ANALYSIS THE THERMAL MANAGEMENT OF
ELECTRONIC DEVICES BY USING DIFFERENT
PHASE CHANGE MATERIALS
PROJECT PHASE 1
by
K.BHARATH
M.TECH(19ME301)
Under the Guidance Of
Dr. P. MATHIAZHAGAN
PROFESSOR
DEPARTMENT OF MECHANICAL ENGINEERING
PONDICHERRY ENGINEERING COLLEGE
Puducherry - 605014
ABSTRACT
Thermal management is recognized as one of the most significant in mobile
electronic device, such as wearable computers , mobile phone, laptops and others,
are becoming increasingly common and also getting smaller in sizes but packed with
higher power dissipation from their electronics components. The electrical resistance
to the flow of electric current during the operation of electronic device through the
leads, poly-silicon layer and transistors will result in a significant internal heat
generation and temperature rise, which if unchecked may lead to a deterioration in
the device performance and even lead to fracture, delimitation, melting vaporization
and combustion to avoid above problem these devices are cooled by using phase
change material.
INTRODUCTION:
PHASE CHANGE MATERIALS:
Phase Change Materials (PCM) is latent heat storage material.
As the source temperature rises, the chemical bonds within the PCM break up as the material
changes phase from solid to liquid.
The temperature then stays constant until the melting process is finished. The heat stored during the
phase change process (melting process) of the material is called latent heat.
PCMs is because they store and release thermal energy during the process of melting & freezing
When such as a material freezes, it releases large amount of energy in the form of latent heat of
fusion , or energy of crystallisation
Thermal management is mould for electronic component
Electronic component is important however this most of the electronic device failure due to the
raising temperature So phase changing material (PCMs) use to reduce temperature.
The effect of latent heat storage:
It is possible to store large amounts of heat with only small temperature changes and
therefore to have a high storage density.
Because the change of phase at a constant temperature takes some time to complete, it
becomes possible to smooth temperature variations.
They store 5 to 14 times more heat per unit volume than sensible storage materials such as
water, masonry, or rock. A large number of PCMs are known to melt with a heat of fusion in
any required range.
CLASSIFICATION OF PHASE
CHANGE MATERIALS:
Phase change materials in electronics cooling:
One alternative passive means of electronic cooling is the use of phase change materials
(PCMs), which are light and have a high latent heat of fusion.
PCMs can be used for cooling single as well as discrete heat loads.
they provide a completely passive method or a partially active method (when connected to
convective heat sink the temperature
range of operation can be easily designed for a specific electronic component by choosing
suitable PCMs.).
METHODOLOGY:
The suitable phase change materials will be choose for implementing in the heat sink.
In order to overcome this inherent drawback of PCMs low thermal conductivity
various methods for improving the thermal conductivity of phase change materials
will be studied .
The effect of cooling regarding with phase change materials will be observed
numerically and experimentally.
The thermal characteristics of phase change materials will be observed by changing
the parameters such as phase change materials volume fraction, temperature
difference, aspect ratio, and various types of Phase change materials.
EXPERIMENTAL WORK
COMPONENT USED IN THE EXPERIMENTAL WORK
1) Auto transformer
2)Heater
3)Heat storing unit
4)Temperature indicator
5)Multi meter
6)Wooden box
EXPERIMENTAL SETUP
AUTO TRANSFORMER
Auto transformer with
specification of 1amp constant
current and variable voltage of 0-
207 AC output is directly
connected to the heater which is
fixed at the bottom of the heat
sink is used to regulate the power
input to the heater by regulating
voltage
Power(P)= voltage(V) x
current(I)
TEMPERATURE INDICATOR
12 Point temperature
indicator is used to
measure the temperature
variation in the heat sink,
ambient, the phase change
material. The thermocouple
was connected with the
heat sink in different
surfaces in the heat sink
and also with base of the
heater with the epoxy resin
for bonding
MICA HEATER
A Mica strip heater is used
in the experimental setup to
mimic the heat generated by
the CPU processor. It is
made in the dimension of
length 80mm, breath 80mm,
thick ness of 2mm. It is
fixed at the base of the heat
sink. Heater is pasted using
the epoxy resin to enhance
the heat transfer from the
heater to the sink. Output
from the auto transformer is
directly connected with the
input of heater
HEAT STORING UNIT
Heat storing unit is a hollow box
which is made of aluminum by
casting process inside which the
phase change material is filled
the heater is attached at the base
of heat sink with epoxy paste in
between the heater and the
heater storing unit to enhanced
the heater transfer from the
heater to the heat storing unit
Multi meter
• Multi meter is connected at the out of
autotransformer to measure the output
voltage from the autotransformer and
also to measure the power input to the
heater
Wooden box
• A wooden box is use in experimental
setup to cover the heat sink for avoiding
the convective mode of heat transfer
from the heat sink to the ambient
SELECTION OF PHASE CHANGE
MATERIAL
PARAFFIN WAX
NAME
(ORGANIC GROUP)
Formula CnH2n+2
Description A white waxy solid, a paraffin
Thermal Conductivity 0.150 W/MK
Specific Heat 3100J/kg-k
Latent Heat 166x103 J/kg
Melting Temperature 58-60°C
Boiling Temperature 370°C
Volume Change On Melting -
Super cooling No Super Cooling
PHASE CHANGE MATERIALS
Phase Change Materials
(PCM) is latent heat storage
material.
As the source temperature
rises, the chemical bonds
within the PCM break up as
the material changes phase
from solid to liquid.
The temperature then stays
constant until the melting
process is finished. The heat
stored during the phase
change process (melting
process) of the material is
called latent heat
SELECTION OF PHASE CHANGE
MATERIALS
The PCM is selected which is satisfied the following
properties:
Melting temperature in the desired operating temperature range.
High latent heat of fusion per unit volume so that the required volume of the
container to store a given amount of energy is less.
Small volume changes on phase transformation and small vapour pressure at
operating temperatures to reduce the containment problem.
SELECTION OF PHASE CHANGE
MATERIALS
The PCM is selected which is satisfied the
following properties
Congruent melting of the phase change material for a constant storage capacity of
the material with each freezing/melting cycle.
High nucleation rate to avoid super cooling of the liquid phase.
No degradation after a large number of freeze / melt cycle.
Non-flammable and non-explosive materials for safety
PROCESSOR TEMPERATURE
Effect of variation in power input and volume of the phase change material on
interior base of heat storing unit
The interior base temperature of the heat storing unit for various power input such
as 20w,30w,40w,50w and change material such as 100g and 200g
Heat input is given by the heater by adjusting the autotransformer and the interior
base temperature of the heat storing unit is noted for experiments such as heat
storing unit with phase change material
OBSERVED EXPERIMENTAL
READING
The temperature variation in the experimental is measured with the interval of 1
minute considering the difficulties of show in plotted for interior base temperature
and time the temperature variation is measured for every one min of time interval
T1 - Temperature of the interior base of heat storing unit
T2 - Temperature of the side wall
T3 - Temperature of the phase change material
T4 - Temperature of the heat storing unit surrounding
TEMPERATURE(℃)
35
40
45
55
60
65
70
50
1
11
21
31
41
51
61
71
81
91
101
111
121
131
temp1
141
151
161
171
temp2
181
191
TIME(MINUTES)
201
211
temp3
221
231
241
20w OF CURRENT IN 100g OF PCM
251
261
271
281
291
301
311
321
331
341
TEMPERATURE(℃)
20
25
30
35
40
45
50
55
60
65
1
5
9
13
17
21
25
29
33
37
41
45
49
53
57
61
TEMP 1
65
69
73
77
TEMP 2
81
85
TIME(MINUTES)
89
93
TEMP 3
97
101
105
30w OF CURRENT IN 100g OF PCM
109
113
117
121
125
129
133
137
141
145
149
153
40w OF CURRENT IN 100g OF PCM
TEMP 1 TEMP 2 TEMP 3
80
75
70
65
TEMPERATURE(℃)
60
55
50
45
40
35
30
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
TIME(MINUTES)
50w OF CURRENT IN 100g OF PCM
TEMP 1 TEMP 2 TEMP 3
80
75
70
65
TEMPERATURE(℃)
60
55
50
45
40
35
30
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33
TIME(MINUTES)
TEMPERATURE(℃)
20
25
30
35
40
45
50
55
60
65
70
1
13
25
37
49
61
73
85
97
109
121
133
145
157
169
TEMP 1
181
193
205
217
TEMP 2
229
241
TIME(MINUTES)
253
265
277
TEMP 3
289
301
313
20w OF CURRENT IN 200g OF PCM
325
337
349
361
373
385
397
409
421
433
445
TEMPERATURE(℃)
30
35
40
45
50
55
60
65
70
1
5
9
13
17
21
25
29
33
37
41
45
TEMP 1
49
53
57
61
TEMP 2
65
TIME(MINUTES)
69
73
77
TEMP 3
81
85
30w OF CURRENT IN 200g OF PCM
89
93
97
101
105
109
113
117
121
40w OF CURRENT IN 200g OF PCM
TEMP 1 TEMP 2 TEMP 3
70
65
60
55
TEMPERATURE(℃)
50
45
40
35
30
25
20
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 65 67 69 71 73
TIME(MINUTES)
50w OF CURRENT IN 200g OF PCM
TEMP 1 TEMP 2 TEMP 3
75
70
65
60
TEMPERATURE(℃)
55
50
45
40
35
30
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
TIME(MINUTES)
THANKYOU
