Specification Number : BP-ABZ-C

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Sub-G Module Data Sheet

Sample Part Number: CMWX1ZZABZ-TEMP

CMWX1ZZABZ-TEMP-1
MP Part Number: CMWX1ZZABZ-078
CMWX1ZZABZ-091

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Revision History
Revision
Date Description Comments
Code
A Dec 1, 2016 Initial Draft
B Jan 19, 2017 Revise template
Updated the RF performance, Electrical Characteristics
and power up sequence.
C Oct 16, 2018 Added weight info.
Updated P/N
Revised label info

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TABLE OF CONTENTS
1. Features ······················································································································· 4
2. Part Number ················································································································· 4
3. Block Diagram ··············································································································· 4
4. Label Information ·········································································································· 5
5. Absolute Maximum Ratings ····························································································· 5
6. Operating Condition ······································································································· 5
7. Electrical Characteristics ································································································ 6
7.1. FSK/OOK Transceiver Specification ············································································ 6
7.2. LoRa Transceiver Specification ··················································································· 6
7.3. SIGFOX Transceiver Specification ·············································································· 7
7.4. Low power mode current ···························································································· 7
8. Power Sequences ············································································································ 8
9. Reference circuit ············································································································ 9
10. Tape and Reel packing·································································································· 11
11. Notice ························································································································ 14
CAUTION ················································································································ 16

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1. Features

Interfaces : I2C, UART, USB, SPI

Main ICs : STM32L, SX1276
Reference Clocks : Integrated 32MHz clock (TCXO with frequency error= 2 ppm)
and 32.768KHz clock (frequency error= 20 ppm)
Supported Frequencies : 868 MHz, 915 MHz
Module Size : 12.5 mm x 11.6 mm x 1.76 mm (Max)
Weight : 0.48g (Typ)
Package : Metal Shield can
RoHS : This module is compliant with the RoHS directive

2. Part Number

Ordering Part Number MCU Secure element Description

CMWX1ZZABZ-TEMP STM32L082 NA Engineering sample
CMWX1ZZABZ-EVK STM32L082 NA Evaluation board
CMWX1ZZABZ-078 STM32L082 NA MP P/N
CMWX1ZZABZ-TEMP-1 STM32L072 NA Engineering sample
CMWX1ZZABZ-EVK-1 STM32L072 NA Evaluation board
CMWX1ZZABZ-091 STM32L072 NA MP P/N

3. Block Diagram

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4. Label Information

1 pin mark
Product name
FCC ID number
IC ID number
Inspection number
TELEC logo

KCC logo
Murata Logo

5. Absolute Maximum Ratings

Table 3 Maximum ratings

Parameters Min Typ Max Unit
Storage Temperature -40 25 +90 degC
Input RF Level - - 10 dBm
VDD_USB -0.3 - 3.9 V
Supply Voltage VDD_MCU, VDD_RF, VDD_TCXO -0.3 - 3.9 V
VREF+ -0.3 - VDD_MCU+0.4 V

6. Operating Condition

Table 4 Operating specification

Parameters Min Typ Max Unit
Operating Temperature -40 25 +85 degC
VDD_USB (USB peripheral used) (1) 3.0 - 3.6 V
VDD_USB(USB peripheral not used) (1) VDD_MCU_min VDD_MCU VDD_MCU_max V
Supply Voltage
VDD_MCU,VDD_RF,VDD_TCXO 2.2(3) - 3.6 V
VREF+(2) 1.8 - VDD_MCU V

(1) VDD_USB must respect the following conditions:

- When VDD_MCU is powered on (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU.
- When VDD_MCU is powered down (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than
VDD_MCU.
- In operating mode, VDD_USB could be lower or higher than VDD_MCU.
- If the USB is not used, VDD_USB must be tied to VDD_MCU to be able to use PA11 and PA12 as standard I/Os.
(2) VREF+ is used to ensure a better accuracy on low-voltage inputs and outputs of ADC and DAC. Detailed information is
on the STM32L082*** datasheet and user guider.
(3) When module is on +20dBm operation, the supply of the voltage should be set from 2.4V to 3.6V.

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7. Electrical Characteristics
7.1. FSK/OOK Transceiver Specification
Conditions:
Supply voltage VDD=3.3 V, temperature = 25 °C, FXOSC = 32 MHz, FRF =868/915 MHz , 2-level FSK modulation
without pre-filtering, FDA = 5 kHz, Bit Rate = 4.8 kb/s and terminated in a matched 50 Ohm impedance, shared Rx
and Tx path matching, unless otherwise specified.

FSK/OOK Receiver Specification

Symbol Description Conditions Min. Typ Max Unit
RFS_F_HF LnaBoost is turned on FDA = 5 kHz, BR = 4.8 kb/s -117.5 dBm
Supply current in Receive LnaBoost Off, band 1 22 mA
IDDR (*)
mode LnaBoost On, band 1 23 mA

FSK/OOK Transmitter Specification

Symbol Description Conditions Min. Typ Max Unit
RF output power in 50 ohms Max 14 dBm
Programmable with
RF_OP on RFO pin ( High efficiency
steps Min -5 dBm
PA)
RF output power in 50 ohms Max 18.5 dBm
Programmable with
RF_OPH on PA_BOOST pin( Regulated
1dB steps Min 2 dBm
PA)
RF output power stability on
PA_BOOST pin versus voltage VDD = 2.2 V to 3.6 V +/-1 dB
OPH_V
supply.
RF output power stability
versus temperature on From T = -40 °C to +85 °C +/-1.5 dB
PA_BOOST pin.
RFOP = +20 dBm, on
128
PA_BOOST mA
RFOP = +17 dBm, on
Supply current in Transmit 106
PA_BOOST mA
IDDT (*) mode with impedance
RFOP = +14 dBm, on
matching 47
RFO_HF pin mA
RFOP = + 7 dBm, on
34
RFO_HF pin mA
(*) IDDR and IDDT are total current consumption including MCU in active.

7.2. LoRa Transceiver Specification

Conditions:
The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation. Following
conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25° C, FXOSC = 32 MHz, Error
Correction Code (EC) = 4/5, Packet Error Rate (PER)= 1%, CRC on payload enabled, Payload length = 10 bytes.
With matched impedances

LoRa Receiver Specification

Symbol Description Conditions Min. Typ Max Unit
Band 1, BW = 125 kHz 21.5 mA
Supply current in receiver
IDDR_L (*) Band 1, BW = 250 kHz 22.2 mA
LoRa mode, LnaBoost off
Band 1, BW = 500 kHz 23.6 mA
SF = 6 -117.5 dBm
RF sensitivity, Long-Range SF = 7 -122.5 dBm
Mode, highest LNA gain, SF = 8 -125.5 dBm
RFS_L125_HF LnaBoost for Band1, using SF = 9 -128.5 dBm
split Rx/Tx path SF = 10 -131.0 dBm
125 kHz bandwidth SF = 11 -133.5 dBm
SF = 12 -135.5 dBm
RF sensitivity, Long-Range SF = 6 -114.0 dBm
Mode, highest LNA gain, SF = 7 -119.0 dBm
RFS_L250_HF
LnaBoost for Band1, using SF = 8 -122.0 dBm
split Rx/Tx path SF = 9 -125.0 dBm

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250 kHz bandwidth SF = 10 -127.5 dBm

SF = 11 -130.0 dBm
SF = 12 -133.0 dBm

LoRa Transmitter Specification

Symbol Description Conditions Min. Typ Max Unit
Supply current in transmitter RFOP setting = 14 dBm 47 mA
IDDT_L (*)
mode RFOP setting = 10 dBm 36 mA
Supply current in transmitter Using PA_BOOST pin
IDDT_H_L (*) 128 mA
mode RFOP setting = 20 dBm
(*) IDDR_L, IDDT_L and IDDT_H_L are total current consumption including MCU in active.

7.3. SIGFOX Transceiver Specification

Conditions:
The table below gives the electrical specifications for the transceiver operating with SIGFOX modulation. Following
conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25° C. With matched
impedances.

Notes: To operate as SIGFOX mode, the following configuration is required.

- TCXO_OUT (Pin 47) must be connected to PH0-OSC_IN (Pin46).
- PA12 (Pin 1) must be connected to TXCO_VCC (Pin48).
- SX1276_DIO4 (Pin10) must be connected to PA5 (Pin21).

SIGFOX Receiver Specification

Symbol Description Conditions Min. Typ Max Unit
AT$SB=x,1, AT$SF=x,1,
RFS_F_HF -122 dBm
AT$SR PER<0.1
Supply current in Receive
IDDR_S AT$TM=3,10 23 mA
mode

SIGFOX Transmitter Specification

Symbol Description Conditions Min. Typ Max Unit
Programmable with Max 18.5 dBm
RF output power in 50 ohms
RF_OP_S steps
on RF pin Min 4.5 dBm
AT$SF
Output power setting 20 dBm
Supply current in Transmit 128
AT$SF mA
IDDT_S mode with impedance
Output power setting 14 dBm
matching 44
AT$SF mA

7.4. Low power mode current

Conditions:
Power supply: 3.3V, Temp: Room, TCXO_VDD (pin 48 of the module) is connected to PA12 (Pin1 of the module)
Mode Description Min. Typ Max Unit
(*1) (*3)
STM32L0 in Stop mode with RTC (Real Time Clock)
Mode0 1.65 uA
SX1276 in Sleep mode
STM32L0 in Standby mode with RTC (Real Time Clock) (*2)
Mode1 1.40 uA
SX1276 in Sleep mode

(*1) The Stop mode achieves the lowest power consumption while retaining the RAM and register contents and real
time clock. All clocks in the VCORE domain are stopped, the PLL, MSI RC, HSE crystal and HSI RC oscillators are
disabled. The LSE or LSI is still running. The voltage regulator is in the low-power mode.
Some peripherals featuring wakeup capability can enable the HSI RC during Stop mode to detect their wakeup
condition. The device can be woken up from Stop mode by any of the EXTI line, in 3.5us, the processor can serve
the interrupt or resume the code. The EXTI line source can be any GPIO. It can be the PVD output, the comparator 1
event or comparator 2 event (if internal reference voltage is on), it can be the RTC alarm/tamper/timestamp/wakeup
events, the USB/USART/I2C/LPUART/LPTIMER wakeup events.

(*2) The Standby mode is used to achieve the lowest power consumption and real time clock. The internal voltage
regulator is switched off so that the entire VCORE domain is powered off. The PLL, MSI RC, HSE crystal and HSI
RC oscillators are also switched off. The LSE or LSI is still running. After entering Standby mode, the RAM and
register contents are lost except for registers in the Standby circuitry (wakeup logic, IWDG, RTC, LSI, LSE Crystal 32
KHz oscillator, RCC_CSR register). Th

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IWDG reset, a rising edge on one of the three WKUP pins, RTC alarm (Alarm A or Alarm B), RTC tamper event, RTC
timestamp event or RTC Wakeup event occurs.

(*3) STM SigFox Firmware is always in stop mode by default, it wakes up automatically when receiving one
character. Else it wakes up automatically when an interrupt is to be processed and returns in stop mode when
finished.

8. Power Sequences

8.1 Power Up Sequence

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 9. Reference circuit

53
GND 52
GND 51
GND 50
GND 49
GND
13
14 DBG_SX1276_DIO0 48
15 PB15/SPI2_MOSI VDD_TCXO 47
16 PB14/SPI2_MISO TCXO_OUT 46
17 PB13/SPI2_SCK PH0-OSC_IN 45
18 PB12/SPI2_NSS PH1-OSC_OUT 44
19 PA10/USART1_RX GND 43
20 PA9/USART1_TX BOOT0 42
21 PA8/MCO PA14/SWCLK/LPUART1_TX 41
22 PA5/ADC5/DAC2 PA13/SWDIO/LPUART1_RX 40
23 PA4/ADC4/DAC1 PB5/LPTIM1_IN1 39
24 PA3/ADC3/USART2_RX/LPUART1_RX PB6/LPTIM1_ETR 38
PA2/ADC2/USART2_TX/LPUART1_TX PB7/LPTIM1_IN2 37
PB2/LPTIM1_OUT
 53
GND 52
GND 51
GND 50
GND 49
GND
13
14 DBG_SX1276_DIO0 48
15 PB15/SPI2_MOSI VDD_TCXO 47
16 PB14/SPI2_MISO TCXO_OUT 46
17 PB13/SPI2_SCK PH0-OSC_IN 45
18 PB12/SPI2_NSS PH1-OSC_OUT 44
19 PA10/USART1_RX GND 43
20 PA9/USART1_TX BOOT0 42
21 PA8/MCO PA14/SWCLK/LPUART1_TX 41
22 PA5/ADC5/DAC2 PA13/SWDIO/LPUART1_RX 40
23 PA4/ADC4/DAC1 PB5/LPTIM1_IN1 39
24 PA3/ADC3/USART2_RX/LPUART1_RX PB6/LPTIM1_ETR 38
PA2/ADC2/USART2_TX/LPUART1_TX PB7/LPTIM1_IN2 37
PB2/LPTIM1_OUT
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10. Tape and Reel packing

10.1 Dimension of Tape (Plastic tape)

1.75±0.10
2.0±0.1
4.0±0.1 *1 1.5+0.1/-0.0 0.30±0.05
11.5±0.1
24.0±0.3

13±0.1

1.5+0.1/-0 24.0±0.1 12.1±0.1

feeding direction 2±0.15

(unit : mm)
10.2 Dimensions of Reel

Label

R80

R135
330 2

R5
13 0.2

22
80 1

120

W1

W2

Reel inside width W1: 25.5 1.0

Reel outside width W2: 29.5 1.0
Unit: mm
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10.3 Taping Diagrams

[1] Feeding Hole : As specified in (1)

[2] Hole for chip : As specified in (1)

[3] Cover tape :

[4] Base tape : As specified in (1)

[3]
[1]

[2]

[3]

[4]

Feeding Hole

Feeding Direction

Chip

10.4 Leader and Tail tape

Tail tape
(No components) Components No components
Leader tape
(Cover tape alone)

40 to 200mm 150mm min. 250mm min.

Feeding direction

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- The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
- The cover tape and base tape are not adhered at no components area for 250mm min.
- Tear off strength against pulling of cover tape : 5N min.
- Packaging unit : 1000 pcs/ reel
- Material
Base tape : Plastic
Reel : Plastic
Cover tape, cavity tape and reel are made the anti-static processing.
- Peeling of force: 1.3N max. in the direction of peeling as shown below.

1.3 N max.
0.7 N max.

165 to 180 °
Cover tape

Base tape
- Packaging (Humidity proof Packing)

Label
Desiccant

Humidity
Indicator

Label
Anti-humidity
Plastic Bag

Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant
and the humidity indicator.

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11. Notice

11.1 Storage Conditions

Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35 °C and humidity from 20 ~ 70 %RH.
(Packing materials, in particular, may be deformed at the temperature over 40 °C)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.

This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)

- After the packing opened, the product shall be stored at <30 °C / <60 %RH and the product shall be
used within 168 hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.

Baking condition: 125 +5/-0 °C, 24 hours, 1 time

The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.

11.2 Handling Conditions

Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.

Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solderability.

11.3 Standard PCB Design (Land Pattern and Dimensions)

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.

The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-standard lands, contact Murata beforehand.

11.4 Notice for Chip Placer :

When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.

11.5 Soldering Conditions

The recommendation conditions of soldering are as in the following figure.
When products are immersed in solvent after mounting, pay special attention to maintain the
temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C.

Contact Murata before use if concerning other soldering conditions.

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Reflow Soldering Standard Conditions (Example)

Within 3 s

240 ~ 250 °C

220 °C Cooling down

Slowly
180 °C

150 °C

Pre-heating

Within 120 s Within 60 s time(s)

Please use the reflow within 2 times.

Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.

11.6 Cleaning :
Since this Product is Moisture Sensitive, any cleaning is not permitted.

11.7 Operational Environment Conditions :

Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.

If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.

As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
static electricity or excessive voltage while assembling and measuring.

11.8 Input Power Capacity :

Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range.

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CAUTION
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.

Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is
mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose,
under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the
environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not
be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this
specification.

WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING
WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR
AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.

The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as
may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such
applications, we will not be responsible for any failure to meet such requirements.

Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS,
AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE
OF OUR PRODUCTS IN SUCH APPLICATIONS.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.

We expressly prohibit you from analyzing, breaking, Reverse-Engineering, remodeling altering, and reproducing our product. Our product cannot be used
for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world.

We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other
intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding
third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such
information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or
other intellectual property.

Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and
the purpose of military use.
Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc.

Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our
suppliers.

Customer acknowledges that Murata will, if requested by you, conduct a failure analysis for defect or alleged defect of Products only at the level required for
consumer grade Products, and thus such analysis may not always be available or be in accordance with your request (for example, in cases where the
defect was caused by components in Products supplied to Murata from a third party).

By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and
accept the validity of the contents herein.
When you are not able to return the signed version of specification sheet or approval sheet within 90 days from receiving date of specification sheet or
approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet.

Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status.
We reject any liability or product warranty for engineering samples.
In particular we disclaim liability for damages caused by
the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you,
deviation or lapse in function of engineering sample,
improper use of engineering samples.
We disclaims any liability for consequential and incidental damages.

you should inquire our sales.

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