Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
Contents
Introducing the GEM Topaz-X ... 0.2.0 c eee ved
General Specifications ....... bev eetteeeee ners 5
Features, Accessories and Options .......-..00e.. 02-10
BAL Features 0... 00eeeeeeeeeeeeeeeeeeeeeeese ee 10
3.2 Accessories and Options . 13,
Mounting Heads Configuration 17
Alignment ......
5.1 Line Array Camera Alignment .
5.2. Single Area CCD Alignment...
5.3. Fiducial Alignment . .
5.4 Master, Bad Mark Sensing .
Board Handling
Component Handling ..
TL Tape Feeding ......- 0000-00000
7.2 Double Shuttle Tray reder (PA. 2699/22)
7.3. ATS 20 Tray Feeder portrait (PA 2696/21)
74 Double ATS 20 Tray Feeder portrait (PA 2696/22)
7.5. ATS 20 Tray Feeder landscape (PA 2696/23)
7.6 Mountable Components & Required Nozzles
GEM Topaz-X oo... cece cvees reece vee Al
| of44Contents
2of 4Introducing
the GEM
Topaz-X
Figure 1
Ineroducing the GEM Topaz-X
"The Topaz-X, part of the GemLine (Modular High Speed Production Machines), is
the newest addition to the top-of-the-line Philips’ SMD pick & place machines. The
‘Topaz-X is a High Speed flexible machine that can handle a wide range of
components at speeds up t0 18,000 SMDs per hour. The machine is built around a
very rigid, vibration-frce frame for improved accuracy and long-term stability and is
perfectly suitable for round-the-clock production,
1850mm
The GEM Topaz-X features a high precision single placement beam carrying 4
Flying Nozzle Change heads (each equipped with 3 nozzles) and 4 standard heads
with exchangeable nozzles. The placement beam moves in X/Y and Z direction,
while the board and component feeders are stationary. A flexible board transport
system enables the Topaz-X to handle virtually any type of PCB, with or without
tooling pins. Board conveyor width is automatically adjustable, allowing board
dimensions up to 460 x 440mm (17.9" x 17.2") to be handled.
The newly designed vision system with Line Array camera allows fast and accurate
“on-the-fly” alignment of a wide range of components fom 0201 up co 32mm
square PLCC, including 32mm square QFPs with lead pitches down to 0.5mm (20
mil). Dark background BGAs, #BGAs and CSPs with ball pitches down to 0.75mm
(31 mil) and ball diameters down to 0.3mm (12 mil) can be recognized with the use
of a new developed illumination unit which allows measurement of ball positions
and dimensions.
3 of 44Ineroducing che GEM Topaz-X
‘An optional single area CCD camera extends the component range to 32mm square
ICs with lead pitches down to 0.4mm (16 mil). The vision system deteets missing,
bent or irregular spaced leads or BGA balls; faulty components are rejected.
A separate camera system monitors fiducial marks at the board, circuit and
component level, using a combination of white-light and IR LEDs with multi-angle
diffusers to provide optimal illumination.
Just five nozzle shapes are required to cover the specified SMD range. High output
levels are therefore achieved, as the need for nozzle exchanges is minimal. An
optional 18 position nozzle exchange station enables additional special nozzles to be
accommodated
Up to 90 tape feeders can be loaded on the GEM Topaz-X. ‘The machine supports
tape, stick, bulk and tray feeders.
‘The tape feeder design for the GEM Topaz-X allows simultancous picking from any
mix of tape feeders ranging from 8 to 44mm,
‘An industrial PC controller, running Philips well proven and user-friendly software,
allows the GEM Topar-X to be used stand-alone or in-line. The controller includes a
Management Information System (MIS) that continuously gathers production data
for management feedback. The unique bad mark sensing capabilities allow a multi-
circuit panel to be run as one large board, thus maximizing placement speed while
still using bad mark information. A laser-based verification system, which guarantees
correct feeder latching, is standard.
‘The GEM Topaz-X is fully compatible with the Sapphire, Topaz, Emerald and
Emerald-X, which use the same feeders, feederbars, software and controller.
A basic program optimization function is also included in the machine as standard.
For more advanced machine optimization and/or line balancing, the new Production
Preparation System for GemLine allows you to create and optimize SMD machine
programs on a PC instead of using the SMD machine. This reduces line change-over
time and prevents errors
4of442.0 General
Specifications
Tact tne
‘Optimal placement rate
‘Nominal placement rate
‘0.20sec/chip with line array camera
{0.45 see/SO with line array camera
14 secIQFP with line array camera
3,7 secIQFP with area CCD camera
18,000 ph
12,000 - 14,000 «ph
‘General Specifications
REMARKS
‘Simultaneous pick with 8 heads
‘Simultaneous pick with 4 heads
‘Sequential pick with 4 heads
in fine mode with | head
‘Simultaneous pick with & heads
‘Applicable components
Mounting accuracy:
&y) 36
Mounting accuracy:
@30
Mounting angle
Mounting repeatabiley
30
Number of heads
‘Alignment system:
0201 - SOP, SO}, PLE Samm CAT 26
‘6mm - QFP 32mm fl (1.26") with pin pitch down to 0.5mm
(20 mi)
Dark background BGA, y8GA, CSP with regular pitches;
‘6mm = 32mm: Min. ball pitch down to 0.75mm (3Imil, Min
ball diameter down to 0.3mm (12m)
“mm = OFP 32mm Fi (1-26") with pin pitch down to O-mm
(16 mi)
Dark background BGA, yBGA,CSP with regular pitches:
‘mm ~ 32mm: Min. ball pitch down to 0.75mm (3Imil, Min
ball diameter down to 0.3mm (I2mil)
£75u for chips and SOIC
+ 604 for QFPs (6mm - 32mm fl 1.26") with pin pitch down to
{0.5mm (20 mil)
+353 for OFPs (6mm = 52mm fA 126") with pin pltch down to
mm (16 mil)
For Chips and SOIC ths s Lead dependent
+£0.° for QFPs (6mm ~ 32mm GZ |.26") with pin pitch down to
0.5mm (20 mil)
+ 0.09" for QFPs (Bmm = 32mm (2 1.2) with pin piech down
10 0-4 (18 mil)
‘0 up to 360 (programmable in steps of 001)
, ¥ 30 for OFPs (Gm - 32mm (126°) pitch 04 Phi (009°)
‘One single beam with 4 Flying Nozzle change heads and 4
standard heads
‘One line aray camera with fore and side llumination system for
Vision on the Fly using the VICS 2500 processing system
‘Area CCD camera for QFP 32mm (i (1.26) with pin pitch
down t© 0.4mm (16 mil)
Moving CCD camera for Fiducil alignment
Tine array camera system
‘Optional 32mm area CCD
camera system with fore and
side illumination unit
Line array camera system
{all placement heads and al
placement angles)
‘Optional area CCD camera
system (in fine mode)
Line array camera system
{all placement heads and al
placement angles)
‘Optional area CCD eamera
system (in fine mode)
“The Standard heads can
exchange nozzles withthe use of
the optional Nozzle Exchange
Station
Standard, second line array
camera is optional
‘Optional
Seandard
Sof 44‘General Specifications
REMARKS,
Type of nozzles: Type TIF (on FNC head) ‘Standard willbe delivered
‘Type 72F (on FNC head) 4x nozzle 7IF, 4x nozzle 72F,
‘Type 73F (on FNC head) 4x nozzle 73F, 4x nozzle 72A
Type TIA
Type 72A
Type A,
Type 744,
Type 76A (Melf nozzle)
Nozale exchange station: | 18 nozzle positions ‘Optional (No nozzles included)
Nozzle station can hold:
4X TIAAX TIAA TAA,
4 76 and 2 special nozzles
Nozzle 73A does not fit in the
nozzle station
Component weight | Max 10 gr With the use of nozzle type 740
‘Component height: Max: 40mm Max: 65mm depending on
mount sequence. Placing of parts
with a height of 6.5mm ~ 10mm
is possible if certain conditions
are met.
‘Component mounting | Chip: 0Smm or more
inerdistance: SOP: 0.7mm or more
Placement system: Pheuratic oF servo contrelled for component height compen:
Placement force: 24 gramimm (for nozzles with bulfer this value is diferent) | Pre-tension i 200 gr. (spring
loaded)
Number of feeders Tapefeeders
‘inm: 90 positions
(Tamm: 43 postions ——=SCS~“~*~*~“~*~*~*~*~‘“~“S*s~“~—*SSSSSSSSS*S
[Témm:43 postions ——~=~*~*~“‘*‘“*~“‘“‘“*~*~‘“‘<“<~*;CS*‘“‘~“CSCSCSCSCStSS*S
24mm: 28 positions
(Hamm: postions ——SCS~“~S~“—s*S*S*S*S*S~S~S~—~—~SsSsSSSSSSSSSS
[Hmm2I postions ———=S~*~“~*~“—~*S*S*S*S*~—~—sSsSsSSSSSSS*Sd
Stick feeders: Depends on stick dimensions
6 of44‘General Specifications
REMARKS
Component packaging: | Tape according to IECIEIA JJEDEC: 8-44mm Tape reel diameter max: 380mm
For larger tape feeders such os Sémm, 72mm please contact your | (I5")
local sales representative
Manual Tray feeder: Max way size Is Board width dependent’ | Optional: Manual tray feeder
Max era size: 330mm x 300mm (12.8" x 11.7") (Max. number of feeders 65,
Max tray size by max board width of 440mm (I7.2"): 330mm x | Head number 8 can't pick
175mm (12.8" x 68°) components in an area of [4mm
Min tray size SOmm x SOmm (2.0" x 2.0 fom the right side of the MTF
ATS 20 Tray Feeder portrait: Max. tray size: 220mm x 350mm | Optional (factory bull in: ATS |
@s"x 137) 20 Tray Feeder portrait (Max.
Min tray size SOmm x SOmm (2.0" x 2.0") board wideh 250mm (9.8"), max.
number of 8mm feeders 3 x 20,
amount of pallets 20 with
2.5mm piteh)
Double ATS 20 Tray Feeder portrait: ‘Optional (factory Bult i)
Max. tray size: 220mm x 350mm (86° x 13.7" Double ATS 20 Tray Feeder
Min tray size 50mm x 50mm (2.0" x 2.0") portrait (Max. board width
250mm (9.8"), max. number of
‘8mm feeders 2 x 20, amount of
pallets 2x 20 with 25mm pitch,
atthe left ATS 20 components
can't be picked by all heads in an
area of 36mm from the left side
of the ATS 20)
‘ATS 20 Tray Feeder landscape ‘Optional (actory bul inj: ATS 20
Max. tray size: 350mm x 220mm (13.7" x 86 ‘Tray Feeder landscape (Max, board
Min tray size 50mm x SOmm (2.0" x 2.0") width 380men (15.0°), max.
umber of feeders 2x 20+ 16,
amount of pallets 20 with 125mm
piech, atthe right side of ATS
‘components can be picked by all
heads in an area of 18:2mm)
Double shuttle LCS Tray Feeder: ‘Optional: Double shuttle LCS
Max. tray size: 350mm x 440mm (13.7" x 17.2") ‘Tray Feeder (no restrictions)
Min tray size SOmm x SOmm (2.0" x 2.0") Max: 120 Jedec trays
Stick and bulk Many solutions possible
Maximum height pre- | 40mm on placement side (0.16")
mounted components: _| I8mm on non placement side (0.7")
PCB Dimensions (xy): | Min: SOmm x SOmm (2.0" x 2.0°)
Max: 460 x 440mm (18" x 17.2") Using PCB pin uation or edge
Special applications upon request ctarmping system.
PCB Weight Max. 12 Ke Without components
Max. 2.0 Ke With components
PCB Thickness Min: 0-4ram (0.015
Max: 4.0mm (0.15")
Special opplicaions upon request
7 of 44'Non-mountable area
PCB Material
PCB Positioning:
Board top side
3mm (0.12") from rear side board edge
mm from front side board edge
|"Amam (0.16") around reference holes (locate pins) Flat edge of 30mm (2) |
Board bottom side
Smm from front and rear side board edge (0.2")
PhenoliciFR4/Composite Materials
Locate pin fivation
Z servo controlled push up system
Push up pins
Edge clamping
Sub stop (PCB waiting buffer)
Exit stop
‘General Specifications
‘Component height restrictions
apply in the 10mm (0.40") area
from front side edge depending
‘on board thickness
Fiat edge of 30mm (12)
required on bottom right corner
for the use of the main stopper,
sub and exie stopper
For ceramic PCBs (optional) the
rnon-mountable area may be di
ferent
‘Ceramic PCBs require special
‘conveyor sections (optional)
‘Adjustable second pin
Sofeware controlled by PCB
thickness
‘Adjustable positions
‘With adjustable push in
‘Adjustable position
Fixed position
PCB Transport height:
300mm + 1Oram 54" OA")
[SMEMA 953mm # 125mm Q75°205) ——~S~SStandard ——SSSSS~*&
‘Standard
‘Seandard
PCB Transport direction:
PCB Transport width
PCB Loading ie:
PCE Ratio widthength
‘Control system
Left to Righe
‘Automatic
‘Approximately 3 se
Max 13
MCX controller 486-100
40 Mb flash disk
[44 Mb floppy drive 3.5"
[RS232Seralinerace==S=S*~*~“‘*‘“‘*“‘“‘“‘~*~*SS*S*S*C‘“
VIOS
MIS data gathering
Data teaching
Data tracing
‘Component database
Mark database
'SMEMA electrical interfacs
‘On line calibration
‘On ne help functions
Feeder lock verifier
Lengch: 1450mm (54)
Height: 1850mm (6.1 )
‘Width: 1408mm (4.5 ®)
‘Weight: 1570 kg (3460 Lbs)
EN 292, EN 294, EN 349, EN 614, EN 1050, EN $5011, EN
'50082-1, EN 60204-1
Electrical safety according IEC 204
‘White: Emergency stop, safety cover interlock
Blue: Pick up error, out of components,
Green: in automatic operation
‘General Specifications
REMARKS
Max. 2560 components per PCB
"3000 Component packages; user
sn define and teach vision files
300 Mark shapes
Width including feeders i=
224mm (7.36 f)
CE-safety is part of system
design, Safety measurements are
tested on each product in the
factory.
Electric power:
Air supply:
‘Operating temperature
Humidity
Noise:
Voltage AC: 200/208/230/240/380/400/416 V + 10%, 3 Phase
Frequency: 50/60 Hz
‘Consumption: 4 KVA max
Pressure: > 5.5.10 Pa (5.5 bar, 80 PSI)
‘Quality: dust and oil free
‘Consumption: 350 Nimin
15:35" C (69"- 95°F)
20-90% (no dew)
< 7adBa
More than 25mm? cables are
needed
Specification guaranteed: 20°
28" C (68" - 82° F)
Table 1
9 0f 443.0
3
Features,
Accessories
and Options
Features ‘The standard GI
Features, Accessories and Options
IM Topaz-X includes the following features:
(On the fly alignment using a vision system with a Line Array camera standard
equipped with a side illumination unit for BGAs, hBGA, CSP components
Placement beam with 4 Flying Nozzle Change heads (cach head standard
equipped with 3 nozzles) and 4 standard heads
Simultaneous picking is possible by all 8 heads fom any mix of tape feeders
(except for 0201 components). This allows a much higher nominal placement
rate and board throughput.
‘Complete component range can be handled with only 5 nozzles shapes.
Fiducial alignment camera with improved software controlled illumination unit
(white + IR’ Leds), that also can be used as teaching/tracing device and for Bad
Mark sensing.
Automatic width adjustment. The PCB dimension is included in your PCB data.
PCB pin-positioning. Second pin is easily adjustable for fast changeover.
PCB edge clamping system, for PCBs without tooling holes.
PCB push up plate (Z. servo controlled) with 12 push up pins, for PCB support
thickness is included in the PCB daca
Substopper, allowing a second PCB to enter the machine for reducing transport
time.
Exit Substopper, allowing a new PCB to enter the work area of the machine while
the downstream machine is still not ready to accept a new PCB.
Feeder lock verification system to avoid damage to the machine due to incorrectly
latched feeders
3.5" FDD for backup purposes.
Component dump box.
Operator manual, available in different languages
User manual
Service manual.
‘Two empty tape bins
Toolset.
10 of 44Features, Accessories and Options
+ First aid spare parts kit.
+ CE safety.
+ ESD safery
+ Electrical and Mechanical SMEMA.
Standard Software Features:
+ Variable XY axis speed per component (neu).
+ Datum angle functionality (especially for stick components, there is no pick angle
necessary to recognize the component which results in higher output). (new)
* User Friendly Human interface VIOS (Visual-Integrated-Operating, System).
+ An Online help funetion allows display of detailed descriptions of operations
and functions on screen.
+ Management Information System (MIS) to gather production history data.
* 4 point fiducial correction, to maintain accuracy for stretched/distorted boards.
+ Template (pattern) matching for PCBs that have no fiducials,
+ Different mark shapes for fiducial pair possible.
* Box teaching to recover fiducial recognition error.
+ Data editing functions with the use of the fiducial camera (teaching, tracing).
+ A Component database, that can hold up to 3000 component packages, with the
most frequently used components already predefined.
+ A Mark database, that can hold up to 300 mark shapes, with the most frequently
used mark shapes already predefined.
+ Precede pick-up, allowing to pick up components before the PCB is fixed,
reducing cycle time.
+ Alternative feeder function, reducing operator intervention (empty feeder
switching),
+ Automatic program change over for family boards (self production contol).
+ Automatic rework cycle to improve operator efficiency and on-line optimization,
to keep mounting speed during production in case of empty feeders. Detected
empty feeders are automatically skipped until end off programs, to allow one time
replenishment.
* Product preparation can be done on the machine including basic optimization of
the mount program. (nozzle and feeder set-up)
1 of 44Features, Accessories and Options
+ Multi-section PCBs can be either be mounted block-by-block or the block daca
can be combined to achieve the fastest mounting sequence. In the latter ease,
block badmatks still remain in effect
3.2 Accessories
snd Opn
PA 1912/00) CSMIGEM Glass Adjustment Kit
PA 2695/12 ‘Manual Tray Feeder Topaz-X/Emerald-X
PA 2696/21 ‘ATS 20 Tray Feeder portrait for GEM
PA 2696/22 Double ATS 20 Tray Feeder portrait for GEM
PA 2696/23 ATS 20 Tray Feeder landscape for GEM
PA 269922 Double shuttle Tray Feeder (LCS) for Topar-X/Emerald-X
PA 2903/20 Timm Tape Feeder, 15 inch reelholder FVIGEM
PA 2903/25 llgmm Tape Feeder, 15 inch reelholder FV/GEM PSA
PA 2903/30 24mm Tape Feeder, 15 inch reelholder FV/GEM
PA 2903/35 ‘2amnm Tape Feeder, 15 inch reelholder FVIGEM PSA
PA 2903/40 32mm Tape Feeder, 15 inch reelholder FV/GEM
PA 2903/45 32mm Tape Feeder, 15 inch reelholder FVIGEM PSA
PA 2903/50 ‘44mom Tape Feeder, 15 inch reeiholder FV/GEM
PA 2903/55 ‘44mm Tape Feeder, 15 inch reelholder FVIGEM PSA
PA 2903/73 ‘8mm Tape Feeder for 0201, 2mm pitch, 7 inch reelholder FV
GEM (PSA)
PA 2903/74 ‘8mm Tape Feeder, 2mm pitch, 7 inch reelholder FVIGEM (PSA)
PA 2903/75 ‘Sm Tape Feeder, 4mm pitch, 7 inch reelholder FVIGEM (PSA)
PA 2903/76 ‘8mm Tape Feeder, 4mm pitch, 15 inch reelholder FVIGEM
(PSA)
PA 2903/85 2mm Tape Feeder, 7 inch reelholder FVIGEM PSA
PA 2903/86 mm Tape Feeder, 15 inch reelholder FVIGEM PSA
PA 2906/10 Reject conveyor for Topaz-X and Emerald:
PA 2923/00 Set of 20 dummy feeders
PA 2962/41 Nozzle Type 71A (0201-0420/0603-1005)
PA 2962/42 Nozzle Type 72A (0603-1206/1608-3216)
PA 2962/43 Nozzle Type 73A (1812-SOPI4532-SOP)
PA 2962/44 Nozzle Type 74A (Middle size QFP)
Inota433
Table 2
Machine
configuration
examples
Features, Accessories and Options
PA 2962/46 Nozzle Type 76A Cylindrical chip (MELF)
PA 2963/16 Nozzle Exchange System Topaz-X (18 position no nozzles
included)
PA 2969/51 Second Line Array camera for Topa-X
PA 2969/53 Second Line Array camera in combination with ATS (factory
bull in only)
PA 2969/91 ‘Area CCD camera 32mm (including fore and side ilunination
unit) for Topaz-X
PA 2981/15 Pallet for LCS Tray Feeder FVIGEM (PA 2699/22)
PA 2981/35 Pallet for PA 2696/21 and PA 2696/22 (ATS 20 portrait)
PA 2981/36 Pallet for PA 2696/23 (ATS 20 landscape)
On the following pages you can find some machine configuration examples for the
Topar-X.
Remark: In the examples the dotted line pictures indicate the physical position of the
second line array camera, area CCD camera and nozzle exchange station. These can be
ardered as an option.
1, Second line array camera
2, Area CCD camera Topaz-X.
3, Nozzle exchange station for Topaz-X.
13 of 44Features, Accessories and Options
Example |: Topaz-X
— Pa 01201 pax
ms 12098 scandy ease
+
veteu
rh
“|
Ci
Example 2: Topaz-X with double shuttle LCS
spi PA 269912. Double shat LCS
—— PA 296314. Nose Exchange Sytem Topas X
(18 pstionsino none neue)
resmucle PA 2968191. Area CCD camer 32m Gluing lihting un for Top
Figure 2 Machine configuration examples I to 5 (sce alo next pages)
M4 of 44Features, Accessories and Options
Example 3: Topaz-X with ATS-20 portrait
zee] tty
som
Li Ld
fam
A 1201 Topaex
A 2696721 ATS-20 tray feederporrat
A 2963/16 Nowale Ehange System ToparX (18 poionine nous included)
#4 2969153 Second be aay carers ni facory baler)
42969931 Area CCD camera 32mm (lung ihn un or Tapa
Example 4: Topaz-X with double ATS-20 portrait
#4 269622 Dovble ATS-20 ty feeder portrait
A 2963/16: Norse Exchange Sytem ToparX IB postonsno nemies need)
A 2969153 Second ie array camera (on factory butt)
A 2969191 Area CCD camera Sim Gling iping uke) for Topas X
15 of 44Example 5:
Features, Accessories and Options
Topaz-X with ATS-20 landscape
L PA 1312001 Topaz-x
Le a 26903 £15209 er oi
t
6 of 444.0
Mounting
Heads
Configuration
Figure 3
Mounting Heads Configuration
‘The GEM Topaz-X features a high precision single placement beam carrying 4
Flying Nozzle Change heads (each equipped with 3 nozzles) and 4 standard heads
with exchangeable nozzles and a separate camera system that monitors fiducial
marks at the board, circuit and component level, using white + IR light LEDs and
multi-angle diffusers to provide optimal illumination. High placement rates are
achieved by simultancous component picking which reduces head beam travel and
thus shortens the mounting cycle.
Configuration of head section
The high-precision dual Y drive Topaz-X features four-axis (X.Y,Z,R) servo control
for accurate, stress-free component mounting. Direct drive, brushless AC motors
controlling heavy duty lead screws allow optimal accuracy and high reliability.
17 of 44Table 3
Number of axis:
Axis configuration:
|Z axis sequence:
R axis sequence:
Mounting Heads Configuration
X axis AC servo
Double Y axis AC servo
Z.Raxis AC servo
W (aucomatie width) axis AC servo
Push up plate AC servo
Air and AC servo motor
AC servo motor
Pick-up error detection:
Mounting angle:
‘Vacuum check (256 level digital setng)
0° - 360° (0.01° step)
‘Number of mounting head!
Nozzle types:
Encoder resolution:
B inline mult head
5 diferene shapes
XY = 0.00122mmipulse
Phi= 0.0146" /pulse
Z= 0,00048mmipulse
Speed:
Acceleration:
X= 1500mmisec
Y= 1500mmisee
X = 36600mmisec?
Y= 27000mmisec?
IB of 44Mounting Heads Configuration
Figure 4 Head section detail
19 of 445.0 Alignment
5.1 Line Array
Camera
Alignment
Figure 5
‘Alipument
‘The high speed of the GEM Topaz-X is achieved by fast on-the-fly component
alignment using a revolutionary Line Array camera system, equipped with a newly
developed multi angle illumination unit, that is four times faster than conventional
systems, For ultimate speed, the machine can be equipped wich a second Line Array
camera which reduces head beam travel and thus shortens the mounting cycle.
encoder
i motor
,
head
€_» spindle
¥
4— components
camera
a monitor
Line sensor vision principle.
‘While moving the beam over the camera, the encoder triggers the camera to caprure
consecutive lines of pixels. All these lines form the total picture of the components
‘This picture is processed by a sophisticated vision system. The vision system
algorithms inspect the components and calculate position and orientation of the
components on the heads.
‘The SMD components are illuminated by a new developed multi angle side
illumination unit which allows high speed recognition of CSPs, uBGAs. The leads
of the components are imaged on the line sensor.
20 0f 44Table 4
Alignment
cations
Line Array camera: CCD 2048 x 1 piel
Max, component size 3mm (126°)
in, components 201
in, ea pitch Oram 0 mip
Min. lead widch: 0.2mm (0.008")
Grey sale: 256 levels
Lighting Mut angle Forelside ilmination
Light ncensiyssofeware controled foreach
component separately
Recognition Reflection Pattern recognition on al leads
Max. number of lead sides
Max. number of lead groups
‘Cheek on:
4
2 per side
Leadbal pitch
eadiball location
Bent/missing leadsibals
Total number of leads/balls
‘Cumulative lead/bal pitch
2I of 44Alignment
5.2 Single Area An optional single area CCD camera extends the component range for the GEM
cb “Topar-X.
Alignment
‘Component illumination is performed by means of fore/teflecive lighting and side
illumination. The lighting source reflects the lead of QF and the balls of BGA
components on the CCD camera. The single area CCD camera grabs the image of
the component in one frame and presents it to the vision system for recognition and
measurements purposes
Figure 6 GEM Topaz-X working area
of 44Table 5
Alignment
JArea CCD Camera!
CCD 512 x 480 pixels
Max. component size: 32mm (126°)
Min, component size mm 2 (0.24")
Min, lead piteh (4mm (16 mi)
Min, lead wide: (0.2mm (0.008")
Grey scale: 256 levels
Lighting Forelside lighting illumination
Recognition: Reflection, Pattern recognition on al leads
Max, number of lead sides
Max. number of lead groups
(Check on:
a
2 per side
Leadiball pitch
Leadball location
‘Bene/missng leadsibals
‘Total number of leads/balls
‘Cumulative leadbal pitch
23 of 44Alignment
5.3 Fiducial “The GEM 'Topaz-x is standard equipped with a fiducial camera. ‘This camera is used
Alignment to compensate for variations in the position of the cireuit pattern relative to the
expected position. ‘The fiducial alignment system is an opto-electronic system which
performs geometric measurements of fiducial marks on the PCB in order to calculate
the deviations from their expected positions. The system can use two or four
fiducials per board. Fach sub-circuit can also be aligned using two fiducials. For
placement of fine-pitch components two local fiducials per component may be used.
‘The individual shapes of a fiducial pair ean be different to allow for maximum
application flexibility. Also pattern recognition algorithms can be used on traces or
pads on the PCB board for cases where fiducials are not available.
‘The fiducial camera can also be used as a high accurate teaching device for PCB data
GE CAD data is not available), automatic calibration and inspection purposes.
Fiducial camera ccD
Fiducial eamera functionality Fiducial detection, Bad Mark detection,
teaching device (2 or 4 point teaching)
Fiducial Mumination ‘White + IR LEDs in conjunction with a mule
angle illumination
‘Compensation for Translation
(with cwo fiducial) Rotation
Linear stretch and shrink
‘Compensation for: Non-linear stretch and shrink
(with 3 or 4 fducials)
“Type of compensation: PCB, Biock, Local
Fiducial size: Max. 3.0mm (0.12)
Min, 0.8mm (0.03")
Fiducial material ‘Copper
Gold
Leadstin
Fiducial clearance area 2x Fiducial size
PCB warpage at fiducial Max. 0.5mm (0.027)
Pattern offset Max. Imm (0.04")
‘Number of diferent Fiducial pairs per PCB: | 128
Number of fiducial shapes in Mark Database: | 300
Examples of fiducial: Solid cirele (preferred)
Square
Triangle
Donut
Binary cross
Bow-tie (connected)
Template matching (art work)
Fiducial definition ‘According CAD data
Table 6
24 of 44Figure 7
Figure 8
Figure 9
Alignment
Fiducial fee space.
@O/a\+\0\O "| m/#
Examples of fiducial.
Examples of PCB, block and local fiducials
25 of 445.4 Master,
Bad Mark
Sensing
Alignment
IF the PCB contains subcircuits, one or more of these subcircuits can be skipped for
placement by giving them a “Bad Mark” on a designated position on the subcircuit. No
parts will be placed on a circuie that has a Bad Mark. Bad Mark sensing, with the use of
the fiducial camera, is based on recognition of a difference in contrast in a certain
area. This area can be defined in the machine software (position and area-
dimensions). This gives maximum freedom in choosing the process or technique to
add Bad Marks, for example:
*+ white or light colored labels of any dimension,
+ white paint,
cor any other material that can be fixed as long as it contrasts with the PCB surface.
Before checking the Bad Marks on all circuits, the Master Mark may be checked
first. Presence of a Master Mark means that one or more Bad Marks are present on
the circuits. This allows the machine to skip the Bad Mark sensing process for all
circuits if no Bad Marks are located on the circuits, therefore saving valuable
production time.
26 of 44Board Handling
6.0 Board PCB boards can be located in the machine by cither tooling pins or edge clamping if
Handling tooling holes are not available. With pin location, one location pin is fixed on the
machine while the other locate pin is easily adjustable when the board length
changes. Change over to a different board size is just a matter of seconds by using the
automatic adjustment (servo controlled) of the conveyor width and the PCB
thickness.
Figure 10 Pin fixation system
PCB support plate PCB
— Spring loaded pin
Conveyor. Pin shat
frame
Magnes—>
Figure 1 Push up system.
27 of 44Figure 12
Board Handling
“The Edge Clamping system is as easy to adjust as che locate pin fixation. Both these
systems use Push-up pins to support the PCB.
GEM Topaz-X Edge Clamping stem.
A sub-stop enables an additional PCB to enter the machine while the current board
is being populated. This reduces time loss during transport and is very useful when
‘operating the machine in a flowline. An exit sub-stop, which can be seen as a
transport buffer function, links the entrance sub-stop and main stopper, shortening
the PCB transport time and reducing loss from inefficient operation.
‘When using the machine ina flowline, ic communicates with the unit upstream and
downstream over a SMEMA-connection.
28 of 44Table 7
IPCB Dimensions (xy)
Board Handling
ations
Min, 50mm x SOmm (2.0" x 2.0°)
Max. 460mm x 440mm (18" x 17.2) using PCB
pin fixation or PCB edge clamping systern
PCB Thickness
Min, 0mm (0.0157)
Max. 4.0mm (0.15")
Reference hole position:
Reference hole diameter:
[@ 2Omm-@ 4.0mm (0.08" - 0.157%)
‘Smm (02°) in X and Y from lower right corner|
PCB Maximum warpage:
Max. height pre-mounted components:
‘4mm on placement side (0.16)
‘05mm up (00)
|.omm down (0.04")
8mm on non placement side (0.7")
INon- Mountable area:
PCB Material
PCB weight!
PCB positioning:
PCB Transport height:
PCB Transport direction:
PCB Transport width:
PCB loading time:
PCB ratio widthilength
"PhenoliciFRA/Composite Materials
‘Max. 1.2 Ke without components
700mm # 10mm (354° = 04%)
Board Top side:
‘3mm from rear side board edge (0.12")
‘mm from front side board edge (Component
height restrictions apply in the |Omm (0.40")
area from front side edge depending on board
thickness)
4mm around reference holes (0.16°) (locate
pins)
Board Bottom side
‘Smm from front and rear side board edge
(02)
‘Ceramic PCB transport is optional
Max. 2.0 Ke with components
Locate pin fixation (adjustable second pin)
Z servo controlled push up system (sofeware
controlled by PCB thickness)
Push up pins (adjustable positions)
Edge clamping (with adjustable push in)
‘Sub stop (PCB waiting buffer) adjustable
position
Exit stop (fixed position)
SMEMA 953mm * 125mm (37.5" + 05")
Lefe to Right standard, optional Right to Lefe
‘Automatic
Approximately 3 sec.
Max. 13
29 of 4Board Handling
sm (0.42%)
w
‘onm
ony
ee At |
gL Lenmioz sn se (0.29
whan ene pectin So)
She be Song hae) and tom eu slo Bord Edge
[Ey -Locat pin esticton. Component hight rstctions apply inthe
{Beem bate om
Figure 13, Mountable area
|
Figure 14 Warp of fixed PCB.
30 0f 44Board Handling
t . 40 mm
(@015*-0.153)
No component
should be inthis area
5mm
(025 ~ Locate pin restriction, component height
~ OF) restrietion apply in the 10 mm (0) area
from front edge depending on board thickness
Figure 15 Mountable area
31 of 447.0
mA
‘Component
Handling
Tape feeding
Table 8
Table 9
‘Component Handling
The GEM Topaz-X has a fully compatible feeder platform with all GemLine
machines, Sapphire, Topaz, Emerald, and Emerald-X. Depending on the machine
configuration up to 90 feeders (8mm) can be loaded.
The tape feeder design for the GemLine allows simultaneous picking from any mix
of tape feeders ranging from 8 to 44mm. To achive high speed feeding all feeder
types are air driven. To prevent incorrect feeder latching, a laser-based verification
system is used.
‘Available tape feeders
Tape Feeder
Tape Feeder 8mm 7° for 0603 (0201) component (PSA) | 2 PA 2903/73
Tape Feeder Simm 7" for 1005 (0402) 24 PA 2903/74
“Tape Feeder 8mm 7° (PSA) 4 PA 2903/75
‘Tape Feeder 8mm 15" (PSA) 4 PA 2903/76
Tape Feeder [2mm 7" (PSA) 48 PA 2903/85
Tape Feeder |2mm 15" (PSA) 48 PA 2903/86
Tape Feeder 6mm 15 4.8,12,16 | PA2903/20
Tape Feeder Iémm 15° (PSA) 4.8,12,16 | PA2903725
Tape Feeder 24mm
Tape Feeder 24mm
Tape Feeder 32mm
4.8, 12, 16,20 PA 2903/30
4.8, 12, 16,20 | PA 2903735
12, 16,24, 32 PA 2903/40
Tape Feeder 32mm 12,16, 24,32 | PA 2903/45,
Tape Feeder 44mm 12, 16,24, 32 | PA 2903/50
Tape Feeder 4mm 15 (PSA) 12, 16,2432 | PA 2903155
The feeding pitch can be adjusted on the feeder side.
Sar
Required feeder position
Feeder type ‘equivalent to tape feeder 8mm
Tape Feeder 8mm T
Tape Feeder [2mm, 16mm, 24mm 3
Tape Feeder 32mm 4
Tape Feeder 4mm 5
The above feeder conversion number may differ according to the installation
combination.
For larger and special tape feeders such as 56mm, 72mm please contact your local
sales representative
320f 4472
Double
Shuttle Tray
Feeder
(PA 2699/22)
Figure 16
‘Component Handling
‘The double shuttle Tray feeder is an additional pallet sequencer feeding parts from a
tray, This feeder can be equipped with maximum 40 pallets, each being able to hold
different trays.
Double shutele Tray Feeder.
‘Two components are picked up from the tray with a double head, and placed
simultaneously on a shuttle. ‘This shuttle then moves into the machine where the
components are picked by the placement head. The partis then aligned by vision
and placed on the PCB. At the same moment when the components are picked by
the placement head a second shuttle will be supplied with the next components
which minimize the feeding time.
The component feeding time of the double shuttle ‘Tray feeder is 3.5 seconds for 2
parts when using the same tray (pallet 1) and 8.5 seconds when changing the tray
(pallet 40). However, in practice no time is lost because of the simultancous
operation of Tray sequencer and Topaz-X: while the machine is picking from on-
board feeders, the shuttle brings in new components. A part that is rejected by vision
will be placed back on the reject conveyor which means no loss of expensive parts.
The PCB conveyor on the double shuttle Tray feeder offers the possibility for visual
PCB inspection.
+ Atray container is fixed and separated into two sections with each 20 pallets. This
allows tray replenishment while the machine is running,
33 of 4Table 10
‘Component Handling
+ A buffer conveyor is standard equipped, so a reflow oven can be connected
without additional conveyors.
LCS Tray Feeder specifications
GENERAL
Max. Tray size (Lx W)
Min Tay size (Lx W}
[Component feeding time
Power and air supply
LCS Tray feeder dimensions
Topaz-X + Tray feeder dimensions:
Weigh
Power supply. air supply
APPLICABLE COMPONENTS
Min. Component dimension:
Max. Component dimension
Max. Try height incladed component height
50mm x SOmm (20° x 2.0)
13.5 sec. for 2 part (picking from pallet 1)
| Delivered by Topar-X
| Length: €26mm (2.8 f)
| Length: 2476mm (23)
| 200 kg (617 Ub
350mm x 468ram (13.7 18.
3 Jedec trays
which can hold
85 sec. for 2 parts (picking one from pallet |
and one from pallet 40)
Heighe 1 165mm (3.8 f); with top cover open
Us45mmn (5.2 f)
Width: 1650mm (52); with door open
2292mn (76 R)
Height: 1850mm (6.1 &)
Width: 1842mm (6.1 Rj; with LCS door open
and feeders on Topar-X 2942mm (98 f)
Supplied from main machine
ram x Sm (031" x 031") Mold size
45mm x 45mm (18x 18")
£8 Sm (0.33) from pallets at pitch of 125mm
(0.5, total 40 pallets possible
20mm (0.78) from pallets at pitch of 25mm
(0.98°), coal 20 pallets possible
FEED CAPACITY
Number of shuts:
2
Number of pads on each shut
[STANDARD COMPONENT CAPACITY
Max. number of component types
2 (witha pitch of 48>)
120 (3x 40 Jedec)
Number of pallets
Standard 30 pallets included (additional pallets
avallable PA 2981/15)
34 of 4413
‘Component Handling
ATS 20 “The ATS 20 Tray Feeder is a new additional internal pallet sequencer, allowing high-
Tray Feeder speed feeding of tray components. This feeder can be equipped with a maximum of
portrait 20 pallets, each being able to hold different trays.
(PA 2696/21)
Figure 17 ATS 20 Tray Feeder portrait.
The maximum pallet exchange time for the ATS 20 Tray feeder is 5.6 seconds.
However, in practice no time is lost because of the simultancous operation of the
ATS 20 Tray feeder and ‘Topaz-X; while the machine is picking from on-board
feeders, the pallet brings in new components.
‘A part rejected by vision will be placed back in its original tray position; this means
no loss of expensive parts.
35 of 44Table 11
‘Component Handling
Crete dda kiana
GENERAL
Max, Tray size (Lx Wi)
Min, Tray size (Lx Wy
220mm x 350mm (8.6° x 13.7).
50mm x 50mm (2.0° x 2.0")
Pallet exchange time:
(Changing from pallet | to 20; 5.6 seconds
Weight:
Power and alr supply
| Supplied by Topaz x
+80 Kg (I76 Lbs)
FTopaz-X + ATS 20 Tray feeder dimensions
Maximum board size Topaz-X:
[250mm (28°)
Lengeh: 1650mm (55)
Height: 1850mm (6.28)
‘With: 1870mm (62 49;
‘with ATS 20 door open: 2220mm (7.4 #)
Maximum amount of feeders on Topaz-X:
APPLICABLE COMPONENTS.
Max. Tray height included component height:
Min. Component dimension:
Témnm (0.63") from pallets at pitch of 25mm
[lemm x 6mm (0.24" x 0.24") mold size
0
8.5mm (0.33") from pallets a pitch of 125mm
(0.49; otal 20 pallets possible.
‘otal 10 pallets possible
Max. Component dimension:
[STANDARD COMPONENT CAPACITY
Max. number of component types
32mm x F2mm (13"x 13°)
20 20 | Jedec tray)
Number of pallets
‘Standard 20 pallets included (additional pallets
available PA 2981/35)
36 0f 4414
‘Component Handling
Double ‘The Double ATS 20 ‘Tray Feeder porteait is a new additional internal pallet
ATS 20 sequencer, allowing high-speed feeding of tray components. This feeder can be
Tray Feeder equipped with a maximum of 2 x 20 pallets, each being able co hold different trays.
portrait
(PA 2696/22)
Figure 18 Double ATS 20 Tray Feeder portmait.
‘The maximum pallet exchange time for the Double ATS 20 Tray feeder is 5.6
seconds. However, in practice no time is lost because of the simultancous operation
of the Double ATS 20 ‘Tray feeder and Topaz-X: while the machine is picking from
on-board feeders, the pallet brings in new components
A part rejected by vision will be placed back in its original tray position; this means
no loss of expensive parts.
37 of 4Table 12
Perce ns
GENERAL
eon
‘Component Handling
Max, Tray size (Lx Wi)
Min, Tray size (Lx Wy
220mm x 350mm (8.6° x 13.7).
50mm x 50mm (2.0° x 2.0")
Pallet exchange time:
(Changing from pallet | to 20; 5.6 seconds
Pick up restricions
Power and air supply
Weight:
FTopaz-X + double ATS 20 Tray feeder dimen-
Maximum board size Topsz-X:
Maximum amount of feeders on Topaz-X:
‘At the left ATS 20 components can't be
picked by all heads in an area of 36mm
(14°Vfrom the lft side ofthe pallet.
Supplied by Topaz-X.
160 Kg (342 Lbs)
| Length: 1650%mm (5.5 A)
Height: 1850mm (6.2)
‘Width: 1870mm (6.2 £9;
‘with ATS 20 door open: 2220mm (7.4 #)
250mm (9.8)
0
[APPLICABLE COMPONENTS:
Max. Tray height included component height:
Min. Component dimension:
Max. Component dimension:
Tlemm x 6mm (02
[32mm x 32mm (13" x 13"
8.5mm (0.33") from pallets ac pitch of 12.5rmm
(0.49; total 20 pallets possible.
Térnm (0.63") from pallets at pitch of 25mm
(0.98"; total 10 pallets possible
024") mold size
[STANDARD COMPONENT CAPACITY
Max. number of component types
-40 (40 * | jedec tray)
Number of pallets
‘Standard 2 x 20 pallets included (additional
pallets available PA 2981/35)
38 of 441s
‘Component Handling
ATS 20 Tray The AT'S 20 ‘Tray Feeder landscape is a new additional internal pallet sequencer,
Feeder allowing high-speed feeding of tray components, This feeder ean be equipped with a
landscape ‘maximum of 20 pallets, each being able to hold different trays
(PA 2696/23)
Figure 19 ATS 20 Tray Feeder landscape.
The maximum pallet exchange time for the ATS 20 Tray Feeder landscape is 5.6
seconds, However, in practice no time is lost because of the simultancous operation
of the ATS 20 Tray Feeder landscape and ‘Topaz-X; while the machine is picking
from on-board feeders, the pallet brings in new components.
‘A part rejected by vision will be placed back in its original tray position; this means
no loss of expensive parts.
39 of 4re aa een errr
GENERAL
‘Component Handling
Max, Tray size (Lx Wi)
Min, Tray size (Lx Wy
350mm x 220mm (13.7" x 86°)
50mm x 50mm (2.0° x 2.0")
Pallet exchange time:
(Changing from pallet | to 20; 5.6 seconds
Pick up restrictions
Power and air supply
Weight:
FTopaz-X + Landscape ATS 20 Tray feeder
dimensions:
Maximum board size Topsz-X:
Maximum amount of feeders on Topaz-X:
| Length: 1650%mm (5.5 A)
‘Ac the right side of the ATS 20 landscape
paler components can't be picked by all
heads in an area of 182mm (0.72")
Supplied by Topaz-X.
+80 Kg (I76 Lbs)
Height: 1850mm (6.2 2)
‘Width: 1783mm (5:99;
‘with ATS 20 door open: 228%mm (7.6 #)
380mm (15.0")
56
[APPLICABLE COMPONENTS:
Max. Tray height included component height:
Min. Component dimension:
Max. Component dimension:
Térnm (0.63") from pallets at pitch of 25mm
Tlemm x 6mm (02
[32mm x 32mm (13" x 13"
8.5mm (0.33") from pallets ac pitch of 12.5rmm
(0.49; total 20 pallets possible.
(0.98"; total 10 pallets possible
024") mold size
[STANDARD COMPONENT CAPACITY
Max. number of component types
20 (20 x | Jedec tray)
Number of pallets
‘Standard 2 x 20 pallets included (additional
pallets available PA 2981/36)
40 of 447.6 Mountable
‘Components
& Required
Nozzles GEM
Topaz-X.
‘Component,
Handling
Just five nozzle shapes are required to cover the specified SMD range. High output
levels are therefore achieved, as the need for nozzle exchanges is minimal. An
optional 18 position nozzle exchange station enables additional special nozzles to be
accommodated.
Solid resistor ogo [030025 Type 7IATIF
ao [050/050 Type 7IAMIF
ia [080050 Type TRAITAF
200 [125/050 Type ATIF
320 [160/040 Type ATIF
Seid restr 200 [6125 Tipe DATE
345 [0138 Tipe RAT
33 222 Type RATE
uléLayered ceramic 08 03 03 Type TIAMIF
epscter ‘a as as Type TIAMIF