Rylr993 en
Rylr993 en
RYLR993
Datasheet
13mm*13mm*2.2mm
RYLR993
868/915MHz LoRaWAN®& Proprietary Dual Mode Transceiver Module
PRODUCT DESCRIPTION
The RYLR993 868/915MHz LoRaWAN® Transceiver Module feature the LoRa long range modem that
provides ultra-long range spread spectrum communication and high interference immunity whilst
minimising current consumption.
FEATURES
• ST STM32WLE5CCU6 256KB flash Industrial LoRa® SOC Engine.
• Customized firmware design service is available.
• AT Command over UART interface
• High sensitivity.
• Temperature sensor.
• Low power consumption.
• AES128 CCM Data encryption
• LoRaWAN® class A, B & C support
• LoRaWAN® and LoRa® Proprietary selection.
• Support bands : US915, EU868, AS923, IN865, KR920, RU864
• Support REYAX RYLR998 proprietary mode
APPLICATIONS
• IoT Applications
• Mobile Equipment
• Home Security
• Industrial Monitoring and Control Equipment
• Car Alarm
CERTIFICATION
• CE RED
• FCC
• MIC Japan
• NCC
PIN DESCRIPTION
U1
44
43
42
41
40
39
38
37
36
35
34
33
REY AX RY LR993
PA3
PA2
PA1
PA0
PB8
PB7
PB6
PB5
GND
RF
GND
GND
1 32
GND GND
2 31
PA6 PB3
3 30
PA7 PB4
4 29
PA8 PA15
5 28
PA9 GND
6 27
PH3 PA14/JTCK-SWCLK
7 26
GND NRST
8 25
GND PC13
9 24
GND PA13/JTMS-SWDIO
10 23
GND GND
VBAT
PB12
PA10
PA11
PA12
GND
GND
VDD
VDD
VDD
PB0
PB2
11
12
13
14
15
16
17
18
19
20
21
22
TIMING DIAGRAM
VDD
RST
TXD Keep Low before power on Keep Low before power off
RXD Keep Low before power on Keep Low before power off
BLOCK DIAGRAM
Processor RYLR993
RF Switch
TX : PA4=H, PA5=L
RX : PA4=L, PA5=H
Filter Match
Schematic
RFO RFIN
STM32WLE5CCU6
LoRa® SOC Engine
15uH
VLXSMPS
VDDRF1V55
470nF
VFBSMPS PA4
PA5
NRESET
VBAT
TXD VBAT Power Supply
VDD
RXD
VDDA VDD
OSC_IN VDDPA Power Supply
SPECIFICATION
Item Min. Typical Max. Unit Condition
VDD Power Supply 3 3.3 3.6 V
VBAT Power Supply 2.7 3.3 3.6 V
Frequency Accuracy ±10 ppm at 25°C ±3°C
(PROPRIETARY MODE)
AT+CRFOP (dBm) Typical Current (mA) VDD=3.3V
0 44.9
1 47.6
2 51.4
3 54.0
4 58.4
5 61.2
6 64.7
7 68.8
8 72.9
9 77.2
10 81.5
11 85.9
12 91.1
13 97.1
14 102.5
15 107.5
16 111.8
17 115.5
18 119.5
19 123.2
20 126.9
21 130.0
22 135.5
Condition :
50
0
922.88 922.9 922.92 922.94 922.96 922.98 923 923.02 923.04 923.06 923.08 923.1
-50
Attenuation(dB)
-100
-150
-200
-250
Frequency(MHz)
*Avoid using center frequencies that are 4MHz apart as this may cause crosstalk issues due to IF
demodulation.
APPLICATION SCHEMATIC
CON1 E1
HIROSE U.FL-R-SMT-1 REY AX RY AF915
CON2
NC
1 VDD
TXD 2 PA13/JTMS-SWDIO
PA14/JTCK-SWCLK
RXD
3
RF
4 NRST
5
U1
44
43
42
41
40
39
38
37
36
35
34
33
REY AX RY LR993
PA3
PA2
PA1
PA0
PB8
PB7
PB6
PB5
RF
GND
GND
GND
VDD
5
1 32
GND GND CON3
2 31 90 degree 6 pin
PA6 PB3
NRST
RXD
TXD
3 30
PA7 PB4
4 29
PA8 PA15 C1 C2 C3 C4
5 28 47uF 0603 47uF 0603 0.1uF 100pF
R10 10K PA9 GND
6 27 PA14/JTCK-SWCLK B1
PH3 PA14/JTCK-SWCLK SKQGADE010
7 26 NRST
GND NRST
8 25
GND PC13
9 24 PA13/JTMS-SWDIO
GND PA13/JTMS-SWDIO VDD
10 23
GND GND
LED1 VDD
RED 0805
VBAT
PB12
PA10
PA11
PA12
GND
GND
VDD
VDD
VDD
PB0
PB2
LED2 VDD
GREEN 0805
11
12
13
14
15
16
17
18
19
20
21
22
R4
1K
LED3
BLUE 0805
R5 R6
1K Q1 1K
LINK AO3418
R3 0 R7 R8
VBAT 1K Q2 1K
RF_TX_ACTIVE AO3418
R9
VDD 1K Q3
RF_RX_ACTIVE AO3418
R2
NC
VDD
R1
NC
Title
RYLR993_Lite
Size Document Number Rev
Custom<Doc> 1.2
REFLOW SOLDERING
Consider the "IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave) processes, published 2001. Only
single reflow soldering processes are recommended for REYAX modules. Repeated reflow soldering processes and soldering the
module upside down are not recommended.
Preheat phase
Initial heating of component leads and balls. Residual humidity will be dried out. Please note that this preheat phase will not replace
prior baking procedures.
• Temperature rise rate: max. 3 °C/s If the temperature rise is too rapid in the preheat phase it may cause excessive slumping.
• Time: 60 - 120 s If the preheat is insufficient, rather large solder balls tend to be generated.
Conversely, if performed excessively, fine balls and large balls will be generated in clusters.
• End Temperature: 150 - 200 °C If the temperature is too low, non-melting tends to be caused in
areas containing large heat capacity.
Cooling phase
A controlled cooling avoids negative metallurgical effects (solder becomes more brittle) of the solder and possible mechanical
tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape and low contact angle.
• Temperature fall rate: max 4 °C/s To avoid falling off, the REYAX module should be placed on the topside of the motherboard
during soldering.
[°C] Y值
Preheat Heating Cooling
250 Peak Temp245°C
Liquidus temperature
217
200
40-60s Max 4°C/s
150
End Temp Typical Leadfree
Soldering Profile
Max 3°C/s 150-200°C
100 Y值
50
60-120s
0
0 50 100 150 200 250 300
座標軸標題
Elapsed Time
CERTIFICATIONS
• FCC Statement:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC
Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate
the equipment.
QLYRYLR993
020-230271
上記のとおり、電波法第 38 条の 24 第 1 項の規定による特定無線設備の工事設計についての認証を行ったものであるこ
とを証する。
第十二條 經型式認證合格之低功率射頻電機,非經許可,公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設
計之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信;經發現有干擾現象時,應立即停用,並改善至無干擾
時方得繼續使用。前項合法通信,指依電信法規定作業之無線電通信。低功率射頻電機須忍受合法通信或工業、
科學及醫療用電波輻射性電機設備之干擾。
CCAK23Y10110T4
DIMENSIONS
Unit : mm
Unit : mm
E-mail : [email protected]
Website : http://reyax.com