White Paper for

KR1180V2 Series Servers

Powered by AMD Processors
For KR1180-E2-A0-R0-00

Document Version: V1.0

Release Date: April 28, 2025
Copyright © 2025 AIVRES SYSTEMS INC. All rights reserved.

No part of this document may be reproduced or transmitted in any form or by any

means without our prior written consent.

Applicable Model
Model Maintenance Cooling
KR1180-E2-A0-R0-00 Rear access Air cooling

Technical Support
Global Service Hotline: (+1) 844-912-0007
Address: 1501 McCarthy Blvd, Milpitas, CA 95035
AIVRES SYSTEMS INC.
Website: https://aivres.com
Email: [email protected]
Environmental Protection
Please dispose of product packaging by recycling at a local recycling center for a
greener planet.

Trademarks
All the trademarks or registered trademarks mentioned herein may be the property of
their respective holders. This document does not mark any product or brand with the
symbol ® or ™.

Security Statement
We are intensely focused on server product safety and have placed a high priority on
this. For a better understanding of our server products, carefully read through the
following security risk statements.

 When servers are to be repurposed or retired, it is recommended to restore their

firmware factory settings, delete information and clear logs from BIOS and BMC to
protect data privacy. Meanwhile, we recommend you to wipe the drive data
thoroughly and securely with trusted erasing tools. You can use KSManage Server
Provisioning. Contact us for specific server models to which KSManage Server
Provisioning is applicable.

 For server open source software statements, please contact us.

 Some interfaces and commands for production, assembly and return-to-depot,

and advanced commands for locating faults, if used improperly, may cause
equipment abnormality or business interruption. This is not described herein.
Please contact us for such information.

 External ports of our servers do not use private protocols for communication.

 Our products will not initiatively obtain or use your personal data. Only when you
consent to use certain functions or services, some personal data such as IP address
and email address for alerts may be obtained or used during business operation or
fault location. We have implemented necessary measures on product functions to
ensure personal data security throughout the data lifecycle, including but not
limited to data collection, storage, use, transmission, and destruction. Meanwhile,
you are obligated to establish necessary user privacy policies in accordance with
applicable national/regional laws and regulations to fully protect user personal
data.

 Committed to product data security, we have implemented necessary measures on

product functions to protect system operation and security data throughout its
lifecycle in strict accordance with relevant laws, regulations and supervision
 requirements. As the owner of system operation and security data, you are
obligated to establish necessary data security policies and take adequate
measures in accordance with applicable national/regional laws and regulations to
fully protect system operation and security data.

 We will remain committed to the safety of our products and solutions to achieve
better customer satisfaction. We have established emergency response procedures
and action plans for security vulnerabilities, so that product safety issues can be
dealt with in a timely manner. Please contact us for any safety problems found or
necessary support on security vulnerabilities when using our products.

Disclaimer
The purchased products, services and features shall be bound by the contract made
between the customer and us. All or part of the products, services and features
described herein may not be within your purchase or usage scope. Unless otherwise
agreed in the contract, we make no express or implied statement or warranty on the
contents herein. Images provided herein are for reference only and may contain
information or features that do not apply to your purchased model. This document is
only used as a guide. We shall not be liable for any damage, including but not limited
to loss of profits, loss of information, interruption of business, personal injury, or any
consequential damage incurred before, during, or after the use of our products. We
assume you have sufficient knowledge of servers and are well trained in protecting
yourself from personal injury or preventing product damage during operation and
maintenance. The information in this document is subject to change without notice. We
shall not be liable for technical or editorial errors or omissions contained in this
document.
 Preface
Abstract
This document describes the KR1180V2 AMD-based server's appearance, features,
performance parameters, and software and hardware compatibility, providing in-
depth information of KR1180V2.

Intended Audience
This document is intended for pre-sales engineers.

Symbol Conventions
The symbols that may be found in this document are defined as follows.

Symbol Description

A potential for serious injury, or even death if not properly

DANGER handled

A potential for minor or moderate injury if not properly

WARNING handled

A potential loss of data or damage to equipment if not

CAUTION properly handled

Operations or information that requires special attention to

IMPORTANT ensure successful installation or configuration

Supplementary description of document information

NOTE

Revision History
Version Date Description of Changes

V1.0 2025/04/28 Initial release

 Table of Contents
1 Product Overview .........................................................................................1

2 Features .......................................................................................................2

2.1 Scalability and Performance ........................................................................... 2

2.2 Availability and Serviceability ......................................................................... 3

2.3 Manageability and Security............................................................................. 4

2.4 Energy Efficiency ............................................................................................. 5

3 System Parts Breakdown ..............................................................................6

4 System Logical Diagram ...............................................................................7

5 Hardware Description ..................................................................................9

5.1 Front Panel ...................................................................................................... 9

5.1.1 4 × 2.5-Inch Drive + 4 × 3.5-Inch Drive Configuration ............................ 9

5.1.2 10 × 2.5-Inch Drive Configuration ......................................................... 9

5.2 Rear Panel ..................................................................................................... 10

5.2.1 2 × PCIe Card Configuration ................................................................ 10

5.2.2 3 × PCIe Card Configuration ................................................................ 11

5.3 LEDs and Buttons .......................................................................................... 11

5.4 Port Description............................................................................................. 13

5.5 Processor ...................................................................................................... 14

5.6 Memory ......................................................................................................... 14

5.6.1 DDR5 DIMMs ....................................................................................... 14

5.7 Storage ......................................................................................................... 19

5.7.1 Drive Configurations ........................................................................... 19

5.7.2 Drive Numbering ................................................................................ 20

5.7.3 Drive LEDs ........................................................................................... 21

5.7.4 RAID Cards .......................................................................................... 22

 5.8 Network ........................................................................................................ 22

5.9 I/O Expansion ............................................................................................... 23

5.9.1 PCIe Expansion Cards ......................................................................... 23

5.9.2 PCIe Slot Locations.............................................................................. 23

5.9.3 PCIe Riser Modules.............................................................................. 24

5.9.4 PCIe Slot Description ........................................................................... 25

5.10 PSUs .............................................................................................................. 25

5.11 Fan Modules.................................................................................................. 26

5.12 Boards........................................................................................................... 27

5.12.1 Motherboard ...................................................................................... 27

5.12.2 Drive Backplanes ................................................................................ 28

6 Product Specifications ................................................................................ 32

6.1 Technical Specifications ................................................................................ 32

6.2 Environmental Specifications ........................................................................ 34

6.3 Physical Specifications .................................................................................. 35

7 Operating System and Hardware Compatibility ......................................... 38

7.1 Supported Operating System ........................................................................ 38

7.2 Hardware Compatibility ................................................................................ 39

7.2.1 CPU Specifications .............................................................................. 39

7.2.2 DIMM Specifications ............................................................................ 39

7.2.3 Drive Specifications ............................................................................ 40

7.2.4 SAS/RAID Card Specifications ............................................................. 41

7.2.5 NIC Specifications ............................................................................... 41

7.2.6 HBA/HCA Card Specifications ............................................................. 42

7.2.7 PSU Specifications .............................................................................. 42

8 Regulatory Information .............................................................................. 44

8.1 Safety ............................................................................................................ 44

 8.1.1 General ............................................................................................... 44

8.1.2 Personal Safety................................................................................... 44

8.1.3 Equipment Safety ............................................................................... 46

8.1.4 Transportation Precautions ................................................................ 47

8.1.5 Manual Handling Weight Limits .......................................................... 47

9 Limited Warranty ........................................................................................ 48

9.1 Warranty Service ........................................................................................... 48

9.1.1 Remote Technical Support .................................................................. 48

9.1.2 RMA Service ........................................................................................ 49

9.1.3 ARMA Service ...................................................................................... 49

9.1.4 9 × 5 × NBD Onsite Service .................................................................. 49

9.1.5 24 × 7 × 4 Onsite Service ..................................................................... 50

9.2 Our Service SLA ............................................................................................. 50

9.3 Warranty Exclusions ...................................................................................... 50

10 System Management.................................................................................. 52

10.1 Intelligent Management System BMC ............................................................ 52

10.2 KSManage ..................................................................................................... 55

10.3 KSManage Tools............................................................................................ 58

11 Certifications .............................................................................................. 59

12 Appendix A ................................................................................................. 60

12.1 Thermal Restrictions...................................................................................... 60

12.2 Model ............................................................................................................ 61

12.3 RAS Features ................................................................................................. 61

12.4 Sensor List ..................................................................................................... 62

13 Appendix B Acronyms and Abbreviations .................................................. 67

13.1 A - E .............................................................................................................. 67

13.2 F - J ................................................................................................................ 69
13.3 K - O .............................................................................................................. 70

13.4 P - T ............................................................................................................... 71

13.5 U - Z .............................................................................................................. 73
1 Product Overview
The KR1180V2 AMD-based system is a cost-effective high-density 1U single-socket
rack server powered by the AMD EPYC 9004 series processor. Featuring multiple
cores, high base frequency, and high scalability, the server offers ultimate
computing performance, balanced network, and expansion capabilities in a
compact 1U space, saving server room space. It is suitable for various application
scenarios, including cloud computing, virtualization, big data, and distributed all-
flash storage.

Figure 1-1 4 × 2.5-Inch Drive + 4 × 3.5-Inch Drive Configuration

Figure 1-2 10 × 2.5-Inch Drive Configuration

1
2 Features
2.1 Scalability and Performance
Table 2-1 Scalability and Performance

Technical Feature Description

 Supports up to 128 cores, a TDP up to 400 W, a max

boost frequency up to 4.40 GHz, and an L3 cache up to
384 MB per core, delivering unrivalled processing
performance.

- Supports 1 processor with up to 128 cores and 256

threads, maximizing the concurrent execution of
multi-threaded applications.
- Increases the capacity of L2 cache. Each core has its
own 1 MB L2 cache.
- AMD Turbo Core technology brings you an
intelligent self-adaption system. It allows the CPU
4th Gen AMD EPYC cores to exceed the processor TDP at peak workload
Processor (Genoa) and run at the max boost frequency.
- Hyper-threading technology allows every processor
core to run multiple threads (up to 2 threads per
core) concurrently, improving the performance of
multi-threaded applications.
- AMD Virtualization (AMD-V) technology integrates
hardware-level virtualization features, allowing the
operating system to better utilize the hardware for
virtualization workloads.
- Advanced Vector Extensions 512 (AVX-512)
significantly improves floating-point performance
for compute-intensive applications.
Up to 24 DDR5 ECC DIMMs (4,800 MT/s at 1 DPC, RDIMMs),
DDR5 ECC DIMMs delivering superior speed, high availability, and a memory
capacity up to 3,072 GB.
Flexible Drive Provides elastic and scalable storage solutions to meet
Configuration different capacity and upgrade requirements.
All-SSD Brings higher I/O performance over all-HDD configuration
Configuration or HDD-SSD mixing configuration.

2
 Technical Feature Description
12 Gbps Serial Doubles the internal storage data transfer rate of 6 Gbps
Attached SCSI SAS, maximizing the performance of storage I/O-intensive
(SAS) applications.
IOD and PCIe 5.0 controllers are integrated into processors,
Infinity Fabric
significantly shortening I/O latency and enhancing overall
Technology
system performance.
Supports up to 3 rear standard PCIe x16 expansion cards,
PCIe Expansion
namely, 1 FHHL card and 2 HHHL cards.
Two OCP 3.0 slots that can flexibly support
OCP Expansion
1/10/25/40/100/200 Gb hot-plug OCP 3.0 cards

2.2 Availability and Serviceability

Table 2-2 Availability and Serviceability

Technical
Description
Feature
Supports hot-swap SAS/SATA/NVMe drives and RAID cards
Hot-swap
with RAID levels 0/1/1E/10/5/50/6/60, RAID cache and data
SAS/SATA/NVMe
protection enabled by the super-capacitor in case of power
Drive
failures.
 SSDs are much more reliable than traditional HDDs,
increasing system uptime.
 The BMC monitors system parameters in real time and
Reliability
sends alerts in advance, enabling technicians to take
corresponding measures in time to minimize system
downtime.

 The LEDs on front and rear panels and the BMC Web GUI
indicate the status of key components and quickly lead
technicians to failed (or failing) components, simplifying
Availability maintenance and speeding up troubleshooting.
 Provides 2 hot-swap PSUs with 1+1 redundancy.
 Provides 8 hot-swap fan modules with N+1 redundancy.
Maintenance The BMC management network port on the rear panel
Efficiency supports remote BMC O&M, improving O&M efficiency.

3
2.3 Manageability and Security
Table 2-3 Manageability and Security

Technical
Description
Feature
Remote The BMC monitors system operating status and enables
Management remote management.
Allows a network port to serve as a management port and a
service port. The NC-SI feature is disabled by default and can
be enabled/disabled through the BIOS or BMC.
Network Notes:
Controller The NC-SI port supports the following features:
Sideband  The NC-SI port can be bonded to any network port of the OCP card or of
Interface (NC-SI) PCIe NIC that supports NC-SI.
Feature  Supports the enablement/disablement and configuration of Virtual
Local Area Network (VLAN). VLAN is disabled by default.
 Supports IPv6 and IPv4 addresses. IP address, subnet mask, default
gateway, and prefix length of IPv6 address can be configured.

Unified
The industry-standard UEFI improves the efficiency of setup,
Extensible
configuration and update, and simplifies the error handling
Firmware
process.
Interface (UEFI)
Trusted Platform Module (TPM) 2.0 and Trusted Cryptography
TPM & TCM
Module (TCM) provide advanced encryption.
AMD Secure Processor (ASP), a microcontroller within the AMD
AMD Secure
processor that provides enhanced security through
Processor
hardware-based resistance to malicious software attacks.
AMD Secure Encrypted Virtualization (SEV) allows applications
AMD SEV to run in isolated space, helping prevent malicious theft and
modification of critical codes and data.
Firmware
The firmware update mechanism based on digital signatures
Update
prevents unauthorized firmware updates.
Mechanism
UEFI Secure Boot Protects the system from malicious bootloaders.
Hierarchical
Password
Ensures system boot and management security.
Protection in
BIOS
BIOS Secure
Flash and BIOS Reduces attacks from malicious software on the BIOS flash
Lock Enable region.
(BLE)

4
 Technical
Description
Feature
Dual-image
Mechanism for Recovers firmware upon detection of corrupted firmware.
BMC and BIOS
BMC Secure Boot Protects BMC from malicious tampering.
BMC Access Flexible BMC access control policies improve BMC
Control Policies management security.
Chassis
Intrusion Enhances physical security.
Detection

2.4 Energy Efficiency

Table 2-4 Energy Efficiency

Technical Feature Description

80 Plus Equipped with 80 Plus Platinum/Titanium power supply
Platinum/Titanium units (PSUs) (550 W to 2,000 W), with power efficiency up to
PSUs 94% at a load of 50%.
1+1 Redundant Supports AC/DC power input for improved power
Power Supplies conversion efficiency.
Features the high-efficiency single-board voltage regulator
VRD Power Supply
down (VRD) solution, reducing DC-DC conversion loss.
Intelligent Fan
Supports Proportional-Integral-Derivative (PID) intelligent
Speed PID Control
fan speed control and intelligent CPU frequency scaling,
and CPU
conserving energy.
Frequency Scaling
Offers a fully-optimized system cooling design with energy-
System Cooling
efficient cooling fans, lowering energy consumption from
Design
system cooling.
Power Capping
Provides power capping and power control measures.
and Power Control
Staggered Spin- Supports staggered spin-up of drives, reducing power
up of Drives consumption during startup.
Low Energy The power consumption of an SSD is 80% lower than that of
Consumption a traditional HDD.

5
3 System Parts Breakdown
Figure 3-1 Exploded View

Item Feature Item Feature

1 2.5-Inch Drive Module 11 PSU

PCIe Riser Module (with the
2 2.5-Inch Drive Backplane 12
butterfly cage)
PCIe Riser Module (with an
3 3.5-Inch Drive Module 13
LP card)
PCIe Riser Module (with an
4 3.5-Inch Drive Backplane 14
FH card)
5 M.2 SSD Module 15 Super-Capacitor

6 Fan Backplane 16 OCP 3.0 Card

7 Fan Module 17 DC-SCM Board

8 Reinforcement Crossbar 18 Motherboard

9 Top Cover 19 CPU
10 Chassis 20 Heatsink

6
4 System Logical Diagram
Figure 4-1 System Logical Diagram

MCIO x8

MCIO x8

MCIO x8

MCIO x8
SATA/PCIe5.0 x8

SATA/PCIe5.0 x8

PCIe5.0 x8

PCIe5.0 x8

PCIe5.0 x8

PCIe5.0 x8

PCIe5.0 x8

PCIe5.0 x8
DDR5 DIMM x24

CH-F CH-E CH-D CH-C CH-B CH-A U1

x8 x8 x8 x8 x8 x8 x8 x8
G3 G2 G1 G0
0 1 2 3 4 5
DIMM1
DIMM0
DIMM1
DIMM0
DIMM1
DIMM0
DIMM1
DIMM0

DIMM1
DIMM0

DIMM1
DIMM0

PCIe5.0 x16

8
x
UMC

MCIO x16

P3
8
x
PCIe5.0 x16
8
x
MCIO x16
P2
8
x
CH-L CH-K CH-J CH-I CH-H CH-G PCIe5.0 x8

Genoa
8
x
P1

Connector
PCIe5.0 x8

OCP3.0

OCP3.0
MCIO x8
8
x
6 7 8 9

SATA/PCIe5.0 x8
MCIO x8

CPU0
x8 x8
DIMM1
DIMM0

DIMM1
DIMM0
DIMM1
DIMM0
DIMM1
DIMM0

DIMM1
DIMM0
DIMM1
DIMM0

P0

SATA/PCIe5.0 x8 MCIO x8
UMC 1 1

P5/WAFL
0 1

UART J25
UART0 COM 内置M.2

R/A MCIO x8
SPI
SPI

Cable to
USB3.1
TF Card

CPU
USB10 PCIE Gen2 x1
P5[3]
APML APML
Internal USB3.1 USB01
80PORT
eSPI
USB3.1 eSPI

U4 PWM TACH GPIO

USB11 P4[0] USB00

USB3.1 CPLD SGPIO

USB3.1 U19 NCSI Conn to OCP1

ISO
eSPI I2C
USB 3.0 HUB 0
U122 NCSI Conn to OCP0
NCSI Connector to

ISO
USB2. USB2.
USB 3.0 HUB 1 0 0 SmartNIC
J56
OCP0
USB2.
0 FP VGA
Smart NIC

J86 TPM/
USB3.1 TPCM
Buffer
USB2.0 BIOS BIOS
Flash Flash REAR VGA
FRONT 0 1
J6 Buffer
MUX

USB 3.0
USB 2.0 USB3.1
Front Left Panel USB3.1 BMC BMC
USB2.0
REAR Flash Flash
USB 3.0 0 1
USB 3.0

U4 FWSPI I2C10 NCSI VGA USB2.0B

U5 UART SGPIO
SGPIO SGPIO
SPI1
UART1 UART1
PCIe UART
UART3 UART3
I2C3/I3C
5 UART4 UART4
eSPI
UART5 UART5 U9
USB2.0A
WDT WDT

DDR4 RGMII GPIO

RTL8211
DRAM
PHY

J1
TF Card

DC-SCM
RJ45 Micro USB

 The 4th Gen AMD EPYC processor (Genoa), with a TDP up to 400 W.

 Up to 24 DDR5 DIMMs.

 Supports 2 PCIe 5.0 MCIO x16 connectors, 11 PCIe 5.0 MCIO x8 connectors, and
2 OCP 3.0 connectors (one of which is onboard).

 CPU PCIe P0/G3 can be directly connected to the motherboard through SATA
protocol; the motherboard supports up to 32 SATA connectors, with a
maximum speed of 6 Gbps (SATA 3.0).

 The motherboard has the ability to expand add-in high-performance graphics

cards; the DC-SCM board integrates a 2D graphics controller with 16 MB of
video memory, and the maximum resolution of the display controller on the
DC-SCM board is 1,920 × 1,200 32 bpp at 60 Hz.

7
 The PCIe RAID card is connected to CPU0 via the PCIe bus, and is connected to
the drive backplane via the SAS signal cable. Multiple local storage
configurations are supported through different drive backplanes.

8
5 Hardware Description
5.1 Front Panel
5.1.1 4 × 2.5-Inch Drive + 4 × 3.5-Inch Drive
Configuration

IMPORTANT
A 3.5-inch drive tray can accommodate a 2.5-inch drive.

Figure 5-1 Front View

Item Feature Item Feature

1 2.5-Inch Drive Bay 5 USB 3.0 Port

2 Power Button and LED 6 VGA Port

UID/BMC RST Button and
3 7 Ear Latch
LED
4 LEDs 8 3.5-Inch Drive Bay

5.1.2 10 × 2.5-Inch Drive Configuration

Figure 5-2 Front View

9
 Item Feature Item Feature

1 Serial Label Pull Tag 5 USB 2.0 Port

UID/BMC RST Button and
2 6 LEDs
LED
3 Power Button and LED 7 2.5-Inch Drive Bay
4 Ear Latch 8 -

5.2 Rear Panel

5.2.1 2 × PCIe Card Configuration
Figure 5-3 Rear View

Item Feature Item Feature

1 PCIe Slot 0 8 BMC Management Network Port
2 PCIe Slot 1 9 USB 3.0 Port
3 PSU0 10 VGA Port
System/BMC Serial Port (Micro
4 PSU1 11
USB)
5 PSU LED 12 UID/BMC RST Button and LED
6 OCP 3.0 Card 1 13 OCP 3.0 Card 0
OCP 3.0 Card 1 Hot-Plug Button OCP 3.0 Card 0 Hot-Plug Button
7 14
and LED and LED

10
5.2.2 3 × PCIe Card Configuration
Figure 5-4 Rear View

Item Feature Item Feature

1 PCIe Slot 0 9 BMC Management Network Port
2 PCIe Slot 1 10 USB 3.0 Port
3 PCIe Slot 2 11 VGA Port
System/BMC Serial Port (Micro
4 PSU0 12
USB)
5 PSU1 13 UID/BMC RST Button and LED
6 PSU LED 14 OCP 3.0 Card 0
OCP 3.0 Card 0 Hot-Plug Button
7 OCP 3.0 Card 1 15
and LED
OCP 3.0 Card 1 Hot-Plug Button
8 - -
and LED

5.3 LEDs and Buttons

Table 5-1 LED and Button Description

Icon Feature Description

 Power LED:
- Off = No power
- Solid green = Power-on state
- Solid orange = Standby state

Power Button and  Power button:

LED - Press and release the button to
power on the system from the
standby state
- Press and hold the button for 6
seconds to force a shutdown from
the power-on state

11
Icon Feature Description

 Off = Normal
 Blinking red (1 Hz) = A warning error is
detected on CPU, memory, power
System Status LED supply, drive, fan, etc.
 Solid red = A critical error is detected
on CPU, memory, power supply, drive,
fan, etc.

 Off = Normal
 Blinking red (1 Hz) = A warning error
Memory Status LED
occurs
 Solid red = A critical error occurs

 Off = Normal
 Blinking red (1 Hz) = A warning error
Fan Status LED occurs
 Solid red = A critical error occurs,
including fan failure and fan absence

 Off = Normal
 Blinking red (1 Hz) = A warning error
Power Status LED
occurs
 Solid red = A critical error occurs

 Off = Normal
 Blinking red (1 Hz) = A warning error
occurs, including Proc Hot, resulting in
System Overheat LED CPU throttling
 Solid red = A critical error occurs,
including CPU Thermal Trip/PCH
Hot/MEM hot, etc.

 Off = No network connection

 Blinking green = Network connected
with data being transmitted
Network Status LED  Solid green = Network connected
without data being transmitted
Note: It only indicates the status of the self-developed
OCP card.

 Solid blue = The UID LED is activated by

UID/BMC RST Button the UID button or via the BMC
and LED

12
 Icon Feature Description
 Press and hold the button for 6
seconds to force the BMC to reset

 OCP 3.0 card hot-plug LED:

- Off = OCP card is powered off
- Blinking green = OCP card is getting
ready for hot-plugging or OCP card
is being identified after being
inserted
- Solid green = OCP card is powered
OCP 3.0 Card Hot- on
-
Plug Button and LED  OCP 3.0 card hot-plug button:
- With the LED solid on, press and
release the button to power off the
OCP card.
- With the LED off and the OCP 3.0
card installed, press and release
the button to power on the OCP
card.

5.4 Port Description

Table 5-2 Port Description

Feature Description
VGA Port Enables you to connect a display terminal
USB 3.0 Port Enables you to connect a USB 3.0/2.0 device
USB 2.0 Port Enables you to connect a USB 2.0 device
 Enables you to debug and monitor the BMC
System/BMC Serial Port
 Enables you to debug and monitor the system
Enables you to manage the server
BMC Management Note:
Network Port It is a Gigabit Ethernet port that supports 100/1,000 Mbps auto-
negotiation.

OCP Network Port Enables you to connect the system to the network

13
5.5 Processor
 The server supports 1 processor.

 For specific processor options, consult your local sales representative or refer
to 7.2 Hardware Compatibility.

Figure 5-5 Processor Location

CPU 0

5.6 Memory
5.6.1 DDR5 DIMMs
1. Identification
To determine DIMM characteristics, refer to the label attached to the DIMM and the
following figure and table.

14
Figure 5-6 DIMM Identification

Item Description Example

 16 GB
 32 GB
1 Capacity  64 GB
 128 GB
 256 GB

 1R = Single rank
 2R = Dual rank
 2S2R = Two ranks of two high
2 Rank(s) stacked 3DS DRAM
 2S4R = Four ranks of two high
stacked 3DS DRAM
 4R = Quad rank

 x4 = 4 bits
3 Data width of DRAM
 x8 = 8 bits
4 DIMM slot type PC5 = DDR5
 4,800 MT/s
5 Maximum memory speed
 5,600 MT/s

 SDP 4800B = 40-39-39

 3DS 4800B = 46-39-39
6 CAS latency
 SDP 5600B = 46-45-45
 3DS 5600B = 52-45-45
7 DIMM type R = RDIMM

2. Memory Subsystem Architecture

The server supports 24 DIMM slots.

15
Within a channel, populate the DIMM slot with its silk screen ending with D1 first.
For instance, within CPU0 Channel A, populate CPU0_CAD1 first. To install DIMMs,
refer to the recommended DIMM population rules.

Table 5-3 DIMM Slot List

CPU Channel ID Silk Screen

CPU0_CAD0
Channel A
CPU0_CAD1
CPU0_CBD0
Channel B
CPU0_CBD1
CPU0_CCD0
Channel C
CPU0_CCD1
CPU0_CDD0
Channel D
CPU0_CDD1
CPU0_CED0
Channel E
CPU0_CED1
CPU0_CFD0
Channel F
CPU0_CFD1
CPU0
CPU0_CGD0
Channel G
CPU0_CGD1
CPU0_CHD0
Channel H
CPU0_CHD1
CPU0_CID0
Channel I
CPU0_CID1
CPU0_CJD0
Channel J
CPU0_CJD1
CPU0_CKD0
Channel K
CPU0_CKD1
CPU0_CLD0
Channel L
CPU0_CLD1

3. Compatibility
Refer to the following rules to configure the DDR5 DIMMs.

IMPORTANT

 A server must use DDR5 DIMMs bearing the same part number (P/N code).
All DDR5 DIMMs operate at the same speed, which is the lowest of:
- Memory speed supported by a specific CPU.
- Maximum operating speed of a specific memory configuration.

16
  Mixing DDR5 DIMM specifications (capacity, bit width, rank, height, etc.) is
not supported.
For specific memory options, consult your local sales representative or refer to
7.2 Hardware Compatibility.

 DDR5 DIMMs can be used with AMD EPYC processors (Genoa). The maximum
memory capacity supported is identical for different CPU models.

 The total memory capacity is the sum of the capacities of all DDR5 DIMMs.

NOTE
Maximum number of DIMMs supported per channel ≤ Maximum number of ranks
supported per channel ÷ Number of ranks per DIMM.

Table 5-4 DDR5 DIMM Specifications

Item Value
Capacity per DDR5
16 32 64 128
DIMM (GB)
Type RDIMM RDIMM RDIMM RDIMM
Rated speed (MT/s) 4,800 4,800 4,800 4,800
Operating voltage (V) 1.1 1.1 1.1 1.1
Maximum number of
DDR5 DIMMs 24 24 24 24
supported in a server 1

Maximum capacity of
DDR5 DIMMs
384 768 1,536 3,072
supported in a server
(GB)2
Actual 1DPC3 4,800 4,800 4,800 4,800
speed
2DPC 3,600 3,600 3,600 3,600
(MT/s)
Notes:
1. The maximum number of DDR5 DIMMs supported is based on 2DPC. The number is halved for 1
DPC.
2. It indicates the maximum memory capacity supported when all the DIMM slots are populated with
DDR5 DIMMs.
3. DIMM Per Channel (DPC) is the number of DIMMs per memory channel.
The above information is for reference only. Consult your local sales representative for details.

17
4. DIMM Population Rules
General population rules for DDR5 DIMMs:

 Install DIMMs only when the corresponding processor has been installed.

 Install dummies in the empty DIMM slots.

Population rules for DDR5 DIMMs in specific modes:

 Memory patrol scrubbing mode

- Follow the general population rules.

5. DIMM Slot Layout

Up to 24 DDR5 DIMMs can be installed in a server, and a balanced DIMM
configuration is recommended for optimal memory performance. DIMM
configuration must be compliant with the DIMM population rules.

Figure5-7 DIMM Slot Layout

Table 5-5 DDR5 DIMM Population Rules

DDR CPU0
QTY CAD0 CAD1 CBD0 CBD1 CCD0 CCD1 CDD0 CDD1 CED0 CED1 CFD0 CFD1 CGD0 CGD1 CHD0 CHD1 CID0 CID1 CJD0 CJD1 CKD0 CKD1 CLD0 CLD1
1 ●
2 ● ●
4 ● ● ● ●
6 ● ● ● ● ● ●
8 ● ● ● ● ● ● ● ●
10 ● ● ● ● ● ● ● ● ● ●
12 ● ● ● ● ● ● ● ● ● ● ● ●
16 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●
20 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●
24 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●

18
5.7 Storage
5.7.1 Drive Configurations

NOTE
For the physical drive No. of each configuration, refer to 5.7.2 Drive Numbering.

Table 5-6 Drive Configurations

Drive
Configuration Front Drives Internal Drives Management
Mode
4 × 2.5-/3.5- 4 × 2.5-/3.5-inch drive M.2 SSD:  SAS/SATA
Inch Drive + 4 × + 4 × 2.5-inch drive: Configured drive:
2.5-Inch Drive Drive bays with through the SAS/RAID
Config. physical drive No. 0 to internal M.2 card or
7 support adapter that directly
SAS/SATA/NVMe supports two connected to
drives only SATA/PCIe M.2 the CPU
SSDs  NVMe drive:
directly
connected to
the CPU
 Internal M.2
SSD: directly
connected to
the CPU
10 × 2.5-Inch 10 × 2.5-inch drive: M.2 SSD:  SAS/SATA
Drive Config. Drive bays with Configured drive:
physical drive No. 0 to through the SAS/RAID
9 support internal M.2 card or
SAS/SATA/NVMe adapter that directly
drives only supports two connected to
SATA/PCIe M.2 the CPU
SSDs  NVMe drive:
directly
connected to
the CPU
 Internal M.2
SSD: directly
connected to
the CPU

19
 Drive
Configuration Front Drives Internal Drives Management
Mode
8 × 2.5-Inch 8 × 2.5-inch drive: M.2 SSD:  SAS/SATA
Drive + 2 × PCIe Drive bays with Configured drive:
Card Config. physical drive No. 0 to through the SAS/RAID
7 support internal M.2 cards or
SAS/SATA/NVMe adapter that directly
drives only supports two connected to
SATA/PCIe M.2 the CPU
SSDs  NVMe drive:
directly
connected to
the CPU
 Internal M.2
SSD: directly
connected to
the CPU

5.7.2 Drive Numbering

1. 4 × 2.5-Inch SAS/SATA/NVMe Drive + 4 × 3.5-Inch
SAS/SATA/NVMe Drive
Figure 5-8 Drive Numbering

Drive No.
Drive No.
Physical Identified by
Configuration Identified by Front/Rear
Drive No. the 8i RAID
the BMC
Card
8 × SAS/SATA 0 to 7 0 to 7 Front 0 to 7
8 × NVMe 0 to 7 0 to 7 Front -

2. 10 × 2.5-Inch SAS/SATA/NVMe Drive Configuration

Figure 5-9 Drive Numbering

20
 Drive No.
Drive No.
Physical Identified by
Configuration Identified by Front/Rear
Drive No. the 16i RAID
the BMC
Card
10 × SAS/SATA 0 to 9 0 to 9 Front 0 to 9
10 × NVMe 0 to 9 0 to 9 Front -

5.7.3 Drive LEDs

1. SAS/SATA Drive LEDs
Figure5-10 SAS/SATA Drive LEDs

Activity LED
Locator/Error LED (②)
(①) Description

Green Blue Red

RAID RAID not
created created
Off Off Drive absent
Solid
Off
on
Drive present but not in
Solid on Off Off
use
Blinking Off Off Drive present and in use
Copyback/Rebuild in
Blinking Solid pink
progress
Drive selected but not in
Solid on Solid on Off
use
Drive selected and in
Blinking Solid on Off
use
Drive is selected but
Off Solid on Off
fails
Any status Off Solid on Drive fails

21
 2. NVMe Drive LEDs
Figure 5-11 NVMe Drive LEDs

The NVMe drives support surprise hot swap.

Table 5-7 NVMe Drive LED Description

Activity LED (①) Locator/Error LED (②)

Description
Green Blue Red
Off Off Off Drive absent
Drive present but not in
Solid on Off Off
use
Blinking Off Off Drive present and in use
Copyback/Rebuild/Initi
Blinking Solid pink alizing/Verifying in
progress
Drive selected but not in
Solid on Solid on Off
use
Drive selected and in
Blinking Solid on Off
use
Drive is selected but
Off Solid on Off
fails
Any status Off Solid on Drive fails

5.7.4 RAID Cards

The RAID card provides functions such as RAID configuration, RAID level migration,
and drive roaming.

For specific RAID card options, consult your local sales representative or refer to 7.2
Hardware Compatibility.

5.8 Network
NICs provide network expansion capabilities.

 The OCP slots support OCP 3.0 cards. Users can select the OCP 3.0 cards as
needed.

22
  The PCIe expansion slots support PCIe NICs. Users can select the PCIe NICs as
needed.

 For specific NIC options, consult your local sales representative or refer to 7.2
Hardware Compatibility.

5.9 I/O Expansion

5.9.1 PCIe Expansion Cards
The PCIe expansion cards provide system expansion capabilities.

 The rear panel supports up to 3 PCIe expansion slots and 2 dedicated slots for
OCP 3.0 cards.

 For specific PCIe expansion card options, consult your local sales
representative or refer to 7.2 Hardware Compatibility.

5.9.2 PCIe Slot Locations

Figure 5-12 PCIe Slot Locations - 2 × PCIe Card Configuration

PCIe Riser Module 0 PCIe Riser Module 1

 Slot 0 resides in PCIe riser module 0.

 Slot 1 resides in PCIe riser module 1.

Figure 5-13 PCIe Slot Locations - 3 × PCIe Card Configuration

PCIe Riser Module 2 PCIe Riser Module 3

 Slot 0 and slot 1 reside in PCIe riser module 2.

 Slot 2 resides in PCIe riser module 3.

23
5.9.3 PCIe Riser Modules
Figure 5-14 PCIe Riser Module 0/1 (One PCIe x16 Slot)

Slot0/Slot1

Figure 5-15 PCIe Riser Module 2 (Two PCIe x16 Slots)

Slot0

Slot1

Figure 5-16 PCIe Riser Module 3 (One PCIe x16 Slot)

Slot2

24
5.9.4 PCIe Slot Description
Table 5-8 PCIe Slot Description - 2 × PCIe Card Configuration

PCIe Connector Bus Port Form

PCIe Slot Owner
Standard Width Width No. Factor
PCIe
Slot 0 CPU0 x16 x16 P3 FHHL
4.0/5.0
PCIe
Slot 1 CPU0 x16 x16 P2 FHHL
4.0/5.0
OCP 3.0 PCIe SFF OCP
CPU0 x16 x8/x16 G2
Slot 4.0/5.0 3.0
OCP 3.0 PCIe SFF OCP
CPU0 x16 x8/x16 P1
Slot 4.0/5.0 3.0

Table 5-9 PCIe Slot Description - 3 × PCIe Card Configuration

PCIe Connector Bus Port Form

PCIe Slot Owner
Standard Width Width No. Factor
PCIe
Slot 0 CPU0 x16 x16 P3 FHHL
4.0/5.0
PCIe
Slot 1 CPU0 x16 x16 G1 HHHL
4.0/5.0
PCIe
Slot 2 CPU0 x16 x16 G0 HHHL
4.0/5.0
OCP 3.0 PCIe SFF OCP
CPU0 x16 x8/x16 G2
Slot 4.0/5.0 3.0
OCP 3.0 PCIe SFF OCP
CPU0 x16 x8/x16 P1
Slot 4.0/5.0 3.0

5.10 PSUs
 The server supports 1 or 2 PSUs.

 The server supports AC or DC power input.

 The PSUs are hot-swappable.

 When 2 PSUs are configured, the PSUs are 1+1 redundant.

 The server must use PSUs bearing the same part number (P/N code).

 The PSUs feature short-circuit protection.

25
 Figure 5-17 PSU Locations

PSU0 PSU1

5.11 Fan Modules

 The server supports 8 fan modules. Users can select high-performance or low-
performance 4056 fans based on the configuration.

 The fan modules are hot-swappable.

 The server supports fans in N+1 redundancy, which means that the server can
continue working properly when a single fan fails.

 The server supports intelligent fan speed control.

 The server must use fan modules bearing the same part number (P/N code).

Figure 5-18 Fan Module Locations

26
5.12 Boards
5.12.1 Motherboard
Figure 5-19 Motherboard Layout

Item Feature Item Feature

1 Riser Power Connector 26 Drive BP I2C Connector

OCP 3.0 Card 0 Hot-Plug

2 27 GPU Riser Power Connector
Button and LED Connector

3 MCIO x16 Connector 28 Drive Riser I2C Connector

4 Smart NIC Power Connector 29 GPU Riser Power Connector

5 NMI Connector 30 GPU Riser Power Connector

6 Button Cell Battery Socket 31 GPU Power Connector

7 Smart NIC UART Connector 32 Riser I2C Connector

27
 Item Feature Item Feature

M.2 Riser Sideband

8 33 Leak Detection Connector
Connector

9 CMOS Jumper 34 Mid-Drive Power Connector

10 VPP Connector 35 Drive BP I2C Connector

Capacitor Board Power

11 USB 3.0 Port 36
Connector

12 Drive BP I2C Connector 37 PSU1 Connector

Right Control Panel

13 38 GPU Power Connector
Connector

OCP 3.0 Card 0 Power

14 39 GPU Power Connector
Connector

15 Drive BP I2C Connector 4 40 PSU0 Connector

16 MCIO x8 Connector 41 GPU Power Connector

Inlet Temperature Sensor

17 42 MCIO x8 Connector
Connector

Intrusion Detection
18 43 Riser Power Connector
Connector

Intrusion Detection OCP 3.0 Card 1 Expansion

19 44
Connector Connector

20 MCIO x8 Connector 45 OCP 3.0 Card 1 Connector

21 Left Control Panel Connector 46 IPMB Connector

Front Drive BP Power OCP 3.0 Card 1 Hot-Plug Button

22 47
Connector and LED Connector

23 Drive BP SGPIO Connector 48 NC-SI Connector

Front Drive BP Power

24 49 OCP 3.0 Card 0 NC-SI Connector
Connector

25 Drive BP I2C Connector 0 50 DC-SCM Connector

5.12.2 Drive Backplanes

1. Front Drive Backplanes
 4 × 2.5-Inch SAS/SATA/NVMe Drive + 4 × 3.5-Inch SAS/SATA/NVMe Drive
Configuration

28
Figure 5-20 4 × 2.5-Inch SAS/SATA/NVMe Drive Backplane

Item Feature Item Feature

1 MCIO x8 Connector 5 Power Connector 1

2 VPP Connector 6 BMC_I2C Connector

3 Power Connector 0 7 Drive Connector

4 Slimline x4 Connector - -

Figure 5-21 4 × 3.5-Inch SAS/SATA/NVMe Drive Backplane

Item Feature Item Feature

1 VPP Connector 4 Power Connector

2 Slimline x4 Connector 5 BMC_I2C Connector

3 MCIO x8 Connector 6 CPLD JTAG Connector

Figure 5-22 4 × 3.5-Inch SAS/SATA Drive Backplane

Item Feature Item Feature

1 Power Connector 3 BMC_I2C Connector

2 SGPIO Connector 4 SATA 7-Pin Connector

29
 10 × 2.5-Inch SAS/SATA/NVMe Drive Configuration

Figure 5-23 8 × 2.5-Inch SAS/SATA/NVMe Drive Backplane

Item Feature Item Feature

1 Power Connector 5 BMC_I2C Connector

2 Slimline x4 Connector 6 VPP Connector

3 CPLD JTAG Connector 7 MCIO x8 Connector

4 Slimline x4 Connector - -

Figure 5-24 8 × 2.5-Inch SAS/SATA Drive Backplane

Item Feature Item Feature

1 Slimline x4 Connector 3 Power Connector

2 BMC_I2C Connector - -

30
Figure 5-25 2 × 2.5-Inch SAS/SATA Drive Backplane

Item Feature Item Feature

1 CPLD JTAG Connector 3 Slimline x4 Connector

2 BMC_I2C Connector 4 Power Connector

Figure 5-26 2 × 2.5-Inch NVMe Drive Backplane

Item Feature Item Feature

1 BMC_I2C Connector 4 MCIO x8 Connector

2 SGPIO Connector 5 Power Connector
3 CPLD JTAG Connector - -

31
6 Product Specifications
6.1 Technical Specifications
Table 6-1 Technical Specifications

Item Description
Form Factor 1U rack server
Supports 1 processor.
 4th Gen AMD EPYC processor (Genoa)
 Integrated memory controllers and 12 memory channels
per processor
 Integrated PCIe 5.0 controllers and 128 PCIe lanes per
processor
Processor
 Up to 128 cores
 Max boost frequency of 4.40 GHz
 L3 cache up to 384 MB
 TDP up to 400 W
Note: The information above is for reference only. See 7.2 Hardware
Compatibility for details.

Supports up to 24 DDR5 DIMMs.

 RDIMMs supported
 Up to 4,800 MT/s at 1 DPC and 3,600 MT/s at 2 DPC
 Mixing DDR5 DIMM types or mixing DDR5 DIMM

Memory specifications (capacity, bit width, rank, height, etc.) is not

supported.
 A server must use DDR5 DIMMs bearing the same part
number (P/N code).
Note: The information above is for reference only. See 7.2 Hardware
Compatibility for details.

Supports multiple drive configurations. For detailed

information, refer to 5.7.1 Drive Configurations.
 Front (one of the following):

Storage - Up to 4 × 3.5-inch hot-swap SAS/SATA/NVMe drive + 4

× 2.5-inch hot-swap SAS/SATA/NVMe drive
- Up to 10 × 2.5-inch hot-swap SAS/SATA/NVMe drive
 Internal:

32
Item Description
- 2 × SATA/PCIe M.2 SSD

 Up to two 1/10/25/40/100/200 Gb hot-plug OCP 3.0 cards

 Standard 1/10/25/40/100/200 Gb PCIe NICs
Network
 1 BMC management network port of 100/1,000 Mbps
auto-negotiation

 Up to 3 PCIe expansion cards

- 2 × HHHL PCIe x16 card

I/O Expansion - 1 × FHHL PCIe x16 card

 Up to 2 OCP 3.0 cards

For details, see 5.9.2 PCIe Slot Locations and 5.9.4 PCIe Slot Description.

Supports multiple ports.

 Front:
- 1 × USB 3.0 port or 1 × USB 2.0 port

- 1 × VGA port
 Rear:
Port - 2 × USB 3.0 port
- 1 × VGA port
- 1 × system/BMC serial port (Micro USB)
- 1 × BMC management network port
Note:
OS installation on the USB storage media is not recommended.

Integrated VGA on the DC-SCM board with a video memory of

64 MB and a maximum 16M color resolution of 1,920 × 1,200 at
60 Hz
Notes:
Display  The integrated VGA can support a maximum resolution of 1,920 × 1,200
only when the video driver matching the OS version is installed;
otherwise, only the default resolution of the OS is supported.
 When both the front and rear VGA ports are connected to monitors, only
the monitor connected to the front VGA port works.

 UEFI

System  BMC
Management  NC-SI
 KSManage

 Trusted Platform Module (TPM) 2.0 and Trusted

Security Cryptography Module (TCM)
 ASP

33
 Item Description
 AMD SEV
 Firmware update mechanism based on digital signatures
 UEFI Secure Boot
 Hierarchical BIOS password protection
 BIOS Secure Flash and BIOS Lock Enable (BLE)
 BMC and BIOS dual-image mechanism
 Chassis intrusion detection

6.2 Environmental Specifications

Table 6-2 Environmental Specifications

Parameter Description

 Operating: 10°C to 35°C (50°F to 95°F)

 Storage (packed): -40°C to +70°C (-40°F to +158°F)
Temperature1
 Storage (unpacked): -40°C to +70°C (-40°F to
+158°F)

 Operating: 5% to 90% RH
Relative Humidity (RH,
 Storage (packed): 5% to 95% RH
non-condensing)
 Storage (unpacked): 5% to 95% RH
Operating: 0 to 3,050 m (0 to 10,007 ft)
Altitude
Shipping (storage): 0 to 12,000 m (0 to 39,370 ft)
Maximum growth rate of corrosion film thickness:
 Copper coupon: 300 Å/month (compliant with
the gaseous corrosivity level of G1 defined in
Corrosive Gaseous
ANSI/ISA-71.04-2013)
Contaminants
 Silver coupon: 200 Å/month (compliant with the
gaseous corrosivity level of G1 defined in
ANSI/ISA-71.04-2013)
Noise emissions are measured in accordance with ISO
7779 (ECMA 74) and declared in accordance with ISO
9296 (ECMA 109). Listed are the declared A-weighted
sound power levels (LWAd) and the declared average
Acoustic Noise2,3,4,5 bystander position A-weighted sound pressure levels
(LpAm) at a server operating temperature of 23°C
(73°F):
 Idle:

34
 Parameter Description

- LWAd: 6.4 Bels for standard configuration

- LpAm: 49.0 dBA for standard configuration

 Operating:
- LWAd: 6.9 Bels for standard configuration
- LpAm: 53.5 dBA for standard configuration

Notes:

1. Standard operating temperature

- 10°C to 35°C (50°F to 95°F) is the standard operating temperature range at sea level. From sea
level to an altitude of 3,050 m (10,007 ft), derate the maximum allowable operating temperature
by 1°C per 305 m (1°F per 556 ft). No direct sustained sunlight is permitted. The maximum
temperature gradient is 20°C/h (36°F/h) and the maximum operating altitude is 3,050 m (10,007
ft), both varying with server configuration.

- Any fan failure or operations above 30°C (86°F) may lead to system performance degradation.

2. This document lists the LWAd and LpAm of the product at a 23°C (73.4°F) ambient environment. All
measurements are conducted in conformance with ISO 7779 (ECMA 74) and declared in conformance
with ISO 9296 (ECMA 109). The listed sound levels apply to the standard configuration. Additional
options may result in increased sound levels. Contact your sales representative for more information.

3. The sound levels shown here were measured based on specific configurations of a server. Sound
levels vary by server configuration. These values are for reference only and subject to change without
notice.

4. Product conformance to cited normative standards is based on sample testing, evaluation, or

assessment. This product or family of products is eligible to bear the appropriate compliance logos and
statements.

5. The listed sound levels apply to the standard configuration. Additional options may result in
increased noise.

6.3 Physical Specifications

Table 6-3 Physical Specifications

Item Description
Outer Packaging
1,090 × 600 × 240 mm (42.91 × 23.62 × 9.45 in.)
Dimensions (L × W × H)
 Installation requirements for the cabinet are as
follows:

- General cabinet compliant with the

Installation Dimension
International Electrotechnical Commission 297
Requirements
(IEC 297) standard
- Width: 482.6 mm (19 in.)
- Depth: Above 1,100 mm (43.31 in.)

35
Item Description

 Installation requirements for the server rails are as

follows:
- L-bracket rails: applicable to our cabinets only
(requires at least a 1U gap during installation)
- Static rail kit: Distance between the front and
rear mounting flanges ranges from 609 to 914
mm (23.98 to 35.98 in.)
- Ball-bearing rail kit: Distance between the front
and rear mounting flanges ranges from 609 to
914 mm (23.98 to 35.98 in.)

 10 × 2.5-inch drive configuration

- Net weight: 19.59 kg (43.19 lbs)

- Gross weight: 29.27 kg (64.53 lbs) (including
server, packaging box, rails and accessory box)

Weight  4 × 2.5-inch drive + 4 × 3.5-inch drive configuration

- Net weight: 20.33 kg (44.82 lbs)
- Gross weight: 29.27 kg (64.53 lbs) (including
server, packaging box, rails and accessory box)
Note:
The weight of a server varies by the server configurations.

36
Figure 6-1 Chassis Dimensions

Zc

Zb
Za

Xa Xb

Ya

Model Za Zb Zc Xa Xb Ya
KR1180-
850 mm 879 mm 30 mm 482 mm 431 mm 43.05 mm
E2-A0-R0-
(33.46 in.) (34.61 in.) (1.18 in.) (18.98 in.) (16.97 in.) (1.69 in.)
00

37
7 Operating System and Hardware
Compatibility
This section describes the OS and hardware compatibility of the server. For the
latest compatibility configuration and the component models not listed in this
document, contact your local sales representative.

IMPORTANT
 Using incompatible components may cause the server to work abnormally,
and such failures are not covered by technical support or warranty.
 The hardware compatibility of different models may vary slightly. Contact
your sales representatives to confirm the detailed hardware configurations
during the pre-sales phase.
 The server performance is strongly influenced by application software,
middleware and hardware. The subtle differences in them may lead to
performance variation in the application and test software.
- For requirements on the performance of specific application software,
contact our sales representatives to confirm the detailed hardware and
software configurations during the pre-sales phase.
- For requirements on hardware performance consistency, define specific
configuration requirements (for example, specific drive models, RAID
cards, or firmware versions) during the pre-sales phase.

7.1 Supported Operating System

Table 7-1 Supported Operating Systems

OS Version
Red Hat Enterprise Linux 9.1

CentOS 8.5

Windows Server 2022

Windows Server 2019

SUSE Linux Enterprise Server 15.4

Ubuntu 20.04.5

OpenEuler 22.03

38
 OS Version
Debian 11.2

NOTE

After installing Linux OS, add iommu=pt in the OS. See the OS installation guide
on our website for details.

7.2 Hardware Compatibility

7.2.1 CPU Specifications
The server supports 1 AMD EPYC processor (Genoa).

Table 7-2 CPU Specifications

Base Max Boost

Cache Default
Model Cores Threads Frequency Frequency
(MB) TDP (W)
(GHz) (GHz)
9654P 96 192 2.4 3.7 384 360
9654 96 192 2.4 3.7 384 360
9354 32 64 3.25 3.8 256 280
9124 16 32 3.00 3.7 64 200
9554P 64 128 3.1 3.75 256 360
9754 128 256 2.4 2.5 256 360
9554 64 128 3.1 3.75 256 360
9634 84 168 2.25 3.7 384 290
9454 48 96 2.75 3.8 256 290
9454P 48 96 2.75 3.8 256 290
9534 64 128 2.45 3.7 256 280

7.2.2 DIMM Specifications

The server supports up to 24 DDR5 DIMMs. The server supports 12 memory
channels and 2 DIMM per channel. The server supports RDIMMs.

39
 Table 7-3 DIMM Specifications

Capacity
Type Rate (MT/s) Data Width Organization
(GB)
RDIMM 16 4,800 x72 1R x8
RDIMM 32 4,800 x72 2R x8
RDIMM 64 4,800 x72 2R x4

7.2.3 Drive Specifications

Table 7-4 HDD Specifications

Type RPM Capacity Max. Qty.

SAS HDD 10,000 1.2 TB 10
SAS HDD 10,000 2.4 TB 10
SAS HDD 10,000 1.8 TB 10
SAS HDD 10,000 0.6 TB 10

Table 7-5 SAS/SATA SSD Specifications

Type Capacity Max. Qty.

SATA SSD 3.84 TB 10
SATA SSD 480 GB 10
SATA SSD 960 GB 10
SATA SSD 240 GB 10

Table 7-6 U.2 NVMe SSD Specifications

Type Capacity Max. Qty.

U.2 NVMe SSD 3.84 TB 10
U.2 NVMe SSD 7.68 TB 10
U.2 NVMe SSD 1.92 TB 10
U.2 NVMe SSD 6.4 TB 10
U.2 NVMe SSD 3.2 TB 10
U.2 NVMe SSD 1.6 TB 10

Table 7-7 M.2 SSD Specifications

Type Capacity Max. Qty.

M.2 PCIe SSD 960 GB 2

40
 Type Capacity Max. Qty.
M.2 SATA SSD 240 GB 2

7.2.4 SAS/RAID Card Specifications

Table7-8 SAS/RAID Card Specifications

Type Description
SAS Card_PM8222_SmartHBA_8_SAS3_PCIE3
SAS Card
SAS Card_BRCM_8R0_9500-8i_SMSAS3_PCIE4
RAID Card_PM8204_RA_8_2GB_SAS3_PCIE3
RAID Card
RAID Card_L_8R0_9560-8i_4G_HDM12G_PCIE4

7.2.5 NIC Specifications

Table 7-9 OCP Card Specifications

Speed Port
Type Description
(Gbps) Qty.
NIC_Andes-6_X710_10G_LC_OCP3x8_2 10 2
NIC_SND_1G_I350_RJ_OCP3x4_2_XR 1 2
NIC_Andes-M6_E810_25G_LC_OCP3x8_2 25 2
NIC_I_100G_E810CQDA2_LC_OCP3x16_2_XR 100 2
OCP 3.0 Card
NIC_M_100G_MCX623436AN_LC_OCP3x16_2_XR 100 2
NIC_M_25G_MCX623432AN_LC_OCP3x16_2_XR 25 2
NIC_ I_25G_E810XXVDA2_LC_OCP3x8_2_XR 25 2
NIC_ Andes-M6_E810_25G_LC_OCP3x8_2 25 2

Table 7-10 PCIe NIC Specifications

Speed
Type Description Port Qty.
(Gbps)
NIC_I_10G_EX710DA2_LC_PCIEx8_2_XR_Lmt 10 2
NIC_I_25G_E810XXVDA2_LC_PCIEx8_2_XR 25 2
PCIe NIC NIC_M_100G_MCX623106AN_LC_PCIEx16_2_XR 100 2
NIC_M_25G_MCX631102AN_LC_PCIEx8_2_XR 25 2
NIC_ I_25G_E810XXVDA2_LC_OCP3x8_2_XR 25 2

41
7.2.6 HBA/HCA Card Specifications
Table 7-11 HBA Card Specifications

Type Description

HBA Card HBA Card_E_0R1_LPE31000-AP_FC16G_PCIE 16G_Single

Table 7-12 HCA Card Specifications

Speed
Type Description Port Qty.
(Gbps)
HCA Card HCA Card_M_1-HDR100_MCX653105A-ECAT_PCIE 100 1
HCA Card HCA Card_ M_2-HDR100_MCX653106A-ECAT_PCIE 100 2

7.2.7 PSU Specifications

The server supports up to 2 PSUs in 1+1 redundancy that follow the Intel Common
Redundant Power Supply (CRPS) specification. The PSUs share a common electrical
and structural design that allows for hot-swapping and tool-less installation into
the server with the PSUs locking automatically after being inserted into the power
bay. The CRPS PSUs are 80 Plus Platinum or Titanium rated with various output
powers, allowing customers to choose as needed.

 The following rated 110 Vac to 230 Vac PSUs in 1+1 redundancy are supported:

- 2,000 W Platinum PSU: 1,000 W (110 Vac), 2,000 W (230 Vac)

- 1,600 W Platinum PSU: 1,000 W (110 Vac), 1,600 W (230 Vac)

- 1,300 W Platinum PSU: 1,000 W (110 Vac), 1,300 W (230 Vac)

- 800 W Platinum PSU: 800 W (110 Vac), 800 W (230 Vac)

- 550 W Platinum PSU: 550 W (110 Vac), 550 W (230 Vac)

- 2,000 W Titanium PSU: 1,000W (110 Vac), 2,000W (230 Vac)

- 1,600 W Titanium PSU: 1,000W (110 Vac), 1,600W (230 Vac)

- 1,300 W Titanium PSU: 1,000W (110 Vac), 1,300W (230 Vac)

- 800 W Titanium PSU: 800W (110 Vac), 800W (230 Vac)

Note: At a rated input voltage of 110 Vac, the output power of a 1,300/1,600/2,000 W PSU will be
derated to 1,000 W.

Operating voltage range:

- 110 Vac to 230 Vac: 90 Vac to 264 Vac

42
 The following rated -48 Vdc PSUs in 1+1 redundancy are supported:

- 800 W -48 Vdc PSU: 800 W (-48 Vdc)

- 1,300 W -48 Vdc PSU: 1,300 W (-48 Vdc)

Operating voltage range:

-48 Vdc: -40 Vdc to -72 Vdc

43
8 Regulatory Information
8.1 Safety
8.1.1 General
 Strictly comply with local laws and regulations while installing the equipment.
The safety instructions in this section are only a supplement to local safety
regulations.

 To ensure personal safety and to prevent damage to the equipment, all

personnel must strictly observe the safety instructions in this section and on
the device labels.

 People performing specialized activities, such as electricians and electric

forklift operators, must possess qualifications recognized by the local
government or authorities.

8.1.2 Personal Safety

 Only personnel certified or authorized by us are allowed to perform the
installation procedures.

 Stop any operation that could cause personal injury or equipment damage.
Report to the project manager and take effective protective measures.

 Working during thunderstorms, including but not limited to handling

equipment, installing cabinets and installing power cords, is forbidden.

 Do not carry the weight over the maximum load per person allowed by local
laws or regulations. Arrange appropriate installation personnel and do not
overburden them.

 Installation personnel must wear clean work clothes, work gloves, safety
helmets and safety shoes, as shown in Figure 8-1.

44
Figure 8-1 Protective Clothing

 Before touching the equipment, put on ESD clothes and ESD gloves or an ESD
wrist strap, and remove any conductive objects such as wrist watches or metal
jewelry, as shown in Figure 8-2, in order to avoid electric shock or burns.

Figure 8-2 Removing Conductive Objects

How to put on an ESD strap (Figure 8-3).

a. Put your hand through an ESD wrist strap.

b. Tighten the strap buckle to ensure a snug fit.

c. Plug the alligator clip of the ESD wrist strap into the corresponding jack on the
grounded cabinet or grounded chassis.

45
 Figure 8-3 Wearing an ESD Wrist Strap

 Use tools correctly to avoid personal injury.

 When moving or lifting equipment above shoulder height, use lifting devices
and other tools as necessary to avoid personal injury or equipment damage
due to equipment slippage.

 The power sources of the server carry a high voltage. Direct contact or indirect
contact through damp objects with the high-voltage power source is fatal.

 To ensure personal safety, ground the server before connecting power.

 When using ladders, always have someone hold and guard the bottom of the
ladders. In order to prevent injury, never use a ladder alone.

 When connecting, testing or replacing optical fiber cable, avoid looking into
the optical port without eye protection in order to prevent eye damage from
laser light.

8.1.3 Equipment Safety

 To ensure personal safety and prevent equipment damage, use only the
power cords and cables that come with the server. Do not use them with any
other equipment.

 Before touching the equipment, put on ESD clothing and ESD gloves to prevent
static electricity from damaging the equipment.

 When moving the server, hold the bottom of the server. Do not hold the
handles of any module installed in the server, such as PSUs, fan modules,
drive modules, or motherboard. Handle the equipment with care at all times.

 Use tools correctly to avoid damage to the equipment.

 Connect the power cords of active and standby PSUs to different PDUs to
ensure high system reliability.

46
  To ensure equipment safety, always ground the equipment before powering it
on.

8.1.4 Transportation Precautions

Contact the manufacturer for precautions before transportation as improper
transportation may damage the equipment. The precautions include but not
limited to:

 Hire a trusted logistics company to move all equipment. The transportation

process must comply with international transportation standards for electronic
equipment. Always keep the equipment being transported right-side up. Avoid
collision, moisture, corrosion, packaging damage or contamination.

 Transport the equipment in its original packaging.

 If the original packaging is unavailable, separately package heavy and bulky

components (such as chassis, blade servers and blade switches), and fragile
components (such as optical modules and PCIe cards).

 Power off all equipment before shipping.

8.1.5 Manual Handling Weight Limits

CAUTION

Observe local laws or regulations regarding the manual handling weight limits
per person. The limits shown on the equipment and in the document are
recommendations only.

Table 8-1 lists the manual handling weight limits per person specified by some
organizations.

Table 8-1 Manual Handling Weight Limits per Person

Organization Weight Limit (kg/lbs)

European Committee for Standardization (CEN) 25/55.13
International Organization for Standardization
25/55.13
(ISO)
National Institute for Occupational Safety and
23/50.72
Health (NIOSH)
Health and Safety Executive (HSE) 25/55.13
General Administration of Quality Supervision,  Male: 15/33.08
Inspection and Quarantine of the People's
Republic of China (AQSIQ)  Female: 10/22.05

47
9 Limited Warranty
This limited warranty applies only to the original purchasers of our products who
are direct customers or distributors of us (“Customer”).

We warrant all our hardware products, if properly used and installed, to be free
from defects in material and workmanship within the warranty period. The term
“Hardware Product” is limited to the hardware components and required firmware.
The term “Hardware Product” DOES NOT include software applications or
programs, and DOES NOT include products or peripherals that are not supplied by
us. We may, at our discretion, repair or replace the defective parts. Repair or
replacement parts may be new, used, or equivalent to new in performance and
reliability. Repair or replacement parts are warranted to be free of defects in
material or workmanship for ninety (90) calendar days or for the remainder of the
warranty period of the product, whichever is longer.

Service offerings may vary by geographic region. Please contact your

representative to identify service levels and needs for your region.

9.1 Warranty Service

Our warranty service includes 24 × 7 remote technical support, RMA (Return
Material Authorization) Service, ARMA (Advanced Return Material Authorization)
Service, 9 × 5 × NBD (Next Business Day) Onsite Service and 24 × 7 × 4 Onsite
Service.

9.1.1 Remote Technical Support

The 24 × 7 remote technical support can be obtained through hotline, e-mail, and
Service Portal*1. Through hotline and e-mail support, our engineers help customers
diagnose the causes of malfunctions and provide solutions. Service Portal*1
provides access to firmware, customized update files, and related manuals for
Hardware Products. Customer may also access the Service Portal*1 to submit an
RMA request or an ARMA request for parts replacement or repair.

Information needed when requesting support:

 Contact name, phone number, e-mail address

 System serial number, part number, model and location (address) of the
product needing service

 Detailed description of problem, logs (SELs and blackbox logs, and any other
related logs from OS), screenshot of issue, pictures of damaged/faulty parts,
etc.

48
9.1.2 RMA Service
Standard Replacement: When a hardware failure occurs, Customer may submit an
RMA request to us via e-mail or Service Portal*1. We will review and approve the
RMA submission at our own discretion, and provide an RMA number and return
information that Customer may use to return the defective part(s) for the RMA
service. We will ship out replacement part(s) within one (1) business day after
receiving the defective part(s) and cover one-way shipment.

NOTE
 Customer should return the defective parts in original packaging to our
designated service center at their own expense.
 After our further diagnosing and testing, if the defective parts conform to
our repair policy, we will ship out the repair or replacement parts at our own
expense; otherwise, we will return the defective parts at Customer’s
expense.
 If Customer needs to designate a logistics company, allocation of the
shipping cost to us/Customer will be redefined.

9.1.3 ARMA Service

Advanced Replacement: If a problem with our hardware products cannot be
resolved via hotline or e-mail support and replacement part(s) are required, we
will ship out replacement part(s) in advance within one (1) business day. Customer
should return defective part(s) within five (5) business days after receiving the
replacement(s). The shipping cost coverage varies by region. Contact your sales
representative for details.

NOTE
 Customer should return the defective parts in original packaging to our
designated service center.
 We will ship out the replacement parts at our own expense after completing
remote diagnosis.
 If Customer needs to designate a logistics company, allocation of the
shipping cost to us/Customer will be redefined.

9.1.4 9 × 5 × NBD Onsite Service

When we ultimately determine that an onsite service call is required to repair or
replace a defect, the call will be scheduled in accordance with the Response Time

49
 Commitment. The response time is measured from the time when the remote
troubleshooting is completed and logged to the arrival of a service engineer and
parts to Customer location for repair.

NOTE

9 × 5 × NBD: Our service engineer typically arrives at the customer’s data center
on the next business day. Service engineers are available on local business day
from 9:00 am to 6:00 pm local time. Calls received/dispatches after 5:00 pm
local time will require an additional day for the service engineer to arrive.

9.1.5 24 × 7 × 4 Onsite Service

When we ultimately determine that an onsite service call is required to repair or
replace a defect, the call will be scheduled in accordance with the Response Time
Commitment. The response time is measured from the time when the remote
troubleshooting is completed and logged to the arrival of a service engineer and
parts to Customer location for repair.

NOTE
24 × 7 × 4: Our service engineer typically arrives at the customer site within 4
hours. Service engineers are available at any time, including weekends and local
national holidays.

9.2 Our Service SLA

We offer a variety of Service Level Agreements (SLA)*2 to meet customer
requirements.

 RMA Service

 ARMA Service

 9 × 5 × NBD Onsite Service

 24 × 7 × 4 Onsite Service

9.3 Warranty Exclusions

We do not guarantee that there will be no interruptions or mistakes during the use
of the products. We will not undertake any responsibility for the losses arising from
any operation not conducted according to instructions intended for Hardware

50
Products.

The Limited Warranty does not apply to

 expendable or consumable parts, such as, but not limited to, batteries or
protective coatings that are designed to diminish over time, unless failure has
occurred during DOA period due to a defect in material or workmanship;

 any cosmetic damage, such as, but not limited to, scratches, dents, broken
plastics, metal corrosion, or mechanical damage, unless failure has occurred
during DOA period due to a defect in material or workmanship;

 damage or defects caused by accident, misuse, abuse, contamination,

improper or inadequate maintenance or calibration or other external causes;

 damage or defects caused by operation beyond the parameters as stipulated

in the user documentation;

 damage or defects by software, interfacing, parts or supplies not provided by

us;

 damage or defects by improper storage, usage, or maintenance;

 damage or defects by virus infection;

 loss or damage in transit which is not arranged by us;

 Hardware Products that have been modified or serviced by non-authorized

personnel;

 any damage to or loss of any personal data, programs, or removable storage

media;

 the restoration or reinstallation of any data or programs except the software

installed by us when the product is manufactured;

 any engineering sample, evaluation unit, or non-mass production product that

is not covered under warranty service;

 any solid-state drive (SSD) which has reached its write endurance limit.

In no event will we be liable for any direct loss of use, interruption of business,
lost profits, lost data, or indirect, special, incidental or consequential damages
of any kind regardless of the form of action, whether in contract, tort (including
negligence), strict liability or otherwise, even if we have been advised of the
possibility of such damage, and whether or not any remedy provided should
fail of its essential purpose.
*1 Service Portal availability is subject to customer type and customer location. Please contact your
representative to learn more.

*2 Not all SLA offerings are available at all customer locations. Some SLA offerings may be limited to
geolocation and/or customer type. Please contact your representative to learn more.

51
10 System Management
10.1 Intelligent Management System BMC
BMC, a remote server management system, supports mainstream management
specifications in the industry such as IPMI 2.0 and Redfish 1.13. BMC features high
operational reliability, easy serviceability for different business scenarios, accurate
and comprehensive fault diagnosis capabilities, and industry-leading security
reinforcement capabilities.

BMC supports:

 IPMI 2.0

 Redfish 1.13

 SNMP v1/v2c/v3

 HTML5/Java remote consoles (Keyboard, Video, Mouse)

 Remote virtual media

 Login via web browsers

 Intelligent fault diagnosis

Table 10-1 BMC Features

Feature Description
Supports extensive remote management interfaces for
various server O&M scenarios. The supported interfaces
include:
 IPMI
 SMASH CLP
 SNMP
Management
Interface  HTTPS
 Web GUI
 Redfish
 RESTful
 DCMI
 Syslog
Accurate and IDL, a fault diagnosis system, offers accurate and
Intelligent Fault comprehensive hardware fault location capabilities, and
Location outputs detailed fault causes and handling suggestions.

52
Feature Description
Supports rich automatic remote alert capabilities, including
Alert proactive alerting mechanisms such as SNMP Trap
Management (v1/v2c/v3), email alerts and syslog remote alerts to ensure
24 × 7 reliability.
Supports HTML5- and Java-based remote console to remotely
Remote Console control and operate the monitor/mouse/keyboard of the
KVM server, providing highly available remote management
capabilities without on-site operation.
Virtual Network Supports mainstream third-party VNC clients without relying
Console (VNC) on Java, improving management flexibility.
Supports virtualizing images, USB devices, folders and local
Remote Virtual
media devices as media devices of remote servers,
Media
simplifying OS installation, file sharing, and other O&M tasks.
Supports the visual management interface developed by us,
Web GUI displaying abundant information of the server and
components, and offers easy-to-use Web GUIs.
Supports automatic crash screenshot and crash video
Crash Screenshot recording (video needs to be enabled manually) to capture
and Crash Video the last screen and video before crash; provides manual
Recording screenshot, which can quickly capture the screen for easy
inspection at scheduled time.
Supports dual flash and dual image, enabling automatic
Dual Flash and
flash failover in case of software or flash corruption,
Dual Image
improving operational reliability.
Supports power capping, increasing deployment density and
Power Capping
reducing energy consumption.
Supports both IPv4 and IPv6, enhancing network deployment
IPv4/IPv6
flexibility.
Supports auto-switching between the dedicated
Auto-Switching management network port and shared management
of Management network port, providing customers with flexible network
Network Port deployment solutions for different management network
deployment scenarios.
 Supports the reliable dual watchdog mechanism for
hardware and software, enabling automatic restoration
of BMC in case of BMC abnormality.
BMC Self-
 Provides a thermal protection mechanism, which is
Diagnosis and
automatically triggered when the BMC is abnormal to
Self-Recovery
ensure that the fan operates at safe speeds to avoid
System
system overheating.
 Supports self-diagnosis of processors, memory modules,
and storage devices of BMC, and automatically cleans

53
Feature Description
the workload to restore to normal when the device
usage rate is too high.
Supports virtual power buttons for power on/off, power cycle
Power Control
and reset.
Supports remote lighting of the UID LED for locating the
UID LED
server in the server room.
Supports firmware update based on secure digital
signatures, and mismatch prevention mechanism for
Secure Firmware
firmware from different manufacturers and firmware for
Update
different server models; supports firmware update of
BMC/BIOS/CPLD/ PSU.
Supports remote redirection of the system serial port, BMC
Serial Port serial port and other serial ports, and directs the server-side
Redirection serial port output to the local administrator via the network
for server debugging.
Storage Displays RAID logical array information and drive
Information information, and supports remote RAID creation for improved
Display deployment efficiency.
Supports user detail management based on user roles and
User Role flexible creation of user roles with different privileges, and
Management provides more user roles to allow administrators to grant
different privileges to O&M personnel.
Adopts the industry-leading server security baseline
standard V3.0. SSH, HTTPS, SNMP and IPMI use secure and
Security Feature reliable algorithms. BMC offers capabilities including secure
update and boot and security reinforcement mechanisms
such as anti-replay, anti-injection, and anti-brute force.
Supports double factor authentication for local BMC users.
Double Factor Users need to log in to the BMC with both password and
Authentication certificate, thus to prevent attacks caused by password
leakage.
Configuration
Exporting and Imports and exports the existing system configurations.
Importing
Displays the server basic information such as the information
System
and health status of key server components, including CPU,
Information
memory, power supply, device inventory, hard drive, network
Display
adapter, and security chip.
Displays the status, current speed, duty ratio, and other
Fan information of a fan module. You can select the fan control
Management mode and preset the speed for each fan module in the
Manual Fan Control mode.

54
 Feature Description
Sets how the server operating system reacts under the BMC's
Power Policy
control when AC power is reconnected to the server.
Performs non-recoverable erasing on all storage devices of
One-Click
the server, preventing data leakage when the server is to be
Erasing
retired.
After this feature is enabled, some parameters of the server
System
cannot be set and some operations cannot be performed on
Lockdown
the server.

10.2 KSManage
The server is compatible with the latest version of KSManage, a new-generation
infrastructure O&M management platform for data centers.

Built on cutting-edge O&M concepts, KSManage provides users with leading and
efficient overall management solutions for data centers to ensure advanced
infrastructure management. This platform provides a rich set of functions such as
centralized asset management, in-depth fault diagnosis, component fault early
warning, intelligent energy consumption management, 3D automatic topologies,
and stateless automatic deployment. With these functions, users can implement
centralized O&M of servers, storage devices, network devices, security devices, and
edge devices, effectively improving O&M efficiency, reducing O&M costs, and
ensuring the secure, reliable, and stable operation of data centers. KSManage
offers:

 lightweight deployment in multiple scenarios and full lifecycle management of

devices

 high reliability and on-demand scalability enabled by 1 to N data collectors

 intelligent asset management and real-time tracking of asset changes

 comprehensive monitoring for overall business control

 intelligent fault diagnosis for reduced maintenance time

 second-level performance monitoring for real-time status of devices

 batch configuration, deployment and update, shortening the time needed to

bring the production environment online

 improved firmware version management efficiency

 standardized northbound interfaces for easy integration and interfacing

55
Table 10-1 KSManage Features

Feature Description

Display of basic information (data centers, server rooms,

Home cabinets, assets and alerts), quick addition of devices and
custom home page

 Batch asset import, automatic asset discovery, and full

lifecycle management of assets
 Management of the full range of our server family,
including general-purpose rack servers, AI servers,
multi-node servers, edge servers and all-in-one servers
 Management of our general-purpose disk arrays and
distributed storage devices
Assets
 Management of network devices (switches, routers, etc.),
security devices (firewalls, load balancers, etc.), cabinets
and clouds
 Management of data centers
 Asset warranty information management, asset
inventory reports for server acceptance, asset attribute
expansion, etc.

 Display of real-time alerts, history alerts, blocked alerts

and events
 Fault prediction of drives and memories
 Custom inspection plan and inspection result
management
 Notification record viewing
Monitor  Intelligent fault diagnosis and analysis, automatic fault
reporting and repair ticket viewing
 Trap management and Redfish management
 Management of monitoring rules, such as alert rules,
notification rules, blocking rules, alert noise reduction
rules, compression rules and fault reporting rules, and
redefinition of the above rules.

 Quick start of firmware update, OS installation, power

management, drive data erasing and stress test
 Batch firmware update (BMC/BIOS/RAID
Control
Card/NIC/Drive/HBA Card/MB CPLD/BP CPLD/PSU)
 Batch firmware configuration (BMC/BIOS)
 Batch RAID configuration and OS deployment for servers

56
Feature Description
 Secure and quick drive data erasing
 CPU and memory stress test
 Automatic firmware baseline management
 BMC and BIOS snapshot management
 Repositories for update files

 Overview of data center power consumption trend chart

and carbon emission trend chart
Energy Efficiency  Setting of server dynamic power consumption policies
and minimum power consumption policies
 Carbon asset and carbon emission management

 Fault log record management

Log
 Diagnosis record and diagnosis rule management

 Centralized management of multiple data centers and

panoramic 3D views, including dynamic display of power
Topologies consumption, temperature, alerts and cabinet capacity
of the data center
 Network topologies

 Management of warranty information reports, alert

reports, asset reports, hardware reports and
Reports
performance reports
 Export of reports in .xlsx format

 Password management, alert forwarding and data

System dump
 Customized KSManage parameters

Security control of KSManage via a set of security policies

such as user management, role management, authentication
Security
management (local authentication and LDAP authentication)
and certificate management.

57
10.3 KSManage Tools
Table 10-2 Features of KSManage Tools

Feature Description

A lightweight automatic batch O&M tool for servers, mainly

KSManage Kits used for server deployment, routine maintenance, firmware
update, fault handling, etc.

A unified batch management platform for bare metals, with

features including firmware management, hardware
KSManage Boot
configuration, system deployment and migration, stress test
and in-band management

KSManage Fast integration with third-party management platforms,

Server CLI delivering a new O&M mode of Infrastructure as Code (IaC)

Operates under the OS and gets system asset and

performance information via the in-band mode, providing
KSManage Driver
users with more comprehensive server management
capabilities

Offers users with RAID configuration, intelligent OS

KSManage
installation, firmware update, hardware diagnosis, secure
Server
erasing and software upgrade, using the TF card as the
Provisioning
carrier

58
11 Certifications
Table 11-1 Certifications

Country/Region Certification Mandatory/Voluntary

International CB Voluntary
EU CE Mandatory
FCC Mandatory
US UL Voluntary
Energy Star Voluntary
Canada IC Mandatory
EAC Mandatory
EAEU EAC-RoHS Mandatory
FSS Mandatory
E-Standby Mandatory
South Korea
KC Mandatory
India BIS Mandatory
Australia RCM Mandatory

59
12 Appendix A
12.1 Thermal Restrictions
Table 12-1 Thermal Restrictions

Max. Operating Temp. Max. Operating Temp.

Configuration
30°C (86°F) 35°C (95°F)

 CPU TDP ≤200 W  CPU TDP ≤200 W

 3 PCIe expansion cards
 3 PCIe expansion cards
supported
supported
 Standard 1U heatsinks
 Standard 1U heatsinks
Drive supported (for some
not supported
Configuration CPU models)
 OCP slot 1 does not
 OCP slot 1 does not
support 100 Gb NICs
support 100 Gb NICs
 Dual-slot GPUs not  Dual-slot GPUs not
supported supported

 CPU TDP ≤200 W  CPU TDP ≤200 W

 1 PCIe expansion card  6 × 2.5-inch

10 × 2.5- supported NVMe/SAS/SATA drive

Inch supported
 10 × 2.5-inch
Drive NVMe/SAS/SATA drive  1 PCIe expansion card
Config. supported supported

GPU  Non-perforated  Non-perforated

Configuration 1 chassis supported chassis supported

 Standard 1U heatsinks  Standard 1U heatsinks

not supported not supported

 OCP slot 1 does not  OCP slot 1 does not

support 100 Gb NICs support 100 Gb NICs

 2 single-slot A2/L4  2 single-slot A2/L4

GPUs supported GPUs supported

 CPU TDP ≤290 W  CPU TDP ≤290 W

GPU  10 × 2.5-inch  6 × 2.5-inch
Configuration 2 NVMe/SAS/SATA drive NVMe/SAS/SATA drive
supported supported

60
  Non-perforated  Non-perforated
chassis not supported chassis not supported

 OCP slot 1 does not  OCP slot 1 does not

support 100 Gb NICs support 100 Gb NICs

 3 single-slot A2/L4  3 single-slot A2/L4

GPUs supported GPUs supported

 CPU TDP ≤240 W  CPU TDP ≤240 W

4 × 3.5-  3 PCIe expansion cards  3 PCIe expansion cards

Inch supported supported
Drive + 4  Standard 1U heatsinks  Standard 1U heatsinks
Drive
× 2.5- not supported not supported
Configuration
Inch  OCP slot 1 does not  OCP slot 1 does not
Drive support 100 Gb NICs support 100 Gb NICs
Config.
 Dual-slot GPUs not  Dual-slot GPUs not
supported supported

NOTE
 The maximum operating temperature will drop by 5°C (9°F) if a single fan
fails.
 Single fan failure may affect system performance.
 When the front bezel is used with any of the following, the maximum
operating temperature will drop by 3°C (5.4°F): 100 Gb OCP 3.0 cards, 360 W
TDP CPUs, 10 × 2.5-inch drive configuration, 4 × 3.5-inch drive + 4 × 2.5-
inch drive configuration, or GPUs.
 Consult your sales representative for detailed component combination
restrictions.

12.2 Model
Table 12-2 Model

Certified Model Description

KR1180-E2-A0-R0-00 Global

12.3 RAS Features

The server supports a variety of RAS (Reliability, Availability, and Serviceability)

61
 features. By configuring these features, the server can provide greater reliability,
availability, and serviceability.

12.4 Sensor List

Table 12-3 Sensor List

Sensor
Sensor Description Note
Location
Chassis air inlet Right mounting
Inlet_Temp
temperature ear
Chassis air outlet
Outlet_Temp Motherboard
temperature
CPU core
CPU0_Temp CPU
temperature
VR chip on the
CPU0_VR_Temp CPU VR temperature
motherboard
x indicates the
The maximum
DIMM number
CPU0_DIMMGx_T temperature of the DIMM
with a value of 0
DIMMs of CPU0
to 1
Maximum
Drives attached
temperature among
HDD_MAX_Temp to the drive
all drives connected
backplane
to the RAID card
Maximum Drives attached
NVMe_Temp temperature among to the drive
all NVMe drives backplane
PSU inlet
PSU_Inlet_Temp PSU
temperature
OCP card
OCP_0_NIC_Temp OCP card
temperature
The temperature of
SFP optical
the SFP optical
OCP_0_SFP_Temp module on the
module on the OCP
OCP card
card
Maximum
PCIe_NIC_Temp temperature among PCIe NIC
all PCIe NICs
The temperature of
SFP optical
the SFP optical
PCIe_SFP_Temp module on the
module on the PCIe
PCIe NIC
NIC

62
 Sensor
Sensor Description Note
Location
Maximum
RAID_Temp temperature among RAID cards
all RAID cards
x indicates the
GPUx_Temp GPUx temperature GPU GPU number with
a value of 0 to 2
HBA card
HBA_Temp HBA card
temperature
HCA card
PCIe_HCA_Temp HCA card
temperature
The temperature of
SFP optical
the SFP optical
PCIe_HCA_SFP_T module on the
module on the HCA
HCA card
card
RAID mezz card
OCP_RAID_Temp RAID mezz card
temperature
12 V voltage
SYS_12V supplied by Motherboard
motherboard to BMC
5 V voltage supplied
SYS_5V by motherboard to Motherboard
BMC
3.3 V voltage
SYS_3V3 supplied by Motherboard
motherboard to BMC
5 V voltage of
standard power
P5V_STBY Motherboard
connectors on the
motherboard
3.3 V voltage of
standard power
P3V3_STBY Motherboard
connectors on the
motherboard
1.8 V voltage of
standard power
P1V8_STBY Motherboard
connectors on the
motherboard
1.05 V voltage
P1V05_USB supplied to USB Motherboard
module

63
 Sensor
Sensor Description Note
Location
The voltage supplied
PVDD33_S5 Motherboard
by VR chip to CPU
The voltage supplied
PVDDCR_CPU0_P0 Motherboard
by VR chip to CPU
The voltage supplied
PVDDCR_CPU1_P0 Motherboard
by VR chip to CPU
The voltage supplied
PVDD18_S5_P0 Motherboard
by VR chip to CPU
The voltage supplied
PVDDCR_SOC_P0 Motherboard
by VR chip to CPU
The voltage supplied
PVDD11_S3_P0 Motherboard
by VR chip to CPU
The voltage supplied
PVDDIO_P0 Motherboard
by VR chip to CPU
12 V voltage
supplied by
P12V_CPU0_DIMM1 Motherboard
motherboard to
DIMMs
x indicates the
PSUx_VIN PSUx input voltage PSU PSU number with
a value of 0 to 1
x indicates the
PSUx_VOUT PSUx output voltage PSU PSU number with
a value of 0 to 1
RTC battery on
RTC_Battery RTC battery voltage the
motherboard
x indicates the fan
module number
FANx_Status FANx status FANx
with a value of 0
to 7
Fan redundancy
FAN_Redundant Fan module
status
x indicates the fan
module number
FANx_F_Speed FANx speed in rpm FANx
with a value of 0
to 7
x indicates the fan
module number
FANx_R_Speed FANx speed in rpm FANx
with a value of 0
to 7

64
 Sensor
Sensor Description Note
Location
Total_Power Total power PSU
x indicates the
PSUx_PIN PSUx input power PSUx PSU number with
a value of 0 to 1
x indicates the
PSUx_POUT PSUx output power PSUx PSU number with
a value of 0 to 1
FAN_Power Total fan power Fan module
CPU_Power Total CPU power Motherboard
Memory_Power Total memory power Motherboard
CPU0_Status CPU status CPU
CPU configuration
status (mixing of
CPU_Config CPU
CPUs, or primary CPU
not installed)
x indicates the
memory channel
number under the
CPU with a value
CPU0_CxDy CPU DIMM status CPU DIMM of A to L; y
indicates the
DIMM number
with a value of 0
to 1
PCIe_Status PCIe status error PCIe bus
Power button
Power button
Power_Button on the front
pressed
panel
Watchdog2 Watchdog Motherboard
Sys_Health BMC health status BMC
UID_Button UID button status Motherboard
Power capping
PWR_CAP_Fail Motherboard
status
PSU redundancy
PSU_Redundant PSU
status
PSU_Mismatch PSU model mismatch PSU
x indicates the
PSUx_Status PSUx status PSUx PSU number with
a value of 0 to 1
Monitors chassis-
Intrusion Top cover
opening activity

65
 Sensor
Sensor Description Note
Location
(chassis intrusion
detection)
Reason for system
SysShutdown
shutdown
ACPI_PWR ACPI status
System software
ME_FW_Status process, system
startup error
Reason for system -
SysRestart
restart
BIOS boot up
BIOS_Boot_Up
complete
Emergency system
System_Error
failure
POST_Status POST status
CPU_Config System hang -
Record the BMC boot
BMC_Boot_Up
event
Record the event that
-
system event logs
SEL_Status
are almost
full/cleared
BMC_Status BMC status -
Leak detection
LeakageSensor -
(reserved)

66
13 Appendix B Acronyms and
Abbreviations
13.1 A - E
A

AC Alternating Current

ACPI Advanced Configuration and Power Interface

AI Artificial Intelligence

AMD Advanced Micro Devices, Inc.

AMD-V AMD Virtualization

ANSI American National Standards Institute

General Administration of Quality Supervision, Inspection and

AQSIQ
Quarantine of the People's Republic of China

ARMA Advanced Return Material Authorization

ASP AMD Secure Processor

AVX Advanced Vector Extensions

BIOS Basic Input Output System

BLE BIOS Lock Enable

BMC Baseboard Management Controller

BP Backplane

CAS Column Address Strobe

67
CB Certification Body

CCC China Compulsory Certificate

CE Conformite Europeenne

CECP China Energy Conservation Program

CEN European Committee for Standardization

CLI Command-Line Interface

CMOS Complementary Metal-Oxide-Semiconductor

COM Communication

CPLD Complex Programmable Logic Device

CPU Central Processing Unit

CRPS Common Redundant Power Supply

DC Direct Current

DCMI Data Center Manageability Interface

DC-SCM Datacenter-ready Secure Control Module

DDR5 Double Data Rate 5

DIMM Dual In-Line Memory Module

DOA Dead on Arrival

DPC DIMM Per Channel

DRAM Dynamic Random-Access Memory

EAC Eurasian Conformity

ECC Error-Correcting Code

ECMA European Computer Manufacturer Association

68
 ESD Electro-static Discharge

EU European Union

13.2 F - J
F

FCC Federal Communications Commission

FHHL Full-Height Half-Length

FW Firmware

GPU Graphics Processing Unit

GUI Graphical User Interface

HBA Host Bus Adapter

HCA Host Channel Adapter

HDD Hard Disk Drive

HDT Hardware Debug Tool

HHHL Half-Height Half-Length

HSE Health and Safety Executive

HTTPS HyperText Transfer Protocol Secure

I/O Input/Output

IC Industry Canada

69
 ID Identity

IEC International Electrotechnical Commission

IOD I/O Die

IP Internet Protocol

IPMB Intelligent Platform Management Bus

IPMI Intelligent Platform Management Interface

ISA International Society of Automation

ISO International Organization for Standardization

JTAG Joint Test Action Group

13.3 K - O
K

KC Korean Certification

KVM Keyboard Video Mouse

LC Lucent Connector

LDAP Lightweight Directory Access Protocol

LED Light Emitting Diode

LP Low Profile

MCIO Mini Cool Edge IO

70
 ME Management Engine

NBD Next Business Day

NC-SI Network Controller Sideband Interface

NIC Network Interface Controller

NIOSH National Institute for Occupational Safety and Health

NVMe Non-Volatile Memory Express

OCP Open Compute Project

O&M Operations and Maintenance

OS Operating System

13.4 P - T
P

PCH Platform Controller Hub

PCIe Peripheral Component Interconnect Express

PFR Platform Firmware Resilience

PID Proportional, Integral, Derivative

POST Power-On Self-Test

PSU Power Supply Unit

PWR Power

71
RAID Redundant Arrays of Independent Disks

RAS Reliability, Availability, Serviceability

RDIMM Registered Dual In-line Memory Module

RH Relative Humidity

RHEL Red Hat Enterprise Linux

RMA Return Material Authorization

RPM Revolutions Per Minute

RST Reset

RTC Real Time Clock

SAS Serial Attached SCSI

SATA Serial Advanced Technology Attachment

SCSI Small Computer System Interface

SDP System Demonstration Platform

SEL System Event Log

SEV Secure Encrypted Virtualization

SFF Small Form Factor

SFP Small Form-factor Pluggable

SGPIO Serial General Purpose Input/Output

SLA Service Level Agreements

SNMP Simple Network Management Protocol

SSD Solid State Drive

SSH Secure Shell

72
 TCM Trusted Cryptography Module

TDP Thermal Design Power

TF TransFlash

TPM Trusted Platform Module

13.5 U - Z
U

UART Universal Asynchronous Receiver Transmitter

UEFI Unified Extensible Firmware Interface

UID Unit Identification

UL Underwriters Laboratories

UMC Unified Memory Controller

USB Universal Serial Bus

VGA Video Graphics Array

VLAN Virtual Local Area Network

VM Virtual Machine

VMD Volume Management Device

VNC Virtual Network Console

VPP Virtual Pin Point

VR Voltage Regulator

VRD Voltage Regulator Down

VROC Virtual RAID on CPU

73