TECHNICAL DATA SHEET
Purging compound
SL Grade
Mechanical Purging Compound for Injection Molding & Extrusion
Packaging Description & Benefits
⚫ Special grade for shutdown & sealing
⚫ Low residue purge
* Ideal for transparent or unreinforced application
* Excellent chaser to newEX grade to ensure
maximum cleaning with minimum residue
⚫ Suitable for low-temperature resins
SL Grade is available in :
20kg bags (pictured above)
Usage Information
Temperature Range : 150℃ to 300℃
Applicant:
Injection Molding - including hot runners
Extrusion - profile, sheet, blown film, compounding
Most commodity and engineering resins within the
Types of Resin: processing temperature range, particularly transparent,
unreinforced or low-temperature resins.
PICTURED: Close-up of SL Grade Typically 1-2 system capacities
Amount of Purge:
(actual amount depends on degree of contamination)
Product Safety No minimum hot runner gate clearance requirement nor
Minimum Clearance:
extrusion die or mesh clearance requirement.
Refer to SDS
for more information Soaking Time: Not required
* Detailed instruction may vary to optimize your purging process.
Key Measurements
Physical & Chemical Properties
Specific Gravity 1.00~1.11 Pellet color: Transparency and white are mixed
Base resin: Styrenic resin
Softening Point 80℃
Inorganic additives: Less than 10%
Visit our website Stability: Stable under normal temperatures
for Non-reactive under normal handling and storage conditions
Reactivity:
・News/Events
・SDS Do not exceed recommended temperature range.
・Training videos Conditions to avoid: Do not allow ASACLEAN SL Grade to reside in barrel for more
https://www.asahi-kasei.co.jp/asaclean/en/
than 30 minutes at temperatures higher than 280℃
Issued : July 2021 Information in this document is subject to change without notice and it should be used for reference only.
AsahiKASEI Corporation