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Bridgecourse Assignment

The document discusses the design cycle of Very Large Scale Integration (VLSI), outlining eight key steps from system specification to packaging and testing. It highlights the importance of each phase in ensuring the functionality, performance, and reliability of integrated circuits. The conclusion emphasizes that VLSI technology enables the miniaturization and cost-effectiveness of electronic circuits while enhancing their operational speed and reliability.

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Soumya Sou
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0% found this document useful (0 votes)
16 views2 pages

Bridgecourse Assignment

The document discusses the design cycle of Very Large Scale Integration (VLSI), outlining eight key steps from system specification to packaging and testing. It highlights the importance of each phase in ensuring the functionality, performance, and reliability of integrated circuits. The conclusion emphasizes that VLSI technology enables the miniaturization and cost-effectiveness of electronic circuits while enhancing their operational speed and reliability.

Uploaded by

Soumya Sou
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as DOCX, PDF, TXT or read online on Scribd
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Artificial Intelligence & Machine Learning

AAT 1

Topic 6: Chatbots

Tasks
Task 1: Can this AI replace the humans in completing the task. Give reasons.

Task 2: How can we measure the performance of an AI agent? What are the parameters to be considered?

Task 3: Do you think AI agent can be considered as a rational agent? Give reasons.

er electronics has been raising. Presently, technologies like Smartphones and cellular
communications afford processing capabilities, portability and application access due to VLSI
technology.

VLSI Design Cycle


VLSI Design is an iterative cycle. Designing a VLSI chip includes few problems like functional
design, logic design etc,. The design is verified for accuracy by the process of simulation.

1. System specification: The objective of the desired


product is written in this step. During system specification,
the designated cost of the system, its performance,
architecture, and how the system will communicate with
the external world are to be determined. During this step,
the design specification should be provided by the clients.
2. Architectural design: The basic architecture of the
desired design must meet the system specifications. The
architecture of the design is decided and the layout is
designed by design engineers. Architectural design
includes the integration of analog and mixed-signal blocks,
memory management, internal and external
communication, power requirements, and choice of process
technology and layer stacks.
3. Functional design: It consists of refining the design
specification of the design in order to design the functional
1
behavior of the system. The main objective of this is to generate design a high-performance
architectural design within the cost requirements.
4. Logic Design: The structure of the design is added to the behavioral representation of the design.
The main specifications to be considered for logic design are logic minimization, performance
enhancement, and testability. Logic design must consider the problems associated with test vector
generation, error detection, and error correction. Many logic synthesis tools have been developed
for the automation of the process of logic design.
5. Circuit Design: The logic blocks of the design are replaced by the electronic circuits, which are
consists of electronic devices such as resistors, capacitors, and transistors. In this stage, Circuit
simulation of the design is done, in order to verify the timing behavior of the system.
6. Physical Design: In this step, the actual layout of the system is done, where all the components
will be placed in the circuit and all these components are interconnected. The actual layout of the
desired system can affect the area, correctness, and performance of the final product. The
correctness of the chip is also controlled by the physical design. A circuit design that passes the test
of a circuit simulator may be faulty after it has been packaged. This is because of geometric design
rule errors. These design rules must be followed to ensure the correctness of the chip fabrication.
7. Fabrication: The handoff of the design to the manufacturing process is called tapeout.
Generation of the data for manufacturing is referred to as streaming out. The design is onto the
different layers of the design using the photolithographic process. ICs are manufactured on round
silicon wafers then, are then tested and are marked as either functional or defective.
8. Packaging and Testing: After fabrication of design, functional chips are then packed. Packaging
is configured early in the design process and the application along with the cost and form factor
requirements. Packaged types include Dual In-Line Packaged (DIPs), Pin Grid Array (PGAs), and
Ball Grid Arrays (BGAs). Pins are connected to the pins of the package. The package of the desired
design is then sealed and then sent to the end-users or clients.

CONCLUSION
The VLSI allows the IC designers to reduce the size and effective cost of circuits. VLSI has higher
reliability and increases the operating speed. Before VLSI, most ICs had limited functions. An
electronic circuit usually consists of a CPU, ROM, RAM and other peripherals on one board. VLSI
lets IC designers add all of these into one chip.

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