wireless communication modules are powered down,
180
Light-sleep peripheral clocks are disabled, and all GPIOs are high-impedance
CPU, wireless communication modules and peripherals are pow-
35
ered down, and all GPIOs are high-impedance
Deep-sleep RTC timer and LP memory are powered on 7
Power off CHIP_PU is set to low level, the chip is powered off 1

Espressif Systems 21 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
6 RF Characteristics

6 RF Characteristics
This section contains tables with RF characteristics of the Espressif product.

The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The
external antennas used for the tests on the modules with external antenna connectors have an impedance of
50 Ω.Devices should operate in the center frequency range allocated by regional regulatory authorities. The
target center frequency range and the target transmit power are configurable by software. See ESP RF Test
Tool and Test Guide for instructions.

Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature.

6.1 Wi-Fi Radio

Table 19: Wi-Fi RF Characteristics

Name Description
Center frequency range of operating channel 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n/ax

6.1.1 Wi-Fi RF Transmitter (TX) Characteristics

Table 20: TX Power with Spectral Mask and EVM Meeting 802.11 Standards

Min Typ Max

Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps, DSSS — 20.5 —
802.11b, 11 Mbps, CCK — 20.5 —
802.11g, 6 Mbps, OFDM — 20.0 —
802.11g, 54 Mbps, OFDM — 19.0 —
802.11n, HT20, MCS0 — 19.0 —
802.11n, HT20, MCS7 — 18.0 —
802.11n, HT40, MCS0 — 18.5 —
802.11n, HT40, MCS7 — 17.5 —
802.11ax, HE20, MCS0 — 19.0 —
802.11ax, HE20, MCS9 — 15.5 —

Table 21: TX EVM Test1

Min Typ Limit

Rate (dB) (dB) (dB)
802.11b, 1 Mbps, DSSS — –25.0 –10.0
802.11b, 11 Mbps, CCK — –25.0 –10.0
802.11g, 6 Mbps, OFDM — –24.0 –5.0
Cont’d on next page

Espressif Systems 22 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
6 RF Characteristics

Table 21 – cont’d from previous page

Min Typ Limit
Rate (dB) (dB) (dB)
802.11g, 54 Mbps, OFDM — –28.0 –25.0
802.11n, HT20, MCS0 — –27.5 –5.0
802.11n, HT20, MCS7 — –30.0 –27.0
802.11n, HT40, MCS0 — –27.0 –5.0
802.11n, HT40, MCS7 — –29.5 –27.0
802.11ax, HE20, MCS0 — –27.0 –5.0
802.11ax, HE20, MCS9 — –34.0 –32.0
1 EVM is measured at the corresponding typical TX power provided
in Table 20 Wi-Fi RF Transmitter (TX) Characteristics above.

6.1.2 Wi-Fi RF Receiver (RX) Characteristics

For RX tests, the PER (packet error rate) limit is 8% for 802.11b, and 10% for 802.11g/n/ax.

Table 22: RX Sensitivity

Min Typ Max

Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps, DSSS — –99.2 —
802.11b, 2 Mbps, DSSS — –96.8 —
802.11b, 5.5 Mbps, CCK — –93.6 —
802.11b, 11 Mbps, CCK — –90.0 —
802.11g, 6 Mbps, OFDM — –94.0 —
802.11g, 9 Mbps, OFDM — –93.0 —
802.11g, 12 Mbps, OFDM — –92.4 —
802.11g, 18 Mbps, OFDM — –90.0 —
802.11g, 24 Mbps, OFDM — –86.8 —
802.11g, 36 Mbps, OFDM — –83.0 —
802.11g, 48 Mbps, OFDM — –78.8 —
802.11g, 54 Mbps, OFDM — –77.6 —
802.11n, HT20, MCS0 — –93.6 —
802.11n, HT20, MCS1 — –92.0 —
802.11n, HT20, MCS2 — –89.4 —
802.11n, HT20, MCS3 — –86.0 —
802.11n, HT20, MCS4 — –82.8 —
802.11n, HT20, MCS5 — –78.6 —
802.11n, HT20, MCS6 — –77.0 —
802.11n, HT20, MCS7 — –75.4 —
802.11n, HT40, MCS0 — –91.0 —
802.11n, HT40, MCS1 — –89.6 —
802.11n, HT40, MCS2 — –87.0 —
Cont’d on next page

Espressif Systems 23 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
6 RF Characteristics

Table 22 – cont’d from previous page

Min Typ Max
Rate (dBm) (dBm) (dBm)
802.11n, HT40, MCS3 — –83.4 —
802.11n, HT40, MCS4 — –80.4 —
802.11n, HT40, MCS5 — –76.2 —
802.11n, HT40, MCS6 — –74.6 —
802.11n, HT40, MCS7 — –73.2 —
802.11ax, HE20, MCS0 — –93.8 —
802.11ax, HE20, MCS1 — –91.0 —
802.11ax, HE20, MCS2 — –88.0 —
802.11ax, HE20, MCS3 — –85.6 —
802.11ax, HE20, MCS4 — –82.0 —
802.11ax, HE20, MCS5 — –78.0 —
802.11ax, HE20, MCS6 — –76.6 —
802.11ax, HE20, MCS7 — –74.4 —
802.11ax, HE20, MCS8 — –70.8 —
802.11ax, HE20, MCS9 — –68.6 —

Table 23: Maximum RX Level

Min Typ Max

Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps, DSSS — 5 —
802.11b, 11 Mbps, CCK — 5 —
802.11g, 6 Mbps, OFDM — 5 —
802.11g, 54 Mbps, OFDM — 0 —
802.11n, HT20, MCS0 — 5 —
802.11n, HT20, MCS7 — 0 —
802.11n, HT40, MCS0 — 5 —
802.11n, HT40, MCS7 — 0 —
802.11ax, HE20, MCS0 — 5 —
802.11ax, HE20, MCS9 — 0 —

Table 24: RX Adjacent Channel Rejection

Min Typ Max

Rate (dB) (dB) (dB)
802.11b, 1 Mbps, DSSS — 38 —
802.11b, 11 Mbps, CCK — 38 —
802.11g, 6 Mbps, OFDM — 31 —
802.11g, 54 Mbps, OFDM — 20 —
802.11n, HT20, MCS0 — 31 —
Cont’d on next page

Espressif Systems 24 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
6 RF Characteristics

Table 24 – cont’d from previous page

Min Typ Max
Rate (dB) (dB) (dB)
802.11n, HT20, MCS7 — 16 —
802.11n, HT40, MCS0 — 28 —
802.11n, HT40, MCS7 — 10 —
802.11ax, HE20, MCS0 — 25 —
802.11ax, HE20, MCS9 — 2 —

6.2 Bluetooth 5 (LE) Radio

Table 25: Bluetooth LE RF Characteristics

Name Description
Center frequency range of operating channel 2402 ~ 2480 MHz
RF transmit power range –16.0 ~ 19.0 dBm

6.2.1 Bluetooth LE RF Transmitter (TX) Characteristics

Table 26: Bluetooth LE - Transmitter Characteristics - 1 Mbps

Parameter Description Min Typ Max Unit

Max. |fn |n=0, 1, 2, 3, ...k — 1.3 — kHz
Max. |f0 − fn |n=2, 3, 4, ...k — 1.5 — kHz
Carrier frequency offset and drift
Max. |fn − fn−5 |n=6, 7, 8, ...k — 0.9 — kHz
|f1 − f0 | — 0.6 — kHz
∆ F 1avg — 249.9 — kHz
Modulation characteristics Min. ∆ F 2max (for at least
— 212.1 — kHz
99.9% of all ∆ F 2max )
∆ F 2avg /∆ F 1avg — 0.88 — —
± 2 MHz offset — –29 — dBm
In-band emissions ± 3 MHz offset — –36 — dBm
> ± 3 MHz offset — –39 — dBm

Table 27: Bluetooth LE - Transmitter Characteristics - 2 Mbps

Parameter Description Min Typ Max Unit

Max. |fn |n=0, 1, 2, 3, ...k — 2.2 — kHz
Max. |f0 − fn |n=2, 3, 4, ...k — 1.1 — kHz
Carrier frequency offset and drift
Max. |fn − fn−5 |n=6, 7, 8, ...k — 1.1 — kHz
|f1 − f0 | — 0.5 — kHz
∆ F 1avg — 499.4 — kHz
Modulation characteristics Cont’d on next page

Espressif Systems 25 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
6 RF Characteristics

Table 27 – cont’d from previous page

Parameter Description Min Typ Max Unit
Min. ∆ F 2max (for at least
— 443.5 — kHz
99.9% of all ∆ F 2max )
∆ F 2avg /∆ F 1avg — 0.95 — —
± 4 MHz offset — –40 — dBm
In-band emissions ± 5 MHz offset — –41 — dBm
> ± 5 MHz offset — –42 — dBm

Table 28: Bluetooth LE - Transmitter Characteristics - 125 Kbps

Parameter Description Min Typ Max Unit

Max. |fn |n=0, 1, 2, 3, ...k — 0.7 — kHz
Max. |f0 − fn |n=1, 2, 3, ...k — 0.3 — kHz
Carrier frequency offset and drift
|f0 − f3 | — 0.1 — kHz
Max. |fn − fn−3 |n=7, 8, 9, ...k — 0.4 — kHz
∆ F 1avg — 250.0 — kHz
Modulation characteristics
Min. ∆ F 1max (for at least
— 238.0 — kHz
99.9% of all ∆ F 1max )
± 2 MHz offset — –29 — dBm
In-band emissions ± 3 MHz offset — –36 — dBm
> ± 3 MHz offset — –39 — dBm

Table 29: Bluetooth LE - Transmitter Characteristics - 500 Kbps

Parameter Description Min Typ Max Unit

Max. |fn |n=0, 1, 2, 3, ...k — 0.5 — kHz
Max. |f0 − fn |n=1, 2, 3, ...k — 0.3 — kHz
Carrier frequency offset and drift
|f0 − f3 | — 0.1 — kHz
Max. |fn − fn−3 |n=7, 8, 9, ...k — 0.4 — kHz
∆ F 2avg — 230.7 — kHz
Modulation characteristics
Min. ∆ F 2max (for at least
— 217.6 — kHz
99.9% of all ∆ F 2max )
± 2 MHz offset — –28 — dBm
In-band emissions ± 3 MHz offset — –36 — dBm
> ± 3 MHz offset — –39 — dBm

6.2.2 Bluetooth LE RF Receiver (RX) Characteristics

Table 30: Bluetooth LE - Receiver Characteristics - 1 Mbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –98.0 — dBm
Maximum received signal @30.8% PER — — 8 — dBm
Cont’d on next page

Espressif Systems 26 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
6 RF Characteristics

Table 30 – cont’d from previous page

Parameter Description Min Typ Max Unit
Co-channel F = F0 MHz — 7 — dB
F = F0 + 1 MHz — 4 — dB
F = F0 – 1 MHz — 3 — dB
F = F0 + 2 MHz — –21 — dB
F = F0 – 2 MHz — –22 — dB
Adjacent channel
C/I and receiver F = F0 + 3 MHz — –28 — dB
selectivity performance F = F0 – 3 MHz — –36 — dB
F ≥ F0 + 4 MHz — –27 — dB
F ≤ F0 – 4 MHz — –36 — dB
Image frequency — — –26 — dB
Adjacent channel to F = Fimage + 1 MHz — –29 — dB
image frequency F = Fimage – 1 MHz — –28 — dB
30 MHz ~ 2000 MHz — –16 — dBm
Out-of-band blocking performance 2003 MHz ~ 2399 MHz — –24 — dBm
2484 MHz ~ 2997 MHz — –16 — dBm
3000 MHz ~ 12.75 GHz — –1 — dBm
Intermodulation — — –27 — dBm

Table 31: Bluetooth LE - Receiver Characteristics - 2 Mbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –95.0 — dBm
Maximum received signal @30.8% PER — — 8 — dBm
Co-channel F = F0 MHz — 8 — dB
F = F0 + 2 MHz — 3 — dB
F = F0 – 2 MHz — 2 — dB
F = F0 + 4 MHz — –23 — dB
F = F0 – 4 MHz — –25 — dB
Adjacent channel
C/I and receiver F = F0 + 6 MHz — –31 — dB
selectivity performance F = F0 – 6 MHz — –35 — dB
F ≥ F0 + 8 MHz — –36 — dB
F ≤ F0 – 8 MHz — –36 — dB
Image frequency — — –23 — dB
Adjacent channel to F = Fimage + 2 MHz — –30 — dB
image frequency F = Fimage – 2 MHz — 3 — dB
30 MHz ~ 2000 MHz — –18 — dBm
Out-of-band blocking performance 2003 MHz ~ 2399 MHz — –28 — dBm
2484 MHz ~ 2997 MHz — –16 — dBm
3000 MHz ~ 12.75 GHz — –1 — dBm
Intermodulation — — –29 — dBm

Espressif Systems 27 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
6 RF Characteristics

Table 32: Bluetooth LE - Receiver Characteristics - 125 Kbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –105.5 — dBm
Maximum received signal @30.8% PER — — 8 — dBm
Co-channel F = F0 MHz — 2 — dB
F = F0 + 1 MHz — –1 — dB
F = F0 – 1 MHz — –3 — dB
F = F0 + 2 MHz — –31 — dB
F = F0 – 2 MHz — –27 — dB
Adjacent channel
C/I and receiver F = F0 + 3 MHz — –33 — dB
selectivity performance F = F0 – 3 MHz — –42 — dB
F ≥ F0 + 4 MHz — –31 — dB
F ≤ F0 – 4 MHz — –48 — dB
Image frequency — — –31 — dB
Adjacent channel to F = Fimage + 1 MHz — –36 — dB
image frequency F = Fimage – 1 MHz — –33 — dB

Table 33: Bluetooth LE - Receiver Characteristics - 500 Kbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –101.5 — dBm
Maximum received signal @30.8% PER — — 8 — dBm
Co-channel F = F0 MHz — 4 — dB
F = F0 + 1 MHz — 1 — dB
F = F0 – 1 MHz — –1 — dB
F = F0 + 2 MHz — –23 — dB
F = F0 – 2 MHz — –24 — dB
Adjacent channel
C/I and receiver F = F0 + 3 MHz — –33 — dB
selectivity performance F = F0 – 3 MHz — –41 — dB
F ≥ F0 + 4 MHz — –31 — dB
F ≤ F0 – 4 MHz — –41 — dB
Image frequency — — –30 — dB
Adjacent channel to F = Fimage + 1 MHz — –35 — dB
image frequency F = Fimage – 1 MHz — –27 — dB

6.3 802.15.4 Radio

Table 34: 802.15.4 RF Characteristics

Name Description
Center frequency range of operating channel 2405 ~ 2480 MHz
1 Zigbee in the 2.4 GHz range supports 16 channels at 5 MHz spacing from
channel 11 to channel 26.

Espressif Systems 28 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
6 RF Characteristics

6.3.1 802.15.4 RF Transmitter (TX) Characteristics

Table 35: 802.15.4 Transmitter Characteristics - 250 Kbps

Parameter Min Typ Max Unit

RF transmit power range –16.0 — 19.0 dBm
EVM — 13% — —

6.3.2 802.15.4 RF Receiver (RX) Characteristics

Table 36: 802.15.4 Receiver Characteristics - 250 Kbps

Parameter Description Min Typ Max Unit

Sensitivity @1% PER — — –104.0 — dBm
Maximum received signal @1% PER — — 8 — dBm
F = F0 + 5 MHz — 27 — dB
Adjacent channel
F = F0 – 5 MHz — 32 — dB
Relative jamming level
F = F0 + 10 MHz — 47 — dB
Alternate channel
F = F0 – 10 MHz — 50 — dB

Espressif Systems 29 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
 Espressif Systems

7 Module Schematics
7 Module Schematics
This is the reference design of the module.

GND

GND GND

3
Y1

GND

GND XOUT
The values of C1 and C2 vary with C1 C2
the selection of the crystal. TBD TBD

XIN
The value of R1 varies with the actual
PCB board. 40MHz

2
VDD33 GND
GND
Submit Documentation Feedback

0
C3 C4
GPIO23
1uF 10nF GPIO22

49
48
47
46
45
44
43
42
41
40
39
38
37
36
GPIO21

R1
GND GND GPIO20

EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
VDD33 GND
53 50
GND GND
L1 2.0nH(0.1nH) VDD33 1 35

33

32
31
30
29
28
27
26
25
2 GND NC 34
C5 C6 C7 3 GND NC 33

GND

VDDA2
XTAL_P
XTAL_N
VDDA1
SDIO_DATA3
SDIO_DATA2
SDIO_DATA1
SDIO_DATA0
4 3V3 NC 32
30

10uF 0.1uF 0.1uF GPIO2 5 NC NC 31 U0TXD

GPIO3 6 IO2 TXD0 30 U0RXD
IO3 ESP32-C6-MINI-1 RXD0
GND GND GND D1 7 29 GPIO23
ANT1 ESD CHIP_EN 8 NC IO23 28 GPIO22
1 RF_ANT L2 TBD LNA_IN 1 24 R3 0 GPIO19 GPIO4 9 EN IO22 27 GPIO21
2 2 ANT SDIO_CLK 23 GPIO18 GPIO5 10 IO4 IO21 26 GPIO20
3 VDDA3P3 SDIO_CMD 22 U0RXD 11 IO5 IO20 25 GPIO19
C8 C9 VDDA3P3 U0RXD GND IO19
PCB_ANT CHIP_EN 4 21 R2 499 U0TXD
TBD TBD 5 CHIP_PU U0TXD 20 GND 52 51

GND

IO12
IO13
IO14
IO15

IO18
VDDPST1 VDDPST2 GND GND

IO0
IO1

IO6
IO7

IO8
IO9
GPIO0 6 19 GPIO15

NC
GPIO1 7 XTAL_32K_P GPIO15 18 GPIO14
GND GND GND GPIO2 8 XTAL_32K_N GPIO14 17 GPIO13 U3

12
13
14
15
16
17
18
19
20
21
22
23
24
GPIO2 GPIO13 VDD33

VDD33
The values of C8, L2 and C9
C10
GPIO12

vary with the actual PCB board.

GPIO12
GPIO13
GPIO14
GPIO15

GPIO18
GPIO3

GPIO8
GPIO9
MTMS

MTDO
MTCK

GPIO0
GPIO1

GPIO6
GPIO7

GPIO8
GPIO9
MTDI
ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

C12 0.1uF
NC: No component. GND
0.1uF U2 ESP32-C6-QFN32
9
10
11
12
13
14
15
16

GND

GND ESP32-C6-MINI-1(pin-out)
GPIO12
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9

Figure 5: ESP32-C6-MINI-1 Schematics

 Espressif Systems

7 Module Schematics
GND

GND GND

3
Y1

GND

GND XOUT
The values of C1 and C2 vary with C1 C2
the selection of the crystal. TBD TBD

XIN
The value of R1 varies with the actual
PCB board. 40MHz

2
VDD33 GND
GND

0
C3 C4
GPIO23
1uF 10nF GPIO22

49
48
47
46
45
44
43
42
41
40
39
38
37
36
GPIO21

R1
GND GND GPIO20

GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
EPAD
VDD33 GND
53 50
GND GND
L1 2.0nH(0.1nH) VDD33 1 35

33

32
31
30
29
28
27
26
25
2 GND NC 34
C5 C6 C7 3 GND NC 33

VDDA2

VDDA1
SDIO_DATA3
SDIO_DATA2
SDIO_DATA1
SDIO_DATA0
GND

XTAL_P
XTAL_N
4 3V3 NC 32
Submit Documentation Feedback

10uF 0.1uF 0.1uF GPIO2 5 NC NC 31 U0TXD

GPIO3 6 IO2 TXD0 30 U0RXD
IO3 ESP32-C6-MINI-1U RXD0
GND GND GND D1 7 29 GPIO23
ESD CHIP_EN 8 NC IO23 28 GPIO22
1RF_ANT L2 TBD LNA_IN 1 24 R3 0 GPIO19 GPIO4 9 EN IO22 27 GPIO21
2 ANT SDIO_CLK 23 GPIO18 GPIO5 10 IO4 IO21 26 GPIO20
3 VDDA3P3 SDIO_CMD 22 U0RXD 11 IO5 IO20 25 GPIO19
ANT1
4
3
2

CHIP_EN 4 VDDA3P3 U0RXD 21 R2 499 U0TXD GND IO19

CONN D2 C8 C9 5 CHIP_PU U0TXD 20 GND 52 51

GND

IO12
IO13
IO14
IO15

IO18
VDDPST1 VDDPST2 GND GND

IO0
IO1

IO6
IO7

IO8
IO9
ESD(NC) TBD TBD GPIO0 6 19 GPIO15

NC
GPIO1 7 XTAL_32K_P GPIO15 18 GPIO14
31

GPIO2 8 XTAL_32K_N GPIO14 17 GPIO13 U3

12
13
14
15
16
17
18
19
20
21
22
23
24
GPIO2 GPIO13 VDD33

GND GND GND GND VDD33

C10

GPIO12

GPIO12
GPIO13
GPIO14
GPIO15

GPIO18
GPIO3

GPIO8
GPIO9
MTDO
MTMS

MTCK

GPIO0
GPIO1

GPIO6
GPIO7

GPIO8
GPIO9
MTDI
The values of C8, L2 and C9 C12 0.1uF
GND
vary with the actual PCB board. 0.1uF U2 ESP32-C6-QFN32
9
10
11
12
13
14
15
16
NC: No component. GND

GND
ESP32-C6-MINI-1U(pin-out)
GPIO12
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Figure 6: ESP32-C6-MINI-1U Schematics

8 Peripheral Schematics

8 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example,
power supply, antenna, reset button, JTAG interface, and UART interface).

GND

49
48
47
46
45
44
43
42
41
40
39
38
37
36
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
53 50
VDD33 VDD33 GND GND
1 35
2 GND NC 34 VDD33
3 GND NC 33 JP1
4 3V3 NC 32 1
C1 C2 IO2 5 NC NC 31 TXD0 2 1
R1 IO3 6 IO2 ESP32-C6-MINI-1 TXD0 30 RXD0 3 2
TBD 22uF 0.1uF 7 IO3 ESP32-C6-MINI-1U RXD0 29 IO23 4 3
EN 8 NC IO23 28 IO22 4
IO4 9 EN IO22 27 IO21 UART
SW1 GND GND IO5 10 IO4 IO21 26 IO20 GND
R2 0 11 IO5 IO20 25 IO19
GND IO19
C4 0.1uF 52 51 VDD33

GND

IO12
IO13
IO14
IO15

IO18
GND GND

IO0
IO1

IO6
IO7

IO8
IO9
C3

NC
TBD
U1
12
13
14
15
16
17
18
19
20
21
22
23
24
R8
GND GND 10K

IO12
IO13
IO14
IO15

IO18
IO8
IO0
IO1

IO6
IO7

IO8
IO9
GND C5 12pF(NC) JP2
JP4 1
1
1

4 TMS IO4 X1 R3 0(NC) 2

R5

4 3 TDI IO5 32.768KHz(NC) 2

3 2 TCK IO6 R4 0(NC) Boot Option
2 X1: ESR
1 TDO IO7 GND
NC

1 = Max. 70 KΩ
2

JTAG GND GND JP3

C6 12pF(NC) R6 TBD USB_D+ 2
R7 TBD USB_D- 1 2
1
C7 C8 USB

TBD TBD NC: No component.

GND GND

Figure 7: Peripheral Schematics

• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much
soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion
between other pins and the baseboard may be poor.

• To ensure that the power supply to the ESP32-C6 chip is stable during power-up, it is advised to add an
RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and
C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
and the power-up and reset sequence timing of the chip. For ESP32-C6’s power-up and reset sequence
timing diagram, please refer to ESP32-C6 Series Datasheet > Section Power Supply.

Espressif Systems 32 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
9 Physical Dimensions and PCB Land Pattern

9 Physical Dimensions and PCB Land Pattern

9.1 Physical Dimensions

Unit: mm

13.20±0.2 0.80

48 x 0.40 4 x 0.70
16.60±0.2

1.45 0.60
11.95

4 x 0.70
48 x 0.80

11.20
9.90
9.80

5.40
9.95

1.60
50

0.60
1.45
0.
Ø
0.62

5.40

0.80
0.62 2.40±0.15 1.60
11.80
11.90
Top view Side view Bottom view

Figure 8: ESP32-C6-MINI-1 Physical Dimensions

Unit: mm

13.20±0.2 0.80
1.70 0.85 48 x 0.40 4 x 0.70

9.18
1.45 0.60
12.25
1.55
12.50±0.2

4 x 0.70
48 x 0.80
11.55

9.90
9.80

5.40
1.60

0.60
1.45
8.70

0.48

5.40

1.60
0.80
5.60

0.48 2.40±0.15
11.80
11.90
Top view Side view Bottom view

Figure 9: ESP32-C6-MINI-1U Physical Dimensions

Note:
For information about tape, reel, and product marking, please refer to Espressif Module Packaging Information.

Espressif Systems 33 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
9 Physical Dimensions and PCB Land Pattern

9.2 Recommended PCB Land Pattern

This section provides the following resources for your reference:

• Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure
10 ESP32-C6-MINI-1 Recommended PCB Land Pattern and Figure 11 ESP32-C6-MINI-1U Recommended
PCB Land Pattern.

• Source files of recommended PCB land patterns to measure dimensions not covered in Figure 10 and
Figure 11. You can view the source files for ESP32-C6-MINI-1 and ESP32-C6-MINI-1U with Autodesk
Viewer.

• 3D models of ESP32-C6-MINI-1 and ESP32-C6-MINI-1U. Please make sure that you download the 3D
model file in .STEP format (beware that some browsers might add .txt).

Unit: mm
: Pad

13.20

Pin 1 Antenna Area

48 x 0.40 4 x 0.70

0.60 1.45
4 x 0.70
48 x 0.80

16.60
11.20
9.90
9.80
1.60

5.40
0.60

1.45

5.40

1.60
0.80

11.80
11.90

Figure 10: ESP32-C6-MINI-1 Recommended PCB Land Pattern

Espressif Systems 34 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
9 Physical Dimensions and PCB Land Pattern

Unit: mm
: Pad
Pin 1 13.20
48 x 0.40 4 x 0.70

0.60 1.45

12.50
4 x 0.70
48 x 0.80
9.90
9.80
1.60

5.40
0.60

1.45
5.40

1.60

0.80
5.60
11.80
11.90

Figure 11: ESP32-C6-MINI-1U Recommended PCB Land Pattern

Espressif Systems 35 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
9 Physical Dimensions and PCB Land Pattern

9.3 Dimensions of External Antenna Connector

ESP32-C6-MINI-1U uses the third generation external antenna connector as shown in Figure 12 Dimensions of
External Antenna Connector. This connector is compatible with the following connectors:

• W.FL Series connector from Hirose

• MHF III connector from I-PEX

• AMMC connector from Amphenol

Unit: mm
Tolerance: +/-0.1 mm

CONTACT
A

2.00±0.10
1.7

A
GROUND CONTACT
2.05±0.10
1.7
0.57

0.85

CONTACT
1.40

0.10

HOUSING
HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;
SHELL

CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;

SECTION: A-A
SCALE: 1:1
SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;

PERFORMANCE:

CONTACT RESISTANCE: 20mOHM Max.

DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE;

INSULATION RESISTANCE: 500MOHM Min.

Figure 12: Dimensions of External Antenna Connector

Espressif Systems 36 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
10 Product Handling

10 Product Handling

10.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.

After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
60%RH. If the above conditions are not met, the module needs to be baked.

10.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V

10.3 Soldering Profile

10.3.1 Reflow Profile
Solder the module in a single reflow.

Peak temperature: 235 – 250 °C

Peak time: 30 – 70 s
Temperature (°C)
Soldering time: ＞ 30 s
Solder: Sn-Ag-Cu (SAC305) lead-free solder
250

230
217
200
180

150

100

50 Ramp-up Preheating Soldering Cooling

25 – 150 °C 150 – 200 °C ＞ 217 °C ＜ 180 °C
25 60 – 90 s 60 – 120 s 60 – 90 s –5 ~ –1 °C/s
1 – 3 °C/s
Time (s)
0 50 100 150 200 250

Figure 13: Reflow Profile

Espressif Systems 37 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
10 Product Handling

10.4 Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or
ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or
even failure. As a consequence, the module may stop working or its performance may deteriorate.

Espressif Systems 38 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
Related Documentation and Resources

Related Documentation and Resources

Related Documentation
• ESP32-C6 Series Datasheet – Specifications of the ESP32-C6 hardware.
• ESP32-C6 Technical Reference Manual – Detailed information on how to use the ESP32-C6 memory and periph-
erals.
• ESP32-C6 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-C6 into your hardware prod-
uct.
• Certificates
https://espressif.com/en/support/documents/certificates
• ESP32-C6 Product/Process Change Notifications (PCN)
https://espressif.com/en/support/documents/pcns?keys=ESP32-C6
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents

Developer Zone
• ESP-IDF Programming Guide for ESP32-C6 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos

Products
• ESP32-C6 Series SoCs – Browse through all ESP32-C6 SoCs.
https://espressif.com/en/products/socs?id=ESP32-C6
• ESP32-C6 Series Modules – Browse through all ESP32-C6-based modules.
https://espressif.com/en/products/modules?id=ESP32-C6
• ESP32-C6 Series DevKits – Browse through all ESP32-C6-based devkits.
https://espressif.com/en/products/devkits?id=ESP32-C6
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en

Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions

Espressif Systems 39 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
Revision History

Revision History

Date Version Release notes

• In Section 1.1 Features, and 1.2 Description, updated flash size from 4 MB
to up to 8 MB flash
• In Section 1.2 Description, added information about ESP32-C6-MINI-1-H8
2024-08-20 v1.2
and ESP32-C6-MINI-1U-H8
• In Section 1.1 Features, 1.2 Description, and 4.1 Functional Overview,
added information about ESP32-C6FH8

• In Section 1.1 Features, added information about certification and test

• In Section 5.4.1 Current Consumption in Active Mode, updated the mini-
mum RF transmit power for Bluetooth LE and 802.15.4 in active mode from
-24 dBm to -16 dBm, and updated the maximum power from 20 dBm to
19 dBm
2024-01-19 v1.1
• In Chapter 6 RF Characteristics, updated the RF transmit power range for
Bluetooth LE and 802.15.4 from -24 ~ 20 dBm to -16 ~ 19 dBm
• In Section 9.2 Recommended PCB Land Pattern, added information
about the recommended PCB land pattern of ESP32-C6-MINI-1U mod-
ule, and 3D models of ESP32-C6-MINI-1 and ESP32-C6-MINI-1U modules

• Added Chapter 4 Peripherals and removed peripheral-related information

from 1.2 Description
2023-06-27 v1.0 • Updated Table 8 ESP32-C6-MINI-1 Physical Dimensions and Table 9
ESP32-C6-MINI-1U Physical Dimensions to change the tolerance in the
top view from 0.25 to 0.2

2023-04-17 v0.6 Added information about ESP32-C6-MINI-1U module

2023-02-16 v0.5 Preliminary release

Espressif Systems 40 ESP32-C6-MINI-1 & MINI-1U Datasheet v1.2

Submit Documentation Feedback
Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND
ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR
PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No
licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are
hereby acknowledged.
Copyright © 2024 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.
www.espressif.com