MIC5236 Micrel, Inc.

MIC5236
Low Quiescent Current µCap LDO Regulator

General Description Features

The MIC5236 is a low quiescent current, µCap low-dropout • Ultra-low quiescent current (IQ = 20µA @IO = 100µA)
regulator. With a maximum operating input voltage of 30V and • Wide input range: 2.3V to 30V
a quiescent current of 20µA, it is ideal for supplying keep-alive • Low dropout:
power in systems with high-voltage batteries. 230mV @50mA;
Capable of 150mA output, the MIC5236 has a dropout volt- 300mV @150mA
age of only 300mV. It can also survive an input transient of • Fixed 2.5V, 3.0V, 3.3V, 5.0V, and Adjustable outputs
–20V to +60V. • ±1.0% initial output accuracy
• Stable with ceramic or tantalum output capacitor
As a µCap LDO, the MIC5236 is stable with either a ceramic
• Load dump protection: –20V to +60V input transient
or a tantalum output capacitor. It only requires a 1.0µF output
survivability
capacitor for stability.
• Logic compatible enable input
The MIC5236 includes a logic compatible enable input and • Low output flag indicator
an undervoltage error flag indicator. Other features of the • Overcurrent protection
MIC5236 include thermal shutdown, current-limit, overvoltage • Thermal shutdown
shutdown, load-dump protection, reverse leakage protections, • Reverse-leakage protection
and reverse battery protection. • Reverse-battery protection
Available in the thermally enhanced SOIC-8 and MSOP-8, the • High-power SOIC-8 and MSOP-8
MIC5236 comes in fixed 2.5V, 3.0V, 3.3V, 5.0V, and adjustable
voltages. For other output voltages, contact Micrel.
Applications
• Keep-alive supply in notebook and
portable personal computers
• Logic supply from high-voltage batteries
• Automotive electronics
• Battery-powered systems

Typical Application
MIC5236 MIC5236
VIN IN OUT VOUT VIN VOUT
IN OUT
30V 3.0V/100µA 5V 3.0V/150mA
47k COUT
EN ERR IGND = 20µA EN ERR
GND GND VERR

Regulator with Low IO and Low IQ Regulator with Error Output

MIC5236
VIN VOUT
IN OUT
5V 3.0V/150mA
R1
EN ADJ
GND R2

Regulator with Adjustable Output

Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com

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MIC5236 Micrel, Inc.

Ordering Information
Part Number* Voltage Junction Temp. Range Package
Standard Pb-Free
MIC5236BM MIC5236YM ADJ -40°C to +125°C 8-Pin SOIC
MIC5236BMM MIC5236YMM ADJ -40°C to +125°C 8-Pin MSOP
MIC5236-2.5BM MIC5236-2.5YM 2.5V -40°C to +125°C 8-Pin SOIC
MIC5236-2.5BMM MIC5236-2.5YMM 2.5V -40°C to +125°C 8-Pin MSOP
MIC5236-3.0BM MIC5236-3.0YM 3.0V -40°C to +125°C 8-Pin SOIC
MIC5236-3.0BMM MIC5236-3.0YMM 3.0V -40°C to +125°C 8-Pin MSOP
MIC5236-3.3BM MIC5236-3.3YM 3.3V -40°C to +125°C 8-Pin SOIC
MIC5236-3.3BMM MIC5236-3.3YMM 3.3V -40°C to +125°C 8-Pin MSOP
MIC5236-5.0BM MIC5236-5.0YM 5.0V -40°C to +125°C 8-Pin SOIC
MIC5236-5.0BMM MIC5236-5.0YMM 5.0V -40°C to +125°C 8-Pin MSOP
* Contact factory regarding availability for voltages not listed

Pin Configuration

ERR 1 8 GND ADJ 1 8 GND

IN 2 7 GND IN 2 7 GND

OUT 3 6 GND OUT 3 6 GND

EN 4 5 GND EN 4 5 GND

8-Pin SOIC (M) 8-Pin SOIC (M)

8-Pin MSOP (MM) 8-Pin MSOP (MM)

Pin Description
Pin Number Pin Number Pin Name Pin Function
1 /ERR Error (Output): Open-collector output is active low when the output is out
of regulation due to insufficient input voltage or excessive load. An external
pull-up resistor is required.
1 ADJ Adjustable Feedback Input. Connect to voltage divider network.
2 2 IN Power supply input.
3 3 OUT Regulated Output
4 4 EN Enable (Input): Logic low = shutdown; logic high = enabled.
5–8 5–8 GND Ground: Pins 5, 6, 7, and 8 are internally connected in common via the lead-
frame.

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Absolute Maximum Ratings (Note 1) Operating Ratings (Note 2)

Supply Voltage (VIN), Note 3 .........................–20V to +60V Supply Voltage (VIN) .................................... + 2.3V to +30V
Power Dissipation (PD), Note 4 ............... Internally Limited Junction Temperature (TJ) ........................ –40°C to +125°C
Junction Temperature (TJ) ....................................... +150°C Package Thermal Resistance
Storage Temperature (TS) ........................ –65°C to +150°C MSOP (θJA) ........................................................................ 80°C/W
Lead Temperature (soldering, 5 sec.) ........................ 260°C SOIC (θJA) .......................................................... 63°C/W
ESD Rating, Note 5

Electrical Characteristics
VIN = 6.0V; VEN = 2.0V; COUT = 4.7µF, IOUT = 100µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted.
Symbol Parameter Conditions Min Typ Max Units
VOUT Output Voltage Accuracy variation from nominal VOUT –1 1 %
–2 +2 %
ΔVOUT/ΔT Output Voltage Note 6 50
ppm/°C
Temperature Coefficient
ΔVOUT/VOUT Line Regulation VIN = VOUT + 1V to 30V 0.2 0.5 %
1.0 %
ΔVOUT/VOUT Load Regulation IOUT = 100µA to 50mA, Note 7 0.15 0.3 %
0.5 %
IOUT = 100µA to 150mA, Note 7 0.3 0.6 %
1.0 %
ΔV Dropout Voltage, Note 8 IOUT = 100µA 50 100 mV
IOUT = 50mA 230 400 mV
IOUT = 100mA 270 mV
IOUT = 150mA 300 500 mV
IGND Ground Pin Current VEN ≥ 2.0V, IOUT = 100µA 20 30 µA
VEN ≥ 2.0V, IOUT = 50mA 0.5 0.8 mA
VEN ≥ 2.0V, IOUT = 100mA 1.5 mA
VEN ≥ 2.0V, IOUT = 150mA 2.8 4.0 mA
5.0 mA
IGND(SHDN) Ground Pin in Shutdown VEN ≤ 0.6V, VIN = 30V 0.1 1 µA
ISC Short Circuit Current VOUT = 0V 260 350 mA
en Output Noise 10Hz to 100kHz, VOUT = 3.0V, CL = 1.0µF 160 µVrms
/ERR Output
V/ERR Low Threshold % of VOUT 90 94 %
High Threshold % of VOUT 95 98 %
VOL /ERR Output Low Voltage VIN = VOUT(nom) – 0.12VOUT, IOL = 200µA 150 250 mV
400 mV
ILEAK /ERR Output Leakage VOH = 30V 0.1 1 µA
2 µA
Enable Input
VIL Input Low Voltage regulator off 0.6 V
VIH Input High Voltage regulator on 2.0 V

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MIC5236 Micrel, Inc.
Symbol Parameter Conditions Min Typ Max Units
IIN Enable Input Current VEN = 0.6V, regulator off 0.01 1.0 µA
2.0 µA
VEN = 2.0V, regulator on 0.15 1.0 µA
2.0 µA
VEN = 30V, regulator on 0.5 2.5 µA
5.0 µA
Note 1. Exceeding the absolute maximum rating may damage the device.
Note 2. The device is not guaranteed to function outside its operating rating.
Note 3: The absolute maximum positive supply voltage (60V) must be of limited duration (≤100ms) and duty cycle (≤1%). The maximum continuous
supply voltage is 30V.
Note 4: The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) ÷ θJA. Exceeding the maximum allow-
able power dissipation will result in excessive die termperature, and the regulator will go into thermal shutdown. The θJA of the MIC5236-x.
xBM (all versions) is 63°C/W, and the MIC5236-x.xBMM (all versions) is 80°C/W, mounted on a PC board (see “Thermal Characteristics” for
further details).
Note 5. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5k in series with 100pF.
Note 6: Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range.
Note 7: Regulation is measured at constant junction temperature using pulse testing with a low duty-cycle. Changes in output voltage due to heating
effects are covered by the specification for thermal regulation.
Note 8: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1.0V
differential.

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Typical Characteristics

Dropout Voltage Dropout Characteristics Dropout Voltage

vs. Output Current 3.5 vs. Temperature
400 600
ILOAD = 10mA

OUTPUT VOLTAGE (V)

3.0
ILOAD = 50mA

DROPOUT VOLTAGE (mV)

DROPOUT VOLTAGE (mV)

500
300
2.5 400
ILOAD = 150mA
200 2.0 300
ILOAD = 150mA
200
1.5 ILOAD = 100mA
100
VOUT = 98% of Nominal VOUT 100
MIC5236-3.0
1.0 MIC5236-3.0
MIC5236-3.0 1.5 2.0 2.5 3.0 3.5 4.0
0 0
0 40 80 120 160 200 -40 -20 0 20 40 60 80 100 120
SUPPLY VOLTAGE (V)
OUTPUT CURRENT (mA) TEMPERATURE (°C)

Ground Current Ground Pin Current Ground Current

vs. Output Current vs. Output Current vs. Supply Voltage
4 25 5
MIC5236-3.0 MIC5236-3.0
GROUND PIN CURRENT (mA)

GROUND PIN CURRENT (µA)

VIN = 4V

GROUND CURRENT (mA)

20 4
3 ILOAD = 150mA
VIN = 10V
15 3
2 VIN = 4V VOUT = 3V
10 2

1 VIN = 10V
5 1 ILOAD = 100µA
MIC5236-3.0
0 0 0
0 20 40 60 80 100 120 140 160 0 100 200 300 400 500 0 1 2 3 4 5 6 7 8
OUTPUT CURRENT (mA) OUTPUT CURRENT (µA) SUPPLY VOLTAGE (V)

Ground Current Ground Current Ground Current

vs. Supply Voltage vs. Temperature vs. Temperature
100 0.10 1.2
GROUND PIN CURRENT (µA)

90 MIC5236-3.0
GROUND CURRENT (mA)
GROUND CURRENT (mA)

1.0
80 0.08
ILOAD = 10mA
70 0.8
60 0.06 VIN = 4V VIN = 4V
50 ILOAD = 10mA 0.6 ILOAD = 75mA
40 1mA 100µA 0.04
0.4
30
20 0.02 0.2
10 10µA MIC5236-3.0 MIC5236-3.0
0 0 0
0 1 2 3 4 5 6 7 8 -40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
SUPPLY VOLTAGE (V) TEMPERATURE (°C) TEMPERATURE (°C)

Ground Current Output Voltage Short Circuit Current

vs. Temperature vs. Temperature vs. Temperature
4 3.015 285
SHORT CIRCUIT CURRENT (mA)

MIC5236-3.0
GROUND CURRENT (mA)

3.010 280
VOLTAGE OUTPUT (V)

3
VIN = 4V 3.005 275
VIN = 4V
ILOAD = 150mA
2 3.000 ILOAD = 150mA 270

2.995 265 VOUT = 0V

1
2.990 260
MIC5236-3.0
MIC5236-3.0
0 2.985 255
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)

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Line Regulation Overvoltage Threshold Current Limit

3.018 vs. Temperature vs. Output Voltage
41 3.5
3.016 MIC5236-3.0
MIC5236-3.0
VOLTAGE OUTPUT (V)

3.0
3.014

OUTPUT VOLTAGE (V)

40

INPUT VOLTAGE (V)

3.012 2.5
39 2.0
3.010
3.008 ILOAD = 10mA 1.5
38
3.006 1.0
3.004 37
0.5
3.002 MIC5236-3.0
0 5 10 15 20 25 30 35 36 0
-40 -20 0 20 40 60 80 100 120 0 100 200 300 400
INPUT VOLTAGE (V)
TEMPERATURE (°C) CURRENT LIMIT (mA)

Input Current Dropout Induced Current Limit Induced

120 Error Flag Error Flag
MIC5236-3.0 3.0 1.25
100 MIC5236-3.0 VIN = 6V
OUTPUT-LOW VOLTAGE (V)

OUTPUT-LOW VOLTAGE (V)

INPUT CURRENT (mA)

VE N = 5V 2.5 VOUT = 2.03V

1.00
80 R = 30Ω VIN = 2.7V RL = 6Ω
L
2.0 VOUT =2.62V
60 0.75
No Load
1.5
40 0.50
1.0
20
0.5 0.25
0 MIC5236-3.0
-30 -20 -10 0 10
0 0
INPUT VOLTAGE (V) 0 0.5 1.0 1.5 2.0 0 0.5 1.0 1.5 2.0 2.5 3.0
SINK CURRENT (mA) SINK CURRENT (mA)

Reverse Current Reverse Current

(Open Input) (Grounded Input)
60 70
Note 10 60
REVERSE CURRENT (µA)

REVERSE CURRENT (µA)

50 Note 11
-40°C 50 -40°C
40
40
30 +25°C +25°C
30
20
20
10 +85°C 10 +85°C
0 0
0 5 10 15 20 0 5 10 15 20
EXTERNAL VOLTAGE (V) EXTERNAL VOLTAGE (V)

Note 10 Note 11

MIC5236 Reverse� MIC5236 Reverse�

Current Current
IN OUT IN OUT
EN GND EN
GND

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MIC5236 Micrel, Inc.

Functional Characteristics

Enable Load
Transient Response Transient Response
(2V/div.)
VOUT

(100mV/div.)
VOUT
VIN = 4V
VOUT = 3V
(5V/div.)

COUT = 15µF
VEN

ESR = 200mΩ

(100mA/div.)
VIN = 5V

IOUT
IL = 10mA

TIME (250µs/div.) TIME (250µs/div.)

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MIC5236 Micrel, Inc.

Functional Diagram
IN OUT

EN

RFB1

Error RFB2
Amplifier

RFB3

ERR

VREF Error
1.23V Comparator

MIC5236-x.x
GND

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MIC5236 Micrel, Inc.

Application Information Error Detection Comparator Output

The MIC5236 provides all of the advantages of the MIC2950: The ERR pin is an open collector output which goes low when
wide input voltage range, load dump (positive transients up the output voltage drops 5% below it’s internally programmed
to 60V), and reversed-battery protection, with the added ad- level. It senses conditions such as excessive load (current
vantages of reduced quiescent current and smaller package. limit), low input voltage, and over temperature conditions.
Additionally, when disabled, quiescent current is reduced to Once the part is disabled via the enable input, the error flag
0.1µA. output is not valid. Overvoltage conditions are not reflected
in the error flag output. The error flag output is also not valid
Enable
for input voltages less than 2.3V.
A low on the enable pin disables the part, forcing the quies-
The error output has a low voltage of 400mV at a current of
cent current to less than 0.1µA. Thermal shutdown and the
200µA. In order to minimize the drain on the source used
error flag are not functional while the device is disabled. The
for the pull-up, a value of 200k to 1MΩ is suggested for the
maximum enable bias current is 2µA for a 2.0V input. An open
error flag pull-up. This will guarantee a maximum low voltage
collector pull-up resistor tied to the input voltage should be
of 0.4V for a 30V pull-up potential. An unused error flag can
set low enough to maintain 2V on the enable input. Figure 1
be left unconnected.
shows an open collector output driving the enable pin through 4.75V
a 200k pull-up resistor tied to the input voltage. Output
Voltage
In order to avoid output oscillations, slow transitions from low 0V

to high should be avoided. VALID ERROR

200k Error NOT NOT
VERR
MIC5236
Output VALID VALID

VIN IN OUT VOUT

5V
200k
5V
EN ERR COUT Input
GND Voltage 1.3V
SHUTDOWN 0V
ENABLE

Figure 3. Error Output Timing

Figure 1. Remote Enable Reverse Current Protection

The MIC5236 is designed to limit the reverse current flow
Input Capacitor
from output to input in the event that the MIC5236 output
An input capacitor may be required when the device is not has been tied to the output of another power supply. See
near the source power supply or when supplied by a bat- the graphs detailing the reverse current flow with the input
tery. Small, surface mount, ceramic capacitors can be used grounded and open.
for bypassing. Larger values may be required if the source
Thermal Shutdown
supply has high ripple.
The MIC5236 has integrated thermal protection. This feature
Output Capacitor
is only for protection purposes. The device should never be
The MIC5236 has been designed to minimize the effect of the intentionally operated near this temperature as this may
output capacitor ESR on the closed loop stability. As a result, have detrimental effects on the life of the device. The ther-
ceramic or film capacitors can be used at the output. Figure 2 mal shutdown may become inactive while the enable input
displays a range of ESR values for a 10µF capacitor. Virtually is transitioning a high to a low. When disabling the device
any 10µF capacitor with an ESR less than 3.4Ω is sufficient via the enable pin, transition from a high to low quickly. This
for stability over the entire input voltage range. Stability can will insure that the output remains disabled in the event of a
also be maintained throughout the specified load and line thermal shutdown.
conditions with 1µF film or ceramic capacitors.
5 Current Limit
OUTPUT CAPACITOR ESR (Ω)

Figure 4 displays a method for reducing the steady state

4
short circuit current. The duration that the supply delivers
3 current is set by the time required for the error flag output
Stable Region to discharge the 4.7µF capacitor tied to the enable pin. The
2 off time is set by the 200K resistor as it recharges the 4.7µF
capacitor, enabling the regulator. This circuit reduces the
1 TJ = 25°C
VOUT = 10µF
short circuit current from 280mA to 15mA while allowing for
0 regulator restart once the short is removed.
5 10 15 20 25 30
INPUT VOLTAGE (V)

Figure 2. Output Capacitor ESR

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MIC5236 Micrel, Inc.
1N4148 which is typically 75°C/W. θCA is reduced because pins 5
200k through 8 can now be soldered directly to a ground plane
VERR which significantly reduces the case-to-sink thermal resistance
MIC5236
VIN and sink to ambient thermal resistance.
IN OUT VOUT
5V
200k Low-dropout linear regulators from Micrel are rated to a
EN ERR COUT maximum junction temperature of 125°C. It is important not to
GND
exceed this maximum junction temperature during operation
SHUTDOWN 4.7µF
ENABLE of the device. To prevent this maximum junction temperature
from being exceeded, the appropriate ground plane heat sink
must be used.
Figure 4. Remote Enable with Short-Circuit 900
Current Foldback 800

100°C
85°C
75°C
65°C
55°C
50°C
40°C
COPPER AREA (mm2)
700
Thermal Characteristics 600
The MIC5236 is a high input voltage device, intended to 500
provide 150mA of continuous output current in two very small 400
profile packages. The power SOIC-8 and power MSOP-8 al- 300
low the device to dissipate about 50% more power than their 200
standard equivalents. 100
0
Power SOIC-8 Thermal Characteristics 0 0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
One of the secrets of the MIC5236’s performance is its power
SO-8 package featuring half the thermal resistance of a Figure 6. Copper Area vs. Power-SOIC
standard SO-8 package. Lower thermal resistance means Power Dissipation (∆TJA)
more output current or higher input voltage for a given pack-
age size. Figure 6 shows copper area versus power dissipation with
each trace corresponding to a different temperature rise
Lower thermal resistance is achieved by joining the four
above ambient.
ground leads with the die attach paddle to create a single-
piece electrical and thermal conductor. This concept has From these curves, the minimum area of copper necessary for
been used by MOSFET manufacturers for years, proving the part to operate safely can be determined. The maximum
very reliable and cost effective for the user. allowable temperature rise must be calculated to determine
operation along which curve.
Thermal resistance consists of two main elements, θJC (junc-
tion-to-case thermal resistance) and θCA (case-to-ambient ΔT = TJ(max) – TA(max)
thermal resistance). See Figure 5. θJC is the resistance from TJ(max) = 125°C
the die to the leads of the package. θCA is the resistance TA(max) = maximum ambient operating temperature
from the leads to the ambient air and it includes θCS (case-
For example, the maximum ambient temperature is 50°C,
to-sink thermal resistance) and θSA (sink-to-ambient thermal
the ΔT is determined as follows:
resistance).
ΔT = 125°C – 50°C
ΔT = 75°C
SOP-8 Using Figure 6, the minimum amount of required copper can
be determined based on the required power dissipation. Power
dissipation in a linear regulator is calculated as follows:
PD = (VIN – VOUT) IOUT + VIN · IGND
If we use a 3V output device and a 28V input at moderate
qJA output current of 25mA, then our power dissipation is as
ground plane
qJC qCA
heat sink area follows:
AMBIENT
PD = (28V – 3V) × 25mA + 28V × 250µA
PD = 625mW + 7mW
printed circuit board
PD = 632mW
Figure 5. Thermal Resistance From Figure 6, the minimum amount of copper required to
operate this application at a ΔT of 75°C is 25mm2.
Using the power SOIC-8 reduces the θJC dramatically and
allows the user to reduce θCA. The total thermal resistance, Quick Method
θJA (junction-to-ambient thermal resistance) is the limiting Determine the power dissipation requirements for the design
factor in calculating the maximum power dissipation capabil- along with the maximum ambient temperature at which the
ity of the device. Typically, the power SOIC-8 has a θJC of device will be operated. Refer to Figure 7, which shows safe
20°C/W, this is significantly lower than the standard SOIC-8 operating curves for three different ambient temperatures:

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MIC5236 Micrel, Inc.
25°C, 50°C and 85°C. From these curves, the minimum 900
T = 125°C
amount of copper can be determined by knowing the maxi- 800 J

COPPER AREA (mm2)

700
mum power dissipation required. If the maximum ambient 85°C 50°C 25°C
600
temperature is 50°C and the power dissipation is as above,
500
632mW, the curve in Figure 7 shows that the required area
400
of copper is 25mm2. 300
The θJA of this package is ideally 63°C/W, but it will vary 200
depending upon the availability of copper ground plane to 100
which it is attached. 0
0 0.25 0.50 0.75 1.00 1.25 1.50
900 POWER DISSIPATION (W)
800 TJ = 125°C
COPPER AREA (mm2)

700 85°C 50°C 25°C

Figure 9. Copper Area vs. Power-MSOP
600
500
Power Dissipation (TA)
400 Power MSOP-8 Thermal Characteristics
300
The power-MSOP-8 package follows the same idea as the
200
100
power-SO-8 package, using four ground leads with the die
0
attach paddle to create a single-piece electrical and thermal
0 0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
conductor, reducing thermal resistance and increasing power
dissipation capability.
Figure 7. Copper Area vs. Power-SOIC Quick Method
Power Dissipation (TA) Determine the power dissipation requirements for the design
along with the maximum ambient temperature at which the
100°C

device will be operated. Refer to Figure 9, which shows safe

40°C
50°C
55°C
65°C
75°C
85°C
COPPER AREA (mm2)

700
600
operating curves for three different ambient temperatures,
500
25°C, 50°C, and 85°C. From these curves, the minimum
400 amount of copper can be determined by knowing the maxi-
300 mum power dissipation required. If the maximum ambient
200 temperature is 50°C, and the power dissipation is 639mW,
100 the curve in Figure 9 shows that the required area of copper
0
0 0.25 0.50 0.75 1.00 1.25 1.50
is 110mm2,when using the power MSOP-8.
POWER DISSIPATION (W)
Adjustable Regulator Application
MIC5236BM/MM
Figure 8. Copper Area vs. Power-MSOP 2 3
Power Dissipation (∆TJA) VIN IN OUT VOUT
4 1 R1
The same method of determining the heat sink area used EN ADJ 1µF
for the power-SOIC-8 can be applied directly to the power- GND R2
MSOP-8. The same two curves showing power dissipation 5-8

versus copper area are reproduced for the power-MSOP-8

and they can be applied identically, see Figures 8 and 9.
Figure 10. Adjustable Voltage Application
The MIC5236BM/MM can be adjusted from 1.24V to 20V by
using two external resistors (Figure 10). The resistors set the
output voltage based on the following equation:
R1
VOUT = VREF (1 + )
R2

Where VREF = 1.23V.

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Package Information

0.026 (0.65)
MAX) PIN 1

0.157 (3.99) DIMENSIONS:

0.150 (3.81) INCHES (MM)

0.020 (0.51)
0.013 (0.33)
0.050 (1.27)
TYP 0.0098 (0.249) 45°
0.010 (0.25)
0.0040 (0.102) 0.007 (0.18)

0.197 (5.0) 0°–8° 0.050 (1.27)

0.064 (1.63) 0.189 (4.8) SEATING 0.016 (0.40)
0.045 (1.14) PLANE
0.244 (6.20)
0.228 (5.79)

8-Pin SOIC (M)

0.122 (3.10) 0.199 (5.05) DIMENSIONS:

0.112 (2.84) 0.187 (4.74) INCH (MM)

0.120 (3.05)
0.116 (2.95)
0.036 (0.90) 0.043 (1.09)
0.032 (0.81) 0.038 (0.97) 0.007 (0.18)
0.012 (0.30) R 0.005 (0.13)

0.012 (0.03) 0.008 (0.20) 5° MAX 0.012 (0.03) R

0.004 (0.10) 0° MIN
0.0256 (0.65) TYP 0.039 (0.99)
0.035 (0.89)
0.021 (0.53)

8-Pin MSOP (MM)

MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA

TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com

This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's
use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser's own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.

© 2005 Micrel, Inc.

MIC5236 12 July 2005