WEEE DISASSEMBLY

INSTRUCTIONS
for the TAE and TAE-DC Disk Array Enclosure

Abstract
This document provides clear guidance for end-of-life recyclers
on how to identify and disassemble reportable materials in
compliance with the Waste Electrical and Electronic Equipment
(WEEE) directive. The document does not replace disposal
instructions in EMC contracts, or those included in EMC Product
and Residuals Disposal Guidelines.

June 2019

Copyright © 2019 EMC Corporation. All Rights Reserved.

Dell believes the information in this publication is accurate as of its

publication date. The information is subject to change without
notice.

The information in this publication is provided “as is.” Dell makes

no representations or warranties of any kind with respect to the
information in this publication, and specifically disclaims implied
warranties of merchantability or fitness for a particular
purpose.Use, copying, and distribution of any Dell software
described in this publication requires an applicable software
license.

Dell, EMC, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be the property of their
respective owners. Published in the USA.

WEEE Disassembly Instructions for the 2

TAE and TAE-DC Disk Array Enclosure
Part Number: 300-015-574

WEEE Disassembly Instructions for the 3

TAE and TAE-DC Disk Array Enclosure
Table of Contents
1.0 Document Purpose ................................................................................................................. 6
2.0 Important Notice..................................................................................................................... 6
3.0 How to Use these Instructions ................................................................................................ 6
5.0 Brand Owner Identification .................................................................................................... 6
6.0 Acronyms ................................................................................................................................ 8
7.0 Product Identification ........................................................................................................... 10
7.0.1 TAE and TAE-DC Disk Array Enclosure ............................................................................. 10
8.0 Product Photos ...................................................................................................................... 11
9.0 Locating Materials—TAE and TAE-DC Disk Array Enclosure.............................................. 12
9.0.1 Locating Materials on the TAE Power/Cooling Module (AC Type)............................ 14
9.0.2 Locating Materials on the TAE-DC Power/Cooling Module........................................ 16
9.0.3 Locating Materials in the Midplane Assembly .............................................................. 18
9.0.4 TAE and TAE-DC Accessories and Optional Equipment .............................................. 19
9.0.4.1 Locating Materials on a 2.5-inch Hard Disk Drive .................................................. 20
10.0 TAE and TAE-DC Disk Array Enclosure PCBs ..................................................................... 21
11.0 Reportable Materials on TAE and TAE-DC Common Components ................................ 22
11.1 Materials of Interest to Recyclers (TAE and TAE-DC) ....................................................... 24
11.2 Precious Metals (TAE and TAE-DC) .................................................................................... 25
11.3 Plastic Part Markings (TAE and TAE-DC) ........................................................................... 25
12.0 Disassembly Details ............................................................................................................ 26
12.0.1 Required Tools for Disassembly ...................................................................................... 26
12.0.2 Safety Precautions and Battery Warnings .................................................................... 26
13.0 Disassembling the TAE and TAE-DC Disk Array Enclosure............................................... 27
13.0.1 Removing and Disassembling a 2.5-inch Hard Disk Drive.......................................... 27
13.0.2 Removing an LCC............................................................................................................ 28
13.0.2.1 Removing LCC Components ................................................................................. 29
13.0.2.2 Removing the LCC PCB Heat Sink and LCC PCB................................................ 30
13.0.3 Removing and disassembling the power/cooling module (AC type) .................... 31
13.0.3.1 DC Power/Cooling Module Top Cover................................................................. 33
13.0.3.2 Power/Cooling Module Top PCB ........................................................................... 34
13.0.3.3 Removing materials on the Power/Cooling Module Top PCB .......................... 35
13.0.3.4 Removing materials on the Power/Cooling Module Bottom PCB ................ 37
13.0.3.5 Removing the Power/Cooling Module Fan Pack Assembly, Attached
Wiring, Carrier .......................................................................................................................... 38
13.0.4 Removing and disassembling the power/cooling module (DC type) ................. 39
13.0.4.1 DC Power/Cooling Module Top Cover................................................................. 40
13.0.4.2 Removing the DC Power/Cooling Module Fan Pack Assembly and Top PCB40

WEEE Disassembly Instructions for the 4

TAE and TAE-DC Disk Array Enclosure
 13.0.4.3 Removing materials in the DC Power/Cooling Module ..................................... 41
13.0.5 Disassembling the Chassis for Recycling and Retrieving the Midplane PCB.......... 43
14.0 RoHS Restricted Materials................................................................................................... 45

WEEE Disassembly Instructions for the 5

TAE and TAE-DC Disk Array Enclosure
 1.0 Document Purpose
This document provides the most accurate information available on the location and
removal of reportable materials as required by the European Union (EU) Waste Electrical
and Electronic Equipment (WEEE) Directive 2002/96/EC.
For more information on EMC’s environmental initiatives, policies, and goals go to:
http://www.emc.com/corporate/sustainability/index.htm

2.0 Important Notice

This document does not in any way replace disposal instructions in EMC contracts, or
those included in EMC Product and Residuals Disposal Guidelines.

3.0 How to Use these Instructions

EMC recommends that you adopt the following workflow to ensure the greatest
efficiency in compliance with WEEE legislation.
1. See 8.0 Product Photos to familiarize yourself with the hardware.
2. Review the items listed in 11.0 Reportable Materials on TAE and TAE-DC Common
Components, 11.1 Materials of Interest to Recyclers (TAE and TAE-DC), and 11.2
Precious Metals (TAE and TAE-DC) to learn the recyclable materials present in this
product.
3. Review 12.0.2 Safety Precautions and Battery Warnings prior to disassembling the
product.
4. Review 13.0 Disassembling the TAE and TAE-DC Disk Array Enclosure for removal
procedures.

5. 4.0 Related Documentation

EMC provides separate WEEE disassembly instructions per product platform. Contact
the
EMC WEEE administrator at [email protected] to request additional documentation as
required.

5.0 Brand Owner Identification

EMC Corporation
176 South Street
Hopkinton, Massachusetts 01748
U.S.A

WEEE Disassembly Instructions for the 6

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http://www.emc.com

WEEE Disassembly Instructions for the 7

TAE and TAE-DC Disk Array Enclosure
6.0 Acronyms
Table 1 defines acronyms that may be used in the document.
Table 1 Acronyms List

ABS Acrylonitrile butadiene styrene

Ag Silver
Au Gold
BBU Battery Backup Unit
Cd Cadmium
CFC Chlorofluorocarbons
CPU Central Processing Unit
Cr Vl Hexavalent Chromium
Cu Copper
DAE Disk Array Enclosure
DIMMs Dual in-line Memory Modules
DPE Disk Processor Enclosure
DRL Device Regulatory Label
EMI Electromagnetic Interference
ESD Electrostatic discharge
EU European Union
GWP Global Warming Potential
HC Hydrocarbons
HCFC Hydrochlorofluorocarbons
HDPE High-Density Polyethylene
Hg Mercury
LCC Link Control Card
LDPE Low-Density Polyethylene
Pb Lead
PBB Polybrominated Biphenyls
PBDE Polybrominated Diphenyl Ethers
PC Polycarbonate
PCB Printed Circuit Board
PCT Polychlorinated Terphenyl

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Pd Palladium
PETE or PET Polyethylene Terephthalate
PP Polypropylene
PS Polystyrene
Pt Platinum
PVC Polyvinyl Chloride
RoHS Restriction of Hazardous Substances
SAS Serial Attached SCSI
SP Storage Processor
SPE Storage Processor Enclosure
SSD Solid State Disk
V Volt
WEEE Waste Electrical and Electronic Equipment

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7.0 Product Identification
7.0.1 TAE and TAE-DC Disk Array Enclosure
Note: EMC uses the Product Regulatory Model Name (usually represented by letters, see
the first item in Table 2) as the main identifier throughout this document. Locate the
product regulatory model name on the Device Rating Label (DRL) affixed to a
rectangular recess on the top of the product chassis.

Table 2 Product Regulatory Model Name and Specifications

Product Regulatory Model Name TAE (ships with two DC power supplies
installed)
TAE-DC (ships with two DC power supplies
for the customer to install)
Product Description 2.5U, 25-slot Disk Array Enclosure (DAE)
Part Number 100-887-129
Note: The part number cited denotes the
base chassis. However, each platform
supports many different EMC products.
Contact your EMC Sales Representative for
product-specific part numbers.
Mass Less than 45 pounds with 25 drives installed
Dimensions 87.0 mm (H) x 447.2 mm (W) x 355.6 mm (D)

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TAE and TAE-DC Disk Array Enclosure
8.0 Product Photos

Figure 1. TAE or TAE-DC front view (fully populated with twenty five hard disk
drives)

Figure 2. TAE or TAE-DC rear view (TAE shown)

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9.0 Locating Materials—TAE and TAE-DC Disk Array Enclosure
Figure 3 and Figure 4 identify TAE and TAE-DC Disk Array Enclosure components. Table 3
and Table 4 provide the disassembly sequence with links to disassembly procedures.
Item numbers below correspond with reportable materials listed in Table 10 through
Table 12.

1 3
2
2
3

Figure 3. TAE Chassis and front view

Table 3 Decoder and Disassembly Sequence

Item Component
1 TAE 25-slot Chassis (sheet metal)
2 Power/Cooling Module
3 LCC I/O Assembly

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 5

4 7
8

9 6

Figure 4. Link Control Card Assembly

Table 4 Decoder and Disassembly Sequence

Item Component Item Component

Connector Fence (non-ferrous) SAS Connector Cage (not visible,
4 7
under air dam)
5 Plastic LCC Guide (ABS plastic) 8 Heat Sink (aluminum)
6 Air Dam (ferrous) 9 LCC PCB

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TAE and TAE-DC Disk Array Enclosure
9.0.1 Locating Materials on the TAE Power/Cooling Module (AC
Type)
Figure 5 and Figure 6 identify power/cooling module components. Table 5 also provides
the disassembly sequence with links to disassembly procedures. Item numbers below
correspond with reportable materials listed in materials listed in Table 10 through Table
12.

10

Figure 5. TAE AC Power/Cooling Module

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 11

12

12

13

14

15

16

17

Figure 6. Materials located on the SAE AC Power/Cooling Module PCBs

Table 5. Decoder and Disassembly Sequence

Item Component Item Component

10 Top Cover (sheet metal) 14 Wiring (cable sheathing, copper)
11 Top PCB 15 Bottom PCB
12 Coils (copper) 16 Fan Pack Assembly (ABS Plastic)
13 Large Capacitor 17 Power/Cooling Module Carrier (sheet metal)

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TAE and TAE-DC Disk Array Enclosure
9.0.2 Locating Materials on the TAE-DC Power/Cooling Module
Figure 7 and Figure 8Figure 6 identify TAE-DC power/cooling module components. Table
6 also provides the disassembly sequence with links to disassembly procedures. Item
numbers below correspond with reportable materials listed in Table 10 through Table 12.

18

Figure 7. TAE DC Power/Cooling Module

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TAE and TAE-DC Disk Array Enclosure
 21

20

23

24
19

22

23
25
26

Figure 8. Materials located on the TAE DC Power/Cooling Module PCB

Table 6. Decoder and Disassembly Sequence

Item Component Item Component

18 Top Cover (sheet metal) 23 Coils (copper)
19 Fan Pack Assembly (ABS Plastic) 24 Large Capacitor
20 Top PCB 25 Bottom PCB
21 Heat Fins (non-ferrous) 26 Power/Cooling Module Carrier (sheet metal)
22 Wiring (cable sheathing, copper)

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TAE and TAE-DC Disk Array Enclosure
9.0.3 Locating Materials in the Midplane Assembly
Figure 9, Figure 10 and Table 7 identify midplane PCB materials. Table 7 also provide the
disassembly sequence with links to disassembly procedures Item numbers below
correspond with reportable materials listed in Table 10 through Table 12.
For disassembly, see Disassembling the Chassis for Recycling and Retrieving the
Midplane PCB.

28
27
27

28

Figure 9. Locating midplane air flappers (ABS plastic)

29

Figure 10. Midplane PCB

Table 7 Decoder and Disassembly Sequence

Item Component
27 Two Power/Cooling Module Air Flappers (ABS plastic)
28 Two LCC Assembly Air Flappers (ABS plastic)
29 Midplane PCB

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TAE and TAE-DC Disk Array Enclosure
9.0.4 TAE and TAE-DC Accessories and Optional Equipment
Table 8 lists accessories and optional hard disk drives.
Table 8 TAE and TAE-DC Accessories and Options

Component Photo Disassembly Required?

AC Power No
Cord
See Table 10 Complete list of
Reportable Materials on TAE and TAE-
DC Components

DC Power No
Cord
See Table 10 Complete list of
Reportable Materials on TAE and TAE-
DC Components

2.5-inch Yes
Hard Disk
See Locating Materials on a 2.5-inch
Drive
Hard Disk Drive,
and
Disassembling the Hard Disk Drive

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TAE and TAE-DC Disk Array Enclosure
9.0.4.1 Locating Materials on a 2.5-inch Hard Disk Drive
Figure 11, Figure 12 and Table 9 identify hard disk drive components. Table 10 also
provides the disassembly sequence with links to disassembly procedures. Item numbers
below correspond with reportable materials listed in Table 10 through Table 12.
Also see Removing and Disassembling a Hard Disk Drive.

21

22

23

Figure 11. TAE and TAE-DC 2.5-inch hard disk drive

Table 9 Decoder and Disassembly Sequence

Item Component
21 SAS PCB
22 PCB
23 Plastic Disk Carrier (Lexan plastic)

Figure 12. Close up of SAS PCB

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TAE and TAE-DC Disk Array Enclosure
 10.0 TAE and TAE-DC Disk Array Enclosure PCBs
2.5-inch Hard Disk Drive PCB (SAS)

LCC PCB

Midplane PCB

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TAE and TAE-DC Disk Array Enclosure
 11.0 Reportable Materials on TAE and TAE-DC Common
Components
Table 10 lists components that require selective treatment. Refer to Figure 3 through
Figure 11 to locate the item numbers listed.
Table 10 Complete list of Reportable Materials on TAE and TAE-DC Components

Material Item Location

Polychlorinated biphenyl (PCB) containing Absent
capacitors and all Polychlorinated Terphenyl
(PCT) containing electrical equipment
Mercury – containing components such as Absent
switches or backlighting lamps
Batteries & Accumulators Absent
Printed circuit boards of mobile phones generally, LCC Assembly
and of other devices if the surface of the printed
9 LCC PCB
circuit board is greater than 10 cm2
Power/Cooling Module
11,20 Top PCB
15,25 Bottom PCB
Chassis
29 Midplane PCB
2.5-inch Hard Disk Drive
21 SAS PCB
22 PCB
Ink & toner cartridges, liquid and pasty, as well as Absent
color toner
Plastic containing brominated flame retardants Absent
Asbestos waste and components which contain Absent
asbestos

Cathode ray tubes Absent

Chlorofluorocarbons (CFC), Absent
Hydrochlorofluorocarbons (HCFC),
Hydrofluorocarbons (HFC)or,
Hydrocarbons (HC)
Gas discharge lamps Absent

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Material Item Location
Liquid crystal displays (together with their casing Absent
where appropriate) of a surface greater than 100
cm2 and all those back-lighted with gas
discharge lamps
External electric tables Table TAE AC Power Cord
8
TAE-DC Power Cord

Embedded electric tables Absent

Components containing radioactive substances, Absent

or materials that become radioactive as a result
of the function of the product, such as ionizing
radiation
Electrolytic capacitors containing substances Power/Cooling Module
of concern (height > 25 mm, diameter > 25 mm or 13,24 Capacitors
proportionately similar volume)
Equipment containing gases that are ozone- Absent
depleting or have a global warming potential
(GWP) about 15, such as those contained in
foams and refrigeration circuits
Ammonia-water solutions containing chromium VI Absent
(Hexavalent Chromium) in the case of absorption
refrigerators
Any other liquid, such as oils and acids in Absent
particular
Components containing refractory ceramic fibers Absent
Photo-conducting drums containing cadmium or Absent
selenium

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TAE and TAE-DC Disk Array Enclosure
 11.1 Materials of Interest to Recyclers (TAE and TAE-DC)
Table 11 lists materials for recycling. Refer to Figure 3 through Figure 11 to locate the
item numbers listed.
Table 11 Complete list of Recyclable Materials on TAE and TAE-DC Components

Material Item Location

Non-ferrous Alloys LCC Assembly
4 Connector Fence
7 SAS Connector Cage
8 Heat Sink
Ferrous Alloys 1 25-slot Chassis
LCC Assembly
6 Air Dam
Power/Cooling Module
10,17 Top Cover and Carrier
ABS LCC Assembly
5 Plastic LCC Guide
Fan Pack Assembly
16,19 Fan Blades and Assembly
Midplane Assembly in Chassis
27 Two Power/Cooling Module Air Flappers
28 Two LCC Assembly Air Flappers
Polyethylene Terephthalate (PETE or PET) Absent or not at an appreciable level
High-Density Polyethylene (HDPE) Absent or not at an appreciable level
Polyvinyl Chloride (PVC) Absent
Low-Density Polyethylene (LDPE) Absent or not at an appreciable level
Polypropylene (PP) Absent or not at an appreciable level
Polystyrene (PS) Absent or not at an appreciable level
Other plastics, (e.g. acrylic; polycarbonate; nylon; All PCBs (Fiberglass, Various)
fiberglass)
See
PCBs

WEEE Disassembly Instructions for the 24

TAE and TAE-DC Disk Array Enclosure
 11.2 Precious Metals (TAE and TAE-DC)
Table 12 lists precious metals for recovery. Refer to Figure 3 through Figure 11 to locate
the item numbers listed.
Table 12 Plastic Part Markings on TAE and TAE-DC Components

Material Item Location

Copper (Cu) Power/Cooling Module
12,23 Two Coils on Top PCB
14,22 Wiring (cable sheathing, copper)
See All PCBs (Circuit Etch)
PCBs
Gold (Au) Absent or not at an appreciable level
Palladium (Pd) Absent or not at an appreciable level
Platinum (Pt) Absent or not at an appreciable level
Silver (Ag) Absent or not at an appreciable level

11.3 Plastic Part Markings (TAE and TAE-DC)

Table 13 lists markings for plastic parts that weigh more than 25 grams.
Table 13 Plastic Part Markings on TAE and TAE-DC Components

Part Name Weight ISO 11469:2000 Marking

2.5-inch Hard Disk Drive Carrier 132 g Lexan 3414R+40%GF
Two Power Cooling/Module Air Flappers 84 g >PC+ABS-FR(40)<
Two LCC Assembly Air Flappers 78 g >PC+ABS-FR(40)<
Fan Pack Assembly 268 g >PC+ABS-FR(40)<

WEEE Disassembly Instructions for the 25

TAE and TAE-DC Disk Array Enclosure
 12.0 Disassembly Details
The following sections describe how to remove the components and associated
materials.

12.0.1 Required Tools for Disassembly

Table 14 lists the tools that may be required to disassemble the product.
Table 14 Tools

Tool Description
Phillips screwdriver #1
Phillips screwdriver #2
Flat-head screwdriver Small
Needle-nose pliers Use to remove precise hardware from PCBs.
Wire Cutters Use to remove capacitors, or cut wires.
Soldering Iron Use to unsolder the leads that attach some
components to a PCB.

12.0.2 Safety Precautions and Battery Warnings

Comply with the following precautions:
• Wear protective glasses during disassembly.
• Follow the recommended disassembly method and sequence.
• Always use the tool specified in the removal procedures.
• Follow standard industry best practices, including all applicable health and safety
regulations.

BATTERY WARNINGS:
- Only trained personnel should handle the battery.
- Danger of explosion if battery is incorrectly replaced.
- Danger of explosion if system batteries or components with batteries are processed in
a shredder.
- Replace only with the battery type recommended by the equipment manufacturer.
- Discard used batteries according to manufacturer’s instructions.
- Do not attempt to reuse or install batteries in any other system, for any other purpose.

WEEE Disassembly Instructions for the 26

TAE and TAE-DC Disk Array Enclosure
13.0 Disassembling the TAE and TAE-DC Disk Array
Enclosure
13.0.1 Removing and Disassembling a 2.5-inch Hard Disk Drive
1. If installed, remove the front bezel. The bezel is required for EMI compliance when
the enclosure is powered up. Follow the instructions in Related Documentation to
obtain the appropriate WEEE instructions for EMC bezels.
2. Press on the disk's latch button to release the latch.
3. Pull the latch and slowly pull the disk from its slot.

Figure 13. Removing a Hard Disk Drive from a TAE or TAE-DC

4. To disassemble:
a. Remove the five screws that attach the larger PCB to the assembly, and lift off.
b. Remove the two screws that attach SAS PCB to the assembly, and lift off.
c. Detach the plastic disk carrier, and lift off.

SAS

PCB

Plastic Disk Carrier

Figure 14. Disassembling the 2.5-inch hard disk drive

WEEE Disassembly Instructions for the 27

TAE and TAE-DC Disk Array Enclosure
13.0.2 Removing an LCC
1. Press the orange handle buttons to release the LCC, pull the latches outward.
2. Remove the LCC from its slot.

Figure 15. Removing an LCC

WEEE Disassembly Instructions for the 28

TAE and TAE-DC Disk Array Enclosure
13.0.2.1 Removing LCC Components
1. Apply pressure to the connector fence and pull away from the LCC PCB.
2. Remove the two screws that attach the plastic LCC guide (circled), and lift off of
the PCB.
3. Drill the four rivets that attach the air dam to the LCC assembly, and remove the air
dam.
4. Remove the four screws attach the SAS connector cage (highlighted), and remove.

Connector

Figure 16. Removing the connector fence, LCC guide, air dam, and SAS
connector

WEEE Disassembly Instructions for the 29

TAE and TAE-DC Disk Array Enclosure
 13.0.2.2 Removing the LCC PCB Heat Sink and LCC PCB
1. To remove the heat sink (spring clip and hook type):
a. Press down on one side of heat sink spring clip and unhook from the PCB
(circled).
b. Lift the heat sink off of PCB.

Figure 17. Disengaging the LCC PCB heat sink

2. To access the LCC PCB:

a. Remove all components in 13.0.2.1 Removing LCC Components.
b. Flip the LCC PCB over and remove the two screws that attach the black
insulator.
The LCC PCB is now ready to recycle.

WEEE Disassembly Instructions for the 30

TAE and TAE-DC Disk Array Enclosure
Figure 18. Removing the LCC PCB insulator

13.0.3 Removing and disassembling the power/cooling module (AC

type)
1. Press the orange handle button to release the module.
2. Pull the latch outward and remove the power/cooling module from its slot.

WEEE Disassembly Instructions for the 31

TAE and TAE-DC Disk Array Enclosure
Figure 19. Removing a power/cooling module

WEEE Disassembly Instructions for the 32

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13.0.3.1 DC Power/Cooling Module Top Cover
Note: This section shows steps for disassembling the AC version of the power/cooling
module.

1. Use a Phillips screwdriver to remove the three screws that attach the top cover to
the power/cooling module carrier:
a. Remove the two screws on either side of the midplane connector (circled).

Figure 20. Removing two power/cooling module top cover screws

b. Turn the power/cooling around to the opposite end and remove the third screw
(circled), and lift off the top cover.

WEEE Disassembly Instructions for the 33

TAE and TAE-DC Disk Array Enclosure
Figure 21. Removing the screw above the air dam

13.0.3.2 Power/Cooling Module Top PCB

1. Remove four screws (circled) that attach the insulator and top PCB.
2. Separate the insulator from the PCB, and lift off it off.

Figure 22. Removing four top PCB screws

3. Disconnect the power/cooling module wiring from the bottom PCB and remove the
top PCB.

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TAE and TAE-DC Disk Array Enclosure
Figure 23. Removing the top PCB

13.0.3.3 Removing materials on the Power/Cooling Module Top PCB

1. To remove the wiring:
a. Disconnect the wiring from the PCB.
b. Use wire cutters to cut the remaining end, and remove the cable.
2. To remove the coils (circled):
a. Flip over the top PCB and unsolder the coil’s leads with a soldering iron.
b. Lift off each coil.
3. To remove the large capacitor:
a. Use a solder iron to unsolder the leads that attach the capacitor to the PCB.
b. Remove the large capacitor.
The top PCB is ready to recycle after all components are removed.

WEEE Disassembly Instructions for the 35

TAE and TAE-DC Disk Array Enclosure
 Large
C it

Figure 24. Removing top PCB materials

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 13.0.3.4 Removing materials on the Power/Cooling Module Bottom PCB
1. To remove the six coils (two transformers in yellow insulators):
a. Detach the two transformers from the PCB.
b. Peel off the yellow insulator off of each coil.
c. Flip over the top PCB and unsolder the coil’s leads with a soldering iron.
d. Lift off each coil.
4. To remove the four small coils (circled):
a. Flip over the top PCB and unsolder the coil’s leads with a soldering iron.
b. Lift off each coil.
5. To remove the wiring:
a. Disconnect the wiring from the PCB.
b. Use wire cutters to cut the remaining end, and remove the cable.
The bottom PCB is ready to recycle when all components are removed.

Two Transformers with

Figure 25. Removing bottom PCB materials

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13.0.3.5 Removing the Power/Cooling Module Fan Pack Assembly,
Attached Wiring, Carrier
1. Position the power/cooling module with the fans facing you.
2. Push the tabs on the fan pack assembly towards the middle, and pull up to remove.

Figure 26. Locating the tabs on the fan pack assembly

3. To remove the fan pack assembly wiring you must first remove each individual fan:
a. Remove each fan from the four rubber grommets that attach it to the fan
assembly.
b. Once each individual fan is removed from the assembly, disconnect the wiring.
The power/cooling module carrier is ready to recycle when the last item (fan pack
assembly) is removed.

WEEE Disassembly Instructions for the 38

TAE and TAE-DC Disk Array Enclosure
 Figure 27. Removing each individual fan

13.0.4 Removing and disassembling the power/cooling module (DC

type)
1. Press the orange handle button to release the module.
2. Pull the latch outward and remove the power/cooling module from its slot.

Figure 28. Removing a power/cooling module

WEEE Disassembly Instructions for the 39

TAE and TAE-DC Disk Array Enclosure
13.0.4.1 DC Power/Cooling Module Top Cover
Note: This section shows steps for disassembling the DC version of the power/cooling
module.

1. Use a Phillips screwdriver to remove the two screws on the front of the unit (see
Figure 20).
2. Turn the power/cooling around, and remove the third screw (circled), and lift off the
top cover

Figure 29. Removing the screw above the air dam

13.0.4.2 Removing the DC Power/Cooling Module Fan Pack Assembly

and Top PCB
1. Push the tabs on the fan pack assembly towards the middle, and pull up to remove.
2. Remove four screws (circled) that attach the top PCB.

WEEE Disassembly Instructions for the 40

TAE and TAE-DC Disk Array Enclosure
Figure 30. Removing four top PCB screws

3. Disconnect the power/cooling module wiring from the bottom PCB and remove the
top PCB.

Figure 31. Removing the top PCB

13.0.4.3 Removing materials in the DC Power/Cooling Module

1. Detach the heat fins.
2. To remove the wiring:

WEEE Disassembly Instructions for the 41

TAE and TAE-DC Disk Array Enclosure
 a. Disconnect the wiring that attaches the top PCB to the bottom PCB.
b. Use wire cutters to cut the remaining end, and remove the cable.
3. To remove the coils:
a. Flip over the PCB and unsolder the coils’ leads with a soldering iron.
b. Lift off each coil.
4. To remove the capacitors:
a. Use a solder iron to unsolder the leads that attach the capacitor to the PCB.
b. Remove the large capacitor.
The PCBs and power/cooling module carrier are ready to recycle after all components are
removed.

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 13.0.5 Disassembling the Chassis for Recycling and Retrieving the
Midplane PCB
To disassemble the 25-slot chassis:
1. Remove all components listed in 13.0 Disassembling the TAE and TAE-DC Disk Array
Enclosure.

Note: All materials that make up the chassis are ready for recycling after all components
are removed.

2. Remove the four screws that attach the chassis top cover.
5. Flip over the chassis and remove the four screws on the bottom of the chassis.
6. Return the chassis to its front facing position to access the LCC housing.
7. Remove the LCC housing.
8. To remove the two power/cooling module air flappers and two LCC assembly air flappers
(highlighted):
a. Squeeze the tabs to release each air flapper.
b. Detach and remove from the hinges.

Figure 32. Locating air flappers

7. To remove the midplane PCB:

a. Remove the ten screws that attach the midplane PCB to the midplane
assembly.
b. Detach the black, frame-like insulator from the midplane PCB.

Figure 33. Midplane PCB

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WEEE Disassembly Instructions for the 44
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 14.0 RoHS Restricted Materials
Table 15 lists Restriction of Hazardous Substances (RoHS) materials.
Table 15 RoHS Materials

Material Location
Cadmium (Cd) Absent
Hexavalent Chromium (Cr VI) Absent
Lead (Pb) Absent
Mercury (Hg) Absent
Polybrominated Biphenyls (PBB) Absent
Polybrominated Diphenyl Ethers (PBDE) Absent

All units are shipped RoHS compliant and contain Lead (Pb) only when specifically
exempted.

The following are possible exemptions for this product:

RoHS Exemption 6c: Lead as an alloying element in copper containing up to 4%

lead by weight

RoHS Exemption 7a: Lead in high melting temperature type solders (i.e. lead based
alloys containing 85 % by weight or more lead)

RoHS Exemption 7b: Lead in solders for servers, storage and storage array systems,
network infrastructure equipment for switching, signaling, transmission; and network
management for telecommunications

RoHS Exemption 7c-I: Electrical and electronic components containing lead in a

glass or ceramic other than dielectric ceramic in capacitors , e.g. piezoelectronic
devices, or in a glass or ceramic matrix compound

RoHS Exemption 7c-II: Lead in dielectric ceramic in capacitors for a rated voltage
of 125 V AC or 250 V DC or higher

RoHS Exemption 15: Lead in solders to complete a viable electrical connection

between semiconductor die and carrier within integrated circuit flip chip packages

RoHS Exemption 24: Lead in solders for the soldering to machined through hole
discoidal and planar array ceramic multilayer capacitors

WEEE Disassembly Instructions for the 45

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WEEE Disassembly Instructions for the 46
TAE and TAE-DC Disk Array Enclosure