TYPE NO: ALUW5050A-912-Y13

PACKAGE DIMENSIONS

+ -

+ -

+ -

Note:

1. All Dimensions are in millimeters

2. Tolerance is ±0.1mm Unless otherwise specified.

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Device Selection Guide
Emitting Color Lens Type
White Yellow Diffused

Absolute Maximum Ratings at Ta=25℃

Parameter Symbol Max Unit
Power Dissipation Pd 0.2 W

Peak Forward Current

IFP 150 mA
1/10 Duty Cycle,0.1ms Pulse Width

Forward Current IF 90 mA

Reverse Voltage VR 5 V

Operating Temperature Range Topr -40℃ to+100℃

Storage Temperature Range Tstg -40℃ to+110℃

Lead Soldering Temperature

Tsol 260℃ For 5 Seconds
【3mm From Body】

Electrical Optical Characteristics at Ta=25℃

Parameter Symb Min Typ Max Unit Conditi
ol
Forward Voltage VF 2.8 3.2 3.6 V IF=60mA

Luminous Intensity IV --- 22 28 Lm IF=60mA

Dominant Wavelength λd --- --- --- nm IF=60mA

Color Rendering lndex Ra 70 IF=60mA

Temperature Color CCT 3800 4200 4500 K IF=60mA

Reverse Current IR / / 5 μA VR=5V

Viewing Angle 2θ1/2 / 120 / deg IF=60mA

Note.
1.Tolerance of Luminous Intensity:11%
2.Tolerance of Dominant Wavelength:+1nm
3.Toleance of Forward Voltage:+0.1V

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Typical Electro-Optical Characteristics Curves

Relative Luminous Intensity vs Forward Relative Luminous Intensity vs Forward

Current, T Ambient=25o C Current, T Ambient=25o C

100 4.0

Relative Value at IF=20mA

80
3.0
Forward Current(mA)

60

Luminous Intensity
2.0
40

1.0
20

0 0
0 1 2 3 4 5 0 10 20 30 40 50
Forward Voltage(V) Forward Current (mA)

Forward Current Derating Curve, Luminous Intensity VS Ambient

Derating based on TjMAX=85 ～C Temperature
100 2.5
Relative Luminous Intensity

80 2.0
Forward Current(mA)

60 1.5

40 1.0

20 0.5

0 0
0 20 40 60 80 100 -20 0 20 40 60 80 100
Ambient Temperature T A ( C) Ambient Temperature T A ( C)

Relative Spectral Distribution,

IF=60mA, T Ambient=25o C
0～ 10～ 20～
1.0
30～
Relative radiant intensity

40～
1.0
0.5 50～
60～
70～
0.7 80～
0 90～
400 500 600 700 0.5 0.3 0.1 0.2 0.4 0.6

Wavelength(nm) Radiation Diagram

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Soldering condition
Reflow Soldering Hand Soldering
Lead Solder Lead – free Solder
Pre-heat 120~150℃ 180~200℃ Temperature 350℃ Max.
Pre-heat time 120sec. Max. 120sec. Max. Soldering time 3sec. Max.
Peak temperature 240℃ Max. 260℃ Max. (one time only)
Soldering time 10sec. Max. 10sec. Max.
Condition refer to refer to
Temperature- Temperature-
Profile 1 Profile 2

Temperature profile in re-flow machine for lead type and lead free

type

Storage condition
In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccators) with
a desiccant. Otherwise, to store them in the following environment is recommended. Temperature:
5℃~30℃ Humidity: 60%HR max.

Dimension of carrier tape

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Dimension of reel

Notes:
1. All dimensions are in mm, tolerance is±2.0mm unless otherwise noted.
2. Specifications are subject to change without notice.

Packing
1. Number of SMD 5050 product in reel and bag(anti-static bag)
1.1. 1000 piece of SMD 5050 Products on one reel. The reel will be put in the anti-static bag then sealed.
1.2. 1000 piece of SMD 5050 products on one bag.

注意事项：

1. 通过使用适当的工具从材料侧面夹取，不可直接用手或尖锐金属压胶体表面，它可能会损
坏内部电路
Through the use of appropriate tools from the material side of the clip, can not be directly
used by hand or sharp metal pressure on the surface, it may damage the internal circuit
2. SMD 吸咀外径不可超过 LED 尺寸，吸咀内役尺寸应尽可能大，吸咀顶端材质建议采用柔
软材料以防在吸取期间刮伤或损坏 LED 胶体表面，元件的尺寸必须在取放机里准备的编程
好，以确保精确的吸取和避免生产过中的损害
SMD suction nozzle diameter can not exceed the size of LED, the suction mouth battle size
should be as large as possible, ceiling tip top material suggestions made of soft material to
prevent absorb during scraping injury or damage the LED colloid surface, the size of the
components must be in good pick and place machine to programming to ensure accurate
absorption and avoid damage in production

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3. 不可将模组材料堆积在一起，它可能会损坏内部电路
Do not stack module materials together, it may damage the internal circuit

4. LED 工作环境与 LED 适配的材料中硫元素及化合物不可超过 100PPM

LED working environment is very suitable for the materials of LED and sulfur elements and
compounds can not be more than 100PPM

5. 当我们需要使用外封胶涂抹 LED 产品时，应确保外封胶与 LED 封胶胶水相匹配，因为大

多数 LED 的封装胶水为硅胶，它有较强的的氧化性和较强的吸湿性.
When we need to use seal glue smearing LED products should be really warranty seal glue
and led sealing glue glue to match, because most of the LED package glue is silica gel, it has
strong oxidation resistance and strong hygroscopicity

6. 在开包装之前，请先检查包装袋有无漏气，如有漏气现象，请退回我司重新除湿包装再使
用。
Before opening the package, please check the packing bag is free of leakage, if there
is leakage phenomenon, please return the division to re - use the packaging and re -
use

7. 要在规定环境条件中使用：温度 30℃以内，湿度 60%RH 以下

To be used in the provisions of the environmental conditions
8. 折包使用前：请用 70℃除湿 24 小时后才可以使用
Please use 70 degrees 24 hours before you can use the10 after the use of the material
is more than 24H of the use of time is not used up

9. 材料拆装后使用时间超过 24H 未用完，需烘烤 70℃/24 小时除湿才可使用。

Need to bake 70 degrees /24 hours before the use of the desiccant can be used.

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