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C7587900 MEMS麦克风 LMD4030T261-OA1 规格书 wj1184476

The document provides the specifications for the LMD4030T261-OA1 MEMS Microphone, detailing its electrical, mechanical, and timing characteristics, as well as application guidelines and packaging information. It emphasizes RoHS compliance and halogen-free materials, and includes reliability test procedures. The microphone is designed for high sensitivity and low power consumption, suitable for surface mounting and high-temperature reflow assembly.

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0% found this document useful (0 votes)
55 views12 pages

C7587900 MEMS麦克风 LMD4030T261-OA1 规格书 wj1184476

The document provides the specifications for the LMD4030T261-OA1 MEMS Microphone, detailing its electrical, mechanical, and timing characteristics, as well as application guidelines and packaging information. It emphasizes RoHS compliance and halogen-free materials, and includes reliability test procedures. The microphone is designed for high sensitivity and low power consumption, suitable for surface mounting and high-temperature reflow assembly.

Uploaded by

woaijiaohaer
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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LMD4030T261-OA1

Specification of MEMS Microphone

RoHS Compliance & Halogen Free

LinkMems P/N: LMD4030T261-OA1

Designed by Checked by Approved by

Kevin Thomas Hary

Customer Approval

Approved by:

LinkMems Acoustic Technology Co.,Ltd. NO :M054 Version :1.2


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LMD4030T261-OA1

Contents

1. Introduction.....................................................................................................................................................................................3

2. Electrical Characteristics..................................................................................................................................................... 3

3. Timing Characteristics......................................................................................................................................................... 5

4. Frequency Response Curve............................................................................................................................................ 5

5. Test Setup....................................................................................................................................................................................... 6

6. Measurement Circuit.............................................................................................................................................................. 6

7. Mechanical Characteristics............................................................................................................................................. 7

7.1. Weight...................................................................................................................................................................................... 7

7.2. Appearance Drawing.................................................................................................................................................... 7

8. Application....................................................................................................................................................................................... 8

8.1. Pickup Tool Pick Location & PCB Solder Pad Layout...................................................................... 8

8.2. Recommended Reflow Process Condition................................................................................................. 8

8.3. Storage Condition........................................................................................................................................................... 8

9. Packaging..................................................................................................................................................................................... 9

9.1. Tape & Reel Specification....................................................................................................................................... 9

9.2. Packaging Information............................................................................................................................................... 10

10. Reliability Test........................................................................................................................................................................... 11

LinkMems Acoustic Technology Co.,Ltd. NO :M054 Version :1.2


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LMD4030T261-OA1

MEMS Microphone
1. Introduction
The LMD4030T MEMS Microphones are integrated with specialized Pre-amplification ASIC

to provide high sensitivity, high SNR output from a capacitive audio sensor. It’s packaged for

surface mounting and high temperature reflow assembly. Data format is a single bit PDM.

2. Electrical Characteristics
Test Condition: VDD=1.8V, 23+/-2℃, 55+/-10%R.H., unless otherwise specified.
Electrical Characteristics
Note/Test Values
Parameter Symbol Unit
Condition Min. Typ. Max.
Power supply
VDD 1.62 1.8 3.6 V
voltage
Standard Mode
Test Condition: Measurement Clock Frequency 2.4 MHz, VDD = 1.8 V

Specification Symbol Test Conditions Min. Typ. Max. Unit

Directivity Omni-directional

Sensitivity Range S 94dB SPL @1kHz -27 -26 -25 dB

Current
I 750 μA
Consumption

94dB SPL @1kHz


S/N Ratio SNR A-Weighted
58 dB(A)

Total Harmonic
THD 94dB SPL @1kHz 0.5 %
Distortion

Acoustic Overload
AOP 10% THD @1kHz 120 dBSPL
Point

100mVpp Square
Power Supply
PSR wave@217Hz, -90 dB
Rejection A-weighted

LinkMems Acoustic Technology Co.,Ltd. NO :M054 Version :1.2


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LMD4030T261-OA1
Low Power Mode
Test Condition: Measurement Clock Frequency 768 kHz, VDD = 1.8 V
Specification Symbol Test Conditions Min. Typ. Max. Unit

Directivity Omni-directional

Sensitivity Range S 94dB SPL @1kHz -27 -26 -25 dB

Current
I 320 μA
Consumption

94dB SPL @1kHz


S/N Ratio SNR A-Weighted
57 dB(A)

Total Harmonic
THD 94dB SPL @1kHz 0.5 %
Distortion

Acoustic Overload
AOP 10% THD @1kHz 120 dBSPL
Point

100mVpp Square
Power Supply
PSR wave@217Hz, -90 dB
Rejection A-weighted

Operation Ratings
Note/Test Vales
Parameter Symbol Unit
Condition Min Typ. Max
Power supply voltage VDD 1.62 3.6 V
Sleep Mode 0 50 kHz
Frequency
Range
Low Power Mode 150 768 900 kHz

Standard Mode 1000 4800 kHz


Duty Cycle DC 45 50 55 %
Logic Input High 0.65*VDD VDD+0.3 V
Logic Input Low -0.3 0.35*VDD V
Logic Output High VDD -0.45 V
Logic Output Low 0.45 V
Load Capacitance 140 pF

LinkMems Acoustic Technology Co.,Ltd. NO :M054 Version :1.2


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LMD4030T261-OA1

3. Timing Characteristics

Vales
Parameter Symbol Unit Comments
Min Typ. Max
Clock Rising Time TR 15 ns
Clock Falling Time TF 15 ns RL=1MΩ
DATA in to Hi Z Time TDZ 0 20 ns CL=12pF
DATA Valid Time TDV 24 36 48 ns
Period jitter
Clock Jitter 0.5 ns
in RMS
Clock Duty Cycle 45 50 55 % %
Clock Frequency 150 2400 4800 kHz

4. Frequency Response Curve

LinkMems Acoustic Technology Co.,Ltd. NO :M054 Version :1.2


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LMD4030T261-OA1

5. Test Setup (Sensitivity Test in Anechoic Room)

6. Measurement Circuit

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LMD4030T261-OA1
7. Mechanical Characteristics
7.1 Weight: Less than 0.03g
7.2 Appearance Drawing (unit: mm)

Item Dimension Tolerance(+/-) Units


Length(L) 4.00 0.10 mm
Width(W) 3.00 0.10 mm
Height(H) 1.05 0.10 mm
Acoustic Port(AP) Ø0.65 0.05 mm

Pin # Pin Name Type Description


1 CLK Clock Clock Input
2 DATA Signal Output Signal
3 VDD Power Power Supply
4 L/R L/R Channel Channel Select
5 GND Ground Ground
6 GND Ground Ground
7 GND Ground Ground
8 GND Ground Ground

Notes:
All dimensions are in millimeter (mm).
Tolerance±0.1mm unless otherwise specified.

LinkMems Acoustic Technology Co.,Ltd. NO :M054 Version :1.2


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LMD4030T261-OA1
8. Application
8.1 Pickup Tool Pick Location& PCB Solder Pad Layout

Recommended Pickup Location Recommended Solder Pad Layout

8.2 Recommended Reflow Process Condition


Recommend reflow profile, solder reflow <=260℃ (for 30s Max of peak temperature).

Important Notes
In order to minimize device damage:
1. Do not wash or clean the boards after the reflow process.
2. Do not apply the airflow which pressure over 0.3MPa blow into the port hole within a
distance of less than 5 cm.
3. Do not exposed to ultrasonic processing or cleaning.
4. Do not pull a vacuum over port hole of the microphone.
8.3 Storage Condition
8.3.1 Storage temperature range:-40~+100℃,and humidity is less than 75%.
8.3.2 Operating temperature range:-40~+85℃.
8.3.3 MSL (moisture sensitivity Level) is Class 1.

LinkMems Acoustic Technology Co.,Ltd. NO :M054 Version :1.2


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LMD4030T261-OA1
9. Packaging
9.1 Tape &Reel Specification

Notes:
All dimensions are in millimeter (mm).

LinkMems Acoustic Technology Co.,Ltd. NO :M054 Version :1.2


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LMD4030T261-OA1
9.2 Packaging Information

Packaging Quantity:
1 Reel=5000pcs

1 Outer Carton=50000pcs

LinkMems Acoustic Technology Co.,Ltd. NO :M054 Version :1.2


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LMD4030T261-OA1
10. Reliability Test
The samples should be placed in the room with 23+/-2℃, 55+/-10%R.H. for 2 hours at least
before final measurement, unless otherwise specified.

Item Detail Standard

Simulated
Samples for qualification testing require 3 times 260±5℃
Reflow
reflow solder profiles. 2 hours of setting time is required ±3 dB
(Without
between each reflow profile test.
Solder)

Static Precondition at +25℃ for 1 hour. Then expose to +85℃


±3 dB
Humidity with 85% relative humidity for 240 hours.

Each cycle shall consist of 30 minutes at -40℃, 30 minutes


Temperature
at +125℃ with 5 minutes transition time. Test duration is for ±3 dB
Shock
30 cycles, starting from cold to hot temperature.
According to MIL-STD-883G, Method 3015.7 for Human
Body Model.
ESD Discharge Position: I/O pins ±3 dB
Sensitivity Charge Voltage: ±3000V
Discharge Network: 100pF & 1500Ω
Vibrate randomly along three perpendicular directions for 30
Random
minutes in each direction, 4 cycles from 20Hz~2000Hz with ±3 dB
Vibrations
a peak acceleration 20g.

Mechanical Subject samples to half sine shock pulses (3000g±15% for


±3 dB
Shock 0.3ms) in each direction, totally 18 shocks.

High
Microphone unit must maintain sensitivity after storage at
temperature ±3 dB
+105℃ for 240 hours.
Storage

Low
Microphone unit must maintain sensitivity after storage at
temperature ±3 dB
–40℃ for 240 hours.
Storage

The test was repeated in six directions for 3 times, Dropped


Drop Test from 1.5m height on to a steel surface, total 18 times and ±3 dB
inspected for mechanical damage.

LinkMems Acoustic Technology Co.,Ltd. NO :M054 Version :1.2


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LMD4030T261-OA1

Specification Revisions

Revision Description Approved Date

1.2 New Version Released Hary 17/05/2024

LinkMems Acoustic Technology Co.,Ltd. NO :M054 Version :1.2


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