Scribd
Upload
8 views2 pages

1 Asahi-1

The Sn633-5T No Clean Solder Paste is designed for fine pitch Surface Mount applications with a melting temperature of 183 °C and excellent print consistency. It features a long working stencil life, no hot or cold slump, and good solderability on copper and nickel substrates. The product is available in various packaging types and has a shelf life of six months when stored properly.

Uploaded by

benyaminamanirad
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
8 views2 pages

1 Asahi-1

The Sn633-5T No Clean Solder Paste is designed for fine pitch Surface Mount applications with a melting temperature of 183 °C and excellent print consistency. It features a long working stencil life, no hot or cold slump, and good solderability on copper and nickel substrates. The product is available in various packaging types and has a shelf life of six months when stored properly.

Uploaded by

benyaminamanirad
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 2

Product Data Sheet

Sn633-5T
No Clean Solder Paste

Product Description Specification


Singapore Asahi Solder Paste Sn633-5T is spe-
cially formulated for fine pitch Surface Mount Item Result
application where application pitch could be as Alloy
fine as 12 mils pitch. This paste uses special Alloy Composition Sn63/Pb37
non-halide flux and low oxide spherical powder. Melting Temperature 183 °C
This paste exhibits excellent paste deposition Differential Scanning Calorimetry

with no cold and hot slump problem. Hence pre- Powder Size 25 – 45 m, Type III,
venting the paste from dropping down the board IPC TM-650 2.2.14 Mesh Size -325 / +500
during preheat stage.
Paste Flux
Characteristics: Flux Content 10.0 +/- 0.5 wt%
• Excellent print consistency IPC-TM-650 2.2.20

• Long working stencil life Halide Content Not added


• Do not exhibit any hot or cold slump JIS Z 3197 8.1.4.2.1

• Exhibit good solderability or wettability on Water Extract > 1 x 104 -cm


both copper and nickel substrate Resistivity
JIS Z 3197 8.1.1

Application Copper Mirror Test Classified as “L”, Pass


IPC-TM-650 2.3.32
Sn633-5T is designed for standard stencil print-
JIS Z 3197 8.4.2
ing. The printing speed can be set at
25 - 40 mm/sec. Its optimum printing condition Copper Corrosion Pass
is 23 to 25 oC and humidity of 50 to 65 %RH, Test
IPC-TM-650 2.6.15
with at least 24 hours stencil life of continuous
JIS Z 3197 8.4.1
printing (process dependant). This paste could
be used on the 0.5mm pitch pattern. Adjust- Flux Activity ROL0
ment may be necessary based on specific pro- Classification
IPC J-STD-004
cess requirement.
Solder Paste
Viscosity
IPC-TM-650 2.4.34 1000 +/- 15% kcPs
(10.0 wt% flux)
Tackiness > 24hrs (> 100gf)
JIS Z 3284 Annex 9
Surface Insulation
Resistance
(85°C, 85%RH, 168hrs)
IPC-TM-650 2.6.3.3 > 1 x 108 , Pass
JIS Z 3197 8.5.3 > 1 x 1011 , Pass
Electromigration Pass
(85°C, 88.5%RH, 596hrs)
IPC-TM-650 2.6.14.1

Slump Test No slump observed


JIS Z 3284 Annex 7, Annex 8

Solder Ball Test Pass


IPC-TM-650 2.4.43

JIS Z 3284 Annex 11

Ver 2 (Mar 17)


Sn633-5T No Clean Solder Paste

Recommended Reflow Profile

Residue Removal
Residue removal is not needed as this is a no clean solder paste. For assemblies that require
cleaning, call Asahi technical support.

Storage, Handling and Shelf Life


Solder paste has to be thawed to room temperature (~25°C) prior using to avoid condensation.
Paste left on the stencil should not be put back into the container together with the unused paste.
It is preferable not to re-use solder paste left on the stencil after printing.

Generally the solder paste could last for 6 months from date of manufacturing, if kept under
proper condition and temperature of 0 - 10 °C.

Health and Safety


Do not handle the paste with your bare hand. Use proper tool when handling the paste. If the
paste touches the skin, wash thoroughly with soap and water. For more information, please refer
to Material Safety Data Sheet.

Packaging
Packaging Type Weight Packaging Part
Jar 500g E
250g F
Cartridge 1000g D
CasseƩe 800g I
Easipak 150g J
50g H
Solder Paste Product Order System:

Alloy Type Powder Size - Series Type Formula Type - Packaging Part

Example: Sn63 3-5T-E


DISCLAIMER OF LIABILITY

“All statements, information and recommendations contained in this catalog are based on data and test results which we consider, to the best of our knowledge
and belief, to be reliable and informative to the users but the accuracy and completeness thereof is not guaranteed. No warranty, expressed or implied, statutory
or otherwise, is given regarding the use of the information and products contained in this catalog since the conditions and suitability for use, handlings, storage
or possession of the products are determined by the users and are therefore beyond our control. We shall not be liable in respect of any liabilities, losses (includ-
ing consequential losses), damages, proceedings, costs, claims or injuries whatsoever sustained or suffered by the users (including any third parties) in connec-
tion with the use of the information, recommendation and the products contained in this catalog.”

Singapore Asahi Chemical and Solder Industries Pte Ltd


47 Pandan Road Singapore 609288
Tel: +65 6262-1616 Fax: +65 6261-6311
Website: http://www.asahisolder.com Email: [email protected]

Ver 2 (Mar 17)

You might also like