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Product Fact Sheet
Industrial
M.2 PCIe SSD
N2000 Series
PCIe 3.1, 3D TLC
Industrial Temperature Grade
Date : Ju l y 0 3, 20 25
Re vi si o n: 1 .05
Product Summary
Capacities: 60 GBytes, 120 GBytes, 240 GBytes, 480 GBytes
Form Factor: PCI Express® M.2 (2230/2242/2280, S4) (30/42/80 mm x 22 mm x 2.63 mm)
Compliance1: PCI Express (PCIe) Specification Revision 3.1
Interface: Gen3 x 4 Lanes
o Drive operates in x1 mode in x1 M.2 PCIe slots
o Drive operates in x2 mode in x2 M.2 PCIe slots
o Drive operates in x4 mode in x4 M.2 PCIe slots
Command Sets: Supports NVMe 1.3
Performance:
o Read Performance: Sequential Read up to 1,753 MBytes/s, Random Read 4K up to 140,000 IOPS
o Write Performance: Sequential Write up to 864 MBytes/s, Random Write 4K up to 134,000 IOPS
Host Memory Buffer (HMB): Support for increased random performance
Operating Temperature Range2:
o Industrial: -40 °C to 85 °C (Tambient)
o Industrial: -40 °C up to 95 °C (Tcase)3
Storage Temperature Range: -40 °C to 85 °C
Operating Voltage: 3.3 V supply voltage
Low Power Consumption
Power:
o Power States PS0, PS1, PS2, PS3 and PS4
o Thermal Throttling supported
Data Retention4: 10 Years @ Life Begin; 1 Year @ Life End, @40 °C
Endurance in TeraBytes Written (TBW) @ 480GB capacity:
o Client ≥ 964
Shock/Vibration: 1,500 g / 50 g
High-Performance Processor with Integrated, Parallel Flash Interface Engines:
o Triple-Level Cell (TLC) 3D NAND Flash
o LDPC Code ECC with up to 120 bit correction per 1 KByte page
High Reliability:
o Mean Time Between Failure (MTBF): > 2,000,000 hours
o Data Reliability: < 1 non-recoverable error per 1016 bits read
1
To check the compatibility of the customer system and the storage device is part of the customer’s responsibility. Swissbit can provide
guidance and support on request.
2
Adequate airflow is required to ensure the drive temperature, as reported in the S.M.A.R.T. data, does not exceed CCTEMP (Critical
Composite Temperature Threshold) reported in the "Identify Controller Data Structure"
3
Tcase is the case surface temperature at the center of the top side of the device.
4
NAND Flash suppliers refer to JEDEC JESD47 and JESD22 for Data Retention testing. Based on the information provided by the NAND Flash
suppliers, Data Retention is targeted as shown in the table for reference.
Swissbit AG Revision: 1.05
Industriestrasse 4 TLP: Swissbit public Template: Doc-4991
CH-9552 Bronschhofen File: P000000424.6
Switzerland www.swissbit.com/contact Page 2 of 3
Product Features
Dynamic and Static Wear Leveling
Subpage Mode Flash Translation Layer (FTL)
Data Care Management
o Active: Adaptive Read Refresh
o Passive: Background Media Scan
Lifetime Enhancements
o Dynamic Bad Block Remapping
o Write Amplification Reduction
Power Fail Data Loss Protection
Data set management support (TRIM)
Active State Power Management (ASPM) Support
In-Field Firmware Update5
Enterprise-Grade Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T.)
30 µinch Gold-Plated Connector (IPC-6012B Class 2 Compliant)
End-to-End (E2E) Data Protection
Life Cycle Management
Controlled “Locked” BOM
RoHS / REACH Compliant
Swissbit Device Manager (SBDM) Tool and SDK for SBDM (on request)
1 Security features
AES256 encryption
TCG OPAL 2.0
Crypto erase
Why Swissbit?
Swissbit is focused on the design, development, manufacture, and support of leading edge memory and
storage solutions for the worldwide OEM/ODM marketplace. As a global supplier, Swissbit recognizes and
addressees the higher level of application requirements of today’s industrial, Netcom, and automotive
customers by providing best-in-class products and services, with uncompromised attention to driving overall
value and quality.
5
The support of In-Field FW update capabilities on host systems is recommended.
Swissbit AG Revision: 1.05
Industriestrasse 4 TLP: Swissbit public Template: Doc-4991
CH-9552 Bronschhofen File: P000000424.6
Switzerland www.swissbit.com/contact Page 3 of 3
