ISP1122A

Universal Serial Bus stand-alone hub

Rev. 03 — 30 October 2001 Product data

1. General description
The ISP1122A is a stand-alone Universal Serial Bus (USB) hub device which
complies with USB Specification Rev. 1.1. It integrates a Serial Interface Engine
(SIE), hub repeater, hub controller, USB data transceivers and a 3.3 V voltage
regulator. It has a configurable number of downstream ports, ranging from 2 to 5.

The ISP1122A can be bus-powered, self-powered or hybrid-powered. When it is

hybrid-powered the hub functions are powered by the upstream power supply (VBUS),
but the downstream ports are powered by an external 5 Volt supply. The low power
consumption in ‘suspend’ mode allows easy design of equipment that is compliant
with the ACPI™, OnNow™ and USB power management requirements.

The ISP1122A has built-in overcurrent sense inputs, supporting individual and global
overcurrent protection for downstream ports. All ports (including the hub) have
GoodLink™ indicator outputs for easy visual monitoring of USB traffic. The ISP1122A
has a serial I2C-bus interface for external EEPROM access and a reduced frequency
(6 MHz) crystal oscillator. These features allow significant cost savings in system
design and easy implementation of advanced USB functionality into PC peripherals.

2. Features
■ High performance USB hub device with integrated hub repeater, hub controller,
Serial Interface Engine (SIE), data transceivers and 3.3 V voltage regulator
■ Complies with Universal Serial Bus Specification Rev. 1.1 and ACPI, OnNow and
USB power management requirements
■ Configurable from 2 to 5 downstream ports with automatic speed detection
■ Internal power-on reset and low voltage reset circuit
■ Supports bus-powered, hybrid-powered and self-powered application
■ Individual or ganged power switching for downstream ports
■ Individual or global port overcurrent protection with built-in sense circuits
■ 6 MHz crystal oscillator with on-chip PLL for low EMI
■ Visual USB traffic monitoring (GoodLink™) for hub and downstream ports
■ I2C-bus interface to read vendor ID, product ID and configuration bits from
external EEPROM
■ Operation over the extended USB bus voltage range (4.0 to 5.5 V)
■ Operating temperature range −40 to +85 °C
■ 8 kV in-circuit ESD protection for lower cost of external components
■ Full-scan design with high test coverage
■ Available in 32-pin SDIP, SO and LQFP packages.
Philips Semiconductors ISP1122A
USB stand-alone hub

3. Ordering information
Table 1: Ordering information
Type number Package
Name Description Version
ISP1122AD SO32 plastic small outline package; 32 leads; body width 7.5 mm SOT287-1
ISP1122ANB SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1
ISP1122ABD LQFP32 plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1

4. Block diagram

pagewidth

upstream
port 6 MHz
VCC Vreg(3.3) D+ D− LED

5V PACKET I2C-BUS SDA

PLL GENERATOR INTERFACE SCL
SUPPLY ANALOG HUB
REGULATOR Tx / Rx GoodLink BIT CLOCK
ISP1122A
3.3 V RECOVERY
full INDV
speed PHILIPS HUB
SIE CONTROLLER OPTION

END OF
HUB
FRAME
REPEATER
TIMERS

GENERAL
PORT
CONTROLLER

ANALOG GoodLink/ ANALOG GoodLink/ ANALOG GoodLink/ ANALOG GoodLink/ ANALOG GoodLink/ self/bus
Tx /Rx POWER SWITCH/ Tx/ Rx POWER SWITCH/ Tx/ Rx POWER SWITCH/ Tx / Rx POWER SWITCH/ Tx / Rx POWER SWITCH/ powered
OC DETECT OC DETECT OC DETECT OC DETECT OC DETECT

D+ D− overcurrent LED/ D+ D− overcurrent LED/ D+ D− overcurrent LED/ D+ D− overcurrent LED/ D+ D− overcurrent LED/
detection power switch detection power switch detection power switch detection power switch detection power switch

downstream downstream downstream downstream downstream

port 1 port 2 port 3 port 4 port 5 MBL169

This is a conceptual block diagram and does not include each individual signal.
Fig 1. Block diagram.

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Product data Rev. 03 — 30 October 2001 2 of 48

Philips Semiconductors ISP1122A
USB stand-alone hub

5. Pinning information

5.1 ISP1122AD (SO32) and ISP1122ANB (SDIP32)

5.1.1 Pinning

handbook, halfpage handbook, halfpage

Vreg(3.3) 1 32 PSW1/GL1 Vreg(3.3) 1 32 PSW1/GL1

PSW2/GL2 2 31 DP2 PSW2/GL2 2 31 DP2

GND 3 30 DM2 GND 3 30 DM2

DM3 4 29 DP0 DM3 4 29 DP0

DP3 5 28 DM0 DP3 5 28 DM0

VCC 6 27 DP1 VCC 6 27 DP1

OC1 7 26 DM1 OC1 7 26 DM1

OC2 8 25 DP5 OC2 8 25 DP5

ISP1122AD ISP1122ANB
OC3 9 24 DM5 OC3 9 24 DM5

OC4 10 23 INDV/SDA OC4 10 23 INDV/SDA

OC5/GOC 11 22 OPTION/SCL OC5/GOC 11 22 OPTION/SCL

DM4 12 21 RESET DM4 12 21 RESET

DP4 13 20 XTAL2 DP4 13 20 XTAL2

SP/BP 14 19 XTAL1 SP/BP 14 19 XTAL1

HUBGL 15 18 PSW5/GL5/GPSW HUBGL 15 18 PSW5/GL5/GPSW

PSW3/GL3 16 17 PSW4/GL4 PSW3/GL3 16 17 PSW4/GL4

MBL163 MBL164

Fig 2. Pin configuration SO32. Fig 3. Pin configuration SDIP32.

5.1.2 Pin description

Table 2: Pin description for SO32 and SDIP32

Symbol [1] Pin Type Description
Vreg(3.3) [2] 1 - regulated supply voltage (3.3 V ± 10%) from internal
regulator; used to connect pull-up resistor on DP0 line
PSW2/GL2 [3] 2 O modes 4 to 6: power switch control output for downstream
port 2 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 2 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
GND 3 - ground supply
DM3 4 AI/O downstream port 3 D− connection (analog) [4]
DP3 5 AI/O downstream port 3 D+ connection (analog) [4]
VCC 6 - supply voltage; connect to USB supply VBUS (bus-powered or
hybrid-powered) or to local supply VDD (self-powered)
OC1 7 AI/I overcurrent sense input for downstream port 1 (analog [5])
OC2 8 AI/I overcurrent sense input for downstream port 2 (analog [5])
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Philips Semiconductors ISP1122A
USB stand-alone hub

Table 2: Pin description for SO32 and SDIP32…continued

Symbol [1] Pin Type Description
OC3 9 AI/I overcurrent sense input for downstream port 3 (analog [5])
OC4 10 AI/I overcurrent sense input for downstream port 4 (analog [5])
OC5/GOC [3] 11 AI/I modes 5, 7: overcurrent sense input for downstream port 5
(analog [5])
modes 0, 1, 3: global overcurrent sense input (analog [5])
DM4 12 AI/O downstream port 4 D− connection (analog) [4]
DP4 13 AI/O downstream port 4 D+ connection (analog) [4]
SP/BP 14 I selects power mode:
self-powered: connect to VDD (local power supply); also use
this mode for hybrid-powered operation
bus-powered: connect to GND; disable downstream port 5 to
meet supply current requirements [4]
HUBGL 15 O hub GoodLink LED indicator output (open-drain, 6 mA);
to connect an LED use a 330 Ω series resistor; if unused
connect to VCC via a 10 kΩ resistor
PSW3/GL3 [3] 16 O modes 4 to 6: power switch control output for downstream
port 3 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 3 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
PSW4/GL4 [3] 17 O modes 4 to 6: power switch control output for downstream
port 4 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 4 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
PSW5/GL5/ 18 O mode 5: power switch control output for downstream port 5
GPSW [3] (open-drain, 6 mA)
modes 3, 7: GoodLink LED indicator output for downstream
port 5 (open-drain, 6 mA); to connect an LED use a 330 Ω
series resistor
modes 0 to 2: gang mode power switch control output
(open-drain, 6 mA)
XTAL1 19 I crystal oscillator input (6 MHz)
XTAL2 20 O crystal oscillator output (6 MHz)
RESET [2] 21 I reset input (Schmitt trigger); a LOW level produces an
asynchronous reset; connect to VCC for power-on reset
(internal POR circuit)
OPTION/SCL 22 I/O mode selection input; also functions as I2C-bus clock output
(open-drain, 6 mA)
INDV/SDA 23 I/O selects individual (HIGH) or global (LOW) power switching
and overcurrent detection; also functions as bidirectional
I2C-bus data line (open-drain, 6 mA)
DM5 24 AI/O downstream port 5 D− connection (analog) [4]
DP5 25 AI/O downstream port 5 D+ connection (analog) [4]
DM1 26 AI/O downstream port 1 D− connection (analog) [6]
DP1 27 AI/O downstream port 1 D+ connection (analog) [6]
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Philips Semiconductors ISP1122A
USB stand-alone hub

Table 2: Pin description for SO32 and SDIP32…continued

Symbol [1] Pin Type Description
DM0 28 AI/O upstream port D− connection (analog)
DP0 29 AI/O upstream port D+ connection (analog)
DM2 30 AI/O downstream port 2 D− connection (analog) [6]
DP2 31 AI/O downstream port 2 D+ connection (analog) [6]
PSW1/GL1 [3] 32 O modes 4 to 6: power switch control output for downstream
port 1 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 1 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor

[1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals.
[2] The voltage at pin Vreg(3.3) is gated by the RESET pin. This allows fully self-powered operation by
connecting RESET to VBUS (+5 V USB supply). If VBUS is lost upstream port D+ will not be driven.
[3] See Table 4 “Mode selection”.
[4] To disable a downstream port connect both D+ and D− to VCC via a 1 MΩ resistor; unused ports must
be disabled in reverse order starting from port 5.
[5] Analog detection circuit can be switched off using an external EEPROM, see Table 23; in this case,
the pin functions as a logic input (TTL level).
[6] Downstream ports 1 and 2 cannot be disabled.

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Philips Semiconductors ISP1122A
USB stand-alone hub

5.2 ISP1122ABD (LQFP32)

5.2.1 Pinning

30 PSW2/GL2

28 PSW1/GL1
idth

29 Vreg(3.3)
31 GND
32 DM3

26 DM2
27 DP2

25 DP0
DP3 1 24 DM0

VCC 2 23 DP1

OC1 3 22 DM1

OC2 4 21 DP5
ISP1122ABD
OC3 5 20 DM5

OC4 6 19 INDV/SDA

OC5/GOC 7 18 OPTION/SCL

DM4 8 17 RESET
SP/BP 10

HUBGL 11

PSW3/GL3 12

PSW4/GL4 13

PSW5/GL5/GPSW 14

XTAL1 15

XTAL2 16
9

MBL165
DP4

Fig 4. Pin configuration LQFP32.

5.2.2 Pin description

Table 3: Pin description for LQFP32

Symbol [1] Pin Type Description
Vreg(3.3) [2] 29 - regulated supply voltage (3.3 V ± 10%) from internal
regulator; used to connect pull-up resistor on DP0 line
PSW2/GL2 [3] 30 O modes 4 to 6: power switch control output for downstream
port 2 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 2 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
GND 31 - ground supply
DM3 32 AI/O downstream port 3 D− connection (analog) [4]
DP3 1 AI/O downstream port 3 D+ connection (analog) [4]
VCC 2 - supply voltage; connect to USB supply VBUS (bus-powered or
hybrid-powered) or to local supply VDD (self-powered)
OC1 3 AI/I overcurrent sense input for downstream port 1 (analog [5])
OC2 4 AI/I overcurrent sense input for downstream port 2 (analog [5])
OC3 5 AI/I overcurrent sense input for downstream port 3 (analog [5])
OC4 6 AI/I overcurrent sense input for downstream port 4 (analog [5])

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Philips Semiconductors ISP1122A
USB stand-alone hub

Table 3: Pin description for LQFP32…continued

Symbol [1] Pin Type Description
OC5/GOC [3] 7 AI/I modes 5, 7: overcurrent sense input for downstream port 5
(analog [5])
modes 0, 1, 3: global overcurrent sense input (analog [5])
DM4 8 AI/O downstream port 4 D− connection (analog) [4]
DP4 9 AI/O downstream port 4 D+ connection (analog) [4]
SP/BP 10 I selects power mode:
self-powered: connect to VDD (local power supply); also use
this mode for hybrid-powered operation
bus-powered: connect to GND; disable downstream port 5 to
meet supply current requirements [4]
HUBGL 11 O hub GoodLink LED indicator output (open-drain, 6 mA);
to connect an LED use a 330 Ω series resistor; if unused
connect to VCC via a 10 kΩ resistor
PSW3/GL3 [3] 12 O modes 4 to 6: power switch control output for downstream
port 3 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 3 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
PSW4/GL4 [3] 13 O modes 4 to 6: power switch control output for downstream
port 4 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 4 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
PSW5/GL5/ 14 O mode 5: power switch control output for downstream port 5
GPSW [3] (open-drain, 6 mA)
modes 3, 7: GoodLink LED indicator output for downstream
port 5 (open-drain, 6 mA); to connect an LED use a 330 Ω
series resistor
modes 0 to 2: gang mode power switch control output
(open-drain, 6 mA)
XTAL1 15 I crystal oscillator input (6 MHz)
XTAL2 16 O crystal oscillator output (6 MHz)
RESET [2] 17 I reset input (Schmitt trigger); a LOW level produces an
asynchronous reset; connect to VCC for power-on reset
(internal POR circuit)
OPTION/SCL 18 I/O mode selection input; also functions as I2C-bus clock output
(open-drain, 6 mA)
INDV/SDA 19 I/O selects individual (HIGH) or global (LOW) power switching
and overcurrent detection; also functions as bidirectional
I2C-bus data line (open-drain, 6 mA)
DM5 20 AI/O downstream port 5 D− connection (analog) [4]
DP5 21 AI/O downstream port 5 D+ connection (analog) [4]
DM1 22 AI/O downstream port 1 D− connection (analog) [6]
DP1 23 AI/O downstream port 1 D+ connection (analog) [6]
DM0 24 AI/O upstream port D− connection (analog)
DP0 25 AI/O upstream port D+ connection (analog)
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USB stand-alone hub

Table 3: Pin description for LQFP32…continued

Symbol [1] Pin Type Description
DM2 26 AI/O downstream port 2 D− connection (analog) [6]
DP2 27 AI/O downstream port 2 D+ connection (analog) [6]
PSW1/GL1 [3] 28 O modes 4 to 6: power switch control output for downstream
port 1 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 1 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor

[1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals.
[2] The voltage at pin Vreg(3.3) is gated by the RESET pin. This allows fully self-powered operation by
connecting RESET to VBUS (+5 V USB supply). If VBUS is lost upstream port D+ will not be driven.
[3] See Table 4 “Mode selection”.
[4] To disable a downstream port connect both D+ and D− to VCC via a 1 MΩ resistor; unused ports must
be disabled in reverse order starting from port 5.
[5] Analog detection circuit can be switched off using an external EEPROM, see Table 23; in this case,
the pin functions as a logic input (TTL level).
[6] Downstream ports 1 and 2 cannot be disabled.

6. Functional description
The ISP1122A is a stand-alone USB hub with up to 5 downstream ports. The number
of ports can be configured between 2 and 5. The downstream ports can be used to
connect low-speed or full-speed USB peripherals. All standard USB requests from
the host are handled by the hardware without the need for firmware intervention. The
block diagram is shown in Figure 1.

The ISP1122A requires only a single supply voltage. An internal 3.3 V regulator
provides the supply voltage for the analog USB data transceivers.

The ISP1122A supports both bus-powered and self-powered hub operation. When
using bus-powered operation a downstream port cannot supply more than 100 mA to
a peripheral. In case of self-powered operation an external supply is used to power
the downstream ports, allowing a current consumption of max. 500 mA per port.

A basic I2C-bus interface is provided for reading vendor ID, product ID and
configuration bits from an external EEPROM upon a reset.

6.1 Analog transceivers

The integrated transceiver interfaces directly to the USB cables through external
termination resistors. They are capable of transmitting and receiving serial data at
both ‘full-speed’ (12 Mbit/s) and ‘low-speed’ (1.5 Mbit/s) data rates. The slew rates
are adjusted according to the speed of the device connected and lie within the range
mentioned in the USB Specification Rev. 1.1.

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USB stand-alone hub

6.2 Philips Serial Interface Engine (SIE)

The Philips SIE implements the full USB protocol layer. It is completely hardwired for
speed and needs no firmware intervention. The functions of this block include:
synchronization pattern recognition, parallel/serial conversion, bit (de-)stuffing, CRC
checking/generation, Packet IDentifier (PID) verification/generation, address
recognition, handshake evaluation/generation.

6.3 Hub repeater

The hub repeater is responsible for managing connectivity on a ‘per packet’ basis. It
implements ‘packet signalling’ and ‘resume’ connectivity. Low-speed devices can be
connected to downstream ports. If a low-speed device is detected the repeater will
not propagate upstream packets to the corresponding port, unless they are preceded
by a PREAMBLE PID.

6.4 End-of-frame timers

This block contains the specified EOF1 and EOF2 timers which are used to detect
‘loss-of-activity’ and ‘babble’ error conditions in the hub repeater. The timers also
maintain the low-speed keep-alive strobe which is sent at the beginning of a frame.

6.5 General and individual port controller

The general and individual port controllers together provide status and control of
individual downstream ports. Any port status change will be reported to the host via
the hub status change (interrupt) endpoint.

6.6 GoodLink
Indication of a good USB connection is provided through GoodLink technology. An
LED can be directly connected via an external 330 Ω resistor.

During enumeration the LED blinks on momentarily. After successful configuration of

the ISP1122A, the LED is permanently on. The LED blinks off for 100 ms upon each
successful packet transfer (with ACK). The hub GoodLink indicator blinks when the
hub receives a packet addressed to it. Downstream GoodLink indicators blink upon
an acknowledgment from the associated port. In ‘suspend’ mode the LED is off.

This feature provides a user-friendly indication of the status of the hub, the connected
downstream devices and the USB traffic. It is a useful diagnostics tool to isolate faulty
USB equipment and helps to reduce field support and hotline costs.

6.7 Bit clock recovery

The bit clock recovery circuit recovers the clock from the incoming USB data stream
using a 4× oversampling principle. It is able to track jitter and frequency drift as
specified by the USB Specification Rev. 1.1.

6.8 Voltage regulator

A 5 to 3.3 V DC-DC regulator is integrated on-chip to supply the analog transceiver
and internal logic. This can also be used to supply the terminal 1.5 kΩ pull-up resistor
on the D+ line of the upstream connection.
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USB stand-alone hub

6.9 PLL clock multiplier

A 6 to 48 MHz clock multiplier Phase-Locked Loop (PLL) is integrated on-chip. This
allows for the use of low-cost 6 MHz crystals. The low crystal frequency also
minimizes Electro-Magnetic Interference (EMI). The PLL requires no external
components.

6.10 Overcurrent detection

An overcurrent detection circuit for downstream ports has been integrated on-chip. It
is self-reporting, resets automatically, has a low trip time and requires no external
components. Both individual and global overcurrent detection are supported.

6.11 I2C-bus interface

A basic serial I2C-bus interface (single master, 100 kHz) is provided to read VID, PID
and configuration bits from an external I2C-bus EEPROM (e.g. Philips PCF8582 or
equivalent). At reset the ISP1122A reads 6 bytes of data from the external memory.

The I2C-bus interface timing complies with the standard mode of operation as
described in The I2C-bus and how to use it, order number 9398 393 40011.

7. Modes of operation
The ISP1122A has several modes of operation, each corresponding with a different
pin configuration. Modes are selected by means of pins INDV, OPTION and SP/BP,
as shown in Table 4.

Table 4: Mode selection

Mode INDV OPTION SP/BP PSWn/GLn PSW5/GL5/GPSW OCn OC5/GOC
[1] [2] (n = 1 to 4) (n = 1 to 4)
0 0 0 0 GoodLink ganged power inactive global overcurrent
1 0 0 1 GoodLink ganged power inactive global overcurrent
2 0 1 0 GoodLink ganged power inactive [3] inactive [3]
3 0 1 1 GoodLink [4] GoodLink [4] inactive global overcurrent
4 1 0 0 individual power inactive individual inactive
overcurrent
5 1 0 1 individual power individual power individual individual
overcurrent overcurrent
6 1 1 0 individual power inactive inactive [3] inactive [3]
7 1 1 1 GoodLink [4] GoodLink [4] individual individual
overcurrent overcurrent

[1] Port power switching: logic 0 = ganged, logic 1 = individual.

[2] Power mode: logic 0 = bus-powered, logic 1 = self-powered (or hybrid-powered).
[3] No overcurrent detection.
[4] No power switching.

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USB stand-alone hub

8. Endpoint descriptions
Each USB device is logically composed of several independent endpoints. An
endpoint acts as a terminus of a communication flow between the host and the
device. At design time each endpoint is assigned a unique number (endpoint
identifier, see Table 5). The combination of the device address (given by the host
during enumeration), the endpoint number and the transfer direction allows each
endpoint to be uniquely referenced.

The ISP1122A has two endpoints, endpoint 0 (control) and endpoint 1 (interrupt).

Table 5: Hub endpoints

Function Ports Endpoint Transfer Direction [1] Max. packet
identifier type size (bytes)
OUT 64
0: upstream 0 control
Hub IN 64
1 to 5: downstream
1 interrupt IN 1

[1] IN: input for the USB host; OUT: output from the USB host.

8.1 Hub endpoint 0 (control)

All USB devices and functions must implement a default control endpoint (ID = 0).
This endpoint is used by the host to configure the device and to perform generic USB
status and control access.

The ISP1122A hub supports the following USB descriptor information through its
control endpoint 0, which can handle transfers of 64 bytes maximum:

• Device descriptor
• Configuration descriptor
• Interface descriptor
• Endpoint descriptor
• Hub descriptor
• String descriptor.

8.2 Hub endpoint 1 (interrupt)

Endpoint 1 is used by the ISP1122A hub to provide status change information to the
host. This endpoint can be accessed only after the hub has been configured by the
host (by sending the Set Configuration command).

Endpoint 1 is an interrupt endpoint: the host polls it once every 255 ms by sending an
IN token. If the hub has detected no change in the port status it returns a NAK (Not
AcKnowledge) response to this request, otherwise it sends the Status Change byte
(see Table 6).

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USB stand-alone hub

Table 6: Status Change byte: bit allocation

Bit Symbol Description
0 Hub SC a logic 1 indicates a status change on the hub’s upstream port
1 Port 1 SC a logic 1 indicates a status change on downstream port 1
2 Port 2 SC a logic 1 indicates a status change on downstream port 2
3 Port 3 SC a logic 1 indicates a status change on downstream port 3
4 Port 4 SC a logic 1 indicates a status change on downstream port 4
5 Port 5 SC a logic 1 indicates a status change on downstream port 5
6 reserved not used
7 reserved not used

9. Host requests
The ISP1122A handles all standard USB requests from the host via control
endpoint 0. The control endpoint can handle a maximum of 64 bytes per transfer.

Remark: Please note that the USB data transmission order is Least Significant Bit
(LSB) first. In the following tables multi-byte variables are displayed least significant
byte first.

9.1 Standard requests

Table 7 shows the supported standard USB requests. Some requests are explicitly
unsupported. All other requests will be responded to with a STALL packet.

Table 7: Standard USB requests

Request name bmRequestType bRequest wValue wIndex wLength Data
byte 0 [7:0] byte 1 byte 2, 3 byte 4, 5 byte 6, 7
(Bin) (Hex) (Hex) (Hex) (Hex)
Address
Set Address X000 0000 05 address [1] 00, 00 00, 00 none
Configuration
Get Configuration 1000 0000 08 00, 00 00, 00 01, 00 configuration
value = 01H
Set Configuration (0) X000 0000 09 00, 00 00, 00 00, 00 none
Set Configuration (1) X000 0000 09 01, 00 00, 00 00, 00 none
Descriptor
Get Configuration 1000 0000 06 00, 02 00, 00 length [2] configuration,
Descriptor interface and
endpoint
descriptors
Get Device Descriptor 1000 0000 06 00, 01 00, 00 length [2] device
descriptor
Get String Descriptor (0) 1000 0000 06 03, 00 00, 00 length [2] language ID
string
Get String Descriptor (1) 1000 0000 06 03, 01 00, 00 length [2] manufacturer
string
Get String Descriptor (2) 1000 0000 06 03, 02 00, 00 length [2] product string

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Table 7: Standard USB requests…continued

Request name bmRequestType bRequest wValue wIndex wLength Data
byte 0 [7:0] byte 1 byte 2, 3 byte 4, 5 byte 6, 7
(Bin) (Hex) (Hex) (Hex) (Hex)
Feature
Clear Device Feature X000 0000 01 01, 00 00, 00 00, 00 none
(REMOTE_WAKEUP)
Clear Endpoint (1) X000 0010 01 00, 00 81, 00 00, 00 none
Feature (HALT/STALL)
Set Device Feature X000 0000 03 01, 00 00, 00 00, 00 none
(REMOTE_WAKEUP)
Set Endpoint (1) X000 0010 03 00, 00 81, 00 00, 00 none
Feature (HALT/STALL)
Status
Get Device Status 1000 0000 00 00, 00 00, 00 02, 00 device status
Get Interface Status 1000 0001 00 00, 00 00, 00 02, 00 zero
Get Endpoint (0) Status 1000 0010 00 00, 00 00/80 [3], 00 02, 00 endpoint 0
status
Get Endpoint (1) Status 1000 0010 00 00, 00 81, 00 02, 00 endpoint 1
status
Unsupported
Set Descriptor 0000 0000 07 XX, XX XX, XX XX, XX descriptor;
STALL
Get Interface 1000 0001 0A 00, 00 XX, XX 01, 00 STALL
Set Interface X000 0001 0B XX, XX XX, XX 00, 00 STALL
Synch Frame 1000 0010 0C 00, 00 XX, XX 02, 00 STALL

[1] Device address: 0 to 127.

[2] Returned value in bytes.
[3] MSB specifies endpoint direction: 0 = OUT, 1 = IN. The ISP1122A accepts either value.

9.2 Hub specific requests

In Table 8 the supported hub specific requests are listed, as well as some
unsupported requests. Table 9 provides the feature selectors for setting or clearing
port features.

Table 8: Hub specific requests

Request name bmRequestType bRequest wValue wIndex wLength Data
byte 0 [7:0] byte 1 byte 2, 3 byte 4, 5 byte 6, 7
(Bin) (Hex) (Hex) (Hex) (Hex)
Descriptor
Get Hub Descriptor 1010 0000 06 00, 00/29 [1] 00, 00 length [2], 00 hub descriptor
Feature
Clear Hub Feature X010 0000 01 00, 00 00, 00 00, 00 none
(C_LOCAL_POWER)
Clear Port Feature X010 0011 01 feature [3], 00 port [4], 00 00, 00 none
(feature selectors)
Set Port Feature X010 0011 03 feature [3], 00 port [4], 00 00, 00 none
(feature selectors)
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Table 8: Hub specific requests…continued

Request name bmRequestType bRequest wValue wIndex wLength Data
byte 0 [7:0] byte 1 byte 2, 3 byte 4, 5 byte 6, 7
(Bin) (Hex) (Hex) (Hex) (Hex)
Status
Get Hub Status 1010 0000 00 00, 00 00, 00 04, 00 hub status and
status change
field
Get Port Status 1010 0011 00 00, 00 port [4], 00 04, 00 port status
Unsupported
Get Bus Status 1010 0011 02 00, 00 port [4], 00 01, 00 STALL
Clear Hub Feature X010 0000 01 01, 00 00, 00 00, 00 STALL
(C_OVER_CURRENT)
Set Hub Descriptor 0010 0000 07 XX, XX 00, 00 3E, 00 STALL
Set Hub Feature X010 0000 03 00, 00 00, 00 00, 00 STALL
(C_LOCAL_POWER)
Set Hub Feature X010 0000 03 01, 00 00, 00 00, 00 STALL
(C_OVER_CURRENT)

[1] USB Specification Rev. 1.0 uses 00H, USB Specification Rev. 1.1 specifies 29H.
[2] Returned value in bytes.
[3] Feature selector value, see Table 9.
[4] Downstream port identifier: 1 to N with N = number of enabled ports (2 to 5).

Table 9: Port feature selectors

Feature selector name Value (Hex) Set feature Clear feature
PORT_CONNECTION 00 not used not used
PORT_ENABLE 01 not used disables a port
PORT_SUSPEND 02 suspends a port resumes a port
PORT_OVERCURRENT 03 not used not used
PORT_RESET 04 resets and enables a not used
port
PORT_POWER 08 powers on a port powers off a port
PORT_LOW_SPEED 09 not used not used
C_PORT_CONNECTION 10 not used clears port connection
change bit
C_PORT_ENABLE 11 not used clears port enable
change bit
C_PORT_SUSPEND 12 not used clears port suspend
change bit
C_PORT_OVERCURRENT 13 not used clears port overcurrent
change bit
C_PORT_RESET 14 not used clears port reset
change bit

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9.3 Descriptors
The ISP1122A hub controller supports the following standard USB descriptors:

• Device
• Configuration
• Interface
• Endpoint
• Hub
• String.

Table 10: Device descriptor

Values in square brackets are optional.
Offset Field name Size Value Comments
(bytes) (bytes) (Hex)
0 bLength 1 12 descriptor length = 18 bytes
1 bDescriptorType 1 01 type = DEVICE
2 bcdUSB 2 10, 01 USB Specification Rev. 1.1
4 bDeviceClass 1 09 HUB_CLASSCODE
5 bDeviceSubClass 1 00 -
6 bDeviceProtocol 1 00 -
7 bMaxPacketSize0 1 40 packet size = 64 bytes
8 idVendor 2 CC, 04 Philips Semiconductors vendor ID
(04CC); can be customized using an
external EEPROM (see Table 23)
10 idProduct 2 22, 11 ISP1122A product ID; can be
customized using an external
EEPROM (see Table 23)
12 bcdDevice 2 01, 01 device release 1.1; silicon revision
increments this value
14 iManufacturer 1 00 no manufacturer string (default)
[01] manufacturer string enabled
(using an external EEPROM)
15 iProduct 1 00 no product string (default)
[02] product string enabled
(using an external EEPROM)
16 iSerialNumber 1 00 no serial number string
17 bNumConfigurations 1 01 one configuration

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Table 11: Configuration descriptor

Values in square brackets are optional.
Offset Field name Size Value Comments
(bytes) (bytes) (Hex)
0 bLength 1 09 descriptor length = 9 bytes
1 bDescriptorType 1 02 type = CONFIGURATION
2 wTotalLength 2 19, 00 total length of configuration, interface
and endpoint descriptors (25 bytes)
4 bNumInterfaces 1 01 one interface
5 bConfigurationValue 1 01 configuration value = 1
6 iConfiguration 1 00 no configuration string
7 bmAttributes 1 E0 self-powered with remote wake-up [1]
A0 bus-powered with remote wake-up [1]
8 MaxPower [2] 1 32 100 mA (default)
[00] 0 mA (using an external EEPROM)
[FA] 500 mA (using an external EEPROM)

[1] Selected by input SP/BP.

[2] Value in units of 2 mA.

Table 12: Interface descriptor

Offset Field name Size Value Comments
(bytes) (bytes) (Hex)
0 bLength 1 09 descriptor length = 9 bytes
1 bDescriptorType 1 04 type = INTERFACE
2 bInterfaceNumber 1 00 -
3 bAlternateSetting 1 01 no alternate setting
4 bNumEndpoints 1 01 status change (interrupt) endpoint
5 bInterfaceClass 1 09 HUB_CLASSCODE
6 bInterfaceSubClass 1 00 -
7 bInterfaceProtocol 1 00 no class-specific protocol
8 bInterface 1 00 no interface string

Table 13: Endpoint descriptor

Offset Field name Size Value Comments
(bytes) (bytes) (Hex)
0 bLength 1 07 descriptor length = 7 bytes
1 bDescriptorType 1 05 type = ENDPOINT
2 bEndpointAddress 1 81 endpoint 1, direction: IN
3 bmAttributes 1 03 interrupt endpoint
4 wMaxPacketSize 2 01, 00 packet size = 1 byte
6 bInterval 1 FF polling interval (255 ms)

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Table 14: Hub descriptor

Values in square brackets are optional.
Offset Field name Size Value Comments
(bytes) (bytes) (Hex)
0 bDescLength 1 09 descriptor length = 9 bytes
1 bDescriptorType 1 29 type = HUB
2 bNbrPorts 1 05 to 02 number of enabled downstream ports;
selectable by DP/DM strapping
3 wHubCharacteristics 2 09, 00 individual power switching [1],
overcurrent protection active
(modes 0, 1, 3, 4, 5, 7)
11, 00 individual power switching [1], no
overcurrent protection (modes 2, 6) [2]
5 bPwrOn2PwrGood [3] 1 32 100 ms (default; modes 0, 1, 2, 4, 5, 6)
00 0 ms (default; modes 3, 7)
[FA] 500 ms (using an external EEPROM;
modes 0, 1, 2, 4, 5, 6); see Table 23
6 bHubContrCurrent 1 64 maximum hub controller current
(100 mA)
7 DeviceRemovable 1 00 all devices removable
8 PortPwrCtrlMask 1 FF must be all ones for compatibility with
USB Specification Rev. 1.0
[1] ISP1122A always reports power management status on an individual basis, even for ganged/global
modes. This is compliant with USB Specification Rev. 1.1.
[2] Condition with no overcurrent detection is reported to the host.
[3] Value in units of 2 ms.

Table 15: String descriptors

String descriptors are optional and therefore disabled by default; they can be enabled through
an external EEPROM.
Offset Field name Size Value Comments
(bytes) (bytes) (Hex)
String descriptor (0): language ID string
0 bLength 1 04 descriptor length = 4 bytes
1 bDescriptorType 1 03 type = STRING
2 bString 2 09, 04 LANGID code zero
String descriptor (1): manufacturer string
0 bLength 1 2E descriptor length = 46 bytes
1 bDescriptorType 1 03 type = STRING
2 bString 44 UC [1] “Philips Semiconductors”
String descriptor (2): product string
0 bLength 1 10 descriptor length = 16 bytes
1 bDescriptorType 1 03 type = STRING
2 bString 14 UC [1] “ISP1122”

[1] Unicode encoded string.

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9.4 Hub responses

This section describes the hub responses to requests from the USB host.

9.4.1 Get device status

The hub returns 2 bytes, see Table 16.

Table 16: Get device status response

Bit # Function Value Description
0 self-powered 0 bus-powered
1 self-powered
1 remote wake-up 0 no remote wake-up
1 remote wake-up enabled
2 to 15 reserved 0 -

9.4.2 Get configuration

The hub returns 1 byte, see Table 17.

Table 17: Get configuration response

Bit # Function Value Description
0 configuration value 0 device not configured
1 device configured
1 to 7 reserved 0 -

9.4.3 Get interface status

The hub returns 2 bytes, see Table 18.

Table 18: Get interface status response

Bit # Function Value Description
0 to 15 reserved 0 -

9.4.4 Get hub status

The hub returns 4 bytes, see Table 19.

Table 19: Get hub status response

Bit # Function Value Description
0 local power source 0 local power supply good
1 local power supply lost
1 overcurrent indicator 0 no overcurrent condition
1 hub overcurrent condition detected
2 to 15 reserved 0 -
16 local power status change 0 no change in local power status
1 local power status changed
17 overcurrent indicator change 0 no change in overcurrent condition
1 overcurrent condition changed
18 to 31 reserved 0 -

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9.4.5 Get port status

The hub returns 4 bytes. The first 2 bytes contain the port status bits (wPortStatus,
see Table 20). The last 2 bytes hold the port status change bits (wPortChange, see
Table 21).

Table 20: Get port status response (wPortStatus)

Bit # Function Value Description
0 current connect status 0 no device present
1 device present on this port
1 port enabled/disabled 0 port disabled
1 port enabled
2 suspend 0 port not suspended
1 port suspended
3 overcurrent indicator 0 no overcurrent condition
1 overcurrent condition detected
4 reset 0 reset not asserted
1 reset asserted
5 to 7 reserved 0 -
8 port power 0 port powered off
1 port power on
9 low-speed device attached 0 full-speed device attached
1 low-speed device attached
10 to 15 reserved 0 -

Table 21: Get port status response (wPortChange)

Bit # Function Value Description
0 connect status change 0 no change in current connect status
1 current connect status changed
1 port enabled/disabled 0 no port error
change 1 port disabled by a port error
2 suspend change 0 no change in suspend status
1 resume complete
3 overcurrent indicator change 0 no change in overcurrent status
1 overcurrent indicator changed
4 reset change 0 no change in reset status
1 reset complete
5 to 15 reserved 0 -

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9.4.6 Get configuration descriptor

The hub returns 25 bytes containing the configuration descriptor (9 bytes, see
Table 11), the interface descriptor (9 bytes, see Table 12) and the endpoint descriptor
(7 bytes, see Table 13).

9.4.7 Get device descriptor

The hub returns 18 bytes containing the device descriptor, see Table 10.

9.4.8 Get hub descriptor

The hub returns 9 bytes containing the hub descriptor, see Table 14.

9.4.9 Get string descriptor (0)

The hub returns 4 bytes containing the language ID, see Table 15.

9.4.10 Get string descriptor (1)

The hub returns 46 bytes containing the manufacturer name, see Table 15.

9.4.11 Get string descriptor (2)

The hub returns 16 bytes containing the product name, see Table 15.

10. I2C-bus interface

A simple I2C-bus interface is provided in the ISP1122A to read customized vendor ID,
product ID and some other configuration bits from an external EEPROM. The
interface supports single master operation at a nominal bus speed of 93.75 kHz.

The I2C-bus interface is intended for bidirectional communication between ICs via two
serial bus wires, SDA (data) and SCL (clock). Both lines are driven by open-drain
circuits and must be connected to the positive supply voltage via pull-up resistors.

10.1 Protocol
The I2C-bus protocol defines the following conditions:

• Bus free: both SDA and SCL are HIGH

• START: a HIGH-to-LOW transition on SDA, while SCL is HIGH
• STOP: a LOW-to-HIGH transition on SDA, while SCL is HIGH
• Data valid: after a START condition, data on SDA are stable during the HIGH
period of SCL; data on SDA may only change while SCL is LOW.

Each device on the I2C-bus has a unique slave address, which the master uses to
select a device for access.

The master starts a data transfer using a START condition and ends it by generating
a STOP condition. Transfers can only be initiated when the bus is free. The receiver
must acknowledge each byte by means of a LOW level on SDA during the ninth clock
pulse on SCL.

For detailed information please consult The I2C-bus and how to use it., order number
9398 393 40011.

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10.2 Hardware connections

Via the I2C-bus interface the ISP1122A can be connected to an external EEPROM
(PCF8582 or equivalent). The hardware connections are shown in Figure 5.

The SCL and SDA pins are multiplexed with pins OPTION and INDV respectively.

idth VDD VDD

RP RP

OPTION/SCL SCL A0

INDV/SDA SDA A1
I2C-bus
PCF8582 A2
ISP1122A EEPROM
USB HUB or
equivalent

MBL166

Fig 5. EEPROM connection diagram.

The slave address which ISP1122A uses to access the EEPROM is 1010000B. Page
mode addressing is not supported, so pins A0, A1 and A2 of the EEPROM must be
connected to GND (logic 0).

10.3 Data transfer

When the ISP1122A is reset, the I2C-bus interface tries to read 6 bytes of
configuration data from an external EEPROM. If no response is detected, the levels
on inputs SDA and SCL are interpreted as INDV and OPTION to select the operating
mode (see Table 4).

The data in the EEPROM memory are organized as shown in Table 22.

Table 22: EEPROM organization

Address Default value Contents
(Hex) (Hex)
00 CC idVendor [1] (lower byte)
01 04 idVendor [1] (upper byte)
02 22 idProduct [2] (lower byte)
03 11 idProduct [2] (upper byte)
04 - configuration bits C7 to C0; see Table 23
05 AA signature

[1] Vendor ID code in the Device descriptor, see Table 10.

[2] Product ID code in the Device descriptor, see Table 10.

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Table 23: Configuration bits

Bit Function Value Description
(Bin)
C0 OPTION see Table 4 “Mode selection”
C1 INDV see Table 4 “Mode selection”
C2 reserved 0 [1] must always be programmed to logic 0
C3 PwrOn2PwrGood [2] 0 [1] 100 ms (bPwrOn2PwrGood = 32H)
1 500 ms (bPwrOn2PwrGood = FAH)
C4 string descriptor enable 0 [1] string descriptors disabled
1 string descriptors enabled (strings:
“Philips Semiconductors”, “ISP1122”)
C5 internal analog overcurrent 0 internal analog overcurrent detection
detection enable circuit disabled; overcurrent pins OCn
function as digital inputs (TTL level)
1 [1] internal analog overcurrent detection
circuit enabled
C7, C6 MaxPower [3] 00 [1] 100 mA (MaxPower = 32H)
1X 500 mA (MaxPower = FAH)
01 0 mA (MaxPower = 00H)

[1] Default value at reset if no external EEPROM is present.

[2] Modifies the Hub Descriptor field ‘bPwrOn2PwrGood’, see Table 14.
[3] Modifies the Hub Descriptor field ‘MaxPower’, see Table 14.

11. Hub power modes

USB hubs can either be self-powered or bus-powered.

Self-powered — Self-powered hubs have a 5 V local power supply on board which

provide power to the hub and the downstream ports. The USB Specification Rev. 1.1
requires that these hubs limit the current to 500 mA per downstream port and report
overcurrent conditions to the host. The hub may optionally draw 100 mA from the
USB supply (VBUS) to power the interface functions (hybrid-powered).

Bus-powered — Bus-powered hubs obtain all power from the host or an upstream
self-powered hub. The maximum current is 100 mA per downstream port. Current
limiting and reporting of overcurrent conditions are both optional.

Power switching of downstream ports can be done individually or ganged, where all
ports are switched simultaneously with one power switch. The ISP1122A supports
both modes, which can be selected using input INDV (see Table 4).

11.1 Voltage drop requirements

11.1.1 Self-powered hubs
Self-powered hubs are required to provide a minimum of 4.75 V to its output port
connectors at all legal load conditions. To comply with Underwriters Laboratory Inc.
(UL) safety requirements, the power from any port must be limited to 25 W (5 A at
5 V). Overcurrent protection may be implemented on a global or individual basis.

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Assuming a 5 V ± 3% power supply the worst case supply voltage is 4.85 V. This only
allows a voltage drop of 100 mV across the hub printed-circuit board (PCB) to each
downstream connector. This includes a voltage drop across:

• Power supply connector

• Hub PCB (power and ground traces, ferrite beads)
• Power switch (FET on-resistance)
• Overcurrent sense device.

PCB resistance and power supply connector resistance may cause a drop of 25 mV,
leaving only 75 mV as the voltage drop allowed across the power switch and
overcurrent sense device. The individual voltage drop components are shown in
Figure 6.

voltage drop voltage drop

4.85 V(min) 75 mV 25 mV
4.75 V(min)
5V + VBUS
POWER SUPPLY hub board (1) D+
± 3% regulated − low-ohmic resistance downstream
PMOS switch D− port
connector
ISP1122A GND
power SHIELD
switch
04aa03

(1) Includes PCB traces, ferrite beads, etc.

Fig 6. Typical voltage drop components in self-powered mode using individual overcurrent detection.

In case of global overcurrent detection an increased voltage drop is needed for the
overcurrent sense device (in this case a low-ohmic resistor). This can be realized by
using a special power supply of 5.1 V ± 3%, as shown in Figure 7.

voltage drop voltage drop voltage drop

4.95 V(min) 100 mV 75 mV 25 mV
4.75 V(min)
5.1 V KICK-UP + VBUS
POWER SUPPLY low-ohmic hub board (1) D+
± 3% regulated − sense resistor low-ohmic resistance downstream
for overcurrent PMOS switch D− port
detection connector
ISP1122A GND
power SHIELD
switch
04aa05

(1) Includes PCB traces, ferrite beads, etc.

Fig 7. Typical voltage drop components in self-powered mode using global overcurrent detection.

11.1.2 Bus-powered hubs

Bus-powered hubs are guaranteed to receive a supply voltage of 4.5 V at the
upstream port connector and must provide a minimum of 4.4 V to the downstream
port connectors. The voltage drop of 100 mV across bus-powered hubs includes:

• Hub PCB (power and ground traces, ferrite beads)

• Power switch (FET on-resistance)
• Overcurrent sense device.

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The PCB resistance may cause a drop of 25 mV, which leaves 75 mV for the power
switch and overcurrent sense device. The voltage drop components are shown in
Figure 8.

For bus-powered hubs overcurrent protection is optional. It may be implemented for

all downstream ports on a global or individual basis.

voltage drop voltage drop

75 mV 25 mV
4.50 V(min) 4.40 V(min)
VBUS VBUS
D+ hub board (1) D+
upstream low-ohmic resistance downstream
port D− PMOS switch D− port
connector connector
GND ISP1122A GND
SHIELD power SHIELD
switch
04aa06

(1) Includes PCB traces, ferrite beads, etc.

Fig 8. Typical voltage drop components in bus-powered mode (no overcurrent detection).

12. Overcurrent detection

The ISP1122A has an analog overcurrent detection circuit for monitoring downstream
port lines. This circuit automatically reports an overcurrent condition to the host and
turns off the power to the faulty port. The host must reset the condition flag.

Pins OC1 to OC5/GOC are used for individual port overcurrent detection. Pin
OC5/GOC can also be used for global overcurrent detection. This is controlled by
input INDV (see Table 4).

The overcurrent detection circuit can be switched off using an external EEPROM (see
Table 23). In this case, the overcurrent pins OCn function as logic inputs (TTL level).

12.1 Overcurrent circuit description

The integrated overcurrent detection circuit of ISP1122A senses the voltage drop
across the power switch or an extra low-ohmic sense resistor. When the port draws
too much current, the voltage drop across the power switch exceeds the trip voltage
threshold (∆Vtrip). The overcurrent circuit detects this and switches off the power
switch control signal after a delay of 15 ms (ttrip). This delay acts as a ‘debounce’
period to minimize false tripping, especially during the inrush current produced by ‘hot
plugging’ of a USB device.

12.2 Power switch selection

From the voltage drop analysis given in Figure 6, Figure 7 and Figure 8, the power
switch has a voltage drop budget of 75 mV. For individual self-powered mode, the
current drawn per port can be up to 500 mA. Thus the power switch should have
maximum on-resistance of 150 mΩ.

If the voltage drop due to the hub board resistance can be minimized, the power
switch can have more voltage drop budget and therefore a higher on-resistance.
Power switches with a typical on-resistance of around 100 mΩ fit into this application.

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The ISP1122A overcurrent detection circuit has been designed with a nominal trip
voltage (∆Vtrip) of 85 mV. This gives a typical trip current of approximately 850 mA for
a power switch with an on-resistance of 100 mΩ1.

12.3 Tuning the overcurrent trip voltage

The ISP1122A trip voltage can optionally be adjusted through external components
to set the desired trip current. This is done by inserting tuning resistors at pins SP/BP
or OCn (see Figure 9). Rtu tunes up the trip voltage ∆Vtrip and Rtd tunes it down
according to Equation 1.

∆V trip = ∆V trip ( intrinsic ) + I ref ⋅ R tu – I OC ⋅ R td (1)

with Iref(nom) = 5 µA and IOC(nom) = 0.5 µA.

handbook, halfpage low-ohmic handbook, halfpage low-ohmic

PMOS switch PMOS switch
VCC VBUS
Iref IOC IOC

Rtu Rtd Rtd

VCC SP/BP OCn VCC SP/BP OCn

ISP1122A ISP1122A

MBL167 MBL168

Iref(nom) = 5 µA IOC(nom) = 0.5 µA

IOC(nom) = 0.5 µA
a. Self-powered mode. b. Bus-powered mode.
Fig 9. Tuning the overcurrent trip voltage.

12.4 Reference circuits

Some typical examples of port power switching and overcurrent detection modes are
given in Figure 10 to Figure 13.

The RC circuit (47 kΩ and 0.1 µF) around the PMOS switch provides for soft turn-on.
The series resistor connecting the SP/BP pin to VCC tunes up the overcurrent trip
voltage slightly (see Figure 9). In the schematic diagram the resistor separates the
net names for pins VCC and SP/BP. This allows an automatic router to use a wide
trace for VCC and a narrow trace to connect pin SP/BP.

1. The following PMOS power switches have been tested to work well with the ISP1122A: Philips PHP109, Vishay Siliconix Si2301DS,
Fairchild FDN338P.

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handbook, full pagewidth downstream

low-ohmic ports
+4.85 V(min) PMOS switch ferrite bead
5V + VBUS
POWER SUPPLY 1 +4.75 V
120
± 3% − 0.1 µF (min) D+
µF D− 1
47 kΩ
GND
SHIELD

low-ohmic
PMOS switch ferrite bead
330 kΩ
VBUS
(5×) 2 +4.75 V
120
0.1 µF (min) D+
µF D− 2
47 kΩ
GND
SHIELD

low-ohmic
+4.85 V(min) ferrite bead
VCC PMOS switch
PSW1/GL1 VBUS
3 +4.75 V
120
GND 0.1 µF (min) D+
PSW2/GL2 µF D− 3
47 kΩ
PSW3/GL3 GND
SHIELD
100 Ω PSW4/GL4
to low-ohmic
1 kΩ PMOS switch ferrite bead
PSW5/GL5/GPSW
VBUS
4 +4.75 V
120
0.1 µF (min) D+
µF
D− 4
47 kΩ
INDV GND
SHIELD
SP/BP
low-ohmic
OPTION PMOS switch ferrite bead
VBUS
5 +4.75 V
120
0.1 µF (min) D+
ISP1122A µF
D− 5
47 kΩ
GND
SHIELD
OC1
MBL170
OC2

OC3

OC4

OC5/GOC

Power switches 1 to 5 are low-ohmic PMOS devices as specified in Section 12.2.

Fig 10. Mode 5: self-powered hub; individual port power switching; individual overcurrent detection.

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handbook, full pagewidth downstream

ports
+4.95 V(min) ferrite bead
5.1 V KICK-UP + VBUS
+4.75 V
POWER SUPPLY 120
− (min) D+
± 3% low-ohmic µF D− 1
sense resistor
for overcurrent GND
detection SHIELD
330
+4.95 V(min) kΩ ferrite bead
VCC VBUS
PSW1/GL1 +4.75 V
120
GND (min) D+
PSW2/GL2 µF D−
low-ohmic 2
PMOS switch GND
PSW3/GL3
SHIELD
100 Ω 0.1 µF
PSW4/GL4
to
1 kΩ 47 kΩ ferrite bead
PSW5/GL5/GPSW VBUS
+4.75 V
120
(min) D+
µF D− 3
INDV GND
SHIELD
SP/BP

OPTION ferrite bead

VBUS
+4.75 V
120
ISP1122A (min) D+
µF D− 4
GND
OC1 SHIELD

OC2
ferrite bead
OC3 VBUS
+4.75 V
120
(min) D+
OC4 µF D− 5
OC5/GOC GND
SHIELD

MBL171

Power switch is low-ohmic PMOS device as specified in Section 12.2.

Fig 11. Mode 1: self-powered hub; ganged port power switching; global overcurrent detection.

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handbook, full pagewidth upstream downstream

port low-ohmic ports
+4.50 V(min) PMOS switch ferrite bead
VBUS VBUS
1 +4.40 V
D+ 120
0.1 µF (min) D+
D− µF D− 1
47 kΩ
GND GND
330 kΩ
SHIELD SHIELD
(4×)
low-ohmic
PMOS switch ferrite bead
VBUS
2 +4.40 V
120
0.1 µF (min) D+
VCC
PSW1/GL1 µF D− 2
47 kΩ
PSW2/GL2 GND
GND
SHIELD
PSW3/GL3
low-ohmic
PMOS switch ferrite bead
PSW4/GL4
VBUS
3 +4.40 V
120
PSW5/GL5/GPSW 0.1 µF (min) D+
µF D− 3
47 kΩ
GND
SHIELD
INDV low-ohmic
PMOS switch ferrite bead
SP/BP VBUS
4 +4.40 V
120
0.1 µF (min) D+
OPTION µF D− 4
47 kΩ
GND
ISP1122A SHIELD

MBL172
OC1

OC2

OC3

OC4

OC5/GOC

Power switches 1 to 4 are low-ohmic PMOS devices as specified in Section 12.2.

Fig 12. Mode 4: bus-powered hub; individual port power switching; individual overcurrent detection.

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handbook, full pagewidth upstream downstream

port ports
+4.50 V(min) ferrite bead
VBUS VBUS
+4.40 V
D+ 120
(min) D+
D− µF D− 1
GND GND
SHIELD SHIELD
330
kΩ ferrite bead
VBUS
+4.40 V
120
(min) D+
VCC PSW1/GL1 µF D− 2

low-ohmic GND
GND PSW2/GL2
PMOS switch SHIELD
PSW3/GL3
0.1 µF ferrite bead
PSW4/GL4 VBUS
47 kΩ +4.40 V
120
PSW5/GL5/GPSW (min) D+
µF D− 3
INDV GND
SHIELD
SP/BP

OPTION ferrite bead

VBUS
+4.40 V
120
(min) D+
µF D− 4
ISP1122A
GND
SHIELD
MBL173
OC1

OC2

OC3

OC4

OC5/GOC

Power switch is low-ohmic PMOS device as specified in Section 12.2.

Fig 13. Mode 0: bus-powered hub; ganged port power switching; global overcurrent detection.

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13. Limiting values

Table 24: Absolute maximum ratings
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage −0.5 +6.0 V
VI input voltage −0.5 VCC + 0.5 V
Ilatchup latchup current VI < 0 or VI > VCC - 100 mA
Vesd electrostatic discharge voltage ILI < 1 µA [1] [2] - ±1500 V
Tstg storage temperature −60 +150 °C
Ptot total power dissipation - 95 mW

[1] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).
[2] Values are given for device only; in-circuit Vesd(max) = ±8000 V.

Table 25: Recommended operating conditions

Symbol Parameter Conditions Min Max Unit
VCC supply voltage 4.0 5.5 V
VI input voltage 0 5.5 V
VI(AI/O) input voltage on analog I/O pins 0 3.6 V
(D+/D−)
VO(od) open-drain output pull-up voltage 0 5.5 V
Tamb operating ambient temperature −40 +85 °C

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14. Static characteristics

Table 26: Static characteristics; supply pins
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Vreg(3.3) regulated supply voltage 3.0 [1] 3.3 3.6 V
ICC operating supply current - 18 - mA
ICC(susp) suspend supply current 1.5 kΩ pull-up on upstream - - 270 µA
port D+ (pin DP0)
no pull-up on upstream port - - 80 µA
D+ (pin DP0)

[1] In ‘suspend’ mode the minimum voltage is 2.7 V.

Table 27: Static characteristics: digital pins

VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Input levels
VIL LOW-level input voltage - - 0.8 V
VIH HIGH-level input voltage 2.0 - - V
Schmitt trigger inputs
Vth(LH) positive-going threshold 1.4 - 1.9 V
voltage
Vth(HL) negative-going threshold 0.9 - 1.5 V
voltage
Vhys hysteresis voltage 0.4 - 0.7 V
Output levels
VOL LOW-level output voltage IOL = 6 mA - - 0.4 V
(open drain outputs) IOL = 20 µA - - 0.1 V
Leakage current
ILI input leakage current - - ±1 µA
Open-drain outputs
IOZ OFF-state output current - - ±1 µA

Table 28: Static characteristics: overcurrent sense pins

VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
overcurrent detection ∆V = VCC − VOCn [1]
∆Vtrip trip voltage on OCn pins 65 85 105 mV
∆V = VSP/BP − VOCn [2]

[1] Bus-powered mode.

[2] Self-powered or hybrid-powered mode.

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Table 29: Static characteristics: analog I/O pins (D+, D−) [1]
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Input levels
VDI differential input sensitivity |VI(D+) − VI(D−)| 0.2 - - V
VCM differential common mode includes VDI range 0.8 - 2.5 V
voltage
VIL LOW-level input voltage - - 0.8 V
VIH HIGH-level input voltage 2.0 - - V
Output levels
VOL LOW-level output voltage RL = 1.5 kΩ to +3.6V - - 0.3 V
VOH HIGH-level output voltage RL = 15 kΩ to GND 2.8 - 3.6 V
Leakage current
ILZ OFF-state leakage current - - ±10 µA
Capacitance
CIN transceiver capacitance pin to GND - - 20 pF
Resistance
ZDRV [2] driver output impedance steady-state drive 28 - 44 Ω
ZINP input impedance 10 - - MΩ
Termination
VTERM [3] termination voltage for 3.0 [4] - 3.6 V
upstream port pull-up (RPU)

[1] D+ is the USB positive data pin (DPn); D− is the USB negative data pin (DMn).
[2] Includes external resistors of 20 Ω ±1% on both D+ and D−.
[3] This voltage is available at pin Vreg(3.3).
[4] In ‘suspend’ mode the minimum voltage is 2.7 V.

15. Dynamic characteristics

Table 30: Dynamic characteristics
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Reset
tW(RESET) pulse width on input RESET crystal oscillator running 10 - - µs
crystal oscillator stopped - 2 [1] - ms
Crystal oscillator
fXTAL crystal frequency - 6 - MHz

[1] Dependent on the crystal oscillator start-up time.

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Table 31: Dynamic characteristics: overcurrent sense pins

VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ttrip overcurrent trip response time see Figure 14 [1]
- - 15 ms
from OCn LOW to PSWn HIGH

[1] Operating modes 0, 1, 4 and 5; see Table 4.

Table 32: Dynamic characteristics: analog I/O pins (D+, D−); full-speed mode [1]
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D+ to VTERM.; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Driver characteristics
tFR rise time CL = 50 pF; 4 - 20 ns
10 to 90% of |VOH − VOL|
tFF fall time CL = 50 pF; 4 - 20 ns
10 to 90% of |VOH − VOL|
FRFM differential rise/fall time [2] 90 - 111.11 %
matching (tFR/tFF)
VCRS output signal crossover voltage [2] [3] 1.3 - 2.0 V
Data source timing
tDJ1 source differential jitter for see Figure 15 [2] [3] −3.5 - +3.5 ns
consecutive transitions
tDJ2 source differential jitter for see Figure 15 [2] [3] −4 - +4 ns
paired transitions
tFEOPT source EOP width see Figure 16 [3] 160 - 175 ns
tFDEOP source differential data-to-EOP see Figure 16 [3] −2 - +5 ns
transition skew
Receiver timing
tJR1 receiver data jitter tolerance for see Figure 17 [3] −18.5 - +18.5 ns
consecutive transitions
tJR2 receiver data jitter tolerance for see Figure 17 [3] −9 - +9 ns
paired transitions
tFEOPR receiver SE0 width accepted as EOP; [3] 82 - - ns
see Figure 16
tFST width of SE0 during differential rejected as EOP; [3] - - 14 ns
transition see Figure 18
Hub timing (downstream ports configured as full-speed)
tFHDD hub differential data delay see Figure 19; [3] - - 44 ns
(without cable) CL = 0 pF
tFSOP data bit width distortion after see Figure 19 [3] −5 - +5 ns
SOP
tFEOPD hub EOP delay relative to tHDD see Figure 20 [3] 0 - 15 ns
tFHESK hub EOP output width skew see Figure 20 [3] −15 - +15 ns

[1] Test circuit: see Figure 22.

[2] Excluding the first transition from Idle state.
[3] Characterized only, not tested. Limits guaranteed by design.

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Table 33: Dynamic characteristics: analog I/O pins (D+, D−); low-speed mode [1]
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D− to VTERM; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Driver characteristics
tLR rise time CL = 200 to 600 pF; 75 - 300 ns
10 to 90% of |VOH − VOL|
tLF fall time CL = 200 to 600 pF; 75 - 300 ns
10 to 90% of |VOH − VOL|
LRFM differential rise/fall time [2] 80 - 125 %
matching (tLR/tLF)
VCRS output signal crossover voltage [2] [3] 1.3 - 2.0 V
Hub timing (downstream ports configured as low-speed)
tLHDD hub differential data delay see Figure 19 - - 300 ns
tLSOP data bit width distortion after see Figure 19 [3] −60 - +60 ns
SOP
tLEOPD hub EOP delay relative to tHDD see Figure 20 [3] 0 - 200 ns
tLHESK hub EOP output width skew see Figure 20 [3] −300 - +300 ns

[1] Test circuit: see Figure 22.

[2] Excluding the first transition from Idle state.
[3] Characterized only, not tested. Limits guaranteed by design.

VCC
∆Vtrip
overcurrent
input

0V
ttrip
VCC

power switch
output

MBL032
0V

Overcurrent input: OCn; power switch output: PSWn.

Reference voltage for overcurrent sensing: VCC (bus-powered mode) or VSP/BP (self-powered mode).
Fig 14. Overcurrent trip response timing.

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TPERIOD

+3.3 V

crossover point crossover point crossover point

differential
data lines

0V
MGR870
consecutive
transitions
N × TPERIOD + t DJ1
paired
transitions
N × TPERIOD + t DJ2

TPERIOD is the bit duration corresponding with the USB data rate.
Fig 15. Source differential data jitter.

TPERIOD

+3.3 V
crossover point
crossover point
extended
differential
data lines

0V
differential data to source EOP width: t EOPT
SE0/EOP skew
N × TPERIOD + t DEOP receiver EOP width: t EOPR
MGR776

TPERIOD is the bit duration corresponding with the USB data rate.
Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L’.
Fig 16. Source differential data-to-EOP transition skew and EOP width.

TPERIOD

+3.3 V

differential
data lines

0V
MGR871
tJR tJR1 tJR2

consecutive
transitions
N × TPERIOD + t JR1
paired
transitions
N × TPERIOD + t JR2

TPERIOD is the bit duration corresponding with the USB data rate.
Fig 17. Receiver differential data jitter.

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tFST
+3.3 V

differential VIH(min)
data lines

0V
MGR872

Fig 18. Receiver SE0 width tolerance.

+3.3 V

upstream crossover downstream crossover

differential point differential point
data lines data

0V
hub delay hub delay
downstream upstream
t HDD t HDD
+3.3 V

downstream crossover upstream crossover

differential point differential point
data lines data

0V
MGR777
(A) downstream hub delay (B) upstream hub delay

SOP distortion:
t SOP = t HDD (next J) − t HDD(SOP)

Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L’.
Fig 19. Hub differential data delay and SOP distortion.

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+3.3 V

upstream crossover crossover

downstream
differential point point
port
data lines extended extended

0V
t EOP− t EOP+ t EOP− t EOP+

+3.3 V

downstream crossover crossover

upstream
differential point point
end of cable
data lines extended extended

0V
MGR778
(A) downstream EOP delay (B) upstream EOP delay

EOP delay:
t EOP = max (t EOP−, tEOP+)

EOP delay relative to t HDD:

t EOPD = t EOP − t HDD

EOP skew:
t HESK = t EOP+ − t EOP−

Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L’.
Fig 20. Hub EOP delay and EOP skew.

Table 34: Dynamic characteristics: I2C-bus pins (SDA, SCL)

VCC and Tamb within recommended operating range; VDD = +5 V; VSS = VGND ; VIL and VIH between VSS and VDD.
Symbol Parameter Conditions Min Typ Max Unit
fSCL SCL clock frequency fXTAL = 6 MHz 0 93.75 [1] 100 kHz
tBUF bus free time 4.7 - - µs
tSU;STA START condition set-up time 250 - - ns
tHD;STA hold time START condition 4.0 - - µs
tLOW SCL LOW time 4.7 - - µs
tHIGH SCL HIGH time 4.0 - - µs
tr SCL and SDA rise time [2] - - 1000 ns
tf SCL and SDA fall time - - 300 ns
tSU;DAT data set-up time 250 - - ns
tHD;DAT data hold time 0 - - µs
tVD;DAT SCL LOW to data out valid - - 0.4 µs
time
tSU;STO STOP condition set-up time 4.0 - - µs
Cb capacitive load for each bus - - 400 pF
line

[1] fSCL = 1⁄64fXTAL.

[2] Rise time is determined by Cb and pull-up resistor value Rp (typ. 4.7 kΩ).

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SDA

t BUF t LOW tr tf t HD;STA

SCL
P S S P

t HD;STA t HD;STA t HIGH t SU;DAT t SU;STA t SU;STO

MGR779

Fig 21. I2C-bus timing.

16. Test information

The dynamic characteristics of the analog I/O ports (D+ and D−) as listed in Table 32
and Table 33, were determined using the circuit shown in Figure 22.

Vreg(3.3)
test point
RPU
1.5 kΩ
20 Ω S1
D.U.T.

CL test S1
15 kΩ
D−/LS closed
D+/LS open
D−/FS open
D+/FS closed
MGR775

Load capacitance:
CL = 50 pF (full-speed mode)
CL = 200 pF or 600 pF (low-speed mode, minimum or maximum timing).
Speed selection:
full-speed mode (FS): 1.5 kΩ pull-up resistor on D+
low-speed mode (LS): 1.5 kΩ pull-up resistor on D−.
Fig 22. Load impedance for D+ and D- pins.

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17. Package outline

SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1

D E A
X

y HE v M A

32 17

Q
A2 A
A1 (A 3)
pin 1 index
θ
Lp

1 16 L

w M detail X
e bp

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A
UNIT max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ

0.3 2.45 0.49 0.27 20.7 7.6 10.65 1.1 1.2 0.95
mm 2.65 0.25 1.27 1.4 0.25 0.25 0.1 o
0.1 2.25 0.36 0.18 20.3 7.4 10.00 0.4 1.0 0.55 8
0.012 0.096 0.02 0.011 0.81 0.30 0.419 0.043 0.047 0.037 0o
inches 0.10 0.01 0.050 0.055 0.01 0.01 0.004
0.004 0.086 0.01 0.007 0.80 0.29 0.394 0.016 0.039 0.022

Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

97-05-22
SOT287-1 MO-119
99-12-27

Fig 23. SO32 package outline.

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SDIP32: plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1

D ME
seating plane

A2 A

L A1

c
Z e w M (e 1)
b1
MH
b
32 17

pin 1 index
E

1 16

0 5 10 mm
scale

DIMENSIONS (mm are the original dimensions)

UNIT
A A1 A2
b b1 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.3 0.53 0.32 29.4 9.1 3.2 10.7 12.2
mm 4.7 0.51 3.8 1.778 10.16 0.18 1.6
0.8 0.40 0.23 28.5 8.7 2.8 10.2 10.5

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

92-11-17
SOT232-1
95-02-04

Fig 24. SDIP32 package outline.

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LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1

c
y
X

24 17 A

25 16 ZE

E HE
A A2 A (A 3)
1

wM
θ
bp Lp
pin 1 index L
32 9
detail X
1 8

e ZD v M A
wM
bp
D B
HD v M B

0 2.5 5 mm
scale

DIMENSIONS (mm are the original dimensions)

A
UNIT max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y Z D (1) Z E (1) θ
o
0.20 1.45 0.4 0.18 7.1 7.1 9.15 9.15 0.75 0.9 0.9 7
mm 1.60 0.25 0.8 1.0 0.2 0.25 0.1
0.05 1.35 0.3 0.12 6.9 6.9 8.85 8.85 0.45 0.5 0.5 0o

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

99-12-27
SOT358 -1 136E03 MS-026
00-01-19

Fig 25. LQFP32 package outline.

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18. Soldering

18.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).

There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. Wave soldering can still be used for certain surface mount ICs,
but it is not suitable for fine pitch SMDs. In these situations reflow soldering is
recommended.

18.2 Surface mount packages

18.2.1 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 250 °C. The top-surface
temperature of the packages should preferable be kept below 220 °C for thick/large
packages, and below 235 °C for small/thin packages.

18.2.2 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically

developed.

If wave soldering is used the following conditions must be observed for optimal
results:

• Use a double-wave soldering method comprising a turbulent wave with high

upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.

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• For packages with leads on four sides, the footprint must be placed at a 45° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.

18.2.3 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.

18.3 Through-hole mount packages

18.3.1 Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260 °C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.

18.3.2 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 °C, contact may be up to 5 seconds.

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18.4 Package related soldering information

Table 35: Suitability of IC packages for wave, reflow and dipping soldering methods
Mounting Package Soldering method
Wave Reflow[1] Dipping
Through-hole DBS, DIP, HDIP, SDIP, SIL suitable[2] − suitable
mount
Surface mount BGA, HBGA, LFBGA, not suitable suitable −
SQFP, TFBGA
HBCC, HLQFP, HSQFP, not suitable[3] suitable −
HSOP, HTQFP, HTSSOP,
HVQFN, SMS
PLCC[4], SO, SOJ suitable suitable −
LQFP, QFP, TQFP not recommended[4][5] suitable −
SSOP, TSSOP, VSO not recommended[6] suitable −

[1] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
[2] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[3] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[4] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[5] Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[6] Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

9397 750 08958 © Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Product data Rev. 03 — 30 October 2001 44 of 48

Philips Semiconductors ISP1122A
USB stand-alone hub

19. Revision history

Table 36: Revision history

Rev Date CPCN Description
03 20011030 Product data; second version; Supersedes ISP1122A-02 of June 6th, 2000.
(9397 750 07175)
• Added new USB basic speed logo to indicate ISP1122A as a USB-IF certified product.
• Table 24 “Absolute maximum ratings” on page 30:
– Changed Ilatchup to 100 mA.
– Changed Vesd to 1500 V.
– Removed table note 3.
– Changed ILI to 1 µA.
02 20000606 Product specification; initial version. Supersedes ISP1122A-01 of 27 March 2000
(9397 750 06986).
01 20000327 Preliminary specification; initial version.

20. Trademarks
ACPI — is an open industry specification for PC power management, co-developed by Intel Corp., Microsoft Corp. and
Toshiba
GoodLink — is a trademark of Koninklijke Philips Electronics N.V.
OnNow — is a trademark of Microsoft Corp.
SMBus — is a bus specification for PC power management, developed by Intel Corp. based on the I2C-bus from
Koninklijke Philips Electronics
SoftConnect — is a trademark of Koninklijke Philips Electronics

9397 750 08958 © Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Product data Rev. 03 — 30 October 2001 45 of 48

Philips Semiconductors ISP1122A
USB stand-alone hub

21. Data sheet status

Data sheet status[1] Product status[2] Definition

Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors
reserves the right to change the specification in any manner without notice.
Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a
later date. Philips Semiconductors reserves the right to change the specification without notice, in order to
improve the design and supply the best possible product.
Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to
make changes at any time in order to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change Notification (CPCN) procedure
SNW-SQ-650A.

[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.

22. Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type
number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are
stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics
sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified
use without further testing or modification.

23. Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where
malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers
using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips
Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or
performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or
warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise
specified.

24. Licenses

Purchase of Philips I2C components

Purchase of Philips I2C components conveys a license

under the Philips’ I2C patent to use the components in the
I2C system provided the system conforms to the I2C
specification defined by Philips. This specification can be
ordered using the code 9398 393 40011.

9397 750 08958 © Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Product data Rev. 03 — 30 October 2001 46 of 48

Philips Semiconductors ISP1122A
USB stand-alone hub

Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: [email protected]. Fax: +31 40 27 24825
9397 750 08958 © Koninklijke Philips Electronics N.V. 2001. All rights reserved.

Product data Rev. 03 — 30 October 2001 47 of 48

Philips Semiconductors ISP1122A
USB stand-alone hub

Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 2 11 Hub power modes . . . . . . . . . . . . . . . . . . . . . . 23
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 11.1 Voltage drop requirements. . . . . . . . . . . . . . . 23
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 11.1.1 Self-powered hubs . . . . . . . . . . . . . . . . . . . . . 23
11.1.2 Bus-powered hubs . . . . . . . . . . . . . . . . . . . . . 24
4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
12 Overcurrent detection. . . . . . . . . . . . . . . . . . . 25
5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
12.1 Overcurrent circuit description . . . . . . . . . . . . 25
5.1 ISP1122AD (SO32) and ISP1122ANB
12.2 Power switch selection. . . . . . . . . . . . . . . . . . 25
(SDIP32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
12.3 Tuning the overcurrent trip voltage . . . . . . . . 26
5.1.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
12.4 Reference circuits . . . . . . . . . . . . . . . . . . . . . 26
5.1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
5.2 ISP1122ABD (LQFP32) . . . . . . . . . . . . . . . . . . 7 13 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 31
5.2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 14 Static characteristics . . . . . . . . . . . . . . . . . . . 32
5.2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7 15 Dynamic characteristics . . . . . . . . . . . . . . . . . 33
6 Functional description . . . . . . . . . . . . . . . . . . . 9 16 Test information . . . . . . . . . . . . . . . . . . . . . . . 39
6.1 Analog transceivers . . . . . . . . . . . . . . . . . . . . . 9 17 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 40
6.2 Philips Serial Interface Engine (SIE). . . . . . . . 10 18 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.3 Hub repeater. . . . . . . . . . . . . . . . . . . . . . . . . . 10
18.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.4 End-of-frame timers . . . . . . . . . . . . . . . . . . . . 10
18.2 Surface mount packages . . . . . . . . . . . . . . . . 43
6.5 General and individual port controller . . . . . . . 10
18.2.1 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 43
6.6 GoodLink . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
18.2.2 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 43
6.7 Bit clock recovery . . . . . . . . . . . . . . . . . . . . . . 10
18.2.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 44
6.8 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . 10
18.3 Through-hole mount packages . . . . . . . . . . . 44
6.9 PLL clock multiplier. . . . . . . . . . . . . . . . . . . . . 11
18.3.1 Soldering by dipping or by solder wave . . . . . 44
6.10 Overcurrent detection . . . . . . . . . . . . . . . . . . . 11
18.3.2 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 44
6.11 I2C-bus interface. . . . . . . . . . . . . . . . . . . . . . . 11
18.4 Package related soldering information. . . . . . 45
7 Modes of operation . . . . . . . . . . . . . . . . . . . . . 11
19 Revision history . . . . . . . . . . . . . . . . . . . . . . . 46
8 Endpoint descriptions . . . . . . . . . . . . . . . . . . . 12
20 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
8.1 Hub endpoint 0 (control) . . . . . . . . . . . . . . . . . 12
21 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 47
8.2 Hub endpoint 1 (interrupt). . . . . . . . . . . . . . . . 12
22 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
9 Host requests . . . . . . . . . . . . . . . . . . . . . . . . . . 13
9.1 Standard requests . . . . . . . . . . . . . . . . . . . . . 13 23 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
9.2 Hub specific requests . . . . . . . . . . . . . . . . . . . 14 24 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
9.3 Descriptors . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
9.4 Hub responses . . . . . . . . . . . . . . . . . . . . . . . . 19
9.4.1 Get device status . . . . . . . . . . . . . . . . . . . . . . 19
9.4.2 Get configuration . . . . . . . . . . . . . . . . . . . . . . 19
9.4.3 Get interface status. . . . . . . . . . . . . . . . . . . . . 19
9.4.4 Get hub status . . . . . . . . . . . . . . . . . . . . . . . . 19
9.4.5 Get port status . . . . . . . . . . . . . . . . . . . . . . . . 20
9.4.6 Get configuration descriptor . . . . . . . . . . . . . . 21
9.4.7 Get device descriptor . . . . . . . . . . . . . . . . . . . 21
9.4.8 Get hub descriptor . . . . . . . . . . . . . . . . . . . . . 21
9.4.9 Get string descriptor (0) . . . . . . . . . . . . . . . . . 21
9.4.10 Get string descriptor (1) . . . . . . . . . . . . . . . . . 21
9.4.11 Get string descriptor (2) . . . . . . . . . . . . . . . . . 21
10 I2C-bus interface . . . . . . . . . . . . . . . . . . . . . . . 21
10.1 Protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
10.2 Hardware connections . . . . . . . . . . . . . . . . . . 22
10.3 Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . 22

© Koninklijke Philips Electronics N.V. 2001.

Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 30 October 2001 Document order number: 9397 750 08958