Code No: R193204H R19 SET - 1
III B. Tech II Semester Regular Examinations, June-2022
MEMS AND ITS APPLICATIONS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 75
Answer any FIVE Questions ONE Question from Each unit
All Questions Carry Equal Marks
*****
UNIT-I
1. a) Explain the basic building blocks of MEMS with neat diagrams. [8M]
b) Describe the role of quantum physics in the design of MEMS and [7M]
Microsystems.
(OR)
2. a) Give one application of MEMS in automobiles. Illustrate its [8M]
working with neat sketches.
b) Write a technical note on application of MEMS and [7M]
Microsystems in
(i) Biomedical Industry and
(ii) Aerospace industry.
UNIT-II
3. a) Explain the principle of operation of MEMS pressure sensors [8M]
with neat diagrams.
b) Demonstrate the working of thermocouple with neat diagram. [7M]
(OR)
4. a) List some of the piezoelectric materials and piezoresistive [8M]
materials. Differentiate between them based on their property.
b) With block diagram explain the functionality of [7M]
(i) Micro gripper
(ii) Micro motors
UNIT-III
5. a) Derive equations for acceleration a, time t and power density [8M]
P/V based on the Trimmer force scaling vector? What
information does the force scaling vector provide to the MEMS
designer?
b) Why electrostatic actuation is preferred over electromagnetic [7M]
actuation in micro motors?
(OR)
6. a) With reference to scaling of electrostatic forces explain why [8M]
electrostatic actuation is preferred over electromagnetic
actuation in micro motors.
b) Compare the properties of Silicon, SiO2 and SiC. [7M]
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Code No: R193204H R19 SET - 1
UNIT-IV
7. a) Explain in detail about Micro systems fabrication process. [8M]
b) Demonstrate about physical vapour deposition. [7M]
(OR)
8. a) Explain with figures the steps in surface micromachining. [8M]
Discuss the various fabrication challenges associated with
surface micromachining.
b) With neat diagrams explain the different etching processes in [7M]
detail.
UNIT-V
9. a) Demonstrate the working principle of RF MEMS in [8M]
(i) RF communication and
(ii) Global positioning systems.
b) Explain with near diagrams any two applications of RF MEMS. [7M]
(OR)
10. a) Illustrate about PIN diode RF switches with neat circuit diagram. [8M]
b) Explain the various contact mechanisms for RF switches. [7M]
*****
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Code No: R193204H R19 SET - 2
III B. Tech II Semester Regular Examinations, June-2022
MEMS AND ITS APPLICATIONS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 75
Answer any FIVE Questions ONE Question from Each unit
All Questions Carry Equal Marks
*****
UNIT-I
1. a) List the types of micro sensors available in the market. With a [8M]
neat sketch explain the working principal of any two types of
sensors.
b) Explain MEMS history and development and its application in [7M]
an health care industry.
(OR)
2. a) Describe the concept miniaturization of MEMS. Distinguish [8M]
between micro sensors and micro actuators.
b) Explain why atomic structure of matter is considered as a [7M]
decisive factor in micro system.
UNIT-II
3. a) Explain in detail about MEMS chemical sensors. [8M]
b) Discuss on electrostatic actuation model with neat diagram. [7M]
(OR)
4. a) Illustrate the mathematical description of piezoelectric effect [8M]
with relevant diagrams.
b) State the constraints in pumping fluids in micro channels. [7M]
What pumping scheme is usually used in micro fluidics? Give
one example.
UNIT-III
5. a) With reference to scaling of electromagnetic forces, derive the [8M]
expressions for electromagnetic potential energy and force.
b) Explain in detail about scaling in electricity. [7M]
(OR)
6. a) Suggest at least one of the properties and applications of the [8M]
following MEMS Materials. Silicon, Silicon nitride, Poly silicon,
Quartz, Nickel, P Type silicon, gold, conductive polymers.
b) What is meant by packaging? What are the special [7M]
requirements for packaging materials? Which material is used
for packaging?
UNIT-IV
7. a) Explain in detail about chemical vapour deposition techniques. [8M]
b) Discuss the criteria for selecting materials for the masks used [7M]
in etching.
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Code No: R193204H R19 SET - 2
(OR)
8. a) Explain with neat sketches, various process steps in bulk [8M]
micromachining process to fabricate a pressure sensor.
b) Describe steps of fabrication of a square tube using LIGA [7M]
process.
UNIT-V
9. a) What are the advantages of using RF MEMS as compared to [8M]
traditional units and systems?
b) What is a phase shifter? Explain the principle of operation of a [7M]
switched-line phase shifter.
(OR)
10. a) Explain the RF design consideration to be taken into account [8M]
while designing RF switch.
b) List out the integrating and biasing issues for RF switches. [7M]
*****
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Code No: R193204H R19 SET - 3
III B. Tech II Semester Regular Examinations, June-2022
MEMS AND ITS APPLICATIONS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 75
Answer any FIVE Questions ONE Question from Each unit
All Questions Carry Equal Marks
*****
UNIT-I
1. a) What are main components of Microsystems? Explain each [8M]
component briefly.
b) Describe the evolution of Micro fabrication. [7M]
(OR)
2. a) Summarize the applications of Microsystems in different [8M]
industries.
b) What are MEMS and Microsystems? How will you classify them [7M]
from the conventional systems?
UNIT-II
3. a) Explain in detail about MEMS biosensors. [8M]
b) Describe the operating principle of two types of micro motors [7M]
with suitable schematics.
(OR)
4. a) With suitable diagrams explain the working principle of Micro [8M]
valves and micro pumps also discuss their various applications
with regard to actuation.
b) Explain the principle of operation of micro-accelerometer with a [7M]
neat schematic diagram.
UNIT-III
5. a) With suitable diagram explain the principles of piezoelectric [8M]
micro cantilever beam. Describe in detail about pressure
sensors.
b) List the properties and applications of piezoelectric materials. [7M]
(OR)
6. a) Explain scaling in heat conduction and heat convection. [8M]
b) State three relevant properties of silicon carbide and silicon [7M]
nitride for use in Microsystems.
UNIT-IV
7. a) Demonstrate the steps involved in photolithography. State the [8M]
chemicals used in each of the stages along with the operating
conditions.
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Code No: R193204H R19 SET - 3
b) State various chemical vapor deposition techniques. Explain in [7M]
brief the techniques of chemical vapor deposition for MEMS
device fabrication.
(OR)
8. a) Describe the role of sacrificial layers in surface micromachining [8M]
with figures. Give examples of two sacrificial materials used in
micro system fabrication.
b) Explain in detail about epitaxial deposition. [7M]
UNIT-V
9. a) Illustrate about various actuation methods used in RF [8M]
switching.
b) Explain the working of RF based communication system. [7M]
(OR)
10. a) Demonstrate the reconfigurable antenna using RF MEMS [8M]
switch?
b) Explain the fabrication of MEMS capacitive switch. [7M]
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Code No: R193204H R19 SET - 4
III B. Tech II Semester Regular Examinations, June-2022
MEMS AND ITS APPLICATIONS
(Electronics and Communication Engineering)
Time: 3 hours Max. Marks: 75
Answer any FIVE Questions ONE Question from Each unit
All Questions Carry Equal Marks
*****
UNIT-I
1. a) What is MEMS? What are the types of MEMS transducers? Give [8M]
advantages and disadvantages of MEMS.
b) Distinguish between Microelectronics and Microsystems. [7M]
(OR)
2. a) Illustrate about Intelligent Microsystems with neat diagram. [8M]
b) Demonstrate the multi-disciplinary nature of Microsystems [7M]
engineering.
UNIT-II
3. a) Describe the principle of operation of acoustic sensors and [8M]
actuators with neat diagrams.
b) Explain with neat diagram actuation using shape memory [7M]
alloys.
(OR)
4. a) Explain the concept of cantilever piezoelectric actuator model [8M]
with neat diagram.
b) Outline the working principle of micro-values and micro fluids. [7M]
UNIT-III
5. a) With reference to scaling of electrostatic forces explain why [8M]
electrostatic actuation is preferred over electromagnetic
actuation in micro motors.
b) Describe about scaling in Electromagnetic forces. [7M]
(OR)
6. a) Demonstrate the oxide growth process in silicon with relevant [8M]
figures.
b) Explain scaling in fluid mechanics. What are the advantages of [7M]
piezoelectric pumping?
UNIT-IV
7. a) With a neat diagram explain in detail about ion implantation [8M]
and diffusion.
b) Explain in detail about the process of oxidation. [7M]
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Code No: R193204H R19 SET - 4
(OR)
8. a) State two advantages of LIGA process over other micro [8M]
machining techniques. Explain with block diagram the steps in
LIGA process. State atleast one commonly used chemical in
each of the steps.
b) Demonstrate the thin film deposition techniques. [7M]
UNIT-V
9. a) Describe about RF MEMS and MEMS inductors. [8M]
b) Explain the potential applications of RF MEMS in wireless [7M]
communication?
(OR)
10. a) Draw and explain the equivalent circuit of RF MEMS switch? [8M]
b) Discuss electromagnetic modeling of RF shunt switch? [7M]
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