MMSZ4684

MMSZ4684

General Description Features

Half watt, General purpose, Medium Current Surface • Compact surface mount with same footprint as mini-melf
Mount Zener in the SOD-123 package. The SOD-123 • 500mW rating on FR-4 or FR-5 board.
package has the same footprint as the glass mini-melf (LL- • Class 3 ESD rating (>16kV) per Human Body Model
34) package & provides a convenient alternative to the
Leadless package.
Ordering
• 7 inch reel (178mm); 8mm Tape; 3,000 units per reel.

Absolute Maximum Ratings (note 1) TA=25°C unless otherwise noted

Symbol Parameter Value Units
TSTG Storage Temperature -55 ~ 150 °C
TJ Maximum Junction Temperature -55 ~ 150 °C
PD Total Power Dissipation at 25°C 500 mW
Derate above 25°C 6.7 mW/°C
RQJA Thermal Resistance Junction to Ambient 340 °C/W
RQJL Thermal Resistance Junction to Lead 150 °C/W
∆VZ Maximum Voltage Change (note 2) 950 mV
Lead Solder Temperature (Max 10 second duration) 260 °C
Nominal Zener Voltage (VZ) at 50µA 3.3 V
Note 1: These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
Note 2: Voltage change is equal to the difference between VZ at 100µA and VZ at 10µA.

Top Mark: CK
1: Cathode 1 2
2: Anode

Electrical Characteristics TA=25°C unless otherwise noted

Symbol Characteristics Test Conditions Min. Max. Units
VZ Zener Voltage IZT = 50µA D.C 3.14 3.47 V
IR Reverse Leakage VR = 1.5V 7.5 µA
VF Forward Voltage IF = 10mA 900 mV
∆VZ Delta Zener Voltage (Note 2) IZT = 100µA to 10µA 950 mV

©2003 Fairchild Semiconductor Corporation MMSZ4692, Rev. A

 MMSZ4684
SOD-123 PACKAGE
PACKAGE CODE = (D6)
Fairchild Semiconductor's Criteria

Corrected March 11, 1998

Actual Size MIN MAX MIN MAX

DIM (mils) (mils) (mm) (mm)
2 1 A
A 55 71 1.400 1.800
B 100 112 2.550 2.850
C 34.6 46 0.880 1.180
D 141.7 153.5 3.600 3.900
B E ---- ---- ------- -------
F 21.5 27.5 0.546 0.70
G 0.5 4 0.0135 0.1015
D H 12.7 ---- 0.322 -------
I 3.7 7.7 0.095 0.195

C
I

F
H G

1.2 2 mm
48 mils

0.91 mm 2.36 mm 0.91 mm

36 mils 93 mils 36 mils

4.19 mm
165 mils

SOD-123 LAND PADS

©2003 Fairchild Semiconductor Corporation MMSZ4692, Rev. A

TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™ FACT Quiet Series™ LittleFET™ Power247™ SuperSOT™-6
ActiveArray™ FAST MICROCOUPLER™ PowerTrench SuperSOT™-8
Bottomless™ FASTr™ MicroFET™ QFET SyncFET™
CoolFET™ FRFET™ MicroPak™ QS™ TinyLogic
CROSSVOLT™ GlobalOptoisolator™ MICROWIRE™ QT Optoelectronics™ TINYOPTO™
DOME™ GTO™ MSX™ Quiet Series™ TruTranslation™
EcoSPARK™ HiSeC™ MSXPro™ RapidConfigure™ UHC™
E2CMOSTM I2C™ OCX™ RapidConnect™ UltraFET
EnSigna TM
ImpliedDisconnect™ OCXPro™ SILENT SWITCHER VCX™
FACT™ ISOPLANAR™ OPTOLOGIC SMART START™
Across the board. Around the world.™ OPTOPLANAR™ SPM™
The Power Franchise™ PACMAN™ Stealth™
Programmable Active Droop™ POP™ SuperSOT™-3
DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant into support device or system whose failure to perform can
the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life
failure to perform when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can be effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information Formative or This datasheet contains the design specifications for
In Design product development. Specifications may change in
any manner without notice.

Preliminary First Production This datasheet contains preliminary data, and

supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.

No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.

Obsolete Not In Production This datasheet contains specifications on a product

that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.

Rev. I5