EDC LAB - ELECTRONICS DEVICE & CIRCUITS LAB
EDC LAB - ELECTRONICS DEVICE & CIRCUITS LAB
UNIVERSITY)
ECE EDC LAB II Year III Sem
Prepared By
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CHAITANYA DEEMED TO BE UNIVERSITY,HYDERABAD
B. TECH –ELECTRONICS & COMMUNICATION ENGINEERING
INSTITUTION VISION
To be a premier Institution in Engineering & Technology and Management with
competency, values and social consciousness.
INSTITUTION MISSION
IM1 Provide high quality academic programs, training activities and research facilities.
IM3 Contribute to the economical and technological development of the region, state
and nation.
DEPARTMENT VISION
To be a technologically adaptive centre for computing by grooming the students as
top notch professionals.
DEPARTMENT MISSION
DM2 To provide an environment that enables overall development of all the stakeholders.
DM3 To impart training on emerging technology like Data Analytics, Artificial
Intelligence and Internet Of Things.
PEO 1: Higher Degrees & Professional Employment: Graduates with ability to pursue
career in core industries or higher studies in reputed institution.
PEO 2: Domain Knowledge: Graduates with ability to apply professional
knowledge/skills to design and develop product or process.
PEO 3: Engineering Career: Graduates with excellence in Electronics and
Communication Engineering along with effective inter-personnel skills.
PEO 4: Lifelong Learning: Graduates equipped with skills in recent technologies and be
receptive to attain professional competence through life-long learning.
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PROGRAM OUTCOMES (POs) & PROGRAM SPECIFIC
OUTCOMES (PSOs)
PO Description
PO 1 Engineering Knowledge: Apply the knowledge of mathematics, science, engineering fundamentals, and
an engineering specialization to the solution of complex engineering problems.
Problem Analysis: Identify, formulate, review research literature, and analyze complex engineering
PO 2
problems reaching substantiated conclusions using first principles of mathematics, natural sciences, and
engineering sciences.
Design / development of Solutions: Design solutions for complex engineering problems and design
PO 3 system components or processes that meet the specified needs with appropriate consideration for the
public health and safety, and the cultural, societal, and environmental considerations.
Conduct investigations of complex problems: Use research-based knowledge and research methods
PO 4 including design of experiments, analysis and interpretation of data, and synthesis of the information to
provide valid conclusions.
Modern tool usage: Create, select, and apply appropriate techniques, resources, and modern engineering
PO 5 and IT tools including prediction and modeling to complex engineering activities with an understanding
of the limitations.
The engineer and Society: Apply reasoning informed by the contextual knowledge to assess societal,
PO 6 health, safety, legal and cultural issues and the consequent responsibilities relevant to the professional
engineering practice.
Environment and sustainability: Understand the impact of the professional engineering solutions in
PO 7
societal and environmental contexts, and demonstrate the knowledge of, and need for sustainable
development.
PO 8 Ethics: Apply ethical principles and commit to professional ethics and responsibilities and norms of the
engineering practice
PO 9 Individual and team work: Function effectively as an individual, and as a member or leader in diverse
teams, and in multidisciplinary settings.
Communication: Communicate effectively on complex engineering activities with the engineering
PO 10 community and with society at large, such as, being able to comprehend and write effective reports and
design documentation, make effective presentations, and give and receive clear instructions.
Project management and finance: Demonstrate knowledge and understanding of the engineering and
PO 11 management principles and apply these to one’s own work, as a member and leader in a team, to manage
projects and in multidisciplinary environments.
PO 12 Life-long learning: Recognize the need for, and have the preparation and ability to engage in independent
and life-long learning in the broadest context of technological Change
Program Specific Outcomes
Basic Electronic and communications knowledge: Apply basic knowledge related to electronic
PSO 1 circuits, VLSI, communication systems, signal processing and embedded systems to solve
engineering/societal problems.
PSO 2 Design Methods: Design, verify and authenticate electronic functional elements for different applications,
with skills to interpret and communicate results.
PSO 3 Experimentation & Communications: Engineering and management concepts are used to analyze
specifications and prototype electronic experiments/projects either independently or in teams.
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ECE
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ECE
Course outcomes:
Course PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12 PSO1 PSO2 PSO3
Outcome
C216.1 3 3 - - 2 - - - 2 - - 2 3 - 3
C216.2 3 3 - - 2 - - - 2 - - 2 3 - 3
C216.3 3 3 2 - 2 - - - 2 - - 2 3 - 3
C216.4 3 3 2 - 2 - - - 2 - - 2 3 - 3
C216.5 3 3 2 - 2.5 - - - - - - 2 3 - 3
C216.6 3 3 2 - 2.5 - - - - - - 2 3 - 3
C216 3 3 2 - 2.1 - - - 2 - - 2 3 - 3
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EDC LAB
List of Experiments:
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Electrical and Electronic Symbols
Electrical symbols and electronic circuit symbols are used for drawing schematic diagram.
The symbols represent electrical and electronic components.
Table of Electrical and Electronic Symbols:
Wire Symbols
SPST Relay
Relay open / close connection by an electromagnet
SPDT Relay
CHAITANYA DEEMED TO BE
UNIVERSITY,HYDERABAD. Dept. of ECE – “EDC Laboratory Manual”
7
Ground Symbols
Used for zero potential reference and electrical
Earth Ground
shock protection.
Resistor Symbols
Resistor (IEEE)
Resistor reduces the current flow.
Resistor (IEC)
Potentiometer (IEEE)
Adjustable resistor - has 3 terminals.
Potentiometer (IEC)
Capacitor Symbols
Capacitor
Capacitor is used to store electric charge. It acts as
short circuit with AC and open circuit with DC.
Capacitor
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Inductor / Coil Symbols
Variable Inductor
Meter Symbols
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Wattmeter Measures electric power
Tunnel Diode
Light Emitting Diode (LED) LED emits light when current flows through
Transistor Symbols
NPN Bipolar Transistor Allows current flow when high potential at base (middle)
PNP Bipolar Transistor Allows current flow when low potential at base (middle)
CHAITANYA DEEMED TO BE
UNIVERSITY,HYDERABAD. Dept. of ECE – “EDC Laboratory Manual”
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JFET-N Transistor N-channel field effect transistor
Misc. Symbols
Fuse
The fuse disconnects when current above threshold.
Used to protect circuit from high currents.
Fuse
Bus
Bus
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Microphone Converts sound waves to electrical signal
Antenna Symbols
Antenna / aerial
Transmits & receives radio waves
Antenna / aerial
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NOR Gate Outputs 0 when any input is 1. (NOT + OR)
Multiplexer / Mux 2 to 1
Connects the output to selected input line.
Multiplexer / Mux 4 to 1
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THE OSCILLOSCOPE
Introduction
The oscilloscope is a universal measuring instrument with applications in physics, biology,
chemistry, medicine, and many other scientific and technological areas. It is used to give a visual
representation of electrical voltages. Thus, any quantity which can be converted to a voltage can be
displayed on an oscilloscope. Although the oscilloscope looks very complicated, once you familiarize
yourself with its controls and functions, it is surprisingly easy to use. The purpose of this experiment is
to develop familiarity with the oscilloscope and with the types of measurements that can be made with
it.
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BREADBOARD
A breadboard is a construction base for prototyping of electronics. The term is commonly used
to refer to solderless breadboard. Because the solderless breadboard does not require soldering, it
is reusable. This makes it easy to use for creating temporary prototypes and experimenting with circuit
design. Older breadboard types did not have this property. A stripboard (veroboard) and similar
prototyping printed, which are used to build permanent soldered prototypes or one-offs, cannot easily
be reused. A variety of electronic systems may be prototyped by using breadboards, from small analog
and digital circuits to complete central processing units (CPUs).
Solderless breadboards are available from several different manufacturers, but most share a
similar layout. The layout of a typical solderless breadboard is made up from two types of areas, called
strips. Strips consist of interconnected electrical terminals.
Bus strips:
Usually Bus strips to provide power to the electronic components. A bus strip usually contains
two columns: one for ground and one for a supply voltage. However, some breadboards only provide a
single-column power distributions bus strip on each long side. Typically the column intended for a
supply voltage is marked in red, while the column for ground is marked in blue or black. Some
manufacturers connect all terminals in a column. Others just connect groups of, for example, 25
consecutive terminals in a column. The latter design provides a circuit designer with some more control
over crosstalk (inductively coupled noise) on the power supply bus. Often the groups in a bus strip are
indicated by gaps in the color marking. Bus strips typically run down one or both sides of a terminal
strip or between terminal strips. On large breadboards additional bus strips can often be found on the
top and bottom of terminal strips.
Terminal strips:
Terminal strips are the main areas, to hold most of the electronic components. In the middle of a
terminal strip of a breadboard, one typically finds a notch running in parallel to the long side. The notch
is to mark the centerline of the terminal strip and provides limited airflow (cooling) to DIP ICs straddling
the centerline. The clips on the right and left of the notch are each connected in a radial way; typically
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five clips (i.e., beneath five holes) in a row on each side of the notch are electrically connected. The five
clip columns on the left of the notch are often marked as A, B, C, D, and E, while the ones on the right
are marked F, G, H, I and J. When a "skinny" Dual In-line Pin package (DIP) integrated circuit (such as
a typical DIP-14 or DIP-16, which have a 0.3 inch separation between the pin rows) is plugged into a
breadboard, the pins of one side of the chip are supposed to go into column E while the pins of the
other side go into column F on the other side of the notch.
Some manufacturers provide separate bus and terminal strips. Others just provide breadboard
blocks which contain both in one block. Often breadboard strips or blocks of one brand can be clipped
together to make a larger breadboard. In a more robust variant, one or more breadboard strips are
mounted on a sheet of metal. Typically, that backing sheet also holds a number of binding posts. These
posts provide a clean way to connect an external power supply. This type of breadboard may be slightly
easier to handle. Several images in this article show such solderless breadboards.
Example breadboard drawing. Two bus strips and one terminal strip in one block. 25 consecutive terminals in a
bus strip connected (indicated by gaps in the red and blue lines). Four binding posts depicted at the left.
A "full size" terminal breadboard strip typically consists of around 56 to 65 rows of connectors,
each row containing the above mentioned two sets of connected clips (A to E and F to J). Together with
bus strips on each side this makes up a typical 784 to 910 tie point solderless breadboard. "Small size"
strips typically come with around 30 rows. Miniature solderless breadboards as small as 17 rows (no
bus strips, 170 tie points) can be found, but these are less well suited for practical use.
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COLOR BANDS
To distinguish left from right there is a gap between the C and D bands.
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1. P-N JUNCTION DIODE CHARACTERISTICS
Aim: To draw the Voltage-current characteristics of PN junction diode under forward and reverse bias
condition and to determine cut in voltage, reverse saturation current and forward dynamic resistance.
Apparatus Required:
CIRCUIT DIAGRAM:-
Forward bias:- Reverse bias :-
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Model waveform:-
THEORY:-
The figure shows the physical and schematic circuit symbol of the diode. The band on the diode
and the bar on the left of the circuit symbol represent the cathode (n-type material) and must be noted.
The p-type material (the anode) in the diode is located to the right. The circuit symbol of the diode is an
arrow showing forward bias, when the p-side is positive with respect to the n-side, and the direction of
the arrow represents the direction of large current flow.
A p-n junction diode conducts only in one direction. The V-I characteristics of the diode are curve
between voltage across the diode and current through the diode. When external voltage is zero, circuit
is open and the potential barrier does not allow the current to flow. Therefore, the circuit current is zero.
When P-type (Anode is connected to +ve terminal and n- type (cathode) is connected to –ve terminal of
the supply voltage, is known as forward bias. The potential barrier is reduced when diode is in the
forward biased condition. At some forward voltage, the potential barrier altogether eliminated and
current starts flowing through the diode and also in the circuit. The diode is said to be in ON state. The
current increases with increasing forward voltage.
CHAITANYA DEEMED TO BE UNIVERSITY,HYDERABAD. Dept. of ECE – “EDC Laboratory Manual”
19
When N-type (cathode) is connected to +ve terminal and P-type (Anode) is connected –ve
terminal of the supply voltage is known as reverse bias and the potential barrier across the junction
increases. Therefore, the junction resistance becomes very high and a very small current (reverse
saturation current) flows in the circuit. The diode is said to be in OFF state. The reverse bias current
due to minority charge carriers.
PROCEDURE:-
Forward bias
2. For forward bias, the DC power supply +ve terminal is connected to the anode of the diode and –ve
terminal is connected to the cathode of the diode using 1N4007.
3. Switch on the power supply and increases the input voltage gradually in Steps.
4. Note down the corresponding current flowing through the diode (in mA) and voltage across the diode
for each and every step of the input voltage.
7. From the graph calculate cut-in voltage, Static resistance and Dynamic resistances.
Reverse bias
2. For reverse bias, the DC power supply +ve terminal is connected to the cathode of the diode and –
ve terminal is connected to the anode of the diode using 1N4007.
3. Switch on the power supply and increases the input voltage gradually in Steps.
4. Note down the corresponding current flowing through the diode (in µA) and voltage across the diode
for each and every step of the input voltage.
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Observations:
Forward bias Reverse bias
S.NO Applied Voltage across Current S.NO Applied Voltage across Current
voltage (V) diode(V) IF (mA) voltage (V) diode(V) IR (µA)
1 1
2 2
3 3
. .
. .
. .
. .
. .
. .
. .
30 30
Calculations:-
From the graph at a given operating point we can determine the static resistance (R d) and
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Precautions:-
1. All the connections should be correct.
2. While doing the experiment do not exceed the ratings of the diode. This may lead to damage of the
diode.
3. Connect voltmeter and Ammeter in correct polarities as shown in the circuit diagram.
4. Do not switch ON the power supply unless you have checked the circuit connections as per the
circuit diagram.
5. Parallax error should be avoided while taking the readings from the (if) Analog meters.
RESULT:- Forward and Reverse Bias characteristics for a p-n diode is observed.
VIVA QESTIONS:-
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2. ZENER DIODE CHARACTERISTICS
AIM:
To volt-ampere characteristics of a given Zener diode, breakdown voltage, voltage regulation of
a given zener diode and Dynamic reverse bias resistance at breakdown voltage.
Apparatus Required:
CIRCUIT DIAGRAM:-
Forward bias:- Reverse bias:-
Theory:-
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A zener diode is heavily doped p-n junction diode, specially made to operate in the break down
region. A p-n junction diode normally does not conduct when reverse biased. But if the reverse bias is
increased, at a particular voltage it starts conducting heavily. This voltage is called Break down
Voltage. High current through the diode can permanently damage the device. To avoid high current,
we connect a resistor in series with zener diode. Once the diode starts conducting it maintains almost
constant voltage across the terminals what ever may be the current through it, i.e., it has very low
dynamic resistance. It is used in voltage regulators.
PROCEDURE:-
Forward bias:-
2. For forward bias, the DC power supply +ve terminal is connected to the anode of the diode and –ve
terminal is connected to the cathode of the zener diode using BZX5V or BZX8V.
3. Switch on the power supply and increases the input voltage gradually in Steps.
4. Note down the corresponding current flowing through the diode (in mA) and voltage across the diode
for each and every step of the input voltage and tabulate the readings.
6. From the graph calculate cut-in voltage, Static resistance and Dynamic resistances.
Reverse bias:-
2. For reverse bias, the DC power supply +ve terminal is connected to the cathode of the diode and
-ve terminal is connected to the anode of the zener diode using BZX5V or BZX8V.
3. Switch on the power supply and increases the input voltage gradually in Steps.
4. Note down the corresponding current flowing through the diode (in µA) and voltage across the diode
for each and every step of the input voltage.
6. Graph is plotted between voltage and current, and from the graph calculate the Breakdown voltage.
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Observations:
Forward bias Reverse bias
S.NO Applied Voltage across Current S.NO Applied Voltage across Current
voltage (V) diode(V) IF (mA) voltage (V) diode(V) IR (µA)
Calculations:-
From the graph at a given operating point we can determine the static resistance (Rd) and dynamic
resistance (rd).
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MODEL WAVEFORMS:-
PRECAUTIONS:-
1. The terminals of the zener diode should be properly identified
2. While determined the load regulation, load should not be immediately shorted.
3. Should be ensured that the applied voltages & currents do not exceed the ratings of the diode.
RESULT:-
a) Static characteristics of zener diode are obtained and
drawn. b) Percentage regulation of zener diode is calculated.
VIVAQUESTIONS:-
1. What type of temperature Coefficient does the zener diode have?
2. If the impurity concentration is increased, how the depletion width effected?
3. Does the dynamic impendence of a zener diode vary?
4. Explain briefly about avalanche and zener breakdowns?
5. Draw the zener equivalent circuit?
6. Differentiate between line regulation & load regulation?
7. In which region zener diode can be used as a regulator?
8. How the breakdown voltage of a particular diode can be controlled?
9. What type of temperature coefficient does the Avalanche breakdown has?
10. By what type of charge carriers the current flows in zener and avalanche breakdown diodes?
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3. LIGHT EMITTING DIODES
AIM: The purpose of this experiment is to determine and plot the characteristics of the light emitting diode in the
forward-bias region, and to compare between different colored diodes.
Required Parts and Equipment's
1. Variable DC Power Supply.
2. Digital Multimeters.
3. Electronic Test Board(M50).
4. Light Emitting Diodes (LEDs) with different colors (Red, Yellow, and Green).
5. Resistor (470Ω, 1W).
6. Leads and Wires.
Theory
The Light-Emitting Diode (LED) is a semiconductor PN junction diode that emits visible light or near-
infrared radiation when forward biased. LEDs switch off and on rapidly, are very rugged and efficient, have a
very long lifetime, don’t heat up, and are easy to use. They are used as indicators, displays, and as light
transmitters.
Various impurities are added during the doping process to vary the color output. The LED is basically, just a
specialized type of PN junction diode, made from a very thin layer of fairly heavily doped semiconductor
material. Fig.1 depicts the construction of the light emitting diode.
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As shown from Fig.1, the cathode is the short lead and there may be a slight flat on the body of round LEDs.
Light emitting diodes are available in a wide range of colors with the most common being RED, ORANGE,
YELLOW and GREEN, and are thus widely used as visual indicators and as moving light displays. Visible LEDs
emit relatively narrow bands of green, yellow, orange, or red light. Infrared LEDs emit in one of several bands
just beyond red light.
Light Emitting Diodes are made from special semiconductor compounds such as Gallium Arsenide (GaAs),
Gallium Phosphide (GaP), Gallium Arsenide Phosphide (GaAsP), Silicon Carbide (SiC) or Gallium Indium
Nitride (GaInN) all mixed together at different ratios to produce a distinct wavelength of color. Silicon and
germanium are not used because they are heat producing materials and are very poor in producing light. Thus, the
actual color of a light emitting diode is determined by the wavelength of the light emitted, which in turn is
determined by the actual semiconductor compound used in forming the PN junction during the manufacturing
process. Therefore, the color of an LED is determined by the semiconductor material, not by the coloring of the
'package' (the plastic body). Table 1 below shows typical technical data for some LEDs with diffused packages.
When an LED is forward biased to the threshold of conduction, its current increases rapidly and must be
controlled to prevent destruction of the device. The light output is quite linearly proportional to the forward LED
current as shown in Fig.3.
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A series resistor (Rs) should be used to limit the current through the LED to a safe value. The LED diode voltage
drop ranges from about 1.3V to about 3.6V. This resistor is calculated from:
Where 𝑉𝑆 is the source bias voltage, 𝑉𝐷 is the LED voltage drop, and 𝐼(max )is the maximum current of the
LED, Fig.4 shows the IV characteristics in the forward bias region for some typical diodes with different colored
packages.
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4. TRANSISTOR COMMON -BASE CONFIGURATION
AIM:
1. To plot the input and output characteristics of a transistor connected in common base configuration.
2. To calculate the input dynamic resistance and output dynamic resistance at a given operating point.
3. To calculate the dc current gain (αdc) and ac current gain (αac) at a given operating point.
Apparatus Required:
CIRCUIT DIAGRAM:-
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THEORY:
A transistor is a three terminal active device. T he terminals are emitter, base, collector. In CB
configuration, the base is common to both input (emitter) and output (collector). For normal operation,
the E-B junction is forward biased and C-B junction is reverse biased.
In CB configuration, IE is +ve, IC is –ve and IB is –ve.
So, VEB=f1 (VCB,IE) and
IC=f2 (VCB,IB)
With an increasing the reverse collector voltage, the space-charge width at the output junction
increases and the effective base width ‘W’ decreases. This phenomenon is known as “Early effect”.
Then, there will be less chance for recombination within the base region. With increase of charge
gradient with in the base region, the current of minority carriers injected across the emitter junction
increases.The current amplification factor of CB configuration is given by,
α= ∆IC/ ∆IE
PROCEDURE:
Input characteristics:
1. Connections are made as per the circuit diagram.
2. For plotting the input characteristics, set VCB = 0V and vary VEE gradually in steps and note down
the corresponding IE and VEB.
3. Repeat the above step by keeping VCB at 4V, 6V, and 10V.
4. Tabulate the readings.
5. Plot the graph between VEB and IE for constant VCB.
Output characteristics:
1. Connections are made as per the circuit diagram.
2. For plotting the output characteristics, set IE = 2 mA and vary VCC gradually in steps and note down
the corresponding IC and VCB.
3. Repeat the above step by keeping IE = 4 mA, 6 mA.
4. Tabulate the readings.
5. Plot the graph between VCB and IC for constant IE.
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OBSERVATIONS:
Input characteristics:
Output characteristics:
HALF PAGE
Calculations:-
Input dynamic resistance (ri) = = _________
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MODEL GRAPHS:
Input characteristics
Output characteristics
PRECAUTIONS:
1. The supply voltages should not exceed the rating of the transistor.
2. Meters should be connected properly according to their polarities.
RESULT:
1. The input and output characteristics of the transistor are drawn.
2. The α of the given transistor is calculated.
Viva questions:
1. What is the range of α for the transistor?
2. Draw the input and output characteristics of the transistor in CB configuration?
3. Identify various regions in output characteristics?
4. What is the relation between α and β?
5. What are the applications of CB configuration?
6. What are the input and output impedances of CB configuration?
7. Define α(alpha)?
8. What is EARLY effect?
9. Draw diagram of CB configuration for PNP transistor?
10. What is the power gain of CB configuration?
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5. TRANSISTOR CE CHARACTERSTICS
AIM: 1. To draw the input and output characteristics of transistor connected in
CE configuration
2. To find β of the given transistor.
Apparatus Required:
CIRCUIT DIAGRAM:-
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THEORY:
A transistor is a three terminal device. The terminals are emitter, base, collector. In
common emitter configuration, input voltage is applied between base and emitter terminals and out
put is taken across the collector and emitter terminals.
Therefore the emitter terminal is common to both input and output.
The input characteristics resemble that of a forward biased diode curve. This is expected
since the Base-Emitter junction of the transistor is forward biased. As compared to CB arrangement I B
increases less rapidly with VBE . Therefore input resistance of CE circuit is higher than that of CB
circuit.
The output characteristics are drawn between I c and VCE at constant IB. the collector current
varies with VCE unto few volts only. After this the collector current becomes almost constant, and
independent of VCE. The value of VCE up to which the collector current changes with V CE is known as
Knee voltage. The transistor always operated in the region above Knee voltage, IC is always constant
and is approximately equal to IB.
The current amplification factor of CE configuration is given
by Β = ΔIC/ΔIB
PROCEDURE:
INPUT CHARECTERSTICS:
1. Connect the circuit as per the circuit diagram.
2. For plotting the input characteristics the output voltage VCE is kept constant at 0V and for
different values of VBE note down the values of IC.
3. Repeat the above step by keeping VCE at 2V and 4V.
4. Tabulate all the readings.
5. plot the graph between VBE and IB for constant VCE
OUTPUT CHARACTERSTICS:
1. Connect the circuit as per the circuit diagram
2. for plotting the output characteristics the input current I B is kept constant at 10μA and for
different values of VCE note down the values of IC
3. repeat the above step by keeping IB at 75 μA 100 μA
4. tabulate the all the readings
5. plot the graph between VCE and IC for constant IB
CHAITANYA DEEMED TO BE UNIVERSITY,HYDERABAD. Dept. of ECE – “EDC Laboratory Manual”
35
MODEL GRAPHS:
INPUT CHARACTERSTICS:
OUTPUT CHARECTERSTICS:
36
Calculations:-
Input dynamic resistance (ri) = = _________
PRECAUTIONS:
1. The supply voltage should not exceed the rating of the transistor
2. Meters should be connected properly according to their polarities
RESULT:
1. the input and out put characteristics of a transistor in CE configuration are Drawn
2. the of a given transistor is calculated
VIVA QUESTIONS:
1. What is the range of for the transistor?
2. What are the input and output impedances of CE configuration?
3. Identify various regions in the output characteristics?
4. what is the relation between and
5. Define current gain in CE configuration?
6. Why CE configuration is preferred for amplification?
7. What is the phase relation between input and output?
8. Draw diagram of CE configuration for PNP transistor?
9. What is the power gain of CE configuration?
10. What are the applications of CE configuration?
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6. HALF – WAVE RECTIFIER
AIM: -
1.To observe the input and output waveforms of the Half-wave rectifier on CRO with and without filter.
2.To find load regulation and ripple factor of a half-wave rectifier both with and without filter.
Apparatus Required:
CIRCUIT DIAGRAM:-
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THEORY: -
During positive half-cycle of the input voltage, the diode D1 is in forward bias and conducts
through the load resistor R1. Hence the current produces an output voltage across the load resistor R1,
which has the same shape as the +ve half cycle of the input voltage.
During the negative half-cycle of the input voltage, the diode is reverse biased and there is no
current through the circuit. i.e, the voltage across R1 is zero. The net result is that only the +ve half
cycle of the input voltage appears across the load. The average value of the half wave rectified o/p
voltage is the value measured on dc voltmeter.
For practical circuits, transformer coupling is usually provided for two reasons.
1. The voltage can be stepped-up or stepped-down, as needed.
2. The ac source is electrically isolated from the rectifier. Thus preventing shock hazards in
the secondary circuit.
PROCEDURE:-
1. Connections are made as per the circuit diagram.
2. Connect the primary side of the transformer to ac mains and the secondary side to the rectifier
input.
3. By the millimeter, measure the, ac and dc voltage at the output of the rectifier with 100 Ω load
resistor VAC(RMS) and VDC respectively.
4. From the CRO output, calculate Vm.
5. Repeat the above step by using different load resistors i.e. with 1 KΩ, 2.2 KΩ, 5.8 KΩ and 10 KΩ.
6. For each reading calculate the ripple factor and percentage regulation.
(Calculate percentage regulation using 1 MΩ resistor as no load.)
7. Repeat the above steps (3, 4, 5 and 6) by using 2.2 µF capacitor filter.
8. Repeat the above steps (3, 4, 5 and 6) by using 100 µF capacitor filter.
9. Plot the graphs for AC input I-Phase signal, output of rectifier without filter and output of
rectifier with filter by considering 1 KΩ resistor as load.
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Expected Waveforms:
Input waveform:
Observations
Observation for without filter with varying load resistance:
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Observation for with filter c= 2.2 µF with varying load resistance:
CALCULATIONS:
Theoretical Calculations:-
Without Filter:-
Vrms=Vm/2 = ________
Vm=2Vrms = ________
Vdc=Vm/П = ________
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Practical calculations:-
Vac= ________
Vdc= ________
Ripple factor with out Filter = Vac / Vdc = ________
Ripple factor with Filter = Vac / Vdc = ________
PRECAUTIONS:
1. The primary and secondary sides of the transformer should be carefully identified.
2. The polarities of the diode should be carefully identified.
3. While determining the % regulation, first Full load should be applied and then it should be
decremented in steps.
RESULT:-
1. The Ripple factor for the Half-Wave Rectifier with and without filters is measured.
2. The % regulation of the Half-Wave rectifier is calculated.
VIVA QUESTIONS:
1. What is the PIV of Half wave rectifier?
2. What is the efficiency of half wave rectifier?
3. What is the rectifier?
4. What is the difference between the half wave rectifier and full wave Rectifier?
5. What is the o/p frequency of Bridge Rectifier?
6. What are the ripples?
7. What is the function of the filters?
8. What is TUF?
9. What is the average value of o/p voltage for HWR?
10. What is the peak factor?
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7. FULL-WAVE RECTIFIER
AIM:-
1.To observe the input and output waveforms of the Full-wave rectifier on CRO with and without filter.
2.To find load regulation and ripple factor of a Full-wave rectifier both with and without filter.
Apparatus Required:
CIRCUIT DIAGRAM:-
THEORY:-
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The circuit of a center-tapped full wave rectifier uses two diodes D1&D2. During
positive half cycle of secondary voltage (input voltage), the diode D1 is forward biased and D2is
reverse biased.
The diode D1 conducts and current flows through load resistor R L. During negative half cycle,
diode
D2 becomes forward biased and D1 reverse biased. Now, D2 conducts and current flows
through the load resistor RL in the same direction. There is a continuous current flow through the load
resistor RL, during both the half cycles and will get unidirectional current as show in the model graph.
The difference between full wave and half wave rectification is that a full wave rectifier allows
unidirectional (one way) current to the load during the entire 360 degrees of the input signal and half-
wave rectifier allows this only during one half cycle (180 degree).
PROCEDURE:-
1. Connections are made as per the circuit diagram.
2. Connect the primary side of the transformer to ac mains and the secondary side to the rectifier
input.
3. By the millimeter, measure the, ac and dc voltage at the output of the rectifier with 100 Ω load
resistor VAC(RMS) and VDC respectively.
4. From the CRO output, calculate Vm.
5. Repeat the above step by using different load resistors i.e. with 1 KΩ, 2.2 KΩ, 5.8 KΩ and 10 KΩ.
6. For each reading calculate the ripple factor and percentage regulation.
(Calculate percentage regulation using 1 MΩ resistor as no load.)
7. Repeat the above steps (3, 4, 5 and 6) by using 2.2 µF capacitor filter.
8. Repeat the above steps (3, 4, 5 and 6) by using 100 µF capacitor filter.
9. Plot the graphs for AC input I-Phase signal, output of rectifier without filter and output of
rectifier with filter by considering 1 KΩ resistor as load.
Expected Waveforms:
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Input waveform:
Observations
Observation for without filter with varying load resistance:
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Load Vdc Vac(rms) Ripple
S. No. Vm % Regulation
Resistor = 2Vm/ Л = Vm / √2 factor(γ)
THEORITICAL CALCULATIONS:-
Vrms = Vm / √2 = _________
Vm =Vrms√2 = _________
Vdc=2Vm / П = _________
PRACTICAL CALCULATIONS:
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Without filter:- Vac = _________
Vdc = _________
Ripple factor, r=V ac / Vdc = _________
With filters:- Vac= _______
Vdc= _______
Ripple factor=Vac/ Vdc = _______
PRECAUTIONS:
1. The primary and secondary side of the transformer should be carefully identified
2. The polarities of all the diodes should be carefully identified.
RESULT:-
The ripple factor of the Full-wave rectifier (with filter and without filter) is calculated.
VIVA QUESTIONS:-
1. Define regulation of the full wave rectifier?
2. Define peak inverse voltage (PIV)? And write its value for Full-wave rectifier?
3. If one of the diode is changed in its polarities what wave form would you get?
4. Does the process of rectification alter the frequency of the waveform?
5. What is ripple factor of the Full-wave rectifier?
6. What is the necessity of the transformer in the rectifier circuit?
7. What are the applications of a rectifier?
8. What is ment by ripple and define Ripple factor?
9. Explain how capacitor helps to improve the ripple factor?
10. Can a rectifier made in INDIA (V=230v, f=50Hz) be used in USA (V=110v, f=60Hz)?
AIM: a). To plot a family of drain and transfer characteristics of a given FET.
b). To find the FET parameters drain resistance (rd), amplification factor (μ), and trans-
conductance (gm) of the given FET.
Apparatus Required:
Circuit Diagram:-
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Theory:
A FET is a three terminal device, having the characteristics of high input impedance and less
noise, the Gate to Source junction of the FET s always reverse biased. In response to small applied
voltage from drain to source, the n-type bar acts as sample resistor, and the drain current increases
linearly with VDS. With increase in ID the ohmic voltage drop between the source and the channel
region reverse biases the junction and the conducting position of the channel begins to remain
constant. The VDS at this instant is called “pinch of voltage”.
If the gate to source voltage (VGS) is applied in the direction to provide additional reverse bias,
the pinch off voltage ill is decreased.
In amplifier application, the FET is always used in the region beyond the pinch-off.
FDS = IDSS*(1-VGS/VP)^2
Procedure:
To obtain drain characteristics:
1. All the connections are made as per the circuit diagram.
2. To plot the drain characteristics, keep VGS constant at 0V (VGS can be set 0V by short circuiting the
terminals of input power supply).
3. Vary the drain voltage (VDD) and observe the values of source voltage (VDS) and drain current
(ID) and note down values in convenient steps.
4. Repeat the above step 3 for different values of VGS at -1V and -2V.
5. All the readings are tabulated and plot the graph V DS verses ID for a constant VGS.
To obtain transfer characteristics:
6. To plot the transfer characteristics, keep VDS constant at 0.5 V.
7. Vary the gate voltage (VGG) and observe the values of gate source voltage (VGS) and drain
current (ID) and note down values in convenient steps.
8. Repeat step 7 for different values of VDS at 1 V and 1.5 V.
9. The readings are tabulated and plot the graph VGS verses ID for a constant VDS.
10. From drain characteristics, calculate the values of dynamic resistance (r d) by using the formula
rd = ∆VDS/∆ID
11. From transfer characteristics, calculate the value of transconductace (gm) By using the formula
Gm=∆ID/∆VDS
12. Amplification factor (μ) = dynamic resistance. Tran conductance μ = ∆V DS/∆VGS
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Model Graph:
Drain Characteristics: Transfer Characteristics:
Observations:
Drain characteristics:
50
Transfer characteristics:
Calculations:
At a suitable operating point, the parameters are calculated as follows:
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Precautions:
1. The three terminals of the FET must be care fully identified
2. Practically FET contains four terminals, which are called source, drain, Gate, substrate.
3. Source and case should be short circuited.
4. Voltages exceeding the ratings of the FET should not be applied.
Result :
1. The drain and transfer characteristics of a given FET are drawn
2. The dynamic resistance (rd), amplification factor (μ) and Tran conductance (gm) of the given
FET are calculated.
VIVA QUESTIONS:
1. What are the advantages of FET?
2. Different between FET and BJT?
3. Explain different regions of V-I characteristics of FET?
4. What are the applications of FET?
5. What are the types of FET?
6. Draw the symbol of FET.
7. What are the disadvantages of FET?
8. What are the parameters of FET?
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9. Measurement of h-parameters of CE configuration
Apparatus Required:
Circuit Diagram:-
53
THEORY:
Input characteristics: The two sets of characteristics are necessary to describe the behavior of the
CE configuration one for input or base emitter circuit and other for the output or collector emitter
circuit. In input characteristics the emitter base junction forward biased by a very small voltage VBB
where as collector base junction reverse biased by a very large voltage V CC. The input characteristics
are a plot of input current IB Vs the input voltage VBE for a range of values of output voltage VCE . The
following important points can be observed from these characteristics curves.
Output characteristics: A set of output characteristics or collector characteristics are a plot of out put
current IC VS output voltage VCE for a range of values of input current I B .The following important points
can be observed from these characteristics curves.
The transistor always operates in the active region. I.e. the collector current I C increases with VCE
very slowly. For low values of the VCE the IC increases rapidly with a small increase in VCE. The
transistor is said to be working in saturation region.
Output resistance is the ratio of change of collector emitter voltage ΔVCE, to change in collector
current ΔIC with constant IB. Output resistance or Output impedance hoe = ΔVCE / ΔIC at IB constant.
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PROCEDURE:
1. Connect a transistor in CE configuration circuit for plotting its input and output characteristics.
2. Take a set of readings for the variations in I B with VBE at different fixed values of output voltage
VCE .
3. Plot the input characteristics of CE configuration from the above readings.
4. From the graph calculate the input resistance h ie and reverse transfer ratio hre by taking the
slopes of the curves.
5. Take the family of readings for the variations of I C with VCE at different values of fixed IB.
6. Plot the output characteristics from the above readings.
7. From the graphs calculate hfe ands hoe by taking the slope of the curves.
Tabular Forms
Input Characteristics:
VCE=0V VCE=6V
S.NO
VBE(V) IB(μA) VBE(V) IB(μA)
Output Characteristics:
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MODEL WAVEFORM:
Input Characteristics
Output Characteristics
56
RESULT: The H-Parameters for a transistor in CE configuration are calculated from the input and
output characteristics.
VIVA QUESTIONS:
57
10. TRANSISTOR COMMON EMITTER AMPLIFIER
AIM: 1. To design and plot the frequency response of a CE amplifier and to find the ‘Voltage gain’ and
‘Bandwidth’ from the frequency response curve of the CE amplifier.
Apparatus Required:
THEORY:
58
The CE amplifier provides high gain &wide frequency response. The emitter lead is
common to both input & output circuits and is grounded. The emitter-base circuit is forward biased.
The collector current is controlled by the base current rather than emitter current. The input signal is
applied to base terminal of the transistor and amplifier output is taken across collector terminal. A very
small change in base current produces a much larger change in collector current. When +VE half-
cycle is fed to the input circuit, it opposes the forward bias of the circuit which causes the collector
current to decrease, it decreases the voltage more –VE. Thus when input cycle varies through a -VE
half-cycle, increases the forward bias of the circuit, which causes the collector current to increases
thus the output signal is common emitter amplifier is in out of phase with the input signal.
PROCEDURE:
59
OBSERVATIONS:
ONE PAGE
Frequency Response: Input voltage Vi = 20mV
FREQUENCY OUTPUT VOLTAGE (V0) GAIN IN dB
(in Hz) In volts Av=20 log10 (V0/Vi)
MODELWAVE FORMS:
Input wave form
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FREQUENCY RESPONSE
RESULT: The voltage gain and frequency response of the CE amplifier are obtained. Also gain
bandwidth product of the amplifier is calculated.
VIVA QUESTIONS:
61
11. COMMON COLLECTOR AMPLIFIER
Apparatus Required:
62
THEORY:
In common-collector amplifier the input is given at the base and the output is taken at the
emitter. In this amplifier, there is no phase inversion between input and output. The input impedance
of the CC amplifier is very high and output impedance is low. The voltage gain is less than unity. Here
the collector is at ac ground and the capacitors used must have a negligible reactance at the
frequency of operation.
This amplifier is used for impedance matching and as a buffer amplifier. This circuit is also
known as emitter follower.
PROCEDURE:
1. Connections are made as per the circuit diagram.
2. For calculating the voltage gain the input voltage of 20mV peak-to-peak and 1 KHz frequency is
applied and output voltage is taken for various load resistors.
3. The readings are tabulated.
The voltage gain calculated by using the expression,
Av=V0/Vi
4. For plotting the frequency response the input voltage is kept constant a
20mV peak-to- peak and the frequency is varied from 100Hzto 1MHz.
5. Note down the values of output voltage for each frequency.
All the readings are tabulated the voltage gain in dB is calculated by using the expression,
Av=20log 10(V0/Vi)
6. A graph is drawn by taking frequency on X-axis and gain in dB on y-axis on Semi-log graph
sheet. The Bandwidth of the amplifier is calculated from the graph using the Expression,
Bandwidth BW=f2-f1
Where f1 is lower cut-off frequency of CE amplifier
f2 is upper cut-off frequency of CE amplifier
The gain Bandwidth product of the amplifier is calculated using the expression,
Gain -Bandwidth product=3-dB midband gain X Bandwidth
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OBSERVATIONS: ONE PAGE
Frequency response: Vi=20mV
FREQUENCY(Hz) OUTPUT GAIN IN dB Av=20log
VOLTAGE( V0) 10(V0/Vi)
WAVEFORM:
PRECAUTIONS:
1. The input voltage must be kept constant while taking frequency response.
2. Proper biasing voltages should be applied.
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RESULT:
The voltage gain and frequency response of the CC amplifier are obtained. Also gain
Bandwidth product is calculated.
VIVA QUESTIONS:
65
12. COMMON SOURCE FET AMPLIFIER
66
THEORY:
Normally, this P-N junction is reverse-biased (a DC voltage is applied to it) so that no current
flows between the channel and the gate. However, under some conditions there is a small current
through the junction during part of the input signal cycle. The FET has some advantages and some
disadvantages relative to the bipolar transistor. Field-effect transistors are preferred for weak-signal
work, for example in wireless, communications and broadcast receivers. They are also preferred in
circuits and systems requiring high impedance. The FET is not, in general, used for high-power
amplification, such as is required in large wireless communications and broadcast transmitters.
Field-effect transistors are fabricated onto silicon integrated circuit (IC) chips. A single IC can contain
many thousands of FETs, along with other components such as resistors, capacitors, and diodes.
PROCEDURE:
1. Connections are made as per the circuit diagram.
2. A signal of 1 KHz frequency and 50mV peak-to-peak is applied at the
Input of amplifier.
3. Output is taken at drain and gain is calculated by using the expression,
Av=V0/Vi
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4. Voltage gain in dB is calculated by using the expression,
Av=20log 10(V0/Vi)
5. Repeat the above steps for various input voltages.
6. Plot Av vs. Frequency
7. The Bandwidth of the amplifier is calculated from the graph using the
Expression,
Bandwidth BW=f2-f1
Where f1 is lower 3 dB frequency
f2 is upper 3 dB frequency
ONE PAGE
OBSERVATIONS:
MODEL GRAPH:
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PRECAUTIONS:
VIVA QUESTIONS
1. What is the difference between FET and BJT?
2. FET is unipolar or bipolar?
3. Draw the symbol of FET?
4. What are the applications of FET?
5. FET is voltage controlled or current controlled?
6. Draw the equivalent circuit of common source FET amplifier?
7. What is the voltage gain of the FET amplifier?
8. What is the input impedance of FET amplifier?
9. What is the output impedance of FET amplifier?
10. What are the FET parameters?
11. What are the FET applications?
69