AOM-5721 Qualcomm QCS6490 AI-on-Module Nano
Preliminary Features
Qualcomm Arm® v8 Cortex® Gold plus up to 2.7 GHz
3x Arm v8 Cortex® Up to 2.4GHz
Onboard LPDDR5 8GB, 6400MT/s memory
1 x 4 lane MIPI DSI, 1x DP and 1x eDP1.4 for Displays
4 x MIPI CSI 4-lane
2 x USB3.2 Gen1, 4 x USB2.0, 4 x UART, 3 x I2C, 14 x GPIO, 3 x PCIe3.0
1 x UFS, 1 x 4-bit SDIO for storages
Support Windows 11, Yocto, Ububtu and Android
RoHS
COMPLIANT
2002/95/EC
Introduction
Advantech AOM-5721 AI-on-Module is powered by Qualcomm QCS6490/5430 SoC which includes up to Arm v8 Cortex® in combination with Andreo GPU 643 and Andreo VPU
633 graphics engine. It provides PCIe, USB 3.2, Giga Ethernet, MIPI-CSI, I2C, SPI, GPIO, PWM, eDP, MIPI-DSI display for embedded applications.
AOM-5721 is paired with Advantech AOM carrier board for faster end product peripheral integration and time-to-market. The reference schematics and layout checklists documentations
for carrier board development will be provided along with Windows 11 and Ubuntu, test utilities, hardware design utilities and reference drivers.
Specifications
Form Factor Form Factor AOM Nano (SMARC compatible)
CPU QCS6490 QCS5430
Processor System
Core 8x Kryo 670 CPU from 1.9 up to 2.7 GHz Up to 6x Kryo 670 CPU from 1.8 GHz to 2.4 GHz
Technology LPDDR5 6400MT/s
Memory Capacity Up to 16GB LPDDR5 (On-board)
Flash Up to 1TB UFS Up to 1TB UFS(Optional)
LVDS/MIPI DSI 1 x 4 lane MIPI DSI (Optional instead of HDMI)
eDP 1 x eDP (4K60fps)
DP 1 x DP
Graphics Adreno GPU 643 @812 MHz, Support for Open GL ES Adreno 642L GPU @ 550 MHz, Support for Open GL ES
GPU
3.2, Open CL 2.0, Vulkan 1.x, DX FL 12 3.2, Open CL 2.0, Vulkan 1.x, DX FL 12
Adreno VPU 633, Up to 4K60 decode for H.264/H.265/VP9, Up to 4K30 encode for H.264/H.265;
VPU
Support for HDR10 and HDR10+ playback
Chipset 1 x RGMII and 1 x SGMII
Ethernet
Speed 10/100/1000 Mbps
RTC Yes
Security Qualcomm® Trusted Execution Environment (TEE) v5.3, TPM
PCIe 1 x PCIe Gen 3 x2(QPS615), 1 x PCIe Gen 3 x1(QPS615), 1 x PCIe Gen3 x1
USB 1 x USB 3.2 Gen 1, 4 x USB 2.0 (Type-A), 1 x USB 2.0 (Recovery)
Audio 1 x I2S, 1 x Soundwire
SDIO 1
Serial Port 2 x UART with TX/RX (Data Only), 2 x UART with TX/RX/RTS/CTS (2 wire handshake)
I/O SPI 2
GPIO 14
I²C 3
1 x MIPI CSI 4-lane, 1 x MIPI CSI 2-lane (SMARC Edge 1 x MIPI CSI 2-lane (SMARC Edge Connector),
Camera Input
Connector), 2 x MIPI CSI 4-lane (Connector) 2 x MIPI CSI 4-lane (Connector)
PWM 1
Power Supply Voltge Fixed 5V DC source
Power
Power Consumption TBD
Standard temperature 0° to 60°C
Environment Extend temperature -20° to 70°C
Operating Humidity 95% @ 40°C (non-condensing)
Mechanical Dimensions (W x D) 82 x 50 mm
Operating System Yocto Linux, Ubuntu Linux, Windows 11 IoT, Android
Certifications CE/FCC Class B
Arm Computing Platforms
All product specifications are subject to change without notice. Last updated: 9-Jul-2025
AOM-5721
Block Diagram
RGMII GbE MDI
LAN PHY
QPS615
SGMII GbE MDI
8GB LPDDR5 PCIE Gen 3 x2 LAN PHY
PCle Gen3 x2
PCle Gen3 x1
USB 3.2 Gen1
SDIO
128G UFS
PCIE Gen 3 x1
By Pass (Option)
MXM3.0 Connector-31 4 pin
USB 2.0
USB 2.0 HUB
EEPROM
USB 2.0(Recovery)
I2S
QCS6490
Soudwire
2 x UART 4-wires
Qualcomm PMIC
2 x UART 2-wires (With Debug console)
2 x SPI
14 x GPIO
3 x 12C (PM, GP, LCD)
RTC
MIPI CSI 2-lane
MIPI CSI 4-lane
By Pass(Option)
MIPI DSI 4 lane
Connector
2 x MIPI CSI 4-lane HDMI bridge
eDP
DP
Ordering Information
Part No. CPU Memory Flash Memory UART GbE USB3.2 Gen1 USB 2.0 Display I2S I2C SPI Operating Temperature
AOM-5721W8XX-XXXX QCS6490 4 2 1 4 3 3 2 -20° ~ 70°C
Up to 1TB UFS 1 x 4 lane MIPI DSI
AOM-5721C8XX-XXXX QCS6490 4 2 1 4 (Optional instead of HDMI), 3 2 2 0 ~ 60 °C
Up to 16GB
AOM-5721W6XX-XXXX QCS5430 4 2 1 4 1 x eDP(4K60fps), 3 3 2 -20° ~ 70°C
Up to 1TB UFS (Optional) 1 x DP
AOM-5721C6XX-XXXX QCS5430 4 2 1 4 3 2 2 0 ~ 60 °C
* DRAM and eMMC of other capacity are available through project-based support. Please contact sales for details.
Development Board
Part No. Description
Dimensions Unit: mm
TBD Carrier Board
82.0
4.0 74.0
Optional Accessories
4.0
R2
Part No. Description
1701200220 Debug port cable
1700019474 D-SUB 9P(F)/D-SUB 9P(F) RS232/RS485 100c
TBD Heat Spreader
34.0
50.0
TBD Semi Heat Sink (0 ~ 60 °C)
TBD Semi Heat Sink (-40 ~ 85 °C)
Ø2.7
96PSA-A36W12R1-3 ADAPTER 100-240V 36W 12V 3A
1700001524 Power Cord 3P UL 10A 125V 180cm .0
170203183C Power Cord 3P Europe (WS-010+WS-083) 183cm Ø6
1700019146 Power Cord CCC 3P 10A 250V 183cm
170203180A Power Cord 3P UK 2.5A/3A 250V 1.83M
6.2
1700008921 Power Cord 3P PSE 183cm 39.0
SQF-ISDM1-16G-21C SQF SD Card I-SD UHS-I MLC 16G (0~70°C)
SQF-ISDM1-16G-21E SQF I-SD UHS-I MLC 16G (-40~85°C)
EWM-W163M201E 802.11 a/b/g/n/ac,QCA6174A,2T2R,w/BT4.1,M.2 2230
1750008717-01 Dipole Ant. D.B 2.4/5G WIFI 3dBi SMA/M-R BLK
1750007965-01 Antenna Cable R/P SMA (M) to MHF4, 300mm
EWM-C117FL06E* LTE 4G,3G WCDMA/DC-HSPA+, 2G module, MPCI-L280H
1750008303-01 Antenna AN0727-64SP6BSM
*Please contact us for suggesting suitable cellular module for your region.
1750006009 Antenna Cable SMA (F) to MHF 1.32 25cm
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